A display panel, its manufacturing method, and a display device.

Abstract

A display panel and its manufacturing method and display device are disclosed. The display panel includes: a driving substrate (1); a pixel defining layer (2) located on one side of the driving substrate (1), the pixel defining layer (2) including a plurality of arrayed first pixel separators (21), adjacent first pixel separators (21) forming a plurality of first pixel regions (A1); a plurality of light-emitting devices (3) located within corresponding first pixel regions (A1); a first encapsulation layer (4) covering the pixel defining layer (2) and the plurality of light-emitting devices (3); a transparent heat insulation layer (5) located on the side of the first encapsulation layer (4) facing away from the driving substrate (1), the transparent heat insulation layer (5) projecting onto the driving substrate (1) onto the side facing away from the driving substrate (1). The first pixel region (A1) is partially covered by the orthogonal projection on the driving substrate (1); a pixel isolation structure (6) is located on the side of the transparent heat insulation layer (5) away from the driving substrate (1). The pixel isolation structure (6) includes a plurality of arrayed second pixel separators (61). Adjacent second pixel separators (61) surround and form a plurality of second pixel regions (A2). The second pixel regions (A2) are correspondingly arranged with the first pixel region (A1); a color conversion layer (7) includes a plurality of color conversion parts (71, 72 and 73). The plurality of color conversion parts (71, 72 and 73) are arranged in the corresponding second pixel regions (A2).

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] Currently, QD-OLED (Quantum dot-Organic Light Emitting Display) panels are an emerging display technology. Their working principle is the combination of quantum dot conversion film and OLED. An additional quantum dot conversion film is added to the original OLED screen structure. The quantum dot conversion film converts the wavelength of the light emitted by the OLED. Summary of the Invention

[0003] This disclosure provides a display panel, which includes:

[0004] Drive substrate;

[0005] A pixel defining layer is located on one side of the driving substrate. The pixel defining layer includes a plurality of arrayed first pixel separators, and adjacent first pixel separators enclose a plurality of first pixel regions.

[0006] Multiple light-emitting devices are located within the corresponding first pixel area;

[0007] A first encapsulation layer covers the pixel defining layer and the plurality of light-emitting devices;

[0008] A transparent heat insulation layer is located on the side of the first encapsulation layer opposite to the driving substrate, and the orthographic projection of the transparent heat insulation layer on the driving substrate at least covers the orthographic projection of the first pixel area on the driving substrate.

[0009] A pixel isolation structure is located on the side of the transparent heat insulation layer away from the driving substrate. The pixel isolation structure includes a plurality of arrayed second pixel separators. Adjacent second pixel separators are arranged to form a plurality of second pixel regions. The second pixel regions are correspondingly arranged with the first pixel regions.

[0010] A color conversion layer includes multiple color conversion units, which are disposed within corresponding second pixel regions.

[0011] Optionally, in the display panel provided in the embodiments of this disclosure, the transparent heat insulation layer has a plurality of hollow portions and a plurality of heat insulation portions, and the orthographic projection of the heat insulation portions on the driving substrate covers the orthographic projection of the first pixel region on the driving substrate.

[0012] Optionally, the display panel provided in the embodiments of this disclosure further includes a first light-shielding layer, the first light-shielding layer including a light-shielding portion that fills the hollow portion, and the orthogonal projection of the pixel isolation structure on the driving substrate covers the orthogonal projection of the light-shielding portion on the driving substrate.

[0013] Optionally, in the display panel provided in the embodiments of this disclosure, the material of the first light-shielding layer is a positive photoresist, the material of the transparent heat-insulating layer is a negative photoresist with heat-insulating properties, or the material of the transparent heat-insulating layer includes a negative photoresist body and a phase change material mixed in the negative photoresist body.

[0014] Optionally, in the display panel provided in the embodiments of this disclosure, along the thickness direction of the driving substrate, the cross-sectional shape of the light-shielding portion is approximately a regular trapezoid, and the cross-sectional shape of the heat-insulating portion is approximately an inverted trapezoid.

[0015] Optionally, in the display panel provided in the embodiments of this disclosure, the phase change material is an organic phase change material, which includes paraffin, higher fatty acids, polyolefins, or alcohols.

[0016] Optionally, in the display panel provided in the embodiments of this disclosure, the thickness of the first light-shielding layer and the transparent heat-insulating layer are both 2μm to 3μm.

[0017] Optionally, in the display panel provided in the embodiments of this disclosure, the thickness of the pixel isolation structure is 2-5 times the thickness of the transparent heat insulation layer.

[0018] Optionally, in the display panel provided in the embodiments of this disclosure, the color of the pixel isolation structure is one of black, yellow, or gray.

[0019] Optionally, in the display panel provided in the embodiments of this disclosure, the pixel isolation structure contains inorganic nanoparticles, which are used to scatter light incident on the sidewalls of the pixel isolation structure.

[0020] Optionally, in the display panel provided in the embodiments of this disclosure, the material of the pixel isolation structure is the same as the material of the light-shielding part, and the pixel isolation structure and the light-shielding part are an integral structure.

[0021] Optionally, the display panel provided in the embodiments of this disclosure further includes: a second encapsulation layer covering the color conversion layer and the pixel isolation structure, a plurality of color filters located on the side of the second encapsulation layer away from the driving substrate and corresponding to the color conversion portion, and a second light-shielding layer located between each of the color filters.

[0022] Accordingly, this disclosure also provides a display device, including the display panel described in any of the above embodiments.

[0023] Optionally, the display device provided in the embodiments of this disclosure further includes a cover plate covering the display panel.

[0024] Accordingly, this disclosure also provides a method for manufacturing the display panel described in any of the above claims, comprising:

[0025] Provide a driving substrate;

[0026] A pixel defining layer is formed on the driving substrate; the pixel defining layer includes a plurality of arrayed first pixel separators, and adjacent first pixel separators enclose a plurality of first pixel regions.

[0027] A corresponding light-emitting device is formed within the first pixel area;

[0028] A first encapsulation layer is formed covering the pixel defining layer and the plurality of light-emitting devices;

[0029] A transparent heat insulation layer is formed on the side of the first encapsulation layer opposite to the driving substrate; wherein, the orthographic projection of the transparent heat insulation layer on the driving substrate at least covers the orthographic projection of the first pixel region on the driving substrate;

[0030] A pixel isolation structure is formed on the side of the transparent heat insulation layer away from the driving substrate; wherein, the pixel isolation structure includes a plurality of arrayed second pixel separators, adjacent second pixel separators enclosing a plurality of second pixel regions, and the second pixel regions are correspondingly arranged with the first pixel regions;

[0031] A corresponding color conversion section is formed within the second pixel area.

[0032] Optionally, in the manufacturing method provided in the embodiments of this disclosure, a pixel isolation structure is formed on the side of the transparent heat insulation layer opposite to the driving substrate, specifically:

[0033] A pixel isolation material film is deposited on the side of the transparent heat insulation layer opposite to the driving substrate;

[0034] The pixel isolation material film is exposed and developed to form a pixel isolation material film including multiple arrayed second pixel separators;

[0035] The pixel isolation material film is first heated and cured on the side of the pixel isolation material film away from the transparent heat insulation layer to form the pixel isolation structure.

[0036] Optionally, in the above-described fabrication method provided in the embodiments of this disclosure, before forming the pixel isolation structure, the method further includes:

[0037] A first light-shielding material film is deposited on the side of the transparent heat insulation layer opposite to the driving substrate;

[0038] The first light-shielding material film layer is exposed and developed to form a first light-shielding material that fills the hollow portion;

[0039] The first light-shielding material is heated and cured a second time on the side of the first light-shielding material film layer away from the transparent heat insulation layer to form the light-shielding part.

[0040] Optionally, in the manufacturing method provided in the embodiments of this disclosure, the same mask is used to form the transparent heat insulation layer and the first light-shielding layer.

[0041] Optionally, in the manufacturing method provided in the embodiments of this disclosure, the temperature of the first heating and curing is greater than the temperature of the second heating and curing. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present disclosure;

[0044] Figure 2 This is a schematic diagram of the structure of another display panel provided in an embodiment of the present disclosure;

[0045] Figure 3 This is a schematic diagram of the structure of another display panel provided in an embodiment of the present disclosure;

[0046] Figure 4 This is a schematic diagram of the structure of another display panel provided in an embodiment of the present disclosure;

[0047] Figure 5 This is a schematic diagram of the structure of another display panel provided in an embodiment of the present disclosure;

[0048] Figure 6A This is an enlarged structural schematic diagram of a light-shielding portion in a display panel provided in an embodiment of the present disclosure;

[0049] Figure 6B This is an enlarged structural schematic diagram of a heat insulation portion in a display panel provided in an embodiment of the present disclosure;

[0050] Figure 6C This is an enlarged structural diagram of a second pixel separator in a display panel provided in an embodiment of the present disclosure;

[0051] Figure 7 This is a schematic diagram of the structure of another display panel provided in an embodiment of the present disclosure;

[0052] Figure 8 This is a top-view diagram of the first pixel region;

[0053] Figure 9 A schematic flowchart illustrating a method for manufacturing a display panel according to an embodiment of this disclosure;

[0054] Figure 10 A schematic flowchart illustrating another method for manufacturing a display panel according to an embodiment of this disclosure;

[0055] Figure 11 A schematic flowchart illustrating another method for manufacturing a display panel according to an embodiment of this disclosure;

[0056] Figures 12A-12K A schematic diagram of the structure after each manufacturing step of a method for manufacturing a display panel provided in this embodiment of the present disclosure;

[0057] Figure 13 This is a schematic diagram of the structure of a display device provided in an embodiment of the present disclosure;

[0058] Figure 14 This is a schematic diagram of the structure of another display device provided in an embodiment of the present disclosure;

[0059] Figure 15 This is a schematic diagram of the structure of another display device provided in an embodiment of the present disclosure;

[0060] Figure 16 This is a schematic diagram of the structure of another display device provided in an embodiment of the present disclosure;

[0061] Figure 17 This is a schematic diagram of the structure of another display device provided in an embodiment of the present disclosure. Detailed Implementation

[0062] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Furthermore, the embodiments and features in the embodiments of this disclosure can be combined with each other without conflict. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0063] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that an element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect.

[0064] It should be noted that the dimensions and shapes of the figures in the accompanying drawings do not reflect actual scale and are intended only to illustrate the content of this disclosure. Furthermore, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.

[0065] QD-OLED device structures can be divided into two types. One is the cell-on-cell type, where the blue OLED and QD conversion layer are fabricated on two separate substrates and then formed in a cell-on-cell manner. Generally, the cell-on-cell structure has a thicker cell due to filler layers and is prone to color crosstalk. The other type of QD-OLED structure uses a color filter on encapsulation (COE) technology. This involves encapsulating a filter on the light-emitting side of the OLED display panel. Since the filter can filter light, it can also reduce the amount of ambient light entering the OLED display panel that is reflected by the internal structure of the OLED display panel and emitted from the light-emitting side. This structure has a thinner cell and a higher color gamut. In COE technology, different color filters need to be defined by pixel isolation structures (Banks), which means that Banks need to be fabricated on the OLED. The material of the Bank is generally resin, and the curing temperature of the resin is generally above 180°C. High-temperature curing will have an adverse effect on the performance of the OLED and thin-film transistor (TFT) below. If a low-temperature curing of 85°C is used, the curing will be incomplete, causing QD ink to penetrate into adjacent pixels through the Bank, resulting in color crosstalk.

[0066] In view of this, embodiments of this disclosure provide a display panel, such as Figures 1-5 As shown, it includes:

[0067] Drive substrate 1;

[0068] The pixel defining layer 2 is located on one side of the driving substrate 1. The pixel defining layer 2 includes a plurality of arrayed first pixel separators 21, and adjacent first pixel separators 21 surround to form a plurality of first pixel regions A1.

[0069] Multiple light-emitting devices 3 are located within the corresponding first pixel region A1;

[0070] The first encapsulation layer 4 covers the pixel defining layer 2 and multiple light-emitting devices 3;

[0071] The transparent heat insulation layer 5 is located on the side of the first encapsulation layer 4 away from the driving substrate 1. The orthogonal projection of the transparent heat insulation layer 5 on the driving substrate 1 at least covers the orthogonal projection of the first pixel area A1 on the driving substrate 1.

[0072] The pixel isolation structure 6 is located on the side of the transparent heat insulation layer 5 away from the driving substrate 1. The pixel isolation structure 6 includes a plurality of arrayed second pixel separators 61. Adjacent second pixel separators 61 surround and form a plurality of second pixel regions A2. The second pixel regions A2 are correspondingly arranged with the first pixel regions A1.

[0073] The color conversion layer 7 includes multiple color conversion units (71, 72 and 73), which are disposed in the corresponding second pixel area A2.

[0074] The display panel provided in this embodiment of the present disclosure has a transparent heat insulation layer 5 provided on the side of the first encapsulation layer 4 away from the driving substrate 1. The transparent heat insulation layer 5 can protect the light-emitting device 3 below the first encapsulation layer 4 from high temperature damage. Therefore, when the pixel isolation structure 6 is subsequently formed, a high temperature curing process can be used to ensure that the material of the pixel isolation structure 6 is completely cured, and to prevent the color conversion layer 7 from color mixing problem caused by incomplete curing of the pixel isolation structure 6.

[0075] In specific implementation, in the display panel provided in the embodiments of this disclosure, such as Figure 1 As shown, the transparent heat insulation layer 5 can be a structure that covers the entire surface. The transparent heat insulation layer 5 can protect the light-emitting device 3 below from high-temperature damage and improve the light-emitting performance.

[0076] In practical implementation, since the light-emitting device emits light at a certain angle, such as 120°, the light reflected from the device not only strikes the corresponding color conversion section above it but also strikes adjacent color conversion sections, thus easily causing color crosstalk. To avoid this color crosstalk problem, in the display panel provided in the embodiments of this disclosure, such as... Figures 2-5 As shown, the transparent heat insulation layer 5 can have multiple cutouts and multiple heat insulation portions 51. The orthographic projection of the heat insulation portion 51 on the driving substrate 1 covers the orthographic projection of the first pixel area A1 on the driving substrate 1. In this way, the heat insulation portion 51 can protect the light-emitting device 3 below from high-temperature damage, while a light-shielding portion can be provided in the cutout to prevent color bleeding.

[0077] In specific implementation, in the display panel provided in the embodiments of this disclosure, such as Figures 2-5 As shown, it also includes a first light-shielding layer 8, which includes a light-shielding portion 81 filling the hollow portion. The orthographic projection of the pixel isolation structure 6 on the driving substrate 1 covers the orthographic projection of the light-shielding portion 81 on the driving substrate 1. In this way, the light-shielding portion 81 filled in the hollow portion of the transparent heat insulation layer 5 can prevent color mixing between adjacent pixels. In addition, since the heat insulation portion 51 is prepared before the light-shielding portion 81, and because the light-shielding portion 81 needs to be cured by high-temperature post-baking, the heat insulation portion 51 needs to be prepared first to protect the light-emitting device 3, and then the light-shielding portion 81 is prepared and then flipped for curing, reducing thermal damage to the underlying light-emitting device.

[0078] Specifically, such as Figures 2-5 As shown, the thickness of the light-shielding part 81 can be the same as the thickness of the heat-insulating part 51.

[0079] In practical implementation, photoresists are generally divided into positive and negative photoresists. Positive photoresists, after exposure and development, approximate a trapezoidal shape, while negative photoresists approximate an inverted trapezoidal shape. For COE-type structures, considering actual light emission, such as... Figures 2-5 As shown, it is desirable that the light-shielding portion 81 is a positive trapezoid. Therefore, the light-shielding portion 81 is preferably formed by exposure and development with positive photoresist, while the heat-insulating portion 51 is formed by exposure and development with negative photoresist. Therefore, in the display panel provided in the embodiments of this disclosure, as Figures 2-5As shown, the material of the first light-shielding layer 8 is positive photoresist, and the material of the transparent heat-insulating layer 5 is negative photoresist with heat-insulating properties. The negative photoresist with heat-insulating properties has specific heat-insulating properties, thereby protecting the light-emitting device 3 from high-temperature damage; or, the material of the transparent heat-insulating layer 5 includes a negative photoresist body and a phase change material mixed in the negative photoresist body. The phase change material absorbs heat when heated and changes from one form to another to achieve heat absorption. This can solve the problem of poor low-temperature curing of the pixel isolation structure 6 and the light-shielding part 81 provided in the embodiments of this disclosure, and can also absorb the heat generated by the light-emitting device 3 during subsequent device use.

[0080] Specifically, such as Figures 2-5 As shown, since the light-shielding part 81 is formed by exposure and development of positive photoresist and the heat-insulating part 51 is formed by exposure and development of negative photoresist, that is, the light-shielding part 81 and the heat-insulating part 51 are made of photoresists with opposite photolithographic properties. Therefore, the light-shielding part 81 and the heat-insulating part 51 can be directly prepared using the same mask, saving one mask and thus saving costs.

[0081] Of course, in practice, the light-shielding part 81 can also be formed by exposure and development with negative photoresist, while the heat insulation part 51 can be formed by exposure and development with positive photoresist.

[0082] In specific implementation, in the display panel provided in the embodiments of this disclosure, the phase change material can be an organic phase change material, which may include, but is not limited to, paraffin wax, higher fatty acids, polyolefins or alcohols.

[0083] In specific implementation, in the display panel provided in the embodiments of this disclosure, such as Figures 2-5 As shown, since the material of the first light-shielding layer 8 is positive photoresist and the material of the transparent heat-insulating layer 5 is negative photoresist, the cross-sectional shape of the light-shielding portion 81 along the thickness direction of the driving substrate 1 is approximately a trapezoid, that is, the angle θ1 between the side tangent a and the bottom tangent b in the cross-section of the light-shielding portion 81 is less than 90 degrees. Figure 6A As shown; the cross-sectional shape of the heat insulation part 51 is approximately an inverted trapezoid, that is, the angle θ2 between the tangent line on the side c and the tangent line on the bottom d of the cross-section of the heat insulation part 51 is greater than 90 degrees, as shown. Figure 6B As shown. This increases the light emission angle of the light-emitting device 3.

[0084] In specific implementation, in the display panel provided in the embodiments of this disclosure, such as Figures 2-5 As shown, the thermal conductivity of the heat insulation part 51 is less than 0.1 W / m·K, and the transmittance of visible light (380nm-780nm) is greater than 97%. Along the thickness direction of the driving substrate 1, the angle θ3 between the side tangent (c) and the bottom tangent (d) in the cross-section of the heat insulation part 51 can be 90° to 110°. Figure 6B As shown, the light-shielding part 81 has an absorption rate of more than 95% for visible light (380nm-780nm).

[0085] In specific implementation, in the display panel provided in the embodiments of this disclosure, such as Figures 1-5 As shown, the thickness of the first light-shielding layer 8 and the transparent heat-insulating layer 5 is 2μm to 3μm.

[0086] In specific implementation, in the display panel provided in the embodiments of this disclosure, such as Figures 1-5 As shown, the thickness of the pixel isolation structure 6 is 2-5 times the thickness of the transparent heat insulation layer 5. Specifically, the smaller this thickness ratio, the larger the distance between the color conversion part and the light-emitting device, resulting in color crosstalk; if the thickness ratio is too large, the transparent heat insulation layer 5 will not be able to provide heat insulation, damaging the performance of the light-emitting device.

[0087] In specific implementations, in the display panel provided in the embodiments of this disclosure, the color of the pixel isolation structure can be black, yellow, or gray, and the thickness of the pixel isolation structure can be 7μm to 10μm, preferably 9μm to 10μm, with an absorption rate of more than 95% for visible light (380nm-780nm). Specifically, the black pixel isolation structure has a stronger light absorption capacity than the yellow or gray pixel isolation structures. To improve the light emission efficiency of the color conversion layer, the color of the pixel isolation structure can be set to yellow or gray; to avoid the influence of ambient light on the device, the color of the pixel isolation structure can be set to black, and the choice can be made according to actual needs. For example, as... Figure 2 As shown, the color of pixel isolation structure 6 is black; as Figure 3 and Figure 5 As shown, the color of pixel isolation structure 6 is yellow; as Figure 4 As shown, the color of pixel isolation structure 6 is gray.

[0088] In specific implementation, such as Figures 2-5 As shown, along the thickness direction of the driving substrate 1, the angle θ3 between the side tangent e and the bottom tangent f in the cross-section of the second pixel separator 61 can be 60° to 85°. Figure 6C As shown.

[0089] In specific implementations, the pixel isolation structure 6 in the display panel provided in the embodiments of this disclosure may also contain inorganic nanoparticles, so as to... Figure 4 Taking the gray pixel isolation structure 6 shown as an example, which contains inorganic nanoparticles 601, these inorganic nanoparticles 601 generally have a scattering effect. The inorganic nanoparticles 601 are used to scatter light incident on the sidewalls of the pixel isolation structure 6. Therefore, using a pixel isolation structure 6 doped with inorganic nanoparticles can improve the light efficiency of the color conversion layer and enhance the display effect.

[0090] In specific implementation, in the display panel provided in the embodiments of this disclosure, such as Figure 4 As shown, the inorganic nanoparticles 601 may include one or a combination of TiO2 and SiO2. Of course, inorganic nanoparticles may also be other materials with scattering effects, which will not be listed here.

[0091] In specific implementation, in the display panel provided in the embodiments of this disclosure, such as Figures 2-5 As shown, the light-emitting device 3 can be a blue light-emitting device, and the color conversion unit can include a red quantum dot color film 71, a green quantum dot color film 72, and a scattering particle film 73. Since the light emission is achieved using the three primary colors of red, green, and blue, and the light-emitting device 3 is a blue light-emitting device, there is no need to set a blue quantum dot color film at the corresponding position; instead, scattering particles can be used to fill the space. The scattering particles can improve the light emission viewing angle.

[0092] In specific implementation, in the display panel provided in the embodiments of this disclosure, such as Figure 5 As shown, it also includes a reflective structure 9 covering the pixel isolation structure 6. The reflective structure 9 is made of metal. The metal material can reflect light, improving the light efficiency of the quantum dot color film layer, and can also prevent crosstalk between adjacent sub-pixel areas. The reflective structure 9 can improve the reflectivity of light, which helps to improve the light extraction effect. The reflectivity of the reflective structure 9 for visible light (380nm-780nm) is preferably 50% to 70%.

[0093] In specific implementation, the material of the reflective structure can be, but is not limited to, silver or aluminum and alloys, and the thickness of the reflective structure 9 is 200nm-400nm.

[0094] It should be noted that the embodiments disclosed herein... Figure 5 The reflection structure 9 is set only when the color of the pixel isolation structure 6 is yellow. Of course, the reflection structure 9 can also be set when the color of the pixel isolation structure 6 is black or gray.

[0095] In specific implementation, in the display panel provided in the embodiments of this disclosure, such as Figure 7 As shown, the material of the pixel isolation structure 6 can be the same as that of the light-shielding part 81, for example, both being black matrix material (BM). In this way, the pixel isolation structure 6 and the light-shielding part 81 can be an integral structure. This allows the pixel isolation structure 6 and the light-shielding part 81 to be formed in a single patterning process, eliminating the need for a separate process to fabricate the pixel isolation structure 6. This simplifies the fabrication process, saves production costs, and improves production efficiency.

[0096] In practical implementation, when the OLED display panel is in a screen-off state, in order to improve product quality and market competitiveness, the viewing area of ​​the display panel needs to be darker when viewed from the outside. Since blue light exists in ambient light, it excites the quantum dot color filter to emit light when the screen is off. Therefore, in the display panel provided in the embodiments of this disclosure, as... Figures 1-5 and Figure 7 As shown, it also includes: a second encapsulation layer 10 covering the color conversion layer 7 and the pixel isolation structure 6; a plurality of color filters (101, 102, 103) located on the side of the second encapsulation layer 10 facing away from the driving substrate 1 and corresponding to the color conversion units (71, 72, 73); and a second light-shielding layer 20 located between each color filter (101, 102, 103). Specifically, a red color filter 101 is provided at the position corresponding to the red quantum dot color film 71, a green color filter 102 is provided at the position corresponding to the green quantum dot color film 72, and a blue color filter 103 is provided at the position corresponding to the scattering particle film 73, so as to block blue light in the ambient light when the screen is off, thereby improving product performance.

[0097] Specifically, such as Figures 1-5 and Figure 7 As shown, the material of the second encapsulation layer 10 may include SiOx, SiNx or Al2O3, the thickness of the second encapsulation layer 10 is less than 1 μm, preferably less than 0.5 μm, and the refractive index of the second encapsulation layer 10 is in the range of 1.7 to 2.0, preferably in the range of 1.75 to 1.85.

[0098] Specifically, such as Figures 1-5 and Figure 7 As shown, the thickness of the color filter (101, 102, 103) and the second light-shielding layer 20 is less than 3 μm.

[0099] In practical implementation, the light-emitting device includes a cathode. External light passing through the cathode (usually a metal) is reflected back, causing us to see ourselves on the screen, affecting the viewing experience and contrast. Therefore, to prevent glare, in the display panel provided in the embodiments of this disclosure, such as... Figures 1-5 and Figure 7 As shown, it also includes a polarizer 30 located on the side of the plurality of color filters (101, 102, 103) facing away from the driving substrate 1. The polarizer 30 is a reflective polarizer, preferably a reflective polarizer with slightly higher reflectivity in the blue light band.

[0100] In specific implementation, such as Figures 1-5 and Figure 7As shown, the driving substrate 1 can be an oxide TFT substrate or a low-temperature polycrystalline silicon TFT substrate. Specifically, the driving substrate 1 includes a substrate 11 and a thin-film transistor 12 located on the substrate 11. The substrate 11 can be made of rigid glass or plastic. The light-emitting device 3 includes a reflective anode 31, a light-emitting layer 32, and a cathode (not shown) sequentially stacked within the first pixel region A1. The cathode is generally disposed over its entire surface.

[0101] In specific implementation, such as Figures 1-5 and Figure 7 As shown, the first encapsulation layer 4 can employ thin-film encapsulation (TFE). The first encapsulation layer 4 may include a three-layer stacked structure: the first layer is an inorganic layer (SiN or SiON layer), the second layer is an organic layer (IJP), and the third layer is an inorganic layer (SiN or SiON layer). The light-emitting device can emit light from the top (i.e., a top-emitting device), with a wavelength center range of 420nm to 470nm and a full width at half maximum (FWHM) of 10nm to 30nm. The first encapsulation layer 4 has high transparency (e.g., transmittance > 90%, preferably ≥ 95%) and a thickness of less than 10µm (80–120ppi).

[0102] In specific implementation, such as Figure 8 As shown, Figures 1-5 and Figure 7 The pixel defining layer 2 defines a plurality of first pixel regions A1, wherein the area of ​​the first pixel region A1 corresponding to the green quantum dot color film 72 (LA1) ≥ the area of ​​the first pixel region A1 corresponding to the red quantum dot color film 71 (LA2) ≥ the area of ​​the first pixel region A1 corresponding to the scattering particle film 73 (LA3).

[0103] Based on the same inventive concept, this disclosure also provides a method for manufacturing the above-mentioned display panel, such as... Figure 9 As shown, it includes:

[0104] S901, Provides a driving substrate;

[0105] S902. A pixel defining layer is formed on the driving substrate; the pixel defining layer includes a plurality of arrayed first pixel separators, and adjacent first pixel separators enclose a plurality of first pixel regions.

[0106] S903, Form a corresponding light-emitting device within the first pixel area;

[0107] S904, forming a first encapsulation layer that covers the pixel definition layer and multiple light-emitting devices;

[0108] S905, A transparent heat insulation layer is formed on the side of the first encapsulation layer away from the driving substrate; wherein, the orthogonal projection of the transparent heat insulation layer on the driving substrate at least covers the orthogonal projection of the first pixel area on the driving substrate.

[0109] S906. A pixel isolation structure is formed on the side of the transparent heat insulation layer away from the driving substrate; wherein, the pixel isolation structure includes a plurality of arrayed second pixel separators, adjacent second pixel separators surround to form a plurality of second pixel regions, and the second pixel regions are correspondingly arranged with the first pixel regions.

[0110] S907, A corresponding color conversion unit is formed within the second pixel area.

[0111] The method for manufacturing the display panel provided in this embodiment forms a transparent heat insulation layer on the side of the first encapsulation layer away from the driving substrate. The transparent heat insulation layer can protect the light-emitting device below the first encapsulation layer from high-temperature damage. Therefore, when forming the pixel isolation structure, a high-temperature curing process can be used to ensure that the material of the pixel isolation structure is completely cured, and to prevent color crosstalk in the color conversion layer caused by incomplete curing of the pixel isolation structure.

[0112] In specific implementation, in the manufacturing method provided in the embodiments of this disclosure, a pixel isolation structure is formed on the side of the transparent heat insulation layer facing away from the driving substrate, such as... Figure 10 As shown, specifically it can be:

[0113] S1001, Deposit a pixel isolation material film on the side of the transparent heat insulation layer away from the driving substrate;

[0114] S1002. Expose and develop the pixel isolation material film to form a pixel isolation material film including multiple arrayed second pixel separators;

[0115] S1003. The pixel isolation material film layer is heated and cured for the first time on the side close to the pixel isolation material film layer to form a pixel isolation structure.

[0116] In specific implementation, in the manufacturing method provided in the embodiments of this disclosure, such as Figure 11 As shown, before forming the pixel isolation structure, the following steps are also included:

[0117] S1101, Deposit a first light-shielding material film layer on the side of the transparent heat insulation layer away from the driving substrate;

[0118] S1102. Expose and develop the first light-shielding material film layer to form the first light-shielding material filling the hollow part;

[0119] S1103. The first light-shielding material is heated and cured a second time on the side near the first light-shielding material film layer to form a light-shielding part.

[0120] In practical implementation, the manufacturing method provided in this embodiment uses the same mask to form the transparent heat insulation layer and the first light-shielding layer. This saves on one mask, thereby reducing costs.

[0121] In specific implementations, in the manufacturing method provided in the embodiments of this disclosure, the temperatures of the first and second heating curing can be the same or different, depending on the material. The heating temperature and time are mainly related to the selected light-shielding part and pixel isolation structure material itself. In one possible implementation, for example, during the first heating curing, the heating source is farther from the light-emitting device, while during the second heating curing, the heating source is closer to the light-emitting device. Therefore, the temperature of the first heating curing can be appropriately increased, and thus the temperature of the first heating curing can be higher than the temperature of the second heating curing. However, the specific temperature depends on the degree of curing in both curing processes.

[0122] The following is about Figure 2 The manufacturing method of the display panel shown is explained in detail:

[0123] (1) Fabricating the driving substrate 1, specifically, fabricating thin-film transistors 12 on the substrate 11, such as... Figure 12A As shown, the specific manufacturing method is the same as the existing technology, and will not be described in detail here.

[0124] (2) A pixel defining layer 2, a reflective anode 31, a light-emitting layer 32, and a cathode (not shown) are sequentially formed on the driving substrate 1, such as... Figure 12B As shown; specifically, the pixel defining layer 2 includes a plurality of first pixel separators 21 arranged in an array, adjacent first pixel separators 21 enclosing a first pixel region A1, a reflective anode 31 and a light-emitting layer 32 located within the first pixel region A1, and a cathode covering the entire surface of the pixel defining layer 2 and the light-emitting device 3 (reflective anode 31 and light-emitting layer 32). The manufacturing methods of the pixel defining layer 2, the reflective anode 31, the light-emitting layer 32 and the cathode are the same as those in the prior art and will not be described in detail here.

[0125] (3) A first encapsulation layer 4 is formed on the side of the cathode away from the driving substrate 1, such as Figure 12C As shown; specifically, the first encapsulation layer 4 may include a three-layer stacked structure, the first layer being an inorganic layer (SiN or SiON layer), the second layer being an organic layer (IJP), and the third layer being an inorganic layer (SiN or SiON layer).

[0126] (4) A transparent heat insulation layer 5 is formed on the side of the first encapsulation layer 4 away from the driving substrate 1. The transparent heat insulation layer 5 has multiple cutouts and heat insulation portions 51, such as... Figure 12DAs shown; specifically, the material of the transparent heat insulation layer 5 can be a negative photoresist with heat insulation properties or a phase change material doped in the photoresist, so that multiple hollow parts and heat insulation parts 51 can be formed in the transparent heat insulation layer 5 by using a mask exposure and development process.

[0127] (5) A light-shielding part 81 is made in the hollow part of the transparent heat insulation layer 5, such as Figure 12E As shown; specifically, the material of the light-shielding part 81 is positive photoresist, and the light-shielding part 81 that fills the hollow part is formed by exposure and development using the same mask as the heat insulation part 51.

[0128] (6) Vertically flip the structure from step (5) and perform a second heat curing on the light-shielding part 81 (as indicated by the arrow). The temperature can be ≥180℃. Figure 12F As shown, Figure 12F The structure designated as No. 100 is a heat curing device.

[0129] (7) A pixel isolation structure 6 is formed on the side of the cured light-shielding portion 81 facing away from the driving substrate 1 by exposure and development. The pixel isolation structure 6 is made of resin and has arrayed second pixel separators 61. Adjacent second pixel separators 61 surround and form a plurality of second pixel regions A2, such as... Figure 12G As shown.

[0130] (8) Vertically flip the structure from step (7) and perform a first heat curing on the pixel isolation structure 6 (as indicated by the arrow). The temperature can be ≥180℃. Figure 12H As shown, Figure 12H The structure of No. 100 is a heat curing device; specifically, the temperature of the first heat curing can be higher than the temperature of the second heat curing.

[0131] (9) In each second pixel region A2 of step (8), a corresponding red quantum dot color film 71, a green quantum dot color film 72, and a scattering particle film 73 are formed. The red quantum dot color film 71, the green quantum dot color film 72, and the scattering particle film 73 constitute the color conversion layer 7, such as Figure 12I As shown.

[0132] (10) A second encapsulation layer 10 is formed above the structure in step (9), such as Figure 12J As shown; specifically, the material of the second encapsulation layer 10 may include SiOx, SiNx, or Al2O3, etc.

[0133] (11) A second light-shielding layer 20 corresponding to the second pixel separator 61 is formed on the side of the second encapsulation layer 10 facing away from the driving substrate 1. Color filters (101, 102, and 103) corresponding to the red quantum dot color film 71, the green quantum dot color film 72, and the scattering particle film 73 are formed between the second light-shielding layers 20. Figure 12K As shown.

[0134] (12) A polarizer 13 is formed above the structure in step (11), such as Figure 2 As shown.

[0135] Based on the same inventive concept, embodiments of the present invention also provide a display device, including any of the display panels described above in embodiments of the present invention.

[0136] In specific implementation, in the display device provided in the embodiments of the present invention, such as Figures 13-17 As shown, it may also include a cover plate 40 covering the display panel. Specifically, the cover plate 40 may be a rigid cover plate or a flexible cover plate.

[0137] The display device can be any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator. Other essential components of this display device are readily understood by those skilled in the art and will not be described in detail here, nor should they be construed as limiting the invention. The principle by which this display device solves the problem is similar to that of the aforementioned quantum dot light-emitting device; therefore, the implementation of this display device can refer to the implementation of the aforementioned display panel, and repetitions will not be repeated here.

[0138] The display panel and its manufacturing method and display device provided in the embodiments of this disclosure, by providing a transparent heat insulation layer on the side of the first encapsulation layer away from the driving substrate, can protect the light-emitting device below the first encapsulation layer from high temperature damage. Thus, when the pixel isolation structure is subsequently formed, a high-temperature curing process can be used to ensure that the material of the pixel isolation structure is completely cured, and to prevent color crosstalk in the color conversion layer caused by incomplete curing of the pixel isolation structure.

[0139] Although preferred embodiments of this disclosure have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this disclosure.

[0140] Obviously, those skilled in the art can make various modifications and variations to the embodiments of this disclosure without departing from the spirit and scope of the embodiments of this disclosure. Therefore, if these modifications and variations to the embodiments of this disclosure fall within the scope of the claims of this disclosure and their equivalents, this disclosure is also intended to include these modifications and variations.

Claims

1. A display panel, wherein, The display panel comprises: a driving substrate; a pixel definition layer located on one side of the driving substrate, the pixel definition layer comprising a plurality of first pixel partitions arranged in an array, adjacent first pixel partitions surrounding a plurality of first pixel regions; a plurality of light emitting devices located in corresponding first pixel regions; a first encapsulation layer covering the pixel definition layer and the plurality of light emitting devices; a transparent thermal insulation layer located on a side of the first encapsulation layer away from the driving substrate, a footprint of the transparent thermal insulation layer on the driving substrate covering at least a footprint of the first pixel regions on the driving substrate; a pixel isolation structure located on a side of the transparent thermal insulation layer away from the driving substrate, the pixel isolation structure comprising a plurality of second pixel partitions arranged in an array, adjacent second pixel partitions surrounding a plurality of second pixel regions, the second pixel regions corresponding to the first pixel regions; wherein the pixel isolation structure is heated and solidified from a side of the pixel isolation structure away from the transparent thermal insulation layer when the pixel isolation structure is formed; a color conversion layer comprising a plurality of color conversion portions arranged in corresponding second pixel regions.

2. The display panel of claim 1, wherein, The transparent thermal insulation layer has a plurality of hollow portions and a plurality of thermal insulation portions, a footprint of the thermal insulation portions on the driving substrate covering a footprint of the first pixel regions on the driving substrate.

3. The display panel of claim 2, wherein, Further comprising a first light shielding layer, the first light shielding layer comprising light shielding portions filling the hollow portions, a footprint of the pixel isolation structure on the driving substrate covering a footprint of the light shielding portions on the driving substrate.

4. The display panel of claim 3, wherein, The first light shielding layer is made of positive photoresist, the transparent thermal insulation layer is made of negative photoresist with thermal insulation properties, or the transparent thermal insulation layer comprises a negative photoresist body and a phase change material mixed in the negative photoresist body.

5. The display panel of claim 3, wherein, In a thickness direction of the driving substrate, a cross-sectional shape of the light shielding portions is a right trapezoid, and a cross-sectional shape of the thermal insulation portions is an inverted trapezoid.

6. The display panel of claim 4, wherein, The phase change material is an organic phase change material, and the organic phase change material comprises paraffin, higher fatty acids, polyolefins, or alcohols.

7. The display panel of claim 3, wherein, The first light shielding layer and the transparent thermal insulation layer each have a thickness of 2-3 μm.

8. The display panel of claim 3, wherein, The pixel isolation structure has a thickness of 2-5 times the thickness of the transparent thermal insulation layer.

9. The display panel of claim 3, wherein, The pixel isolation structure has a color of one of black, yellow, and gray.

10. The display panel of claim 9, wherein, The pixel isolation structure has inorganic nanoparticles for scattering light incident on a sidewall of the pixel isolation structure.

11. The display panel of claim 3, wherein, The pixel isolation structure is made of the same material as the light shielding portions, and the pixel isolation structure and the light shielding portions form an integral structure.

12. The display panel of any of claims 1-11, wherein, Further comprising: a second encapsulation layer covering the color conversion layer and the pixel isolation structure, a plurality of color filter portions corresponding to the color conversion portions on a side of the second encapsulation layer away from the driving substrate, and a second light shielding layer between the color filter portions.

13. A display device, wherein, The display panel comprises any one of claims 1-12.

14. The display device of claim 13, wherein, Further comprising a cover plate covering the display panel.

15. A method of manufacturing a display panel as claimed in any one of claims 1-12, wherein, The display panel comprises: providing a driving substrate; forming a pixel definition layer on the driving substrate; The pixel defining layer comprises a plurality of first pixel partitions arranged in an array, and adjacent first pixel partitions form a plurality of first pixel regions; A corresponding light emitting device is formed in the first pixel region; A first encapsulation layer covering the pixel defining layer and the plurality of light emitting devices is formed; A transparent thermal insulation layer is formed on the side of the first encapsulation layer away from the driving substrate, and a projection of the transparent thermal insulation layer on the driving substrate at least covers a projection of the first pixel region on the driving substrate; A pixel isolation material film layer is deposited on the side of the transparent thermal insulation layer away from the driving substrate; The pixel isolation material film layer is exposed and developed to form a pixel isolation material film layer comprising a plurality of second pixel partitions arranged in an array, and adjacent second pixel partitions form a plurality of second pixel regions corresponding to the first pixel regions; The pixel isolation material film layer is first heat-cured on the side of the pixel isolation material film layer away from the transparent thermal insulation layer to form the pixel isolation structure; A corresponding color conversion part is formed in the second pixel region.

16. The method of manufacturing of claim 15, wherein, The transparent thermal insulation layer is formed on the side of the first encapsulation layer away from the driving substrate, specifically, a transparent thermal insulation layer having a plurality of hollow parts and thermal insulation parts is formed on the side of the first encapsulation layer away from the driving substrate, and a projection of the thermal insulation part on the driving substrate covers a projection of the first pixel region on the driving substrate; Before forming the pixel isolation structure, the method further comprises: A first light-shielding material film layer is deposited on the side of the transparent thermal insulation layer away from the driving substrate; The first light-shielding material film layer is exposed and developed to form a first light-shielding material filling the hollow parts; The first light-shielding material is second heat-cured on the side of the first light-shielding material film layer away from the transparent thermal insulation layer to form a light-shielding part.

17. The production method according to claim 16, wherein The transparent thermal insulation layer and the light-shielding part are formed using the same mask.

18. The production method according to claim 16, wherein The temperature of the first heat-curing is higher than the temperature of the second heat-curing.

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