Powder supply device and coating system

Abstract

The present invention provides a powder supply device and a plating system that prevent powder from flying as much as possible. Provided is a powder supply device that supplies powder containing a metal used in plating to a plating solution. The powder supply device comprises: a plating solution tank configured to store the plating solution; a feeding pipe for feeding powder into the plating solution tank; a gas supply line for feeding gas; and a spiral airflow generating component configured to receive gas from the gas supply line and generate a spiral airflow toward the plating solution tank inside the feeding pipe.

Description

[0001] This application is a divisional application of the invention patent application with the application date of December 24, 2018, application number 201811585813.6, and invention name “Powder supply device and plating system”. Technical Field

[0002] The invention relates to a powder supply device and a plating system. Background Art

[0003] In the past, wiring was formed in fine wiring grooves, holes, or resist openings provided on the surface of a substrate such as a semiconductor wafer, or bumps (protruding electrodes) electrically connected to electrodes of a package were formed on the surface of the substrate. Methods for forming the wiring and bumps include electroplating, vapor deposition, printing, and ball bump formation methods. However, with the increase in the number of I / Os of semiconductor chips and the finer pitch, electroplating methods that can be miniaturized and have relatively stable performance are often used.

[0004] In an apparatus for performing electroplating, generally, an anode and a substrate are disposed facing each other in a plating tank containing a plating solution, and a voltage is applied to the anode and the substrate, thereby forming a plated film on the surface of the substrate.

[0005] In the past, as the anode used in the electroplating device, a dissolving anode that dissolves in the plating solution or an insoluble anode that does not dissolve in the plating solution is used. When the insoluble anode is used for plating, the metal ions in the plating solution are consumed as the plating proceeds. Therefore, it is necessary to regularly replenish the metal ions to the plating solution to adjust the concentration of the metal ions in the plating solution. Thus, a device is known that dissolves metal powder in a plating solution stored in a plating solution tank different from a plating tank and supplies the plating solution to the plating tank (for example, refer to patent document 1).

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Publication No. 2017-141503 Summary of the invention

[0009] In the past, when metal powder was put into the plating liquid tank, there was a risk that the powder would fly outside the device and contaminate the clean room. In order to prevent the clean room from being contaminated, the previous device was set in a space different from the clean room, such as the downstairs room of the clean room. However, in the case where it is impossible to prepare a space different from the clean room, there is also a demand to set the device in the clean room. In addition, even if the scattering of the powder stops inside the device, there is also a problem that the scattered powder cannot be put into the plating liquid tank and causes waste.

[0010] The present invention has been made in view of the above-mentioned problems, and one of its objects is to provide a powder supply device that prevents powder from scattering as much as possible.

[0011] According to one embodiment of the present invention, there is provided a powder supply device for supplying a powder containing a metal used in plating to a plating solution. The powder supply device comprises: a plating solution tank configured to store the plating solution; a feeding pipe for feeding the powder into the plating solution tank; a gas supply line for feeding gas; and a spiral airflow generating member configured to receive gas from the gas supply line and generate a spiral airflow toward the plating solution tank inside the feeding pipe.

[0012] According to another aspect of the present invention, there is provided a powder supply device for supplying a powder containing a metal used in plating to a plating solution. The powder supply device comprises: a plating solution tank configured to store the plating solution; a feeding pipe for feeding the powder into the plating solution tank; and a liquid curtain generating member for generating a cylindrical liquid curtain of the plating solution in a manner covering an outlet of the feeding pipe.

[0013] According to another aspect of the present invention, there is provided a powder supply device for supplying a powder containing a metal used in plating to a plating solution. The powder supply device comprises: a plating solution tank configured to store the plating solution; and a hopper for storing the powder. The hopper comprises: an inlet for feeding the powder into the hopper; and an exhaust port for discharging the gas in the hopper. The powder supply device further comprises: a first scattering prevention member configured to prevent the powder from scattering from a gap between the inlet and a feeding nozzle for feeding the powder into the inlet; and a second scattering prevention member configured to prevent the powder from scattering from the exhaust port.

[0014] According to another aspect of the present invention, there is provided a plating system comprising: one of the above-mentioned powder supply devices; a plating tank for plating a substrate; and a plating solution supply pipe extending from the plating solution tank of the above-mentioned powder supply device to the plating tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram showing the entire plating system of this embodiment.

[0016] Figure 2 It is a side view showing a powder container capable of holding copper oxide powder inside.

[0017] Figure 3 It is a side view showing a part of the powder supply device.

[0018] Figure 4 yes Figure 3An enlarged perspective view of the interior of the enclosure is shown.

[0019] Figure 5A It is a three-dimensional diagram of the spiral airflow generating component.

[0020] Figure 5B It is a side sectional view of the spiral airflow generating component.

[0021] Figure 6 It is a side view showing the outlet opening end portion of the injection pipe in this embodiment.

[0022] Fig. 7A It is a perspective view showing an example of a liquid curtain generating member.

[0023] Figure 7B yes Fig. 7A A side sectional view of a liquid curtain generating component is shown.

[0024] Figure 7C It is a schematic diagram showing the shape of the discharge port of the liquid curtain generating member.

[0025] Fig. 8A It is a perspective view showing another example of the liquid curtain generating member.

[0026] Figure 8B yes Fig. 8A A side sectional view of a liquid curtain generating component is shown.

[0027] Fig. 9 It is an enlarged side view near the cover of the hopper.

[0028] Fig.10 It is a perspective view of the second scattering prevention member.

[0029] Fig.11 It is a perspective view of the first scattering prevention member.

[0030] Fig.12 This is a perspective view of the hopper before the first scattering prevention member is brought into contact with the input port of the hopper.

[0031] Fig.13 This is a perspective view of the hopper after the first scattering prevention member is brought into contact with the input port of the hopper.

[0032] Description of Reference Numerals

[0033] 2…Plating tank

[0034] 20…Powder supply device

[0035] 29…Pipeline

[0036] 29a…Inlet opening end

[0037] 29b…Outlet opening end

[0038] 30…Feeder

[0039] 33…Hopper

[0040] 35… Plating liquid tank

[0041] 42…Exhaust port

[0042] 44…Inert gas supply line

[0043] 46…Powder catheter

[0044] 46a…Nozzle

[0045] 50…Spiral airflow generating component

[0046] 51…Cylindrical parts

[0047] 53…1st end

[0048] 54…Second end

[0049] 55…Slot

[0050] 56…Circumferential step difference

[0051] 60…Liquid curtain generating components

[0052] 62…1st cylindrical part

[0053] 63…Second cylindrical part

[0054] 64…Entrance

[0055] 65…Discharge port

[0056] 66…1st circumferential flow path

[0057] 67…Axial flow path

[0058] 68…Second circumferential flow path

[0059] 69…Discharge flow path

[0060] 70…Second scatter prevention member

[0061] 72…Filter

[0062] 74…First scattering prevention member

[0063] 80…Intermediate nozzle

[0064] 82…Nozzle DETAILED DESCRIPTION

[0065] Embodiments of the present invention will be described below with reference to the accompanying drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals and duplicate descriptions are omitted. Figure 1 Schematic diagram showing the entire plating system of this embodiment. The plating system includes: a plating device 1 installed in a clean room; and a powder supply device 20 installed in a downstairs room. The powder supply device 20 of this embodiment can also be installed in a clean room like the plating device 1.

[0066] In the present embodiment, the plating device 1 is a plating unit for electroplating a metal such as copper on a substrate such as a wafer, and the powder supply device 20 is a device for supplying a powder containing at least a metal to a plating solution used in the plating device 1. In the present embodiment, an example of using a copper oxide powder as a powder containing at least a metal is described. In addition, the average particle size of the copper oxide powder in the present embodiment is, for example, 10 microns to 200 microns. In this specification, "powder" includes objects of any shape that may be scattered, such as solid particles, shaped granular objects, solid objects shaped into granular shapes, solid balls formed into small particle diameter spheres, solid metals shaped into strips or strands, or a mixture consisting of a combination thereof.

[0067] The plating device 1 of the present embodiment has four plating tanks 2. The plating device 1 can have any number of plating tanks 2. Each plating tank 2 has an inner tank 5 and an outer tank 6. An insoluble anode 8 held by an anode holder 9 is arranged in the inner tank 5. In the plating tank 2, a neutral membrane (not shown) is arranged around the insoluble anode 8. The inner tank 5 is filled with plating liquid, and the plating liquid overflowing from the inner tank 5 flows into the outer tank 6. In addition, a stirrer (not shown) for stirring the plating liquid can be provided in the inner tank 5. The substrate W is held by the substrate holder 11 and immersed in the plating liquid in the inner tank 5 together with the substrate holder 11. In addition, as the substrate W, a semiconductor substrate, a printed wiring board, etc. can be used.

[0068] The insoluble anode 8 is electrically connected to the positive electrode of the plating power source 15 via the anode holder 9, and the substrate W held by the substrate holder 11 is electrically connected to the negative electrode of the plating power source 15 via the substrate holder 11. When a voltage is applied between the insoluble anode 8 immersed in the plating solution and the substrate W by the plating power source 15, an electrochemical reaction occurs in the plating solution contained in the plating tank 2, and copper is precipitated on the surface of the substrate W. In this way, the surface of the substrate W is plated with copper.

[0069] The plating device 1 has a plating control unit 17 for controlling the plating process of the substrate W. The plating control unit 17 has a function of calculating the concentration of copper ions contained in the plating solution in the plating tank 2 based on the cumulative value of the current flowing through the substrate W. Specifically, as the substrate W is plated, the copper in the plating solution is consumed. The consumption of copper is proportional to the cumulative value of the current flowing through the substrate W. The plating control unit 17 can calculate the copper ion concentration in the plating solution in each plating tank 2 based on the amount of copper put into the plating solution and the cumulative value of the current (the consumption of copper).

[0070] The powder supply device 20 includes: a sealed chamber 24, a hopper 33, a feeder 30, a motor 31, a plating solution tank 35, and an operation control unit 32. The powder container 21 containing the copper oxide powder is moved into the sealed chamber 24. The hopper 33 contains the copper oxide powder supplied from the powder container 21. The feeder 30 is configured to transport the powder located at the bottom of the hopper 33. The motor 31 is a driving source of the feeder 30. The plating solution tank 35 is configured to store the plating solution and receive the copper oxide powder transported by the feeder 30. The operation control unit 32 controls the operation of the motor 31.

[0071] The plating device 1 and the powder supply device 20 are connected through a plating solution supply pipe 36 and a plating solution return pipe 37. More specifically, the plating solution supply pipe 36 extends from the plating solution tank 35 to the bottom of the inner tank 5 of the plating tank 2. The plating solution supply pipe 36 branches into four branch pipes 36a, and the four branch pipes 36a are respectively connected to the bottom of the inner tank 5 of the four plating tanks 2. A flow meter 38 and a flow control valve 39 are respectively provided on the four branch pipes 36a. The flow meter 38 and the flow control valve 39 are connected to the plating control unit 17 so as to be able to communicate. The plating control unit 17 is configured to control the opening of the flow control valve 39 based on the flow of the plating solution measured by the flow meter 38. Therefore, the flow of the plating solution supplied to each plating tank 2 via the four branch pipes 36a is controlled by each flow control valve 39 provided on the upstream side of each plating tank 2, so that their flow rates are substantially the same. The plating solution return pipe 37 extends from the bottom of the outer tank 6 of the plating tank 2 to the plating solution tank 35. The plating solution return pipe 37 has four discharge pipes 37a connected to the bottoms of the outer tanks 6 of the four plating tanks 2, respectively.

[0072] The plating solution supply pipe 36 is provided with a pump 25 for transferring the plating solution and a filter 26 disposed on the downstream side of the pump 25. The plating solution used in the plating device 1 is transported to the plating solution tank 35 of the powder supply device 20 through the plating solution return pipe 37. The plating solution to which the copper oxide powder is added by the powder supply device 20 is transported to the plating device 1 through the plating solution supply pipe 36. The pump 25 can circulate the plating solution between the plating device 1 and the powder supply device 20 at all times. Alternatively, a predetermined amount of plating solution may be intermittently transported from the plating device 1 to the powder supply device 20, and the plating solution to which the copper oxide powder is added may be intermittently returned from the powder supply device 20 to the plating device 1.

[0073] In addition, in order to add pure water (DIW: De-ionized Water) to the plating solution, the pure water supply pipeline 22 is connected to the plating solution tank 35. The pure water supply pipeline 22 is provided with an on-off valve 23 for stopping the pure water supply when the plating device 1 is stopped, a flow meter 28 for measuring the flow rate of pure water, and a flow rate regulating valve 27 for regulating the flow rate of pure water. The on-off valve 23 is normally open. The flow meter 28 and the flow rate regulating valve 27 are connected to the plating control unit 17 so as to be able to communicate. When the copper ion concentration in the plating solution exceeds the set value, the plating control unit 17 controls the opening of the flow rate regulating valve 27 to supply pure water to the plating solution tank 35 in order to dilute the plating solution.

[0074] The plating control unit 17 is communicatively connected to the action control unit 32 of the powder supply device 20. When the copper ion concentration in the plating solution is lower than the set value, the plating control unit 17 sends a signal indicating the required replenishment value to the action control unit 32 of the powder supply device 20. The powder supply device 20 receives the signal and adds copper oxide powder to the plating solution until the amount of copper oxide powder added reaches the required replenishment value. In the present embodiment, the plating control unit 17 and the action control unit 32 are configured as different devices, but in one embodiment, the plating control unit 17 and the action control unit 32 may also be configured as one control unit. In this case, the control unit may be a computer that operates in accordance with a program. The program may be stored in a storage medium.

[0075] The plating device 1 may also have a concentration measuring device 18a for measuring the copper ion concentration in the plating solution. The concentration measuring devices 18a are respectively installed on the four discharge pipes 37a of the plating solution return pipe 37. The measured value of the copper ion concentration obtained by the concentration measuring device 18a is sent to the plating control unit 17. The plating control unit 17 may compare the copper ion concentration in the plating solution calculated based on the cumulative value of the current with the above-mentioned set value, or may compare the copper ion concentration measured by the concentration measuring device 18a with the above-mentioned set value. The plating control unit 17 may also correct the estimated value of the copper ion concentration based on the comparison between the copper ion concentration in the plating solution calculated based on the cumulative value of the current (i.e., the estimated value of the copper ion concentration) and the copper ion concentration measured by the concentration measuring device 18a (i.e., the measured value of the copper ion concentration).

[0076] In addition, a branch pipe 36b may be provided to the plating solution supply pipe 36, and a concentration measuring device 18b may be provided on the branch pipe 36b to monitor the copper ion concentration in the plating solution. In addition, an analysis device (such as a CVS device, a colorimeter, etc.) may be provided on the branch pipe 36b to quantitatively analyze and monitor not only the copper ions but also the solubility of various chemical components. Thus, the concentration of chemical components, such as impurities, in the plating solution of the plating solution supply pipe 36 can be analyzed before the plating solution is supplied to each plating tank 2. As a result, it is possible to prevent impurities from affecting the plating performance and perform a plating treatment with higher precision. In addition, only one of the concentration measuring devices 18a and 18b may be provided.

[0077] Figure 2 2 is a side view showing a powder container 21 capable of holding copper oxide powder inside. Figure 2 As shown, the powder container 21 includes: a container body 45 capable of storing copper oxide powder inside; a powder conduit 46 (equivalent to an example of a feeding nozzle) connected to the container body 45; and a valve 48 installed on the powder conduit 46. The container body 45 is made of a synthetic resin such as polyethylene. A handle 49 is formed on the container body 45, and an operator can hold the handle 49 to carry the powder container 21.

[0078] The powder conduit 46 is connected to the container body 45. The powder conduit 46 is inclined at an angle of about 30 degrees relative to the vertical direction. When the valve 48 installed on the powder conduit 46 is opened, the copper oxide powder can pass through the powder conduit 46, and when the valve 48 is closed, the copper oxide powder cannot pass through the powder conduit 46. Figure 2 The valve 48 is shown in a closed state. The powder conduit 46 has a nozzle 46a at its front end. A cap 47 is mounted on the nozzle 46a.

[0079] Next, we will explain in detail Figure 1 The powder supply device 20 is shown. Figure 3 : is a side view showing a part of the powder supply device 20. The closed chamber 24 of the powder supply device 20 is omitted in the figure. As shown in the figure, the hopper 33 is a storage container for powder, and the copper oxide powder supplied from the powder container 21 is stored inside it. The hopper 33 has a truncated cone shape as a whole, and the copper oxide powder easily flows downward. The upper end opening of the hopper 33 is covered by a cover 41. The cover 41 has an inlet 19 and an exhaust port 42, and the inlet 19 is used for the copper oxide powder to be put in from the above-mentioned powder container 21. The exhaust port 42 is connected to the internal space of the hopper 33 and is connected to a negative pressure source not shown in the figure. Therefore, the hopper 33 discharges the gas in the hopper 33 through the exhaust port 42.

[0080] The feeder 30 is connected to an opening provided at the bottom of the hopper 33. The feeder 30 is configured to flow from the opening at the bottom of the hopper 33 toward the input pipe 29 (see Figure 4 ) supplies powder. In the present embodiment, the feeder 30 is a screw feeder having a screw 30a, but is not limited thereto, and any conveying device can be used. The motor 31 is connected to the feeder 30 and is configured to drive the feeder 30. The hopper 33 and the feeder 30 are fixed on a bracket 34, and the bracket 34 is supported on a weight measuring device 40. That is, the weight measuring device 40 is configured to measure the total weight of the hopper 33, the feeder 30, the motor 31, and the copper oxide powder present in the hopper 33 and the feeder 30.

[0081] The outlet 30b of the feeder 30 is surrounded by the enclosure 43. When the motor 31 drives the feeder 30, the copper oxide powder in the hopper 33 is transported to the inside of the enclosure 43 through the feeder 30 and falls into the plating liquid tank 35. The outlet 30b of the feeder 30 is located in the enclosure 43. In addition, the powder supply device 20 has an inert gas supply pipeline 44 (equivalent to an example of a gas supply pipeline). The inert gas supply pipeline 44 passes through the enclosure 43 and is connected to the spiral airflow generating component 50 (refer to Figure 4 )connect.

[0082] The weight measuring device 40 is connected to the operation control unit 32 for controlling the operation of the motor 31 so as to be communicable. The weight measurement value output from the weight measuring device 40 can be sent to the operation control unit 32. The operation control unit 32 receives the weight measurement value from the plating device 1 (see Figure 1 ) sends a signal indicating the required replenishment value, so that the motor 31 is operated until the amount of copper oxide powder added reaches the required replenishment value. The motor 31 drives the feeder 30, and the feeder 30 adds the amount of copper oxide powder corresponding to the required replenishment value to the plating liquid tank 35.

[0083] exist Figure 3In the powder supply device 20 shown, as described above, the weight of the feeder 30 is measured by the weight measuring device 40. Therefore, the vicinity of the outlet 30b of the feeder 30 is configured not to contact the surrounding cover 43. That is, a gap is formed between the vicinity of the outlet 30b of the feeder 30 and the surrounding cover 43. When the copper oxide powder falls from the outlet 30b of the feeder 30 to the plating liquid tank 35, the copper oxide powder may scatter from the gap. The powder supply device 20 of this embodiment has a structure to suppress the scattering.

[0084] Figure 4 yes Figure 3 FIG. 4 is an enlarged perspective view of the interior of the enclosure 43. Figure 4 As shown, the enclosure 43 has an opening 43a on its side for inserting the feeder 30. Since the feeder 30 is not in contact with the enclosure 43, the copper oxide powder may be scattered from the gap between the opening 43a and the feeder 30. The powder supply device 20 has a Figure 1 and Figure 3 The plating liquid tank 35 shown in the figure has a feed pipe 29 extending in the vertical direction. The feed pipe 29 is preferably made of ultra-high molecular weight polyethylene material to prevent static electricity. The feed pipe 29 has an inlet opening end 29a for feeding powder and an outlet opening end 29b for discharging powder (see the following description). Figure 6 ). The inlet opening end 29a is as follows Figure 4 As shown in FIG. 1 , the copper oxide powder conveyed by the feeder 30 falls from the outlet 30 b of the feeder 30 , passes through the injection pipe 29 , and is injected into the plating solution tank 35 .

[0085] In this embodiment, in order to suppress the scattering of copper oxide powder, a spiral airflow generating member 50 is provided to generate a spiral airflow inside the input pipe 29. The spiral airflow generating member 50 receives the inert gas from the inert gas supply line 44 and generates a spiral airflow toward the plating liquid tank 35.

[0086] Figure 5A It is a perspective view of the spiral airflow generating member 50 . Figure 5B FIG. 5 is a side sectional view of the spiral airflow generating component 50. Figure 5A As shown, the spiral airflow generating member 50 is installed at the inlet opening end 29a of the input pipe 29. Figure 5A and Figure 5B As shown, the spiral airflow generating member 50 includes: a substantially cylindrical cylindrical member 51; and an annular member 52 mounted on the cylindrical member 51 or formed integrally therewith. Figure 5A In FIG. 1 , the annular member 52 and the injection pipe 29 are shown in cross section.

[0087] like Figure 5A As shown in the figure, when the spiral airflow generating member 50 is installed in the input pipe 29, the outer surface 51a of the cylindrical member 51 is configured to contact the inner surface of the input pipe 29. The cylindrical member 51 has a first end 53 (lower end in the figure) located on the side of the plating liquid tank 35, and a second end 54 (upper end in the figure) on the opposite side. In the present embodiment, the cylindrical member 51 is partially inserted into the inside of the input pipe 29, and is configured in a manner that the second end 54 protrudes from the input pipe 29.

[0088] The tubular member 51 has one or more grooves 55 extending from the first end 53 toward the second end 54 on its outer surface 51a. In other words, the groove 55 reaches at least the first end 53, and may reach the second end 54 or may not reach the second end 54. In the present embodiment, a plurality of grooves 55 are formed on the outer surface 51a. As shown in the figure, the groove 55 is configured to be inclined relative to the axial direction of the tubular member 51. The grooves 55 are each configured to be inclined at the same angle as each other. In addition, it is desired that the angle, width and depth of the groove 55 are appropriately set according to the inner diameter or length of the input pipe 29. After the tubular member 51 is partially inserted into the interior of the input pipe 29, a plurality of flow paths inclined relative to the axial direction of the tubular member 51 are divided by the grooves 55 of the tubular member 51 and the inner surface of the input pipe 29.

[0089] Furthermore, the tubular member 51 has a circumferential step portion 56 extending in the circumferential direction. In the present embodiment, the circumferential step portion 56 is formed at the second end portion 54 of the tubular member 51. Thus, a circumferential gas flow path 58 (see FIG. 5 ) communicating with the groove 55 is defined by the tubular member 51 and the annular member 52. Figure 5B The annular member 52 has a gas injection port 57 on its upper surface (the upper surface in the figure) to which the inert gas supply line 44 is connected. The gas injection port 57 is connected to a gas flow path 58 in the circumferential direction of the cylindrical member 51 .

[0090] Next, the function of the spiral airflow generating component 50 will be described. When an inert gas is supplied from the inert gas supply pipeline 44 to the gas injection port 57, the inert gas passes through the circumferential gas flow path 58 and reaches each of the plurality of grooves 55. As a result, the pressure of the inert gas passing through the grooves 55 can be uniformized. The inert gas passes through the grooves 55 and is discharged from the first end 53 of the tubular component 51 into the injection piping 29. At this time, since the grooves 55 are inclined relative to the axial direction of the tubular component 51, a spiral airflow (spiral airflow) is generated in the injection piping 29 by the inert gas. The spiral airflow generated in the injection piping 29 introduces the air in the enclosing cover 43 into the injection piping 29 while being discharged from the outlet opening end 29b of the injection piping 29 (refer to the following description). Figure 6) is discharged. Thus, the copper oxide powder in the atmosphere in the enclosure 43 can be introduced into the input pipe 29, thereby suppressing the scattering of the copper oxide powder. In addition, the spiral airflow generated in the input pipe 29 can prevent the copper oxide powder passing through the inside of the input pipe 29 from contacting the inner wall surface of the input pipe 29. Thus, the copper oxide powder can be prevented from adhering to the inner wall surface of the input pipe 29.

[0091] As described above, in this embodiment, the spiral airflow generating member 50 can generate a spiral airflow inside the input pipe 29, thereby suppressing the scattering of powder inside the enclosure 43. In addition, according to this embodiment, the adhesion of powder inside the input pipe 29 can be suppressed.

[0092] In the present embodiment, the tubular member 51 has a groove 55 on its outer surface 51a, and a spiral airflow is generated by supplying gas to the groove 55. Therefore, according to the spiral airflow generating component 50 of the present embodiment, a spiral airflow can be generated with a very simple structure. In addition, in the present embodiment, the inert gas supply pipeline 44 is connected to the gas injection port 57, and the inert gas is directly supplied to the input pipe 29 via the spiral airflow generating component 50. In the case where the inert gas is supplied to the space in the enclosing cover 43, the powder of the ambient gas present in the enclosing cover 43 may be scattered. Therefore, in the present embodiment, compared with the case where the inert gas is supplied to the space in the enclosing cover 43, the scattering of the powder in the enclosing cover 43 can be suppressed.

[0093] For example, when the spiral airflow generating member 50 is disposed in the middle portion of the input pipe 29 in the longitudinal direction, the spiral airflow is not generated inside the input pipe 29 on the side of the inlet opening end 29a of the spiral airflow generating member 50. In this case, the powder may adhere to the inner wall of the input pipe 29 on the side of the inlet opening end 29a of the spiral airflow generating member 50. In the present embodiment, the spiral airflow generating member 50 is disposed at the inlet opening end 29a of the input pipe 29. Thus, the spiral airflow can be generated throughout the inside of the input pipe 29, thereby preventing the powder from adhering to the entire inside of the input pipe 29.

[0094] In addition, in the present embodiment, an inert gas is supplied into the input pipe 29. When the plating solution stored in the plating solution tank 35 is maintained at a high temperature (e.g., about 45° C.), vapor is generated from the plating solution. The vapor rises in the input pipe 29 and reaches the inside of the enclosing cover 43, and may invade the feeder 30. When the vapor is adsorbed on the copper oxide powder in the feeder 30, there is a risk that the copper oxide powder agglomerates and blocks the feeder 30. Therefore, by supplying an inert gas into the input pipe 29, the vapor of the plating solution can be prevented from invading the feeder 30.

[0095] Next, a structure for suppressing scattering of copper oxide powder in the vicinity of the end portion of the injection pipe 29 on the plating solution tank 35 side will be described. Figure 6 FIG. 2 is a side view showing the outlet opening end portion 29b of the input pipe 29 in this embodiment. Figure 6 As shown in FIG. 1 , the injection pipe 29 has an outlet opening end 29b. When the inert gas from the inert gas supply line 44 is discharged from the outlet opening end 29b of the injection pipe 29, it is diffused due to the pressure difference between the inside and outside of the injection pipe 29. Therefore, the copper oxide powder injected into the injection pipe 29 is scattered due to the diffusion of the inert gas and may adhere to the wall surface of the plating liquid tank 35. Therefore, in this embodiment, as shown in FIG. Figure 6 As shown in FIG. 2 , a liquid curtain generating unit 60 is provided for generating a cylindrical liquid curtain of the plating liquid so as to cover the outlet of the input pipe 29. A plating liquid supply line 61 is connected to the liquid curtain generating unit 60 to supply the plating liquid. The plating liquid supply line 61 may be connected to the liquid curtain generating unit 60, for example. Figure 1 The plating liquid tank 35 is connected to the plating liquid return pipe 37 shown, and the plating liquid in the plating liquid tank 35 may be pumped out by a pump or the like and supplied to the liquid curtain generating member 60 .

[0096] Next, the detailed structure of the liquid curtain generating member 60 will be described. Fig. 7A It is a perspective view showing an example of the liquid curtain generating member 60 . Figure 7B yes Fig. 7A A side cross-sectional view of the liquid curtain generating component 60 is shown. Figure 7C 2 is a schematic diagram showing the shape of the discharge port of the liquid curtain generating member 60. Fig. 7A and Figure 7B As shown, the liquid curtain generating member 60 is an annular member as a whole, and is configured to be mounted on the outer peripheral surface of the input pipe 29. Figure 7B As shown in detail, the liquid curtain generating member 60 includes a first cylindrical portion 62 and a second cylindrical portion 63 located outside the first cylindrical portion 62. The second cylindrical portion 63 includes an inlet 64 for supplying the plating liquid to the liquid curtain generating member 60. In addition, a discharge port 65 for discharging the plating liquid in the form of a liquid curtain is formed between the first cylindrical portion 62 and the second cylindrical portion 63. In addition, the inlet 64 may also be formed in the first cylindrical portion 62.

[0097] A flow path for the plating liquid to flow is formed between the inlet 64 and the discharge port 65. In the present embodiment, the flow path is composed of a first circumferential flow path 66, an axial flow path 67, a second circumferential flow path 68, and a discharge flow path 69. The first circumferential flow path 66 is formed between the first cylindrical portion 62 and the second cylindrical portion 63 in the circumferential direction and is connected to the inlet 64. The axial flow path 67 is connected to the first circumferential flow path 66. In the present embodiment, a plurality of axial flow paths 67 are arranged at approximately equal intervals along the circumference of the liquid curtain generating member 60. The second circumferential flow path 68 is formed between the first cylindrical portion 62 and the second cylindrical portion 63 in the circumferential direction and is connected to each axial flow path 67. The second circumferential flow path 68 is configured to allow the plating liquid to flow not only in the circumferential direction but also to flow radially outward. The discharge flow path 69 communicates with the radially outer side of the second circumferential flow path 68, and fluidically connects the second circumferential flow path 68 and the discharge port 65. The axial direction here refers to the central axis direction of the first cylindrical portion 62 and the second cylindrical portion 63.

[0098] like Figure 7C As shown, the discharge port 65 of this embodiment extends along the entire circumferential direction between the first cylindrical portion 62 and the second cylindrical portion 63. In other words, the discharge port 65 as a whole has a substantially annular cross-section. Figure 7C The shape of the liquid curtain generating component 60 in a cross section orthogonal to the axial direction is shown. The discharge port 65 has: a first portion 65a having a first radial width; and a second portion 65b having a second radial width larger than the first radial width. Specifically, the shape of the first portion 65a is roughly fan-shaped, and the shape of the second portion 65b is roughly circular. In addition, the fan-shaped shape here refers to a shape surrounded by two radii of a circle and two arcs between the two radii. In the present embodiment, the discharge port 65 is composed of a plurality of first portions 65a and a plurality of second portions 65b, forming a roughly annular cross section as a whole. In other words, the discharge port 65 is configured in such a manner that the roughly fan-shaped first portions 65a connect the roughly circular second portions 65b. As shown in FIG. Figure 7C As shown, it is preferable that the plurality of second portions 65b are arranged at substantially equal intervals in the circumferential direction.

[0099] illustrate FIG. 7A to FIG. 7C The function of the liquid curtain generating component 60 is shown. Figure 6When the plating solution supply pipeline 61 shown supplies the plating solution to the inlet 64 of the liquid curtain generating component 60, the plating solution passes through the first circumferential flow path 66 and spreads over the entire circumference of the liquid curtain generating component 60. The plating solution spread over the entire circumference then passes through the plurality of axial flow paths 67 and moves in the axial direction. As a result, the flow direction of the plating solution changes. Next, the plating solution that has passed through the axial flow path 67 passes through the second circumferential flow path 68 and spreads over the entire circumference of the liquid curtain generating component 60 again. At this time, the pressure of the plating solution is roughly uniformly dispersed over the entire circumference of the liquid curtain generating component 60. The plating solution that has reached the second circumferential flow path 68 passes through the second circumferential flow path 68 and flows outward in the circumferential direction and radial direction, and reaches the discharge flow path 69. The plating solution that has reached the discharge flow path 69 passes through the discharge port 65 and generates a roughly cylindrical liquid curtain of the plating solution.

[0100] According to the liquid curtain generating member 60 described above, a cylindrical liquid curtain of the plating solution can be generated so as to cover the outlet of the injection pipe 29. Thus, it is possible to prevent the copper oxide powder from being scattered and attached to the wall surface of the plating solution tank 35 due to the diffusion of the inert gas when the copper oxide powder is discharged from the injection pipe 29. In the present embodiment, the inert gas is supplied to the injection pipe 29, but when the inert gas is not supplied to the injection pipe 29, the copper oxide powder discharged from the injection pipe 29 may also be attached to the wall surface of the plating solution tank 35. Specifically, for example, when the copper oxide powder collides with the plating liquid surface, it scatters around together with the plating liquid, and the copper oxide powder may be attached to the wall surface of the plating solution tank 35. Therefore, according to the liquid curtain generating member 60 of the present embodiment, even when the inert gas is not supplied to the injection pipe 29, it is possible to suppress the scattering of the copper oxide powder when the copper oxide powder collides with the plating liquid surface.

[0101] In addition, the liquid curtain generating member 60 has a discharge port 65 including a first portion 65a and a second portion 65b. When the discharge port 65 is a simple ring with a fixed width, it is difficult to generate a continuous liquid curtain of the plating liquid. In addition, when a plurality of axial flow paths are arranged at intervals along the circumferential direction to form the discharge port 65, the plating liquid is discharged in a spray-like manner, and it is difficult to generate a liquid curtain of the plating liquid. Since the discharge port 65 of the present embodiment includes the first portion 65a and the second portion 65b, a continuous liquid curtain of the plating liquid can be generated stably. In addition, the discharge port 65 has a plurality of second portions 65b at approximately equal intervals along the circumferential direction, thereby being able to generate a continuous liquid curtain of the plating liquid more stably.

[0102] The liquid curtain generating member 60 of this embodiment has a first circumferential flow path 66 and an axial flow path 67, so that the plating liquid supplied from the inlet 64 can be immediately distributed throughout the entire circumference of the liquid curtain generating member 60 while changing its flow direction. In addition, since the liquid curtain generating member 60 has a second circumferential flow path 68, the pressure of the plating liquid can be evenly dispersed along the entire circumference.

[0103] Next, a modification of the liquid curtain generating member 60 will be described. Fig. 8A It is a perspective view showing another example of the liquid curtain generating member 60 . Figure 8B yes Fig. 8A The side cross-sectional view of the liquid curtain generating component 60 is shown. Fig. 8A and Figure 8B As shown, the liquid curtain generating component 60 of this example is FIG. 7A to FIG. 7C The liquid curtain generating member 60 shown in FIG. 1 is similarly an annular member as a whole and is configured to be mounted on the outer peripheral surface of the input pipe 29. Figure 8B As shown in detail, the liquid curtain generating component 60 has a first cylindrical portion 62 and a second cylindrical portion 63 located outside the first cylindrical portion 62. The second cylindrical portion 63 has an inlet 64 for supplying the plating liquid to the liquid curtain generating component 60. In addition, a discharge port 65 for discharging the plating liquid in the form of a liquid curtain is formed between the first cylindrical portion 62 and the second cylindrical portion 63. The inlet 64 may also be formed in the first cylindrical portion 62. The first cylindrical portion 62 is longer in the axial direction than the second cylindrical portion 63. Specifically, when the liquid curtain generating component 60 is installed in the input pipe 29, the first cylindrical portion 62 is closer to the plating liquid tank 35 side ( Fig. 8A , Figure 8B The inner surface of the spherical member extends in the downward direction.

[0104] A flow path for the plating liquid to flow is formed between the inlet 64 and the discharge port 65. In the example shown in the figure, the flow path is composed of a first circumferential flow path 66, an axial flow path 67, and a discharge flow path 69. The first circumferential flow path 66 is formed between the first cylindrical portion 62 and the second cylindrical portion 63 in the circumferential range and is connected to the inlet 64. The axial flow path 67 is connected to the first circumferential flow path 66. In the example shown in the figure, a plurality of axial flow paths 67 are arranged at approximately equal intervals along the circumference of the liquid curtain generating member 60, and each axial flow path 67 is connected to the radial outer side of the first circumferential flow path 66. The discharge flow path 69 is a flow path that connects the axial flow path 67 and the discharge port 65 fluid.

[0105] The discharge port 65 of the present embodiment extends along the entire circumferential direction between the first cylindrical portion 62 and the second cylindrical portion 63. The discharge port 65 as a whole has a substantially annular cross-section, and the radial width (thickness of the ring) of the discharge port 65 is substantially constant. The second cylindrical portion 63 has an inclined surface 63a on its inner circumferential surface that is inclined in a manner that the distance between the first cylindrical portion 62 and the discharge port 65 becomes closer. On the other hand, the surface of the first cylindrical portion 62 opposite to the inclined surface 63a of the second cylindrical portion 63 has a fixed outer diameter. Therefore, the discharge flow path 69 is configured to gradually narrow toward the discharge port 65 through the inclined surface 63a of the second cylindrical portion 63.

[0106] illustrate Fig. 8A and Figure 8B The function of the liquid curtain generating component 60 is shown. Figure 6 When the plating liquid supply pipeline 61 shown supplies the plating liquid to the inlet 64 of the liquid curtain generating component 60, the plating liquid passes through the first circumferential flow path 66 and spreads over the entire circumference of the liquid curtain generating component 60. The plating liquid spread over the entire circumference then passes through the plurality of axial flow paths 67 and moves in the axial direction. As a result, the flow direction of the plating liquid changes. Then, the plating liquid that has passed through the axial flow path 67 reaches the discharge flow path 69. The plating liquid that has reached the discharge flow path 69 passes through the discharge flow path 69 that gradually narrows toward the discharge port 65, and is discharged from the discharge port 65 while the flow rate increases. The plating liquid discharged from the discharge port 65 is pressurized by passing through the gradually narrowing discharge flow path 69, thereby generating a substantially cylindrical liquid curtain of the plating liquid.

[0107] According to the liquid curtain generating member 60 described above, a cylindrical liquid curtain of the plating solution can be generated so as to cover the outlet of the injection pipe 29. Thus, it is possible to prevent the copper oxide powder from being scattered and attached to the wall surface of the plating solution tank 35 due to the diffusion of the inert gas when the copper oxide powder is discharged from the injection pipe 29. In the present embodiment, the inert gas is supplied to the injection pipe 29, but when the inert gas is not supplied to the injection pipe 29, the copper oxide powder discharged from the injection pipe 29 may also be attached to the wall surface of the plating solution tank 35. Specifically, for example, when the copper oxide powder collides with the plating liquid surface, it scatters around together with the plating liquid, and the copper oxide powder may be attached to the wall surface of the solution tank 35. Therefore, according to the liquid curtain generating member 60 of the present embodiment, even when the inert gas is not supplied to the injection pipe 29, it is possible to suppress the scattering of the copper oxide powder when the copper oxide powder collides with the plating liquid surface.

[0108] In addition, the liquid curtain generating member 60 has an inclined surface 63a in the second cylindrical portion 63, and the discharge flow path 69 gradually narrows toward the discharge port 65. As a result, a pressure in the direction toward the outer peripheral surface of the first cylindrical portion 62 is generated in the plating liquid passing through the discharge flow path 69, and the flow rate and pressure of the plating liquid can be increased. In addition, since the first cylindrical portion 62 extends further downward (to the plating liquid tank 35 side) than the discharge port 65, the plating liquid discharged from the discharge port 65 flows along the outer peripheral surface of the first cylindrical portion 62. As a result, a liquid curtain of the plating liquid continuous in the circumferential direction can be stably generated.

[0109] Next, a structure for suppressing scattering of copper oxide powder in the vicinity of the cover 41 of the hopper 33 will be described. Fig. 94 is an enlarged side view of the vicinity of the cover 41 of the hopper 33. When copper oxide powder is fed from the powder container 21 to the feed port 19 of the hopper 33, the copper oxide powder may be scattered outside the hopper 33 from the gap between the powder conduit 46 of the powder container 21 and the feed port 19. In addition, after the copper oxide powder is fed into the hopper 33, the gas inside the hopper 33 is exhausted from the exhaust port 42, and the copper oxide powder in the hopper 33 may be scattered outside the hopper 33 from the exhaust port 42. Therefore, in this embodiment, as shown in FIG. Fig. 9 As shown, the powder supply device 20 has: a first scattering prevention member 74 for preventing copper oxide powder from scattering from a gap between the input port 19 of the hopper 33 and the powder conduit 46; and a second scattering prevention member 70 for preventing copper oxide powder from scattering from the exhaust port 42 of the hopper 33.

[0110] like Fig. 9 As shown, the powder supply device 20 of this embodiment has an intermediate nozzle 80, which receives the copper oxide powder fed from the nozzle 46a of the powder conduit 46 and feeds the copper oxide powder into the feed port 19 of the hopper 33. In this embodiment, the first scattering prevention member 74 is provided at the intermediate nozzle 80. In other embodiments, the copper oxide powder may be directly fed from the powder conduit 46 of the powder container 21 to the feed port 19 of the hopper 33 without providing the intermediate nozzle 80. In this case, the first scattering prevention member 74 is provided at the powder conduit 46.

[0111] Fig.10 2 is a perspective view of the second scattering prevention member 70. Fig.10 The second scattering prevention member shown has a filter 72 that closes the exhaust port 42, and a fixing member 71 that fixes the filter 72 to the exhaust port 42. In this embodiment, any filter that can capture copper oxide powder, such as a filter cloth filter, can be used as the filter 72. In addition, in this embodiment, a substantially cylindrical member that presses the filter 72 to the exhaust port 42 is used as the fixing member 71.

[0112] Fig.11 74 is a perspective view of the first scattering prevention member. Fig.11 As shown, the first scattering prevention member 74 includes a tubular member 77 and a flange portion 75 extending radially from the tubular member 77. The tubular member 77 is configured to fit with the powder conduit 46 or the intermediate nozzle 80. The first scattering prevention member 74 can be fixed to the powder conduit 46 or the intermediate nozzle 80 by fixing screws 76. The flange portion 75 has a plurality of openings. In the present embodiment, four openings are provided on the flange portion 75. These plurality of openings are closed by the filter 72. In addition, an opening 78 is formed inside the tubular member 77, and the powder conduit 46 or the intermediate nozzle 80 is inserted into the opening 78.

[0113] Next, a process of feeding the copper oxide powder from the powder container 21 into the hopper 33 will be described. Fig.12 It is a perspective view of the hopper 33 before the first scattering prevention member 74 is brought into contact with the input port 19 of the hopper 33 . Fig.13 1 is a perspective view of the hopper 33 after the first scattering prevention member 74 is brought into contact with the input port 19 of the hopper 33. Fig.12 As shown, the powder supply device 20 includes a fixing plate 85 extending in the horizontal direction and a plurality of bolts 84 screwed to the fixing plate 85. Figure 3 The weight measuring device 40 is shown configured in a manner such that no load is applied.

[0114] like Fig.12 As shown, the intermediate nozzle 80 includes a flange portion 81 and a nozzle portion 82 (corresponding to an example of a drop nozzle) extending from the flange portion 81. The first scattering prevention member 74 is attached to the nozzle portion 82 of the intermediate nozzle 80. The flange portion 81 includes a plurality of holes 83 through which bolts 84 can pass. Fig.12 In the state shown, the flange portion 81 is supported from below by a plurality of bolts 84, and the filter 72 of the first scattering prevention member 74 (see Fig.11 ) does not contact the input port 19 of the hopper 33. Therefore, when the copper oxide powder is not put into the hopper 33, since the first scattering prevention member 74 installed on the intermediate nozzle 80 does not contact the hopper 33, it will not affect the copper oxide powder. Figure 3 The weight measuring device 40 shown applies the weight of the intermediate nozzle 80 and the first scattering prevention member 74 .

[0115] like Fig.13 As shown in the figure, when copper oxide powder is put into the hopper 33, first, the intermediate nozzle 80 is rotated in the circumferential direction by a predetermined angle, and the bolt 84 is passed through the hole 83 of the flange portion 81. The intermediate nozzle 80 moves toward the hopper 33, and the first scattering prevention member 74 contacts the input port 19 of the hopper 33. Thus, the filter 72 of the first scattering prevention member 74 prevents the copper oxide powder from scattering from the gap between the intermediate nozzle 80 and the input port 19 of the hopper 33.

[0116] In addition, when the intermediate nozzle 80 is not provided and the first scattering prevention member 74 is provided on the powder conduit 46 of the powder container 21, the powder conduit 46 is inserted into the input port 19 until the filter 72 of the first scattering prevention member 74 contacts the input port 19, and the valve 48 is opened (see Figure 2 ). Thus, the filter 72 of the first scattering prevention member 74 prevents the copper oxide powder from scattering from the gap between the powder conduit 46 of the powder container 21 and the input port 19 of the hopper 33 .

[0117] In other embodiments, the first scattering prevention member 74 may be pre-installed on the input port 19 of the hopper 33. In this case, the nozzle portion 82 of the intermediate nozzle 80 or the nozzle 46a of the powder conduit 46 of the powder container 21 can be inserted into the cylindrical member 77 of the first scattering prevention member 74 installed on the input port 19 to put the copper oxide powder into the hopper 33. In this case, the weight of the hopper 33 and the like including the weight of the first scattering prevention member 74 is managed in advance.

[0118] In the above embodiment, a powder supply device is described that is separately provided with respect to the plating device, but the present invention can also be applied when copper oxide powder is directly supplied to the plating tank of the plating device. In addition, the powder containing the metal supplied to the plating solution is not limited to copper oxide, and can also contain various metals such as nickel.

[0119] The above describes the embodiments of the present invention, but the embodiments of the above invention are intended to make the present invention easy to understand and do not limit the present invention. The present invention can be changed and improved without departing from its main purpose, and its equivalents are certainly included in the present invention. In addition, within the scope of at least a part of the problems that can solve the above-mentioned problems or within the scope of at least a part of the effects, any combination or omission of the various structural elements recorded in the claims and the specification can be performed.

[0120] Several aspects disclosed in this specification are described below.

[0121] According to a first aspect, a powder supply device for supplying a powder containing a metal used in plating to a plating solution is provided. The powder supply device comprises: a plating solution tank configured to store the plating solution; a charging pipe for charging the powder into the plating solution tank; a gas supply line for supplying gas; and a spiral airflow generating member configured to receive gas from the gas supply line and generate a spiral airflow toward the plating solution tank inside the charging pipe.

[0122] According to the second embodiment, in the powder supply device of the first embodiment, the spiral airflow generating component has a cylindrical component having an outer surface configured to contact the inner surface of the input pipe, the cylindrical component having a first end on the plating liquid tank side and a second end on the side opposite to the first end, and having a groove extending from the first end toward the second end on the outer surface, so that the gas from the gas supply pipeline passes through the groove of the cylindrical component.

[0123] According to a third aspect, in the powder supply device according to the second aspect, the groove is formed to be inclined with respect to the axial direction of the tubular member.

[0124] According to a fourth aspect, in the powder supply device of the second or third aspect, the spiral airflow generating member further includes an air flow path extending in the circumferential direction and communicating with the groove, and an air injection port connected to the gas supply line and communicating with the air flow path.

[0125] According to the fifth embodiment, in any one of the powder supply devices of the first to fourth embodiments, the input pipe has an inlet opening end for inputting the powder and an outlet opening end for discharging the powder, and the spiral airflow generating component is arranged at the inlet opening end of the input pipe.

[0126] According to a sixth aspect, in any one of the first to fifth aspects, the powder supply device comprises: a hopper configured to accommodate the powder; and a feeder configured to supply the powder from an opening provided at a lower portion of the hopper toward the input pipe.

[0127] According to a seventh aspect, there is provided a powder supply device for supplying a powder containing a metal used in plating to a plating solution. The powder supply device comprises: a plating solution tank configured to store the plating solution; a feeding pipe for feeding the powder into the plating solution tank; and a liquid curtain generating member for generating a cylindrical liquid curtain of the plating solution so as to cover an outlet of the feeding pipe.

[0128] According to the 8th embodiment, in the powder supply device of the 7th embodiment, the liquid curtain generating component has a first cylindrical portion, and a second cylindrical portion located outside the first cylindrical portion, and a discharge port for discharging the plating liquid is formed between the first cylindrical portion and the second cylindrical portion, and the discharge port extends along the entire circumferential direction between the first cylindrical portion and the second cylindrical portion, and in a cross section of the liquid curtain generating component that is orthogonal to the axial direction, it has: a first portion having a first radial width; and a second portion having a second radial width that is larger than the first radial width.

[0129] According to a ninth aspect, in the powder supply device of the eighth aspect, the discharge port includes a plurality of the second portions, and the plurality of the second portions are arranged at substantially equal intervals in the circumferential direction.

[0130] According to the 10th embodiment, in the powder supply device of the 7th embodiment, the liquid curtain generating component comprises: a first cylindrical portion; a second cylindrical portion located outside the first cylindrical portion; and a discharge port formed between the first cylindrical portion and the second cylindrical portion, a discharge flow path connected to the discharge port and discharging the plating liquid is formed between the first cylindrical portion and the second cylindrical portion, the second cylindrical portion comprises an inclined surface on its inner circumferential surface which is inclined in such a manner that the distance between the second cylindrical portion and the first cylindrical portion becomes closer toward the discharge port, and the discharge flow path is configured to gradually narrow toward the discharge port through the inclined surface of the second cylindrical portion.

[0131] According to an eleventh aspect, in the powder supply device of the tenth aspect, the first cylindrical portion extends toward the plating solution tank side beyond the discharge port.

[0132] According to the 12th method, in any one of the powder supply devices of the 8th to 11th methods, the liquid curtain generating component comprises: an inlet for the plating liquid; and a first circumferential flow path connected to the inlet and extending circumferentially between the first cylindrical portion and the second cylindrical portion.

[0133] According to a thirteenth aspect, in the powder supply device of the twelfth aspect, the liquid curtain generating member includes a plurality of axial flow paths communicating with the first circumferential flow path.

[0134] According to the 14th embodiment, in the powder supply device of the 12th embodiment, the liquid curtain generating component has a second circumferential flow path connected to each of the above-mentioned axial flow paths and extending circumferentially between the above-mentioned first cylindrical portion and the second cylindrical portion, and the above-mentioned second circumferential flow path is connected to the above-mentioned discharge port.

[0135] According to a fifteenth aspect, in the powder supply device of the thirteenth aspect, the plurality of axial flow paths communicate with the discharge flow path.

[0136] According to a sixteenth aspect, in any one of the seventh to fifteenth aspects, the powder supply device comprises a gas supply line for supplying gas into the input pipe.

[0137] According to the 17th aspect, there is provided a powder supply device for supplying a powder containing a metal used for plating to a plating solution. The powder supply device comprises: a plating solution tank configured to store the plating solution; and a hopper for storing the powder, the hopper having an inlet for charging the powder into the hopper, and an exhaust port for exhausting the gas in the hopper, the powder supply device further comprising: a first scattering prevention member configured to prevent the powder from scattering from a gap between the inlet and a charging nozzle for charging the powder into the inlet; and a second scattering prevention member configured to prevent the powder from scattering from the exhaust port.

[0138] According to an eighteenth aspect, in the powder supply device of the seventeenth aspect, the first scattering prevention member includes a filter cloth filter and is attached to the input port or the input nozzle.

[0139] According to a nineteenth aspect, in the powder supply device of the seventeenth or eighteenth aspect, the second scattering prevention member includes a filter cloth filter and is attached to the exhaust port.

[0140] According to a 20th aspect, in the powder supply device according to any one of the 17th to 19th aspects, the injection nozzle is a nozzle of a powder container that stores powder.

[0141] According to the 21st mode, in any one of the powder supply devices of the 17th to 19th modes, there is an intermediate nozzle which receives the above-mentioned powder injected from the nozzle of the powder container storing the powder and injects the above-mentioned powder into the injection port of the above-mentioned hopper, and the above-mentioned injection nozzle is the above-mentioned intermediate nozzle.

[0142] According to a 22nd aspect, in the powder supply device of the 21st aspect, the first scattering prevention member is attached to the intermediate nozzle, and is configured so that when the powder is added to the hopper, the first scattering prevention member contacts the insertion port of the hopper.

[0143] According to a 23rd aspect, there is provided a plating system comprising: the powder supply device of any one of the 1st to 22nd aspects; a plating tank for plating a substrate; and a plating solution supply pipe extending from the plating solution tank of the powder supply device to the plating tank.

Claims

1. A powder supply device for supplying powder containing a metal used in plating to a plating solution, the powder supply device comprising: A plating solution tank configured to contain the plating solution; a feeding pipe for feeding the powder into the plating liquid tank; and a liquid curtain generating member for generating a tubular liquid curtain of the plating liquid so as to cover the outlet of the input pipe, The liquid curtain generating member includes a first tubular portion and a second tubular portion located outside the first tubular portion. A discharge port for discharging the plating liquid is formed between the first cylindrical portion and the second cylindrical portion. The discharge port extends along the entire circumferential direction between the first cylindrical portion and the second cylindrical portion, and in a cross section of the liquid curtain generating component perpendicular to the axial direction, has: a first portion having a first radial width; and a second portion having a second radial width larger than the first radial width.

2. The powder supply device according to claim 1, characterized in that: The discharge port has a plurality of the second parts, The plurality of second portions are arranged at equal intervals in the circumferential direction.

3. The powder supply device according to claim 1, characterized in that: The liquid curtain generating component comprises: an inlet for the plating solution; and A first circumferential flow path communicates with the inlet and extends in the circumferential direction between the first cylindrical portion and the second cylindrical portion.

4. The powder supply device according to claim 3, characterized in that: The liquid curtain generating member has a plurality of axial flow passages communicating with the first circumferential flow passage.

5. The powder supply device according to claim 4, characterized in that: The liquid curtain generating member has a second circumferential flow path connected to each of the plurality of axial flow paths and extending in the circumferential direction between the first tubular portion and the second tubular portion. The second circumferential flow path communicates with the discharge port.

6. The powder supply device according to claim 1, characterized in that: A gas supply line is provided for supplying gas into the injection pipe.

7. A powder supply device for supplying powder containing a metal used in plating to a plating solution, the powder supply device comprising: A plating solution tank configured to contain the plating solution; a feeding pipe for feeding the powder into the plating solution tank; and a liquid curtain generating member for generating a tubular liquid curtain of the plating liquid so as to cover the outlet of the input pipe, The liquid curtain generating member comprises: a first cylindrical portion; a second cylindrical portion located outside the first cylindrical portion; and a discharge port formed between the first cylindrical portion and the second cylindrical portion. A discharge flow path is formed between the first cylindrical portion and the second cylindrical portion, which is connected to the discharge port and discharges the plating solution. The second cylindrical portion has an inclined surface on its inner peripheral surface which is inclined so as to become closer to the first cylindrical portion toward the discharge port. The discharge flow path is configured to gradually narrow toward the discharge port due to the inclined surface of the second tubular portion.

8. The powder supply device according to claim 7, characterized in that: The first cylindrical portion extends toward the plating solution tank side beyond the discharge port.

9. The powder supply device according to claim 7, characterized in that: The liquid curtain generating component comprises: an inlet for the plating solution; a first circumferential flow path communicating with the inlet and extending in the circumferential direction between the first cylindrical portion and the second cylindrical portion; and a plurality of axial flow paths communicating with the first circumferential flow path, The plurality of axial flow paths are in communication with the exhaust flow path.

10. A plating system, characterized in that: have: The powder supply device according to any one of claims 1 to 9; a plating tank for plating a substrate; and A plating solution supply pipe extending from the plating solution tank of the powder supply device to the plating tank.

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