Chip transmission buffer device

By installing flexible rubber or plastic elliptical barrier plates behind the chip transport track, the problem of excessive chip transport speed is solved, achieving flexible deceleration and efficient sorting, and avoiding chip damage and jamming.

CN115892969BActive Publication Date: 2025-11-18NANTONG XINMENG TESTING RES INST OPERATION MANAGEMENT CO LTD
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Patent Information

Application Number
CN202211692058.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-12-28
Publication Date
2025-11-18
Estimated Expiration
2042-12-28

AI Technical Summary

Technical Problem

In existing chip testing devices, the chips travel too fast during transmission, which leads to untimely sorting of genuine and defective products and may even damage the chips.

Method used

A flexible rubber or plastic elliptical barrier is installed behind the transmission track. It slows down the chip by colliding with it. The barrier rotates around the axis to control the chip speed and prevent jamming.

Benefits of technology

It achieves flexible deceleration of the chip, avoiding damage, while improving sorting efficiency and avoiding jamming problems. The structure is simple and the cost is low.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application provides a chip transmission buffer device, which has a door-shaped support crossing a horizontal track, two sides of the door-shaped support are erected on two sides of the horizontal track, and the upper side of the door-shaped support is a cylindrical rotating shaft. An elliptical blocking piece in a vertical plane is movably sleeved on the rotating shaft, and the sleeving position of the blocking piece is a focus above the ellipse. The application can effectively slow down the transmission speed of the descending chip, the flexibility of the blocking piece will not damage the chip, the blocking piece will not rotate too much to cause a jamming situation, and the transmission of the chip can be continuously carried out.
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Description

Technical Field

[0001] This invention relates to a device for controlling the speed of a chip sliding on a track. Background Technology

[0002] Chips are tiny electronic devices, typically temporarily loaded onto straight plastic or aluminum alloy tubes during production line transport for inspection and sorting. Existing IC inspection equipment usually introduces chips from a high position into the inspection and sorting machine, using their own weight to transport them along a track to individual inspection stations. After inspection, they are sorted and packaged at a lower position. The chips in the inspection and sorting machine experience significant drops, and their falling speed can sometimes be quite fast. Without deceleration control, the sorting and packaging of genuine and defective chips may not be completed in time, and in some cases, chips may be damaged.

[0003] The invention with application number 2022109129968 relates to an automatic chip detection and sorting device, which includes: a support assembly, the support assembly including a bracket and a panel fixed on the bracket and inclined; and a sorting assembly, the sorting assembly including a main track fixed on the panel, a rear sorting plate fixed on the top of the main track, a pin slot formed on the top of the main track, a chip support plate integrally connected to the bottom of the pin slot, a rear chip slot formed on the bottom of the rear sorting plate and facing the pin slot, a baffle slot penetrating the rear sorting plate, and a first baffle plate and a second baffle plate that are relatively liftable and detachable in the baffle slot; the baffle plate of this invention is a rigid barrier, which can easily cause chip impact damage.

[0004] The invention with application number 2022105409090 provides a receiving mechanism and a corresponding IC chip testing device. The receiving mechanism has a sorting component mounted on an inclined plate near the testing station's waiting track for sorting and receiving tested IC chips. A good-quality chip receiving component is mounted on the inclined plate near the sorting component for receiving tested good IC chips, and a defective chip receiving component is mounted on the inclined plate near the sorting component for receiving tested defective IC chips. The limiting protrusions in this invention make it difficult to decelerate, easily causing chips to splash off the track. Summary of the Invention

[0005] Purpose of the invention:

[0006] A chip transmission buffer device is provided that allows chips in the transmission track to be flexibly decelerated and is less prone to jamming.

[0007] Technical solution:

[0008] The chip transfer buffer device of the present invention is installed directly above the horizontal track behind the inclined transfer track. It has a gantry bracket spanning the horizontal track. The two sides of the gantry bracket stand on both sides of the horizontal track, and the upper side of the gantry bracket is a cylindrical rotating shaft. An elliptical blocking piece in a vertical plane is movably sleeved on the rotating shaft. The sleeved position of the blocking piece is a focus above the ellipse, and the thickness of the blocking piece is less than the width of the horizontal track; the blocking piece can rotate around the rotating shaft at the focus position in the vertical plane.

[0009] When the chip sliding down from the inclined track passes through the horizontal track, the lower end of the blocking piece will collide with the chip, thereby blocking the chip and slowing down or even stopping the chip's speed.

[0010] The described blocking piece is a flexible rubber sheet or plastic sheet. The collision between the chip and the flexible blocking piece will not cause damage to the chip. The thickness of the blocking piece can be slightly smaller than the width of the chip, about half of the width of the track.

[0011] In the present invention, assume that the length of the long axis of the ellipse is L, the distance between the two foci is D, and the thickness of the chip itself is T. The distance h between the upper focus of the ellipse and the horizontal transfer track is less than (L + D) / 2 and greater than (L - D) / 2 + T. When the blocking piece hangs naturally, it will be slightly inclined to contact the horizontal transmission track. So that no matter what thickness of the chip is transmitted, it can contact and impact the lower end of the blocking piece, and the chip is blocked and decelerated. After being impacted by the chip, the blocking piece obtains a certain kinetic energy. While blocking the chip, the blocking piece will obtain the kinetic energy of rotating around the rotating shaft and be lifted to a certain height; the decelerated chip continues to move forward through the horizontal transfer track to the subsequent process section.

[0012] Assume that the height difference of the chip on the inclined transfer track is H (assuming the initial velocity of the chip at the starting position of the inclined transfer track is 0), the mass of the chip is m, and the mass of the blocking piece is M; after the chip falls, it will obtain potential energy mgH, and most of this potential energy will be transmitted to the blocking piece, and a small amount of potential energy is converted into the kinetic energy of the chip continuing to slide on the horizontal track.

[0013] The blocked piece will rotate around the rotating shaft after being impacted, and its center of gravity will move upward. The maximum displacement that its center can move upward is D. When mgH < MgD, the potential energy of the chip falling from the inclined track is less than the potential energy of the blocking piece rotating to the highest position, the lowest end of the blocking piece cannot rotate to the highest end, and the angle of rotation of the blocking piece around the rotating shaft after being impacted is less than 180°. After the blocking piece rotates to a high position, it cannot continue to rotate and will return to rotate and fall to facilitate blocking the next chip.

[0014] If the chip's falling potential energy or initial velocity is too high, causing the impact barrier to rotate more than 180°, the barrier will continue to rotate and fall, eventually contacting the horizontal track at an angle and jamming it, preventing further chip passage. A sensor monitoring the barrier's status can be installed. In this situation, the sensor sends a signal to the controller, which then pauses the entire machine for manual intervention. The cause is checked, the fault is eliminated, and the barrier is reversed and reset, allowing the equipment to resume operation.

[0015] At the same time, the potential energy of the chip must be greater than the potential energy required for the barrier to lift the chip thickness, i.e., mgH>MgT, so that after the barrier is hit by the chip, the height lifted is greater than the thickness of the chip, ensuring that the chip can still pass under the barrier with a certain speed under the action of inertia, and will not be blocked and stopped by the barrier.

[0016] The thickness of the lower end of the preferred barrier is greater than that of the upper end, so that its center of gravity is located below its geometric center. This results in a smaller angle of rotation (height of the bottom end being lifted) when the barrier is impacted, a shorter fall time, and timely return without affecting the blocking and deceleration of subsequent chips, thereby improving the efficiency of equipment detection and sorting.

[0017] Beneficial effects:

[0018] The device of this invention has a simple structure and low manufacturing cost. It can effectively slow down the transmission speed of the chip after it descends, allowing sufficient time for subsequent testing. The flexibility or elasticity of the blocking sheet allows the chip to be slowed down without damaging it.

[0019] Furthermore, during normal operation, the blocking plate will not rotate excessively, preventing jamming. This invention also prevents the chip from stopping and becoming unable to move due to obstruction. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the state at the start of the blocking operation of the present invention;

[0021] Figure 2 This is a schematic diagram of the state at the end of the blocking operation of the present invention;

[0022] Figure 3 This is a three-dimensional structural diagram of the present invention during installation and use.

[0023] In the diagram, 1-horizontal track; 2-upper focus of the ellipse (through which the upper crossbeam of the portal frame passes); 3-barrier plate; 4-chip; 5-lower focus; 6-length of the major axis; 7-distance between the two focuses; 8-distance between the upper focus and the horizontal track; 9-chip thickness; 10-inclined track; 11-portal frame; 12-cylindrical pivot. Detailed Implementation

[0024] Example:

[0025] like Figure 1 , 2 The chip transmission buffer device shown is installed directly above the horizontal track 1 behind the inclined transmission track 10. It has a gate-shaped bracket 11 that spans the horizontal track 1. The two sides of the gate-shaped bracket 11 are erected on both sides of the horizontal track 1. The upper crossbeam of the gate-shaped bracket 11 is a cylindrical rotating shaft 12.

[0026] An elliptical PU rubber stop plate 3 is movably sleeved on the rotating shaft 12. The stop plate 3 is sleeved at the focal point 2 above the ellipse, so that the elliptical stop plate 3 can rotate in the vertical plane around the rotating shaft 12 where the focal point 2 is located.

[0027] The distance h between the upper focus 2 of the ellipse and the horizontal transmission track 1 satisfies (L+D) / 2>h>[(LD) / 2+T]; where the length of the major axis of the ellipse is L, the distance between the two foci is D, and the chip thickness is T.

[0028] like Figure 3 As shown, the drop of chip 4 on the inclined transmission track 10 is H, the mass of chip 4 is m, and the mass of the blocking plate 3 is M. After chip 4 falls, it will gain potential energy mgH. Most of this potential energy will be transferred to the blocking plate 3, and a small amount of potential energy will be converted into the kinetic energy for chip 4 to continue sliding on the horizontal track 1.

[0029] After the impact, the blocking plate 3 will rotate around the pivot 12 at the upper focal point 2 by a certain angle, and its center of gravity will shift upward. The maximum upward displacement of its center of gravity is D (at this time, the lowest point at the bottom rotates to the highest point at the top, and the highest point at the top rotates to the lowest point at the bottom). Using the process data of mgH=2 / 3MgD, the lowest point of the blocking plate 3 cannot rotate to the highest point. After being impacted, the blocking plate 3 rotates around the pivot by an angle of approximately 120°. After rotating to the highest point, the blocking plate 3 cannot continue to rotate and will return to its original position and fall, blocking the chip 4 being transported on the next track.

Claims

1. A chip transmission buffer device, installed directly above a horizontal track (1) behind an inclined transmission track (10), having a portal frame (11) spanning the horizontal track (1), with the two sides of the portal frame (11) erected on both sides of the horizontal track (1), and the upper crossbeam of the portal frame (11) being a cylindrical rotating shaft (12); characterized in that: An elliptical barrier plate (3) is movably fitted on the rotating shaft. The position of the barrier plate (3) is the focus (2) above the ellipse, so that the elliptical barrier plate (3) can rotate in the vertical plane around the rotating shaft where the focus is located. The distance between the upper focus (2) of the ellipse and the lower horizontal transmission track (1) is less than (L+D) / 2 and greater than (LD) / 2+T; where the major axis of the ellipse is L, the distance between the two focuses is D, and the thickness of the transmission chip (4) is T; and satisfies: MgD > mgH > MgT; Wherein, the drop of the chip (4) on the inclined transmission track (10) is H, the mass of the chip (4) is m, and the mass of the blocking piece (3) is M; The thickness of the lower end of the barrier plate is greater than that of the upper end, so that its center of gravity is located below its geometric center.

2. The chip transmission buffer device as described in claim 1, characterized in that: The barrier sheet (3) is a flexible rubber sheet or plastic sheet.

Citation Information

Patent Citations

  • Chip transmission device and sorting machine

    CN215644399U