Machine and method for tight packaging

Abstract

The present invention discloses a close packaging machine and a close packaging method. The close packaging method is implemented in cooperation with the close packaging machine. The close packaging machine comprises a film sealing device and a cutting device. The film sealing device is capable of conveying and sealing films on a plurality of circuit board groups. The cutting device comprises a first limiting frame and a cutting device arranged at intervals on the first limiting frame, and the cutting device comprises two cutting mechanisms arranged at intervals from each other, and the distance between the two cutting mechanisms is not less than any side length of a circuit board. The first limiting frame is capable of limiting a circuit board group, and the two cutting mechanisms are capable of cutting a bubble paper of the circuit board group along two mutually parallel sides of the plurality of circuit board groups at intervals simultaneously.

Description

Technical Field

[0001] This invention relates to a packaging machine and a packaging method, and more particularly to a circuit board close-fitting packaging machine and a circuit board close-fitting packaging method. Background Technology

[0002] Existing circuit boards are typically packaged manually. However, this manual packaging method is not only time-consuming and labor-intensive but also prone to errors. Furthermore, manual packaging increases the risk of damage or breakage to the circuit boards due to operational errors, thereby increasing the likelihood of secondary defects.

[0003] Therefore, how to improve the packaging efficiency of circuit boards and reduce the risk of secondary defects by replacing manpower with machinery and improving packaging methods has become one of the important issues that this business aims to solve. Summary of the Invention

[0004] This invention addresses the shortcomings of existing technologies by providing a tight-fitting packaging machine and a tight-fitting packaging method, which can effectively improve the defects that may occur in existing manual packaging methods for circuit boards.

[0005] This invention discloses a sealing packaging machine, comprising: a sealing device, including: a sealing assembly for applying film to multiple circuit board assemblies; and a conveyor belt spaced apart from the sealing assembly, the conveyor belt being used to transport multiple circuit board assemblies to the sealing assembly; wherein each circuit board assembly includes multiple stacked circuit boards, a transport plate carrying the multiple circuit boards, and a bubble wrap located between the multiple circuit boards and the transport plate; and a cutting device, including: a first limiting frame spaced around one end of the conveyor belt; and a cutting assembly spaced apart from the first limiting frame spacer, the cutting assembly including two cutting mechanisms spaced apart from each other, the distance between the two cutting mechanisms being not less than the side length of any side of the circuit board; wherein the first limiting frame spacer is used to limit one circuit board assembly transported from the conveyor belt, and the two cutting mechanisms are used to simultaneously cut the bubble wrap along two parallel sides of the multiple circuit boards spaced apart.

[0006] This invention discloses a method for airtight packaging, comprising: a sealing step: applying film to a plurality of circuit board groups disposed on a conveyor belt using a sealing device; wherein each circuit board group includes a plurality of stacked circuit boards, a transport plate carrying the plurality of circuit boards, and a bubble wrap located between the plurality of circuit boards and the transport plate; a conveying step: conveying the plurality of circuit board groups to a first limiting frame using the conveyor belt; wherein the first limiting frame can be used to limit one of the circuit board groups conveyed from the conveyor belt; and a cutting step: simultaneously cutting the bubble wrap along two parallel sides of the plurality of circuit boards at intervals using a cutting device; wherein the cutting device includes two cutting mechanisms disposed at intervals, and the distance between the two cutting mechanisms is not less than the side length of any side of the circuit board.

[0007] One of the beneficial effects of the present invention is that the airtight packaging machine and the airtight packaging method provided by the present invention can improve the packaging efficiency of multiple circuit boards and reduce the risk of secondary defects in multiple circuit boards by means of the technical solutions of "the sealing device applying film to multiple circuit board groups disposed on the conveyor belt" and "the cutting device cutting the bubble wrap at intervals along two parallel sides of multiple circuit boards simultaneously".

[0008] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Attached Figure Description

[0009] Figure 1 This is a top view schematic diagram of the sealing packaging machine according to the first embodiment of the present invention;

[0010] Figure 2 This is a schematic diagram (a) of the operation of the sealing device according to the first embodiment of the present invention;

[0011] Figure 3 This is a schematic diagram (II) of the operation of the sealing device according to the first embodiment of the present invention;

[0012] Figure 4 This is a schematic diagram (III) of the operation of the sealing device according to the first embodiment of the present invention;

[0013] Figure 5 This is a schematic diagram (four) of the operation of the sealing device according to the first embodiment of the present invention;

[0014] Figure 6 This is a schematic diagram (V) of the operation of the sealing device according to the first embodiment of the present invention;

[0015] Figure 7A schematic diagram (six) illustrating the operation of the sealing device according to the first embodiment of the present invention;

[0016] Figure 8 This is a schematic diagram (a) of the operation of the cutting device according to the first embodiment of the present invention;

[0017] Figure 9 This is a schematic diagram (II) of the operation of the cutting device according to the first embodiment of the present invention;

[0018] Figure 10 This is a schematic diagram (a) of the operation of the recycling device according to the first embodiment of the present invention;

[0019] Figure 11 This is a schematic diagram (II) of the operation of the recycling device according to the first embodiment of the present invention;

[0020] Figure 12 This is a schematic flowchart of the close-fitting packaging method according to the second embodiment of the present invention.

[0021] Symbol Explanation

[0022] 100:Dense packaging machine

[0023] 1: Sealing equipment

[0024] 11: Sealing device

[0025] 111: Sealing Mechanism

[0026] 1111: Membrane breaking frame

[0027] 11111: Rotation Module

[0028] 11112: Framework

[0029] 11113: Membrane breaking module

[0030] 1112: Sealing frame

[0031] 1113: Heater

[0032] 112: Lifting mechanism

[0033] 12: Conveyor belt

[0034] 2: Cutting equipment

[0035] 21: First limiting frame platform

[0036] 22: Cutting device

[0037] 221: Cutting Mechanism

[0038] 222: Rotating mechanism

[0039] 223: Lifting mechanism

[0040] 23: Fixed arm

[0041] 231: Cushioning Pad

[0042] 24: Fixed claw

[0043] 3: Recycling equipment

[0044] 31: Second limiting frame platform

[0045] 32: Moving Platform

[0046] 33: Conveyor belt

[0047] 34: Recycling Station

[0048] 35: Retract the arm

[0049] 351: Suction Cup Assembly

[0050] 3511: Main suction nozzle

[0051] 3512: Sub-suction nozzle

[0052] 352: Mobile mechanism

[0053] 200: Circuit Board Assembly

[0054] 201: Circuit Board

[0055] 202: Release paper

[0056] 203: Bubble Wrap

[0057] 204: partition

[0058] 205: Transport pallet

[0059] 206: Desiccant

[0060] 207: Humidity Card

[0061] 300: Film roll

[0062] 301: Adhesive film

[0063] S100: Close packaging method

[0064] S101: Sealing Procedure

[0065] S103: Conveying Steps

[0066] S105: Cutting Steps

[0067] S107: First Recovery Step

[0068] S109: Second Recovery Step Detailed Implementation

[0069] The following specific embodiments illustrate the implementation of the "sealed packaging machine and sealed packaging method" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions, as stated in advance. In addition, if it is indicated below that a specific drawing is referenced or shown as shown in a specific drawing, it is only for emphasis in the following description, and most of the relevant content mentioned appears in that specific drawing, but it does not limit the subsequent description to refer only to that specific drawing. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0070] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the associated listed items.

[0071] [First Embodiment]

[0072] Please see Figures 1 to 11 As shown, this is the first embodiment of the present invention. It should be noted that the accompanying drawings and the related quantities and shapes mentioned in this embodiment are only used to specifically illustrate the implementation of the present invention so as to facilitate understanding of the content of the present invention, and are not intended to limit the scope of protection of the present invention.

[0073] like Figure 1 and Figure 2As shown, the first embodiment of the present invention discloses a sealing packaging machine 100, which can be used to package multiple circuit board groups 200. Each circuit board group 200 includes multiple stacked circuit boards 201, multiple release papers 202 disposed between the multiple circuit boards 201, a transport plate 205 carrying the multiple circuit boards 201, a bubble wrap 203 located between the multiple circuit boards 201 and the transport plate 205, multiple partitions 204 disposed on the bubble wrap 203 and the multiple circuit boards 201, a desiccant 206 placed beside the multiple circuit boards 201, and a humidity card 207 placed on one of the partitions 204. However, the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the circuit board group 200 may not include the multiple release papers 202, the multiple partitions 204, the desiccant 206, and the humidity card 207.

[0074] More specifically, such as Figure 2 As shown, each circuit board assembly 200, from top to bottom, sequentially includes the humidity card 207, the partition 204, the release paper 202, and the circuit board 201 (array), the partition 204, the bubble wrap 203, and the transport plate 205. The arrangement order of the components in the circuit board assembly 200 can be adjusted according to actual conditions, and the present invention is not limited thereto.

[0075] It should be noted that, in this embodiment, each circuit board 201 is preferably a multi-layer PCB, each desiccant 206 is preferably a silica gel desiccant, and each humidity card 207 is preferably a six-point humidity card; however, the invention is not limited thereto. For example, in other embodiments not illustrated in this invention, each circuit board 201 may also be a single-layer PCB or a double-layer PCB, and the desiccant 206 and the humidity card 207 may also be other types of desiccants and humidity cards, respectively.

[0076] like Figure 1 As shown, the sealing packaging machine 100 includes a sealing device 1, a cutting device 2, and a recycling device 3. The sealing device 1 is spaced apart from the cutting device 2, and the recycling device 3 is located adjacent to the cutting device 2. However, the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the sealing packaging machine 100 may not include the recycling device 3.

[0077] It should be noted that, for ease of explanation and understanding, the sealing device 1, the cutting device 2, and the recycling device 3 will be introduced in sequence below, and the relative positional relationship and actuation relationship between the above devices will be explained as appropriate.

[0078] like Figure 1 and Figure 2 As shown, the sealing device 1 includes a sealing unit 11 and a conveyor belt 12 spaced apart from the sealing unit 11, and in this embodiment, the conveyor belt 12 is located below the sealing unit 11. The sealing unit 11 can be used to apply film to multiple circuit board assemblies 200, and the conveyor belt 12 can be used to transport multiple circuit board assemblies 200 to the sealing unit 11.

[0079] Furthermore, such as Figures 2 to 7 As shown, the sealing device 11 includes a sealing mechanism 111 and two lifting mechanisms 112 mounted on the sealing mechanism 111. The sealing mechanism 111 includes a film-cutting frame 1111, a sealing frame 1112 disposed on the side of the film-cutting frame 1111 that is adjacent to the conveyor belt 12, and a heater 1113 disposed at intervals between the film-cutting frame 1111 and the sealing frame 1112. The sealing frame 1112 and the film-cutting frame 1111 are jointly mounted on the two lifting mechanisms 112, while the heater 1113 is located adjacent to the end of each lifting mechanism 112 that is relatively away from the conveyor belt 12.

[0080] It should be noted that the two lifting mechanisms 112 can be used to move the film cutting frame 1111 and the film sealing frame 1112 of the sealing mechanism 111 relative to the circuit board assembly 200 on the conveyor belt 12, and the film sealing frame 1112 of the sealing mechanism 111 can be used to place a film 301 of a film roll 300 onto the circuit board assembly 200.

[0081] Furthermore, in this embodiment, the sealing frame 1112 and the film-breaking frame 1111 are preferably square frames, and as follows... Figure 2 As shown, when the adhesive film 301 is disposed on the sealing mechanism 111 and has not yet been used, the adhesive film 301 is disposed between the sealing frame 1112 and the film breaking frame 1111. That is, the adhesive film 301 covers the side of the sealing frame 1112 that is relatively far away from the conveyor belt 12, while the side of the film breaking frame 1111 that is relatively adjacent to the conveyor belt 12 is located above the adhesive film 301.

[0082] In addition, such as Figure 2As shown, the film-breaking frame 1111 further includes a rotating module 11111, a frame 11112 mounted on the rotating module 11111, and a film-breaking module 11113 connected to the frame 11112. The rotating module 11111 is positioned corresponding to the film-breaking module 11113, and the film-breaking module 11113 is positioned adjacent to the outside of the film-breaking frame 1112. In other words, as... Figure 1 and Figure 2 As shown, the rotating module 11111 is located near the side of the sealing frame 1112 that is relatively far away from the first limiting frame 21, and the film breaking module 11113 is located near the side of the sealing frame 1112 that is relatively close to the first limiting frame 21.

[0083] It should be noted that the rotating module 11111 can be used to rotate the frame 11112 so that the film cutting module 11113 moves away from or closer to the sealing frame 1112, and the film cutting module 11113 can be used to cut the adhesive film 301 connected to the edge of each of the circuit board groups 200 after the circuit board group 200 is coated with film and enters the first limiting frame platform 21.

[0084] For ease of understanding and explanation, the following will describe the operating process of the sealing mechanism 111, such as... Figure 3 As shown, when the sealing mechanism 111 starts operating, the heater 1113 will start heating the adhesive film 301 disposed between the sealing frame 1112 and the film breaking frame 1111, and the adhesive film 301 will droop down from the hollow part of the sealing frame 1112 due to the heat and softening.

[0085] Next, as Figure 4 As shown, the two lifting mechanisms 112 will move the sealing frame 1112 and the cutting frame 1111 so that they are arranged around the circuit board assembly 200, thereby causing the adhesive film 301 to be placed on the circuit board assembly 200. Then, as... Figure 1 , Figure 5 and Figure 6 As shown, the rotating module 11111 rotates the frame 11112 to move the film-cutting module 11113 away from the sealing frame 1112, and the circuit board assembly 200 with the film applied is moved to the cutting device 2. Finally, as Figure 7 As shown, the rotating module 11111 then rotates the frame 11112 so that the film cutting module 11113 approaches (aggregates) the sealing frame 1112, so that the film cutting module 11113 cuts the adhesive film 301 adhered to the circuit board assembly 200.

[0086] The sealing device 1 has been introduced here. The cutting device 2 will now be introduced. Figure 1 As shown, the cutting device 2 includes a first limiting frame 21, a cutting device 22, two fixed arms 23, and two fixed claws 24. The first limiting frame 21 is spaced apart at one end of the conveyor belt 112, the cutting device 22 is spaced apart above the first limiting frame 21, the two fixed arms 23 are spaced apart on both sides of the first limiting frame 21, and the two fixed claws 24 are detachably disposed on both sides of the first limiting frame 21. The first limiting frame 21 can be used to limit one circuit board assembly 200 conveyed from the conveyor belt 12.

[0087] It should be noted that, for ease of understanding and explanation, the specific structure and function of the cutting device 22, the two fixed arms 23 and the two fixed claws 24 will be described in sequence first, and then the operation of each component of the cutting equipment 2 will be explained.

[0088] like Figure 8 As shown, the cutting device 22 includes two cutting mechanisms 221 spaced apart from each other, a rotating mechanism 222 mounted on the two cutting mechanisms 221, and a lifting mechanism 223 connected to the rotating mechanism 222. The distance between the two cutting mechanisms 221 is not less than the length of any side of the circuit board 201. The lifting mechanism 223 can move the two cutting mechanisms 221 relative to one of the circuit board groups 200 on the first limiting frame 21. The rotating mechanism 222 can simultaneously rotate the two cutting mechanisms 221. The two cutting mechanisms 221 can simultaneously cut the bubble wrap 203 along two parallel sides of the plurality of circuit boards 201 at intervals.

[0089] like Figure 1 As shown, the two fixing arms 23 are respectively positioned adjacent to the adjacent sides of the first limiting frame 21, and the two length directions of the two fixing arms 23 are perpendicular to each other. The two fixing arms 23 can be used alternately to fix multiple circuit boards 201 of the circuit board assembly 200, and as... Figure 8 As shown, one end of each of the fixed arms 23 includes a buffer pad 231, which can be used to prevent damage to the circuit board assembly 200.

[0090] like Figure 1 As shown, the two fixing claws 24 are positioned corresponding to each other, and the two length directions of the two fixing claws 24 are parallel to each other, while the two length directions of the two fixing claws 24 are parallel to the length direction of one fixing arm 23. Wherein, as... Figure 8 As shown, the two retaining claws 24 can be used to secure the bubble wrap 203 of the circuit board assembly 200, and for ease of explanation, Figure 8 Only one of the said retaining claws 24 is shown, but there are actually two said retaining claws 24, as hereby noted.

[0091] The specific structure and function of the cutting device 22, the two fixed arms 23 and the two fixed claws 24 have been introduced here. The following will explain how each component of the cutting equipment 2 moves.

[0092] When one of the circuit board assemblies 200 is located on the first limiting frame 21, the two fixing claws 24 are positioned and pressed onto the bubble wrap 203 of the circuit board assembly 200, and one fixing arm 23 fixes the circuit board assembly 200, while the other fixing arm 23 presses against one of the fixing claws 24 to make room so that the two cutting mechanisms 221 can straddle the fixing arm 23 that fixes the circuit board assembly 200 and cut the bubble wrap 203 along the length direction of the fixing arm 23 that fixes the circuit board assembly 200.

[0093] Then, as Figure 9 As shown, the fixing arm 23 that originally fixed the circuit board assembly 200 will be shifted to the left to be spaced apart from one end of the other fixing arm 23, and the other fixing arm 23 will then move onto the circuit board assembly 200 and press it in place. The rotating mechanism 222 will rotate the two cutting mechanisms 221 so that they can straddle the other fixing arm 23 and cut the bubble wrap 203 along the length of the other fixing arm 23.

[0094] As described above, the sealing packaging machine 100 can achieve the following by means of "the rotating mechanism 222 is installed on two cutting mechanisms 221, and the distance between the two cutting mechanisms 221 is not less than the length of any side of the circuit board 201" and "the two cutting mechanisms 221 can be used to cut the bubble wrap 203 at intervals and simultaneously along two parallel sides of the multiple circuit boards 201", so that the cutting equipment 2 only needs to perform two cuts to complete the operation process, effectively saving the cutting operation time.

[0095] It should be noted that, for ease of explanation and understanding, Figure 8 Although the two fixing claws 24 are not shown in the drawing, in reality, when the two cutting mechanisms 221 are cutting the bubble wrap 203, one of the fixing arms 23 is actually pressed against one of the fixing claws 24 to make room. This is to avoid misunderstanding.

[0096] The cutting device 2 has been introduced here. The recycling device 3 will now be introduced. Figure 1As shown, the recycling device 3 includes a second limiting frame 31 located adjacent to the first limiting frame 21, a transport platform 32 located in the first limiting frame 21 and the second limiting frame 31, a conveyor belt 33 spaced apart from the second limiting frame 31, a recycling table 34 spanning the conveyor belt 33, and a recycling arm 35 spaced apart from the second limiting frame 31.

[0097] Furthermore, after the circuit board assembly 200 is cut at the first limiting frame 21, the transport platform 32 transports one of the circuit board assemblies 200 from the first limiting frame 21 to the second limiting frame 31. Then, as... Figure 1 , Figure 10 and Figure 11 As shown, the recycling arm 35 will transport multiple circuit boards 201 and bubble wrap 203 from one circuit board assembly 200 and move them above another placement platform (not shown), then place the multiple circuit boards 201 onto the placement platform. Next, the recycling arm 35 will continue to transport any remaining bubble wrap 203 and place it on the recycling table 34. Finally, the conveyor belt 33 will transport multiple transport plates 205 from the multiple circuit board assemblies 200 and move them elsewhere.

[0098] It should be noted that, as Figure 10 and Figure 11 As shown, the recovery arm 35 includes a suction cup assembly 351 and a moving mechanism 352 connected to the suction cup assembly 351, and the moving mechanism 352 is used to move the suction cup assembly 351. The suction cup assembly 351 includes multiple main suction nozzles 3511 and multiple secondary suction nozzles 3512 surrounding the main suction nozzles 3511. The main suction nozzles 3511 are used to adsorb multiple circuit boards 201, while the secondary suction nozzles 3512 are used to adsorb some of the bubble wrap 203. It should be noted that when the recovery arm 35 places the circuit board assembly 200, the main suction nozzles 3511 will stop adsorbing, allowing the circuit board assembly 200 to fall automatically.

[0099] [Second Embodiment]

[0100] See Figure 12As shown, this is the second embodiment of the present invention. It should be noted that this embodiment is similar to the first embodiment described above, so the similarities between the two embodiments will not be repeated (e.g., the sealing device 1). Furthermore, for ease of explanation and understanding, this embodiment will be described in conjunction with the accompanying drawings of the first embodiment described above. The quantities and shapes mentioned in the accompanying drawings are only used to specifically illustrate the implementation of the present invention so as to facilitate understanding of the content of the present invention, and are not intended to limit the scope of protection of the present invention.

[0101] like Figure 12 As shown, a second embodiment of the present invention discloses a tight-fitting packaging method S100, which can be used to package multiple circuit board assemblies 200. The tight-fitting packaging method S100 sequentially includes a sealing step S101, a conveying step S103, a cutting step S105, a first recycling step S107, and a second recycling step S109, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the tight-fitting packaging method S100 may not include the first recycling step S107 and the second recycling step S109.

[0102] The sealing step S101 involves applying a film to a plurality of circuit board groups 200 disposed on the conveyor belt 12 using the sealing device 11. Each circuit board group 200 includes a plurality of stacked circuit boards 201, a transport plate 205 carrying the plurality of circuit boards 201, and bubble wrap 203 located between the plurality of circuit boards 201 and the transport plate 205.

[0103] The conveying step S103 involves conveying a plurality of circuit board groups 200 to the first limiting frame 21 via the conveyor belt 12. The first limiting frame 21 can be used to limit one circuit board group 200 conveyed from the conveyor belt 12.

[0104] The cutting step S105 involves simultaneously cutting the bubble wrap 203 along two parallel sides of a plurality of circuit boards 201 at intervals using the cutting device 22. The cutting device 22 comprises two cutting mechanisms 221 spaced apart from each other, and the distance between the two cutting mechanisms 221 is not less than the length of any side of the circuit board 201.

[0105] The first recycling step S107: The transport platform 32 transports a circuit board group 200 from the first limiting frame 21 to the second limiting frame 31, and the recycling arm 35 transports a plurality of circuit boards 201 and bubble wrap 203 of the circuit board group 200, and places a portion of the bubble wrap 203 on the recycling table 34.

[0106] The second recycling step S109: conveying the multiple transport plates 205 of the multiple circuit board groups 200 by the conveyor belt 33.

[0107] [Beneficial Effects of the Examples]

[0108] One of the beneficial effects of the present invention is that the airtight packaging machine 100 and the airtight packaging method S100 provided by the present invention can improve the packaging efficiency of multiple circuit boards 201 and reduce the risk of secondary defects in multiple circuit boards 201 by means of the technical solutions of "the sealing device 11 applying film to multiple circuit board groups 200 disposed on the conveyor belt 12" and "the cutting device 22 cutting the bubble wrap 203 at intervals along two parallel sides of multiple circuit boards 201 simultaneously".

[0109] The above-disclosed content is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included in the scope of the patent application of the present invention.

Claims

1. A sealing packaging machine, comprising: Sealing equipment, comprising: The sealing device can be used to apply films to multiple circuit board assemblies; and A conveyor belt is spaced apart from the sealing device, and the conveyor belt can be used to transport multiple circuit board assemblies to the sealing device; Each of the circuit board groups includes a plurality of stacked circuit boards, a transport plate carrying the plurality of circuit boards, and bubble wrap located between the plurality of circuit boards and the transport plate; and Cutting equipment, comprising: The first limiting frame is spaced apart at one end of the conveyor belt; and A cutting device is provided at intervals on the first limiting frame, and the cutting device includes two cutting mechanisms provided at intervals from each other, wherein the distance between the two cutting mechanisms is not less than the side length of either side of the circuit board; The first limiting frame can be used to limit one assembly of circuit boards conveyed from the conveyor belt, and the two cutting mechanisms can be used to cut the bubble wrap at intervals simultaneously along two parallel sides of the plurality of circuit boards. The sealing packaging machine further includes a recycling device, which comprises a second limiting frame located adjacent to the first limiting frame and a transport platform located between the first and second limiting frames; wherein the transport platform is capable of transporting one of the circuit board assemblies from the first limiting frame to the second limiting frame. The recycling equipment further includes a conveyor belt spaced apart from the second limiting frame, a recycling table spanning the conveyor belt, and recycling arms spaced apart from the second limiting frame. The conveyor belt is used to transport multiple transport boards from multiple circuit board groups, and the recycling arms are used to handle multiple circuit boards and bubble wrap from one circuit board group, placing a portion of the bubble wrap on the recycling table. The recycling arm includes multiple main suction nozzles and multiple secondary suction nozzles surrounding the main suction nozzles. The main suction nozzles are used to pick up multiple circuit boards, and the secondary suction nozzles are used to pick up a portion of the bubble wrap.

2. The sealing packaging machine as described in claim 1, wherein, The sealing device includes a sealing mechanism and two lifting mechanisms mounted on the sealing mechanism. The two lifting mechanisms are used to move the sealing mechanism relative to the circuit board assembly on the conveyor belt, and the sealing mechanism is used to apply adhesive film onto the circuit board assembly.

3. The sealing packaging machine as described in claim 2, wherein, The sealing mechanism further includes a film-breaking frame and a sealing frame disposed on the film-breaking frame, and the film-breaking frame includes a rotating module, a frame mounted on the rotating module and a film-breaking module connected to the frame, wherein the position of the rotating module corresponds to the film-breaking module.

4. The sealing packaging machine as described in claim 3, wherein, The rotating module is located adjacent to the side of the sealing frame that is relatively far from the first limiting frame, and the film-cutting module is located adjacent to the side of the sealing frame that is relatively close to the first limiting frame. The film-cutting module is used to cut the adhesive film attached to the edge of each circuit board group after each circuit board group is coated and enters the first limiting frame. The rotating module is used to rotate the frame to move the film-cutting module away from or closer to the sealing frame.

5. The sealing packaging machine as described in claim 1, wherein, The cutting device further includes two fixed arms spaced apart from the first limiting frame, and the two fixed arms are respectively located adjacent to adjacent sides of the first limiting frame; wherein the length directions of the two fixed arms are perpendicular to each other, and the two fixed arms can be used alternately to fix multiple circuit boards of the circuit board assembly.

6. The sealing packaging machine as described in claim 5, wherein, The cutting device further includes two fixing claws detachably disposed on both sides of the first limiting frame, wherein the two fixing claws are positioned corresponding to each other and the length directions of the two fixing claws are parallel to each other; wherein the two fixing claws can be used to fix the bubble wrap of the circuit board assembly, and the length direction of one fixing arm is parallel to the length direction of the two fixing claws.

7. A method for tight-fitting packaging, applied to the tight-fitting packaging machine according to any one of claims 1 to 6, comprising: Sealing step: Apply film to multiple circuit board groups arranged on a conveyor belt using a sealing device; wherein, each circuit board group includes multiple circuit boards stacked together, a transport plate carrying the multiple circuit boards, and bubble wrap located between the multiple circuit boards and the transport plate; Conveying step: conveying a plurality of the circuit board groups to a first limiting frame via the conveyor belt; wherein the first limiting frame can be used to limit one of the circuit board groups conveyed from the conveyor belt; and Cutting step: The bubble wrap is cut simultaneously along two parallel sides of a plurality of circuit boards at intervals using a cutting device; wherein the cutting device includes two cutting mechanisms arranged at intervals, and the distance between the two cutting mechanisms is not less than the length of any side of the circuit board.

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