Laser processing machine and workpiece processing method

Abstract

【Problem】To reliably push down the slag remaining in the hole without damaging the protrusions of the worktable. 【Solution】A laser processing machine for laser-processing a plate-shaped workpiece, comprising: a worktable having a plurality of protrusions and supporting the workpiece at the upper ends of the protrusions; a laser head that irradiates a laser beam along the contour of a hole to be formed in the workpiece on the worktable to perform punching; a conveying device that conveys the workpiece after being laser-processed; and a rod-shaped tool that pushes down the slag remaining in the hole. The workpiece is conveyed by the conveying device until the hole formed by the punching is disposed at a processing position where there is a slag discharge space outside and below the worktable when viewed from above, and at the processing position, the slag remaining in the hole is pushed down by the rod-shaped tool.

Description

Technical Field

[0001] The present invention relates to a laser processing machine and a workpiece processing method. Background Art

[0002] A laser processing machine can perform forming on a plate-like workpiece and perform opening processing for forming a hole portion as a pilot hole for tapping. The opening processing is processing in which a laser beam is irradiated along the contour of the hole portion to be formed in the workpiece while the plate-like workpiece is supported by a worktable having a plurality of protrusions. Slag usually falls from the workpiece and is removed. However, the slag that should fall is sometimes blocked by the protrusions and does not fall, or is embedded in the hole portion and does not fall. In addition, even when there is a cutting defect, the slag that should fall sometimes adheres to the workpiece and does not fall. For a workpiece in a state where the slag has not fallen, when forming or tapping the hole portion, it may cause processing defects, die breakage, or tap breakage.

[0003] In Patent Document 1, it is disclosed that in a state where a plate-like workpiece is supported by a worktable having a plurality of protrusions, the slag remaining in the hole portion formed by the opening processing is pushed down by a rod-shaped tool.

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Patent Laid-Open No. 4-231192 Summary of the Invention

[0007] When opening processing is performed directly above the protrusion of the worktable, since there is a possibility that the protrusion may be damaged due to the impact when pushing down the slag, the method disclosed in Patent Document 1 cannot be applied.

[0008] A laser processing machine according to one aspect of the present invention may be a laser processing machine that performs laser processing on a plate-like workpiece. The laser processing machine may include a worktable having a plurality of protrusions and supporting the workpiece at the upper ends of the protrusions. The laser processing machine may include a laser head that irradiates a laser beam along the contour of the hole portion to be formed in the workpiece on the worktable to perform opening processing. The laser processing machine may include a transfer device that transfers the workpiece after being subjected to laser processing. The laser processing machine may include a rod-shaped tool that pushes down the slag remaining in the hole portion. The laser processing machine may transfer the workpiece by the transfer device until the hole portion formed by the opening processing is disposed at a processing position where there is a slag discharge space outside and below the worktable when viewed from above. The laser processing machine may push down the slag remaining in the hole portion by the rod-shaped tool at the processing position.

[0009] A workpiece processing method according to one embodiment of the present invention may be a method of processing a plate-shaped workpiece by laser processing. The workpiece processing method may include supporting the workpiece on the upper ends of a plurality of protrusions provided on a worktable. The workpiece processing method may include performing hole-opening processing by irradiating a laser beam along the contour of a hole portion to be formed in the workpiece on the worktable. The workpiece processing method may include transporting the workpiece by a transport device until the hole portion formed by the hole-opening processing is disposed at a processing position having a slag discharge space outside and below the worktable when viewed from above. The workpiece processing method may include pushing down the slag remaining in the hole portion with a rod-shaped tool at the processing position.

[0010] Advantages of the Invention

[0011] A laser processing machine and a workpiece processing method according to one embodiment of the present invention can reliably push down the slag remaining in the hole portion without damaging the protrusions of the worktable.

[0012] A laser processing machine according to one embodiment of the present invention may include a secondary processing tool for performing secondary processing on a hole portion from which the slag has been pushed down by a rod-shaped tool. The laser processing machine of this embodiment can perform secondary processing on the hole portion from which the slag has been pushed down.

[0013] A laser processing machine according to one embodiment of the present invention can select one of the rod-shaped tool and the secondary processing tool and position it at the processing position. The laser processing machine of this embodiment can push down the slag without being interfered by the secondary processing tool and can perform secondary processing without being interfered by the rod-shaped tool.

[0014] A laser processing machine according to one embodiment of the present invention may include an annular member that is disposed opposite to the rod-shaped tool with the workpiece therebetween and into which the rod-shaped tool can be inserted. The laser processing machine may be provided with a plurality of sets each including one rod-shaped tool and one annular member, and one of the sets is selected for use according to the size of the hole portion. The laser processing machine of this embodiment can appropriately push down the slag remaining in various hole portions having different sizes.

[0015] A laser processing machine according to one embodiment of the present invention may include a control unit that controls the operation of the rod-shaped tool. The control unit may perform an operation of pushing down the slag with the rod-shaped tool on all the hole portions formed in the workpiece. The laser processing machine of this embodiment can reliably push down the slag remaining in the hole portion.

[0016] A laser processing machine according to one embodiment of the present invention may include a control unit that controls the operation of the rod-shaped tool. The control unit may perform an operation of pushing down the slag with the rod-shaped tool on the hole portion formed directly above the protrusion on the workpiece. The laser processing machine of this embodiment can shorten the time required for the operation of pushing down the slag.

[0017] A laser processing machine according to one aspect of the present invention may include a control unit that controls the operation of a rod-shaped tool. The laser processing machine may include an imaging unit that images a hole portion formed by punching. The control unit may determine whether slag remains in the hole portion based on the image captured by the imaging unit, and when it is determined that slag remains in the hole portion, perform an operation of pushing down the slag using the rod-shaped tool on the hole portion. The laser processing machine of this aspect can not only reliably push down the slag remaining in the hole portion, but also shorten the time required for the operation of pushing down the slag. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 FIG. is an example of a perspective view showing the appearance of a laser processing machine.

[0019] Figure 2 FIG. is an example of a view showing the structure of a laser head.

[0020] Figure 3 FIG. is an example of a perspective view showing the appearance of a pushing-down unit.

[0021] Figure 4 FIG. is an example of a flowchart showing the sequence of controlling punching.

[0022] Figure 5 FIG. is an example of a view showing the sequence of punching.

[0023] Figure 6 FIG. is an example of a view showing the sequence of punching.

[0024] Figure 7 FIG. is an example of a flowchart showing the sequence of controlling the pushing down of slag and secondary processing.

[0025] Figure 8 FIG. is an example of a view showing the sequence of pushing down slag.

[0026] Figure 9 FIG. is an example of a view showing the sequence of pushing down slag.

[0027] Figure 10 FIG. is a reference view for explaining the diameter of a rod-shaped tool and the diameter of an annular member suitable for pushing down slag.

[0028] Figure 11 FIG. is an example of a flowchart showing another example of the sequence of controlling the pushing down of slag and secondary processing.

[0029] Figure 12 FIG. is an example of a flowchart showing another example of the sequence of controlling punching.

[0030] Figure 13It is a flowchart showing other examples of the sequence for controlling the pushing down and secondary processing of the slag. Detailed implementation

[0031] Hereinafter, the present invention will be described by way of embodiments of the invention. However, the following embodiments do not limit the invention of the claims. In addition, the combinations of the features described in the embodiments are not necessarily all essential for the solution of the invention.

[0032] Hereinafter, the directions in the figures will be described using the XYZ coordinate system. In this XYZ coordinate system, the vertical direction is taken as the Z direction, and the horizontal directions are taken as the X direction and the Y direction. In addition, for the X direction, Y direction, and Z direction, the side pointed to by the arrow is appropriately referred to as the + side, and the opposite side is referred to as the - side.

[0033] Figure 1 It is a figure showing an example of the external perspective view of the laser processing machine 1. The laser processing machine 1 is a device for laser processing, secondary processing, and pushing down of slag on a plate-shaped workpiece W. The laser processing machine 1 includes a laser processing device 100, a transfer device 200, a secondary processing device 300, and a control unit 400. The control unit 400 controls the operations of the laser processing device 100, the transfer device 200, and the secondary processing device 300.

[0034] The laser processing device 100 is a device for laser processing the workpiece W. The laser processing device 100 includes a frame 110A, a frame 110B, a lower frame 110C, a worktable 120, a laser head 130, and a laser head drive unit 140.

[0035] The laser processing device 100 performs laser processing on the workpiece W in the laser processing area R1. The laser processing area R1 is an area surrounded by the frame 110A and the frame 110B. The frame 110A and the frame 110B are plate-shaped main frames that stand upright in the Z direction and extend in the X direction. The frame 110A and the frame 110B are connected to each other by the lower frame 110C and support the laser head drive unit 140. The lower frame 110C is provided below the laser processing area R1 and supports the worktable 120. The frame 110A has an opening 110AO through which the workpiece W transported by the transfer device 200 can pass.

[0036] The worktable 120 is a component that supports the workpiece W in the laser processing area R1. The worktable 120 includes a rectangular base plate 121 and a plurality of support plates 122. The plurality of support plates 122 are arranged side by side in the X direction in a state of standing upright on the upper surface of the base plate 121. A plurality of protrusions 122A are formed at the upper end portions of the support plates 122. The worktable 120 supports the lower surface of the workpiece W using the upper ends of the protrusions 122A. The protrusions 122A are, for example, serrated and are formed to have the same height from the base plate 121.

[0037] The laser head 130 is a device that irradiates a workpiece W on the worktable 120 with a laser beam under the control of the control unit 400 to perform laser processing. For example, the laser head 130 can irradiate a laser beam along the contour of a hole portion to be formed in the workpiece W on the worktable 120 to perform drilling processing.

[0038] Figure 2 FIG. shows an example of the structure of the laser head 130. The laser head 130 includes a nozzle 131, an optical fiber 132, a collimator 133, a beam splitter 134, and a condenser lens 135.

[0039] The laser head 130 irradiates a processing laser beam L1 and an illumination laser beam L2 from the exit port 131A of the nozzle 131 toward the workpiece W. The laser head 130 is arranged so as to be capable of relatively moving in the X direction, Y direction, and Z direction with respect to the workpiece W. The laser head 130 performs cutting processing by irradiating the processing laser beam L1 along a cutting line to be formed in the workpiece W while relatively moving with respect to the workpiece W.

[0040] The optical fiber 132 is connected to the laser oscillator 150 and guides the processing laser beam output from the laser oscillator 150 into the laser head 130.

[0041] The collimator 133 is arranged such that the focal point on the incident side of the processing laser beam L1 coincides with the position of the end of the optical fiber 132, and converts the processing laser beam L1 output from the laser oscillator 150 into parallel light.

[0042] The beam splitter 134 is provided at the position where the processing laser beam L1 passing through the collimator 133 is incident, reflects the processing laser beam L1, and transmits the illumination laser beam L2.

[0043] The condenser lens 135 is provided at the position where the processing laser beam L1 reflected by the beam splitter 134 is incident, and converges the incident processing laser beam L1. The optical system drive unit 160 moves the condenser lens 135 along the optical axis to adjust the focal point on the workpiece W side.

[0044] An illumination unit 160 is detachably connected to the laser head 130. The illumination unit 160 includes a laser array 161 and a collimator 162. The laser array 161 emits an illumination laser beam L2 having a wavelength different from that of the processing laser beam L1. The collimator 162 is provided at the position where the illumination laser beam L2 from the laser array 161 is incident, and converts the illumination laser beam L2 incident from the laser array 161 into parallel light.

[0045] The optical head 130 is provided with a semi-transmissive and semi-reflective mirror 136. The semi-transmissive and semi-reflective mirror 136 is disposed at the position where the illumination laser beam L2 after passing through the collimator 162 is incident, reflects a part of the illumination laser beam L2, and allows a part of the illumination laser beam L2 to pass through.

[0046] The illumination laser beam L2 reflected by the semi-transmissive and semi-reflective mirror 136 passes through the beam splitter 134. The condenser lens 135 converges the illumination laser beam L2 after passing through the beam splitter 134. On the workpiece W, the area irradiated with the illumination laser beam L2 is set to include the area irradiated with the processing laser beam L1 on the workpiece W.

[0047] An imaging unit 170 is provided on the optical head 130. The imaging unit 170 is a device that photographs the area irradiated with the processing laser beam L1. The imaging unit 170 includes an imaging element 171. The imaging element 171 is an image sensor that detects the return light generated by the reflection and diffusion of the illumination of the illumination laser beam L2 on the workpiece W and generates image data.

[0048] The return light from the workpiece W passes through the condenser lens 135 and is incident on the beam splitter 134. The return light includes the light generated by the reflection and diffusion of the illumination laser beam L2 on the workpiece W and the light generated by the reflection of the processing laser beam L1 on the workpiece W. The light originating from the illumination laser beam L2 passes through the beam splitter 134 and is incident on the semi-transmissive and semi-reflective mirror 136. On the other hand, the light originating from the processing laser beam L1 is reflected by the beam splitter 134.

[0049] When molten metal formed by melting the workpiece W is deposited on the cut surface or the like of the workpiece W, the return light includes light in the infrared to near-infrared wavelength band radiated from the molten metal. The light caused by the molten metal passes through the beam splitter 134 and is incident on the semi-transmissive and semi-reflective mirror 136.

[0050] The optical head 130 includes a wavelength selection filter 137 and an imaging lens 138. The wavelength selection filter 137 is, for example, a dichroic mirror, a notch filter, etc. The return light incident on the semi-transmissive and semi-reflective mirror 136 passes through the semi-transmissive and semi-reflective mirror 136 and is incident on the wavelength selection filter 137. The light originating from the illumination laser beam L2 is reflected by the wavelength selection filter 137 and is incident on the imaging lens 138. On the other hand, the light originating from the processing laser beam L1 passes through the wavelength selection filter 137. The imaging lens 138 converges the light reflected by the wavelength selection filter 137 onto the imaging element 171.

[0051] The laser processing machine 1 is equipped with an image processing unit 500. The image processing unit 500 is connected to the imaging unit 170 and the control unit 400 in a communicable manner. The imaging unit 170 transmits the image data generated by the imaging element 171 to the image processing unit 500. When the image processing unit 500 receives the image data transmitted from the imaging unit 170, it performs image processing on the image data and generates data related to the processing state. The image processing unit 500 generates, for example, data representing the cut width as data related to the processing state. The cut width can be calculated, for example, by detecting the edges at both ends of the cut formed by laser processing and converting the distance between the edges on the image into a distance on the actual scale. When the image processing unit 500 generates data related to the processing state, it transmits the data to the control unit 400.

[0052] In addition, an auxiliary gas supply unit 180 is connected to the laser head 130. The auxiliary gas supply unit 180 is a device that supplies auxiliary gas into the nozzle 131. The auxiliary gas is used to remove the molten material during laser processing.

[0053] Return to Figure 1 For the description of , the laser head 130 is provided on the laser head drive unit 140 and can be moved in the X direction, Y direction, and Z direction by the laser head drive unit 140. The laser head drive unit 140 includes a gantry 140A, a slider 140B, and a lifting unit 140C.

[0054] The gantry 140A is provided along the Y direction on the upper parts of the frame 110A and the frame 110B. The laser head drive unit 140 includes a drive mechanism such as a ball screw mechanism that moves the gantry 140A in the X direction. The gantry 140A can be moved in the X direction by this drive mechanism. On the upper surface of the gantry 140A, a guide 140AG for guiding the slider 140B is provided along the Y direction.

[0055] The slider 140B is arranged in the range from the upper surface of the gantry 140A to the surface on the -X side. The laser head drive unit 140 includes a drive mechanism such as a ball screw mechanism that moves the slider 140B in the Y direction. The slider 140B can be moved in the Y direction by this drive mechanism. On the surface of the slider 140B on the -X side, a guide 140BG for guiding the lifting unit 140C is provided along the Z direction.

[0056] The lifting unit 140C is provided on the surface of the slider 140B on the -X side. The laser head drive unit 140 includes a drive mechanism such as a ball screw mechanism that moves the lifting unit 140C in the Z direction. The lifting unit 140C can be moved in the Z direction by this drive mechanism.

[0057] The laser head 130 is held at the lower part of the lifting unit 140C. The laser head 130 can move in the X direction above the laser processing area R1 by moving in the X direction through the gantry 140A. In addition, the laser head 130 can move in the Y direction above the laser processing area R1 by moving in the Y direction through the slider 140B. In addition, the laser head 130 can move in the Z direction above the laser processing area R1 by moving in the Z direction through the lifting unit 140C.

[0058] The transfer device 200 is a device for transferring the workpiece W that has been laser processed by the laser processing device 100. The transfer device 200 includes a carriage 210, a plate 220, and a plurality of workpiece holders 230.

[0059] The carriage 210 is arranged so as to be movable in the Y direction. The plate 220 is provided on the +Y side surface of the carriage 210. The plurality of workpiece holders 230 are arranged at intervals in the X direction in a state of protruding from the +Y side surface of the plate 220. The workpiece holder 230 can hold the workpiece W by clamping the end portion of the workpiece W.

[0060] The secondary processing device 300 is a device for performing secondary processing on the workpiece W and pushing down the slag in the secondary processing area R2. The secondary processing area R2 is an area that has a slag discharge space ES outside and below the worktable 120 when viewed from above.

[0061] The secondary processing device 300 includes a frame 310, a secondary processing unit 320, and a pushing-down unit 330.

[0062] The frame 310 includes a vertical frame 310A and a horizontal frame 310B. The vertical frame 310A is a plate-like member that stands up in the Z direction and extends in the X direction. The vertical frame 310A is formed of a single metal member, and the plate quality and plate thickness are set in such a way as to have sufficient strength for performing secondary processing on the workpiece W and pushing down the slag. The vertical frame 310A supports each part of the secondary processing device 300. An opening 310AO through which the workpiece W transferred by the transfer device 200 can pass is provided in the vertical frame 310A. The horizontal frame 310B is a plate-like member provided on the -Y side of the vertical frame 310A and extending in the X direction. The horizontal frame 310B supports the secondary processing unit 320 and the pushing-down unit 330 in a suspended state.

[0063] The secondary processing unit 320 is a device for performing secondary processing on the workpiece W. The secondary processing unit 320 is suspended on a guide member provided on the lower surface of the horizontal frame 310B along the X direction and can move in the X direction along the guide member. The secondary processing unit 320 includes a secondary processing tool 321 for performing secondary processing on the workpiece W. The secondary processing tool 321 is, for example, a tool for performing tapping processing to cut threads for screwing a screw in the cut surface of a hole formed in the workpiece W by drilling. When performing tapping processing on the hole of the workpiece W, the secondary processing unit 320 brings the secondary processing tool 321 into contact with the cut surface of the hole of the workpiece W and rotates it. In addition, the secondary processing unit 320 can perform tapping processing on a hole from which slag has been dropped by the dropping unit 330.

[0064] Here, the drilling is a process in which, while the workpiece W is supported by the workbench 120 having a plurality of protrusions 122A, a laser beam is irradiated along the contour of the hole to be formed in the workpiece W by the laser head 130. The slag usually falls off from the workpiece W and is removed. However, the slag that should have fallen sometimes is blocked by the protrusions 122A and does not fall, or is embedded in the hole and does not fall. In addition, even when cutting failure occurs, the slag that should have fallen sometimes adheres to the workpiece W and does not fall. The dropping unit 330 is a device for dropping the slag remaining in the hole formed in the workpiece W by drilling.

[0065] Figure 3 FIG. is an example of an external perspective view showing the dropping unit 330. The dropping unit 330 includes a striker support 331, a striker 332, a tool support 333, a plurality of rod-shaped tools 334, an annular member support 335, and a plurality of annular members 336.

[0066] The striker support 331 includes a frame 331A and a lifting drive unit 331B. The frame 331A supports the lifting drive unit 331B. The frame 331A is suspended on a guide member provided on the lower surface of the horizontal frame 310B along the X direction and can move in the X direction along the guide member. The lifting drive unit 331B raises and lowers the striker 332 by the driving force of a driving device such as an electric motor.

[0067] The striker 332 drives the rod-shaped tool 334 by descending. The striker 332 is formed in a cylindrical shape and is raised and lowered by the lifting drive unit 331B. The lower end portion of the striker 332 is formed to correspond to the shape of the upper end portion of the rod-shaped tool 334. The dropping of the slag is performed by the striker 332 descending and causing the rod-shaped tool 334 to descend.

[0068] The tool support 333 is provided at a position across the workpiece W from the annular member support 335 and supports a plurality of rod-shaped tools 334 along the X direction. The plurality of rod-shaped tools 334 are tools for pushing off the slag remaining in the hole. The plurality of rod-shaped tools 334 are formed in a rod shape and have different diameters.

[0069] The tool support body 333 includes a driving unit 333A and a plurality of elastic members 333B. The tool support body 333 is supported by a guide 310C provided on the wall surface of the vertical frame 310A, and is driven by the driving unit 333A to be movable in the X direction along the guide 310C. When the rod-shaped tool 334 is lowered by the striker 332, the tool support body 333 supports the rod-shaped tool 334 in such a manner that the lower end of the rod-shaped tool 334 protrudes downward. The plurality of elastic members 333B are provided corresponding to the plurality of rod-shaped tools 334, respectively, and elastically support the rod-shaped tool 334. The elastic member 333B is compressed when the striker 332 is lowered, and the rod-shaped tool 334 is raised to the original position before the lowering by the elastic force when the striker 332 is raised.

[0070] The annular member support 335 is provided at a position across the workpiece W from the tool support 333, and supports a plurality of annular members 336 provided along the X direction. The plurality of annular members 336 are members into which the rod-shaped tool 334 driven and lowered by the striker 332 can be inserted. The plurality of annular members 336 are each formed in a hollow cylindrical shape, and have different diameters.

[0071] The annular member support body 335 includes a driving unit 335A. The annular member support body 335 is supported by a guide 310D provided on the wall surface of the vertical frame 310A, and is driven by the driving unit 335A to be movable in the X direction along the guide 310D. The annular member support body 335 supports the annular member 336 in such a manner that when the slag remaining in the hole of the workpiece W is pushed down by the rod-shaped tool 334, the pushed down slag falls below the annular member support body 335.

[0072] Figure 4 This is a flowchart showing an example of a procedure for controlling a drilling process. Figure 5 and Figure 6 1 is a diagram showing an example of a procedure of a hole drilling process. In the following description, a procedure of a hole drilling process performed by the laser processing device 100 is described.

[0073] like Figure 5 As shown, the control unit 400 controls the operation of the laser processing device 100 to perform a cutting process by irradiating a laser beam along a closed path C1 (step S101 ).

[0074] In step S101, Figure 5As shown in (A) of , after the control unit 400 aligns the nozzle 131 of the laser head 130 with the center position Q1 of the contour WC of the hole to be formed in the workpiece W, it irradiates a laser beam from the nozzle 131. A light spot LS of the laser beam with a diameter D1 is formed on the upper surface of the workpiece W. Then, the control unit 400 moves the laser head 130 to a position Q2 where the light spot LS of the laser beam contacts the contour WC of the hole to be formed in the workpiece W.

[0075] As Figure 5 shown in (B) of , the control unit 400 moves the laser head 130 in such a way that the center of the light spot LS moves along a specified closed path C1. By moving the center of the light spot LS along the closed path C1, the light spot LS moves in contact with the contour WC of the hole to be formed in the workpiece W. The portion of the workpiece W irradiated with the laser beam melts, and when the light spot LS makes one round along the closed path C1, the slag S is cut off from the workpiece W. Thus, a hole is formed in the workpiece W along the closed path C1 which is the trajectory of the light spot LS.

[0076] Here, the slag S usually falls off from the workpiece W and is removed. However, as described above, the slag S that should have fallen off is sometimes blocked by the protrusion 122A from falling off and is embedded in the hole and does not fall off. In addition, even in the case of a cutting defect, the slag S that should have fallen off sometimes adheres to the workpiece W and does not fall off.

[0077] Therefore, as Figure 6 shown, the control unit 400 controls the operation of the laser processing apparatus 100 to perform a cutting process of irradiating a laser beam along a closed path C2 inside the closed path C1 (step S102).

[0078] In step S102, as Figure 6 shown in (A) of , the control unit 400 changes the diameter of the light spot LS to a diameter D2 smaller than the diameter D1. Then, as Figure 6 shown in (B) of , the control unit 400 moves the laser head 130 in such a way that the center of the light spot LS of the laser beam moves along the closed path C2. By moving the center of the light spot LS along the closed path C2, the laser beam irradiates along the periphery of the slag S. By irradiating the laser beam along the periphery of the slag S, even if the slag S is embedded in the hole, the laser beam irradiates the part where the slag S contacts the workpiece W. In addition, by irradiating the laser beam along the periphery of the slag S, even if the slag S adheres to the workpiece W, the laser beam irradiates the part where the slag S adheres to the workpiece W. As a result, the slag falls off from the workpiece W more reliably and is removed.

[0079] Here, for the workpiece W in a state where the slag S has not fallen off, when forming and tapping the hole portion, machining defects, die breakage, and tap breakage may occur. Therefore, since there is a possibility that the slag S has not fallen off, the control unit 400 performs a process for pushing down the slag S that may remain in the hole portion before forming and tapping the hole portion.

[0080] Figure 7 It is a flowchart showing an example of the sequence for controlling the pushing down of the slag S and the secondary processing. Figure 8 and Figure 9 It is a diagram showing an example of the sequence for pushing down the slag S. Figure 10 It is a reference diagram for explaining the diameter of the rod-shaped tool 334 and the diameter of the annular member 336 suitable for pushing down the slag S. In the following description, the sequence for pushing down the slag S and the secondary processing for all the hole portions formed in the workpiece W is described.

[0081] When the laser processing by the laser processing apparatus 100 is completed, the control unit 400 determines whether there are hole portions on the workpiece W (step S101). For example, if the opening machining program for forming the hole portions is included in the laser processing program, the control unit 400 determines that there are hole portions on the workpiece W.

[0082] In the case where it is determined that there are no hole portions on the workpiece W (step S201; No), the control unit 400 ends Figure 7 the process shown.

[0083] In the case where it is determined that there are hole portions on the workpiece W (step S201; Yes), the control unit 400 causes the transfer device 200 to transfer the workpiece W so as to position its hole portion at the processing position for pushing down the slag S (step S202). In the case where there are a plurality of hole portions on the workpiece W, the control unit 400 causes the transfer device 200 to transfer the workpiece W so as to position a certain hole portion among the plurality of hole portions at the processing position. By performing the process of step S202, as Figure 8 (A) of shows, the transfer device 200 transfers the workpiece W to position the hole portion at a prescribed processing position in the secondary processing region R2.

[0084] Moreover, the control unit 400 moves the tool support 333 of the secondary processing device 300 to position the rod-shaped tool 334 for pushing down the slag S to the processing position (step S203). For example, the control unit 400 moves the secondary processing unit 320 of the secondary processing device 300 to shift the secondary processing tool 321 to a position where there will be no interference when pushing down the slag S. Moreover, the control unit 400 selects, from among a plurality of rod-shaped tools 334 with different diameters, the rod-shaped tool 334 for pushing down the slag S according to the diameter of the hole portion. The diameter of the rod-shaped tool 334 for pushing down the slag S must be smaller than the diameter of the hole portion. However, if the diameter of the rod-shaped tool 334 is too small relative to the diameter of the hole portion, the force when the rod-shaped tool 334 pushes down the slag S may be insufficient. When the force when the rod-shaped tool 334 pushes down the slag S is insufficient, as shown in (A) of Figure 10 the slag S deposited on the workpiece W may still be deposited on the workpiece W without being pushed down. Therefore, the control unit 400 selects the rod-shaped tool 334 with the largest diameter among the rod-shaped tools 334 whose diameters are smaller than the diameter of the hole portion as the rod-shaped tool 334 for pushing down the slag S. Then, the control unit 400 moves the tool support 333 of the secondary processing device 300 to position the selected rod-shaped tool 334 at the processing position. By performing the process of step S203, as shown in (B) of Figure 8 the secondary processing device 300 moves the tool support 333 to position the selected rod-shaped tool 334 directly above the hole portion disposed at the processing position.

[0085] Moreover, the control unit 400 moves the ring-shaped member support 335 of the secondary processing device 300 to position the ring-shaped member 336 for pushing down the slag S to the processing position (step S204). For example, the control unit 400 selects, from among a plurality of ring-shaped members 336 with different diameters, the ring-shaped member 336 for pushing down the slag S according to the diameter of the hole portion. The diameter of the ring-shaped member 336 for pushing down the slag must be larger than the diameter of the hole portion. However, if the diameter of the ring-shaped member 336 is too large relative to the diameter of the hole portion, the force for supporting the workpiece W around the hole portion may be insufficient. When the force for supporting the workpiece W around the hole portion is insufficient, as shown in (B) of Figure 10 the workpiece W around the hole portion may not be able to fully withstand the force when the rod-shaped tool 334 pushes down the slag S and may deform. Therefore, the control unit 400 selects the ring-shaped member 336 with the smallest diameter among the ring-shaped members 336 whose diameters are larger than the diameter of the hole portion as the ring-shaped member 336 for pushing down the slag S. Then, the control unit 400 moves the ring-shaped member support 335 of the secondary processing device 300 to position the selected ring-shaped member 336 at the processing position. By performing the process of step S204, as shown in (B) of Figure 9As shown in (A) of FIG. , the secondary processing device 300 moves the annular member support 335 to position the selected annular member 336 directly below the hole portion disposed at the processing position.

[0086] Then, the control unit 400 causes the secondary processing device 300 to lower the impactor 332 to push down the slag S that may remain in the hole portion through the rod-shaped tool 334 (step S205). By performing the process of step S205, the secondary processing device 300 moves the impactor 332 to directly above the rod-shaped tool 334 for pushing down the slag S. Then, as Figure 9 shown in (B) of FIG. , the secondary processing device 300 lowers the impactor 332 to drive the rod-shaped tool 334 and pushes down the slag S through the rod-shaped tool 334. When using a rod-shaped tool 334 with a diameter appropriate for the diameter of the hole portion, as Figure 10 shown in (C) of FIG. , the slag S deposited on the workpiece W is reliably pushed down by the rod-shaped tool 334. In addition, when using an annular member 336 with a diameter appropriate for the diameter of the hole portion, as Figure 10 shown in (C) of FIG. , the workpiece W around the hole portion does not deform.

[0087] Then, the control unit 400 determines whether to perform secondary processing on the hole portion where the slag S has been pushed down (step S206). For example, if the program for performing secondary processing on the hole portion where the slag S has been pushed down is included in the secondary processing program, the control unit 400 determines to perform secondary processing.

[0088] In the case where it is determined to perform secondary processing (step S206; YES), the control unit 400 causes the secondary processing device 300 to move the secondary processing unit 320 to position the secondary processing tool 321 at the processing position (step S207). For example, the control unit 400 causes the secondary processing device 300 to move the tool support 333 so that the rod-shaped tool 334 is offset to a position where there will be no interference during secondary processing. In addition, the control unit 400 causes the secondary processing device 300 to move the annular member support 335 so that the annular member 336 is offset to a position where there will be no interference during secondary processing. Moreover, the control unit 400 causes the secondary processing device 300 to move the secondary processing unit 320 to position the secondary processing tool 321 at the processing position. By performing the process of step S207, the secondary processing device 300 moves the secondary processing unit 320 to position the secondary processing tool 321 directly above the hole portion disposed at the processing position.

[0089] Then, the control unit 400 drives the secondary processing device 300 to operate the secondary processing unit 320 to perform secondary processing on the hole portion (step S208). By executing the process of step S208, the secondary processing device 300 performs secondary processing such as tapping through the secondary processing tool 321 of the secondary processing unit 320.

[0090] In the case where it is determined in step S206 not to perform secondary processing (step S206; No), or after executing the process of step S208, the control unit 400 determines whether there is an unprocessed hole portion (step S209). For example, if an opening processing program for forming other hole portions in addition to the hole portions where the slag S has been pushed down is included in the laser processing program, the control unit 400 determines that there is an unprocessed hole portion.

[0091] In the case where it is determined that there is an unprocessed hole portion (step S209; Yes), the control unit 400 causes the transfer device 200 to transfer the workpiece W so as to position the unprocessed hole portion at the processing position for pushing down the slag S (step S202).

[0092] The control unit 400 repeatedly executes the processes from step S202 to step S209 until it is determined in step S209 that there is no unprocessed hole portion. As a result, the control unit 400 performs the operation of pushing down the slag S remaining in the hole portions formed in the workpiece W using the rod-shaped tool 334.

[0093] In the case where it is determined that there is no unprocessed hole portion (step S209; No), the control unit 400 ends Figure 7 the processing shown.

[0094] As described above, the laser processing machine 1 is a device that performs laser processing on a plate-shaped workpiece W. The laser processing machine 1 includes a worktable 120 having a plurality of protrusions 122A and supporting the workpiece W at the upper ends of the protrusions 122A. In addition, the laser processing machine 1 includes a laser head 130 that irradiates laser light along the contour WC of the hole portion to be formed in the workpiece W on the worktable 120 to perform opening processing. In addition, the laser processing machine 1 includes a transfer device 200 that transfers the workpiece W after being subjected to laser processing. In addition, the laser processing machine 1 includes a rod-shaped tool 334 that pushes down the slag S remaining in the hole portion. Moreover, the laser processing machine 1 transfers the workpiece W through the transfer device 200 until the hole portion formed by the opening processing is positioned at the processing position where there is a discharge space ES for the slag S outside and below the worktable 120 when viewed from above. Moreover, the laser processing machine 1 pushes down the slag S remaining in the hole portion through the rod-shaped tool 334 at the processing position. With this configuration, the laser processing machine 1 can reliably push down the slag S remaining in the hole portion without damaging the protrusions 122A of the worktable 120.

[0095] In addition, the laser processing machine 1 is provided with a secondary processing tool 321 for performing secondary processing on the hole portion from which the slag S has been pushed down by the rod-shaped tool 334. With this configuration, the laser processing machine 1 can perform secondary processing on the hole portion from which the slag S has been pushed down.

[0096] In addition, the laser processing machine 1 selects one of the rod-shaped tool 334 and the secondary processing tool 321 and positions it at the processing position. With this configuration, the laser processing machine 1 can push down the slag S without being interfered with by the secondary processing tool 321, and can perform secondary processing without being interfered with by the rod-shaped tool 334.

[0097] In addition, the laser processing machine 1 is provided with an annular member 336 that is disposed opposite to the rod-shaped tool 334 with the workpiece W interposed therebetween and into which the rod-shaped tool 334 can be inserted. Moreover, the laser processing machine 1 is provided with a plurality of sets each including one rod-shaped tool 334 and one annular member 336, and selects and uses one of the sets according to the size of the hole portion. With this configuration, the laser processing machine 1 can appropriately push down the slag S remaining in various hole portions having different sizes.

[0098] In addition, the laser processing machine 1 is provided with a control unit 400 that controls the operation of the rod-shaped tool 334. The control unit 400 performs the operation of pushing down the slag S by the rod-shaped tool 334 on all the hole portions formed in the workpiece W. With this configuration, the laser processing machine 1 can reliably push down the slag remaining in the hole portion.

[0099] Figure 11 FIG. is a flowchart showing another example of the sequence for controlling the pushing down of the slag S and the secondary processing. In the following description, the sequence for pushing down the slag S and performing secondary processing on the hole portion formed directly above the protrusion 122A of the worktable 120 among the hole portions formed in the workpiece W will be described. In Figure 11 the flowchart shown, the same reference numerals as those in the Figure 7 flowchart shown are assigned to the same processes as those in the Figure 7 flowchart shown. In the following description, the description of the processes assigned the same reference numerals as those in the Figure 7 flowchart shown will be omitted.

[0100] When the laser processing based on the laser processing apparatus 100 is completed, the control unit 400 determines whether there is a hole portion directly above the protrusion 122A of the worktable 120 (step S301). For example, the control unit 400 determines whether the opening processing program for forming a hole portion at the coordinates directly above the protrusion 122A is included in the laser processing program. Then, if the opening processing program for forming a hole portion at the coordinates directly above the protrusion 122A is included in the laser processing program, the control unit 400 determines that there is a hole portion directly above the protrusion 122A.

[0101] When it is determined that there is no hole portion directly above the protrusion 122A (step S301; NO), the control unit 400 ends Figure 11 the processing shown.

[0102] When it is determined that there is a hole portion directly above the protrusion 122A (step S301; YES), the control unit 400 executes the processing from step S202 to step S208.

[0103] When it is determined in step S206 that secondary processing is not to be performed (step S206; NO), or after the processing of step S208 is executed, the control unit 400 determines whether there is an unprocessed hole portion directly above the protrusion 122A (step S309). For example, the control unit 400 determines whether a drilling program for forming other hole portions at the coordinates directly above the protrusion 122A in addition to the hole portions where the slag S has been pushed down is included in the laser processing program. If a drilling program for forming other hole portions at the coordinates directly above the protrusion 122A is included in the laser processing program, the control unit 400 determines that there is an unprocessed hole portion directly above the protrusion 122A.

[0104] The control unit 400 repeatedly executes the processing from step S202 to step S309 until it is determined in step S309 that there is no unprocessed hole portion. As a result, the control unit 400 performs an operation of pushing down the slag S using the rod-shaped tool 334 on the hole portions formed on the workpiece W directly above the protrusion 122A.

[0105] When it is determined that there is no unprocessed hole portion (step S309; NO), the control unit 400 ends Figure 11 the processing shown.

[0106] As described above, the laser processing machine 1 includes a control unit 400 that controls the operation of the rod-shaped tool 334. Moreover, the control unit 400 performs an operation of pushing down the slag S using the rod-shaped tool 334 on the hole portions formed on the workpiece W directly above the protrusion 122A. With this configuration, the laser processing machine 1 can shorten the time required for the operation of pushing down the slag S.

[0107] Figure 12 It is a flowchart showing another example of the sequence for controlling the drilling process. In Figure 12 the flowchart shown, the same reference numerals as those in Figure 4 the flowchart shown are assigned to the same processing. In the following description, the description of the processing assigned with the same reference numerals as those in Figure 4 the flowchart shown is omitted. Figure 4 the flowchart shown.

[0108] After the process of step S102 is performed, the control unit 400 determines whether there is slag S remaining in the hole formed by the opening process (step S403). As described above, the imaging unit 170 transmits the image data generated by photographing the area irradiated with the processing laser beam L1 to the image processing unit 500. When the image processing unit 500 receives the image data transmitted from the imaging unit 170, it performs image processing on the image data and generates data related to the processing state. Then, the image processing unit 500 generates, for example, data representing the cut width as data related to the processing state and transmits this data to the control unit 400. Here, for the cut width at the end position of the opening process, when the slag S has fallen during the opening process, since the edge on the slag S side cannot be detected, it should be impossible to calculate the above-mentioned cut width. Therefore, if the control unit 400 calculates the cut width at the end position of the opening process by referring to the data representing the cut width, for example, it determines that there is slag S remaining in the hole formed by the opening process.

[0109] In the case where it is determined that there is no slag S remaining in the hole (step S403; NO), the control unit 400 ends Figure 12 the processing shown.

[0110] In the case where it is determined that there is slag remaining in the hole (step S403; YES), the control unit 400 sets the hole formed by the opening process as the object for pushing down the slag S (step S404) and ends Figure 12 the processing shown.

[0111] Figure 13 FIG. is a flowchart showing another example of the sequence for controlling the pushing down and secondary processing of the slag S. In the following description, the sequence for pushing down the slag S and performing secondary processing on the hole in which it has been determined that there is slag S remaining in the hole will be described. In Figure 13 the flowchart shown, the same reference numerals as those in the Figure 7 flowchart shown are assigned to the same processes as those in the Figure 7 flowchart shown. In the following description, the description of the processes assigned the same reference numerals as those in the Figure 7 flowchart shown will be omitted.

[0112] When the laser processing of the laser processing apparatus 100 ends, the control unit 400 determines whether there is a hole that has been set as the object for pushing down the slag S in step S404 (step S501). Figure 12

[0113] In the case where it is determined that there is no hole that has been set as the object for pushing down the slag S (step S501; NO), the control unit 400 ends Figure 13 the processing shown.

[0114] When it is determined that there is a hole portion to be the object of the pushing-down process set as the slag S (step S501; YES), the control unit 400 executes the processes from step S202 to step S208.

[0115] When it is determined in step S206 that no secondary processing is to be performed (step S206; NO), or after the process of step S208 is executed, the control unit 400 determines whether there is an unprocessed hole portion to be the object of the pushing-down process set as the slag S (step S509).

[0116] The control unit 400 repeatedly executes the processes from step S202 to step S509 until it is determined in step S509 that there is no unprocessed hole portion. As a result, the control unit 400 performs an operation of pushing down the slag S in the hole portion where it has been determined that the slag S remains in the hole portion, using the rod-shaped tool 334.

[0117] When it is determined that there is no unprocessed hole portion (step S509; NO), the control unit 400 ends Figure 13 the processing shown.

[0118] As described above, the laser processing machine 1 includes the control unit 400 that controls the operation of the rod-shaped tool 334. In addition, the laser processing machine 1 includes the imaging unit 170 that images the hole portion formed by the drilling process. Moreover, the control unit 400 determines whether the slag S remains in the hole portion based on the image captured by the imaging unit 170. Further, when the control unit 400 determines that the slag S remains in the hole portion, the control unit 400 performs an operation of pushing down the slag S in the hole portion using the rod-shaped tool 334. With this configuration, the laser processing machine 1 can not only reliably push down the slag remaining in the hole portion, but also shorten the time required for the operation of pushing down the slag.

[0119] As described above, the present invention has been described using the embodiments, but the technical scope of the present invention is not limited to the scope described in the above embodiments. It is obvious to those skilled in the art that various changes or improvements can be made to the above embodiments. As can be seen from the claims, the embodiments thus changed or improved are also included in the technical scope of the present invention. In addition, within the scope permitted by law, the disclosures of Japanese Patent Application No. 2020-107510 and all the documents cited in the above embodiments and the like are incorporated herein by reference as part of the present disclosure.

[0120] The execution order of each process such as actions, sequences, steps, and stages in the devices, systems, programs, and methods shown in the claims, specifications, and drawings is not specifically indicated as "earlier than", "before", etc. Additionally, it should be noted that as long as the output of the previous process is not used for the subsequent process, each process can be implemented in any order. Regarding the action flow in the claims, specifications, and drawings, even if terms such as "firstly", "secondly", etc. are used for convenience in the description, it does not mean that the implementation must follow this order.

[0121] Description of Reference Numerals

[0122] 1 Laser processing machine

[0123] 120 Workbench

[0124] 122A Protrusion

[0125] 130 Laser head

[0126] 170 Imaging unit

[0127] 200 Conveyor

[0128] 334 Rod-shaped tool

[0129] 336 Ring-shaped component

[0130] 321 Secondary processing tool

[0131] 400 Control unit

[0132] ES discharge space

[0133] S Slag

[0134] W Workpiece

[0135] WC Profile

Claims

1. A laser processing machine for laser processing of a plate-shaped workpiece, characterized in that, Comprising: A workbench having a plurality of protrusions and supporting the workpiece at the upper ends of the protrusions; A laser head that irradiates a laser beam along the contour of a hole portion to be formed in the workpiece on the workbench for drilling; A transfer device that transfers the workpiece after laser processing; and A rod-shaped tool that pushes down the slag remaining in the hole portion, The workpiece is transferred by the transfer device until the hole portion formed by the drilling is disposed at a processing position where, when viewed from above, there is a discharge space for the slag outside and below the workbench, At the processing position, the slag remaining in the hole portion that is embedded in the hole portion or cladded on the workpiece during the drilling using the laser head is pushed down by the rod-shaped tool.

2. The laser processing machine according to claim 1, wherein: It comprises a secondary processing tool that performs secondary processing on the hole portion from which the slag has been pushed down by the rod-shaped tool.

3. The laser processing machine according to claim 2, wherein: One of the rod-shaped tool and the secondary processing tool is selected and positioned at the processing position.

4. The laser processing machine according to claim 1, wherein: It comprises an annular member that is disposed with the workpiece therebetween relative to the rod-shaped tool and into which the rod-shaped tool can be inserted, A plurality of sets are configured with one rod-shaped tool and one annular member as a set, and one of the sets is selected for use according to the size of the hole portion.

5. The laser processing machine according to claim 2, wherein: It comprises an annular member that is disposed with the workpiece therebetween relative to the rod-shaped tool and into which the rod-shaped tool can be inserted, A plurality of sets are configured with one rod-shaped tool and one annular member as a set, and one of the sets is selected for use according to the size of the hole portion.

6. The laser processing machine according to claim 3, wherein: It comprises an annular member that is disposed with the workpiece therebetween relative to the rod-shaped tool and into which the rod-shaped tool can be inserted, A plurality of sets are configured with one rod-shaped tool and one annular member as a set, and one of the sets is selected for use according to the size of the hole portion.

7. The laser processing machine according to any one of claims 1 to 6, wherein: It comprises a control unit that controls the operation of the rod-shaped tool, The control unit performs the operation of pushing down the slag using the rod-shaped tool on all the hole portions formed in the workpiece.

8. The laser processing machine according to any one of claims 1 to 6, wherein: It comprises a control unit that controls the operation of the rod-shaped tool, The control unit performs the operation of pushing down the slag using the rod-shaped tool on the hole portion formed directly above the protrusion on the workpiece.

9. The laser processing machine according to any one of claims 1 to 6, wherein: Comprising: A control unit that controls the operation of the rod-shaped tool; and An imaging unit that images the hole portion formed by the opening process. The control unit determines whether slag remains in the hole portion based on the image captured by the imaging unit. When it is determined that slag remains in the hole portion, an operation of pushing down the slag in the hole portion using the rod-shaped tool is performed on the hole portion.

10. A workpiece processing method for processing a plate-shaped workpiece by laser processing, characterized in that, Comprising: Supporting the workpiece at the upper ends of a plurality of protrusions provided on the workbench. Performing an opening process by irradiating a laser beam along the contour of the hole portion to be formed in the workpiece on the workbench. Transporting the workpiece by a transport device until the hole portion formed by the opening process is disposed at a processing position where there is a discharge space for slag outside and below the workbench when viewed from above. Pushing down the slag remaining in the hole portion that has been embedded in the hole portion or cladded on the workpiece during the opening process with a rod-shaped tool at the processing position.

Images