Wafer fixing apparatus

Abstract

The application discloses a wafer fixing device and relates to the technical field of wafer fixing. The piston rod of the air cylinder of the driving mechanism drives the pressing plate of the clamping assembly to move downwards in the limiting block, the roller drives the moving plate to move towards the wafer, the clamping plate on the moving plate clamps and fixes the wafer on the material disc, and multiple wafers can be clamped and fixed simultaneously. When the wafer is loosened, the piston rod of the air cylinder drives the pressing plate to move upwards, the clamping plate can be separated from the wafer under the elastic force of the spring, the wafer is loosened, and the wafer is very convenient to fix and loosen.

Description

Technical Field

[0001] This invention relates to the technical field of wafer fixing, and more specifically to a wafer fixing device. Background Technology

[0002] In the semiconductor device manufacturing process, to ensure the effectiveness of the front-side circuit of the wafer, a series of complex processes such as spin coating, exposure, and development are carried out on the front side of the wafer to provide chips that meet product requirements. During the production process, the wafer cannot be simply placed, but needs to be clamped by a special device. However, the existing wafer fixing equipment has a relatively complex structure and can only fix one wafer at a time, resulting in low wafer fixing efficiency. Therefore, it is necessary to solve the above problems. Summary of the Invention

[0003] The purpose of this invention is to provide a wafer fixing device to overcome the above-mentioned defects in the prior art.

[0004] A wafer fixing device includes a worktable, an upper top seat, clamping components, and a driving mechanism. The upper top seat is fixed on the worktable. A plurality of fixing seats are evenly distributed along the circumference of the upper top seat, and each fixing seat is provided with a material tray. A plurality of clamping components are evenly distributed along the circumference of the material tray. The driving mechanism is located in the worktable and is used to drive the clamping plates on the clamping components to move and fix the wafer.

[0005] Preferably, the clamping assembly further includes a limiting block, a movable plate, a pressure plate, and a spring. The limiting block is connected to the material tray via a connecting plate. The movable plate is inserted into the mounting groove on the limiting block. The clamping plate is fixed to the inner end of the movable plate. A guide rod is fixed to the outer end of the movable plate. The guide rod is slidably connected to a bracket on the outer side of the limiting block, and a baffle is fixed to its outer end. The spring is sleeved on the guide rod and located between the bracket and the baffle. A roller is rotatably connected to the opening groove on the movable plate. The pressure plate is inserted into the limiting block, and one side of the pressure plate has an arc-shaped pressing surface that abuts against the roller. A horizontal plate is connected to the bottom of the pressure plate. All horizontal plates on the same material tray are connected to the same connecting plate.

[0006] Preferably, the driving mechanism includes a lifting rod and a cylinder. Each connecting plate has a lifting rod fixed to its bottom. The lifting rod is slidably connected to the upper top seat. The lower ends of all the lifting rods are connected to the same lifting plate. The cylinder body is fixed in the worktable and the upper end of its piston rod is connected to the lifting plate.

[0007] Preferably, each cross plate is slidably connected to a guide groove on a fixed base.

[0008] Preferably, the clamp is inverted L-shaped and has a rubber pad on its inner wall.

[0009] The present invention has the following advantages:

[0010] This invention uses a cylinder and lifting rod of a drive mechanism to move the pressure plate of the clamping assembly downward within a limiting block. Rollers then move the moving plate toward the wafer. The clamping plates on the moving plate clamp and fix the wafers on the material tray. Multiple wafers can be clamped and fixed simultaneously. When the wafer is released, the piston rod of the cylinder simply moves the pressure plate upward. Under the action of the spring force, the clamping plates can move away from the wafer, and the wafer is released. The entire process is very convenient for fixing and releasing the wafer. Attached Figure Description

[0011] Figure 1 and Figure 2 This is a schematic diagram of the overall three-dimensional structure of the present invention from different angles.

[0012] Figure 3 and Figure 4 This is a schematic diagram of the structure of the present invention at different angles when the worktable is not installed.

[0013] Figure 5 for Figure 3 A magnified view of a portion of point A in the middle.

[0014] Figure 6 This is a schematic diagram of the drive mechanism of the present invention.

[0015] Figure 7 This is a schematic diagram of the clamping assembly of the present invention.

[0016] The components are as follows: 1. Workbench, 2. Top seat, 3. Fixed seat, 31. Guide groove, 4. Material tray, 5. Clamping assembly, 51. Clamping plate, 511. Rubber pad, 52. Limiting block, 53. Connecting plate, 54. Moving plate, 541. Opening groove, 542. Roller, 55. Guide rod, 56. Bracket, 561. Baffle, 57. Spring, 58. Pressure plate, 581. Arc-shaped pressure surface, 59. Horizontal plate, 591. Connecting plate, 6. Drive mechanism, 61. Lifting rod, 62. Lifting plate, 63. Cylinder. Detailed Implementation

[0017] The following detailed description of the embodiments, with reference to the accompanying drawings, will further illustrate the specific implementation of the present invention, in order to help those skilled in the art to have a more complete, accurate, and in-depth understanding of the concept and technical solutions of the present invention.

[0018] like Figure 1-7As shown, the present invention provides a wafer fixing device, including a worktable 1, an upper top seat 2, clamping components 5 and a driving mechanism 6. The upper top seat 2 is fixed on the worktable 1, and a plurality of fixing seats 3 are evenly distributed along the circumference of the upper top seat 2. Each fixing seat 3 is provided with a material tray 4, and a plurality of clamping components 5 are evenly distributed along the circumference of the material tray 4. The driving mechanism 6 is disposed in the worktable 1 and is used to drive the clamping plates 51 on the clamping components 5 to move and fix the wafer.

[0019] It should be noted that the clamping assembly 5 also includes a limiting block 52, a movable plate 54, a pressure plate 58, and a spring 57. The limiting block 52 is connected to the material tray 4 via a connecting plate 53. The movable plate 54 is inserted into the mounting groove on the limiting block 52. A clamping plate 51 is fixed to the inner end of the movable plate 54. The clamping plate 51 is inverted L-shaped and has a rubber pad 511 on its inner wall. A guide rod 55 is fixed to the outer end of the movable plate 54. The guide rod 55 is slidably connected to the bracket 56 on the outside of the limiting block 52, and its outer end is fixed with a spring 57. The baffle 561, the spring 57 is sleeved on the guide rod 55 and located between the bracket 56 and the baffle 561, the roller 542 is rotatably connected in the slot 541 on the moving plate 54, the pressure plate 58 is inserted into the limiting block 52 and has an arc-shaped pressure surface 581 on one side that abuts against the roller 542, the bottom of the pressure plate 58 is connected to the horizontal plate 59, all the horizontal plates 59 on the same material tray 4 are connected to the same connecting plate 591, and each horizontal plate 59 is slidably connected in the guide groove 31 on the fixed seat 3.

[0020] In addition, the drive mechanism 6 includes a lifting rod 61 and a cylinder 63. Each connecting plate 591 has a lifting rod 61 fixed at its bottom. The lifting rod 61 is slidably connected to the upper top seat 2. The lower ends of all the lifting rods 61 are connected to the same lifting plate 62. The cylinder body of the cylinder 63 is fixed in the worktable 1 and its piston rod upper end is connected to the lifting plate 62.

[0021] Detailed implementation methods and principles:

[0022] In practical application, the wafers to be processed are placed on the material tray 4. After all the wafers are placed on the material tray 4, the piston rod of the control cylinder 63 retracts, thereby driving the lifting plate 62 and the lifting rod 61 to move downward. The lifting rod 61 drives the horizontal plate 59 and the pressure plate 58 to move downward through the connecting plate 591. The arc-shaped pressing surface 581 on the pressure plate 58 drives the moving plate 54 to move towards the wafer through the roller 542, and clamps and fixes the wafer through the clamping plate 51 on the moving plate 54. The spring 57 on the guide rod 55 is compressed under the action of the baffle 561. Then the wafers on the material tray 4 are processed. After the wafer processing is completed, the piston rod of the control cylinder 63 extends, thereby driving the pressure plate 58 to move upward. Under the action of the spring 57, the moving plate 54 and the clamping plate 51 on it move outward, the wafer is released, and then the wafer can be removed from the material tray 4.

[0023] In summary, the present invention uses the cylinder 63 and lifting rod 61 of the driving mechanism 6 to drive the pressure plate 58 of the clamping assembly 5 to move downward in the limiting block 52, and the roller 542 to drive the moving plate 54 to move towards the wafer. The clamping plate 51 on the moving plate 54 clamps and fixes the wafer on the material tray 4. Multiple wafers can be clamped and fixed at the same time. When the wafer is released, it is only necessary to drive the piston rod of the cylinder 63 to move the pressure plate 58 upward. Under the action of the spring 57, the clamping plate 51 can be moved away from the wafer, and the wafer is released. The whole process is very convenient for fixing and releasing the wafer.

[0024] The present invention has been described above by way of example with reference to the accompanying drawings. Obviously, the specific implementation of the present invention is not limited to the above-described manner. Any non-substantial improvements made using the concept and technical solution of the present invention, or the direct application of the present invention and technical solution to other situations without modification, are all within the protection scope of the present invention.

Claims

1. A wafer fixing device, characterized in that: The device includes a worktable (1), an upper top seat (2), clamping components (5) and a driving mechanism (6). The upper top seat (2) is fixed on the worktable (1). Several fixed seats (3) are evenly distributed along the circumference of the upper top seat (2), and each fixed seat (3) is provided with a material tray (4). Several clamping components (5) are evenly distributed along the circumference of the material tray (4). The driving mechanism (6) is located in the worktable (1) and is used to drive the clamping plate (51) on the clamping component (5) to move and fix the wafer. The clamping assembly (5) further includes a limiting block (52), a movable plate (54), a pressure plate (58), and a spring (57). The limiting block (52) is connected to the material tray (4) via a connecting plate (53). The movable plate (54) is inserted into the mounting groove on the limiting block (52). The clamping plate (51) is fixed to the inner end of the movable plate (54). A guide rod (55) is fixed to the outer end of the movable plate (54). The guide rod (55) is slidably connected to the bracket (56) on the outer side of the limiting block (52), and a baffle is fixed to its outer end. (561), the spring (57) is sleeved on the guide rod (55) and located between the bracket (56) and the baffle (561). The roller (542) is rotatably connected in the slot (541) on the moving plate (54). The pressure plate (58) is inserted into the limiting block (52) and has an arc-shaped pressure surface (581) on one side that abuts against the roller (542). The bottom of the pressure plate (58) is connected to a horizontal plate (59). All the horizontal plates (59) on the same material tray (4) are connected to the same connecting plate (591). The drive mechanism (6) includes a lifting rod (61) and a cylinder (63). Each connecting plate (591) has a lifting rod (61) fixed at its bottom. The lifting rod (61) is slidably connected to the upper top seat (2). The lower ends of all the lifting rods (61) are connected to the same lifting plate (62). The cylinder body of the cylinder (63) is fixed in the worktable (1) and its piston rod is connected to the lifting plate (62). The wafers to be processed are placed on the material tray (4). After all the wafers are placed on the material tray (4), the piston rod of the control cylinder (63) retracts, thereby driving the lifting plate (62) and lifting rod (61) to move down. The lifting rod (61) drives the horizontal plate (59) and pressure plate (58) to move down through the connecting plate (591). The arc-shaped pressing surface (581) on the pressure plate (58) drives the moving plate (54) to move towards the wafer through the roller (542). The clamping plate (51) on the moving plate (54) clamps and fixes the wafer. The spring (57) on the guide rod (55) is compressed under the action of the baffle (561). Then the wafer on the material tray (4) is processed. After the wafer is processed, the piston rod of the control cylinder (63) extends, thereby driving the pressure plate (58) to move upward. Under the action of the spring (57), the moving plate (54) and the clamping plate (51) on it move outward, and the wafer is released.

2. The wafer fixing device according to claim 1, characterized in that: Each horizontal plate (59) is slidably connected to the guide groove (31) on the fixed base (3).

3. The wafer fixing device according to claim 1, characterized in that: The clamp (51) is inverted L-shaped and has a rubber pad (511) on its inner wall.

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