Substrate, display panel, and method for fabricating the display panel

Abstract

This application discloses a substrate, a display panel, and a method for fabricating the display panel. The substrate includes: a display area and a non-display area at least partially surrounding the display area; a substrate; a circuit layer located on one side of the substrate; a pixel definition layer located on the side of the circuit layer facing away from the substrate, and the pixel definition layer is located in the display area; a plurality of first support portions and a plurality of second support portions, the first support portions being located in the display area and on the side of the pixel definition layer facing away from the circuit layer; the second support portions being located in the non-display area and on the side of the circuit layer facing away from the substrate; a first metal layer and a second metal layer, at least a portion of the first metal layer being located on the side of the first support portions facing away from the circuit layer; at least a portion of the second metal layer being located on the side of the second support portions facing away from the circuit layer. The substrate disclosed in this application, through the first metal layer and the second metal layer, hinders the conduction of electrostatic energy to the circuit layer, thereby reducing the risk of electrostatic damage to the circuitry of the display panel.

Description

Technical Field

[0001] This application relates to the field of display panel manufacturing technology, and in particular to a substrate, a display panel, and a method for preparing the display panel. Background Technology

[0002] When manufacturing a display panel, a photomask is used to fabricate the light-emitting devices, and a support structure is usually set up to support the photomask. During the process of the photomask contacting and separating from the support structure, static electricity is generated between the photomask and the support structure, which can damage the circuitry of the underlying array substrate. Summary of the Invention

[0003] This application provides a substrate, a display panel, and a method for manufacturing the display panel, which can reduce the risk of electrostatic damage to the circuitry of the display panel.

[0004] In a first aspect, a substrate is provided, comprising: a display area and a non-display area at least partially surrounding the display area; a substrate; and a circuit layer located on one side of the substrate; a pixel definition layer located on the side of the circuit layer opposite to the substrate, and the pixel definition layer being located in the display area; a plurality of first supports and a plurality of second supports, the first supports being located in the display area and on the side of the pixel definition layer opposite to the circuit layer; the second supports being located in the non-display area and on the side of the circuit layer opposite to the substrate; a first metal layer and a second metal layer, at least a portion of the first metal layer being located on the side of the first supports opposite to the circuit layer; and at least a portion of the second metal layer being located on the side of the second supports opposite to the circuit layer.

[0005] In a second aspect, a display panel is provided, including the substrate of the first aspect of this application.

[0006] Thirdly, a method for fabricating a display panel is provided, for fabricating the display panel of the second aspect of this application. The method for fabricating the display panel includes: obtaining a substrate; fabricating a circuit layer on one side of the substrate; fabricating a pixel definition layer on the side of the circuit layer away from the substrate within a display area, and making the pixel definition layer have pixel openings; fabricating a first support portion on the side of the pixel definition layer away from the circuit layer within the display area; fabricating a second support portion on the side of the circuit layer away from the substrate within a non-display area; fabricating a first metal layer on the side of the first support portion away from the pixel definition layer, and simultaneously fabricating a second metal layer on the side of the second support portion away from the circuit layer; fabricating a light-emitting material at the pixel openings within the display area; and fabricating a vapor deposition layer, such that the vapor deposition layer covers the first metal layer, the second metal layer, and the light-emitting material.

[0007] The substrate, display panel, and method for fabricating the display panel provided in this application embodiment are provided with a first metal layer disposed between a first support portion and a vapor deposition layer, and a second metal layer disposed between a second support portion and a vapor deposition layer. When the mask plate comes into contact with the first and second support portions and generates static electricity, the static electricity can be prevented from being further conducted to the circuit layer below by the first and second metal layers, thereby reducing the risk of damage to the circuit layer due to static electricity. Attached Figure Description

[0008] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0009] Figure 1 This is a planar schematic diagram of a substrate according to an embodiment of this application.

[0010] Figure 2 for Figure 1 A cross-sectional view of the substrate at section AA according to an embodiment of this application.

[0011] Figure 3 This is a schematic diagram of the contact between the substrate and the mask plate in an embodiment of this application.

[0012] Figure 4 for Figure 1 Another cross-sectional view of the substrate AA section of the embodiment of this application.

[0013] Figure 5 for Figure 1 Another cross-sectional view of the substrate AA section of the embodiment of this application.

[0014] Figure 6 This is a schematic diagram of an interlayer structure of a display panel according to an embodiment of this application.

[0015] Figure 7 This is a schematic diagram of another interlayer structure of the display panel according to an embodiment of this application.

[0016] Figure 8 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application.

[0017] Figure label:

[0018] 110. Substrate;

[0019] 120. Circuit layer;

[0020] 130. Pixel definition layer; 131. Pixel aperture;

[0021] 140. Light-emitting device; 141. Anode layer; 142. Organic light-emitting layer; 143. Cathode layer; 144. Hole transport layer; 145. Electron transport layer;

[0022] 150. Evaporated coating;

[0023] 160. Planarization layer;

[0024] 170. Encapsulation layer;

[0025] 180. Cover plate;

[0026] 210. First support section;

[0027] 220. Second support section;

[0028] 230. First metal layer;

[0029] 240. Second metal layer;

[0030] 250. Third metal layer;

[0031] 260. Fourth metal layer;

[0032] 300. Photomask;

[0033] AA, display area; NA, non-display area. Detailed Implementation

[0034] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description in order to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples thereof.

[0035] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The embodiments will now be described in detail with reference to the accompanying drawings.

[0036] Relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0037] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0038] Furthermore, the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0039] It should be understood that in the embodiments of this application, "B corresponding to A" means that B is associated with A, and B can be determined based on A. However, it should also be understood that determining B based on A does not mean that B is determined solely based on A; B can also be determined based on A and / or other information.

[0040] The applicant discovered that in the fabrication of display panels, a circuit layer is first fabricated on a substrate, and then light-emitting devices are fabricated on the circuit layer. During the fabrication of the light-emitting devices, a photomask is used. To stabilize the photomask, multiple support structures are placed on the side of the circuit layer facing away from the substrate. During the fabrication of the light-emitting devices, the photomask comes into contact with and separates from the support structures, generating static electricity through friction. When this static electricity accumulates to a certain level, it can break down the insulating layer above the circuit layer, causing damage to the circuit layer and resulting in a lower yield rate for the display panel.

[0041] Based on the above analysis, the applicant proposes a substrate, a display panel, and a method for fabricating the display panel. The substrate includes a substrate layer, a circuit layer, and a pixel definition layer stacked sequentially. A first support portion and a second support portion are disposed on the side of the pixel definition layer facing away from the substrate. A first metal layer covering a portion of the first support portion and a second metal layer covering a portion of the second support portion are disposed. When a mask contacts and separates from the first and second support portions and generates static electricity, the first and second metal layers can prevent the static electricity from continuing to conduct downwards along the thickness direction of the substrate, thereby reducing the possibility of static electricity damaging the circuit layer.

[0042] Figure 1 This is a planar schematic diagram of a substrate according to an embodiment of this application. Figure 2 for Figure 1 A cross-sectional view of the substrate at section AA according to an embodiment of this application. Figure 3 This is a schematic diagram of the contact between the substrate and the mask plate in an embodiment of this application.

[0043] Please see Figures 1 to 3 This application provides a substrate, including: a display area AA and a non-display area NA at least partially surrounding the display area AA; a substrate 110; and a circuit layer 120 located on one side of the substrate 110; a pixel definition layer 130 located on the side of the circuit layer 120 opposite to the substrate 110, and the pixel definition layer 130 located in the display area AA; a plurality of first support portions 210 and a plurality of second support portions 220, the first support portions 210 being located in the display area AA, and the first support portions 210 being located on the side of the pixel definition layer 130 opposite to the circuit layer 120; the second support portions 220 being located in the non-display area NA, and the second support portions 220 being located on the side of the circuit layer 120 opposite to the substrate 110; a first metal layer 230 and a second metal layer 240, at least a portion of the first metal layer 230 being located on the side of the first support portion 210 opposite to the circuit layer 120; at least a portion of the second metal layer 240 being located on the side of the second support portion 220 opposite to the circuit layer 120.

[0044] The substrate of this application embodiment is used to fabricate an organic light-emitting diode (OLED) display panel. The substrate of this application embodiment is a structure during the fabrication process of the display panel; at this stage, the circuitry of the display panel has been largely completed, but the light-emitting devices of the display panel have not yet been fabricated.

[0045] In this embodiment, the display area AA corresponds to the display area AA of the display panel and is used for displaying light emission. In this embodiment, the non-display area NA surrounds the display area AA and corresponds to the non-display area NA of the display panel, similar to signal traces, such as traces in a driving circuit.

[0046] The substrate 110 can be formed from polymeric materials such as glass, polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyaryl compounds (PAR), or glass fiber reinforced plastic (FRP). The substrate 110 can be transparent, translucent, or opaque. In the embodiments of this application, the substrate 110 can also be a flexible substrate formed from a thin polymer, such as polyimide.

[0047] The circuit layer 120 is located on one side of the substrate 110 and is used as the control circuit of the display panel. It may include pixel circuits located in the display area AA and driving circuits located in the non-display area NA.

[0048] The pixel definition layer 130 located in the display area AA includes a plurality of pixel openings 131, which define the position and size of the light-emitting devices of the display panel.

[0049] The first support portion 210 is disposed within the display area AA, located on the side of the pixel definition layer 130 opposite to the circuit layer 120. The second support portion 220 is disposed within the non-display area NA, located on the side of the circuit layer 120 opposite to the substrate 110. When fabricating the light-emitting device of the display panel using the mask 300, the first support portion 210 and the second support portion 220 together support the mask 300 to keep the mask 300 in a stable state.

[0050] The first metal layer 230 is disposed on the side of the first support portion 210 facing away from the substrate 110, and is used to attract static electricity generated when the first support portion 210 contacts the mask 300, and to prevent the static electricity from being further conducted to the circuit layer 120. Similarly, the second metal layer 240 is disposed on the side of the second support portion 220 facing away from the substrate 110, and is used to attract static electricity generated when the second support portion 220 contacts the mask 300, and to prevent the static electricity from being further conducted to the circuit layer 120. Therefore, by providing the first metal layer 230 and the second metal layer 240, the substrate of this embodiment can effectively reduce the risk of damage to the circuit layer 120 caused by static electricity generated when the mask 300 contacts the first support portion 210 and the second support portion 220. Static electricity can be directly stored in the first metal layer 230 and the second metal layer 240, or the first metal layer 230 and the second metal layer 240 can be electrically connected to other conductive layers of the display panel to conduct the static electricity away from the first metal layer 230 and the second metal layer 240. After the light-emitting material of the light-emitting device is fabricated using the mask 300, an evaporation layer covering the first metal layer 230 and the second metal layer 240 can be prepared by evaporation. Then, an encapsulation layer 170 is fabricated to cover the evaporation layer, thereby preventing the first metal layer 230 and the second metal layer 240 from affecting the signal transmission inside the display panel.

[0051] Further reading Figure 2 The first metal layer 230 covers a portion of the first support portion 210, and the first metal layer 230 is spaced apart from the pixel definition layer 130.

[0052] Both the first metal layer 230 and the first support portion 210 are located in the display area AA. To ensure the normal display of the display area AA, both the first metal layer 230 and the first support portion 210 are located in the area covered by the pixel definition layer 130. The first metal layer 230 only covers a portion of the first support portion 210 and is spaced apart from the pixel definition layer 130, so that the orthographic projection of the first metal layer 230 onto the pixel definition layer 130 is located in the area covered by the pixel definition layer 130, and does not cover the area of ​​the pixel opening 131 corresponding to the pixel definition layer 130, thereby avoiding the first metal layer 230 and the first support portion 210 from affecting the subsequent fabrication of the light-emitting device. During the fabrication of the light-emitting device through the mask 300, the static electricity generated between the mask 300 and the first support portion 210 will accumulate in the first metal layer 230, thereby preventing the static electricity from being conducted to the circuit layer 120, thus achieving the purpose of protecting the circuit layer 120.

[0053] Further reading Figure 2 The first support structure includes a first top surface and a first side surface. The first top surface is perpendicular to the thickness direction of the substrate, and the first side surface is inclined or parallel to the thickness direction of the substrate. The first metal layer 230 covers at least a portion of the first top surface, and the first side surface is exposed relative to the first metal layer 230.

[0054] Considering that the first support portion 210 is located between the pixel openings 131 of the pixel definition layer 130, the cross-sectional shape of the first support portion 210 along the plane perpendicular to the substrate 110 can be regarded as a rectangle or a trapezoid with a narrower end away from the substrate 110. In this case, the surface corresponding to the end of the first support portion 210 away from the substrate 110 is the first top surface, and the side surface of the first support portion 210 is the first side surface. The first metal layer 230 covers at least a portion of the first top surface so that the static electricity between the first support portion 210 and the mask 300 can be smoothly absorbed by the first metal layer 230. The first metal layer 230 only covers a portion of the first side surface to avoid the first metal layer 230 obscuring the pixel openings 131 of the pixel definition layer 130.

[0055] Further reading Figure 2 The second metal layer 240 covers a portion of the second support portion 220, and the second metal layer 240 is spaced apart from the circuit layer 120.

[0056] The arrangement of the second metal layer 240 and the second support portion 220 can be similar to that of the first metal layer 230 and the first support portion 210. The second metal layer 240 only covers a portion of the second support portion 220 and is spaced apart from the circuit layer 120, such that the orthographic projection of the second metal layer 240 onto the circuit layer 120 lies within the area covered by the second support portion 220. This prevents the second metal layer 240 from covering the circuit layer 120, thus avoiding the conduction of static electricity to the circuit layer 120 via the second metal layer 240. During the fabrication of the light-emitting device using the mask 300, static electricity generated between the mask 300 and the second support portion 220 accumulates within the second metal layer 240, thereby hindering the conduction of static electricity to the circuit layer 120 and protecting the circuit layer 120.

[0057] Further reading Figure 2 The second support structure includes a second top surface and a second side surface. The second top surface is perpendicular to the thickness direction of the substrate, and the second side surface is inclined or parallel to the thickness direction of the substrate. The second metal layer 240 covers at least a portion of the second top surface, and the second side surface is exposed relative to the second metal layer 240.

[0058] Similarly, along a cross-section of the plane perpendicular to the substrate 110, the cross-sectional shape of the second support portion 220 can be considered as a rectangle or a trapezoid with a narrower end away from the substrate 110. In this case, the surface corresponding to the end of the second support portion 220 away from the substrate 110 is the second top surface, and the side surface of the second support portion is the second side surface. The second metal layer 240 covers at least a portion of the second top surface so that static electricity between the second support portion 220 and the mask 300 can be readily absorbed by the second metal layer 240. The second metal layer 240 only covers a portion of the second side surface to prevent static electricity from being conducted to the circuit layer 120 via the second metal layer 240.

[0059] Figure 4 for Figure 1 Another cross-sectional view of the substrate AA section of the embodiment of this application.

[0060] Further, please refer to Figure 4 The second metal layer 240 completely covers the second support portion 220.

[0061] The arrangement of the second metal layer 240 and the second support portion 220 may differ from that of the first metal layer 230 and the first support portion 210. The second metal layer 240 completely covers the second support portion 220 and forms an electrical connection with the circuit layer 120. During the fabrication of the light-emitting device using the mask 300, static electricity generated between the mask 300 and the second support portion 220 accumulates in the second metal layer 240 and is introduced into specific signal lines of the circuit layer 120 via the second metal layer 240. At this time, the signal line can be grounded or assigned a value to dissipate the static electricity and prevent it from affecting other circuits in the circuit layer 120, including the driving circuit and pixel circuit, thereby protecting the circuit layer 120.

[0062] Figure 5 for Figure 1 Another cross-sectional view of the substrate AA section of the embodiment of this application.

[0063] Further, please refer to Figure 5 The circuit layer 120 includes a third metal layer 250 and a fourth metal layer 260; the third metal layer 250 is located in the display area AA, and the fourth metal layer 260 is located in the non-display area NA. The third metal layer 250 and the fourth metal layer 260 are insulated from each other and are disposed on the same layer; the second metal layer 240 covers the second support portion 220 and at least part of the fourth metal layer 260.

[0064] Both the third metal layer 250 and the fourth metal layer 260 are part of the circuit layer 120. The third metal layer 250 is disposed in the display area AA, and the fourth metal layer 260 is disposed in the non-display area NA. The third metal layer 250 and the fourth metal layer 260 are on the same layer and can be manufactured simultaneously. The third metal layer 250 can be used for pixel circuits in the circuit layer 120, while the fourth metal layer 260 is electrically connected to the second metal layer 240 to conduct static electricity generated between the second support 220 and the mask 300. The third metal layer 250 and the fourth metal layer 260 are insulated from each other, which effectively prevents static electricity from the fourth metal layer 260 from affecting the third metal layer 250, thereby reducing the risk of static electricity affecting the original function of the circuit layer 120.

[0065] Further reading Figure 5 The pixel definition layer 130 includes a plurality of pixel openings 131 arranged in an array; on the plane where the substrate 110 is located, the orthographic projection of the third metal layer 250 overlaps with the orthographic projection of the pixel openings 131.

[0066] The third metal layer 250 can be an anode layer, and the anodes of the light-emitting devices in the display panel are all located in the anode layer. Considering that the third metal layer 250, as the anode layer, only needs to be set in the display area AA, when fabricating the third metal layer 250, a fourth metal layer 260 can be fabricated simultaneously in the non-display area NA to remove the static electricity led out from the second metal layer 240, thereby preventing the static electricity from being conducted to other metal layers (such as scan line layers or data line layers in the driving circuit) on the side of the third metal layer 250 or the fourth metal layer 260 near the substrate 110, thus protecting the circuit layer 120.

[0067] Further reading Figure 5 The first metal layer 230 and the second metal layer 240 are disposed in the same layer.

[0068] Considering that the first metal layer 230 is located in the display area AA and the second metal layer 240 is located in the non-display area NA, and that the first metal layer 230 covers at least a portion of the first support portion 210 and the second metal layer 240 covers at least a portion of the second support portion 220, the first metal layer 230 and the second metal layer 240 can be disposed on the same layer and manufactured simultaneously in one process. This not only simplifies the process flow but also reduces the thickness of the display panel.

[0069] This application also provides a display panel, including the substrate of the foregoing embodiments of this application. To obtain the display panel of this application, a light-emitting material and subsequent film layers need to be fabricated on the substrate of the foregoing embodiments of this application to form the display panel.

[0070] Figure 6 This is a schematic diagram of an interlayer structure of a display panel according to an embodiment of this application.

[0071] Please see Figure 6The display panel in this embodiment further includes a light-emitting device layer located on the side of the circuit layer 120 facing away from the substrate 110. Multiple arrays of light-emitting devices 140 arranged in the light-emitting device layer are located at pixel openings 131 of the pixel definition layer 130. An anode, an organic light-emitting layer 142, and a cathode form the light-emitting device 140. The anode is located in the anode layer 141, which is disposed between the circuit layer 120 and the pixel definition layer 130, and is electrically connected to the pixel circuitry of the circuit layer 120. The organic light-emitting layer 142 is disposed at the pixel opening 131, on the side of the anode layer 141 facing away from the circuit layer 120. A cathode layer 143 covers the organic light-emitting layer 142. The light-emitting device layer also includes a hole transport layer 144 and an electron transport layer 145. The organic light-emitting layer 144 is located on the surface of the anode facing away from the substrate 110, the organic light-emitting layer 142 is located on the surface of the hole transport layer 144 facing away from the anode, and the electron transport layer 145 is located on the surface of the organic light-emitting layer 142 facing away from the hole transport layer 144. The hole transport layer 144, located between the anode and the organic light-emitting layer 142, enhances the ability of the anode to inject holes and transport them to the organic light-emitting layer 142. The electron transport layer 145, located between the organic light-emitting layer 142 and the cathode, enhances the ability of the cathode to inject electrons and transport them to the organic light-emitting layer 142. This allows for a greater injection of holes and electrons into the organic light-emitting layer 142, thereby improving the recombination efficiency and ultimately increasing the luminous efficiency of the organic light-emitting layer 142.

[0072] The display panel in this embodiment further includes a planarization layer 160, an encapsulation layer 170, and a cover plate 180. The planarization layer 160 is located on the side of the cathode layer 143 opposite to the circuit layer 120, and is used to make the light-emitting surface of the display panel substantially flat. The encapsulation layer 170 is located on the side of the planarization layer 160 opposite to the circuit layer 120, and is used to encapsulate the display panel to isolate moisture and protect it. The cover plate 180 is located on the side of the encapsulation layer 170 opposite to the circuit layer 120, and is used to protect the display panel from damage caused by external impacts or moisture.

[0073] Figure 7 This is a schematic diagram of another interlayer structure of the display panel according to an embodiment of this application.

[0074] Further, please refer to Figure 7 The display panel in this embodiment further includes a vapor deposition layer 150, at least a portion of which covers the first metal layer 230 and at least a portion of which covers the second metal layer 240; the vapor deposition layer 150 completely covers the support structure and partially covers the circuit layer 120.

[0075] The vapor-deposited layer 150 is a film layer fabricated by vapor deposition and typically includes a cathode layer 143. The vapor-deposited layer 150 covers the first metal layer 230 and the second metal layer 240, thereby protecting the first metal layer 230 and the second metal layer 240. Furthermore, when the vapor-deposited layer 150 overlaps with the first metal layer 230 and the second metal layer 240 to achieve electrical connection, the low voltage level of the cathode can cover the static electricity in the first metal layer 230 and the second metal layer 240, thereby further reducing the impact of static electricity on the circuit layer 120.

[0076] This application also provides a method for manufacturing a display panel, used to manufacture the display panel described in the foregoing embodiments of this application.

[0077] Figure 8 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application.

[0078] Specifically, please refer to Figure 8 The method for manufacturing the display panel in this application includes:

[0079] Step S1: Obtain substrate 110.

[0080] The substrate 110 can be prepared directly, or the finished substrate 110 can be obtained directly.

[0081] Continue reading Figure 8 Step S2: Prepare a circuit layer 120 on one side of the substrate 110.

[0082] Considering that the circuit layer 120 can be further refined into multiple conductive layers, it should be patterned sequentially from the direction closest to the substrate 110 to the direction furthest from the substrate 110 to obtain the circuit layer 120. Exemplarily, the individual conductive layers of the circuit layer 120 can be fabricated by etching.

[0083] Continue reading Figure 8 Step S3: In the display area AA, a pixel definition layer 130 is prepared on the side of the circuit layer 120 away from the substrate 110, and the pixel definition layer 130 has a pixel opening 131.

[0084] Based on the pre-designed positions of the display area AA and the non-display area NA, a pixel definition layer 130 is fabricated within the display area AA. During the fabrication of the pixel definition layer 130, patterning is also performed to ensure that the pixel definition layer 130 has pixel openings 131. At this time, the portion of the circuit layer 120 located in the non-display area NA and the pixel openings 131 is exposed.

[0085] Continue reading Figure 8Step S4: In the display area AA, a first support portion 210 is prepared on the side of the pixel definition layer 130 away from the circuit layer 120; in the non-display area NA, a second support portion 220 is prepared on the side of the circuit layer 120 away from the substrate 110.

[0086] Within the display area AA, the location of the first support portion 210 needs to be clear of the pixel opening 131 to avoid the first support portion 210 affecting the subsequent fabrication of the light-emitting device 140 within the pixel opening 131. Within the non-display area NA, the location of the second support portion 220 can be unrestricted, and priority can be given to ensuring the support capability of the second support portion 220 for the mask plate 300.

[0087] Continue reading Figure 8 In step S5, a first metal layer 230 is prepared on the side of the first support portion 210 away from the pixel definition layer 130, and a second metal layer 240 is prepared on the side of the second support portion 220 away from the circuit layer 120.

[0088] The first metal layer 230 and the second metal layer 240 can be disposed in the same layer, and the fabrication of the first metal layer 230 and the second metal layer 240 can be completed directly in one process. For example, the first metal layer 230 and the second metal layer 240 can be fabricated simultaneously by vapor deposition or etching.

[0089] Continue reading Figure 8 Step S6: Prepare luminescent material in the pixel opening 131 within the display area AA.

[0090] A light-emitting material is prepared using a mask 300. The light-emitting material is disposed at the pixel opening 131 and covers the anode layer 141 in the circuit layer 120. At this time, the mask 300 is supported by the first support portion 210 and the second support portion 220, and the mask 300 is in contact with the first metal layer 230 and the second metal layer 240. When static electricity is generated between the mask 300 and the first support portion 210 and the second support portion 220, the static electricity is attracted by the first metal layer 230 and the second metal layer 240, thereby preventing the static electricity from being further conducted to the circuit layer 120, thus protecting the circuit layer 120.

[0091] Continue reading Figure 8 Step S7: Prepare the vapor deposition layer 150, so that the vapor deposition layer 150 covers the first metal layer 230, the second metal layer 240 and the luminescent material.

[0092] The vapor deposition layer 150 can protect the first metal layer 230 and the second metal layer 240. When the second metal layer 240 overlaps with the fourth metal layer 260 in the circuit layer 120, the vapor deposition layer 150 can be electrically connected to the fourth metal layer 260. When the cathode layer 143 in the vapor deposition layer 150 is supplied with a low level, the low level can cover the static electricity, thereby preventing the static electricity from affecting the driving circuit of the circuit layer 120 located in the non-display area NA.

[0093] Furthermore, during the fabrication of the first metal layer 230 on the side of the first support portion 210 facing away from the pixel definition layer 130, the process includes: the first metal layer 230 partially covering the first support portion 210. The orthographic projection of the first metal layer 230 onto the pixel definition layer 130 lies within the orthographic projection of the first support portion 210 onto the pixel definition layer 130. Therefore, provided that the first support portion 210 does not affect the fabrication of the light-emitting device 140 at the pixel opening 131, the first metal layer 230 also does not affect the fabrication of the light-emitting device 140 at the pixel opening 131.

[0094] Furthermore, during the fabrication of the second metal layer 240 on the side of the second support portion 220 opposite to the circuit layer 120, the process includes: the second metal layer 240 completely covering the second support portion 220. The second metal layer 240 can overlap with the fourth metal layer 260 of the circuit layer 120 below the second support portion 220; therefore, static electricity in the second metal layer 240 will be conducted to the fourth metal layer 260. Considering the insulating arrangement between the fourth metal layer 260 and the third metal layer 250, static electricity will not affect the normal function of the circuit layer 120. In addition, since the fourth metal layer 260 and the vapor deposition layer 150 are electrically connected, static electricity in the fourth metal layer 260 can be further conducted to the vapor deposition layer 150. Since the vapor deposition layer 150 transmits a low-level signal, the static electricity will be covered by the low-level signal, thereby further reducing the impact of static electricity on the circuit layer 120.

[0095] In summary, this application provides a substrate, a display panel, and a method for fabricating the display panel. A first metal layer is disposed between a first support portion and a vapor-deposited layer, and a second metal layer is disposed between a second support portion and a vapor-deposited layer. When the mask comes into contact with the first and second support portions and generates static electricity, the static electricity can be prevented from being further conducted to the underlying circuit layer by the first and second metal layers, thereby reducing the risk of damage to the circuit layer due to static electricity.

[0096] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A substrate, characterized in that, include: A display area and a non-display area that at least partially surrounds the display area; Substrate; as well as, A circuit layer located on one side of the substrate; A pixel definition layer is located on the side of the circuit layer opposite to the substrate, and the pixel definition layer is located in the display area; A plurality of first support portions and a plurality of second support portions, wherein the first support portions are located in the display area and are located on the side of the pixel definition layer opposite to the circuit layer; the second support portions are located in the non-display area and are located on the side of the circuit layer opposite to the substrate; When fabricating the light-emitting device of the display panel using a photomask, the first support portion and the second support portion together support the photomask; A first metal layer and a second metal layer, with at least a portion of the first metal layer located on the side of the first support portion away from the circuit layer; At least a portion of the second metal layer is located on the side of the second support portion opposite to the circuit layer; the first metal layer is spaced apart from the pixel definition layer; The first support includes a first top surface and a first side surface. The first top surface is perpendicular to the thickness direction of the substrate, and the first side surface is inclined or parallel to the thickness direction of the substrate. The first metal layer covers at least a portion of the first top surface, and the first side surface is exposed relative to the first metal layer.

2. The substrate according to claim 1, characterized in that, The second metal layer covers a portion of the second support portion, and the second metal layer is spaced apart from the circuit layer.

3. The substrate according to claim 2, characterized in that, The second support includes a second top surface and a second side surface. The second top surface is perpendicular to the thickness direction of the substrate, and the second side surface is inclined or parallel to the thickness direction of the substrate. The second metal layer covers at least a portion of the second top surface, and the second side surface is exposed relative to the second metal layer.

4. The substrate according to claim 1, characterized in that, The second metal layer completely covers the second support portion.

5. The substrate according to claim 4, characterized in that, The circuit layer includes a third metal layer and a fourth metal layer; the third metal layer is located in the display area, the fourth metal layer is located in the non-display area, and the third metal layer and the fourth metal layer are insulated from each other and disposed on the same layer; The second metal layer covers the second support portion and at least a portion of the fourth metal layer.

6. The substrate according to claim 5, characterized in that, The pixel definition layer includes multiple pixel openings arranged in an array; on the plane where the substrate is located, the orthographic projection of the third metal layer overlaps with the orthographic projection of the pixel opening.

7. The substrate according to claim 1, characterized in that, The first metal layer and the second metal layer are disposed in the same layer.

8. A display panel, characterized in that, Includes the substrate described in any one of claims 1 to 7.

9. The display panel according to claim 8, characterized in that, It also includes a vapor-deposited layer, at least partially covering the first metal layer and at least partially covering the second metal layer; the vapor-deposited layer completely covers the first support portion and the second support portion, and partially covers the circuit layer.

10. A method for manufacturing a display panel, characterized in that, The method for preparing the display panel according to claim 8 or 9 includes: Obtain the substrate; The circuit layer is fabricated on one side of the substrate; Within the display area, the pixel definition layer is prepared on the side of the circuit layer opposite to the substrate, and the pixel definition layer has pixel openings; In the display area, the first support portion is formed on the side of the pixel definition layer opposite to the circuit layer; in the non-display area, the second support portion is formed on the side of the circuit layer opposite to the substrate. The first metal layer is prepared on the side of the first support portion away from the pixel definition layer, and the second metal layer is prepared on the side of the second support portion away from the circuit layer. Within the display area, a light-emitting material is prepared at the pixel opening; A vapor deposition layer is prepared to cover the first metal layer, the second metal layer, and the luminescent material.

11. The method for manufacturing a display panel according to claim 10, characterized in that, The first metal layer is fabricated on the side of the first support portion opposite to the pixel definition layer, including: The first metal layer partially covers the first support portion.

12. The method for manufacturing a display panel according to claim 10, characterized in that, The second metal layer is prepared on the side of the second support portion opposite to the circuit layer, including: The second metal layer completely covers the second support portion.

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