Flexible vibration sensor

Abstract

The application provides a flexible vibration sensor, comprising: a packaging part, comprising two oppositely arranged packaging layers; a spacing part, formed as a closed ring clamped between the two packaging layers, so that the two packaging layers and the spacing part enclose a containing space; a magnetic film part, comprising two magnetic film layers, respectively arranged on the facing surfaces of the two packaging layers, wherein one packaging layer is suspended relative to the other packaging layer through the containing space based on the magnetic force between the two magnetic film layers; and a coil part, comprising two electrically connected coil layers, respectively attached to the facing surfaces of the two magnetic film layers; wherein in the case that the flexible vibration sensor senses external vibration, one coil layer is offset relative to the other coil layer, so as to change the current flowing through the coil part.

Description

Technical Field

[0001] This invention relates to the field of flexible sensor technology, and in particular to a magnetically levitated flexible vibration sensor based on a pyramidal microstructure magnetic film. Background Technology

[0002] Magnetic levitation vibration sensors, due to the introduction of nonlinear forces, can achieve large-amplitude oscillation responses over a wide frequency range with low energy loss, making them suitable for sensing minute vibrations. Furthermore, the suspended magnets do not contact other components, preventing wear and tear from prolonged exposure to vibration environments.

[0003] However, existing magnetic levitation vibration sensors are large in size, heavy in weight, and cannot be adapted to curved surfaces, which limits their application in biomedical detection and other scenarios that require changes in sensor shape. Summary of the Invention

[0004] To at least partially overcome the technical defects of at least one or other inventions mentioned above, at least one embodiment of the present invention provides a magnetically levitated flexible vibration sensor based on a pyramidal microstructure magnetic film. By attaching a coil portion to the magnetic film layer in response to external vibration, the current flowing through the coil portion is changed, thereby achieving the purpose of vibration detection and sensor miniaturization.

[0005] According to one aspect of the present invention, a flexible vibration sensor is provided, comprising: an encapsulation portion including two opposing encapsulation layers; a spacer portion formed as a closed annulus sandwiched between the two encapsulation layers, such that the two encapsulation layers and the spacer portion enclose a receiving space; a magnetic film portion including two magnetic film layers respectively disposed on the facing surfaces of the two encapsulation layers, wherein one encapsulation layer is suspended relative to the other encapsulation layer through the receiving space based on the magnetic force between the two magnetic film layers; and a coil portion including two electrically connected coil layers respectively attached to the facing surfaces of the two magnetic film layers. In the event that the flexible vibration sensor senses an external vibration, one coil layer shifts relative to the other coil layer, thereby changing the current flowing through the coil portion.

[0006] According to embodiments of this disclosure, the magnetic film layer has a pyramidal microstructure.

[0007] According to an embodiment of this disclosure, the coil layer includes: a substrate having a plurality of through holes, the through holes being fitted onto the pyramid microstructure.

[0008] According to an embodiment of this disclosure, the coil layer further includes: a plurality of first coils fixed on the substrate and sleeved on the pyramid microstructure, the number of first coils being the same as the number of pyramid microstructures; and a plurality of first wires fixed on the substrate and connecting adjacent plurality of first coils to conduct current through the coil portion.

[0009] According to an embodiment of this disclosure, the coil layer further includes: a plurality of second coils fixed on the substrate and distributed on opposite sides of the through hole; and a plurality of second wires fixed on the substrate and connecting adjacent plurality of second coils to conduct current through the coil portion.

[0010] According to embodiments of this disclosure, each encapsulation layer includes: an annular frame disposed on the spacer portion; a support portion on which the magnetic film layer is disposed; and a plurality of curved connecting claws configured to connect the annular frame and the support portion. Preferably, eight connecting claws are provided, the eight connecting claws being divided into two symmetrically distributed groups.

[0011] According to an embodiment of this disclosure, the area of ​​the support portion is the same as the area of ​​the magnetic film layer.

[0012] According to embodiments of this disclosure, the magnetic film portion is a mixture of a high-molecular elastic polymer and magnetic particles;

[0013] According to embodiments of this disclosure, the elastic polymer is one of polydimethylsiloxane film, silicone film, and polyimide film. Preferably, the magnetic particles are at least one of neodymium iron boron microparticles and ferrite nanoparticles.

[0014] According to embodiments of this disclosure, the coil layer is at least one of gold, silver, copper, or a conductive polymer material.

[0015] According to an embodiment of this disclosure, the coil layer is insulated from the magnetic film layer.

[0016] According to embodiments of this disclosure, by cooperating with a magnetic film layer disposed opposite to the magnetic film layer and a coil portion disposed opposite to the magnetic film layer, the sensor can sense external vibrations in a miniaturized manner, change the current flowing through the coil portion, and achieve the purpose of vibration detection. Attached Figure Description

[0017] Figure 1 This is a cross-sectional view of a magnetically levitated flexible vibration sensor according to an illustrative embodiment of the present invention;

[0018] Figure 2a This is a three-dimensional schematic diagram of a magnetically levitated flexible vibration sensor according to an illustrative embodiment of the present invention;

[0019] Figure 2b This is an exploded view of a magnetically levitated flexible vibration sensor according to an illustrative embodiment of the present invention;

[0020] Figure 3 This is a three-dimensional schematic diagram of a flexible magnetic film with a pyramid microstructure according to an illustrative embodiment of the present invention;

[0021] Figure 4a This is a simulation diagram of the magnetic field distribution of a pyramid-less microstructure magnetic film according to an illustrative embodiment of the present invention;

[0022] Figure 4b This is a simulation diagram of the magnetic field distribution of a pyramid-shaped microstructure magnetic film according to an illustrative embodiment of the present invention;

[0023] Figure 5a This is a top view of a coil layer with a first coil sleeved on a pyramid microstructure according to an illustrative embodiment of the present invention;

[0024] Figure 5b This is a top view of a coil layer with the second coil distributed on both sides opposite to the through hole according to an illustrative embodiment of the present invention; and

[0025] Figure 6 This is a top view of the encapsulation layer according to an illustrative embodiment of the present invention.

[0026] Explanation of reference numerals in the attached figures

[0027] 1: Encapsulation layer;

[0028] 11: Ring frame;

[0029] 12: Support section;

[0030] 13: Connecting claw;

[0031] 2: Magnetic film layer;

[0032] 21: Pyramid microstructure;

[0033] 3: Coil layer;

[0034] 31: Base;

[0035] 32: Through hole;

[0036] 331: First coil;

[0037] 332: First conductor;

[0038] 341: Second coil;

[0039] 342: Second conductor;

[0040] 4: Spacing section. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to specific embodiments and the accompanying drawings. However, the present invention can be implemented in different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided to make the disclosure thorough and complete, and to fully convey the scope of the invention to those skilled in the art. In the accompanying drawings, for clarity, the dimensions and relative dimensions of layers and regions may be exaggerated, and the same reference numerals denote the same elements throughout.

[0042] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the invention. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the embodiments of the invention for ease of explanation. However, it will be apparent that one or more embodiments may be practiced without these specific details. Furthermore, descriptions of well-known structures and techniques are omitted in the following description to avoid unnecessarily obscuring the concept of the invention.

[0043] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0044] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0045] To facilitate understanding of the technical solutions of this invention by those skilled in the art, the following technical terms are explained below.

[0046] When using expressions such as "at least one of A, B, and C," the expression should generally be interpreted in accordance with the meaning commonly understood by a person skilled in the art (e.g., "a system having at least one of A, B, and C" should include, but is not limited to, systems having A alone, having B alone, having C alone, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.). When using expressions such as "at least one of A, B, or C," the expression should generally be interpreted in accordance with the meaning commonly understood by a person skilled in the art (e.g., "a system having at least one of A, B, or C" should include, but is not limited to, systems having A alone, having B alone, having C alone, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.).

[0047] Figure 1 This is a front view schematic diagram of a flexible vibration sensor according to an illustrative embodiment of the present invention; Figure 2a This is a three-dimensional schematic diagram of a flexible vibration sensor according to an illustrative embodiment of the present invention; Figure 2b This is an exploded view of a flexible vibration sensor according to an illustrative embodiment of the present invention.

[0048] like Figure 1-2b As shown, an embodiment of the present invention provides a flexible vibration sensor, including an encapsulation part, a spacer part 4, a magnetic film part, and a coil part.

[0049] Specifically, the encapsulation section includes two opposing encapsulation layers 1. A spacer 4 is formed as a closed annulus sandwiched between the two encapsulation layers 1, such that the two encapsulation layers 1 and the spacer 4 form a receiving space. The magnetic film section includes two magnetic film layers 2, respectively disposed on the facing surfaces of the two encapsulation layers 1. One encapsulation layer 1 is suspended relative to the other encapsulation layer 1 through the receiving space based on the magnetic force between the two magnetic film layers 2. The coil section includes two electrically connected coil layers 3, respectively attached to the facing surfaces of the two magnetic film layers 2. When the flexible vibration sensor senses external vibration, one coil layer 3 shifts relative to the other coil layer 3, thereby changing the current flowing through the coil section.

[0050] In detail, the flexible vibration sensor can be used to manufacture wearable devices. The two encapsulation layers 1 of the encapsulation part can be the top and bottom of the sensor, respectively. The bottom of the sensor can be used to contact a carrier such as clothing or a flexible wearable device, and can also transmit vibration information when the carrier vibrates. The two encapsulation layers 1 of the sensor can be configured with the same structure. For example, both encapsulation layers 1 can be configured with a curved structure to facilitate a larger displacement of the coil layer 3 when the carrier vibrates. The two encapsulation layers 1 of the sensor can be configured with different structures. For example, the encapsulation layer 1 based on magnetic levitation can be configured with a curved structure to facilitate a larger displacement of the coil layer 3 when the carrier vibrates, while the encapsulation layer 1 in contact with the carrier can be without a curved structure.

[0051] The spacer 4 can be made of a high-molecular-weight elastic polymer through resin molding. The selected high-molecular-weight elastic polymer can include at least one of the following: polydimethylsiloxane (PDMS), silicone (e.g., silicone branded Dragon Skin), and silicone (e.g., silicone branded Ecoflex). The spacer 4 can support the encapsulation layer 1 and form a receiving space between the two encapsulation layers 1. The spacer 4 can be a closed annular structure or other symmetrical structures. For example, the spacer 4 can include two cuboids disposed opposite each other between the two encapsulation layers 1. For example, the spacer 4 can be a hollow rectangle with a certain thickness, and the outer frame size can be the same as the size of the encapsulation layer 1. An adhesive made of polydimethylsiloxane can be used to fix the coil portion and the magnetic film portion relative to each other, the magnetic film portion and the encapsulation portion relative to each other, and the encapsulation portion and the spacer 4 relative to each other.

[0052] Furthermore, the coil layer 3, which is magnetically levitated between the two magnetic film layers 2, and the attached magnetic film layer 2 can constitute an inertial oscillator. When the flexible vibration sensor senses external vibration, the inertial oscillator shifts relative to the magnetic film layer 2, causing a change in the magnetic flux through the two coil layers 3. This induces an electromotive force in the coil layers 3, converting the vibration signal into an electrical signal. The spacer 4 can be used to ensure that the levitation height of the inertial oscillator remains within a preset range when the inertial oscillator shifts relative to the magnetic film layer 2. For example, a spacer 4 with a thickness of 2 mm, in conjunction with the encapsulation part, can achieve a levitation height of 2.5 mm for the inertial oscillator. The two electrically connected coil layers 3 can be connected to an external electrical signal, allowing an initial electrical signal to flow through the coil section itself. When the flexible vibration sensor senses external vibration, the relative position of the two coil layers 3 changes, causing a change in the output electrical signal of the coil section. Alternatively, the two electrically connected coil layers 3 can be connected without an external signal, allowing the coil section to generate an electrical signal when the flexible vibration sensor senses external vibration and converts the vibration signal into an electrical signal.

[0053] According to embodiments of this disclosure, by cooperating with the opposingly disposed magnetic film layer 2 and the opposingly disposed coil portion attached to the magnetic film layer 2, the sensor can detect external vibrations and change the current flowing through the coil portion to achieve the detection purpose while maintaining a miniaturized design. Therefore, it can be well applied in the fields of biomedical detection and wearable devices.

[0054] Figure 3 This is a three-dimensional schematic diagram of a magnetic film layer with a pyramid microstructure according to an illustrative embodiment of the present invention; Figure 4a This is a simulation diagram of the magnetic field distribution of a magnetic film layer without a pyramid microstructure according to an illustrative embodiment of the present invention; Figure 4b This is a simulation diagram of the magnetic field distribution of a magnetic film layer with a pyramidal microstructure according to an illustrative embodiment of the present invention.

[0055] like Figure 3-4b As shown, in some embodiments, the magnetic film layer 2 has a pyramidal microstructure 21.

[0056] In some embodiments, the magnetic film portion is a mixture of a polymeric elastic material and magnetic particles. The elastic polymer is one of polydimethylsiloxane film, silicone film, and polyimide film. The magnetic particles are at least one of neodymium iron boron microparticles and ferrite nanoparticles.

[0057] Specifically, such as Figure 4a As shown in Figure 4b, the pyramidal microstructure 21 effectively enhances the magnetic field. The average magnetic flux density at the edge of the pyramid is 12.8 mT, while it is 7.59 mT at the non-edge. Finite element simulation shows that the average magnetic flux density in the coil region of the magnetic film with the pyramidal microstructure 21 is increased by 84.8% compared to the magnetic film without the pyramidal microstructure 21. The array of pyramidal microstructures 21 attached to the surface of the magnetic film layer 2 can be used to regulate the magnetic field distribution, guide more magnetic field lines through the coil region, enhance the magnetism of the magnetic film layer 2, and thus improve the sensor output performance. The magnetic film layer 2 can be made of a mixture of a polymeric elastic polymer and magnetic particles. The polymeric elastic polymer can include at least one of the following: polydimethylsiloxane, silicone, and silicone. The magnetic particles can include at least one of the following: neodymium iron boron microparticles and ferrite nanoparticles. The magnetic particles provide magnetism to the magnetic film layer 2, and the elastic polymer provides flexibility, enabling the flexible vibration sensor to be applied to complex curved surfaces and improving comfort during wear, thereby broadening the application range of the flexible vibration sensor. The pyramid microstructure arrays on the two magnetic film layers 2 can be arranged relative to each other. That is, the number of pyramid microstructures 21 on the two magnetic film layers 2 arranged relative to each other can be the same, and their relative positions can be the same.

[0058] Specifically, the base side length of a single pyramid microstructure 21 can be 360 ​​μm, the height can be 254 μm, and the spacing between two pyramid microstructures 21 can be 440 μm. The magnetic film layer 2 can be fabricated using the following steps:

[0059] Step 11: Mix polydimethylsiloxane and magnetic nanoparticles at a ratio of 1:5 and pour the mixture into a pyramid mold;

[0060] Step 12: Apply the above mixture to the mold surface using a four-sided applicator;

[0061] Step 13: After heating the above mixture in an oven at 90 degrees to solidify it, peel the solidified mixture from the pyramid mold to obtain a flexible magnetic film with a thickness of 300 μm and surface pyramid microstructure 21.

[0062] Step 14: Cut the flexible magnetic film into a rectangle with a length of 28mm and a width of 20mm, and magnetize it vertically upwards along the pyramid tip to obtain magnetic film layer 2.

[0063] In some embodiments, the coil layer 3 includes a base 31 with a plurality of through holes 32, the through holes 32 being fitted onto the pyramid microstructure 21.

[0064] In some embodiments, the coil layer 3 is at least one of gold, silver, copper, or a conductive polymer material. The coil layer 3 is insulated from the magnetic film layer 2.

[0065] Specifically, the material of the coil layer 3 may include at least one of the following: gold, silver, copper, and conductive polymer materials. The number of through-holes 32 in the coil layer 3 may be the same as the number of pyramidal microstructures 21. The coil layer 3 can maintain relative positional stability with the magnetic film layer 2 through the cooperation of the through-holes 32 and the pyramidal microstructures 21. The coil layer 3 and the magnetic film layer 2 may be insulated from each other.

[0066] Figure 5a This is a top view of the coil layer 3 on the pyramid microstructure, according to an illustrative embodiment of the present invention, in which the first coil 331 is fitted.

[0067] like Figure 5a As shown, in some embodiments, the coil layer 3 further includes: a plurality of first coils 331 and a plurality of first wires 332.

[0068] Specifically, a first coil 331 is fixed on a base 31, and multiple first coils 331 are respectively sleeved on a pyramid microstructure 21, with the number of first coils 331 being the same as the number of pyramid microstructures 21. A first wire 332 is fixed on a base 31, and multiple first wires 332 connect adjacent first coils 331 to conduct current through the coil section.

[0069] In detail, such as Figure 5a As shown, each first coil 331 surrounds a through-hole 32, and the first coils 331 and the surrounding through-holes 32 are arranged in an array. The first coils 331 in each row are connected by first wires 332, allowing each row of first coils 331 to be connected in series. The rows of coil layers 3 can also be connected in series by first wires 332, enabling electrical conductivity in the coil layers 3. Two coil layers 3 can also be connected in series to enable electrical conductivity in their coil sections. When the through-hole 32 is fitted onto the pyramid microstructure 21, each first coil 331 is correspondingly fitted onto the pyramid microstructure 21. The number of first coils 331 can be the same as the number of pyramid microstructures 21. The array of first coils 331 can be an ultrathin planar coil or composed of multiple layers of planar coils stacked together. The fabrication process can include at least one of the following: photolithography, screen printing, inkjet printing, and laser engraving.

[0070] Figure 5b This is a top view of the coil layer 3, in which the second coil 341 is distributed on both sides opposite to the through hole 32 according to an illustrative embodiment of the present invention.

[0071] like Figure 5b As shown, in some embodiments, the coil layer 3 further includes a plurality of second coils 341 and a plurality of second wires 342.

[0072] Specifically, the second coil 341 is fixed on the base 31, and multiple second coils 341 are distributed on opposite sides of the through hole 32. The second wire 342 is fixed on the base 31, and multiple second wires 342 connect adjacent multiple second coils 341 to conduct current in the coil section.

[0073] In detail, such as Figure 5b As shown, each through-hole 32 has a second coil 341 on both its left and right sides, and adjacent second coils 341 in each row are connected by second wires 342. The second coils 341 and the second wires 342 can be arranged in an array, for example, a micro-coil array including 24×24 second coils 341. When the through-hole 32 is fitted onto the pyramid microstructure 21, each second coil 341 can be distributed on both sides of the pyramid microstructure 21.

[0074] Furthermore, the first coil 331 and the second coil 341 can be microcoils wound three turns counterclockwise. Each microcoil can have a linewidth of 45 μm and a line spacing of 15 μm, and can be fabricated using microfabrication techniques. Coil layer 3 can be fabricated through the following steps:

[0075] Step 21: Coat polyimide as a substrate 31 onto the cured polydimethylsiloxane;

[0076] Step 22: Deposit metallic copper on substrate 31. The deposition method may include at least one of electron beam evaporation, magnetron sputtering and electroplating. The thickness of metallic copper may be selected according to the applicable scenario.

[0077] Step 23: Pattern the planar coil using photolithography and etching processes, and then coat the patterned planar coil with a polyimide insulating layer;

[0078] Step 24: Expose the copper electrodes at the two interfaces of the planar coil using photolithography and etching processes;

[0079] Step 25: Repeat steps 22 to 24 for a preset number of times, then coat the top polyimide insulating layer and expose the copper metal electrode using photolithography and etching processes;

[0080] Step 26: Prepare through hole 32.

[0081] Figure 6 This is a top view of the encapsulation layer 1 according to an illustrative embodiment of the present invention.

[0082] like Figure 6 As shown, in some embodiments, each encapsulation layer 1 includes: an annular frame 11, a support 12, and a plurality of curved connecting claws 13. More specifically, as... Figure 6 and 2a As shown, an annular frame 11 is disposed on the spacer 4. A magnetic film layer 2 is disposed on the support 12. A connecting claw 13 is configured to connect the annular frame 11 and the support 12, so as to provide support force to the support 12 and conform to the deformation of the support 12.

[0083] In some embodiments, eight connecting claws 13 are provided, and the eight connecting claws 13 are divided into two symmetrically distributed groups.

[0084] In some embodiments, the area of ​​the support portion 12 is the same as the area of ​​the magnetic film layer 2.

[0085] Specifically, the encapsulation layer 1 can be used to encapsulate the flexible vibration sensor and can provide traction for the suspended magnetic film layer 2.

[0086] The encapsulation layer 1 can be made of a polymer film, which may include at least one of the following: polydimethylsiloxane film, silicone film, and polyimide film. The magnetic film layer 2 can be disposed on the support portion 12. When the magnetic film layer 2 is subjected to magnetic force, the magnetic film layer 2 and the support portion 12 can be suspended under the action of the magnetic force. The area of ​​the support portion 12 can be the same as the area of ​​the magnetic film layer 2, and further, the size of the support portion 12 can be the same as the size of the magnetic film layer 2. The ring frame 11 and the support portion 12 are connected by symmetrically distributed connecting claws 13. When the flexible vibration sensor senses external vibration, one coil layer 3 can be relatively stably offset relative to another coil layer 3.

[0087] Specifically, the encapsulation layer 1 can be fabricated by cutting a 12.5 μm thick polyimide film using a paper cutter. For example... Figure 6 As shown, the outer frame size of the annular frame 11 of the encapsulation layer 1 can be 44mm × 36mm, and the width between the outer frame and the inner frame of the annular frame 11 of the encapsulation layer 1 can be 4mm. Correspondingly, the outer frame size of the spacer 4 can be 44mm × 36mm, and the width between the outer frame and the inner frame of the spacer 4 can be 4mm. The size of the support portion 12 can be 28mm × 20mm. The width of the eight connecting claws 13 can be 1mm.

[0088] According to embodiments of this disclosure, the flexible vibration sensor can be used to measure high-frequency vibration signals such as music and voice, as well as low-frequency vibration signals such as human movement and mechanical operation.

[0089] It should also be noted that the directional terms mentioned in the embodiments, such as "up," "down," "front," "back," "left," and "right," are only for reference to the directions in the accompanying drawings and are not intended to limit the scope of protection of the present invention. Throughout the accompanying drawings, the same elements are represented by the same or similar reference numerals. Conventional structures or constructions will be omitted where they may cause confusion in understanding the present invention, and the shapes and dimensions of the components in the drawings do not reflect actual size and proportion, but are only schematic representations of the embodiments of the present invention.

[0090] Unless otherwise stated, the numerical parameters in this specification and the appended claims are approximate values ​​and can be varied according to the desired characteristics obtained from the content of this invention. Specifically, all figures used in the specification and claims to indicate the content of components, reaction conditions, etc., should be understood to be modified by the term "about" in all cases. Generally, this means that there may be variations of ±10% in some embodiments, ±5% in some embodiments, ±1% in some embodiments, and ±0.5% in some embodiments.

[0091] The use of ordinal numbers such as "first," "second," "third," etc., in the specification and claims to modify the corresponding elements does not imply that the element has any ordinal number, nor does it represent the order of one element with another element, or the order of manufacturing methods. The use of these ordinal numbers is only to enable a named element to be clearly distinguished from another element with the same name.

[0092] Furthermore, unless specifically described or required to occur in a specific order, the order of the above steps is not limited to those listed above and can be varied or rearranged according to the desired design. Moreover, the above embodiments can be used in combination with each other or with other embodiments based on design and reliability considerations; that is, technical features from different embodiments can be freely combined to form more embodiments.

[0093] The above specific embodiments further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above are merely specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A flexible vibration sensor, characterized in that, include: The packaging section includes two packaging layers disposed opposite to each other; The spacer portion is formed as a closed ring sandwiched between the two encapsulation layers, such that the two encapsulation layers and the spacer portion form an accommodating space; A magnetic film portion includes two magnetic film layers, respectively disposed on the facing surfaces of the two encapsulation layers, wherein one encapsulation layer is suspended relative to the other encapsulation layer through the receiving space based on the magnetic force between the two magnetic film layers; and The coil section includes two electrically connected coil layers, which are respectively attached to the facing surfaces of the two magnetic film layers; When the flexible vibration sensor senses an external vibration, one of the coil layers shifts relative to the other coil layer, thereby changing the current flowing through the coil section.

2. The flexible vibration sensor according to claim 1, characterized in that, The magnetic film layer has a pyramidal microstructure.

3. The flexible vibration sensor according to claim 2, characterized in that, The coil layer includes: The base has multiple through holes, which are fitted onto the pyramid microstructure.

4. The flexible vibration sensor according to claim 3, characterized in that, The coil layer also includes: A plurality of first coils are fixed on the substrate and sleeved on the pyramid microstructure, the number of first coils being the same as the number of pyramid microstructures; and Multiple first wires are fixed on the substrate and connected to adjacent multiple first coils to conduct current through the coil sections.

5. The flexible vibration sensor according to claim 3, characterized in that, The coil layer also includes: A plurality of second coils, the second coils being fixed on the substrate, and the plurality of second coils being distributed on opposite sides of the through-hole; and Multiple second wires are fixed on the substrate and connected to adjacent multiple second coils to conduct current through the coil sections.

6. The flexible vibration sensor according to claim 1, characterized in that, Each of the encapsulation layers includes: A ring-shaped frame is disposed on the spacer portion; Support portion, wherein the magnetic film layer is disposed on the support portion; and Multiple curved connecting claws are configured to connect the annular frame and the support portion. There are eight connecting claws, which are divided into two symmetrically distributed groups.

7. The flexible vibration sensor according to claim 6, characterized in that, The area of ​​the support portion is the same as the area of ​​the magnetic film layer.

8. The flexible vibration sensor according to claim 1, characterized in that, The magnetic film portion is a mixture of a high-molecular elastic polymer and magnetic particles; The elastic polymer is one of polydimethylsiloxane film, silicone film and polyimide film; The magnetic particles are at least one of neodymium iron boron microparticles and ferrite nanoparticles.

9. The flexible vibration sensor according to claim 1, characterized in that, The coil layer is at least one of gold, silver, copper, or a conductive polymer material.

10. The flexible vibration sensor according to claim 1, characterized in that, The coil layer is insulated from the magnetic film layer.

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