A heat dissipation component for an optical module and a communication device

Abstract

This invention discloses an optical module heat dissipation assembly and a communication device, used to improve the heat dissipation efficiency of two optical modules symmetrically arranged on both sides of a printed circuit board. The optical module heat dissipation assembly includes a first heat dissipation end and a second heat dissipation end positioned opposite each other. The first heat dissipation end is connected to a first optical module cage, and the second heat dissipation end is connected to a second optical module cage. The first heat dissipation end includes a plurality of spaced-apart first heat dissipation teeth, and the second heat dissipation end includes a plurality of spaced-apart second heat dissipation teeth. It is evident that heat is conducted between the first and second optical modules through the first and second heat dissipation ends, thereby improving the heat dissipation efficiency of the optical module heat dissipation assembly and effectively preventing stress damage to the assembly, thus extending its service life.

Description

[0001] This application is a divisional application. The original application has the application number 202010506635.4 and the original application date is June 5, 2020. The entire contents of the original application are incorporated herein by reference. Technical Field

[0002] This application relates to the field of optical communication, and more particularly to an optical module heat dissipation component and a communication device. Background Technology

[0003] In communication equipment with high reliability requirements, optical modules are one of the key components. As communication continues to evolve towards higher speeds, larger bandwidths, and larger volumes, optical modules are constantly developing towards higher density, clustering, and higher heat generation per module. As a result, the heat dissipation problem of optical modules is becoming increasingly difficult to solve.

[0004] In scenarios where there are many optical modules and they cannot be fully placed on one side of a printed circuit board (PCB), the optical modules will be symmetrically arranged on both sides of the PCB. If there is a large temperature difference between two optical modules symmetrically arranged on both sides of the PCB, the optical module on the side with a higher temperature will become the bottleneck for heat dissipation of the entire communication device, while the optical module on the other side still has heat dissipation margin.

[0005] It is evident that the heat dissipation solutions provided by existing technologies for optical modules have low heat dissipation efficiency for two optical modules symmetrically arranged on both sides of the PCB. Summary of the Invention

[0006] This application provides an optical module heat dissipation assembly and a communication device, which are used to improve the heat dissipation efficiency of two optical modules symmetrically arranged on both sides of a PCB, and effectively improve the service life of the optical module heat dissipation assembly.

[0007] In a first aspect, this application provides an optical module heat dissipation assembly, including a printed circuit board, and a first optical module cage and a second optical module cage located on both sides of the printed circuit board. The first optical module cage is used to accommodate a first optical module, and the second optical module cage is used to accommodate a second optical module. The optical module heat dissipation assembly further includes a first heat dissipation end and a second heat dissipation end positioned opposite each other. The first heat dissipation end is attached to the first optical module cage, and the second heat dissipation end is attached to the second optical module cage. If the temperature of the first optical module is higher than that of the second optical module, the first optical module is used to transfer heat to the second optical module sequentially through the first heat dissipation end and the second heat dissipation end. If the temperature of the second optical module is higher than that of the first optical module, the second optical module conducts heat to the first optical module sequentially through the second heat dissipation end and the first heat dissipation end. The first heat dissipation end includes a plurality of first heat dissipation teeth spaced apart, with a first gap between two adjacent first heat dissipation teeth. The first heat dissipation teeth are deformed within the first gap under the pressure of the first heat dissipation end. The second heat dissipation end includes a plurality of second heat dissipation teeth spaced apart, with a second gap between two adjacent second heat dissipation teeth. The second heat dissipation teeth are deformed within the second gap under the pressure of the second heat dissipation end.

[0008] As can be seen, heat is conducted between the first and second optical modules through the first and second heat dissipation ends. This allows for heat dissipation even when there is a temperature difference between the first and second optical modules, thus ensuring sufficient heat dissipation for both modules and improving the heat dissipation efficiency of the optical module heat dissipation component. Furthermore, the interconnected heat dissipation between the first and second optical modules improves the uniformity of heat dissipation, enhancing the reliability of the optical modules and extending their service life. Moreover, the stress at the first heat dissipation end can be fully released within the first gap, effectively preventing potential damage to the first optical module cage. Similarly, the stress at the second heat dissipation end can be fully released within the second gap, effectively preventing potential damage to the second optical module cage. This significantly improves the safety and service life of both the first and second optical module cages. Furthermore, the use of multiple first heat dissipation teeth and multiple second heat dissipation teeth effectively avoids heat conduction between the first heat dissipation end and the second heat dissipation end through air with a relatively high thermal resistance, effectively reducing the thermal resistance between the first heat dissipation end and the second heat dissipation end. Moreover, during the deformation process of the first heat dissipation teeth and the second heat dissipation teeth, the contact area between the first heat dissipation teeth and the first heat dissipation end, as well as the contact area between the second heat dissipation teeth and the second heat dissipation end, is increased, which is more conducive to the heat conduction between the first heat dissipation end and the second heat dissipation end, thus improving the heat dissipation efficiency.

[0009] In conjunction with the first aspect, in an optional implementation, both the first heat dissipation end and the second heat dissipation end are made of thermally conductive material. The end face of the first optical module cage facing the printed circuit board is attached to the first heat dissipation end, and the end face of the second optical module cage facing the printed circuit board is attached to the second heat dissipation end. The printed circuit board includes a window that extends through the printed circuit board in a direction perpendicular to the printed circuit board. Both the first heat dissipation end and the second heat dissipation end are inserted into the window, and the first heat dissipation end and the second heat dissipation end are positioned opposite each other in a direction perpendicular to the printed circuit board.

[0010] As can be seen, both the first heat dissipation end and the second heat dissipation end are inserted into the opening of the printed circuit board, thereby effectively achieving the alignment between the first heat dissipation end and the second heat dissipation end. This avoids the situation where the positions of the first heat dissipation end and the second heat dissipation end are misaligned, which would prevent the first heat dissipation end and the second heat dissipation end from achieving mutual heat dissipation performance.

[0011] In conjunction with the first aspect, in an optional implementation, a first elastic element made of thermally conductive material is disposed inside the first optical module cage. The first elastic element is located between the first optical module and the first heat dissipation end, and the first elastic element in a compressed state is simultaneously attached to the first optical module and the first heat dissipation end. A second elastic element made of thermally conductive material is disposed inside the second optical module cage. The second elastic element is located between the second optical module and the second heat dissipation end, and the second elastic element in a compressed state is simultaneously attached to the second optical module and the second heat dissipation end.

[0012] As can be seen, the first elastic element is tightly fitted to both the first heat dissipation end and the first optical module. The first optical module can then conduct heat to the first heat dissipation end through the first elastic element. Because the conduction process is carried out through the first elastic element made of thermally conductive material, the drawback of heat from the first optical module being conducted to the first heat dissipation end through air with high thermal resistance is avoided, thus effectively reducing the thermal resistance during the heat conduction process from the first optical module to the first heat dissipation end. For a detailed explanation of the beneficial effects of using the second elastic element, please refer to the description of the first elastic element; further details will not be repeated here.

[0013] In conjunction with the first aspect, in one optional implementation, the first elastic member includes a first fixed end and a first elastic end connected to each other, the first fixed end being fixedly connected to the end face of the first heat dissipation end facing the first optical module, and the first elastic end extending between the first heat dissipation end and the first optical module; the second elastic member includes a second fixed end and a second elastic end connected to each other, the second fixed end being fixedly connected to the end face of the second heat dissipation end facing the second optical module, and the second elastic end extending between the second heat dissipation end and the second optical module.

[0014] As can be seen, the first fixed end is fixedly connected to the end face of the first heat dissipation end facing the first optical module. This first fixed end effectively ensures the stability of the structure between the first elastic member and the first optical module cage, preventing the first elastic member from detaching from the first optical module cage. The first elastic end extends between the first heat dissipation end and the first optical module, and can freely deform under pressure. This allows the heat from the first optical module to be conducted to the first heat dissipation end when the first elastic end deforms, with low thermal resistance during the conduction process. For a detailed explanation of the beneficial effects of using the second elastic member, please refer to the description of the first elastic member; further details will not be repeated here.

[0015] In conjunction with the first aspect, in an optional implementation, the optical module heat dissipation assembly further includes a thermally conductive intermediate component made of a thermally conductive material, the thermally conductive intermediate component being located between the first heat dissipation end and the second heat dissipation end, and both sides of the thermally conductive intermediate component being in contact with the first heat dissipation end and the second heat dissipation end.

[0016] As can be seen, heat is conducted between the first heat dissipation end and the second heat dissipation end through a thermally conductive intermediate component, which reduces the thermal resistance during heat conduction between the first heat dissipation end and the second heat dissipation end, avoids heat conduction between the first heat dissipation end and the second heat dissipation end through air with high thermal resistance, and improves the efficiency of heat conduction between the first heat dissipation end and the second heat dissipation end.

[0017] In conjunction with the first aspect, in one optional implementation, the first optical module cage is connected to a first heat sink, the second optical module cage is connected to a second heat sink, and the first optical module is used to dissipate heat through a first heat dissipation path and a second heat dissipation path. The first heat dissipation path is that the first optical module dissipates heat through the first heat sink. If the temperature of the first optical module is higher than that of the second optical module, then the second heat dissipation path is that the first optical module dissipates heat sequentially through the first optical module cage, the first heat dissipation end, the second heat dissipation end, the second optical module cage, the second optical module, and the second heat sink.

[0018] It is evident that by using the first and second heat dissipation paths to dissipate heat from the first optical module, the heat dissipation efficiency of the first optical module is effectively improved, and the heat dissipation margin of the second heat sink can also be effectively utilized to dissipate heat from the first optical module. This achieves balanced heat dissipation between the first and second optical modules even when there is a temperature difference between them.

[0019] In conjunction with the first aspect, in one optional implementation, the first optical module cage is connected to a first heat sink, the second optical module cage is connected to a second heat sink, and the second optical module is used for heat dissipation through a third heat dissipation path and a fourth heat dissipation path. The third heat dissipation path is that the second optical module dissipates heat through the second heat sink. If the temperature of the second optical module is higher than that of the first optical module, the fourth heat dissipation path is that the second optical module dissipates heat sequentially through the second optical module cage, the second heat dissipation end, the first heat dissipation end, the first optical module cage, the first optical module, and the first heat sink.

[0020] It is evident that by using the third and fourth heat dissipation paths to cool the second optical module, the heat dissipation efficiency of the second optical module is effectively improved, and the heat dissipation margin of the first heat sink can also be effectively utilized to cool the second optical module, thus achieving balanced heat dissipation between the first and second optical modules even when there is a temperature difference between them.

[0021] In conjunction with the first aspect, in an optional implementation, there is a first space and a second space between the first optical module cage and the second optical module cage, the first space being used to house the printed circuit board; the optical module heat dissipation assembly further includes a first interconnecting heat dissipation component made of thermally conductive material, the first interconnecting heat dissipation component being located within the second space, a first end of the first interconnecting heat dissipation component being attached to the first optical module cage, and a second end of the first interconnecting heat dissipation component being attached to the second optical module cage.

[0022] It is evident that the first optical module and the second optical module can also achieve heat dissipation between the first optical module and the second optical module through the first interconnecting heat dissipation component, thereby further improving heat dissipation efficiency.

[0023] In conjunction with the first aspect, in one optional implementation, the first optical module cage has a bottom shell and a first outer shell, the first outer shell being fastened to the bottom shell to form a receiving space for accommodating the first optical module between the first outer shell and the bottom shell, the bottom shell being disposed towards the printed circuit board; the second optical module cage has a top shell and a second outer shell, the second outer shell being fastened to the top shell to form a receiving space for accommodating the second optical module between the second outer shell and the top shell, the top shell being disposed towards the printed circuit board; the optical module heat dissipation assembly further includes a second interconnecting heat dissipation component made of thermally conductive material, a first end of the second interconnecting heat dissipation component being attached to the first outer shell, and a second end of the second interconnecting heat dissipation component being attached to the second outer shell.

[0024] It is evident that the first optical module and the second optical module can also achieve heat dissipation between the first optical module and the second optical module through the second interconnecting heat dissipation component, thereby further improving heat dissipation efficiency.

[0025] In a second aspect, this application provides a communication device, including a cabinet, wherein the cabinet includes at least one optical module heat dissipation component as described in any of the first aspects above. Attached Figure Description

[0026] Figure 1 Example diagram of the side structure of a communication device provided by the prior art;

[0027] Figure 2 This is a side cross-sectional view of an embodiment of the optical module heat dissipation assembly provided in this application.

[0028] Figure 3 An example diagram of an overall structure of the first optical module cage provided in this application;

[0029] Figure 4 A partial structural example of the optical module heat dissipation assembly provided in this application;

[0030] Figure 5 Another example diagram of the overall structure of the first optical module cage provided in this application;

[0031] Figure 6 Example diagram of the bottom structure of the first optical module cage provided in this application;

[0032] Figure 7 Example of a side cross-sectional view of the first optical module cage provided in this application;

[0033] Figure 8 This is a side cross-sectional view of another embodiment of the optical module heat dissipation assembly provided in this application. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such uses of components can be interchanged where appropriate so that the embodiments described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0036] This application provides a heat dissipation component for an optical module, which is used to dissipate heat from the optical module. For better understanding, the following describes the process in conjunction with... Figure 1 The diagram illustrates, exemplarily, the structure of a communication device in which the optical module heat dissipation assembly is applied. Figure 1 Example diagram of the side structure of a communication device provided by the prior art.

[0037] To adapt to the continuous evolution of communication equipment towards higher speeds, larger bandwidths, and higher throughput, communication equipment needs to integrate as many optical modules as possible. An optical module is an integrated module that converts optical signals into electrical signals and / or electrical signals into optical signals, playing a crucial role in optical communication. Optical modules generate a significant amount of heat during operation, and the lasers used to generate or receive optical signals within the module have relatively strict temperature requirements. To ensure normal optical communication, the heat generated by the optical module needs to be dissipated promptly.

[0038] like Figure 1 As shown, the communication device includes a PCB100. To integrate more optical modules, the communication device can symmetrically arrange two optical modules on two sides of the PCB100. That is, a first optical module cage 101 is arranged on the first side of the PCB100, and a second optical module cage 102 is arranged on the second side of the PCB100, so that the first optical module cage 101 and the second optical module cage 102 are symmetrical about the PCB100.

[0039] Specifically, the first optical module cage 101 is used to house the first optical module. The first optical module cage 101 is connected to the first heat sink 104 via a flexible heat pipe 103, so that the first optical module conducts heat to the first heat sink 104 sequentially through the first optical module cage 101 and the flexible heat pipe 103, and the first heat sink 104 can dissipate the acquired heat. The second optical module cage 102 is used to house the second optical module. The second optical module cage 102 is connected to the second heat sink 106 via a flexible heat pipe 105, so that the second optical module conducts heat to the second heat sink 106 sequentially through the second optical module cage 102 and the flexible heat pipe 105, and the second heat sink 106 can dissipate the acquired heat.

[0040] Figure 1 The illustration only shows two optical modules symmetrically arranged on both sides of PCB100; the arrangement of other optical modules included in the communication equipment is not described in detail. It can be seen that... Figure 1 The communication device shown can effectively increase the number of optical modules installed on the communication device by symmetrically arranging optical modules on both sides of PCB100, thereby achieving a high-density layout of optical modules on PCB100 and increasing the service capacity of the communication device.

[0041] However, the heat dissipation paths of the optical modules symmetrically arranged on both sides of PCB100 are isolated from each other, such as... Figure 1 The first optical module shown dissipates heat solely by conducting heat to the first heat sink 104, while the second optical module dissipates heat solely by conducting heat to the second heat sink 106. This results in uneven heat dissipation between the optical modules located on both sides of the PCB, as illustrated in the example below:

[0042] For example, in scenarios where there is a significant temperature difference between the first and second optical modules—for instance, the first optical module has a higher temperature while the second optical module has a lower temperature—the disadvantages are as follows: First, the heat dissipation required by the first optical module exceeds the heat dissipation capacity of the first heat sink 104, resulting in the first heat sink 104 being unable to adequately dissipate heat from the first optical module, thus reducing its reliability. Second, the heat dissipation required by the second optical module is less than the heat dissipation capacity of the second heat sink 106, leaving unused heat dissipation capacity in the second heat sink 106, thus reducing its heat dissipation efficiency.

[0043] To solve Figure 1 To address the shortcomings of existing communication equipment in terms of heat dissipation performance, this application provides an optical module heat dissipation assembly. This assembly improves the heat dissipation efficiency of optical modules symmetrically arranged on both sides of a PCB, thereby enhancing the heat dissipation capacity of communication equipment integrating multiple optical modules. The following section first combines... Figure 2The structure of the optical module heat dissipation assembly provided in this embodiment is illustrated below. Figure 2 This is a side view cross-sectional diagram illustrating an embodiment of the optical module heat dissipation assembly provided in this application.

[0044] The optical module heat dissipation assembly 200 shown in this embodiment includes an optical module heat dissipation assembly housing, for example, Figure 2 The optical module heat dissipation component housing shown specifically includes an upper housing 202 and a lower housing 203, and the accommodating space formed between the upper housing 202 and the lower housing 203 is used to accommodate the PCB 201.

[0045] A first optical module cage 210 and a second optical module cage 220 are disposed on both sides of PCB 201, with the first optical module cage 210 located between the upper housing 202 and PCB 201, and the second optical module cage 220 located between the lower housing 203 and PCB 201. The first optical module cage 210 is used to accommodate the first optical module, and the second optical module cage 220 is used to accommodate the second optical module.

[0046] The following combination Figure 2 and Figure 3 The structure of the first optical module cage 210 is illustrated by way of example, wherein, Figure 3 This is an example diagram of an overall structure of the first optical module cage provided in this embodiment.

[0047] The first optical module cage 210 has a first opening 211 on its side away from the PCB 201. This first opening 211 is positioned opposite the upper housing 202. When installing the first optical module, it can be placed inside the first optical module cage 210 through this first opening 211. It should be noted that this embodiment uses the top surface of the first optical module cage 210 as an example for illustration, and is not limited to any particular scenario. In other scenarios, the first opening can be made on the side wall or bottom surface of the first optical module cage 210, as long as the first opening reduces the thermal resistance of the first optical module cage 210. The second optical module cage 220 shown in this embodiment also has a second opening. For a detailed description of the second opening, please refer to the description of the first opening 211; further details will not be repeated here.

[0048] In this embodiment, a first heat sink is provided between the PCB201 and the upper housing 202 for dissipating heat from the first optical module. The specific location of the first heat sink is not limited in this embodiment, as long as the first heat sink can dissipate heat from the first optical module located in the first optical module cage 210.

[0049] The following is an exemplary description of how the first heat sink dissipates heat from the first optical module. In this embodiment, a first heat-conducting element 213 is disposed within the first opening 211. This first heat-conducting element 213 is made of a thermally conductive material, which can be a thermally conductive gel, thermally conductive pad, carbon fiber thermally conductive pad, phase change thermally conductive material, thermally conductive potting compound, thermally conductive silicone grease, or graphite vapor chamber, etc., and is not specifically limited. This embodiment does not limit the thermal conductivity of the thermally conductive material; for example, a thermal conductivity of not less than 330 W / mK, or a thermal conductivity of not less than 180 W / mK, etc.

[0050] In this embodiment, one end of the first heat-conducting element 213 is attached to the first optical module, and the other end is connected to the first heat sink. Optionally, the first heat-conducting element 213 can be directly connected to the first heat sink. Alternatively, the first heat-conducting element 213 can be indirectly connected to the first heat sink through a flexible heat pipe or the like. The specific connection is not limited in this embodiment, as long as the first heat-conducting element 213 can obtain heat from the first optical module and conduct that heat to the first heat sink. The optical module heat dissipation assembly shown in this embodiment also includes a second heat sink, which is used to dissipate heat from the second optical module. For a detailed description of the second heat sink, please refer to the description of the first heat sink dissipating heat from the first optical module; further details are omitted here.

[0051] In this embodiment, to improve the heat dissipation efficiency of the optical modules symmetrically arranged on both sides of PCB201, the following is combined with... Figure 2 and Figure 4 As shown, where, Figure 4 This is a partial structural example of the optical module heat dissipation assembly provided in this embodiment. In this embodiment, a window 204 is provided through the PCB 201, and the window 204 is along a direction perpendicular to the PCB 201 (e.g., ...). Figure 4 (The arrow direction shown) extends the settings.

[0052] Combination Figure 2 , Figure 5 and Figure 6 As shown in the figure, in this embodiment, the end face of the first optical module cage 210 facing the PCB 201 is fitted with a first heat dissipation end 214 made of thermally conductive material. Optionally, the fitting arrangement shown in this embodiment may refer to welding the first heat dissipation end 214 to the end face of the first optical module cage 210 facing the PCB 201. It can be seen that in this case, the first heat dissipation end 214 and the first optical module cage 210 are fixedly connected. Alternatively, the fitting arrangement shown in this embodiment may also refer to the first heat dissipation end 214 and the first optical module cage 210 being two independent components, with the first heat dissipation end 214 achieving fitting between the first optical module cages 210 under pressure (e.g., pressure from the first optical module cage 210).

[0053] In this embodiment, the second optical module cage 220 is fitted with a second heat dissipation end 221 on the end face facing the PCB 201. For a detailed description of the bonding device between the second optical module cage 220 and the second heat dissipation end 221, please refer to the description of the bonding device between the first heat dissipation end 214 and the first optical module cage 210, which will not be repeated here.

[0054] The first heat dissipation end 214 extends in a direction perpendicular to the PCB 201 and is inserted into the window 204. The second heat dissipation end 221 extends in a direction perpendicular to the PCB 201 and is inserted into the window 204. As can be seen from the diagram of the first heat dissipation end 214 and the second heat dissipation end 221, within the window 204, the first heat dissipation end 214 and the second heat dissipation end 221 are positioned opposite each other in a direction perpendicular to the PCB 201.

[0055] With the first heat dissipation end 214 and the second heat dissipation end 221 inserted into the window 204, the alignment between the first heat dissipation end 214 and the second heat dissipation end 221 is effectively achieved, avoiding the situation where the positions of the first heat dissipation end 214 and the second heat dissipation end 221 are misaligned, which would result in the first heat dissipation end 214 and the second heat dissipation end 221 being unable to achieve heat dissipation performance through communication.

[0056] In this embodiment, the first optical module can be cooled not only by the first heat sink but also by the second optical module, and the second optical module can be cooled not only by the second heat sink but also by the first optical module. That is, the mutual heat dissipation between the first optical module and the second optical module is achieved based on the first heat dissipation end 214 and the second heat dissipation end 221. The process of mutual heat dissipation between the first optical module and the second optical module is described below:

[0057] First, the heat dissipation path of the first optical module will be explained:

[0058] The first optical module shown in this embodiment has two heat dissipation paths, namely the first heat dissipation path and the second heat dissipation path. The first heat dissipation path is as follows: the first optical module conducts heat to the first heat sink through the first heat conductor 213, and the first heat sink can dissipate heat from the first optical module.

[0059] The first optical module shown in this embodiment can also dissipate heat through a second heat dissipation path. The prerequisites for the second heat dissipation path are explained below:

[0060] Prerequisites: The temperature difference between the first optical module and the second optical module is relatively large, and the temperature of the first optical module is higher than that of the second optical module. If the first optical module is cooled only through the first heat dissipation path, it will result in insufficient heat dissipation of the first optical module and insufficient utilization of the heat dissipation margin of the second heat sink. However, the first optical module shown in this embodiment can be cooled not only through the first heat dissipation path but also through the second heat dissipation path, thereby effectively ensuring sufficient heat dissipation of the first optical module and improving the heat dissipation efficiency of cooling the optical module.

[0061] The second heat dissipation path is as follows: the first optical module is used to conduct the heat to be dissipated by the first optical module to the second heat sink via the first optical module cage 210, the first heat dissipation end 214, the second heat dissipation end 221, the second optical module cage 220 and the second optical module in sequence, so that the second heat sink can dissipate the heat from the first optical module.

[0062] As can be seen, in this embodiment, when the temperature of the first optical module is higher than that of the second optical module, the first optical module can dissipate heat through the first heat sink. It can also conduct heat to the second heat sink through the first heat dissipation end 214 and the second heat dissipation end 221, which are located opposite each other within the window 204, for heat dissipation. By dissipating heat through the first heat dissipation path and the second heat dissipation path, the heat dissipation efficiency of the first optical module is effectively improved, and the heat dissipation margin of the second heat sink can also be effectively utilized to dissipate heat from the first optical module. This achieves balanced heat dissipation between the first optical module and the second optical module when there is a temperature difference between them.

[0063] Secondly, the heat dissipation path of the second optical module will be explained:

[0064] The second optical module shown in this embodiment has two heat dissipation paths, namely the third heat dissipation path and the fourth heat dissipation path. The third heat dissipation path is as follows: the second optical module conducts heat to the second heat sink through the second heat conductor, and the second heat sink can dissipate heat from the second optical module. For a detailed description of the second heat conductor, please refer to the description of the first heat conductor 213 shown above, which will not be repeated here.

[0065] The second optical module shown in this embodiment can also dissipate heat through a fourth heat dissipation path. The prerequisites for the fourth heat dissipation path are explained below:

[0066] Prerequisites: The temperature difference between the first optical module and the second optical module is relatively large, and the temperature of the second optical module is higher than that of the first optical module. In this case, if the second optical module is only cooled through the third heat dissipation path, it will result in insufficient heat dissipation of the second optical module and insufficient utilization of the heat dissipation margin of the first heat sink. However, the second optical module shown in this embodiment can not only be cooled through the third heat dissipation path, but also through the fourth heat dissipation path, thereby effectively ensuring sufficient heat dissipation of the first optical module. The fourth heat dissipation path is as follows: the second optical module is used to conduct the heat to be dissipated by the second optical module to the first heat sink in sequence through the second optical module cage 220, the second heat dissipation end 221, the first heat dissipation end 214, the first optical module cage 210, and the first optical module.

[0067] As can be seen, in this embodiment, when the temperature of the second optical module is higher than that of the first optical module, the second optical module can dissipate heat through the second heat sink. It can also conduct heat to the first heat sink for heat dissipation through the first heat dissipation end 214 and the second heat dissipation end 221, which are located opposite each other within the window 204. The second optical module is also dissipated through the third and fourth heat dissipation paths. This not only effectively improves the heat dissipation efficiency of the second optical module, but also effectively utilizes the heat dissipation margin of the first heat sink to dissipate heat from the second optical module. This achieves balanced heat dissipation between the first and second optical modules when there is a temperature difference between them.

[0068] The first heat dissipation end 214 and the second heat dissipation end 221 shown in this embodiment can also fully release stress, effectively avoid damage to the components included in the optical module heat dissipation assembly caused by stress, and can also effectively improve heat dissipation efficiency. The following is a detailed explanation:

[0069] Combination Figure 2 as well as Figure 5 As shown, the first heat dissipation end 214 includes a plurality of first heat dissipation teeth 215 spaced apart. In this embodiment, the plurality of first heat dissipation teeth 215 extend into the opening 204. It can be seen that the ends of each first heat dissipation tooth 215 are opposite to the second heat dissipation end 221. In this embodiment, the specific shape of the first heat dissipation tooth 215 is not limited. For example, each first heat dissipation tooth 215 may be elongated, cylindrical, conical, etc.

[0070] Specifically, among the plurality of first heat dissipation teeth 215 included in the first heat dissipation end 214, there is a first gap 216 between any two adjacent first heat dissipation teeth 215. In this embodiment, the shape and depth of the first gap 216 are not limited. The function of the first gap 216 is explained below:

[0071] First, the first heat dissipation end 214 will be subjected to stress: Specifically, the first heat dissipation end 214 is made of a thermally conductive material with a certain elasticity. When the first optical module cage 210 is installed on the PCB 201, the first optical module cage 210 will apply a force to the first heat dissipation end 214 in the direction of the PCB 201. This force will cause the first heat dissipation end 214 to generate stress, and the direction of the stress is away from the PCB 201.

[0072] Secondly, the drawbacks of applying stress are explained: Specifically, the stress acting on the first optical module cage 210 in a direction away from the PCB 210 increases the likelihood of damage to the first optical module cage 210, for example, as... Figure 5 As shown, the first optical module cage 210 includes pins 217. When the first optical module cage 210 needs to be mounted on the PCB 201, the pins 217 need to be inserted into the PCB 201 to fix the first optical module cage 210 onto the PCB 201. However, under the stress from the first heat dissipation end 214, the pins 217 will be subjected to a force away from the PCB 201. This force can easily damage the pins 217, thereby reducing the structural stability between the first optical module cage 210 and the PCB 201.

[0073] Next, the function of the first heat dissipation tooth 215 will be explained: As can be seen, in order to avoid the possibility of damage to the first optical module cage 210, it is necessary to release the stress generated by the first heat dissipation end 214 as much as possible, so as to avoid the application of stress on the first optical module cage 210 and avoid damage to the devices included in the first optical module cage 210. Therefore, in this embodiment, a plurality of spaced first heat dissipation teeth 215 are provided on the end face of the first heat dissipation end 210 facing the PCB 201. When the first optical module cage 210 is mounted on the PCB 201, the first heat dissipation teeth 215 are subjected to stress by the first optical module cage 210. Under the action of this stress, the first heat dissipation teeth 215 will deform in a direction parallel to the PCB 201. However, because there is a first gap 216 between two adjacent first heat dissipation teeth 215, the first heat dissipation teeth 215 can deform freely within the first gap 216. The first heat dissipation teeth 215 that can deform freely within the first gap 216 will fully release the stress. After the stress of each first heat dissipation tooth 215 is released through the first gap 216, the stress of the first heat dissipation end 214 will not or will be minimally applied to the first optical module cage 210, thereby effectively avoiding damage to the first optical module cage 210.

[0074] The second heat dissipation end 221 shown in this embodiment also includes a plurality of second heat dissipation teeth arranged at intervals. For a description of the second heat dissipation teeth, please refer to the description of the first heat dissipation teeth 215, which will not be repeated here.

[0075] As can be seen, by employing the multiple first heat dissipation teeth 215 and multiple second heat dissipation teeth shown in this embodiment, heat conduction between the first heat dissipation end 214 and the second heat dissipation end 221 through air with a relatively high thermal resistance is effectively avoided, thus effectively reducing the thermal resistance between the first heat dissipation end 214 and the second heat dissipation end 221. Moreover, during the deformation process of the first heat dissipation teeth 215 and the second heat dissipation teeth, the contact area between the first heat dissipation teeth and the first heat dissipation end 214 and the contact area between the second heat dissipation teeth and the second heat dissipation end is increased, which is more conducive to the conduction of heat between the first heat dissipation end 214 and the second heat dissipation end 221 and improves the heat dissipation efficiency.

[0076] To improve the heat dissipation efficiency of the optical module heat dissipation component, it is necessary to reduce the thermal resistance of the optical module heat dissipation component. The following describes several optional methods for reducing the thermal resistance of the optical module heat dissipation component as shown in this embodiment:

[0077] Method 1

[0078] like Figure 2 , Figure 3 as well as Figure 7 As shown, where, Figure 7This is a side cross-sectional view of an embodiment of the first optical module cage provided in this embodiment. A first elastic element 301 made of thermally conductive material is disposed within the first optical module cage 210. The first elastic element 301 is located between the first optical module 302 and the first heat dissipation end 214. The first elastic element 301 achieves a tight fit between the first optical module and the first heat dissipation end 214, thereby effectively reducing the thermal resistance between the first optical module and the first heat dissipation end 214.

[0079] Specifically, this embodiment does not limit the specific shape of the first elastic element 301, as long as the first elastic element 301 has an elastic structure. For example, the first elastic element 301 can be a tongue reed or a spring. When the first optical module 302 is not installed inside the first optical module cage 210 (e.g. Figure 7 As shown on the left), the first elastic element 301 is in a naturally extended state when the first optical module 302 is installed inside the first optical module cage 210 (as shown on the left). Figure 7 As shown on the right), the first elastic element 301 deforms under the pressure of the first optical module 302, thereby compressing the first elastic element 301 and holding it between the first heat dissipation end 214 and the first optical module 302. This allows the first elastic element 301 to be tightly fitted to both the first heat dissipation end 214 and the first optical module 302. The first optical module 302 can then conduct heat to the first heat dissipation end 214 through the first elastic element 301. Since the conduction process is carried out through the first elastic element 301 made of thermally conductive material, the drawback of the heat from the first optical module 302 being conducted to the first heat dissipation end 214 through air with high thermal resistance is avoided, thus effectively reducing the thermal resistance during the process of the first optical module 302 conducting heat to the first heat dissipation end 214.

[0080] This embodiment does not limit the arrangement of the first elastic element 301, as long as the first elastic element 301 is located between the first optical module 302 and the first heat dissipation end 214, for example, such as Figure 7 As shown, the first elastic member 301 includes a first fixed end 303 and a first elastic end 304 connected to each other. The first fixed end 303 is welded to the end face of the first heat dissipation end 214 facing the first optical module 302. The first fixed end 303 effectively ensures the stability of the structure between the first elastic member 301 and the first optical module cage 210, and prevents the first elastic member 301 from detaching from the first optical module cage 210. The first elastic end 304 extends between the first heat dissipation end 214 and the first optical module 302, and the first elastic end 304 can deform freely under pressure, so that when the first elastic end 304 deforms, the heat of the first optical module 302 can be conducted to the first heat dissipation end 214.

[0081] The second optical module cage 220 shown in this embodiment includes a second elastic element. For a detailed description of the second elastic element, please refer to the description of the first elastic element 301 shown above. Specific details will not be repeated here.

[0082] Method 2

[0083] like Figure 2 As shown, the optical module heat dissipation assembly 200 also includes a heat-conducting intermediate component 230 made of a heat-conducting material. The heat-conducting intermediate component 230 is located between the first heat dissipation end 214 and the second heat dissipation end 221, and both sides of the heat-conducting intermediate component 230 are in contact with the first heat dissipation end 214 and the second heat dissipation end 221.

[0084] In this embodiment, the specific shape of the heat-conducting intermediate component 230 is not limited. As long as one side of the heat-conducting intermediate component 230 is in contact with the first heat dissipation end 214 and the other side of the heat-conducting intermediate component 230 is in contact with the second heat dissipation end 221, heat can be conducted between the first heat dissipation end 214 and the second heat dissipation end 221 through the heat-conducting intermediate component 230. This reduces the thermal resistance during heat conduction between the first heat dissipation end 214 and the second heat dissipation end 221, avoids heat conduction between the first heat dissipation end 214 and the second heat dissipation end 221 through air with high thermal resistance, and improves the efficiency of heat conduction between the first heat dissipation end 214 and the second heat dissipation end 221.

[0085] The above embodiment uses a first heat dissipation end and a second heat dissipation end located within the PCB opening to conduct heat between the first optical module and the second optical module. This allows for heat dissipation even when there is a temperature difference between the first and second optical modules, thus enabling sufficient heat dissipation for both modules and improving the heat dissipation efficiency of the optical module heat dissipation component. Furthermore, the interconnected heat dissipation between the first and second optical modules improves the heat dissipation uniformity of the component, enhances the reliability of the optical module, and extends its service life.

[0086] For example, taking the first and second optical modules both having a power of 3 watts (W) as an example, and taking the temperature difference between the first and second optical modules as 5°C as an example, when using... Figure 1In the case of the existing solution shown, taking the first optical module as an example, the temperature of the first optical module can be reduced to T1. However, when using the optical module heat dissipation component shown in this embodiment, the temperature of the first optical module can be reduced to T2, and T1 is higher than T2. ​​It can be seen that using the optical module heat dissipation component shown in this embodiment can effectively improve the heat dissipation efficiency of the optical module. Even if the heat dissipation of the optical module at a single point continues to increase, it can still effectively dissipate heat from the optical module.

[0087] To improve the heat dissipation efficiency of the optical module heat dissipation assembly, the following describes several optional heat dissipation methods included in the optical module heat dissipation assembly.

[0088] Method 1

[0089] like Figure 4 As shown, there is a first space 401 and a second space 402 located side by side between the first optical module cage 210 and the second optical module cage 220. The first space 401 is used to set the PCB 201. For a detailed description of the PCB 201, please refer to the above embodiment, which will not be repeated here.

[0090] The optical module heat dissipation assembly further includes a first interconnecting heat dissipation component 403 made of thermally conductive material. The first interconnecting heat dissipation component 403 is located within the second space 402, that is, the first interconnecting heat dissipation component 403 is located between the first optical module cage 210 and the second optical module cage 220, and the first end of the first interconnecting heat dissipation component 403 is attached to the first optical module cage 210, and the second end of the first interconnecting heat dissipation component 403 is attached to the second optical module cage 220.

[0091] As can be seen, the first optical module and the second optical module can also achieve heat dissipation through the first interconnecting heat sink 403 shown in this embodiment, thereby further improving heat dissipation efficiency. Specifically, when the temperature of the first optical module is higher than that of the second optical module, the first optical module can conduct heat to the second heat sink sequentially through the first optical module cage 210, the first interconnecting heat sink 403, the second optical module cage 220, and the second optical module. When the temperature of the second optical module is higher than that of the first optical module, the second optical module can conduct heat to the first heat sink sequentially through the second optical module cage 220, the first interconnecting heat sink 403, the first optical module cage 210, and the first optical module.

[0092] Method 2

[0093] Combination Figure 5 and Figure 8As shown, the first optical module cage 210 has a bottom shell 801 and a first outer shell 802. The first outer shell 802 is fastened to the bottom shell 801. The bottom shell 801 faces the PCB 201, and a receiving space for accommodating the first optical module is formed between the first outer shell 802 and the bottom shell 801. This embodiment does not limit the overall shape of the first optical module cage 210 formed by the mutually fastening bottom shell 801 and the first outer shell 802, as long as the first optical module cage can accommodate the first optical module.

[0094] The second optical module cage 220 has a top shell 803 and a second outer shell. For a description of the second outer shell, please refer to the description of the first outer shell 802, which will not be repeated here. The second outer shell is fastened to the top shell 803 to form a receiving space for accommodating the second optical module between the second outer shell and the top shell 803, wherein the top shell 803 is disposed facing the PCB 201.

[0095] The optical module heat dissipation assembly shown in this embodiment further includes a second interconnecting heat dissipation component 800 made of thermally conductive material. The first end of the second interconnecting heat dissipation component 800 is connected to the first housing 802, and the second end of the second interconnecting heat dissipation component 800 is connected to the second housing.

[0096] This embodiment does not limit the specific shape of the second interconnecting heat sink 800. The second interconnecting heat sink 800 can be connected to both the first outer shell 802 and the second outer shell. For example, the second interconnecting heat sink 800 can be a flexible heat pipe. Using the second interconnecting heat sink 800 shown in this embodiment enables heat dissipation between the first optical module and the second optical module, thereby further improving heat dissipation efficiency. Specifically, when the temperature of the first optical module is higher than that of the second optical module, the first optical module can sequentially conduct heat to the second heat sink through the first optical module cage 210, the second interconnecting heat sink 800, the second optical module cage 220, and the second optical module. When the temperature of the second optical module is higher than that of the first optical module, the second optical module can sequentially conduct heat to the first heat sink through the second optical module cage 220, the second interconnecting heat sink 800, the first optical module cage 210, and the first optical module.

[0097] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An optical module assembly, characterized in that, The device includes a printed circuit board, and a first optical module cage and a second optical module cage located on both sides of the printed circuit board. The first optical module cage is used to accommodate a first optical module, and the second optical module cage is used to accommodate a second optical module. The optical module assembly also includes a first heat dissipation end and a second heat dissipation end located opposite each other. The first heat dissipation end is attached to the first optical module cage, and the second heat dissipation end is attached to the second optical module cage. The first heat dissipation end includes a plurality of first heat dissipation teeth, and there is a first gap between two adjacent first heat dissipation teeth. The first heat dissipation teeth are used to deform within the first gap under the pressure of the first heat dissipation end. The second heat dissipation end includes a plurality of second heat dissipation teeth, and there is a second gap between two adjacent second heat dissipation teeth. The second heat dissipation teeth are used to deform within the second gap under the pressure of the second heat dissipation end. The printed circuit board includes a window that extends through the printed circuit board in a direction perpendicular to the printed circuit board. The plurality of first heat dissipation teeth and the plurality of second heat dissipation teeth are all disposed within the window. The plurality of first heat dissipation teeth and the plurality of second heat dissipation teeth are used for heat conduction from the first optical module to the second optical module and in the opposite direction.

2. The optical module assembly according to claim 1, characterized in that, Both the first heat dissipation end and the second heat dissipation end are made of thermally conductive material. The end face of the first optical module cage facing the printed circuit board is attached to the first heat dissipation end, and the end face of the second optical module cage facing the printed circuit board is attached to the second heat dissipation end.

3. The optical module assembly according to claim 1 or 2, characterized in that, The first optical module cage is provided with a first elastic element made of thermally conductive material. The first elastic element is located between the first optical module and the first heat dissipation end, and the first elastic element in a compressed state is in contact with both the first optical module and the first heat dissipation end. The second optical module cage is provided with a second elastic element made of thermally conductive material. The second elastic element is located between the second optical module and the second heat dissipation end, and the second elastic element in a compressed state is in contact with both the second optical module and the second heat dissipation end.

4. The optical module assembly according to claim 3, characterized in that, The first elastic member includes a first fixed end and a first elastic end connected to each other. The first fixed end is fixedly connected to the end face of the first heat dissipation end facing the first optical module, and the first elastic end extends between the first heat dissipation end and the first optical module. The second elastic member includes a second fixed end and a second elastic end connected to each other. The second fixed end is fixedly connected to the end face of the second heat dissipation end facing the second optical module, and the second elastic end extends between the second heat dissipation end and the second optical module.

5. The optical module assembly according to claim 1 or 2, characterized in that, The optical module assembly also includes a thermally conductive intermediate component made of a thermally conductive material, which is located between the first heat dissipation end and the second heat dissipation end, and both sides of the thermally conductive intermediate component are in contact with the first heat dissipation end and the second heat dissipation end.

6. The optical module assembly according to claim 1 or 2, characterized in that, The first optical module cage is connected to the first heat sink, and the second optical module cage is connected to the second heat sink. The first optical module is used to dissipate heat through the first heat dissipation path and the second heat dissipation path. The first heat dissipation path is that the first optical module dissipates heat through the first heat sink. If the temperature of the first optical module is higher than that of the second optical module, the second heat dissipation path is that the first optical module dissipates heat sequentially through the first optical module cage, the first heat sink end, the second heat sink end, the second optical module cage, the second optical module, and the second heat sink.

7. The optical module assembly according to claim 1 or 2, characterized in that, The first optical module cage is connected to the first heat sink, and the second optical module cage is connected to the second heat sink. The second optical module is used for heat dissipation through a third heat dissipation path and a fourth heat dissipation path. The third heat dissipation path is that the second optical module dissipates heat through the second heat sink. If the temperature of the second optical module is higher than that of the first optical module, the fourth heat dissipation path is that the second optical module dissipates heat sequentially through the second optical module cage, the second heat sink end, the first heat sink end, the first optical module cage, the first optical module, and the first heat sink.

8. The optical module assembly according to claim 1 or 2, characterized in that, There is a first space and a second space between the first optical module cage and the second optical module cage, and the first space is used to house the printed circuit board; The optical module assembly further includes a first interconnecting heat dissipation component made of thermally conductive material, the first interconnecting heat dissipation component being located within the second space, a first end of the first interconnecting heat dissipation component being attached to the first optical module cage, and a second end of the first interconnecting heat dissipation component being attached to the second optical module cage.

9. The optical module assembly according to claim 1 or 2, characterized in that, The first optical module cage has a bottom shell and a first outer shell, the first outer shell being fastened to the bottom shell to form a receiving space for accommodating the first optical module between the first outer shell and the bottom shell, the bottom shell being disposed towards the printed circuit board; the second optical module cage has a top shell and a second outer shell, the second outer shell being fastened to the top shell to form a receiving space for accommodating the second optical module between the second outer shell and the top shell, the top shell being disposed towards the printed circuit board; The optical module assembly further includes a second interconnecting heat sink made of thermally conductive material, with a first end of the second interconnecting heat sink attached to the first housing and a second end of the second interconnecting heat sink attached to the second housing.

10. A communication device, characterized in that, The equipment includes a cabinet, which contains at least one optical module assembly as described in any one of claims 1 to 9.

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