Wafer clamping type edge polishing device and process

Abstract

The application relates to the field of edge polishing devices for semiconductor wafer regeneration, in particular to a wafer clamping type edge polishing device and process, which comprises a fixed spindle and a wafer chuck, the fixed spindle is fixedly connected with an external mechanical arm, a spindle motor for driving the fixed spindle to rotate is arranged in the external mechanical arm, a triangular chuck is fixedly connected to the bottom end of the fixed spindle, wafer clamping arms are arrayed and rotationally connected to the surface of the triangular chuck, a triangular sliding disc is slidingly connected to the surface of the fixed spindle, and pull plates are arrayed and rotationally connected to the surface of the triangular sliding disc. The wafer clamping arms, the clamping part and the polishing cloth are arranged, the clamping and polishing integrated structure is adopted, the wafer is moved by the wafer clamping arms and the clamping part, the mechanical time in the process is reduced, the production efficiency is improved, meanwhile, the polishing cloth is sleeved on the clamping part, the polishing cloth is convenient to disassemble, the use area of the polishing cloth is reduced, and the effective utilization rate of the polishing cloth is improved.

Description

Technical Field

[0001] This invention relates to the field of edge polishing apparatus for semiconductor wafer regeneration, specifically a wafer clamping edge polishing apparatus and process. Background Technology

[0002] After surface cleaning and cleaning, regenerated wafers will have surface and edge defects due to etching. In particular, after cleaning wafers that have undergone coating processes, the non-uniformity of the coating will cause inconsistent etching rates, which will increase the edge roughness and affect the quality of the wafer itself.

[0003] To reduce the cost of edge polishing, the area of ​​the polishing cloth is reduced, and the position and flow rate of the polishing slurry outlet are adjusted to grind away the uneven oxide layer on the edge. Conventional processing involves grinding the notch, followed by physical and chemical polishing of the edge face and bevel to remove the oxide film and particle residue from the surface of the recycled waste wafer, making it usable again.

[0004] Existing technology, Chinese invention patent application number CN201810338638.4, discloses a wafer clamping robotic arm and a method for cleaning wafers, which helps to ensure the hydrophilicity of wafers after polishing and facilitates wafer cleaning operations. The robotic arm includes a support arm, a wafer-bearing clamping mechanism, and a fluid conduit. The support arm has a main body containing several holes penetrating the surface of the main body. The wafer-bearing clamping mechanism is disposed on the main body and perpendicular to the surface to clamp the wafer. The fluid conduit communicates with the several holes to receive flowing liquid and transport the liquid to the holes for ejection.

[0005] In existing technologies, the edge polishing cloth is designed to be large in size, which leads to insufficient use of the grinding life and waste of the polishing cloth's usable time. At the same time, existing edge polishing equipment separates the grinding device and the conveying device in terms of mechanical action, and the processing is completed in steps by different actions, resulting in high mechanical cost and low efficiency.

[0006] Based on this, the present invention designs a wafer clamping edge polishing device and process to solve the above problems. Summary of the Invention

[0007] The purpose of this invention is to provide a wafer clamping edge polishing device and process to solve the problems mentioned in the background art, such as the large size of the edge polishing cloth, which leads to insufficient use of the grinding life and waste of the polishing cloth's usable time. At the same time, existing edge polishing equipment has separate grinding and conveying devices in mechanical operation, and the processing is completed in steps by different actions, resulting in high mechanical cost and low efficiency.

[0008] To achieve the above objectives, the present invention provides the following technical solution: a wafer clamping edge polishing device, comprising a fixed spindle and a wafer chuck, wherein the fixed spindle is fixedly connected to an external robotic arm, and a spindle motor for driving the fixed spindle to rotate is provided inside the external robotic arm; a triangular chuck is fixedly connected to the bottom end of the fixed spindle, a wafer clamping arm is rotatably connected to the surface array of the triangular chuck, a triangular slide is slidably connected to the surface of the fixed spindle, a pull plate is rotatably connected to the surface array of the triangular slide, the other end of the pull plate is rotatably connected to the surface of the wafer clamping arm, and a lifting mechanism for sliding the triangular slide up and down is provided at the top of the triangular slide, the lifting mechanism being integrated with the fixed spindle;

[0009] Each wafer clamping arm is fixedly connected to a clamping part at its bottom end. The inner side of the clamping part is an elliptical arc surface, and a polishing cloth is sleeved on the surface of the clamping part. When the lifting mechanism controls the triangular slide to slide downward along the fixed main axis, the pull plate and the connecting end of the triangular slide rotate, so that the multiple wafer clamping arms are in an unfolded state. When the lifting mechanism controls the triangular slide to slide upward along the fixed main axis, the pull plate and the connecting end of the triangular slide rotate, so that the multiple wafer clamping arms are in a retracted state. The polishing cloth on the surface of the clamping part clamps the edge of the wafer and transfers the wafer to the wafer chuck.

[0010] The wafer chuck includes an inner chuck and an outer chuck. The inner chuck is provided with a polishing groove, and a wafer holder is fixedly connected in the polishing groove. Polishing slurry nozzles are arranged in an array on the surfaces of the inner and outer chucks, and each polishing slurry nozzle is provided with a pumping mechanism at its end.

[0011] The lifting mechanism includes several internal cylinders. The bottom ends of the telescopic rods of the internal cylinders are all fixedly connected to the surface of the triangular slide plate. The top ends of the several internal cylinders are all fixedly connected to a connecting seat. The connecting seat is fixedly connected to the surface of the fixed main shaft. The top end of the fixed main shaft is fixedly connected to a conductive slip ring. The wires of the conductive slip ring are electrically connected to the internal cylinders respectively.

[0012] In existing technologies, the large size of the edge polishing cloth leads to insufficient use of its grinding life, resulting in wasted polishing cloth time. Furthermore, existing edge polishing equipment separates the grinding and conveying devices, requiring separate steps in different actions, leading to high mechanical costs and low efficiency. This solution addresses these issues. The specific operation is as follows: An external robotic arm controls the fixed spindle to move to the wafer position. Then, a conductive slip ring is controlled, energizing the internal cylinder via its wires. First, the cylinder's extension rod extends downwards, causing the triangular slide to slide upwards along the fixed spindle. The connection between the pull plate and the triangular slide rotates, unfolding multiple wafer clamping arms. These arms are then aligned with the wafer edge. Since the inner side of the wafer clamping part is an elliptical arc surface with polishing cloth attached, applying 30N of pressure to the internal cylinder pulls the cylinder's extension rod upwards, causing the triangular slide to slide downwards along the fixed spindle. The connection between the pull plate and the triangular slide rotates. This system allows multiple wafer clamping arms to converge, with a polishing cloth on the clamping surface holding the wafer edges and transferring the wafer to a wafer chuck. A spindle motor within the robotic arm then rotates the clamping section at 800 rpm. Once the wafer reaches the chuck, it is held in place to prevent shifting. Polishing slurry, flowing from nozzles at 2 L / min, sprays onto the wafer edges, working in conjunction with the polishing cloth to polish the wafer edges. After polishing, cleaning water from the nozzles washes the polished wafer and clamping surfaces, preventing slurry residue. After cleaning, the wafer is transferred back to the next processing step via the clamping section. This edge polishing equipment integrates the polishing and conveying devices, completing both processes on a single device, improving wafer processing efficiency. Furthermore, the polishing cloth, fitted onto the clamping section, facilitates disassembly, reduces the cloth's surface area, and increases its effective utilization rate.

[0013] As a further aspect of the present invention, the top surfaces of the inner and outer suction cups are arrayed with cross grooves, and cross slides are slidably connected within each cross groove. The polishing slurry nozzle is fixedly connected to the end surface of the cross slide, and locking blocks are fixedly connected to the surface of the cross slide. A retaining ring is connected to the surface of the outer suction cup via a pin, and the width of the retaining ring is the same as the distance between the two locking blocks. During operation, due to different wafer sizes, if the polishing slurry nozzle is too close, it will interfere with the rotation of the wafer clamping arm; if it is too far, it will not be able to spray the polishing slurry to the edge of the wafer, thus making it inconvenient to use. By setting... The cross slide and cross slide allow for manual adjustment of the distance between the polishing slurry nozzle and the wafer edge. Multiple locking blocks are fixedly connected to the top array of the cross slide, ensuring that the distance between the multiple cross slides and the wafer edge is the same. After adjustment, a retaining ring of the same width as the spacing between the two locking blocks can be inserted between them and secured with a pin, thus ensuring the stability of the polishing slurry nozzle. This allows for free adjustment of the distance between the polishing slurry nozzle and the wafer edge, ensuring that the polishing slurry is sprayed onto the wafer edge without interfering with the rotation of the wafer clamping arm, thereby improving the polishing effect.

[0014] As a further embodiment of the present invention, a guide plate is fixedly connected inside the polishing tank. A drainage groove is arrayed on the surface of the guide plate and the bottom of the inner suction cup. A connecting pipe is fixedly connected to the bottom of the inner suction cup. A water collection chamber is fixedly connected to the bottom of the drainage pipe. A drainage pipe is arrayed and fixedly connected to the side wall of the water collection chamber. Several connecting rods are fixedly connected to the top of the water collection chamber and the side wall of the outer suction cup. During operation, by setting the guide plate, after wafer grinding and cleaning, the grinding fluid and cleaning fluid are guided to the drainage groove through the guide plate, discharged into the water collection chamber through the drainage groove, and then discharged through the drainage pipe, thus avoiding water accumulation in the polishing tank.

[0015] As a further embodiment of the present invention, the polishing slurry nozzle is fixedly connected to a polishing slurry nozzle and a cleaning slurry nozzle at its end. The pumping mechanism includes a delivery pump, which is fixedly connected to a polishing slurry pumping pipe and a cleaning slurry pumping pipe. The polishing slurry pumping pipe and the cleaning slurry pumping pipe are fixedly connected to the polishing slurry nozzle and the cleaning slurry nozzle, respectively. During operation, by setting the polishing slurry nozzle and the cleaning slurry nozzle, the polishing slurry in the polishing slurry nozzle flows out at a flow rate of 2L / min through the delivery pump, spraying it onto the side of the wafer edge. It works together with the polishing cloth to polish the wafer edge. After polishing, cleaning water is sprayed out through the cleaning slurry nozzle in the delivery pump to clean the polished wafer and the surface of the clamping part, so as to avoid polishing slurry residue on the surface of the wafer and the clamping part.

[0016] As a further embodiment of the present invention, the polishing cloth is fixed to the surface of the clamping part by an elastic rubber band; during operation, the polishing cloth is fixed by the elastic rubber band to improve the stability of the polishing cloth, avoid the problem of the polishing cloth loosening during polishing, thereby improving the polishing effect and facilitating the disassembly of the polishing cloth.

[0017] To address the above problems, this invention also proposes a wafer clamping edge polishing process, which includes the following steps:

[0018] Step 1: The fixed spindle is moved to the wafer position by the control of the external robotic arm. Then, the cylinder inside the spindle is controlled to make the triangular slide slide down along the fixed spindle. The pull plate and the connection end of the triangular slide rotate, so that the multiple wafer clamping arms are unfolded. Then, the wafer position is aligned with the edge.

[0019] Step 2: Since the inner side of the wafer clamping part is an elliptical arc surface with a polishing cloth attached to its surface, a pressure of 30N is applied to the cylinder inside the shaft to clamp the three clamping parts with a fixed force on the edge of the wafer. The main spindle motor inside the robotic arm drives the clamping parts to rotate at a speed of 800r / min.

[0020] Step 3: During the implementation of Step 2, the entire wafer is fixed and adsorbed by the wafer chuck to prevent it from shifting. At this time, the polishing slurry nozzles in the three polishing slurry nozzles flow out polishing slurry at a flow rate of 2L / min, spraying it onto the side edge of the wafer, and working together with the polishing cloth to polish the edge of the wafer.

[0021] Step 4: After Step 3 is completed, the cleaning fluid nozzle in the polishing slurry sprays out cleaning water to clean the polished wafer and the surface of the clamping part, so as to avoid polishing slurry residue on the surface of the wafer and the clamping part.

[0022] Step 5: During the implementation of Step 2 and Step 3, the polishing fluid and cleaning fluid are guided to the drainage tank through the diversion plate, discharged into the water collection chamber through the drainage tank, and then discharged through the drain pipe to avoid water accumulation in the polishing tank;

[0023] Step Six: After cleaning, the wafer is transferred to the next process again through the clamping part.

[0024] Compared with the prior art, the beneficial effects of the present invention are:

[0025] 1. The present invention adopts an integrated clamping and polishing structure by setting up a wafer clamping arm, a clamping part and a polishing cloth. The wafer is moved by the wafer clamping arm and the clamping part, which reduces the mechanical time in the process and improves the production efficiency. At the same time, the polishing cloth is sleeved on the clamping part, which is easy to disassemble and reduces the area of ​​the polishing cloth used, thereby improving the effective utilization rate of the polishing cloth.

[0026] 2. This invention allows for manual adjustment of the distance between the polishing slurry nozzle and the wafer edge by setting a cross slide groove and a cross slide base. Since multiple locking blocks are fixedly connected to the top array of the cross slide base, it is easy to make the distance between the multiple cross slide bases and the wafer edge the same. At the same time, after adjustment, a retaining ring with the same width as the spacing between the two locking blocks can be inserted between the two locking blocks and fixed by a pin, thereby ensuring the stability of the polishing slurry nozzle. This allows for free adjustment of the distance between the polishing slurry nozzle and the wafer edge, ensuring that the polishing slurry is sprayed to the wafer edge without interfering with the rotation of the wafer clamping arm, thus improving the polishing effect.

[0027] 3. By setting up a flow guide plate, after the wafer is polished and cleaned, the polishing slurry and cleaning slurry are guided to the drainage tank through the flow guide plate, discharged into the water collection chamber through the drainage tank, and then discharged through the drainage pipe, thus avoiding water accumulation in the polishing tank.

[0028] 4. This invention uses elastic rubber bands to fix the polishing cloth, which improves the stability of the polishing cloth, avoids the problem of the polishing cloth loosening during polishing, thereby improving the polishing effect and making it easier to disassemble the polishing cloth. Attached Figure Description

[0029] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0031] Figure 2 This diagram illustrates the connection between the fixed spindle, wafer clamping arm, clamping part, and polishing cloth in this invention.

[0032] Figure 3 This is a diagram showing the first connection between the fixed spindle, wafer clamping arm, and clamping part in this invention;

[0033] Figure 4 This is a diagram showing the second connection between the fixed spindle, wafer clamping arm, and clamping part in this invention;

[0034] Figure 5 This is a diagram showing the first connection of the wafer chuck, inner chuck, and outer chuck in this invention;

[0035] Figure 6 for Figure 5 Enlarged view of point A in the middle;

[0036] Figure 7 This is a diagram showing the second connection of the wafer chuck, inner chuck, and outer chuck in this invention;

[0037] Figure 8 This is a cross-sectional view of the inner and outer suction cups in this invention;

[0038] Figure 9 This is a process flow diagram of the present invention.

[0039] The attached diagram lists the components represented by each number as follows:

[0040] Fixed spindle 1, wafer chuck 2, inner chuck 201, outer chuck 202, polishing tank 3, wafer chuck 4, triangular chuck 5, wafer clamping arm 6, triangular slide 7, pull plate 8, clamping part 9, polishing cloth 10, polishing slurry nozzle 11, polishing slurry nozzle 1101, and cleaning slurry nozzle 1102, cross slide 12, cross slide 13, clamping block 14, clamping ring 15, guide plate 16, drainage tank 17, connecting pipe 18, water collection chamber 19, drainage pipe 20, connecting rod 21, shaft cylinder 22, connecting seat 23, conductive slip ring 24, delivery pump 25, polishing slurry pumping pipe 26, elastic rubber band 27, cleaning slurry pumping pipe 28. Detailed Implementation

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] Please see Figure 1-9 The present invention provides a technical solution: a wafer clamping edge polishing device, including a fixed spindle 1 and a wafer chuck 2. The fixed spindle 1 is fixedly connected to an external robotic arm. The external robotic arm is equipped with a spindle motor that drives the fixed spindle 1 to rotate. A triangular chuck 5 is fixedly connected to the bottom end of the fixed spindle 1. A wafer clamping arm 6 is rotatably connected to the surface of the triangular chuck 5. A triangular slide 7 is slidably connected to the surface of the fixed spindle 1. A pull plate 8 is rotatably connected to the surface of the triangular slide 7. The other end of the pull plate 8 is rotatably connected to the surface of the wafer clamping arm 6. A lifting mechanism for sliding the triangular slide 7 up and down is provided at the top of the triangular slide 7. The lifting mechanism is integrated with the fixed spindle 1.

[0043] Each wafer clamping arm 6 has a clamping part 9 fixedly connected to its bottom end. The inner side of the clamping part 9 is an elliptical arc surface, and a polishing cloth 10 is sleeved on the surface of the clamping part 9. When the lifting mechanism controls the triangular slide 7 to slide downward along the fixed main shaft 1, the connecting end of the pull plate 8 and the triangular slide 7 rotates, so that the multiple wafer clamping arms 6 are in an unfolded state. When the lifting mechanism controls the triangular slide 7 to slide upward along the fixed main shaft 1, the connecting end of the pull plate 8 and the triangular slide 7 rotates, so that the multiple wafer clamping arms 6 are in a retracted state. The polishing cloth 10 on the surface of the clamping part 9 clamps the edge of the wafer and transfers the wafer to the wafer chuck 2.

[0044] The wafer chuck 2 includes an inner chuck 201 and an outer chuck 202. The inner chuck 201 is provided with a polishing groove 3, and a wafer chuck 4 is fixedly connected in the polishing groove 3. Polishing slurry nozzles 11 are arranged in an array on the surfaces of the inner chuck 201 and the outer chuck 202. A pumping mechanism is provided at the end of each polishing slurry nozzle 11.

[0045] The lifting mechanism includes several internal cylinders 22. The bottom ends of the telescopic rods of the internal cylinders 22 are all fixedly connected to the surface of the triangular slide plate 7. The top ends of the several internal cylinders 22 are all fixedly connected to a connecting seat 23. The connecting seat 23 is fixedly connected to the surface of the fixed main shaft 1. The top end of the fixed main shaft 1 is fixedly connected to a conductive slip ring 24. The wires of the conductive slip ring 24 are electrically connected to the internal cylinders 22 respectively.

[0046] In existing technologies, the edge polishing cloth 10 is designed to be large, resulting in insufficient use of its grinding life and wasted time. Furthermore, existing edge polishing equipment separates the grinding and conveying devices in its mechanical movements, with the processing steps performed in different actions, leading to high mechanical costs and low efficiency. This solution addresses these issues. The specific operation is as follows: An external robotic arm controls the fixed spindle 1 to move to the wafer position, then controls the conductive slip ring 24, sending wires through the slip ring 24 to the cylinder inside the shaft. When energized, the telescopic rod of the internal cylinder 22 extends downwards, causing the triangular slide 7 to slide upwards along the fixed main shaft 1. The connecting end of the pull plate 8 and the triangular slide 7 rotates, causing the multiple wafer clamping arms 6 to unfold. Then, the multiple wafer clamping arms 6 are aligned with the edge of the wafer position. Since the inner side of the wafer clamping part 9 is an elliptical arc surface with a polishing cloth 10 attached to its surface, a pressure of 30N is applied to the internal cylinder 22, causing the telescopic rod of the internal cylinder 22 to pull upwards, and the triangular slide 7 to slide downwards along the fixed main shaft 1. The connecting end of the pull plate 8 and the triangular slide 7... The rotation causes the multiple wafer clamping arms 6 to retract, and the polishing cloth 10 on the surface of the clamping part 9 clamps the edge of the wafer and transfers the wafer to the wafer chuck 2. Then, the spindle motor installed inside the robotic arm drives the clamping part 9 to rotate at a speed of 800 r / min. When the wafer is transferred to the wafer chuck 2, the wafer chuck 2 fixes and holds the entire wafer to prevent it from shifting. Subsequently, the polishing slurry nozzle 11 flows out polishing slurry at a flow rate of 2 L / min, spraying it onto the side of the wafer edge, working together with the polishing cloth 10 to polish the wafer edge. After polishing, the polishing slurry nozzle 11 is cleaned with water to clean the polished wafer and the surface of the clamping part 9, so as to avoid polishing slurry residue on the surface of the wafer and the clamping part 9. After cleaning, the wafer is transferred to the next process again through the clamping part 9. In terms of mechanical action, the polishing device and the conveying device are integrated, and the conveying and polishing are completed on one device, which improves the wafer processing efficiency. At the same time, the polishing cloth 10 is sleeved on the clamping part 9, which is convenient for disassembly and reduces the area of ​​the polishing cloth 10 used, thereby improving the effective utilization rate of the polishing cloth 10.

[0047] As a further embodiment of the present invention, the top surfaces of the inner suction cup 201 and the outer suction cup 202 are arrayed with cross grooves 12, and cross slide seats 13 are slidably connected in each cross groove 12. The polishing slurry nozzle 11 is fixedly connected to the end surface of the cross slide seat 13, and the surface of the cross slide seat 13 is arrayed with locking blocks 14. The surface of the outer suction cup 202 is connected with a retaining ring 15 by a pin, and the width of the retaining ring 15 is the same as the distance between the two locking blocks 14. During operation, due to different wafer sizes, if the polishing slurry nozzle 11 is too close, it will interfere with the rotation of the wafer clamping arm 6; if it is too far, it will not be able to spray the polishing slurry to the edge of the wafer, thus making it inconvenient to use. By setting ten... The groove 12 and the cross slide 13 allow for manual adjustment of the distance between the polishing slurry nozzle 11 and the wafer edge. Since multiple locking blocks 14 are fixedly connected to the top of the cross slide 13, the distance between the multiple cross slides 13 and the wafer edge is made the same. After adjustment, a retaining ring 15 with the same width as the spacing between the two locking blocks 14 can be inserted between the two locking blocks 14 and fixed by a pin, thereby ensuring the stability of the polishing slurry nozzle 11. This allows for free adjustment of the distance between the polishing slurry nozzle 11 and the wafer edge, ensuring that the polishing slurry is sprayed onto the wafer edge without interfering with the rotation of the wafer clamping arm 6, thus improving the polishing effect.

[0048] As a further embodiment of the present invention, a guide plate 16 is fixedly connected inside the polishing tank 3. The surface of the guide plate 16 and the bottom of the inner suction cup 201 are arranged together with a drainage groove 17. A connecting pipe 18 is fixedly connected to the bottom of the inner suction cup 201. A water collection chamber 19 is fixedly connected to the bottom of the drainage pipe 20. A drainage pipe 20 is fixedly connected to the side wall of the water collection chamber 19. Several connecting rods 21 are fixedly connected to the top of the water collection chamber 19 and the side wall of the outer suction cup 202. During operation, by setting the guide plate 16, after the wafer is polished and cleaned, the polishing liquid and cleaning liquid are guided to the drainage groove 17 through the guide plate 16, discharged into the water collection chamber 19 through the drainage groove 17, and then discharged through the drainage pipe 20, thus avoiding water accumulation in the polishing tank 3.

[0049] As a further embodiment of the present invention, the polishing slurry nozzle 11 is fixedly connected to a polishing slurry nozzle 1101 and a cleaning slurry nozzle 1102 at its end. The pumping mechanism includes a delivery pump 25, which is fixedly connected to a polishing slurry pumping pipe 26 and a cleaning slurry pumping pipe 28. The polishing slurry pumping pipe 26 and the cleaning slurry pumping pipe 28 are fixedly connected to the polishing slurry nozzle 1101 and the cleaning slurry nozzle 1102, respectively. During operation, by setting the polishing slurry nozzle 1101 and the cleaning slurry nozzle 1102, the polishing slurry in the polishing slurry nozzle 1101 flows out at a flow rate of 2L / min through the delivery pump 25 and sprays onto the side of the wafer edge. It works together with the polishing cloth 10 to polish the wafer edge. After polishing, cleaning water is sprayed out through the cleaning slurry nozzle 1102 in the polishing slurry nozzle 11 by the delivery pump 25 to clean the polished wafer and the surface of the clamping part 9, so as to avoid polishing slurry residue on the surface of the wafer and the clamping part 9.

[0050] As a further embodiment of the present invention, the polishing cloth 10 is fixed to the surface of the clamping part 9 by the elastic rubber band 27; during operation, the polishing cloth 10 is fixed by the elastic rubber band 27 to improve the stability of the polishing cloth 10, avoid the problem of the polishing cloth 10 loosening during polishing, thereby improving the polishing effect and facilitating the disassembly of the polishing cloth 10.

[0051] To address the above problems, this invention also proposes a wafer clamping edge polishing process, which includes the following steps:

[0052] Step 1: The fixed spindle 1 is moved to the wafer position by the control of the external robotic arm. Then, the cylinder 22 inside the spindle is controlled to make the triangular slide 7 slide down along the fixed spindle 1. The pull plate 8 and the connecting end of the triangular slide 7 rotate, so that the multiple wafer clamping arms 6 are unfolded and aligned with the edge of the wafer position.

[0053] Step 2: Since the inner side of the wafer clamping part 9 is an elliptical arc surface, and a polishing cloth 10 is attached to its surface, a pressure of 30N is applied to the cylinder 22 inside the shaft, so that the three clamping parts 9 are clamped on the edge of the wafer with a fixed force. The main spindle motor installed in the robotic arm drives the clamping part 9 to rotate at a speed of 800r / min.

[0054] Step 3: During the implementation of step 2, the entire wafer is fixed and adsorbed by the wafer chuck 2 to prevent it from shifting. At this time, the polishing slurry nozzles 1101 of the three polishing slurry nozzles 11 flow out polishing slurry at a flow rate of 2L / min and spray it onto the side edge of the wafer, working together with the polishing cloth 10 to polish the edge of the wafer.

[0055] Step 4: After step 3 is completed, the cleaning fluid nozzle 1102 in the polishing slurry nozzle 11 sprays out cleaning water to clean the polished wafer and the surface of the clamping part 9, so as to avoid polishing slurry residue on the surface of the wafer and the clamping part 9.

[0056] Step 5: During the implementation of Step 2 and Step 3, the polishing fluid and cleaning fluid are guided to the drainage tank 17 through the drainage plate 16, discharged into the water collection chamber 19 through the drainage tank 17, and then discharged through the drainage pipe 20 to avoid water accumulation in the polishing tank 3;

[0057] Step Six: After cleaning, the wafer is transferred to the next process again through the clamping part 9.

[0058] Working principle: The external robotic arm controls the fixed spindle 1 to move to the wafer position. Then, it controls the conductive slip ring 24, which powers the internal cylinder 22 via its wires. First, the telescopic rod of the internal cylinder 22 extends downwards, causing the triangular slide 7 to slide upwards along the fixed spindle 1. The connection between the pull plate 8 and the triangular slide 7 rotates, unfolding multiple wafer clamping arms 6. Then, the multiple wafer clamping arms 6 are aligned with the edge of the wafer. Since the inner side of the wafer clamping part 9 is an elliptical arc surface with a polishing cloth 10 attached to its surface, a pressure of 30N is applied to the internal cylinder 22. The telescopic rod of the internal cylinder 22 pulls upwards, causing the triangular slide 7 to slide downwards along the fixed spindle 1. The connection between the pull plate 8 and the triangular slide 7 rotates, causing the multiple wafer clamping arms 6 to retract. The polishing cloth 10 on the surface of the clamping part 9 clamps the edge of the wafer and transfers it to the wafer chuck 2. Then, the mechanical arm... The main spindle motor drives the clamping part 9 to rotate at a speed of 800 r / min. When the wafer is transferred to the wafer chuck 2, the wafer is fixed and held in place by the wafer chuck 2 to prevent it from shifting. Then, the polishing slurry nozzle 11 flows out polishing slurry at a flow rate of 2 L / min, spraying it onto the edge of the wafer. Together with the polishing cloth 10, it polishes the edge of the wafer. After polishing, the polishing slurry nozzle 11 is cleaned with cleaning water to clean the polished wafer and the surface of the clamping part 9, so as to avoid polishing slurry residue on the surface of the wafer and the clamping part 9. After cleaning, the wafer is transferred to the next process again through the clamping part 9. In terms of mechanical operation, the polishing device and the conveying device are integrated. The conveying and polishing are completed on one device, which improves the wafer processing efficiency. At the same time, the polishing cloth 10 is sleeved on the clamping part 9, which is convenient for disassembly and reduces the area of ​​the polishing cloth 10 used, thereby improving the effective utilization rate of the polishing cloth 10.

[0059] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0060] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to any specific implementation. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A wafer clamping edge polishing device, comprising a fixed spindle (1) and a wafer chuck (2), wherein the fixed spindle (1) is fixedly connected to an external robotic arm, and the external robotic arm is provided with a spindle motor for driving the fixed spindle (1) to rotate, characterized in that: The bottom end of the fixed spindle (1) is fixedly connected to a triangular chuck (5), and a wafer clamping arm (6) is rotatably connected to the surface of the triangular chuck (5). A triangular slide (7) is slidably connected to the surface of the fixed spindle (1), and a pull plate (8) is rotatably connected to the surface of the triangular slide (7). The other end of the pull plate (8) is rotatably connected to the surface of the wafer clamping arm (6). A lifting mechanism for sliding the triangular slide (7) up and down is provided at the top of the triangular slide (7). The lifting mechanism is integrated with the fixed spindle (1). Each of the wafer clamping arms (6) has a clamping part (9) fixedly connected to its bottom end. The inner side of the clamping part (9) is an elliptical arc surface. A polishing cloth (10) is sleeved on the surface of the clamping part (9). When the lifting mechanism controls the triangular slide (7) to slide downward along the fixed main shaft (1), the connecting end of the pull plate (8) and the triangular slide (7) rotates, so that the multiple wafer clamping arms (6) are in an unfolded state. When the lifting mechanism controls the triangular slide (7) to slide upward along the fixed main shaft (1), the connecting end of the pull plate (8) and the triangular slide (7) rotates, so that the multiple wafer clamping arms (6) are in a retracted state. The polishing cloth (10) on the surface of the clamping part (9) clamps the edge of the wafer and transfers the wafer to the wafer chuck (2). The wafer chuck (2) includes an inner chuck (201) and an outer chuck (202). The inner chuck (201) is provided with a polishing groove (3). A wafer chuck (4) is fixedly connected in the polishing groove (3). Polishing slurry nozzles (11) are arranged in an array on the surfaces of the inner chuck (201) and the outer chuck (202). A pumping mechanism is provided at the end of each polishing slurry nozzle (11).

2. The wafer clamping edge polishing device according to claim 1, characterized in that: The top surfaces of the inner suction cup (201) and the outer suction cup (202) are provided with cross grooves (12), and cross slides (13) are slidably connected in the cross grooves (12). The grinding fluid nozzle (11) is fixedly connected to the end surface of the cross slide (13). The surface of the cross slide (13) is fixedly connected with a series of locking blocks (14). The surface of the outer suction cup (202) is connected with a retaining ring (15) by a pin. The width of the retaining ring (15) is the same as the distance between the two retaining blocks (14).

3. The wafer clamping edge polishing device according to claim 1, characterized in that: A flow guide plate (16) is fixedly connected inside the polishing tank (3). The surface of the flow guide plate (16) and the bottom of the inner suction cup (201) are provided with a drainage groove (17). A connecting pipe (18) is fixedly connected to the bottom of the inner suction cup (201). A water collection chamber (19) is fixedly connected to the bottom of the connecting pipe (18). A drain pipe (20) is fixedly connected to the side wall of the water collection chamber (19). Several connecting rods (21) are fixedly connected to the top of the water collection chamber (19) and the side wall of the outer suction cup (202).

4. The wafer clamping edge polishing device according to claim 1, characterized in that: The lifting mechanism includes several internal cylinders (22). The bottom ends of the telescopic rods of the internal cylinders (22) are fixedly connected to the surface of the triangular slide plate (7). The top ends of the internal cylinders (22) are all fixedly connected to a connecting seat (23). The connecting seat (23) is fixedly connected to the surface of the fixed spindle (1). The top end of the fixed spindle (1) is fixedly connected to a conductive slip ring (24). The wires of the conductive slip ring (24) are electrically connected to the internal cylinders (22).

5. The wafer clamping edge polishing device according to claim 2, characterized in that: The polishing slurry nozzle (11) is fixedly connected to a polishing slurry nozzle (1101) and a cleaning slurry nozzle (1102) respectively. The pumping mechanism includes a delivery pump (25). The delivery pump (25) is fixedly connected to a polishing slurry pumping pipe (26) and a cleaning slurry pumping pipe (28) respectively. The polishing slurry pumping pipe (26) and the cleaning slurry pumping pipe (28) are fixedly connected to the polishing slurry nozzle (1101) and the cleaning slurry nozzle (1102) respectively.

6. The wafer clamping edge polishing device according to claim 1, characterized in that: The polishing cloth (10) is fixed to the surface of the clamping part (9) by an elastic rubber band (27).

7. A wafer clamping edge polishing process, applicable to a wafer clamping edge polishing apparatus according to any one of claims 1-6, characterized in that: This wafer clamping edge polishing process includes the following steps: Step 1: Control the fixed spindle (1) to move to the wafer position through the mechanical arm of the external device, and then control the cylinder (22) inside the shaft to make the triangular slide (7) slide down along the fixed spindle (1), and the pull plate (8) and the connecting end of the triangular slide (7) rotate, so that multiple wafer clamping arms (6) are in an unfolded state, and then align with the edge of the wafer position; Step 2: Since the inner side of the wafer clamping part (9) is an elliptical arc surface, and a polishing cloth (10) is attached to its surface, a pressure of 30N is applied to the cylinder (22) inside the shaft, so that the three clamping parts (9) are clamped at the edge of the wafer with a fixed force. The clamping part (9) is driven to rotate at a speed of 800r / min by the spindle motor installed in the robotic arm. Step 3: During the implementation of step 2, the entire wafer is fixed and adsorbed by the wafer chuck (2) so that it does not shift. At this time, the polishing slurry nozzle (1101) in the three polishing slurry nozzles (11) flows out of the polishing slurry at a flow rate of 2L / min and sprays onto the side edge of the wafer. Together with the polishing cloth (10), the wafer edge is polished. Step 4: After the completion of Step 3, the cleaning fluid nozzle (1102) in the polishing slurry nozzle (11) sprays out cleaning water to clean the polished wafer and the surface of the clamping part (9) to avoid polishing slurry residue on the surface of the wafer and the clamping part (9). Step 5: During the implementation of Step 2 and Step 3, the polishing fluid and cleaning fluid are guided to the drainage tank (17) through the drainage plate (16), discharged into the water collection chamber (19) through the drainage tank (17), and then discharged through the drain pipe (20) to avoid water accumulation in the polishing tank (3); Step 6: After cleaning, the wafer is transferred to the next process again through the clamping part (9).

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