Repair device and method for its production and repair method

Abstract

The application provides a repairing device and a preparation method and a repairing method thereof. The repairing device comprises a repairing part and a supporting frame. The repairing part comprises a repairing base plate, a repairing part and a connecting part. The supporting frame comprises a supporting frame and a plurality of supporting columns. The plurality of supporting columns surround to form a buffer space. The repairing part and at least part of the connecting part are arranged in the buffer space. The supporting frame is provided with an avoiding space which is communicated with the buffer space. The area of the avoiding space is smaller than the area of the surface of the repairing part which is away from the repairing base plate. The connecting part can be connected with the connecting part on the repairing base plate through the avoiding space. In the repairing process, when the repairing part is separated from the repairing base plate, the repairing part can be arranged in the buffer space with at least part of the connecting part. After the repairing part is separated from the repairing base plate, the repairing part will not directly fall on the repairing base plate, but will first fall on the supporting frame, so as to avoid the damage of the repairing base plate and the repairing part, and improve the service life of the repairing base plate and the repairing part.

Description

Technical Field

[0001] This application belongs to the field of mechanical repair technology, specifically relating to repair devices and their preparation methods, as well as repair methods. Background Technology

[0002] In mechanical repair, it is usually necessary to transfer the repaired portion from the component to the substrate to be repaired. For example, when repairing micro-components, a certain distance is typically required between the repaired portion and the substrate to avoid interfering with intact components on the substrate. Therefore, non-contact transfer methods are usually used for repair. However, during non-contact transfer, the repaired portion can easily fall directly onto the substrate, causing damage to both the substrate and the repaired portion. Summary of the Invention

[0003] In view of this, the first aspect of this application provides a repair device, including a repair component and a support frame. The repair component includes a repair substrate, a repair portion, and a connecting portion. The repair portion is disposed on one side of the repair substrate, and the connecting portion is disposed on the side of the repair portion away from the repair substrate. The support frame includes a support frame and a plurality of support columns. The two ends of the support columns are respectively connected to the repair substrate and the support frame. The plurality of support columns form a buffer space. The repair portion and at least a portion of the connecting portion are disposed within the buffer space. The support frame has a clearance space communicating with the buffer space. The area of ​​the clearance space is smaller than the area of ​​the surface of the repair portion away from the repair substrate, and the connecting portion can be connected to the portion to be connected on the substrate to be repaired through the clearance space.

[0004] The repair apparatus provided in the first aspect of this application adds a support frame consisting of a support frame and support columns, with multiple support columns forming a buffer space. The repair part and at least part of the connecting part can be disposed within the buffer space. During the repair process, since the repair apparatus is usually flipped so that the repair part and the part to be connected on the substrate to be repaired face each other, and then the repair part needs to be separated from the substrate, the radial dimension of the support frame, which is smaller than the repair part, allows the support frame to abut against and support the repair part. Therefore, after the repair part is separated from the substrate, it does not fall directly onto the substrate to be repaired, but first falls onto the support frame. Then, by continuing to move the repair apparatus, the repair part can be connected to the part to be connected. This application, by adding a support frame, prevents the repair part from falling directly onto the substrate after separation, instead using the support frame to abut against and support the repair part, thereby avoiding damage to the substrate to be repaired and the repair part, and improving the service life of the substrate to be repaired and the repair part.

[0005] In addition, the support frame of this application is also provided with a clearance space that connects to the buffer space. The area of ​​the clearance space is smaller than the area of ​​the surface of the repair part facing away from the repair substrate. The connecting part can be connected to the part to be connected on the substrate to be repaired through the clearance space. That is, the support frame is annular in shape, and the annular arrangement forms the clearance space. Therefore, the connecting part can be connected to the part to be connected through the area in the middle of the annulus, i.e., the clearance space, so that the addition of the support frame will not affect its normal connection and ensures the smooth progress of the repair.

[0006] Wherein, the height from the surface of the repair substrate near the support frame to the surface of the support frame near the repair substrate is not less than the height from the surface of the repair substrate near the connection portion to the surface of the connection portion near the repair substrate.

[0007] The repair substrate includes a receiving portion corresponding to the repair part. The receiving portion is elastic; when the repair part is subjected to an external force toward the repair substrate and the repair component abuts against the repair substrate, the repair part, the connecting portion, and the support frame can move toward the receiving portion, compressing the receiving portion. The repair substrate includes a receiving portion corresponding to the repair part, and the receiving portion includes a first part and a second part connected together. The first part is closer to the repair part than the second part, and the second part has a clearance groove. The first part supports the repair part and is also used to, when the repair part is subjected to an external force toward the repair substrate, and the external force is greater than a preset force, and the repair part abuts against the first part, to position the repair part, the connecting portion, and the support frame within the clearance groove.

[0008] The preset force includes the fracture stress of the first part; or the first part includes a plurality of elastic portions spaced apart, the plurality of elastic portions being arranged corresponding to the periphery of the second part, and each of the elastic portions extending toward the remaining elastic portions, the preset force including an elastic force capable of causing elastic deformation of the elastic portions. The plurality of support columns are flexible.

[0009] The repair portion has multiple sides on the surface opposite to the repair substrate, and the orthographic projection of the support frame on the repair portion covers the area sandwiched between two adjacent sides.

[0010] The support frame is provided with a fracture groove.

[0011] A second aspect of this application provides a method for preparing a repair device, comprising:

[0012] A repair component is provided, the repair component including a repair substrate, a repair portion and a connecting portion, the repair portion being disposed on the repair substrate, and the connecting portion being disposed on the side of the repair portion opposite to the repair substrate;

[0013] A photolithographic layer is formed covering the repair substrate and the repaired portion;

[0014] Multiple support pillars are formed that penetrate the photolithography layer, the multiple support pillars are connected to the repair substrate, the multiple support pillars surround a buffer space, and the repair part and at least a portion of the connection part are disposed within the buffer space;

[0015] A support frame is formed that penetrates the photolithography layer. The support frame is connected to the support pillar. The support frame is provided with a clearance space that communicates with the buffer space. The area of ​​the clearance space is smaller than the area of ​​the surface of the repair part away from the repair substrate. The connecting part can be connected to the part to be connected on the substrate to be repaired through the clearance space.

[0016] Remove the photolithographic layer.

[0017] The fabrication method provided in the second aspect of this application is simple. It involves first forming a photolithographic layer covering the repair substrate and the repair portion, then fabricating support pillars and a support frame on the photolithographic layer, and finally removing the photolithographic layer to obtain the desired repair device. By adding a support frame, the repair portion, after being separated from the repair substrate, will not fall directly onto the substrate to be repaired. Instead, the support frame will abut and support the repair portion, thereby preventing damage to both the substrate to be repaired and the repair portion, and improving their service life.

[0018] A third aspect of this application provides a repair method, comprising:

[0019] Provide a repair device as provided in the first aspect of this application;

[0020] A component to be repaired is provided, including the substrate to be repaired, and a connection portion and a repair portion arranged in sequence, wherein the repair portion surrounds a repair area, and the connection portion located in the repair area is exposed;

[0021] The repair device is flipped so that the connecting part and the part to be connected are positioned face to face, and the connecting part is directly corresponding to the part to be connected;

[0022] Separate the repair part from the repair substrate so that the repair part abuts against the support frame;

[0023] Move the repair device so that the connecting part moves toward the substrate to be repaired and connects the connecting part to the part to be connected located in the area to be repaired;

[0024] Remove the remaining repair device.

[0025] The repair method provided in the third aspect of this application, by using the repair device provided in this application, adds a support frame consisting of a support frame and a support column to the surface of the repair part near the repair part. This allows the repair part to be separated from the repair substrate and not fall directly onto the substrate to be repaired. Instead, the support frame abuts and supports the repair part, thereby avoiding damage to the substrate to be repaired and the repair part, and improving the service life of the substrate to be repaired and the repair part. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0027] Figure 1 This is a top view of the repair device according to one embodiment of this application.

[0028] Figure 2 for Figure 1 Side view.

[0029] Figure 3 This is a side view of a repair device flipped up and with the repair part abutting against the support frame in one embodiment of this application.

[0030] Figure 4 This is a side view of a repair device flipped up and connected to the part to be connected according to one embodiment of this application.

[0031] Figure 5 This is a side view of a repair device being removed according to one embodiment of this application.

[0032] Figure 6 This is a top view of the repair device according to another embodiment of this application.

[0033] Figure 7 This is a cross-sectional schematic diagram of the repair device along the AA direction in another embodiment of this application.

[0034] Figure 8 for Figure 7 A cross-sectional diagram along the AA direction when the repair device is flipped over and the connecting part is connected to the part to be connected.

[0035] Figure 9 for Figure 7 A schematic diagram of the cross-section along the AA direction when the repair device is removed.

[0036] Figure 10 This is a cross-sectional schematic diagram of the repair device along the AA direction in another embodiment of this application.

[0037] Figure 11 for Figure 10A cross-sectional diagram along the AA direction when the repair device flips over and the repair part comes into contact with the support frame.

[0038] Figure 12 for Figure 10 A cross-sectional diagram along the AA direction when the repair device flips over and the connecting part is connected to the part to be connected.

[0039] Figure 13 for Figure 10 A schematic diagram of the cross-section along the AA direction when the repair device is removed.

[0040] Figure 14 This is a cross-sectional schematic diagram of the repair device along the AA direction in another embodiment of this application.

[0041] Figure 15 for Figure 14 A cross-sectional diagram along the AA direction when the repair device flips over and the repair part comes into contact with the support frame.

[0042] Figure 16 for Figure 14 A cross-sectional diagram along the AA direction when the repair device flips over and the connecting part is connected to the part to be connected.

[0043] Figure 17 for Figure 14 A schematic diagram of the cross-section along the AA direction when the repair device is removed.

[0044] Figure 18 This is a cross-sectional schematic diagram of the repair device along the AA direction in another embodiment of this application.

[0045] Figure 19 for Figure 18 A cross-sectional diagram along the AA direction when the repair device flips over and the repair part comes into contact with the support frame.

[0046] Figure 20 for Figure 18 A cross-sectional diagram along the AA direction when the repair device flips over and the connecting part is connected to the part to be connected.

[0047] Figure 21 for Figure 18 A schematic diagram of the cross-section along the AA direction when the repair device is removed.

[0048] Figure 22 This is a top view of a repair device according to another embodiment of this application.

[0049] Figure 23 This is a side view of the repair device in another embodiment of this application.

[0050] Figure 24 for Figure 23Side view of the repair device when it is flipped over and the connecting part is connected to the part to be connected.

[0051] Figure 25 for Figure 23 Side view of the device being removed.

[0052] Figure 26 This is a process flow diagram of the preparation method of the repair device in one embodiment of this application.

[0053] Figure 27 for Figure 26 The process side view included in S10.

[0054] Figure 28 for Figure 26 The process side view included in S20.

[0055] Figure 29 for Figure 26 The process included in S30 is shown in the side view when the support column has not been formed.

[0056] Figure 30 for Figure 26 The process included in S30 is shown in the side view when the support column has been formed.

[0057] Figure 31 for Figure 26 The process side view included in S40.

[0058] Figure 32 This is a process flow diagram of the repair method in one embodiment of this application.

[0059] Label Explanation:

[0060] Repair device-1, repair part-10, repair substrate-101, repair section-102, connecting section-103, receiving section-1011, bearing section-1012, first part-10111, second part-10112, clearance groove-10112a, support frame-20, support frame-201, first side-2011, second side-2012, third side-2013, fourth side-2014, support section-2015, clearance space-2016, fracture groove-2017, support column-202, buffer space-2021, part to be repaired-30, substrate to be repaired-301, connecting section-302, repair section-303, repair area-3021, photolithography layer 40. Detailed Implementation

[0061] The following are preferred embodiments of this application. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principles of this application, and these improvements and modifications are also considered to be within the scope of protection of this application.

[0062] Before introducing the technical solution of this application, let's go over the technical issues in related technologies in detail.

[0063] In related technologies, especially in the field of mechanical repair, it is often necessary to transfer the repair portion from the repair component to the substrate to be repaired. This can also be understood as connecting the connecting portion on the repair component to the connecting portion on the component to be repaired. For example, in the field of micron-sized light-emitting diodes (LEDs), self-emissive micron-sized LEDs are typically used as light-emitting pixel units, assembled onto a driving panel to form a high-density LED array display technology. Therefore, a chip is located on the backlight. Damaged chips are usually repaired using selective laser transfer. In this method, the damaged chip needs to be removed, and then the intact chip is moved to the backlight, allowing the chip electrodes on the intact chip to connect with the metal electrodes on the backlight to complete the repair. However, during the repair process, the repair component can easily interfere with intact components on the substrate to be repaired; that is, the repair portion can easily damage intact components on the substrate to be repaired. Therefore, non-contact transfer methods are usually used for repair. However, during non-contact transfer, the repair portion can easily fall directly onto the substrate to be repaired, causing damage to the substrate and reducing the lifespan of both the repair portion and the substrate to be repaired.

[0064] In view of this, in order to solve the above problems, this application provides a repair device. Please refer to it as well. Figures 1-5 , Figure 1 This is a top view of the repair device according to one embodiment of this application. Figure 2 for Figure 1 Side view.

[0065] Figure 3 This is a side view of a repair device flipped up and the repair part abutting against the support frame in one embodiment of this application.

[0066] Figure 4 This is a side view of a repair device flipped up and connected to the part to be connected according to one embodiment of this application.

[0067] Figure 5 This is a side view of the removal of the repair device according to one embodiment of this application.

[0068] This embodiment provides a repair device 1, including a repair component 10 and a support frame 20. The repair component 10 includes a repair substrate 101, a repair portion 102, and a connecting portion 103. The repair portion 102 is disposed on one side of the repair substrate 101, and the connecting portion 103 is disposed on the side of the repair portion 102 away from the repair substrate 101. The support frame 20 includes a support frame 201 and a plurality of support columns 202. The two ends of the support columns 202 are respectively connected to the repair substrate 101 and the support frame 201. The plurality of support columns 202 surround and form a buffer space 2021. The repair portion 102 and at least a portion of the connecting portion 103 are disposed in the buffer space 2021. The support frame 201 has a clearance space 2016 communicating with the buffer space 2021. The area of ​​the clearance space 2016 is smaller than the area of ​​the surface of the repair portion 102 away from the repair substrate 101, and the connecting portion 103 can be connected to the connecting portion 302 on the substrate 301 to be repaired through the clearance space.

[0069] Furthermore, the terms “including” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion.

[0070] The repair device 1 provided in this embodiment is used for mechanical repair and performs a repair function. Furthermore, the repair device 1 provided in this embodiment can be applied to various fields and structures. This embodiment is only used to illustrate the application of the repair device 1 to micro-components, such as chips. However, this does not mean that the repair device 1 in this embodiment must be applied to micro-components. In other embodiments, it can also be applied to other structures, such as building structural components, mechanical components, etc.

[0071] The repair device 1 provided in this embodiment includes a repair component 10, which is used to repair and replace damaged parts. This can be understood as removing the repairable portion 303 from the damaged area of ​​the component 30 to be repaired, and then transferring the intact part from the repair component 10 to the damaged area to achieve repair and replacement. The repair component 10 includes a repair substrate 101, a repair portion 102, and a connecting portion 103. The repair substrate 101 is used to prepare and support the repair portion 102 and the connecting portion 103. The repair portion 102 and the connecting portion 103 are used to transfer to the damaged area of ​​the component 30 to complete the repair. It should be noted that, in order to complete the repair, the connecting portion 103 on the repair component 10 needs to be connected to the connection portion 302 on the component 30 to be repaired. The repair substrate 101, repair portion 102, and connecting portion 103 provided in this application can be components of any structural form; this embodiment does not limit this, and the material of the repair component 10 includes, but is not limited to, plastic, metal, etc. For ease of understanding, the repair part 102 and the connecting part 103 have been given different names. However, in actual production, the repair part 102 and the connecting part 103 can be integrally formed structural components. Specifically, when the repair component 10 in this embodiment is applied to a micro-component, the repair substrate 101 provided in this embodiment can be a sapphire substrate, the repair part 102 can be a chip, and the connecting part 103 can be a chip electrode.

[0072] The repair device 1 provided in this embodiment also includes a support frame 20. For ease of understanding, the support frame 20 is artificially divided into a support frame 201 and a support column 202, and the support frame 201 and the support column 202 are distinguished in the figure. In actual production, the support frame 201 and the support column 202 are integrally formed structural components. The materials of the support frame 20 include, but are not limited to, organic resins, metal compounds, etc. During the repair process, it is usually necessary to flip the repair part 10 so that the connecting part 103 of the repair part 10 and the connecting part 302 of the part to be repaired 30 are placed face to face, and the repair part 102 and the repair substrate 101 are separated. At this time, multiple support columns 202 surround to form a buffer space 2021, so that the repair part 102 and at least part of the connecting part 103 are placed in the buffer space 2021. It can also be understood that the support frame 20 plays the role of abutting the repair part 102, so that the repair part 102 does not fall directly. The support column 202 is used to connect the support frame 201 and the repair substrate 101, and to form a buffer space 2021, so that the repair part 102 and at least part of the connecting part 103 are disposed in the buffer space 2021. The shape of the support column 202 includes, but is not limited to, cylinder, elliptical cylinder, cube, and cubic.

[0073] This application does not specifically limit the shape of the support frame 201, only requiring it to be annular and to interfere with the surface of the repair part 102 facing away from the repair substrate 101. Furthermore, the vertical height from the surface of the support frame 201 near the repair part 102 to the surface of the support frame 201 facing away from the repair part 102 is not specifically limited, only requiring a clearance space 2016 to allow the connecting part 103 or the part to be connected 302 to pass through and connect. The support frame 201 also includes multiple support parts 2015, each support part 2015 connecting two adjacent support columns 202, and the multiple support parts 2015 are sequentially connected to enclose and form the clearance space 2016. It can be understood that the support part 2015 is the corresponding portion of the support frame 201 between any two adjacent support columns 202. The clearance space 2016 is formed by the support frame 201, that is, the clearance space 2016 is an annular space enclosed by the multiple support parts 2015. This can also be understood as follows: the support frame 201 ensures that the area of ​​the clearance space 2016 is smaller than the area of ​​the surface of the repair part 102 facing away from the repair substrate 101, i.e., the radial dimension of the support frame 201 is slightly smaller than that of the repair part 102. This allows the support frame 201 to abut against and support the repair part 102, preventing the repair part 102 from falling directly onto the part to be repaired 30. Furthermore, the connecting part 103 and the part to be connected 302 can be connected through the clearance space 2016, meaning the support frame 20 does not affect the connection between the connecting part 103 and the part to be connected 302, thus ensuring that the repair is achieved. Specifically, in this embodiment, the support column 202 is cylindrical, the support frame 201 is octagonal, and the support frame 201 is parallel to the surface of the repair part 102 facing away from the repair substrate 101.

[0074] like Figure 3 As shown, during the repair process, the repair device 1 is usually flipped so that the repair part 102 and the connection part 302 on the substrate 301 to be repaired are face to face. Then, the repair part 102 needs to be separated from the substrate 101. Optionally, laser peeling technology can be used to separate the repair part 102 from the substrate 101. At this time, since multiple support pillars 202 form a buffer space 2021, the repair part 102 and at least part of the connection part 103 can be located within the buffer space 2021. It can also be understood that the radial dimension of the support frame 201 is smaller than that of the repair part 102, so that the repair part 102 can abut against the support frame 201. Even though the repair part 102 and at least part of the connection part 103 are located within the buffer space 2021, after the repair part 102 is separated from the substrate 101, it will not fall directly onto the substrate 301 to be repaired, but will first fall onto the support frame 201. Then, the repair device 1 is moved further toward the substrate 301 to be repaired (as shown by D1 in the figure), so that the repair part 102 is connected to the part 302 to be connected (e.g., Figure 4As shown), repair is achieved. By adding a support frame 20, the repair part 102 will not fall directly onto the substrate 301 to be repaired after being separated from the repair substrate 101. Instead, the support frame 201 will abut against and support the repair part 102, thereby avoiding damage to the substrate 301 to be repaired and the repair part 102, and improving the service life of the substrate 301 to be repaired and the repair part 102.

[0075] In addition, the support frame 201 is provided with a clearance space 2016 that connects to the buffer space 2021. The area of ​​the clearance space 2016 is smaller than the area of ​​the surface of the repair part 102 facing away from the repair substrate 101. The connecting part 103 can be connected to the connecting part 302 on the substrate to be repaired 301 through the clearance space. That is, the connecting part 103 can be connected to the connecting part 302 on the substrate to be repaired 301 through the clearance space 2016, or the connecting part 302 can be connected to the connecting part 103 on the repair part 10 through the clearance space 2016. The clearance space 2016 is formed by the support frame 201 and can be understood as an annular space formed by multiple support parts 2015. Furthermore, the area of ​​the clearance space 2016 is smaller than the area of ​​the surface of the repair part 102 facing away from the repair substrate 101. Therefore, when the repair part 103 falls onto the support frame 20, the connecting part 103 or the part to be connected 302 can be connected through the clearance space 2016. It can also be understood that the support frame 201 is annular in shape, allowing the connecting part 103 or the part to be connected 302 to pass through, so that the addition of the support frame 20 will not affect its normal connection, ensuring smooth repair. Specifically, in this embodiment, the connecting part 103 connects to the part to be connected 302 through the area in the middle of the annulus.

[0076] Optionally, a gap exists between the support column 202 and the repair part 102. This gap prevents the support frame 20 from affecting the separation of the repair part 102 from the repair substrate 101, and also prevents the repair part 102 from having a large displacement deviation in the extension direction of the substrate 301 to be repaired, thus limiting the position of the repair part 102. This gap can be adjusted according to the density of the repair part 102 on the repair substrate 101 and the size of the connecting part 103 on the substrate 301 to be repaired. Specifically, in this embodiment, the gap between the support column 202 and the repair part 102 is 1-5 μm. Therefore, while the support frame 20 abuts against and supports the repair part 102, preventing the repair part 102 from falling directly onto the substrate 301 to be repaired, it can also limit the position of the repair part 102, improve the accuracy of the alignment between the connecting part 103 and the part to be connected 302, and improve the repair efficiency.

[0077] like Figure 5As shown, after the connecting part 103 is connected to the part to be connected 302, the repair device 1 moves away from the substrate 301 to be repaired (as shown in D2 in the figure). At this time, since the force between the connecting part 103 and the part to be connected 302 is greater than the fracture stress between the support column 202 and the support frame 201, the support frame 201 falls onto the substrate 301 to be repaired and is located at the periphery of the part to be connected 302. The repair part 102 separates from the support frame 20 due to the breakage of the support frame 20 and connects with the part to be repaired 30 to complete the repair. The remaining repair device 1 separates from the part to be repaired 30, and at this time, the repaired part 10 only has the support column 202 and the repaired substrate 101 remaining. Specifically, in this embodiment, the substrate 301 to be repaired can be a sapphire substrate, the part to be connected 302 can be a metal electrode, and the connecting part 103 and the part to be connected 302 are electrically connected. The connecting part 103 and the part to be connected 302 form a metal bond at high temperature. It can be understood that the metal electrode bonding strength between the connecting part 103 and the part to be connected 302 is greater than the tensile fracture strength of the support frame 20, causing the support frame 20 to break, thereby allowing the remaining repair device 1 to be removed.

[0078] Furthermore, the support frame 20 can be made of polyimide, because in subsequent production, it is necessary to further cover the surface of the substrate 301 to be repaired with polyimide on the side where the connection portion 302 is located to protect the component. Therefore, the residue of the support frame 201 will not affect the performance of the component 30 to be repaired. Thus, the repair device 1 provided in this application can easily and conveniently achieve mechanical repair, and avoid damage to the substrate 301 to be repaired and the repair portion 102, thereby improving the service life of the substrate 301 to be repaired and the repair portion 102.

[0079] Optionally, the substrate 301 to be repaired typically has multiple connection portions 302, meaning there are multiple components that need to be repaired. For example, in the field of micron-sized light-emitting diodes, the number of chips on the backplane is usually multiple; optionally, the number of chips in the corresponding product can reach millions or even tens of millions. Therefore, when repair is required, the number of chips to be repaired is also enormous. The following will describe in detail four embodiments of the repair device 1 provided in this application for mass repair.

[0080] Please refer to this as well. Figures 6-9 , Figure 6 This is a top view of the repair device according to another embodiment of this application. Figure 7 This is a cross-sectional schematic diagram of the repair device along the AA direction in another embodiment of this application. Figure 8 for Figure 7 A cross-sectional view along the AA direction when the repair device 1 is flipped over and the connecting part is connected to the part to be connected. Figure 9 for Figure 7 A schematic diagram of the cross-section along the AA direction when the repair device is removed.

[0081] The number of repair portions 102 is multiple, and each repair portion 102 is connected to a connecting portion 103. The component to be repaired 30 includes the substrate to be repaired 301, the connecting portion 302, and the repair portion 303. Multiple connecting portions 103 are provided on one side of the substrate to be repaired 301. Each connecting portion 103 is connected to a repair portion 102 on the side opposite to and close to the substrate to be repaired 301. The multiple repair portions 303 surround a repair area 3021, and the connecting portion 302 is located within the repair area 3021. Optionally, as... Figure 6 As shown, the repair device 1 can be provided with multiple support frames 20, multiple repair parts 102, and multiple connecting parts 103. The workpiece 30 to be repaired has multiple repair parts 303, and each repair part 303 has a connecting part 302 on its surface near the substrate 301 to be repaired; this can also be understood as the connecting part 302 being located between the repair part 303 and the substrate 301 to be repaired. It should be noted that the repair parts 303 in the workpiece 30 to be repaired include both intact and damaged parts 303. Since only the damaged parts 303 need to be repaired, they must first be removed from the workpiece 30 to be repaired. In the figures provided in this application, all the workpieces 30 to be repaired have had their damaged parts 303 removed. The remaining intact parts to be repaired 303 surround the substrate 301 to be repaired, forming a repair area 3021. The parts to be connected 302 in the repair area 3021 are exposed on the surface closest to the part to be repaired 10, so that the parts to be connected 302 can be connected to the connecting part 103. It can be understood that the repair area 3021 is the area formed on the part to be repaired 30 after the damaged parts to be repaired 303 are separated. Therefore, the repair area 3021 contains the parts to be connected 302 that will be connected to the connecting part 103 during the repair process, and intact parts to be repaired 303 are provided around the periphery of the repair area 3021.

[0082] In the first embodiment, the plurality of support columns 202 are flexible. Specifically, in this embodiment, the support columns 202 are prepared using organic resins such as polyimide, polytetrafluoroethylene, and polyphenylene ether, thus forming flexible support columns 202.

[0083] When multiple repairable portions 303 are provided on the part to be repaired 30, it is necessary to ensure that the vertical height of the support column 202 on the side of the repair portion 102 corresponding to the repair portion 302 near the repair substrate 101 to the surface of the support column 202 near the support frame 201 is (e.g.) Figure 7 (As shown in H1) The vertical height from the surface of the repair part 102 near the repair substrate 101 to the surface of the connecting part 103 near the support frame 201 should not be less than (e.g., Figure 7The height of the support column 202 (as shown in H2) is twice that of the repair substrate 101, or it can be implemented in combination with other embodiments. In this case, it is only necessary to ensure that the vertical height H1 of the support column 202 on the side of the repair part 102 corresponding to the repair part 302 is close to the vertical height of the support column 202 on the side of the support frame 201 is not less than the vertical height of the repair part 102 on the side of the repair substrate 101 to the vertical height of the repair part 102 on the side of the support frame 201. Other detailed embodiments will be described in detail below.

[0084] like Figure 8 As shown, when the repair component 10 moves towards direction D1 and the connecting portion 103 abuts against the receiving portion 303, the support column 202 deforms under the action of external force, allowing the repair component 10 to continue moving towards direction D1 until the connecting portion 103 connects with the portion to be connected 302. This can be understood as the support column 202 bending under the reaction force of the portion to be repaired 303 on the connecting portion 103, causing the vertical height from the surface of the support column 202 near the repair substrate 101 to the surface of the support column 202 near the support frame 201 to decrease, allowing the repair component 10 to continue moving towards the component to be repaired 30. Additionally, as... Figure 25 As shown, when the connecting part 103 is connected to the part to be connected 302, and the repair part 10 moves towards the D2 direction, the support column 202 recovers its deformation due to the disappearance of the external force. At this time, the remaining repair part 10 is removed, and the repair is completed. By forming a flexible support column 202, the support column 202 can deform during the repair process. This means that after the repair part 102 is separated from the repair substrate 101, it will not fall directly onto the substrate 301 to be repaired. It also allows for large-scale repairs in one go, improving repair efficiency. Optionally, this embodiment can be implemented in conjunction with any of the embodiments described below.

[0085] Please refer to this as well. Figures 10-13 , Figure 10 This is a cross-sectional schematic diagram of the repair device along the AA direction in another embodiment of this application. Figure 11 for Figure 10 A cross-sectional diagram along the AA direction when the repair device flips over and the repair part comes into contact with the support frame. Figure 12 for Figure 10 A cross-sectional diagram along the AA direction when the repair device is flipped over and the connecting part is connected to the part to be connected. Figure 13 for Figure 10 A schematic diagram of the cross-section along the AA direction when the repair device is removed.

[0086] In the second embodiment, the repair substrate 101 includes a receiving portion 1011 corresponding to the repair portion 102. The receiving portion 1011 is elastic. When the repair portion 102 is subjected to an external force toward the repair substrate 101 and the repair member 10 abuts against the repair substrate 101, the repair portion 10, the connecting portion 103 and the support frame 20 can move toward the receiving portion 1011 and compress the receiving portion 1011.

[0087] The repair substrate 101 also includes a receiving portion 1011 and a supporting portion 1012. In actual production, the receiving portion 1011 and the supporting portion 1012 are integrally formed structural components. For ease of understanding in the following text, the repair substrate 101 is artificially divided into the receiving portion 1011 and the supporting portion 1012. The receiving portion 1011 is provided on the side of the repair substrate 101 near the repair portion 102. The material of the receiving portion 1011 can be rubber, sponge, etc. The shape of the receiving portion 1011 includes, but is not limited to, cylinders, elliptical cylinders, cubes, cubics, etc., as long as it corresponds to the repair portion 102 and can accommodate at least part of the repair portion 102 and the support frame 20. The supporting portion 1012 can be a component of any structural form, and this embodiment does not limit it. The supporting portion 1012 is used to support various components on the repair substrate 101, such as the repair portion 102, the support frame 20, etc. The receiving part 1011 is used to receive at least a portion of the repair part 102 and the support frame 20 (e.g., when the connecting part 103 abuts against the repair part 303 of the receiving repair part 30 and the repair part 10 continues to move in the D1 direction). Figure 12 (As shown).

[0088] During the repair process, as the repair component 10 moves continuously toward direction D1, the connecting portion 103 of the repair component 10 abuts against the repaired portion 303 of the component 30 to be repaired. At this time, the connecting portion 103 is not connected to the portion 302 to be connected. Figure 12 As shown, the repair part 10 continues to move towards direction D1. At this time, the connecting part 103 that abuts against the part to be repaired 303 receives a reaction force from the part to be repaired 303, causing at least a portion of the repair part 102 and the support frame 20 to move in the opposite direction of D1, compressing the receiving part 1011. This causes the receiving part 1011 to deform to accommodate at least a portion of the repair part 102 and the support frame 20, meaning that at this time, at least a portion of the repair part 102 and the support frame 20 are located in the receiving part 1011. Figure 13As shown, when the repair component 10 moves towards direction D2, the connecting portion 103 separates from the part to be repaired 303, the reaction force acting on the receiving portion 1011 disappears, causing the receiving portion 1011 to return to its original deformation, thereby causing at least a portion of the repair component 102 to separate from the support frame 20 from the receiving portion 1011. Because the receiving portion 1011 is elastic, even when multiple parts to be repaired 303 are present, the repair component 10 can continue to move towards direction D1, thereby connecting the connecting portion 103 with the part to be repaired 302 to complete the repair. This repair device 1, by adding a receiving portion 1011 to the repair substrate 101, prevents the repair component 102 from falling directly onto the substrate 301 to be repaired by using the support frame 20, thus avoiding damage to the substrate 301 and the repair component 102, while simultaneously completing the repair of multiple parts to be repaired 303 at once, enabling large-scale repairs and further improving repair efficiency.

[0089] Please refer to this as well. Figures 14-17 , Figure 14 This is a cross-sectional schematic diagram of the repair device along the AA direction in another embodiment of this application. Figure 15 for Figure 14 A cross-sectional diagram along the AA direction when the repair device flips over and the repair part comes into contact with the support frame. Figure 16 for Figure 14 A cross-sectional diagram along the AA direction when the repair device is flipped over and the connecting part is connected to the part to be connected. Figure 17 for Figure 14 A schematic diagram of the cross-section along the AA direction when the repair device is removed.

[0090] The repair substrate 101 includes a receiving portion 1011 corresponding to the repair part 102. The receiving portion 1011 includes a first part 10111 and a second part 10112 connected to each other. The first part 10111 is closer to the repair part 102 than the second part 10112. The second part 10112 is provided with a relief groove 10112a. The first part 10111 is used to support the repair part 102. The first part 10111 is also used to place the repair part 102, the connecting part 103 and the support frame 20 in the relief groove 10112a when the repair part 102 is subjected to an external force in the direction of the repair substrate 101, the external force is greater than a preset force and the repair part 102 abuts against the first part 10111.

[0091] The preset force includes the fracture stress of the first part 10111; or the first part 10111 includes a plurality of elastic parts spaced apart, the plurality of elastic parts being arranged around the periphery of the second part 10112, and each of the elastic parts extending toward the remaining elastic parts, the preset force including an elastic force that can cause the elastic parts to undergo elastic deformation.

[0092] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this application are used to distinguish different objects, rather than to describe a specific order.

[0093] The receiving part 1011 and the supporting part 1012 have been described in detail above, and will not be repeated here. The receiving part 1011 provided in this embodiment includes a first part 10111 and a second part 10112. The shape of the first part 10111 includes, but is not limited to, a cylinder, an elliptical cylinder, a cube, or a cubic shape. The second part 10112 can be a component of any structural form; this embodiment does not limit this, only requiring a clearance groove 10112a to be provided on the side near the repair part 102. The clearance groove 10112a is used to receive at least a portion of the repair part 102 and the supporting part. The materials of the first part 10111 and the second part 10112 include, but are not limited to, sponge, plastic, rubber, etc. At least a portion of the first part 10111 and the second part 10112 are connected to each other at their periphery. The first part 10111 and the second part 10112 are integrally formed structural components on the repair substrate 101. For ease of understanding in the following text, the receiving part 1011 is artificially divided into the first part 10111 and the second part 10112. In actual production, the first part 10111 and the second part 10112 are integrally formed structural components.

[0094] The first portion 10111 of the housing section is described above for supporting the repair section 102, and is also used to ensure that at least a portion of the repair section 102 is disposed in the clearance groove 10112a when an external force is applied to the repair section 102 in the direction toward the repair substrate 101, the external force being greater than a preset force, and the repair section 102 abutting against the first portion 10111. Optionally, the first portion 10111 may break or deform. This application does not specifically limit the shape and structure of the clearance groove 10112a, as long as it can accommodate at least a portion of the support frame 20, the repair section 102, and the connecting portion 103 when the first portion 10111 is subjected to an external force greater than a preset force.

[0095] The following sections of this application detail several specific structural forms of Part 10111.

[0096] In the third embodiment, when the first part 10111 has a fracture portion, the first part 10111 can fracture. The fracture portion can be a component of any structural form, and this embodiment is not limited to this. It is only required that the fracture portion fractures when the first part 10111 is subjected to a fracture stress not less than a preset value, so that at least part of the repair portion 102 and the support frame 20 are housed in the relief groove 10112a of the second part 10112 (e.g., Figure 16 As shown). Figure 14 As shown, when the first part 10111 is subjected to a fracture stress less than the preset value, the first part 10111 can support the repair part 102. During the repair process, when the repair part 10 moves toward the D1 direction and the connecting part 103 of the repair part 10 abuts against the repaired part 303 of the part to be repaired 30, the first part 10111 does not break. Subsequently, the repair part 10 continues to move toward the D1 direction, so that the connecting part 103 abutting against the repaired part 303 is subjected to a reaction force from the repaired part 303. When the reaction force is not less than the preset fracture stress, the fractured part breaks, so that at least a portion of the repair part 102 and the support frame 20 are disposed in the clearance groove 10112a of the second part 10112, and at least a portion of the first part 10111 is also disposed in the clearance groove 10112a of the second part 10112, thereby allowing the repair part 10 to continue to move toward the D1 direction until the connecting part 103 is connected to the part to be connected 302 (e.g., Figure 16 (as shown), to complete the repair. (As shown) Figure 17 As shown, the repair component 10 is then moved towards direction D2. At this time, the part to be repaired 303 separates from the connecting part 103, causing the repair part 102, the support frame 20, and the first part 10111 to separate from the second part 10112, and the remaining repair device 1 is removed. Optionally, the first part 10111 breaks into multiple parts, and due to gravity, the broken first part 10111 no longer remains parallel to the surface of the repair part 102 near the repair substrate 101. On the repair component 10, the first part 10111, which is not subjected to this reaction force, still maintains an integral structure. Therefore, the repair device 1 of this application can complete the repair of multiple parts to be repaired 303 at one time, completing a large number of repairs, thereby improving repair efficiency.

[0097] Please also refer to the following: Figures 18-21 , Figure 18 This is a cross-sectional schematic diagram of the repair device along the AA direction in another embodiment of this application. Figure 19 for Figure 18 A cross-sectional diagram along the AA direction when the repair device flips over and the repair part comes into contact with the support frame. Figure 20 for Figure 18 A cross-sectional view along the AA direction when the repair device 1 is flipped and the connecting part is connected to the part to be connected. Figure 21 for Figure 18 A schematic diagram of the cross-section along the AA direction when the repair device is removed.

[0098] In the fourth embodiment, the first part 10111 includes a plurality of spaced elastic portions extending toward the remaining parts of the first part 10111. This can also be understood as the elastic portions extending toward the center of the connection surface between the first part 10111 and the second part 10112, with at least a partial gap between each. The clearance groove 10112a of the second part 10112 corresponds to the gap between the plurality of elastic portions. The elastic portions can be components of any structural form; this embodiment does not limit this, as long as the elastic portions undergo elastic deformation when the first part 10111 is subjected to an elastic force not less than a preset value, thereby allowing at least a portion of the repair part 102 and the support frame 20 to be housed in the clearance groove 10112a of the second part 10112 (e.g., ...). Figure 20 (As shown).

[0099] like Figure 15 As shown, when the elastic part is subjected to an elastic force less than the preset value, the elastic part can support the repair part 102. During the repair process, when the repair part 10 moves toward the D1 direction and the connecting part 103 of the repair part 10 abuts against the repaired part 303 of the part to be repaired 30, the elastic part does not deform. Subsequently, the repair part 10 continues to move toward the D1 direction, so that the connecting part 103 abutting against the repaired part 303 is subjected to a reaction force from the repaired part 303. When the reaction force is not less than the preset elastic force, the elastic part deforms, so that at least part of the repair part 102 and the support frame 20 are disposed in the clearance groove 10112a of the second part 10112, and at least part of the elastic part is also disposed in the clearance groove 10112a of the second part 10112, thereby allowing the repair part 10 to continue to move toward the D1 direction until the connecting part 103 is connected to the part to be connected 302 (e.g., Figure 20 (as shown), to complete the repair. (As shown) Figure 21 As shown, the repair part 10 is then moved towards direction D2. At this time, the part to be repaired 303 separates from the connecting part 103, causing the repair part 102, the support frame 20, and the elastic part to separate from the second part 10112, and the elastic part recovers its deformation to remove the remaining repair device 1; while on the repair part 10, the elastic part that is not subjected to the reaction force does not deform. Therefore, the repair device 1 of this application can be performed, that is, multiple parts to be repaired 303 can be repaired at one time, thereby improving the repair efficiency.

[0100] In this embodiment, the surface of the repair portion 102 facing away from the repair substrate 101 has multiple sides, and the orthographic projection of the support frame 201 on the repair portion 102 covers the area sandwiched between two adjacent sides. Please refer to [the relevant documentation / reference]. Figure 1 and Figure 22 , Figure 22 This is a top view of a repair device according to another embodiment of this application.

[0101] The support frame 201 has been described in detail above and will not be repeated here. The support frame 201 must simultaneously satisfy the following conditions: the area of ​​the clearance space 2016 formed by the support frame 201 is smaller than the area of ​​the surface of the repair part 102 facing away from the repair substrate 101, so that when the support frame 201 abuts against the repair part 102, the repair part 102 does not fall directly onto the part to be repaired 30; another condition is that the connecting part 103 or the part to be connected 302 can pass through the clearance space 2016 to ensure the connection between the connecting part 103 and the part to be connected 302 is completed. The following sections of this application detail several specific structural forms of the repair part 102, i.e., the shape of the support frame 201.

[0102] Optionally, the sides of the repair portion 102 include, but are not limited to, a first side 2011, a second side 2012, a third side 2013, and a fourth side 2014. In this embodiment, the first side 2011 and the second side 2012 are disposed opposite to each other, the third side 2013 and the fourth side 2014 are disposed opposite to each other, and the first side 2011 and the second side 2012 are disposed between the third side 2013 and the fourth side 2014; the orthographic projection of the support frame 201 on the repair portion 102 simultaneously covers the area sandwiched between the first side 2011 and the third side 2013, and the area sandwiched between the second side 2012 and the fourth side 2014; and / or, the orthographic projection of the support frame 201 on the repair portion 102 simultaneously covers the area sandwiched between the first side 2011 and the fourth side 2014, and the area sandwiched between the second side 2012 and the third side 2013.

[0103] like Figure 1 As shown, the orthographic projection of the support frame 201 onto the repair section 102 simultaneously covers the area sandwiched between the first side 2011 and the fourth side 2014, the area sandwiched between the second side 2012 and the third side 2013, the area sandwiched between the first side 2011 and the third side 2013, and the area sandwiched between the second side 2012 and the fourth side 2014. That is, eight support columns are distributed on opposite sides of the first, second, third, and fourth sides, and adjacent support columns connect to form a support section 2015. The support section 2015 forms a stable octagonal structure, which helps improve the stability of the support frame 20 against the repair section 102. Figure 22As shown, the orthographic projection of the support frame 201 onto the repair portion 102 simultaneously covers the area sandwiched between the first side 2011 and the third side 2013, as well as the area sandwiched between the second side 2012 and the fourth side 2014; or simultaneously covers the area sandwiched between the first side 2011 and the fourth side 2014, as well as the area sandwiched between the second side 2012 and the third side 2013. The support portion 2015 forms a stable hexagonal structure, which ensures that the support frame 20 abuts against the repair portion 102 while saving on manufacturing materials.

[0104] Please refer to this as well. Figures 23-25 , Figure 23 This is a side view of the repair device in another embodiment of this application. Figure 24 for Figure 23 Side view of the repair device when it is flipped over and the connecting part is connected to the part to be connected. Figure 25 for Figure 23 Side view of the device being removed.

[0105] In this embodiment, the support frame 201 is provided with a fracture groove 2017. The shape of the fracture groove 2017 is not specifically limited; it only needs to fracture under a preset external force, which includes the force exerted by the repair part 102 on the support frame 201. During the repair process, after the repair part 10 is flipped over, the repair part 102 abuts against the support frame 201. At this time, the force exerted by the repair part 102 on the support frame 201 is insufficient to cause the fracture groove 2017 to fracture. Therefore, the support frame 20 prevents the repair part 102 from falling directly onto the part to be repaired 30. Figure 25 As shown, when the connecting part 103 is connected to the part to be connected 302, and the repair piece 10 moves towards the D2 direction, the fracture groove 2017 breaks because the direct force between the connecting part 103 and the part to be connected 302 is greater than the preset external force, but the support frame 201 remains connected to the support column 202. If the repair piece 10 continues to move towards the D2 direction, the support frame 201 will separate from the part to be repaired 30 along with the support column 202 and the repair substrate 101, thereby completing the repair. Therefore, by providing at least one fracture groove 2017 on the repair part 102, the support frame 201 can be removed together with the remaining repair piece 10 after the connecting part is connected to the part to be connected. Optionally, this embodiment can be implemented in conjunction with any of the above embodiments.

[0106] In this embodiment, the height from the surface of the repair substrate 101 near the support frame 201 to the surface of the support frame 201 near the repair substrate 101 is not less than the height from the surface of the repair substrate 101 near the connection portion 103 to the surface of the connection portion 103 near the repair substrate 101.

[0107] Specifically, when multiple repairable portions 303 are provided on the part to be repaired 30, it is necessary to ensure that the vertical height from the surface of the repair substrate 101 near the support frame 201 to the surface of the support frame 201 near the repair substrate 101 is not less than the vertical height from the surface of the repair substrate 101 near the connecting portion 103 to the surface of the connecting portion 103 near the repair substrate 101. This can be understood as follows: during the repair process, when the repair portion 102 needs to correspond to the part to be repaired 303, the vertical height from the surface of the support pillar 202 around the repair portion 102 near the repair substrate 101 to the surface of the support pillar 202 near the support frame 201 (e.g., ...) is... Figure 7 (As shown in H1) The vertical height from the surface of the repair part 102 near the repair substrate 101 to the surface of the repair part 102 near the support frame 201 should not be less than (e.g., Figure 7 (as shown in H2); and the vertical height from the surface of the support post 202 on the side of the repair part 102 corresponding to the part to be connected 302 to the surface of the support post 202 on the side of the support frame 201 (as shown in H2); and the vertical height from the surface of the support post 202 on the side of the repair part 102 near the repair substrate 101 to the surface of the support post 202 near the support frame 201 ( Figure 7 (As shown in H1) The height of the repair part 102 from the surface near the repair substrate 101 to the surface near the support frame 201 must be no less than twice the vertical height of the repair part 102. Figure 7 As shown in H2, when the repair component 10 moves towards the D1 direction, the connecting portion 302 on the substrate 301 to be repaired does not affect the movement of the repair component 10 until the connecting portion 103 and the connecting portion 302 can smoothly abut. This can also be understood as designing different heights of the support pillars 202 so that after the repair component 10 is flipped, the horizontal position of the repair portion 102 falling onto the support frame 201 is different. That is, the vertical distance between the surface of the connecting portion 103 near the substrate 301 to the surface of the connecting portion 302 near the connecting portion 103 is different, thereby ensuring that the connecting portion 103 can connect with the connecting portion 302, achieving repair. By simply designing the height of the support pillars 202, a large number of repairs can be completed in one go, improving repair efficiency.

[0108] In addition to the repair device 1 provided above, this application also provides a method for preparing the repair device 1. For example, the repair device 1 provided above can be prepared using the preparation method described below.

[0109] Please refer to Figure 2 ,and Figures 26-30 , Figure 27 for Figure 26 The process side view included in S10. Figure 28 for Figure 26 The process side view included in S20. Figure 29 for Figure 26 The process included in S30 is shown in the side view when the support column has not been formed. Figure 30 for Figure 26 The process included in S30 is shown in the side view when the support column has been formed. Figure 31 for Figure 26 The process side view included in S40.

[0110] This embodiment provides a method for preparing a repair device 1, the method comprising steps S10, S20, S30, S40, and S50. Detailed descriptions of steps S10, S20, S30, S40, and S50 are as follows.

[0111] Please refer to Figure 27 S10, a repair component 10 is provided, the repair component 10 including a repair substrate 101, a repair portion 102, and a connecting portion 103, the repair portion 102 being disposed on the repair substrate 101, and the connecting portion 103 being disposed on the side of the repair portion 102 away from the repair substrate 101.

[0112] Please refer to Figure 28 S20, a photolithographic layer 40 is formed covering the repair substrate 101 and the repair portion 102.

[0113] Please refer to Figure 29 S30, a plurality of support pillars 202 are formed through the photolithography layer 40. The plurality of support pillars 202 are connected to the repair substrate 101. The plurality of support pillars 202 surround a buffer space 2021. The repair part 102 and at least a portion of the connection part 103 are disposed in the buffer space 2021.

[0114] Please refer to this as well. Figures 30-31 S40, a support frame 201 is formed that penetrates the photolithography layer 40. The support frame 201 is connected to the support post 202. The support frame 201 is provided with a clearance space 2016 that communicates with the buffer space 2021. The area of ​​the clearance space is smaller than the area of ​​the surface of the repair part 102 facing away from the repair substrate 101. The connecting part 103 can be connected to the connecting part 302 on the substrate 301 to be repaired through the clearance space 2016.

[0115] Please refer to Figure 2 S50, remove the photolithography layer 40.

[0116] The repair component 10 has been described in detail above and will not be repeated here. The photolithography layer 40 needs to cover the repair substrate 101 and the repair portion 102. It can be understood that the photolithography layer 40 is disposed on the surface of the repair substrate 101 near the repair portion 102, and the vertical height from the surface of the photolithography layer 40 near the repair substrate 101 to the surface of the photolithography layer 40 near the connecting portion 103 (e.g., Figure 27(As shown in H3) The vertical height from the surface of the repair portion 102 near the repair substrate 101 to the surface of the repair portion 102 near the connecting portion 103 (as shown in H3) Figure 27 (as shown in H4) to ensure that the support frame 201 can be formed on the photolithography layer 40.

[0117] Optionally, the support pillar 202 can be formed by first etching holes in the photolithography layer 40 around the repair portion 102, and then forming the support pillar 202 by chemical deposition or physical deposition. The support pillar 202 has been described in detail above and will not be repeated here. Then, the through holes of the support frame 201 (such as...) are etched. Figure 29 As shown), the support post 202 is exposed. The through-hole should be located on the surface of the photolithography layer 40 near the connecting portion 103, and a gap should be maintained between the through-hole and the repair portion 102 to avoid damage to the repair portion 102 during the formation of the support frame 201. The support frame 201 has been described in detail above and will not be repeated here. Optionally, the support frame 201 can be formed using chemical deposition or physical deposition. Subsequently, by removing the photolithography layer 40, the following is obtained: Figure 2 Repair device 1 shown.

[0118] The fabrication method provided in this application is simple. First, a photolithographic layer 40 is formed covering the repair substrate 101 and the repair portion 102. Then, support pillars 202 and a support frame 201 are fabricated on the photolithographic layer 40. Finally, the required repair device 1 is obtained simply by removing the photolithographic layer 40. During the fabrication process, multiple support pillars 202 can be arranged to form a buffer space 2021, within which the repair portion 102 and at least a portion of the connecting portion 103 can be disposed. Thus, during the repair process, even after the repair portion 102 separates from the repair substrate 101, it will not fall directly onto the substrate 301 to be repaired. Instead, it will first be placed within the buffer space 2021, i.e., first fall onto the support frame 201, allowing the support frame 201 to provide support. Subsequently, the repair device 1 can be moved further to connect the repair portion 102 to the connecting portion 302. By forming a support frame 20, the repair part 102, after being separated from the repair substrate 101, will not fall directly onto the substrate 301 to be repaired. Instead, the support frame 201 abuts against and supports the repair part 102, thereby preventing damage to the substrate 301 to be repaired and the repair part 102, and improving their service life. Furthermore, this application can also provide a clearance space 2016 in the support frame 201, which connects to the buffer space 2021. The area of ​​the clearance space 2016 is smaller than the area of ​​the surface of the repair part 102 facing away from the repair substrate 101, and the connecting part 103 can be connected to the connecting part 302 on the substrate 301 to be repaired through the clearance space 2016. That is, the support frame 201 is annular in shape, and the annular arrangement forms the clearance space 2016. In this way, the connecting part 103 can be connected to the connecting part 302 through the central area of ​​the annular space 2016, ensuring that the addition of the support frame 20 will not affect its normal connection and guaranteeing the smooth progress of the repair.

[0119] Please refer to this as well. Figures 2-5 ,and Figure 32 , Figure 32 This is a process flow diagram of the repair method according to one embodiment of this application. The repair device 1 and the repair method provided in this embodiment must be used together. For example, as one embodiment, the repair method of the repair device 1 provided below can be used to use the repair device 1 mentioned above. This embodiment provides a repair method for the repair device 1, the preparation method including steps S100, S200, S300, S400, S500, and S600. Detailed descriptions of steps S100, S200, S300, S400, S500, and S600 are as follows.

[0120] Please refer to Figure 2 S100, a repair device 1 is provided, the repair device 1 including a repair component 10 and a support frame 20;

[0121] The repair component 10 includes a repair substrate 101, a repair portion 102, and a connecting portion 103. The repair portion 102 is disposed on one side of the repair substrate 101, and the connecting portion 103 is disposed on the side of the repair portion 102 opposite to the repair substrate 101.

[0122] The support frame 20 includes a support frame 201 and a plurality of support columns 202. The two ends of the support columns 202 are respectively connected to the repair substrate 101 and the support frame 201. The plurality of support columns 202 surround a buffer space 2021. The repair part 102 and at least part of the connecting part 103 are disposed in the buffer space 2021. The support frame 201 is provided with a clearance space 2016 communicating with the buffer space 2021. The area of ​​the clearance space 2016 is smaller than the area of ​​the surface of the repair part 102 facing away from the repair substrate 101, and the connecting part 103 can be connected to the connecting part 302 on the substrate 301 to be repaired through the clearance space 2016.

[0123] Please refer to Figure 3 S200, a component to be repaired 30 is provided, including the substrate to be repaired 301, and a connection portion 302 and a repair portion 303 arranged in sequence. The repair portion 303 surrounds a repair area 3021, and the connection portion 302 located in the repair area 3021 is exposed.

[0124] S300, flip the repair device 1 so that the connecting part 103 and the part to be connected 302 are positioned face to face, and the connecting part 103 corresponds to the part to be connected 302.

[0125] S400, the repair part 102 is separated from the repair substrate 101 so that the repair part 102 abuts against the support frame 201.

[0126] Please refer to Figure 4 S500, the repair device 1 is moved so that the connecting part 103 moves toward the substrate 301 to be repaired and the connecting part 103 connects to the connecting part 302 located in the area to be repaired 3021.

[0127] Please refer to Figure 5 S600, remove the remaining repair device 1.

[0128] The repair device 1 provided in this application has been described in detail above and will not be repeated here. The repair method provided in this application, by employing the repair device 1, adds a support frame 20, consisting of a support frame 201 and a support column 202, to the surface of the repaired part 10 near the repair section 102. This allows the repair section 102 to be separated from the repair substrate 101 after the repair device 1 is flipped during the repair process, with at least a portion of the connecting part positioned within a buffer space. Specifically, the support frame 201 can abut against the repair section 102, preventing it from falling directly onto the part to be repaired 30. Subsequently, when the repair device 1 is moved, the support frame 20 provides support, preventing the repair section 102 from falling directly, thus connecting the connecting part 103 to the part to be connected 302, completing the repair. Because the support frame provides support, the repair section does not fall directly onto the substrate to be repaired, thereby preventing damage to the substrate and the repair section and improving their service life.

[0129] In addition, the support frame 201 of this application is also provided with a clearance space 2016 that connects to the buffer space 2021. The area of ​​the clearance space 2016 is smaller than the area of ​​the surface of the repair part 102 facing away from the repair substrate 101. The connecting part 103 can be connected to the part 302 to be connected on the substrate 301 to be repaired through the clearance space 2016. That is, the support frame 201 is annular in shape, and the clearance space 2016 is formed by the annular arrangement. In this way, the connecting part 103 can be connected to the part 302 to be connected through the area in the middle of the annular ring, i.e., the clearance space 2016, so that the addition of the support frame 20 will not affect its normal connection and ensure the smooth progress of the repair.

[0130] The above provides a detailed description of the embodiments provided in this application. This document elucidates and explains the principles and implementation methods of this application. The above description is only intended to help understand the methods and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A repair device, characterized in that, include: A repair component includes a repair substrate, a repair portion, and a connecting portion, wherein the repair portion is disposed on one side of the repair substrate, and the connecting portion is disposed on the side of the repair portion opposite to the repair substrate. A support frame includes a support frame and a plurality of support columns. The two ends of the support columns are respectively connected to the repair substrate and the support frame. The plurality of support columns enclose a buffer space for the repair part to fall. The repair part and at least part of the connecting part are disposed in the buffer space. The support frame is provided with a clearance space communicating with the buffer space for avoiding the connecting part. The area of ​​the clearance space is smaller than the area of ​​the surface of the repair part away from the repair substrate, and the connecting part can be connected to the connecting part on the substrate to be repaired through the clearance space.

2. The repair device as described in claim 1, characterized in that, The height from the surface of the repair substrate near the support frame to the surface of the support frame near the repair substrate is not less than the height from the surface of the repair substrate near the connecting portion to the surface of the connecting portion near the repair substrate.

3. The repair device as described in claim 1, characterized in that, The repair substrate includes a receiving portion corresponding to the repair portion. The receiving portion is elastic. When the repair portion is subjected to an external force in the direction of the repair substrate and the repair portion abuts against the repair substrate, the repair portion, the connecting portion, and the support frame can move toward the receiving portion and compress the receiving portion.

4. The repair device as described in claim 1, characterized in that, The repair substrate includes a receiving portion corresponding to the repair portion. The receiving portion includes a first portion and a second portion connected to each other. The first portion is closer to the repair portion than the second portion, and the second portion is provided with a clearance groove. The first part is used to support the repair part, and the first part is also used to arrange the repair part, the connecting part and the support in the clearance groove when the repair part is subjected to an external force in the direction of the repair substrate, the external force is greater than a preset force and the repair part abuts against the first part.

5. The repair device as described in claim 4, characterized in that, The preset force includes the fracture stress of the first part; or The first part includes a plurality of elastic portions spaced apart, the plurality of elastic portions being arranged around the periphery of the second part, and each of the elastic portions extending toward the remaining elastic portions, the preset force including an elastic force that can cause the elastic portions to undergo elastic deformation.

6. The repair device according to any one of claims 1-5, wherein the plurality of support columns are flexible.

7. The repair device as claimed in claim 1, characterized in that, The surface of the repair part away from the repair substrate has multiple sides, and the orthographic projection of the support frame on the repair part covers the area sandwiched between two adjacent sides.

8. The repair device as claimed in claim 1, characterized in that, The support frame is provided with a fracture groove.

9. A method for preparing a repair device, characterized in that, include: A repair component is provided, the repair component including a repair substrate, a repair portion and a connecting portion, the repair portion being disposed on the repair substrate, and the connecting portion being disposed on the side of the repair portion opposite to the repair substrate; A photolithographic layer is formed covering the repair substrate and the repaired portion; Multiple support pillars are formed that penetrate the photolithography layer, the multiple support pillars are connected to the repair substrate, the multiple support pillars surround a buffer space, and the repair part and at least a portion of the connection part are disposed within the buffer space; A support frame is formed that penetrates the photolithography layer. The support frame is connected to the support pillar. The support frame is provided with a clearance space that communicates with the buffer space. The area of ​​the clearance space is smaller than the area of ​​the surface of the repair part away from the repair substrate. The connecting part can be connected to the part to be connected on the substrate to be repaired through the clearance space. Remove the photolithographic layer.

10. A repair method, characterized in that, include: Provide a repair apparatus as described in any one of claims 1-8; A component to be repaired is provided, including the substrate to be repaired, and a connection portion and a repair portion arranged in sequence, wherein a plurality of the repair portions are arranged to form a repair area, and the connection portion located in the repair area is exposed; The repair device is flipped so that the connecting part and the part to be connected are positioned face to face, and the connecting part is directly corresponding to the part to be connected; Separate the repair part from the repair substrate so that the repair part abuts against the support frame; Move the repair device so that the connecting part moves toward the substrate to be repaired and connects the connecting part to the part to be connected located in the area to be repaired; Remove the remaining repair device.

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