Adhesive for endoscope, cured product thereof, endoscope, and manufacturing method thereof

Abstract

An object of the present invention is to provide an endoscope adhesive suitable for use in fixing components of an endoscope, a cured product thereof, an endoscope, and a method for manufacturing the same. The endoscope adhesive can maintain sufficient adhesive force even when it is exposed to high temperatures for a long time in a state of being used for fixing components, and also even when a strong sterilization treatment such as ozone water is applied. The endoscope adhesive contains an epoxy resin, a curing component of the epoxy resin, and a radical scavenger.

Description

Technical Field

[0001] The present invention relates to an adhesive for an endoscope, a cured product thereof, an endoscope, and a method for manufacturing the same. Background Art

[0002] Endoscopes for observing the body cavities, digestive tracts, esophagi, etc. of the human body are repeatedly used. Therefore, the flexible tube that constitutes the insertion portion of the endoscope is cleaned every time it is used, and drugs are also used for disinfection. In particular, when inserting into a highly infectable site such as the bronchus, a cleanliness level exceeding the disinfection effect and reaching the sterilization level is required. Thus, the endoscope is required to have a high durability that can withstand repeated disinfection or sterilization treatments.

[0003] The insertion portion of the endoscope is inserted into the body through the oral cavity or nasal cavity. In order to reduce the foreign body sensation and pain of the patient during insertion, it is desired to make the insertion portion of the endoscope thinner. Therefore, for the bonding of the components that constitute the insertion portion, an adhesive is mainly used instead of large-volume components such as screws and bolts.

[0004] Among adhesives, epoxy adhesives have excellent workability, and the cured products thereof also have excellent adhesiveness, heat resistance, moisture resistance, etc., so they are also used for bonding the components of the endoscope. Since the endoscope is repeatedly used for a long time, the fixed state of the endoscope components bonded by the adhesive is required to be sufficiently maintained even after long-term repeated use of the endoscope. That is, a durability that can sufficiently maintain the above fixed state even when immersed in a disinfectant solution and subjected to a sterilization treatment is required.

[0005] For example, Patent Document 1 discloses a two-component adhesive for an endoscope, which is composed of a main agent and a curing agent. The main agent contains at least one epoxy resin selected from bisphenol A type epoxy resin, bisphenol F type epoxy resin, and novolac type epoxy resin, and the curing agent contains a specific amount of a compound that promotes curing and a specific polythiol compound. According to Patent Document 1, it is considered that the durability of this adhesive against an aqueous peracetic acid solution is excellent in the state (cured product state) of being used for fixing endoscope components. In addition, Patent Document 2 discloses a two-component adhesive for an endoscope, which is composed of a main agent and a curing agent. The main agent contains at least one epoxy resin selected from bisphenol A type epoxy resin, bisphenol F type epoxy resin, and novolac type epoxy resin, and the curing agent contains a specific amount of a tertiary amine compound. According to Patent Document 2, it is considered that the durability of this adhesive against hydrogen peroxide plasma is excellent in the cured product state.

[0006] Prior Art Documents

[0007] Patent Documents

[0008] Patent Document 1: Japanese Patent Application Laid-Open No. 2019-41872

[0009] Patent Document 2: WO 2019 / 044755 SUMMARY OF THE INVENTION

[0010] TECHNICAL PROBLEM TO BE SOLVED BY THE INVENTION

[0011] Recently, as a sterilization treatment for an endoscope, a sterilization treatment using ozone water, which is obtained by dissolving a trace amount of ozone (O3) in water, has been started. However, this ozone water generates highly reactive species such as hydroxyl radicals, and its oxidizing power is stronger than that of hydrogen peroxide gas.

[0012] In addition, through the research by the present inventors, it has been found that when using an endoscope, if it is in a thermal atmosphere generated by a lighting source or the like built in the endoscope for a long time, the cured product of an epoxy-based adhesive softens, oxygen is absorbed into the cured product, and free radicals derived from this oxygen deteriorate the cured product, which is the main reason for the inability to sufficiently maintain the immobilized state of the endoscope components bonded by the adhesive. Therefore, it is required that the adhesive for endoscopes has excellent heat resistance (not easily deteriorated even when heated for a long time) in the state of being used for immobilizing endoscope components.

[0013] An object of the present invention is to provide an adhesive for endoscopes and a cured product thereof suitable for use in immobilizing components constituting an endoscope, which can maintain sufficient adhesive force even when exposed to high temperatures for a long time in the state of being used for immobilizing components, and even when subjected to a strong sterilization treatment such as ozone water. Another object of the present invention is to provide an endoscope having the above-mentioned cured product as an immobilizing component of a component constituting the endoscope, which is not easily deteriorated in performance even when used for a long time in a state with heat near or higher than the glass transition temperature, and even when subjected to a strong sterilization treatment such as ozone water. Another object of the present invention is to provide a method for manufacturing the above-mentioned endoscope using the above-mentioned adhesive for endoscopes.

[0014] MEANS FOR SOLVING THE TECHNICAL PROBLEM

[0015] In view of the above problems, the present inventors have conducted intensive research repeatedly, and as a result, it has been found that in an epoxy-based adhesive, by using a specific curing agent as a curing component combined with a main agent epoxy resin, and further blending a compound having a specific structure with free radical scavenging ability, even when subjected to a strong sterilization treatment such as ozone water, and even when heated for a long time, the immobilized state of the components bonded with this adhesive can be sufficiently maintained. The present invention has been completed based on these findings through further repeated research.

[0016] The above object is achieved by the following solutions.

[0017] <1>

[0018] An adhesive for endoscopes containing the following components (A) to (C),

[0019] Component (A): Epoxy resin

[0020] Component (B): Curing component of epoxy resin

[0021] Component (C): Radical scavenger

[0022] The above-mentioned component (A) includes at least one of bisphenol A type epoxy resin, bisphenol F type epoxy resin and novolac type epoxy resin.

[0023] The above-mentioned component (B) includes at least one of phosphorus-containing compounds, polythiol compounds, dicyandiamide compounds, phenolic compounds, polyamine compounds with unsubstituted amino groups, acid anhydride compounds and imidazole compounds.

[0024] The above-mentioned component (C) includes at least one of the following components (C-1) to (C-7).

[0025] Component (C-1): Compound represented by the following general formula (C-1)

[0026] Component (C-2): Compound represented by the following general formula (C-2)

[0027] Component (C-3): Compound represented by the following formula (C-3)

[0028] Component (C-4): Compound represented by the following general formula (C-4)

[0029] Component (C-5): Compound represented by the following general formula (C-5)

[0030] Component (C-6): Compound having the structure represented by the following general formula (C-6)

[0031] Component (C-7): Compound having the structure represented by the following general formula (C-7)

[0032] [Chemical formula 1]

[0033]

[0034] In the formula, R 1 and R 2 represent a hydrogen atom, an aliphatic group, an acyl group, an aliphatic oxycarbonyl group, an aromatic oxycarbonyl group, an aliphatic sulfonyl group or an aromatic sulfonyl group, and R 3 represents an aliphatic group, an aliphatic oxy group, an aromatic oxy group, an aliphatic thio group, an aromatic thio group, an acyloxy group, an aliphatic oxycarbonyloxy group, an aromatic oxycarbonyloxy group, a substituted amino group, a heterocyclic group or a hydroxyl group; R 1 and R 2 , R 2 and R 3 , R1 With R 3 can be bonded to each other to form a 5- to 7-membered ring, but will not form a piperidine skeleton; wherein, R 1 and R 2 will not both be hydrogen atoms, and the total number of carbon atoms of R 1 and R 2 is 7 or more; in addition, R 1 , R 2 and R 3 do not contain an unsubstituted amino group;

[0035] [Chemical formula 2]

[0036]

[0037] In the formula, R 4 to R 7 represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 15 carbon atoms;

[0038] [Chemical formula 3]

[0039]

[0040] [Chemical formula 4]

[0041]

[0042] In the formula, R 8 and R 9 represent an alkyl group, an aryl group, an alkoxy group, an aryloxy group or a halogen atom, and R 10 represents an alkyl group or an aryl group; at least two of R 8 , R 9 and R 10 can be connected to each other via a divalent or higher-valent group or a single bond;

[0043] [Chemical formula 5]

[0044] R 11 -S-R 12 General formula (C-5)

[0045] In the formula, R 11 and R 12 represent an alkyl group;

[0046] [Chemical formula 6]

[0047]

[0048] In the formula, R 13 to R 16 represent a hydrogen atom or an alkyl group having 1 to 12 carbon atoms; R 17 represents a hydrogen atom, an alkyl group having 1 to 18 carbon atoms or OR18 ; R 18 represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms; * represents a bonding site; wherein, R 13 ~R 16 do not all represent hydrogen atoms;

[0049] [Chemical formula 7]

[0050]

[0051] In the formula, R 19 and R 20 represent a hydrogen atom, an alkyl group having 1 to 12 carbon atoms or an aralkyl group having 7 to 36 carbon atoms; * represents a bonding site.

[0052] <2>

[0053] The adhesive for an endoscope according to <1>, wherein,

[0054] the above-mentioned component (C) contains at least one of the above-mentioned component (C-6) and the above-mentioned component (C-7).

[0055] <3>

[0056] The adhesive for an endoscope according to <1> or <2>, wherein,

[0057] the above-mentioned component (C) contains the above-mentioned component (C-6).

[0058] <4>

[0059] The adhesive for an endoscope according to any one of <1> to <3>, wherein,

[0060] the above-mentioned component (C-6) contains at least one of the following component (C-6-1) and the following component (C-6-2),

[0061] Component (C-6-1): A compound represented by the following general formula (C-6-1)

[0062] Component (C-6-2): A compound having a constituent represented by the following general formula (C-6-2)

[0063] [Chemical formula 8]

[0064]

[0065] In the formula, R 13 ~R 17 are respectively the same as R 13 ~R 17 in the above general formula (C-6); q represents an integer of 2 or more, D 1q represents a q-valent linking group; r represents an integer; Q represents an s+2-valent linking group; s represents 1 or 2.

[0066] <5>

[0067] The adhesive for an endoscope according to any one of <1> to <4>, wherein

[0068] The above component (C-7) contains at least one of the following component (C-7-1) and the following component (C-7-2),

[0069] Component (C-7-1): A compound represented by the following general formula (C-7-1)

[0070] Component (C-7-2): A compound represented by the following general formula (C-7-2)

[0071] [Chemical formula 9]

[0072]

[0073] In the formula, R 19 and R 20 are respectively the same as R in the above general formula (C-7) 19 and R 20 in meaning; L represents a single bond or a divalent linking group; t represents an integer from 2 to 4, and A 1 represents a linking group with a valence of 2 to 4; R 21 to R 24 are the same as R 19 in meaning; R 25 represents a reactive organic substituent.

[0074] <6>

[0075] A cured product obtained by curing the adhesive for an endoscope according to any one of <1> to <5>.

[0076] <7>

[0077] An endoscope that fixes components by the cured product described in <6>.

[0078] <8>

[0079] A method for manufacturing an endoscope, which includes using the adhesive for an endoscope according to any one of <1> to <5> to fix components.

[0080] In the description of the present invention, "~" is used in the sense of including the values described before and after it as the lower limit value and the upper limit value.

[0081] In this specification, regarding substituents that are not clearly described as substituted or unsubstituted (the same applies to linking groups), it means that within the range where the desired effect is achieved, any substituent can be present on the group. Examples of such substituents include substituent T described later. This also applies to compounds where substitution or non-substitution is not clearly described.

[0082] In this specification, when defining the number of carbon atoms of a certain group, the number of carbon atoms refers to the total number of carbon atoms in the entire group. That is, in the case where the group further has a substituent, it means the total number of carbon atoms including the substituent.

[0083] Advantages of the Invention

[0084] The adhesive for endoscopes of the present invention can maintain sufficient adhesive force even when exposed to high temperatures for a long time in a state where it is used for fixing endoscope components, and also even when subjected to a strong sterilization treatment such as ozone water. In addition, the cured product of the present invention has excellent heat resistance and also excellent durability against strong sterilization treatments such as ozone water. Further, the endoscope of the present invention is not easily caused to deteriorate in performance even when used for a long time in a high-temperature state, and also even when subjected to a sterilization treatment such as ozone water. Furthermore, according to the method for manufacturing an endoscope of the present invention, an endoscope can be obtained that is not easily caused to deteriorate in performance even when used for a long time in a high-temperature state and also even when subjected to a sterilization treatment such as ozone water. BRIEF DESCRIPTION OF THE DRAWINGS

[0085] Figure 1 is an external view showing the structure of an embodiment of the endoscope of the present invention.

[0086] Figure 2 is showing Figure 1 a partial cross-sectional view showing the structure of the insertion portion of the endoscope shown.

[0087] Figure 3 is an external perspective view of the tip portion of the above insertion portion.

[0088] Figure 4 is a partial cut-away partial cross-sectional view of the above tip portion, omitting the hatching of the cross-section showing the lens and prism. DETAILED DESCRIPTION OF THE INVENTION

[0089] [Adhesive for Endoscopes]

[0090] A preferred embodiment of the adhesive for endoscopes of the present invention will be described.

[0091] The adhesive for endoscopes of the present invention (hereinafter, also referred to as "the adhesive of the present invention") contains the following components (A) to (C).

[0092] Component (A): Epoxy resin;

[0093] Component (B): Curing component of epoxy resin;

[0094] Component (C): Radical scavenger.

[0095] The above-mentioned component (A) is the main agent of the adhesive, and the above-mentioned component (B) is a curing component that reacts with the epoxy resin to cure the adhesive. The adhesive of the present invention contains, in addition to the above-mentioned main agent and curing component, a radical scavenger of the above-mentioned component (C). As described below, components (A) to (C) are components containing specific compounds.

[0096] The form of the adhesive of the present invention is not limited as long as it contains the above-mentioned components. For example, the adhesive for endoscope of the present invention can be in the form of a mixture containing the above-mentioned components (A) to (C) (one-component type), or can contain components (A) to (C) in a state where some of the above-mentioned components (A) to (C) are more separated from other components (two-component type). In addition, the adhesive for endoscope of the present invention can also contain components (A) to (C) in a state where each of the components (A) to (C) is more separated from each other (three-component type). Any of these forms is included in the adhesive of the present invention.

[0097] When the content of each component in the adhesive is described in this specification, or when the content of each component in the adhesive is specified in the present invention, in forms such as the two-component type and the three-component type, it means that when used, components (A) to (C) are mixed so that each component in the mixture satisfies the desired content described later. That is, in a state where the components are more separated, the content of each of components (A) to (C) does not have to satisfy the content described in this specification. That is, in forms such as the two-component type and the three-component type, it means that the content described in this specification is satisfied at the moment when components (A) to (C) are mixed during use.

[0098] When the adhesive for endoscope of the present invention is of the one-component type, and even when it is of the two-component type or the like and components that can react with each other are mixed (for example, when an epoxy resin and its curing agent are mixed), in order not to cause or sufficiently suppress the reaction between the components and maintain a state where each component is stably maintained, it is preferred that the above-mentioned adhesive be stored at a low temperature to such an extent that the reaction does not actually occur. For example, it can be stored at -20°C or lower, preferably at -30°C or lower, more preferably at -40°C or lower, and further preferably at -50°C or lower. In addition, it can also be stored in the dark as needed.

[0099] The adhesive of the present invention may contain, within the range that does not impair the effects of the present invention, for example, solvents, plasticizers, adhesion improvers (such as silane coupling agents), surfactants, colorants (pigments, dyes, etc.), weathering agents, antioxidants, heat stabilizers, lubricants, antistatic agents, brighteners, mold release agents, conductive agents, viscosity regulators, fillers (such as silica, calcium carbonate, etc.), rheology modifiers, diluents, and flame retardants, etc.

[0100] Even when the cured product obtained by curing the adhesive of the present invention is exposed to high temperatures for a long time, and even when a strong sterilization treatment such as ozone water is applied, sufficient adhesive force can be maintained. The reason is not clear, and it can be inferred that the following situations, etc., are acting comprehensively: Component (C) efficiently captures the free radicals absorbed in the cured product and the free radicals generated by the sterilization treatment, and effectively inhibits the reaction of the free radicals. That is, this component (C) is uniformly dispersed in the cured product obtained by curing component (A) with a specific curing component (component (B)), and effectively captures free radicals.

[0101] The adhesive of the present invention is suitable for the immobilization of various components (endoscope components) constituting an endoscope. That is, the adhesive of the present invention is suitable for bonding (adhering) and fixing an endoscope component to other components of the endoscope. The adhesive used for the fixation of the endoscope component becomes a cured product and constitutes the adhesive part of the endoscope.

[0102] There is no particular limitation on the components fixed using the adhesive of the present invention, and metal components, glass components, resin components, etc. can be preferably selected. The "fixation" of the endoscope component can be carried out by bonding the endoscope component to other components (support components) constituting the endoscope. In addition, the support component can be the tube wall of the endoscope or an immovable component fixed to the tube wall, etc., or a component that can move relative to its position in the endoscope like a tube. Further, in the present invention, the term "fixation" is used to include the meaning of filling, that is, sealing, the space between the endoscope component and the support component for assembling the component with the cured product of the adhesive.

[0103] Next, each component constituting the adhesive of the present invention will be described.

[0104] <Component (A)>

[0105] The adhesive of the present invention contains an epoxy resin, and this epoxy resin contains at least one of bisphenol A type epoxy resin, bisphenol F type epoxy resin, and novolac type epoxy resin. The adhesive of the present invention may contain one epoxy resin selected from bisphenol A type epoxy resin, bisphenol F type epoxy resin, and novolac type epoxy resin, or may contain two or more.

[0106] The proportion of the total amount of bisphenol A type epoxy resin, bisphenol F type epoxy resin and novolac type epoxy resin in the total amount of epoxy resin contained in the adhesive of the present invention is preferably 70% by mass or more, preferably 80% by mass or more, more preferably 90% by mass or more. More preferably, the above-mentioned epoxy resin contained in the adhesive of the present invention is at least one of bisphenol A type epoxy resin, bisphenol F type epoxy resin and novolac type epoxy resin.

[0107] The epoxy equivalent of the epoxy resin contained in the adhesive of the present invention is preferably 10 to 1000, more preferably 50 to 500, further preferably 80 to 400, and particularly preferably 100 to 300. The epoxy resin contained in the adhesive of the present invention usually has two or more epoxy groups in one molecule.

[0108] The epoxy equivalent is the value obtained by dividing the weight average molecular weight of the epoxy compound by the number of moles of epoxy groups possessed by the epoxy compound.

[0109] The bisphenol A type epoxy resin that can be used in the adhesive of the present invention is not particularly limited, and resins that are generally used as the main component of epoxy adhesives can be widely used. As preferred specific examples, bisphenol A diglycidyl ether (jER825, jER828 and jER834 (all are trade names), manufactured by Mitsubishi Chemical Corporation) and bisphenol A propoxylated diglycidyl ether (manufactured by Sigma-Aldrich Corporation) can be cited.

[0110] The bisphenol F type epoxy resin that can be used in the adhesive of the present invention is not particularly limited, and resins that are generally used as the main component of epoxy adhesives can be widely used. As preferred specific examples, bisphenol F diglycidyl ether (trade name: EPICLON830, manufactured by DIC Corporation) and 4,4'-methylenebis(N,N-diglycidylaniline) can be cited.

[0111] The novolac type epoxy resin that can be used in the adhesive of the present invention is not particularly limited, and resins that are generally used as the main component of epoxy adhesives can be widely used. For example, such a novolac type epoxy resin is sold by Sigma-Aldrich Corporation under the product number 406775.

[0112] The content of the epoxy resin contained in the adhesive of the present invention is preferably 5% by mass or more, more preferably 10% by mass or more, more preferably 20% by mass or more, more preferably 30% by mass or more, more preferably 40% by mass or more, and further preferably 50% by mass or more. The content of the above-mentioned epoxy resin is preferably 99% by mass or less, more preferably 98% by mass or less, more preferably 97% by mass or less, and further preferably 96% by mass or less.

[0113] <Component (B)>

[0114] The adhesive of the present invention contains, as component (B), at least one of a phosphorus-containing compound, a polythiol compound, a dicyandiamide compound, a phenolic compound, a polyamine compound having an unsubstituted amino group (-NH2), an acid anhydride, and an imidazole compound. In the adhesive of the present invention, the phosphorus-containing compound, the polythiol compound, the dicyandiamide compound, the phenolic compound, the polyether polyamine compound, the acid anhydride compound, and the imidazole compound may be used alone or in combination of two or more.

[0115] From the viewpoint of further improving the sterilization durability, the adhesive of the present invention preferably contains a polyether polyamine compound as component (B).

[0116] (1) Phosphorus-containing compound

[0117] The phosphorus-containing compound used in the present invention can be widely used as a compound that is usually used as a curing accelerator for epoxy resins. Among them, the phosphorus-containing compound does not include the component (C-4) described later. As the phosphorus-containing compound, for example, a tertiary phosphine compound and a tetra-substituted phosphonium tetra-substituted borate can be cited.

[0118] As the tertiary phosphine compound, for example, a phosphine compound in which a total of three alkyl groups and aryl groups are bonded to a phosphorus atom can be cited. The above alkyl group can be any of linear, branched, and cyclic, preferably an alkyl group having 1 to 20 carbon atoms, more preferably an alkyl group having 1 to 10 carbon atoms, and further preferably an alkyl group having 1 to 5 carbon atoms. Specific examples of the above alkyl group include methyl, ethyl, propyl, butyl, tert-butyl, and cyclohexyl. The aryl group preferably has 6 to 20 carbon atoms, more preferably 6 to 10 carbon atoms. Specific examples of the above aryl group include phenyl and naphthyl, and phenyl is preferred. The above aryl group may have a substituent, and specific examples of the substituent include the above alkyl group.

[0119] As the phosphine compound in which a total of three alkyl groups and aryl groups are bonded to a phosphorus atom, triarylphosphine, trialkylphosphine, and monoalkyldiarylphosphine are preferred.

[0120] Specific examples of the triarylphosphine include: triphenylphosphine, tris(4-methylphenyl)phosphine, tris(4-ethylphenyl)phosphine, tris(4-propylphenyl)phosphine, tris(4-butylphenyl)phosphine, tris(2,4-dimethylphenyl)phosphine, and tris(2,4,6-trimethylphenyl)phosphine.

[0121] Specific examples of the trialkylphosphine include: tributylphosphine, trioctylphosphine, tricyclohexylphosphine, and triisobutylphosphine.

[0122] Specific examples of the monoalkyldiarylphosphine include: methyldiphenylphosphine, ethyldiphenylphosphine, hexyldiphenylphosphine, and cyclohexyldiphenylphosphine.

[0123] Examples of the tetrasubstituted phosphonium tetrasubstituted borate include tetraarylphosphonium tetraaryl borate and tetraalkylphosphonium tetraalkyl borate. The aryl group of the tetraarylphosphonium tetraaryl borate and the alkyl group of the tetraalkylphosphonium tetraalkyl borate may be any alkyl group or aryl group that can be used for a phosphine compound having three alkyl groups and three aryl groups bonded to a phosphorus atom.

[0124] Specific examples of the tetraarylphosphonium tetraarylborate include tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetra-p-tolylborate, and p-tolyltriphenylphosphonium tetra-p-tolylborate.

[0125] Specific examples of the tetraalkylphosphonium tetraalkylborate include tetrabutylphosphonium tetrabutylborate, tri-tert-butylmethylphosphonium tetrabutylborate, and di-tert-butyldimethylphosphonium tetrabutylborate.

[0126] In the adhesive of the present invention, triarylphosphines are preferred, and among them, triphenylphosphine and tri(4-methylphenyl)phosphine are preferred.

[0127] (2) Polythiol compounds

[0128] The polythiol compound used in the present invention can widely use compounds that are generally used as curing accelerators for epoxy resins. For example, a compound having at least two partial structures represented by the following general formula (S1) or a compound having at least two partial structures represented by the following general formula (S2) can be used. From the viewpoint of increasing the crosslinking density of the cured product and further improving the sterilization durability, it is preferred that the polythiol compound have 3 to 10 (preferably 3 to 6) partial structures represented by the following general formula (S1) or a structure having 3 to 10 (preferably 3 to 6) partial structures represented by the following general formula (S2). On the other hand, the polythiol compound having two partial structures represented by the following general formula (S1) or a structure having two partial structures represented by the following general formula (S2) can obtain a relatively soft cured product, so it is preferred.

[0129] [Chemical formula 8]

[0130]

[0131] In the general formula (S1), R a1 ~R a5 One of them represents a thiol group (thiol group), and the others each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an aryl group having 6 to 14 carbon atoms, and l represents an integer of 0 to 2. When l is 2, the two R a1 They can be the same or different. a5 They may be the same as or different from each other. * indicates a bonding site in the polythiol compound.

[0132] In the general formula (S2), R a6 ~Ra10 One of them represents a mercapto group, and the others each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an aryl group having 6 to 14 carbon atoms, and m represents an integer of 0 to 2. When m is 2, the two Rs a6 may be the same as each other or different from each other, and the two Rs a10 may be the same as each other or different from each other. * Represents the bonding site in the polythiol compound.

[0133] The above-mentioned alkyl group having 1 to 10 carbon atoms may be linear or branched, and examples thereof include: methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, hexyl, and octyl. Among these alkyl groups, methyl or ethyl is preferred.

[0134] Specific examples of the aryl group having 6 to 14 carbon atoms include phenyl and naphthyl.

[0135] l is preferably 0 or 1.

[0136] m is preferably 0 or 1.

[0137] The partial structure represented by the above general formula (S1) is preferably the partial structure represented by the following general formula (S3).

[0138] [Chemical formula 9]

[0139]

[0140] In the general formula (S3), R a11 and R a12 each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and u represents an integer of 0 to 2. * Represents the bonding site in the polythiol compound.

[0141] R a11 and R a12 At least one of them preferably represents an alkyl group having 1 to 10 carbon atoms.

[0142] R a11 and R a12 The alkyl group having 1 to 10 carbon atoms represented has the same meaning as the above-mentioned alkyl group that can be selected as R a1 in the general formula (S1), and the preferred ranges are also the same.

[0143] u is preferably 0 or 1, more preferably 1.

[0144] The polythiol compound is preferably an ester of a compound represented by the following general formula (S4) and a polyfunctional alcohol.

[0145] [Chemical formula 10]

[0146]

[0147] In the general formula (S4), R a1 ~R a5 and l respectively have the same meanings as R a1 ~R a5 and l in the above general formula (S1), and also have the same preferred ranges.

[0148] The compound represented by the general formula (S4) is preferably a compound represented by the following general formula (S5).

[0149] [Chemical formula 11]

[0150]

[0151] In the general formula (S5), R a11 , R a12 and u respectively have the same meanings as R a11 , R a12 and u in the above general formula (S3), and also have the same preferred ranges.

[0152] As specific examples of the compound represented by the general formula (S4), there may be mentioned: 2-mercaptopropionic acid, 3-mercaptopropionic acid, 3-mercaptobutyric acid, 2-mercaptoisobutyric acid, 3-mercapto-3-phenylpropionic acid, 3-mercaptoisobutyric acid, 2-mercapto-3-methylbutyric acid, 3-mercapto-3-methylbutyric acid, 3-mercaptopentanoic acid and 3-mercapto-4-methylpentanoic acid.

[0153] The polyhydric alcohol is preferably an alcohol having 2 to 10 functional groups (a polyhydric alcohol having 2 to 10 hydroxyl groups), more preferably 2 to 8 functional groups, and particularly preferably 2 to 6 functional groups.

[0154] As specific examples of the polyhydric alcohol, there may be mentioned: alkylene glycols (the number of carbon atoms of the alkylene is preferably 2 to 10, and the alkylene may be linear or branched), diethylene glycol, glycerol, dipropylene glycol, trimethylolpropane, pentaerythritol, dipentaerythritol, etc.

[0155] As the alkylene glycol, there may be mentioned, for example: ethylene glycol, propylene glycol, 1,2-propylene glycol, 1,2-butanediol, 1,3-butanediol, 2,3-butanediol and tetramethylene glycol, etc.

[0156] As the polyhydric alcohol, alkylene glycols having 2 carbon atoms in the main chain of the alkylene such as ethylene glycol, 1,2-propylene glycol and 1,2-butanediol, and trimethylolpropane and pentaerythritol are preferred.

[0157] Next, specific examples of the polythiol compound that can be used in the present invention are given, but the present invention is not limited to these specific examples.

[0158] As specific examples, the following can be cited: bis(1-mercaptoethyl) phthalate, bis(2-mercaptopropyl) phthalate, bis(3-mercaptobutyl) phthalate, bis(3-mercaptoisobutyl) phthalate, ethylene glycol bis(3-mercaptopropionate), ethylene glycol bis(3-mercaptobutyrate), propylene glycol bis(3-mercaptobutyrate), diethylene glycol bis(3-mercaptobutyrate), tetraethylene glycol bis(3-mercaptopropionate), butanediol bis(3-mercaptobutyrate), octanediol bis(3-mercaptobutyrate), trimethylolpropane tris(3-mercaptobutyrate), trimethylolpropane tris(3-mercaptopropionate), dipentaerythritol hexa(3-mercaptopropionate), pentaerythritol tetra(3-mercaptopropionate), pentaerythritol tetra(3-mercaptobutyrate), dipentaerythritol hexa(3-mercaptobutyrate), ethylene glycol bis(2-mercaptopropionate), propylene glycol bis(2-mercaptopropionate), diethylene glycol bis(2-mercaptopropionate), butanediol bis(2-mercaptopropionate), octanediol bis(2-mercaptopropionate), trimethylolpropane tris(2-mercaptopropionate), pentaerythritol tetra(2-mercaptopropionate), dipentaerythritol hexa(2-mercaptopropionate), ethylene glycol bis(3-mercaptoisobutyrate), propylene glycol bis(3-mercaptoisobutyrate), diethylene glycol bis(3-mercaptoisobutyrate), butanediol bis(3-mercaptoisobutyrate), octanediol bis(3-mercaptoisobutyrate), trimethylolpropane tris(3-mercaptoisobutyrate), pentaerythritol tetra(3-mercaptoisobutyrate), dipentaerythritol hexa(3-mercaptoisobutyrate), ethylene glycol bis(2-mercaptoisobutyrate), propylene glycol bis(2-mercaptoisobutyrate), diethylene glycol bis(2-mercaptoisobutyrate), butanediol bis(2-mercaptoisobutyrate), octanediol bis(2-mercaptoisobutyrate), trimethylolpropane tris(2-mercaptoisobutyrate), pentaerythritol tetra(2-mercaptoisobutyrate), dipentaerythritol hexa(2-mercaptoisobutyrate), ethylene glycol bis(4-mercaptovalerate), propylene glycol bis(4-mercaptoisovalerate), diethylene glycol bis(4-mercaptovalerate), butanediol bis(4-mercaptovalerate), octanediol bis(4-mercaptovalerate), trimethylolpropane tris(4-mercaptovalerate), pentaerythritol tetra(4-mercaptovalerate), dipentaerythritol hexa(4-mercaptovalerate), ethylene glycol bis(3-mercaptovalerate), propylene glycol bis(3-mercaptovalerate), diethylene glycol bis(3-mercaptovalerate), butanediol bis(3-mercaptovalerate), octanediol bis(3-mercaptovalerate), trimethylolpropane tris(3-mercaptovalerate), pentaerythritol tetra(3-mercaptovalerate), dipentaerythritol hexa(3-mercaptovalerate), 1,4-bis(3-mercaptobutyryloxy)butane, 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, and tris[(3-mercaptopropionyloxy)ethyl] isocyanurate.

[0159] From the viewpoints of less odor, having a desired degree of viscosity, good miscibility with the epoxy resin as component (A), and the workability of the mixture obtained by mixing component (A) and component (B), the above-mentioned polythiol compound is preferably at least one of 1,4-bis(3-mercaptobutyryloxy)butane, pentaerythritol tetra(3-mercaptobutyrate), 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, trimethylolpropane tris(3-mercaptobutyrate), ethylene glycol bis(3-mercaptopropionate), tetraethylene glycol bis(3-mercaptopropionate), trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetra(3-mercaptopropionate), dipentaerythritol hexa(3-mercaptopropionate), and tris[(3-mercaptopropionyloxy)ethyl] isocyanurate, and more preferably at least one of 1,4-bis(3-mercaptobutyryloxy)butane, pentaerythritol tetra(3-mercaptobutyrate), 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, and trimethylolpropane tris(3-mercaptobutyrate).

[0160] The molecular weight of the above-mentioned polythiol compound is not particularly limited. From the viewpoints of easy mixing with the epoxy resin as component (A) of the adhesive of the present invention and not being easily re-separated, and the workability that the mixture obtained by mixing component (A) and component (B) is not likely to cause sagging or unevenness, it is preferably 200 to 1,000, and more preferably 300 to 800.

[0161] In the present invention, the above-mentioned polythiol compound can use commercially available products. As specific examples, there can be mentioned: 1,4-bis(3-mercaptobutyryloxy)butane (trade name: KARENZ MT BD1, manufactured by Showa Denko K.K.), pentaerythritol tetra(3-mercaptobutyrate) (trade name: KARENZ MT PE1, manufactured by Showa Denko K.K.), 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione (trade name: KARENZ MT NR1, manufactured by Showa Denko K.K.), and trimethylolpropane tris(3-mercaptobutyrate) (trade name TPMB, manufactured by Showa Denko K.K.).

[0162] (3) Dicyandiamide compound

[0163] The dicyandiamide compound used in the present invention is a compound having dicyandiamide as a basic skeleton and exhibiting a curing promoting effect, which is widely used as a curing promoter for epoxy resins. Among such compounds, in addition to dicyandiamide ((NH2)2C=NCN) itself, there are also compounds having a structure in which a part of the hydrogen atoms of the amino group of dicyandiamide is substituted. As the dicyandiamide compound, for example, DICY7 and DICY15 (both are trade names, manufactured by Mitsubishi Chemical Corporation) are commercially available. In addition, commercially available products manufactured by Tokyo Chemical Industry Co., Ltd. and the like can also be used in the adhesive of the present invention.

[0164] (4) Phenolic compounds

[0165] The phenolic compound used in the present invention is a compound having a phenolic hydroxyl group, which is widely used as a curing agent for epoxy resins. "Phenolic hydroxyl group" refers to a hydroxyl group bonded to a ring-forming carbon atom of an aromatic hydrocarbon ring.

[0166] As the phenolic compound used in the present invention, a phenol resin is preferred. As specific examples of the phenol resin, HF-1M, DL-92, MEHC-7841-4S, and MEH-7000 manufactured by Meiwafosis Co., Ltd. and TD-2131 and TD-2106 manufactured by DIC Corporation (both are trade names) can be cited.

[0167] (5) Polyamine compounds having unsubstituted amino groups

[0168] A polyamine compound having unsubstituted amino groups is a compound having two or more unsubstituted amino groups (-NH2) in one molecule. This polyamine compound is more preferably a primary polyamine compound (a polyamine compound in which all amino groups are unsubstituted amino groups). The adhesive of the present invention can widely use a compound having two or more unsubstituted amino groups in a polyamine compound that exhibits a curing effect in an epoxy-based adhesive.

[0169] The number of amino groups having active hydrogen (preferably unsubstituted amino groups) in one molecule of the above polyamine compound is preferably 2 to 10, more preferably 2 to 8, further preferably 2 to 6, further preferably 2 to 4, and particularly preferably 2 or 3. Among them, at least one selected from diamine compounds and triamine compounds can be appropriately used.

[0170] The active hydrogen equivalent (equivalent of active hydrogen possessed by the amino group) of the above polyamine compound is preferably 10 to 2000, more preferably 20 to 1000, further preferably 30 to 900, further preferably 40 to 800, further preferably 60 to 700, and particularly preferably 65 to 600.

[0171] The active hydrogen equivalent is a value obtained by dividing the molecular weight of the polyamine compound by the number of moles of active hydrogen of the amino group possessed by the polyamine compound (meaning the molecular weight of each active hydrogen of the amino group in the polyamine compound).

[0172] The molecular weight of the above polyamine compound is preferably from 100 to 6000, more preferably from 100 to 3000. When the polyamine compound is a polymer (for example, in the case of having a polyoxyalkylene group as described later), the above molecular weight is the number average molecular weight.

[0173] In addition, in the present invention, the number average molecular weight is determined by gel permeation chromatography. The measurement method is as follows. The apparatus used is HLC-8320GPC (manufactured by Tosoh Corporation), the column used is TOSOH TSKgel Super AWM-H (column size 6.0 mm × 15 cm), and the eluent used is N-methylpyrrolidone (NMP) (containing 10 mM LiBr). The flow rate is 0.35 mL / min, the measurement is carried out at 40 °C, and detection is performed using a differential refractive index detector (RI). The molecular weight is determined using polystyrene standards.

[0174] The above polyamine compound is preferably in a form in which two or more amino groups are bonded via a group selected from an aliphatic hydrocarbon group, a cyclic hydrocarbon group, an aromatic hydrocarbon group, and a heterocyclic group or a group formed by combining these groups. These groups may have a heteroatom such as an oxygen atom, a nitrogen atom, or a sulfur atom (preferably an oxygen atom) between carbon-carbon bonds.

[0175] From the viewpoints of ozone water treatment durability and heat resistance, the above polyamine compound is also preferably a compound that does not contain a heteroatom such as an oxygen atom, a nitrogen atom, or a sulfur atom (preferably an oxygen atom) between carbon-carbon bonds. In the case of a polyamine compound that does not contain a heteroatom between the above carbon-carbon bonds, the group bonding two or more amino groups may be a chain-like aliphatic hydrocarbon group, and the chain-like aliphatic hydrocarbon group may have a branched chain. The number of carbon atoms of these chain-like aliphatic hydrocarbon groups having a branched chain is preferably from 4 to 50, more preferably from 4 to 12, and further preferably from 6 to 12.

[0176] From the viewpoints of ozone water treatment durability and heat resistance, the above polyamine compound is also preferably a compound having a chain-like alkylene group or an oxyalkylene group structure in the molecule, and more preferably having a polyoxyalkylene group structure.

[0177] The polyamine compound having a chain-like alkylene group is preferably an alkylenediamine compound. The polyamine compound having a polyoxyalkylene group structure (hereinafter, also referred to as "polyether polyamine compound") is more preferably a polyoxyalkylenediamine compound or a polyoxyalkylenetriamine compound.

[0178] The above chain-like alkylene group may be straight-chain or branched-chain, and the number of carbon atoms is preferably from 1 to 20, more preferably from 5 to 12. Specific examples of the alkylene group include: methylene, ethylene, hexamethylene, 2,4,4-trimethylhexamethylene, 2-methylpentamethylene, and dodecamethylene.

[0179] The alkylene group in the above oxyalkylene group structure may be a straight-chain alkylene group or a branched-chain alkylene group. In addition, the number of carbon atoms of the alkylene group in the above oxyalkylene group structure is preferably 1 to 10, more preferably 2 to 6, and still more preferably 2 to 4.

[0180] The above oxyalkylene group structure is more preferably oxyethylene group or oxypropylene group.

[0181] When the polyamine compound of component (B) has a polyoxyalkylene group structure, the plurality of oxyalkylene groups constituting the polyoxyalkylene group structure may be the same as or different from each other. In addition, the average number of repetitions of the oxyalkylene group in the above polyoxyalkylene group structure is preferably 2 to 1000, more preferably 3 to 500. In addition, the average number of repetitions is also preferably 2 to 100, preferably 2 to 50, preferably 2 to 35, and preferably 2 to 25. The polyamine compound of component (B) may have a plurality of polyoxyalkylene group structures.

[0182] From the viewpoints of ozone water treatment durability and heat resistance, the above polyamine compound preferably has a polyamide bond (-NH-CO-) in the molecule.

[0183] The polyamine compound having a polyamide bond (hereinafter, also referred to as "polyamide polyamine compound") is preferably a polyamide diamine compound.

[0184] The average number of amide bonds in one molecule of the polyamide polyamine compound is preferably 2 to 50, more preferably 5 to 30, and still more preferably 5 to 20.

[0185] The linking group connecting the above-mentioned plurality of amide bonds is not particularly limited, and examples thereof include saturated or unsaturated aliphatic hydrocarbon groups and aromatic hydrocarbon groups. When the polyamide polyamine compound has a plurality of linking groups connecting the amide bonds to each other, the plurality of linking groups may be the same as or different from each other.

[0186] From the viewpoints of ozone water treatment durability and heat resistance of the cured product obtained from the adhesive of the present invention, the above polyamine compound preferably has a polyoxyalkylene group structure. It is inferred that if the polyamine compound is a compound having a polyoxyalkylene group structure, even when the crosslinked structure deteriorates and decomposes due to ozone water treatment, since the cured product has high toughness, cracks are not easily generated inside the cured product, and the strength of the cured product is maintained. In addition, it is inferred that even when exposed to high temperatures, since it has a soft structure, the stress during thermal expansion or thermal contraction is easily relieved and cracking is not likely to occur.

[0187] The following shows preferred specific examples of the polyamine compound that can be used in the present invention. The numbers in parentheses are the average number of repetitions of the repeating units in the parentheses.

[0188] [Chemical formula 12]

[0189]

[0190] [Chemical Formula 13]

[0191]

[0192] [Chemical Formula 14]

[0193]

[0194] [Chemical Formula 15]

[0195]

[0196] [Chemical Formula 16]

[0197]

[0198] [Chemical Formula 17]

[0199]

[0200] The above polyamine compounds can be synthesized by conventional methods. Additionally, commercially available products can also be used. Examples of commercially available products include: polyetheramine D230, polyetheramine D400, and polyetheramine T403 (all are trade names, manufactured by MITSUI FINE CHEMICALS), JEFFAMINE ED-600 (trade name, manufactured by Huntsman), and HV953U (trade name, manufactured by Nagase Kasei, polyaminoamide).

[0201] (6) Acid anhydride compound

[0202] In the present invention, "acid anhydride" means carboxylic anhydride.

[0203] The acid anhydride compound used in the present invention preferably contains an alicyclic dicarboxylic anhydride. The alicyclic dicarboxylic anhydride is a compound having a structure formed by dehydration condensation of carboxyl groups of two adjacent carbon atoms constituting the alicyclic ring. The alicyclic ring is preferably a monocyclic ring of 5 or 6 members, more preferably a 6-membered ring. Additionally, the alicyclic ring may have one or more than two substituents. Two adjacent substituents among the substituents may be connected to form a ring. The ring formed by connecting two substituents is preferably a monocyclic ring of 5 or 6 members, and it is also preferred that an acid anhydride group is formed through this ring.

[0204] The acid anhydride compound used in the present invention can contain one or more than two of the alicyclic dicarboxylic anhydrides.

[0205] The acid anhydride compound used in the present invention may also contain an acid anhydride compound other than an alicyclic dicarboxylic anhydride. When the acid anhydride compound used in the present invention contains an alicyclic dicarboxylic anhydride, the proportion of the total amount of the alicyclic dicarboxylic anhydride in the total acid anhydride compounds contained in the acid anhydride compound used in the present invention is preferably 50% by mass or more, more preferably 70% by mass or more, still more preferably 80% by mass or more, and particularly preferably 90% by mass or more. In addition, it is also preferred that all the acid anhydride compounds contained in the acid anhydride compound used in the present invention are the above-mentioned alicyclic dicarboxylic anhydrides.

[0206] In addition, the acid anhydride compound used in the present invention preferably also contains an acid anhydride compound represented by the following formula (I).

[0207] [Chemical formula 18]

[0208]

[0209] In formula (I), ring T is a 5-membered ring or a 6-membered ring. Ring T may be an alicyclic ring or an aromatic ring. In addition, when ring T is an alicyclic ring, it may be a saturated hydrocarbon ring or may have an unsaturated bond between ring-forming atoms.

[0210] R b represents an alkyl group, an alkoxy group, an acyl group, an alkoxycarbonyl group, an aryl group or a carboxyl group, and nb is an integer of 0 to 4.

[0211] The alkyl group optionally serving as R b preferably has 1 to 10 carbon atoms, more preferably 1 to 6 carbon atoms, still more preferably 1 to 3 carbon atoms, and still more preferably is a methyl group or an ethyl group.

[0212] The alkoxy group optionally serving as R b preferably has 1 to 10 carbon atoms, more preferably 1 to 6 carbon atoms, still more preferably 1 to 3 carbon atoms, and still more preferably is a methoxy group or an ethoxy group.

[0213] The acyl group optionally serving as R b preferably has 1 to 30 carbon atoms, more preferably 1 to 20 carbon atoms, still more preferably 1 to 10 carbon atoms. In the present invention, the acyl group is used to include the meaning of an arylcarbonyl group.

[0214] The alkoxycarbonyl group optionally serving as R b preferably has 1 to 30 carbon atoms, more preferably 1 to 20 carbon atoms, still more preferably 1 to 15 carbon atoms. The alkoxy group constituting the alkoxycarbonyl group is preferably a methoxy group, an ethoxy group or a propoxy group.

[0215] The aryl group optionally serving as R b preferably has 6 to 20 carbon atoms, more preferably 6 to 15 carbon atoms, still more preferably 6 to 12 carbon atoms, and still more preferably is a phenyl group.

[0216] nb is preferably 0 or 1.

[0217] When nb is 2 or more, two adjacent Rs b can be connected to form a condensed ring together with ring T. The ring formed by connecting two Rs b is preferably a 5- or 6-membered ring, more preferably a 5-membered ring. This ring is more preferably formed by two ring-forming carbon atoms and the ring-forming oxygen atom clamped by them to form an acid anhydride structure (-C(=O)-O-C(=O)-) (that is, preferably two adjacent Rs that are both carboxyl groups b are dehydrated and condensed).

[0218] The acid anhydride compound represented by formula (I) preferably has 1 to 3 acid anhydride structures in the molecule, more preferably has one or two acid anhydride structures, and further preferably has one acid anhydride structure. In addition, the molecular weight of the acid anhydride compound represented by formula (I) is preferably 90 to 800, more preferably 100 to 300.

[0219] The acid anhydride compound used in the present invention can contain one or more of the acid anhydride compounds represented by formula (I).

[0220] When the acid anhydride compound used in the present invention contains the acid anhydride compound represented by formula (I), this acid anhydride compound can contain an acid anhydride compound other than the acid anhydride compound represented by formula (I). When the above acid anhydride compound contains the acid anhydride compound represented by formula (I), the proportion of the total amount of the acid anhydride compound represented by formula (I) in all the acid anhydride compounds contained in the acid anhydride compound used in the present invention is preferably 50% by mass or more, more preferably 70% by mass or more, further preferably 80% by mass or more, and particularly preferably 90% by mass or more. In addition, it is also preferred that all the acid anhydride compounds contained in the acid anhydride compound used in the present invention are the acid anhydride compounds represented by the above formula (I).

[0221] In addition, the acid anhydride compound used in the present invention also preferably contains at least one acid anhydride compound selected from phthalic anhydride, trimellitic anhydride, pyromellitic dianhydride, benzophenone tetracarboxylic dianhydride, ethylene glycol bis(trimellitic anhydride), glycerol tris(trimellitic anhydride), maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylbutenyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, succinic anhydride, octenyl succinic anhydride, dodecenyl succinic anhydride, methylcyclohexene dicarboxylic anhydride, methylbicyclo[2.2.1]heptane-2,3-dicarboxylic anhydride, and bicyclo[2.2.1]heptane-2,3-dicarboxylic anhydride (hereinafter, these acid anhydride compounds are collectively referred to as acid anhydride Z). That is, the acid anhydride compound used in the present invention preferably contains at least one acid anhydride compound selected from acid anhydride Z.

[0222] The acid anhydride compound used in the present invention more preferably contains an acid anhydride compound selected from trimellitic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, succinic anhydride, methylbicyclo[2.2.1]heptane-2,3-dicarboxylic anhydride, bicyclo[2.2.1]heptane-2,3-dicarboxylic anhydride, benzophenone tetracarboxylic anhydride, glycerol trimellitate, and octenyl succinic anhydride value.

[0223] When the acid anhydride compound used in the present invention contains an acid anhydride compound selected from the above acid anhydride Z, the acid anhydride compound used in the present invention may contain an acid anhydride compound other than acid anhydride Z within the range that does not impair the effects of the present invention. When the acid anhydride compound used in the present invention contains an acid anhydride compound selected from acid anhydride Z, the proportion of the total amount of the acid anhydride compound selected from acid anhydride Z in all the acid anhydride compounds contained in the acid anhydride compound used in the present invention is preferably 50% by mass or more, more preferably 70% by mass or more, further preferably 80% by mass or more, and particularly preferably 90% by mass or more. In addition, it is also preferred that all the acid anhydride compounds contained in the acid anhydride compound used in the present invention are acid anhydride compounds selected from the above acid anhydride Z.

[0224] Hereinafter, specific examples of the acid anhydride compound that can be used in the present invention are shown, but the present invention is not limited to these specific examples.

[0225] [Chemical formula 19]

[0226]

[0227] (7) Imidazole compound

[0228] The imidazole compound used in the present invention preferably contains an imidazole compound represented by the following formula (II).

[0229] [Chemical formula 20]

[0230]

[0231] In formula (II), R b1 represents a hydrogen atom or an alkyl group. The alkyl group that can be selected as R b1 can be any of a straight-chain alkyl group, a branched alkyl group, and a cyclic alkyl group, and is preferably a straight-chain alkyl group.

[0232] The alkyl group that can be selected as R b1 is also preferably in the form of having a substituent. Examples of such a substituent include a cyano group, an aromatic hydrocarbon group, and an aromatic heterocyclic group. These aromatic hydrocarbon groups and aromatic heterocyclic groups are preferably monocyclic structures. The monocyclic aromatic heterocycle constituting the above aromatic heterocyclic group is preferably a 5-membered ring or a 6-membered ring, and more preferably a triazine ring.

[0233] The alkyl group that can be selected as R b1The number of carbon atoms of the alkyl group is preferably 1 to 20, more preferably 1 to 18, still more preferably 1 to 15, and particularly preferably 1 to 12. In addition, when the alkyl group is a cyclic alkyl group, the lower limit value of the above-mentioned number of carbon atoms is 3, preferably 4, and more preferably 5.

[0234] As the alkyl group that can be selected as R b1 Preferred examples of the alkyl group include cyanoalkyl and aralkyl. The cyanoalkyl is preferably a cyanoalkyl having 1 to 5 carbon atoms, more preferably 1 to 3 carbon atoms, and particularly preferably cyanoethyl. In addition, the aralkyl is preferably an aralkyl having 7 to 20 carbon atoms, more preferably 7 to 15 carbon atoms, still more preferably 7 to 10 carbon atoms, and particularly preferably benzyl.

[0235] R b2 、R b3 and R b4 represent a hydrogen atom, an alkyl group or an aryl group.

[0236] The alkyl group that can be selected as R b2 、R b3 and R b4 can be any of a straight-chain alkyl group, a branched alkyl group, and a cyclic alkyl group, and is preferably a straight-chain alkyl group.

[0237] The alkyl group that can be selected as R b2 、R b3 and R b4 The number of carbon atoms of the alkyl group is preferably 1 to 20, more preferably 1 to 18, still more preferably 1 to 15, and particularly preferably 1 to 12. In addition, when the alkyl group is a cyclic alkyl group, the lower limit value of the above-mentioned number of carbon atoms is 3, preferably 4, and more preferably 5.

[0238] As the preferred specific examples of the alkyl group that can be selected as R b2 、R b3 and R b4 can be cited: methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, 2-ethylhexyl, decyl, undecyl, dodecyl, heptadecyl, octadecyl, hydroxymethyl, and cyanoethyloxymethyl.

[0239] The aryl group that can be selected as R b2 、R b3 and R b4 The number of carbon atoms of the aryl group is preferably 6 to 15, more preferably 6 to 12, and particularly preferably phenyl.

[0240] The imidazole compound represented by formula (II) is also preferably in the form having a counter ion. When referred to as "the imidazole compound represented by formula (II)" in the present invention, it means including the form in which the imidazole compound represented by formula (II) has a counter ion. When the imidazole compound represented by formula (II) is in the form having a counter ion, a hydrogen atom is bonded to the ring-forming nitrogen atom of the compound represented by formula (II) and is positively charged, and a counter ion having a negative charge with respect to this positive charge is bonded.

[0241] The above-mentioned counter ion is not particularly limited, and as a preferred source of the counter ion, examples thereof include: trimellitic acid, pyromellitic acid, cyanuric acid, hydrochloric acid, sulfuric acid, thiocyanic acid, boric acid, etc.

[0242] In the imidazole compound represented by formula (II), R is more preferably b1 a hydrogen atom, a benzyl group, a triazinyl ethyl group or a cyanoethyl group. Further, R is more preferably b2 a hydrogen atom, a straight-chain unsubstituted alkyl group having 1 to 20 carbon atoms or a phenyl group. Further, R is more preferably b3 a hydrogen atom, a straight-chain and unsubstituted alkyl group having 1 to 20 carbon atoms (preferably 1 to 12 carbon atoms, more preferably 1 to 5 carbon atoms), a hydroxymethyl group or a cyanoethyloxymethyl group. Further, R is more preferably b4 a hydrogen atom, a hydroxymethyl group or a cyanoethyloxymethyl group.

[0243] The imidazole compound used in the present invention may contain one or more of the imidazole compounds represented by formula (II).

[0244] When the imidazole compound used in the present invention contains the imidazole compound represented by formula (II), the imidazole compound used in the present invention may also contain an imidazole compound other than the imidazole compound represented by formula (II). When the imidazole compound used in the present invention contains the imidazole compound represented by formula (II), the proportion of the total amount of the imidazole compound represented by formula (II) in the total imidazole compounds contained in the imidazole compound used in the present invention is preferably 50% by mass or more, more preferably 70% by mass or more, further preferably 80% by mass or more, and particularly preferably 90% by mass or more. In addition, it is also preferred that all the imidazole compounds contained in the imidazole compound used in the present invention are the imidazole compounds represented by formula (II).

[0245] The imidazole compounds used in the present invention also preferably contain at least one imidazole compound selected from imidazole, 1-methylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4-undecylimidazole, 1-cyanoethyl-2-undecylimidazolium·trimellitate, 2-phenyl-4,5-dihydroxymethylimidazole, 2-methylimidazolium·isocyanurate, 2,4-diamino-6-[2-(2-methyl-1-imidazolyl)ethyl]-s-triazine, and 2-phenylimidazolium·isocyanurate (hereinafter, these imidazole compounds are collectively referred to as imidazole Z). That is, the imidazole compounds used in the present invention preferably contain at least one imidazole compound selected from imidazole Z.

[0246] The imidazole compounds used in the present invention more preferably contain imidazole compounds selected from imidazole, 1-methylimidazole, 2-methylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazolium·trimellitate, 2-phenylimidazolium·isocyanurate, and 2,4-diamino-6-[2-(2-methyl-1-imidazolyl)ethyl]-s-triazine.

[0247] When the imidazole compounds used in the present invention contain imidazole compounds selected from the above imidazole Z, the curing agent may contain imidazole compounds other than imidazole Z within the range that does not impair the effects of the present invention. When the imidazole compounds used in the present invention contain imidazole compounds selected from imidazole Z, the proportion of the total amount of the imidazole compounds selected from imidazole Z in the total imidazole compounds contained in the imidazole compounds used in the present invention is preferably 50% by mass or more, more preferably 70% by mass or more, further preferably 80% by mass or more, and particularly preferably 90% by mass or more. In addition, it is also preferred that all the imidazole compounds contained in the imidazole compounds used in the present invention are imidazole compounds selected from the above imidazole Z.

[0248] Hereinafter, specific examples of the imidazole compounds that can be used in the present invention are shown, but the present invention is not limited to these specific examples. In addition, I-14 to I-17 in the following compounds represent the form in which the imidazole compound has a counter ion.

[0249] [Chemical formula 21]

[0250]

[0251] The proportion of the phosphorus-containing compound, polythiol compound, dicyandiamide compound, phenolic compound, polyamine compound having an unsubstituted amino group, acid anhydride compound, and imidazole compound in the component (B) of the adhesive for the present invention is preferably 80% by mass or more, more preferably 90% by mass or more. In addition, it is also preferred that all of the component (B) is a combination of one or more of the phosphorus-containing compound, polythiol compound, dicyandiamide compound, phenolic compound, polyamine compound having an unsubstituted amino group, acid anhydride compound, and imidazole compound. When the adhesive of the present invention contains a curing component of an epoxy resin other than the phosphorus-containing compound, polythiol compound, dicyandiamide compound, phenolic compound, polyamine compound having an unsubstituted amino group, acid anhydride compound, and imidazole compound as the component (B), a metal salt such as a boron complex can be used as the curing component.

[0252] The content of the component (B) in the adhesive of the present invention is not particularly limited and can be appropriately prepared in consideration of the reaction between the component (A) and the component (B).

[0253] When the component (B) contains the above phosphorus-containing compound, in the adhesive of the present invention, the content of the above phosphorus-containing compound is preferably 0.1 to 10 parts by mass, more preferably 0.3 to 5 parts by mass, and further preferably 0.5 to 4 parts by mass with respect to 100 parts by mass of the epoxy resin as the component (A).

[0254] When the component (B) contains the above polythiol compound, in the adhesive of the present invention, the content of the above polythiol compound can be appropriately set in consideration of the active hydrogen equivalent and the like.

[0255] In the adhesive of the present invention, the content of the above polythiol compound is preferably 15 to 100 parts by mass, more preferably 20 to 90 parts by mass, more preferably 35 to 90 parts by mass, and further preferably 50 to 80 parts by mass with respect to 100 parts by mass of the epoxy resin as the component (A).

[0256] When the component (B) contains the above dicyandiamide compound, in the adhesive of the present invention, the content of the above dicyandiamide compound can be appropriately set in consideration of the active hydrogen equivalent and the like.

[0257] For example, with respect to 100 parts by mass of the epoxy resin as the component (A), it can be set to 1 to 70 parts by mass, preferably 10 to 60 parts by mass, more preferably 20 to 65 parts by mass, and further preferably 30 to 50 parts by mass. In addition, it is preferred to use the dicyandiamide compound with the active hydrogen equivalent relative to the epoxy equivalent of the epoxy resin as the component (A) (active hydrogen equivalent / epoxy equivalent) being 0.3 to 1.0, and more preferably 0.4 to 0.7.

[0258] When component (B) contains the above-mentioned phenolic compound, in the adhesive of the present invention, the content of the above-mentioned phenolic compound is preferably 3 to 60 parts by mass, more preferably 5 to 50 parts by mass, still more preferably 10 to 40 parts by mass, and further preferably 15 to 35 parts by mass with respect to 100 parts by mass of the epoxy resin as component (A).

[0259] When component (B) contains the polyamine compound having the above-mentioned unsubstituted amino group, in the adhesive of the present invention, the content of the polyamine compound having the above-mentioned unsubstituted amino group can be appropriately set in consideration of the active hydrogen equivalent and the like.

[0260] For example, with respect to 100 parts by mass of the epoxy resin as component (A), it can be set to 10 to 100 parts by mass, more preferably 20 to 90 parts by mass, still more preferably 20 to 80 parts by mass, and further preferably 20 to 70 parts by mass. In addition, it is preferable to use the active hydrogen equivalent of the polyether polyamine compound with respect to the epoxy equivalent of the epoxy resin as component (A) (active hydrogen equivalent / epoxy equivalent) in the range of 0.1 to 1.5, more preferably 0.3 to 1.0, and further preferably 0.5 to 1.0.

[0261] When component (B) contains the above-mentioned acid anhydride compound, in the adhesive of the present invention, the content of the above-mentioned acid anhydride compound is preferably 50 to 200 parts by mass, more preferably 60 to 150 parts by mass, and further preferably 80 to 120 parts by mass with respect to 100 parts by mass of the epoxy resin as component (A).

[0262] When component (B) contains the above-mentioned imidazole compound, in the adhesive of the present invention, the content of the above-mentioned imidazole compound is preferably 1 to 20 parts by mass, more preferably 3 to 15 parts by mass, and further preferably 5 to 10 parts by mass with respect to 100 parts by mass of the epoxy resin as component (A).

[0263] In this specification, when the amount of the imidazole compound relative to the epoxy resin is described, the amount of the imidazole compound means the amount of the part after removing the counter ion in the case where the imidazole compound has a counter ion.

[0264] <Component (C)>

[0265] The adhesive of the present invention contains a radical scavenger, and the radical scavenger contains at least one of the following components (C-1) to (C-7). The adhesive of the present invention may contain one radical scavenger selected from components (C-1) to (C-7), or may contain two or more.

[0266] The total amount of components (C-1) to (C-7) preferably accounts for 70% by mass or more, more preferably 80% by mass or more, and still more preferably 90% by mass or more of the total amount of the radical scavenger contained in the adhesive of the present invention. Further preferably, the above radical scavenger contained in the adhesive of the present invention is at least one of components (C-1) to (C-7).

[0267] In the present invention, from the viewpoints of the heat resistance and sterilization durability of the cured adhesive, the radical scavenger preferably contains at least one of component (C-6) and component (C-7), and more preferably contains the above component (C-6). Component (C-6) can catalytically capture radicals, and thus exhibits radical capture ability over a long period. On the other hand, component (C-7) has excellent reactivity with radicals, can rapidly capture radicals, and inhibits deterioration of the cured adhesive, and is thus preferred.

[0268] Next, components (C-1) to (C-7) will be specifically described.

[0269] Component (C-1) is a compound represented by the following general formula (C-1).

[0270] [Chemical formula 22]

[0271]

[0272] In general formula (C-1), R 1 and R 2 represent a hydrogen atom, an aliphatic group, an acyl group, an aliphatic oxycarbonyl group, an aromatic oxycarbonyl group, an aliphatic sulfonyl group, or an aromatic sulfonyl group.

[0273] R 3 represents an aliphatic group, an aliphatic oxy group, an aromatic oxy group, an aliphatic thio group, an aromatic thio group, an acyloxy group, an aliphatic oxycarbonyloxy group, an aromatic oxycarbonyloxy group, a substituted amino group, a heterocyclic group, or a hydroxyl group.

[0274] R 1 and R 2 , R 2 and R 3 , R 1 and R 3 may be bonded to each other to form a 5- to 7-membered ring, but a piperidine skeleton is not formed.

[0275] In general formula (C-1), R 1 and R 2 are not both hydrogen atoms, the total number of carbon atoms of R 1 and R 2 is 7 or more. In addition, R 1 , R 2 and R 3 do not contain an unsubstituted amino group.

[0276] The above aliphatic group in the general formula (C-1) (the aliphatic group that forms part of the substituent in the general formula (C-1)) means an alkyl group, an alkenyl group, and an alkynyl group. The alkyl group, alkenyl group, and alkynyl group can be any of linear, branched, and cyclic.

[0277] The number of carbon atoms of the alkyl group is preferably 1 to 20, more preferably 1 to 18. Among them, when the alkyl group is branched or cyclic, the lower limit value of the number of carbon atoms is 3. The same applies to the alkenyl group and the alkynyl group.

[0278] The number of carbon atoms of the alkenyl group is preferably 2 to 20, more preferably 2 to 18.

[0279] The number of carbon atoms of the alkynyl group is preferably 2 to 20, more preferably 2 to 18. The above aliphatic group may have at least one of the following substituents T as a substituent. Among them, when the above aliphatic group is cyclic, it may also have an alkyl group, an alkenyl group, and an alkynyl group of the following substituent T.

[0280] Substituent T

[0281] · Halogen atom

[0282] Fluorine atom, chlorine atom, bromine atom, iodine atom

[0283] · Alkyl group [linear, branched or cyclic, substituted or unsubstituted alkyl group]

[0284] Linear or branched alkyl group (preferably a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms, such as methyl, ethyl, propyl, isopropyl, tert-butyl, octyl, eicosyl, 2-chloroethyl, 2-cyanoethyl, 2-ethylhexyl)

[0285] Cycloalkyl group (preferably a substituted or unsubstituted cycloalkyl group having 3 to 30 carbon atoms, such as cyclohexyl, cyclopentyl, 4-dodecylcyclohexyl)

[0286] Bicycloalkyl group (preferably a substituted or unsubstituted bicycloalkyl group having 5 to 30 carbon atoms, that is, a monovalent group obtained by removing one hydrogen atom from a bicycloalkane having 5 to 30 carbon atoms. For example, bicyclo[1.2.2]heptan-2-yl, bicyclo[2.2.2]octan-3-yl)

[0287] In the present invention, the cyclic alkyl group further includes polycycloalkyl groups such as tricycloalkyl group, tetracycloalkyl group, and pentacycloalkyl group in addition to the above cycloalkyl group and bicycloalkyl group (bicyclic system).

[0288] As a preferred form of the alkyl group constituting the substituent described below (for example, the alkyl group of alkylthio), the form of the alkyl group of substituent T can be cited.

[0289] · Alkenyl [linear, branched or cyclic, substituted or unsubstituted alkenyl]

[0290] Includes: linear or branched alkenyl (preferably substituted or unsubstituted alkenyl having 2 to 30 carbon atoms), such as vinyl, allyl, isoprenyl, geranyl, oleyl)

[0291] Cycloalkenyl (preferably substituted or unsubstituted cycloalkenyl having 3 to 30 carbon atoms, i.e., a monovalent group obtained by removing one hydrogen atom from a cycloalkene having 3 to 30 carbon atoms. For example, 2-cyclopenten-1-yl, 2-cyclohexen-1-yl)

[0292] Bicycloalkenyl (substituted or unsubstituted bicycloalkenyl, preferably substituted or unsubstituted bicycloalkenyl having 5 to 30 carbon atoms, i.e., a monovalent group obtained by removing one hydrogen atom from a bicycloalkene having one double bond. For example, bicyclo[2.2.1]hept-2-en-1-yl, bicyclo[2.2.2]oct-2-en-4-yl).

[0293] · Alkynyl [linear, branched or cyclic, substituted or unsubstituted alkynyl]

[0294] Preferably substituted or unsubstituted alkynyl having 2 to 30 carbon atoms, such as ethynyl, propargyl, trimethylsilylethynyl

[0295] · Aryl

[0296] Preferably substituted or unsubstituted aryl having 6 to 40 carbon atoms (more preferably 6 to 30 carbon atoms, particularly preferably 6 to 20 carbon atoms), such as phenyl, p-tolyl, naphthyl, m-chlorophenyl, o-hexadecanoylaminophenyl (more preferably phenyl, naphthyl, particularly preferably phenyl). In addition, the substituted aryl may be condensed with an aliphatic ring, another aromatic ring or a heterocyclic ring.

[0297] · Heterocyclic group

[0298] Preferably a monovalent group obtained by removing one hydrogen atom from a 5- or 6-membered substituted or unsubstituted heterocyclic compound (including aromatic heterocyclic compounds and non-aromatic heterocyclic compounds), more preferably a 5- or 6-membered substituted or unsubstituted aromatic heterocyclic group having 3 to 30 carbon atoms. For example, 2-furyl, 2-thienyl, 2-pyrimidinyl, 2-benzothiazolyl

[0299] · Cyano

[0300] · Hydroxy

[0301] · Nitro

[0302] · Carboxy

[0303] · Alkoxy

[0304] Preferably a substituted or unsubstituted alkoxy group having 1 to 30 carbon atoms, for example, methoxy, ethoxy, isopropoxy, tert-butoxy, octyloxy, 2-methoxyethoxy

[0305] · Aryloxy

[0306] Preferably a substituted or unsubstituted aryloxy group having 6 to 30 carbon atoms, for example, phenoxy, 2-methylphenoxy, 4-tert-butylphenoxy, 3-nitrophenoxy, 2-tetradecanoylaminophenoxy, p-methoxyphenoxy

[0307] · Silyloxy

[0308] Preferably a substituted or unsubstituted silyloxy group having 3 to 20 carbon atoms, for example, trimethylsilyloxy, tert-butyldimethylsilyloxy

[0309] · Hetero epoxy group

[0310] Preferably a substituted or unsubstituted hetero epoxy group having 2 to 30 carbon atoms, 1-phenyltetrazol-5-oxy, 2-tetrahydropyranyloxy

[0311] · Acyloxy

[0312] Preferably formyloxy, a substituted or unsubstituted alkylcarbonyloxy having 2 to 30 carbon atoms and a substituted or unsubstituted arylcarbonyloxy having 6 to 30 carbon atoms, for example, formyloxy, acetyloxy, pivaloyloxy, stearoyloxy, benzoyloxy, p-methoxyphenylcarbonyloxy

[0313] · Substituted carbamoyloxy

[0314] Preferably a substituted carbamoyloxy having 1 to 30 carbon atoms (preferably 2 to 30 carbon atoms), for example, N,N-dimethylcarbamoyloxy, N,N-diethylcarbamoyloxy, morpholinylcarbonyloxy, N,N-dioctylaminocarbonyloxy, N-octylcarbamoyloxy

[0315] · Alkoxycarbonyloxy

[0316] Preferably a substituted or unsubstituted alkoxycarbonyloxy having 2 to 30 carbon atoms, for example, methoxycarbonyloxy, ethoxycarbonyloxy, tert-butoxycarbonyloxy, octyloxycarbonyloxy

[0317] · Aryloxycarbonyloxy

[0318] Preferably a substituted or unsubstituted aryloxycarbonyloxy having 7 to 30 carbon atoms, for example, phenoxycarbonyloxy, p-methoxyphenoxycarbonyloxy, p-hexadecyloxyphenoxycarbonyloxy

[0319] ·amino

[0320] Preferably a substituted or unsubstituted alkylamino having 1 to 30 carbon atoms and a substituted or unsubstituted anilino having 6 to 30 carbon atoms (specific examples of the substituents of the substituted amino and substituted anilino include aliphatic groups, aryl groups, acyl groups, aliphatic sulfonyl groups, and aromatic sulfonyl groups), for example, methylamino, dimethylamino, anilino, N-methyl-anilino, diphenylamino

[0321] ·acylamino

[0322] Preferably formylamino, a substituted or unsubstituted alkylcarbonylamino having 2 to 30 carbon atoms, and a substituted or unsubstituted arylcarbonylamino having 6 to 30 carbon atoms, for example, formylamino, acetylamino, pivaloylamino, lauroylamino, benzoylamino, 3,4,5-tri(octyloxy)phenylcarbonylamino

[0323] ·substituted aminocarbonylamino (monosubstituted or disubstituted amino-carbonyl-amino)

[0324] Preferably a substituted aminocarbonylamino having 1 to 30 carbon atoms, for example, N,N-dimethylaminocarbonylamino, N,N-diethylaminocarbonylamino, morpholinocarbonylamino

[0325] ·alkoxycarbonylamino

[0326] Preferably a substituted or unsubstituted alkoxycarbonylamino having 2 to 30 carbon atoms, for example, methoxycarbonylamino, ethoxycarbonylamino, tert-butoxycarbonylamino, octadecyloxycarbonylamino, N-methyl-methoxycarbonylamino

[0327] ·aryloxycarbonylamino

[0328] Preferably a substituted or unsubstituted aryloxycarbonylamino having 7 to 30 carbon atoms, for example, phenoxycarbonylamino, p-chlorophenoxycarbonylamino, m-octyloxyphenoxycarbonylamino

[0329] ·substituted aminosulfonylamino (substituted aminosulfonyl-amino)

[0330] Preferably a substituted aminosulfonylamino having 0 to 30 carbon atoms (preferably 1 to 30 carbon atoms), for example, N,N-dimethylaminosulfonylamino, N-octylaminosulfonylamino

[0331] ·alkyl or arylsulfonylamino

[0332] Preferably a substituted or unsubstituted alkylsulfonylamino group having 1 to 30 carbon atoms and a substituted or unsubstituted arylsulfonylamino group having 6 to 30 carbon atoms, for example, methylsulfonylamino group, butylsulfonylamino group, phenylsulfonylamino group, 2,3,5-trichlorophenylsulfonylamino group, p-methylphenylsulfonylamino group

[0333] · Mercapto group

[0334] · Alkylthio group

[0335] Preferably a substituted or unsubstituted alkylthio group having 1 to 30 carbon atoms, such as methylthio group, ethylthio group, hexadecylthio group, octylthio group

[0336] · Arylthio group

[0337] Preferably a substituted or unsubstituted arylthio group having 6 to 30 carbon atoms, for example, phenylthio group, p-chlorophenylthio group, m-methoxyphenylthio group, p-methoxyphenylthio group

[0338] · Heterocyclicthio group

[0339] Preferably a substituted or unsubstituted heterocyclicthio group having 2 to 30 carbon atoms, such as 2-benzothiazolylthio group, 1-phenyltetrazol-5-ylthio group

[0340] · Sulfamoyl group

[0341] Preferably a substituted sulfamoyl group having 0 to 30 carbon atoms (preferably 1 to 30 carbon atoms), for example, N-ethylsulfamoyl group, N-(3-dodecyloxypropyl)sulfamoyl group, N,N-dimethylsulfamoyl group, N-acetylsulfamoyl group, N-benzoylsulfamoyl group, N-(N'-phenylcarbamoyl)sulfamoyl group

[0342] · Sulfonic group

[0343] · Alkyl or arylsulfinyl group

[0344] Preferably a substituted or unsubstituted alkylsulfinyl group having 1 to 30 carbon atoms and a substituted or unsubstituted arylsulfinyl group having 6 to 30 carbon atoms, for example, methylsulfinyl group, ethylsulfinyl group, phenylsulfinyl group, p-methylphenylsulfinyl group

[0345] · Alkyl or arylsulfonyl group

[0346] Preferably a substituted or unsubstituted alkylsulfonyl group having 1 to 30 carbon atoms and a substituted or unsubstituted arylsulfonyl group having 6 to 30 carbon atoms, for example, methylsulfonyl group, ethylsulfonyl group, butylsulfonyl group, phenylsulfonyl group, p-methylphenylsulfonyl group

[0347] · Acyl group

[0348] Preferably a formyl group, a substituted or unsubstituted alkylcarbonyl group having 2 to 30 carbon atoms, a substituted or unsubstituted arylcarbonyl group having 7 to 30 carbon atoms, and a substituted or unsubstituted heterocyclic carbonyl group having 4 to 30 carbon atoms (the heterocyclic carbonyl group is bonded by a carbon atom of the heterocycle and a carbon atom of the carbonyl group), for example, an acetyl group, a pivaloyl group, a 2-chloroacetyl group, a stearoyl group, a benzoyl group, a p-octyloxyphenylcarbonyl group, a 2-pyridylcarbonyl group, a 2-furylcarbonyl group, a (meth)acryloyl group

[0349] · Aryloxycarbonyl

[0350] Preferably a substituted or unsubstituted aryloxycarbonyl group having 7 to 30 carbon atoms, for example, a phenoxycarbonyl group, an o-chlorophenoxycarbonyl group, an m-nitrophenoxycarbonyl group, a p-tert-butylphenoxycarbonyl group

[0351] · Alkoxycarbonyl

[0352] Preferably a substituted or unsubstituted alkoxycarbonyl group having 2 to 30 carbon atoms, for example, a methoxycarbonyl group, an ethoxycarbonyl group, a tert-butoxycarbonyl group, a hexadecyloxycarbonyl group, an octadecyloxycarbonyl group

[0353] · Carbamoyl

[0354] Preferably a substituted carbamoyl group having 1 to 30 carbon atoms (preferably 2 to 30 carbon atoms), for example, an N-methylcarbamoyl group, an N,N-dimethylcarbamoyl group, an N,N-dioctylcarbamoyl group, an N-(methylsulfonyl)carbamoyl group

[0355] · Aryl or heterocyclic azo group

[0356] Preferably a substituted or unsubstituted arylazo group having 6 to 30 carbon atoms and a substituted or unsubstituted heterocyclic azo group having 3 to 30 carbon atoms, for example, a phenylazo group, a p-chlorophenylazo group, a 5-ethylthio-1,3,4-thiadiazol-2-ylazo group

[0357] · Imide group

[0358] Preferably N-succinimide, N-phthalimide

[0359] · Phosphino group

[0360] Preferably a substituted or unsubstituted phosphino group having 2 to 30 carbon atoms, for example, a dimethylphosphino group, a diphenylphosphino group, a methylphenoxyphosphino group

[0361] · Phosphinyl group

[0362] Preferably a phosphinyl group and a substituted or unsubstituted phosphinyl group having 2 to 30 carbon atoms, for example, a phosphinyl group, a dioctyloxyphosphinyl group, a diethoxyphosphinyl group

[0363] · Phosphinyloxy

[0364] Preferably a substituted or unsubstituted phosphinyloxy having 2 to 30 carbon atoms, for example, diphenoxyphosphinyloxy, dioctyloxyphosphinyloxy

[0365] · Phosphinylamino

[0366] Preferably a substituted or unsubstituted phosphinylamino having 2 to 30 carbon atoms, for example, dimethoxyphosphinylamino, dimethylaminophosphinylamino

[0367] · Silyl

[0368] Preferably a substituted or unsubstituted silyl having 3 to 30 carbon atoms, for example, trimethylsilyl, tert-butyldimethylsilyl, phenyldimethylsilyl

[0369] Among the above substituents T, the hydrogen atom of the group having a hydrogen atom can be further substituted by the above group. Examples of such substituents include: alkylcarbonylaminosulfonyl, arylcarbonylaminosulfonyl, alkylsulfonylaminocarbonyl, arylsulfonylaminocarbonyl. Examples thereof include: methylsulfonylaminocarbonyl, p-tolylsulfonylaminocarbonyl, acetylaminosulfonyl, benzoylaminosulfonyl.

[0370] Specific examples of the above acyl group in the general formula (C-1) include the acyl groups of the above substituents T.

[0371] Specific examples of the above aliphatic oxycarbonyl in the general formula (C-1) include the alkoxycarbonyls of the above substituents T.

[0372] Specific examples of the above aromatic oxycarbonyl in the general formula (C-1) include the aryloxycarbonyls of the above substituents T.

[0373] Specific examples of the above aliphatic sulfonyl in the general formula (C-1) include the alkylsulfonyls of the above substituents T.

[0374] Specific examples of the above aromatic sulfonyl in the general formula (C-1) include the arylsulfonyls of the above substituents T.

[0375] Specific examples of the above aliphatic oxy in the general formula (C-1) include the alkoxys of the above substituents T.

[0376] Specific examples of the above aromatic oxy in the general formula (C-1) include the aryloxys of the above substituents T.

[0377] Specific examples of the above aliphatic thio in the general formula (C-1) include the alkylthios of the above substituents T.

[0378] As a specific example of the above aromatic thio group in the general formula (C-1), an arylthio group of the above substituent T can be cited.

[0379] As a specific example of the above acyloxy group in the general formula (C-1), an acyloxy group of the above substituent T can be cited.

[0380] As a specific example of the above aliphatic oxycarbonyloxy group in the general formula (C-1), an alkoxycarbonyloxy group of the above substituent T can be cited.

[0381] As a specific example of the above aromatic oxycarbonyloxy group in the general formula (C-1), an aryloxycarbonyloxy group of the above substituent T can be cited.

[0382] As a specific example of the above substituted amino group in the general formula (C-1), a substituted amino group of the above substituent T can be cited.

[0383] The above heterocyclic group in the general formula (C-1) preferably contains a 5- or 6-membered saturated or unsaturated heterocycle. An aliphatic ring, an aromatic ring, or another heterocycle may be condensed on the heterocycle. Examples of the heteroatom of the heterocycle include B, N, O, S, Se, and Te. N, O, and S are preferred as the heteroatom. The heterocyclic group preferably has a free valence (monovalent) of a carbon atom (the heterocyclic group is bonded to a carbon atom). The number of carbon atoms of the preferred heterocyclic group is 1 to 40, more preferably 1 to 30, and still more preferably 1 to 20. Examples of the saturated heterocycle include a pyrazolidine ring, a pyrrolidine ring, a morpholine ring, 2-bora-1,3-dioxolane, and a 1,3-thiazolidine ring (excluding a piperidine ring). Examples of the unsaturated heterocycle include an imidazole ring, a thiazole ring, a benzothiazole ring, a benzoxazole ring, a benzotriazole ring, a benzoselenazole ring, a pyridine ring, a pyrimidine ring, and a quinoline ring. The heterocyclic group may have a substituent. As an example of the substituent, the above substituent T can be cited.

[0384] In the general formula (C-1), R 1 and R 2 have a total carbon atom number of 7 or more, preferably 7 to 70, and more preferably 7 to 40.

[0385] The compounds represented by the above general formula (C-1) used in the present invention include the compounds represented by the general formula (I) of Japanese Patent Publication No. 6-97332, the general formula (I) of Japanese Patent Publication No. 6-97334, the general formula (I) of Japanese Patent Laid-Open No. 2-148037, the general formula (I) of Japanese Patent Laid-Open No. 2-150841, the general formula (I) of Japanese Patent Laid-Open No. 2-181145, the general formula (I) of Japanese Patent Laid-Open No. 3-266836, the general formula (IV) of Japanese Patent Laid-Open No. 4-350854, the general formula (I) of Japanese Patent Laid-Open No. 5-61166, etc.

[0386] As the compound represented by the above general formula (C-1), the compound represented by the following general formula (C-1a) or (C-1b) is preferred.

[0387] [Chemical formula 23]

[0388]

[0389] In the general formula (C-1a), R 1 and R 2 are respectively the same as R 1 and R 2 in the above formula (C-1). R c1 is the same as R 1 .

[0390] In the general formula (C-1b), R c2 to R c4 represent an aliphatic group or an acyl group.

[0391] Hereinafter, specific examples of the compound represented by the above general formula (C-1) are shown, but the present invention is not limited to these specific examples.

[0392] [Chemical formula 24]

[0393]

[0394] [Chemical formula 25]

[0395]

[0396] [Chemical formula 26]

[0397]

[0398] Component (C-2) is a compound represented by the following general formula (C-2).

[0399] [Chemical formula 27]

[0400]

[0401] In the general formula (C-2), R 4 to R 7 represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, or an aryl group having 6 to 15 carbon atoms. The substituents represented by R 4 to R 7 may have at least one of the above substituents T.

[0402] In the general formula (C-2), the alkyl group having 1 to 20 carbon atoms may be a straight-chain or branched-chain alkyl group. Examples thereof include: methyl, ethyl, propyl, isopropyl, butyl, isobutyl, pentyl, 2-ethylbutyl, hexyl, heptyl, octyl, 2-ethylhexyl, nonyl, decyl, dodecyl, tetradecyl, octadecyl, eicosyl, benzyl, 2,6-di-tert-butyl-4-methylbenzyl, phenethyl, phenylpropyl, naphthylmethyl, 2-phenylisopropyl, and the like. When the alkyl group has a substituent, the above number of carbon atoms includes the number of carbon atoms of the substituent.

[0403] In the general formula (C-2), examples of the aryl group having 6 to 15 carbon atoms include: phenyl, tolyl, naphthyl, and the like. When the aryl group has a substituent, the above number of carbon atoms includes the number of carbon atoms of the substituent.

[0404] In the general formula (C-2), as R 4 and R 5 , a combination of a hydrogen atom and an aryl group having 7 to 20 carbon atoms is preferred. Further, among them, a combination of a hydrogen atom and an aryl group having 8 to 20 carbon atoms is preferred, a combination of a hydrogen atom and an aryl group having 8 to 18 carbon atoms is more preferred, and a combination of a hydrogen atom and 3,4-dimethylphenyl is particularly preferred.

[0405] In the general formula (C-2), as R 6 and R 7 , an alkyl group having 1 to 20 carbon atoms is preferred, an alkyl group having 2 to 20 carbon atoms is more preferred, an alkyl group having 3 to 20 carbon atoms is further preferred, and tert-butyl is particularly preferred.

[0406] As the compound represented by the general formula (C-2), the following compounds are specifically exemplified. However, the present invention is not limited to these compounds.

[0407] [Chemical formula 28]

[0408]

[0409] [Chemical formula 29]

[0410]

[0411] [Chemical formula 30]

[0412]

[0413] [Chemical formula 31]

[0414]

[0415] [Chemical formula 32]

[0416]

[0417] [Chemical formula 33]

[0418]

[0419] Component (C-3) is a compound represented by the following formula (C-3).

[0420] [Chemical formula 34]

[0421]

[0422] Component (C-4) is a compound represented by the following general formula (C-4).

[0423] [Chemical formula 35]

[0424]

[0425] In the general formula (C-4), R 8 and R 9 represent an alkyl group, an aryl group, an alkoxy group, an aryloxy group or a halogen atom, and R 10 represents an alkyl group or an aryl group. R 8 , R 9 and R 10 Among them, at least two of them can be connected to each other via a divalent or higher-valent group or a single bond.

[0426] In the present invention, the compound having the structure represented by the general formula (C-4) includes, in addition to the compound represented by the general formula (C-4), the compounds of the following (a) and (b).

[0427] (a) A monovalent group obtained by removing one hydrogen atom from R 8 , R 9 and R 10 is connected to at least one of R 8 , R 9 and R 10 of one or more (preferably an integer of 1 to 3) other compounds represented by the general formula (C-4) via a divalent or higher-valent group or a single bond, and (b) a divalent or higher-valent group obtained by removing a total of two or more hydrogen atoms from at least one group selected from R 8 , R 9 and R 10 (for example, a divalent group when two hydrogen atoms are removed, and a trivalent group when three are removed) is connected to at least one of R 8 , R 9 and R 10 of one or more (preferably an integer of 1 to 3) other compounds represented by the general formula (C-4) via a divalent or higher-valent group or a single bond.

[0428] That is, in the present invention, the compound having the structure represented by the general formula (C-4) means a compound represented by the general formula (C-4) and a compound having a structure in which multiple structures represented by the general formula (C-4) exist in one molecule.

[0429] R in the above general formula (C-4) 8 、R 9 and R 10 The alkyl group represented means a linear, branched or cyclic substituted or unsubstituted alkyl group, preferably having 1 to 50 carbon atoms, more preferably 1 to 30 carbon atoms, and particularly preferably 1 to 20 carbon atoms. Preferred examples include: methyl, ethyl, n-propyl, isopropyl, cyclopropyl, butyl, isobutyl, tert-butyl, sec-butyl, pentyl, isopentyl, neopentyl, tert-pentyl, hexyl, cyclohexyl, heptyl, cyclopentyl, octyl, 2-ethylhexyl, nonyl, decyl, dodecyl, tetradecyl, hexadecyl, octadecyl, eicosyl, docosyl, triacontyl. More preferably, they are methyl, ethyl, n-propyl, isopropyl, butyl, isobutyl, tert-butyl, sec-butyl, pentyl, isopentyl, neopentyl, hexyl, cyclohexyl, octyl, 2-ethylhexyl, dodecyl, hexadecyl, octadecyl, and further preferably methyl, ethyl, n-propyl, isopropyl, butyl, tert-butyl, pentyl, isopentyl, hexyl, cyclohexyl, octyl, 2-ethylhexyl, dodecyl, hexadecyl, octadecyl.

[0430] R 8 、R 9 and R 10 The alkyl group represented may further have a substituent. Examples of such a substituent include a halogen atom, a cycloalkyl group, an alkenyl group, an alkynyl group, an aryl group, a cyano group, a hydroxyl group, a nitro group, a carboxyl group, an alkoxy group, an aryloxy group, an acyloxy group, a carbamoyloxy group, an alkoxycarbonyloxy group, an aryloxycarbonyloxy group, an amino group (including an anilino group), an acylamino group, a carbamoylamino group, an alkoxycarbonylamino group, an aryloxycarbonylamino group, an acyl group, an aryloxycarbonyl group, an alkoxycarbonyl group, a carbamoyl group, etc.

[0431] More specifically, examples of the above substituents include: halogen atoms (e.g., chlorine atom, bromine atom, iodine atom), alkyl groups [substituents including the following groups: alkyl groups (representing linear, branched, or cyclic substituted or unsubstituted alkyl groups. These alkyl groups also include alkyl groups (preferably alkyl groups having 1 to 30 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, tert-butyl, n-octyl, eicosyl, 2-chloroethyl, 2-cyanoethyl, 2-ethylhexyl), cycloalkyl groups (preferably substituted or unsubstituted cycloalkyl groups having 3 to 30 carbon atoms, such as cyclohexyl, cyclopentyl, 4-n-dodecylcyclohexyl), bicycloalkyl groups (preferably substituted or unsubstituted bicycloalkyl groups having 5 to 30 carbon atoms, i.e., monovalent groups obtained by removing one hydrogen atom from bicycloalkanes having 5 to 30 carbon atoms. For example, bicyclo[1.2.2]heptan-2-yl, bicyclo[2.2.2]octan-3-yl), and tricyclic structures with more ring structures, etc. The alkyl groups in the substituents described below (e.g., the alkyl group in alkylthio) also represent alkyl groups of this concept.)], alkenyl groups (preferably substituted or unsubstituted alkenyl groups having 2 to 30 carbon atoms, such as vinyl, allyl, isoprenyl, geranyl, oleyl), cycloalkenyl groups (preferably substituted or unsubstituted cycloalkenyl groups having 3 to 30 carbon atoms, i.e., monovalent groups obtained by removing one hydrogen atom from cycloalkenes having 3 to 30 carbon atoms. For example, 2-cyclopenten-1-yl, 2-cyclohexen-1-yl), bicycloalkenyl groups (substituted or unsubstituted bicycloalkenyl groups, preferably substituted or unsubstituted bicycloalkenyl groups having 5 to 30 carbon atoms, i.e., monovalent groups obtained by removing one hydrogen atom from bicycloalkenes having one double bond. For example, bicyclo[2.2.1]hept-2-en-1-yl, bicyclo[2.2.2]oct-2-en-4-yl).];

[0432] Alkynyl (preferably a substituted or unsubstituted alkynyl having 2 to 30 carbon atoms, such as ethynyl, propargyl, trimethylsilylethynyl), aryl (preferably a substituted or unsubstituted aryl having 6 to 30 carbon atoms, such as phenyl, p-tolyl, naphthyl, m-chlorophenyl, o-hexadecanoylaminophenyl), heterocyclic group (preferably a monovalent group obtained by removing one hydrogen atom from a 5- or 6-membered substituted or unsubstituted, aromatic or non-aromatic heterocyclic compound, more preferably a 5- or 6-membered aromatic heterocyclic group having 3 to 30 carbon atoms. For example, 2-furyl, 2-thienyl, 2-pyrimidinyl, 2-benzothiazolinyl), cyano, hydroxy, nitro, carboxy, alkoxy (preferably a substituted or unsubstituted alkoxy having 1 to 32 carbon atoms, such as methoxy, ethoxy, isopropoxy, tert-butoxy, n-octyloxy, 2-methoxyethoxy), aryloxy (preferably a substituted or unsubstituted aryloxy having 6 to 30 carbon atoms, such as phenoxy, 2-methylphenoxy, 4-tert-butylphenoxy, 3-nitrophenoxy, 2-tetradecanoylaminophenoxy), silyloxy (preferably a silyloxy having 3 to 20 carbon atoms, such as trimethylsilyloxy, tert-butyldimethylsilyloxy), heterocyclic oxy (preferably a substituted or unsubstituted heterocyclic oxy having 2 to 30 carbon atoms, 1-phenyltetrazol-5-oxy, 2-tetrahydropyranyloxy), acyloxy (preferably formyloxy, a substituted or unsubstituted alkylcarbonyloxy having 2 to 30 carbon atoms, a substituted or unsubstituted arylcarbonyloxy having 6 to 30 carbon atoms, such as formyloxy, acetyloxy, pivaloyloxy, stearoyloxy, benzoyloxy, p-methoxyphenylcarbonyloxy), carbamoyloxy (preferably a substituted or unsubstituted carbamoyloxy having 1 to 30 carbon atoms, such as N,N-dimethylcarbamoyloxy, N,N-diethylcarbamoyloxy, morpholinylcarbonyloxy, N,N-di-n-octylaminocarbonyloxy, N-n-octylcarbamoyloxy), alkoxycarbonyloxy (preferably a substituted or unsubstituted alkoxycarbonyloxy having 2 to 30 carbon atoms, such as methoxycarbonyloxy, ethoxycarbonyloxy, tert-butoxycarbonyloxy, n-octylcarbonyloxy), aryloxycarbonyloxy (preferably a substituted or unsubstituted aryloxycarbonyloxy having 7 to 30 carbon atoms, such as phenoxycarbonyloxy, p-methoxyphenoxycarbonyloxy, p-n-hexadecyloxyphenoxycarbonyloxy);

[0433] amino groups (preferably amino groups, substituted or unsubstituted alkylamino groups having 1 to 30 carbon atoms, substituted or unsubstituted phenylamino groups having 6 to 30 carbon atoms, for example, amino groups, methylamino groups, dimethylamino groups, phenylamino groups, N-methylphenylamino groups, diphenylamino groups), acylamino groups (preferably formylamino groups, substituted or unsubstituted alkylcarbonylamino groups having 1 to 30 carbon atoms, substituted or unsubstituted arylcarbonylamino groups having 6 to 30 carbon atoms, for example, formylamino groups, acetylamino groups, pivaloylamino groups, lauroylamino groups, benzoylamino groups, 3,4,5-tri-n-octyloxyphenylcarbonylamino groups), aminocarbonylamino groups (preferably substituted or unsubstituted aminocarbonylamino groups having 1 to 30 carbon atoms, for example, carbamoylamino groups, N,N-dimethylaminocarbonylamino groups, N,N-diethylaminocarbonylamino groups, morpholinocarbonylamino groups), alkoxycarbonylamino groups (preferably substituted or unsubstituted alkoxycarbonylamino groups having 2 to 30 carbon atoms, for example, methoxycarbonylamino groups, ethoxycarbonylamino groups, tert-butoxycarbonylamino groups, n-octadecyloxycarbonylamino groups, N-methylmethoxycarbonylamino groups), aryloxycarbonylamino groups (preferably substituted or unsubstituted aryloxycarbonylamino groups having 7 to 30 carbon atoms, for example, phenoxycarbonylamino groups, p-chlorophenoxycarbonylamino groups, m-n-octyloxyphenoxycarbonylamino groups), sulfamoylamino groups (preferably substituted or unsubstituted sulfamoylamino groups having 0 to 30 carbon atoms, for example, sulfamoylamino groups, N,N-dimethylaminosulfonylamino groups, N-n-octylaminosulfonylamino groups), alkyl and arylsulfonylamino groups (preferably substituted or unsubstituted alkylsulfonylamino groups having 1 to 30 carbon atoms, substituted or unsubstituted arylsulfonylamino groups having 6 to 30 carbon atoms, for example, methylsulfonylamino groups, butylsulfonylamino groups, phenylsulfonylamino groups, 2,3,5-trichlorophenylsulfonylamino groups, p-methylphenylsulfonylamino groups);

[0434] A mercapto group, an alkylthio group (preferably a substituted or unsubstituted alkylthio group having 1 to 30 carbon atoms, such as a methylthio group, an ethylthio group, a n - hexadecylthio group), an arylthio group (preferably a substituted or unsubstituted arylthio group having 6 to 30 carbon atoms, such as a phenylthio group, a p - chlorophenylthio group, a m - methoxyphenylthio group), a heterocyclic thio group (preferably a substituted or unsubstituted heterocyclic thio group having 2 to 30 carbon atoms, such as a 2 - benzothiazolylthio group, a 1 - phenyltetrazol - 5 - ylthio group), a sulfamoyl group (preferably a substituted or unsubstituted sulfamoyl group having 0 to 30 carbon atoms, such as an N - ethylsulfamoyl group, an N-(3 - dodecyloxypropyl)sulfamoyl group, an N,N - dimethylsulfamoyl group, an N - acetylsulfamoyl group, an N - benzoylsulfamoyl group, an N-(N'-phenylcarbamoyl)sulfamoyl group), a sulfo group, an alkyl and arylsulfinyl group (preferably a substituted or unsubstituted alkylsulfinyl group having 1 to 30 carbon atoms, a substituted or unsubstituted arylsulfinyl group having 6 to 30 carbon atoms, such as a methylsulfinyl group, an ethylsulfinyl group, a phenylsulfinyl group, a p - methylphenylsulfinyl group);

[0435] An alkyl and arylsulfonyl group (preferably a substituted or unsubstituted alkylsulfonyl group having 1 to 30 carbon atoms, a substituted or unsubstituted arylsulfonyl group having 6 to 30 carbon atoms, such as a methylsulfonyl group, an ethylsulfonyl group, a phenylsulfonyl group, a p - methylphenylsulfonyl group), an acyl group (preferably a formyl group, a substituted or unsubstituted alkylcarbonyl group having 2 to 30 carbon atoms, a substituted or unsubstituted arylcarbonyl group having 7 to 30 carbon atoms, a substituted or unsubstituted heterocyclic carbonyl group in which a carbon atom having 4 to 30 carbon atoms is bonded to a carbonyl group, such as an acetyl group, a pivaloyl group, a 2 - chloroacetyl group, a stearoyl group, a benzoyl group, a p - n - octyloxyphenylcarbonyl group, a 2 - pyridylcarbonyl group, a 2 - furylcarbonyl group), an aryloxycarbonyl group (preferably a substituted or unsubstituted aryloxycarbonyl group having 7 to 30 carbon atoms, such as a phenoxycarbonyl group, an o - chlorophenoxycarbonyl group, a m - nitrophenoxycarbonyl group, a p - tert - butylphenoxycarbonyl group), an alkoxycarbonyl group (preferably a substituted or unsubstituted alkoxycarbonyl group having 2 to 30 carbon atoms, such as a methoxycarbonyl group, an ethoxycarbonyl group, a tert - butoxycarbonyl group, a n - octadecyloxycarbonyl group),

[0436] A carbamoyl group (preferably a substituted or unsubstituted carbamoyl group having 1 to 30 carbon atoms, for example, carbamoyl, N-methylcarbamoyl, N,N-dimethylcarbamoyl, N,N-di-n-octylcarbamoyl, N-(methylsulfonyl)carbamoyl), an aryl group and a heterocyclic azo group (preferably a substituted or unsubstituted aryl azo group having 6 to 30 carbon atoms, a substituted or unsubstituted heterocyclic azo group having 3 to 30 carbon atoms, for example, phenylazo, p-chlorophenylazo, 5-ethylthio-1,3,4-thiadiazol-2-ylazo), an imide group (preferably N-succinimide, N-phthalimide), a phosphino group (preferably a substituted or unsubstituted phosphino group having 2 to 30 carbon atoms, for example, dimethylphosphino, diphenylphosphino, methylphenoxyphosphino), an oxyphosphino group (preferably a substituted or unsubstituted oxyphosphino group having 2 to 30 carbon atoms, for example, oxyphosphino, dioctyloxyphosphino, diethoxyphosphino), an oxyphosphinoxy group (preferably a substituted or unsubstituted oxyphosphinoxy group having 2 to 30 carbon atoms, for example, diphenoxyphosphinoxy, dioctyloxyphosphinoxy), an oxyphosphinoamino group (preferably a substituted or unsubstituted oxyphosphinoamino group having 2 to 30 carbon atoms, for example, dimethoxyphosphinoamino, dimethylaminooxyphosphinoamino), a silyl group (preferably a substituted or unsubstituted silyl group having 3 to 30 carbon atoms, for example, trimethylsilyl, tert-butyldimethylsilyl, phenyldimethylsilyl).

[0437] Among the above substituents, the hydrogen atom of the group having a hydrogen atom may be further substituted by the above substituents. Examples of such substituents include: alkylcarbonylaminosulfonyl, arylcarbonylaminosulfonyl, alkylsulfonylaminocarbonyl, arylsulfonylaminocarbonyl, methylsulfonylaminocarbonyl, p-methylphenylsulfonylaminocarbonyl, acetylaminosulfonyl, benzoylaminosulfonyl.

[0438] R 8 、R 9 and R 10 The aryl group represented by represents a substituted or unsubstituted aryl group, preferably having 6 to 50 carbon atoms, more preferably having 6 to 30 carbon atoms, and particularly preferably having 6 to 20 carbon atoms. Preferred examples include: phenyl, 2-methylphenyl, 3-methylphenyl, 4-methylphenyl, 2-ethylphenyl, 4-ethylphenyl, 2,4-dimethylphenyl, 2,6-dimethylphenyl, 2,4,6-trimethylphenyl, 1-naphthyl, 2-naphthyl, 2-chlorophenyl, 3-chlorophenyl, 4-chlorophenyl, 2-methoxyphenyl, 3-methoxyphenyl, 4-methoxyphenyl, 2-benzylphenyl, 4-benzylphenyl, 2-methylcarbonylphenyl, 4-methylcarbonylphenyl.

[0439] R 8 、R9 and R 10 The aryl represented is further preferably phenyl, 2-methylphenyl, 4-methylphenyl, 2-ethylphenyl, 4-ethylphenyl, 2,4-dimethylphenyl, 2,6-dimethylphenyl, 2,4,6-trimethylphenyl, 1-naphthyl, 2-naphthyl, 2-chlorophenyl, 4-chlorophenyl, 2-methoxyphenyl, 3-methoxyphenyl, 4-methoxyphenyl, 2-benzylphenyl, or 4-benzylphenyl, and particularly preferably phenyl.

[0440] R 8 、R 9 and R 10 The above-mentioned aryl represented may further have a substituent. As examples of the substituent, the aforementioned R 8 、R 9 and R 10 The substituents that the alkyl represented can have.

[0441] R 8 and R 9 The alkoxy represented by R and R represents a linear, branched, cyclic substituted or unsubstituted alkoxy. It is preferably an alkoxy having 1 to 50 carbon atoms, more preferably 1 to 30 carbon atoms, and particularly preferably 1 to 20 carbon atoms. As preferred examples, there can be mentioned: methoxy, ethoxy, n-propoxy, isopropoxy, cyclopropoxy, butoxy, isobutoxy, tert-butoxy, sec-butoxy, pentyloxy, isopentyloxy, neopentyloxy, tert-pentyloxy, hexyloxy, cyclohexyloxy, heptyloxy, cyclopentyloxy, octyloxy, 2-ethylhexyloxy, nonyloxy, decyloxy, dodecyloxy, tetradecyloxy, hexadecyloxy, octadecyloxy, icosyloxy, docosyloxy, triacontyloxy. More preferably, they are methoxy, ethoxy, n-propoxy, isopropoxy, butoxy, isobutoxy, tert-butoxy, sec-butoxy, pentyloxy, isopentyloxy, neopentyloxy, hexyloxy, cyclohexyloxy, octyloxy, 2-ethylhexyloxy, dodecyloxy, hexadecyloxy, octadecyloxy, and particularly preferably methoxy, ethoxy, n-propoxy, isopropoxy, tert-butoxy, pentyloxy, isopentyloxy, hexyloxy, cyclohexyloxy, octyloxy, 2-ethylhexyloxy, dodecyloxy, hexadecyloxy, octadecyloxy.

[0442] R 8 and R 9 The above-mentioned alkoxy represented may further have a substituent. As examples of the substituent, the aforementioned R 8 、R 9 and R 10 The substituents that the alkyl represented can have.

[0443] R8 and R 9 The aryloxy group represented by 9 represents a substituted or unsubstituted aryloxy group, preferably having 6 to 50 carbon atoms, more preferably 6 to 30 carbon atoms, and particularly preferably 6 to 20 carbon atoms. As preferred examples, there can be mentioned: phenoxy, 2-methylphenoxy, 3-methylphenoxy, 4-methylphenoxy, 2-ethylphenoxy, 4-ethylphenoxy, 2,4-dimethylphenoxy, 2,4-di-tert-butylphenoxy, 2,6-di-tert-butylphenoxy, 2,6-dimethylphenoxy, 2,6-di-tert-butyl-4-methylphenoxy, 2,4,6-trimethylphenoxy, 2,4,6-tri-tert-butylphenoxy, 1-naphthyloxy, 2-naphthyloxy, 2-chlorophenoxy, 3-chlorophenoxy, 4-chlorophenoxy, 2-methoxyphenoxy, 3-methoxyphenoxy, 4-methoxyphenoxy, 2-benzylphenoxy, 4-benzylphenoxy, 2-methylcarbonylphenoxy, 4-methylcarbonylphenoxy.

[0444] More preferably, there can be mentioned: phenyl, 2,4-di-tert-butylphenoxy, 2,4,6-tri-tert-butylphenoxy, etc.

[0445] R 8 and R 9 The above-mentioned aryloxy group represented by 9 may further have a substituent. As examples of the substituent, there can be mentioned the aforementioned R 8 、R 9 and R 10 The substituents that the alkyl group represented by 10 can have.

[0446] In the general formula (C-4), from the aspect of the compatibility between the polyester having a naphthalene structure and the compound having the structure shown in the general formula (C-4), R 8 and R 9 are preferably an alkoxy group or an aryloxy group, and R 10 is preferably an alkyl group or an aryl group.

[0447] In the compound having the structure shown in the general formula (C-4), as the divalent or higher-valent group as the linking group, there can be mentioned the divalent or higher-valent group obtained by removing one or more hydrogen atoms from the substituents that the alkyl group represented by the aforementioned R 8 、R 9 and R 10 can have, or a group formed by combining two or more of these groups (in addition, if one hydrogen atom is removed from the substituent, it becomes a divalent group, and if two are removed, it becomes a trivalent group). The divalent or higher-valent group is preferably a 2- to 6-valent group, more preferably a 2- to 4-valent group. In addition, the divalent or higher-valent group is preferably an organic group.

[0448] The above-mentioned divalent or higher valent group may further have a substituent. Examples of the substituent include the above-mentioned R 8 , R 9 and R 10 The alkyl group represented by may have a substituent.

[0449] The molecular weight of the divalent or higher valent group is preferably 10 to 1,000.

[0450] Among the above-mentioned divalent or higher-valent groups or single bonds, preferred are single bonds, or divalent or higher-valent groups obtained by removing one or more hydrogen atoms from an amino group, an alkyl group, an aryl group, a biaryl group (arylaryl group), an arylalkylaryl group, an aryloxyaryl group, an alkoxyalkyl group, an alkoxyaryl group, or an alkylaryl group.

[0451] In the case where the compound having the structure represented by the general formula (C-4) is a compound having multiple structures represented by the general formula (C-4) in one molecule, the number of phosphorus atoms in one molecule is preferably greater than 2 and less than 20, more preferably greater than 2 and less than 10, and further preferably greater than 2 and less than 5.

[0452] Specific examples of the compound having a structure represented by the general formula (C-4) are shown below, but the present invention is not limited to these specific examples.

[0453] [Chemical formula 36]

[0454]

[0455] [Chemical formula 37]

[0456]

[0457] [Chemical formula 38]

[0458]

[0459] Furthermore, as the compound having a structure represented by the general formula (C-4), the phosphite compounds described in JP-A-2011-527357 can also be used appropriately.

[0460] Component (C-5) is a compound represented by the following general formula (C-5).

[0461] [Chemical formula 39]

[0462] R 11 -SR 12 General formula (C-5)

[0463] In the general formula (C-5), R 11 and R 12 R represents an alkyl group. 11 and R12 They can be connected to each other via a group with a valence of 2 or more or a single bond.

[0464] In the present invention, the compound having the structure represented by the general formula (C-5) includes, in addition to the compound represented by the general formula (C-5), the compounds of the following (c) and (d).

[0465] (c) A monovalent group obtained by removing one hydrogen atom from R 11 and R 12 is connected to at least one of R 11 and R 12 of one or more (preferably an integer of 1 to 3) other compounds represented by the general formula (C-5) via a group with a valence of 2 or more or a single bond, and

[0466] (d) A group with a valence of 2 or more obtained by removing a total of two or more hydrogen atoms from at least one group selected from R 11 and R 12 (for example, a divalent group when two hydrogen atoms are removed, and a trivalent group when three hydrogen atoms are removed) is connected to at least one of R 11 and R 12 of one or more (preferably an integer of 1 to 3) other compounds represented by the general formula (C-5) via a group with a valence of 2 or more or a single bond.

[0467] That is, in the present invention, the compound having the structure represented by the general formula (C-5) means a compound including the compound represented by the general formula (C-5) and a compound having a structure in which multiple structures represented by the general formula (C-5) exist in one molecule.

[0468] R 11 and R 12 represent a linear, branched, or cyclic substituted or unsubstituted alkyl group. Preferably, it has 1 to 50 carbon atoms, more preferably 2 to 30 carbon atoms, and particularly preferably 2 to 20 carbon atoms. As preferred examples, there can be mentioned: methyl, ethyl, n-propyl, isopropyl, cyclopropyl, butyl, isobutyl, tert-butyl, sec-butyl, pentyl, isopentyl, neopentyl, tert-pentyl, hexyl, cyclohexyl, heptyl, cyclopentyl, octyl, 2-ethylhexyl, nonyl, decyl, dodecyl, tetradecyl, hexadecyl, octadecyl, eicosyl, docosyl, triacontyl. More preferably, they are methyl, ethyl, n-propyl, isopropyl, butyl, isobutyl, tert-butyl, sec-butyl, pentyl, isopentyl, neopentyl, hexyl, cyclohexyl, octyl, 2-ethylhexyl, dodecyl, hexadecyl, octadecyl, and particularly preferably methyl, ethyl, n-propyl, isopropyl, butyl, tert-butyl, pentyl, isopentyl, hexyl, cyclohexyl, octyl, 2-ethylhexyl, dodecyl, hexadecyl, octadecyl.

[0469] As R 11 and R 12 Examples of the substituents of the substituted alkyl represented are the R's in the aforementioned general formula (C-4) 8 , R 9 and R 10 representing the substituents that the alkyl may have.

[0470] In the substituted alkyl represented by R 11 and R 12 Alkoxycarbonylalkyl is preferred. The number of carbon atoms of the alkoxycarbonyl in the above alkoxycarbonylalkyl is preferably 2 to 50 carbon atoms, more preferably 5 to 30 carbon atoms, and particularly preferably 9 to 20 carbon atoms.

[0471] In the compound having the structure represented by the general formula (C-5), the divalent or higher-valent group as the linking group can be the divalent or higher-valent group described as the linking group in the general formula (C-4), and the preferred ranges are also the same.

[0472] Hereinafter, specific examples of the compound having the structure represented by the general formula (C-5) are shown. However, the present invention is not limited to these specific examples.

[0473] [Chemical formula 40]

[0474]

[0475] Component (C-6) is a compound having the structure represented by the following general formula (C-6).

[0476] [Chemical formula 41]

[0477]

[0478] In the general formula (C-6), R 13 to R 16 represent a hydrogen atom or an alkyl group having 1 to 12 carbon atoms (preferably 1 to 8 carbon atoms, more preferably 1 to 5 carbon atoms). Among them, not all of R 13 to R 16 represent hydrogen atoms.

[0479] As specific examples of the alkyl group represented by R 13 to R 16 , examples include: methyl, ethyl, n-butyl, isopropyl, sec-butyl, tert-butyl, tert-pentyl, tert-hexyl, and tert-octyl. R 13 to R 16 are preferably primary (linear) alkyl groups, and more preferably all of R 13 to R 16 are primary (linear) alkyl groups (particularly preferably methyl).

[0480] In general formula (C-6), R 17 represents a hydrogen atom, an alkyl group having 1 to 18 carbon atoms (preferably 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms, still more preferably 1 to 3 carbon atoms, and still more preferably 1 or 2 carbon atoms), or -OR 18 , and R 18 represents a hydrogen atom or a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms (preferably 1 to 12 carbon atoms). Among them, when R 17 is -OR 18 , the self-polymerization of the epoxy resin can be inhibited. In addition, by having a piperidine skeleton, the nitrogen atom to which "-OR 18 " is bonded is in a bulky environment. Therefore, the N-oxy radical generated after capturing the free radical is stable, and the N-OR structure is easily regenerated. For these reasons, it is preferable in terms of the heat resistance and sterilization durability of the cured adhesive.

[0481] In general formula (C-6), * represents the bonding site in the compound.

[0482] From the viewpoints of the heat resistance and sterilization durability of the cured adhesive, component (C-6) preferably contains at least one of a compound represented by the following general formula (C-6-1) (component (C-6-1)) and a compound having a constituent (preferably a repeating unit) represented by the following general formula (C-6-2) (component (C-6-2)), and more preferably contains component (C-6-2). Component (C-6-1) is easily diffused inside the cured adhesive and easily captures free radicals, so it is preferable. On the other hand, component (C-6-2) is not easily dissolved and precipitated from the cured adhesive.

[0483] In component (C-6), the total content of component (C-6-1) and component (C-6-2) is not particularly limited. For example, it is preferably 50% by mass or more, more preferably 80% by mass or more, still more preferably 90% by mass or more, and may also be 100% by mass.

[0484] [Chemical formula 42]

[0485]

[0486] In the formula, R 13 to R 17 respectively have the same meanings as R 13 to R 17 in the above general formula (C-6), and the preferred ranges are also the same. q represents an integer of 2 or more (preferably an integer of 2 to 10), and D 1represents a q-valent linking group. s represents 1 or 2. r represents a positive integer, preferably within the range of the polymerization degree values described later. Q represents an (s + 2)-valent linking group, examples of which include: a group containing an aromatic hydrocarbon group, a group containing an imide group (NR N ), a group containing a triazine linking group, etc. Specific examples of R N include a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, and a piperidinyl group-containing group represented by the general formula (C-6).

[0487] D 1 The molecular weight of the linking group represented is preferably 100 to 1000, more preferably 180 to 600. Additionally, the molecular weight of the linking group represented by Q is preferably 100 to 1000, more preferably 180 to 600.

[0488] The compound having the structure represented by the general formula (C-6) is more preferably a compound represented by any one of the following general formulas (CC-1) to (CC-3), (CC-6), (CC-7), and (CC-8), a polymer or oligomer having the structure represented by the following general formula (CC-4) in the repeating unit (preferably a polymer or oligomer having any one of the repeating units represented by the general formulas (CC-4-1) to (CC-4-3)), and a polymer or oligomer having the repeating unit represented by the following general formula (CC-6).

[0489] [Chemical formula 43]

[0490]

[0491] [Chemical formula 44]

[0492]

[0493] In the above formulas, R 31 has the same meaning as R 17 in the general formula (C-6), and preferably has the same form as well.

[0494] R 32 represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms (preferably 1 to 12 carbon atoms, more preferably 1 to 8 carbon atoms, and further preferably 1 to 6 carbon atoms). L 31 represents a single bond or an alkylene group having 1 to 20 carbon atoms (preferably 1 to 10 carbon atoms). R N has the same meaning as R N in the general formula (C-6). n represents an integer from 1 to 20 (preferably 1 to 10) (in addition, in the general formula (CC-4-3), n represents an integer from 4 to 20 (preferably 4 to 10)).

[0495] In the general formula (CC-4), * represents the bonding site in the compound. In the general formula (CC-7), at least one of the Rs is not H, but a group containing a triazine. In the general formula (CC-8), the wavy line indicates that this is the bonding site.

[0496] When the compound having the structure represented by the general formula (C-6) is a polymer or an oligomer, the number of the above repeating units (degree of polymerization) is preferably 2 to 100, more preferably 2 to 50, and still more preferably 2 to 10. In addition, the terminal structure of the polymer or oligomer is not particularly limited and can be, for example: a hydrogen atom, a substituted or unsubstituted amino group, or a substituted or unsubstituted triazine group.

[0497] Component (C-7) is a compound having the structure represented by the following general formula (C-7).

[0498] [Chemical formula 45]

[0499]

[0500] In the general formula (C-7), R 19 and R 20 are a hydrogen atom, an alkyl group having 1 to 12 carbon atoms (preferably an alkyl group having 1 to 8 carbon atoms, such as methyl, ethyl, n-butyl, isopropyl, sec-butyl, tert-butyl, tert-pentyl, tert-hexyl, or tert-octyl), or an aralkyl group having 7 to 36 (preferably 7 to 30) carbon atoms. At least one of R 19 and R 20 is preferably a secondary alkyl group or a tertiary alkyl group, and at least one of R 19 and R 20 is more preferably a tertiary alkyl group. In addition, R 19 and R 20 are also preferably both tertiary alkyl groups (preferably tert-butyl). * represents the bonding site in the compound.

[0501] From the viewpoints of the heat resistance and sterilization durability of the cured adhesive, component (C-7) preferably contains at least one of the compound represented by the following general formula (C-7-1) (component (C-7-1)) and the compound represented by the following general formula (C-7-2) (component (C-7-2)). In component (C-7), the total content of component (C-7-1) and component (C-7-2) is not particularly limited. For example, it is preferably 50% by mass or more, more preferably 80% by mass or more, still more preferably 90% by mass or more, and may also be 100% by mass.

[0502] [Chemical formula 46]

[0503]

[0504] In the general formula, R 19 and R20 respectively have the same meanings as R in the above general formula (C-7). 19 and R 20 respectively.

[0505] L represents a single bond or a divalent linking group. L is preferably an alkylene group having 1 to 10 carbon atoms (preferably 1 to 5 carbon atoms), an alkenylene group having 2 to 10 carbon atoms (preferably 2 to 5 carbon atoms), or a group represented by -L 1 -C(=O)-O-L 2 - represents a group. Here, L 1 and L 2 represent a single bond, an alkylene group having 1 to 10 carbon atoms (preferably 1 to 5 carbon atoms), a carbonyl group, an oxygen atom, or a combination thereof.

[0506] t is an integer from 2 to 4, and A 1 represents a linking group having a valence of 2 to 4. A 1 is preferably an organic group having a valence of 2 to 4, and the organic group preferably has 1 to 20 carbon atoms, more preferably 1 to 15 carbon atoms, further preferably 1 to 12 carbon atoms, and further preferably 1 to 10 carbon atoms.

[0507] When t is 2 and A 1 is a divalent organic group, A 1 is preferably a divalent aliphatic group having 1 to 10 carbon atoms (preferably 1 to 5 carbon atoms) (preferably an alkylene group) or an arylene group having 6 to 22 carbon atoms (preferably 6 to 14 carbon atoms).

[0508] When t is 3 and A 1 is a trivalent linking group, A 1 is preferably a group represented by the following general formula (A 1 L). In the following general formula (A 1 L), * represents the bonding site.

[0509] [Chemical formula 47]

[0510]

[0511] In the above general formula (A 1 L), * represents the bonding site. R 33 to R 35 represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms (preferably 1 to 6 carbon atoms, more preferably 1 to 3 carbon atoms).

[0512] When t is 4 and A 1 is a tetravalent linking group, A 1 is preferably a quaternary carbon atom. In this case, the linking group L is preferably -L 1 -C(=O)-O-L2 -represents a group. Here, L 1 and L 2 respectively have the same meanings as the above-mentioned L 1 and L 2 respectively.

[0513] R 21 ~R 24 have the same meanings as R 19 respectively. R 25 is a reactive organic substituent, preferably a vinyl group-containing group, more preferably a (meth)acryloyl group-containing group.

[0514] As specific examples of the component (C-7), the compounds used in the following examples can be cited, but the present invention is not limited to these specific examples.

[0515] In the adhesive of the present invention, the content of the radical scavenger is not particularly limited. For example, relative to 100 parts by mass of the epoxy resin as the component (A), it is preferably 0.1 part by mass or more and 30 parts by mass or less, more preferably 0.5 part by mass or more and 25 parts by mass or less, more preferably 3 parts by mass or more and 18 parts by mass or less, and further preferably 2 parts by mass or more and 8 parts by mass or less.

[0516] [Cured product]

[0517] The cured product of the present invention is a cured product formed by curing the adhesive of the present invention. That is, the cured product of the present invention is used as a component constituting the adhesive part of the endoscope. The curing temperature of the adhesive of the present invention is not particularly limited, and can be appropriately adjusted according to the heat resistance of the adherend, the curing time, etc. The mixing of each component is preferably carried out while degassing, and therefore, it is usually carried out under reduced pressure. The above-mentioned curing temperature is preferably 100 °C or lower, more preferably 90 °C or lower, and further preferably 80 °C or lower. In addition, in order to make the curing reaction proceed sufficiently, the curing temperature is preferably 0 °C or higher, more preferably 10 °C or higher. The curing reaction time can be appropriately set according to the purpose. Usually, a cured product can be obtained by curing for 1.5 to 200 hours.

[0518] [Endoscope]

[0519] The endoscope of the present invention fixes the constituent components through the cured product of the present invention. "Fixing the constituent components through the cured product of the present invention" means that at least a part of the components constituting the endoscope are fixed to the support member through the cured product of the present invention.

[0520] An example of the endoscope (electronic endoscope) of the present invention will be described. An endoscope flexible tube for endoscopes (hereinafter, the endoscope flexible tube may sometimes be simply referred to as "flexible tube") is assembled on the electronic endoscope, and it is widely used as a medical instrument. In Figure 1In the example shown, the electronic endoscope 2 includes an insertion portion 3 inserted into a body cavity, a main body operation portion 5 connected to the proximal end portion of the insertion portion 3, and a general-purpose cord 6 connected to a processor device and a light source device. The insertion portion 3 is composed of a flexible tube 3a connected to the main body operation portion 5, a bending portion 3b connected to the flexible tube 3a, and a distal end portion 3c connected to the distal end of the bending portion 3b and mainly composed of metal (e.g., stainless steel) components. A imaging device (not shown) for imaging inside the body cavity is built in the distal end portion 3c. The flexible tube 3a, which occupies most of the length of the insertion portion 3, has flexibility almost throughout its entire length, and has a structure that is more flexible in the part inserted into the body cavity or the like.

[0521] Figure 1 In, a plurality of channels (tubes, not shown) penetrating in the axial direction of the insertion portion 3 are formed from the main body operation portion 5 to the top surface of the distal end portion 3c.

[0522] As Figure 2 shown, Figure 1 the flexible tube 3a in becomes a structure in which the peripheral surface of the flexible tube base material 14 is covered with a resin layer 15.

[0523] 14a is the distal end side (the distal end portion 3c side), and 14b is the proximal end side (the main body operation portion 5 side).

[0524] The flexible tube base material 14 is formed by covering a tubular net body 12, which is formed by covering a spiral tube 11 formed by winding a metal strip 11a in a spiral shape on the innermost side, with a braided metal wire. Pipe heads 13 are fitted at both ends thereof. The resin layer 15 is bonded to the flexible tube base material 14 via an adhesive cured product layer 17. The adhesive cured product layer 17 can be formed by applying the adhesive of the present invention and curing it. For convenience of illustration, the adhesive cured product layer (bonding portion) 17 is shown as a layer with a uniform thickness, but it does not have to be in this form, and it can also be irregularly interposed between the resin layer 15 and the flexible tube base material 14. It can also have almost no thickness and be bonded in a form in which the resin layer 15 and the flexible tube base material 14 are substantially in contact.

[0525] A coating 16 containing, for example, fluorine and having chemical resistance is coated on the outer surface of the resin layer 15. In addition, for the sake of clearly illustrating the layer structure, the adhesive cured product layer 17, the resin layer 15, and the coating 16 are drawn thicker than the diameter of the flexible tube base material 14.

[0526] As Figure 3 shown, an illumination window 31, an observation window 32, and a forceps port 33 are formed on the top surface of the distal end portion 3c. In addition, a nozzle 34 for sending out water and air is formed in order to clean the top surface as needed. The illumination window 31, the observation window 32, the forceps port 33, and the nozzle 34 are connected to the main body operation portion 5 through channels.

[0527] AsFigure 4 As shown in the figure, the top part 3c is composed of a top part main body 35 made of metal and a top cover 36 made of an electrically insulating component.

[0528] An observation unit 43 as an optical system device is provided on the observation window 32. In the lens holder 37, an objective optical system composed of lenses L1 to L5 is fixed by adhesive cured products 41 and 42. The adhesive cured products 41 and 42 can be formed by applying the adhesive of the present invention and curing it. In this objective optical system, A is an air layer. A prism 38 is adhesively fixed to the end face of the lens holder 37. The optical axis of the objective optical system is bent at a right angle by the prism 38. The prism 38 is fixed to the solid-state imaging element 40. The solid-state imaging element 40 is fixed to the substrate 39. The fixing of these components can also use the adhesive of the present invention.

[0529] <Method for manufacturing an endoscope>

[0530] The method for manufacturing an endoscope of the present invention is not particularly limited as long as it includes fixing endoscope components using the adhesive of the present invention. As processes other than the fixing of endoscope components, the endoscope of the present invention can be manufactured using ordinary manufacturing processes.

[0531] The material of the fixed endoscope components is not particularly limited, and examples include resin components, metal components, and glass components. For example, after preferably mixing each component contained in the adhesive of the present invention under reduced pressure, the mixture is injected or coated on the application site and heated at -10 to 60 °C (preferably 0 to 60 °C, more preferably 10 to 50 °C) for 1.5 to 200 hours, whereby the endoscope components can be fixed to the support components and the like constituting the endoscope.

[0532] Hereinafter, specific examples will be given to illustrate the usage form of the adhesive in the method for manufacturing an endoscope of the present invention, but the present invention is not limited to these specific examples.

[0533] Among the endoscope components fixed by the adhesive of the present invention, as resin components, for example, a tube inserted into the insertion portion of the endoscope can be cited. As the resin material constituting the tube, fluororesins such as Teflon (registered trademark), polysulfone, polyester, polyolefin, polysiloxane, etc. can be cited. The adhesive of the present invention can be used for, for example, bonding a metal component or a glass component constituting the insertion portion of the endoscope to the above-mentioned tube (fixing the metal component or the glass component to the above-mentioned tube).

[0534] In addition, as described above, it can also be used to form Figure 2 the adhesive cured product layer 17. In addition, it can also be used for Figure 2 bonding the resin layer 15 and the coating layer 16 in

[0535] The adhesive of the present invention can be used for the surface finishing and fixation of the end portion of the flexible outer skin tube (resin layer 15) (the end portion on the tip side (bending angle portion 3b side) of the flexible tube 3a). Specifically, after tying and fixing the end portion of the resin layer 15 of the flexible tube 3a from the outside with a silk thread to the component inside it, the adhesive is applied and cured in a manner that covers the silk thread. This is because by forming the outermost layer of the tip side end portion of the flexible tube 3a with the adhesive of the present invention, the silk thread at the tip side end portion is not easily loosened, and it is easy to insert the insertion portion into the body cavity.

[0536] In addition, the adhesive of the present invention can be used for at least one of the adhesion between the tip portion 3c and the bending angle portion 3b and the adhesion between the insertion portion 3 and the main body operation portion 5. For example, the tip portion 3c and the bending angle portion 3b are adhered with the adhesive of the present invention. Then, the adhered portion between the tip portion 3c and the bending angle portion 3b and its vicinity are wound tightly with a silk thread to enhance the adhesion, and the adhesive is applied and cured in a manner that covers the silk thread. The same applies to the adhesion between the insertion portion 3 and the main body operation portion 5.

[0537] In addition, the adhesive of the present invention can also be used for fixing various tubes inserted into the insertion portion of the endoscope to at least one of the tip portion 3c and the main body operation portion 5.

[0538] In addition, the adhesive of the present invention is also preferably used for sealing the illumination window 31 and the observation window 32 (fixation of glass components) in the tip portion 3c. By applying the adhesive thickly, the corners around the lens can be made smooth, and in addition, the lateral entry of light from the lens can be blocked.

[0539] In addition, the adhesive of the present invention can be used for fixing components such as the assembly of the imaging device built in the tip portion 3c, the adhesion of components, and the sealing of the solid-state imaging element 40. The imaging device has an optical system composed of a plurality of optical components such as lenses L1 to L5 and a prism 38, and a solid-state imaging element 40 such as a CCD (Charge Coupled Device) that photoelectrically converts the optical image imaged by the optical system into a video signal. The adhesive of the present invention can be used for the adhesion between optical components such as lenses L1 to L5 and the prism 38 made of materials such as glass, and the adhesion between lenses L1 to L5, the prism 38, etc. and a substrate 39 made of resin or metal. Through this adhesion, glass components can be fixed, and in addition, metal components can be fixed.

[0540] In addition, the adhesive of the present invention can be used for the adhesion fixation and sealing of the solid-state imaging element 40 and the substrate 39. Through this adhesion, metal components constituting the solid-state imaging element, the substrate, etc. can be fixed.

[0541] In this way, the method for manufacturing an endoscope of the present invention includes a step of fixing endoscope components using the adhesive of the present invention.

[0542] [Examples]

[0543] The present invention will be described in further detail based on examples, but the present invention is not limited to the following examples. In the following examples, "room temperature" means 25°C. In addition, the blending amount of the components refers to the blending amount of the components themselves. That is, when the raw material contains a solvent, it is the amount after removing the solvent.

[0544] [Preparation Example] Preparation of Adhesive

[0545] The components (A) to (C) shown in Table 1 below were mixed according to the mixing ratio (parts by mass) shown in Table 1 below, and the mixture was defoamed with "Defoaming Ren Tarou ARV-310 (trade name, manufactured by THINKY Corporation)" at room temperature and under reduced pressure to 1.0 Pa while stirring at 2000 rpm for 5 minutes to obtain an adhesive. In addition, in Production Examples 1 and 2 below, the just-prepared adhesive was used.

[0546] [Production Example 1] Production of Test Sheet (Sheet-like Adhesive Cured Product)

[0547] The adhesive obtained in the above Preparation Example was cured at 80°C for 24 hours using a small proofing machine (manufactured by Toyo Seiki Co., Ltd.) to obtain a test sheet having a length of 100 mm × a width of 100 mm × a thickness of 0.4 mm. The test sheet was produced for use in Test Examples 1 and 2 below.

[0548] [Production Example 2] Production of Test Piece (Stainless Steel (SUS) Substrate Bonding Test Piece)

[0549] Using the adhesive obtained in the above Preparation Example, a test piece (SUS substrate bonding test piece) was produced in accordance with JIS K 6850 (1999). The substrate used was a SUS304 plate (manufactured by MISUMI) having a width of 25 mm, a length of 10 cm, and a thickness of 2 mm. The bonding area was set to 25 mm × 10 mm. A wire gasket (manufactured by AS ONE Corporation) having a thickness of 0.1 mm was used as the gasket. The curing time of the adhesive was set to 24 hours at 80°C to obtain a test piece (SUS substrate bonding test piece) in which two SUS304 plates were bonded with the adhesive cured product.

[0550] [Test Example 1] Ozone Water Treatment Durability Test

[0551] Place two test sheets into a glass box measuring 20 cm in length × 20 cm in width × 1 cm in thickness without overlapping. Set this glass box in the flow path of an ozone water generating device (trade name, "OWM-10L10P" manufactured by EcoDesign Co., Ltd.), and let ozone water with an ozone concentration of 3 ppm flow at a flow rate of 1 L / min for 3 hours for treatment. Take out the test sheets from the glass box and wash them with distilled water.

[0552] (Appearance evaluation)

[0553] For one test sheet, after washing it with distilled water, wipe off the moisture on the surface and let it stand in an environment of 25 °C for 8 hours for drying. Visually observe this test sheet and evaluate it according to the following evaluation criteria. S, A, and B are qualified for this test.

[0554] -Evaluation criteria-

[0555] S: The surface of the sheet is free of roughness and dirt.

[0556] A: Slight roughness appears on the surface of the sheet, but there is no dirt.

[0557] B: Slight roughness appears on the surface of the sheet and slight dirt with a degree of translucency appears.

[0558] C: Roughness is generated on the surface of the sheet and it loses transparency due to dirt.

[0559] (Tensile strength retention rate evaluation)

[0560] For the other test sheet, after washing it with distilled water, dry it at 23 °C × 50% RH (relative humidity) for 24 hours. Use a TENSILON universal material testing machine (trade name: RTF-1210, manufactured by A&D Co., Ltd.) to measure the tensile strength (I) (MPa) of the test sheet before ozone water treatment and the tensile strength (II) (MPa) of the test sheet after ozone water treatment at room temperature.

[0561] Calculate the retention rate X (%) of the tensile strength by the following formula and evaluate it according to the following evaluation criteria. S, A, and B are qualified for this test.

[0562] Retention rate X (%) of tensile strength = 100 × tensile strength (II) / tensile strength (I)

[0563] -Evaluation criteria-

[0564] S: The retention rate X of the tensile strength is 90% or more

[0565] A: The retention rate X of the tensile strength is 80% or more and less than 90%

[0566] B: The retention rate X of the tensile strength is 70% or more and less than 80%

[0567] C: The retention rate X of the tensile strength is 60% or more and less than 70%.

[0568] D: The retention rate X of the tensile strength is less than 60%.

[0569] [Test Example 2] Heat resistance

[0570] Using a TENSILON universal material testing machine (trade name: RTF-1210, manufactured by A&D Company), hold the ends of two SUS304 plates at room temperature, and stretch them parallel to each other and in opposite directions along the length direction, thereby measuring the adhesive strength (A) (MPa) of the test piece (the test piece not subjected to ozone water treatment).

[0571] On the other hand, measure the adhesive strength (MPa) of the test piece after standing at a temperature of glass transition temperature (Tg) + 10°C for 24 hours and then standing at 23°C for 24 hours in the same operation as above, as the adhesive strength (B) (MPa).

[0572] In addition, for the test piece material (the test piece material made of the adhesive with the same composition as the adhesive used to make the test piece), perform dynamic viscoelasticity measurement using DMS6100 (trade name, manufactured by SII Technology) to determine the glass transition temperature.

[0573] Calculate the retention rate Y (%) of the adhesive strength from the following formula and evaluate it according to the following evaluation criteria. S, A, and B are qualified for this test.

[0574] Retention rate Y (%) of adhesive strength = 100 × adhesive strength (B) / adhesive strength (A)

[0575] -Evaluation criteria-

[0576] S: The retention rate Y of the adhesive strength is 90% or more

[0577] A: The retention rate Y of the adhesive strength is 80% or more and less than 90%

[0578] B: The retention rate Y of the adhesive strength is 70% or more and less than 80%

[0579] C: The retention rate Y of the adhesive strength is 60% or more and less than 70%

[0580] D: The retention rate Y of the adhesive strength is less than 60%

[0581] [Table 1]

[0582] Table 1

[0583]

[0584]

[0585] Ex: Example

[0586] Comp: Comparative example

[0587] [Component (A): Epoxy resin]

[0588] A-1:

[0589] Bisphenol A diglycidyl ether (trade name “jER828”, manufactured by Mitsubishi Chemical Corporation, epoxy equivalent 190)

[0590] A-2:

[0591] Bisphenol F diglycidyl ether (trade name “EPICLON830”, manufactured by DIC Corporation, epoxy equivalent 170)

[0592] A-3:

[0593] Epoxy varnish resin (product number 406775, manufactured by Sigma-Aldrich Corporation, epoxy equivalent 170)

[0594] [Component (B): Curing component of epoxy resin]

[0595] B-1:

[0596] Dicyandiamide (manufactured by Tokyo Chemical Industry Co., Ltd.)

[0597] B-2:

[0598] Pentaerythritol tetra(3-mercaptobutyrate) (trade name “KARENZ MT (registered trademark) PE1”, manufactured by Showa Denko K.K.)

[0599] B-3:

[0600] Triphenylphosphine (manufactured by Tokyo Chemical Industry Co., Ltd.)

[0601] B-4:

[0602] Polyetheramine D230 (trade name, manufactured by MITSUI FINE CHEMICALS CO., LTD., number average molecular weight 230)

[0603] B-5:

[0604] Phenol resin (trade name “HF-1M”, manufactured by Meiwafosis Co., Ltd.)

[0605] B-6:

[0606] Polyetheramine D400 (trade name, manufactured by MITSUI FINE CHEMICALS CO., LTD., number average molecular weight 400)

[0607] B-7:

[0608] Polyetheramine T403 (trade name, manufactured by MITSUI FINE CHEMICALS, number-average molecular weight 440)

[0609] B-8:

[0610] JEFFAMINE ED-600 (trade name, manufactured by Huntsman, number-average molecular weight 600)

[0611] B-9:

[0612] 1,6-Hexanediamine (manufactured by Tokyo Chemical Industry Co., Ltd.)

[0613] B-10:

[0614] m-Xylylenediamine (manufactured by Tokyo Chemical Industry Co., Ltd.)

[0615] B-11:

[0616] HV953U (trade name, manufactured by Nagase Kasei Co., Ltd., polyaminoamide, number-average molecular weight 1100)

[0617] X-1:

[0618] Boron trifluoride monoamine complex (manufactured by Aldrich)

[0619] [Component (C): Radical scavenger]

[0620] C11: Component (C-1), trade name: IRGASTAB FS042, manufactured by Aldrich Corporation

[0621] C21: Component (C-2), trade name: IRGANOX HP-136, manufactured by ADEKA Corporation

[0622] C31: Component (C-3), ascorbic acid

[0623] C41: Component (C-4), trade name: ADK STAB HP-10, manufactured by ADEKA Corporation

[0624] C51: Component (C-5), trade name: ADK STAB AO-412S, manufactured by ADEKA Corporation

[0625] C61: Component (C-6-2), trade name: ADK STAB LA-63P, manufactured by ADEKA Corporation (NR 17 is N-CH3)

[0626] C62: Component (C-6-1), trade name: TINUVIN765, manufactured by BASF Corporation (NR 17 is N-CH3)

[0627] C63: Component (C-6-2), trade name: FLAMESTAB NOR 116, manufactured by BASF (NR 17 is N-O-cyclohexane)

[0628] C64: Component (C-6-2), trade name: CHIMASSORB 2020FDL, manufactured by BASF (NR 17 is N-H)

[0629] C65: Component (C-6-2), trade name: CHIMASSORB 944FDL, manufactured by BASF (NR 17 is N-H)

[0630] C71: Component (C-7-1), trade name: IRGANOX1010, manufactured by BASF

[0631] C72: Component (C-7-2), trade name: SUMILIZER GS, manufactured by Sumitomo Chemical Co., Ltd.

[0632] The following conclusions can be drawn from the results in Table 1.

[0633] For Comparative Examples 1 and 2 of the adhesive that does not contain Component (C), both the "appearance" evaluation and the "tensile strength evaluation" of the durability of the adhesive treated with ozone water are poor, and the heat resistance is also poor. In addition, for Comparative Example 3 of the adhesive that uses boron trifluoride monoamine complex instead of Component (B) specified in the present invention, both the "appearance" evaluation and the "tensile strength" evaluation of the durability of the adhesive treated with ozone water are poor, and the heat resistance is also poor.

[0634] In contrast, for the adhesives of Examples 1 to 36 (the adhesives of the present invention), the durability of the adhesives treated with ozone water (the "appearance" evaluation and the "tensile strength" evaluation) and the heat resistance evaluation are all at a qualified level.

[0635] Symbol Explanation

[0636] 2 Electronic endoscope (endoscope)

[0637] 3 Insertion section

[0638] 3a Flexible tube

[0639] 3b Bending section

[0640] 3c Tip section

[0641] 5 Main body operation section

[0642] 6 Universal cord

[0643] 11 Spiral tube

[0644] 11a Metal strip

[0645] 12 cylindrical net body

[0646] 13 pipe head

[0647] 14 flexible pipe base material

[0648] 14a top end side

[0649] 14b base end side

[0650] 15 resin layer

[0651] 16 coating

[0652] 17 adhesive cured product layer

[0653] 31 lighting window

[0654] 32 observation window

[0655] 33 forceps opening

[0656] 34 nozzle

[0657] 35 top end part main body

[0658] 36 top end cover

[0659] 37 lens holder

[0660] 38 prism

[0661] 39 substrate

[0662] 40 solid-state imaging device

[0663] 41 adhesive cured product

[0664] 42 adhesive cured product

[0665] 43 observation unit

[0666] L1 to L5 lenses

Claims

1. An endoscope adhesive comprising the following components (A) to (C) Component (A): Epoxy resin Component (B): Curing component of epoxy resin Component (C): Radical scavenger The component (A) contains at least one of bisphenol A type epoxy resin, bisphenol F type epoxy resin, and novolac type epoxy resin The component (B) contains at least one of a phosphorus-containing compound, a polythiol compound, a dicyandiamide compound, a phenolic compound, and a polyamine compound having an unsubstituted amino group The component (C) contains at least one of the following components (C-1) to (C-7) Component (C-1): A compound represented by the following general formula (C-1) Component (C-2): A compound represented by the following general formula (C-2) Component (C-3): A compound represented by the following formula (C-3) Component (C-4): A compound represented by the following general formula (C-4) Component (C-5): A compound represented by the following general formula (C-5) Component (C-6): A compound having the structure represented by the following general formula (C-6) Component (C-7): A compound having the structure represented by the following general formula (C-7) In the endoscope adhesive, the content of the component (A) is 40% by mass or more and 99% by mass or less, and the content of the component (C) is 0.1 part by mass or more and 30 parts by mass or less with respect to 100 parts by mass of the content of the component (A) [Chemical formula 1] In the formula, R 1 and R 2 represent a hydrogen atom, an aliphatic group, an acyl group, an aliphatic oxycarbonyl group, an aromatic oxycarbonyl group, an aliphatic sulfonyl group or an aromatic sulfonyl group, R 3 represents an aliphatic group, an aliphatic oxy group, an aromatic oxy group, an aliphatic thio group, an aromatic thio group, an acyloxy group, an aliphatic oxycarbonyloxy group, an aromatic oxycarbonyloxy group, a substituted amino group, a heterocyclic group or a hydroxyl group; R 1 and R 2 , R 2 and R 3 , R 1 and R 3 do not bond to each other or bond to each other to form a 5- to 7-membered ring, but do not form a piperidine skeleton; wherein, R 1 and R 2 will not both be hydrogen atoms, R 1 and R 2 have a total number of carbon atoms of 7 to 40; in addition, R 1 , R 2 and R 3 do not contain an unsubstituted amino group R 1 、R 2 Among the groups represented by, the aliphatic group is selected from the group consisting of an alkyl group having 1 to 18 carbon atoms, an alkenyl group having 2 to 18 carbon atoms, and an alkynyl group having 2 to 18 carbon atoms; The acyl group is selected from the group consisting of acetyl, pivaloyl, 2-chloroacetyl, stearoyl, benzoyl, p-octyloxyphenylcarbonyl, 2-pyridylcarbonyl, 2-furylcarbonyl, (meth)acryloyl The aliphatic oxycarbonyl group is selected from the group consisting of methoxycarbonyl, ethoxycarbonyl, tert-butoxycarbonyl, hexadecyloxycarbonyl, octadecyloxycarbonyl The aromatic oxycarbonyl group is selected from the group consisting of phenoxycarbonyl, o-chlorophenoxycarbonyl, m-nitrophenoxycarbonyl, p-tert-butylphenoxycarbonyl The aliphatic sulfonyl or aromatic sulfonyl group is selected from the group consisting of methylsulfonyl, ethylsulfonyl, butylsulfonyl, phenylsulfonyl, p-methylphenylsulfonyl R 3 Among the respective groups represented The aliphatic group is selected from the group consisting of an alkyl group having 1 to 18 carbon atoms, an alkenyl group having 2 to 18 carbon atoms, and an alkynyl group having 2 to 18 carbon atoms The aliphatic oxy group is selected from the group consisting of methoxy, ethoxy, isopropoxy, tert-butoxy, octyloxy, 2-methoxyethoxy The aromatic oxy group is selected from the group consisting of phenoxy, 2-methylphenoxy, 4-tert-butylphenoxy, 3-nitrophenoxy, 2-tetradecanoylaminophenoxy, p-methoxyphenoxy The aliphatic thio group is selected from the group consisting of methylthio, ethylthio, hexadecylthio, octylthio The aromatic thio group is selected from the group consisting of phenylthio, p-chlorophenylthio, m-methoxyphenylthio, p-methoxyphenylthio The acyloxy group is selected from the group consisting of formyloxy, acetyloxy, pivaloyloxy, stearoyloxy, benzoyloxy, p-methoxyphenylcarbonyloxy The aliphatic oxycarbonyloxy group is selected from the group consisting of methoxycarbonyloxy, ethoxycarbonyloxy, tert-butoxycarbonyloxy, and octyloxycarbonyloxy; The aromatic oxycarbonyloxy group is selected from the group consisting of phenoxycarbonyloxy, p-methoxyphenoxycarbonyloxy, and p-hexadecyloxyphenoxycarbonyloxy; The substituted amino group is selected from the group consisting of methylamino, dimethylamino, phenylamino, N-methyl-phenylamino, and diphenylamino; The heterocyclic group is selected from the group consisting of an imidazole ring, a thiazole ring, a benzothiazole ring, a benzoxazole ring, a benzotriazole ring, a benzoselenazole ring, a pyridine ring, a pyrimidine ring, and a quinoline ring, [Chemical formula 2] In the formula, R 4 ~R 7 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 15 carbon atoms; [Chemical formula 3] [Chemical formula 4] In the formula, R 8 and R 9 represent an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an aryloxy group having 6 to 20 carbon atoms, or a halogen atom, and R 10 represents an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 20 carbon atoms; at least two of R 8 , R 9 and R 10 are not connected to each other or are connected to each other via a group or single bond having a valence of 2 or more; [Chemical formula 5] R 11 -S-R 12 General formula (C-5) In the formula, R 11 and R 12 represent an alkyl group having 2 to 20 carbon atoms; [Chemical formula 6] In the formula, R 13 ~R 16 represents a hydrogen atom or an alkyl group having 1 to 12 carbon atoms; R 17 represents a hydrogen atom, an alkyl group having 1 to 18 carbon atoms or OR 18 ; R 18 represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms; * represents a bonding site; wherein, R 13 ~R 16 do not all represent hydrogen atoms; [Chemical formula 7] In the formula, R 19 and R 20 represent a hydrogen atom, an alkyl group having 1 to 12 carbon atoms or an aralkyl group having 7 to 36 carbon atoms; * represents a bonding site.

2. The adhesive for an endoscope according to claim 1, wherein in the adhesive for joining an endoscope, the content of the component (A) is 50% by mass or more and 96% by mass or less, and the content of the component (C) is 0.5 part by mass or more and 25 parts by mass or less with respect to 100 parts by mass of the content of the component (A).

3. The adhesive for an endoscope according to claim 1, wherein the component (C) contains at least one of the component (C-6) and the component (C-7).

4. The adhesive for an endoscope according to claim 1 or 2, wherein the component (C) contains the component (C-6).

5. The adhesive for an endoscope according to claim 1 or 2, wherein the component (C-6) contains at least one of the following component (C-6-1) and the following component (C-6-2), Component (C-6-1): A compound represented by the following general formula (C-6-1) Component (C-6-2): A compound having a constituent component represented by the following general formula (C-6-2) [Chemical formula 8] In the formula, R 13 ~R 17 are respectively the same as R 13 ~R 17 in the general formula (C-6); q represents an integer of 2 or more, D 1 represents a q-valent linking group; r represents an integer; Q represents an s+2-valent linking group; s represents 1 or 2.

6. The adhesive for an endoscope according to claim 1 or 2, wherein the component (C-7) contains at least one of the following component (C-7-1) and the following component (C-7-2), Component (C-7-1): A compound represented by the following general formula (C-7-1) Component (C-7-2): A compound represented by the following general formula (C-7-2) [Chemical formula 9] In the formula, R 19 and R 20 have the same meanings as R 19 and R 20 in the general formula (C-7) respectively; L represents a single bond or a divalent linking group; t represents an integer from 2 to 4, and A 1 represents a linking group with a valence of 2 to 4; R 21 to R 24 have the same meanings as R 19 ; R 25 represents a reactive organic substituent.

7. A cured product obtained by curing the adhesive for an endoscope according to any one of claims 1 to 6.

8. An endoscope in which a component is fixed using the cured product according to claim 7.

9. A method for manufacturing an endoscope, which includes fixing a component using the adhesive for an endoscope according to any one of claims 1 to 6.

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