Mounting device and method for manufacturing a semiconductor device

Abstract

The present application provides a mounting device for improving mounting alignment accuracy and a method for manufacturing a semiconductor device. The mounting device includes a rack table for mounting a mounting table, a beam portion extending in a first direction above the rack table, both ends of the beam portion being movably supported on the rack table in a second direction, a mounting head portion movably supported on the beam portion in the first direction, a reference member extending in the first direction and supported at both ends, the reference member being separate from the beam portion, and a detection head provided on the mounting head portion in opposition to the reference member. The detection head is configured to detect a positional relationship with the reference member.

Description

Technical Field

[0001] This disclosure relates to installation apparatus, such as an installation apparatus that can be applied to an installation apparatus having a beam. Background Technology

[0002] Conventionally, a component mounting device includes a placement machine. This machine holds a component from a component supply unit relative to a fixed substrate, transports the component above the substrate, and then lowers it to mount it onto the substrate. This placement machine needs to accurately reproduce the position of the held component in the XY direction (horizontal plane). On the other hand, to improve the productivity of mounting the substrate, it is also necessary to maximize the speed from transporting the component from the component supply unit to above the substrate and performing XY-direction positioning, or the speed from when the component is mounted back to the component supply unit.

[0003] Therefore, the mounting machine, as a mounting device, has a structure comprising an X-beam extending along the X-axis and fixed to a base, a Y-beam extending along the Y-axis and slidably mounted relative to the X-beam, and a mounting head slidably mounted relative to the Y-beam. This allows for accurate and high-speed transport of components.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: JP 2019-145607 Summary of the Invention

[0007] In the aforementioned installation device, bending may sometimes occur in the Y-beam on which the mounting head is slidably mounted due to the weight of the Y-beam and the mounting head or thermal deformation, resulting in poor installation alignment accuracy.

[0008] The subject of this disclosure is to provide a technique for improving installation alignment accuracy. Other subjects and new features will become clear from the description and accompanying drawings.

[0009] A brief summary of representative elements in this disclosure is provided below.

[0010] That is, the mounting device includes: a frame for mounting on a mounting platform; a beam extending in a first direction across the frame, with both ends of the beam movably supported on the frame in a second direction; a mounting head movably supported on the beam in the first direction; a reference member extending in the first direction and supported at both ends, separate from the beam; and a detection head disposed on the mounting head opposite the reference member. The detection head is configured to detect the positional relationship between itself and the reference member.

[0011] According to this disclosure, installation alignment accuracy can be improved. Attached Figure Description

[0012] Figure 1 This is a schematic top view showing the installation device in the comparative example.

[0013] Figure 2 It is shown schematically. Figure 1 The front view of the mounting device is shown.

[0014] Figure 3 It is shown schematically. Figure 1 A side view of the mounting device is shown.

[0015] Figure 4 This is an explanation Figure 1 A schematic front view showing the problem points of the installation device.

[0016] Figure 5 This is an explanation Figure 1 A schematic side view showing the problem points of the installation device.

[0017] Figure 6 This is an explanation Figure 1 A schematic top view showing the problem points of the installation device.

[0018] Figure 7 This is a schematic top view of the mounting device in the first embodiment.

[0019] Figure 8 It is shown schematically. Figure 7 A cross-section diagram shown along line AA.

[0020] Figure 9 It is shown schematically. Figure 7 The front view of the mounting device is shown.

[0021] Figure 10 It is shown Figure 7 A front view showing the bent state of the main beam.

[0022] Figure 11 It is shown Figure 10 The front view shows the mounting head in a state on the right.

[0023] Figure 12 The mounting device in the first variation is equivalent to Figure 7 A cross-sectional view of the section along line AA is shown.

[0024] Figure 13 It is shown Figure 12 A cross-sectional view showing the torsional state of the main beam in the mounting device.

[0025] Figure 14 This is a schematic top view of the mounting device in the second embodiment.

[0026] Figure 15 It is shown schematically. Figure 14 The front view of the mounting device is shown.

[0027] Figure 16 yes Figure 14 The cross-sectional view shown along line AA.

[0028] Figure 17 It is shown Figure 16 A cross-sectional view showing the torsional state of the main beam in the mounting device.

[0029] Figure 18 This is a diagram illustrating the linear scale in the second embodiment.

[0030] Figure 19 This is a schematic top view showing the mounting device in the second variation.

[0031] Figure 20 It is shown Figure 19 A top view showing the bent state of the main beam.

[0032] Figure 21 This is a schematic top view showing the mounting device in the third embodiment.

[0033] Figure 22 It is shown schematically. Figure 21 The front view of the mounting device is shown.

[0034] Figure 23 yes Figure 21 The cross-sectional view shown along line AA.

[0035] Figure 24 It is shown Figure 22 A front view showing the bent state of the main beam.

[0036] Figure 25 It is shown Figure 23 A cross-sectional view showing the torsional state of the main beam section.

[0037] Figure 26 This is a schematic front view showing the mounting device in the third variation.

[0038] Figure 27 It is equivalent to Figure 21 A cross-sectional view showing the location of line AA.

[0039] Figure 28 This is a schematic front view showing the mounting device in the fourth variation.

[0040] Figure 29 It is equivalent to Figure 21 A cross-sectional view showing the location of line AA.

[0041] Figure 30 This is a schematic front view showing the mounting device in the fifth variation.

[0042] Figure 31 It is equivalent to Figure 21 A cross-sectional view showing the location of line AA.

[0043] Figure 32 This is a schematic top view showing the mounting device in the fourth embodiment.

[0044] Figure 33 It is shown schematically. Figure 32 The front view of the mounting device is shown.

[0045] Figure 34 It is shown Figure 8 The diagram shows the installation head and other parts of the mounting device tilted.

[0046] Figure 35 This is a diagram illustrating a method for fixing a support member based on a reference beam.

[0047] Figure 36 This is a schematic top view illustrating an embodiment of the flip-chip placement machine.

[0048] Figure 37 This means that in Figure 36 The diagram shows the actions of the inverted head, transfer head, and mounting head when viewed from the direction of arrow A.

[0049] Figure 38 It is shown Figure 36 A schematic cross-sectional view of the main parts of the bare chip supply department.

[0050] Figure 39 It is shown Figure 36 A schematic side view of the main parts of the mounting section.

[0051] Figure 40 It is shown that... Figure 36 The flowchart shown illustrates the placement method implemented by the flip-chip placement machine.

[0052] The reference numerals in the attached figures are explained as follows:

[0053] 100 Installation Device

[0054] 110 platforms

[0055] 120 installation platform

[0056] 140Y beam

[0057] 150 Install Head

[0058] 171 Reference Beam (Reference Component)

[0059] 174 detection heads Detailed Implementation

[0060] The following description uses the accompanying drawings to illustrate comparative examples, embodiments, modifications, and examples. However, in the following description, the same reference numerals are used to refer to the same constituent elements, and repeated descriptions are sometimes omitted. Furthermore, to make the description clearer, the width, thickness, shape, etc., of the parts in the drawings are sometimes schematically shown compared to the actual form, but this is merely an example and does not limit the interpretation of this disclosure.

[0061] First, use Figures 1-3 Explain the installation device in the comparative example. Figure 1 This is a schematic top view showing the installation device in the comparative example. Figure 2 It is shown schematically. Figure 1 Front view of the mounting device. Figure 3 It is shown schematically. Figure 1 Side view of the mounting device.

[0062] The mounting device 100R in the comparative example is a device that transports a component 300 from a component supply unit (not shown) to a position above a workpiece 200 and mounts the transported component 300 onto the workpiece 200. The mounting device 100 includes a frame 110, a mounting platform 120 supported on the frame 110, an X-support platform 131 provided on the frame 110, a Y-beam 140 supported on the X-support platform 131, and a mounting head 150 supported by the Y-beam 140. Furthermore, the X-axis and Y-axis directions are directions orthogonal to each other in the horizontal plane. In this comparative example, the direction extending along the Y-beam 140 is defined as the Y-axis direction (first direction), and the direction orthogonal to it is defined as the X-axis direction (second direction). Additionally, the Z-axis direction (third direction) is a vertical direction perpendicular to the XY plane. A linear scale 161 extending along the Y-axis direction is provided on the Y-beam 140.

[0063] The mounting head 150 includes a mounting head 151 with a retaining mechanism that allows for easy attachment and removal of the retaining member 300, and a drive unit 152 that drives the mounting head 150 along the Z-axis direction. The drive unit 152 is mounted on the Y-beam 140 and is movable back and forth in the Y-axis direction. The detection head 162 is positioned above the drive unit 152 of the mounting head 150 so that the detection head 162 is opposite to the linear scale 161.

[0064] In this comparative example, the mounting head 150 has three mounting heads 151, each mounting head 151 having a holding mechanism 151a with a nozzle held by the vacuum suction holding member 300. Furthermore, the drive unit 152 enables each mounting head 151 to move independently up and down in the Z-axis direction. The mounting head 151 functions to hold and transport the member 300 and to mount the member 300 onto the workpiece 200 that is suction-fixed to the mounting stage 120.

[0065] The guide rail 132 on the X support platform 131 is a component that slides freely in the X-axis direction to guide the Y beam 140. In this comparative example, the two X support platforms 131 are arranged in parallel, and each X support platform 131 is fixed to the frame 110 in a state of extending in the X-axis direction. The X support platform 131 may also be integrally formed with the frame 110.

[0066] A slider 143 is mounted on the guide rail 132 and is movable in the X-axis direction. Furthermore, each foot 142 of the Y-beam 140 is mounted on each slider 143 of the two guide rails 132. That is, the main beam 141 of the Y-beam 140 extends in the Y-axis direction across the mounting platform 120, and each foot 142 at both ends is mounted on the slider 143 and is movable in the X-axis direction by the guide rails 132 mounted on the X-support platform 131. Moreover, the bottom surface of the main beam 141 and the bottom surface of the foot 142 (the upper surface of the slider 143) are on the same plane; therefore, the main beam 141 is positioned at a position not much higher than the X-support platform 131.

[0067] Y-beam 140 is a rod-shaped component that extends along the Y-axis. The XZ section of Y-beam 140 has a frustum shape, which is a combination of quadrilaterals and right triangles.

[0068] The Y-beam 140 is a component that guides the reciprocating movement of the mounting head 150 in the Y-axis direction. When the reciprocating mounting head 150 vibrates, defects such as the falling off of the held component 300 may occur. In addition, in order to transport the component 300 to the accurate position, bending and other defects must be suppressed as much as possible. Therefore, the Y-beam 140 needs to have sufficient structural strength. On the other hand, since the Y-beam 140 is a component that moves linearly along the X-support platform 131 together with the mounting head 150, the lighter it is, the faster it can transport the component 300.

[0069] Next, use Figures 4-6 Explain the problems with the installation device in the comparative example. Figure 4 This is a schematic front view illustrating the problems with the installation device in the comparative example. Figure 5 This is a schematic side view illustrating the problems with the installation device in the comparative example. Figure 6 This is a schematic top view illustrating the problems with the installation device in the comparative example.

[0070] like Figure 4 As shown, the main beam 141 bends due to the weight of the main beam 141 and the mounting head 150, or due to the thermal expansion of the main beam 141 (first problem point). As a result, the mounting head 150 affects tilt, mounting position (placement position), and tilt of components (e.g., bare chips).

[0071] In addition, such as Figure 5 As shown, the main beam 141 twists due to the weight of the main beam 141 and the mounting head 150, or due to the thermal expansion of the main beam 141 (the second problem point). As a result, the mounting head 150 tilts, thereby affecting the tilt of the mounting position (placement position) and components (e.g., bare chips).

[0072] In addition, such as Figure 6 As shown, the main beam 141 bends due to thermal expansion (the third problem point). As a result, the mounting head 150 affects tilt, mounting position (placement position), and tilt of components (e.g., bare chips). The linear scale 161 provided on the main beam 141 is also affected by the deformation; therefore, it is impossible to use the detection head 162 to capture and correct the effects caused by the deformation of the main beam 141.

[0073] In the mounting apparatus of this disclosure, to address at least one of the aforementioned problems, a reference member (e.g., a beam-shaped member) is prepared as a reference for measuring the position of the mounting head. The reference member is preferably made of a material that is resistant to heat and is lightweight and highly rigid. Furthermore, the reference member is held in a position separate from the main beam portion, unaffected by heat, weight, or deformation of the main beam portion. Moreover, a sensor for detecting the position of the mounting head is provided at the mounting head. The sensor can measure either the reference member itself or be positioned on the reference member.

[0074] The following examples illustrate several representative embodiments and their variations. In the following descriptions of the embodiments and variations, the same reference numerals as those used in the comparative examples are used for parts having the same structure and function as those described in the comparative examples. Furthermore, the descriptions of these parts are appropriately applied to the extent that they do not contradict the technical specifications. Additionally, all or part of the comparative examples, all or part of multiple embodiments, and all or part of multiple variations may be appropriately combined to the extent that they do not contradict the technical specifications.

[0075] <First Implementation>

[0076] In the first embodiment, a sensor is used to detect the position of the mounting head, and the reference member itself is used as the object of measurement by the sensor.

[0077] use Figures 7-9 The configuration of the mounting device in the first embodiment will be explained. Figure 7 This is a schematic top view of the mounting device in the first embodiment. Figure 8 yes Figure 7 The cross-sectional view shown along line AA. Figure 9 It is shown schematically. Figure 7 The front view of the mounting device is shown. Figure 35 This is a diagram illustrating a method for fixing a support member based on a reference beam. Furthermore, in Figure 8 as well as Figure 9 The installation head 151 is omitted.

[0078] The mounting device 100 in the first embodiment has the same configuration as the mounting device 100R in the comparative example. However, the mounting device 100 in the first embodiment also includes a reference beam 171 as a reference member, support members 172 and 173 supporting the reference beam 171, and a detection head 174.

[0079] The reference crossbeam 171 is positioned separately from the main beam portion 141 and is located parallel to the main beam portion 141 below the main beam portion 141 of the Y-beam 140. The reference crossbeam 171 is, for example, a quadrangular prism, and is preferably made of a lightweight, high-rigidity material that is not easily affected by heat (resulting in a smaller coefficient of thermal expansion). The reference crossbeam 171 can be formed, for example, using ceramics, silicon carbide (SiC), carbon fiber reinforced plastic (CFRP), ceramic-impregnated aluminum alloy, Invar alloy, or quartz glass (SiO2). The reference crossbeam 171 is supported by a pair of support members 172 and 173.

[0080] Support members 172 and 173 are crank-shaped in the front view, having a first extension and a second extension extending along the Y-axis, and a third extension extending in the vertical direction and connecting the first and second extensions. The first extension is fixed between the foot 142 and the slider 143. The second extension is located below the first extension and supports the reference crossbeam from below.

[0081] The reference beam 171 deforms in the Y-axis direction of the platform 110 due to the expansion of the Y-beam 140, etc. Furthermore, the support members 172 and 173 sometimes move along with the deformation of the platform. The reference beam 171 is preferably supported by the support members 172 and 173 in a manner unaffected by the movement of the support members 172 and 173. For example, one end of the reference beam 171 is fixed to the support member 172 as a reference, while the other end of the reference beam 171 is freely held by the support member 173.

[0082] Specifically Figure 9 The end of the reference beam 171 within the dashed ellipse A is fixed with screws or the like in the straight line direction (Y-axis direction) and the rotation direction (X-axis direction), which is set as the reference for the reference beam 171. Figure 9 The end of the reference beam 171 within the dashed ellipse B is as follows: Figure 9 As shown in B1 and B2, a key 171a is provided on the reference beam 171, and a groove 173a is provided on the support member 173. Here, Figure 9 B2 is a cross-sectional view along line CC shown in B1. Thus, the reference beam 171 can have its rotation direction fixed and can move in a straight line. In this way, if one end of the reference beam 171 is fixed, the rotation direction is constrained, and the other end is supported by a sliding mechanism, it is less susceptible to overall torsion. Furthermore, since the load applied to the reference beam 171 is not considered based on the accuracy of construction or operation, using screws or similar fasteners to fix the support member 172 is a simple construction, thus reducing cost. Figure 9 The end of the reference beam 171 within the dashed ellipse A can also be as follows: Figure 35 As shown, the beam is fixed to the support member 172 by means of a fixing member 176 in a manner that allows rotation within the XY plane. As a result, it becomes difficult to apply force to the reference beam 171 if the parallelism of the support members 172 and 173 cannot be maintained.

[0083] like Figure 8 As shown, the detection head 174 is located below the main beam 141 and mounted on the lower part of the drive unit 152. The detection head 174 is equipped with a sensor (displacement sensor) for measuring the distance (d) between itself and the reference crossbeam 171. The mounting device 100 is equipped with a control device for monitoring and controlling the movement of each part. The control device controls the drive unit that drives the Y-beam 140 in the X-axis direction and the drive unit that drives the mounting head 150 in the Y-axis direction based on the position measured by the detection head 174, thereby correcting the position of the mounting head 150. This will be explained in detail later.

[0084] Here, the displacement sensor is explained. A displacement sensor is mounted on the mounting head to measure the distance to the reference beam in each direction. As in this embodiment, when the reference beam is below the displacement sensor, the distance in the Z direction can be measured. When the reference beam is to the side of the displacement sensor, the distance in the X or Y direction can be measured. The reference beam is designed as a non-deformable component, so that any changes in the measured value can be identified as positioning errors. For example, an optical (triangulation / coaxial confocal) type displacement sensor is used. The coaxial confocal method has the advantages of high accuracy and space saving. Here, if there is a deviation from the focal point, it becomes undetectable, but if it is within the focal distance, it can stably receive light even if the object is tilted. In the case of the triangulation method, a CMOS or CCD sensor is used as the light-receiving element, thereby becoming less susceptible to the influence of uneven color or surface condition of the object.

[0085] Next, use Figure 10 as well as Figure 11 Instructions for adjusting the position of the mounting head by 150. Figure 10 It is shown Figure 7 A front view showing the bent state of the main beam. Figure 11 It is shown Figure 10 The front view shows the mounting head in a state on the right.

[0086] like Figure 10 As shown, if the main beam 141 bends, the height of the mounting head 150 changes. The control device can correct the height of the mounting head 151 based on the amount of bending of the main beam 141 by measuring the distance (d) between the detection head 174 provided on the mounting head 150 and the reference crossbeam 171.

[0087] Furthermore, the control device calculates the bending of the beam section based on the height changes at various positions of the mounting head 150 along the Y-axis. Here, the position of the mounting head 150 in the Y-axis direction is calculated based on data obtained by reading a linear scale 161 provided on the main beam section 141 using a detection head 162 provided on the mounting head 150. Then, as... Figure 11 As shown, the control device calculates the tilting amount (θ) of the mounting head 150 and corrects the positioning error (ΔY) of the workpiece 200 to the target point.

[0088] (First variation)

[0089] use Figure 12 as well as Figure 13 Explain the mounting device in the first variation. Figure 12 The mounting device in the first variation is equivalent to Figure 7 A cross-sectional view of the section along line AA is shown. Figure 13 It is shown Figure 12A cross-sectional view showing the torsional state of the main beam in the mounting device.

[0090] In the first embodiment, such as Figure 5 As shown, when the main beam 141 is torsional, the position of the mounting head 150 cannot be determined. Therefore, in the first modified example, a detection head 175 with a displacement sensor is added.

[0091] The mounting head 150 is provided with a detection head 174 positioned separately from the upper surface of the reference beam 171 in the Z direction. The mounting head 175 is provided with the mounting head 150 positioned separately from the side of the reference beam 171 in the X direction. The detection head 174 can be used to measure the distance in the Z direction, and the detection head 175 can be used to measure the distance in the X direction.

[0092] like Figure 13 As shown, when the main beam 141 is twisted, the detection head 175 approaches the reference crossbeam 171, while the detection head 174 moves away from the reference crossbeam 171. That is, the distance between the detection head 175 and the reference crossbeam 171 in the X direction decreases, and the distance between the detection head 174 and the reference crossbeam 171 in the Z direction increases. Based on this, the control device calculates the amount of twist of the mounting head 150 and corrects the positioning error (ΔX) between the workpiece 200 and the target point.

[0093] <Second Implementation>

[0094] In the second embodiment, a position reading sensor is used as a sensor to detect the position of the mounting head, and a linear scale provided on the reference member is used as the measurement object of the sensor.

[0095] Next, use Figures 14-17 The installation device in the second embodiment is described. Figure 14 This is a schematic top view of the mounting device in the second embodiment. Figure 15 It is shown schematically. Figure 14 The front view of the mounting device is shown. Figure 16 yes Figure 14 The cross-sectional view shown along line AA. Figure 17 It is shown Figure 16 A cross-sectional view showing the torsional state of the main beam in the mounting assembly. Furthermore, in Figures 15-17 The installation head 151 is omitted.

[0096] The mounting device 100 in the second embodiment has the same configuration as the mounting device 100 in the first embodiment. However, the mounting device 100 in the second embodiment replaces the reference beam 171 with a reference beam 271 having a linear scale 261 on its upper surface, and replaces the detection head 174 with a detection head 274 having a sensor with the same reading position as the detection head 162. In addition, it does not have the linear scale 161 and the detection head 162 as in the first embodiment.

[0097] The reference beam 271 has the same configuration as the reference beam 171, except that it has a linear scale 261 on its upper surface. Like the reference beam 171, the reference beam 271 is supported by a pair of support members 172 and 173 in a manner that is not affected by the movement of the support members 172 and 173.

[0098] use Figure 18 Explain the linear scale 261. Figure 18 This is a diagram illustrating the linear scale in the second embodiment.

[0099] The linear scale 261 comprises a scale 261a having a pattern that allows reading of its position in the Y-axis direction, and a scale 261b having a pattern that allows reading of its position in the X-axis direction. Scale 261a is configured to extend along the Y-axis direction. Scale 261b are adjacent to each other in the X-axis direction and are configured to extend along the Y-axis direction.

[0100] The detection head 274 includes sensors 274a and 274b for reading scale 261a and sensor 274c for reading scale 261b. Sensor 274a is configured such that the optical axis is perpendicular to scale 261a. Sensor 274c is configured such that the optical axis is perpendicular to scale 261b. The position in the X-axis direction is read using sensor 274a, and the position in the X-axis direction is read using sensor 274c.

[0101] Sensors 274b and 274a are adjacent in the Y-axis direction and are configured with their optical axes tilted relative to scale 261a. When the height of the detection head 274 changes, the position where the optical axis of sensor 274b intersects with scale 261a changes, thus changing the position read by sensor 274b in the Y-axis direction. The control device then calculates the difference (dy) between the position read by sensor 274b and the position read by sensor 274a in scale 261a. This difference (dy) changes due to the height of the detection head 274. The control device then calculates the change (dz) in the Z-axis position based on this change in difference (dy), thus determining the position in the Z-axis.

[0102] Therefore, the orientation of the mounting head 150 in the X-axis, Y-axis, and Z-axis directions can be detected using a single detection head 274. Thus, as... Figure 4 ( Figure 11 As shown in the diagram, when the main beam 141 is bent, the positioning error (ΔY) in the Y-axis direction can be corrected based on the position of the mounting head 150 in both the Y-axis and Z-axis directions. Furthermore, as... Figure 6 As shown, when the main beam 141 is bent, the positioning error (ΔX) in the X-axis direction can be corrected based on the position of the mounting head 150 in both the X-axis and Y-axis directions. Furthermore, as... Figure 17 As shown, when the main beam 141 is torn, the positioning error (ΔX) in the X-axis direction can be corrected based on the position (dX) in the X-axis direction and the position (d) in the Z-axis direction of the mounting head 150.

[0103] (Second variation)

[0104] use Figure 19 as well as Figure 20 Explain the mounting device in the second variation. Figure 19 This is a schematic top view showing the mounting device in the second variation. Figure 20 It is shown Figure 19 A top view showing the bent state of the main beam.

[0105] In the second variation, the mounting device 100 replaces the support members 172 and 173 and the detection head 274 that support the reference beam 271 in the second embodiment, and has support members 372 and 373 and the detection head 374 that support the reference beam 371.

[0106] The reference beam 371 is located on the side of the main beam portion 141 of the Y-beam 140, and is parallel to the main beam portion 141 at a position separate from it. The reference beam 371 is formed using the same shape and material as the reference beam 171. Like the reference beam 171, the reference beam 371 is supported by a pair of support members 372 and 373 in a manner unaffected by the movement of the support members 372 and 373.

[0107] Support members 372 and 373 have the same construction as support members 172 and 173. That is, support members 372 and 373 are crank-shaped when viewed from above, and have a first extension and a second extension extending along the Y-axis, and a third extension extending in the X-direction and connecting the first extension and the second extension. The first extension is fixed to the foot 142. The second extension is located separately from the main beam 141 in the X-direction compared to the first extension, and supports the reference crossbeam 371 from the side.

[0108] The reference beam 371 has the same linear scale as the reference beam 271 at a position opposite to the detection head 374. In addition, the detection head 374 has the same sensor as the detection head 162 in the first embodiment at the same position.

[0109] The detection head 374, configured on the mounting head 150, reads the linear scale of the reference crossbeam 371, which is separately configured from the main beam 141 in the X direction, and measures the position of the mounting head 150. The reference crossbeam 371 is not affected by the deformation of the main beam 141, and its positional relationship with the sensor of the detection head 374 changes.

[0110] Therefore, the orientation of the mounting head 150 in the X-axis, Y-axis, and Z-axis directions can be detected using a single detection head 374. Thus, as... Figure 4 ( Figure 11 As shown, when the main beam 141 is bent, the positioning error in the Y-axis direction can be corrected based on the position of the mounting head 150 in both the Y-axis and Z-axis directions. Furthermore, as... Figure 20 As shown, when the main beam 141 is bent, the positioning error in the X-axis direction can be corrected based on the position of the mounting head 150 in both the X-axis and Y-axis directions. Furthermore, as... Figure 17 As shown, when the main beam 141 is torn, the positioning error in the X-axis direction can be corrected based on the position of the mounting head 150 in the X-axis and Z-axis directions.

[0111] <Third Implementation Method>

[0112] In the third embodiment, a position reading sensor is used as a sensor to detect the position of the mounting head, and two reference members are used, with a linear scale set on each reference member serving as the measurement object of the sensor.

[0113] use Figures 21-23 The configuration of the mounting device in the third embodiment will be explained. Figure 21 This is a schematic top view of the mounting device in the third embodiment. Figure 22 It is shown schematically. Figure 21 The front view of the mounting device is shown. Figure 23 yes Figure 21 The cross-sectional view shown along line AA. Furthermore, in Figure 22 as well as Figure 23 The installation head 151 is omitted.

[0114] The mounting device 100 in the third embodiment has the same configuration as the mounting device 100 in the second embodiment. However, the mounting device 100 in the third embodiment replaces the support members 172 and 173 with support members 472 and 473, and the mounting device 100 in the third embodiment also includes a reference beam 471 and a detection head 474.

[0115] The reference beam 471 has the same configuration as the reference beam 271. However, the reference beam 471 has a linear scale 261 on its lower surface. Like the reference beam 171, the reference beams 271 and 471 are supported by a pair of support members 472 and 473 in a manner unaffected by the movement of the support members 472 and 473.

[0116] Support members 472 and 473, when viewed from above, include a first extension, a second extension, and a fourth extension extending along the Y-axis, and a third extension extending vertically and connecting the first, second, and fourth extensions. The first extension is fixed between the foot 142 and the slider 143. The second extension is located below the first extension and supports the reference beam 271 from below. The fourth extension is located above the first extension and supports the reference beam 471 from below.

[0117] The detection head 474 is located above the main beam 141 and below the reference crossbeam 471, and is mounted on the upper part of the drive unit 152. The detection head 474 has the same configuration as the detection head 274.

[0118] The detection heads 274 and 474, configured on the mounting head 150, read the linear scales of the reference crossbeams 271 and 471, which are separately configured from the main beam 141 in the Z direction, and measure the position of the mounting head 150. The reference crossbeams 271 and 471 are not affected by the deformation of the main beam 141, and their positional relationship with the sensors of the detection heads 274 and 474 changes.

[0119] Next, use Figure 24 as well as Figure 25 Instructions for adjusting the position of the mounting head by 150. Figure 24 It is shown Figure 22 A front view showing the bent state of the main beam. Figure 25 It is shown Figure 23 A cross-sectional view showing the torsional state of the main beam section.

[0120] The mounting head 150 can be positioned in three directions—X-axis, Y-axis, and Z-axis—using detection heads 274 and 474. Therefore, as... Figure 24As shown, when the main beam 141 is bent, the positioning error (ΔY) in the Y-axis direction can be corrected based on the positions (dy) of the detection heads 274 and 474 in the Y-axis direction and the positions (dz) in the Z-axis direction. Furthermore, as... Figure 6 As shown, when the main beam 141 is bent, the positioning error in the X-axis direction can be corrected based on the positions of the detection heads 274 and 474 in the X-axis and Y-axis directions. Furthermore, as... Figure 25 As shown, when the main beam 141 is torn, the positioning error (ΔX) in the X-axis direction can be corrected based on the position (dX) in the X-axis direction and the position (dz) in the Z-axis direction of the detection heads 274 and 474.

[0121] (Third variation)

[0122] use Figure 26 as well as Figure 27 Explain the configuration of the mounting device in the third variation. Figure 26 This is a schematic front view showing the mounting device in the third variation. Figure 27 yes Figure 21 The cross-sectional view shown corresponds to the position of line AA. Furthermore, in Figure 26 as well as Figure 27 The installation head 151 is omitted in the text.

[0123] The mounting device 100 in the third variation has the same configuration as the mounting device 100 in the third embodiment. However, the mounting device 100 in the third variation replaces the support members 472 and 473 and has the support members 172 and 173 of the second embodiment, and replaces the reference beam 471 and has the reference beam 571.

[0124] The reference beam 571 has the same configuration as the reference beam 271. However, the reference beam 571 has a linear scale 261 on its lower surface side. Like the reference beam 271, the reference beam 571 is supported on the upper surface side of the pair of feet 142 in a manner unaffected by the movement of the feet 142.

[0125] In this modified example, the detection heads 274 and 474, configured on the mounting head 150, read the linear scales of the reference crossbeams 271 and 471, which are separately configured from the main beam 141 in the Z direction, and measure the position of the mounting head 150. The reference crossbeams 271 and 471 are unaffected by the deformation of the main beam 141, and their positional relationship with the sensors of the detection heads 274 and 474 changes. Furthermore, the posture of the mounting head 150 in the X-axis, Y-axis, and Z-axis directions can be detected using the detection heads 274 and 474. Therefore, in this modified example, similar to the third embodiment, positioning errors (ΔX, ΔY) can be corrected.

[0126] (Fourth variation)

[0127] use Figure 28 as well as Figure 29 Explain the configuration of the mounting device in the fourth variation. Figure 28 This is a schematic front view showing the mounting device in the fourth variation. Figure 29 yes Figure 21 The cross-sectional view shown corresponds to the position of line AA. Furthermore, in Figure 28 as well as Figure 29 The installation head 151 is omitted.

[0128] The mounting device 100 in the fourth modification has the same configuration as the mounting device 100 in the third modification. However, the mounting device 100 in the fourth modification replaces the support members 172, 173 and the reference beam 271 with a reference beam 671, and replaces the detection head 274 with a detection head 674.

[0129] The reference beam 671 has the same configuration as the reference beam 571. However, like the reference beam 571, the reference beam 671 is supported on the lower side of the pair of feet 142 in a manner unaffected by the movement of the feet 142.

[0130] The detection head 674 is located below the main beam 141 and the reference crossbeam 671, and is installed at the lower part of the drive unit 152. The detection head 674 has the same structure as the detection head 274, but is installed by reading the linear scale of the reference crossbeam 671 located above.

[0131] In this modified example, the detection heads 674 and 474, configured on the mounting head 150, read the linear scales of the reference crossbeams 671 and 571, which are separately configured from the main beam 141 in the Z direction, and measure the position of the mounting head 150. The reference crossbeams 671 and 571 are unaffected by the deformation of the main beam 141, and their positional relationship with the sensors of the detection heads 674 and 474 changes. Furthermore, the posture of the mounting head 150 in the X-axis, Y-axis, and Z-axis directions can be detected using the detection heads 674 and 474. Therefore, in this modified example, similar to the third embodiment, positioning errors (ΔX, ΔY) can be corrected.

[0132] (Fifth variation)

[0133] use Figure 30 as well as Figure 31 Explain the configuration of the mounting device in the fifth variation. Figure 30 This is a schematic front view showing the mounting device in the fifth variation. Figure 31 yes Figure 21The cross-sectional view shown corresponds to the position of line AA. Furthermore, in Figure 30 as well as Figure 31 The installation head 151 is omitted.

[0134] The mounting device 100 in the fifth modification has the same configuration as the mounting device 100 in the third modification. However, the mounting device 100 in the fifth modification replaces the support members 172, 173 and the reference beam 271 with support members 772, 773 and the reference beam 771, replaces the detection head 274 with the detection head 774, and replaces the reference beam 571 and the detection head 474 with the reference beam 871 and the detection head 874.

[0135] The reference beam 771 has the same configuration as the reference beam 271. However, the reference beam 771 has a linear scale 261 on its side. Like the reference beam 271, the reference beam 771 is supported by a pair of support members 772 and 773 in a manner unaffected by the movement of the support members 772 and 773.

[0136] The reference beam 871 has the same configuration as the reference beam 571. However, the reference beam 871 has a linear scale 261 on one side. Like the reference beam 571, the reference beam 871 is supported on the upper surface of the pair of feet 142 in a manner unaffected by the movement of the feet 142.

[0137] Like support members 172 and 173, support members 772 and 773 are crank-shaped in front view, and have a first extension and a second extension extending along the Y-axis, and a third extension extending in the vertical direction and connecting the first extension and the second extension. The first extension is fixed between the foot 142 and the slider 143. The second extension is located below the first extension and supports the reference crossbeam from below. However, in this modified example, the third extension is configured to be shorter than the third extension in support members 172 and 173.

[0138] The detection head 774 is mounted on the lower part of the drive unit 152, positioned below the main beam 141 and facing the side of the reference crossbeam 771. The detection head 674 has the same configuration as the detection head 274, but is mounted to read the linear scale of the reference crossbeam 771 located on the side.

[0139] The detection head 874 is mounted on the upper part of the drive unit 152 above the main beam 141, facing the side of the reference crossbeam 871. The detection head 874 has the same configuration as the detection head 274, but is installed to read the linear scale of the reference crossbeam 871 located on the side.

[0140] In this modified example, the detection heads 774 and 874, configured on the mounting head 150, read the linear scales of the reference crossbeams 771 and 871, which are separately configured from the main beam portion 141 in the Z direction, and measure the position of the mounting head 150. The positional relationship between the reference crossbeams 771 and 871 and the sensors of the detection heads 774 and 874 is not affected by the deformation of the main beam portion 141. Furthermore, the posture of the mounting head 150 in the X-axis, Y-axis, and Z-axis directions can be detected using the detection heads 774 and 874. Therefore, in this modified example, similar to the third embodiment, positioning errors (ΔX, ΔY) can be corrected.

[0141] <Fourth Implementation>

[0142] use Figures 32-34 The installation device in the fourth embodiment is described. Figure 32 This is a schematic top view showing the mounting device in the fourth embodiment. Figure 33 It is shown schematically. Figure 32 The front view of the mounting device is shown. Figure 34 It is shown Figure 8 The diagram shows the mounting head of the mounting device in a tilted state. Furthermore, in... Figures 32-34 The installation head 151 is omitted.

[0143] In the first embodiment, such as Figure 34 As shown, when the X-support platform 131 deforms due to thermal expansion, the guide rail 132 also deforms, and the beam 140, mounting head 150, reference beam 171, and support members 172 and 173, which move along the X-direction on the guide rail 132, are in a tilted position. In this situation, the positional relationship between the detection head 174, which is located on the mounting head 150, and the reference beam 171 does not change; therefore, it is impossible to detect the rotation (tilting) of the mounting head 150 with the Y-axis as its rotation axis.

[0144] Therefore, the mounting device 100 in the fourth embodiment is as follows: Figure 33 As shown, the mounting device 100 in the first embodiment also includes fixing members 973 and 974 for fixing reference beams 971 and 972, and detection heads 975 and 976.

[0145] like Figure 32As shown, reference beams 971 and 972 are configured to extend along the X direction and are fixed to the frame 110 by fixing members 973 and 974. Reference beams 971 and 972 extend parallel to the direction of the guide rail 132 and are positioned in a manner that does not interfere with reference beam 171, support members 172 and 173, or mounting head 151. Reference beams 971 and 972 have the same configuration as reference beam 271, except for the linear scale provided on their upper surface.

[0146] like Figure 33 As shown, detection heads 975 and 976 are positioned above and separated from reference beams 971 and 972 on support members 172 and 173. Detection heads 975 and 976 have removed sensor 274c from detection head 274 for reading scale 261b. However, sensor 274b is adjacent to sensor 274a in the X-axis direction and its optical axis is arranged at an angle relative to scale 261a.

[0147] When the height of the detection heads 975 and 976 changes, the position where the optical axis of sensor 274b intersects with scale 261a changes, thus changing the position read by sensor 274b in the X-axis direction. The control device then calculates the difference (dX) between the position read by sensor 274b and the position read by sensor 274a. This difference (dX) varies with the height of the detection head 274. Based on this change in difference (dX), the control device calculates the change in position (dz) in the Z-direction, thus determining the position in the Z-direction.

[0148] Therefore, the orientation of the reference beam 171 (mounting head 150) in both the X-axis and Z-axis directions can be detected using detection heads 975 and 976. Thus, as... Figure 39 As shown, when the mounting head 150 is tilted, the positioning error (ΔX) in the X-axis direction can be corrected based on the position (dX) of the mounting head 150 in the X-axis direction and the position (d) in the Z-axis direction.

[0149] Furthermore, since the reference beams 971 and 972 have the same configuration as the reference beam 171, the detection heads 975 and 976 can be configured to have the same configuration as the detection head 174.

[0150] The following describes an example of applying the Y-beam of the above-described embodiment to a flip-chip mounter as an example of a mounting apparatus. However, it is not limited to this and can also be applied to chip mounters (surface mounters) that mount packaged semiconductor devices onto a substrate, or chip mounters that mount semiconductor chips (bare chips) onto a substrate. Furthermore, flip-chip mounters are used, for example, in the manufacture of packages that form a redistribution layer in a wide area exceeding the chip area, such as fan-out wafer level packages (FOWLP).

[0151]

Example

[0152] Figure 36 This is a schematic top view illustrating an embodiment of the flip-chip placement machine. Figure 37 This means that in Figure 36 The diagram shows the actions of the inverted head, transfer head, and mounting head when viewed from the direction of arrow A.

[0153] The flip-chip placement machine 10 generally includes a bare chip supply unit 1, a pick-up unit 2, a transfer unit 8, an intermediate stage unit 3, a placement unit 4, a transport unit 5, a substrate supply unit 6K, a substrate removal unit 6H, and a control device 7 for monitoring and controlling the operation of each part.

[0154] First, the bare die supply unit 1 supplies bare dies D mounted on the substrate P. The bare die supply unit 1 includes a die holding stage 12 for holding diced wafers 11, a push-up unit 13 (shown in dashed lines) for pushing the bare die D from the wafer 11, and a die ring supply unit 18. The bare die supply unit 1 moves in the XY direction using a drive mechanism (not shown), moving the picked-up bare die D to the position of the push-up unit 13. The die ring supply unit 18 has a die cassette that houses the die rings, sequentially supplying die rings to the bare die supply unit 1 and replacing them with new die rings. The bare die supply unit 1 moves the die rings to a pickup point in a manner that allows the desired bare die to be picked up from the die rings. The die rings are fixtures that hold wafers and can be mounted on the bare die supply unit 1.

[0155] The pickup unit 2 includes a pickup flip head 21 for picking up and flipping the bare die D, and various drive units (not shown) for raising, rotating, flipping, and moving the collet 22 in the X direction. The pickup flip head 21 is configured to pick up the bare die using this configuration, rotate the pickup flip head 21 180 degrees so that the bumps of the bare die D are flipped to face the lower surface, and deliver the bare die D to the transfer head 81.

[0156] The transfer unit 8 receives the flipped bare chip D from the pick-up flip head 21 and places it on the intermediate stage 31. The transfer unit 8, like the pick-up flip head 21, has a transfer head 81 with a collet 82 that holds the bare chip D at the front end, and a Y drive unit 83 that moves the transfer head 81 in the Y direction.

[0157] The intermediate stage 3 includes an intermediate stage 31 for temporarily mounting the bare chip D and a stage recognition camera 34. The intermediate stage 31 can move in the Y direction using a drive unit (not shown).

[0158] The mounting unit 4 picks up the bare die D from the intermediate stage 31 and mounts it onto the transported substrate P. Similar to the pick-up flip head 21, the mounting unit 4 includes a mounting head 41 with a collet 42 that holds the bare die D at its front end, a Y-beam 43 that moves the mounting head 41 in the Y direction, a substrate recognition camera 44 that identifies the mounting position by capturing a position identification mark (not shown) on the substrate P, and an X-support stage 45. The mounting head 41 uses this configuration to pick up the bare die D from the intermediate stage 31 and mounts the bare die D onto the substrate P based on the image data captured by the substrate recognition camera 44.

[0159] The transport unit 5 includes transport channels 51 and 52 for moving the substrate P in the X direction. The transport channels 51 and 52 are parallel. Using this configuration, the substrate P is taken from the substrate supply unit 6K and moved along the transport channels 51 and 52 to the mounting position, and then to the substrate removal unit 6H after mounting, where the substrate P is transferred to the substrate removal unit 6H. During the mounting of the bare chip D onto the substrate P, the substrate supply unit 6K removes a new substrate P and waits on the transport channels 51 and 52.

[0160] The control device 7 includes a memory for storing programs (software) that monitor and control the operation of each part of the flip mounting machine 10, and a central processing unit (CPU) that executes the programs stored in the memory.

[0161] Figure 38 It is shown Figure 36 A schematic cross-sectional view of the main parts of the bare die supply section 1. The bare die supply section 1 includes an extension ring 15 that holds a wafer ring 14, a support ring 17 that is held by the wafer ring 14 and horizontally positions a dicing strip 16 to which multiple bare dies D are attached, and a push-up unit 13 for pushing the bare dies D upwards. In order to pick up the specified bare die D, the push-up unit 13 moves in the vertical direction using a drive mechanism (not shown), and the bare die supply section 1 moves in the horizontal direction.

[0162] Referring to the comparative example and the second embodiment, using Figure 2 , Figure 15 , Figure 39 Explanation of the mounting section. Figure 39 This is a schematic side view showing the main parts of the mounting section 4. The perspective view shows the constituent elements of one part. Furthermore, Figure 39 Side view and Figure 2 , 15 The main view corresponds to this. But... Figure 39 In the original text, the supporting components 172 and 173, the reference beam 271, and the detection head 274 are omitted.

[0163] The mounting section 4 includes a mounting table BS (mounting table 120) supported on a stand 53 (stand 110), an X support table 451 (X support table 131) located near transport channels 52 and 53, a Y beam 43 (Y beam 140) supported on the X support table 451, a mounting head 41 (mounting head 151) supported by the Y beam 43, a drive unit 46 (drive unit 152) that drives the mounting head 41 in the Y-axis direction and the Z-axis direction, and a drive unit (not shown) that drives the Y beam 43 in the X-axis direction.

[0164] The mounting head 41 is a device equipped with a collet 42 (holding mechanism 151a) that can hold the bare chip D (component 300) freely, and is mounted on the Y beam 43 in a direction that can move freely back and forth in the Y axis direction.

[0165] In this embodiment, there is one placement head 41, which includes a collet 42 that holds the bare die D using vacuum suction. Additionally, the drive unit 46 enables the placement head 41 to move up and down in the Z-axis direction. The placement head 41 functions to hold and transport the bare die D picked up from the intermediate stage 31, and to mount the bare die D onto the substrate P (workpiece 200) that is suction-fixed to the placement stage BS.

[0166] The guide rail 132, mounted on the X-support platform 451, is a component that slides freely in the X-axis direction to guide the Y-beam 43. In this embodiment, the two X-support platforms 451 are arranged in parallel, and each X-support platform 451 is fixed to the transport channels 52 and 53 in a state of extending in the X-axis direction. The X-support platforms 451 may also be integrally formed with the transport channels 52 and 53.

[0167] like Figure 36 as well as Figure 39 As shown, a slider 433 is mounted on the guide rail 452 and is movable in the X-axis direction. Then, the two ends of a Y-beam 43 are mounted on each slider 433 of the two guide rails 452. That is, the Y-beam 43 extends in the Y-axis direction across the mounting table BS, with both ends mounted on the slider 433, and is supported by the guide rail 452 mounted on the X-support table 451 and movable in the X-axis direction. Furthermore, the bottom surface of the Y-beam 43 and the upper surface of the slider 433 are on the same plane; therefore, the Y-beam 43 is positioned at a position not much higher than the X-support table 451.

[0168] The Y-beam 43 in this embodiment has a configuration that is substantially the same as the Y-beam 140 in the second embodiment. However, the Y-beam 43 extends significantly to the right compared to the support platform 451 on the right side of the drawing. This is because the placement head 41 can pick up the bare die D from the intermediate stage 31. Furthermore, when the placement head 41 moves to the right compared to the support platform 451, the placement head 41 is raised such that the collet 42 is higher than the guide rail 452.

[0169] Next, use Figure 40 This describes the mounting method (semiconductor device manufacturing method) implemented in the flip-chip mounter of the embodiment. Figure 40 It shows the use of Figure 36 The flowchart shown illustrates the placement method implemented by the flip-chip placement machine.

[0170] A wafer ring 14, containing a dicing tape 16 with bare dies D separated from wafer 11 attached, is stored in a wafer cassette (not shown) and then transferred to the flip-chip mounter 10. The control unit 7 supplies the wafer ring 14 from the wafer cassette filled with the wafer ring 14 to the bare die supply unit 1. Additionally, a substrate P is prepared and transferred to the flip-chip mounter 10. The control unit 7 uses the substrate supply unit 6K to mount the substrate P onto the substrate transport claw.

[0171] (Step S1: Raw chip pickup)

[0172] The control device 7 moves the wafer holding stage 12 so that the picked-up bare die D is directly above the push unit 13, positioning the bare die to be peeled onto the push unit 13 and the collet 22. The push unit 13 is moved so that its upper surface contacts the back of the dicing tape 16. At this time, the control device 7 adsorbs the dicing tape 16 onto the upper surface of the push unit 13. While evacuating the collet 22, the control device 7 lowers the collet 22, causing it to fall onto the bare die D and adsorb it. The control device 7 then raises the collet 22, peeling the bare die D from the dicing tape 16. Thus, the bare die D is picked up by the pick-up flip head 21.

[0173] (Step S2: Pick up the inverted head and move it)

[0174] The control device 7 moves the pick-up inverted head 21.

[0175] (Step S3: Pick up the inverted head and flip it over)

[0176] The control device 7 rotates the pick-up flip head 21 180 degrees, flipping the bump surface (surface) of the bare chip D to face the lower surface, and delivers the bare chip D to the transfer head 81.

[0177] (Step S4: Transfer Head Handover)

[0178] The control device 7 uses the collet 82 of the transfer head 81 to pick up the bare chip D from the collet 22 of the pick-up flip head 21, and performs the handover of the bare chip D.

[0179] (Step S5: Pick up the inverted head and flip it over)

[0180] The control device 7 flips the pickup inverted head 21 so that the adsorption surface of the collet 22 faces downward.

[0181] (Step S6: Move the transfer head)

[0182] Before or in parallel with step S5, the control device 7 moves the transfer head 81 to the intermediate stage 31.

[0183] (Step S7: Loading the intermediate platform)

[0184] The control device 7 places the bare chip D, held by the transfer head 81, onto the intermediate stage 31.

[0185] (Step S8: Transfer head moves)

[0186] The control device 7 moves the transfer head 81 to the handover position of the bare chip D.

[0187] (Step S9: Move the position of the intermediate platform)

[0188] After step S8 or in parallel, the control device 7 moves the intermediate stage 31 to the position where it intersects with the placement head 41.

[0189] (Step SA: Placement Head Handover)

[0190] The control device 7 uses the collet of the placement head 41 to pick up the bare chip D from the intermediate stage 31 and perform the handover of the bare chip D.

[0191] (Step SB: Move the position of the intermediate platform)

[0192] The control device 7 moves the intermediate platform 31 to the handover position between it and the transfer head 81.

[0193] (Step SC: Placement head movement)

[0194] The control device 7 moves the bare chip D held by the collet 42 of the placement head 41 onto the substrate P. At this time, based on the positional relationship between the placement head and the reference beam detected by the detection head, the control device 7 controls the drive unit 46 and the drive unit of the drive Y-beam 43 to correct the position of the placement head 41.

[0195] (Step SD: Mounting)

[0196] The control device 7 picks up the bare chip D from the clamp 42 of the placement head 41 from the intermediate stage 31 and places it on the substrate P.

[0197] (Step SE: Placement head movement)

[0198] The control device 7 moves the placement head 41 to the junction position with the intermediate table 31.

[0199] After all bare chips D are mounted on substrate P, control device 7 transports substrate P to substrate removal unit 6H. Control device 7 uses substrate removal unit 6H to remove substrate S with bare chips D mounted from substrate transport claw. Substrate P is then removed from flip-chip mounter 10.

[0200] The above description is based on the implementation methods, variations, and embodiments to specifically illustrate the present disclosure made by the present discloser. However, the present invention is not limited to the above implementation methods, variations, and embodiments, and various modifications can be made.

[0201] For example, the embodiment illustrates an example using a Y-beam of the second embodiment, but it is not limited thereto; a Y-beam of one or a combination of the first embodiment, the third embodiment, and other variations may also be used.

[0202] In addition, the example described in the embodiment is a single mounting head, but multiple mounting heads may also be used in the same manner as in the embodiment.

[0203] Furthermore, the example described in the embodiment is that there is one transfer section, one intermediate platform section, and one mounting section, but there may also be multiple sections.

[0204] Additionally, the embodiment describes an example where a flipping mechanism is provided at the pick-up flip head, a transfer head is used to receive the bare chip from the pick-up flip head and place it on an intermediate stage, and then the intermediate stage is moved. However, it can also be configured to move the pick-up flip head that picks up and flips the bare chip, or it can be configured to place the picked-up bare chip D on a stage unit that can rotate the back of the bare chip and move the stage unit.

Claims

1. An installation device comprising: A mounting frame for mounting on an installation platform; A beam extends in a first direction across the platform, and both ends of the beam are each movably supported on the platform in a second direction. A mounting head that is freely movable in the first direction and supported on the beam; A reference member extending in the first direction and supported at both ends is disposed separately from the beam portion downwards; A pair of support members supporting the reference member are fixed at both ends of the beam. as well as A detection head is disposed on the mounting head in a manner opposite to the reference component. The detection head is located above the reference member and has a displacement sensor for detecting the distance between itself and the reference member. The pair of support members each have a first extension fixed to the beam and a second extension supporting the reference member from below. One of the support members fixes one end of the reference member in the second extension, and the other support member is configured to support the other end of the reference member in the second extension in a manner that allows the other end of the reference member to move.

2. The installation device according to claim 1, wherein, One of the support members is configured to fix one end of the reference member in a manner that allows one end of the reference member to rotate.

3. The installation device according to claim 1, wherein, It also includes a second detection head located to the side of the reference member and having a displacement sensor for measuring the distance between the reference member and the reference member.

4. The installation device according to claim 1, wherein, It also has a third detection head and a third reference component. The third reference component has a linear scale. The third detection head has a sensor for reading the scale of the linear scale.

5. The installation device according to claim 4, wherein, The third reference member is located on the opposite side of the mounting head, separated from the beam portion. The third detection head is disposed on the mounting head in a manner opposite to the side of the third reference member.

6. The installation device according to claim 1, wherein, It also has: A fourth reference member is provided on the platform, which extends in the second direction; as well as A fourth detection head is disposed on the support member in a manner opposite to the fourth reference member. The fourth detection head is configured to detect the positional relationship between itself and the fourth reference component.

7. An installation device comprising: A mounting frame for mounting on an installation platform; A beam extends in a first direction across the platform, and both ends of the beam are each movably supported on the platform in a second direction. A mounting head that is freely movable in the first direction and supported on the beam; A reference member extending in the first direction and supported at both ends, which is separated from the beam portion; and A detection head is disposed on the mounting head in a manner opposite to the reference component. The detection head is configured to detect the positional relationship between itself and the reference component. The reference component includes a first linear scale for detecting position in the first direction and a second linear scale for detecting position in the second direction. The detection head has a first sensor that reads the scale from a direction perpendicular to the first linear scale, a second sensor that reads the scale from a direction inclined to the first linear scale, and a third sensor that reads the scale from a direction perpendicular to the second linear scale.

8. The installation device according to claim 7, wherein, The reference member is located below the beam. The detection head is disposed on the mounting head in a manner opposite to the upper surface of the reference member.

9. A method for manufacturing a semiconductor device, comprising: A process of moving a substrate into a mounting device, the mounting device comprising a frame for mounting on a mounting table, a beam extending in a first direction across the frame and each end of which is movably supported on the frame in a second direction, a mounting head movably supported on the beam in the first direction, a reference member extending in the first direction and supported at both ends, disposed separately from the beam and disposed below the beam, a pair of support members fixed to the two ends of the beam and supporting the reference member, and a detection head disposed on the mounting head opposite the reference member, the detection head being located above the reference member and having a displacement sensor for detecting the distance between itself and the reference member, the pair of support members each having a first extension fixed to the beam and a second extension supporting the reference member from below, one support member fixing one end of the reference member in the second extension, and the other support member being configured to support the other end of the reference member in the second extension such that the other end of the reference member can be moved; and The process of picking up a bare die from a wafer held by a wafer ring.

10. The method for manufacturing a semiconductor device according to claim 9, wherein, Also includes: The process of flipping the picked-up bare chip; as well as The process of using the mounting head to pick up the flipped bare chip and place it onto the substrate.

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