Error detection method and system for a semiconductor package

Abstract

The present application discloses a method, a system and a jig for error detection of semiconductor packages. The error detection method sequentially includes an electrical test step, an appearance detection step, a transfer error detection step and a stacking and storage step. The way of performing the electrical test first makes the steps the most concise without redundant steps. The error detection system for semiconductor packages includes an electrical test device, an appearance detection device, a replacement device and a storage device. Among them, a jig for error detection is used in the replacement device. The jig for error detection includes a hinged upper cover and a lower cover. First, the semiconductor package is slid into the jig for error detection, then the upper cover is opened to take out the non-conforming product, and after replacing the non-conforming product with a conforming product, the semiconductor package is transferred back to the packaging strip, which is convenient for assisting in picking out the non-conforming semiconductor packages in the packaging strip. This device realizes high-efficiency testing and error detection of semiconductor packages, improves the production quality of semiconductor packages and reduces the production cost.

Description

Technical Field

[0001] This application relates to the field of semiconductor picking, and in particular to a method and system for error detection of semiconductor packages. Background Art

[0002] Currently, during the production of semiconductor chips, it is necessary to perform relevant performance tests on the produced chips to ensure that the quality of the chips meets the quality inspection standards. The tests for chips mainly include electrical performance tests and appearance inspections. The electrical performance tests mainly include detecting properties such as resistivity, Hall coefficient, and magnetoresistance, and relevant electrical detection instruments are mainly used for detection during the detection; the appearance inspection is mainly to judge whether the length of the pins is qualified and whether the direction of the pins is incorrect, etc. During the inspection, the human eye is mainly used for observation, and the unqualified products are selected when unqualified situations are observed. This kind of appearance inspection not only wastes manpower but also has low picking ability. In addition, long-term work will cause visual fatigue of the human eye, prone to errors, resulting in low picking quality.

[0003] From the overall picking steps, testing each direction that needs to be tested for the chips requires multiple chip transfer processes, testing processes, and judgment processes, etc., with cumbersome operations and low efficiency. Summary of the Invention

[0004] In order to achieve high-efficiency testing and error detection of semiconductor packages and improve the production quality of semiconductor packages, this application provides a method for error detection of semiconductor packages.

[0005] The method for error detection of semiconductor packages provided by this application adopts the following technical solutions: Electrical testing S1: Conduct electrical performance tests on semiconductor packages one by one to eliminate semiconductor packages with unqualified electrical performance tests and package the qualified semiconductor packages in a transparent packaging strip, and seal the transparent packaging strip with a limit pin; Appearance inspection S2: Conduct an appearance inspection of the semiconductor packages grouped and packaged in the transparent packaging strip in the transparent packaging strip to determine the position of the semiconductor packages with unqualified appearance inspection in the transparent packaging strip; Transfer and error detection S3: Pull out the transparent packaging strip, transfer the semiconductor packages in the transparent packaging strip described in S2 with a error detection fixture, pick out the semiconductor packages with unqualified appearance inspection on the error detection fixture and replace them with qualified products, and then load the qualified products back into the transparent packaging strip and insert the limit pin; Stacking and storage S4: Stack and store the transparent packaging strips loaded with all qualified semiconductor packages in S3.

[0006] Based on the above operation steps, electrical testing and appearance inspection of semiconductor packages can be achieved. When performing appearance inspection, the semiconductor packages are set in groups, and the appearance shape tests of multiple semiconductor packages are carried out at one time, reducing the testing time and improving the testing efficiency. After detecting unqualified semiconductor packages, the non-conforming products are transferred and replaced with qualified products, so that after the error-picking operation is completed, the semiconductor packages can be stacked and stored in groups, which not only saves storage space but also facilitates counting. In addition, if the electrical test of the chip is unqualified, the chip cannot be repaired and must be directly removed. If the appearance inspection of the chip is unqualified, the chip can be made qualified through repair. Therefore, the step of performing electrical testing first and then appearance inspection is more concise and will not cause redundant steps.

[0007] Further, the transfer method in the S3 specifically includes: docking the transparent packaging strip with the error-picking fixture so that the accommodation spaces of the two are connected, and then driving the semiconductor packages in the transparent packaging strip to move into the error-picking fixture to complete the transfer of the semiconductor packages.

[0008] Based on the above operation steps, the semiconductor packages can be directly transferred from the transparent packaging strip to the error-picking fixture, with simple and fast operation, facilitating the subsequent picking out of unqualified semiconductor packages in the error-picking fixture.

[0009] Further, in the S2, a group of semiconductor packages are subjected to appearance inspection, and the positions of the unqualified semiconductor packages in each semiconductor package are recorded.

[0010] Based on the above operation steps, each time a group of semiconductor packages are subjected to appearance inspection. For the convenience of subsequent transfer operations, if non-conforming products are detected during the appearance inspection, the positions of the non-conforming products in the group of semiconductor packages are recorded, facilitating subsequent repositioning to the non-conforming products and transferring the non-conforming products.

[0011] Further, in the S3, the semiconductor packages are transferred from the transparent packaging strip to the error-picking fixture, the non-conforming products in each group of semiconductor packages are separately selected and transferred to the repair area, a qualified semiconductor package is filled in the position of the non-conforming product, and then a group of qualified semiconductor packages are transferred back to the transparent packaging strip.

[0012] Based on the above operation steps, the non-conforming products obtained in the appearance inspection are transferred to the repair area, facilitating the correction and repair of the semiconductor packages with unqualified appearances, saving production materials, reducing production costs, and at the same time replacing a qualified product in the original position of the non-conforming product, so that subsequent operations are not hindered and the error-picking rate is improved.

[0013] Further, in the step S4, the semiconductor packages are stacked and stored in groups, and a counting scale is set in the storage area.

[0014] Based on the above operation steps, a counting scale is set in the storage area. Since the semiconductor packages are stacked and stored in groups, and the number of semiconductor packages in each group is constant, the total number of semiconductor packages can be obtained by multiplying the number of groups of semiconductor packages by the number of each group. Setting a counting scale in the storage area facilitates quickly obtaining the number of groups of semiconductor packages, thereby enabling the quick acquisition of the total number of semiconductor packages.

[0015] Further, in the step S1, the specific method for rejection includes: sequentially moving the semiconductor packages, and pushing out the semiconductor packages with unqualified electrical performance test results from the moving queue of the semiconductor packages according to the results after the electrical performance test, leaving the semiconductor packages with qualified electrical performance test results to continue moving downward.

[0016] Based on the above operation steps, the semiconductor packages are arranged in a queue and moved sequentially. If a semiconductor package with unqualified electrical test is detected, it is directly pushed out of the queue, leaving all the semiconductor packages with qualified electrical tests. The operation is simple and fast.

[0017] This application also provides a fault detection system for semiconductor packages, adopting the following technical solutions:

[0018] An electrical test device is arranged in the working area. The electrical test device includes an electrical test component and a rejection component; an appearance detection device is arranged in the working area. The appearance detection device includes an appearance detection component and a second conveyor belt; a replacement device is arranged on the working area. The replacement device includes a transfer component and a fault detection jig, and the transfer component is used to transfer the semiconductor package from the transparent packaging strip to the fault detection jig.

[0019] Based on the above technical solutions, the electrical test component is used to perform electrical tests on the semiconductor packages, and the rejection component is used to reject non-conforming products. The semiconductor packages with qualified electrical tests are transferred to the appearance detection component through the first conveyor belt, and the semiconductor packages with unqualified appearance detections are transferred into the replacement device through the second conveyor belt to complete the replacement of non-conforming products, obtaining a set of qualified products.

[0020] Further, the replacement device includes a receiving plate, and an opening and closing suction cup and a transfer gripper are arranged on the receiving plate. The opening and closing suction cup is slidably connected to the receiving plate, and the opening and closing suction cup is rotatably connected to the receiving plate.

[0021] Based on the above technical solutions, setting the opening and closing suction cup facilitates opening the fault detection jig, and the transfer gripper picks out the non-conforming product located in the fault detection jig and transfers a qualified product into the position where the original non-conforming product was located.

[0022] Furthermore, the transfer component is arranged on the working area, and the transfer component includes a grabbing member and a lifting member, the grabbing member is used to grab the translucent packaging strip, and the lifting member is used to change the height of the translucent packaging strip.

[0023] Based on the above technical solution, a transfer component is provided on the working area for transferring the semiconductor package from the transparent packaging strip to the error-detecting jig. The transparent packaging strip is first transferred to a place coaxial with the error-detecting jig, and the transparent packaging strip is connected to the error-detecting jig so that the transparent packaging strip is connected to the inside of the error-detecting jig. The transparent packaging strip is grasped by a grasping member, and then one end of the transparent packaging strip is lifted by a lifting member so that the transparent packaging strip and the error-detecting jig are tilted, so that the semiconductor package can be transferred from the transparent packaging strip to the error-detecting jig to complete the transfer action.

[0024] The present application also provides a semiconductor package error detection jig, including a receiving box, fixedly connected to the receiving plate, including an upper cover and a lower cover, the upper cover is hinged to the lower cover, the upper cover and the lower cover are magnetically closed to form a receiving cavity; a connecting sleeve, fixedly connected to the receiving box, the connecting sleeve is communicated with the receiving cavity

[0025] Based on the above technical solution, the connecting sleeve is used to connect the transparent packaging strip and the error-detecting jig. The transparent packaging strip is partially inserted into the connecting sleeve, and the angles of the transparent packaging strip and the error-detecting jig are adjusted so that the semiconductor package in the transparent packaging strip slides into the containing box under the action of gravity. Then the upper cover is opened, which makes it convenient to select unqualified products and replace them with qualified products, making the operation simpler and faster.

[0026] In summary, the present application includes at least one of the following beneficial technical effects:

[0027] 1. The procedure of conducting electrical test first and then appearance test is more concise, does not produce redundant steps, and meets the requirements of production operation steps;

[0028] 2. Group semiconductor packages for appearance inspection and perform optical tests on multiple semiconductor packages at one time, which greatly saves test time and improves error detection efficiency;

[0029] 3. Set up a counting ruler in the storage area. Since semiconductor packages are stored in groups and the number of semiconductor packages in each group is constant, the number of semiconductor packages can be obtained by simply obtaining the number of groups of semiconductor packages and then multiplying it by the number of each group, which is convenient for quickly counting semiconductor packages. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A flow chart of a method for detecting errors in a semiconductor package is depicted;

[0031] Figure 2 Shows an overall schematic diagram of an error detection system for a semiconductor package;

[0032] Figure 3 Shows a schematic diagram of an error detection jig for a semiconductor package;

[0033] Figure 4 Shows a schematic diagram of the transparent packaging strip in this application.

[0034] Explanation of reference numerals: 10, working area;

[0035] 20, electrical testing device; 21, first conveyor belt; 22, electrical testing component; 23, rejection component; 231, push block; 232, first cylinder;

[0036] 30, appearance inspection device; 31, appearance inspection component; 32, second conveyor belt;

[0037] 40, replacement device; 41, third conveyor belt; 44, transfer component; 441, lifting member; 442, grasping member; 45, receiving plate; 451, opening and closing suction cup; 452, transfer gripper; 46, error detection jig; 461, connecting sleeve; 462, accommodating box; 463, upper cover; 464, lower cover; 465, limiting strip; 466, observation port; 47, adjusting plate; 48, positioning rod.

[0038] 50, storage device; 51, storage frame; 511, bottom plate; 512, back plate; 513, limiting arm; 52, tripod; 53, counting scale;

[0039] 60, placement box; 70, transparent packaging strip; 71, limiting pin; 80, semiconductor package. Detailed implementation manners

[0040] In order to make the objectives, technical solutions and advantages of the present invention clearer, the following further elaborates on a method, system and jig for error detection of a semiconductor package provided by the present invention in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0041] It should be noted that the terms "set" and "connected" should be understood in a broad sense. For example, they can be directly set and connected, or indirectly set and connected through intermediate components and intermediate structures.

[0042] In addition, in the embodiments of the present invention, if there are terms indicating orientation or positional relationships such as "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., they are based on the orientation or positional relationships shown in the drawings or the conventional placement state or usage state. They are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the structures, features, devices or elements referred to must have a specific orientation or positional relationship, nor must they be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0043] An embodiment of the present application discloses a method for detecting errors in a semiconductor package. Referring to Figure 1 , first, electrical performance tests are performed on the semiconductor package, mainly including detecting performances such as resistivity, Hall coefficient, and magnetoresistance, and the semiconductor packages with unqualified electrical performances are eliminated. Because if the electrical performance of the chip is unqualified, it is necessary to re-deseal the semiconductor, and the steps are cumbersome and the cost is high. Therefore, the semiconductor packages with unqualified electrical performance tests are directly eliminated.

[0044] Refer to Figure 1 , if the electrical test of the semiconductor package 80 is qualified, the following appearance inspection is carried out. Most of the unqualified appearances of the semiconductor package 80 are deformations, copper leakage, excessive tin, missing, and abnormal dimensions of the pins. The appearance of the semiconductor package 80 can be improved by corresponding methods such as soldering with a soldering iron and polishing. The improvement method is relatively simple. Compared with direct elimination, improving the appearance of the semiconductor package 80 and reusing it can save more costs. Therefore, when performing an appearance inspection on the chip, if the inspection of the semiconductor package 80 is qualified, the product is a qualified product and directly enters the storage device. If the appearance inspection of the semiconductor package 80 is unqualified, the semiconductor package 80 is transferred to the improvement area for improvement treatment to obtain a semiconductor package 80 with a qualified appearance inspection, and then enters the storage area.

[0045] Specifically, referring to Figure 1 , when performing electrical performance tests on the semiconductor package 80, the semiconductor packages 80 enter the electrical test device one by one, and the unqualified products are eliminated one by one. The qualified products are grouped, and then the shape and appearance inspection is carried out in groups to improve the efficiency. During the shape and appearance inspection process, if unqualified products are generated, record the positions of the unqualified products in the group of semiconductor packages 80, pick out the unqualified products according to the recorded positions and replace them with qualified products, and finally store the qualified products of the semiconductor packages 80 in groups.

[0046] Refer toFigure 2 , the error detection system of the semiconductor package 80 includes a working area 10, an electrical testing device 20, an appearance inspection device 30, a replacement device 40, and a storage device 50. Except for the storage device 50, other devices are arranged on the working area 10. The electrical testing device 20 is used to perform electrical testing on the semiconductor package 80. If the electrical test is qualified, it is transferred to the appearance inspection device 30 for appearance inspection. For the semiconductor package 80 with unqualified appearance inspection, the non-conforming product is replaced with a qualified product by the replacement device 40, and then the qualified product is transferred to the storage device 50 for storage.

[0047] Specifically, referring to Figure 2 , the electrical testing device 20 includes a first conveyor belt 21, an electrical testing component 22, and a rejection component 23. The electrical testing component 22 is fixedly arranged on both sides of the first conveyor belt 21. Along the conveying direction of the conveyor belt, the rejection component 23 is fixedly connected behind the electrical testing component 22 and is used to reject the semiconductor package 80 with unqualified electrical testing. The rejection component 23 includes a first cylinder 232 and a push plate. The push plate is fixedly connected to the output end of the first cylinder 232, and the moving direction of the push plate is perpendicular to the moving direction of the first conveyor belt 21.

[0048] The semiconductor conveyor belt is placed on the first conveyor belt 21 and is conveyed into the electrical testing component 22 by the first conveyor belt 21. If the test is qualified, it continues to be conveyed backward. If the test is unqualified, the first cylinder 232 drives the push plate to push the non-conforming product out of the first conveyor belt 21 for rejection.

[0049] The appearance inspection device 30 includes a second conveyor belt 32 and an appearance inspection component 31. The conveying direction of the second conveyor belt 32 is perpendicular to the first conveyor belt 21. A transparent packaging strip 70 is also placed on the second conveyor belt 32. Referring to Figure 4 , the transparent packaging strip 70 is made of a transparent material and has an opening on one side. A limit pin 71 is arranged at the opening end. The transparent packaging strip 70 is provided with a through hole, and the limit pin 71 is inserted into the opening of the transparent packaging strip 70 from top to bottom to prevent the semiconductor package from falling out of the transparent packaging strip 70.

[0050] Referring to Figure 2, the transparent packaging strip 70 is placed on the extension line of the first conveyor belt 21. The first conveyor belt 21 transfers the semiconductor packages 80 that have passed the electrical test into the transparent packaging strip 70, and packs the semiconductor packages 80 into a group using the transparent packaging strip 70, which is convenient for transferring them to the appearance detection component 31 to perform appearance detection on a whole group of semiconductor packages 80, thereby improving the test efficiency. At the same time, because different test devices are applicable to objects with different forms, the semiconductor packages 80 are packaged into the transparent packaging strip 70, making the object to be tested compatible with each instrument. The limit pin 71 is inserted to prevent the semiconductor packages 80 from falling out, which facilitates the subsequent storage operation of the semiconductor packages 80.

[0051] The appearance detection component 31 identifies and judges the semiconductor packages in the packaging strip. If there are non-conforming products, starting from the position of the limit pin 71, record the position of the non-conforming product in the group of semiconductor packages 80, and then transfer the entire packaging strip to the third conveyor belt 41 and pull out the limit pin 71.

[0052] Reference Figure 2 , a transfer component 44 is provided on the third conveyor belt 41, including a lifting member 441 and a grasping member 442. The lifting member 441 is slidably connected to the third conveyor belt 41, and the grasping member 442 is fixedly connected to the lifting member 441. The shape of the lifting member 441 is engaged with the shape of the transparent packaging strip 70.

[0053] Reference Figure 2 , a receiving plate 45 is arranged on the left side of the third conveyor belt 41, and a fault-finding fixture 46 is fixedly connected to the receiving plate 45. A positioning rod 48 is also slidably connected to the fault-finding fixture 46. The positioning rod 48 is used to determine that the transparent packaging strip 70 has reached the position where it is connected to the fault-finding fixture 46. After the transparent packaging strip 70 is transferred to this position, the grasping member 442 descends and is engaged with the transparent packaging strip 70, thereby playing a limiting role on the transparent packaging strip 70. The grasping member 442 can be set as any component such as a clamp or a suction cup that can be connected to the transparent packaging strip 70, and the lifting member 441 can be selected from any component such as a telescopic rod or a motor that can realize the lifting of the grasping member 442.

[0054] A fixture refers to a tool mainly used to assist in controlling position or movement. Specifically, reference Figure 3, in this embodiment, the error detection fixture 46 is used to assist in picking out unqualified semiconductor packages 80 from a group of semiconductor packages 80. The error detection fixture 46 includes a receiving box 462 and a connecting sleeve 461. The receiving box 462 and the connecting sleeve 461 are fixedly connected to the receiving plate 45. The receiving box 462 includes an upper cover 463 and a lower cover 464. The upper cover 463 is hinged to the lower cover 464. The upper cover 463 and the lower cover 464 are magnetically closed by magnets to form a receiving cavity. The connecting sleeve 461 is fixedly connected to the receiving box 462 and communicates with the receiving cavity. A circle of clamping rings is fixedly connected to the inner wall of the connecting sleeve 461, which is convenient for clamping one end of the packaging strip in the connecting sleeve 461 of the error detection fixture 46 when transferring the semiconductor package 80 from the packaging strip into the error detection fixture 46, so that the semiconductor package 80 can enter the receiving cavity of the receiving box 462. An observation port 466 is opened on the upper cover of the error detection fixture 46, which is convenient for further judging the position of the non-conforming product after the semiconductor package 80 enters the receiving cavity, and avoiding errors in taking out the non-conforming product due to incomplete transfer of the semiconductor package 80. Specifically, the upper cover 463 and the lower cover 464 of the error detection fixture 46 are both provided with limiting strips for stabilizing the semiconductor package 80 in the error detection fixture 46. When the semiconductor package 80 is placed in the error detection fixture 46, the limiting strips are clamped between the main body and the pins of the semiconductor package 80. Therefore, the limiting strips can play a limiting role on the semiconductor package 80 in the receiving box 462.

[0055] An opening and closing suction cup 451 and a transfer gripper 452 are arranged on the receiving plate 45. The opening and closing suction cup 451 is rotatably connected to the receiving plate 45 and is used to open the upper cover 463 of the error detection fixture 46. The transfer gripper 452 is slidably connected to the receiving plate 45 and is used to pick out the non-conforming product according to the position of the non-conforming product detected in the appearance detection component 31 by using the transfer gripper 452.

[0056] Two placement boxes 60 (not shown in the figure) are also placed on the left side of the receiving plate 45. One is for placing qualified products and the other is for placing non-conforming products. The transfer gripper 452 picks out the non-conforming product in the error detection fixture 46 and puts it into the placement box 60, which is convenient for subsequent improvement and saves production costs. Then, a qualified semiconductor package 80 is clamped from the placement box 60 for placing qualified products and placed in the position where the non-conforming product was originally in the error detection fixture 46, which is convenient for subsequent storage and other operations.

[0057] Reference Figure 2, the storage device 50 includes a storage frame 51 and a tripod 52 (not shown in the figure). The storage frame 51 includes a bottom plate 511, a back plate 512, and limiting arms 513 on both sides. The bottom plate 511, the back plate 512, and the limiting arms 513 are fixedly connected to each other. The storage frame 51 is fixedly connected to the tripod 52 through the back plate 512 to achieve inclined placement. The transparent packaging strip 70 is conveyed to the top of the storage frame 51 by the third conveyor belt 41 and slides downward to form stacked placement, avoiding the semiconductor package 80 being damaged due to the direct fall of the packaging strip. The orientation of the transparent packaging strip 70 during storage is determined by the position of the limiting pin 71. At this time, the limiting pin 71 plays a role in guiding the transparent packaging strip 70 to be in the same orientation. In addition, a counting scale 53 is provided on the limiting arm 513. The interval of the counting scale 53 is equal to the vertical height of the packaging strip. The reading on the counting scale 53 represents the number of packaging strips. By multiplying the number of obtained packaging strips by the number of semiconductor packages 80 in each packaging strip, it is convenient to quickly obtain the number of qualified semiconductor packages 80.

[0058] The implementation principle of an error detection system for a semiconductor package 80 in an embodiment of the present application is as follows: An electrical test component 22 and a rejection component 23 are provided on the working area 10 to perform an electrical test on the semiconductor package 80 alone. If the electrical test is unqualified, it is directly rejected. Then, the individual semiconductor packages 80 are conveyed to the packaging strip through the conveyor belt to form groups. The appearance of each group of semiconductor packages 80 is detected by the appearance detection component 31. A replacement device 40 is also provided on the working area 10. The replacement device 40 includes an adjustment plate 47 and an error detection fixture 46. If there are no non-conforming products in a group of semiconductor packages 80, the semiconductor packages 80 are directly conveyed to the storage device 50 through the conveyor belt. If a group of semiconductor packages 80 contains non-conforming products, the semiconductor packages 80 are transferred from the packaging strip to the error detection fixture 46 through the transfer component 44, the non-conforming products are picked out and replaced with qualified products, and then a group of qualified semiconductor packages 80 are transferred to the storage device 50 for stacked placement.

[0059] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A method for error detection of a semiconductor package, characterized in that, sequentially including the following steps: Electrical testing S1: Conduct electrical performance tests on multiple semiconductor packages one by one, reject the semiconductor packages with unqualified electrical performance tests among them, and package the semiconductor packages with qualified tests in a transparent packaging strip, and seal the transparent packaging strip with a limit pin; Appearance inspection S2: Conduct appearance inspection of the semiconductor packages packaged in the transparent packaging strip in step S1 while they are in the transparent packaging strip to determine the positions of the semiconductor packages with unqualified appearance inspection in the transparent packaging strip; Reprinting and error correction S3: Pull out the limit pin on the transparent packaging strip, reprint the semiconductor packages in the transparent packaging strip obtained in step S2 with an error correction fixture, pick out the semiconductor packages with unqualified appearance inspection on the error correction fixture and replace them with qualified products, and then load the qualified products and the semiconductor packages with qualified tests and appearance inspections back into the transparent packaging strip and insert the limit pin; Stacking and storing S4: Stack and store the transparent packaging strips loaded with all qualified semiconductor packages in step S3; Among them, the reprinting method in step S3 specifically includes: docking the transparent packaging strip with the error correction fixture so that their accommodation spaces are connected, and then driving the semiconductor packages in the transparent packaging strip to move into the error correction fixture to complete the reprinting of the semiconductor packages.

2. The error detection method of the semiconductor package according to claim 1, wherein: In step S2, conduct appearance inspection on a group of semiconductor packages and record the positions of the unqualified semiconductor packages in each semiconductor package.

3. The error detection method of the semiconductor package according to claim 2, characterized in that: In step S3, transfer the semiconductor packages from the transparent packaging strip to the error correction fixture, separately pick out the non-conforming products in each group of semiconductor packages and transfer them to the repair area, fill in qualified semiconductor packages at the positions of the non-conforming products, and then transfer the whole group of qualified semiconductor packages back to the transparent packaging strip.

4. The error detection method of the semiconductor package according to claim 1, characterized in that: In step S4, the semiconductor packages are stacked and stored in groups, and a counting scale is set in the storage area.

5. The error detection method of the semiconductor package according to claim 1, characterized in that: In step S1, the rejection method specifically includes: sequentially moving the semiconductor packages, and pushing out the semiconductor packages with unqualified electrical performance tests from the moving queue of the semiconductor packages according to the results of the electrical performance tests, and leaving the semiconductor packages with qualified electrical performance tests to continue moving down.

6. An error detection system for a semiconductor package, which is used to implement an error detection method for a semiconductor package as described in claim 1, characterized in that, The error correction system includes: An electrical testing device (20), arranged in the working area (10), the electrical testing device (20) includes an electrical testing component (22) and a rejection component (23); An appearance inspection device (30), arranged in the working area (10), the appearance inspection device (30) includes an appearance inspection component (31) and a second conveyor belt (32); A replacement device (40), arranged on the working area (10), the replacement device (40) includes a reprinting component (44) and an error correction fixture (46), and the reprinting component (44) is used to transfer the semiconductor packages from the transparent packaging strip (70) to the error correction fixture (46).

7. The error detection system for the semiconductor package according to claim 6, wherein: The replacement device (40) includes a receiving plate (45). An opening and closing suction cup (451) and a transfer jaw (452) are provided on the receiving plate (45). The opening and closing suction cup (451) is slidably connected to the receiving plate (45), and the opening and closing suction cup (451) is rotatably connected to the receiving plate (45).

8. The error detection system for a semiconductor package according to claim 6, characterized in that: The transfer assembly (44) is arranged on the working area (10). The transfer assembly (44) includes a grasping member (442) and a lifting member (441). The grasping member (442) is used for grasping the transparent packaging strip (70), and the lifting member (441) is used for changing the height of the transparent packaging strip (70).

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