Display panel manufacturing method, display panel and display device

Abstract

The present disclosure relates to a method for manufacturing a display panel, a display panel, and a display device, the manufacturing method comprising: preparing a first base on a substrate to form a first substrate; preparing a plurality of supporting structures on the first substrate, wherein the plurality of supporting structures are arranged at intervals on the first substrate, and a first gap is formed between adjacent supporting structures; filling a first photoresist in the first gap to form a pixel wall; removing the supporting structure to form the pixel wall on the first substrate. The present disclosure prepares a plurality of supporting structures at a preset interval on the first substrate, and then coats the first photoresist in the first gap formed between the supporting structures to form a pixel wall, and then removes the supporting structure, so that a highly uniform pixel wall can be manufactured on the first substrate, and the gap between the pixel wall and the first substrate is filled to prevent the migration of black microspheres in the ink from causing display crosstalk, thereby ensuring the stability of the display of the display panel and improving the product quality of the display panel.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a method for manufacturing a display panel, a display panel, and a display device. Background Art

[0002] The reflective display device in the display panel is a device structure that uses natural light for display. It can use ambient light to achieve clear display in both strong and weak light conditions, and has the advantages of low driving voltage, energy saving, and little damage to the eyes. However, there are still many technical difficulties in the preparation process of reflective display panels, resulting in poor performance of the prepared display panels. Summary of the invention

[0003] According to one of the solutions of the present disclosure, a method for manufacturing a display panel is provided, comprising:

[0004] Preparing a first base on a base substrate to form a first substrate;

[0005] Preparing a plurality of support structures on the first substrate, wherein the plurality of support structures are spaced apart on the first substrate, and a first gap is formed between adjacent support structures;

[0006] Filling the first gap with a first photoresist to form a pixel wall;

[0007] The supporting structure is removed so that the pixel wall is formed on the first substrate.

[0008] In some embodiments, the support structure extends along a thickness direction of the first substrate.

[0009] In some embodiments, the height of the support structure is greater than the height of the pixel wall, wherein the height of the support structure is the distance from the surface of the support structure away from the first substrate to the first substrate along the thickness direction of the first substrate; the height of the pixel wall is the distance from the surface of the pixel wall away from the first substrate to the first substrate along the thickness direction of the first substrate.

[0010] In some embodiments, preparing a plurality of support structures on the first substrate comprises:

[0011] coating a second photoresist on the first substrate;

[0012] The coated second photoresist is exposed, and the exposed second photoresist is developed to obtain the support structure.

[0013] In some embodiments, preparing a plurality of support structures on the first substrate comprises:

[0014] Coating an embossing adhesive on the first substrate to form an embossing layer;

[0015] The embossing layer is embossed according to a preset graphic pattern to form a groove area, wherein the groove area forms the first gap, and the unembossed portion of the embossing layer forms the support structure;

[0016] The preset embossing glue is retained on the embossed layer to form an embossing residual glue layer.

[0017] In some embodiments, removing the support structure comprises:

[0018] The support structure is removed by using a stripping solution or dry etching.

[0019] In some embodiments, the method further comprises:

[0020] preparing a second substrate;

[0021] The first substrate and the second substrate are assembled together to form a display panel.

[0022] In some embodiments, the method further comprises:

[0023] preparing a lens layer on the first substrate;

[0024] A plurality of the support structures are prepared on the lens layer.

[0025] In some embodiments, the first substrate includes a filter layer and a light shielding layer arranged in the same layer, and the plurality of support structures are prepared on the lens layer, including:

[0026] The support structure is prepared at a position on the lens layer corresponding to the filter layer.

[0027] In some embodiments, preparing a lens layer on the first substrate comprises:

[0028] The lens material disposed on the first substrate is coated, and the lens layer is formed by nanoimprint curing.

[0029] In some embodiments, the first substrate is an array substrate, the second substrate is a color filter substrate, the second substrate includes a filter layer and a light shielding layer arranged on the same layer, and after the first substrate and the second substrate are assembled, the position of the pixel wall formed on the first substrate corresponds to the light shielding layer of the second substrate; or

[0030] The first substrate is a color filter substrate, the second substrate is an array substrate, and the method further includes:

[0031] A pixel wall is formed on the second substrate; after the first substrate and the second substrate are aligned, the pixel wall on the second substrate corresponds to the pixel wall on the first substrate one by one.

[0032] According to one of the solutions of the present disclosure, a display panel is further provided, comprising a first substrate, a second substrate, and a pixel wall arranged between the first substrate and the second substrate, wherein the pixel wall is formed on the first substrate using the above method.

[0033] In some embodiments, the first substrate is a color film substrate having a lens layer formed thereon, and the pixel wall is formed on the lens layer; or, the first substrate is an array substrate, and the pixel wall is formed on a TFT base of the array substrate.

[0034] In some embodiments, a printed residual adhesive layer is provided between the pixel wall and the lens layer; or, a printed residual adhesive layer is provided between the pixel wall and the TFT base of the array substrate.

[0035] According to one of the solutions of the present disclosure, a display device is also provided, comprising the above-mentioned display panel.

[0036] The various embodiments of the present disclosure provide a method for manufacturing a display panel, a display panel, and a display device. A plurality of support structures are first prepared on a first substrate at a preset distance, and a first photoresist is then coated in a first gap formed between the support structures to form a pixel wall. The support structure is then removed, so that a pixel wall with a regular shape and uniformity can be manufactured on the first substrate, and the gap between the pixel wall and the first substrate is filled to prevent the migration of black microspheres in the ink from causing display crosstalk on the display panel, thereby ensuring the display stability of the display panel and improving the product quality of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 A schematic diagram showing the main structure of a CID reflective display device in the related art;

[0038] Figure 2 A schematic diagram showing a top view of the structure of a pixel wall;

[0039] 3(a) and 3(b) are schematic diagrams showing the migration of black microspheres in a CID device structure in the related art;

[0040] Figure 4 A real-life image of a pixel wall prepared in the related art is shown;

[0041] Figure 5 A flow chart showing a method for manufacturing a display panel according to an embodiment of the present disclosure;

[0042] Figures 6 to 13A schematic diagram of manufacturing a display panel according to an embodiment of the present disclosure is shown;

[0043] Fig.14 A real-life image of a pixel wall produced by a nanoimprinting method according to an embodiment of the present disclosure is shown;

[0044] FIG. 15( a ) shows a schematic structural diagram of a display panel manufactured by the method for manufacturing a display panel according to an embodiment of the present disclosure;

[0045] FIG. 15( b ) shows a schematic structural diagram of another display panel manufactured by the method for manufacturing a display panel according to an embodiment of the present disclosure;

[0046] FIG15( c ) shows a schematic structural diagram of another display panel manufactured using the method for manufacturing a display panel according to an embodiment of the present disclosure.

[0047] Reference numerals:

[0048] 11-color film substrate; 12-array substrate, 121-TFT substrate; 13-lens element; 14-pixel wall; 15-sealant frame; 16-pixel area; 17-ink, 171-black microspheres;

[0049] 10-first substrate, 20-second substrate;

[0050] 1-base substrate; 2-color film base, 21-filter layer, 22-light shielding layer, 211-first color filter, 212-second color filter, 213-third color filter; 3-lens layer; 4-support structure; 5-first gap; 6-embossed residual glue layer. DETAILED DESCRIPTION

[0051] Various aspects and features of the present disclosure are described herein with reference to the drawings.

[0052] It should be understood that various modifications may be made to the embodiments of the present application. Therefore, the above description should not be considered as limiting, but only as an example of an embodiment. Other modifications within the scope and spirit of the present disclosure will occur to those skilled in the art.

[0053] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the general description of the present disclosure given above and the detailed description of the embodiments given below, serve to explain the principles of the present disclosure.

[0054] These and other characteristics of the present disclosure will become apparent from the following description of a preferred form of embodiment given as a non-limiting example, with reference to the attached drawings.

[0055] It should also be understood that although the disclosure has been described with reference to certain specific examples, those skilled in the art will be able to readily implement many other equivalent forms of the disclosure.

[0056] The above and other aspects, features and advantages of the present disclosure will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.

[0057] Specific embodiments of the present disclosure are described hereinafter with reference to the accompanying drawings; however, it should be understood that the embodiments claimed are merely examples of the present disclosure, which may be implemented in a variety of ways. Well-known and / or repeated functions and structures are not described in detail to avoid obscuring the present disclosure with unnecessary or redundant details. Therefore, the specific structural and functional details claimed herein are not intended to be limiting, but merely serve as a basis and representative basis for the claims to teach those skilled in the art to use the present disclosure in a variety of ways with substantially any suitable detailed structure.

[0058] Reflective display devices are device structures that use natural light for display. They can use ambient light to display clearly in strong or weak light, and have the advantages of low driving voltage, energy saving, and little damage to the eyes. There are two main methods for reflective display in related technologies, namely E-Ink reflective display and Clear-Ink reflective display (CID).

[0059] like Figure 1 As shown, the CID display device includes a color film substrate (CF) 11 with a lens 13 (Lens), an array substrate (TFT) 12, and a pixel wall 14 (Pixel wall) located between the color film substrate 11 and the array substrate 12. The peripheries of the color film substrate 11 and the array substrate 12 are sealed by a sealing frame 15; Figure 2 As shown, the pixel wall 14 in the CID display device structure is a closed structure, and each pixel area 16 corresponds to a closed pixel wall.

[0060] Compared with E-ink reflective display, CID reflective display has the advantages of low driving voltage, low energy consumption, and color display. However, the CID device structure has the technical difficulties of ink filling difficulty and black microsphere migration leading to unstable display (display crosstalk) during the preparation process. As shown in Figure 3 (a) and Figure 3 (b), the pixel wall 14 corresponding to each pixel area 16 of the CID device structure adopts a closed structure design to ensure that the number of black microspheres 171 in the ink 17 under each pixel 16 remains stable. However, when the CID device structure has the problem of uneven height of the pixel wall 14 during the preparation process, the black ink 17 can migrate in different pixel areas 16, resulting in the occurrence of display crosstalk. As shown in Figure 3 (a), when the ink 17 is overfilled (the height H of the filled ink 17 exceeds the height of the pixel wall 14), the black microsphere 171 migrates between the pixel walls 14; as shown in Figure 3 (b), when there is a contact gap between the pixel wall 14 and the color filter substrate 11, the black microsphere 171 migrates through the gap.

[0061] In the related art, the method for preparing the pixel wall 14 on the lens part 13 (Lens substrate) of the color film substrate 11 is generally to first coat the lens part 13 with photoresist, and then prepare the pixel wall 14 structure by photolithography, that is, the pixel wall 14 prepared by direct photolithography (the material is generally negative photoresist). Since there are ups and downs in the upper and lower surfaces of the lens part 13, the use of direct photolithography to coat the photoresist to prepare the pixel wall 14 will make the height of the pixel wall 14 along the thickness direction of the CID device uneven (including different heights of different pixel walls 14 and different heights of the surface of the same pixel wall 14). Specifically, due to the difference in light intensity received by the upper surface (the side surface away from the color film substrate 11) and the lower surface (the side surface close to the color film substrate 11) of the lens part 13, usually the upper surface is more and the lower surface is less, and the line width of the lower surface of the pixel wall 14 after development is significantly smaller than the upper surface, so that it presents an inverted trapezoidal structure, and the vertical shape, height uniformity and light output rate of the pixel wall 14 cannot be ensured. In addition, the exposure machine automatically focuses during exposure (Auto Focus), combined with the scattering effect of different colors of light on the color filter substrate 11 on the exposure lamp, makes the height of the pixel wall 14 uneven after exposure, and the shape structure of the pixel wall 14 cannot be well controlled. Figure 4 As shown in the circled portion, the pixel wall 14 is in an inverted trapezoidal shape and is offset (the upper surface of the pixel wall 14 has different heights).

[0062] Figure 5 A flow chart showing a method for manufacturing a display panel according to an embodiment of the present disclosure is shown; Figures 6 to 13 FIG. 2 shows a schematic diagram of manufacturing a display panel according to an embodiment of the present disclosure. Figures 5 to 13 As shown, the embodiment of the present disclosure provides a method for manufacturing a display panel, comprising:

[0063] S101: preparing a first base on a base substrate 1 to form a first substrate 10;

[0064] S102: preparing a plurality of support structures 4 on the first substrate, wherein the plurality of support structures 4 are arranged at intervals on the first substrate, and first gaps 5 are formed between adjacent support structures 4;

[0065] S103: filling the first gap 5 with a first photoresist to form a pixel wall 14;

[0066] S104 : removing the support structure 4 , so that the pixel wall 14 is formed on the first substrate 10 .

[0067] The manufacturing method of the display panel provided in the embodiment of the present disclosure prepares a plurality of support structures 4 at a preset distance on a first substrate 10, and then coats a first photoresist in a first gap 5 formed between the support structures 4 to form a pixel wall 14. Thereafter, the support structure 4 is removed, so that a pixel wall 14 with a regular shape and uniformity can be manufactured on the first substrate 10, and a second gap between the pixel wall 14 and the first substrate 10 is filled to prevent the migration of black microspheres 171 in the ink from causing display crosstalk on the display panel, thereby ensuring the display stability of the display panel and improving the product quality of the display panel.

[0068] Figure 15(a) to Figure 15(c) FIG. 1 is a schematic diagram showing the structure of a display panel manufactured by the method for manufacturing a display panel according to an embodiment of the present disclosure. Figure 15(a) to Figure 15(c) As shown, in some embodiments, the method further includes:

[0069] preparing a second substrate 20;

[0070] The first substrate 10 and the second substrate 20 are assembled together to form a display panel.

[0071] After the first substrate 10 with the pixel walls 14 is manufactured, the second substrate 20 is prepared, and then the first substrate 10 and the second substrate 20 are assembled and sealed with a frame sealant to form a display panel.

[0072] The first substrate 10 may be a color filter substrate 11 and / or an array substrate 12, that is, the pixel wall 14 may be formed on the color filter substrate 11 or the array substrate 12 by the above-mentioned manufacturing method. The manufacturing method of the display panel of the embodiment of the present disclosure is described in detail below by taking the manufacturing of the pixel wall 14 on the color filter substrate 11 as an example.

[0073] like Figures 6 to 13 As shown, the manufacturing method of the display panel of the embodiment of the present disclosure specifically includes the following steps:

[0074] S1011: preparing a color filter base 2 on the base substrate 1 to form a color filter substrate 11.

[0075] Specifically, Figure 6 As shown, a color filter substrate 2 having a filter layer 21 and a light shielding layer 22 is prepared on a base substrate 1. The filter layer 21 and the light shielding layer 22 are arranged in the same layer, and the filter layer 21 may include: a plurality of filters, and the filters may include different colors. For example, the filters include a first color filter 211, a second color filter 212, and a third color filter 213. Each color filter may correspond to at least one pixel area 16. When the display panel is displayed, the position corresponding to the pixel area 16 may display the color corresponding to the color of the filter, and the color display of the display panel can be realized. Exemplarily, the first color filter 211 is a red filter (R), the second color filter 212 is a green filter (G), and the third color filter 213 is a blue filter (B).

[0076] The light shielding layer 22 may be a black matrix (BM), and the light shielding layer 22 is arranged between adjacent color filters, that is, the black matrix and the color filters are arranged alternately to avoid crosstalk between adjacent pixel regions 16, and at the same time, the light irradiated on the thin film transistor (TFT) is shielded by the light shielding layer 22. The areas on the color filter substrate 2 except the color filter layer 21 are all covered by the light shielding layer 22. The base substrate 1 is preferably a glass substrate.

[0077] S1021: preparing a lens layer 3 on the color film substrate 2.

[0078] like Figure 7 As shown, the lens material disposed on the color film substrate 2 is coated, and a lens layer (Lens substrate) 3 is formed by nano-imprint curing.

[0079] S1031 : preparing a plurality of support structures 4 on the lens layer 3 , with adjacent support structures 4 spaced apart by a preset distance to form a first gap 5 .

[0080] Specifically, Figure 8 As shown, a support structure 4 extending along the thickness direction of the color film substrate 2 is prepared on the lens layer 3 .

[0081] S1041 : coating a first photoresist (PR) in the first gap 5 to form a pixel wall 14 .

[0082] Specifically, Fig. 9 As shown, the first photoresist is evenly coated in the first gap 5 by scraping to form the pixel wall 14 .

[0083] S1051 : removing the support structure 4 , so that the pixel wall 14 is formed on the color filter substrate 11 .

[0084] like Fig.10 and Fig.13 As shown, in this step, the support structure 4 is removed by using a stripping liquid or dry etching, and the pixel wall 14 is retained, so that the pixel wall 14 can be made on the lens layer 3 of the color filter substrate 11. For example, the support structure 4 can be washed away by using a stripping liquid.

[0085] The manufacturing method of the display panel provided by the embodiment of the present disclosure prepares a plurality of support structures 4 at a preset distance on the lens layer 3 of the color film substrate 2, and then coats a first photoresist in a first gap 5 formed between the support structures 4 to form a pixel wall 14. After that, the support structure 4 is removed, so that a pixel wall 14 with uniform height can be manufactured on the lens layer 3 of the color film substrate 2.

[0086] Compared with the pixel wall 14 obtained by direct patterning, the line width of the upper surface and the line width of the lower surface of the pixel wall 14 produced by the embodiment of the present disclosure are basically the same, and the shape is square, with good shape and size uniformity. At the same time, in the display panel prepared by the above method, since the support structure 4 is perpendicular to the color filter substrate 2, it is possible to prepare a pixel wall 14 with a regular shape and a slope angle close to 90°, which can effectively improve the shape and alignment accuracy of the pixel wall 14 to ensure the light output rate, thereby solving the technical problems of the uniformity of the box thickness in the CID display device structure and the occurrence of display crosstalk caused by the migration of black microspheres.

[0087] In some embodiments, Fig. 9 and Fig.12 As shown, the height of the support structure 4 is greater than the height of the pixel wall 14, wherein the height of the support structure 4 is the distance from the surface of the support structure 4 away from the first substrate 10 to the first substrate 10 along the thickness direction of the first substrate 10; the height of the pixel wall 14 is the distance from the surface of the pixel wall 14 away from the first substrate 10 to the first substrate 10 along the thickness direction of the first substrate 10.

[0088] When preparing the support structure 4 and the pixel wall 14, the height of the support structure 4 is set higher than the height of the pixel wall 14, and the coating material (first photoresist) is filled in the first gap 5. The coating material in the first gap 5 can be controlled to prevent material overflow and ensure the uniformity of the size of the formed pixel wall 14.

[0089] In some embodiments, Figures 8 to 10As shown, the support structure 4 is prepared at a position on the lens layer 3 corresponding to the filter. That is, in step S103, the orthographic projection of the support structure 4 on the color filter substrate 11 formed with the filter (i.e., the projection along the thickness direction of the first substrate 10) corresponds to the position of the filter, wherein the orthographic projection of the support structure 4 on the first substrate 10 corresponds to the position of the filter means that the orthographic projection of the support structure 4 on the first substrate 10 and the orthographic projection of the filter at least partially overlap, and further, the orthographic projection of the filter is located within the orthographic projection area of ​​the corresponding support structure 4, so that the first gap 5 corresponds to the light shielding layer 22, so that the pixel wall 14 produced in step S103 corresponds to the light shielding layer 22, and the display aperture ratio of the display panel is ensured. In some examples, the orthographic projection of the pixel wall 14 on the first substrate 10 is located within the orthographic projection area of ​​the light shielding layer 22.

[0090] In some embodiments, Figure 8 and Fig. 9 As shown, steps S1031 to S1041 specifically include:

[0091] S10311: coating a second photoresist on the lens layer 4;

[0092] S10312: exposing the coated second photoresist, and developing the exposed second photoresist to obtain the support structure 4;

[0093] S10411 : coating a first photoresist in the first gap 5 to form the pixel wall 14 .

[0094] Specifically, in steps S10311 and S10312, the support structure 4 is first prepared on the lens layer 3 by photolithography, and the pixel wall 14 is prepared by photolithography in step S10411. After the lens layer 3 is produced, the support structure 4 is prepared by coating the second photoresist on the lens layer 3 and then using an exposure and development process, and then the first photoresist is uniformly coated on the first gap 5 by scraping to form the pixel wall 14, and then the support structure 4 is removed by stripping liquid or dry etching in step S1051, and the pixel wall 14 is retained. The second photoresist is preferably a resin glue.

[0095] In this embodiment, the support structure 4 is prepared by photolithography. Although there may be height fluctuations (dimensions along the thickness direction of the first substrate) in the process of coating the second photoresist on the lens layer 3, since the support structure 4 plays a role in determining the position and width of the pixel wall 14, the height of the pixel wall 14 extending from the lens layer 3 is less than the height of the support structure 4 extending from the lens layer 3 ( Fig. 9The height of the pixel wall 14 shown is much lower than the height of the support structure 4), that is, the support structure 4 acts like a "container". When other conditions are constant, the height of the pixel wall 14 extending from the lens layer 3 is determined by the amount of glue sprayed when the first photoresist is coated in the first gap 5 to make the pixel wall 14. Since the support structure 4 will eventually be peeled off, the height difference of different support structures 4 does not affect the uniformity of the height of the pixel wall 14.

[0096] In the disclosed embodiment, the support structure 4 is first prepared by a photolithography process, and then a first photoresist is coated on the first gap 5 to form a pixel wall 14 by a photolithography process (the pixel wall 14 is prepared indirectly). Compared with directly preparing the pixel wall 14 by a photolithography process, the desired pixel wall 14 can be obtained by controlling the amount of the first photoresist sprayed, and the formed pixel wall 14 has a uniform and fixed appearance. When the pixel wall 14 is prepared directly by a photolithography process, the appearance of the pixel wall 14 cannot be precisely controlled, so that each pixel wall 14 is of different sizes.

[0097] In other embodiments, Fig.11 and Fig.12 As shown, steps S1031 to S1041 specifically include:

[0098] S10313: Coating an embossing adhesive on the lens layer 3 to form an embossing layer;

[0099] S10314: stamping the stamping layer according to a preset graphic style to stamp out a groove area, wherein the groove area forms the first gap 5, and the unstamped portion of the stamping layer forms the support structure 4;

[0100] S10315: retaining the preset embossing adhesive on the embossed layer to form an embossed adhesive residue layer 6;

[0101] S10412 : Coating a first photoresist in the groove area to form the pixel wall 14 .

[0102] Specifically, steps S10313 and S10314 use nanoimprinting to prepare the support structure 4 on the lens layer 3, and then prepare the pixel wall 14 through step S10412. In this embodiment, the support structure 4 is prepared by nanoimprinting. By first imprinting and then curing, the imprinting glue used as the support structure 4 can be directly flattened, which fully ensures the morphology and height uniformity of the support structure 4, and then the second photoresist (PW material) is applied by scraping to obtain the pixel wall 14, which can better ensure the height uniformity of the pixel wall. In addition, the nanoimprinting method does not require the use of a mask process, the process is simple, and the production cost of the pixel wall 14 can be effectively reduced. In this embodiment, UV-curable imprinting glue can be used. The imprinting glue can be selected from any one of acrylic resin and epoxy resin.

[0103] Furthermore, if Fig.13 As shown, after the pixel wall 14 is formed in step S10412 , the support structure 4 is removed in step S1051 , so that the pixel wall 14 is formed on the color filter substrate 11 .

[0104] It is understandable that if Fig.13 and Fig.14 As shown, after the support structure 4 is removed in step S1051, the embossed adhesive residue layer 6 in the groove area of ​​the first gap 5 is still retained, and the embossed adhesive residue layer 6 corresponding to the support structure 4 can be completely removed along with the removal of the support structure 4, or partially retained.

[0105] In this embodiment, in order to protect the underlying structure during the imprinting process, a certain amount of imprinting adhesive residue is retained. After the pixel wall 14 is obtained by scraping, the imprinting adhesive residue will be retained in the overall structure later. The thickness of the imprinting adhesive residue is generally about tens of nanometers. The existence of the imprinting adhesive residue prevents the pixel wall 14 from directly contacting the lens layer 3, protecting the structure of the lens layer 3, and the thickness of the nano-imprinting adhesive residue is small. The existence of the adhesive residue does not affect the light extraction efficiency, and has no effect on the structure and height of the pixel wall 14.

[0106] The preset spraying amount of the embossing adhesive for forming the embossing residual adhesive layer 6 in step S10315 can be designed in advance according to the size of the base substrate 1 and can be adjusted by adjusting the number of embossing times during the embossing process.

[0107] The preset graphic style includes the graphic shape and the graphic size, etc., which are determined according to the size of the sealant 30 and the size of each protruding structure in the lens layer 3 to ensure the efficiency and yield in the subsequent CID device preparation process. In this embodiment, the preset graphic style is preferably in the form of a specific graphic coating of the second photoresist (PW material).

[0108] When the pixel wall 14 is formed on the array substrate 12 , the TFT substrate 121 can be directly prepared on the base substrate 1 in step S101 . After the array substrate 12 is formed, the support structure 4 is prepared on the TFT substrate 121 by using the above-mentioned photolithography method or nanoimprinting method.

[0109] After the pixel wall 14 is formed on the array substrate 12, since the lens layer 3 is formed on the color filter substrate 11, after the color filter substrate 11 and the array substrate 12 are assembled, the position of the pixel wall 14 formed on the array substrate 12 corresponds to the light shielding layer 22 of the color filter substrate 11, so as to ensure the display aperture ratio of the display panel. That is, the position of the support structure 4 can be determined in advance based on the light shielding layer 22 of the color filter substrate 11, and then the support structure 4 is prepared.

[0110] As shown in FIG. 15(a), the pixel wall 14 can be prepared on the color filter substrate 11; as shown in FIG. 15(b), the pixel wall 14 can also be prepared on the array substrate 12. Since the array substrate 12 adopts the AM TFT (a-Si) driving mode, the light shielding layer-filter layer-lens layer-electrode layer-pixel wall-dielectric layer is prepared on the color filter substrate 11 side. The pixel wall 14 is prepared on the array substrate 12. After the array substrate 12 and the color filter substrate 11 are boxed, it is impossible to make the pixel wall 14 and the lens layer 3 set on the color filter substrate 11 fit tightly, that is, the pixel wall 14 and the lens layer 3 are formed on different substrates respectively, and there may still be a certain gap. Since the black ink 17 has fluidity, it will cause the black ink 17 to migrate in different pixel areas 16, resulting in the occurrence of display crosstalk. Therefore, in order to ensure the display effect of the display panel, when preparing the pixel wall 14, it is preferred to prepare the pixel wall 14 on the color film substrate 11 so that the lens layer 3 and the pixel wall 14 are prepared on the same substrate to prevent a gap from appearing between the lens layer 3 and the pixel wall 14.

[0111] In a specific implementation, as shown in FIG. 15( c ), the pixel walls 14 may be prepared on the color filter substrate 11 and the array substrate 12 at the same time, and after the color filter substrate 11 and the array substrate 12 are aligned, the pixel walls 14 respectively prepared on the color filter substrate 11 and the array substrate 12 are connected one by one, so that the display effect of the display panel can also be guaranteed.

[0112] The embodiment of the present disclosure further provides a display panel, including a first substrate 10, a second substrate 20, and a pixel wall 14 disposed between the first substrate 10 and the second substrate 20, wherein the pixel wall 14 is formed on the first substrate 10 using the above method.

[0113] In some embodiments, the first substrate 10 is a color filter substrate 11 , the second substrate 20 is an array substrate 12 , a lens layer 3 is formed on the color filter substrate 11 , and the pixel wall 14 is formed on the lens layer 3 .

[0114] In some other embodiments, the first substrate 10 is an array substrate 12 , the second substrate 20 is a color filter substrate 11 , and the pixel wall 14 is formed on a TFT substrate 121 of the array substrate 12 .

[0115] Furthermore, if Fig.13 and Fig.14 As shown, when the pixel wall 14 is formed on the lens layer 3, an imprinted adhesive residue layer 6 is further provided between the pixel wall 14 and the lens layer 3; when the pixel wall 14 is formed on the TFT substrate 121 of the array substrate 12, an imprinted adhesive residue layer 6 is further provided between the pixel wall 14 and the TFT substrate 121 of the array substrate 12, so that when the pixel wall 14 is formed by nanoimprinting, a certain amount of nanoimprinted adhesive residue is retained to form the imprinted adhesive residue layer 6 to protect the lens layer 3.

[0116] An embodiment of the present disclosure further provides a display device, comprising the above-mentioned display panel.

[0117] An example of the display device is a liquid crystal display device. The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a wearable watch, a navigator, etc.

[0118] The display panel and the display device provided in the embodiments of the present disclosure correspond to the manufacturing method of the display panel in the above-mentioned embodiments. Any optional items in the embodiment of the manufacturing method of the display panel are also applicable to the embodiments of the display panel and the display device, which will not be described in detail here.

[0119] The above embodiments are only exemplary embodiments of the present disclosure and are not intended to limit the present disclosure. The protection scope of the present disclosure is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present disclosure within the essence and protection scope of the present disclosure, and such modifications or equivalent substitutions shall also be deemed to fall within the protection scope of the present disclosure.

Claims

1. A method for manufacturing a display panel, comprising: Preparing a first base on a base substrate to form a first substrate; Preparing a plurality of support structures on the first substrate, wherein the plurality of support structures are spaced apart on the first substrate, and a first gap is formed between adjacent support structures; Filling the first gap with a first photoresist to form a pixel wall; removing the supporting structure so that the pixel wall is formed on the first substrate; On the first substrate, a plurality of support structures are prepared, including: preparing a lens layer on the first substrate; Coating an imprint glue on the lens layer by a nanoimprint method to form an imprint layer; The embossing layer is embossed according to a preset graphic pattern to form a groove area, wherein the groove area forms the first gap, and the unembossed portion of the embossing layer forms the support structure; The preset embossing glue is retained on the embossed layer to form an embossing residual glue layer, wherein the embossing residual glue layer prevents the pixel wall from directly contacting the lens layer.

2. The method according to claim 1, wherein: The supporting structure extends along a thickness direction of the first substrate.

3. The method according to claim 1, wherein: The height of the support structure is greater than the height of the pixel wall, wherein the height of the support structure is the distance from the surface of the support structure away from the first substrate to the first substrate along the thickness direction of the first substrate; the height of the pixel wall is the distance from the surface of the pixel wall away from the first substrate to the first substrate along the thickness direction of the first substrate.

4. The method according to claim 1, wherein: The removing of the support structure comprises: The support structure is removed by using a stripping solution or dry etching.

5. The method according to any one of claims 1 to 4, wherein: The method further comprises: preparing a second substrate; The first substrate and the second substrate are assembled together to form a display panel.

6. The method according to claim 1, wherein: The first substrate includes a filter layer and a light shielding layer arranged in the same layer, and a plurality of the support structures are prepared on the lens layer, including: The support structure is prepared at a position on the lens layer corresponding to the filter layer.

7. The method according to claim 1, wherein: The step of preparing a lens layer on the first substrate comprises: The lens material disposed on the first substrate is coated, and the lens layer is formed by nanoimprint curing.

8. The method according to claim 5, wherein: The first substrate is an array substrate, the second substrate is a color filter substrate, the second substrate includes a filter layer and a light shielding layer arranged on the same layer, and after the first substrate and the second substrate are assembled, the position of the pixel wall formed on the first substrate corresponds to the light shielding layer of the second substrate; or The first substrate is a color filter substrate, the second substrate is an array substrate, and the method further includes: forming a pixel wall on the second substrate; After the first substrate and the second substrate are assembled, the pixel walls on the second substrate correspond one-to-one to the pixel walls on the first substrate.

9. A display panel comprising a first substrate, a second substrate, and a pixel wall disposed between the first substrate and the second substrate, wherein: The pixel wall is formed on the first substrate by the method according to any one of claims 1 to 5; The first substrate is a color filter substrate, a lens layer is formed on the color filter substrate, and the pixel wall is formed on the lens layer; an embossed residual adhesive layer is provided between the pixel wall and the lens layer; or an embossed residual adhesive layer is provided between the pixel wall and the TFT base of the array substrate. 10 . A display device comprising the display panel according to claim 9 .

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