System and method for calibrating a teds compliant connected electric energy meter

Abstract

According to aspects of the present disclosure, a sensing system includes at least one sensor configured to provide an output signal indicative of a sensed property, an interface configured to couple to a computing device, and a processor coupled to the interface, the processor configured to provide, via the interface, a first transducer electronic data sheet (TEDS) template to the computing device indicative of a first variable of the sensed property, and to provide, via the interface, a second TEDS template to the computing device indicative of a second variable of the sensed property.

Description

Technical Field

[0001] At least one example according to this disclosure generally involves sensors and the exchange of sensor data. Background Technology

[0002] A sensor is an electronic device configured to sense one or more physical properties. A sensor provides an output signal indicating one or more sensed properties. The output signal may include data encoded from the sensed properties. A device receiving the output signal (such as a computing device) may require some information to decode the encoded properties. For example, such information may include calibration information. Summary of the Invention

[0003] According to at least one aspect of this disclosure, a sensing system includes at least one sensor configured to provide an output signal indicating a sensed property, an interface configured to be coupled to a computing device, and a processor coupled to the interface, the processor being configured to provide, via the interface, a first Transducer Electronic Data Sheet (TEDS) template indicating a first variable of the sensed property to the computing device, and a second TEDS template indicating a second variable of the sensed property to the computing device via the interface.

[0004] In some examples, at least one sensor includes at least one of a current sensor or a voltage sensor. In various examples, the first variable includes the current phase. In at least one example, the second variable includes the current amplitude. In some examples, the first variable includes the voltage phase. In various examples, the second variable includes the voltage amplitude. In at least one example, each of the first and second TEDS templates is a high-level voltage output sensor TEDS template. In some examples, the processor is also configured to provide at least one TEDS calibration template to a computing device via an interface.

[0005] In various examples, the processor is also configured to provide a first TEDS calibration template indicating a first variable of the sensed attribute to the computing device via an interface, and a second TEDS calibration template indicating a second variable of the sensed attribute to the computing device via the same interface. In at least one example, each of the first and second TEDS calibration templates is a calibration table TEDS template. In some examples, the first TEDS template is paired with the first TEDS calibration template, and the second TEDS template is paired with the second TEDS calibration template. In various examples, at least one sensor is also configured to transmit an output signal to the computing device via an interface.

[0006] According to at least one example, a non-transitory computer-readable medium is provided having a sequence of computer-executable instructions stored thereon for operating a sensing system coupled to a computing device and including at least one sensor configured to provide an output signal indicating a sensed attribute. The sequence of computer-executable instructions includes instructions to instruct at least one processor to provide the computing device with a first transducer electronic data sheet (TEDS) template indicating a first variable of the sensed attribute, and a second TEDS template indicating a second variable of the sensed attribute.

[0007] In some examples, the first variable includes the current phase, and the second variable includes the current amplitude. In at least one example, the first variable includes the voltage phase, and the second variable includes the voltage amplitude. In various examples, each of the first and second TEDS templates is a high-level voltage output sensor TEDS template. In some examples, the instructions further instruct at least one processor to provide a computing device with a first TEDS calibration template indicating the first variable of the sensed attribute, and to provide the computing device with a second TEDS calibration template indicating the second variable of the sensed attribute. In at least one example, each of the first and second TEDS calibration templates is a calibration table TEDS template.

[0008] According to at least one example, a method for operating a sensing system coupled to a computing device and including at least one sensor is provided, the method comprising: providing an output signal from the at least one sensor indicating a sensed attribute; providing the computing device a first transducer electronic data sheet (TEDS) template indicating a first variable of the sensed attribute; and providing the computing device a second TEDS template indicating a second variable of the sensed attribute.

[0009] In some examples, the method includes providing a computing device with a first TEDS calibration template indicating a first variable of the sensed attribute, the first TEDS calibration template being paired with a first TEDS template, and providing a computing device with a second TEDS calibration template indicating a second variable of the sensed attribute, the second TEDS calibration template being paired with a second TEDS template. Attached Figure Description

[0010] At least one embodiment will now be discussed with reference to the accompanying drawings, which are not intended to be drawn to scale. The drawings are included to provide illustration and further understanding of the aspects and embodiments, and are incorporated in and form part of this specification, but are not intended to be a definition of limitation on any particular embodiment. The drawings, together with the remainder of the specification, serve to explain the principles and operation of the described and claimed aspects and embodiments. In the drawings, each identical or substantially identical component shown in the various figures is indicated by the same reference numerals. For clarity, not every component may be labeled in every figure. In the drawings:

[0011] Figure 1 A block diagram of a sensing system based on an example is shown;

[0012] Figure 2A and 2B The corresponding portion of the table for the TEDS high-level voltage output template fields is shown;

[0013] Figure 3 It shows the ability to interact with Figure 2A and Figure 2B The table of calibration templates paired with the high-level voltage output template;

[0014] Figure 4 The operation based on the example is shown. Figure 1 The process of the sensing system;

[0015] Figure 5 This illustrates, based on an example, how to transfer TEDS information from... Figure 1 The process of the sensor system outputting to the computing device; and

[0016] Figure 6 A block diagram of a sensing system based on an example is shown. Detailed Implementation

[0017] The examples of methods and systems discussed herein are not limited in application to the details of the construction and arrangement of components set forth in the following description or shown in the accompanying drawings. These methods and systems can be implemented in other embodiments and can be practiced or performed in various ways. The examples of specific implementations provided herein are for illustrative purposes only and are not restrictive. In particular, actions, components, elements, and features discussed in conjunction with any one or more examples are not intended to exclude similar roles in any other examples.

[0018] Furthermore, the wording and terminology used herein are for illustrative purposes and should not be construed as limiting. Any reference to examples, embodiments, components, elements, or actions of systems and methods mentioned in the singular herein may also include embodiments comprising multiple embodiments, and any reference to any embodiment, component, element, or action in the plural herein may also include embodiments comprising only the singular. References in either the singular or plural form are not intended to limit the currently disclosed systems or methods, their components, actions, or elements. The terms “comprising,” “including,” “having,” “containing,” “involving,” and variations thereof, as used herein, are intended to cover the items listed thereafter and their equivalents, as well as additional items.

[0019] The use of "or" can be interpreted as inclusive, such that any term described using "or" can refer to any one, more than one, or all of the terms described. Furthermore, in the event of any inconsistency in terminology used between this document and a document incorporated herein by reference, the terminology used in the incorporated feature shall supplement the terminology used in this document; for irreconcilable differences, the terminology used in this document shall prevail.

[0020] A sensor is configured to sense one or more physical properties and output a signal indicating one or more physical properties. Known sensors include current sensors, voltage sensors, temperature sensors, accelerometers, microphones, and various other sensors. The physical properties sensed by a sensor can vary depending on the type of sensor. For example, a physical property sensed by a temperature sensor may include heat, and a physical property sensed by a current sensor may include a magnetic field generated by an electric current.

[0021] A sensor provides an output signal that encodes the sensed information. The sensor can interface with a computing device, providing the output signal to the device for analysis or viewing, for example, by a user. In order for the computing device to process the output signal received from the sensor, the device may require certain information about the sensor. Such information may include details such as the sensor's manufacturer, model number, serial number, and calibration information.

[0022] Advantageously, the sensor should provide this information directly to the computing device, rather than requiring the user to manually input such information into the computing device. This "plug-and-play" functionality allows the computing device to begin interfacing with the sensor shortly after installation, without requiring the user to spend significant time and effort providing information to the computing device. This plug-and-play functionality can be achieved by implementing a standardized Transducer Electronic Data Sheet (TEDS) device.

[0023] A TEDS device is a memory device integrated with a sensor or "transducer." TEDS devices store information about the sensor, such as manufacturer information, model information, calibration date information, calibration information, etc. The stored information is provided to the computing device during initial communication, enabling the computing device to quickly and easily interface with the transducer. The stored information is provided according to a standardized format corresponding to the transducer type. For example, a first standardized TED format is provided for microphone transducers, a second standardized TED format for thermistor transducers, and so on.

[0024] The information stored in a TEDS device comprises four sets of information. The first set includes basic TEDS information that can be considered universal across various transducer types. This basic TEDS information describes aspects of the transducer, including the manufacturer's identification number, model number, version letter, version number, and serial number. The second set includes an identifier for one of several standardized information templates specific to a particular type of transducer. For example, the second set can identify standardized templates for accelerometers or force sensors, capacitive microphone transducers, high-level voltage output sensors, etc. Currently, approximately sixteen such standardized templates exist. The third set includes identifiers for standardized calibration TEDS templates, which can represent calibration tables, polynomial calibration curves, or frequency response tables. The fourth set may include a user area where users can add additional customized information.

[0025] Therefore, it is advantageous to implement TEDS devices in association with transducers. However, as mentioned above, only about sixteen standardized TEDS templates exist, each corresponding to a specific type of transducer. While transducers corresponding to these templates can utilize TEDS devices (and are therefore considered "TEDS compatible"), transducers for which no corresponding standardized template exists may not be easily implemented as TEDS devices. For example, current and voltage sensors may be non-TEDS compatible, at least because there are no standardized TEDS templates specifically for current and voltage sensors. Although some types of TEDS templates (such as high-level voltage output sensor TEDS templates) can partially describe current or voltage sensors, the information presented by the TEDS template may be incomplete. For example, although a high-level voltage output sensor TEDS template can describe voltage amplitude or voltage phase, the template may not describe both, and therefore may not fully describe the voltage sensor. Therefore, voltage sensors (and similarly, current sensors) may be non-TEDS compatible, and plug-and-play functionality may be limited for such non-TEDS compatible transducers (i.e., transducers for which no complete TEDS template has yet been created).

[0026] Existing sensing systems, such as energy metering systems, can implement non-TEDS-compatible sensors, including voltage and current sensors. Such non-TEDS-compatible systems can operate inefficiently because initializing the system to enable computing devices to connect to one or more sensor interfaces is time-consuming and requires significant user knowledge and manual effort. This is a technical problem. Exemplary embodiments of the sensing system provide computing elements, such as microprocessors, configured to provide analog memory TEDS devices by sending complete TEDS information for non-TEDS-compatible transducers. At least this combination of features includes a sensing system that serves as a technical solution to the aforementioned technical problem. This technical solution is not routine and is unconventional. It is a practical application of sensing system design that solves the aforementioned technical problem and constitutes an improvement in the technical field of sensing systems (including energy metering systems), at least by providing TEDS compatibility to sensors for which a complete TEDS template does not exist.

[0027] This disclosure provides an example of an analog TEDS device for non-TEDS compatible transducers, such as current and voltage transducers. The sensor or sensing device may include at least one microprocessor for simulating the TEDS device. The microprocessor may send multiple cascaded TEDS templates for a single sensor. For example, the microprocessor may send a first TEDS template describing the amplitude of the sensed attribute (such as voltage or current amplitude) and a second TEDS template describing the phase of the sensed attribute (such as voltage or current phase). In some examples, the TEDS templates may each be paired with a corresponding calibration template when parameter calibration is required. Thus, by using existing TEDS templates, an analog TEDS device can be implemented using transducers for which standardized TEDS templates are not available.

[0028] Figure 1 A block diagram of a sensing system 100 according to an example is shown. The sensing system 100 may be one or more devices configured to sense one or more parameters. In one example, the sensing system 100 may be an energy meter configured to measure the amount of energy consumed by one or more devices. For example, the sensing system 100 may be a split-core transformer configured to be coupled to a conductor and sense the current through the conductor and / or the voltage across the conductor. However, it should be understood that the sensing system 100 may be implemented as any other one or more sensing devices, and the examples of this disclosure are not limited to energy metering devices.

[0029] The sensing system 100 includes one or more sensors 102 (“sensors 102”), one or more microprocessors 104 (“microprocessors 104”), and at least one input and / or output interface 106 (“interface 106”). The sensing system 100 is configured to be coupled to at least one external computing device 108 (“computing device 108”). The sensing system 100 may also be configured to be coupled to one or more external devices, such as energy conductors, and is configured to sense one or more physical properties, such as voltage, current, or other physical properties indicating voltage or current. It should be understood that the sensing system 100 may include additional components, such as power supply components and / or connectors, user interface elements, power conditioning and / or power conversion components, etc., which are omitted for illustrative purposes.

[0030] Sensor 102 is communicatively connected to microprocessor 104. Microprocessor 104 is communicatively connected to sensor 102 and interface 106. Interface 106 is communicatively connected to microprocessor 104 and configured to be communicatively connected to computing device 108. In some examples, sensor 102 may be directly connected to interface 106.

[0031] Sensor 102 may include one or more types of sensors. For example, sensor 102 may include one or more voltage sensors, one or more current sensors, one or more temperature sensors (such as thermistors), etc. Sensor 102 may sense physical properties and send an output signal indicating the physical properties to microprocessor 104. Microprocessor 104 may process the output signal and provide information indicating the sensed properties to computing device 108 via interface 106. Interface 106 may include wired and / or wireless communication interfaces. For example, interface 106 may include an RJ45-8 interface for connection to computing device 108. In some examples, interface 106 may include a single-wire interface configured to exchange power and data on a single wire (in some examples, this is a wire other than a return line or a common line) between microprocessor 104 and computing device 108. Computing device 108 may be accessible to a user who wishes to view or analyze the sensed information.

[0032] Figure 6A sensing system 600 according to an example is shown. Sensing system 600 may be an exemplary implementation of sensing system 100, and similar components are labeled accordingly. In one example, sensing system 600 includes a split-core transformer configured to be coupled to conductor 602 and to sense one or more properties of conductor 602. For example, conductor 602 may conduct electrical signals, and sensing system 600 may be configured to sense one or more properties of the electrical signals. Thus, sensing system 600 can provide power metering functionality by measuring the properties of the electrical signals conducted by conductor 602.

[0033] The sensing system 600 includes a sensor 102, a microprocessor 104, and an interface 106. The sensor 102 includes one or more temperature sensors 604 (“temperature sensor 604”), one or more voltage sensors 606 (“voltage sensor 606”), and one or more current sensors 608 (“current sensor 608”).

[0034] Temperature sensor 604 is coupled to microprocessor 104. Voltage sensor 606 is coupled to microprocessor 104 and configured to sense one or more voltage properties of conductor 602. Current sensor 608 is coupled to microprocessor 104 and configured to sense one or more current properties of conductor 602. Microprocessor 104 is coupled to sensors 604-608 and configured to be coupled to interface 106 via a single-wire connection 610. In various examples, sensors 604-608 may receive power from microprocessor 104. In other examples, sensors 604-608 may not be coupled to microprocessor 104. Sensors 604-608 may be directly coupled to interface 106 (not shown for clarity) and may each provide a corresponding output signal (e.g., indicating the sensed property) to interface 106, thereby bypassing microprocessor 104.

[0035] Power and data can be transmitted via a single-wire connection 610, which may include a single conductor (e.g., a conductor other than a neutral or ground common return conductor). For example, interface 106 can provide power to microprocessor 104 via single-wire connection 610, and microprocessor 104 can provide and receive data from interface 106 via single-wire connection 610. Interface 106 is coupled to microprocessor 104 via single-wire connection 610 and is configured to be coupled to computing device 108. Microprocessor 104 can be configured to provide TEDS information to interface 106 via single-wire connection 610.

[0036] As described above, conductor 602 can conduct electrical signals. Sensing system 600 may include a split-core transformer configured to be circumferentially coupled around conductor 602. Temperature sensor 604 may be configured to sense the ambient temperature at or around conductor 602 and send a temperature sensing signal indicating the sensed temperature to microprocessor 104. Voltage sensor 606 may be electrically coupled to conductor 602 (e.g., by sensing the electric field provided by conductor 602) and configured to sense the voltage across at least a portion of conductor 602 and send a voltage sensing signal indicating the voltage across at least a portion of conductor 602 to microprocessor 104. For example, the voltage sensing signal may indicate whether conductor 602 is currently energized (e.g., conducting electrical signals) by detecting a voltage drop sensed by voltage sensor 606. Current sensor 608 may be magnetically coupled to conductor 602 and configured to sense the current conducted by conductor 602 and send a current sensing signal indicating the current conducted by conductor 602 to microprocessor 104 (or, in some examples, directly to interface 106). For example, current sensor 608 may include a current transformer configured to be inductively connected to conductor 602 and to output an induced current in response to a magnetic field generated by the current passing through conductor 602.

[0037] As described above, while TEDS devices can advantageously enable computing devices (such as computing device 108) to interface with sensors (such as sensor 102), TEDS devices may not provide benefits or only provide limited benefits to sensors for which a standardized TEDS template does not exist. Therefore, if sensor 102 includes non-TEDS compatible sensors, such as current or voltage sensors (e.g., voltage sensor 606 and / or current sensor 608), computing device 108 may find it more difficult to interface with sensing system 100.

[0038] In various examples, microprocessor 104 is configured to emulate a TEDS memory device. Microprocessor 104 emulates a TEDS device by providing TEDS information to computing device 108 in a manner similar to that of a conventional TEDS device. As described above, the TEDS information includes a TEDS template for the corresponding sensor type and a calibration template paired with the TEDS template, as well as other information. For certain sensors where standardized TEDS templates are not available, such as current or voltage sensors, microprocessor 104 can provide multiple cascaded high-level voltage output sensor TEDS templates and paired calibration templates to fully describe the sensor. In some examples, microprocessor 104 provides TEDS information via a single-wire connection (e.g., single-wire connection 610).

[0039] Figure 2A and 2BThe high-level voltage output template field table 200 is shown. Figure 2A The "top" section of Table 200 is shown, and Figure 2B The "bottom" section of Table 200 is shown. Table 200 is from... Figure 2A Continuously extended to Figure 2B And for clarity, it is shown in a separate figure. The TEDS template ID 30 high-level voltage output template is a universal template that can be used with various types of sensors, including sensors with analog voltage as the output signal. The sensor type can be specified using the first 6-bit Select Case field 202, which indicates the physical measured variable (e.g., voltage amplitude, voltage phase, current amplitude, current phase, etc.) and its corresponding unit (e.g., volts, amperes, degrees, radians, etc.).

[0040] Figure 3 It shows the ability to interact with Figure 2A and 2B A TEDS calibration table 300 is paired with a high-level voltage output template. A calibration table with 40 TEDS template IDs can be used in conjunction with a high-level voltage output template and specifies calibration information about the corresponding sensor, such as input-output information. The calibration template can include any number of n data pairs indicating the physical property input sensed by the sensor and the output signal provided by the sensor based on the physical property input. In some examples, the calibration template provides information according to a piecewise linear interpolation scheme.

[0041] As described above, high-level voltage output templates and paired calibration templates may not be suitable for physical properties with multiple parameters, such as voltages or currents having both amplitude and phase, because the templates can be designed for only a single parameter (e.g., as specified by the select case field 202). Examples of this disclosure implement multiple high-level voltage output templates and paired calibration templates cascaded together. For example, when a connection is established between the sensor in sensor 102 and computing device 108, microprocessor 104 can send a first template describing the amplitude of the sensed attribute and a paired calibration template, and a second template describing the phase of the sensed attribute and a paired calibration template, for a total of four templates. Thus, the cascaded templates can provide computing device 108 with substantially all the information required to initialize the connection to the applicable sensor with sensor 102.

[0042] Figure 4 The process 400 for operating the sensing system 100 according to an example is shown. For example, in some examples, process 400 may be performed when the sensing system 100 is first used and / or first connected to the computing device 108.

[0043] At action 402, process 400 begins.

[0044] At action 404, the sensing system 100 is connected to the computing device 108 via interface 106. In some examples, the sensing system 100 is connected to the computing device 108 by connecting a wired connector, such as an RJ45-8 connector, to interface 106 and computing device 108. Power and / or data can be exchanged through the connection between interface 106 and computing device 108. In some examples, such as when the sensing system 100 is first used by a user, action 404 may include the initial connection between the sensing system 100 and computing device 108.

[0045] At action 406, microprocessor 104 outputs TEDS information, including one or more TEDS templates, to computing device 108. Action 406 may include providing multiple TEDS templates and associated calibration templates for a single sensor type. Furthermore, action 406 may include providing TEDS templates and associated calibration templates for multiple sensor types. Figure 5 An example of action 406 is provided. The computing device 108 is able to interface with the sensing system 100 and receive sensor information from the sensing system 100 after action 406 is completed.

[0046] At action 408, the microprocessor 104 receives sensor measurement information from the sensor 102. The sensor 102 may include various types of sensors, such as a current sensor configured to provide current measurement information, a voltage sensor configured to provide voltage measurement information, a temperature sensor configured to provide temperature measurement information, etc., each sensor being configured to sense the corresponding physical property at the same or different rates and / or intervals. The sensor 102 may provide output signals to the microprocessor 104 simultaneously or at different times. The microprocessor 104 may receive sensor measurement information from a portion of the sensors 102 at certain times and may receive sensor measurement information from all sensors 102 at other times.

[0047] At action 410, microprocessor 104 outputs sensor measurement information or information indicating it to computing device 108. Microprocessor 104 can process the sensor measurement information received at action 408 and output processed information indicating the sensor measurement information to computing device 108. Microprocessor 104 can send information to computing device 108 in real time or at periodic or non-periodic intervals upon receiving sensor measurement information. At least because computing device 108 has received TEDS information indicating that sensor 102 has provided sensor measurement information, computing device 108 is equipped to easily interface with sensor 102 and the sensor measurement information.

[0048] At action 412, process 400 ends.

[0049] Modifications to process 400 are within the scope of this disclosure. For example, in some examples, action 408 may alternatively include sensor 102 providing an output signal directly to interface 106. Similarly, action 410 may include sensor 102 providing output measurement information to computing device 108 via interface 106. Thus, in various examples, microprocessor 104 may be configured to provide TEDS information to computing device 108, but may also not provide information such as output measurement information to computing device 108.

[0050] Figure 5 The illustration shows a process 500 for outputting TEDS information from a sensing system 100 to a computing device 108, the TEDS information including at least one TEDS template and at least one paired calibration template. Process 500 can be an example of action 406.

[0051] At action 502, process 500 begins.

[0052] At action 504, microprocessor 104 sends the TEDS template and paired calibration template of the corresponding sensor to computing device 108. If the sensor is one whose single TEDS template and single paired calibration template already exist and fully describe the sensor, computing device 108 can interface with the sensor based on the TEDS template and paired calibration template. Otherwise, if the sensor is not one whose single TEDS template and single paired calibration template already exist, such as a voltage or current sensor, computing device 108 may require additional information to interface with the sensor. For example, action 504 may include microprocessor 104 sending a first TEDS template and paired calibration template to describe the amplitude measured by the sensor, and sending a second TEDS template and paired calibration template to describe the phase measured by the sensor.

[0053] At action 506, microprocessor 104 determines whether an additional template should be sent to the corresponding sensor. If the sensor is a sensor (such as a thermistor) for which a single TEDS template and a single paired calibration template already exist and fully describe the sensor, then microprocessor 104 can determine that the single TEDS template and single paired calibration template sent to computing device 108 at action 504 are sufficient to enable computing device 108 to interface with the corresponding sensor, and the sensor does not require an additional template (506 is no). Then, process 500 proceeds to action 508.

[0054] Otherwise, if no single TEDS template and paired calibration template already exist that fully describe the sensor, microprocessor 104 may determine that an additional template and / or calibration template should be sent to computing device 108 (506 is yes). Sensors that sense properties with multiple variables, such as current or voltage with phase and amplitude, may not be fully described by a single TEDS template and paired calibration template. For example, if the sensor is a current or voltage sensor, a single TEDS template and paired calibration template may not be sufficient to enable computing device 108 to interface with the sensor. Therefore, if an additional template with a paired calibration template is to be sent to the sensor (506 is yes), process 500 returns to action 504 to send at least one additional template and paired calibration template. Actions 504 and 506 are repeated to send cascaded TEDS templates and calibration templates until it is determined at action 506 that no additional template with a paired calibration template has been sent to computing device 108 of the sensor (506 is no), and process 500 continues to action 508. It should be understood that for a single sensor, fewer or more than two pairs of templates can be sent to the computing device 108.

[0055] At action 508, it is determined whether an additional sensor exists for which an additional TEDS with a paired calibration template needs to be sent. For example, if microprocessor 104 has already sent a TEDS template with a paired calibration template for a voltage sensor instead of a current sensor, microprocessor 104 can determine that an additional sensor for which TEDS information needs to be sent exists (508 indicates yes). Process 500 continues to action 510.

[0056] At action 510, microprocessor 104 proceeds to the next sensor. For example, microprocessor 104 may advance to the next sensor that needs to send additional TEDS information. Then, process 500 returns to action 504 and repeats actions 504-508 until it is determined that there is no additional sensor that needs to send TEDS information (508 is no). Then, process 500 continues to action 512.

[0057] At action 512, process 500 ends.

[0058] An example of process 500 is provided for illustrative purposes. In the following example, sensor 102 includes a temperature sensor, a voltage sensor, and a current sensor. At action 504, microprocessor 104 sends a TEDS template and a paired calibration template for a temperature sensor, which is arbitrarily selected as the first sensor to send TEDS information. For example, the temperature sensor may be implemented as a thermistor, and the TEDS information may include a thermistor TEDS template (ID 38) and a paired calibration template (ID 40). As mentioned above, the TEDS information may additionally include basic TEDS information and any user data.

[0059] At action 506, microprocessor 104 determines that an additional TEDS template is not required for the temperature sensor (506 is No), at least because a single TEDS template and a paired calibration table fully describe the temperature sensor and enable computing device 108 to interface with the temperature sensor. At action 508, microprocessor 508 determines that there are additional sensors that need to send TEDS information (508 is Yes), including a current sensor and a voltage sensor. At action 510, microprocessor 104 proceeds to the voltage sensor, which is arbitrarily selected as the second sensor that needs to send TEDS information.

[0060] Returning to action 504, microprocessor 104 sends the first TEDS template and paired calibration template for the voltage sensor to computing device 108. For example, the first TEDS template and paired calibration template could correspond to the voltage amplitude. (See above regarding Figure 2 and...) Figure 3 As discussed, microprocessor 104 can send a high-level voltage output sensor template (ID 30) and a paired calibration table (ID 40) for the voltage amplitude. At action 506, microprocessor 104 can determine to send an additional TEDS template for the voltage sensor. Returning to action 504, microprocessor 104 sends a second TEDS template cascaded with the first TEDS template and the paired calibration table for the voltage sensor to computing device 108. For example, the second TEDS template and the paired calibration table can correspond to the voltage phase. As mentioned above regarding Figure 2 and... Figure 3 As discussed, the microprocessor 104 can send a high-level voltage output sensor template (ID 30) and a paired calibration table (ID 40) for voltage phase. Although in this example, the microprocessor 104 sends TEDS information for voltage amplitude before TEDS information for voltage phase, in other examples, TEDS information for voltage phase can be sent before TEDS information for voltage amplitude.

[0061] At action 506, microprocessor 104 determines that the first TEDS information and the cascaded second TEDS information are sufficient to enable computing device 108 to interface with the voltage sensor, and that no additional template is sent to computing device 108 for the voltage sensor (506 is no). At action 508, microprocessor 104 determines that there is an additional sensor for which TEDS information needs to be sent (508 is yes). At action 510, microprocessor 104 proceeds to the current sensor, which is arbitrarily selected as the third sensor for which TEDS information needs to be sent.

[0062] Returning to action 504, microprocessor 104 sends the first TEDS template and paired calibration template for the current sensor to computing device 108. For example, the first TEDS template and paired calibration template could correspond to the current amplitude. (See above regarding Figure 2 and...) Figure 3 As discussed, microprocessor 104 can send a high-level voltage output sensor template (ID 30) and a paired calibration table (ID 40) for the current amplitude. At action 506, microprocessor 104 can determine to send an additional TEDS template for the current sensor. Returning to action 504, microprocessor 104 sends a second TEDS template cascaded with the first TEDS template and the paired calibration template to computing device 108 for the current sensor. For example, the second TEDS template and the paired calibration table can correspond to the current phase. As mentioned above regarding Figure 2 and... Figure 3 As discussed, the microprocessor 104 can send a high-level voltage output sensor template (ID 30) for the current phase and a paired calibration table (ID 40). Although in this example, the microprocessor 104 sends TEDS information for the current amplitude before TEDS information for the current phase, in other examples, TEDS information for the current phase can be sent before TEDS information for the current amplitude.

[0063] At action 506, microprocessor 104 determines that the first TEDS information and the cascaded second TEDS information are sufficient to enable computing device 108 to interface with the current sensor, and that no additional template for the current sensor is sent to computing device 108 (506 is No). At action 508, microprocessor 104 determines that there is no additional sensor for which TEDS information needs to be sent (508 is No). At action 512, process 500 ends, and computing device 108 is able to interface with sensor 102.

[0064] Various processors, such as microprocessor 104, can perform the various operations discussed above. Using data stored in associated memory and / or storage devices, microprocessor 104 also executes one or more instructions stored on one or more non-transitory computer-readable media that can be coupled to microprocessor 104, which can produce manipulated data. In some examples, microprocessor 104 may include one or more processors and / or controllers. In one example, microprocessor 104 is at least one processor or includes at least one processor. In another example, in addition to or instead of a general-purpose processor, microprocessor 104 uses application-specific integrated circuits (ASICs) customized to perform specific operations to perform at least a portion of the operations discussed above. As these examples show, examples of this disclosure can use many specific combinations of hardware and software to perform the operations described herein, and this disclosure is not limited to any specific combination of hardware and software components. Examples of the content of this disclosure may include computer program products configured to perform the methods, processes, and / or operations discussed above. Computer program products may be or include one or more controllers and / or processors configured to execute instructions to perform the methods, processes, and / or operations discussed above.

[0065] Having described several aspects of at least one embodiment, it should be understood that various changes, modifications, and improvements will readily occur to those skilled in the art. Such changes, modifications, and improvements are intended to be part of and within the spirit and scope of this disclosure. Therefore, the foregoing description and drawings are merely exemplary.

Claims

1. A sensing system (100), comprising: At least one sensor (102) is configured to provide an output signal indicating the sensed attribute; Interface (106), the interface being configured to connect to a computing device; as well as Processor (104), the processor being connected to the interface, the processor being configured to: A first transducer electronic data sheet (TEDS) template, i.e. a first TEDS template, indicating a first variable of the sensed attribute, and a first TEDS calibration template paired with the first TEDS template are provided to the computing device via the interface. as well as A second transducer electronic data sheet (TEDS), i.e. a second TEDS template, indicating a second variable of the sensed attribute, and a second TEDS calibration template paired with the second TEDS template are provided to the computing device via the interface.

2. The sensing system according to claim 1, wherein, The at least one sensor includes at least one of a current sensor or a voltage sensor.

3. The sensing system according to claim 1, wherein, The first variable includes the current phase.

4. The sensing system according to claim 3, wherein, The second variable includes the current amplitude.

5. The sensing system according to claim 1, wherein, The first variable includes the voltage phase.

6. The sensing system according to claim 5, wherein, The second variable includes the voltage amplitude.

7. The sensing system according to claim 1, wherein each of the first TEDS template and the second TEDS template is a high-level voltage output sensor TEDS template.

8. The sensing system according to claim 1, wherein, Each of the first TEDS calibration template and the second TEDS calibration template is a calibration table TEDS template.

9. The sensing system according to claim 1, wherein, The at least one sensor is also configured to send the output signal to the computing device via the interface.

10. A method of operating a sensing system, the sensing system being coupled to a computing device and including at least one sensor, the method comprising: Provide an output signal from the at least one sensor that indicates the sensed attribute; The computing device is provided with a first transducer electronic data sheet template, i.e., a first TEDS template, which indicates a first variable of the sensed attribute, and a first TEDS calibration template paired with the first TEDS template; as well as The computing device is provided with a second transducer electronic data sheet (TEDS) indicating a second variable of the sensed attribute, i.e. a second TEDS template, and a second TEDS calibration template paired with the second TEDS template.

11. A computer program product configured to perform the method of claim 10 when executed on a computer.

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