Filters and electronic equipment

Abstract

The embodiments of the present application belong to the technical field of terminal equipment, and specifically relate to a filtering device and an electronic device. The embodiments of the present application aim to solve the problem that particles in the water can easily damage the waterproof membrane, causing the shell seal to fail. In the filtering device and the electronic device provided by the present embodiment, the first filter layer is arranged on the outside of the outer surface of the shell, and the second filter layer is arranged between the outer surface and the first filter layer, and the first filter layer and the second filter layer both cover the functional holes on the shell. With such an arrangement, the first filter layer and the second filter layer can filter the water entering the functional hole to prevent impurities such as particles in the water from entering the functional hole; in a deep water environment, impurities and other particles can be prevented from damaging the waterproof membrane, thereby improving the waterproof performance of the electronic device in a deep water environment, that is, improving the ability of the electronic device to withstand water pressure and increasing the water depth of use of the electronic device.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of terminal equipment, and specifically to a filtering device and an electronic device. Background Art

[0002] Electronic devices (such as smart watches, mobile phones, etc.) are often provided with microphones to collect external sound waves. Specifically, the electronic device also includes a housing and a waterproof membrane. The housing is provided with a functional hole running through it. The microphone is provided on the housing, and the microphone is arranged toward the functional hole. The functional hole is blocked by a waterproof membrane. When working, sound waves pass through the functional hole and the waterproof membrane to be received by the microphone. The waterproof membrane can prevent external water from entering through the functional hole, thereby achieving the sealing of the housing.

[0003] However, in deep water environment, the water pressure is relatively high, and particles in the water can easily damage the waterproof membrane, causing the shell seal to fail. Summary of the invention

[0004] The embodiments of the present application provide a filtering device and an electronic device, which are intended to solve the problem that particulate matter in water can easily damage a waterproof membrane, causing failure of the housing seal.

[0005] On the one hand, an embodiment of the present application provides a filtering device for being arranged on an electronic device.

[0006] The electronic device comprises:

[0007] A shell, the shell having an inner surface and an outer surface opposite to the inner surface, and the shell is provided with a functional hole penetrating the inner surface and the outer surface;

[0008] The filtering device comprises:

[0009] A first filter layer, the first filter layer is located outside the outer surface, and the first filter layer covers the functional hole, and a plurality of first mesh holes are arranged at intervals on the first filter layer;

[0010] A second filter layer, the second filter layer is located between the outer surface and the first filter layer, and the second filter layer covers the functional holes, and a plurality of second mesh holes are arranged at intervals on the second filter layer;

[0011] In a cross section parallel to the first filter layer, a cross-sectional area of ​​the first mesh is greater than a cross-sectional area of ​​the second mesh.

[0012] In some embodiments that may include the above embodiments, there are multiple second filter layers, and the multiple second filter layers are stacked; along the direction away from the outer surface, in the cross-section parallel to the first filter layer, the cross-sectional area of ​​the second mesh on each second filter layer gradually increases.

[0013] In some embodiments that may include the above embodiments, the filtering device further comprises:

[0014] The first bonding layer is arranged between the first filter layer and the second filter layer adjacent thereto, and between adjacent second filter layers, and the first bonding layer is provided with a first through hole communicating with the functional hole.

[0015] In some embodiments that may include the above embodiments, the filtering device further comprises:

[0016] The first supporting layer is arranged between the second filtering layer and the outer surface, and the first supporting layer is in contact with the outer surface; the first supporting layer is provided with a second through hole communicating with the functional hole.

[0017] In some embodiments, which may include the above embodiments, the first filter layer is a rigid filter layer.

[0018] In some embodiments that may include the above embodiments, there are two second filter layers, and the two second filter layers are stacked, the first filter layer is located between the two second filter layers, and along the direction away from the outer surface, in the cross-section parallel to the first filter layer, the cross-sectional area of ​​the second mesh on each second filter layer gradually increases.

[0019] In some embodiments that may include the above embodiments, the filtering device further comprises:

[0020] A first bonding layer is provided between the first filter layer and the second filter layer, and a first through hole communicating with the functional hole is provided on the first bonding layer.

[0021] In some embodiments that may include the above embodiments, the filtering device further comprises:

[0022] a cover plate, wherein the cover plate covers the outer surface, the first filter layer and the second filter layer are located between the cover plate and the outer surface, and a third through hole communicating with the functional hole is provided on the cover plate;

[0023] The cover plate is connected to the shell.

[0024] In some embodiments that may include the above embodiments, the filtering device further comprises:

[0025] A second bonding layer, wherein the second bonding layer is disposed between the cover plate and the first filter layer, and a fourth through hole communicating with the functional hole is disposed on the second bonding layer.

[0026] In some embodiments that may include the above embodiments, a first groove is provided on the surface of the cover plate facing the housing, and at least a portion of the first filter layer is accommodated in the first groove.

[0027] In some embodiments that may include the above embodiments, a second groove is provided on the outer surface, and at least a portion of the second filter layer is accommodated in the second groove.

[0028] In some embodiments that may include the above embodiments, the electronic device further includes a sound module, the sound module is disposed on the inner surface, and the sound module is disposed in the functional hole.

[0029] On the other hand, an embodiment of the present application further provides an electronic device, including:

[0030] A shell, the shell having an inner surface and an outer surface opposite to the inner surface, and the shell is provided with a functional hole penetrating the inner surface and the outer surface;

[0031] A waterproof component, the waterproof component is arranged on the functional hole, and the waterproof component is used to prevent liquid from passing through the functional hole;

[0032] And, the filtering device as described above.

[0033] In some embodiments that may include the above embodiments, the waterproof component is disposed on the inner surface, and the waterproof component includes:

[0034] A waterproof membrane, a third adhesive layer, a second supporting layer and a fourth adhesive layer are stacked in a direction away from the inner surface, the third adhesive layer is provided with a fifth through hole, the fourth adhesive layer is provided with a sixth through hole, and the fifth through hole and the sixth through hole are both connected to the functional hole;

[0035] A plurality of first holes are arranged at intervals in an area of ​​the second supporting layer facing the functional hole.

[0036] In some embodiments that may include the above embodiments, the waterproof component further includes a buffer layer, the buffer layer is arranged on a side of the fourth bonding layer away from the inner surface, and a seventh through hole connected to the functional hole is arranged on the buffer layer.

[0037] In some embodiments that may include the above embodiments, the waterproof assembly further includes:

[0038] A fifth bonding layer, wherein the fifth bonding layer is disposed between the waterproof membrane and the inner surface, and an eighth through hole connected to the functional hole is disposed on the fifth bonding layer.

[0039] In some embodiments that may include the above embodiments, the waterproof assembly further includes:

[0040] a third supporting layer, the third supporting layer being arranged on the inner surface, and the third supporting layer being provided with a containing channel communicating with the functional hole;

[0041] The waterproof membrane is accommodated in the accommodating channel, and the edge of the waterproof membrane is in contact with the side wall of the accommodating channel; there is a gap between the waterproof membrane and the inner surface.

[0042] In some embodiments, which may include the above embodiments, the second supporting layer is in contact with a surface of the third supporting layer facing away from the inner surface.

[0043] In some embodiments, which may include the above embodiments, the third supporting layer includes a silicone layer.

[0044] In some embodiments that may include the above embodiments, the second supporting layer and the third supporting layer are an integral structure.

[0045] In some embodiments that may include the above embodiments, a sealing ring is provided between the third supporting layer and the shell, and the sealing ring is provided around the functional hole.

[0046] In some embodiments that may include the above embodiments, the waterproof assembly further includes:

[0047] An auxiliary supporting layer is provided between the third supporting layer and the inner surface, and a plurality of second holes are provided at intervals in the area of ​​the auxiliary supporting layer facing the functional hole; the gap is located between the waterproof membrane and the auxiliary supporting layer.

[0048] In some embodiments that may include the above embodiments, the auxiliary supporting layer and the third supporting layer are an integral structure.

[0049] In some embodiments that may include the above embodiments, a sixth bonding layer is arranged between the third supporting layer and the second supporting layer, a ninth through hole is arranged on the sixth bonding layer, the third bonding layer is located in the ninth through hole, and the third bonding layer is bonded to the hole wall of the ninth through hole.

[0050] In some embodiments that may include the above embodiments, the waterproof assembly further includes:

[0051] A protective layer is provided on the surface of the waterproof membrane facing the inner surface, and a via hole connected to the functional hole is provided on the protective layer.

[0052] In some embodiments that may include the above embodiments, a first receiving groove is provided on the inner surface, and the waterproof component is provided in the first receiving groove.

[0053] In some embodiments that may include the above embodiments, the waterproof component is disposed on the outer surface, and the waterproof component includes:

[0054] A third adhesive layer, a waterproof film and a protective layer are stacked in a direction away from the outer surface, the third adhesive layer is provided with a fifth through hole connected to the functional hole, and the protective layer is provided with a via hole facing the functional hole.

[0055] In some embodiments that may include the above embodiments, the waterproof component also includes a second supporting layer, the second supporting layer is arranged between the third bonding layer and the outer surface, and a plurality of first holes are spaced apart in an area of ​​the second supporting layer facing the functional hole.

[0056] In some embodiments that may include the above embodiments, a second receiving groove is provided on the outer surface, and the waterproof component is provided in the second receiving groove.

[0057] In some embodiments that may include the above embodiments, the electronic device further includes a sound module, the sound module is disposed on the inner surface, and the sound module is disposed in the functional hole.

[0058] In the filtering device and electronic device provided in the embodiment of the present application, the first filter layer is arranged outside the outer surface of the housing, and a plurality of first mesh holes are arranged at intervals on the first filter layer. The second filter layer is arranged between the outer surface and the first filter layer, and a plurality of second mesh holes are arranged at intervals on the second filter layer, and the first filter layer and the second filter layer both cover the functional holes on the housing. With such arrangement, the first filter layer and the second filter layer can filter the water entering the functional holes to prevent impurities such as particles in the water from entering the functional holes; in a deep water environment, impurities such as particles can be prevented from damaging the waterproof membrane, thereby improving the waterproof performance of the electronic device in a deep water environment, that is, improving the ability of the electronic device to withstand water pressure and increasing the water depth of use of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] Figure 1 This is the back view of the smartwatch;

[0060] Figure 2 It is a structural schematic diagram of a waterproof component in the related art;

[0061] Figure 3 A schematic diagram of the structure of the electronic device provided in the embodiment of the present application Figure 1 ;

[0062] Figure 4 Schematic diagram of the connection between the first filter layer and the cover plate in the filter device provided in the embodiment of the present application Figure 1 ;

[0063] Figure 5 for Figure 4 A partial enlarged view of the middle A;

[0064] Figure 6 for Figure 4 An exploded view of the first filter layer and the second filter layer;

[0065] Figure 7 A schematic diagram of the structure of the electronic device provided in the embodiment of the present application Figure 2 ;

[0066] Figure 8 Schematic diagram of the connection between the first filter layer and the cover plate in the filter device provided in the embodiment of the present application Figure 2 ;

[0067] Fig. 9 for Figure 8 A partial enlarged view of point B in the middle;

[0068] Fig.10 for Figure 8 An exploded view of the first filter layer and the second filter layer;

[0069] Fig.11 for Figure 8 A partial enlarged view of point C in the middle;

[0070] Fig.12 A schematic diagram of the structure of a housing in an electronic device provided in an embodiment of the present application;

[0071] Fig.13 A schematic diagram of the structure in which a first filter layer is disposed between two second filter layers in a filter device provided in an embodiment of the present application;

[0072] Fig.14 A schematic diagram of the structure of the electronic device provided in the embodiment of the present application Figure 3 ;

[0073] Fig.15 A schematic diagram of the structure of the electronic device provided in the embodiment of the present application Figure 4 ;

[0074] Fig.16 A schematic diagram of the structure of the electronic device provided in the embodiment of the present application Figure 5 ;

[0075] Fig.17A schematic diagram of the structure of the electronic device provided in the embodiment of the present application Figure 6 ;

[0076] Fig.18 A schematic diagram of the structure of the electronic device provided in the embodiment of the present application Figure 7 ;

[0077] Fig.19 A schematic diagram of the structure of the electronic device provided in the embodiment of the present application Figure 8 .

[0078] Description of Reference Numerals

[0079] 10: Filter device;

[0080] 101: first filter layer;

[0081] 102: second filter layer;

[0082] 103: first bonding layer;

[0083] 104: second bonding layer;

[0084] 105: first supporting layer;

[0085] 106: cover plate;

[0086] 1011: first mesh;

[0087] 1021: second mesh;

[0088] 1031: first through hole;

[0089] 1041: fourth through hole;

[0090] 1051: second through hole;

[0091] 1061: third through hole;

[0092] 1062: first groove;

[0093] 20: Shell;

[0094] 201: inner surface;

[0095] 202: outer surface;

[0096] 203: Functional hole;

[0097] 204: glue tank;

[0098] 205: first containing groove;

[0099] 206: second groove;

[0100] 207: second containing groove;

[0101] 2011: First Shell Wall;

[0102] 2021: Second shell wall;

[0103] 2051: first groove bottom;

[0104] 2071: Second groove bottom;

[0105] 30: Waterproof components;

[0106] 301: waterproof membrane;

[0107] 302: third bonding layer;

[0108] 303: second supporting layer;

[0109] 304: fourth bonding layer;

[0110] 305: buffer layer;

[0111] 306: fifth bonding layer;

[0112] 307: third supporting layer;

[0113] 308: protective layer;

[0114] 3021: fifth through hole;

[0115] 3023: sixth bonding layer;

[0116] 3024: ninth through hole;

[0117] 3031: first hole;

[0118] 3032: auxiliary support layer;

[0119] 3033: Second hole;

[0120] 3034: seventh bonding layer;

[0121] 3035: tenth through hole;

[0122] 3041: sixth through hole;

[0123] 3051: seventh through hole;

[0124] 3061: eighth through hole;

[0125] 3071: Accommodation channel;

[0126] 3072: gap;

[0127] 3073: Sealing ring;

[0128] 3074: Annular groove;

[0129] 3081: via;

[0130] 40: Sound module;

[0131] 401: Microphone;

[0132] 402: Speaker. DETAILED DESCRIPTION

[0133] With the gradual development of terminal equipment technology, electronic devices such as mobile phones and smart watches have been widely used. In order to improve the performance of electronic devices, electronic devices often need to be waterproof. Figure 1 As shown, in the related art, the smart watch includes a shell 20, a microphone and a waterproof component. A functional hole 203 is provided on the shell 20, and the microphone is provided in the functional hole. The waterproof component is used to block the functional hole to prevent water from passing through while allowing sound waves to pass through, thereby achieving sealing of the functional hole 203.

[0134] Please refer to Figure 2 The waterproof component 30 includes a waterproof membrane 301, a steel sheet 310, and a foam 320 which are stacked. An adhesive layer 330 is provided between the waterproof membrane 301 and the housing 20, between the waterproof membrane 301 and the steel sheet 310, and between the steel sheet 310 and the foam 320 to fix each membrane layer. The steel sheet 310 is provided with a plurality of holes. Since the waterproof membrane 301 has a microporous structure, sound waves from the outside can pass through the microporous structure, and pass through the holes and functional holes in sequence, and then be received by the microphone; and water has a certain surface tension and is difficult to pass through the microporous structure, thereby achieving a seal between the housing 20 and the outside. When the electronic device is placed in water, as the water depth increases, the pressure in the water gradually increases. At this time, impurities such as particles in the water will damage the microporous structure, so that water can pass through the waterproof membrane 301 and then enter the interior of the housing, causing the sealing of the housing 20 to fail, resulting in the failure of the waterproofing of the electronic device in a deep water environment.

[0135] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0136] Please refer to Figure 1 and Figure 3 The present application embodiment provides a filtering device 10 for use in an electronic device. The filtering device 10 is used to be arranged on the electronic device. For example, the electronic device may include: a mobile phone, a smart watch (such as Figure 1The present invention relates to terminal devices such as PC, tablet computer, VR, AR, headphones, etc., and this embodiment does not limit the electronic devices.

[0137] The electronic device may include a housing 20, which may be the outer shell of the electronic device. The housing 20 is configured to form a cavity for accommodating devices such as a battery (not shown) and a circuit board (not shown) in the electronic device. The housing 20 has an inner surface 201 and an outer surface 202 that are arranged opposite to each other. It can be understood that the inner surface 201 may be a surface facing the inside of the electronic device (such as the cavity wall of the cavity), and correspondingly, the outer surface 202 is the surface of the housing 20 exposed to the outside. The housing 20 is provided with a functional hole 203 that passes through the inner surface 201 and the outer surface 202. The functional hole 203 may be a balancing hole (such as a hole for balancing the inner surface 201 and the outer surface 202). Figure 3 The functional hole 203 on the left side of the middle portion and the balance hole can balance the air pressure inside and outside the shell so that the speaker and the microphone can work normally.

[0138] Of course, the functional hole 203 can also be a hole for sound waves to pass through (such as Figure 3 The electronic device further includes a sound module 40, which is disposed on the inner surface 201, that is, the sound module 40 is located in the cavity, and the sound module 40 is disposed in the functional hole 203. Exemplarily, the sound module 40 may include a speaker, and accordingly, the sound module 40 may emit sound waves to the outside of the housing 20 through the functional hole 203; of course, the sound module 40 may also include a microphone, and accordingly, the sound module 40 may receive sound waves outside the housing 20 through the functional hole 203 to obtain external sound signals. This embodiment does not limit the sound module 40.

[0139] Please refer to Figure 3 and Figure 4 The filter device 10 provided in this embodiment includes a first filter layer 101, and the first filter layer 101 is arranged on the outside of the outer surface 202 ( Figure 3 The first filter layer 101 has a plurality of first meshes (not shown) arranged at intervals. The first filter layer 101 covers the functional holes 203, that is, the functional holes 203 are located inside the projection of the first filter layer 101 on the outer surface 202, so that the first filter layer 101 and the first meshes thereon can filter the water entering the functional holes 203 to prevent impurities such as particles in the water from entering the functional holes 203.

[0140] Please refer to Figure 4 and Figure 5The filter device 10 further includes a second filter layer 102, which is located between the outer surface 202 and the first filter layer 101, and has a plurality of second meshes (not shown) arranged at intervals. The second filter layer 102 covers the functional hole 203, that is, the functional hole 203 is located inside the projection of the second filter layer 102 on the outer surface 202, so that the second filter layer 102 and the second mesh thereon can also filter the water entering the functional hole 203, so as to further prevent impurities such as particles in the water from entering the functional hole 203. Both the first filter layer 101 and the second filter layer 102 can filter the water entering the functional hole 203, so as to further prevent impurities such as particles in the water from entering the functional hole 203.

[0141] Please refer to Figure 6 In the above implementation, in the cross section parallel to the first filter layer 101, the cross-sectional area of ​​the first mesh 1011 is larger than the cross-sectional area of ​​the second mesh 1021, that is, the projection area of ​​the first mesh 1011 on the outer surface 202 is larger than the projection area of ​​the second mesh 1021 on the outer surface 202. With such a configuration, the first filter layer 101 can prevent impurities with larger particle sizes from passing through, and the second filter layer 102 can prevent impurities with smaller particle sizes from passing through. Compared with only one filter layer, the accumulation of impurities with larger particle sizes can be avoided, thereby preventing the first filter layer 101 and the second filter layer 102 from being blocked.

[0142] Exemplarily, the cross-sections of the first mesh 1011 and the second mesh 1021 may be regular shapes such as rectangles and circles. Of course, the cross-sections of the first mesh 1011 and the second mesh 1021 may also be irregular shapes. In the implementation mode where the cross-sections of the first mesh 1011 and the second mesh 1021 are circular, the aperture of the first mesh 1011 may be 0.1-0.5 mm, and the thickness of the first filter layer 101 may be 0.1-0.3 mm. Correspondingly, the aperture of the second mesh may be 0.5 μm-100 μm, and the thickness of the second filter layer 102 may be 0.05-0.1 mm. In this way, while ensuring a good filtering effect, the loss of sound waves passing through the first filter layer 101 and the second filter layer 102 is small; in addition, the thickness of the first filter layer 101 and the second filter layer 102 is small, which can improve the compactness of the electronic device.

[0143] In this embodiment, the first filter layer 101 can be a rigid filter layer, that is, the first filter layer 101 can be composed of a material with a certain rigidity, such as a steel mesh, a perforated steel sheet, a perforated plastic plate, etc. Since the first filter layer 101 is the outermost filter layer, in this configuration, the first filter layer 101 filters relatively hard and sharp impurities (such as sand, metal particles, etc.), which can prevent impurities such as particulate matter from damaging the first filter layer 101; in addition, since the first filter layer 101 has a certain rigidity, it can play a certain supporting role for the second filter layer 102 and other membrane layers to avoid wrinkles in the second filter layer 102 and other membrane layers. Correspondingly, the second filter layer 102 can be a filter layer with a certain flexibility. Exemplarily, the second filter layer 102 can include a dustproof net, and the material of the dustproof net can include polyethylene terephthalate (PET), polyether ether ketone (PEEK), etc.

[0144] Continue to refer to Figure 3 As can be seen from the above, in this embodiment, the electronic device further includes a waterproof component 30, which is disposed on the housing 20. The waterproof component 30 blocks the functional hole 203 to achieve the closure of the functional hole 203. The waterproof component 30 can be disposed on the inner surface 201 of the housing 20, and the waterproof component 30 is located between the sound module 40 and the inner surface 201. The waterproof component 30 allows sound waves to pass through, while preventing water from passing through. Of course, the waterproof component 30 can also be located on the inner side of the balance hole (such as Figure 3 The functional hole 203 on the left side of the middle portion is formed. At this time, the waterproof component 30 allows air to pass through while preventing water from passing through. Exemplarily, the waterproof component 30 may include a waterproof breathable membrane, which has a microporous structure. Some air can pass through the microporous structure, while water has a certain surface tension and is difficult to pass through the microporous structure, so that the waterproof component 30 can prevent water from passing through while allowing sound waves and air to pass through, thereby achieving sealing. Among them, the material of the waterproof breathable membrane may include expanded polytetrafluoroethylene (expanded PTFE, referred to as e-PTFE), etc. The pore size range of the microporous structure in the waterproof breathable membrane can be 0.05-10μm, for example: 0.085μm, 0.1μm, etc.; such a setting can improve the waterproof effect of the waterproof breathable membrane to increase the water depth of use of electronic equipment. Of course, the waterproof breathable membrane can also achieve the transmission of sound waves from one side of the waterproof breathable membrane to the other side through its own vibration.

[0145] Please refer to Figure 7, two functional holes 203 may be provided on the housing 20, and the corresponding sound module 40 may include a speaker 402 and a microphone 401, wherein the speaker 402 is arranged toward one functional hole 203, and the microphone 401 is arranged toward the other functional hole 203. That is, the speaker 402 emits sound waves to the outside of the housing 20 through the corresponding functional hole 203, and the microphone 401 receives external sound waves through the corresponding functional hole 203. Accordingly, a waterproof component 30 is provided between the speaker 402 and the inner surface 201, and between the microphone 401 and the inner surface 201, so as to achieve sealing of the two functional holes 203.

[0146] It can be understood that in the above implementation, the filter device 10 can cover the two functional holes 203, that is, the two functional holes 203 are both located within the projections of the first filter layer 101 and the second filter layer 102 on the outer surface 202, so that the water entering the two functional holes 203 can be filtered through the first filter layer 101 and the second filter layer 102.

[0147] Of course, in some implementations, there may be two filter devices 10, one of which is provided corresponding to one functional hole 203, and the other filter device 10 is provided corresponding to another functional hole 203. That is, the first filter layer 101 and the second filter layer 102 in one filter device 10 cover one functional hole 203, and the functional hole 203 is located within the projection of the first filter layer 101 and the second filter layer 102 on the outer surface 202; the first filter layer 101 and the second filter layer 102 in another filter device 10 cover another functional hole 203, and the functional hole 203 is located within the projection of the first filter layer 101 and the second filter layer 102 on the outer surface 202. In this way, each filter device 10 can filter the water entering its corresponding functional hole 203.

[0148] In the filter device 10 provided in this embodiment, the first filter layer 101 is arranged outside the outer surface 202 of the housing 20, and a plurality of first meshes 1011 are arranged at intervals on the first filter layer 101. The second filter layer 102 is arranged between the outer surface 202 and the first filter layer 101, and a plurality of second meshes 1021 are arranged at intervals on the second filter layer 102, and the first filter layer 101 and the second filter layer 102 both cover the functional holes 203 on the housing 20. With such arrangement, when entering the water, the first filter layer 101 and the second filter layer 102 can filter the water entering the functional holes 203 to prevent impurities such as particles in the water from entering the functional holes 203; especially in a deep water environment, impurities such as particles can be prevented from damaging the waterproof membrane 301, thereby improving the waterproof performance of the electronic device in the deep water environment, that is, improving the ability of the electronic device to withstand water pressure, and increasing the water depth of use of the electronic device.

[0149] On the other hand, the cross-sectional area of ​​the first mesh 1011 is larger than the cross-sectional area of ​​the second mesh 1021. With this arrangement, the first filter layer 101 can prevent impurities with larger particle sizes from passing through, and the second filter layer 102 can prevent impurities with smaller particle sizes from passing through. Compared with only one filter layer, the accumulation of large particle impurities can be avoided, thereby avoiding blockage of the filter layer.

[0150] Please refer to Figure 8 and Fig. 9 In some embodiments, there may be multiple second filter layers 102, and multiple second filter layers 102 are stacked and arranged between the first filter layer 101 and the outer surface 202. In this way, multiple second filter layers 102 can further improve the filtering effect of impurities such as particulate matter, so as to further improve the waterproof performance of electronic equipment in deep water environment and increase the water depth of use of electronic equipment.

[0151] Please refer to Fig. 9 and Fig.10 , in some implementations, in a direction away from the outer surface 202 ( Fig.10 In the cross section parallel to the first filter layer 101, the cross-sectional area of ​​the second mesh 1021 on each second filter layer 102 gradually increases. In other words, the cross-sectional area of ​​the second mesh 1021 of the second filter layer 102 close to the first filter layer 101 is greater than the cross-sectional area of ​​the second mesh 1021 on the second filter layer 102 away from the first filter layer 101. In this way, impurities with larger particle sizes stay on the second filter layer 102 close to the first filter layer 101, and impurities with smaller particle sizes stay on the second filter layer 102 away from the first filter layer 101, which can prevent impurities from accumulating on each second filter layer 102, thereby preventing the second filter layer 102 from being blocked.

[0152] In other implementations, the cross-sectional areas of the second meshes 1021 on each second filter layer 102 may also be the same.

[0153] In this embodiment, the number of the second filter layers 102 can be 2, 3, 4, etc., and this embodiment does not limit the number of the second filter layers 102. Fig. 9 As shown, the number of the second filter layers 102 is 2, the aperture of the second mesh 1021 on the second filter layer 102 close to the first filter layer 101 can be 50 μm, and the aperture of the second mesh 1021 on the second filter layer 102 away from the first filter layer 101 can be 25 μm; at this time, while ensuring a high filtering effect, the loss of sound waves when passing through the filter device 10 can be reduced, and the acoustic performance of the electronic device can be improved. Compared with not setting the filter device 10, the water pressure that the electronic device can withstand can reach 1.25 MPa (about 12.5 atm), that is, the water depth of the electronic device can reach 125 meters.

[0154] Continue to refer to Fig. 9 In the implementation mode in which the filter device 10 includes a plurality of second filter layers 102 stacked, the filter device 10 further includes a first bonding layer 103, which is disposed between the first filter layer 101 and the second filter layer 102 adjacent thereto, and between adjacent second filter layers 102. In this arrangement, the first bonding layer 103 can achieve bonding between the first filter layer 101 and the second filter layer 102 adjacent thereto, and between adjacent second filter layers 102. In addition, the first filter layer 101 can be connected to the second filter layer 102 adjacent thereto, and the adjacent second filter layer 102 through the first bonding layer 103 to form a filter layer assembly, thereby achieving pre-assembly of the filter device 10, and then the filter layer assembly is mounted on the housing 20, which facilitates assembly of the electronic device.

[0155] The first bonding layer 103 is provided with a first through hole 1031, which is used to connect to the functional hole 203; that is, the projection of the first through hole 1031 on the outer surface 202 at least covers a portion of the functional hole 203; so that the first filter layer 101 and the second filter layer 102 corresponding to the first through hole 1031 can filter the water entering the functional hole 203, and the sound waves and the filtered water can enter the functional hole 203 through the first through hole 1031.

[0156] It can be understood that the center line of the first through hole 1031 is colinear with the center line of the functional hole 203, and the projections of the first through holes 1031 on the outer surface 202 can completely overlap; in this case, the projection of the first through hole 1031 on the outer surface 202 can partially overlap or completely overlap with the functional hole 203. Of course, the functional hole 203 can also be located inside the projection of the first through hole 1031 on the outer surface 202, so that the loss of the sound wave when passing through the filter device 10 can be reduced.

[0157] Continue to refer to Figure 8 and Fig. 9 The filter device 10 provided in this embodiment further includes a first support layer 105, which is disposed between the second filter layer 102 and the outer surface 202 (eg Figure 7 202, the first support layer 105 is in contact with the outer surface 202, and the first support layer 105 is provided with a second through hole 1051 for connecting the functional hole 203. In this way, the second filter layer 102 close to the outer surface 202 can be supported on the outer surface 202 by the first support layer 105, thereby avoiding direct contact between the second filter layer 102 and the outer surface 202, so as to avoid the outer surface squeezing the second filter layer 102 and damaging the second filter layer 102.

[0158] Exemplarily, the center line of the second through hole 1051 may be colinear with the center line of the first through hole 1031, and the projection of the second through hole 1051 on the outer surface 202 may completely overlap with the projection of the first through hole 1031 on the outer surface 202, or the projection of the second through hole 1051 on the outer surface 202 is located within the projection of the first through hole 1031 on the outer surface 202. The first support layer 105 may be a silicone layer, a waterproof adhesive layer, or the first support layer 105 includes a waterproof adhesive layer and a steel sheet stacked in a direction away from the outer surface 202, and accordingly, both the waterproof adhesive layer and the steel sheet have openings connected to the functional holes 203, so as to achieve sealing between the second filter layer 102 and the outer surface while ensuring that the first support layer 105 has a certain support effect.

[0159] Continue to refer to Figure 7 and Figure 8 In some embodiments, the filter device 10 further includes a cover plate 106, which covers the outer surface 202 of the shell 20, and the first filter layer 101 and the second filter layer 102 are sandwiched between the cover plate 106 and the outer surface 202; that is, the first filter layer 101 and the second filter layer 102 are located between the cover plate 106 and the outer surface 202, and the first filter layer 101 and the second filter layer 102 can be fixed to the shell 20 through the cover plate 106.

[0160] Exemplarily, the cover plate 106 can be bonded to the outer surface 202 of the housing 20 by adhesive, thereby fixing the cover plate 106. The adhesive can be adhesive, etc., to facilitate the installation of the cover plate 106; accordingly, a glue groove 204 can be provided on the outer surface 202, and the glue groove 204 can accommodate adhesive to avoid that the distance between the cover plate 106 and the outer surface 202 is too large. Of course, the cover plate 106 can also be connected to the housing 20 in a detachable manner such as snap connection or bolt connection, so that the filter device 10 can be removed from the housing 20 during maintenance. In some implementations, while the cover plate 106 is connected to the housing 20 by bolt connection or snap connection, adhesive is also provided between the cover plate 106 and the housing 20 to further improve the sealing performance.

[0161] The cover plate 106 is provided with a third through hole 1061 for connecting with the functional hole 203, that is, the center line of the third through hole 1061 can be colinear with the center line of the functional hole 203, and the functional hole 203 can be located within the projection of the third through hole 1061 on the outer surface 202. In this way, after passing through the third through hole 1061, the external sound waves and water can enter the inside of the housing 20 through the functional hole 203 to be received by the sound module 40; or the sound waves emitted by the sound module 40 can pass through the functional hole 203 and propagate to the outside of the housing 20 through the third through hole 1061.

[0162] Continue to refer to Fig. 9 A second adhesive layer 104 may be provided between the cover plate 106 and the first filter layer 101, and a fourth through hole 1041 for connecting the functional hole 203 is provided on the second adhesive layer 104. In this way, the second adhesive layer 104 can fix the filter device 10 on the cover plate 106, so as to achieve the pre-installation of the filter device 10. After that, the cover plate 106 with the first filter layer 101 and the second filter layer 102 is installed on the housing 20, so as to complete the installation of the filter device 10, thereby simplifying the installation process.

[0163] Exemplarily, the center line of the fourth through hole 1041 can be colinear with the center line of the first through hole 1031, and the projection of the fourth through hole 1041 on the outer surface 202 can completely coincide with the projection of the first through hole 1031 on the outer surface 202; or the projection of the fourth through hole 1041 on the outer surface 202 is located within the projection of the first through hole 1031 on the outer surface 202.

[0164] Please refer to Fig.11 In the above implementation, the first groove 1062 may be provided on the surface of the cover plate 106 facing the outer surface 202, and correspondingly at least part of the first filter layer 101 is accommodated in the first groove 1062. Such a configuration can avoid a large distance between the cover plate 106 and the outer surface 202 caused by the first filter layer 101 and the second filter layer 102 being sandwiched between the cover plate 106 and the outer surface 202, thereby improving the compactness of the electronic device and reducing the volume of the electronic device.

[0165] Exemplarily, the first filter layer 101 may be completely accommodated in the first groove 1062; of course, at least a portion of the second filter layer 102 may also be accommodated in the first groove 1062 to further improve the compactness of the electronic device and reduce the volume of the electronic device.

[0166] Please refer to Fig.12 In this embodiment, a second groove 206 is provided on the outer surface 202, and correspondingly at least a portion of the second filter layer 102 is accommodated in the second groove 206. Such a configuration can avoid a large distance between the cover plate 106 and the outer surface 202 caused by the first filter layer 101 and the second filter layer 102 being sandwiched between the cover plate 106 and the outer surface 202, thereby improving the compactness of the electronic device and reducing the volume of the electronic device.

[0167] Exemplarily, when the cover plate 106 covers the outer surface 202, the first filter layer 101 and the second filter layer 102 can be both accommodated in the second groove 206, so as to further improve the compactness of the electronic device and reduce the volume of the electronic device. Of course, in the implementation mode in which the first groove 1062 is provided on the surface of the cover plate 106 facing the outer surface 202, part of the first filter layer 101 is accommodated in the first groove 1062, and correspondingly, the rest of the first filter layer 101 and the second filter layer 102 are both accommodated in the second groove 206; in this way, the first groove 1062 and the second groove 206 jointly accommodate the filter device 10, which can avoid the first groove 1062 and the second groove 206 from being too deep.

[0168] Please refer to Fig.13 In the implementation mode where the first filter layer 101 is a rigid layer and the second filter layer 102 is a dustproof net, there are two second filter layers 102, and the two second filter layers 102 are stacked. The first filter layer 101 is located between the two second filter layers 102. In the direction away from the outer surface, in the cross section parallel to the first filter layer 101, the cross-sectional area of ​​the second mesh on each second filter layer 102 gradually increases. In this way, the first filter layer 101 can be sandwiched between the two second filter layers 102, thereby avoiding the exposure of the first filter layer 101 and improving the decorative effect of the electronic device. At this time, the cross-sectional area of ​​the first mesh on the first filter layer 101 can be greater than the cross-sectional area of ​​the second mesh on each second filter layer 102.

[0169] Continue to refer to Fig.13 The filter device 10 further includes a first bonding layer 103, which is disposed between the first filter layer 101 and the second filter layer 102. The first bonding layer 103 is provided with a first through hole 1031 communicating with the functional hole 203. The first bonding layer 103 can achieve connection between the first filter layer 101 and each second filter layer 102, and can also achieve sealing between the first filter layer 101 and each second filter layer 102.

[0170] The present application also provides an electronic device, which may include a mobile phone, a smart watch (such as Figure 1 As shown), PC, tablet computer, VR, AR, headphones, etc. This embodiment does not limit the electronic devices.

[0171] like Figure 3As shown, the electronic device includes a housing 20, which may be the outer shell of the electronic device. The housing 20 is arranged to form a cavity for accommodating devices such as batteries and circuit boards in the electronic device. The housing 20 has an inner surface 201 and an outer surface 202 that are arranged opposite to each other. It can be understood that the inner surface 201 may be a surface facing the inside of the electronic device (such as the cavity wall of the cavity), and correspondingly, the outer surface 202 is the surface of the housing 20 exposed to the outside. The housing 20 is provided with a functional hole 203 that passes through the inner surface 201 and the outer surface 202. The functional hole 203 may be a balancing hole (such as a hole for balancing the inner surface 201 and the outer surface 202). Figure 3 The balance hole can balance the air pressure inside and outside the housing so that the speaker and microphone can work normally. Of course, the functional hole 203 can also be a hole for sound waves to pass through (such as Figure 3 Functional hole 203 on the right side of the middle).

[0172] The filter device 10 provided in any of the above embodiments is disposed on the outer surface 202 of the housing 20 to filter the water flowing into the functional hole 203 , thereby preventing impurities such as particles from entering the functional hole 203 .

[0173] The electronic device further includes a sound module 40 , which may be a device for emitting sound waves such as a speaker, or a device for receiving sound waves such as a microphone. This embodiment does not limit the sound module 40 .

[0174] The sound module 40 is disposed on the inner surface 201 , and is disposed toward the functional hole 203 , so that the sound module 40 can emit sound waves outward through the functional hole 203 , or receive sound waves from outside the shell 20 via the functional hole 203 .

[0175] like Figure 3 As shown, the electronic device further includes a waterproof component 30, which is disposed on the housing 20. The waterproof component 30 can be disposed corresponding to the sound module 40 to allow sound waves to pass through, while the waterproof component 30 prevents water from passing through; of course, the waterproof component 30 can also be located on the inner side of the balance hole (such as Figure 3 The functional hole 203 on the left side of the middle portion is shown in FIG. 2 . At this time, the waterproof component 30 allows air to pass through while preventing water from passing through, thereby achieving sealing of the functional hole 203 .

[0176] In this embodiment, the waterproof component 30 can be arranged in various positions and structures, as long as it can prevent water from passing through while allowing gas to pass through. The structure and arrangement position of the waterproof component 30 will be introduced in multiple scenarios below:

[0177] Scene 1

[0178] like Fig.14As shown, in this scenario, the waterproof component 30 can be arranged on the inner surface 201, and the corresponding waterproof component 30 needs to be located between the housing 20 and the sound module 40, or the waterproof component 30 is arranged corresponding to the balance hole to achieve the closure of the functional hole 203. Accordingly, the waterproof component 30 may include: a waterproof membrane 301, a third adhesive layer 302, a second support layer 303 and a fourth adhesive layer 304 stacked in a direction away from the inner surface 201, a fifth through hole 3021 is arranged on the third adhesive layer 302, and a sixth through hole 3041 is arranged on the fourth adhesive layer 304, and the fifth through hole 3021 and the sixth through hole 3041 are both used to connect the functional hole 203. That is, the center lines of the fifth through hole 3021 and the sixth through hole 3041 can be arranged colinearly with the center line of the functional hole 203, the projections of the fifth through hole 3021 and the sixth through hole 3041 on the inner surface 201 can completely overlap, and the functional hole 203 can be located within the projections of the fifth through hole 3021 and the sixth through hole 3041 on the inner surface 201, or the functional hole 203 can completely overlap with the projections of the fifth through hole 3021 and the sixth through hole 3041 on the inner surface 201. This prevents the third adhesive layer 302 and the fourth adhesive layer 304 from hindering the propagation of sound waves.

[0179] The waterproof component 30 further includes a buffer layer 305, which is disposed on the side of the fourth adhesive layer 304 away from the inner surface 201, and is provided with a seventh through hole 3051 connected to the functional hole 203. The buffer layer 305 can support the entire waterproof component 30.

[0180] The waterproof membrane 301 has a microporous structure, part of the air can pass through the microporous structure, while water has a certain surface tension and is difficult to pass through the microporous structure, so that the waterproof component 30 can prevent water from passing through while allowing sound waves to pass through, thereby achieving sealing; at this time, the corresponding waterproof component 30 is set in the balance hole or the corresponding sound module 40. The material of the waterproof membrane 301 can include expanded polytetrafluoroethylene, and the pore size range of the microporous structure in the waterproof membrane 301 can be 0.05-10μm, for example: 0.085μm, 0.1μm, etc., so that the waterproof membrane 301 can withstand a water pressure of up to 1.25MPa, and the use depth can reach 125 meters, and has a certain air permeability, and at an audio frequency of 100-10000Hz, the sound blocking amount is not greater than 5dB. In the related art, the waterproof component includes a polymer film that has been hydrophobically modified. The film is a dense film, that is, the film does not allow gas to pass through, and the transmission of sound waves on both sides of the film is achieved through its own vibration; the elastic modulus of the film is 2000-8000MPa, and the sound blocking amount is 1.5-6dB at an audio frequency of 100-10000Hz. The surface energy of the film is less than 50mN / m, so that the electronic equipment using the film can withstand a water pressure of more than 1MPa, and the water depth can reach 100 meters. However, since the film does not allow gas to pass through, when the external air pressure changes, under the action of the internal and external air pressures, it is easy to cause the film to deform (such as bulging or concave), thereby affecting the transmission of sound waves. In contrast, the waterproof component 30 uses the waterproof membrane 301 in this embodiment. Since the waterproof membrane 301 has a microporous structure, it can ensure that it can withstand a large water pressure (such as 1.25MPa) while not affecting the transmission of sound waves due to changes in the external air pressure. It can be understood that in the implementation of the speaker setting corresponding to the waterproof component 30, a breathable membrane such as a waterproof membrane 301 with a microporous structure can be used. In the implementation of the microphone setting corresponding to the waterproof component 30, a waterproof membrane 301 with a microporous structure or a dense membrane can be used. When the waterproof component 30 is used to seal the balance hole, the corresponding waterproof membrane 301 needs to be a breathable membrane such as a waterproof membrane 301 with a microporous structure.

[0181] A plurality of first holes 3031 are arranged at intervals in the area of ​​the second supporting layer 303 facing the functional hole 203, that is, the functional hole 203 is located within the projection of the area on the inner surface 201, or the functional hole 203 completely overlaps with the projection of the area on the inner surface 201. During use, air can pass through the second supporting layer 303 through the first holes 3031.

[0182] like Fig.14As shown, the projections of the fifth through hole 3021 , the sixth through hole 3041 and the seventh through hole 3051 on the inner surface 201 can completely overlap with the area where the first hole 3031 is set, and the functional hole 203 is located within the projections of the fifth through hole 3021 , the sixth through hole 3041 and the seventh through hole 3051 on the inner surface 201 .

[0183] In the above implementation, the second supporting layer 303 may have a certain rigidity. For example, the material of the second supporting layer 303 may include stainless steel, copper, etc., so that the second supporting layer 303 can play a better supporting role for the waterproof membrane 301 .

[0184] Continue to refer to Fig.14 The housing 20 is provided with a first receiving groove 205, and the waterproof component 30 is received in the first receiving groove 205. Such a configuration can improve the compactness of the structure of the electronic device, thereby reducing the volume of the electronic device. It can be understood that at this time, the inner surface 201 of the housing 20 includes a first groove bottom 2051 of the first receiving groove 205 and a portion of the first shell wall 2011 outside the first receiving groove 205.

[0185] Continue to refer to Fig.14 The waterproof component 30 further includes a fifth adhesive layer 306, which is disposed between the waterproof membrane 301 and the inner surface 201 (i.e., between the waterproof membrane 301 and the first groove bottom 2051), and the fifth adhesive layer 306 is provided with an eighth through hole 3061 communicating with the functional hole 203. The fifth adhesive layer 306 can realize the connection between the waterproof membrane 301 and the housing 20, and at the same time, the fifth adhesive layer 306 can also realize the sealing between the waterproof membrane 301 and the housing 20.

[0186] Exemplarily, the center line of the eighth through hole 3061 can be colinear with the center line of the fifth through hole 3021, and the projection of the eighth through hole 3061 on the inner surface 201 can completely overlap with the projection of the fifth through hole 3021 on the inner surface 201, so that sound waves can be transmitted to the waterproof membrane 301 after passing through the eighth through hole 3061.

[0187] Continue to refer to Fig.14In this scenario, the material of the buffer layer 305 may include: polyurethane foam, silicone, polyethylene foam glue, etc., so that the buffer layer 305 has a certain amount of compression. In the process of installing the waterproof component 30, by appropriately compressing the buffer layer 305 (for example, compressing it by about 60%), a certain pre-pressure can be applied between the film layers to improve the sealing between adjacent film layers, and also improve the sealing between the waterproof component 30 and the housing 20. In this way, the waterproof performance of the electronic device in the deep water environment is improved, that is, the ability of the electronic device to withstand water pressure is improved, and the water depth of the electronic device is increased. For example, the third adhesive layer 302, the fourth adhesive layer 304, and the fifth adhesive layer 306 are all annular, and the outer diameter is 4 mm and the inner diameter is 1.75 mm. When the buffer layer 305 is compressed by 50%, the obtained pre-pressure can meet the sealing requirements of the use water depth of 50 meters; while the buffer layer 305 of the same material needs to meet the use water depth of more than 125 meters, the buffer layer 305 needs to be compressed by more than 80% to obtain sufficient pre-pressure.

[0188] It is understandable that too much pre-pressure can easily cause wrinkles in the waterproof membrane 301, thus affecting the acoustic performance; too little pre-pressure can easily lead to weak bonding between the bonding layers and insufficient sealing. Accordingly, a buffer layer 305 with a relatively gentle stress-strain curve can be used so that a slight change in thickness will not lead to an excessive change in pre-pressure.

[0189] In some implementations, the elastic modulus of the buffer layer 305 may be appropriately increased to reduce the deformation of the buffer layer 305 (eg, compress it by 50%) while obtaining the same preload, so that the deformation of the buffer layer 305 is within the use range.

[0190] In this scenario, the projection area of ​​the waterproof membrane 301 on the inner surface 201 can be appropriately increased, thereby increasing the projection areas of the third adhesive layer 302, the fourth adhesive layer 304, and the fifth adhesive layer 306 on the inner surface 201 to improve the sealing properties of the third adhesive layer 302, the fourth adhesive layer 304, and the fifth adhesive layer 306. During assembly, the pre-pressure on the buffer layer 305 can be reduced to avoid damage to the buffer layer 305. In addition, it can also prevent the waterproof membrane 301 from being wrinkled due to excessive force, thereby affecting the transmission of sound waves.

[0191] It is understandable that the waterproof membrane 301 can be in a regular shape, such as a circle, a rectangle, etc.

[0192] Of course, since bolts and other structures are generally provided on the housing 20, in order to avoid bolts and other structures, the waterproof membrane 301 can also be an irregular shape; this embodiment does not limit the shape of the waterproof membrane 301. Accordingly, the outer edges of the third adhesive layer 302, the fourth adhesive layer 304, and the fifth adhesive layer 306 are flush with the outer edges of the waterproof membrane 301, that is, the projections of the third adhesive layer 302, the fourth adhesive layer 304, and the fifth adhesive layer 306 on the inner surface 201 completely overlap; the projection area of ​​the third adhesive layer 302, the fourth adhesive layer 304, and the fifth adhesive layer 306 on the inner surface 201 can be 10-40mm 2 (eg: 10mm 2 , 14mm 2 , 20mm 2 , 40mm 2 The bonding width of the third bonding layer 302 (the width between the outer edge of the third bonding layer 302 and the hole wall of the fifth through hole 3021) must be 1.2-3 mm (e.g., 1.2 mm, 2 mm, 3 mm, etc.). In this way, each bonding layer can have sufficient bonding force to ensure sufficient sealing while reducing the pre-pressure to avoid damage to the buffer layer 305; at the same time, it can also prevent the waterproof membrane 301 from being wrinkled due to excessive force, thereby affecting the transmission of sound waves.

[0193] In this scenario, during assembly, the fifth adhesive layer 306, the waterproof membrane 301, the third adhesive layer 302, the second supporting layer 303, the fourth adhesive layer 304, and the buffer layer 305 can be sequentially attached to the housing 20 to achieve the assembly of the waterproof component 30. Of course, the fourth adhesive layer 304, the second supporting layer 303, the third adhesive layer 302, the waterproof membrane 301, and the fifth adhesive layer 306 can also be sequentially attached to the buffer layer 305 to form a pre-installed component, and then the component is assembled to the housing 20 as a whole to complete the assembly of the waterproof component 30, thereby simplifying the assembly difficulty of the electronic device.

[0194] Scene 2

[0195] Please refer to Fig.15In this scenario, the waterproof component 30 can be arranged on the inner surface 201, and the corresponding waterproof component 30 needs to be located between the housing 20 and the sound module 40, or the waterproof component 30 is arranged corresponding to the balance hole to achieve the closure of the functional hole 203. Accordingly, the waterproof component 30 may include: a waterproof membrane 301, a third adhesive layer 302, a second support layer 303, a fourth adhesive layer 304 and a buffer layer 305 stacked in a direction away from the inner surface 201, a fifth through hole 3021 is arranged on the third adhesive layer 302, a sixth through hole 3041 is arranged on the fourth adhesive layer 304, and a seventh through hole 3051 is arranged on the buffer layer 305. The fifth through hole 3021, the sixth through hole 3041 and the seventh through hole 3051 are all used to connect the functional hole 203. That is, the center lines of the fifth through hole 3021, the sixth through hole 3041 and the seventh through hole 3051 can be arranged colinearly with the center line of the functional hole 203, the projections of the fifth through hole 3021, the sixth through hole 3041 and the seventh through hole 3051 on the inner surface 201 can completely overlap, and the functional hole 203 can be located within the projections of the fifth through hole 3021, the sixth through hole 3041 and the seventh through hole 3051 on the inner surface 201, or the functional hole 203 can completely overlap with the projections of the fifth through hole 3021, the sixth through hole 3041 and the seventh through hole 3051 on the inner surface 201. This prevents the third adhesive layer 302, the fourth adhesive layer 304 and the buffer layer 305 from hindering the propagation of sound waves.

[0196] The waterproof membrane 301 may have a microporous structure, through which some air can pass, but water has difficulty passing due to its own surface tension, so that the waterproof component 30 can prevent water from passing while allowing sound waves to pass, thereby achieving sealing. The waterproof membrane 301 may be made of expanded polytetrafluoroethylene.

[0197] A plurality of first holes 3031 are arranged at intervals in the area of ​​the second supporting layer 303 facing the functional hole 203, that is, the functional hole 203 is located within the projection of the area on the inner surface 201, or the functional hole 203 completely overlaps with the projection of the area on the inner surface 201. During use, air can pass through the second supporting layer 303 through the first holes 3031.

[0198] like Fig.15 As shown, the projections of the fifth through hole 3021 , the sixth through hole 3041 and the seventh through hole 3051 on the inner surface 201 can completely overlap with the area where the first hole 3031 is set, and the functional hole 203 is located within the projections of the fifth through hole 3021 , the sixth through hole 3041 and the seventh through hole 3051 on the inner surface 201 .

[0199] In the above implementation, the second supporting layer 303 may have a certain rigidity. For example, the material of the second supporting layer 303 may include stainless steel, copper, etc., so that the second supporting layer 303 can play a better supporting role for the waterproof membrane 301 .

[0200] Please refer to Fig.15 The housing 20 is provided with a first receiving groove 205, and the waterproof component 30 is received in the first receiving groove 205. Such a configuration can improve the compactness of the structure of the electronic device, thereby reducing the volume of the electronic device. It can be understood that at this time, the inner surface 201 of the housing 20 includes a first groove bottom 2051 of the first receiving groove 205 and a portion of the first shell wall 2011 outside the first receiving groove 205.

[0201] Continue to refer to Fig.15 The waterproof component 30 also includes a third supporting layer 307, which is arranged on the inner surface 201 (i.e., the first groove bottom 2051), and is provided with a receiving channel 3071 connected to the functional hole 203; the waterproof membrane 301 is accommodated in the receiving channel 3071, and the waterproof membrane 301 is in contact with the side wall of the receiving channel 3071, and there is a gap 3072 (forming a U-shaped cavity structure) between the waterproof membrane 301 and the inner surface 201 (i.e., the first groove bottom 2051). In this way, the third supporting layer 307 is supported between the second supporting layer 303 and the housing 20, and there is a gap 3072 between the waterproof membrane 301 and the inner surface (i.e., the first groove bottom 2051). When the pre-pressure is applied to the housing 20 through the buffer layer 305 during the installation process, the pre-pressure acts on the third supporting layer 307 to prevent the waterproof membrane 301 from being wrinkled due to the pre-pressure, thereby preventing the wrinkles from affecting the acoustic performance.

[0202] In the above implementation, the second support layer 303 may be in contact with the surface of the third support layer 307 away from the inner surface 201, that is, the second support layer 303 is in contact with the surface of the third support layer 307 away from the first groove bottom 2051. Accordingly, the third support layer 307 may include a silicone layer, which can achieve a certain support effect while achieving a seal between the second support layer 303 and the housing 20; the water pressure that the electronic device can withstand can reach 1MPa (about 10atm), that is, the water depth of the electronic device can reach 100 meters. Of course, the third support layer 307 can also be other rubber layers, etc.

[0203] Continue to refer to Fig.15During assembly, the fourth adhesive layer 304, the second supporting layer 303, the third adhesive layer 302, the waterproof membrane 301 and the fifth adhesive layer 306 can be sequentially attached to the buffer layer 305, and then the third supporting layer 307 can be attached to the second supporting layer 303 to form a pre-installed component, and then the component can be assembled to the housing 20 as a whole to complete the assembly of the waterproof component 30, thereby simplifying the assembly difficulty of the electronic device. Of course, the fourth adhesive layer 304, the second supporting layer 303, the third adhesive layer 302 and the third supporting layer 307 can also be sequentially attached to the buffer layer 305, and then the waterproof membrane 301 and the fifth adhesive layer 306 can be sequentially attached to the second supporting layer 303 to form a pre-installed component, and then the component can be assembled to the housing 20 as a whole.

[0204] Continue to refer to Fig.15 The third adhesive layer 302 can be a waterproof adhesive. Since there is a gap 3072 between the waterproof membrane 301 and the first groove bottom 2051, during assembly, it is only necessary to activate the third adhesive layer 302. During use, water pressure will act on the waterproof membrane 301, thereby squeezing the third adhesive layer 302, and automatically achieving bonding between the waterproof membrane 301 and the second supporting layer 303.

[0205] Please refer to Fig.16 In other implementations, the third support layer 307 and the second support layer 303 can be an integral structure. With this arrangement, the integral structure formed by stamping, injection molding and other processes simplifies the structure of the waterproof component 30 and facilitates the assembly of the waterproof component 30.

[0206] Continue to refer to Fig.16 A sealing ring (O-ring) 3073 is arranged between the third supporting layer 307 and the housing 20, and the sealing ring 3073 is arranged around the functional hole 203, that is, the sealing ring 3073 surrounds the outside of the functional hole 203. This arrangement can improve the sealing between the third supporting layer 307 and the housing 20, thereby improving the waterproof performance of the electronic device in a deep water environment, that is, improving the ability of the electronic device to withstand water pressure and increasing the water depth of the electronic device. Fig.16 The waterproof assembly 30 shown is capable of withstanding a water pressure of up to 1 MPa (about 10 atm) for the electronic device, that is, the electronic device can be used in water at a depth of up to 100 meters.

[0207] It can be understood that an annular groove 3074 can be provided on the inner surface 201 (i.e., the first groove bottom 2051), the sealing ring 3073 is provided in the annular groove 3074, and part of the sealing ring 3073 extends out of the annular groove 3074, and one end of the third supporting layer 307 facing the inner surface 201 (i.e., the first groove bottom 2051) contacts the sealing ring 3073 located outside the annular groove 3074. Of course, annular grooves 3074 can also be provided on both the inner surface 201 and one end of the third supporting layer 307 facing the inner surface 201 (i.e., the first groove bottom 2051), and accordingly, part of the sealing ring 3073 is located in the annular groove 3074 on the inner surface 201 (i.e., the first groove bottom 2051), and the rest of the sealing ring 3073 is located in the annular groove 3074 on the third supporting layer 307.

[0208] Continue to refer to Fig.16 During assembly, the fourth adhesive layer 304 and the second supporting layer 303 can be attached to the buffer layer 305 in sequence, and then the third adhesive layer 302 and the waterproof membrane 301 can be attached to the second supporting layer 303 in sequence to form a pre-installed component. After that, the component is assembled as a whole to the housing 20, which simplifies the difficulty of assembling the electronic device.

[0209] Continue to refer to Fig.16 The third adhesive layer 302 can be a waterproof adhesive. Since there is a gap 3072 between the waterproof membrane 301 and the first groove bottom 2051, during assembly, it is only necessary to activate the third adhesive layer 302. During use, water pressure will act on the waterproof membrane 301, thereby squeezing the third adhesive layer 302, and automatically achieving bonding between the waterproof membrane 301 and the second supporting layer 303.

[0210] Please refer to Fig.17 The waterproof component 30 in this scenario may also include an auxiliary support layer 3032, which is disposed between the third support layer 307 and the housing 20 (i.e., the first groove bottom 2051), and the auxiliary support layer 3032 is provided with a plurality of second holes 3033 at intervals in the region facing the functional hole 203, so that sound waves can pass through the auxiliary support layer 3032 through the second holes 3033. In this configuration, the waterproof membrane 301 is sandwiched between the second support layer 303 and the auxiliary support layer 3032, which can improve the support effect on the waterproof membrane 301.

[0211] Correspondingly, the gap 3072 is located between the waterproof membrane 301 and the auxiliary supporting layer 3032 to prevent the waterproof membrane 301 from contacting the auxiliary supporting layer 3032, thereby preventing the waterproof membrane 301 from being stressed and wrinkled.

[0212] It can be understood that the functional hole 203 can be located within the projection of the area where the second hole 3033 is set on the shell 20, or the functional hole 203 completely overlaps with the projection of the area where the second hole 3033 is set on the shell 20, so that the area where the second hole 3033 is set faces the functional hole 203.

[0213] In the above implementation, the auxiliary support layer 3032 can be an integral structure with the third support layer 307 , and the integral structure is formed by stamping or injection molding, which can simplify the structure of the waterproof component 30 and facilitate the installation of the waterproof component 30 .

[0214] Continue to refer to Fig.17 , a seventh adhesive layer 3034 may be provided between the auxiliary support layer 3032 and the inner surface 201 (i.e., the first groove bottom 2051), and correspondingly, a tenth through hole 3035 communicating with the functional hole 203 is provided on the seventh adhesive layer 3034. It can be understood that the functional hole 203 may be located within the projection of the tenth through hole 3035 on the inner surface 201, or the projections of the functional hole 203 and the tenth through hole 3035 on the inner surface 201 completely overlap. In this way, the auxiliary support layer 3032 may be fixed to the housing 20 through the seventh adhesive layer 3034, thereby achieving the fixing of the waterproof component 30; and at the same time, the sealing between the auxiliary support layer 3032 and the housing 20 may also be achieved.

[0215] Continue to refer to Fig.17 , a sixth adhesive layer 3023 is arranged between the third supporting layer 307 and the second supporting layer 303, a ninth through hole 3024 is arranged on the sixth adhesive layer 3023, the waterproof membrane 301 can be flush with the surface of the third supporting layer 307 away from the inner surface 201, the third adhesive layer 302 is located in the ninth through hole 3024, and the third adhesive layer 302 is bonded to the hole wall of the ninth through hole 3024. In this way, the connection between the third supporting layer 307 and the second supporting layer 303 can be achieved through the sixth adhesive layer 3023, and when the pre-pressure is applied through the buffer layer 305, the sixth adhesive layer 3023 located between the second supporting layer 303 and the third supporting layer 307 is stressed, and the third adhesive layer 302 is not stressed at this time, so that the third adhesive layer 302 and the waterproof membrane 301 on the third adhesive layer 302 are prevented from being stressed and wrinkled; at the same time, the third adhesive layer 302 is bonded with the sixth adhesive layer 3023, which can improve the sealing between the third supporting layer 307 and the second supporting layer 303.

[0216] Of course, in other implementations, the waterproof membrane 301 may also partially protrude outside the accommodating channel 3071, and this embodiment does not limit this.

[0217] Continue to refer to Fig.17During assembly, the fourth adhesive layer 304, the second supporting layer 303, the sixth adhesive layer 3023, the third adhesive layer 302, the waterproof membrane 301, the third supporting layer 307, and the seventh adhesive layer 3034 can be sequentially attached to the buffer layer 305 to form a pre-installed component, and then the component is assembled to the housing 20 as a whole, which simplifies the assembly difficulty of the electronic device. In addition, the pre-installed component can also be transported separately to realize the modularization of the electronic device.

[0218] For example, using Fig.17 The waterproof assembly 30 shown is capable of withstanding a water pressure of up to 1 MPa (about 10 atm) for the electronic device, that is, the electronic device can be used in water at a depth of up to 100 meters.

[0219] Continue to refer to Fig.17 The third adhesive layer 302 can be a waterproof adhesive. Since there is a gap 3072 between the waterproof membrane 301 and the auxiliary supporting layer 3032, during assembly, it is only necessary to activate the third adhesive layer 302. During use, water pressure will act on the waterproof membrane 301, thereby squeezing the third adhesive layer 302, and automatically achieving bonding between the waterproof membrane 301 and the second supporting layer 303.

[0220] Continue to refer to Figure 15-17 In this scenario, the waterproof component 30 further includes a protective layer 308, which is disposed on the surface of the waterproof membrane 301 facing the inner surface 201 (i.e., the first groove bottom 2051), and is provided with a via hole 3081 connected to the functional hole 203. It is understood that the functional hole 203 may be located within the projection of the via hole 3081 on the inner surface 201, or the functional hole 203 and the projection of the via hole 3081 on the inner surface 201 completely overlap.

[0221] Accordingly, the gap 3072 is located between the protective layer 308 and the inner surface 201 (i.e., the first groove bottom 2051). With such a configuration, under the action of water pressure, the protective layer 308 can make the force on the waterproof membrane 301 more uniform to avoid wrinkles; in addition, the protective layer 308 can play a certain supporting role to prevent the edge of the waterproof membrane 301 from warping. Exemplarily, the material of the protective layer 308 may include polyethylene glycol terephthalate (PET for short) and the like.

[0222] Scene 3

[0223] Please refer to Fig.18The difference between this scenario and scenario one and scenario two is that the setting position of the waterproof component 30 is different. The waterproof component 30 can be set on the outer surface 202. The corresponding waterproof component 30 needs to be located between the shell 20 and the filter device 10 to prevent impurities such as particulate matter in the water from contacting the waterproof component 30.

[0224] Continue to refer to Fig.18 The housing 20 is provided with a second receiving groove 207, and the second groove bottom 2071 of the corresponding second receiving groove 207 and the second shell wall 2021 outside the receiving groove 205 constitute the outer surface 202. The waterproof component 30 can be arranged in the receiving groove 205 to improve the compactness of the electronic device and reduce the volume of the electronic device.

[0225] The waterproof assembly 30 includes: a third adhesive layer 302, a waterproof membrane 301 and a protective layer 308 which are stacked in a direction away from the outer surface 202 (i.e., the second groove bottom 2071), a fifth through hole 3021 which is connected to the functional hole 203 is provided on the third adhesive layer 302, and a through hole 3081 which is connected to the functional hole 203 is provided on the protective layer 308. In this way, the waterproof membrane 301 is fixed on the housing 20 through the third adhesive layer 302, and the sealing between the waterproof membrane 301 and the housing 20 can be achieved. In addition, when in use, the water pressure acts on the protective layer 308, and then acts on the third adhesive layer 302, which can further improve the sealing between the waterproof membrane 301 and the housing 20; therefore, during the assembly process, the waterproof membrane 301 can be installed without applying pre-pressure, or a small pre-pressure can be applied to the waterproof membrane 301, so as to avoid wrinkles caused by excessive force on the waterproof membrane 301.

[0226] In the above implementation, the protective layer 308 can make the force on the waterproof membrane 301 more uniform to avoid wrinkles caused by uneven force. In addition, the protective layer 308 can play a certain supporting role to prevent the edge of the waterproof membrane 301 from warping.

[0227] It can be understood that the center lines of the via hole 3081 and the fifth through hole 3021 can be arranged colinearly with the center line of the functional hole 203, and the functional hole 203 can be located within the projection of the via hole 3081 and the fifth through hole 3021 on the second groove bottom 2071, or the functional hole 203 completely overlaps with the projection of the via hole 3081 and the fifth through hole 3021 on the second groove bottom 2071.

[0228] Please refer to Fig.19The waterproof component 30 further includes a second supporting layer 303, which is disposed between the third adhesive layer 302 and the outer surface 202. The second supporting layer 303 is provided with a plurality of first holes 3031 at intervals in the region facing the functional hole 203. The second supporting layer 303 can support the waterproof membrane 30. It is understood that an adhesive layer (not shown) can be provided between the second supporting layer 303 and the outer surface 202 to achieve the fixation of the second supporting layer 303 and the sealing between the second supporting layer 303 and the outer surface 202.

[0229] In the electronic device provided in this embodiment, the first filter layer 101 in the filter device 10 is arranged outside the outer surface 202 of the housing 20, and a plurality of first meshes are arranged at intervals on the first filter layer 101. The second filter layer 102 is arranged between the outer surface 202 and the first filter layer 101, and a plurality of second meshes are arranged at intervals on the second filter layer 102, and the first filter layer 101 and the second filter layer 102 both cover the functional hole 203 on the housing 20. In this way, when entering the water, the first filter layer 101 and the second filter layer 102 can filter the water entering the functional hole 203 to prevent impurities such as particles in the liquid from entering the functional hole 203; especially in a deep water environment, impurities such as particles can be prevented from damaging the waterproof membrane 301 of the waterproof component 30, thereby improving the waterproof performance of the electronic device in a deep water environment, that is, improving the ability of the electronic device to withstand water pressure, and increasing the water depth of use of the electronic device.

[0230] It should be noted that in the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or an integral connection; it can also be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0231] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A filtering device, used to be arranged on an electronic device, the electronic device comprising a housing and a waterproof component, characterized in that: The filtering device comprises: A first filter layer, the first filter layer is located outside the shell, and the first filter layer covers the functional hole, and a plurality of first mesh holes are arranged at intervals on the first filter layer; wherein the functional hole is arranged on the shell and passes through the inner surface of the shell and the outer surface opposite to the inner surface; A second filter layer, the second filter layer is located between the housing and the first filter layer, and the second filter layer covers the functional hole, and a plurality of second mesh holes are arranged at intervals on the second filter layer; In a cross section parallel to the first filter layer, the cross-sectional area of ​​the first mesh is greater than the cross-sectional area of ​​the second mesh; The filtering device is used to filter the liquid flowing toward the waterproof component; wherein the waterproof component is used to block the functional hole and prevent the liquid from passing through the filtering device.

2. The filtering device according to claim 1, characterized in that: There are a plurality of second filter layers, and the plurality of second filter layers are stacked; along a direction away from the housing, in a cross section parallel to the first filter layer, the cross-sectional area of ​​the second mesh on each second filter layer gradually increases.

3. The filtering device according to claim 2, characterized in that: The filtering device also includes: The first bonding layer is arranged between the first filter layer and the second filter layer adjacent thereto, and between adjacent second filter layers, and the first bonding layer is provided with a first through hole communicating with the functional hole.

4. The filtering device according to claim 1, characterized in that: The filtering device also includes: The first supporting layer is arranged between the second filtering layer and the shell, and the first supporting layer is in contact with the shell; the first supporting layer is provided with a second through hole communicating with the functional hole.

5. The filtering device according to claim 1, characterized in that: The first filter layer is a rigid filter layer.

6. The filtering device according to claim 5, characterized in that: There are two second filter layers, which are stacked, and the first filter layer is located between the two second filter layers. In the direction away from the shell, in the cross section parallel to the first filter layer, the cross-sectional area of ​​the second mesh on each second filter layer gradually increases.

7. The filtering device according to claim 6, characterized in that: The filtering device also includes: A first bonding layer is provided between the first filter layer and the second filter layer, and a first through hole communicating with the functional hole is provided on the first bonding layer.

8. The filtering device according to claim 1, characterized in that: The filtering device also includes: a cover plate, wherein the cover plate covers the shell, the first filter layer and the second filter layer are located between the cover plate and the shell, and a third through hole communicating with the functional hole is provided on the cover plate; The cover plate is connected to the shell.

9. The filtering device according to claim 8, characterized in that: The filtering device also includes: A second bonding layer, wherein the second bonding layer is disposed between the cover plate and the first filter layer, and a fourth through hole communicating with the functional hole is disposed on the second bonding layer.

10. The filtering device according to claim 8, characterized in that: A first groove is arranged on the surface of the cover plate facing the housing, and at least a part of the first filter layer is accommodated in the first groove.

11. The filtering device according to claim 8, characterized in that: The housing is provided with a second groove, and at least a part of the second filter layer is accommodated in the second groove.

12. The filtering device according to any one of claims 1 to 10, characterized in that: The electronic device further comprises a sound module, wherein the sound module is arranged on the inner surface and the sound module is arranged in the functional hole.

13. An electronic device, characterized in that: include: A shell, the shell having an inner surface and an outer surface opposite to the inner surface, and the shell is provided with a functional hole penetrating the inner surface and the outer surface; A waterproof component, the waterproof component is arranged on the functional hole, and the waterproof component is used to prevent liquid from passing through the functional hole; And, the filtering device according to any one of claims 1 to 12.

14. The electronic device according to claim 13, characterized in that: The waterproof component is arranged on the inner surface, and the waterproof component comprises: A waterproof membrane, a third adhesive layer, a second supporting layer and a fourth adhesive layer are stacked in a direction away from the inner surface, the third adhesive layer is provided with a fifth through hole, the fourth adhesive layer is provided with a sixth through hole, and the fifth through hole and the sixth through hole are both connected to the functional hole; A plurality of first holes are arranged at intervals in an area of ​​the second supporting layer facing the functional hole.

15. The electronic device according to claim 14, characterized in that: The waterproof component further includes a buffer layer, which is disposed on a side of the fourth adhesive layer away from the inner surface, and a seventh through hole connected to the functional hole is disposed on the buffer layer.

16. The electronic device according to claim 14, characterized in that: The waterproof component also includes: A fifth bonding layer, wherein the fifth bonding layer is disposed between the waterproof membrane and the inner surface, and an eighth through hole connected to the functional hole is disposed on the fifth bonding layer.

17. The electronic device according to claim 14, characterized in that: The waterproof component also includes: a third supporting layer, the third supporting layer being arranged on the inner surface, and the third supporting layer being provided with a containing channel communicating with the functional hole; The waterproof membrane is accommodated in the accommodating channel, and the edge of the waterproof membrane is in contact with the side wall of the accommodating channel; there is a gap between the waterproof membrane and the inner surface.

18. The electronic device according to claim 17, characterized in that: The second supporting layer is in contact with a surface of the third supporting layer facing away from the inner surface.

19. The electronic device according to claim 18, characterized in that: The third supporting layer includes a silica gel layer.

20. The electronic device according to claim 18, characterized in that The second supporting layer and the third supporting layer are an integral structure.

21. The electronic device according to claim 20, characterized in that: A sealing ring is arranged between the third supporting layer and the shell, and the sealing ring is arranged around the functional hole.

22. The electronic device according to claim 17, characterized in that: The waterproof component also includes: An auxiliary supporting layer is provided between the third supporting layer and the inner surface, and a plurality of second holes are provided at intervals in the area of ​​the auxiliary supporting layer facing the functional hole; the gap is located between the waterproof membrane and the auxiliary supporting layer.

23. The electronic device according to claim 22, characterized in that: The auxiliary supporting layer and the third supporting layer are an integral structure.

24. The electronic device according to claim 22, characterized in that: A sixth bonding layer is disposed between the third supporting layer and the second supporting layer, a ninth through hole is disposed on the sixth bonding layer, the third bonding layer is located in the ninth through hole, and the third bonding layer is bonded to the hole wall of the ninth through hole.

25. The electronic device according to claim 14, characterized in that: The waterproof component also includes: A protective layer is provided on the surface of the waterproof membrane facing the inner surface, and a via hole connected to the functional hole is provided on the protective layer.

26. The electronic device according to claim 13, characterized in that: A first accommodating groove is arranged on the inner surface, and the waterproof component is arranged in the first accommodating groove.

27. The electronic device according to claim 13, characterized in that: The waterproof component is arranged on the housing, and the waterproof component comprises: A third adhesive layer, a waterproof membrane and a protective layer are stacked in a direction away from the shell, the third adhesive layer is provided with a fifth through hole connected to the functional hole, and the protective layer is provided with a via hole facing the functional hole.

28. The electronic device according to claim 27, characterized in that: The waterproof component further includes a second supporting layer, which is disposed between the third adhesive layer and the shell, and a plurality of first holes are spaced apart in an area of ​​the second supporting layer facing the functional hole.

29. The electronic device according to claim 27, characterized in that: The housing is provided with a second accommodating groove, and the waterproof component is arranged in the second accommodating groove.

30. The electronic device according to claim 13, characterized in that: The electronic device further comprises a sound module, wherein the sound module is arranged on the inner surface and the sound module is arranged in the functional hole.

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