Display panel, manufacturing method thereof, and display device

Abstract

The present invention discloses a display panel, a method for manufacturing the same, and a display device. The display panel includes a first display area and a second display area, wherein the first display area is provided with a first light-emitting element, and the second display area is provided with a second light-emitting element. The display panel also includes: a substrate; a pixel circuit layer provided on one side of the substrate; the first light-emitting element and the second light-emitting element are both located on one side of the pixel circuit layer; a first encapsulation layer located on the side of the first light-emitting element away from the substrate, and along the thickness direction of the display panel, the first encapsulation layer at least covers the first light-emitting element; a second encapsulation layer located on the side of the second light-emitting element away from the substrate, and along the thickness direction of the display panel, the second encapsulation layer at least covers the second light-emitting element. By performing block encapsulation on the display panel including the first light-emitting element and the second light-emitting element, the encapsulation yield is improved, and the display resolution of the spliced ​​display panel is also improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] With the continuous advancement of science and technology, more and more electronic devices with display functions are being widely used in people's daily lives and work, bringing tremendous convenience to people's daily lives and work, and becoming an indispensable tool for people today. A key component in achieving the display function of electronic devices is the display panel. For hybrid display panels composed of organic and inorganic light-emitting elements, manufacturing process limitations seriously affect the packaging effect of the display panel and the resolution of the assembled display. Summary of the Invention

[0003] The present invention provides a display panel and a manufacturing method thereof, and a display device, so as to improve the packaging yield and display resolution of the display panel.

[0004] In a first aspect, an embodiment of the present invention provides a display panel, comprising a first display area and a second display area, wherein the first display area is provided with a first light-emitting element, and the second display area is provided with a second light-emitting element;

[0005] The display panel further includes:

[0006] substrate;

[0007] A pixel circuit layer is provided on one side of the substrate; the first light-emitting element and the second light-emitting element are both located on one side of the pixel circuit layer;

[0008] a first encapsulation layer, located on a side of the first light-emitting element away from the substrate, and covering at least the first light-emitting element along a thickness direction of the display panel;

[0009] The second encapsulation layer is located on a side of the second light-emitting element away from the substrate. Along the thickness direction of the display panel, the second encapsulation layer at least covers the second light-emitting element.

[0010] In a second aspect, an embodiment of the present invention further provides a method for manufacturing a display panel, the method comprising:

[0011] providing a substrate;

[0012] preparing a pixel circuit layer on one side of the substrate;

[0013] A first light-emitting element located in a first display area and a second light-emitting element located in a second display area are provided on a side of the pixel circuit layer away from the substrate;

[0014] preparing a first encapsulation layer on a side of the first light-emitting element away from the substrate;

[0015] A second encapsulation layer is prepared on a side of the second light-emitting element away from the substrate.

[0016] In a third aspect, an embodiment of the present invention further provides a display device, comprising the display panel according to any one of the first aspects.

[0017] The technical solution of the embodiment of the present invention is that the display panel includes a first display area and a second display area, the first display area is provided with a first light-emitting element, and the second display area is provided with a second light-emitting element; the display panel also includes: a substrate; a pixel circuit layer, which is provided on one side of the substrate; the first light-emitting element and the second light-emitting element are both located on one side of the pixel circuit layer; a first encapsulation layer, which is located on the side of the first light-emitting element away from the substrate, and along the thickness direction of the display panel, the first encapsulation layer at least covers the first light-emitting element; the second encapsulation layer, which is located on the side of the second light-emitting element away from the substrate, and along the thickness direction of the display panel, the second encapsulation layer at least covers the second light-emitting element. By performing block encapsulation on the first light-emitting element and the second light-emitting element in the display panel, the encapsulation yield is improved, and at the same time, the border width of the display panel is reduced, thereby improving the display resolution of the spliced ​​display panel.

[0018] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 It is a structural diagram of a display panel in the prior art;

[0021] Figure 2 A schematic structural diagram of a display panel provided by an embodiment of the present invention;

[0022] Figure 3 A schematic structural diagram of another display panel provided by an embodiment of the present invention;

[0023] Figure 4 A schematic diagram of another display panel provided by an embodiment of the present invention;

[0024] Figure 5A schematic diagram of a top view of a display panel provided by an embodiment of the present invention;

[0025] Figure 6 A schematic diagram of a top view of another display panel provided by an embodiment of the present invention;

[0026] Figure 7 A schematic diagram of a top view of another display panel provided by an embodiment of the present invention;

[0027] Figure 8 A schematic diagram of a top view of another display panel provided by an embodiment of the present invention;

[0028] Figure 9 A schematic flow chart of a method for manufacturing a display panel provided in an embodiment of the present invention;

[0029] Figure 10 A schematic flow chart of another method for manufacturing a display panel provided by an embodiment of the present invention;

[0030] Figure 11 A schematic flow chart of another method for manufacturing a display panel provided by an embodiment of the present invention;

[0031] Figure 12 A schematic flow chart of another method for manufacturing a display panel provided by an embodiment of the present invention;

[0032] Figure 13 A schematic structural diagram of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0034] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0035] Figure 1 It is a schematic diagram of the structure of the display panel in the prior art, such as Figure 1 As shown, the display panel 10 includes a substrate 11, an organic light-emitting element 12 and an inorganic light-emitting element 13 located on the light-emitting side of the display panel 10 and spaced apart, and an encapsulation layer 14 located on the side of the organic light-emitting element 12 and the inorganic light-emitting element 13 away from the substrate 11. Along the thickness direction of the display panel 10, the encapsulation layer 14 covers the organic light-emitting element 12 and the inorganic light-emitting element 13. Since the organic light-emitting element 12 and the inorganic light-emitting element 13 in the display panel 10 are encapsulated on the entire surface, if there is a failure in the encapsulation at a certain point during the use of the display panel 10, the overall display effect of the display panel 10 is affected. At the same time, since there is a supporting retaining wall 15 for encapsulation of the display panel 10 for spliced ​​display, the border width of the display panel 10 is seriously affected, thereby affecting the display resolution of the display panel 10.

[0036] To address the above technical issues, embodiments of the present invention provide a display panel comprising a first display area and a second display area, wherein the first display area is provided with a first light-emitting element, and the second display area is provided with a second light-emitting element. The display panel also includes: a substrate; a pixel circuit layer disposed on one side of the substrate; the first light-emitting element and the second light-emitting element are both located on one side of the pixel circuit layer; a first encapsulation layer located on the side of the first light-emitting element away from the substrate, and along the thickness direction of the display panel, the first encapsulation layer at least covers the first light-emitting element; and a second encapsulation layer located on the side of the second light-emitting element away from the substrate, and along the thickness direction of the display panel, the second encapsulation layer at least covers the second light-emitting element. By independently encapsulating the second light-emitting element and the first light-emitting element, the packaging yield of the display panel is improved, the border width of the display panel is reduced, and the display resolution of the spliced ​​display panel is improved.

[0037] The above is the core concept of the present invention. The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0038] Figure 2 A schematic structural diagram of a display panel provided by an embodiment of the present invention is shown in FIG. Figure 2 As shown, the display panel 100 includes a first display area 101 and a second display area 102, the first display area 101 is provided with a first light-emitting element 103, and the second display area 102 is provided with a second light-emitting element 104; the display panel 100 also includes: a substrate 105; a pixel circuit layer 106, which is provided on one side of the substrate 105; the first light-emitting element 103 and the second light-emitting element 104 are both located on one side of the pixel circuit layer 106; a first encapsulation layer 107, which is located on the side of the first light-emitting element 103 away from the substrate 105, and along the thickness direction of the display panel 100 (X direction in the figure), the first encapsulation layer 107 at least covers the first light-emitting element 103; a second encapsulation layer 108, which is located on the side of the second light-emitting element 104 away from the substrate 105, and along the thickness direction X of the display panel 100, the second encapsulation layer 108 at least covers the second light-emitting element 104.

[0039] Among them, the substrate 105 can be a flexible substrate or a rigid substrate. The specific substrate material can be selected according to actual design requirements and is not specifically limited in the embodiment of the present invention. The display panel 100 can be a spliced ​​display panel, including a second light-emitting element 104 located in the second display area 102 and a first light-emitting element 103 located in the first display area 101. The first light-emitting element 103 can be a micro-light-emitting element such as a sub-millimeter light-emitting diode (Mini LED) or a micron light-emitting diode (Micro LED). The first light-emitting element 103 can include an N-type semiconductor layer, a P-type semiconductor layer and a quantum well layer located therebetween. The first light-emitting element 103 can also include a film layer such as a current diffusion layer. The specific film layer structure of the first light-emitting element 103 can be selected according to actual design requirements and is not specifically limited in the embodiment of the present invention. The second light-emitting element 104 can be an inorganic light-emitting element, for example, it can be a quantum dot light-emitting diode (QLED). The second light-emitting element 104 includes a light-emitting layer, and the light-emitting layer includes quantum dots. The quantum dot material is usually an inorganic material. The second light-emitting element 104 can also include functional layers such as a hole injection layer, a hole transport layer, an electron injection layer and an electron transport layer, and the materials of these functional layers can be inorganic materials. The specific film structure of the second light-emitting element 104 can be selected according to actual design requirements, and the embodiment of the present invention does not make specific limitations. In order to achieve color display of the display panel 100, the display panel 100 usually includes a red light emitting element, a green light emitting element and a blue light emitting element. Since the traditional red light emitting first light emitting element 103 has a low luminous efficiency, the light peak of the green light emitting first light emitting element 103 will be offset at low brightness, affecting the display effect. However, the blue light emitting first light emitting element 103 has higher luminous stability and higher luminous efficiency. Therefore, the advantages of the good luminous stability of the blue light emitting first light emitting element 103 and the low power consumption and good luminous stability of the red light emitting second light emitting element 104 and the green light emitting second light emitting element 104 are combined to form a display panel. The display panel 100 is also provided with a pixel circuit layer 106, and the pixel circuit layer 106 is provided with a plurality of pixel driving circuits 1061. The pixel driving circuit 1061 is located on one side of the substrate 105. The pixel driving circuit 1061 can be a 2T1C circuit, that is, a circuit with 2 thin film transistors and 1 storage capacitor, or a 7T1C circuit, that is, a circuit with 7 thin film transistors and 1 storage capacitor, etc. The embodiment of the present invention does not limit the specific structure of the pixel driving circuit 1061. The connection structure is electrically connected to the light-emitting element through the pixel driving circuit 1061, and the pixel driving circuit 1061 is used to provide a driving signal to the light-emitting element, thereby ensuring normal display. The driving mode of the first light-emitting element 103 in the display panel 100 can be active driving, such as Figure 2As shown in , the pixel driving circuit 1061 includes a plurality of thin film transistors, which drive the first light-emitting element 103 in an active driving manner and simultaneously drive the second light-emitting element 104. The first light-emitting element 103 and the second light-emitting element 104 adopt the same driving method, which can reduce the difficulty of the manufacturing process and realize the display driving of the display panel 100. Alternatively, the pixel driving circuit 1061 may further include a cathode signal line and an anode signal line, which provide the cathode signal and anode signal required for the first light-emitting element 103 to emit light through the cathode signal line and the anode signal line, thereby driving the first light-emitting element 103 to emit light. The selection of the specific pixel driving circuit 1061 corresponding to the first light-emitting element 103 can be selected according to actual design requirements and is not specifically limited in the embodiment of the present invention. In order to ensure the normal use of the display panel 100, the display panel 100 needs to be encapsulated. A first encapsulation layer 107 is provided on the side of the first light-emitting element 103 away from the substrate 105. Along the thickness direction X of the display panel 100, the first encapsulation layer 107 at least covers the first light-emitting element 103; a second encapsulation layer 108 is provided on the side of the second light-emitting element 104 away from the substrate 105. Along the thickness direction X of the display panel 100, the second encapsulation layer 108 at least covers the second light-emitting element 104. The first encapsulation layer 107 and the second encapsulation layer 108 are both a three-layer encapsulation structure consisting of an inorganic layer-organic layer-inorganic layer. The film layer composition material type in the first encapsulation layer 107 and the second encapsulation layer 108 can be the same. The first encapsulation layer 107 includes a first inorganic layer 1071, a first organic layer 1072 and a second inorganic layer 107, which are sequentially provided along the thickness direction X of the display panel 100. 3. The second encapsulation layer 108 includes a third inorganic layer 1081, a second organic layer 1082, and a fourth inorganic layer 1083, which are sequentially arranged along the thickness direction X of the display panel 100. The first inorganic layer 1071 and the third inorganic layer 1081 are arranged on the same layer, and the second inorganic layer 1073 and the fourth inorganic layer 1083 are arranged on the same layer. By arranging the first organic layer 1072 in the first encapsulation layer 107 and the second organic layer 1082 in the second encapsulation layer 108, the first light-emitting element 103 and the second light-emitting element 104 are independently encapsulated, respectively forming complete independent encapsulation structures, and adjusting the panel-level encapsulation structure in the related art to a pixel-level encapsulation structure or a light-emitting element row / column-level encapsulation structure, thereby reducing the phenomenon of encapsulation failure at a certain point in the entire encapsulation, thereby reducing the overall display effect of the display panel 100. This effectively improves the encapsulation yield of the display panel 100. The first light-emitting element 103 and the second light-emitting element 104 are packaged independently at the same time, and the retaining wall structure corresponding to the first light-emitting element 103 for adjusting the light output is reused as the retaining wall structure of the packaging layer to prevent the organic layer in the packaging layer from overflowing. At the same time, it can effectively reduce the border width of the display panel 100 and improve the display resolution of the spliced ​​display panel 100.

[0040] In the embodiment of the present invention, the first light-emitting element is encapsulated by using a first inorganic encapsulation layer and the second light-emitting element is encapsulated by using a second inorganic encapsulation layer, so that the first light-emitting element and the second light-emitting element are independently encapsulated, thereby reducing the risk of failure of the entire encapsulation of the display panel and improving the encapsulation yield of the display panel. At the same time, the retaining wall structure of the first light-emitting element is reused, reducing the overflow risk of the inorganic layer in the encapsulation layer, effectively reducing the border width of the display panel, and improving the display resolution of the spliced ​​display panel.

[0041] Optional, continue to refer to Figure 2 The display panel 100 also includes: a first passivation layer 109, located on the side of the pixel circuit layer 106 away from the substrate 105; a first conductive layer 110, located on the side of the first passivation layer 109 away from the substrate 105, the first conductive layer 110 includes at least one of a first anode 111 of the first light-emitting element 103 and a second anode 112 of the second light-emitting element 104, the first anode 111 and the second anode 112 are electrically connected to the pixel circuit layer 106 through connecting vias.

[0042] Among them, a first passivation layer 109 is provided on the side of the pixel circuit layer 106 away from the substrate 105. The material of the first passivation layer 109 may include any one or any two or more of silicon oxide, silicon nitride and silicon oxynitride. The first light-emitting element 103 and the second light-emitting element 104 are provided on the side of the first passivation layer 109 away from the substrate 105, so that the first light-emitting element 103 and the second light-emitting element 104 share a first conductive layer 110. The first conductive layer 110 is in direct contact with the first passivation layer 109. The first conductive layer 110 can form a first anode 111 of the first light-emitting element 103 and a second anode 112 of the second light-emitting element 104, respectively. The first conductive layer 110 may include at least one transparent conductive oxide material, for example, indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (InzOs), indium gallium oxide (IGO) or aluminum zinc oxide (AZO). The first anode 111 of the first light emitting element 103 is electrically connected to the pixel driving circuit 1061 in the pixel circuit layer 106 through a connecting via, and the second anode 112 of the second light emitting element 104 is electrically connected to the pixel driving circuit 1061 in the pixel circuit layer 106 through a connecting via. At the same time, the thickness of the display panel 100 is prevented from being too high, thereby reducing the volume of the display panel 100. At the same time, the provision of the first passivation layer 109 can realize the independent packaging of the first light emitting element 103 and the second light emitting element 104, such as Figure 2 As shown, the inorganic film layer in the encapsulation layer close to the substrate 105 can contact the first passivation layer 109 , and the material of the inorganic film layer in the encapsulation layer can be the same as that of the first passivation layer 109 to ensure the encapsulation effect.

[0043] Optional, Figure 3 A structural diagram of another display panel provided by an embodiment of the present invention is shown in FIG. Figure 3 As shown, the display panel also includes: a retaining wall structure layer 113, located on the side of the first passivation layer 109 away from the substrate 105; a plurality of grooves 114 are formed in the retaining wall structure layer 113, and the first light-emitting element 103 is arranged in the groove 114; a reflective metal layer 115, located on the side of the groove 114 away from the substrate 105, and the reflective metal layer 115 is formed on the sidewall of the groove 114.

[0044] Among them, a retaining wall structure layer 113 is arranged on the side of the first passivation layer 109 away from the substrate 105, and the retaining wall structure layer 113 is in contact with the first passivation layer 109. A groove 114 is formed on the retaining wall structure layer 113 through a mask process, and the first light-emitting element 103 is arranged in the groove 114, so that the retaining wall structure layer 113 is arranged around the first light-emitting element 103. Since the sidewall of the formed groove 114 has a certain angle, the light emitted by the first light-emitting element 103 can be adjusted. In order to further improve the light extraction efficiency of the first light-emitting element 103, a reflective metal layer 115 can be formed on the side wall of the groove 114 by thermal evaporation, electron beam evaporation or sputtering. The reflective metal layer 115 can be a metal material with high reflectivity such as silver (Al) or molybdenum (Mo). By reasonably setting the thickness of the reflective metal layer 115, it is fit with the side wall of the groove 114 to ensure the adjustment effect of the light emitted by the first light-emitting element 103, improve the light extraction efficiency of the first light-emitting element 103, and thus ensure the display effect of the display panel 100.

[0045] Optional, continue to refer to Figure 2 and Figure 3 Along the thickness direction X of the display panel 100 , the height H of the retaining wall structure layer 113 is in the range of 9.5 to 10.5 μm.

[0046] Among them, the height of the retaining wall structure layer 113 is reasonably set. Usually, the organic layer in the encapsulation layer is prepared by inkjet printing technology. Along the thickness direction X of the display panel 100, the height of the organic film layer is in the range of 8-9 μm. By setting the height H of the retaining wall structure layer 113 in the range of 9.5 to 10.5 μm, the first encapsulation layer 107 of the first light-emitting element 103 and the second encapsulation layer 108 of the second light-emitting element 104 can be flush, realizing block encapsulation while ensuring the overall thickness of the display panel 100, thereby reducing the volume of the display panel 100.

[0047] Optional, continue to refer to Figure 2 and Figure 3The second light-emitting element 104 includes at least a first sub-light-emitting element 1041 and a second sub-light-emitting element 1042 having different emitting wavelengths. Along the thickness direction X of the display panel 100 , the second encapsulation layer 108 covers at least the first sub-light-emitting element 1041 and the second sub-light-emitting element 1042 .

[0048] In order to realize the color light emission of the display panel 100, considering the difference in light emission effect between the second light emitting element 104 and the first light emitting element 103, the first light emitting element 103 in the display panel 100 is set to be a blue light emitting element, and the second light emitting element 104 is respectively a first sub-light emitting element 1041 and a second sub-light emitting element 1042 having different wavelengths of emitted light, that is, the first sub-light emitting element 1041 can be a red light emitting element, and the second sub-light emitting element 1042 can be a green light emitting element. For example, Figure 2 Alternatively, the first sub-light-emitting element 1041 can be a green light-emitting element, and the second sub-light-emitting element 1042 can be a red light-emitting element. Since the first sub-light-emitting element 1041 and the second sub-light-emitting element 1042 have the same structure, with only the light-emitting film layer being different, during the manufacturing process, the first sub-light-emitting element 1041 and the second sub-light-emitting element 1042 can be encapsulated and covered by the same second encapsulation layer 108 along the thickness direction X of the display panel 100, simplifying the manufacturing process, ensuring the encapsulation effect, and thus ensuring the display effect of the display panel 100.

[0049] Optional, continue to refer to Figure 2 and Figure 3 The display panel 100 further includes a first planarization layer 116 located on the side of the first conductive layer 110 close to the substrate 105, and the first planarization layer 116 includes a first signal line 117; the display panel 100 further includes a pixel definition layer 118, the pixel definition layer 118 is located on the side of the first conductive layer 110 away from the substrate 105, and the pixel definition layer 118 includes a first pixel definition layer 1181 and a second pixel definition layer 1182; the first pixel definition layer 1181 includes a first opening 119, and the first opening 119 defines the formation of the first sub-light emitting element 1041; the second ... first pixel definition layer 1181 includes a first opening 119, and the first pixel definition layer 1181 includes a first opening 119, and the first pixel definition layer 1181 includes a first The pixel definition layer 1182 includes a second opening 120, and the second opening 120 defines the formation of a second sub-light-emitting element 1042; a second conductive layer 121 is located on the side of the pixel definition layer 118 away from the substrate 105, and the second conductive layer 121 includes a first cathode 122 of the first sub-light-emitting element 1041 and a second cathode 123 of the second sub-light-emitting element 1042; an electrode through hole is provided between adjacent first pixel definition layers 1181 and second pixel definition layers 1182, and the first cathode 122 and the second cathode 123 are both electrically connected to the first signal line 117 through the electrode through hole.

[0050] The display panel 100 is further provided with a first planarization layer 116 located on the side of the first conductive layer 110 close to the substrate 105 and in contact with the first conductive layer 110. The first planarization layer 116 can be configured as a single layer or multiple layers comprising an organic material. A first signal line 117 is disposed within the first planarization layer 116. The first signal line 117 is used to transmit a cathode drive signal, thereby ensuring normal light emission from the second light-emitting element 104. The first planarization layer 116 is used to resolve the step difference caused by the first signal line 117, thereby ensuring the structure of the display panel 100. The display panel 100 also includes a pixel definition layer 118 located on the side of the first conductive layer 110 away from the substrate 105. The pixel definition layer 118 can include at least one inorganic insulating material, such as polyimide, polyamide, acrylic resin, benzocyclobutene, or phenolic resin. The pixel definition layer 118 includes a first pixel definition layer 1181 with a first opening 119 and a second pixel definition layer 1182 with a second opening 120. The first opening 119 defines the formation of a first sub-light-emitting element 1041, and the second opening 120 defines the formation of a second sub-light-emitting element 1042. For example, the first sub-light-emitting element 1041 is a red light-emitting element, and the second sub-light-emitting element 1042 is a green light-emitting element. The first opening 119 exposes the first anode 111, and a red light-emitting film layer is provided on the side of the first anode 111 away from the substrate 105, and a first cathode 122 is provided on the side of the red light-emitting film layer away from the substrate 105; the second opening 120 exposes the second anode 112, and a green light-emitting film layer is provided on the side of the second anode 112 away from the substrate 105, and a second cathode 123 is provided on the side of the green light-emitting film layer away from the substrate 105. The first cathode 122 and the second cathode 123 are both formed with electrode through holes by a downward punching process to achieve connection with the first signal line 117, thereby achieving light emission of the first sub-light-emitting element 1041 and the second sub-light-emitting element 1042. The first cathode 122 and the second cathode 123 may include various conductive materials. For example, they may be formed as a multilayer or single layer including at least one of lithium (Li), calcium (Ca), lithium fluoride (LiF), aluminum (Al), magnesium (Mg), silver (Ag), or an alloy including at least two of these materials. The specific material can be selected according to actual design requirements and is not specifically limited in the embodiment of the present invention.

[0051] Further, Figure 4 A schematic diagram of another display panel provided by an embodiment of the present invention is shown in FIG. Figure 4As shown, a second planarization layer 124 can be provided on the side of the first planarization layer 116 close to the substrate 105. Since the first anode 111 and the second anode 112 need to be electrically connected to the pixel circuit layer 106 using a downward punching process, in order to avoid deep drilling that easily causes circuit short-circuit, a second planarization layer 124 can be added for bridging to ensure the electrical connection effect of the first anode 111, the second anode 112 and the pixel circuit layer 106, thereby ensuring the light-emitting effect of the first light-emitting element 103 and the second light-emitting element 104.

[0052] Optional, continue to refer to Figure 2 、 Figure 3 and Figure 4 The first cathode 122 and the second cathode 123 are arranged in the same layer.

[0053] Among them, since the film structure of the first sub-light-emitting element 1041 and the second sub-light-emitting element 1042 is the same, the first cathode 122 and the second cathode 123 can be prepared simultaneously in a one-step preparation process, and the different second light-emitting elements 104 are set with the same cathode, which can ensure that the first sub-light-emitting element 1041 and the second sub-light-emitting element 1042 share an opening, and the opening is wider, thereby making the preparation process of the evaporated cathode simpler, reducing the risk of metal blocking the hole, and ensuring the preparation effect of the display panel 100.

[0054] Optional, Figure 5 A schematic diagram of a top view of a display panel provided by an embodiment of the present invention is shown in FIG. Figure 5 As shown, the display panel 100 further includes a spare first light emitting element 125 , and the first conductive layer 110 further includes a spare anode 126 . The spare first light emitting element 125 is electrically connected to the pixel circuit layer 106 via the spare anode 126 .

[0055] Among them, since the size of the first light-emitting element 103 is small, in order to avoid failure of the first light-emitting element 103 and affect the display effect of the display panel 100, a spare first light-emitting element 125 can be provided around each first light-emitting element 103. The film layer structures of the first light-emitting element 103 and the spare first light-emitting element 125 are the same. The spare anode 126 of the spare first light-emitting element 125 can be provided in the first conductive layer 110, so that the spare anode 126 of the spare first light-emitting element 125 is electrically connected to the pixel driving circuit 1061 in the pixel circuit layer 106, thereby ensuring that the spare first light-emitting element 125 can be used normally, thereby ensuring the display effect of the display panel 100.

[0056] Optional, Figure 6 A schematic top view of another display panel provided by an embodiment of the present invention is shown. Figure 7 A schematic top view of another display panel provided by an embodiment of the present invention is shown. Figure 8 A schematic diagram of a top view of another display panel provided in an embodiment of the present invention is shown in FIG. Figure 5 、 Figure 6 、 Figure 7 and Figure 8 As shown, along a plane perpendicular to the thickness direction of the display panel 100, the display panel 100 includes at least one first light-emitting element 103 and at least one second light-emitting element 104, and along a first direction (such as the X1 direction in the figure), the first light-emitting elements 103 and the second light-emitting elements 104 are arranged at intervals, and the first light-emitting elements 103 are located between adjacent second light-emitting elements 104; along a second direction (such as the X2 direction in the figure), the same first light-emitting elements 103 are arranged at intervals, and the same second light-emitting elements 104 are arranged at intervals, and the first direction X1 intersects with the second direction X2.

[0057] Among them, for the display panel 100 that realizes color display, the display panel 100 includes a first light-emitting element 103 that emits blue light, a first sub-light-emitting element 1041 that emits red light, and a second sub-light-emitting element 1042 that emits green light. Along the first direction X1, the first light-emitting element 103, the first sub-light-emitting element 1041 and the second sub-light-emitting element 1042 are arranged at intervals, and the first direction X1 and the second direction X2 are perpendicular to each other. Figure 6 and Figure 7 As shown, the display panel 100 is not provided with a spare first light-emitting element 125, and the red light-emitting film layer of each first sub-light-emitting element 1041 and the green light-emitting film layer of each second sub-light-emitting element 1042 are separately provided; further, in order to ensure the display effect of the display panel 100, as shown Figure 5 and Figure 8 As shown, the display panel is provided with a spare first light emitting element 125. In order to further simplify the difficulty of the manufacturing process and ensure the display effect of the display panel 100, as shown in FIG. Figure 7 and Figure 8As shown, the red light-emitting film layer of the first sub-light-emitting element 1041 and the green light-emitting film layer of the second sub-light-emitting element 1042 are both continuously arranged along the second direction X2, and the red light-emitting film layer in the same column is correspondingly provided with a plurality of first anodes 111 spaced apart along the second direction X2, and along the thickness direction X of the display panel 100, the red light-emitting film layer overlaps with the first anode 111, so as to realize light emission of each first sub-light-emitting element 1041; the green light-emitting film layer in the same column is correspondingly provided with a plurality of second anodes 112 spaced apart along the second direction X2, and along the thickness direction X of the display panel 100, the green light-emitting film layer overlaps with the second anode 111, so as to realize light emission of each first sub-light-emitting element 1041; The poles 112 overlap to realize the light emission of each second sub-light emitting element 1042; the first light emitting elements 103 are arranged at intervals along the first direction X1, and along the second direction X2, the same first light emitting elements 103 in the same column are arranged at intervals. At the same time, along the first direction X1, the first light emitting elements 103 and the second light emitting elements 104 are arranged at intervals. Along the second direction X2, each first light emitting element 103 in the same column is distributed in blocks, and the second light emitting elements 104 in the same column are distributed in strips, thereby enabling the first light emitting elements 103 and the second light emitting elements 104 to be independently packaged, thereby effectively improving the packaging yield of the display panel 100. At the same time, Figure 5 、 Figure 6 、 Figure 7 and Figure 8 As shown, the first sub-light-emitting element 1041 and the second sub-light-emitting element 1042 can be synchronously set with the first cathode 122 and the second cathode 123. The first cathode 122 and the second cathode 123 are set in the same layer, which reduces the difficulty of preparing the evaporated cathode and reduces the risk of metal blocking to ensure the display effect of the display panel 100.

[0058] Figure 9 The present invention provides a flow chart of a method for manufacturing a display panel according to an embodiment of the present invention. The present invention can be applied to the manufacturing of the display panel according to the above embodiment. Figure 9 As shown, the preparation method comprises:

[0059] S101, providing a substrate.

[0060] S102, preparing a pixel circuit layer on one side of the substrate.

[0061] S103 , disposing a first light-emitting element located in the first display area and a second light-emitting element located in the second display area on a side of the pixel circuit layer away from the substrate.

[0062] Among them, the film layers constituting the first light-emitting element and the second light-emitting element are respectively prepared on one side of the pixel circuit layer, so that the first light-emitting element and the second light-emitting element are arranged at intervals, which is convenient for subsequent block independent packaging.

[0063] S104 , preparing a first encapsulation layer on a side of the first light-emitting element away from the substrate.

[0064] S105 , preparing a second encapsulation layer on a side of the second light-emitting element away from the substrate.

[0065] Among them, the first light-emitting element is covered by the first encapsulation layer for encapsulation protection, and the second light-emitting element is covered by the second encapsulation layer for encapsulation protection. The first encapsulation layer and the second encapsulation layer are both composed of three-layer film layers of inorganic layer-organic layer-inorganic layer. The inorganic layer is prepared by chemical vapor deposition process, and the organic layer is prepared by inkjet printing process. The first encapsulation layer and the second encapsulation layer can be composed of the same material to simplify the difficulty of the preparation process and thereby ensure the display effect of the display panel.

[0066] The embodiment of the present invention realizes independent packaging of the first light-emitting element and the second light-emitting element by respectively packaging the first light-emitting element with the first packaging layer and packaging the second light-emitting element with the second packaging layer, thereby ensuring the packaging yield of the display panel and further ensuring the display effect of the display panel.

[0067] Figure 10 A schematic flow chart of another method for manufacturing a display panel provided by an embodiment of the present invention is shown in FIG. Figure 10 As shown, the preparation method comprises:

[0068] S201, providing a substrate.

[0069] S202, preparing a pixel circuit layer on one side of the substrate.

[0070] S203 , preparing a first passivation layer on a side of the pixel circuit layer away from the substrate.

[0071] The first passivation layer is formed on the side of the pixel circuit layer away from the substrate by using a chemical vapor deposition process. The constituent material of the first passivation layer can be made of silicon nitride or silicon oxide.

[0072] S204 , preparing a first conductive layer on a side of the first passivation layer away from the substrate, wherein the first conductive layer includes at least one of a first anode of the first light-emitting element and a second anode of the second light-emitting element.

[0073] Among them, due to the presence of the first passivation layer, the second light-emitting element and the anode in the first light-emitting element can be prepared on the same layer. By setting the first conductive layer, the first anode constituting the second light-emitting element and the second anode constituting the first light-emitting element are respectively formed on the first conductive layer, thereby ensuring the preparation effect of the display panel and the overall volume of the display panel.

[0074] S205 , disposing a pixel definition layer on a side of the second anode away from the substrate, wherein the pixel definition layer comprises an opening, and along a thickness direction of the display panel, the opening at least partially overlaps with the second anode.

[0075] Among them, the pixel definition layer can be formed by using a spin coating method, and an opening is set on the pixel definition layer. The opening can expose the second anode. At the same time, a light-emitting film layer can be set on the side of the second anode away from the substrate, thereby ensuring the preparation of the second light-emitting element.

[0076] S206 , providing a eutectic layer on a side of the first anode away from the substrate.

[0077] Among them, the cathode and anode of the first light-emitting element itself need to be electrically connected to the substrate electrode on one side of the substrate using a eutectic layer, so as to realize the light emission of the first light-emitting element. The substrate electrode includes the first anode and the cathode corresponding to the cathode of the light-emitting element itself. The eutectic layer can be obtained by a photolithography process. The eutectic layer covers the substrate electrode. The material of the eutectic layer can be a metal mixture such as a silver-tin mixed mixture or a copper-indium mixture.

[0078] S207 , disposing a first light-emitting element on a side of the eutectic layer away from the substrate, wherein the first light-emitting element is connected to the pixel circuit layer through the eutectic layer.

[0079] Among them, the eutectic layer located on one side of the pixel circuit layer is in a molten state after being pressurized and heated. During the transfer process of the first light-emitting element, the cathode and anode of the first light-emitting element itself are in direct contact with the eutectic layer part respectively. After the eutectic layer is solidified, the first light-emitting element and the pixel driving circuit side are stably bonded through the eutectic layer, while ensuring the light emission effect of the first light-emitting element, thereby improving the light emission effect of the display panel.

[0080] S208, disposing a second light-emitting element in the opening.

[0081] S209 , preparing a first encapsulation layer on a side of the first light-emitting element away from the substrate.

[0082] S210 , preparing a second encapsulation layer on a side of the second light-emitting element away from the substrate.

[0083] In the embodiment of the present invention, a first passivation layer is provided to achieve the same-layer preparation of the conductive layers of the first light-emitting element and the second light-emitting element, thereby facilitating the subsequent block packaging of the first light-emitting element and the second light-emitting element, thereby ensuring the packaging yield of the display panel. At the same time, a eutectic layer is provided between the first light-emitting element and the first conductive layer to ensure the connection effect between the first light-emitting element and one side of the pixel circuit layer, thereby ensuring the display effect of the display panel.

[0084] Figure 11 A schematic flow chart of another method for manufacturing a display panel provided by an embodiment of the present invention is shown in FIG. Figure 11 As shown, the preparation method comprises:

[0085] S301, providing a substrate.

[0086] S302, preparing a pixel circuit layer on one side of the substrate.

[0087] S303 , preparing a first passivation layer on a side of the pixel circuit layer away from the substrate.

[0088] S304 , preparing a first conductive layer on a side of the first passivation layer away from the substrate, wherein the first conductive layer includes at least one of a first anode of the first light-emitting element and a second anode of the second light-emitting element.

[0089] S305 , disposing a pixel definition layer on a side of the second anode away from the substrate, wherein the pixel definition layer comprises an opening, and along a thickness direction of the display panel, the opening at least partially overlaps with the second anode.

[0090] S306 , forming a eutectic layer on a side of the first anode away from the substrate.

[0091] S307 , disposing a first light-emitting element on a side of the eutectic layer away from the substrate, wherein the first light-emitting element is connected to the pixel circuit layer through the eutectic layer.

[0092] S308 , preparing a retaining wall structure layer on a side of the first passivation layer away from the substrate, forming a plurality of grooves in the retaining wall structure layer, and disposing first light-emitting elements in the grooves.

[0093] The retaining wall structure layer is provided and patterned to form a groove, so that the groove surrounds the first light-emitting element. The sidewalls of the groove modulate the light emitted by the first light-emitting element, thereby improving the light emission effect of the first light-emitting element. The retaining wall structure layer is also reused as a supporting retaining wall for the encapsulation layer, preventing leakage of the encapsulation layer, reducing the border width of the display panel, and improving the display resolution of the spliced ​​display panel.

[0094] S309 , forming a second anode protection layer on a side of the first conductive layer away from the substrate, wherein the second anode protection layer at least partially overlaps the second anode along a thickness direction of the display panel.

[0095] S310 , preparing a reflective metal layer on a side of the groove away from the substrate, wherein the reflective metal layer is formed on a sidewall of the groove.

[0096] Among them, in order to ensure the light extraction efficiency of the first light-emitting element, a reflective metal layer can be set on the side wall of the groove in the retaining wall structure layer. However, in order to avoid the risk of the second anode of the second light-emitting element arranged in the same layer being etched by the reflective metal layer during the preparation, before preparing the reflective metal layer, a second anode protection layer is formed on the side of the first conductive layer away from the substrate to perform second anode protection to ensure the preparation effect of the display panel.

[0097] S311, set a second light-emitting element in the opening.

[0098] S312, preparing a first encapsulation layer on a side of the first light-emitting element away from the substrate.

[0099] S313 , preparing a second encapsulation layer on a side of the second light-emitting element away from the substrate.

[0100] In an embodiment of the present invention, a retaining wall structure layer is provided, a groove is provided in the retaining wall structure layer, a first light-emitting element is provided in the groove, and a reflective metal layer is provided on the inner wall of the groove. The reflective metal layer adjusts the light emitted by the first light-emitting element, thereby improving the light extraction efficiency of the first light-emitting element and ensuring the display effect of the display panel.

[0101] Figure 12 A schematic flow chart of another method for manufacturing a display panel provided by an embodiment of the present invention is shown in FIG. Figure 12 As shown, the preparation method comprises:

[0102] S401, providing a substrate.

[0103] S402, preparing a pixel circuit layer on one side of the substrate.

[0104] S403 , preparing a first passivation layer on a side of the pixel circuit layer away from the substrate.

[0105] S404: Prepare a first conductive layer on a side of the first passivation layer away from the substrate, wherein the first conductive layer includes at least one of a first anode of the first light-emitting element and a second anode of the second light-emitting element.

[0106] S405 , disposing a pixel definition layer on a side of the second anode away from the substrate, wherein the pixel definition layer comprises an opening, and along a thickness direction of the display panel, the opening at least partially overlaps with the second anode.

[0107] S406 , forming a eutectic layer on a side of the first anode away from the substrate.

[0108] S407 , disposing a first light-emitting element on a side of the eutectic layer away from the substrate, wherein the first light-emitting element is connected to the pixel circuit layer through the eutectic layer.

[0109] S408 , preparing a retaining wall structure layer on a side of the first passivation layer away from the substrate, forming a plurality of grooves in the retaining wall structure layer, and disposing first light-emitting elements in the grooves.

[0110] S409 , forming a second anode protection layer on a side of the first conductive layer away from the substrate, wherein the second anode protection layer at least partially overlaps the second anode along a thickness direction of the display panel.

[0111] S410 , preparing a reflective metal layer on a side of the groove away from the substrate, wherein the reflective metal layer is formed on a sidewall of the groove.

[0112] S411, removing the second anode protection layer.

[0113] After the reflective metal layer is prepared, the second anode protection layer can be removed by immersion in a solvent so as to facilitate the subsequent preparation of the second light-emitting element.

[0114] S412, preparing a light-emitting layer on a side of the second anode away from the substrate by using a stripe printing process.

[0115] Among them, for the second light-emitting elements of the same column and the same light-emitting color, a strip printing process can be used to print the light-emitting layer, which simplifies the difficulty of the preparation process, reduces the uneven preparation of the film layer, and facilitates subsequent packaging to ensure the display effect of the display panel.

[0116] S413, preparing a second cathode on the side of the light-emitting layer away from the substrate to form a second light-emitting element.

[0117] Among them, a second cathode is arranged on the side of the light-emitting layer away from the substrate. The material of the second cathode can be at least one of lithium (Li), calcium (Ca), lithium fluoride (LiF), aluminum (Al), magnesium (Mg), and silver (Ag). Along the thickness direction of the display panel, the second cathode and the second anode are arranged to overlap. At the same time, since the second anode of each second light-emitting element is independently arranged, in order to simplify the difficulty of the preparation process, the second cathode can be evaporated in the entire layer, reducing the difficulty of the preparation process. At the same time, the second cathode arranged in the entire layer can be electrically connected to the cathode signal line by punching, thereby ensuring the luminous effect of the second light-emitting element.

[0118] S414: Prepare a first encapsulation layer on a side of the first light-emitting element away from the substrate.

[0119] S415 , preparing a second encapsulation layer on a side of the second light-emitting element away from the substrate.

[0120] The embodiment of the present invention reduces the difficulty of the manufacturing process by printing the light-emitting layers of the second light-emitting elements in the same column in strip shape, thereby ensuring the display effect of the display panel.

[0121] In an optional embodiment, Figures 9-12The process steps of preparing the first encapsulation layer and the process steps of preparing the second encapsulation layer in the flow diagram of any of the display panel preparation methods shown are completed in the same process step. The process of forming the first encapsulation layer and the second encapsulation layer using the same process step may include: first, forming a first inorganic film layer, the first inorganic film layer including the first inorganic layer 1071 of the first encapsulation layer 107 and the third inorganic layer 1081 of the second encapsulation layer 108, the first inorganic layer 1071 and the third inorganic layer 1081 extending to each other and connected to form the same film layer; secondly, an organic film layer may be formed by inkjet printing, the organic film layer including the first organic layer 1072 in the first encapsulation layer 107 and the second organic layer 1082 in the second encapsulation layer 108, wherein the first organic layer 1072 is located on the first inorganic layer 1071 and filled in the groove of the retaining wall structure layer 113 , the retaining wall structure layer 113 prevents the first organic layer 1072 from overflowing or flowing to other positions, the second organic layer 1082 is located on the third inorganic layer 1081 and is located in the groove of the retaining wall structure layer 113, the retaining wall structure layer 113 prevents the second organic layer 1082 from overflowing or flowing to other positions, the first organic layer 1072 and the second organic layer 1082 are independently arranged and not connected to each other; again, a second inorganic film layer is formed, which includes the second inorganic layer 1073 in the first encapsulation layer 107 and the fourth inorganic layer 1083 in the second encapsulation layer 108, and the second inorganic layer 1073 and the fourth inorganic layer 1083 can extend to each other and be connected to form the same film layer. The first inorganic film layer and the second inorganic film layer can contact each other, and the position where the first inorganic film layer and the second inorganic film layer contact each other can be located between the adjacent first organic layer 1072 and the second organic layer 1082, thereby forming a first encapsulation layer 107 and a second encapsulation layer 108 that are independently encapsulated from each other. Each of the first encapsulation layer 107 and the second encapsulation layer 108 includes a stacked structure of inorganic layer / organic layer / inorganic layer, and at the edge of the encapsulation layer, the inorganic layer at the bottom layer and the inorganic layer at the top layer are in contact with each other to form a complete encapsulation structure.

[0122] Figure 13 A schematic structural diagram of a display device provided by an embodiment of the present invention is shown in FIG. Figure 13 As shown, the display device 200 includes the display panel 100 described in the above embodiment.

[0123] It should be noted that since the display device provided in this embodiment has the same or corresponding beneficial effects as the display panel of the above embodiment, no further description is given here. The display device 200 provided in this embodiment of the present invention can be Figure 13The mobile phone shown can also be any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop monitors, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, medical equipment, industrial control equipment, touch interactive terminals, etc. The embodiments of the present invention do not specifically limit this.

[0124] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A display panel, characterized in that: The display panel includes a first display area and a second display area, the first display area is provided with a first light-emitting element, and the second display area is provided with a second light-emitting element; The display panel further includes: substrate; A pixel circuit layer is provided on one side of the substrate; the first light-emitting element and the second light-emitting element are both located on one side of the pixel circuit layer; a first encapsulation layer, located on a side of the first light-emitting element away from the substrate, and covering at least the first light-emitting element along a thickness direction of the display panel; the first encapsulation layer comprises a first organic layer; a second encapsulation layer, located on a side of the second light-emitting element away from the substrate, and covering at least the second light-emitting element along the thickness direction of the display panel; the second encapsulation layer comprises a second organic layer, and the first organic layer and the second organic layer are independently provided and not connected to each other; The display panel further includes a retaining wall structure layer and a pixel definition layer, wherein the retaining wall structure layer is located on a side of the pixel circuit layer away from the substrate, and the pixel definition layer is located on a side of the pixel circuit layer away from the substrate; Along the thickness direction of the display panel, the height of the retaining wall structure layer is greater than the height of the pixel definition layer.

2. The display panel according to claim 1, wherein: The display panel further includes: a first passivation layer, located on a side of the pixel circuit layer away from the substrate; A first conductive layer is located on a side of the first passivation layer away from the substrate, the first conductive layer includes at least one of a first anode of the first light-emitting element and a second anode of the second light-emitting element, and the first anode and the second anode are electrically connected to the pixel circuit layer through connecting vias.

3. The display panel according to claim 2, wherein: The retaining wall structure layer is located on a side of the first passivation layer away from the substrate; A plurality of grooves are formed in the retaining wall structure layer, and the first light-emitting elements are arranged in the grooves; The reflective metal layer is located on a side of the groove away from the substrate, and the reflective metal layer is formed on a sidewall of the groove.

4. The display panel according to claim 2, wherein: The second light emitting element comprises at least a first sub-light emitting element and a second sub-light emitting element having different wavelengths of emitted light. Along the thickness direction of the display panel, the second encapsulation layer at least covers the first sub-light-emitting element and the second sub-light-emitting element.

5. The display panel according to claim 4, wherein: The display panel further includes a first planarization layer located on a side of the first conductive layer close to the substrate, the first planarization layer including a first signal line; The pixel definition layer is located on a side of the first conductive layer far from the substrate, and the pixel definition layer includes a first pixel definition layer and a second pixel definition layer; The first pixel definition layer includes a first opening, and the first opening defines and forms the first sub-light emitting element; The second pixel definition layer includes a second opening, and the second opening defines and forms the second sub-light emitting element; a second conductive layer located on a side of the pixel definition layer away from the substrate, the second conductive layer comprising a first cathode of the first sub-light emitting element and a second cathode of the second sub-light emitting element; An electrode through-hole is provided between the adjacent first pixel definition layer and the second pixel definition layer, and the first cathode and the second cathode are both electrically connected to the first signal line through the electrode through-hole.

6. The display panel according to claim 5, wherein: The first cathode and the second cathode are arranged in the same layer.

7. The display panel according to claim 2, wherein: The display panel further includes a spare first light emitting element, the first conductive layer further includes a spare anode, and the spare first light emitting element is electrically connected to the pixel circuit layer via the spare anode.

8. The display panel according to claim 3, wherein: Along the thickness direction of the display panel, the height of the retaining wall structure layer is in the range of 9.5 to 10.5 μm.

9. The display panel according to claim 3, wherein: In a plane perpendicular to the thickness direction of the display panel, the display panel includes at least one first light-emitting element and at least one second light-emitting element. Along a first direction, the first light-emitting elements and the second light-emitting elements are arranged at intervals, and the first light-emitting elements are located between adjacent second light-emitting elements. Along a second direction, the same first light-emitting elements are arranged at intervals, and the same second light-emitting elements are arranged at intervals, and the first direction intersects the second direction.

10. A method for preparing a display panel, characterized in that: The preparation method comprises: providing a substrate; preparing a pixel circuit layer on one side of the substrate; A first light-emitting element located in a first display area and a second light-emitting element located in a second display area are provided on a side of the pixel circuit layer away from the substrate; Prepare a first encapsulation layer on a side of the first light-emitting element away from the substrate, wherein the first encapsulation layer includes a first organic layer; A second encapsulation layer is formed on a side of the second light-emitting element away from the substrate, wherein the second encapsulation layer includes a second organic layer, and the first organic layer and the second organic layer are independently provided and not connected to each other; In which, the display panel also includes a retaining wall structure layer and a pixel definition layer, the retaining wall structure layer is located on the side of the pixel circuit layer away from the substrate, and the pixel definition layer is located on the side of the pixel circuit layer away from the substrate; along the thickness direction of the display panel, the height of the retaining wall structure layer is greater than the height of the pixel definition layer.

11. The method for manufacturing a display panel according to claim 10, wherein: Before arranging the first light-emitting element and the second light-emitting element on the side of the pixel circuit layer away from the substrate, the method further includes: forming a first passivation layer on a side of the pixel circuit layer away from the substrate; A first conductive layer is formed on a side of the first passivation layer away from the substrate, wherein the first conductive layer includes at least one of a first anode of the first light-emitting element and a second anode of the second light-emitting element; A first light-emitting element located in a first display area and a second light-emitting element located in a second display area are provided on a side of the pixel circuit layer away from the substrate, comprising: A pixel definition layer is provided on a side of the second anode away from the substrate, wherein the pixel definition layer includes an opening, and along a thickness direction of the display panel, the opening at least partially overlaps with the second anode; Disposing a eutectic layer on a side of the first anode away from the substrate; The first light-emitting element is arranged on a side of the eutectic layer away from the substrate, and the first light-emitting element is connected to the pixel circuit layer through the eutectic layer; The second light emitting element is disposed in the opening.

12. The method for manufacturing a display panel according to claim 11, wherein: After the first light-emitting element is provided on a side of the eutectic layer away from the substrate, the method further includes: A retaining wall structure layer is formed on a side of the first passivation layer away from the substrate, wherein a plurality of grooves are formed in the retaining wall structure layer, and the first light-emitting elements are disposed in the grooves; forming a second anode protection layer on a side of the first conductive layer away from the substrate, wherein the second anode protection layer at least partially overlaps the second anode along a thickness direction of the display panel; A reflective metal layer is prepared on a side of the groove away from the substrate, and the reflective metal layer is formed on a sidewall of the groove.

13. The method for manufacturing a display panel according to claim 12, wherein: The second light emitting element is arranged in the opening, comprising: removing the second anode protective layer; A light-emitting layer is prepared on the side of the second anode away from the substrate by using a stripe printing process; A second cathode is prepared on the side of the light-emitting layer away from the substrate to form the second light-emitting element.

14. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 9.

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