Low-loss millimeter-wave package interconnect structure based on slot coupling

Abstract

This invention discloses a low-loss millimeter-wave packaged interconnect structure based on slot coupling in the field of antennas, comprising a first metal plate, a first dielectric substrate, a second metal plate, a high dielectric constant dielectric block, a third metal plate, a second dielectric substrate, and a fourth metal plate arranged sequentially. A first grounded coplanar waveguide is disposed on the second metal plate and connected to a first wave port. A second grounded coplanar waveguide is disposed on the third metal plate and connected to a second wave port. Stepped impedance lines are disposed on the first and second grounded coplanar waveguides. The stepped impedance lines of the first and second grounded coplanar waveguides are respectively disposed on both sides of the high dielectric constant dielectric block. It features small size and simple structure, and can ensure good broadband impedance matching while reducing interconnect loss.

Description

Technical Field

[0001] This invention belongs to the field of broadband antenna technology, specifically relating to a low-loss millimeter-wave packaged interconnect structure based on slot coupling. Background Technology

[0002] Antenna in Package (AiP) integrates the antenna and chip within a package based on packaging materials and processes. It integrates the antenna with the RF transceiver system, resulting in higher system integration and smaller size, making it widely favored by chip and packaging manufacturers. Today, AiP technology is widely used in gesture radar, automotive radar, and multi-channel antennas.

[0003] In the high-density packaging of large-scale array antennas and integrated circuit systems, traditional packaging interconnect technology has high requirements for processing precision in the millimeter-wave band, and the interconnect part will also introduce inductive reactance, resulting in antenna impedance mismatch and seriously affecting system efficiency. Summary of the Invention

[0004] The purpose of this invention is to provide a low-loss millimeter-wave packaged interconnect structure based on slot coupling, which features small size and simple structure, and can ensure good broadband impedance matching while reducing interconnect loss.

[0005] To achieve the above objectives, the first aspect of the present invention provides:

[0006] The low-loss millimeter-wave packaging interconnect structure based on gap coupling comprises a first metal plate, a first dielectric substrate, a second metal plate, a high dielectric constant dielectric block, a third metal plate, a second dielectric substrate, and a fourth metal plate arranged sequentially.

[0007] A first grounded coplanar waveguide is disposed on the second metal plate and connected to a first wave port; a second grounded coplanar waveguide is disposed on the third metal plate and connected to a second wave port; stepped impedance lines are disposed on the first and second grounded coplanar waveguides; the stepped impedance lines of the first and second grounded coplanar waveguides are respectively disposed on both sides of the high dielectric constant dielectric block.

[0008] Preferably, the length of the stepped impedance line is equal to the width of the high dielectric constant dielectric block.

[0009] Preferably, a first coupling gap is provided on the second metal plate; the first coupling gap is disposed opposite to the high dielectric constant dielectric block; the stepped impedance line of the first grounded coplanar waveguide is disposed within the first coupling gap.

[0010] Preferably, a second coupling gap is provided on the third metal plate; the second coupling gap is disposed opposite to the high dielectric constant dielectric block; the stepped impedance line of the second ground coplanar waveguide is disposed within the second coupling gap.

[0011] Preferably, the length of the stepped impedance line is equal to the width of the first coupling gap and the second coupling gap.

[0012] Preferably, a plurality of metal pillars are embedded in the first dielectric substrate and the second dielectric substrate; the metal pillars on the first dielectric substrate are arranged around the first grounding coplanar waveguide; and the metal pillars on the second dielectric substrate are arranged around the second grounding coplanar waveguide.

[0013] Preferably, the spacing between the metal columns is 0.2 mm.

[0014] Preferably, a plurality of grounded metal welding posts are arranged around the high dielectric constant dielectric block.

[0015] Preferably, the diameter of the grounding metal welding column is 0.065 mm and the height of the grounding metal welding column is 0.05 mm.

[0016] Preferably, the dielectric constant of the high dielectric constant dielectric block is in the range of [15, 30].

[0017] The second aspect of the present invention provides: an adjustment method for a low-loss millimeter-wave packaged interconnect structure based on slot coupling, wherein the slot coupling degree of the low-loss millimeter-wave packaged antenna is changed by adjusting the width and length of the first coupling slot and the second coupling slot, as well as the width of the stepped impedance line.

[0018] Compared with the prior art, the beneficial effects achieved by the present invention are as follows:

[0019] In this invention, stepped impedance lines are provided on the first grounding coplanar waveguide and the second grounding coplanar waveguide; by loading the stepped impedance lines, the influence of inductive reactance introduced after interconnection is reduced, and the impedance bandwidth of the port is optimized.

[0020] In this invention, a first grounded coplanar waveguide is disposed on the second metal plate and connected to a first wave port; a second grounded coplanar waveguide is disposed on the third metal plate and connected to a second wave port; energy is coupled to the second grounded coplanar waveguide through the first grounded coplanar waveguide to achieve interconnection; a coupling interconnection method is proposed, which has the advantage of low interconnection loss, providing a new method for efficient interconnection between antennas and front-end chips.

[0021] This invention improves impedance matching of coupled interconnects and reduces interconnect losses by loading high dielectric constant dielectric blocks into the coupled interconnect portions. Attached Figure Description

[0022] Figure 1 This is an exploded view of a slot-to-slot coupled interconnect structure;

[0023] Figure 2 This is a left view of a slot-to-slot coupled interconnect structure;

[0024] Figure 3 This is a top view of a slot-to-slot coupled interconnect structure;

[0025] Figure 4 This is an exploded view of the slot-ground coplanar waveguide coupling interconnect structure;

[0026] Figure 5 This is a top view of a slot-ground coplanar waveguide coupling interconnect structure;

[0027] Figure 6 This is an exploded view of the grounded coplanar waveguide-grounded coplanar waveguide coupling interconnection structure;

[0028] Figure 7 This is a top view of the grounded coplanar waveguide-grounded coplanar waveguide coupled interconnection structure;

[0029] Figure 8 This is a diagram showing the S-parameter results of a slot-to-slot coupled interconnect structure;

[0030] Figure 9 This is a graph showing the S-parameter results of a slot-to-slot coupled interconnect structure without a high dielectric constant dielectric block.

[0031] Figure 10 This is a diagram showing the S-parameter results of the slot-grounded coplanar waveguide coupling interconnect structure;

[0032] Figure 11 This is a diagram showing the S-parameter results of a grounded coplanar waveguide-grounded coplanar waveguide coupled interconnection structure;

[0033] In the figure: 101 First metal plate, 102 First dielectric substrate, 103 Second metal plate, 104 Third metal plate, 105 Second dielectric substrate, 106 Fourth metal plate, 107 First wave port, 108 Second wave port, 109 First grounded coplanar waveguide, 110 Second grounded coplanar waveguide, 111 First coupling gap, 112 Second coupling gap, 113 Grounded metal weld pillar, 114 High dielectric constant dielectric block, 115 Metal pillar, 116 Stepped impedance line. Detailed Implementation

[0034] The present invention will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and should not be used to limit the scope of protection of the present invention.

[0035] It should be noted that in the description of this invention, the terms "front," "rear," "left," "right," "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are used only for the convenience of describing the invention and do not require the invention to be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on the invention. The terms "front," "rear," "left," "right," "upper," and "lower" used in the description of this invention refer to the directions shown in the accompanying drawings, while the terms "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0036] Example 1

[0037] like Figures 1 to 3 As shown, the low-loss millimeter-wave package interconnect structure based on gap coupling includes a first metal plate 101, a first dielectric substrate 102, a second metal plate 103, a high dielectric constant dielectric block 114, a third metal plate 104, a second dielectric substrate 105 and a fourth metal plate 106 arranged sequentially.

[0038] A first grounding coplanar waveguide 109 is disposed on the second metal plate 103, and the first grounding coplanar waveguide 109 is connected to the first wave port 107; a second grounding coplanar waveguide 110 is disposed on the third metal plate 104, and the second grounding coplanar waveguide 110 is connected to the second wave port 108; stepped impedance lines 116 are disposed on the first grounding coplanar waveguide 109 and the second grounding coplanar waveguide 110; the stepped impedance lines of the first grounding coplanar waveguide 109 and the second grounding coplanar waveguide 110 are respectively disposed on both sides of the high dielectric constant dielectric block 114; the dielectric constant of the high dielectric constant dielectric block 114 is in the range of [15, 30], and here the dielectric constant value is 20 and the loss factor is 0.002; the length of the stepped impedance line 116 is equal to the width of the high dielectric constant dielectric block 114.

[0039] A first coupling gap 111 is provided on the second metal plate 103; the first coupling gap 111 is disposed opposite to the high dielectric constant dielectric block 114; the stepped impedance line 116 of the first ground coplanar waveguide 109 is disposed within the first coupling gap 111; a second coupling gap 112 is provided on the third metal plate 104; the second coupling gap 112 is disposed opposite to the high dielectric constant dielectric block 114; the stepped impedance line of the second ground coplanar waveguide 110 is disposed within the second coupling gap 112. The length of the stepped impedance line 116 is equal to the width of the first coupling gap 111 and the second coupling gap 112.

[0040] A plurality of metal pillars 115 are embedded in the first dielectric substrate 102 and the second dielectric substrate 105; the metal pillars 115 on the first dielectric substrate 102 are arranged around the first grounding coplanar waveguide 109; the metal pillars 115 on the second dielectric substrate 105 are arranged around the second grounding coplanar waveguide 110.

[0041] Specifically, the first grounding coplanar waveguide 109 has a length SL1 of 1.5 mm, a width SW1 of 0.05 mm, and a spacing SP1 of 0.05 mm between it and the second metal ground plane 103. The high dielectric constant dielectric block 114 has a length SLf of 0.28 mm and a width SWf of 0.08 mm. The first coupling gap 111 and the second coupling gap 112 have the same dimensions: a length SSL of 0.63 mm and a width equal to the length SWf of the stepped impedance line. The metal pillar 115 has a diameter SR1 of 0.065 mm and a height of 0.25 mm, with a spacing SPc of 0.2 mm. The grounding metal welding pillar has a diameter of 0.065 mm and a height of 0.05 mm. The second grounding coplanar waveguide 110 has a length SL2 of 1.28 mm and a width SW2 of 0.05 mm. The first dielectric substrate 102 and the second dielectric substrate 105 both have a thickness of 0.25 mm.

[0042] like Figure 8 As shown, in the 66-76 GHz frequency band, the return loss of the first wave port 107 and the second wave port 108 are both greater than 20 dB, and the interconnection loss is less than 0.18 dB. Figure 9 As shown, without a high dielectric constant dielectric block, the impedance of the structure is mismatched and close to total reflection.

[0043] Example 2

[0044] like Figure 4 and Figure 5 As shown, this embodiment provides a low-loss millimeter-wave packaged interconnect structure based on slot coupling. The low-loss millimeter-wave packaged antenna comprises a first metal plate 101, a first dielectric substrate 102, a second metal plate 103, a high dielectric constant dielectric block 114, a third metal plate 104, a second dielectric substrate 105, and a fourth metal plate 106 arranged sequentially.

[0045] A first grounded coplanar waveguide 109 is provided on the second metal plate 103, and the first grounded coplanar waveguide 109 is connected to the first wave port 107; a second grounded coplanar waveguide 110 and a second coupling gap 112 are provided on the third metal plate 104, and the second grounded coplanar waveguide 112 is connected to the second wave port 108; energy is coupled to the first grounded coplanar waveguide 109 through the second coupling gap 112 to achieve the interconnection effect; the first grounded coplanar waveguide 109 includes a stepped impedance line 116.

[0046] The difference between this embodiment and Embodiment 1 is that only the first grounded coplanar waveguide 109 is provided on the second metal plate 103; and other specific dimensions are the same as in Embodiment 1. Figure 10 As shown, in this embodiment, the return loss of the first wave port and the first wave port in the 66-76GHz frequency band are both greater than 20dB, and the interconnection loss is less than 0.2dB.

[0047] Example 3

[0048] like Figure 6 and Figure 7 As shown, this embodiment provides a low-loss millimeter-wave packaged interconnect structure based on slot coupling. The low-loss millimeter-wave packaged antenna comprises a first metal plate 101, a first dielectric substrate 102, a second metal plate 103, a high dielectric constant dielectric block 114, a third metal plate 104, a second dielectric substrate 105, and a fourth metal plate 106 arranged sequentially.

[0049] A first grounded coplanar waveguide 109 is provided on the second metal plate 103, and the first grounded coplanar waveguide 109 is connected to the first wave port 107; a second grounded coplanar waveguide 110 is provided on the third metal plate 104, and the second grounded coplanar waveguide 110 is connected to the second wave port 108; energy is coupled to the first grounded coplanar waveguide 109 through the second grounded coplanar waveguide 110 to achieve the interconnection effect; the first grounded coplanar waveguide 109 and the second grounded coplanar waveguide 110 include stepped impedance lines.

[0050] Specifically, such as Figure 7 As shown, the first grounding coplanar waveguide 109 has a length LL1 of 2 mm, a width LW1 of 0.05 mm, and a distance LP1 to the side metal of 0.05 mm; the stepped impedance line 116 has a length LLf of 0.95 mm, a width LWf of 0.09 mm, and a distance LP2 to the side metal of 0.11 mm; the second grounding coplanar waveguide 110 has a length LL2 of 2 mm, a width LW2 of 0.05 mm; the metal pillar 115 has a diameter LR1 of 0.065 mm, a height of 0.25 mm, and a distance LPc between the metal pillars of 0.2 mm. The high dielectric constant dielectric block 114 has a length LLf of 0.95 mm, a width LLw of 0.11 mm, and a grounding metal solder pillar 113 has a diameter of 0.065 mm and a height of 0.05 mm; the first dielectric substrate 102 and the second dielectric substrate 105 both have a thickness of 0.25 mm.

[0051] like Figure 11As shown, in the grounded coplanar waveguide-grounded coplanar waveguide coupled interconnection structure, the return loss of the fifth wave port 307 and the sixth wave port 308 in the 66-76GHz frequency band is greater than 20dB, and the interconnection loss is less than 0.4dB.

[0052] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A low-loss millimeter-wave package interconnect structure based on a slot coupling, characterized by, The first metal plate, the first dielectric substrate, the second metal plate, the high dielectric constant dielectric block, the third metal plate, the second dielectric substrate and the fourth metal plate are sequentially arranged. The first ground coplanar waveguide line is arranged on the second metal plate and connected with the first wave port; the second ground coplanar waveguide line is arranged on the third metal plate and connected with the second wave port; the first ground coplanar waveguide line and the second ground coplanar waveguide line are provided with stepped impedance lines; the stepped impedance lines of the first ground coplanar waveguide line and the second ground coplanar waveguide line are arranged on both sides of the high dielectric constant dielectric block respectively; The first coupling gap is arranged on the second metal plate and opposite to the high dielectric constant dielectric block; the stepped impedance line of the first ground coplanar waveguide line is arranged in the first coupling gap; The second coupling gap is arranged on the third metal plate and opposite to the high dielectric constant dielectric block; the stepped impedance line of the second ground coplanar waveguide line is arranged in the second coupling gap.

2. The low-loss millimeter-wave package interconnect structure based on slot coupling of claim 1, wherein, The length of the stepped impedance line is equal to the width of the first coupling gap and the second coupling gap.

3. The low-loss millimeter-wave package interconnect structure based on slot coupling of claim 1, wherein, The first dielectric substrate and the second dielectric substrate are embedded with a plurality of metal columns; the metal columns on the first dielectric substrate are arranged around the first ground coplanar waveguide line; the metal columns on the second dielectric substrate are arranged around the second ground coplanar waveguide line.

4. The low-loss millimeter-wave package interconnect structure based on slot coupling of claim 3, wherein, The spacing between the metal columns is 0.2mm.

5. The low-loss millimeter-wave package interconnect structure based on slot coupling of claim 1, wherein, A plurality of ground metal solder columns are arranged around the high dielectric constant dielectric block.

6. The low-loss millimeter-wave package interconnect structure based on slot coupling of claim 5, wherein, The diameter of the ground metal solder column is 0.065mm, and the height of the ground metal solder column is 0.05mm.

7. The low-loss millimeter-wave package interconnect structure based on slot coupling of claim 1, wherein, The dielectric constant of the high dielectric constant dielectric block ranges from 15 to 30.

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