Silicon rod cutting and grinding integrated machine

Abstract

The application discloses a square silicon rod cutting and grinding integrated machine, which comprises a base, a cutting device, a silicon rod transfer device and a grinding device. The original square silicon rod horizontally placed can be transversely cut by the cutting device to form first and second square silicon rods stacked one on top of another. The first and second square silicon rods formed after the transverse cutting can be subjected to grinding operation of the cutting surface by the grinding device, so that the integrated operation of the half-cutting and grinding of the original square silicon rod is completed, and the production efficiency and the quality of the product operation are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of silicon workpiece processing, in particular to a square silicon rod cutting and grinding all-in-one machine. BACKGROUND

[0002] At present, with the attention and opening of society to green renewable energy utilization, the field of photovoltaic solar power generation is increasingly valued and developed. In the field of photovoltaic power generation, a common crystalline silicon solar cell is made on a high-quality silicon wafer, which is formed by multi-wire saw cutting and subsequent processing after being cut from a pulled or cast silicon ingot.

[0003] The existing silicon wafer manufacturing process takes a single crystal silicon product as an example. Generally, the approximate operation procedure can include: first, using a silicon rod cutting machine to cut the original long silicon rod to form multiple short silicon rods; after cutting, using a silicon rod squaring machine to square the cut short silicon rod to form a square silicon rod with a rectangular cross section; then, performing grinding operations such as surface grinding, rounding, and chamfering on the squared silicon rod to shape the surface of the silicon rod to meet the corresponding flatness and dimensional tolerance requirements; and finally, performing slicing operations on the square silicon rod to obtain a silicon wafer.

[0004] The silicon wafer obtained by slicing can be used to make photovoltaic modules, and photovoltaic modules can convert light energy into electrical energy.

[0005] In order to improve the conversion efficiency of photovoltaic modules, tile-type modules have emerged. Tile-type modules refer to a form in which multiple cell pieces are connected in series by stacking them front to back, and there is no gap between the cell pieces, nor does the welding strip form an obstruction to the cell pieces. Therefore, under the same area of the module, more cell pieces can be accommodated, expanding the effective power generation area. In the current related technology, to obtain a silicon wafer for making tile-type modules, a silicon rod for slicing to form a silicon wafer needs to be made first, and the silicon rod is usually made by re-cutting and grinding the square silicon rod made in the previous process. Therefore, how to provide a device that is simple in structure, convenient to operate, and can quickly and efficiently make the corresponding silicon rod is a problem that needs to be solved. SUMMARY

[0006] In view of the various deficiencies of the above-mentioned related technology, the purpose of the present application is to disclose a square silicon rod cutting and grinding all-in-one machine to solve the problems of complex structure, inconvenient operation, and low efficiency in the existing related technology.

[0007] To achieve the above object and other related objects, the present application discloses a square silicon rod cutting and grinding integrated machine, a machine base, having a silicon rod processing platform; the silicon rod processing platform includes a cutting area and a grinding area arranged along a second direction; a cutting device is arranged at the cutting area of the silicon rod processing platform, the cutting device includes at least one cutting wire saw, the at least one cutting wire saw is arranged along the second direction, and the at least one cutting wire saw is used for performing horizontal cutting operation on a horizontal placed original square silicon rod at the cutting area to form a first square silicon rod and a second square silicon rod stacked vertically; the original square silicon rod is a silicon rod with a cross section in a rectangular shape, and the center line of the original square silicon rod is consistent with a first direction; the second direction is perpendicular to the first direction and forms a horizontal plane with the first direction; a silicon rod transfer device is used for transferring the first square silicon rod and the second square silicon rod at the cutting area to the grinding area; a grinding device is arranged at the grinding area of the silicon rod processing platform and is used for performing grinding operation on the cutting surface of the first square silicon rod and the second square silicon rod horizontally placed at the grinding area, and the center line of the first square silicon rod and the second square silicon rod is consistent with the first direction.

[0008] In some embodiments of the present application, the cutting device includes: a cutting frame arranged at the machine base; a cutting support movably arranged at the cutting frame along a vertical direction; a plurality of cutting wheels arranged at the cutting support; and a cutting wire wound around the plurality of cutting wheels to form at least one cutting wire saw.

[0009] In some embodiments of the present application, the cutting wire is wound around the plurality of cutting wheels to form a closed loop cutting wire with a head-to-tail connection.

[0010] In some embodiments of the present application, the square silicon rod cutting and grinding integrated machine further includes: a silicon rod carrying device arranged at the cutting area of the silicon rod processing platform; and the at least one cutting wire saw performs horizontal cutting operation on the original square silicon rod carried by the silicon rod carrying device through relative movement of the cutting device and the silicon rod carrying device along a first direction.

[0011] In some embodiments of the present application, the silicon rod carrying device is fixedly arranged at the cutting area of the silicon rod processing platform, and the cutting frame is movably arranged at the machine base along the first direction through a cutting frame traveling mechanism.

[0012] In some embodiments of the present application, the silicon rod carrying device is movably arranged at the cutting area of the silicon rod processing platform along the first direction through a silicon rod conveying mechanism, and the cutting frame is movably arranged at the machine base along the first direction through a cutting frame traveling mechanism or is fixedly arranged at the machine base.

[0013] In some embodiments of the present application, the cutting frame traveling mechanism comprises: a first traveling guide rail arranged along a first direction on the machine base for setting the cutting frame; and a first traveling drive unit for driving the cutting frame to move along the first traveling guide rail.

[0014] In some embodiments of the present application, the first traveling drive unit comprises: a first traveling rack arranged along a first direction on the machine base; a first traveling gear engaged with the cutting frame and the first traveling rack; and a first gear drive motor associated with the first traveling gear.

[0015] In some embodiments of the present application, the cutting frame traveling mechanism comprises: a traveling suspension rail arranged along a first direction on the top of the machine base; a traveling lead screw arranged along a first direction and associated with the cutting frame of the cutting device; and a lead screw drive motor associated with the traveling lead screw.

[0016] In some embodiments of the present application, the silicon rod conveying mechanism comprises: a conveying guide rail arranged along a first direction on the machine base for setting the silicon rod carrying device; and a conveying drive unit for driving the silicon rod carrying device to move along the conveying guide rail.

[0017] In some embodiments of the present application, the silicon rod carrying device further comprises: a silicon rod side clamping mechanism for clamping the side of the raw square silicon rod.

[0018] In some embodiments of the present application, the silicon rod side clamping mechanism comprises: a side clamping support; at least two side clamping members arranged on opposite sides of the side clamping support along a second direction; a side clamping space between the at least two side clamping members; and a side clamping drive unit for driving at least one of the at least two side clamping members to move along the second direction to adjust the side clamping space.

[0019] In some embodiments of the present application, the silicon rod carrying device further comprises: a first silicon rod end clamping mechanism for clamping the end of the raw square silicon rod.

[0020] In some embodiments of the present application, the first silicon rod end clamping mechanism comprises: a first end clamping support; at least two first end clamping members arranged on opposite ends of the first end clamping support along a first direction; a first end clamping space between the at least two first end clamping members; and a first end clamping drive unit for driving at least one of the at least two first end clamping members to move along the first direction to adjust the first end clamping space.

[0021] In some embodiments of the present application, the cutting support is movably arranged on the cutting frame by a first lifting mechanism.

[0022] In some embodiments of the present application, the silicon rod cutting and grinding all-in-one machine further comprises: at least two second silicon rod end clamping mechanisms, which are arranged in the grinding area of the silicon rod processing platform along the first direction.

[0023] In some embodiments of the present application, the grinding device comprises: a grinding frame movably arranged on the machine base along the first direction; a grinding support movably arranged on the grinding frame along the vertical direction; and at least one grinding wheel arranged on the grinding support for grinding and chamfering / rounding the first and second square silicon rods.

[0024] In some embodiments of the present application, the grinding device comprises a grinding frame traveling mechanism, which comprises: a second traveling guide rail arranged on the machine base along the first direction for arranging the grinding frame; and a second traveling drive unit for driving the grinding frame to move along the second traveling guide rail.

[0025] In some embodiments of the present application, the second traveling drive unit comprises: a second traveling rack arranged on the machine base along the first direction; a second traveling gear engaged with the second traveling rack and associated with the grinding frame; and a second gear drive motor associated with the second traveling gear.

[0026] In some embodiments of the present application, the grinding support is movably arranged on the grinding frame by a second lifting mechanism.

[0027] In some embodiments of the present application, the grinding frame is movably arranged on the machine base along the second direction by a first grinding frame advancing and retreating mechanism.

[0028] In some embodiments of the present application, the silicon rod transfer device comprises: a transfer clamp comprising a clamp base, at least one pair of clamp arms arranged at opposite ends of the clamp base, and a clamp arm drive mechanism, the at least one pair of clamp arms being provided with clamping portions and clamping portion rotating mechanisms; a transfer translation mechanism for driving the transfer clamp to move along the second direction; a transfer traveling mechanism for driving the transfer clamp to move along the first direction; and a transfer lifting mechanism for driving the transfer clamp to move up and down along the vertical direction.

[0029] In some embodiments of the present application, the silicon rod cutting and grinding all-in-one machine further comprises: at least two second silicon rod end clamping mechanisms, which are arranged in the grinding area of the silicon rod processing platform along the second direction.

[0030] In some embodiments of the present application, the grinding device comprises a grinding base movably arranged in the first direction on the base; a grinding frame movably arranged in the second direction on the grinding base; a grinding support movably arranged in the vertical direction on the grinding frame; and at least one grinding wheel arranged on the grinding support for grinding the first and second square silicon rods.

[0031] In some embodiments of the present application, the grinding frame is movably arranged on the grinding base by a second grinding frame advancing and retreating mechanism, and the grinding support is movably arranged on the grinding frame by a second lifting mechanism.

[0032] In some embodiments of the present application, the grinding device comprises a grinding base advancing mechanism comprising a second advancing guide rail arranged in the first direction on the base for arranging the grinding base; and a second advancing drive unit for driving the grinding base to move along the second advancing guide rail.

[0033] In some embodiments of the present application, the grinding base advancing mechanism comprises a second advancing rack arranged in the first direction on the base; a second advancing gear wheel engaged with the second advancing rack and associated with the grinding base; and a second gear wheel drive motor associated with the second advancing gear wheel.

[0034] In some embodiments of the present application, the at least one grinding wheel in the grinding device comprises any one of the following combinations: at least one grinding wheel for grinding and chamfering; at least one grinding wheel for grinding and at least one grinding wheel for chamfering and rounding.

[0035] In some embodiments of the present application, the second silicon rod end clamping mechanism comprises a second end clamping support; at least two second end clamping members arranged at opposite ends of the second end clamping support in the first direction; a second end clamping space between the at least two second end clamping members; and a second end clamping drive unit for driving at least one of the at least two second end clamping members to move in the first direction to adjust the second end clamping space.

[0036] In some embodiments of the present application, the second silicon rod end clamping mechanism further comprises a silicon rod overturning component for overturning the first and second square silicon rods by a predetermined angle.

[0037] In some embodiments of the present application, the silicon rod transfer device comprises a transfer clamp comprising a clamp base, at least one pair of clamp arms arranged at opposite ends of the clamp base, and a clamp arm drive mechanism, the at least one pair of clamp arms being provided with clamping portions and clamping portion rotation mechanisms; a transfer translation mechanism for driving the transfer clamp to move in the second direction; and a transfer lifting mechanism for driving the transfer clamp to move up and down in the vertical direction.

[0038] In some embodiments of the present application, the silicon rod cutting and grinding all-in-one machine further comprises a silicon rod loading device.

[0039] In some embodiments of the present application, the silicon rod cutting and grinding all-in-one machine further comprises a silicon rod unloading device.

[0040] The silicon rod cutting and grinding all-in-one machine disclosed in the present application comprises a machine base, a cutting device, a silicon rod transfer device and a grinding device, wherein the cutting device and the grinding device are located on the left and right sides respectively. The cutting device can be used to cut a horizontally placed original silicon rod to form a first silicon rod and a second silicon rod stacked vertically. The grinding device can be used to grind the cutting surface of the first silicon rod and the second silicon rod after cutting, thereby completing the integrated operation of the half-cutting and grinding of the original silicon rod, improving the production efficiency and the quality of the product operation. BRIEF DESCRIPTION OF DRAWINGS

[0041] The specific features of the invention involved in the present application are shown in the appended claims. The features and advantages of the invention involved in the present application can be better understood by referring to the exemplary embodiments described in detail below and the accompanying drawings. A brief description of the drawings is as follows:

[0042] Figure 1 The figure shows the state of the silicon rod cutting and grinding all-in-one machine in an embodiment of the present application.

[0043] Figure 2 The figure shows the top view of the silicon rod cutting and grinding all-in-one machine in an embodiment of the present application.

[0044] Figure 3 And Figure 4 The figure shows the partial structure of the cutting device and the silicon rod bearing device.

[0045] Figure 5 And Figure 6 The figure shows the state of chamfering / rounding the first silicon rod or the second silicon rod in different implementations.

[0046] Figures 7 to 11 The figure shows the state of the silicon rod cutting and grinding all-in-one machine in an embodiment of the present application. DETAILED DESCRIPTION

[0047] The embodiments of the present application are illustrated by specific examples below, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the specification.

[0048] In the following description, reference is made to the accompanying drawings which form a part hereof, and which are shown by way of illustration of several embodiments of the present application. It is understood that other embodiments can be utilized and mechanical, structural, electrical, and operational changes can be made without departing from the spirit and scope of the present disclosure. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of various embodiments of the present application are defined by the appended claims. The summary of the application is not intended to limit the scope of the application, and the terms used herein are for the purpose of describing particular embodiments and are not intended to be limiting of the application. Spatially relative terms such as "upper", "lower", "left", "right", "below", "below", "bottom", "top", and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures.

[0049] Although the terms first, second, etc. can be used herein to describe various elements or parameters, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another element or parameter. For example, a first square silicon rod can be termed a second square silicon rod, and similarly, a second square silicon rod can be termed a first square silicon rod, and a first direction can be termed a second direction, and similarly, a second direction can be termed a first direction, without departing from the scope of the various described embodiments.

[0050] Furthermore, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises", "comprising", "includes" and / or "including" when used herein, specify the presence of stated features, steps, operations, elements, components, items, and / or groups but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, items, and / or groups thereof. As used herein, the terms "or" and "and / or" are to be interpreted as inclusive, i.e., as meaning one or more of the stated items is present. Therefore, "A, B, or C" or "A, B, and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B, and C". An exception to this definition will occur only when a combination of elements, functions, steps or acts are in some way inherently mutually exclusive.

[0051] In order to improve the conversion efficiency of photovoltaic modules, the tile component emerges as the times require. Tile component refers to the form of a plurality of battery pieces in front and back of the piece for series connection, there is no gap between the battery pieces, and there is no welding strip to form a shelter for the battery pieces, so that more battery pieces can be accommodated in the same area of the component, and the effective generating area is expanded. In the current related technology, to obtain the silicon rod for making the tile component, the silicon rod for slicing to form the silicon rod needs to be made first, and the silicon rod is usually made by re-cutting and grinding the square silicon rod made in the previous process.

[0052] In related technical fields of silicon rod processing, several processes such as square cutting, surface grinding, rounding / chamfering, etc. are involved.

[0053] Generally, existing silicon rods are mostly in cylindrical structure. The silicon rods are cut by a silicon rod square cutting device to make the cross section of the silicon rod after square cutting processing to be a rectangle (including a square), and the whole silicon rod after square cutting is a cuboid (may also include a cube). The rectangle includes a rectangle with orthogonal adjacent sides or a rectangle with an angle within a predetermined angle range, a rectangle with rounded corners between adjacent sides, a rectangle with connecting short sides between adjacent sides, etc.

[0054] Taking a single crystal silicon rod as an example, in some related technologies, the forming process of the single crystal silicon rod can include: first cutting the original long silicon rod by a silicon rod cutting machine to form a plurality of short silicon rods; and then performing square cutting on the short silicon rods by a silicon rod square cutting machine to form a single crystal silicon rod with a rectangular cross section. The specific implementation of cutting the original long silicon rod by the silicon rod cutting machine to form a plurality of short silicon rods can be referred to, for example, CN105856445A, CN105946127A, and CN105196A, and the specific implementation of performing square cutting on the short silicon rods by the silicon rod square cutting machine to form a single crystal silicon rod with a rectangular cross section can be referred to CN105818285A. However, the forming process of the single crystal silicon rod is not limited to the foregoing technologies. In alternative examples, the forming process of the single crystal silicon rod can also include: first performing square cutting on the original long silicon rod by a full silicon rod square cutting machine to form a long single crystal silicon rod with a rectangular cross section; and then cutting the long single crystal silicon rod after square cutting by a silicon rod cutting machine to form a short single crystal silicon rod. The specific implementation of performing square cutting on the original long silicon rod by the full silicon rod square cutting machine to form a long single crystal silicon rod with a rectangular cross section can be referred to, for example, CN003443A.

[0055] After the cylindrical single crystal silicon rod is cut by the square cutting device to form a silicon rod with a rectangular cross section, the silicon rod with a rectangular cross section can be subjected to surface grinding, rounding / chamfering, etc. by a grinding device. The specific implementation of the grinding device for surface grinding, rounding / chamfering, etc. of the silicon rod with a rectangular cross section can be referred to, for example, CN105835247A.

[0056] The inventor of the present application finds that there is no special equipment for cutting and grinding of the original square silicon rod in the prior art, and in the existing equipment technology, the operation required for each process operation (such as half cutting, grinding, etc.) is independently arranged, and the corresponding processing equipment is scattered in different production units or production workshops or different production areas of a production workshop, the conversion of workpieces performing different process operations needs to be transported and allocated, and preprocessing work may be required before each process operation is performed. Therefore, the process is complicated, the efficiency is low, the quality of the silicon rod processing operation is easily affected, more manpower or transfer equipment is needed, the safety risk is high, in addition, there are many flow links between the process equipment of each process, which increases the risk of workpiece damage during workpiece transfer, and non-production factors are easily caused to be unqualified, thereby reducing the product qualification rate and the unreasonable loss caused by the existing processing mode.

[0057] Therefore, the present application provides a square silicon rod cutting and grinding all-in-one machine, which includes a base, a cutting device, a silicon rod transfer device, and a grinding device. The cutting device can perform horizontal cutting on a horizontally placed original square silicon rod to form first and second square silicon rods stacked vertically. The grinding device can perform grinding on the cutting surface of the first and second square silicon rods after horizontal cutting, thereby completing the integrated operation of half cutting and grinding of the original square silicon rod. The device has a simple overall structure, improves production efficiency and saves costs, and improves the quality of product processing operation.

[0058] In the embodiments provided in the present application, in order to clearly define the direction and the operation mode between different structures, a three-dimensional space defined by a first direction, a second direction and a third direction is defined, the first direction, the second direction and the third direction are straight lines and perpendicular to each other, wherein the first direction and the second direction can constitute a horizontal plane, and the third direction is a vertical direction perpendicular to the horizontal plane, which can also be called a vertical direction, a vertical direction, a plumb line direction, an up-down direction or a lifting direction.

[0059] In any embodiment provided in the present application, the original square silicon rod refers to a square silicon rod with a rectangular cross section formed after cutting and grinding of a silicon rod with a circular cross section, and the rectangular cross section includes a rectangle with four right angles, a rectangle with a folding edge or an arc to be rounded, etc. The end of the silicon rod refers to two opposite ends along the length direction of the silicon rod axis, the end face of the end refers to two opposite faces along the length direction of the silicon rod, and the side face of the silicon rod refers to the other four faces of the silicon rod except the two end faces. For example, for the original square silicon rod, the end face of the original square silicon rod is rectangular, and the side face of the original square silicon rod is rectangular.

[0060] In embodiments, the silicon rod can be, for example, a single crystal silicon rod, i.e. a rod-shaped single crystal silicon grown from a melt by using a Czochralski method or a floating zone method, such as a single crystal silicon rod with a length of about 5000 mm (e.g. a specification of 5360 mm or the like) or a single crystal silicon rod with a length of about 800 mm or the like commonly seen in silicon rod processing, or a polycrystalline silicon rod obtained by using a deposition technique such as a chemical vapor deposition technique to deposit silicon on the surface of a silicon core wire, but is not limited thereto. In other possible embodiments of the present application, the square silicon rod cutting and grinding all-in-one machine can also be used to cut off a single crystal silicon rod or other long strip-shaped hard materials that need to be cut off.

[0061] Referring to Figures 1 to 2 wherein, Figure 1 a state diagram of the square silicon rod cutting and grinding all-in-one machine in an embodiment of the present application is shown, Figure 2 a top view of the square silicon rod cutting and grinding all-in-one machine in an embodiment of the present application is shown. As Figure 1 and Figure 2 The square silicon rod cutting and grinding all-in-one machine comprises a machine base 11, a cutting device 12, a silicon rod transfer device 13, and a silicon rod grinding device 14.

[0062] The square silicon rod cutting and grinding all-in-one machine will be described in detail below.

[0063] The machine base 11 is the main component of the square silicon rod cutting and grinding all-in-one machine, and is used to provide a silicon rod processing platform. In actual applications, the machine base has a large volume and weight to provide a large mounting surface and firm overall stability. It should be understood that the machine base can serve as a seat for different structural or component units of the square silicon rod cutting and grinding all-in-one machine, and the specific structure of the machine base can be changed based on different functional or structural requirements. In some examples, the machine base comprises a fixing structure or a limiting structure such as a base, a column, a frame, etc. for receiving different components of the square silicon rod cutting and grinding all-in-one machine.

[0064] Meanwhile, in some examples, the machine base can be an integrated base, and in some examples, the machine base can comprise a plurality of independent bases.

[0065] The machine base has a silicon rod processing platform, which can be divided into multiple functional areas according to the specific operation content of the silicon rod processing operation. For example, in some embodiments, the silicon rod processing platform includes a cutting area and a grinding area. In some embodiments, the silicon rod processing platform includes a cutting area, a grinding area, and an unloading area. In some embodiments, the silicon rod processing platform includes a waiting area, a cutting area, a grinding area, and an unloading area. It should be noted that in each example provided in this application, the functional area is defined by the travel path and range of the processing device at the functional area, for example, the cutting device of the square silicon rod cutting and grinding integrated machine is arranged at the cutting area, and the range of the cutting area is the range occupied by the cutting device during the completion of the square cutting operation. Similarly, the grinding device of the square silicon rod cutting and grinding integrated machine is arranged at the grinding area, and the range of the grinding area is the range occupied by the grinding device during the completion of the grinding operation. The shape of the silicon rod processing platform can be determined according to the machine base, or can be determined according to the machine base and the processing needs of the cutting device and the grinding device. In Figure 1 and Figure 2 In the embodiments shown in the figures, the machine base 1 has a silicon rod processing platform, which is provided with functional areas such as a loading and unloading area, a cutting area, and a grinding area. The cutting device is arranged at the cutting area and is used to perform transverse cutting operation on the original square silicon rod located at the cutting area to form a first square silicon rod and a second square silicon rod. The grinding device is arranged at the grinding area and is used to perform cutting surface grinding operation on the silicon rod located at the grinding area.

[0066] In the embodiments shown in the figures, Figure 1 and Figure 2 Each functional area is arranged in parallel along the second direction, where in the following description, the first direction refers to the length direction of the square silicon rod cutting and grinding integrated machine, the second direction is perpendicular to the first direction and can form a horizontal plane with the first direction, i.e., the second direction refers to the width direction of the square silicon rod cutting and grinding integrated machine. For example, when the square silicon rod cutting and grinding integrated machine includes a cutting area and a grinding area, the cutting area and the grinding area are arranged in parallel along the second direction. When the square silicon rod cutting and grinding integrated machine includes a loading and unloading area, a cutting area, and a grinding area, the loading and unloading area, the cutting area, and the grinding area can be arranged in parallel along the second direction, and the loading and unloading area can be located between the cutting area and the grinding area. When the square silicon rod cutting and grinding integrated machine includes a loading area, a cutting area, a grinding area, and an unloading area, the cutting area and the grinding area can be arranged in parallel along the second direction, the loading area can be arranged before and after the cutting area along the first direction, and the grinding area can be arranged before and after the unloading area along the first direction, and so on.

[0067] The cutting device 12 is arranged at a cutting area of the silicon rod processing platform, and is configured to perform a horizontal cutting operation on a horizontally placed original square silicon rod at the cutting area to form a first square silicon rod and a second square silicon rod stacked one above another.

[0068] In Figure 1 and Figure 2 In the embodiment shown, the cutting device 12 includes a cutting frame 121, a cutting support 122, a plurality of cutting wheels 123, and a cutting wire 124. The cutting frame 121 is arranged on the base 11, the cutting support 122 is movably arranged on the cutting frame 121 along a vertical direction, the plurality of cutting wheels 123 are arranged on the cutting support 122, and the cutting wire 124 is wound around the plurality of cutting wheels 123 to form at least one cutting wire saw 125 arranged along a second direction.

[0069] In the silicon rod cutting and grinding all-in-one machine, the workpiece to be processed is a square silicon rod (hereinafter referred to as an original square silicon rod in the following description to distinguish from a square silicon rod processed by cutting and grinding). The original square silicon rod is formed after relevant square cutting and grinding operations, i.e., the original square silicon rod is a silicon rod with a cross section in a rectangular shape, which includes a rectangle with four right angles, a rectangle with a folding edge or an arc to be rounded at a corner, etc.

[0070] In relevant processing techniques for silicon rods, several processes such as square cutting, surface grinding, rounding or chamfering, etc. are involved.

[0071] Generally, existing silicon rods are mostly in a cylindrical structure. A silicon rod is subjected to square cutting by a silicon rod square cutting device, so that the cross section of the silicon rod after square cutting is in a rectangular shape (including a square shape). The rectangular shape includes a rectangle with orthogonal adjacent sides or an angle within a predetermined angle range, a rectangle with a rounded corner between adjacent sides, a rectangle with a connecting short side between adjacent sides, etc.

[0072] For example, in some related art, a single crystal silicon rod is formed by first cutting a long silicon rod into multiple short silicon rods using a silicon rod cutting machine, and then cutting the short silicon rods into square-shaped single crystal silicon rods using a silicon rod squaring machine. The specific implementation of cutting a long silicon rod into multiple short silicon rods using a silicon rod cutting machine can be found in, for example, CN105856445A, CN105946127A, and CN105196A. The specific implementation of cutting the short silicon rods into square-shaped single crystal silicon rods using a silicon rod squaring machine can be found in, for example, CN105818285A. However, the formation of a single crystal silicon rod is not limited to the above-mentioned techniques. In alternative examples, a single crystal silicon rod can be formed by first cutting a long silicon rod into a square-shaped long single crystal silicon rod using a full silicon rod squaring machine, and then cutting the long single crystal silicon rod into short single crystal silicon rods using a silicon rod cutting machine. The specific implementation of cutting a long silicon rod into a square-shaped long single crystal silicon rod using a full silicon rod squaring machine can be found in, for example, CN003443A.

[0073] After the cylindrical single crystal silicon rod is cut into a square-shaped single crystal silicon rod using a squaring machine, the square-shaped single crystal silicon rod can be further processed by a grinding machine to perform face grinding, rounding, chamfering, and the like. The specific implementation of performing face grinding, rounding, chamfering, and the like on a square-shaped single crystal silicon rod using a grinding machine can be found in, for example, CN105835247A.

[0074] In addition, the cutting and grinding operations described above can be performed in the same silicon rod processing equipment, such as a silicon rod cutting and grinding all-in-one machine. The silicon rod cutting and grinding all-in-one machine can perform both the cutting and grinding operations on a cylindrical silicon rod to form a square-shaped single crystal silicon rod. The specific implementation of performing the cutting and grinding operations on a cylindrical silicon rod to form a square-shaped single crystal silicon rod using a silicon rod cutting and grinding all-in-one machine can be found in, for example, CN112297264A and CN112297263A.

[0075] Therefore, the square-shaped single crystal silicon rod described in the present application has the following characteristics: the cross-section of the square-shaped single crystal silicon rod is square-shaped, the four sides of the square-shaped single crystal silicon rod have been ground, and the edges (e.g., corners, edge connecting surfaces, etc.) of the four sides of the square-shaped single crystal silicon rod have been chamfered / rounded.

[0076] As shown in the figures, in the present application, the original square silicon rod is placed in a horizontal manner at the cutting area of the silicon rod processing platform, and when placed, the original square silicon rod is placed along the length of the square silicon rod cutting and grinding integrated machine, that is, the axis of the original square silicon rod is consistent with the first direction.

[0077] The square silicon rod cutting and grinding integrated machine of the present application includes a silicon rod bearing device arranged at the cutting area of the silicon rod processing platform for bearing the original square silicon rod.

[0078] The cross-cut operation of the original square silicon rod placed horizontally at the cutting area by the cutting device can specifically include relative movement of the cutting device and the silicon rod bearing device in the first direction, and cross-cut operation of the original square silicon rod borne by the silicon rod bearing device by the at least one cutting wire saw.

[0079] In order to enable the original square silicon rod to be stably placed at the cutting area, the silicon rod bearing device can include a silicon rod side clamping mechanism for clamping the original square silicon rod. As shown in Figure 1 and Figure 2 The silicon rod bearing device includes a silicon rod side clamping mechanism 15.

[0080] The silicon rod side clamping mechanism 15 is intended to clamp the side of the original square silicon rod.

[0081] The number of silicon rod side clamping mechanisms 15 can be one or more. For example, in some embodiments, the number of silicon rod side clamping mechanisms is one, and this one silicon rod side clamping mechanism is located at the central position of the cutting area for clamping the middle position of the side of the original square silicon rod. In some embodiments, the number of silicon rod side clamping mechanisms is two or more, and the multiple silicon rod side clamping mechanisms can be sequentially arranged at the cutting area in the first direction for clamping different positions of the side of the original square silicon rod.

[0082] In some embodiments, the silicon rod side clamping mechanism includes a side clamping support, at least two side clamping members, and a side clamping drive unit.

[0083] The side clamping support is fixed on the silicon rod processing platform. The side clamping support not only can serve as a basic component for mounting other components (such as side clamping members and side clamping drive units), but also can serve as a bearing component for the original square silicon rod.

[0084] The at least two side clamping members are arranged on opposite sides of the side clamping support in the second direction. The at least two side clamping members have a side clamping space therebetween.

[0085] The number of the side clamping members can be two or more. For example, in some embodiments, the number of the side clamping members can be two, for example, forming a pair of side clamping members, and the two side clamping members are respectively arranged on opposite sides of the side clamping support along the second direction. In some embodiments, the number of the side clamping members can be four, for example, forming two pairs of side clamping members, and the two side clamping members in any one pair of side clamping members are respectively arranged on opposite sides of the side clamping support along the second direction. However, the side clamping members can also be arranged in a non-paired manner. For example, in some embodiments, the number of the side clamping members can be three, for example, two side clamping members are arranged on one side and the other side clamping member is arranged on the other side.

[0086] In addition, the size of the side clamping members is not limited. In some embodiments, the size of each side clamping member included is the same. For example, in the embodiments including two side clamping members forming a pair of side clamping members or four side clamping members forming two pairs of side clamping members, in some embodiments, the size of each side clamping member included can not be exactly the same. For example, in the aforementioned embodiment including two side clamping members, the sizes of the two side clamping members can not be the same. For another example, in the aforementioned embodiment including three side clamping members, the sizes of the two side clamping members arranged on the same side can be relatively small, and the size of the third side clamping member arranged on the other side can be relatively large.

[0087] In addition, the side clamping members can be partially movable. For example, the side clamping members arranged on one side can be movable, and the side clamping members arranged on the other side can be fixed, or the side clamping members arranged on both sides can be movable.

[0088] In addition, the side clamping members can be partially movable. For example, the side clamping members arranged on one side can be movable, and the side clamping members arranged on the other side can be fixed, or the side clamping members arranged on both sides can be movable. In some embodiments, taking two side clamping members as an example, one of the two side clamping members is fixed as a support, and the other side clamping member is movable and can move along the second direction. In some embodiments, both of the two side clamping members are movable and can move along the second direction.

[0089] The side clamping driving unit is used to drive at least one of the at least two side clamping members to move along the second direction to adjust the side clamping space.

[0090] As mentioned above, in some embodiments, the first one of the two side clamping members is fixed as a backstop, and the second one of the two side clamping members is movable, and the side clamping driving unit is configured to drive the second one of the two side clamping members to move towards the first one of the two side clamping members in the second direction to reduce the side clamping space between the two side clamping members or to move away from the first one of the two side clamping members in the second direction to increase the side clamping space between the two side clamping members. In some embodiments, both of the two side clamping members are movable, and the side clamping driving unit is configured to drive both of the two side clamping members to move towards each other in the second direction to reduce the side clamping space between the two side clamping members or to move away from each other in the second direction to increase the side clamping space between the two side clamping members.

[0091] As to the side clamping driving unit, in some embodiments, the side clamping driving unit can include a driving cylinder with a telescopic rod, or a driving hydraulic cylinder. Taking the driving cylinder as an example, the driving cylinder is fixedly arranged, and the telescopic rod is associated with the movable side clamping member(s). In this way, the movable side clamping member(s) can be driven to move in the second direction by the driving cylinder.

[0092] In some embodiments, the side clamping driving unit can include a lead screw and a driving motor, wherein the lead screw is associated with the movable side clamping member(s), and the driving motor is configured to drive the lead screw to rotate in forward and reverse directions to drive the movable side clamping member(s) to move in the second direction. When both of the two side clamping members are movable, the lead screw can be designed as a bidirectional lead screw, which can be referred to as a left-right rotation lead screw, or a forward-reverse tooth lead screw, one end of which is provided with left-hand screw threads, and the other end of which is provided with right-hand screw threads. In this way, the driving motor is configured to drive the bidirectional lead screw to rotate in forward and reverse directions to drive both of the two side clamping members to move towards each other or away from each other in the second direction.

[0093] In addition, the silicon rod carrying device can further include a first silicon rod end clamping mechanism for clamping the end of the raw square silicon rod. Figure 1 As shown in FIGS. 16 and 17, the silicon rod carrying device further includes a first silicon rod end clamping mechanism 16. Figure 2 As shown in FIGS. 16 and 17, the silicon rod carrying device further includes a first silicon rod end clamping mechanism 16.

[0094] The first silicon rod end clamping mechanism 16 is configured to clamp the end of the raw square silicon rod.

[0095] In some embodiments, the first silicon rod end clamping mechanism includes a first end clamping support, at least two first end clamping members, and a first end clamping driving unit. Figure 1 As shown in FIGS. 16 and 17, the first silicon rod end clamping mechanism 16 can include a first end clamping support, at least two first end clamping members, and a first end clamping driving unit. 2 As shown in FIGS. 16 and 17, the first silicon rod end clamping mechanism 16 can include a first end clamping support, at least two first end clamping members, and a first end clamping driving unit.

[0096] The first end clamping support is fixed on the silicon rod processing platform.

[0097] At least two first end clamping members are arranged at opposite ends of the first end clamping support along the first direction. The at least two first end clamping members have a first end clamping space therebetween.

[0098] As previously described, the original square silicon rod located in the cutting area is subjected to cross-cutting operation by the cutting device to form the first square silicon rod and the second square silicon rod stacked one above the other. Assuming that among the first square silicon rod and the second square silicon rod stacked one above the other, the one located at the upper side is the first square silicon rod and the one located at the lower side is the second square silicon rod, in order to ensure the stability of the original square silicon rod during cross-cutting operation and to avoid the collapse or cutting ripples between the first square silicon rod and the second square silicon rod due to mutual displacement, the first end clamping member needs to at least contact the end face of the first square silicon rod to be formed. In some embodiments, the first end clamping member clamps the upper part of the end face of the original square silicon rod (the range of the upper part of the end face of the original square silicon rod only covers the end face of the first square silicon rod to be formed), so that the second square silicon rod at the lower side is clamped by the aforementioned silicon rod side clamping mechanism, and the first square silicon rod at the upper side can be clamped by the first silicon rod end clamping mechanism. In some embodiments, the first end clamping member clamps most or even all of the end face of the original square silicon rod (the range of most or even all of the end face of the original square silicon rod covers the end face of the second square silicon rod to be formed and the end face of the first square silicon rod), so that the first end clamping member can effectively clamp the first square silicon rod and the second square silicon rod to be formed. See Figure 3 the state shown.

[0099] In actual application, taking two first end clamping members as an example, the two first end clamping members in the silicon rod first end clamping mechanism can be partially movable, that is, at least one first end clamping member arranged at one end can be designed to be movable, for example, one first end clamping member arranged at one end is fixed and the other first end clamping member arranged at the other end is movable, or both first end clamping members arranged at both ends are movable. In some embodiments, taking two first end clamping members as an example, one of the two first end clamping members is fixed as a support, and the other first end clamping member is movable and can move along the first direction. In some embodiments, both first end clamping members are movable and can move along the first direction.

[0100] The first end clamping driving unit is used to drive at least one of the at least two first end clamping members to move along the first direction to adjust the first end clamping space.

[0101] As mentioned above, in some embodiments, one of the two first end clamping members is fixed as a backstop, and the other is movable. In this case, the first end clamping driving unit can be used to drive the movable first end clamping member to move towards the fixed first end clamping member in the first direction to reduce the first end clamping space between them or to move away from the fixed first end clamping member in the first direction to expand the first end clamping space between them. In some embodiments, both of the two first end clamping members are movable. In this case, the first end clamping driving unit can be used to drive the two first end clamping members to move towards each other in the first direction to reduce the first end clamping space between them or to move away from each other in the first direction to expand the first end clamping space between them.

[0102] Regarding the first end clamping driving unit, in some embodiments, the first end clamping driving unit can include a driving cylinder with a telescopic rod. For example, the driving cylinder is fixedly arranged, and the telescopic rod is associated with the movable first end clamping member(s). In this way, the movable first end clamping member(s) can be driven to move in the first direction by the driving cylinder.

[0103] In some embodiments, the first end clamping driving unit can include a lead screw and a driving motor. The lead screw is associated with the movable first end clamping member(s), and the driving motor is used to drive the lead screw to rotate in forward and reverse directions to drive the movable first end clamping member(s) to move in the first direction. When both of the two first end clamping members are movable, the lead screw can be designed as a bidirectional lead screw, which can also be referred to as a left-right rotating lead screw or a forward-reverse threaded lead screw. One end of the bidirectional lead screw is left-handed, and the other end is right-handed. In this way, the driving motor is used to drive the bidirectional lead screw to rotate in forward and reverse directions to drive the two first end clamping members to move towards each other or away from each other in the first direction.

[0104] The cutting device is arranged at a cutting position of the silicon rod processing platform and is used to perform a cross-cutting operation on the horizontally placed original square silicon rod at the cutting position to form the first square silicon rod and the second square silicon rod stacked one above the other.

[0105] In some embodiments, the cutting device includes a cutting frame, a cutting support, a plurality of cutting wheels, and a cutting wire. The cutting frame is arranged on the base, the cutting support is movably arranged on the cutting frame in the vertical direction, the plurality of cutting wheels are arranged on the cutting support, and the cutting wire is wound around the plurality of cutting wheels to form at least one cutting wire saw arranged in the second direction. The combination of the cutting support, the plurality of cutting wheels, and the cutting wire can also be referred to as a wire cutting unit.

[0106] As mentioned above, the cross-cutting operation on the horizontally placed raw silicon rod at the cutting area is achieved by the relative movement between the cutting device and the silicon rod carrying device along the first direction, and thus can be achieved by different implementations.

[0107] In some implementations, the silicon rod carrying device is fixed at the cutting area of the silicon rod processing platform, and the cutting frame in the cutting device is movably arranged in the machine base along the first direction by a cutting frame traveling mechanism.

[0108] In some embodiments, the cutting frame traveling mechanism includes a first traveling guide rail and a first traveling drive unit.

[0109] The first traveling guide rail is arranged in the machine base along the first direction for arranging the cutting frame. In practical applications, the first traveling guide rail may, for example, include two rails arranged on opposite sides of the cutting frame along the second direction. The length of the first traveling guide rail in the first direction covers at least the entire cutting area to ensure the transfer of the cutting device within the cutting area.

[0110] The first traveling drive unit is used to drive the cutting frame to move along the first traveling guide rail.

[0111] Regarding the first traveling drive unit, in some implementations, the first traveling drive unit includes a first traveling rack, a first traveling gear, and a first gear drive motor. In practical applications, one first traveling drive unit is arranged on each of the opposite sides of the cutting device along the second direction, and the two first traveling drive units on the opposite sides can drive the cutting frame and the wire cutting unit (e.g., a cutting support, a plurality of cutting wheels, and a cutting wire) arranged thereon to move smoothly along the first traveling guide rail. The first traveling rack is arranged in the machine base along the first direction. The first traveling gear is associated with the cutting frame and engages with the first traveling rack, and the first gear drive motor is associated with the first traveling gear. In practical applications, the forward and reverse rotation of the first traveling gear driven by the first gear drive motor can drive the cutting frame to move along the first traveling guide rail relative to the machine base along the first direction. For example, the forward rotation of the first traveling gear driven by the first gear drive motor drives the cutting frame to move forward along the first traveling rack along the first direction, and the reverse rotation of the first traveling gear driven by the first gear drive motor drives the cutting frame to move backward along the first traveling rack along the first direction.

[0112] In other embodiments, the first travel driving unit can also include a first travel screw rod and a first screw rod driving motor, wherein the first travel screw rod is arranged along the first direction and associated with the cutting frame, and the first screw rod driving motor is associated with the first travel screw rod. In actual applications, driving the first travel screw rod to rotate forward or backward by the first screw rod driving motor can drive the cutting frame to move along the first travel guide rail in the first direction relative to the machine base. For example, driving the first travel screw rod to rotate forward by the first screw rod driving motor can drive the cutting frame to move forward along the first travel guide rail in the first direction, and driving the first travel screw rod to rotate backward by the first screw rod driving motor can drive the cutting frame to move backward along the first travel guide rail in the first direction.

[0113] In some embodiments, the cutting frame travel mechanism includes a travel suspension rail and a travel driving unit. The travel suspension rail is arranged on the top of the machine base along the first direction, and the travel driving unit can include a travel screw rod and a screw rod driving motor, wherein the travel screw rod is arranged along the first direction and associated with the cutting frame, and the screw rod driving motor is associated with the travel screw rod. Driving the screw rod to rotate forward or backward by the screw rod driving motor can drive the cutting device to move along the first direction. For example, driving the screw rod to rotate forward by the screw rod driving motor can drive the cutting frame (i.e., the cutting device) to move forward along the first travel rack in the first direction, and driving the screw rod to rotate backward by the screw rod driving motor can drive the cutting frame (i.e., the cutting device) to move backward along the first travel rack in the first direction.

[0114] In other embodiments, the travel driving unit can also include a travel rack, a travel gear, and a gear driving motor, the implementation of which can refer to the description of the aforementioned first travel driving unit, which will not be described here.

[0115] In some implementations, the silicon rod carrying device is movably arranged in the cutting area of the silicon rod processing platform along the first direction by a silicon rod conveying mechanism, and the cutting frame is movably arranged in the machine base along the first direction by a cutting frame travel mechanism or fixedly arranged in the machine base.

[0116] Regarding the silicon rod conveying mechanism, in some embodiments, the silicon rod conveying mechanism includes a conveying guide rail and a conveying driving unit.

[0117] The conveying guide rail is arranged on the machine base along the first direction for arranging the silicon rod carrying device.

[0118] The conveying drive unit is configured to drive the silicon rod carrying device to move along the conveying guide rail. In some embodiments, the conveying drive unit can include a conveying screw rod and a screw rod drive motor. In some embodiments, the conveying drive unit can include a conveying rack, a conveying gear, and a gear drive motor.

[0119] As can be seen from the above, by relative movement of the cutting device and the silicon rod carrying device in the first direction, the at least one cutting wire saw performs cross-cutting work on the raw silicon rod carried by the silicon rod carrying device.

[0120] In the embodiments as shown in Figure 1 and Figure 2 In the embodiments as shown in

[0121] In the embodiments as shown in Figure 1 The conveying mechanism includes a conveying guide rail and a conveying drive unit.

[0122] The conveying guide rail is arranged along the first direction on the base frame and is configured to arrange the silicon rod carrying device. The length of the conveying guide rail in the first direction covers at least the entire cutting area, and in the embodiments as shown in Figure 1 In the embodiments as shown in

[0123] The conveying drive unit can include a conveying screw rod and a screw rod drive motor, wherein the conveying screw rod is arranged along the first direction and is associated with the silicon rod carrying device (which includes the silicon rod side clamping mechanism 15 and the first silicon rod end clamping mechanism 16), and the screw rod drive motor is associated with the conveying screw rod. In actual applications, by driving the conveying screw rod to rotate forward or backward by the screw rod drive motor, the silicon rod carrying device (which includes the silicon rod side clamping mechanism 15 and the first silicon rod end clamping mechanism 16) can be driven to move along the conveying guide rail in the first direction relative to the base frame. For example, by driving the conveying screw rod to rotate forward by the screw rod drive motor, the silicon rod carrying device (which includes the silicon rod side clamping mechanism 15 and the first silicon rod end clamping mechanism 16) can be driven to move forward along the conveying guide rail in the first direction, to move from the external waiting area to the cutting area; by driving the conveying screw rod to rotate backward by the screw rod drive motor, the silicon rod carrying device (which includes the silicon rod side clamping mechanism 15 and the first silicon rod end clamping mechanism 16) can be driven to move backward along the conveying guide rail in the first direction, to move from the cutting area to the external waiting area.

[0124] The cutting frame of the cutting device is fixedly arranged on the base. Figure 1 In the illustrated embodiment, the cutting frame 121 adopts an X-shaped frame structure, and four ends of the X-shaped frame structure are fixedly arranged on the base 11 through support columns 1211.

[0125] The cutting support is movably arranged on the cutting frame in a vertical direction. Figure 1 As shown, the cutting support 122 is movably arranged on the cutting frame 121 through a first lifting mechanism.

[0126] In some embodiments, the first lifting mechanism can include a first lifting guide rail and a first lifting driving unit.

[0127] The first lifting guide rail is arranged on the cutting frame in a vertical direction, and Figure 1 In the illustrated embodiment, the four support columns 1211 can serve as the first lifting guide rail, and the cutting support 122 is provided with sleeves or arc-shaped sliding blocks corresponding to the four support columns 1211.

[0128] The first lifting driving unit can include a first lifting screw rod and a first lifting motor, the first lifting screw rod being associated with the cutting support, and the first lifting motor being associated with the lifting screw rod. Figure 1 In the illustrated embodiment, the lifting screw rod 1221 is arranged at a central intersection position of the X-shaped frame structure serving as the cutting frame 121, connecting the X-shaped frame structure and the cutting support 122 below, and the first lifting motor 1222 is arranged on the X-shaped frame structure serving as the cutting frame 121. The first lifting motor and the first lifting screw rod can drive the cutting support to move vertically along the first lifting guide rail. For example, the first lifting motor drives the first lifting screw rod to rotate forward, driving the cutting support to move vertically upward along the first lifting guide rail; the first lifting motor drives the first lifting screw rod to rotate reversely, driving the cutting support to move vertically downward along the first lifting guide rail. In some embodiments, the first lifting mechanism can include a first lifting guide rail, a first lifting sliding block, and a first lifting driving unit, wherein the first lifting sliding block can be arranged on the cutting support and correspond to the first lifting guide rail. The structure of the first lifting guide rail and the first lifting driving source and their functions can be referred to the foregoing description.

[0129] The plurality of cutting wheels are arranged on the cutting support, and the cutting wire is wound on the plurality of cutting wheels to form a cutting wire saw.

[0130] In practical applications, the cutting device can include at least two cutting wheels, which can combine a cutting wheel set, i.e., two cutting wheels opposite to each other along the second direction form a cutting wheel set.

[0131] The cutting lines are sequentially wound around the cutting wheels to form a cutting line net. In practical applications, the cutting lines are sequentially wound around the two cutting wheels to form a cutting line saw along the second direction.

[0132] Of course, the cutting device can also include guide wheels for the transition guidance of the cutting lines. As shown in Figure 1 The cutting device can also include guide wheels 126. The guide wheels can be not limited to one. In addition, in some embodiments, the cutting device can also include tension wheels arranged on the cutting support line rack and / or the cutting frame for tension adjustment of the cutting lines.

[0133] In some embodiments, the cutting device also includes a take-up and pay-off unit. For example, the take-up and pay-off unit can include a pay-off drum and a take-up drum, which can be arranged on the machine base or the cutting frame.

[0134] In some embodiments, the cutting lines are wound around the plurality of cutting wheels to form a closed loop cutting line with the first end connected to the second end. In this example, the cutting device can be free of a wire storage drum, etc., and the closed loop cutting line can be run by a cutting line driving device to achieve cutting. The closed loop cutting line can avoid the influence of the acceleration and deceleration process of the cutting line on the cutting precision during the running process to perform cutting, so that the cutting precision is improved, and the problems of the existing cutting method, such as the corrugated cutting surface caused by the running reversal or running speed of the cutting line, are avoided. At the same time, the closed loop cutting line can effectively reduce the total length of the cutting line required by the cutting device and reduce the production cost.

[0135] In the embodiments as shown in Figure 1 and Figure 2 The cutting support 122 is similar to the cutting frame and can also be an X-shaped mounting structure arranged horizontally, and the first cutting wheel, the second cutting wheel, the first guide wheel, and the second guide wheel are arranged on the four branches of the X-shaped mounting structure as the cutting support 122, respectively.

[0136] Referring to Figure 3 , which shows a partial structural schematic view of the cutting device and the silicon rod carrying device in Figure 1 As shown in Figure 3As shown, the wheel surface of the first cutting wheel 1231 is parallel or coplanar with the wheel surface of the second cutting wheel 1232, the first guide wheel 1261 is located adjacent to the first cutting wheel 1231, and the second guide wheel 1262 is located adjacent to the second cutting wheel 1232. Specifically, the first cutting wheel 1231 and the second cutting wheel 1232 are located at the front side of the cutting area (close to the waiting area) and are arranged along the second direction, i.e., the first cutting wheel 1231 is on the left and the second cutting wheel 1232 is on the right, the first guide wheel 1261 is located at the rear side of the first cutting wheel 1231, and the second guide wheel 1262 is located at the rear side of the second cutting wheel 1232 and is located at the right side of the first guide wheel 1261. In the wire cutting unit, the cutting wire 124 is a closed loop cutting wire, i.e., the cutting wire 124 is wound in a ring shape with the first end connected to the tail end between the first cutting wheel 1231, the second cutting wheel 1232, the second guide wheel 1262, and the first guide wheel 1261, wherein the cutting wire segment wound between the first cutting wheel 1231 and the second cutting wheel 1232 forms a cutting wire saw 125. The cutting wire saw 125 is arranged along the second direction, and the original square silicon rod carried by the corresponding processing station (the silicon rod carrying device includes a silicon rod side clamping mechanism 15 and a first silicon rod end clamping mechanism 16) is placed horizontally (the axial center line of the original square silicon rod is arranged along the first direction), so that the length of the cutting wire saw is adapted to the size of the end face of the original square silicon rod, for example, the length of the cutting wire saw is greater than or equal to the width of the end face of the original square silicon rod, in order to achieve transverse cutting of the original square silicon rod.

[0137] In addition, as mentioned above, in order to ensure the stability of the original square silicon rod during transverse cutting and to avoid edge collapse or cutting surface ripples between the first square silicon rod and the second square silicon rod due to mutual displacement, the first end clamping member in the first silicon rod end clamping mechanism at least needs to be in contact with the end face of the first square silicon rod to be formed, for example, the first end clamping member clamps and contacts the upper part of the end face of the original square silicon rod (the range of the upper part of the end face of the original square silicon rod only covers the end face of the first square silicon rod to be formed), or the first end clamping member clamps and contacts most or even all of the end face of the original square silicon rod (the range of most or even all of the end face of the original square silicon rod covers the end face of the second square silicon rod to be formed and the end face of the first square silicon rod), in which case the first end clamping member may interfere with the cutting wire saw during transverse cutting. Therefore, in actual application, as shown in FIG. 1, the first end clamping member 1211 is arranged on the right side of the first guide wheel 1261, and the second end clamping member 1212 is arranged on the left side of the second guide wheel 1262. Figure 4As shown, the driving bearing device can be first driven to move the original square silicon rod to the cutting position and make the front end surface of the square silicon rod close to the cutting wire saw 125, and then the first silicon rod end clamping mechanism 16 clamps the two end surfaces of the original square silicon rod. At this time, the cutting wire saw 125 is located inside the first end clamping piece of the first silicon rod end clamping mechanism 16, and the cutting wire saw 125 will not interfere with the first end clamping piece of the first silicon rod end clamping mechanism 16 during the cross-cutting operation, ensuring the smooth execution of the cross-cutting operation.

[0138] As shown in Figure 1 and Figure 3 The first cutting wheel, the second cutting wheel, the first guide wheel, and the second guide wheel provided on the four branches of the X-shaped mounting structure serving as the cutting support 122 can form a quadrilateral, which can be, for example, a rectangle, a trapezoid, or other irregular quadrilateral.

[0139] In addition, the first guide wheel and the second guide wheel are used for reversing or guiding the cutting wire (the guide wheel can also be referred to as a reversing wheel or a transition wheel). In some embodiments, the first guide wheel and the second guide wheel can be used to adjust the tension of the cutting wire (the guide wheel that adjusts the tension can also be referred to as a tension wheel). For example, the first guide wheel or the second guide wheel can serve as a tension wheel, and by adjusting the first guide wheel or the second guide wheel, the tension of the closed-loop cutting wire can be adjusted. Taking the first guide wheel as a tension wheel as an example, a tension adjustment mechanism can be configured for the first guide wheel, and the tension adjustment mechanism can be used to drive the first guide wheel to move on the corresponding branch of the X-shaped mounting structure serving as the cutting support 122 to adjust the tension of the closed-loop cutting wire. For example, driving the first guide wheel to move towards the end on the corresponding branch increases the tension of the closed-loop cutting wire; driving the first guide wheel to move towards the central intersection position of the X-shaped mounting structure on the corresponding branch reduces the tension of the closed-loop cutting wire. In some embodiments, the tension adjustment mechanism can be, for example, a guide rail, a lead screw, and a driving motor.

[0140] In some embodiments, the cutting device further comprises at least one distance adjustment mechanism for driving the plurality of cutting wheels to move relative to the cutting frame in a direction perpendicular to the cutting wheel surface. The cutting device can switch the cutting wire between different cutting grooves of the cutting wheel based on the distance adjustment mechanism, or adjust the position of the cutting wire saw to change the cutting position (or processing specification) relative to the silicon rod.

[0141] In some implementations, the carrier for carrying the plurality of cutting wheels and the guide wheels is a cutting support, and the distance adjusting mechanism is configured to drive the cutting support as a whole to move along the vertical direction of the cutting wheel surface, and the guide wheels move along with the cutting wheels to follow the movement of the cutting support along the vertical direction of the cutting wheel surface, in which case the plurality of cutting wheels and the guide wheels are relatively static, i.e., the positional relationship between the guide wheels and the cutting wheels is unchanged. At this time, the distance adjusting mechanism is configured to adjust the cutting position of the at least one wire saw in the at least one wire cutting unit relative to the silicon rod.

[0142] In some implementations, each cutting wheel has at least two cutting wire slots, and different cutting wire slots are parallel to each other and have a cutting offset in the vertical direction of the cutting wheel surface. When the distance adjusting mechanism is configured to drive the plurality of cutting wheels in the wire cutting unit to move relative to the cutting support, the position of the cutting wire wound around the wire slots on the cutting wheels can be changed. In some implementations, the plurality of cutting wheels can be connected to a support, in which the support is movably arranged on the cutting support and is driven by the distance adjusting mechanism to move along the vertical direction of the cutting wheel surface.

[0143] When the at least one distance adjusting mechanism is configured to change the cutting wire slots around the plurality of cutting wheels, in actual scenarios, the cutting wire slots to which the cutting wire corresponds before and after the change of the cutting wire slots can be determined in advance, for example, the position of the cutting wire before the change of the cutting wire slots is cutting wire slot a1, and the cutting wire is wound around cutting wire slot a2 after the change of the cutting wire slots. Based on the cutting offset between cutting wire slot a1 and cutting wire slot a2, the displacement of the plurality of cutting wheels driven by the at least one distance adjusting mechanism is determined, i.e., the displacement is set as the cutting offset between cutting wire slot a1 and cutting wire slot a2, so as to change the cutting wire from cutting wire slot a1 to cutting wire slot a2. It should be noted that the direction in which the plurality of cutting wheels in the wire cutting unit move along the vertical direction of the cutting wheel surface is the direction in which cutting wire slot a2 points to cutting wire slot a1, and the cutting position of the wire saw in space is unchanged after the change of the cutting wire slots. Therefore, the step of further calibrating the position of the cutting wheel or other components can be omitted, and the silicon rod can be cut according to the preset cutting amount, so that the change of the cutting wire slots is simplified.

[0144] In some embodiments, the distance adjusting mechanism comprises a screw rod arranged along the orthogonal direction of the cutting wheel surface and threadedly connected to the mounting structure of the plurality of cutting wheels, and a screw rod driving source for driving the screw rod to rotate. In some embodiments, the distance adjusting mechanism comprises a telescopic member arranged along the orthogonal direction of the cutting wheel surface and associated with the mounting structure of the plurality of cutting wheels, a telescopic member driving source for driving the telescopic member to perform telescopic movement along the orthogonal direction of the cutting wheel surface. In some embodiments, the distance adjusting mechanism comprises a distance adjusting rack arranged along the orthogonal direction of the cutting wheel surface and associated with the mounting structure of the plurality of cutting wheels, a transmission gear meshing with the distance adjusting rack, and a gear driving source for driving the transmission gear to rotate.

[0145] In some embodiments, the cutting device further comprises a wire saw adjusting mechanism for adjusting the length of the cutting wire saw to adapt to the cutting position of the raw square silicon rod (i.e. the end surface of the raw square silicon rod) to be cut. For example, when the cutting position of the raw square silicon rod to be cut is large, the length of the cutting wire saw can be increased; when the cutting position of the raw square silicon rod to be cut is small, the length of the cutting wire saw can be shortened.

[0146] In the cross-cutting operation of the raw square silicon rod using the cutting device, first, the raw square silicon rod to be processed is stably positioned using the silicon rod side clamping mechanism and the first silicon rod end clamping mechanism; the cutting support is raised and lowered by the first lifting mechanism to adjust the height position of the cutting wire saw, and after adjustment, the cutting wire saw corresponds to the cutting position in the raw square silicon rod; the silicon rod carrying device (including the silicon rod side clamping mechanism and the first silicon rod end clamping mechanism) and the raw square silicon rod carried thereby are driven by the silicon rod conveying mechanism to move forward along the first direction and enter the cutting area; in the moving process, the end surface of the raw square silicon rod is contacted and entered by the cutting wire saw to perform cross-cutting operation, and the silicon rod carrying device is continuously moved and the cross-cutting operation is performed by the cutting wire saw until the cutting wire saw moves through the raw square silicon rod and moves out of the raw square silicon rod, i.e. the cross-cutting operation of the raw square silicon rod is completed, so that the raw square silicon rod is formed into a first square silicon rod and a second square silicon rod stacked up and down after cross-cutting operation. If the cutting position of the cutting wire is exactly the middle position of the raw square silicon rod in height, the raw square silicon rod is cut in half into a first square silicon rod and a second square silicon rod with consistent specifications after cross-cutting operation.

[0147] The grinding device is arranged at the grinding area of the silicon rod processing platform and is used for performing cutting surface grinding operation on the first square silicon rod and the second square silicon rod horizontally placed at the grinding area.

[0148] As shown in the figure, in the cutting area, the original square silicon rod is cut by the cutting device to form a first square silicon rod and a second square silicon rod, and in the grinding area, the first square silicon rod and the second square silicon rod are placed in a horizontal manner in the grinding area of the silicon rod processing platform, and when placed, the first square silicon rod and the second square silicon rod are placed along the length, that is, the axis of the first square silicon rod is consistent with the first direction, and the axis of the second square silicon rod is consistent with the first direction.

[0149] In order to stably place the first square silicon rod and the second square silicon rod in the grinding area, the square silicon rod cutting and grinding all-in-one machine includes at least two second square silicon rod end clamping mechanisms arranged in the cutting area of the silicon rod processing platform. Since the first square silicon rod and the second square silicon rod are formed after being cut, two second square silicon rod end clamping mechanisms can be included, respectively used for clamping the first square silicon rod and the second square silicon rod.

[0150] In some embodiments, the at least two second square silicon rod end clamping mechanisms are arranged side by side along the second direction in the grinding area of the silicon rod processing platform. In some embodiments, the at least two second square silicon rod end clamping mechanisms are arranged front and back along the first direction in the grinding area of the silicon rod processing platform.

[0151] In the embodiments as shown in Figure 1 and Figure 2 , the square silicon rod cutting and grinding all-in-one machine includes two second square silicon rod end clamping mechanisms 17 arranged front and back along the first direction in the grinding area of the silicon rod processing platform.

[0152] The second square silicon rod end clamping mechanism 17 is intended to clamp the end of the first square silicon rod or the second square silicon rod.

[0153] In some embodiments, the second square silicon rod end clamping mechanism includes a second end clamping support, at least two second end clamping pieces, and a second end clamping driving unit. As shown in Figure 1 and 2 , the second square silicon rod end clamping mechanism 17 can include a second end clamping support, at least two second end clamping pieces, and a second end clamping driving unit.

[0154] The second end clamping support is fixed on the silicon rod processing platform. The second end clamping support can not only serve as a basic component for mounting other components (such as the second end clamping piece and the second end clamping driving unit), but also serve as a bearing component for the first square silicon rod or the second square silicon rod.

[0155] The at least two second end clamping pieces are arranged at opposite ends of the second end clamping support along the first direction. The at least two second end clamping pieces have an end clamping space therebetween.

[0156] In practical applications, taking two second end clamping members as an example, the second end clamping members in the second silicon rod end clamping mechanism can be partially movable, that is, at least one of the second end clamping members arranged at one end can be designed to be movable, for example, one of the second end clamping members arranged at one end is fixed and the other second end clamping member arranged at the other end is movable, or both of the second end clamping members arranged at both ends are movable. In some embodiments, taking two second end clamping members as an example, one of the second end clamping members is fixed as a support and the other second end clamping member is movable, which can move in the first direction. In some embodiments, both of the second end clamping members are movable, which can move in the first direction.

[0157] The second end clamping driving unit is used to drive at least one of the at least two second end clamping members to move in the first direction to adjust the end clamping space.

[0158] As mentioned above, in some embodiments, one of the two second end clamping members is fixed as a support and the other second end clamping member is movable, so that the second end clamping driving unit can be used to drive the movable second end clamping member to move in the first direction to face the fixed first end clamping member to reduce the end clamping space between them or to move in the first direction to move away from the fixed first end clamping member to expand the end clamping space between them. In some embodiments, both of the second end clamping members are movable, so that the second end clamping driving unit can be used to drive the two second end clamping members to move in the first direction to face each other to reduce the end clamping space between them or to move in the first direction to move away from each other to expand the end clamping space between them.

[0159] Regarding the second end clamping driving unit, in some embodiments, the second end clamping driving unit can include a driving cylinder with a telescopic rod, for example, a driving cylinder is fixedly arranged, and the telescopic rod is associated with the one or the two second end clamping members. In this way, the movable (one or two) second end clamping members can be driven to move in the first direction by the driving cylinder.

[0160] In some embodiments, the second end clamping driving unit can include a screw rod and a driving motor, wherein the screw rod is associated with the movable second end clamping piece(s), and driving the screw rod to rotate in forward and reverse directions by the driving motor can drive the movable second end clamping piece(s) to move in the first direction. When both of the second end clamping pieces are movable, the screw rod can be a bidirectional screw rod, which can also be referred to as a left-right screw rod or a forward-reverse thread screw rod, having left thread at one end and right thread at the other end. In this way, driving the bidirectional screw rod to rotate in forward and reverse directions by the driving motor can drive the two second end clamping pieces to move towards each other or away from each other in the first direction.

[0161] In addition, in some embodiments, the second silicon rod end clamping mechanism can further include a silicon rod overturning component for overturning the clamped first or second silicon rod by a predetermined angle, which can be any angle in the range of 0° to 30°, any angle in the range of 0° to 60°, or even any angle in the range of 0° to 90°, wherein the angle is not limited to an integer degree.

[0162] The grinding device is arranged at a grinding position of the silicon rod processing platform, and is used for performing a cutting surface grinding operation on the horizontally placed first and second silicon rods at the grinding position.

[0163] In the embodiments shown in Figure 1 and Figure 2 , the grinding device 14 includes a grinding frame 141, a grinding support 142, and at least one grinding wheel 143, and the at least one grinding wheel 143 can be used to perform a cutting surface grinding operation on the first and second silicon rods.

[0164] Due to the difference in layout of the first and second silicon rods at the grinding position, the grinding device also has different settings.

[0165] In the embodiments shown in Figure 1 and Figure 2 , the two second silicon rod end clamping mechanisms 17 are arranged at the grinding position of the silicon rod processing platform in the first direction. Correspondingly, in the grinding device 14, the grinding frame 141 is movably arranged in the first direction on the machine base 11, the grinding support 142 is movably arranged in the vertical direction on the grinding frame 141, and the at least one grinding wheel 143 is arranged on the grinding support 142.

[0166] In some embodiments, the at least one grinding wheel in the grinding device includes any one of the following combinations: at least one chamfering grinding wheel; at least one flat grinding wheel and at least one chamfering / rounding grinding wheel.

[0167] For example, in some embodiments, the at least one face chamfering grinding wheel can include a coarse face chamfering grinding wheel, a fine face chamfering grinding wheel, or a combination of a coarse face chamfering grinding wheel and a fine face chamfering grinding wheel.

[0168] For example, in some embodiments, the coarse face chamfering grinding wheel and the fine face chamfering grinding wheel are independent components, wherein the coarse face chamfering grinding wheel and the fine face chamfering grinding wheel can be arranged along the first direction, wherein the coarse face chamfering grinding wheel is in front of the fine face chamfering grinding wheel, i.e., coarse face chamfering is performed by the coarse face chamfering grinding wheel first and then fine face chamfering is performed by the fine face chamfering grinding wheel. In some embodiments, the coarse face chamfering grinding wheel and the fine face chamfering grinding wheel are nested with each other. For example, the coarse face chamfering grinding wheel is nested in the fine face chamfering grinding wheel, or the fine face chamfering grinding wheel is nested in the coarse face chamfering grinding wheel.

[0169] For example, in some embodiments, the at least one face chamfering grinding wheel can include a coarse face chamfering grinding wheel, a fine face chamfering grinding wheel, or a combination of a coarse face chamfering grinding wheel and a fine face chamfering grinding wheel.

[0170] For example, in some embodiments, the coarse face chamfering grinding wheel and the fine face chamfering grinding wheel are independent components, wherein the coarse face chamfering grinding wheel and the fine face chamfering grinding wheel can be arranged along the first direction, wherein the coarse face chamfering grinding wheel is in front of the fine face chamfering grinding wheel, i.e., coarse face chamfering is performed by the coarse face chamfering grinding wheel first and then fine face chamfering is performed by the fine face chamfering grinding wheel. In some embodiments, the coarse face chamfering grinding wheel and the fine face chamfering grinding wheel are nested with each other. For example, the coarse face chamfering grinding wheel is nested in the fine face chamfering grinding wheel, or the fine face chamfering grinding wheel is nested in the coarse face chamfering grinding wheel.

[0171] In the silicon rod cutting and grinding all-in-one machine of the present application, the grinding device is moved relative to the machine base along the first direction by a grinding frame travel mechanism. Figure 1 and Figure 2 In the embodiments shown in FIGS. 1 and 2, the grinding frame travel mechanism is arranged along the first direction at the grinding area.

[0172] In some embodiments, the grinding frame travel mechanism includes a second travel guide rail and a second travel drive unit.

[0173] The second travel guide rail is arranged along a first direction on the machine base and is used to set the grinding frame. In practical applications, the second travel guide rail may, for example, include two rails, which are respectively arranged on opposite sides of the grinding frame along a second direction. The length of the second travel guide rail along the first direction covers at least the entire grinding area, so as to ensure the transfer of the grinding device within the grinding area.

[0174] The second travel drive unit is used to drive the grinding frame to move along the second travel guide rail.

[0175] Regarding the second travel drive unit, in some embodiments, the second travel drive unit includes a second travel rack, a second travel gear, and a second gear drive motor. In practical applications, one second travel drive unit is arranged on each of the opposite sides of the grinding device along the second direction. The two second travel drive units on the opposite sides can drive the grinding frame, the grinding support arranged on the grinding frame, and at least one grinding wheel arranged on the grinding support to move smoothly along the second travel guide rail. The second travel rack is arranged along the first direction on the machine base. The second travel gear is associated with the grinding frame and is engaged with the second travel rack. The second gear drive motor is associated with the second travel gear. In practical applications, the forward and reverse rotation of the second travel gear driven by the second gear drive motor can drive the grinding frame to move along the second travel guide rail relative to the machine base along the first direction. For example, the forward movement of the grinding frame along the second travel guide rail along the first direction (the forward movement refers to the movement towards the grinding area) is driven by the forward rotation of the second travel gear driven by the second gear drive motor. The backward movement of the grinding frame along the second travel guide rail along the first direction (the backward movement refers to the movement away from the grinding area) is driven by the reverse rotation of the second travel gear driven by the second gear drive motor.

[0176] In addition, the grinding frame travel mechanism can also adopt other structures. For example, in other embodiments, the second travel drive unit can also include a second travel screw rod and a second screw rod drive motor, wherein the second travel screw rod is arranged along the first direction and is associated with the grinding frame, and the second screw rod drive motor is associated with the second travel screw rod. In practical applications, the forward and reverse rotation of the second travel screw rod driven by the second screw rod drive motor can drive the grinding frame to move along the second travel guide rail relative to the machine base along the first direction. For example, the forward movement of the grinding frame along the second travel guide rail along the first direction (the forward movement refers to the movement towards the grinding area) is driven by the forward rotation of the second travel screw rod driven by the second screw rod drive motor. The backward movement of the grinding frame along the second travel guide rail along the first direction (the backward movement refers to the movement away from the grinding area) is driven by the reverse rotation of the second travel screw rod driven by the second screw rod drive motor.

[0177] In addition, in some embodiments, the grinding frame can also be movably arranged in the second direction on the base through a first grinding frame advancing and retreating mechanism.

[0178] In some embodiments, the first grinding frame advancing and retreating mechanism can include a first advancing and retreating guide rail and a first advancing and retreating driving unit. In some embodiments, the first grinding frame advancing and retreating mechanism can include a first advancing and retreating guide rail, a first advancing and retreating slider corresponding to the first advancing and retreating guide rail, and a first advancing and retreating driving unit.

[0179] The first advancing and retreating guide rail is arranged in the second direction on the base. The first advancing and retreating driving unit can include a first advancing and retreating screw rod associated with the grinding frame and a first advancing and retreating driving motor associated with the first advancing and retreating screw rod. The grinding frame and the at least one grinding wheel thereon are driven to move left and right along the advancing and retreating guide rail in the second direction relative to the base by driving the first advancing and retreating screw rod to rotate forward and backward by the first advancing and retreating driving motor. For example, the first advancing and retreating driving motor drives the first advancing and retreating screw rod to rotate forward, driving the grinding frame and the at least one grinding wheel thereon to move left along the first advancing and retreating guide rail in the second direction (close to the second silicon rod end clamping mechanism); the first advancing and retreating driving motor drives the first advancing and retreating screw rod to rotate backward, driving the grinding frame and the at least one grinding wheel thereon to move right along the first advancing and retreating guide rail in the second direction (away from the second silicon rod end clamping mechanism).

[0180] In the silicon rod cutting and grinding all-in-one machine of the present application, the grinding support is movably arranged on the grinding frame through a second lifting mechanism. Figure 1 and Figure 2 In the embodiment shown, the grinding support 142 is movably arranged on the grinding frame 141 through a second lifting mechanism.

[0181] In some embodiments, the second lifting mechanism can include a second lifting guide rail and a second lifting driving unit, wherein the second lifting guide rail is arranged on the grinding frame along the vertical direction, and the second lifting driving unit can include a second lifting screw rod and a second lifting motor, and the second lifting screw rod is associated with the grinding support. The second lifting motor and the second lifting screw rod can be used to drive the grinding support to move vertically along the second lifting guide rail. For example, the second lifting motor drives the second lifting screw rod to rotate forward, thereby driving the grinding support to move vertically upward along the second lifting guide rail; the second lifting motor drives the second lifting screw rod to rotate reversely, thereby driving the grinding support to move vertically downward along the second lifting guide rail. In some embodiments, the second lifting mechanism can include a second lifting guide rail, a second lifting slider, and a second lifting driving unit, wherein the second lifting slider can be arranged on the grinding support and correspond to the second lifting guide rail. The structure of the second lifting guide rail and the second lifting driving unit and their functions can be referred to the foregoing description.

[0182] In some embodiments, the two second silicon rod end clamping mechanisms are arranged side by side along the second direction at the grinding area of the silicon rod processing platform. Correspondingly, the grinding device includes: a grinding base movably arranged along the first direction on the machine base; a grinding frame movably arranged along the second direction on the grinding base; a grinding support movably arranged along the vertical direction on the grinding frame; and at least one grinding wheel arranged on the grinding support for grinding and chamfering / rounding the first and second square silicon rods.

[0183] The grinding base is movably arranged along the first direction on the machine base.

[0184] In the square silicon rod cutting and grinding all-in-one machine of the present application, the grinding base is moved relative to the machine base along the first direction by a grinding base traveling mechanism.

[0185] In some embodiments, the grinding base traveling mechanism includes a second traveling guide rail and a second traveling driving unit.

[0186] The second traveling guide rail is arranged along the first direction on the machine base for arranging the grinding base. In actual application, the second traveling guide rail can include two rails, for example, arranged on opposite sides of the grinding base along the second direction. The length of the second traveling guide rail along the first direction covers at least the entire grinding area, so as to ensure the transfer of the grinding device within the grinding area.

[0187] The second traveling driving unit is used to drive the grinding base to move along the second traveling guide rail.

[0188] As to the second travel drive unit, in some embodiments, the second travel drive unit comprises a second travel rack, a second travel gear and a second gear drive motor. In practical applications, the grinding device is provided with one second travel drive unit on each of the opposite sides in the second direction, and the two second travel drive units on the opposite sides can drive the grinding base, the grinding frame, the grinding support and the at least one grinding wheel arranged on the grinding base to move stably along the second travel rail. The second travel rack is arranged in the first direction on the machine base. The second travel gear is associated with the grinding base and engages with the second travel rack, and the second gear drive motor is associated with the second travel gear. In practical applications, the second travel gear can be driven by the second gear drive motor to move the grinding base along the second travel rail in the first direction relative to the machine base by driving the second travel gear to rotate in the forward direction or in the reverse direction. For example, the second gear drive motor drives the second travel gear to rotate in the forward direction, thereby driving the grinding base to move forward along the second travel rack in the first direction (forward movement refers to movement towards the grinding area); the second gear drive motor drives the second travel gear to rotate in the reverse direction, thereby driving the grinding base to move backward along the second travel rack in the first direction (backward movement refers to movement away from the grinding area).

[0189] In addition, the (backward movement refers to movement away from the grinding area) travel mechanism can also adopt other structures, for example, the (backward movement refers to movement away from the grinding area) travel mechanism comprises a second travel rail, a second travel screw rod and a second drive motor. Among them, the second travel rail is arranged in the first direction, the second travel screw rod is arranged in the first direction and is associated with the grinding frame, and the second screw rod drive motor is associated with the second travel screw rod. Its implementation can refer to the description of the foregoing second travel drive mechanism, which will not be described here.

[0190] In the silicon rod cutting and grinding all-in-one machine of the present application, the grinding frame is movably arranged on the grinding base in the second direction by a grinding frame advancing and retreating mechanism.

[0191] In some embodiments, the second grinding frame advancing and retreating mechanism can comprise a second advancing and retreating rail and a second advancing and retreating drive unit. In some embodiments, the second grinding frame advancing and retreating mechanism can comprise a second advancing and retreating rail, a second advancing and retreating slider corresponding to the second advancing and retreating rail, and a second advancing and retreating drive unit.

[0192] The second advancing and retreating guide rail is arranged on the grinding base of the grinding device along a second direction. The second advancing and retreating driving unit can include a second advancing and retreating screw rod and a second advancing and retreating driving motor, the second advancing and retreating screw rod being associated with the grinding frame, and the second advancing and retreating driving motor being associated with the second advancing and retreating screw rod. The second advancing and retreating driving motor is used to drive the second advancing and retreating screw rod to rotate forward and backward, so as to drive the grinding frame and the at least one grinding wheel thereon to move left and right along the second advancing and retreating guide rail relative to the grinding base along a second direction. For example, the second advancing and retreating driving motor drives the second advancing and retreating screw rod to rotate forward, so as to drive the grinding frame and the at least one grinding wheel thereon to move left (close to the second silicon rod end clamping mechanism) along the second advancing and retreating guide rail along a second direction. The second advancing and retreating driving motor drives the second advancing and retreating screw rod to rotate backward, so as to drive the grinding frame and the at least one grinding wheel thereon to move right (away from the second silicon rod end clamping mechanism) along the second advancing and retreating guide rail along a second direction.

[0193] In the square silicon rod cutting and grinding all-in-one machine, the grinding seat is movably arranged on the grinding frame along a vertical direction by a second lifting mechanism.

[0194] In some embodiments, the second lifting mechanism can include a second lifting guide rail and a second lifting driving unit, wherein the second lifting guide rail is arranged on the grinding frame along a vertical direction, and the second lifting driving unit can include a second lifting screw rod and a second lifting motor, the second lifting screw rod being associated with the grinding support. The second lifting motor and the second lifting screw rod are used to drive the grinding support to move up and down along the second lifting guide rail along a vertical direction. For example, the second lifting motor drives the second lifting screw rod to rotate forward, so as to drive the grinding support to move up along the second lifting guide rail along a vertical direction. The second lifting motor drives the second lifting screw rod to rotate backward, so as to drive the grinding support to move down along the second lifting guide rail along a vertical direction. In some embodiments, the second lifting mechanism can include a second lifting guide rail, a second lifting sliding block, and a second lifting driving unit, wherein the second lifting sliding block is arranged on the grinding support and corresponds to the second lifting guide rail. The structure and function of the second lifting guide rail and the second lifting driving unit can be referred to the foregoing description.

[0195] In the present application, the square silicon rod cutting and grinding all-in-one machine further includes a silicon rod transfer device for transferring the original square silicon rod, the first square silicon rod, and the second square silicon rod.

[0196] In the present application, the silicon rod transfer device specifically performs the following work: transferring the original square silicon rod from the loading and unloading area to the cutting area, transferring the first square silicon rod and the second square silicon rod formed after the cutting operation in the cutting area to the grinding area, and transferring the first square silicon rod and the second square silicon rod after the grinding operation in the grinding area to the loading and unloading area.

[0197] In Figure 1 And Figure 2 In the embodiment shown in FIG. 1, the silicon rod transfer device 13 is hoisted on the top of the machine base.

[0198] In some embodiments, the two second silicon rod end clamping mechanisms are arranged at the grinding area of the silicon rod processing platform along the first direction. Correspondingly, the silicon rod transfer device 13 comprises: a transfer clamp 131 comprising a clamp base, at least one pair of clamp arms arranged at opposite ends of the clamp base, and a clamp arm driving mechanism, wherein the at least one pair of clamp arms are provided with clamping portions and clamping portion rotating mechanisms; a transfer translation mechanism 132 for driving the transfer clamp 131 to move along the second direction; a transfer running mechanism 133 for driving the transfer clamp 131 to move along the first direction; and a transfer lifting mechanism for driving the transfer clamp 131 to move up and down along the vertical direction.

[0199] The clamp arm driving mechanism is configured to drive at least one of the at least one pair of clamp arms to move so as to adjust the clamping distance between the pair of clamp arms.

[0200] In some embodiments, the clamp arm driving mechanism can comprise: a screw rod arranged along the length direction of the clamp base and associated with at least one of the pair of clamp arms; and a driving unit configured to drive the screw rod to rotate so as to drive the associated at least one of the pair of clamp arms to move along the length direction of the clamp base.

[0201] In some embodiments, the clamp arm driving mechanism can comprise: a bidirectional screw rod arranged along the length direction of the clamp base and associated with the pair of clamp arms at both ends; and a driving unit configured to drive the bidirectional screw rod to rotate so as to drive the pair of clamp arms to move towards each other or away from each other along the first direction.

[0202] The clamp arm driving mechanism is not limited to the above, and can also adopt structures such as telescopic rods, driving cylinders, and driving hydraulic cylinders.

[0203] The pair of clamp arms are provided with clamping portions. In this application, the clamping portions are designed to be rotatable, for example, the transfer clamp further comprises clamping portion rotating mechanisms for driving the clamping portions on the clamp arms of the transfer clamp to rotate.

[0204] In some embodiments, the clamping portion of the clamping arms is rotatable under the driving of a clamping portion rotating mechanism provided in the setting, and the clamped silicon rod is rotatable about an axis (which can be, for example, the clamping center of the clamping portion). For example, a rotating driving unit is associated with at least one of the two clamping portions provided on the two clamping arms, for example, the rotating driving unit is associated with one of the clamping portions. The rotating driving unit can be, for example, a rotating motor. The associated clamping portion is rotatable under the driving of the rotating motor, and the clamped first or second silicon rod is rotatable, so that the side surface of the clamped first or second silicon rod can be adjusted.

[0205] In some embodiments, the clamping portion has a multi-point contact clamping head

[0206] The transfer translation mechanism is used to drive the transfer clamp to move along the second direction.

[0207] In some embodiments, the transfer translation mechanism can include a translation guide rail and a translation driving unit. In some embodiments, the transfer translation mechanism can include a translation guide rail, a translation slider corresponding to the translation guide rail, and a translation driving unit. The translation guide rail is provided on the top of the base along the second direction. The translation driving unit can include a translation screw rod associated with the transfer clamp and a driving motor associated with the translation screw rod. The driving motor drives the translation screw rod to drive the transfer clamp to move along the translation guide rail along the second direction. For example, the driving motor drives the translation screw rod to rotate forward to drive the transfer clamp to move along the translation guide rail along the second direction to the left (close to the cutting area); the driving motor drives the translation screw rod to rotate reversely to drive the transfer clamp to move along the translation guide rail along the second direction to the right (close to the grinding area).

[0208] The transfer lifting mechanism is used to drive the transfer clamp to move up and down along the vertical direction.

[0209] In some embodiments, the transfer lifting mechanism can include a transfer lifting guide rail and a transfer lifting driving unit, wherein the transfer lifting guide rail is arranged on the grinding frame along the vertical direction, and the transfer lifting driving unit can include a transfer lifting screw rod and a transfer lifting motor, and the transfer lifting screw rod is associated with the transfer clamp. The transfer lifting motor and the transfer lifting screw rod are used to drive the transfer clamp to move vertically along the transfer lifting guide rail. For example, the transfer lifting motor drives the transfer lifting screw rod to rotate forward, thereby driving the transfer clamp to move vertically upward along the transfer lifting guide rail; the transfer lifting motor drives the transfer lifting screw rod to rotate backward, thereby driving the transfer clamp to move vertically downward along the transfer lifting guide rail. In some embodiments, the transfer lifting mechanism can include a transfer lifting guide rail, a transfer lifting slider, and a transfer lifting driving unit, wherein the transfer lifting slider is arranged on the transfer clamp and corresponds to the transfer lifting guide rail. The structure and function of the transfer lifting guide rail and the transfer lifting driving unit are described above.

[0210] The transfer feeding mechanism is used to drive the transfer clamp to move in the first direction.

[0211] In some embodiments, the transfer feeding mechanism can include a transfer feeding guide rail and a transfer feeding driving unit. In some embodiments, the transfer feeding mechanism can include a transfer feeding guide rail, a transfer feeding slider corresponding to the transfer feeding guide rail, and a transfer feeding driving unit. The transfer feeding guide rail is arranged on the top of the base along the first direction. The transfer feeding driving unit can include a transfer feeding screw rod associated with the transfer clamp and a driving motor associated with the transfer feeding screw rod. The driving motor is used to drive the transfer feeding screw rod to rotate forward and backward, thereby driving the transfer clamp to move forward and backward along the transfer feeding guide rail in the first direction. For example, the driving motor drives the transfer feeding screw rod to rotate forward, thereby driving the transfer clamp to move forward along the transfer feeding guide rail in the first direction; the driving motor drives the transfer feeding screw rod to rotate backward, thereby driving the transfer clamp to move backward along the transfer feeding guide rail in the first direction.

[0212] In some embodiments, the two second silicon rod end clamping mechanisms are arranged side by side along the second direction at the grinding position of the silicon rod processing platform. Correspondingly, the silicon rod transfer device includes a transfer clamp, a transfer translation mechanism, and a transfer lifting mechanism. The transfer clamp includes a clamp seat, at least one pair of clamp arms arranged at opposite ends of the clamp seat, and a clamp arm driving mechanism. The at least one pair of clamp arms are provided with clamping portions and clamping portion rotating mechanisms. The transfer translation mechanism is used to drive the transfer clamp to move in the second direction. The transfer lifting mechanism is used to drive the transfer clamp to move vertically.

[0213] The clamping arm driving mechanism is configured to drive at least one of the clamping arms to move so as to adjust the clamping distance between the two clamping arms.

[0214] In some embodiments, the clamping arm driving mechanism can include a screw rod arranged along the length direction of the clamping base and associated with at least one of the clamping arms; and a driving unit configured to drive the screw rod to rotate so as to drive the associated at least one clamping arm to move along the length direction of the clamping base.

[0215] In some embodiments, the clamping arm driving mechanism can include a bidirectional screw rod arranged along the length direction of the clamping base and associated with the two clamping arms at two ends; and a driving unit configured to drive the bidirectional screw rod to rotate so as to drive the two clamping arms to move towards or away from each other in a first direction.

[0216] The clamping arm driving mechanism is not limited to the above, and can also be a telescopic rod, a driving cylinder or a driving hydraulic cylinder.

[0217] The two clamping arms are provided with clamping portions. In this application, the clamping portions are designed to rotate, for example, the transfer clamp further includes a clamping portion rotating mechanism configured to drive the clamping portions on the clamping arms to rotate.

[0218] In some embodiments, the clamping portions on the clamping arms can be driven to rotate by the clamping portion rotating mechanism, and the clamped silicon rod can rotate around an axis (which can be, for example, the clamping center of the clamping portion). For example, a rotating driving unit is associated with at least one of the two clamping portions provided on the two clamping arms, for example, the rotating driving unit is associated with one of the clamping portions. The rotating driving unit can be, for example, a rotating motor. The associated clamping portion can be driven to rotate by the rotating motor, and the first side silicon rod or the second side silicon rod can be driven to rotate, so that the side surface of the first side silicon rod or the second side silicon rod can be adjusted.

[0219] In some embodiments, the clamping portion has a multi-point contact clamping head

[0220] The transfer translation mechanism is configured to drive the transfer clamp to move in a second direction.

[0221] In some embodiments, the transfer and translation mechanism may include a translation guide rail and a translation drive unit. In some embodiments, the transfer and translation mechanism may include a translation guide rail, a translation slider corresponding to the translation guide rail, and a translation drive unit. The translation guide rail is disposed on the top of the base along a second direction. The translation drive unit may include a translation screw and a drive motor. The translation screw is associated with the transfer fixture, and the drive motor is associated with the translation screw. The drive motor drives the translation screw to rotate forward and backward to drive the transfer fixture to move left and right along the translation guide rail along the second direction. For example, the drive motor drives the translation screw to rotate forward, driving the transfer fixture to move left along the translation guide rail along the second direction; the drive motor drives the translation screw to rotate backward, driving the transfer fixture to move right along the translation guide rail along the second direction.

[0222] The transfer lifting mechanism is used to drive the transfer clamp to move up and down in the vertical direction.

[0223] In some embodiments, the transfer lifting mechanism may include a transfer lifting guide rail and a transfer lifting drive unit. The transfer lifting guide rail is vertically mounted on the grinding frame, and the transfer lifting drive unit may include a transfer lifting screw and a transfer lifting motor. The transfer lifting screw is associated with the transfer fixture. The transfer lifting motor and the transfer lifting screw can drive the transfer fixture to move vertically up and down along the transfer lifting guide rail. For example, the transfer lifting motor drives the transfer lifting screw to rotate clockwise, driving the transfer fixture to move vertically upward along the transfer lifting guide rail; the transfer lifting motor drives the transfer lifting screw to rotate counterclockwise, driving the transfer fixture to move vertically downward along the transfer lifting guide rail. In some embodiments, the transfer lifting mechanism may include a transfer lifting guide rail, a transfer lifting slider, and a transfer lifting drive unit. The transfer lifting slider may be mounted on the transfer fixture and correspond to the transfer lifting guide rail. For the structure and function of the transfer lifting guide rail and the transfer lifting drive unit, please refer to the preceding description.

[0224] When using Figures 1 to 2When the illustrated silicon rod transfer device performs the transfer operation of transferring the first square silicon rod and the second square silicon rod at the cutting zone to the grinding zone, the transfer translation mechanism is used to drive the transfer clamp to move to the cutting zone along the second direction; the transfer lifting mechanism is used to drive the transfer clamp to move up and down along the vertical direction, and the clamping arm driving mechanism is used to drive the clamping arm in the transfer clamp to act, so as to clamp the opposite two ends of the upper first square silicon rod in the first square silicon rod and the second square silicon rod stacked up and down; the transfer lifting mechanism is used to lift the transfer clamp, and the transfer translation mechanism is used to drive the transfer clamp to move to the grinding zone along the second direction; the transfer feeding mechanism is used to drive the transfer clamp to move along the first direction, so that the position of the transfer clamp corresponds to the first second silicon rod end clamping mechanism at the grinding zone; the transfer lifting mechanism is used to lower the transfer clamp, and the clamping arm driving mechanism is used to drive the clamping arm in the transfer clamp to act, so as to place the first square silicon rod on the first second silicon rod end clamping mechanism. It is worth noting that for the square silicon rod after the cross-cutting, the grinding surface at the grinding zone is the cutting surface in the cross-cutting operation at the cutting zone, so for the first square silicon rod, the cutting surface is actually the bottom surface, and therefore when the first square silicon rod is placed on the first second silicon rod end clamping mechanism, the bottom surface of the first square silicon rod also needs to be turned up. In this embodiment, the clamping part rotating mechanism is used to drive the clamping part to rotate, for example, to rotate by 180°, so as to turn the cutting surface of the first square silicon rod originally located at the bottom to the top. The turning operation can be performed when the first square silicon rod is just clamped at the cutting zone, or can be performed before the transfer clamp is moved to the grinding zone position and placed on the first second silicon rod end clamping mechanism, and is not limited thereto.

[0225] Subsequently, the transfer of the second square silicon rod is performed, the transfer translation mechanism is used to drive the transfer clamp to move to the cutting zone along the second direction; the transfer lifting mechanism is used to drive the transfer clamp to move up and down along the vertical direction, and the clamping arm driving mechanism is used to drive the clamping arm in the transfer clamp to act, so as to clamp the opposite two ends of the remaining second square silicon rod; the transfer lifting mechanism is used to lift the transfer clamp, and the transfer translation mechanism is used to drive the transfer clamp to move to the grinding zone along the second direction; the transfer feeding mechanism is used to drive the transfer clamp to move along the first direction, so that the position of the transfer clamp corresponds to the second second silicon rod end clamping mechanism at the grinding zone; the transfer lifting mechanism is used to lower the transfer clamp, and the clamping arm driving mechanism is used to drive the clamping arm in the transfer clamp to act, so as to place the second square silicon rod on the second second silicon rod end clamping mechanism. Since the cutting surface of the second square silicon rod is originally at the top, it is not necessary to turn the second square silicon rod.

[0226] Subsequently, the grinding operation of the cutting surface of the first square silicon rod and the second square silicon rod can be performed by using the grinding device, that is, the grinding operation of the cutting surface of the first square silicon rod and the second square silicon rod is performed by at least one grinding wheel in the grinding device.

[0227] For example, the grinding and chamfering / cylindricalizing operation of the cutting surface of the first and second square silicon rods by at least one grinding and chamfering wheel includes grinding operation and chamfering / cylindricalizing operation.

[0228] For the grinding operation, it can generally include: using the silicon rod transfer device to transfer the first and second square silicon rods at the cutting position to the grinding position, using the second silicon rod end clamping mechanism to clamp and position the first and second square silicon rods at the grinding position, wherein when clamped and positioned by the second silicon rod end clamping mechanism, the first and second square silicon rods are horizontally placed with the cutting surface facing upwards, i.e., the cutting surface of the first square silicon rod is horizontally placed as a top surface, and the cutting surface of the second square silicon rod is horizontally placed as a top surface; adjusting the position of at least one grinding wheel in the grinding device, driving the grinding device to travel in a first direction, and performing grinding operation on the cutting surface of the first and second square silicon rods by the at least one grinding wheel.

[0229] For the chamfering / cylindricalizing operation, in some embodiments, the position of at least one grinding wheel can be adjusted so that the grinding wheel surface of at least one grinding wheel is adjusted from horizontal to have a predetermined inclination angle (the inclination angle can be, for example, any angle in the range of 40° to 60°, not limited to an integer degree), or, in some embodiments, the first or second square silicon rod to be ground is flipped by a predetermined inclination angle. For example, in some implementations, the first or second square silicon rod can be placed on the second silicon rod end clamping mechanism at a predetermined inclination angle by using the silicon rod transfer device (as shown in the state of Figure 5 Alternatively, in some implementations, the second silicon rod end clamping mechanism further includes a silicon rod flipping component for flipping the first or second square silicon rod by a predetermined angle.

[0230] For example, at least one flat grinding wheel and at least one chamfering / cylindricalizing grinding wheel are used, wherein the at least one flat grinding wheel is used for grinding operation of the first or second square silicon rod, and the at least one chamfering / cylindricalizing grinding wheel is used for chamfering / cylindricalizing operation of the first or second square silicon rod. In some embodiments, two oppositely arranged chamfering / cylindricalizing grinding wheels 144 can be included, which can be set at a predetermined inclination angle (as shown in the state of Figure 6 The inclination angle can be, for example, any angle in the range of 40° to 60°, not limited to an integer degree.

[0231] After the grinding operation is completed, the cutting surface of the first square silicon rod is ground and the edge connecting surface adjacent to the cutting surface is chamfered / cylindricalized, and the cutting surface of the second square silicon rod is ground and the edge connecting surface adjacent to the cutting surface is chamfered / cylindricalized.

[0232] In the silicon rod cutting and grinding integrated machine of the present application, a silicon rod unloading device is further included. The silicon rod unloading device is for example a conveyor belt device including a conveyor belt, which is arranged around two conveyor rollers arranged opposite to each other, at least one of the two conveyor rollers is connected to a conveyor driving unit, which can be for example a servo motor. By using the silicon rod unloading device, the first and second silicon rods after completing the grinding operation can be unloaded.

[0233] In the silicon rod cutting and grinding integrated machine of the present application, a silicon rod loading device is further included. The silicon rod loading device is for example a conveyor belt device including a conveyor belt, which is arranged around two conveyor rollers arranged opposite to each other, at least one of the two conveyor rollers is connected to a conveyor driving unit, which can be for example a servo motor. By using the silicon rod unloading device, the first and second silicon rods after completing the grinding operation can be unloaded.

[0234] In the silicon rod cutting and grinding integrated machine of the present application, a silicon rod loading device is further included. The silicon rod loading device is for example a conveyor belt device including a conveyor belt, which is arranged around two conveyor rollers arranged opposite to each other, at least one of the two conveyor rollers is connected to a conveyor driving unit, which can be for example a servo motor. By using the silicon rod unloading device, the first and second silicon rods after completing the grinding operation can be unloaded. Figure 1 and Figure 2 In the embodiments as shown in

[0235] In the silicon rod cutting and grinding integrated machine of the present application, in an optional embodiment, a silicon rod cleaning device can be further included. The silicon rod cleaning device can be arranged on the machine base for cleaning the silicon rod. For the silicon rod cleaning device, generally, after the above-mentioned working operation, the cutting debris generated during the operation will be attached to the surface of the silicon rod, therefore, if necessary, the silicon rod needs to be cleaned. Generally, the silicon rod cleaning device includes a cleaning brush head and a cleaning liquid spraying device cooperating with the cleaning brush head, during cleaning, the cleaning liquid spraying device sprays cleaning liquid to the silicon rod, at the same time, the cleaning brush head driven by the motor acts on the silicon rod to complete the cleaning operation. In actual application, the cleaning liquid can be for example pure water, and the cleaning brush head can be for example a rotary brush head.

[0236] The execution process of the silicon rod cutting and grinding integrated machine in the above-mentioned embodiments will be described below in combination with the drawings:

[0237] First, the original square silicon rod to be processed is transferred and placed in the cutting position by using the silicon rod loading device and the silicon rod transfer device, the side of the original square silicon rod is clamped by the side clamping mechanism, and the end of the original square silicon rod is clamped by the first end clamping mechanism, wherein the center line of the original square silicon rod is consistent with the first direction. The state as shown in Figure 7 is formed.

[0238] The original square silicon rod in the cutting position is cross-cut by using the cutting device, so that the original square silicon rod forms the first and second square silicon rods stacked vertically after cross-cutting. The state as shown in Figure 8 is formed.

[0239] The first square silicon rod and the second square silicon rod are sequentially transferred to the grinding position by the silicon rod transfer device, and the first square silicon rod and the second square silicon rod are clamped and positioned by the two second silicon rod end clamping mechanisms arranged in front and back along the first direction at the grinding position. The grinding device is used to sequentially perform grinding operation on the cutting surface of the first square silicon rod and the second square silicon rod at the grinding position. The grinding operation on the cutting surface specifically includes face grinding operation of the cutting surface and chamfering / rounding operation of two edges related to the cutting surface. In actual application, the face grinding operation of the cutting surface of the first square silicon rod and the second square silicon rod can be performed by the grinding wheel in the grinding device; then, the positions of the first square silicon rod and the second square silicon rod are adjusted, the first square silicon rod and the second square silicon rod are turned by a first predetermined angle, the first edge related to the cutting surface of the first square silicon rod and the first edge related to the cutting surface of the second square silicon rod are upward, and the first chamfering / rounding operation is performed on the first edge related to the cutting surface of the first square silicon rod and the first edge related to the cutting surface of the second square silicon rod by the grinding wheel in the grinding device; then, the positions of the first square silicon rod and the second square silicon rod are adjusted again, the first square silicon rod and the second square silicon rod are turned by a second predetermined angle, the second edge related to the cutting surface of the first square silicon rod and the second edge related to the cutting surface of the second square silicon rod are upward, and the second chamfering / rounding operation is performed on the second edge related to the cutting surface of the first square silicon rod and the second edge related to the cutting surface of the second square silicon rod by the grinding wheel in the grinding device. The state shown in FIG. 8 is formed, in which, Figures 9 to 11 Figure 9 the state of performing the face grinding operation on the first square silicon rod and the second square silicon rod at the grinding position is shown, Figure 10 and Figure 11 the state of performing the chamfering / rounding operation on the first square silicon rod and the second square silicon rod at the grinding position is shown.

[0240] Finally, the first square silicon rod and the second square silicon rod after the grinding operation are transferred to the silicon rod unloading device by the silicon rod transfer device and then unloaded.

[0241] The square silicon rod cutting and grinding all-in-one machine disclosed in the application comprises a base, a cutting device, a silicon rod transfer device and a grinding device. The cutting device and the grinding device are arranged on the left and right sides. The horizontal original square silicon rod is cut by the cutting device to form the first square silicon rod and the second square silicon rod stacked vertically. The grinding device is used to perform grinding operation on the cutting surface of the first square silicon rod and the second square silicon rod after cutting, so as to complete the integrated operation of the half cutting and grinding of the original square silicon rod, improve the production efficiency and the quality of the product operation.

[0242] ​The above embodiments are only illustrative of the principles of the present application and its effects, and are not intended to limit the present application. Any modification or change made by any person skilled in the art without departing from the spirit and scope of the present application shall be covered by the claims of the present application.

Claims

1. A square silicon rod cutting and grinding all-in-one machine, characterized in that, The machine base has a silicon rod processing platform, and the silicon rod processing platform comprises a cutting area and a grinding area arranged along a second direction; The cutting device is arranged at the cutting area of the silicon rod processing platform, and the cutting device comprises at least one cutting wire saw arranged along the second direction, and the at least one cutting wire saw is used for performing cross-cutting work on a horizontal original square silicon rod arranged at the cutting area to form a first square silicon rod and a second square silicon rod stacked one above another. The original square silicon rod is a silicon rod with a cross section in the shape of a rectangle, and the center line of the original square silicon rod is consistent with the first direction. The second direction is perpendicular to the first direction and forms a horizontal plane with the first direction. The silicon rod transfer device is hung on the top of the machine base and is used for transferring the first square silicon rod and the second square silicon rod at the cutting area to the grinding area, and the silicon rod transfer device comprises a transfer clamp, a transfer translation mechanism used for driving the transfer clamp to move along the second direction, a transfer feeding mechanism used for driving the transfer clamp to move along the first direction, and a transfer lifting mechanism used for driving the transfer clamp to move up and down along the vertical direction. The transfer clamp comprises a clamp seat, at least one pair of clamp arms arranged at opposite ends of the clamp seat, and a clamp arm driving mechanism. The at least one pair of clamp arms are provided with clamping portions and clamping portion rotating mechanisms. The clamping portion rotating mechanisms are used for driving the clamping portions to rotate to turn over the cutting surface of the first square silicon rod arranged at the upper side.

2. The silicon ingot cutting and grinding all-in-one machine according to claim 1, characterized in that, The grinding device is arranged at the grinding area of the silicon rod processing platform and is used for performing grinding work on the cutting surface of the first square silicon rod and the second square silicon rod arranged horizontally at the grinding area. The center line of the first square silicon rod and the second square silicon rod is consistent with the first direction. The cutting device comprises: A cutting frame arranged at the machine base; A cutting support movably arranged at the cutting frame along the vertical direction; 3. The silicon ingot cutting and grinding all-in-one machine according to claim 2, characterized in that, A plurality of cutting wheels arranged at the cutting support; and 4. The silicon rod cutting and grinding all-in-one machine according to claim 2, characterized in that, A cutting wire wound around the plurality of cutting wheels to form at least one cutting wire saw. The cutting wire is wound around the plurality of cutting wheels to form a closed loop cutting wire with the first end connected to the second end. Further comprising:

5. The silicon ingot cutting and grinding all-in-one machine according to claim 4, characterized in that, A silicon rod carrying device arranged at the cutting area of the silicon rod processing platform; 6. The silicon ingot cutting and grinding all-in-one machine according to claim 4, wherein, The at least one cutting wire saw performs cross-cutting work on the original square silicon rod carried by the silicon rod carrying device through relative movement of the cutting device and the silicon rod carrying device along the first direction.

7. The silicon ingot cutting and grinding all-in-one machine according to claim 5 or 6, characterized in that, The silicon rod carrying device is fixedly arranged at the cutting area of the silicon rod processing platform, and the cutting frame is movably arranged at the machine base along the first direction through a cutting frame advancing mechanism. The silicon rod carrying device is movably arranged at the cutting area of the silicon rod processing platform along the first direction through a silicon rod conveying mechanism, and the cutting frame is movably arranged at the machine base along the first direction through a cutting frame advancing mechanism or is fixedly arranged at the machine base. The cutting frame advancing mechanism comprises:

8. The silicon ingot cutting and grinding all-in-one machine according to claim 7, characterized in that, A first advancing guide rail arranged at the machine base along the first direction and used for arranging the cutting frame; and A first advancing driving unit used for driving the cutting frame to move along the first advancing guide rail. The first advancing driving unit comprises: A first advancing rack arranged at the machine base along the first direction; and A first advancing gear arranged at the first advancing rack and used for driving the cutting frame to move along the first advancing guide rail. A first travel gear associated with the cutting frame and engaged with the first travel rack, and a first gear drive motor associated with the first travel gear.

9. The silicon ingot cutting and grinding all-in-one machine according to claim 5 or 6, characterized in that, The cutting frame travel mechanism comprises: A travel rail disposed on the top of the base along a first direction; and A travel screw disposed along a first direction and associated with the cutting frame of the cutting device, and a screw drive motor associated with the travel screw.

10. The silicon ingot cutting and grinding all-in-one machine according to claim 6, characterized in that, The silicon rod conveying mechanism comprises: A conveying rail disposed on the base along a first direction for disposing the silicon rod carrying device; and A conveying drive unit for driving the silicon rod carrying device to move along the conveying rail.

11. The silicon ingot cutting and grinding all-in-one machine according to claim 4, characterized in that, The silicon rod carrying device further comprises a silicon rod side clamping mechanism for clamping the side of the square silicon rod.

12. The silicon ingot cutting and grinding all-in-one machine according to claim 11, characterized in that, The silicon rod side clamping mechanism comprises: A side clamping support; At least two side clamping members disposed on opposite sides of the side clamping support along a second direction, the at least two side clamping members having a side clamping space therebetween; and A side clamping drive unit for driving at least one of the at least two side clamping members to move along the second direction to adjust the side clamping space.

13. The silicon ingot cutting and grinding all-in-one machine according to claim 4 or 11, characterized in that, The silicon rod carrying device further comprises a first silicon rod end clamping mechanism for clamping the end of the square silicon rod.

14. The silicon ingot cutting and grinding all-in-one machine according to claim 13, characterized in that, The first silicon rod end clamping mechanism comprises: A first end clamping support; At least two first end clamping members disposed on opposite ends of the first end clamping support along a first direction, the at least two first end clamping members having a first end clamping space therebetween; and A first end clamping drive unit for driving at least one of the at least two first end clamping members to move along the first direction to adjust the first end clamping space.

15. The silicon ingot cutting and grinding all-in-one machine according to claim 2, characterized in that, The cutting support is movably disposed on the cutting frame by a first lifting mechanism.

16. The silicon ingot slicing and polishing all-in-one machine according to claim 1, characterized in that, Further comprising: At least two second silicon rod end clamping mechanisms disposed in front of and behind the grinding area of the silicon rod processing platform along the first direction.

17. The silicon ingot cutting and grinding all-in-one machine according to claim 16, characterized in that, The grinding device comprises: A grinding frame movably disposed on the base along a first direction; A grinding support movably disposed on the grinding frame along a vertical direction; and At least one grinding wheel disposed on the grinding support for grinding and chamfering / rounding the first square silicon rod and the second square silicon rod.

18. The silicon ingot slicing and polishing all-in-one machine according to claim 17, wherein, The grinding device comprises a grinding frame travel mechanism, the grinding frame travel mechanism comprising: A second travel rail disposed on the base along a first direction for disposing the grinding frame; and A second travel drive unit for driving the grinding frame to move along the second travel rail.

19. The silicon ingot cutting and grinding all-in-one machine according to claim 18, characterized in that, The second travel drive unit comprises: A second travel rack disposed on the base along a first direction; and A second travel gear associated with the grinding frame and engaged with the second travel rack, and a second gear drive motor associated with the second travel gear.

20. The silicon ingot slicing and polishing all-in-one machine according to claim 17, wherein, The grinding support is movably disposed on the grinding frame by a second lifting mechanism.

21. The silicon ingot slicing and polishing all-in-one machine according to claim 17, wherein, The grinding frame is movably disposed on the base along a second direction by a first grinding frame advancing and retreating mechanism.

22. The silicon ingot slicing and polishing all-in-one machine according to claim 1, characterized in that, Further comprising: At least two second silicon rod end clamping mechanisms are arranged side by side along a second direction at a grinding area of the silicon rod processing platform.

23. The silicon ingot slicing and polishing all-in-one machine according to claim 22, wherein, The grinding device comprises: A grinding base movably arranged along a first direction at the machine base; A grinding frame movably arranged along a second direction at the grinding base; A grinding support movably arranged along a vertical direction at the grinding frame; and At least one grinding wheel arranged at the grinding support for grinding and chamfering / rounding the first and second square silicon rods.

24. The silicon ingot slicing and polishing all-in-one machine according to claim 23, wherein, The grinding frame is movably arranged at the grinding base by a second grinding frame advancing and retreating mechanism, and the grinding support is movably arranged at the grinding frame by a second lifting mechanism.

25. The silicon ingot slicing and polishing all-in-one machine according to claim 23, wherein, The grinding device comprises a grinding base advancing mechanism, which comprises: A second advancing guide rail arranged along a first direction at the machine base for arranging the grinding base; and A second advancing drive unit for driving the grinding base to move along the second advancing guide rail.

26. The silicon ingot slicing and polishing all-in-one machine according to claim 25, wherein, The grinding base advancing mechanism comprises: A second advancing rack arranged along a first direction at the machine base; and A second advancing gear and a second gear drive motor, the second advancing gear being associated with the grinding base and engaged with the second advancing rack, and the second gear drive motor being associated with the second advancing gear.

27. The silicon ingot slicing and polishing all-in-one machine according to claim 17 or 23, wherein, The at least one grinding wheel in the grinding device comprises any one of the following combinations: At least one grinding and chamfering wheel; and At least one flat grinding wheel and at least one chamfering / rounding grinding wheel.

28. The silicon ingot slicing and polishing all-in-one machine according to claim 16 or 22, characterized in that, The second silicon rod end clamping mechanism comprises: A second end clamping support; At least two second end clamping members arranged at opposite ends of the second end clamping support along a first direction, the at least two second end clamping members having a second end clamping space therebetween; and A second end clamping drive unit for driving at least one of the at least two second end clamping members to move along a first direction to adjust the second end clamping space.

29. The silicon ingot slicing and polishing all-in-one machine according to claim 16 or 22, characterized in that, The second silicon rod end clamping mechanism further comprises a silicon rod overturning component for overturning the first and second square silicon rods by a predetermined angle.

30. The silicon ingot sawing and polishing all-in-one machine according to claim 22, wherein, The silicon rod transfer device comprises: A transfer clamp comprising a clamp base, at least one pair of clamp arms arranged at opposite ends of the clamp base, and a clamp arm drive mechanism, the at least one pair of clamp arms being provided with clamping portions and clamping portion rotating mechanisms; A transfer translation mechanism for driving the transfer clamp to move along a second direction; and A transfer lifting mechanism for driving the transfer clamp to move up and down along a vertical direction.

31. The silicon ingot slicing and polishing all-in-one machine according to claim 1, wherein, A silicon rod loading device is further included.

32. The silicon ingot slicing and polishing all-in-one machine according to claim 1, wherein, A silicon rod unloading device is further included.

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