Magnesium alloy connection structure, electronic equipment and component forming method

Abstract

The present application relates to the field of terminals and discloses a magnesium alloy connection structure, an electronic device, and a component forming method. The magnesium alloy connection structure comprises a magnesium alloy body and a conductive layer, and a conductive transition layer is formed at the junction of the magnesium alloy body and the conductive layer. The transition layer enables electrical connection between the magnesium alloy body and the conductive layer. At the same time, the transition layer separates the magnesium alloy body and the conductive layer to avoid galvanic corrosion between the magnesium alloy body and the conductive layer, thereby extending the service life of the magnesium alloy connection structure and achieving stable electrical connection between the magnesium alloy structure and components such as the motherboard. Furthermore, the conductive layer, sealing material, and transition layer isolate the magnesium alloy body from the outside, preventing oxidation or corrosion of the magnesium alloy body and further preventing galvanic corrosion between the various structures in the magnesium alloy connection structure.

Description

Technical Field

[0001] The present application relates to the field of terminals, and in particular to a magnesium alloy connection structure, an electronic device, and a component forming method. Background Art

[0002] With the development of terminal devices, in order to achieve lightweight design of terminal devices, more and more components in terminal devices use lightweight components. For example, more and more terminal devices' middle frames, camera housings, etc. use magnesium alloy components.

[0003] Since magnesium alloys are relatively active, when grounding magnesium alloy components in electronic equipment, it is also necessary to consider the sealing and corrosion protection of the magnesium alloy components. Summary of the Invention

[0004] In order to achieve sealing and corrosion protection of magnesium alloy components in electronic equipment while grounding the magnesium alloy components, the present application provides a magnesium alloy connection structure, electronic equipment and component forming method. In the magnesium alloy connection structure, a conductive transition layer is formed on the area where the magnesium alloy body and the conductive layer are connected. On the one hand, the transition layer is used to achieve electrical connection between the magnesium alloy body and the conductive layer. On the other hand, the transition layer is used to separate the magnesium alloy body and the conductive layer to avoid galvanic corrosion at the interface between the magnesium alloy body and the conductive layer, as well as galvanic corrosion between the transition layer and the conductive layer, and between the transition layer and the magnesium alloy body, thereby extending the service life of the magnesium alloy connection structure and achieving stable electrical connection between the magnesium alloy structure and the component to be connected.

[0005] The first aspect of the present application provides a magnesium alloy connection structure, wherein the magnesium alloy connection structure includes a magnesium alloy body; a protective layer encapsulating the magnesium alloy body, a connection through-hole formed in the protective layer and communicating with the surface of the magnesium alloy body, a transition layer formed at the bottom of the connection through-hole; a conductive layer formed on the transition layer, the transition layer and the conductive layer being used to electrically connect the magnesium alloy body to the outside world; and the connection through-hole being sealed by the transition layer, or the conductive layer and a sealing material, to isolate the magnesium alloy body from the outside world. The magnesium alloy connection structure refers to the structure formed by connecting the magnesium alloy component and the conductive layer.

[0006] Among them, magnesium alloy connection structural parts can be applied to electrical connection solutions in electrical / electronic / communication equipment. The magnesium alloy body can be any one of magnesium-zinc alloy, magnesium-manganese alloy, magnesium-rhenium alloy and magnesium-lithium alloy. The conductive layer is a metal or alloy material with good electrical conductivity. When the conductive layer is an alloy material, the conductive layer includes a substrate, which is a conductor with higher wear resistance and corrosion resistance than magnesium alloy, and the surface resistance of the side away from the magnesium alloy body is lower than a preset value. Among them, the substrate can be at least one of copper alloy, aluminum alloy and multi-element alloy. The protective layer includes but is not limited to at least one of micro-arc oxidation ceramic layer, film, anode layer, electrophoretic film layer and paint coating. The forming process of the connecting through hole can be to break the protective layer, or to reserve the connecting through hole in advance when forming the protective layer. Among them, the breaking process of the connecting through hole can be etching, laser carving and other processes.

[0007] That is, in the implementation of the present application, the magnesium alloy connection structure includes a magnesium alloy body and a conductive layer, and a conductive transition layer is formed at the junction of the magnesium alloy body and the conductive layer, and the transition layer realizes electrical connection between the magnesium alloy body and the conductive layer. At the same time, the transition layer separates the magnesium alloy body and the conductive layer to avoid galvanic corrosion caused by the contact between the magnesium alloy body and the conductive layer. In addition, the conductive layer, sealing material and transition layer isolate the magnesium alloy body from the outside, preventing oxidation or corrosion of the magnesium alloy body, and further preventing galvanic corrosion between the various structures in the magnesium alloy connection structure, thereby extending the service life of the magnesium alloy connection structure and achieving stable electrical connection between the magnesium alloy structure and components such as the motherboard.

[0008] In some implementations, the transition layer can be a solid solution generated based on the conductive layer and the magnesium alloy body. Among them, the transition layer can be a solid solution formed based on the conductive layer and the magnesium alloy body. The area where the conductive layer and the magnesium alloy body are connected refers to the area where the conductive layer and the magnesium alloy body are opposite to the connecting through-hole. Before the transition layer is formed, the conductive layer and the magnesium alloy body can be pre-connected or not. During the forming process, the area where the conductive layer and the magnesium alloy body are connected is fitted. The transition layer can also be a solid solution generated based on the conductive layer, the magnesium alloy body and other materials. In some other alternative implementations, the transition layer can also be a conductive adhesive layer provided between the surface of the magnesium alloy body and the conductive layer.

[0009] In one possible implementation of the first aspect, in the magnesium alloy connected structural component, the transition layer is formed by ultrasonic welding in the region where the magnesium alloy body and the conductive layer meet, and is composed of a portion of the conductive layer and a portion of the magnesium alloy body at a height. The transition layer in the magnesium alloy connected structural component is an electrical connection medium, such as a solid solution, formed between the magnesium alloy body and the conductive layer using ultrasonic welding technology. The electrical connection medium can be formed by combining the magnesium alloy body and the conductive layer, or by combining the magnesium alloy body, the conductive layer, and an intermediate layer.

[0010] In some implementations, the transition layer is a solid solution formed by ultrasonic welding at the junction of the magnesium alloy body and the conductive layer, formed by a portion of the conductive layer and a portion of the magnesium alloy body at the height. Specifically, the solid solution fills at least a portion of the thickness of the connecting via and is connected to the conductive layer and the magnesium alloy body in the height direction of the connecting via.

[0011] In some implementations, the transition layer fills the entire connecting via.

[0012] In some possible implementations, the present application does not impose any specific restrictions on the process of forming a solid solution between the magnesium alloy body and the conductive layer by ultrasonic welding in the area where the two are connected. Any process that can achieve solid solution between the magnesium alloy body and the conductive layer is within the scope of protection of the present application.

[0013] In the above-mentioned magnesium alloy connection structure, the transition layer is formed in the area where the magnesium alloy body and the conductive layer are connected by ultrasonic welding technology. The forming method is simple, and the bonding force between the transition layer and the conductive layer, as well as between the transition layer and the magnesium alloy body is large, which improves the mechanical properties of the magnesium alloy connection structure and improves the structural stability of the magnesium alloy connection structure.

[0014] In one possible implementation of the first aspect, in the magnesium alloy connection structure, the ultrasonic weld spot is located in the area corresponding to the connection through-hole. A weld spot refers to a raised or depressed area on the surface of the welded part resulting from the welding process after welding. It is understood that the raised or depressed area on the surface of the welded part may be caused by melting and recondensation of the surface of the welded part, or by melting and recondensation within the welded part, or by solid solution, resulting in changes in the surface of the welded part. The conductive layer includes a welding area and a working area, wherein the welding area is used for welding to the magnesium alloy body, and the working area is used to cooperate with the component to be connected to achieve an electrical connection between the magnesium alloy body and the component to be connected through the magnesium alloy connection structure. Specifically, in this implementation of the present application, to prevent oxidation or corrosion of the magnesium alloy body, the outer surface of the magnesium alloy body is coated with a protective layer to isolate the magnesium alloy body from the outside world. To achieve electrical connection between the magnesium alloy body and the structure to be connected, only a portion of the surface of the magnesium alloy body is exposed at the location of the connection through-hole. Based on this, when forming a magnesium alloy connection structure by welding, the welding points are preferably connected to the areas corresponding to the through holes.

[0015] In the above-mentioned magnesium alloy connection structure, the ultrasonic welding points are selected as the areas corresponding to the connection through holes. There is no need to remove the protective layer on the surface of the magnesium alloy body through other processes. The welding of the magnesium alloy body and the conductive layer can be completed through the welding process, which reduces the difficulty of welding.

[0016] In a possible implementation of the first aspect, in the above-mentioned magnesium alloy connecting structural member, there is at least one transition layer, at least one transition layer is at least partially embedded in the magnesium alloy body in terms of height, and a common conductive layer covering the connecting through-hole is formed on at least one transition layer; the sealing material is an adhesive layer, and the adhesive layer is adhered between the protective layer and the corresponding parts of the conductive layer and the protective layer to seal the connecting through-hole.

[0017] That is, in the implementation of the present application, when the working area of ​​the conductive layer is relatively large, for example, when the conductive layer is copper foil or other ductile structures, and part of the conductive layer covers the connecting through-hole, and the remaining area of ​​the conductive layer covers the protective layer around the connecting through-hole. Then there is at least one transition layer, and the transition layers are distributed in parallel on the surface of the magnesium alloy body. That is, the transition layer includes at least one transition region distributed in parallel along the surface of the magnesium alloy body. In other words, different parts of the area where the conductive layer and the magnesium alloy body are connected form transition regions, wherein these transition regions can be interconnected or independent of each other. In some implementations, these transition regions are distributed in an array in a certain order in the area opposite to the connecting through-hole.

[0018] A transition layer is formed at the locations where the conductive layer and the magnesium alloy body's connecting through-holes face each other, enabling electrical connection between the conductive layer and the magnesium alloy body without direct contact. Furthermore, an adhesive layer is provided between other areas of the conductive layer and the protective layer to connect them, sealing the connecting through-holes and isolating the magnesium alloy body from the outside world.

[0019] In a possible implementation of the first aspect, in the magnesium alloy connection structure, recesses are formed at locations corresponding to the conductive layer and the transition layer, and the recesses are filled with a filling material.

[0020] That is, in the implementation of the present application, selective glue dispensing or resin can be used to seal the recessed portion to prevent cracks in the recessed portion from expanding, thereby affecting the service life of the magnesium alloy connection structure.

[0021] In a possible implementation of the first aspect, in the magnesium alloy connection structure, an outer surface of the filling material is flush with an outer surface of the conductive layer, so as to improve the aesthetics of the surface of the magnesium alloy connection structure.

[0022] In a possible implementation of the first aspect, in the above-mentioned magnesium alloy connecting structure, the transition layer is at least partially embedded in the magnesium alloy body in terms of height, and the rest of the transition layer is located in the connecting through-hole; the conductive layer is located in the connecting through-hole; a gap is formed between the side surface of the transition layer, the side surface of the conductive layer and the inner side surface of the connecting through-hole, and the sealing material fills the gap in the radial direction of the connecting through-hole to seal the connecting through-hole.

[0023] Specifically, in the implementations of this application, the conductive layer is smaller than the diameter of the connecting through-hole, and the transition layer cannot completely fill the connecting through-hole in the radial direction. In some implementations, the magnesium-copper heterogeneous alloy is ultrasonically welded to form an electrical connection medium. Areas not covered by the conductive layer and protective layer are sealed with adhesive to mitigate galvanic corrosion. Based on this, the aforementioned magnesium alloy connection structure can further reduce the welding area of ​​the conductive layer, achieving corrosion-resistant electrical connections for ultra-small magnesium alloy components.

[0024] In the above-mentioned magnesium alloy connection structural parts, when transparent dispensing sealant is used, the corrosion condition of the magnesium alloy body can be clearly observed later, providing a basis for subsequent process adjustments.

[0025] In some implementations, based on ultrasonic welding technology for magnesium-copper heterogeneous alloys, a master alloy is provided within the magnesium-copper heterogeneous alloy. The master alloy can form a solid solution alloy with the magnesium-copper heterogeneous alloy to form a solid solution layer. The solid solution layer and the copper alloy form an electrical connection medium and an anti-corrosion medium.

[0026] In a possible implementation of the first aspect, in the magnesium alloy connection structure, outer surfaces of the protective layer, the sealing material, and the conductive layer are flush to improve the aesthetics of the surface of the magnesium alloy connection structure.

[0027] In a possible implementation of the first aspect, in the above-mentioned magnesium alloy connection structure, at least a portion of the transition layer at the height is embedded in the magnesium alloy body, and the remaining portion of the transition layer fills the connection through hole in the radial direction of the connection through hole to seal the connection through hole.

[0028] In a possible implementation of the first aspect, in the magnesium alloy connection structure, the transition layer includes: a first sub-transition layer, the first sub-transition layer being formed in the region where the magnesium alloy body and the intermediate layer meet, and being formed by a portion of the intermediate layer and a portion of the magnesium alloy body at a height, with at least a portion of the first sub-transition layer being embedded in the magnesium alloy body at a height; a second sub-transition layer being formed on the first sub-transition layer, the second sub-transition layer being formed in the region where the conductive layer and the intermediate layer meet, and being formed by a portion of the intermediate layer and a portion of the conductive layer at a height; and the remaining portion of the transition layer filling the connecting through hole in a radial direction of the connecting through hole, namely, the first sub-transition layer and / or the second sub-transition layer filling the connecting through hole in a radial direction of the connecting through hole to seal the connecting through hole. It is understood that the first sub-transition layer and the second sub-transition layer have a generally layered structure in the extension direction, but are not limited to a standard layer structure.

[0029] Specifically, in the implementation of the present application, the transition layer includes a first sub-transition layer and a second sub-transition layer, which are formed by ultrasonic welding based on the conductive layer, the intermediate layer, and the magnesium alloy body and overlapped with each other. At least one of the first sub-transition layer and the second sub-transition layer fills the connecting through-hole in the radial direction of the connecting through-hole, thereby sealing the connecting through-hole. Simultaneously, the first sub-transition layer and the second sub-transition layer at least partially fill the connecting through-hole in the axial direction of the connecting through-hole, thereby achieving electrical connection between the conductive layer and the magnesium alloy body.

[0030] In some implementations, the first transition sub-layer and the second transition sub-layer completely fill the entire connection via. For example, the first transition sub-layer and the second transition sub-layer exactly fill the entire connection via. In another example, a small portion of the first transition sub-layer and the second transition sub-layer overflows from the gap between the conductive layer and the protective layer.

[0031] In some implementations, the conductive layer covers the entire connecting through-hole, and after the transition layer is formed, the conductive layer can cover the entire top of the transition layer. Of course, in other alternative implementations, the conductive layer may not cover the entire connecting through-hole, and the conductive layer and the transition layer in the connecting through-hole can also be sealed with the aforementioned sealing material.

[0032] A second aspect of the present application provides an electronic device comprising any one of the magnesium alloy connection structural components described in the first aspect.

[0033] The third aspect of the present application provides a component forming method for forming any one of the magnesium alloy connection structural components described in the first aspect above, the method comprising: covering the connection through-holes of the protective layer with a conductive layer; welding the conductive layer and the magnesium alloy body at the corresponding positions of the connection through-holes by ultrasonic welding; and gluing the protective layer and the conductive layer to the corresponding positions of the protective layer by means of a sealing material.

[0034] The forming method of the above-mentioned magnesium alloy connection structural member forms a solid solution alloy welding layer between the magnesium alloy body and the conductive layer through ultrasonic welding, and then forms an electrical connection medium and an anti-corrosion medium through the welding layer and the copper alloy, thereby realizing an anti-corrosion grounding scheme for the magnesium alloy.

[0035] In some implementations, the anti-corrosion grounding scheme of the magnesium alloy component is optimized by adjusting the contact area between the welding head and the conductive layer, the number of welds, the distribution of welds and the vibration frequency during welding, as well as the adjustment of the welding area and the working area in the conductive layer.

[0036] The fourth aspect of the present application provides a component forming method for forming any one of the magnesium alloy connection structural components described in the first aspect above, the method comprising: providing a conductive layer on the surface of the magnesium alloy body in the connecting through hole; welding the conductive layer and the magnesium alloy body by ultrasonic welding; and filling the gaps between the side surfaces of the protective layer and the side surfaces of the conductive layer and the side surfaces of the transition layer by means of a sealing material.

[0037] The above-mentioned magnesium alloy connection structure and the forming method of the magnesium alloy connection structure are characterized by setting an intermediate alloy in the magnesium-copper heterogeneous alloy. The intermediate alloy can form a solid solution alloy with the magnesium-copper heterogeneous alloy respectively. After ultrasonic welding under certain temperature conditions, a solid solution alloy welding layer is formed. The welding layer and the copper alloy constitute an electrical connection medium and an anti-corrosion medium. By adjusting the connection area of ​​the ultrasonic welding joint, the distribution of the welding points and the vibration frequency during welding, based on the direction of integration of the ultrasonic welding area and the electrical connection working area, the anti-corrosion electrical connection of the ultra-small area magnesium alloy component is achieved.

[0038] The fifth aspect of the present application provides a component forming method for forming any one of the magnesium alloy connection structural parts in the first aspect above, the method comprising: arranging an intermediate layer on the surface of the magnesium alloy body in the connecting through hole, and arranging a conductive layer on the intermediate layer; welding the conductive layer, the intermediate layer and the magnesium alloy body by ultrasonic welding, and filling the connecting through hole in the radial direction of the connecting through hole with a transition layer formed by the conductive layer, the intermediate layer and the magnesium alloy body. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] FIG1( a ) shows a perspective view of an electronic device;

[0040] Figure 1(b) shows an exploded view of an electronic device;

[0041] Figure 1(c) shows a local enlarged view of the P region in Figure 1(b);

[0042] FIG2( a ) shows a top view of a magnesium alloy connection structure 10 ′;

[0043] FIG2( b ) shows a cross-sectional view of a magnesium alloy connection structure 10 ′ along the AA section in FIG2( a );

[0044] FIG3 (a) shows a schematic structural diagram of a magnesium alloy connection structure 10 of the present application;

[0045] FIG3( b ) shows a schematic diagram of the distribution of the magnesium alloy body 100 , the transition layer 400 , and the conductive layer 300 in a magnesium alloy connection structure 10 of the present application;

[0046] Figure 3(c) shows a schematic diagram of an interstitial solid solution;

[0047] Figure 3(d) shows a schematic diagram of a substitutional solid solution;

[0048] Figure 4 A schematic diagram showing the distribution of a magnesium alloy body 100 ″, a transition layer 500 ″ and the magnesium alloy body 100 ″ is shown;

[0049] FIG5( a ) shows a top view of a magnesium alloy connection structure 10 a of the present application;

[0050] FIG5( b ) shows a cross-sectional view of the magnesium alloy connection structure 10 a in FIG5( a ) along the BB section in FIG5( a );

[0051] FIG5( c ) shows a partial enlarged view of the magnesium alloy connection structure 10 a in the M1 region of FIG5( b );

[0052] FIG5( d ) shows a partial enlarged view of the N1 region of FIG5( c ) of a magnesium alloy connection structure 10 a of the present application;

[0053] FIG5(e) shows a partial enlarged view of another magnesium alloy connection structure 10a of the present application in the M1 region of FIG5(b);

[0054] FIG5( f ) shows a partial enlarged view of another magnesium alloy connection structure 10 a in the present application at the M1 region in FIG5( b );

[0055] FIG5(g) shows a partial enlarged view of the M1 region in FIG5(b) of another magnesium alloy connection structure 10a of the present application;

[0056] FIG6 (a) shows a schematic diagram of a conductive layer 300a and a magnesium alloy body 100 in a magnesium alloy connection structure 10a of the present application before welding;

[0057] FIG6( b ) shows a schematic diagram of the welding process of the conductive layer 300 a and the magnesium alloy body 100 in a magnesium alloy connection structure 10 a of the present application;

[0058] FIG6( c ) shows a schematic diagram of the conductive layer 300 a and the magnesium alloy body 100 in a magnesium alloy connection structure 10 a of the present application after welding is completed;

[0059] FIG6 (d) shows a schematic structural diagram of a magnesium alloy connection structure 10a of the present application;

[0060] FIG6 (e) shows a flow chart of a forming process of a magnesium alloy connection structure 10a of the present application;

[0061] FIG7 (a) shows a top view of a magnesium alloy connection structure 10b of the present application;

[0062] FIG7( b ) shows a cross-sectional view of the magnesium alloy connection structure 10 b in FIG7( a ) along the CC section in FIG7( a );

[0063] FIG7( c ) shows a partial enlarged view of the magnesium alloy connection structure 10 b in the present application at the M2 region in FIG7( b );

[0064] FIG7( d ) shows a partial enlarged view of the N2 region of FIG7( c ) of a magnesium alloy connection structure 10 b of the present application;

[0065] FIG8( a ) shows a schematic diagram of a conductive layer 300 b and a magnesium alloy body 100 in a magnesium alloy connection structure 10 b of the present application before welding;

[0066] FIG8( b ) shows a schematic diagram of the welding process of the conductive layer 300 b and the magnesium alloy body 100 in a magnesium alloy connection structure 10 b of the present application;

[0067] FIG8 (c) shows a schematic structural diagram of a magnesium alloy connection structure 10b of the present application;

[0068] FIG8( d ) shows a forming process flow chart of a magnesium alloy connection structure 10 b of the present application;

[0069] FIG9( a ) shows a top view of a magnesium alloy connection structure 10 c of the present application;

[0070] FIG9( b ) shows a cross-sectional view of the magnesium alloy connection structure 10 c in FIG9( a ) along the DD section in FIG9( a );

[0071] FIG9( c ) shows a partial enlarged view of the magnesium alloy connection structure 10 c of the present application in the M3 area of ​​FIG9( b );

[0072] FIG9( d ) shows a partial enlarged view of the N3 region of FIG9( c ) of a magnesium alloy connection structure 10 c of the present application;

[0073] FIG10( a ) shows a schematic diagram of a conductive layer 300 c and a magnesium alloy body 100 in a magnesium alloy connection structure 10 c of the present application before welding;

[0074] FIG10( b ) shows a schematic diagram of a conductive layer 300 c and a magnesium alloy body 100 in a magnesium alloy connection structure 10 c of the present application during welding;

[0075] FIG10( c ) shows a schematic diagram of a conductive layer 300 c and a magnesium alloy body 100 in a magnesium alloy connection structure 10 c of the present application after welding is completed;

[0076] FIG10( d ) shows a schematic structural diagram of a magnesium alloy connection structure 10 c of the present application;

[0077] FIG10( e ) shows a flow chart of a forming process of a magnesium alloy connection structure 10 c of the present application.

[0078] Among them, in the accompanying drawings:

[0079] 1'-electronic equipment; 10'-magnesium alloy connecting structure; 20'-grounding spring;

[0080] 2'-camera;

[0081] 3'-posterior shell;

[0082] 4'-middle frame;

[0083] 5'-display screen;

[0084] 1-Electronic equipment; 6-Welding device; 7-Heating device;

[0085] 10-Magnesium alloy connecting structural parts;

[0086] 100-magnesium alloy body;

[0087] 200-protective layer;

[0088] 300-conductive layer;

[0089] 400-transition layer;

[0090] 500-sealing material;

[0091] S W - welding area;

[0092] S C - working area;

[0093] 10a-magnesium alloy connection structure; 11a-weld point;

[0094] 300a-conductive layer;

[0095] 400a-Mg-Cu solid solution layer;

[0096] 500a-adhesive layer;

[0097] 600a-filling material;

[0098] S W1 -First welding area; S W2 - a first welding area;

[0099] 10b-magnesium alloy connecting structural parts; 11b-weld points;

[0100] 300b-copper plate;

[0101] 400b-solid solution layer; 410b-first sub-solid solution layer; 420b-second sub-solid solution layer;

[0102] 700-middle layer;

[0103] 10c-magnesium alloy connecting structural parts; 11c-welding points;

[0104] 300c-conductive layer;

[0105] 400c-Mg-Cu solid solution layer;

[0106] 500c-sealing part. DETAILED DESCRIPTION

[0107] Illustrative embodiments of the present application include, but are not limited to, a magnesium alloy connection structure, an electronic device, and a component forming method.

[0108] It is understood that the magnesium alloy connecting structure described in this application is used as an electrical connection solution in electrical / electronic / communication equipment. It can provide a reliable grounding point for electronic equipment that is free of nonlinear excitation and passive intermodulation (PIM), while also reducing electromagnetic compatibility (EMC) noise or signal feeds. In other words, the magnesium alloy connecting structure can electrically connect magnesium alloy components to components to be connected. Electronic devices such as mobile phones, tablets, laptops, and large screens have magnesium alloy connecting structures. Magnesium alloy components include motherboards, liquid crystal displays, camera housings, and midframes. The components to be connected include grounding springs. The magnesium alloy connecting structure is the area on the magnesium alloy component that contacts an external electrical connection point. The external electrical connection point is also the component to be connected. The following description uses the magnesium alloy connecting structure on a camera housing as an example.

[0109] Figure 1(a) shows a three-dimensional view of an electronic device. Figure 1(b) shows an exploded view of an electronic device. Figure 1(c) shows a partial enlarged view of the P area in Figure 1(b). As shown in Figures 1(a) to 1(c), the electronic device 1' includes a camera 2', a rear housing 3', a middle frame 4', and a display screen 5', which are arranged in sequence. The camera 2' is mounted on the middle frame 4' and can pass through a mounting hole (not shown) on the rear housing 3' to complete the installation of the electronic device 1'. Specifically, the camera 2' includes a magnesium alloy connecting structure 10', and a grounding spring 20' is provided on the middle frame 4'. The camera 2' elastically abuts the grounding spring 20' via the magnesium alloy connecting structure 10', so that static electricity carried by the camera 2' is released through the magnesium alloy connecting structure 10' and the grounding spring 20'.

[0110] FIG2( a ) shows a top view of a magnesium alloy connection structure 10 ′, and FIG2( b ) shows a cross-sectional view of the magnesium alloy connection structure 10 ′ along the AA section in FIG2( a ). In combination with FIG2( a ) and FIG2( b ), it can be seen that the present application provides a magnesium alloy connection structure 10 ′, on which at least one electrical connection point region 400 ′ is provided. Specifically, the magnesium alloy connection structure 10 ′ includes a magnesium alloy body 100 ′, a protective layer 200 ′ disposed on the surface of the magnesium alloy body 100 ′, and a conductive layer 300 ′ disposed on the protective layer 200 ′ in the electrical connection point region 400 ′. The conductive layer 300 ′ is connected to the magnesium alloy body 100 ′ via a weld. The conductive layer 300 ′ serves as an electrical connection point for contacting the outside world to form an electrical connection. The magnesium alloy connection structure 10' connects the conductive layer 300' to the magnesium alloy body 100' using a welding process, such as laser welding, in the electrical connection point region 400', eliminating the need to remove the protective layer 200' from the entire electrical connection point region 400'. The weld point shown in FIG2(a) refers to the region where the conductive layer 300', protective layer 200', and magnesium alloy body 100' melt and resolidify during welding, resulting in a raised or recessed surface of the welded part.

[0111] In the above technical solution, the conductive layer 300' is connected to the magnesium alloy body 100' in the electrical connection point region 400' on the magnesium alloy connection structure 10' by a welding process. Although this can effectively isolate the magnesium alloy body 100' from the outside air, reduce air corrosion and galvanic corrosion, and achieve electrical connection between the magnesium alloy connection structure 10' and the external grounding spring, the electrical connection point region 400' in the magnesium alloy connection structure 10' is directly exposed to the air. Moreover, since most of the electrical connection point region 400' is magnesium alloy, the electrical connection point region 400' is susceptible to oxidation corrosion. After a long period of use, it may even cause the magnesium alloy body 100' connected to the electrical connection point region 400' to be corroded, thereby shortening the service life of the electronic device. Furthermore, due to the limited forming dimensions of laser spot welding, the electrical connection point region 400' is relatively large, resulting in a low proportion of the conductive layer 300' area dedicated to electrical connection. Given the same required electrical connection area, the conductive layer 300' needs to be larger, increasing layout complexity and the material cost of the magnesium alloy connection structure 10'. Finally, the electrical connection point region 400' is a structure formed by melting and then solidifying, resulting in a weak bond between the electrical connection point region 400' and the conductive layer 300'. The central region of the electrical connection point region 400' contains a magnesium-copper eutectic alloy, and gaps inevitably exist at the grain boundaries of the eutectic alloy, resulting in low shear strength of the weld.

[0112] To address the above-mentioned issues, the present application provides a magnesium alloy connection structure 10. As shown in FIG3(a), in the magnesium alloy connection structure 10, a conductive transition layer 400 is formed on the contact area between the magnesium alloy body 100 and the conductive layer 300. On the one hand, the transition layer 400 realizes the electrical connection between the magnesium alloy body 100 and the conductive layer 300. On the other hand, as shown in FIG3(b), the transition layer 400 is a layer structure formed at the contact area between the magnesium alloy body 100 and the conductive layer 300. The transition layer 400 separates the magnesium alloy body 100 from the conductive layer 300. The transition layer 400 separates the magnesium alloy body 100 and the conductive layer 300 to avoid galvanic corrosion at the interface between the magnesium alloy body 100 and the conductive layer 300, thereby extending the service life of the magnesium alloy connection structure 10. Specifically, as shown in FIG3(a), the magnesium alloy connection structure 10 includes a magnesium alloy body 100, a protective layer 200, a conductive layer 300, and a transition layer 400. Among them, the protective layer 200 encapsulates the magnesium alloy body 100, and a connecting through-hole 210 is opened on the protective layer 200 to connect to the surface of the magnesium alloy body 100. The transition layer 400 is formed at the bottom of the connecting through-hole 210. A conductive layer 300 is formed on the transition layer 400. The transition layer 400 and the conductive layer 300 are used to electrically connect the magnesium alloy body 100 to the outside world. The above-mentioned magnesium alloy connection structure 10 seals the connecting through-hole 210 through the transition layer 400 to isolate the magnesium alloy body 100 from the outside world. Alternatively, the magnesium alloy connection structure 10 seals the connecting through-hole 210 through the conductive layer 300 and the sealing material 500 to isolate the magnesium alloy body 100 from the outside world.

[0113] For ease of description, the interface between the conductive layer 300 and the transition layer 400 is marked as l 1. The interface between the transition layer 400 and the magnesium alloy body 100 is marked as l 3. Mark the surface of the magnesium alloy body 100 as l 2. It is understood that the surface marking of the magnesium alloy body 100 is l 2 The interface between the conductive layer 300 and the transition layer 400 is marked as l 1 and the interface between the transition layer 400 and the magnesium alloy body 100 is marked as l 3, and this application does not make any specific limitations.

[0114] In some implementations, the transition layer 400 is a solid solution formed between the magnesium alloy body 100 and the conductive layer 300. The transition layer 400 is distributed between the magnesium alloy body 100 and the conductive layer 300 and is in contact with the magnesium alloy body 100 and the conductive layer 300, respectively. A solid solution refers to an alloy phase in which solute atoms dissolve in a solvent lattice while maintaining the solvent type.

[0115] Generally speaking, solid solutions can be divided into substitutional solid solutions, interstitial solid solutions and mixed solid solutions according to the position of solute atoms in the solvent lattice. Mixed solid solutions refer to solid solutions that have both interstitial solid solutions and substitutional solid solutions.

[0116] An interstitial solid solution is one in which solute atoms are distributed among the interstices of the solvent lattice. For example, as shown in Figure 3(c), Solvent I is a transition metal with a relatively large diameter, while Solute II is a non-metallic element with a relatively small diameter, such as carbon or hydrogen. A substitutional solid solution is one in which solute atoms occupy nodal sites in the solvent lattice. For example, as shown in Figure 3(d), the atomic diameters of Solvent I and Solute III are similar, making the formation of a substitutional solid solution more likely. Metallic elements can generally form substitutional solid solutions with each other, but the solubility varies depending on the element. Many factors influence the solubility of a solid solution, primarily depending on crystal structure, atomic size, chemical affinity, and atomic valence. To facilitate the subsequent description of solid solutions, we will first introduce a commonly used concept regarding solid solutions: solid solubility. Solid solubility refers to the solubility of a metal in its solid state.

[0117] In some implementations, the magnesium-aluminum solid solution formed by a magnesium alloy and an aluminum alloy, the copper-zinc solid solution formed by copper or a copper alloy and a zinc alloy, and the magnesium-copper solid solution formed by a magnesium alloy and a copper alloy are generally substitutional solid solutions. Furthermore, because the atomic radius of a magnesium atom is comparable to that of an aluminum atom, and the atomic radius of a copper atom is comparable to that of a zinc atom, the magnesium-aluminum solid solution and the copper-zinc solid solution have relatively high solid solubility. However, because the atomic radius of a magnesium atom differs significantly from that of a copper atom, the magnesium-copper solid solution has relatively low solid solubility.

[0118] In some implementations, the solubility of the substitutional solid solution in the magnesium alloy connection structure 10 is greater than or equal to 0.1%.

[0119] In some implementations, the replacement solid solution forming process between the magnesium alloy body 100 and the conductive layer 300 in the magnesium alloy connection structure 10 is ultrasonic welding. The dimensions of the magnesium alloy body 100 and the conductive layer 300 both meet the requirements of the ultrasonic welding process. The dimensions of the magnesium alloy body 100, the conductive layer 300, and the ultrasonic welding process will be described in detail below in conjunction with application scenarios. It will be appreciated that in some application scenarios, a transition layer 400" may be formed between the first magnesium alloy body 110" and the second magnesium alloy body 120" using the ultrasonic welding process and an intermediate layer to achieve connection between the first magnesium alloy body 110" and the second magnesium alloy body 120".

[0120] In another alternative implementation, the transition layer 400 in the magnesium alloy connection structure 10 is a conductive adhesive layer. The magnesium alloy connection structure 10 connects the magnesium alloy body 100 and the conductive layer 300 via the conductive adhesive layer. The electrical conductivity of the conductive adhesive layer also enables electrical connection between the magnesium alloy body 100 and the conductive layer 300. Finally, the conductive adhesive layer separates the magnesium alloy body 100 from the conductive layer 300, thereby preventing galvanic corrosion at the interface between the magnesium alloy body 100 and the conductive layer 300.

[0121] The magnesium alloy connection structure 10 is based on ultrasonic welding technology for the magnesium alloy body 100 and the conductive layer 300. The magnesium alloy body 100 and the conductive layer 300 are ultrasonically welded to form an electrical connection medium, thereby achieving a stable electrical connection between the magnesium alloy body 100 and the conductive layer 300 in a non-contact manner. At the same time, by sealing the connection through-hole 210 to isolate the magnesium alloy body 100 from the outside world, the oxidation of the magnesium alloy body 100 and the galvanic corrosion at the interface between the magnesium alloy body 100 and the conductive layer 300 are further reduced, thereby extending the service life of the magnesium alloy connection structure 10 and, in turn, the service life of the electronic device. It is understood that the interface between the magnesium alloy body 100 and the conductive layer 300 can be the contact interface when the magnesium alloy body 100 and the conductive layer 300 come into contact in some application scenarios.

[0122] Currently, the following main types of magnesium alloy connecting structural members 10 and methods for forming the magnesium alloy connecting structural members 10 are included. The following describes the relevant technical solutions from three aspects, including the specific structure of the magnesium alloy connecting structural member 10, the structural composition of the magnesium alloy connecting structural member 10 before forming, and the forming process of the magnesium alloy connecting structural member 10, in combination with specific application scenarios.

[0123] It can be understood that the conductive layer 300 is a metal or alloy material with good electrical conductivity. In some implementations, when the conductive layer 300 is an alloy material, the conductive layer 300 includes a substrate, which is a conductor with higher wear resistance and corrosion resistance than magnesium alloy, and a surface resistance of less than 0.5 ohms on the side away from the magnesium alloy body 100. The substrate can be at least one of a copper alloy, an aluminum alloy, and a multi-element alloy, and the thickness of the substrate is 0.08 mm to 0.6 mm. The conductive layer 300 also includes an anti-corrosion layer provided on the surface of the substrate. The anti-corrosion layer includes a nickel layer provided on the surfaces of the opposite sides of the substrate, and a gold layer provided on the nickel layer on the side of the substrate away from the magnesium alloy body 100, and the thickness of the anti-corrosion layer is 0.0005 mm to 0.05 mm. In summary, the present application does not specifically limit the conductive layer 300.

[0124] FIG5( a ) shows a top view of a magnesium alloy connection structure 10 a , and FIG5( b ) shows a cross-sectional view of the magnesium alloy connection structure 10 a along the BB section in FIG5( a ).

[0125] In some application scenarios, referring to FIG. 5 ( a ), the conductive layer 300 a in the magnesium alloy connection structure 10 a may be a copper foil, and a welding area S is formed on a local area of ​​the conductive layer 300 a. W , welding area S W The conductive layer 300a includes several concentrated and distributed solder joints 11a. W All other areas are working areas S c .

[0126] It is understandable that the conductive layer 300a may also be other conductive materials with good ductility, and this application does not make any specific limitation.

[0127] As shown in FIG5(a), the conductive layer 300a includes a first welding region S W1 and the second welding region S W2 . The first welding area S W1 The second welding area S includes welding spots 11a distributed in an array of 2 columns and 8 rows. W2 The weld spot 11a is arranged in an array of 2 columns and 8 rows. A weld spot refers to a raised or depressed area on the surface of a welded part caused by the welding process after welding. The raised or depressed area on the surface of the welded part may be caused by melting and recondensing the surface of the welded part. Alternatively, the raised or depressed area may be caused by melting and recondensing within the welded part, or by solid solution, which may cause changes in the surface of the welded part.

[0128] It is not difficult to find from Figure 5 (a) that the first welding area S W1 The welding spots 11a are concentrated and distributed, and the second welding area S W2 The solder joints 11a are concentrated and distributed. The conductive layer 300a is divided into the first soldering area S W1 and the second welding region S W2 The areas outside are all working areas S C , the grounding area required for the magnesium alloy connecting structural member 10a is relatively large. It is understandable that due to the good ductility of the conductive layer 300a, the conductive layer 300a can be formed to a relatively large area within a certain thickness. Based on this, the above application scenario is particularly suitable for applications where the grounding area of ​​the magnesium alloy connecting structural member 10a is relatively large.

[0129] In some implementations, the grounding area of ​​the magnesium alloy connection structure 10 a is adjusted by adjusting the area of ​​the conductive layer 300 a , which is easy and convenient to operate.

[0130] As shown in Figure 5(b), the present application provides a magnesium alloy connection structure 10a. The conductive layer 300a is copper foil, the transition layer 400 is a magnesium-copper solid solution layer 400a, and the sealing material 500 is an adhesive layer 500a. Based on ultrasonic welding technology for magnesium-copper heterogeneous alloys, the present application ultrasonically welds the conductive layer 300a and the magnesium alloy body 100 to form a magnesium-copper solid solution layer 400a at the interface between the conductive layer 300a and the magnesium alloy body 100. The conductive layer 300a and the magnesium-copper solid solution layer 400a serve as electrical connection media between the magnesium alloy body 100 and the grounding spring. Regarding the area opposite the conductive layer 300a and the protective layer 200, for example, the area between the conductive layer 300a and the protective layer 200 after the conductive layer 300a is flattened, since this area cannot be connected by forming a magnesium-copper solid solution layer 400a, an adhesive layer 500a is used to bond the conductive layer 300a and the protective layer 200 within this area. As shown in FIG5(b), the location of the connecting through hole 210 is the welding area S of the magnesium alloy connecting structure 10a. W The position of the conductive layer 300a in the magnesium alloy connection structure 10a except the connection through hole 210 is the working area S C It can be understood that the welding area S W That is, the area for mechanically and electrically connecting the conductive layer 300a to the magnesium alloy body 100. The working area S C That is, the area of ​​the conductive layer 300a is used for elastically connecting to the external grounding spring.

[0131] Specifically, the magnesium alloy connection structure 10a includes a magnesium alloy body 100, a protective layer 200, a conductive layer 300a, a magnesium-copper solid solution layer 400a, and an adhesive layer 500a. The protective layer 200 encapsulates the magnesium alloy body 100. A connection through-hole 210 is formed in the protective layer 200, communicating with the surface of the magnesium alloy body 100. A magnesium-copper solid solution layer 400a is formed at the bottom of the connection through-hole 210. A conductive layer 300a is formed on the magnesium-copper solid solution layer 400a. The magnesium-copper solid solution layer 400a and the conductive layer 300a are used to electrically connect the magnesium alloy body 100 to an external grounding spring.

[0132] In the aforementioned magnesium alloy connection structure 10a, first, the connection through-hole 210 is sealed by the adhesive layer 500a, the conductive layer 300a, and the magnesium-copper solid solution layer 400a. Specifically, the adhesive layer 500a, the conductive layer 300a, and the magnesium-copper solid solution layer 400a form a barrier between the magnesium alloy body 100 and the outside world, thereby isolating the magnesium alloy body 100 from the outside world and preventing oxidation or corrosion of the magnesium alloy body 100. Secondly, the magnesium alloy body 100 is electrically connected to an external grounding spring via the conductive layer 300a and the magnesium-copper solid solution layer 400a. Specifically, the magnesium alloy body 100, the conductive layer 300a, and the magnesium-copper solid solution layer 400a together constitute a grounding functional unit, thereby achieving grounding of the magnesium alloy connection structure 10a. Furthermore, the conductive layer 300a, adhesive layer 500a, protective layer 200, and magnesium-copper solid solution layer 400a collectively form an anti-corrosion layer for the magnesium alloy body 100, mitigating galvanic corrosion between the conductive layer 300a and the magnesium alloy body 100 in the magnesium alloy connection structure 10, thereby extending the service life of the magnesium alloy connection structure 10a. Finally, the area occupied by the welds in the magnesium alloy connection structure 10a is relatively low, increasing the actual effective area of ​​the conductive layer 300a, facilitating a reduction in the area of ​​the conductive layer 300a, optimizing spatial layout, and reducing material costs.

[0133] After introducing the overall structure of the magnesium alloy connection structure 10 a , the following will describe in detail the distribution position of the magnesium-copper solid solution layer 400 a (transition layer 400 ) in the magnesium alloy connection structure 10 a and the size of the magnesium-copper solid solution layer 400 a .

[0134] Figure 5(c) shows a partial, enlarged view of the M1 region in Figure 5(b) of a magnesium alloy connection structure 10a. In some implementations, as shown in Figure 5(c), a magnesium-copper solid solution layer 400a is formed in the area where the conductive layer 300a and the magnesium alloy body 100 meet before the magnesium alloy connection structure 10a is formed. This area is located at the bottom of the connection through-hole 240. A portion of the magnesium-copper solid solution layer 400a is embedded in the magnesium alloy body 100, while another portion protrudes from the surface of the magnesium alloy body 100 and meets the lower surface of the conductive layer 300a.

[0135] Figure 5(d) shows a partial enlarged view of the N1 region in Figure 5(c) of a magnesium alloy connection structure 10a. In some implementations, as shown in Figure 5(d), the conductive layer 300a, the magnesium-copper solid solution layer 400a, and the magnesium alloy body 100 are sequentially arranged in parallel. The magnesium-copper solid solution layer 400a is used to achieve electrical connection between the conductive layer 300a and the magnesium alloy body 100 while separating the conductive layer 300a from the magnesium alloy body 100. It should be understood that the thickness d1 of the conductive layer 300a, the thickness d2 of the magnesium-copper solid solution layer 400a, and the placement of the magnesium-copper solid solution layer 400a are not specifically limited in this application. Any arrangement that can achieve a stable mechanical and electrical connection between the conductive layer 300a and the magnesium alloy body 100 and that separates the conductive layer 300a from the magnesium alloy body 100 is within the scope of protection of this application.

[0136] Figure 5(e) shows a partial, enlarged view of the M1 region in Figure 5(b) of a magnesium alloy connection structure 10a. In some implementations, as shown in Figure 5(e), a magnesium-copper solid solution layer 400a is formed in the region where the conductive layer 300a and the magnesium alloy body 100 meet before the magnesium alloy connection structure 10a is formed. This region is located at the bottom of the connection via 240. The magnesium-copper solid solution layer 400a is disposed on the upper surface of the magnesium alloy body 100 and is in contact with the lower surface of the conductive layer 300a.

[0137] Figure 5(f) shows a partial, enlarged view of the M1 region in Figure 5(b) of a magnesium alloy connection structure 10a. In some implementations, as shown in Figure 5(f), a magnesium-copper solid solution layer 400a is formed in the area where the conductive layer 300a and the magnesium alloy body 100 meet before the magnesium alloy connection structure 10a is formed. This area is located at the bottom of the connection through-hole 240. The magnesium-copper solid solution layer 400a is embedded in the magnesium alloy body 100 and contacts the lower surface of the conductive layer 300a.

[0138] Figure 5(g) shows a partial, enlarged view of the M1 region in Figure 5(b) of a magnesium alloy connection structure 10a. In some implementations, as shown in Figure 5(g), a magnesium-copper solid solution layer 400a is formed in the area where the conductive layer 300a and the magnesium alloy body 100 meet before the magnesium alloy connection structure 10a is formed, and this area is located at the bottom of the connection through-hole 240. A portion of the magnesium-copper solid solution layer 400a is embedded in the magnesium alloy body 100, while another portion is connected to the conductive layer 300a. At the weld 11a, the entire conductive layer 300a forms the magnesium-copper solid solution layer 400a with the magnesium alloy body 100.

[0139] In some implementations, in the magnesium alloy connection structure 10a, the adhesive layer 500a can be insulating Mylar or other non-conductive adhesive materials. When the adhesive layer 500a is insulating Mylar, the insulating Mylar is provided with an adhesive and has a pre-recorded cutout corresponding to the connection through-hole 210. The insulating Mylar and the conductive layer 300a form a composite material.

[0140] The magnesium alloy connecting structure 10a uses insulating Mylar and composite materials to seal the magnesium alloy body 100, thereby slowing down the galvanic corrosion between the magnesium-copper heterogeneous alloys, extending the service life of the magnesium alloy connecting structure 10a, and further extending the service life of the electronic device.

[0141] In some implementations, the conductive layer 300 a is ultrasonically welded to the magnesium alloy body 100 through the connecting through-hole 210 .

[0142] In some implementations, the protective layer 200 includes, but is not limited to, at least one of a micro-arc oxidation ceramic layer, a membrane, an anode layer, an electrophoretic film layer, and a paint coating layer. The thickness of the micro-arc oxidation ceramic layer is 0.002 mm to 0.012 mm, the membrane is 0.0005 mm to 0.003 mm, the anode layer is 0.005 mm to 0.01 mm, the electrophoretic film layer is 0.005 mm to 0.01 mm, and the paint coating layer is 0.005 mm to 0.01 mm.

[0143] In some implementations, the connecting through hole 210 on the protective layer 200 may be pre-opened. For example, the forming process of the connecting through hole 210 may be to break the protective layer 200, or the connecting through hole 210 may be reserved in advance when forming the protective layer 200. The breaking process of the connecting through hole 210 may be etching, laser engraving, or other processes.

[0144] In some implementations, the magnesium alloy connection structure 10a includes at least one magnesium-copper solid solution layer 400a, which is at least partially embedded in the magnesium alloy body 100. Furthermore, the at least one magnesium-copper solid solution layer 400a is formed with a common conductive layer 300a covering the connection through-hole 210. An adhesive layer 500a is adhered between the protective layer 200 and the conductive layer 300a at corresponding locations on the protective layer 200 to seal the connection through-hole 210.

[0145] In some implementations, a recess 310a (shown in FIG. 6(c) below) is formed in the magnesium alloy connection structure 10 at the portion corresponding to the conductive layer 300a and the magnesium-copper solid solution layer 400a (i.e., the weld point). To prevent crack propagation in the recess 310a and thereby reduce the service life of the magnesium alloy connection structure 10a, the recess 310a is filled with a filler material 600. For example, the recess 310a can be sealed using selective dispensing of glue or resin. It is understood that the recess 310a is also the weld point 11a formed by ultrasonic welding.

[0146] In some implementations, as shown in FIG. 5( b ), in order to improve the aesthetics of the surface of the magnesium alloy connection structure 10 , the outer surface of the filling material 600 is flush with the outer surface of the conductive layer 300 a .

[0147] In some implementations, the material of the magnesium alloy body 100 in the magnesium alloy connection structure 10a is any one of magnesium-zinc alloy, magnesium-manganese alloy, magnesium-rhenium alloy and magnesium-lithium alloy.

[0148] After describing the specific structure of the magnesium alloy connection structure 10a, the following will further describe the pre-molding structural composition and the forming process of the magnesium alloy connection structure 10a. As shown in Figure 6(a), the pre-molding structural composition of the magnesium alloy connection structure 10a includes a conductive layer 300a and a magnesium alloy body 100, which is surrounded by a protective layer 200.

[0149] The present application also provides a structural component forming method for forming any of the aforementioned magnesium alloy connection structural components 10a. The transition layer 400a is formed by ultrasonic welding in the region where the magnesium alloy body 100 and the conductive layer 300 meet, and is formed by combining a portion of the conductive layer 300 and a portion of the magnesium alloy body 100 at a height. The ultrasonic welding point is located in the region corresponding to the connection through-hole 210. Specifically, the structural component forming method includes:

[0150] Block S101: Covering the conductive layer 300a on the connecting through-hole 210 of the protective layer 200. The area of ​​the conductive layer 300a is larger than the size of the connecting through-hole 210, and the connecting through-hole 210 is located within the projection area of ​​the conductive layer 300a on the plane of the protective layer 200. It is understood that before covering the connecting through-hole 210 of the protective layer 200 with the conductive layer 300a, the conductive layer 300a may be pre-fixed to the protective layer 200, or pre-fixed to the magnesium alloy body 100, to prevent the conductive layer 300a from moving relative to the connecting through-hole 210 during subsequent ultrasonic welding, thereby preventing the conductive layer 300a from being misaligned relative to the connecting through-hole 210.

[0151] Block S102 : ultrasonic welding is used to weld the conductive layer 300 a and the magnesium alloy body 100 at locations corresponding to the connecting through holes 210 .

[0152] In some implementations, before ultrasonic welding, the area where the conductive layer 300a and the magnesium alloy body 100 in the connecting through-hole 210 meet is cleaned and polished, and the conductive layer 300a is pre-fixed on the surface of the magnesium alloy body 100. Specifically, the interface to be welded of the conductive layer 300a and the interface to be welded of the magnesium alloy body 100b are mechanically polished and ultrasonically cleaned to ensure that the conductive layer 300a and the magnesium alloy body 100 are tightly fitted after being stacked. Specifically, when the surface of the conductive layer 300a facing the magnesium alloy body 100 has a high smoothness, and the surface of the magnesium alloy body 100 facing the conductive layer 300a also has a high smoothness, the conductive layer 300a and the magnesium alloy body 100 can be pre-fixed by stacking them. For ease of description, except for the distribution area of ​​the protective layer on the magnesium alloy body 100 , the rest of the surface of the magnesium alloy body 100 can be considered as the surface of the magnesium alloy body 100 exposed in the connecting through hole 210 .

[0153] As shown in FIG6(b), the ultrasonic welding probe 6 contacts the conductive layer 300a, and then the ultrasonic tool head of the ultrasonic welding probe 6 is adjusted to apply welding ultrasound to the conductive layer 300a, so that the conductive layer 300a and the magnesium alloy body 100 are alloyed through the contact portion to form a weld 11a, as shown in FIG6(d).

[0154] In some implementations, the ultrasonic tool head applies welding ultrasound to the conductive layer 300a and the magnesium alloy body 100. The power of the welding ultrasound is controlled to be between 200W and 500W, and the frequency of the welding ultrasound is controlled to be between 10kHz and 30kHz. A ternary eutectic reaction occurs between the magnesium alloy body 100 and the conductive layer 300a. The adjoining region transforms into a liquid phase of a Mg-Cu-Zn eutectic structure. The Mg-Cu-Zn eutectic structure forms a Mg-Cu-Zn eutectic structure layer. A Mg(Cu, Zn) solid solution is formed in the magnesium alloy body 100. The Mg(Cu, Zn) solid solution forms a Mg(Cu, Zn) solid solution layer. The ultrasonic tool head continues to apply welding ultrasound to the conductive layer 300a and the magnesium alloy body 100. The reaction of the Mg-Cu-Zn eutectic structure decreases, and the amount of the Mg(Cu, Zn) solid solution increases, until the Mg-Cu-Zn eutectic structure disappears and the Mg-Cu-Zn eutectic structure is completely transformed into a Mg(Cu, Zn) solid solution.

[0155] Block S103 : The protective layer 200 and the conductive layer 300 a are adhered to the corresponding portions of the protective layer 200 through the adhesive layer 500 a .

[0156] 6( c ), the protective layer 200 and the conductive layer 300 a are adhered to the corresponding portions of the protective layer 200 by the adhesive layer 500 a to complete the sealing of the connecting through hole 210 . That is, the conductive layer 300 a around the connecting through hole 210 is adhered to the protective layer 200 by the adhesive layer 500 a to achieve isolation of the magnesium alloy body 100 from the outside.

[0157] In some implementations, the thinness of the conductive layer 300a results in a large recess 310a in the area corresponding to the weld spot 11a of the formed magnesium alloy connection structure 10a. Since the process of forming the recess 310a may cause cracks to form at the bend, to avoid stress concentration at the crack and damage to the conductive layer 300a, the above-described structural component forming method, after completing the sealing step of the connection through-hole 210, further includes a treatment step for the area where the weld spot 11a is located, for example:

[0158] Block S104 : filling the recess 310 with a filling material 600 .

[0159] The filler material 600 can be a dispensing glue or resin. To improve the overall aesthetics of the structure, as shown in Figure 6(d), the outer surface of the filler material 600 is flush with the outer surface of the conductive layer 300a. It should be understood that the outer surface of the filler material 600 refers to the surface of the filler material 600 facing away from the magnesium alloy body 100, and the outer surface of the conductive layer 300a refers to the surface of the conductive layer 300a facing away from the magnesium alloy body 100.

[0160] Figure 7(a) shows a top view of a magnesium alloy connection structure 10b. Figure 7(b) shows a cross-sectional view of the magnesium alloy connection structure 10b in Figure 7(a) along the CC section in Figure 7(a). Figure 7(c) shows a partial enlarged view of the magnesium alloy connection structure 10b of the present application in the N2 area in Figure 7(c).

[0161] In another application scenario, the difference from the magnesium alloy connection structure 10a in the previous application scenario is that, referring to FIG7(a), the conductive layer 300b in the magnesium alloy connection structure 10b is a copper plate or copper sheet, and a welding area S is formed on the peripheral area of ​​the conductive layer 300b. W , welding area S W The conductive layer 300b includes a plurality of solder joints 11b distributed around the edge of the conductive layer 300b. W Other areas outside the working area S cIn some implementations, based on ultrasonic welding technology for magnesium-copper heterogeneous alloys, an intermediate alloy is provided in the magnesium-copper heterogeneous alloy. The intermediate alloy can form a solid solution alloy with the magnesium-copper heterogeneous alloy. After ultrasonic welding under certain temperature conditions, a solid solution alloy weld layer is formed. The weld layer and the copper alloy constitute an electrical connection medium and an anti-corrosion medium. By adjusting the contact area of ​​the ultrasonic weld joint, the distribution of the weld points, and the vibration frequency during welding, and based on the direction of integration of the ultrasonic welding area and the electrical connection working area, an anti-corrosion electrical connection solution for ultra-small area magnesium alloy components is achieved.

[0162] In some implementations, the conductive layer 300b may be made of at least one of copper metal and zinc-copper alloy.

[0163] As shown in Figure 7(a), the welding area S W Enclosed in the work area S c Around. Welding area S W It includes 12 welding spots 11b. It is understood that the working area S can be adjusted by adjusting the number and distribution of welding spots 11b and the process parameters of ultrasonic welding. c The location and size of the solder joint.

[0164] As shown in Figure 7(b), in the magnesium alloy connection structure 10b, the connection through-hole 210 is located within the projection of the conductive layer 300b within the plane of the protective layer 200. At least a portion of the transition layer 400b at its height is embedded in the magnesium alloy body 100, and the remaining portion of the transition layer 400b radially fills the connection through-hole 210 to seal the connection through-hole 210. It is understood that this application does not specifically limit whether the remaining portion of the transition layer 400b fills the connection through-hole 210 in the axial direction of the connection through-hole 210. As long as the connection through-hole 210 is filled in the radial direction of the connection through-hole 210 and the conductive layer 300b and the magnesium alloy body 100 are stably connected, and the relevant solutions are within the scope of protection of this application, and this application does not specifically limit them. The interface shape of the connection through-hole 210 in the cross-section parallel to the surface of the magnesium alloy body 100 can be any shape, such as circular, square, hexagonal, etc. The radial direction of the connecting through hole 210 refers to a direction in the connecting through hole 210 that is parallel to the surface of the magnesium alloy body 100 . Similarly, the axial direction of the connecting through hole 210 refers to a direction in the connecting through hole 210 that is perpendicular to the surface of the magnesium alloy body 100 .

[0165] It is understood that in this application scenario, the transition layer 400b needs to completely fill the connecting through-hole 210 in the radial direction of the connecting through-hole 210. That is, the thickness of the transition layer 400b is thicker than the thickness of the transition layer 400a in the previous application scenario, and the volume of the transition layer 400b is larger than the volume of the transition layer 400a in the previous application scenario. Based on this, in some implementations, the above-mentioned transition layer 400b is formed not only with the aid of the conductive layer 300b and the magnesium alloy body 100, but also with the aid of the intermediate layer 700.

[0166] In some implementations, the thickness of the intermediate layer 700 needs to meet ultrasonic welding requirements, and the thickness of the intermediate layer 700 ranges from 0.5 μm to 15 μm. For example, the thickness of the intermediate layer 700 ranges from 1 μm to 10 μm.

[0167] In some implementations, the intermediate layer 700 can be selected based on the following conditions: first, the melting temperature of the intermediate layer 700 is 195°C to 205°C lower than the melting points of the conductive layer 300 and the magnesium alloy body 100, or the eutectic temperature between the intermediate layer 700 and the main elements of the magnesium alloy body 100 and the conductive layer 300 is 150°C to 300°C lower than the melting points of the magnesium alloy body 100 and the conductive layer 300; second, the maximum solid solubility between the main elements of the intermediate layer 700 and the main elements of the magnesium alloy body 100 and the conductive layer 300 is at least 0.1%; third, the maximum atomic radius difference between the main elements in the intermediate layer 700 and the magnesium alloy body 100 and the conductive layer 300 is no more than 50 μm; and the electrode potential difference between the main elements in the intermediate layer 700 and the melting point of the magnesium alloy body 100 and the conductive layer 300 is at most within -0.8 V. It is understood that the intermediate layer 700 needs to meet at least three of the above conditions.

[0168] In addition, the thickness of the conductive layer 300b needs to meet the grounding requirements, the surface treatment and overall conductive performance of the conductive layer 300b need to meet the grounding requirements of the conductive foam or conductive elastic feet or even the grounding springs, and the thickness of the conductive layer 300b also needs to meet the process requirements of ultrasonic welding.

[0169] In some implementations, the thickness of the conductive layer 300b ranges from 5 μm to 300 μm. For example, the thickness of the conductive layer 300b ranges from 10 μm to 200 μm.

[0170] In some implementations, to achieve good welding between the conductive layer 300b and the magnesium alloy body 100 and avoid severe galvanic corrosion after welding, an alloy material with a low melting point, the ability to form a solid solution with the magnesium alloy and the copper alloy, and a solid solubility of at least 0.1%, is selected as the intermediate layer 700 between the conductive layer 300b and the magnesium alloy body 100. For example, the intermediate layer 700 is a zinc-aluminum-tin alloy. It will be understood that tin is used to lower the melting point of the intermediate layer 700, aluminum is used to increase its solid solubility with the magnesium alloy body 100, and zinc is used to increase its solid solubility with the conductive layer 300b (copper alloy).

[0171] In some implementations, the transition layer 400b includes a first sub-transition layer 410b and a second sub-transition layer 420b. The first sub-transition layer 410b is formed in the region where the magnesium alloy body 100 and the intermediate layer 700 meet, and is formed by a portion of the intermediate layer 700 and a portion of the magnesium alloy body 100 at the height. At least a portion of the first sub-transition layer 410b is embedded in the magnesium alloy body 100 at the height. The second sub-transition layer 420b is formed on the first sub-transition layer 410b and in the region where the conductive layer 300 and the intermediate layer 700 meet, and is formed by a portion of the intermediate layer 700 and a portion of the conductive layer 300 at the height. The remaining portion of the transition layer 400 radially fills the connecting through-hole 210, meaning that the first sub-transition layer 410b and / or the second sub-transition layer 420b radially fill the connecting through-hole 210 to seal the connecting through-hole 210. As shown in FIG7( c ), at least one of the first sub-transition layer 410 b and the second sub-transition layer 420 b completely fills the connecting through-hole 210 in the radial direction of the connecting through-hole 210, thereby sealing the connecting through-hole 210. Furthermore, the first sub-transition layer 410 b and the second sub-transition layer 420 b at least partially fill the connecting through-hole 210 in the axial direction of the connecting through-hole 210, thereby achieving electrical connection between the conductive layer 300 b and the magnesium alloy body 100.

[0172] Figure 7(d) shows a partial enlarged view of the N2 region of a magnesium alloy connection structure 10b in Figure 7(b). In some implementations, as shown in Figure 7(d), the conductive layer 300b, the first sub-transition layer 410b, the second sub-transition layer 420b, and the magnesium alloy body 100 are sequentially arranged in parallel. The first sub-transition layer 410b and the second sub-transition layer 420b are used to separate the conductive layer 300b from the magnesium alloy body 100 and to achieve electrical connection between the conductive layer 300b and the magnesium alloy body 100. It should be understood that the thickness of the conductive layer 300b, the thickness of the first sub-transition layer 410b, and the thickness of the second sub-transition layer 420b, as well as the arrangement of the first sub-transition layer 410b and the second sub-transition layer 420b, are not specifically limited in this application. Any arrangement that can achieve stable connection and separation between the conductive layer 300b and the magnesium alloy body 100 is within the scope of protection of this application.

[0173] After introducing the specific structure of the magnesium alloy connecting structural member 10 b , the structural composition of the magnesium alloy connecting structural member 10 a before forming and the forming process of the magnesium alloy connecting structural member 10 b will be described below.

[0174] As shown in FIG. 8( a ), the structure of the magnesium alloy connection structure 10 b before forming includes a magnesium alloy body 100 , an intermediate layer 700 and a conductive layer 300 c , and the periphery of the magnesium alloy body 100 is enclosed by a protective layer 200 .

[0175] The present application also provides a structural component forming method for forming any one of the above-mentioned magnesium alloy connection structural components 10b.

[0176] Block S201 : an intermediate layer 700 is disposed on the surface of the magnesium alloy body 100 in the connecting through hole 210 , and a conductive layer 300 is disposed on the intermediate layer 700 .

[0177] In some implementations, the intermediate layer 700 and the conductive layer 300b may be installed by cleaning and polishing the surfaces of the conductive layer 300b, the intermediate layer 700, and the magnesium alloy body 100. Specifically, the interfaces to be welded of the conductive layer 300b, the intermediate layer 700, and the magnesium alloy body 100b are mechanically polished and ultrasonically cleaned to ensure that the conductive layer 300b, the intermediate layer 700, and the magnesium alloy body 100b are tightly attached after they are stacked in sequence.

[0178] In some implementations, the conductive layer 300b and the intermediate layer 700 are pre-fixed and then pre-positioned on the surface of the magnesium alloy body 100. The thickness of the intermediate layer 700 is slightly greater than that of the protective layer 200. The cleaned and polished conductive layer 300b, intermediate layer 700, and magnesium alloy body 100 are stacked in this order, ensuring that the area where the stacked conductive layer 300b, intermediate layer 700, and magnesium alloy body 100 meet is the pre-cleaned and polished interface to be welded.

[0179] When the surface of the conductive layer 300b facing the intermediate layer 700 is smoother, and the surface of the intermediate layer 700 facing the conductive layer 300b is also smoother, stacking the conductive layer 300a and the intermediate layer 700 can achieve pre-fixation between the conductive layer 300a and the intermediate layer 700. The conductive layer 300a and the intermediate layer 700 are pre-fixed by intermolecular adsorption.

[0180] Frame S202 : ultrasonically welding the conductive layer 300 , the intermediate layer 700 and the magnesium alloy body 100 , and filling the connecting through hole 210 in the radial direction of the connecting through hole 210 with the transition layer 400 formed by the conductive layer 300 , the intermediate layer 700 and the magnesium alloy body 100 .

[0181] In some implementations, as shown in FIG8( b ), local induction heating is applied directly below the surface of the magnesium alloy body 100 , heating the local weld zone to a temperature above the melting point of the intermediate layer 700 . For example, the temperature of the local weld zone is adjusted to be at least 10°C higher than the melting point of the intermediate layer 700 . The ultrasonic welding probe 6 is brought into contact with the conductive layer 300 b . The ultrasonic tool head of the ultrasonic welding probe 6 is then adjusted to continue applying welding ultrasound to the conductive layer 300 b , while the intermediate layer 700 is simultaneously heated by the heating device 7 . For example, the ultrasonic tool head is pressed against the upper portion of the conductive layer 300 b and applies pressure of 0.1 to 0.2 MPa to the conductive layer 300 b . As shown in FIG8( c ), the physical state of the conductive layer 300 b changes, and the conductive layer 300 b and the magnesium alloy body 100 react with the intermediate layer 700 to form a transition layer 400 b . The transition layer 400 b is adjusted so that it fills the connecting through hole 210 in a radial direction thereof.

[0182] In some implementations, the intermediate layer 700 is made of a Sn-Zn-Al alloy. A Cu (Sn, Zn, Al) solid solution is formed on the weld surface between the intermediate layer 700 and the conductive layer 300, and a Mg (Sn, Zn, Al) solid solution is formed on the weld surface between the intermediate layer 700 and the magnesium alloy body 100. The intermediate alloy layer between the two weld surfaces completely covers the magnesium alloy weld area, forming an anti-corrosion medium and a conductive medium.

[0183] In some implementations, the power of the welding ultrasound is controlled at 200W~500W, the frequency of the welding ultrasound is controlled at 10kHz~30kHz, and at the same time, the intermediate layer 700 is heated by the heating device 7, the power of the heating device 7 is controlled at 4kW~6kW, the frequency of the heating device 7 is controlled at 200 kHz~250kHz, and the reaction temperature of the intermediate layer 700 is controlled at 460°C. Under the action of the welding ultrasound, the physical state of the magnesium alloy body 100 and the conductive layer 300b is solid, and the physical state of the intermediate layer 700 is liquid, forming a solid-liquid interface and realizing preliminary metallurgical bonding.

[0184] The ultrasonic tool head continues to apply welding ultrasound to the conductive layer 300b, the intermediate layer 700 and the magnesium alloy body 100, and at the same time, the intermediate layer 700 is heated by the heating device 7, and the reaction temperature of the intermediate layer 700 is maintained at 455°C~465°C. The physical state of the magnesium alloy body 100 is solid, and the magnesium alloy body 100 and the intermediate layer 700 undergo a multi-element eutectic reaction. The intermediate layer 700 is transformed into a liquid phase of the Mg-Cu-Zn-Al-Sn eutectic structure, and the Mg-Cu-Zn-Al-Sn eutectic structure forms a Mg-Cu-Zn-Al-Sn eutectic structure layer. Mg (Al, Cu, Zn) solid solution is formed in the magnesium alloy body 100, and the Mg (Al, Cu, Zn) solid solution forms a Mg (Al, Cu, Zn) solid solution layer. Cu (Zn, Al, Sn) solid solution is formed in the conductive layer 300b, and the Cu (Zn, Al, Sn) solid solution forms a Cu (Zn, Al, Sn) solid solution layer.

[0185] The ultrasonic tool head continues to apply welding ultrasound to the conductive layer 300b, the intermediate layer 700, and the magnesium alloy body 100. The reaction temperature of the intermediate layer 700 continues to be maintained at 455°C to 465°C. The Mg-Cu-Zn-Al-Sn eutectic structure in the intermediate layer 700 reacts less, while the Cu(Zn, Al, Sn) solid solution and the Mg(Al, Cu, Zn) solid solution increase, until the Mg-Cu-Zn-Al-Sn eutectic structure disappears and the Mg-Cu-Zn-Al-Sn eutectic structure is completely transformed into the Cu(Zn, Al, Sn) solid solution and the Mg(Al, Cu, Zn) solid solution. It can be understood that the physical state of the Cu(Zn, Al, Sn) solid solution and the Mg(Al, Cu, Zn) solid solution is solid, thereby forming a solid solution joint.

[0186] The above-mentioned magnesium alloy connection structural member 10b and the forming method of the magnesium alloy connection structural member 10b are characterized by setting an intermediate alloy in the magnesium-copper heterogeneous alloy, and the intermediate alloy can form a solid solution alloy with the magnesium-copper heterogeneous alloy respectively. After ultrasonic welding under certain temperature conditions, a solid solution alloy welding layer is formed. The welding layer and the copper alloy constitute an electrical connection medium and an anti-corrosion medium. By adjusting the connection area of ​​the ultrasonic welding joint, the distribution of the welding points and the vibration frequency during welding, based on the direction of integration of the ultrasonic welding area and the electrical connection working area, the anti-corrosion electrical connection of the ultra-small area magnesium alloy component is achieved.

[0187] In another application scenario, the difference from the magnesium alloy connection structure 10b in the previous application scenario is that, referring to FIG9(a), the size of the conductive layer 300c is smaller than the aperture of the connection through-hole 210, and the transition layer 400c cannot completely fill the connection through-hole 210 in the radial direction of the connection through-hole 210. In some implementations, based on ultrasonic welding technology for magnesium-copper heterogeneous alloys, the magnesium-copper heterogeneous alloys are ultrasonically welded to form an electrical connection medium. The weld area between the conductive layer 300c and the protective layer 200 that is not covered is sealed with glue to mitigate galvanic corrosion, further reducing the weld area of ​​the conductive layer 300c and achieving corrosion-resistant electrical connection for ultra-small magnesium alloy components.

[0188] Specifically, as shown in FIG9( b ), at least a portion of the transition layer 400 c is vertically embedded in the magnesium alloy body 100 , while the remaining portion of the transition layer 400 c is located within the connecting through-hole 210 . The conductive layer 300 c is located within the connecting through-hole 210 . A gap is formed between the side surfaces of the transition layer 400 c, the side surfaces of the conductive layer 300 c, and the inner side surface of the connecting through-hole 210 . The sealing material 500 c fills the gap in the radial direction of the connecting through-hole 210 to seal the connecting through-hole 210 .

[0189] Figure 9(c) shows a partial, enlarged view of the N3 region in Figure 9(b) of a magnesium alloy connection structure 10c. In some implementations, as shown in Figure 9(c), the conductive layer 300b, the transition layer 400c, and the magnesium alloy body 100 are sequentially arranged in parallel. The transition layer 400c is used to separate the conductive layer 300c from the magnesium alloy body 100 and to achieve electrical connection between the conductive layer 300b and the magnesium alloy body 100. It should be understood that the thickness of the conductive layer 300c, the thickness of the transition layer 400c, and the arrangement position of the transition layer 400c are not specifically limited in this application. Any arrangement that can achieve stable connection and separation between the conductive layer 300c and the magnesium alloy body 100 is within the scope of protection of this application.

[0190] In the aforementioned magnesium alloy connection structure 10c, the intermediate layer 700 is eliminated between the conductive layer 300c and the magnesium alloy body 100, reducing welding difficulty and improving welding efficiency. The area of ​​the conductive layer 300c is further reduced. As shown in the figure, the conductive layer 300c is smaller than the surface area of ​​the magnesium alloy body 100. A dispensing sealant is used between the conductive layer 300c and the protective layer 200. Using a transparent dispensing sealant allows for clear observation of corrosion on the magnesium alloy body 100, providing a basis for subsequent process adjustments.

[0191] After introducing the specific structure of the magnesium alloy connecting structural member 10 c , the structural composition of the magnesium alloy connecting structural member 10 c before forming and the forming process of the magnesium alloy connecting structural member 10 c will be described below.

[0192] Box 301 : a conductive layer 300 c is disposed on the surface of the magnesium alloy body 100 in the connecting through hole 210 .

[0193] Block 302 : welding the conductive layer 300 c and the magnesium alloy body 100 using ultrasonic welding.

[0194] Block 303 : Filling the gap 800 between the side surface of the protection layer 200 , the side surface of the conductive layer 300 , and the side surface of the transition layer 400 with a sealing material 500 c .

[0195] In some implementations, in the magnesium alloy connection structure 10c, the outer surfaces of the protective layer 200, the outer surface of the sealing material 500c, and the outer surface of the conductive layer 300c are flush. The term "flat" may be understood as meaning that two or more planes are substantially in the same plane to a certain extent.

[0196] In addition, the present application also provides an electronic device comprising at least one of the above-mentioned magnesium alloy connecting structural components.

[0197] In the accompanying drawings, some structural or method features may be shown in a particular arrangement and / or order. However, it should be understood that such a particular arrangement and / or order may not be required. Rather, in some embodiments, these features may be arranged in a manner and / or order different from that shown in the illustrative drawings. In addition, the inclusion of a structural or method feature in a particular figure does not imply that such feature is required in all embodiments, and in some embodiments, such features may not be included or may be combined with other features.

[0198] It should be noted that in the examples and description of this patent, relational terms such as first and second, etc. are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "including a" does not exclude the presence of other identical elements in the process, method, article or device that includes the element.

[0199] Although the present application has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the application.

Claims

1. A magnesium alloy connecting structural member (10), characterized in that: include: Magnesium alloy body (100); a protective layer (200), the protective layer (200) encapsulating the magnesium alloy body (100), and a connecting through hole (210) communicating with the surface of the magnesium alloy body (100) is formed on the protective layer (200), and a transition layer (400) is formed at the bottom of the connecting through hole (210); A conductive layer (300) is formed on the transition layer (400), and the transition layer (400) and the conductive layer (300) are used to electrically connect the magnesium alloy body (100) to the outside world; The connecting through hole (210) is sealed by the transition layer (400), or the conductive layer (300) and the sealing material (500), so as to isolate the magnesium alloy body (100) from the outside world; The transition layer (400) is one of the following: a solid solution formed based on the magnesium alloy body (100) and the conductive layer (300), a solid solution formed based on the magnesium alloy body (100), the conductive layer (300) and an intermediate layer (700) located between the magnesium alloy body (100) and the conductive layer (300), or a conductive adhesive layer.

2. The magnesium alloy connection structural member (10) according to claim 1, characterized in that: The transition layer (400) is formed by ultrasonic welding in the area where the magnesium alloy body (100) and the conductive layer (300) are connected, and is formed by a portion of the conductive layer (300) and a portion of the magnesium alloy body (100) at a height.

3. The magnesium alloy connection structural member (10) according to claim 2, characterized in that: The ultrasonic welding spot is located in the area corresponding to the connecting through hole (210).

4. The magnesium alloy connection structural member (10) according to any one of claims 1 to 3, characterized in that: The number of the transition layer (400) is at least one, the at least one transition layer (400) is at least partially embedded in the magnesium alloy body (100) in terms of height, and a common conductive layer (300) covering the connecting through hole (210) is formed on the at least one transition layer (400); The sealing material (500) is an adhesive layer, and the adhesive layer is adhered between the protective layer (200) and the corresponding portions of the conductive layer (300) and the protective layer (200) to seal the connecting through hole (210).

5. The magnesium alloy connection structural member (10) according to claim 4, characterized in that: A concave portion is formed at a portion of the conductive layer (300) corresponding to the transition layer (400), and the concave portion is filled with a filling material (600).

6. The magnesium alloy connection structural member (10) according to claim 5, characterized in that: The outer surface of the filling material (600) is flush with the outer surface of the conductive layer (300).

7. The magnesium alloy connection structural member (10) according to any one of claims 1 to 3, characterized in that: At least a portion of the transition layer (400) is embedded in the magnesium alloy body (100) in terms of height, and the remaining portion of the transition layer (400) is located in the connecting through hole (210); The conductive layer (300) is located in the connecting through hole (210); A gap is formed between the side surface of the transition layer (400), the side surface of the conductive layer (300) and the inner side surface of the connecting through hole (210), and the sealing material (500) fills the gap in the radial direction of the connecting through hole (210) to seal the connecting through hole (210).

8. The magnesium alloy connection structural member (10) according to claim 7, characterized in that: The outer surface of the protective layer (200), the outer surface of the sealing material (500), and the outer surface of the conductive layer (300) are flush.

9. The magnesium alloy connection structural member (10) according to any one of claims 1 to 3, characterized in that: At least a portion of the transition layer (400) at its height is embedded in the magnesium alloy body (100), and the remaining portion of the transition layer (400) fills the connecting through hole (210) in a radial direction of the connecting through hole (210) to seal the connecting through hole (210).

10. The magnesium alloy connection structural member (10) according to claim 9, characterized in that: The transition layer (400) comprises: a first sub-transition layer (410), the first sub-transition layer (410) being formed in a region where the magnesium alloy body (100) and the intermediate layer (700) meet, and being formed by a portion of the intermediate layer (700) and a portion of the magnesium alloy body (100) at a height thereof, and at least a portion of the first sub-transition layer (410) being embedded in the magnesium alloy body (100) at a height thereof; a second sub-transition layer (420) formed on the first sub-transition layer (410), wherein the second sub-transition layer (420) is formed in a region where the conductive layer (300) and the intermediate layer (700) meet, and is formed by a portion of the intermediate layer (700) and a portion of the conductive layer (300) at a height; The remaining portion of the transition layer (400) fills the connecting through hole (210) in the radial direction of the connecting through hole (210), and the first sub-transition layer (410) and / or the second sub-transition layer (420) fills the connecting through hole (210) in the radial direction of the connecting through hole (210) to seal the connecting through hole (210).

11. The magnesium alloy connection structural member (10) according to claim 1, characterized in that: The material of the magnesium alloy body (100) is any one of magnesium-zinc alloy, magnesium-manganese alloy, magnesium-rhenium alloy and magnesium-lithium alloy.

12. The magnesium alloy connection structural member (10) according to claim 1, characterized in that: The protective layer (200) comprises any one of a micro-arc oxidation ceramic layer, a film and an anode layer.

13. An electronic device, characterized in that: The invention comprises at least one magnesium alloy connection structural member (10) according to any one of claims 1 to 12.

14. A component forming method, characterized in that: For forming a magnesium alloy connection structural member (10) according to any one of claims 1 to 6, the method comprises: Covering the conductive layer (300) on the connecting through hole (210) of the protective layer (200); welding the conductive layer (300) and the magnesium alloy body (100) at a location corresponding to the connecting through hole (210) using ultrasonic welding; The protective layer (200) and the conductive layer (300) are pasted to corresponding portions of the protective layer (200) through the sealing material (500).

15. A component forming method, characterized in that: For forming a magnesium alloy connection structural member (10) as claimed in any one of claims 1, 7 and 8, the method comprises: The conductive layer (300) is provided on the surface of the magnesium alloy body (100) in the connecting through hole (210); Welding the conductive layer (300) and the magnesium alloy body (100) using ultrasonic welding; The sealing material (500) is used to fill the gap between the inner side surface of the connecting through hole (210) and the side surface of the conductive layer (300) and the side surface of the transition layer (400).

16. A component forming method, characterized in that: For forming a magnesium alloy connection structural member (10) as claimed in any one of claims 1, 9 and 10, the method comprises: Disposing an intermediate layer (700) on the surface of the magnesium alloy body (100) in the connecting through hole (210), and disposing the conductive layer (300) on the intermediate layer (700); The conductive layer (300), the intermediate layer (700) and the magnesium alloy body (100) are welded by ultrasonic welding, and the transition layer (400) formed by the conductive layer (300), the intermediate layer (700) and the magnesium alloy body (100) fills the connecting through hole (210) in the radial direction of the connecting through hole (210).

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