An automated solder terminal power module

Abstract

The application discloses an automatic welding terminal power module, which comprises an insulating bottom plate and power terminals. The top of the insulating bottom plate is provided with a copper layer. A plurality of power terminals are arranged at intervals along the length direction of the bottom plate. One end of each power terminal is welded and fixed on the copper layer and electrically connected with the copper layer. A connecting piece is arranged between two adjacent power terminals. The power terminal comprises a welding section, a connecting section and a conducting section. The bottom of the welding section is welded on the copper layer. The bottom of the connecting section is connected with the top of the welding section. The cross-sectional area of the connecting section is smaller than that of the welding section. The connecting piece is connected with the connecting section. The application effectively reduces terminal incoming abnormality, incoming disorder, plug-in difficulty and deformation, reduces manual intervention, realizes full-automatic production, and guarantees the quality and production efficiency of the module.

Description

Technical Field

[0001] This invention relates to the technical field of power electronics, and more particularly to an automated terminal welding power module. Background Technology

[0002] Currently, the demand for power modules in the conventional industrial control industry, home appliance industry, welding machine industry, induction heating industry and new energy industry is growing, forcing manufacturers to continuously increase production capacity.

[0003] Most power modules have several power terminals. Existing power terminals are basically arranged in a random manner. When installing power terminals on a power module, manual intervention is required to process and fix the terminals at specific positions, which greatly reduces labor costs and production efficiency. Moreover, when fixing power terminals, they are prone to deformation under external force, which affects the power transmission effect of the terminals. Summary of the Invention

[0004] To address the aforementioned problems with existing power modules, the aim is to provide an automated terminal welding power module that features a high degree of automation, low labor costs, and high efficiency.

[0005] The specific technical solution is as follows:

[0006] An automated welding terminal power module includes: an insulating base plate and power terminals. The top of the insulating base plate has a copper layer. A plurality of power terminals are spaced apart along the length of the base plate. One end of each power terminal is welded and fixed to the copper layer and electrically connected to the copper layer. A connector is connected between adjacent power terminals. The power terminals include:

[0007] A welding section, the bottom of which is welded to the copper layer;

[0008] A connecting segment, the bottom of which is connected to the top of the welding segment, and the cross-sectional area of ​​the connecting segment is smaller than that of the welding segment; the connector is connected to the connecting segment.

[0009] A conductive section, the bottom of which is connected to the top of the connecting section.

[0010] As a further improvement and optimization of this solution, the top of the insulating base plate is provided with an insulating shell, and a sealed accommodating cavity is formed between the insulating shell and the insulating base plate. The top end of the connecting section passes through the top of the insulating shell and extends the conductive section to the outside of the accommodating cavity. The accommodating cavity is provided with a chip assembly and a thermistor, and both the chip assembly and the thermistor are soldered on the copper layer and electrically connected to the copper layer.

[0011] As a further improvement and optimization of this solution, vacuum high-temperature reflow soldering is used between the chip assembly and the copper layer, between the thermistor and the copper layer, and between the power terminal and the copper layer.

[0012] As a further improvement and optimization of this solution, the chip assembly and the copper layer, the thermistor and the copper layer, and the power terminal and the copper layer are all electrically connected through a first conductive line.

[0013] As a further improvement and optimization of this solution, ultrasonic welding is used to connect the first conductive line to the chip assembly, the first conductive line to the thermistor, and the first conductive line to the power terminal.

[0014] As a further improvement and optimization of this solution, the chip assembly includes: an insulated bipolar transistor chip, a fast recovery diode chip, and two rectifier diode chips. The insulated bipolar transistor chip and the fast recovery diode chip, as well as the two rectifier diode chips, are electrically connected through a second conductive line.

[0015] As a further improvement and optimization of this solution, the second conductive line is connected to the insulated bipolar transistor chip, the second conductive line is connected to the fast recovery diode chip, and the rectifier diode chip is connected to the second conductive line by ultrasonic welding.

[0016] As a further improvement and optimization of this solution, both the first conductive wire and the second conductive wire are aluminum wires.

[0017] As a further improvement and optimization of this solution, the insulating shell and the insulating base plate are sealed together with sealant, and the accommodating cavity is filled with silicone.

[0018] As a further improvement and optimization of this solution, a buffer groove is provided on both sides of the welding part, and the two buffer grooves are staggered.

[0019] The positive effects of the above technical solution compared with the existing technology are:

[0020] (1) In this invention, several power terminals are arranged at equal intervals along the length of the base plate, and adjacent power terminals are connected by connectors. This is beneficial for the production line to linearly and synchronously transport several power terminals in the form of a material strip, so that several power terminals can be transported and inserted into the copper layer and welded. Linear and synchronous transport of several power terminals is beneficial to reduce abnormal power terminal incoming materials, disordered incoming materials, reduce insertion difficulty and deformation, reduce manual intervention, achieve fully automated production, and ensure the quality and production efficiency of the module.

[0021] (2) In this invention, the cross-sectional area of ​​the welded part is larger than that of the connecting section, which increases the contact area between the welded part and the copper layer, improves the welding stability of the power terminal, and connects two adjacent connecting sections with relatively small cross-sectional areas through connectors. The strength of the power terminal itself is improved under the support of the connectors, reducing the occurrence of deformation of the power terminal under external force, and further ensuring the quality of the module.

[0022] (3) In this invention, vacuum high-temperature reflow soldering is used between the chip components and the copper layer, between the thermistor and the copper layer, and between the power terminals and the copper layer. Vacuum high-temperature reflow soldering can efficiently remove the bubbles generated when the flux evaporates, reduce the void rate of the product soldering surface, and improve the soldering quality of the product.

[0023] (3) In this invention, the bottom of the power terminal is provided with two buffer notches, so that the power terminal has the buffering effect of the axis, improving the shock resistance of the power module, thereby improving the stability and reliability of the power module. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of an automated welding terminal power module according to the present invention;

[0025] Figure 2 This is a schematic diagram of the power terminal structure of an automated welding terminal power module according to the present invention;

[0026] In the attached diagram: 1. Insulating base plate; 2. Insulating shell; 3. Power terminal; 4. Silicone; 5. Sealant; 6. Thermistor; 7. Chip assembly; 8. Connector; 31. Welding part; 32. Connection section; 33. Conducting section; 71. Insulating bipolar transistor chip; 72. Fast recovery diode chip; 73. Rectifier diode chip; 74. Second conductive line. Detailed Implementation

[0027] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the scope of the invention.

[0028] Figure 1 This is a schematic diagram of the overall structure of an automated welding terminal power module according to the present invention. Figure 2 This is a schematic diagram of the power terminal structure of an automated welding terminal power module according to the present invention, as shown below. Figures 1 to 2The diagram illustrates an automated welding terminal power module according to a preferred embodiment, comprising: an insulating base plate 1 and power terminals 3. The top of the insulating base plate 1 has a copper layer 11. A plurality of power terminals 3 are spaced apart along the length of the base plate. One end of each power terminal 3 is welded and fixed to the copper layer 11 and electrically connected to the copper layer 11. A connector 8 is connected between adjacent power terminals 3. Each power terminal 3 includes a welding section 31, a connecting section 32, and a conductive section 33. The bottom of the welding section 31 is welded to the copper layer 11. The bottom of the connecting section 32 is connected to the top of the welding section 31, and the cross-sectional area of ​​the connecting section 32 is smaller than that of the welding section 31. The connector 8 is connected to the connecting section 32, and the bottom of the conductive section 33 is connected to the top of the connecting section 32.

[0029] In this embodiment, several power terminals 3 are arranged at equal intervals along the length of the base plate, and adjacent power terminals 3 are connected by connectors 8. This facilitates the production line to linearly and synchronously transport several power terminals in a material belt manner, so that the power terminals can be transported and inserted into the copper layer 11 and welded together. The linear and synchronous transport of several power terminals 3 helps to reduce abnormal and disordered incoming power terminals 3, reduce insertion difficulty and deformation, reduce manual intervention, achieve fully automated production, and ensure the quality and production efficiency of the module.

[0030] In this embodiment, the cross-sectional area of ​​the welding part 31 is larger than that of the connecting section 32, which increases the contact area between the welding part 31 and the copper layer 11, thereby improving the welding stability of the power terminal. For two adjacent connecting sections 32 with relatively small cross-sectional areas, they are connected by the connector 8. With the support of the connector 8, the strength of the power terminal itself is improved, reducing the occurrence of deformation of the power terminal under external force, and further ensuring the quality of the module.

[0031] As a further improvement and optimization of this solution, the top of the insulating base plate 1 is provided with an insulating shell 2, and a sealed accommodating cavity is formed between the insulating shell 2 and the insulating base plate 1. The top end of the connecting section 32 passes through the top of the insulating shell 2 and extends the conductive section 33 to the outside of the accommodating cavity. The accommodating cavity is provided with a chip assembly 7 and a thermistor 6, and both the chip assembly 7 and the thermistor 6 are soldered on the copper layer 11 and electrically connected to the copper layer 11.

[0032] As another embodiment, the connector 8 can also be cut off after the power terminal 8 is soldered, reducing the space requirements of the connector 8 for the accommodating cavity.

[0033] As a further improvement and optimization of this solution, vacuum high-temperature reflow soldering is used between chip component 7 and copper layer 11, between thermistor 6 and copper layer 11, and between power terminal 3 and copper layer 11.

[0034] In this embodiment, vacuum high-temperature reflow soldering can efficiently remove bubbles generated during flux evaporation, reduce the void rate on the welded surface of the product, improve the welded quality of the product, and further enhance the quality of the module.

[0035] As a further improvement and optimization of this solution, the chip component 7 is electrically connected to the copper layer 11, the thermistor 6 is connected to the copper layer 11, and the power terminal 3 is connected to the copper layer 11 through the first conductive line.

[0036] As a further improvement and optimization of this solution, ultrasonic welding is used to connect the first conductive line to the chip assembly 7, the first conductive line to the thermistor 6, and the first conductive line to the power terminal 3.

[0037] As a further improvement and optimization of this solution, the chip assembly 7 includes: an insulated bipolar transistor chip 71, a fast recovery diode chip 72, and two rectifier diode chips 73. The insulated bipolar transistor chip 71 and the fast recovery diode chip 72, as well as the two rectifier diode chips 73, are electrically connected through a second conductive line.

[0038] As a further improvement and optimization of this solution, the second conductive line is connected to the insulated bipolar transistor chip 71, the second conductive line is connected to the fast recovery diode chip 72, and the rectifier diode chip 73 is connected to the second conductor 73 by ultrasonic welding.

[0039] As a further improvement and optimization of this solution, both the first and second conductive wires are made of aluminum wire.

[0040] As a further improvement and optimization of this solution, the insulating shell 2 and the insulating base plate 1 are sealed together with sealant 5, and the cavity is filled with silicone 4.

[0041] As a further improvement and optimization of this solution, a buffer groove is provided on both sides of the welding part 31, and the two buffer grooves are staggered.

[0042] In this embodiment, the welding part 31 is provided with a buffer groove. When an axial external force is applied to the power terminal, the welding part 31 has an axial buffering effect under the action of the buffer groove, and automatically recovers its deformation when the external force disappears, thereby improving the strength and performance of the power terminal itself.

[0043] The above description is merely a preferred embodiment of the present invention and does not limit the implementation and protection scope of the present invention. Those skilled in the art should realize that any equivalent substitutions and obvious changes made based on the description and illustrations of the present invention should be included within the protection scope of the present invention.

Claims

1. An automated welding terminal power module, characterized in that, include: An insulating base plate and power terminals are provided. The top of the insulating base plate has a copper layer. A plurality of power terminals are spaced apart along the length of the base plate. One end of each power terminal is welded and fixed to the copper layer and electrically connected to it. A connector is provided between adjacent power terminals for removal after welding. The power terminals include: A welding section, the bottom of which is welded to the copper layer; A connecting segment, the bottom of which is connected to the top of the welding segment, and the cross-sectional area of ​​the connecting segment is smaller than that of the welding segment, and the connector is connected to the connecting segment; A conductive section, the bottom of which is connected to the top of the connecting section.

2. The automated welding terminal power module according to claim 1, characterized in that, The top of the insulating base plate is provided with an insulating shell, and a sealed accommodating cavity is formed between the insulating shell and the insulating base plate. The top end of the connecting section passes through the top of the insulating shell and extends the conductive section to the outside of the accommodating cavity. A chip assembly and a thermistor are provided inside the accommodating cavity, and both the chip assembly and the thermistor are soldered on the copper layer and electrically connected to the copper layer.

3. The automated welding terminal power module according to claim 2, characterized in that, Vacuum high-temperature reflow soldering is used between the chip assembly and the copper layer, between the thermistor and the copper layer, and between the power terminal and the copper layer.

4. The automated welding terminal power module according to claim 3, characterized in that, The chip assembly and the copper layer, the thermistor and the copper layer, and the power terminal and the copper layer are all electrically connected via a first conductive line.

5. The automated welding terminal power module according to claim 4, characterized in that, The first conductive line is ultrasonically welded to the chip assembly, to the thermistor, and to the power terminal.

6. The automated welding terminal power module according to claim 5, characterized in that, The chip assembly includes: an insulated bipolar transistor chip, a fast recovery diode chip, and two rectifier diode chips. The insulated bipolar transistor chip and the fast recovery diode chip, as well as the two rectifier diode chips, are electrically connected through a second conductive line.

7. The automated welding terminal power module according to claim 6, characterized in that, The second conductive line is connected to the insulated bipolar transistor chip, the second conductive line is connected to the fast recovery diode chip, and the rectifier diode chip is connected to the second conductive line by ultrasonic welding.

8. The automated welding terminal power module according to claim 7, characterized in that, Both the first conductive wire and the second conductive wire are aluminum wires.

9. The automated welding terminal power module according to claim 8, characterized in that, The insulating outer shell and the insulating base plate are sealed together with sealant, and the accommodating cavity is filled with silicone.

10. The automated welding terminal power module according to claim 9, characterized in that, A buffer groove is provided on both sides of the welding section, and the two buffer grooves are staggered.

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