Semiconductor package device

Abstract

The application discloses a semiconductor packaging device, which is characterized in that a pressing plate is arranged on one side of a mounting unit and above a packaging plate, a welding unit is arranged on each side of the pressing plate, a strip plate with a plurality of through holes is arranged between the pressing plate and the packaging plate, a plurality of pressing blocks with a plug rod on the top are arranged along the length direction of the strip plate at intervals, the upper end of the plug rod is rotatably connected with a roller, a buffer spring is arranged between the pressing block and the strip plate and is sleeved on the outer wall of the plug rod, a belt is arranged above the strip plate and is fixedly connected with corresponding rotating shafts at two ends, a torsion spring is arranged between each rotating shaft and the inner wall of a corresponding shaft seat, and a torsion sensor mounted on the shaft seat is connected with the rotating shafts.

Description

Technical Field

[0001] This invention relates to the field of chip processing technology, and more particularly to a semiconductor packaging device. Background Technology

[0002] QFN integrated circuit packages are flat, leadless packages that use a soldering device to package the integrated circuit onto the chip. Due to the small size of semiconductor chips, compared to directly dispensing adhesive onto the leadframe for soldering, using an adhesive stamping device to stamp adhesive onto the leadframe is more suitable. This adhesive stamping device has a slender, rod-shaped stamping tool. Adhesive is applied to the end of this tool and stamped onto the leadframe, thus supplying adhesive to the leadframe.

[0003] The currently disclosed Chinese patent CN201010624106.0 describes a chip bonding apparatus comprising multiple imprinting components, each including an imprinting needle that contacts the lead frame and imprints the adhesive, and a needle clamp for engaging the imprinting needle; a rotating disk with multiple imprinting springs that elastically support each imprinting component upwards, the multiple imprinting components being mounted on the rotating disk and movable; a main body on which the rotating disk is rotatably mounted; a rotation means for rotating the rotating disk relative to the main body; an imprinting lifting unit including a pressure member and a pressure driver, the pressure member being located above the multiple imprinting components and movable to apply downward pressure to at least one of the multiple imprinting components, and having at least one tool through hole through which the remaining imprinting components other than the one being pressurized can pass; the pressure driver being coupled to the pressure member for moving the pressure member relative to the main body; and an imprinting transfer unit coupled to the main body for horizontally transferring the main body. According to the aforementioned patent, the chip welding apparatus of this patent has the effect of improving the productivity of the chip welding process by shortening the adhesive imprinting time and the chip welding time.

[0004] However, existing technologies are unstable in chip bonding and cannot guarantee a tight fit between the chip and the packaging board, resulting in unevenness during chip bonding and affecting the welding effect. Summary of the Invention

[0005] The purpose of this invention is to provide a semiconductor packaging device that achieves tight bonding between the chip and the corresponding packaging area, avoiding excessive gaps between the chip and the packaging board that could lead to poor soldering, thereby improving the soldering effect. It also ensures consistent pressure on the chip, thereby improving overall consistency.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows: a semiconductor packaging device, comprising: a conveyor belt and a packaging plate, wherein a limiting plate is provided on both sides of the conveyor belt, the packaging plate for placing QFN chips is located between the two limiting plates, and the bottom of the packaging plate is in contact with the conveyor belt, the surface of the packaging plate has a plurality of equidistantly distributed packaging areas, a mounting unit is installed in the middle of the conveyor belt, and a feed belt is arranged perpendicular to the axis of the conveyor belt, the mounting unit being used to transfer the chips on the feed belt to the packaging plate;

[0007] A pressure plate is provided on one side of the mounting unit and above the encapsulation board, and a support plate is provided below the encapsulation board. The pressure plate and the support plate are connected by a first cylinder. A welding unit is provided on each side of the pressure plate.

[0008] A strip plate with several through holes is provided between the lower pressure plate and the encapsulation plate. The lower pressure plate is fixedly connected to the strip plate. Several pressure blocks with insert rods on the top are arranged at intervals along the length of the strip plate. A roller is rotatably connected to the upper end of the insert rod. The through holes are slidably connected to the insert rod. A buffer spring is provided between the pressure block and the strip plate and fitted on the outer wall of the insert rod.

[0009] The strip has bearing seats at both ends for rotating shafts to be connected, and the axis of the roller is parallel to the axis of the rotating shaft. A strip spans across the strip and its two ends are fixedly connected to the corresponding rotating shafts. The length of the strip is perpendicular to the axis of the rotating shaft. A torsion spring is provided on each rotating shaft and between it and the inner wall of the corresponding bearing seat. A torque sensor mounted on the bearing seat is connected to the rotating shaft.

[0010] The following are further improvements to the above technical solution:

[0011] 1. In the above scheme, the welding unit further includes a welding gun, a first sliding frame and a linear driver. The welding gun is symmetrically arranged on both sides of the lower pressure plate, and the output end of the welding gun is facing the welding area of ​​the packaging board. The linear driver is connected to the welding gun and is used to drive the welding gun to move.

[0012] 2. In the above scheme, the first sliding frame further includes a fixed rod, a first threaded rod, and a first limiting rod and a second limiting rod distributed on the upper and lower sides. The first threaded rod is located between the first limiting rod, the second limiting rod and the lower pressure plate. The fixed rod is located on the side of the first limiting rod and the second limiting rod opposite to the lower pressure plate. The first limiting rod is located above the second limiting rod, thereby forming a first sliding groove between the second limiting rod and the fixed rod, and forming a second sliding groove between the first limiting rod and the second limiting rod.

[0013] 3. In the above scheme, the linear actuator includes a driving part and a mounting part. The driving part, which is connected to the first threaded rod, can slide along the second slide groove, and the mounting part, which is equipped with a welding gun, can slide along the first slide groove.

[0014] 4. In the above solution, the mounting unit further includes a second sliding frame, a sliding seat, and suction cups. A second threaded rod is provided between the inner walls of the second sliding frame. A motor for driving the second threaded rod to rotate is provided on one side of the second sliding frame. The sliding seat is fitted onto the second threaded rod, and a fixed plate is provided below the sliding seat. Several suction cups are installed along the length of the fixed plate. A second cylinder is installed on the top of the sliding seat, and the movable end of the second cylinder is connected to the fixed plate.

[0015] 5. In the above scheme, the motor is a reversible motor.

[0016] 6. In the above scheme, two conveyor belts are provided.

[0017] 7. In the above scheme, the strip and the lower pressure plate are fixedly connected by a connecting frame.

[0018] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0019] 1. The semiconductor packaging apparatus of the present invention comprises a lower pressure plate located above a packaging board, both ends of which are rotatably connected to a cylinder. A strip plate with several through holes is disposed between the lower pressure plate and the packaging board, and the lower pressure plate and the strip plate are fixedly connected. Several pressure blocks with insert rods on top are disposed at intervals along the length direction of the strip plate. The through holes and the insert rods are slidably connected. A buffer spring is disposed between the pressure block and the strip plate and fitted on the outer wall of the insert rod. The lower pressure plate is driven by the cylinder, so that the pressure blocks on the strip plate tightly fit the chip with the corresponding packaging area, which facilitates subsequent processing. During the fitting process, the insert rod of the pressure block slides along the through hole. The buffer spring maintains the pressing force of the pressure block on the chip and also buffers the pressing process, avoiding hard contact between the pressure block and the chip that could damage the chip, thus improving chip safety. It can also process multiple chips at the same time, improving production efficiency.

[0020] 2. In the semiconductor packaging apparatus of the present invention, the axis of the roller located at the upper end of the insertion rod is parallel to the axis of the rotating shaft. A strip spans across the strip and its two ends are fixedly connected to the corresponding rotating shafts. The length direction of the strip is perpendicular to the axis of the rotating shaft, and the surface of the roller contacts the surface of the strip. A torsion spring is provided on each rotating shaft and between it and the inner wall of the corresponding shaft seat. A torque sensor installed on the shaft seat is connected to the rotating shaft, ensuring that the pressure of each pressure block in contact with the chip is consistent, thereby improving the consistency of the overall processing. Attached Figure Description

[0021] Appendix Figure 1 This is a schematic diagram of the overall structure of the semiconductor packaging device of the present invention;

[0022] Appendix Figure 2 Appendix to this invention Figure 1 Enlarged view of point A;

[0023] Appendix Figure 3 Appendix to this invention Figure 1 Enlarged view of point B;

[0024] Appendix Figure 4 This is a partial three-dimensional view of the semiconductor packaging device of the present invention;

[0025] Appendix Figure 5 This is a cross-sectional front view of the semiconductor packaging device of the present invention.

[0026] In the attached diagrams: 1. Conveyor belt; 2. Encapsulation plate; 3. Limiting plate; 4. Mounting unit; 5. Feeding belt; 6. Lower pressure plate; 7. Support plate; 8. First cylinder; 9. Welding unit; 10. Through hole; 11. Strip plate; 12. Insert rod; 13. Pressure block; 14. Roller; 15. Buffer spring; 16. Rotating shaft; 17. Shaft seat; 18. Strip; 19. Torsion spring; 20. Torque sensor; 21. Welding gun; 22. Sliding frame; 23. Linear actuator; 231. Drive unit; 232. Mounting unit; 24. Fixing rod; 25. First threaded rod; 26. First limiting rod; 27. Second limiting rod; 28. First slide groove; 29. ​​Second slide groove; 30. Second sliding frame; 31. Sliding seat; 32. Suction cup; 33. Second threaded rod; 34. Motor; 35. Fixing plate; 36. Second cylinder. Detailed Implementation

[0027] The present patent can be further understood through the specific embodiments given below, but they are not intended to limit the present patent.

[0028] Example 1: A semiconductor packaging device includes: a conveyor belt 1 and a packaging plate 2. A limiting plate 3 is provided on both sides of the conveyor belt 1. The packaging plate 2 for placing QFN chips is located between the two limiting plates 3, and the bottom of the packaging plate 1 is in contact with the conveyor belt 1. The surface of the packaging plate 1 has a plurality of equidistantly distributed packaging areas. A mounting unit 4 is installed in the middle of the conveyor belt 1. A feed belt 5 is arranged perpendicular to the axis of the conveyor belt 1. The mounting unit 4 is used to transfer the chip on the feed belt 5 to the packaging plate 2.

[0029] A pressure plate 6 is provided on one side of the mounting unit 4 and above the encapsulation plate 2, and a support plate 7 is provided below the encapsulation plate 2. The pressure plate 6 and the support plate 7 are connected by a first cylinder 8. A welding unit 9 is provided on each side of the pressure plate 6.

[0030] A strip plate 11 with several through holes 10 is provided between the lower pressure plate 6 and the encapsulation plate 2. The lower pressure plate 6 is fixedly connected to the strip plate 11. Several pressure blocks 13 with insert rods 12 on the top are arranged at intervals along the length of the strip plate 11. A roller 14 is rotatably connected to the upper end of the insert rod 12. The through holes 10 are slidably connected to the insert rod 12. A buffer spring 15 is provided between the pressure block 13 and the strip plate 11 and fitted on the outer wall of the insert rod 12.

[0031] Driven by the first cylinder, the lower pressure plate moves relative to the support plate, causing the pressure block 13 to press the chips in the same row on the packaging plate onto the corresponding packaging area of ​​the packaging plate. The chips are in elastic contact under the action of the buffer spring, and the packaging plate will not be dented under the support of the support plate, thus improving the welding effect.

[0032] The strip 11 has bearing seats 17 at both ends for rotating shafts 16 to be rotatably connected, and the axis of the roller 14 is parallel to the axis of the rotating shaft 16. A strip 18 spans across the strip and its two ends are fixedly connected to the corresponding rotating shafts 16. The length direction of the strip 18 is perpendicular to the axis of the rotating shaft 16. A torsion spring 19 is provided on each rotating shaft 16 and between it and the inner wall of the corresponding bearing seat 17. A torque sensor 20 installed on the bearing seat 17 is connected to the rotating shaft 16.

[0033] By detecting the torque of the corresponding rotating shaft using two torque sensors, the positions of the strip and pressure block are adjusted to ensure that the torque of the rotating shafts at both ends of the strip is consistent, thus ensuring that the pressure of each pressure block in contact with the chip is consistent, thereby improving the overall consistency of the processing.

[0034] As the pressure block presses the chip onto the packaging board, the insertion rod drives the roller to push the strip upward, causing the strip to deform. The shafts connected to both ends of the strip rotate, and the torque sensor detects the torque. Before use, the positions of the strip and pressure block are adjusted to ensure that the torque of the shafts at both ends of the strip is consistent, thus ensuring that each pressure block exerts consistent pressure on the chip.

[0035] When the pressure plate stops moving, the pressure block completes the pressing of the chip, so that all the chips in the same row are kept in close contact with the packaging board, avoiding the situation where the chip is not in close contact with the packaging board, which would affect the soldering. When the pressure plate moves away from the support plate, the pressure block returns to its original position, and the strip returns to normal under the action of the torsion spring.

[0036] The welding unit 9 further includes a welding gun 21, a first sliding frame 22, and a linear driver 23. The welding gun 21 is symmetrically arranged on both sides of the lower pressure plate 6, and the output end of the welding gun 21 faces the welding area of ​​the encapsulation plate 2. The linear driver 23 is connected to the welding gun 21 and is used to drive the welding gun 21 to move.

[0037] The aforementioned first sliding frame 22 further includes a fixed rod 24, a first threaded rod 25, and a first limiting rod 26 and a second limiting rod 27 distributed above and below. The first threaded rod 25 is located between the first limiting rod 26, the second limiting rod 27 and the lower pressure plate 6. The fixed rod 24 is located on the side opposite to the lower pressure plate 6 of the first limiting rod 26 and the second limiting rod 27. The first limiting rod 26 is located above the second limiting rod 27, thereby forming a first sliding groove 28 between the second limiting rod 27 and the fixed rod 24, and forming a second sliding groove 29 between the first limiting rod 26 and the second limiting rod 27.

[0038] The linear actuator 23 includes a drive part 231 and a mounting part 232. The drive part 231, which is fitted with the first threaded rod 25, can slide along the second slide groove 29, and the mounting part 232, which is provided with the welding gun 21, can slide along the first slide groove 28.

[0039] A welding gun that moves in a straight line can weld chips on the same straight line, which is simple and convenient to operate and greatly improves processing efficiency.

[0040] A first groove is formed between the second limiting rod and the fixed rod, and a second groove is formed between the first limiting rod and the second limiting rod. The linear actuator moves along the first groove and the second groove. The linear actuator moves along the horizontal first groove and the vertical second groove respectively. The linear actuator is limited in both the horizontal and vertical directions, which greatly improves the stability of the linear actuator movement and thus improves the welding accuracy of the welding gun.

[0041] The mounting unit 4 further includes a second sliding frame 30, a sliding seat 31, and suction cups 32. A second threaded rod 33 is provided between the inner walls of the second sliding frame 30. A motor 34 for driving the second threaded rod 33 to rotate is provided on one side of the second sliding frame 30. The sliding seat 31 is fitted onto the second threaded rod 33, and a fixing plate 35 is provided below the sliding seat 31. Several suction cups 32 are installed along the length of the fixing plate 35. A second cylinder 36 is installed on the top of the sliding seat 31, and the movable end of the second cylinder 36 is connected to the fixing plate 35.

[0042] The aforementioned conveyor belt 1 is provided with two belts; the aforementioned conveyor belt 1 is arranged symmetrically about the axis of the encapsulation plate 2.

[0043] The strip 11 and the lower pressure plate 6 are fixedly connected by a connecting frame 37.

[0044] Example 2: A semiconductor packaging device includes: a conveyor belt 1 and a packaging plate 2. A limiting plate 3 is provided on both sides of the conveyor belt 1. The packaging plate 2 for placing QFN chips is located between the two limiting plates 3, and the bottom of the packaging plate 1 is in contact with the conveyor belt 1. The surface of the packaging plate 1 has a plurality of equidistantly distributed packaging areas. A mounting unit 4 is installed in the middle of the conveyor belt 1. A feeding belt 5 is arranged perpendicular to the axis of the conveyor belt 1. The mounting unit 4 is used to transfer the chip on the feeding belt 5 to the packaging plate 2.

[0045] A pressure plate 6 is provided on one side of the mounting unit 4 and above the encapsulation plate 2, and a support plate 7 is provided below the encapsulation plate 2. The pressure plate 6 and the support plate 7 are connected by a first cylinder 8. A welding unit 9 is provided on each side of the pressure plate 6.

[0046] A strip plate 11 with several through holes 10 is provided between the lower pressure plate 6 and the encapsulation plate 2. The lower pressure plate 6 is fixedly connected to the strip plate 11. Several pressure blocks 13 with insert rods 12 on the top are arranged at intervals along the length of the strip plate 11. A roller 14 is rotatably connected to the upper end of the insert rod 12. The through holes 10 are slidably connected to the insert rod 12. A buffer spring 15 is provided between the pressure block 13 and the strip plate 11 and fitted on the outer wall of the insert rod 12.

[0047] The cylinder drives the lower platen, causing the pressure block on the strip to tightly fit the chip with the corresponding packaging area, facilitating subsequent processing. During the fitting process, the insertion rod of the pressure block slides along the through hole. The buffer spring maintains the pressing force of the pressure block on the chip while also buffering the pressing process, avoiding hard contact between the pressure block and the chip that could damage the chip, thus improving chip safety. Multiple chips can also be processed simultaneously, improving production efficiency.

[0048] The strip 11 has bearing seats 17 at both ends for rotating shafts 16 to be rotatably connected, and the axis of the roller 14 is parallel to the axis of the rotating shaft 16. A strip 18 spans across the strip and its two ends are fixedly connected to the corresponding rotating shafts 16. The length direction of the strip 18 is perpendicular to the axis of the rotating shaft 16. A torsion spring 19 is provided on each rotating shaft 16 and between it and the inner wall of the corresponding bearing seat 17. A torque sensor 20 installed on the bearing seat 17 is connected to the rotating shaft 16.

[0049] When the pressure block squeezes the chip, it presses the chip firmly onto the packaging board. The pressure block moves upward relative to the strip, and the insert rod drives the roller to move upward on the strip. Since the strip crosses the roller, the movement of the roller changes the shape of the strip, and the torque sensor determines whether the pressure block has pressed the chip firmly. When the pressure block presses the chip firmly, the strip continues to press down. Under the action of the buffer spring, the downward pressure of the pressure block is buffered, avoiding damage to the chip.

[0050] The welding unit 9 further includes a welding gun 21, a first sliding frame 22, and a linear driver 23. The welding gun 21 is symmetrically arranged on both sides of the lower pressure plate 6, and the output end of the welding gun 21 faces the welding area of ​​the encapsulation plate 2. The linear driver 23 is connected to the welding gun 21 and is used to drive the welding gun 21 to move.

[0051] The aforementioned first sliding frame 22 further includes a fixed rod 24, a first threaded rod 25, and a first limiting rod 26 and a second limiting rod 27 distributed above and below. The first threaded rod 25 is located between the first limiting rod 26, the second limiting rod 27 and the lower pressure plate 6. The fixed rod 24 is located on the side opposite to the lower pressure plate 6 of the first limiting rod 26 and the second limiting rod 27. The first limiting rod 26 is located above the second limiting rod 27, thereby forming a first sliding groove 28 between the second limiting rod 27 and the fixed rod 24, and forming a second sliding groove 29 between the first limiting rod 26 and the second limiting rod 27.

[0052] The linear actuator 23 includes a drive part 231 and a mounting part 232. The drive part 231, which is fitted with the first threaded rod 25, can slide along the second slide groove 29, and the mounting part 232, which is provided with the welding gun 21, can slide along the first slide groove 28.

[0053] Limiting the linear actuator in both horizontal and vertical directions greatly improves the stability of its movement, thereby enhancing the welding accuracy of the welding gun.

[0054] The aforementioned motor 34 is a reversible motor.

[0055] The aforementioned conveyor belt 1 is provided with two belts.

[0056] The strip 11 and the lower pressure plate 6 are fixedly connected by a connecting frame 37.

[0057] The working principle of the semiconductor packaging device of the present invention is as follows: When the packaging board is conveyed by the conveyor belt, the setting of the limiting plate restricts the movement direction of the packaging board, keeping the packaging board moving along a trajectory direction. After the chip is pressed onto the packaging board, since there is a welding gun on both sides of the lower pressure plate, the output ends of the two welding guns point to the side of the chip as the lower pressure plate moves. By controlling the welding guns through the linear driver, the welding between the side of the chip and the packaging board in the same row is finally completed.

[0058] The cylinder drives the lower platen, which makes the pressure block on the strip tightly fit the chip with the corresponding packaging area, facilitating subsequent processing. During the fitting process, the insertion rod of the pressure block slides along the through hole. The buffer spring maintains the pressing force of the pressure block on the chip and also buffers the pressing process, avoiding hard contact between the pressure block and the chip that could damage the chip, thus improving chip safety. Multiple chips can also be processed at the same time, improving production efficiency.

[0059] By detecting the torque of the corresponding rotating shaft using two torque sensors, the positions of the strip and pressure block are adjusted to ensure that the torque of the rotating shafts at both ends of the strip is consistent, thus ensuring that the pressure of each pressure block in contact with the chip is consistent, thereby improving the overall consistency of the processing.

[0060] When the above-mentioned semiconductor packaging device is used, the chip is tightly attached to the corresponding packaging area, which facilitates subsequent processing. During the bonding process, the buffer spring can maintain the pressing force of the pressure block on the chip while also buffering the pressing process, avoiding hard contact between the pressure block and the chip that could damage the chip, thus improving the chip's safety. Furthermore, by adjusting the position of the strip and the pressure block, the torque of the rotating shaft at both ends of the strip is made consistent, ensuring that the pressure of each pressure block on the chip is consistent, thereby improving the consistency of the overall processing.

[0061] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A semiconductor packaging device, comprising: The conveyor belt (1) and the packaging plate (2) are characterized in that: a limiting plate (3) is provided on both sides of the conveyor belt (1), the packaging plate (2) for placing QFN chips is located between the two limiting plates (3), and the bottom of the packaging plate (2) is in contact with the conveyor belt (1). The surface of the packaging plate (2) has several packaging areas distributed at equal intervals. A mounting unit (4) is installed in the middle of the conveyor belt (1), and a feeding belt (5) is arranged perpendicular to the axis of the conveyor belt (1). The mounting unit (4) is used to transfer the chips on the feeding belt (5) to the packaging plate (2). A pressure plate (6) is provided on one side of the mounting unit (4) and above the encapsulation plate (2), and a support plate (7) is provided below the encapsulation plate (2). The pressure plate (6) and the support plate (7) are connected by a first cylinder (8). A welding unit (9) is provided on each side of the pressure plate (6). A strip plate (11) with several through holes (10) is provided between the lower pressure plate (6) and the encapsulation plate (2). The lower pressure plate (6) is fixedly connected to the strip plate (11). Several pressure blocks (13) with insert rods (12) on the top are provided at intervals along the length direction of the strip plate (11). A roller (14) is rotatably connected to the upper end of the insert rod (12). The through holes (10) are slidably connected to the insert rod (12). A buffer spring (15) is provided between the pressure block (13) and the strip plate (11) and fitted on the outer wall of the insert rod (12). The strip (11) has bearing seats (17) at both ends for rotating shafts (16) to be rotatably connected, and the axis of the roller (14) is parallel to the axis of the rotating shaft (16). A strip (18) spans across the strip and its two ends are fixedly connected to the corresponding rotating shafts (16). The length of the strip (18) is perpendicular to the axis of the rotating shaft (16). A torsion spring (19) is provided on each rotating shaft (16) and between it and the inner wall of the corresponding bearing seat (17). A torque sensor (20) installed on the bearing seat (17) is connected to the rotating shaft (16) and is used to detect the torque of the rotating shaft (16).

2. The semiconductor packaging apparatus according to claim 1, characterized in that: The welding unit (9) further includes a welding gun (21), a first sliding frame (22) and a linear driver (23). The welding gun (21) is symmetrically arranged on both sides of the lower pressure plate (6), and the output end of the welding gun (21) is facing the welding area of ​​the encapsulation plate (2). The linear driver (23) is connected to the welding gun (21) and is used to drive the welding gun (21) to move.

3. The semiconductor packaging apparatus according to claim 1, characterized in that: The mounting unit (4) further includes a second sliding frame (30), a sliding seat (31), and a suction cup (32). A second threaded rod (33) is provided between the inner walls of the second sliding frame (30). A motor (34) for driving the second threaded rod (33) to rotate is provided on one side of the second sliding frame (30). The sliding seat (31) is fitted on the second threaded rod (33), and a fixing plate (35) is provided below the sliding seat (31). Several suction cups (32) are installed along the length of the fixing plate (35). A second cylinder (36) is installed on the top of the sliding seat (31), and the movable end of the second cylinder (36) is connected to the fixing plate (35).

4. The semiconductor packaging apparatus according to claim 1, characterized in that: The conveyor belt (1) is provided with two belts.

5. The semiconductor packaging apparatus according to claim 1, characterized in that: The strip (11) and the lower pressure plate (6) are fixedly connected by a connecting frame (37).

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