Splicing device and electronic device

Abstract

The present invention provides a splicing device and an electronic device. The electronic device includes a flexible substrate and a wire. The wire is disposed on the flexible substrate. The wire includes a first sub-structure that extends in a direction. The first sub-structure includes a first extension portion that extends along the direction, a second extension portion that extends along the direction, and a joint portion where the first extension portion and the second extension portion meet. The ratio of the sum of the widths of the first extension portion and the second extension portion to the width of the joint portion on a second tangent line along the other direction is in the range of 0.8 to 1.2, and the other direction is perpendicular to the direction.

Description

[0001] This application is a divisional application of the invention patent application with the application date of May 29, 2019, the application number of 201910457824.4, and the invention title of "Splicing Device and Electronic Device". Technical Field

[0002] The present invention relates to a splicing device and an electronic device having a flexible substrate. Background Art

[0003] Common electronic devices nowadays usually have a display to provide information to users through the display. In large-sized electronic devices, such as public information displays (PIDs), a technology of splicing multiple displays may be adopted. In order to improve the display quality of large-sized electronic devices, the wires in the electronic device may be bent to the back of the electronic device to minimize the gap generated by splicing the displays as much as possible. However, in some cases, the wires are damaged when bent, thereby reducing the reliability or qualification rate of the electronic device. Summary of the Invention

[0004] To solve the above problems, the present invention provides an electronic device, which includes a flexible substrate and a wire. The wire is disposed on the flexible substrate, wherein the wire includes a first sub-structure, the first sub-structure extends along a direction, wherein the first sub-structure includes a first extension portion extending along the direction, a second extension portion extending along the direction, and a joint portion where the first extension portion and the second extension portion meet, wherein on a first tangent line along another direction, the ratio of the sum of the widths of the first extension portion and the second extension portion to the width of the joint portion on a second tangent line along the another direction is between 0.8 and 1.2, and the another direction is perpendicular to the direction.

[0005] The present invention further provides an electronic device, which includes a flexible substrate and a wire. The wire is disposed on the flexible substrate, wherein the wire includes a first sub-structure and a second sub-structure, the first sub-structure and the second sub-structure extend along a direction, the first sub-structure is connected to the second sub-structure in another direction, and the another direction is perpendicular to the direction, wherein each of the first sub-structure and the second sub-structure includes a first extension portion extending along the direction, a second extension portion extending along the direction, and a joint portion where the first extension portion and the second extension portion meet, wherein the width of the joint portion in the first sub-structure is greater than the width of the joint portion in the second sub-structure.

[0006] The present invention also provides a splicing device, which includes a plurality of displays. Each of the displays includes a flexible substrate and a wire. The flexible substrate includes a first bending region and a side region connected to the first bending region. The wire is disposed on the flexible substrate and includes a metal portion and a plurality of openings located within the metal portion. The ratio of the total width of the metal portion located in the first bending region to the total width of the metal portion located in the side region ranges between 0.8 and 1.2.

[0007] The present invention also provides an electronic device, which includes a flexible substrate and a wire. The flexible substrate includes a first bending region and a side region connected to the first bending region. The wire is disposed on the flexible substrate and includes a metal portion and a plurality of openings located within the metal portion. The ratio of the total width of the metal portion located in the first bending region to the total width of the metal portion located in the side region ranges between 0.8 and 1.2. The length of one of the openings in the first bending region is less than or equal to the length of one of the openings in the side region. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 The side view schematic diagram of the splicing device or the electronic device according to the first embodiment of the present invention is shown.

[0009] Figure 2 The partial side view schematic diagram of the bent electronic device according to the first embodiment of the present invention is shown.

[0010] Figure 3 The partial side view schematic diagram of the unfolded electronic device according to the first embodiment of the present invention is shown.

[0011] Figure 4 The top view schematic diagram of the structure of the wire according to the first embodiment of the present invention is shown.

[0012] Figure 5 The partial enlarged schematic diagram of the wire according to the first embodiment of the present invention is shown.

[0013] Figure 6 The top view schematic diagram of the partial structure of the wire according to the second embodiment of the present invention is shown.

[0014] Figure 7 The top view schematic diagram of the partial structure of the wire according to the third embodiment of the present invention is shown.

[0015] Figure 8 The top view schematic diagram of the partial structure of the wire according to the fourth embodiment of the present invention is shown.

[0016] Figure 9 The top view schematic diagram of the partial structure of the wire according to the fifth embodiment of the present invention is shown.

[0017] Figure 10The figure shows a schematic diagram of an electronic device according to the sixth embodiment of the present invention.

[0018] Description of reference numerals: 10 - electronic device; 100 - flexible substrate; 100a - first main area; 100b - first bending area; 100c - side area; 100d - second bending area; 100e - second main area; 1021 - front surface; 1022 - rear surface; 1023 - side surface; 102a, 102b - carriers; 104, 1041, 1042 - light-emitting units; 106, 106a, 106b - wires; 1061, 1062, 1063 - sub-structures; 106-1; 106-2; 106-3 - first part; second part; connecting part; 108 - first conductive layer; 110 - second conductive layer; 112 - first insulating layer; 1121 - groove; 114 - second insulating layer; 116 - third insulating layer; 118 - contact hole; 12, 14 - displays; 120, 120s - metal parts; 1200, 1204, 1208 - extension parts; 1202, 1210, 1206 - joining parts; 122, 1220, 1222, 1224, 1226 - openings; 1220-1, 1222-1 - sides; 124A1, 124A2 - first blocks; 124B - second block; 124C - third block; 126 - bevel; 128 - integrated circuit; D1 - first direction; D2 - second direction; H0, H1, L1, L2, La, Lb, Lc, Ld, Le - lengths; Ha - height; N - projection direction; T1, T2 - thicknesses; W1, W2, W3, W4, W5, W6, W7, W8, W9, Wa, Wb, Wc, Wi - widths; θ1 - first included angle; θ2 - second included angle; θa, θb, θc - included angles. Detailed description of the specific implementation

[0019] The present invention can be understood by referring to the following detailed description and in conjunction with the accompanying drawings. It should be noted that, for the convenience of the reader's understanding and the simplicity of the drawings, only a part of the electronic device or the splicing device is shown in the multiple drawings of the present invention, and the specific elements in the drawings are not drawn according to the actual scale. In addition, the number and size of each element in the drawings are only for illustration and are not used to limit the scope of the present invention.

[0020] Throughout the specification and claims of the present invention, certain terms are used to refer to specific elements. Those skilled in the art should understand that electronic device manufacturers may use different names to refer to the same element. This document does not intend to distinguish between elements that have the same function but different names. In the following specification and claims, words such as "comprising" and "including" are open-ended terms and should therefore be interpreted as meaning "including but not limited to...".

[0021] It should be understood that when an element or film layer is said to be "on" or "connected to" another element or film layer, it can be directly on this other element or film layer or directly connected to this other element or layer, or there are intervening elements or film layers between the two (non-direct case). Conversely, when an element is said to be "directly" "on" another element or film layer or "directly connected to" another element or film layer, there are no intervening elements or film layers between the two.

[0022] The terms "substantially" or "equal" generally represent within 20% of a given value or range, or represent within 10%, 5%, 3%, 2%, 1% or 0.5% of a given value or range.

[0023] Although terms such as first, second, third... may be used to describe various components, the components are not limited to these terms. These terms are only used to distinguish a single component in the specification from other components. The same terms may not be used in the claims, and first, second, third... may be used to replace them according to the order of the component declarations in the claims. Therefore, in the following specification, the first component may be the second component in the claims.

[0024] It should be noted that in the following embodiments, without departing from the spirit of the present invention, the technical features in several different embodiments can be replaced, recombined, and mixed to complete other embodiments.

[0025] The electronic device of the present invention may include a display device, an antenna device, or a splicing device, but is not limited thereto. The electronic device may be a bendable or flexible electronic device. The electronic device may, for example, include light-emitting diodes; the light-emitting diodes may, for example, include organic light-emitting diodes (OLEDs), mini light-emitting diodes (miniLEDs), micro light-emitting diodes (micro LEDs), or quantum dot light-emitting diodes (QLEDs), or any arrangement combination thereof, but is not limited thereto. The antenna device may, for example, be a liquid crystal antenna, but is not limited thereto. The splicing device may, for example, be a display splicing device, an antenna splicing device, or a combination thereof, but is not limited thereto. It should be noted that the electronic device may be any arrangement combination of the foregoing, but is not limited thereto. In the following, the display device will be used as the electronic device or the splicing device to illustrate the content of the present invention, but the present invention is not limited thereto.

[0026] Please refer to Figure 1 and Figure 2 , Figure 1 The side view schematic diagram of the splicing device or the electronic device according to the first embodiment of the present invention is shown as Figure 2The following is a partial side view schematic diagram of the bent electronic device according to the first embodiment of the present invention. In some embodiments, the electronic device 10 may be a splicing device and may include multiple displays. For example, the electronic device 10 (or the splicing device) may include a display 12 and a display 14, and the display 12 and the display 14 are connected, but not limited thereto. The number of displays connected to each other in the splicing device is not limited by Figure 1 this. In some other embodiments, the electronic device 10 may not be a spliced display device but may include an independent display (such as Figure 2 the display 12), but not limited thereto.

[0027] Hereinafter, the display 12 will be taken as an example for illustration. As shown in Figure 1 and Figure 2 , the electronic device 10 (in the case where the electronic device 10 includes an independent display) or each display of the splicing device (such as the display 12) may include a flexible substrate 100, carriers 102a and 102b, and the flexible substrate 100 may be disposed on the front surface 1021 of the carriers 102a and 102b. After the display 12 is bent, the respective rear surfaces 1022 of the carriers 102a and 102b may contact each other, so that the flexible substrate 100 can be disposed outside the carriers 102a and 102b. For example, the carriers 102a and 102b may be located between two portions of the flexible substrate 100 in a projection direction N, but not limited thereto. In addition, after the display 12 is bent, the flexible substrate 100 may be disposed on the side surface 1023 of the carriers 102a and 102b, but not limited thereto. The length of the carrier 102a may be greater than the length of the carrier 102b, but not limited thereto. The material of the flexible substrate 100 may include, for example, polyimide (PI), or other materials suitable for being used as a flexible substrate. The carriers 102a and 102b may include, for example, rigid substrates, and the materials thereof may include, for example, glass, PET, but not limited thereto.

[0028] The flexible substrate 100 may include, but is not limited to, a first main region 100a, a first bending region 100b, a side region 100c, a second bending region 100d, and a second main region 100e after being bent. The side region 100c is disposed between the first bending region 100b and the second bending region 100d, and the side region 100c is connected to the first bending region 100b and the second bending region 100d respectively. The first bending region 100b, the side region 100c, and the second bending region 100d may be regarded as the folding region of the flexible substrate 100. The first bending region 100b is disposed between the first main region 100a and the side region 100c, and the first bending region 100b is connected to the first main region 100a and the side region 100c respectively. The second bending region 100d is disposed between the side region 100c and the second main region 100e, and the second bending region 100d is connected to the second main region 100e and the side region 100c respectively.

[0029] In addition, the electronic device may include at least one working unit and / or at least one integrated circuit disposed in the main region of the flexible substrate 100. The at least one working unit may include at least one light-emitting unit and / or at least one antenna unit, but is not limited thereto. For example, the working unit may be a light-emitting unit. As Figure 1As shown, the display 12 may include at least one light-emitting unit 104 disposed within the first major area 100a of the flexible substrate 100, and the display 12 may include at least one integrated circuit (not shown) disposed within the second major area 100e of the flexible substrate 100. In some embodiments, the first major area 100a may be, for example, a working area, while the first bending area 100b, the side area 100c, the second bending area 100d, and the second major area 100e may be, for example, non-working areas, but not limited thereto. In some embodiments, the working area may be, for example, a display area, and the non-working areas may be, for example, peripheral areas or routing areas, but not limited thereto. Other film layers or components may also be disposed between the light-emitting unit 104 and the flexible substrate 100, such as inorganic or organic insulating layers, conductive layers, thin-film transistors, etc., but not limited thereto. In addition, the light-emitting unit 104 may include mini LEDs, micro LEDs, OLEDs, quantum dot light-emitting diodes (QLEDs), or a combination of the above elements, but not limited thereto. The light-emitting unit 104 may also include different forms of display media, such as liquid crystals, quantum dots, phosphors, fluorescent materials, or a combination of the above materials, but not limited thereto. The integrated circuit may include at least one thin-film transistor for driving the light-emitting unit 104, but not limited thereto. In some embodiments, the integrated circuit may be, for example, a part of a flexible circuit board or directly fabricate the circuit on the flexible substrate or the flexible circuit board, but not limited thereto.

[0030] In some embodiments, the electronic device may include at least one antenna unit disposed within the first major area 100a of the flexible substrate 100, and the electronic device may include at least one integrated circuit disposed within the second major area 100e of the flexible substrate 100, but not limited thereto.

[0031] In a splicing device (such as Figure 1 ), the distance between two adjacent light-emitting units 1041 and 1042 between the display 12 and the display 14 may be less than the distance between adjacent light-emitting units 104 within the display 12 or the display 14 to prevent the user from observing a gap between the display 12 and the display 14. On the other hand, the bending angle (or radius of curvature) of the first bending area 100b and / or the second bending area 100d may be reduced, and a smaller bending angle may reduce the gap between the display 12 and the display 14.

[0032] Such as Figure 2As shown, the display 12 (or the electronic device 10) may include one or more wires 106 disposed on the flexible substrate 100. For example, the wire 106 may sequentially extend from the first main region 100a through the first bending region 100b, the side region 100c, and the second bending region 100d to the second main region 100e, and the wire 106 may be bent together with the flexible substrate 100, but not limited thereto. In some embodiments, the wire 106 may connect the light-emitting unit 104 in the first main region 100a and the integrated circuit in the second main region 100e, but not limited thereto.

[0033] Please refer to Figure 3 , which shows a partial side view schematic diagram of the unfolded electronic device according to the first embodiment of the present invention. The display 12 (or the electronic device 10) may include a plurality of insulating layers and a plurality of conductive layers disposed on the flexible substrate 100. For example, as Figure 3 shown, the display 12 may include a first conductive layer 108, a second conductive layer 110, a first insulating layer 112, a second insulating layer 114, and a third insulating layer 116 disposed on the flexible substrate 100, but not limited thereto. The first conductive layer 108 may be disposed on the flexible substrate 100 and disposed in the first main region 100a. The first insulating layer 112 may be disposed on the flexible substrate 100 and cover the first conductive layer 108. In addition, the first insulating layer 112 may be disposed in the first main region 100a and the second main region 100e, and not disposed in the first bending region 100b, the side region 100c, and the second bending region 100d. In other words, there may be a groove 1121 between a part of the first insulating layer 112 in the first main region 100a and another part of the first insulating layer 112 in the second main region 100e, but not limited thereto. The first insulating layer 112 may include, for example, an inorganic insulating material, but not limited thereto. Since the inorganic insulating material is more fragile, the first insulating layer 112 may be avoided from being disposed in the bent portions of the display 12 (such as the first bending region 100b, the side region 100c, and the second bending region 100d) to improve the reliability of the display 12. In some embodiments, other film layers may also be disposed between the first conductive layer 108 and the flexible substrate 100 or between the first insulating layer 112 and the flexible substrate 100.

[0034] The second insulating layer 114 may be disposed on the first insulating layer 112 and fill the groove 1121. The second insulating layer 114 may include, for example, an organic insulating material, but not limited thereto. Since the organic insulating material is more flexible than the inorganic insulating material, the second insulating layer 114 may be disposed in the bent portions of the display 12. The second conductive layer 110 may be disposed on the second insulating layer 114.

[0035] Figure 3The stacking relationship in the figure is only for illustration. In some embodiments (please cooperate with Figure 3 with Figure 4 ), the wire 106 may be formed by the second conductive layer 110, but not limited thereto. The wire 106 may also be formed by any conductive layer in the display 12 (or the electronic device 10), depending on the design requirements. The second conductive layer 110 may extend from the first main region 100a sequentially through the first bending region 100b, the side region 100c, the second bending region 100d to the second main region 100e, or may alternatively be selectively distributed in some of these regions, but not limited thereto. In addition, the second conductive layer 110 may be electrically connected to the first conductive layer 108 through a contact hole 118. For example, the first conductive layer 108 may be an electrode of a thin film transistor, and the thin film transistor may be electrically connected to the integrated circuit in the second bending region 100d through the wire 106 (the second conductive layer 110), but not limited thereto. The first conductive layer 108 and the second conductive layer 110 may include a metal layer or other suitable conductive materials, and the first conductive layer 108 and the second conductive layer 110 may also be a composite conductive layer formed by stacking multiple metal layers, but not limited thereto.

[0036] The third insulating layer 116 may be disposed on the second conductive layer 110. The third insulating layer 116 may include, for example, an organic insulating material, and the thickness of the third insulating layer 116 may be greater than the thickness of the first insulating layer 112 or the second insulating layer 114, but not limited thereto. The second insulating layer 114 and the third insulating layer 116 may be used as, for example, planarization layers, but not limited thereto. In addition, the light-emitting unit 104 may be disposed on the third insulating layer 116 and within the first main region 100a, but not limited thereto.

[0037] For example, thin film transistors may also be disposed on the flexible substrate 100, and the semiconductor layer of the thin film transistors may include amorphous silicon, polysilicon, or oxide semiconductors, but not limited thereto. The polysilicon may be, for example, low-temperature polysilicon, but not limited thereto. The oxide semiconductor may be, for example, indium gallium zinc oxide, but not limited thereto.

[0038] The pattern structure of the wire 106 in the unfolded electronic device in the projection direction N (top view direction) will be further described below. Please continue to refer to Figure 4 , which shows a top view schematic diagram of the structure of the wire according to the first embodiment of the present invention. The wire 106 may include a metal portion 120 and a plurality of openings 122, and the plurality of openings are provided corresponding to the metal portion. In one embodiment, the plurality of openings are located within the metal portion 120, for example Figure 4As shown. In some embodiments, the wire 106 may include substructures 1061, 1062, and 1063 in a first direction D1, but the arrangement and number of substructures in the wire 106 can be adjusted arbitrarily according to requirements. Taking the substructure 1063 as an example, the substructure 1063 may include metal wires in a chain-like structure extending along a second direction D2, where the first direction D1 may be perpendicular to the second direction D2, but not limited thereto. The substructure 1063 may include a plurality of openings 1220 and a plurality of openings 1222 arranged along the second direction D2, and a part of the metal part 120 disposed within the substructure 1063 may surround the openings 1220 and 1222 and extend along the second direction D2. Each of the openings 1220 or each of the openings 1222 may be surrounded by two extending portions 1200 and two joining portions 1202 in the metal part 120. The extending portion 1200 may be, for example, a metal line segment, and the joining portion 1202 may be, for example, the junction of different metal line segments, but not limited thereto. The sizes of the openings 1220 and 1222 are different, and this feature will be described separately later.

[0039] In the substructure 1063, the widths W1 of the respective extending portions 1200 may be substantially equal, the widths W2 of the respective joining portions 1202 may be substantially equal, and the width W2 may be substantially twice the width W1, but not limited thereto. The width of the extending portion mentioned in the text may refer to the width of the metal line segment, and the width of the joining portion may refer to the width of the junction of the metal line segments, but not limited thereto. The term "width" used herein may be measured along a direction (such as Figure 4 the first direction D1) perpendicular to the wire extending direction in the region where the measurement object is located, and the term "length" may be measured along a direction (such as Figure 4 the second direction D2) parallel to the wire extending direction in the region where the measurement object is located. In addition, the substructures 1061 and 1062 may also have the same features as the above-mentioned substructure 1063, and will not be elaborated here.

[0040] As Figure 4 shown, in the first direction D1, the substructure 1062 may be disposed between the substructure 1061 and the substructure 1063. The substructure 1062 may be connected to the substructure 1061 and the substructure 1063. For example, the extending portion 1204 on one side of the substructure 1062 may be connected to the extending portion 1200 of the adjacent substructure 1063, and the extending portion 1204 on the other side of the substructure 1062 may be connected to the extending portion 1208 of the adjacent substructure 1061.

[0041] In addition, in the substructure 1062, each of the extending portions 1204 has a width W3, and each of the joining portions 1206 has a width W4. In some embodiments (such as Figure 4) Among them, the width W1 may be greater than the width W3, and the width W2 may be greater than the width W4, but this is not limiting. In the sub-structure 1061, each extension portion 1208 has a width W5, and each joint portion 1210 has a width W6. In some embodiments (such as Figure 4 ) Among them, the width W3 may be greater than the width W5, and the width W4 may be greater than the width W6, but this is not limiting. In addition, the opening 1220 of the sub-structure 1063 may have a width W7, the opening 1224 in the sub-structure 1062 may have a width W8, and the opening 1226 in the sub-structure 1061 may have a width W9. The width W7 is greater than the width W8, and the width W8 is greater than the width W9, but this is not limiting. The above widths are all measured along the first direction D1 (a direction perpendicular to the extension direction of the wire 106). In some embodiments, the widths of the extension portions, joint portions, and / or openings in different sub-structures may also be substantially equal to each other. For example, the wire 106 may include one or more sub-structures 1061, one or more sub-structures 1062, or one or more sub-structures 1063 in the first direction D1.

[0042] In the wire 106, in any two different regions among the first main region 100a, the first bending region 100b, the side region 100c, the second bending region 100d, and the second main region 100e in the second direction D2, the ratio range of the total width of the metal portion 120 measured along the first direction D1 may be between 0.8 and 1.2. Such as Figure 4As shown, in the first bending region 100b, the total width WT1 of the metal part 120 measured along the tangent line A-A' and in the first direction D1 can be, for example, 2*W1 + 2*W3 + 2*W5. The total width of the metal part can be, for example, the sum of the widths of the metal line segments (such as extension parts) through which the tangent line passes and / or the joints of the metal line segments (such as joint parts), but is not limited thereto. Additionally, in the side region 100c, the total width WT2 of the metal part 120 measured along the tangent line B-B' and in the first direction D1 can also be, for example, 2*W1 + 2*W3 + 2*W5. The ratio (WT1 / WT2) of the total width WT1 of the metal part 120 in the first bending region 100b to the total width WT2 of the metal part 120 in the side region 100c can range between 0.8 and 1.2 (0.8 ≤ WT1 / WT2 ≤ 1.2). Similarly, the ratio (WT3 / WT2) of the total width WT3 of the metal part 120 in the second bending region 100d to the total width WT2 of the metal part 120 in the side region 100c can range between 0.8 and 1.2 (0.8 ≤ WT3 / WT2 ≤ 1.2). Furthermore, the ratio (WT4 / WT1) of the total width WT4 of the metal part 120 in the first main region 100a or the second main region 100e to the total width WT1 of the metal part 120 in the first bending region 100b can range between 0.8 and 1.2 (0.8 ≤ WT4 / WT1 ≤ 1.2). It should be noted that the ratio of the total widths of the metal parts between the above different regions can be, for example, the ratio of the sum of the widths of the extension parts in the two regions, or the ratio of the sum of the widths of the joint parts in the two regions, or the ratio of the sum of the widths of the respective metal line segments and the sum of the widths of the joint parts in the two regions, but is not limited to this.

[0043] On the other hand, in the wire 106, at different positions within any one of the first main region 100a, the first bending region 100b, the side region 100c, the second bending region 100d, and the second main region 100e in the second direction D2, the ratio range of the total width of the metal part 120 measured along the first direction D1 can be between 0.8 and 1.2. The total width of the metal part can be, for example, the sum of the widths of the metal line segments (such as extension parts) through which the tangent line passes and / or the joints of the metal line segments (such as joint parts), but is not limited thereto. For example, as Figure 4As shown, in the first bending region 100b, the total width WT1 of the metal portion 120 measured along the tangent line A-A' and in the first direction D1 can be, for example, 2*W1 + 2*W3 + 2*W5. Similarly, in the first bending region 100b, the total width WT5 of the metal portion 120 measured along the tangent line C-C' and in the first direction D1 can be, for example, W2 + W4 + W6. In the first bending region 100b, the range of the ratio (WT1 / WT5) of the total width WT1 of the metal portion 120 to the total width WT5 of the metal portion 120 can be between 0.8 and 1.2 (0.8 ≤ WT1 / WT5 ≤ 1.2). The above is only an example using the first bending region 100b. In other regions such as the side region 100c, the second bending region 100d, or other regions, the range of the ratio of the total widths of different positions of the metal portion of the wire 106 can also be between 0.8 and 1.2. It should be noted that the ratio of the total widths of the metal portions within the same region can be, for example, the ratio of the total widths of the extending portions within the same region, or the ratio of the total widths of the joining portions within the same region, or the ratio of the total widths of the respective metal line segments within the same region to the total width of the joining portion, but is not limited thereto.

[0044] Thereby, the difference in the total width of the metal portion 120 of the wire 106 in the direction perpendicular to the extending direction (the first direction D1) between different regions or within the same region is very small, which can enable the stress during bending of the wire 106 to be evenly distributed through the metal portion 120, so as to reduce the chance of the wire 106 breaking.

[0045] In addition, the portions of the wire 106 corresponding to different regions of the flexible substrate 100 can have a structure with metal portions 120 having different densities. Taking the sub-structure 1063 as an example, as Figure 4 shown, the length H0 of at least one opening 1222 in the first bending region 100b and / or the second bending region 100d can be less than the length H1 of at least one opening 1220 in the first main region 100a, the side region 100c, and / or the second main region 100e. The length H0 and the length H1 can be approximately the maximum length of the opening in the second direction D2. The ratio (H0 / H1) of the length H0 to the length H1 can be less than or equal to 0.9 and greater than or equal to 0.3. On the other hand, on the same column arranged in the first direction D1, the lengths H0 and / or H1 of the openings in the sub-structures 1061, 1062, 1063 can be selectively equal or unequal, but are not limited thereto.

[0046] On the other hand, the portions of the wire 106 corresponding to different regions of the flexible substrate 100 can have a structure with metal portions 120 having substantially the same density. Please refer to Figure 4, taking the sub-structure 1063 as an example, the length H1 of at least one opening 1222 in the first bending region 100b and / or the second bending region 100d may also be equal to the length H0 of at least one opening 1220 in the first main region 100a, the side region 100c and / or the second main region 100e. The length H0 and the length H1 may be generally the maximum length of the opening along the second direction D2. The ratio (H0 / H1) of the length H0 to the length H1 may be between 0.95 and 1.05. On the other hand, on the same column extending along the first direction D1, the length H0 and / or the length H1 of at least one opening in the sub-structures 1061, 1062, 1063 may be selectively equal or unequal, but not limited thereto.

[0047] Taking the sub-structure 1063 as an example, one of the openings 1222 in the first bending region 100b and / or the second bending region 100d includes a first included angle θ1, and the first included angle θ1 is an acute included angle between one side 1222-1 of the opening 1222 and the first direction D1; one of the openings 1220 in the first main region 100a, the side region 100c and / or the second main region 100e includes a second included angle θ2, and the second included angle θ2 is an acute included angle between one side 1220-1 of the opening 1220 and the first direction D1, and the side 1222-1 of the opening 1222 corresponds to the side 1220-1 of the opening 1220. For example, please refer to Figure 4 , the side 1222-1 of the opening 1222 is located in the upper left region, corresponding to the side 1220-1 also located in the upper left region of the opening 1220. And the ratio (θ1 / θ2) of the first included angle θ1 to the second included angle θ2 may be less than or equal to 0.9 and greater than or equal to 0.3. The first included angle θ1 and the second included angle θ2 may be, for example, the included angles between the hypotenuse of the extension part 1200 and the first direction D1 (the extension direction of the vertical wire 106). The sub-structures 1061 and 1062 may also have the same features as the above-mentioned sub-structure 1063, and will not be elaborated here.

[0048] Thus, the part of the wire 106 corresponding to the first bending region 100b and / or the second bending region 100d of the flexible substrate 100 may have a structure with a higher density metal part 120 to improve the tensile resistance of the wire 106 during bending. In some embodiments, the structure of the higher density metal part 120 may also be applied to the first main region 100a, the side region 100c and / or the second main region 100e, but not limited thereto.

[0049] Please refer to Figure 4 and Figure 1, for the length La of the portion with an opening design in the first main region 100a of the flexible substrate 100 corresponding to the wire 106, the range can be 0.2T2 ≤ La ≤ L1, where T2 is the thickness of the carrier 102a and L1 is the length of the carrier 102a. For the length Lc of the portion with an opening design in the side region 100c of the flexible substrate 100 corresponding to the wire 106, the range can be 2(T1 + T2) ≤ Lc ≤ L1, where T1 is the thickness of the flexible substrate 100. For the length Le of the portion with an opening design in the second main region 100e of the flexible substrate 100 corresponding to the wire 106, the range can be 0.2T2 ≤ Le ≤ L2, where L2 is the length of the carrier 102b. For the length Lb or the length Ld of the portion with an opening design in the first bending region 100b or the second bending region 100d of the flexible substrate 100 corresponding to the wire 106, the range can be 2(T1 + T2) ≤ Lb ≤ L1 or 2(T1 + T2) ≤ Ld ≤ L1. In addition, as Figure 4 shown, in the first main region 100a and / or the second main region 100e, the wire 106 may also have a straight metal portion 120s without an opening connected to the metal portion 120, but not limited thereto. In some embodiments, the wire 106 may not have an opening in the first main region 100a and / or the second main region 100e.

[0050] Please refer to Figure 5 , which shows a partially enlarged schematic view of the wire of the first embodiment of the present invention. Figure 5 The structure shown can be a part of the sub-structure 1061, the sub-structure 1062, or the sub-structure 1063. Taking a part of the sub-structure 1063 as an example, the metal portion 120 in this part may include two first blocks 124A1 and 124A2, a second block 124B, and a third block 124C. The second block 124B is disposed between the first block 124A1 and the first block 124A2, and the first block 124A1 is disposed between the second block 124B and the third block 124C. The first block 124A1 and the first block 124A2 may be, for example, rectangles, and the first block 124A2 may be, for example, Figure 4 a part of the bonding portion 1202 in

[0051] An included angle θa may exist between the sides of the first blocks 124A1 and 124A2 and the first direction D1, an included angle θb may exist between the hypotenuse 126 of the second block 124B and the first direction D1, and an included angle θc may exist between the hypotenuse 126 of the third block 124C and the second direction D2. For example, the ratio of the included angle θb to the included angle θa (θb / θa) or the ratio of the included angle θc to the included angle θa (θc / θa) may range from 0.01 to 0.99, but is not limited thereto. For example, the included angle θa may range from 80 degrees to 90 degrees, such as 85 degrees, but is not limited thereto. For example, the included angles θb and θc may range from 1 degree to 89 degrees, such as 30 degrees or 60 degrees, but is not limited thereto.

[0052] In the first direction D1, the first blocks 124A1 and 124A2 may have a width Wa, the second block 124B may have a width Wb, and the third block 124C may have a width Wc. The ratio of the width Wa to the width Wb (Wa / Wb) or the ratio of the width Wa to the width Wc (Wa / Wc) may range from 0.9 to 1.1, but is not limited thereto. For example, the width Wa may range from 1 micrometer (um) to 15 um, such as 5 um, but is not limited thereto. In addition, the first blocks 124A1 and 124A2 may have a height Ha, and the ratio of the height Ha to the width Wa (Ha / Wa) may range from 0.2 to 1.5 (0.2 ≤ Ha / Wa ≤ 1.5), such as 0.5, 0.9, or 1.2, but is not limited thereto.

[0053] Other embodiments of the present invention will be described in detail hereinafter. For the sake of simplicity, the same reference numerals are used to label the same elements in the following description. In order to highlight the differences between the embodiments, the differences between different embodiments are described in detail below, and the repeated technical features will not be described again.

[0054] Please refer to Figure 6 , which shows a top view schematic diagram of a partial structure of a wire according to a second embodiment of the present invention. The difference between the second embodiment and the first embodiment (as shown in Figure 4 ) is that the wire 106 of the second embodiment may include four sub-structures, for example, two sub-structures 1062 and two sub-structures 1063. For example, in the first direction D1, the sub-structure 1063 may be disposed between the two sub-structures 1062 and be linked to each other, but the number or arrangement of the sub-structures is not limited thereto. In addition, similar to the first embodiment, the wire 106 of this embodiment may also have a structure with metal parts 120 having different densities corresponding to different parts of different regions of the flexible substrate 100, and the wire edge and / or the opening edge may be selectively designed as an arc edge to reduce the probability of static electricity accumulation or discharge.

[0055] Please refer toFigures 7 to 9 , Figures 7 to 9 The upper view schematic diagram of the partial structure of the wire in the third to fifth embodiments of the present invention is shown. The difference between the third to fifth embodiments and the first embodiment (as Figure 4 shown) is that the wire 106 in the third to fifth embodiments may include a sub-structure. As Figures 7 to 9 shown, the wire 106 may include a sub-structure 1061, a sub-structure 1062 or a sub-structure 1063. As described in the first embodiment, the metal structures 120 (such as the extending part or the joining part) in the sub-structure 1061, the sub-structure 1062 and the sub-structure 1063 may have different widths, or the openings 122 in the sub-structure 1061, the sub-structure 1062 and the sub-structure 1063 may have different widths. In addition, similar to the first embodiment, the wires 106 in the third to fifth embodiments may also have a structure with metal parts 120 of different densities corresponding to different parts of different regions of the flexible substrate 100.

[0056] Please refer to Figure 10 , which shows the schematic diagram of the electronic device in the sixth embodiment of the present invention. For the convenience of the reader's understanding and the simplicity of the drawings, Figure 10 only the flexible substrate 100, the wires 106a, the wire 106b and the integrated circuit 128 thereon are shown, and the remaining elements in the electronic device and the structures of the metal parts and the openings in the wires are omitted. As Figure 10As shown, the wire 106a and the wire 106b can extend from the working area 130 to the non-working area 132 and be electrically connected to the integrated circuit 128, but not limited thereto. For example, the working area 130 can be, for example, the first main area 100a of the above embodiment, and the non-working area 132 can be, for example, the first bending area 100b, the side area 100c, the second bending area 100d, and the second main area 100e of the above embodiment, but not limited thereto. The extending direction of the wire 106a extending from the working area 130 to the non-working area 132 can remain unchanged, and the wire 106b can change its extending direction within the non-working area 132 (such as the second main area 100e). The wire 106b can include a first part 106-1, a second part 106-2, and a connecting part 106-3. The connecting part 106-3 connects the first part 106-1 and the second part 106-2, and the extending direction of the connecting part 106-3 is different from that of the first part 106-1 or the second part 106-2. The connecting part 106-3 can extend obliquely into the interior of the flexible substrate 100 in the non-working area 132, which can make the wires more concentratedly distributed. For example, the extending direction of the connecting part 106-3 of the wire 106b can be parallel to a third direction D3, the extending directions of the remaining parts of the wire 106b can be parallel to a fourth direction D4, and the third direction D3 and the fourth direction D4 are not parallel. The number or position of the wire 106b changing its extending direction is not limited by Figure 10 as shown.

[0057] In addition, in the connecting part 106-3 of the wire 106b, the total width Wi of the metal part is measured along a fifth direction D5 perpendicular to the third direction D3. In other words, when measuring the total width of the metal part of the wire, it is measured along a direction perpendicular to the extending direction of the wire in the area where it is located. In addition, Figure 10 the integrated circuit 128 in

[0058] can be bent to the back side or below the working area 130 of the flexible substrate 100, but not limited thereto.

[0059] The above are only embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. As long as the different features between the embodiments do not conflict or violate the spirit of the invention, they can be arbitrarily arranged and combined, depending on the design requirements. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An electronic device, characterized in that, Comprising: A flexible substrate; And A wire disposed on the flexible substrate, Wherein the wire includes a first sub-structure and a second sub-structure, the first sub-structure and the second sub-structure extend along one direction, the first sub-structure is connected to the second sub-structure in another direction, and the another direction is perpendicular to the one direction, Wherein each of the first sub-structure and the second sub-structure includes an opening, a first extension portion extending along the one direction, a second extension portion extending along the one direction, and a joint portion where the first extension portion and the second extension portion meet, Wherein, on a first tangent line along the another direction, the ratio of the sum of the widths of the first extension portion and the second extension portion in the first sub-structure to the width of the joint portion on a second tangent line along the another direction is between 0.8 and 1.2, Wherein, in the another direction, the width of the joint portion in the first sub-structure is greater than the width of the joint portion in the second sub-structure, and in the another direction, the width of the opening adjacent to the joint portion in the first sub-structure in the first sub-structure is greater than the width of the opening adjacent to the joint portion in the second sub-structure in the second sub-structure. Wherein the opening in the first sub-structure has an arc-shaped edge adjacent to the joint portion in the first sub-structure, and the opening in the second sub-structure has an arc-shaped edge adjacent to the joint portion in the second sub-structure.

2. The electronic device according to claim 1, wherein The electronic device includes a light-emitting unit disposed on the flexible substrate.

3. The electronic device according to claim 2, wherein The flexible substrate includes a display area, and the light-emitting unit is disposed in the display area of the flexible substrate.

4. The electronic device according to claim 3, wherein At least a part of the wire is disposed in the display area of the flexible substrate.

5. The electronic device according to claim 2, wherein, The electronic device includes a thin-film transistor disposed on the flexible substrate, and the thin-film transistor is used to drive the light-emitting unit.

6. The electronic device according to claim 1, characterized in that, The wire includes a third sub-structure extending along the one direction, Wherein the third sub-structure is connected to the first sub-structure in the another direction, and in the another direction, the first sub-structure is disposed between the second sub-structure and the third sub-structure, Wherein the third sub-structure includes a first extension portion extending along the one direction, a second extension portion extending along the one direction, and a joint portion where the first extension portion and the first extension portion meet, Wherein the first tangent line passes through the first sub-structure, the second sub-structure and the third sub-structure, the second tangent line passes through the first sub-structure, the second sub-structure and the third sub-structure, and the ratio of the sum of the widths of the first extension portion and the second extension portion on the first tangent line to the sum of the widths of the joint portions on the second tangent line is between 0.8 and 1.2.

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