Circuit structure and electrical connection box

Abstract

A circuit structure and an electrical connection box are provided. The control terminals can be prevented from moving or deforming when a resin retaining component is formed. The circuit structure comprises: a plurality of electronic components, a plurality of control terminals electrically connected to the plurality of electronic components, and a retaining component having insulating properties and retaining the plurality of control terminals. The control terminals are inlays integrated with the resin retaining component, and a portion of the control terminals comprises: an exposed surface exposed from the retaining component; a contact surface, which is a surface on the opposite side of the exposed surface and in contact with the retaining component; a first side surface located between the exposed surface and the contact surface; and a second side surface located between the exposed surface and the contact surface. A first space portion is formed on the side of the first side surface, and a second space portion is formed on the side of the second side surface.

Description

Technical Field

[0001] The present disclosure relates to a circuit structure and an electrical connection box. Background Art

[0002] Patent Document 1 discloses a circuit structure including a control substrate, a plurality of switching elements that operate based on signals from the control substrate, and bus bars constituting a power circuit. The switching elements are connected to the bus bars by soldering.

[0003] Prior art literature

[0004] Patent Document 1: Japanese Patent Application Publication No. 2019-96769 Summary of the Invention

[0005] Problems to be solved by the invention

[0006] As a component of the power circuit, the circuit structure includes, in addition to the busbars, a plurality of control terminals that are electrically connected to electronic components such as switching elements, and transmit signals from the control substrate to the electronic components via the control terminals.

[0007] The circuit structure further includes a retaining member having insulating properties and retaining the control terminals. The retaining member is made of a thermoplastic resin and is formed by injection molding. Sometimes, the control terminals are placed as inserts in the injection molding mold to form the retaining member. Figure 9 It is a cross-sectional view showing a part of the injection molding die 90 and the control terminal 91 .

[0008] By making a part of the control terminal 91 in surface contact with the mold 90, the control terminal 91 can be positioned relative to the mold 90. However, during injection molding, due to the injection pressure of the molten resin 99, part of the resin 99 flows into the space between the mold 90 and the control terminal 91, as shown in FIG. Figure 9 As shown, the control terminal 91 may be tilted or deformed in the mold 90. Then, the control terminal 91 may come into contact with another conductor 92 such as a bus bar integrated with the holding member 95, and may cause a short circuit.

[0009] Therefore, an object of the present disclosure is to provide a circuit structure capable of suppressing movement or deformation of a control terminal during molding of a resin holding member.

[0010] Technical solutions to problems

[0011] A circuit structure of one embodiment of the present invention comprises: a plurality of electronic components, a plurality of control terminals electrically connected to the plurality of electronic components, and a holding component having insulation properties and holding the plurality of control terminals, the control terminals being an inlaid part integral with the holding component made of resin, and the control terminals having, in a portion thereof: an exposed surface exposed from the holding component; a contact surface, which is a surface on the opposite side of the exposed surface and in contact with the holding component; a first side surface located between the exposed surface and the contact surface; and a second side surface located between the exposed surface and the contact surface, a first space portion being formed on the side of the first side surface, and a second space portion being formed on the side of the second side surface.

[0012] An electrical junction box according to one aspect of the present disclosure includes the aforementioned circuit structure and a cover covering the circuit structure.

[0013] Effects of the Invention

[0014] According to the present disclosure, it is possible to suppress the control terminal from being moved or deformed by the injection pressure of the molten resin during the molding of the resin holding member. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a perspective view of an electrical junction box including the circuit structure according to the present embodiment.

[0016] Figure 2 It is from Figure 1 A perspective view of the circuit structure when viewed from the opposite side.

[0017] Figure 3 This is an exploded view of the circuit structure with the control board removed.

[0018] Figure 4 It is a cross-sectional view showing a part of the control terminal and the holding member.

[0019] Figure 5 It is a perspective view showing a part of the control terminal and the holding member.

[0020] Figure 6 yes Figure 5 A cross-sectional view of the V direction.

[0021] Figure 7 It is a cross-sectional view showing a part of a mold for molding a holding member made of resin.

[0022] Figure 8 This is a cross-sectional view showing a state in which a holding member is molded using a control terminal as an insert.

[0023] Figure 9 It is a cross-sectional view showing a part of the injection molding die and the control terminal. DETAILED DESCRIPTION

[0024] <Overview of Embodiments of the Present Disclosure>

[0025] Hereinafter, embodiments of the present disclosure will be described with reference to their outlines.

[0026] (1) The circuit structure of this embodiment comprises: a plurality of electronic components, a plurality of control terminals electrically connected to the plurality of electronic components, and a holding component having insulation properties and holding the plurality of control terminals, the control terminals being an inlay product integrated with the holding component made of resin, and the control terminals having, in a portion thereof,: an exposed surface exposed from the holding component; a contact surface, which is a surface on the opposite side of the exposed surface and in contact with the holding component; a first side surface located between the exposed surface and the contact surface; and a second side surface located between the exposed surface and the contact surface, a first space portion being formed on the side of the first side surface, and a second space portion being formed on the side of the second side surface.

[0027] In the circuit structure of this embodiment, the control terminal is an insert integrally formed with a resin retaining member. During the molding of the retaining member, molten resin fills the area surrounding the control terminal. A portion of the contact surface of the control terminal comes into contact with the retaining member, and a portion of the contact surface is integrated with the retaining member. The exposed surface of the control terminal is formed by contact with the molding die.

[0028] In this mold, protrusions are provided on both sides of a portion of the control terminal. After molding, a first space is formed on the side of the first side surface, and a second space is formed on the side of the second side surface. Protrusions on both sides of the portion of the control terminal in the mold prevent molten resin from seeping between the exposed surface and the mold. This prevents the control terminal from moving or deforming due to the injection pressure of the molten resin during molding of the retaining member.

[0029] (2) Preferably, the holding member includes: a thick-walled portion in contact with the contact surface; a first thin-film portion made of resin covering the first side surface; and a second thin-film portion made of resin covering the second side surface, wherein the side surface of the first thin-film portion is exposed in the first space portion, and the side surface of the second thin-film portion is exposed in the second space portion. With this structure, the control terminal is bonded to the resin holding member at the first and second side surfaces in addition to the contact surface, and the control terminal is less likely to fall off the holding member.

[0030] In order to maintain the shape of the component, a pair of the above-mentioned protrusions are provided in the mold, with a portion of the control terminal interposed therebetween. It is conceivable that there are manufacturing errors in the first dimension between the pair of protrusions and the second dimension between the first side and the second side of the control terminal. In order to make a portion of the control terminal interposed between the pair of protrusions, it is preferable to set the above-mentioned first dimension to be slightly larger than the above-mentioned second dimension. As a result, a small gap is formed between the protrusion and the control terminal, and the resin in a molten state may flow into this small gap. However, the small gap is thin, and the resin in a molten state cannot easily enter this small gap. Therefore, it is not easy for the resin to penetrate into the space between the mold and the control terminal through the small gap. In addition, the molten resin that enters the above-mentioned small gap hardens, thereby forming the first thin film portion and the second thin film portion.

[0031] (3) Preferably, the circuit structure has a control substrate that outputs a signal to the electronic component through the control terminal, and the control terminal has: a first terminal body portion that is connected to the control substrate; a pad portion that is a part of the first terminal body portion and is electrically connected to the first terminal body portion, is arranged along the retaining component, and has the exposed surface and the contact surface; and a second terminal body portion that is electrically connected to the pad portion and the electronic component.

[0032] According to this structure, before connecting the control substrate to the first terminal body of the control terminal, the probe of a tester used for electrical inspection is brought into contact with each pad portion, thereby enabling electrical inspection of each of the multiple electronic components. In the pad portion, the surface opposite to the exposed surface (contact surface) is in contact with the retaining member, so that even if the tester probe is brought into contact with the exposed surface, deformation of the pad portion can be prevented.

[0033] (4) Preferably, the pad portion extends from the base of the first terminal body, and the retaining member includes a first embedded portion that embeds a boundary region between the first terminal body and the pad portion in the control terminal. In this case, the embedded portion can prevent the first terminal body from floating from the retaining member.

[0034] (5) Preferably, the pad portion extends from the base of the second terminal body portion, the retaining member includes a second embedded portion, the second embedded portion embeds the boundary region between the pad portion and the second terminal body portion, the second embedded portion includes a resin surface, and the resin surface and the exposed surface of the pad portion are flush with each other. In this case, the exposed surface of the pad portion and the resin surface of the second embedded portion are flush with each other, making it easier to mold the portion of the retaining member covering the portion between the pad portion and the second terminal body portion. In addition, the structure of the mold is simplified.

[0035] (6) Preferably, the second terminal main body has: a terminal surface exposed from the holding member and connected to the electronic component; and a second exposed surface opposite to the terminal surface, exposed from the holding member.

[0036] If the retaining member is made of resin and formed by injection molding using a mold, the metal member that will become the second terminal body can be positioned by partially contacting the mold. The molds are then brought into contact with this portion, clamping it from both sides to form the terminal surface and the second exposed surface. This dual-sided contact improves the positioning accuracy of the second terminal body, particularly the terminal surface. This reduces the chance of poor connection between the terminal surface and the electronic component.

[0037] (7) The electrical junction box of the present embodiment includes: the circuit structure described in any one of (1) to (6) above; and a cover covering the circuit structure.

[0038] According to the electrical junction box of this embodiment, it is possible to suppress the control terminal from being moved or deformed by the injection pressure of the molten resin when the resin holding member is molded.

[0039] <Details of the embodiments of the present disclosure>

[0040] Hereinafter, the details of the embodiments of the present disclosure will be described with reference to the accompanying drawings. In addition, at least a part of the embodiments described below may be arbitrarily combined.

[0041] [About electrical connection box 10]

[0042] Figure 1 This is a three-dimensional view of an electrical connection box 10 having a circuit structure 11 of the present embodiment. The electrical connection box 10 can be mounted on various devices, but the electrical connection box 10 of the present embodiment is mounted on a car. Specifically, the electrical connection box 10 is located in the middle of a wiring path connecting a first vehicle-mounted device and a second vehicle-mounted device (not shown). The electrical connection box 10 includes a circuit structure 11 and a cover 12 covering the circuit structure 11. The cover 12 is made of metal (aluminum or aluminum alloy), for example, and has a heat dissipation function for dissipating heat generated in the circuit structure 11. Although the electrical connection box 10 is not shown in the figure, other units installed on the opposite side of the cover 12 may also be provided.

[0043] [Regarding circuit structure 11]

[0044] Figure 2 It is from Figure 1 A perspective view of the circuit structure 11 when viewed from the opposite side. Figure 2 FIG. 1 shows a state where the cover 12 is removed. Figure 1 and Figure 2 In the embodiment, the circuit structure 11 includes a plurality of electronic components 15 , a plurality of control terminals 16 , a holding member 14 , and a control substrate 13 . Figure 3 This is an exploded view of the circuit structure 11 with the control substrate 13 removed. The circuit structure 11 further includes a plurality of conductive plates 17. The plurality of conductive plates 17 and the plurality of control terminals 16 constitute a power circuit of the circuit structure 11.

[0045] In this embodiment, the circuit structure 11 includes three (three) conductive plates 17 (see Figure 1 ), with eight control terminals 16 (refer to Figure 3 The number of control terminals 16 and electronic components 15 is the same, and one control terminal 16 is connected to one electronic component 15 in a one-to-one relationship. In addition, the number of conductive plates 17, control terminals 16, electronic components 15, and control substrate 13 is arbitrary and can be changed freely.

[0046] The electronic component 15 is, for example, a semiconductor relay such as a field effect transistor (FET). In the following description, the electronic component 15 is described as a field effect transistor, and the field effect transistor is referred to as a "FET". The FET 15 has a plurality of terminals. Figure 1 As shown in the enlarged view of FIG, FET 15 has a plurality of terminals including a source terminal (first terminal) 15a, a gate terminal (second terminal) 15b, and a drain terminal (third terminal) 15c. Each terminal is mechanically and electrically connected to a conductive plate 17 or a control terminal 16 by solder or the like.

[0047] The conductive plate 17 is manufactured by stamping a metal plate into a predetermined shape. The conductive plate 17 is a metal plate, also known as a bus bar. The conductive plate 17 is preferably a copper component such as pure copper or a copper alloy. The conductive plate 17 is a conductor as a whole, and the wiring pattern of a general printed circuit board is not formed on the conductive plate 17. Figure 1 As shown, the circuit structure 11 includes a first conductive plate 17 - 1 , a second conductive plate 17 - 2 , and a third conductive plate 17 - 3 .

[0048] The control terminal 16 is manufactured by punching a metal wire into a predetermined shape. The control terminal 16 is a metal terminal. The control terminal 16 is preferably a copper member such as pure copper or a copper alloy. Figure 4 This is a cross-sectional view showing a portion of the control terminal 16 and the holding member 14. The control terminal 16 has a bent shape and includes a first terminal body portion 31, a pad portion 33, and a second terminal body portion 32. Details of each portion of the control terminal 16 will be described later.

[0049] exist Figure 2In the embodiment, the control substrate 13 is a generally rectangular insulating substrate having a control circuit unit 27 on its first surface 13a. The control circuit unit 27 outputs a signal to the FET 15 via the control terminal 16. The FET 15 operates based on this signal. The control circuit unit 27 includes an integrated circuit including a switching element, a diode, and the like, as a second electronic component for enabling the FET 15 to function. The control circuit unit 27 includes a wiring pattern 29 for electrically connecting this second electronic component to the control terminal 16.

[0050] The control substrate 13 is formed with a through hole 18 (see Figure 3 By filling the through hole 18 with a conductive material, the control circuit portion 27 is mechanically and electrically connected to a portion of the first terminal main portion 31 of the control terminal 16. In the state before the control substrate 13 is connected to the control terminal 16 (see Figure 3 ), the multiple control terminals 16 are not electrically connected to each other (non-energized state).

[0051] The holding member 14 is made of thermoplastic resin and is formed by injection molding. In this embodiment, as will be described later, the holding member 14 is formed by placing the control terminal 16 and the conductive plate 17 in the injection molding mold 60 (see FIG. Figure 7 ). Thus, a portion of the control terminal 16 and a portion of the conductive plate 17 are embedded in the retaining member 14, and the control terminal 16, the conductive plate 17, and the retaining member 14 are integrated. The control terminal 16 and the conductive plate 17 are insert parts integrally formed with the resin retaining member 14.

[0052] The holding member 14 is made of, for example, PPS (polyphenylene sulfide), PBT (polybutylene terephthalate), nylon, PP (polypropylene), PE (polyethylene), etc., and has insulating properties. The holding member 14 holds eight control terminals 16 and three conductive plates 17, and functions as a housing for the circuit structure 11. Figure 3 As shown, the holding member 14 has a housing space 30 open to the control board 13. A first terminal body 31 and a pad 33 of the control terminal 16 are provided in the housing space 30. The control board 13 is attached to the first terminal body 31 to close the housing space 30.

[0053] The holding member 14 has a plate-shaped central base 19 and a surrounding frame 20. Figure 1As shown, the main body 22 of the conductive plate 17, on which the FET 15 is mounted, is disposed on the base 19. The main bodies 22 of the three conductive plates 17 are arranged in a planar manner on the base 19 without overlapping. The three conductive plates 17 are separated and non-contacting. The three conductive plates 17 are separated and non-contacting from the control terminal 16.

[0054] In this embodiment (see Figure 1 ), the source terminal 15a of the FET 15 is connected to the third conductive plate 17-3 located in the center. The drain terminal 15c of the FET 15 is connected to the first conductive plate 17-1 or the second conductive plate 17-2. Figure 1 As shown in the enlarged view of FIG, a through hole 28 is provided in the central third conductive plate 17-3, and a portion of the second terminal main body 32 of the control terminal 16 is exposed through the hole 28. The gate terminal 15b of the FET 15 is connected to the portion of the second terminal main body 32 exposed through the hole 28. As a result, the gate terminal 15b of the FET 15 and the control terminal 16 are electrically connected.

[0055] The frame 20 is provided with mounting holes 39 for fixing the cover 12. The end 21A of the first conductive plate 17-1 and the end 21B of the second conductive plate 17-2 are provided to protrude outward from the frame 20. Cables and the like (not shown) are connected to these ends 21A and 21B.

[0056] [Regarding control terminal 16]

[0057] Figure 5 This is a perspective view showing a portion of the control terminal 16 and the retaining member 14. As described above, the control terminal 16 has a bent shape and includes a first terminal body 31, a pad portion 33, and a second terminal body 32. In this embodiment, the first terminal body 31, the pad portion 33, and the second terminal body 32 are formed by bending the same metal component. Specifically, the first terminal body 31 is formed from a portion of an elongated, plate-shaped metal component, the pad portion 33 is formed from another portion of the metal component, and the second terminal body 32 is formed from a portion of the metal component that is different from the first and second portions.

[0058] The first terminal body portion 31, the pad portion 33, and the second terminal body portion 32 each have a rectangular shape in cross section (see Figure 6 ). Figure 6 yes Figure 5 The cross-sectional view of the V direction. Figure 5As shown, the first terminal body portion 31 has a straight line shape. The first terminal body portion 31 is bent at a right angle to the pad portion 33. The pad portion 33 extends from the base 31a of the first terminal body portion 31 and has a straight line shape. The second terminal body portion 32 is bent at a right angle to the pad portion 33. The pad portion 33 extends from the base 32a of the second terminal body portion 32 and has a straight line shape. The second terminal body portion 32 has a U-shape.

[0059] [First terminal main body 31]

[0060] The first terminal main body 31 is connected to the control substrate 13 (see Figure 2 and Figure 3 ). The front end portion of the first terminal main body 31 is inserted into the through hole 18 of the control substrate 13 and is electrically connected to the wiring pattern 29 provided on the control substrate 13. As described above, the control circuit portion 27 of the control substrate 13 outputs a signal to the FET 15 through the control terminal 16. The signal is output from the control substrate 13 to the first terminal main body 31. The signal is transmitted from the first terminal main body 31 through the pad portion 33 and the second terminal main body 32 (see Figure 5 ) and is provided to the gate terminal 15b of FET15.

[0061] The first terminal main body 31 has an elongated plate shape. The first terminal main body 31 protrudes from the first embedded portion 23 which is a part of the holding member 14. The portion of the first terminal main body 31 protruding from the first embedded portion 23 is exposed as a whole. That is, as shown in FIG. Figure 5 As shown, the first terminal body 31 has a first surface 41, which is exposed from the retaining member 14 on one side in the thickness direction of the first terminal body 31; and a second surface 42, which is the surface opposite to the first surface 41 and is exposed from the retaining member 14. Furthermore, side surfaces 43 located on both sides between the first surface 41 and the second surface 42 are also exposed surfaces. Before being connected to the control board 13, the first terminal body 31 has a cantilevered shape extending from the first embedded portion 23.

[0062] [Pad portion 33]

[0063] The pad portion 33 is provided extending from the base portion 31a of the first terminal main body portion 31 and is electrically connected to the first terminal main body portion 31 as a whole. The pad portion 33 has an elongated plate shape. Figure 5 As shown, the pad portion 33 is provided along the holding member 14 and is exposed from a portion of the holding member 14. The pad portion 33 is provided along the thick portion 50 of the holding member 14.

[0064] like Figure 4 and Figure 5As shown, the pad portion 33 has a first exposed surface 34 exposed from the holding component 14 and a contact surface 35 on the opposite side of the first exposed surface 34. The first exposed surface 34 has an elongated shape. Specifically, for example, the first exposed surface 34 is an elongated rectangular shape, having a first side 34a and a second side 34b that is more than twice as long as the first side 34a. The contact surface 35 is in contact with the holding component 14 as a whole and is a non-exposed surface that is not exposed from the holding component 14. As described above, the holding component 14 is formed by setting the control terminal 16 in the injection molding mold 60 (refer to Figure 7 Therefore, the pad portion 33 is in a state of being joined to a portion of the holding component 14 at the contact surface 35.

[0065] like Figure 6 As shown, the pad portion 33 has a first side surface 36 and a second side surface 37 in addition to the first exposed surface 34 and the contact surface 35. The first side surface 36 is located between the first exposed surface 34 and the contact surface 35. The second side surface 37 is the surface opposite to the first side surface 36 and is located between the first exposed surface 34 and the contact surface 35.

[0066] In this embodiment, the first side surface 36 is covered by a first thin film portion 51 made of resin, and the second side surface 37 is covered by a second thin film portion 52 made of resin. The first thin film portion 51 and the second thin film portion 52 are each part of the retaining member 14. The first thin film portion 51 and the second thin film portion 52 are each film-like resin portions that are thinner than the thick-walled portion 50 with which the contact surface 35 contacts. A first space K1 is formed to the side of the first side surface 36 covered by the first thin film portion 51. A second space K2 is formed to the side of the second side surface 37 covered by the second thin film portion 52.

[0067] The side surface 51a of the first thin film portion 51 is exposed in the first space portion K1. The side surface 52a of the second thin film portion 52 is exposed in the second space portion K2. The retaining member 14 has a first protrusion 57 that rises from the thick wall portion 50. The first protrusion 57 is provided separately from the pad portion 33. The space formed between the first protrusion 57 and the pad portion 33 (the first thin portion 51) is the first space portion K1. The retaining member 14 has a second protrusion 58 that rises from the thick wall portion 50. The second protrusion 58 is provided separately from the pad portion 33. The space formed between the second protrusion 58 and the pad portion 33 (the second thin portion 52) is the second space portion K2.

[0068] [Second terminal main body 32]

[0069] like Figure 5As shown, the second terminal body 32 is continuously provided with the pad portion 33. The second terminal body 32 has a shape (U-shaped) formed by bending a slender plate. The base 32a of the second terminal body 32 is connected to the pad portion 33, and the second terminal body 32 and the pad portion 33 are electrically connected. The second terminal body 32 includes: a first piece 46 continuous with the pad portion 33; a second piece 47 spaced apart from and parallel to the first piece 46; and an intermediate piece 48 connecting the first piece 46 and the second piece 47. The second piece 47 is exposed from the retaining member 14, and the intermediate piece 48 has a surface exposed from the retaining member 14.

[0070] The gate terminal 15b of the FET 15 is connected to the intermediate piece 48 by solder or the like. This mechanically and electrically connects the second terminal body 32 to the FET 15. The second terminal body 32 includes a terminal surface 45 on the intermediate piece 48, which is exposed from the retaining member 14, and a second exposed surface 44, which is the surface opposite to the terminal surface 45 and is exposed from the retaining member 14. The FET 15 (gate terminal 15b) is connected to the terminal surface 45.

[0071] [Regarding the holding member 14]

[0072] Figure 7 14 is a cross-sectional view showing a portion of a mold 60 for molding the resin holding member 14. Figure 7 The part shown can be obtained Figure 6 The cross-sectional structure of the circuit structure 11 shown in FIG. In the circuit structure 11 of this embodiment, the control terminal 16 and the conductive plate 17 are inserts integrally formed with the resin retaining member 14. When the retaining member 14 is formed, the molten resin is filled into the cavity 60a formed in the mold 60. The molten resin is also filled near the control terminal 16. By this forming, the contact surface 35 of the pad portion 33 of the control terminal 16 becomes in contact with the retaining member 14 (see FIG. Figure 6 ) contact state, the pad portion 33 is integrated with the holding member 14. In the cavity 60a, the molten resin is also filled near the conductive plate 17. As a result, the conductive plate 17 becomes in contact with the holding member 14 (refer to Figure 6 ) contact state and is integrated with the retaining component 14.

[0073] like Figure 7 As shown, the exposed surface 34 of the pad portion 33 is formed by contacting with the mold 60 during molding and separating from the mold 60 during demolding. In the mold 60, protrusions 61, 61 are provided on both sides of the pad portion 33. By these protrusions 61, 61, after molding (refer to Figure 6), a first space portion K1 is formed on the side of the first side surface 36 of the pad portion 33, and a second space portion K2 is formed on the side of the second side surface 37. The protrusion 61 is a portion constituting a part of the mold 60.

[0074] The cross-sectional shapes of the first and second space portions K1 and K2 are identical to the cross-sectional shapes of the protrusions 61, 61. Thus, in the mold 60, the protrusions 61 are provided on both sides of the pad portion 33, so that molten resin is less likely to penetrate between the exposed surface 34 and the mold 60. In other words, the molten resin flows through the cavity 60a to fill it, and at this time, the protrusions 61 function as barrier walls that cover the pad portion 33, making it less likely that the resin flow will be affected by the pad portion 33.

[0075] Therefore, it is possible to suppress the control terminal 16 including the pad portion 33 from moving or deforming in the cavity 60a due to the injection pressure of the molten resin during the molding of the holding member 14. As a result, it is possible to prevent the control terminal 16 (pad portion 33) from contacting (short-circuiting) with the conductive plate 17.

[0076] like Figure 6 As shown, after molding, the retaining member 14 includes a thick-walled portion 50 made of resin that contacts the contact surface 35 of the pad portion 33, a first thin-film portion 51 made of resin that covers the first side surface 36, and a second thin-film portion 52 made of resin that covers the second side surface 37. The first thin-film portion 51 and the second thin-film portion 52 are substantially thinner than the thick-walled portion 50. The side surface 51a of the first thin-film portion 51 is exposed in the first space K1. The side surface 52a of the second thin-film portion 52 is exposed in the second space K2. The pad portion 33 is structured so that it is bonded to the resin retaining member 14 not only on the contact surface 35 but also on the first side surface 36 and the second side surface 37. As a result, the control terminal 16, including the pad portion 33, is less likely to fall out of the retaining member 14.

[0077] As mentioned above (see Figure 7 ), in order to maintain the shape of component 14, a pair of protrusions 61, 61 are provided in mold 60. A portion of control terminal 16 (pad portion 33) is interposed between these protrusions 61, 61. It is conceivable that there are manufacturing errors in the first dimension L1 between the pair of protrusions 61 and the second dimension L2 between the first side 36 and the second side 37 of control terminal 16. In order to position pad portion 33 between the pair of protrusions 61, 61, first dimension L1 is preferably set to be slightly larger than second dimension L2. As a result, a small gap e is formed between protrusion 61 and pad portion 33. Molten resin may flow into this small gap e.

[0078] However, the minute gap e is thin, and the molten resin does not easily enter the minute gap e. Therefore, the molten resin does not easily penetrate through the minute gap e into the space between the mold 60 and the first exposed surface 34 of the pad portion 33. Furthermore, when the molten resin that has entered the minute gap e hardens, the hardened portion becomes the first thin film portion 51 and the second thin film portion 52.

[0079] The gap size of the microgap e is preferably set to a value that prevents molten resin from easily entering. As a result, the corner (edge) 38 formed between the first exposed surface 34 and the first side surface 36 (or second side surface 37) is exposed in the pad portion 33. Corner 38 is preferably not covered by the first thin film portion 51 or the second thin film portion 52. With respect to the thick-walled portion 50, the first thin film portion 51 and the second thin film portion 52 are each lower than the first exposed surface 34.

[0080] like Figure 4 and Figure 5 As shown, the entire first bent portion 25 between the first terminal body 31 and the pad portion 33 is embedded in a resin-made first embedded portion 23. The first embedded portion 23 is part of the retaining member 14. Specifically, the retaining member 14 includes the first embedded portion 23, which embeds the first boundary region J1 between the first terminal body 31 and the pad portion 33 in the control terminal 16. While a portion of the pad portion 33 and most of the first terminal body 31 are exposed from the retaining member 14, the first embedded portion 23 prevents the first terminal body 31 from floating from the retaining member 14.

[0081] The second bent portion 26 between the second terminal body 32 and the pad portion 33 is embedded by a second embedded portion 24 made of resin. The second embedded portion 24 is another portion of the retaining member 14. In other words, the retaining member 14 includes the second embedded portion 24 that embeds the second boundary region J2 between the pad portion 33 of the control terminal 16 and the second terminal body 32. The second embedded portion 24 prevents the second terminal body 32 and the pad portion 33 from floating from the retaining member 14.

[0082] In the direction perpendicular to the longitudinal direction of the pad portion 33, as described above (see Figure 6 ), a first space portion K1 and a second space portion K2 are formed on both sides of the pad portion 33, separated by the first film portion 51 and the second film portion 52. In other words, the holding member 14 is missing on both sides of the pad portion 33. In contrast, Figure 5 As shown, a first embedded portion 23 is provided on the first terminal body portion 31 side of the pad portion 33 in the longitudinal direction thereof and is embedded in the resin. A second embedded portion 24 is provided on the second terminal body portion 32 side of the pad portion 33 in the longitudinal direction thereof and is embedded in the resin.

[0083] The second bent portion 26 between the pad portion 33 and the second terminal body portion 32 is embedded in the second embedded portion 24. The second embedded portion 24 has a resin surface 54 that is flush with the first exposed surface 34 of the pad portion 33 (same plane). Since the first exposed surface 34 of the pad portion 33 and the resin surface 54 of the second embedded portion 24 are flush with each other, the portion of the retaining member 14 covering the portion between the pad portion 33 and the second terminal body portion 32 (base portion 32a) can be easily molded using the mold 60 (see FIG. 1 ). Figure 8 ) forming. In addition, the structure of the mold 60 is simplified.

[0084] Both surfaces of the intermediate piece 48, which is the midway portion of the second terminal main body 32, are exposed from the holding member 14. Specifically, the second terminal main body 32 has, in the intermediate piece 48, a terminal surface 45 exposed from the holding member 14 and connected to the FET 15, and a second exposed surface 44, which is the surface opposite to the terminal surface 45 and exposed from the holding member 14.

[0085] Figure 8 It is a cross-sectional view showing a state in which the holding member 14 is molded with the control terminal 16 as an insert product. Figure 8 The second terminal main body 32 and its surroundings in the control terminal 16 are shown together with the mold 60. As described above, the holding member 14 is made of resin and is formed by injection molding using the mold 60. The metal member serving as the second terminal main body 32 is partially in contact with the mold 60 for positioning. Figure 8 As shown, the mold 60 contacts a portion 32b of the second terminal body portion 32 so as to sandwich the portion 32b from both sides. The portion of the second terminal body portion 32 contacted by the mold 60 forms the terminal surface 45 and the second exposed surface 44.

[0086] In this manner, the first portion 60b and the second portion 60c of the mold 60 are brought into contact with the portion 32b of the second terminal main body 32 from both sides, thereby improving the positioning accuracy of the second terminal main body 32, particularly the terminal surface 45. As a result, poor connection between the terminal surface 45 and the FET 15 (gate terminal 15b) can be suppressed.

[0087] [Regarding electrical inspection of electronic component (FET) 15]

[0088] In the manufacturing process of the circuit structure 11, an electrical inspection is performed to confirm that there is no connection failure of the FET 15. In the case of the circuit structure 11 of this embodiment, Figure 3As shown, each pad portion 33 of the control terminal 16 is housed in the housing space 30 of the holding member 14. However, before the control substrate 13 is connected to the control terminal 16, each pad portion 33 is exposed to the outside. Therefore, before the control substrate 13 is connected to the control terminal 16, the probe of a tester (not shown) is brought into contact with each pad portion 33 to perform an electrical inspection on each of the plurality of FETs 15.

[0089] For this purpose, the control terminal 16 includes a pad portion 33 and a second terminal main body portion 32 electrically connected to the pad portion 33 and the FET 15. The pad portion 33 is provided along the resin holding member 14 and is exposed from a portion of the holding member 14. By bringing the probe of the tester into contact with each pad portion 33, it is possible to perform electrical inspections on each of the plurality of FETs 15. Therefore, a conventional test circuit element 99 (see FIG. 1 ) is provided on the control substrate 13. Figure 9 By omitting the test circuit element 99, the cost of the circuit structure 11 can be reduced, and the size of the control substrate 13 can be reduced.

[0090] In this embodiment, the first terminal main body 31 (see Figure 4 ) has a first surface 41 exposed from the retaining member 14; and a second surface 42, the surface opposite the first surface 41 and exposed from the retaining member 14. The first terminal body 31 is a thin, elongated plate, with both the first surface 41 and the second surface 42 exposed from the retaining member 14. Therefore, if a tester probe were to come into contact with the first surface 41 or the second surface 42, the first terminal body 31 could deform. Deformation of the first terminal body 31 could potentially cause problems with the connection to the control board 13.

[0091] In contrast, the pad portion 33 includes a first exposed surface 34, a portion of which is exposed from the holding member 14, and a contact surface 35, which is the surface opposite to the first exposed surface 34 and contacts the holding member 14. Because the surface of the pad portion 33 opposite to the first exposed surface 34 (contact surface 35) contacts the holding member 14, even if a tester probe contacts the first exposed surface 34, the force generated by the contact is supported by the holding member 14, thereby preventing deformation of the pad portion 33.

[0092] The probe of the tester is aligned with the target area Q (see FIG. 1 ) of the first exposed surface 34 of the pad portion 33 away from the first terminal main body 31 so that the probe does not interfere with the first terminal main body 31. Figure 5 ) contact. The first exposed surface 34 of the pad portion 33 is not only the target area Q, but also has an elongated shape that partially includes the target area Q. For example, the first exposed surface 34 of the pad portion 33 has a second side 34b that is at least three times longer than the first side 34a.

[0093] This is because the holding member 14 is made of resin. Figure 7 As described above, during injection molding using mold 60, a portion of the metal component serving as pad portion 33 contacts mold 60, with the contact portion forming first exposed surface 34. This is because the longer the contact portion of the metal component with mold 60, the more stably the metal component is positioned. Thus, by setting first exposed surface 34 of pad portion 33 to a slender shape, the contact area between the metal component and mold 60 is increased, stabilizing the metal component and preventing defective products.

[0094] 〔Other structures〕

[0095] In the present embodiment, the control terminal 16 is formed by bending the first terminal body 31, the pad portion 33, and the second terminal body 32 from the same metal component. Therefore, there is no need to join the first terminal body 31, the pad portion 33, and the second terminal body 32. Alternatively, one or all of the first terminal body 31, the pad portion 33, and the second terminal body 32 may be different components, and the control terminal 16 may be formed by joining the components, for example, by welding.

[0096] like Figure 4 As shown, the pad portion 33 is provided along the holding member 14, and its contact surface 35 is in contact with the holding member 14 over the entire pad portion 33. As another configuration, a portion of the contact surface 35 may be exposed from the holding member 14.

[0097] Although the first exposed surface 34 of the pad portion 33 has been described as having an elongated rectangular shape, it may have other shapes such as a circle or an oval.

[0098] In this embodiment (see Figure 6 ), the first side surface 36 of the pad portion 33 is covered by a first thin film portion 51 made of resin, and the second side surface 37 is covered by a second thin film portion 52 made of resin. As a modification, one or both of the first thin film portion 51 and the second thin film portion 52 may be omitted.

[0099] The first space portion K1 and the second space portion K2 formed on the sides of the first side surface 36 and the second side surface 37 of the pad portion 33 may have shapes (cross-sectional shapes) other than those shown in the drawings.

[0100] The electronic component 15 (first electronic component 15) may be another component other than a field-effect transistor, such as a mechanical relay. Even in this case, in the completed state of the circuit structure 11, the electronic component 15 is electrically connected to the control substrate 13, and a signal is supplied from the control substrate 13 to the electronic component 15 via the control terminal 16, causing the electronic component 15 to operate. Furthermore, an electrical inspection is performed before connecting the control substrate 13.

[0101] The above embodiments are illustrative in all respects and are not restrictive. The scope of the present invention is defined by the claims rather than the above embodiments, and includes all modifications within the scope of equivalence to the structures described in the claims.

[0102] Description of Reference Numerals

[0103] 10 Electrical connection box

[0104] 11 Circuit structure

[0105] 12. Cover

[0106] 13 Control board

[0107] 13a Page 1

[0108] 14. Retaining components

[0109] 15 Electronic components

[0110] 15a source terminal

[0111] 15c drain terminal

[0112] 15b Gate terminal

[0113] 16 control terminals

[0114] 17 Conductive Plate

[0115] 17-1 First conductive plate

[0116] 17-2 Second conductive plate

[0117] 17-3 Third conductive plate

[0118] 18 through holes

[0119] 19 base

[0120] 20 Frame

[0121] 21A terminal

[0122] 21B end

[0123] 22 Main body

[0124] 23 First buried part

[0125] 24 Second buried part

[0126] 25 First bend

[0127] 26 Second bend

[0128] 27 Control circuit unit

[0129] 28 holes

[0130] 29 Wiring pattern

[0131] 30 Containment Space

[0132] 31 first terminal main body

[0133] 31a base

[0134] 32 Second terminal main body

[0135] 32a base

[0136] Part 32b

[0137] 33 pad part

[0138] 34 First appearance

[0139] 34a First side

[0140] 34b Second side

[0141] 35 contact surface

[0142] 36 First side

[0143] 37 Second side

[0144] 38 corners

[0145] 39 mounting holes

[0146] Page 41

[0147] 42 Side 2

[0148] 43 Side

[0149] 44 Second appearance

[0150] 45 terminal surface

[0151] 46 First Film

[0152] 47 Second Film

[0153] 50 thick wall part

[0154] 51 First Film Department

[0155] 51a Side

[0156] 52 Second film section

[0157] 52a Side

[0158] 54 resin surface

[0159] 57 First convex part

[0160] 58 Second convex part

[0161] 60 mold

[0162] 60a cavity

[0163] 60b Part 1

[0164] 60c Part 2

[0165] 61 protrusion

[0166] J1 First boundary area

[0167] J2 Second boundary area

[0168] K1 First Space Department

[0169] K2 Second Space Department

[0170] L1 first size

[0171] L2 Second size.

Claims

1. A circuit structure comprising: Conductive plate; a plurality of electronic components mounted on the conductive plate; a plurality of control terminals electrically connected to the plurality of electronic components; a holding member having insulating properties and holding the plurality of control terminals and the conductive plate; and a control substrate, outputting a signal to the electronic component via the control terminal, The control terminal is an insert integrally formed with the resin holding member. The control terminal has, at its pad portion: an exposed surface exposed from the holding member; A contact surface is a surface opposite to the exposed surface and in contact with the holding member; a first side surface located between the exposed surface and the contact surface; and The second side surface is a surface opposite to the first side surface and is located between the exposed surface and the contact surface. A first space portion is formed on the side of the first side surface, and a second space portion is formed on the side of the second side surface. The control terminal comprises: a first terminal body portion, which is in the shape of an elongated plate and is connected to the control substrate; a pad portion, which is electrically connected to the first terminal body portion, is provided along the holding component, and has the exposed surface and the contact surface; and a second terminal body portion, which is electrically connected to the pad portion and the electronic component. When the direction in which the first terminal main body extends from the pad portion toward the control substrate is defined as a first direction, The pad portion and the first terminal main body portion are held by the holding member and are located closer to the first direction side than the conductive plate. The electronic component is mechanically and electrically connected to a surface of the conductive plate on a second direction side opposite to the first direction. The electronic component is mechanically and electrically connected to a surface of the second terminal body portion on the second direction side.

2. The circuit structure according to claim 1, wherein The holding component has: a thick-walled portion in contact with the contact surface; a first film portion made of resin, covering the first side surface; and a second film portion made of resin, covering the second side surface, The side surface of the first thin film portion is exposed in the first space portion, A side surface of the second thin film portion is exposed in the second space portion.

3. The circuit structure according to claim 1, wherein The pad portion extends from the base of the first terminal body portion. The holding member includes a first embedded portion that embeds a boundary region between the first terminal main body portion and the pad portion of the control terminal.

4. The circuit structure according to claim 2, wherein: The pad portion extends from the base of the first terminal body portion. The holding member includes a first embedded portion that embeds a boundary region between the first terminal main body portion and the pad portion of the control terminal.

5. The circuit structure according to any one of claims 1 to 4, wherein: The pad portion extends from the base of the second terminal body portion. The holding member has a second embedded portion, and the second embedded portion embeds a boundary area between the pad portion and the second terminal main body portion. The second embedded portion has a resin surface, and the resin surface is flush with the exposed surface of the pad portion.

6. The circuit structure according to any one of claims 1 to 4, wherein: The second terminal body has: a terminal surface, exposed from the holding member and connected to the electronic component; and The second exposed surface is a surface opposite to the terminal surface and is exposed from the holding member.

7. The circuit structure according to claim 5, wherein: The second terminal body has: a terminal surface, exposed from the holding member and connected to the electronic component; and The second exposed surface is a surface opposite to the terminal surface and is exposed from the holding member.

8. An electrical connection box comprising: The circuit structure according to any one of claims 1 to 7; and The cover covers the circuit structure.

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