Horizontal line foreign object backstaining inspection method

Abstract

This invention discloses a method for inspecting horizontal lines for foreign matter contamination, comprising three steps: PCB board fabrication, PCB horizontal line production, and horizontal line inspection. The horizontal line inspection uses a solder resist ink exposure and development method to create a loop-shaped circuit. AOI (Automated Optical Inspection) equipment is used to compare the inspected board with the design drawings for analysis. The ink is resistant to chemical attacks and recyclable. By using a solder resist ink exposure and development method to create a loop-shaped circuit (copper is replaced by ink), and because the ink is resistant to chemical attacks and recyclable, AOI equipment is used to compare the inspected board with the design drawings, replacing manual inspection. If there is a discrepancy with the design drawings, it indicates the presence of foreign matter between the lines on the inspected board, requiring further inspection and maintenance of the horizontal lines. If there is a match with the design drawings, it indicates the absence of foreign matter between the lines on the inspected board.

Description

Technical Field

[0001] This invention belongs to the field of PCB manufacturing technology, specifically relating to a method for inspecting horizontal lines for foreign matter contamination. Background Technology

[0002] In the PCB horizontal line production process, if the rollers are not used thoroughly for a long time, contamination may occur. During production, contaminants may be transferred back onto the PCB circuitry or pads as the rollers rotate. Because the contaminants are small, they cannot be detected by the naked eye and may flow to the next station, causing functional defects.

[0003] The traditional method involves using a copper-free substrate to run a horizontal line after each maintenance. Because the board surface is smooth and flat, contaminants on the rollers in the horizontal line cannot easily adhere to the copper-free substrate, leading to incomplete inspection. Alternatively, a loop-shaped circuit can be used, which can effectively simulate the current method of foreign objects getting stuck between circuits or pads. However, because the horizontal line uses an acidic solution that corrodes copper, the loop-shaped circuit has poor durability, requires periodic test board fabrication, is costly, and the dense circuitry makes it impossible for personnel to detect contaminants visually. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the purpose of this invention is to provide a method for reverse-adhesion inspection of foreign matter along horizontal lines. This method solves the problems of traditional methods where, after each maintenance, a copper-free substrate is used to inspect the horizontal lines. Because the substrate surface is smooth and flat, contaminants on the rollers in the horizontal lines cannot easily adhere to the copper-free substrate, leading to incomplete inspection. Alternatively, a loop-shaped circuit method can effectively simulate the current method of foreign matter stuck between circuits or pads, but because the horizontal lines use acidic chemicals that corrode copper, the loop-shaped circuit method has poor durability, requires periodic test board fabrication, is costly, and suffers from the problem that densely packed circuits cannot be visually detected by personnel.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a method for inspecting horizontal foreign matter by reverse adhesion, comprising the following steps:

[0006] S1: PCB board fabrication: The signal layer, sold layer and Comp layer are placed inside the laminator and pressed together to form the inner layer of the PCB board. Then the inner layer substrate and the outer layer are placed inside the laminator for a second lamination to form the PCB board.

[0007] S2: PCB horizontal line production: Then, drilling equipment is used to drill holes in the PCB board. After drilling, the PCB board is placed inside the electroplating equipment for copper plating. After copper plating, the PCB board is placed inside the etching device to etch horizontal lines in the copper plating area on the PCB board surface.

[0008] S3: Horizontal line inspection: A loop-shaped circuit is created using solder resist ink exposure and development. An AOI inspection device is used to take the inspection board and compare it with the design drawing for analysis.

[0009] Preferably, the ink used in the S3 horizontal line inspection step is resistant to chemical attack and cyclic.

[0010] The advantages of the above technical solution are as follows.

[0011] Preferably, in the S3 horizontal line inspection step, if it is inconsistent with the design drawing, it indicates that there are foreign objects between the lines on the inspection board, and the horizontal line needs to be checked and maintained again. If it is consistent with the design drawing, it indicates that there are no foreign objects between the lines on the inspection board.

[0012] The advantages of the above technical solution are as follows.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] A loop-shaped circuit (copper is replaced by ink) is created by using solder resist ink exposure and development. Since the ink is resistant to chemical attack and can be recycled, AOI inspection equipment is used to take the inspection board and compare it with the design drawing for analysis, replacing manual inspection. If it is inconsistent with the design drawing, it means that there are foreign objects between the lines on the inspection board, and the horizontal line needs to be checked and maintained again. If it is consistent with the design drawing, it means that there are no foreign objects between the lines on the inspection board.

[0015] Attached Invention

[0016] Figure 1 This is a schematic diagram of the design of the present invention. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] like Figure 1 As shown, a method for inspecting horizontal foreign matter by reverse adhesion includes the following steps:

[0019] S1: PCB board fabrication: The signal layer, sold layer and Comp layer are placed inside the laminator and pressed together to form the inner layer of the PCB board. Then the inner layer substrate and the outer layer are placed inside the laminator for a second lamination to form the PCB board.

[0020] S2: PCB horizontal line production: Then, drilling equipment is used to drill holes in the PCB board. After drilling, the PCB board is placed inside the electroplating equipment for copper plating. After copper plating, the PCB board is placed inside the etching device to etch horizontal lines in the copper plating area on the PCB board surface.

[0021] S3: Horizontal line inspection: A loop-shaped circuit is created using solder resist ink exposure and development. AOI inspection equipment is used to take the inspection board and compare it with the design drawing for analysis. The ink is resistant to chemical attack and has cycle resistance. If it is inconsistent with the design drawing, it indicates that there are foreign objects between the lines on the inspection board, and the horizontal line needs to be checked and maintained again. If it is consistent with the design drawing, it indicates that there are no foreign objects between the lines on the inspection board.

[0022] The working principle of the above technical solution is as follows:

[0023] A loop-shaped circuit (copper is replaced by ink) is created by using solder resist ink exposure and development. Since the ink is resistant to chemical attack and can be recycled, AOI inspection equipment is used to take the inspection board and compare it with the design drawing for analysis, replacing manual inspection. If it is inconsistent with the design drawing, it means that there are foreign objects between the lines on the inspection board, and the horizontal line needs to be checked and maintained again. If it is consistent with the design drawing, it means that there are no foreign objects between the lines on the inspection board.

[0024] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A horizontal line foreign matter backstaining inspection method characterized by comprising: Includes the following steps: S1: PCB board manufacturing: The signal layer, sold layer and Comp layer are placed inside the laminator and pressed together to form the inner layer of the PCB board. Then the inner layer substrate and the outer layer are placed inside the laminator for a second lamination to form the PCB board. S2: PCB horizontal line production: Then, drilling equipment is used to drill holes in the PCB board. After drilling, the PCB board is placed inside the electroplating equipment for copper plating. After copper plating, the PCB board is placed inside the etching device for etching in the copper plating area on the PCB board surface. S3: Horizontal line inspection: A loop-shaped circuit is created on the board by using solder resist ink exposure and development to form an inspection board; Make the inspection plate pass through the horizontal line; The inspection board is compared with the design drawing using AOI inspection equipment. If it is inconsistent with the design drawing, it indicates that there are foreign objects between the lines on the inspection board, and the horizontal line needs to be checked and maintained again. If it is consistent with the design drawing, it indicates that there are no foreign objects between the lines on the inspection board.

2. The method for inspecting horizontal foreign matter against contamination according to claim 1, characterized in that: The ink used in the S3 horizontal line inspection step is resistant to chemical attack and cyclic.

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