Display device

Abstract

A display device is provided. The display device includes a lower substrate made of a transparent conductive oxide or an oxide semiconductor; a first inorganic insulating layer provided on the lower substrate; a planarization layer provided on the first inorganic insulating layer; a light emitting element provided on the planarization layer; a sealing substrate provided on the first inorganic insulating layer, the planarization layer, and the light emitting element; a back cover provided on the sealing substrate and having a plurality of opening portions; and a roller portion configured to wind or unwind the back cover, wherein an end portion of the first inorganic insulating layer is inwardly provided from an end portion of the sealing substrate.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2021-0134344, filed with the Korean Intellectual Property Office on October 8, 2021, the disclosure of which is incorporated herein by reference. Technical Field

[0003] This disclosure relates to display devices, and more specifically, to rollable display devices that can display images even when the display device is rolled up. Background Technology

[0004] As display devices used as monitors for computers, televisions, mobile phones, etc., there are organic light-emitting displays (OLEDs) that are configured to emit their own light, and liquid crystal displays (LCDs) that require a separate light source.

[0005] The applications of display devices range from computer and television monitors to personal mobile devices, and research is underway on display devices with wide display areas and reduced size and weight.

[0006] In addition, flexible display devices have recently attracted much attention as the next generation of display devices. Flexible display devices are made by forming display elements, lines, etc. on a substrate made of flexible plastic material, and therefore can display images even when folded or rolled up. Summary of the Invention

[0007] The purpose of this disclosure is to provide a rollable display device that uses a substrate including a transparent conductive oxide layer or an oxide semiconductor layer instead of a plastic substrate.

[0008] Another objective of this disclosure is to provide a rollable display device that uses a flexible substrate that minimizes cracking by mitigating stress generated during rolling.

[0009] Another objective of this disclosure is to provide a display device that can reduce operational defects by suppressing back cover expansion.

[0010] The purpose of this disclosure is not limited to the purposes mentioned above, and other purposes not mentioned above will be clearly understood by those skilled in the art from the following description.

[0011] According to one aspect of this disclosure, a display device is provided. The display device includes: a lower substrate made of a transparent conductive oxide or oxide semiconductor; a first inorganic insulating layer disposed on the lower substrate; a planarization layer disposed on the first inorganic insulating layer; a light-emitting element disposed on the planarization layer; a sealing substrate disposed on the first inorganic insulating layer, the planarization layer, and the light-emitting element; a rear cover disposed on the sealing substrate and having a plurality of openings; and a roller portion configured to wind or unwind the rear cover, wherein the end of the first inorganic insulating layer extends inwardly from the end of the sealing substrate.

[0012] According to another aspect of this disclosure, a display device is provided. The display device includes: a display panel including a functional thin film layer, an inorganic insulating layer, a planarization layer, a light-emitting element, and a sealing substrate, the display panel being divided into a display area and a non-display area; a rear cover disposed on the rear surface of the display panel, configured to support the display panel, and having a plurality of holes; and a sealing member disposed around a side surface of the display panel, wherein the functional thin film layer is made of a transparent conductive oxide or oxide semiconductor, and the inorganic insulating layer includes a first inorganic insulating layer having an end disposed inwardly from an end of the sealing substrate.

[0013] Further details of the exemplary embodiments are included in the detailed embodiments and the accompanying drawings.

[0014] According to this disclosure, the flexibility of a display device can be improved by using a transparent conductive oxide layer or a thin-film oxide semiconductor layer as the substrate of the display device.

[0015] According to this disclosure, operational defects can be reduced by adjusting the position of multiple openings in the back cover to suppress its expansion.

[0016] According to this disclosure, cracking can be suppressed by changing the arrangement of the inorganic insulating layer in the peripheral area of ​​the display panel.

[0017] According to this disclosure, the inorganic insulating layer in the peripheral area of ​​the display panel is disconnected, and the disconnected area is filled with an organic insulating layer. Therefore, the propagation of cracks generated in the inorganic insulating layer located at the periphery into the display panel can be suppressed.

[0018] The effects of this disclosure are not limited to those illustrated above, and include a variety of other effects as described in this specification. Attached Figure Description

[0019] The above and other aspects, features and advantages of this disclosure will become more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0020] Figure 1 and Figure 2 This is a perspective view of a display device according to an embodiment of the present disclosure;

[0021] Figure 3 This is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure;

[0022] Figure 4 This is a top plan view of the display section of a display device according to an embodiment of the present disclosure;

[0023] Figure 5 This is a top plan view of the rear cover of a display device according to an embodiment of the present disclosure;

[0024] Figure 6 It is along Figure 4 A cross-sectional view taken by line A-A' in the diagram;

[0025] Figure 7 This is a cross-sectional view of a display device according to another embodiment of the present disclosure;

[0026] Figure 8 This is a cross-sectional view of a display device according to yet another embodiment of the present disclosure;

[0027] Figure 9 This is a cross-sectional view of a display device according to yet another embodiment of the present disclosure;

[0028] Figure 10 This is a cross-sectional view of a display device according to yet another embodiment of the present disclosure;

[0029] Figure 11 This is a cross-sectional view of a display device according to other embodiments of the present disclosure;

[0030] Figure 12 This is a cross-sectional view of a display device according to another embodiment of the present disclosure;

[0031] Figure 13 This is a cross-sectional view of a display device according to yet another embodiment of the present disclosure; and

[0032] Figure 14 This is a cross-sectional view of a display device according to yet another embodiment of the present disclosure. Detailed Implementation

[0033] The advantages and features of this disclosure, as well as methods for achieving these advantages and features, will become clear from the exemplary embodiments described in detail below with reference to the accompanying drawings. However, this disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided by way of example only so that those skilled in the art can fully understand the disclosure and scope of this disclosure. Therefore, this disclosure is limited only by the scope of the appended claims.

[0034] The shapes, dimensions, scales, angles, quantities, etc., shown in the accompanying drawings used to describe exemplary embodiments of this disclosure are merely examples, and this disclosure is not limited thereto. Throughout the specification, the same reference numerals generally denote the same elements. Furthermore, in the following description of this disclosure, detailed descriptions of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of this disclosure. Terms such as “comprising,” “having,” and “consisting of” as used herein are generally intended to allow for the addition of additional components, unless these terms are used in conjunction with the term “only.” Unless otherwise expressly stated, any reference to the singular may include the plural.

[0035] Even without explicit statement, components are interpreted as including a normal tolerance range.

[0036] When using terms such as “on top of,” “above,” “below,” and “beside” to describe the positional relationship between two parts, one or more parts may be located between the two parts unless these terms are used with the terms “immediately following” or “directly.”

[0037] When an element or layer is placed "on" another element or layer, the other layer or element can be directly inserted onto the other element or inserted between the element or layer and the other element or layer.

[0038] Although the terms "first," "second," etc., are used to describe individual components, these components are not limited by these terms. These terms are merely used to distinguish one component from others. Therefore, the first component mentioned below may be a second component in the technical concept of this disclosure.

[0039] Throughout the specification, the same reference numerals generally denote the same elements.

[0040] For ease of description, the dimensions and thickness of each component shown in the accompanying drawings are illustrated, but this disclosure is not limited to the dimensions and thickness of the components shown.

[0041] Features of various embodiments of this disclosure may be attached or combined with each other in part or in whole and may be interlocked and operated in technically different ways, and the embodiments may be implemented independently of each other or in relation to each other.

[0042] In the following, a display device according to an exemplary embodiment of the present disclosure will be described in detail with reference to the accompanying drawings.

[0043] <Display Devices - Roll-up Display Devices>

[0044] A rollable display device refers to a display device that can display images even when it is rolled up. Compared to general display devices in related technologies, rollable display devices offer greater flexibility. The shape of a rollable display device can be freely changed depending on whether it is used. Specifically, when not in use, the rollable display device can be rolled up and stored in a reduced volume. Conversely, when in use, the rolled-up device can be unfolded and reused.

[0045] Figure 1 and Figure 2 This is a perspective view of a display device according to an embodiment of the present disclosure. Figure 3 This is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure. Figure 3 This is a schematic cross-sectional view illustrating the roller 161 and display section DP of the display device 100 according to an embodiment of the present disclosure. For ease of description, Figure 3 Only the housing HP, roller 161, and display DP are shown. (See reference) Figure 1 and Figure 2 According to an embodiment of the present disclosure, the display device 100 includes a display unit DP and a housing unit HP.

[0046] The display unit DP is configured to display an image to a user. For example, display elements, as well as circuitry, wiring, and components for operating the display elements, can be provided on the display unit DP. In this case, since the display device 100 according to the embodiment of this disclosure is a rollable display device, the display unit DP can be configured to be rolled up or unfolded. For example, the display unit DP may include a display panel and a back cover that are flexible enough to be rolled up or unfolded. Reference will be made below. Figures 4 to 6 A more detailed description of the display unit (DP).

[0047] The housing HP is a casing capable of accommodating the display unit DP. The housing HP may have an opening HPO through which the display unit DP can be moved to the outside or inside of the housing HP.

[0048] At the same time, the display unit DP of the display device 100 can switch from a fully unfolded state to a fully rolled-up state, or from a fully rolled-up state to a fully unfolded state.

[0049] The drive unit is configured to wind or unwind the display unit DP to switch the display unit DP to a fully unwinding state or a fully wound state. The drive unit may include a roller section and a lifting section, and uses a motor, linkage structure, etc. to wind or unwind the display unit DP around the roller 161.

[0050] Specifically, refer to Figure 3 Roller 161 can generally have a cylindrical shape. However, this disclosure is not limited thereto. Roller 161 can have any shape, as long as the display unit DP can be wound around roller 161.

[0051] Simultaneously, the display unit DP can be connected to the roller 161. For example, the rear cover of the components of the display unit DP, which will be described below, can be fastened to the roller 161, allowing the display unit DP to be wound around or unwound from the roller 161 depending on the rotation of the roller 161. In this case, during the winding of the display unit DP around the roller 161, the surface of the display unit DP displaying the image faces the roller 161. Therefore, in the display unit DP, the visual direction can be... Figure 3 direction shown.

[0052] To wind the display unit DP, roller 161 can rotate and the display unit DP can be wound around roller 161. For example, see reference... Figure 3 When the roller 161 rotates along the first direction DR1, i.e. clockwise, the display part DP can be wound up, so that the rear surface of the display part DP is in close contact with the surface of the roller 161.

[0053] To unfold the display unit DP, roller 161 can rotate, and the display unit DP can be unfolded from roller 161. (See reference...) Figure 3 For example, when the roller 161 rotates in the second direction DR2, i.e. counterclockwise, the display part DP that is wound around the roller 161 can be unfolded from the roller 161 and disposed outside the housing part HP.

[0054] Figure 4 This is a top plan view of the display section of a display device according to an embodiment of the present disclosure. Figure 5 This is a top plan view of the rear cover of a display device according to an embodiment of the present disclosure, and Figure 6 It is along Figure 4 The cross-sectional view taken by line A-A' in the diagram.

[0055] Reference Figures 4 to 6 The display unit DP may include a back cover 110, a display panel 120, a flexible film 130, and a printed circuit board 135.

[0056] Display panel 120 is a panel configured to display images to a user. Display panel 120 may include display elements configured to display images, driving elements configured to operate the display elements, and lines configured to transmit various types of signals to the display elements and driving elements.

[0057] Depending on the type of display panel 120, the display elements can have different configurations. For example, if the display panel 120 is an organic light-emitting display panel 120, the display element can be an organic light-emitting element comprising an anode, an organic light-emitting layer, and a cathode. For example, if the display panel 120 is a liquid crystal display panel 120, the display element can be a liquid crystal display element. Hereinafter, it is assumed that the display panel 120 is an organic light-emitting display panel 120. However, the display panel 120 is not limited to an organic light-emitting display panel 120. Furthermore, since the display device 100 according to the embodiments of this disclosure is a rollable display device, the display panel 120 can be implemented as a flexible display panel 120, which can be rolled around or unfolded from the roller 161.

[0058] The display panel 120 according to an embodiment of the present disclosure includes a display area AA and a non-display area NA. For convenience, the non-display area NA can be defined as the area other than the display area AA. The display area AA can be located at the center of the display panel 120. The display area AA can be the area of ​​the flexible display device 100 in which an image is displayed.

[0059] Various display elements and driving elements for operating the display elements can be disposed in the display area AA. For example, the display element can be configured as a light-emitting element EM including an anode AN, an organic light-emitting layer EL, and a cathode CA. In addition, various driving elements configured to operate the display element, such as transistors TR, capacitors, lines, etc., can be disposed in the display area AA.

[0060] Meanwhile, the display panel 120 can be a top-emitting display panel or a bottom-emitting display panel, depending on the direction in which light is emitted from the light-emitting element EM.

[0061] The top-emitting display panel allows light emitted from the light-emitting element EM to propagate toward the upper side of the lower substrate 121 on which the light-emitting element EM is disposed. The top-emitting display panel may have a reflective layer formed on the lower part of the anode AN to allow light emitted from the light-emitting element EM to propagate toward the upper side of the lower substrate 121, i.e. toward the cathode CA.

[0062] Bottom-emitting display panels allow light emitted from the light-emitting element EM to propagate toward the underside of the lower substrate 121 on which the light-emitting element EM is disposed. In the case of a bottom-emitting display panel, the anode AN can be made of only a transparent conductive material, and the cathode CA can be made of a metallic material with high reflectivity, so as to allow light emitted from the light-emitting element to propagate toward the underside of the lower substrate 121.

[0063] In the following description, for ease of description, the display device 100 according to the embodiments of the present disclosure will be described as a bottom-emitting type display device 100. However, the present disclosure is not limited thereto.

[0064] The non-display area NA can be an area located at the edge of the display panel 120. The non-display area NA can be an area where no image is displayed. The non-display area NA can be configured to surround the display area AA. Various constituent elements for operating multiple sub-pixels disposed in the display area AA can be disposed in the non-display area NA. For example, a driver IC, driver circuit, signal line, flexible film 130, etc., configured to supply signals for operating multiple sub-pixels can be disposed there.

[0065] As described above, one or more flexible films 130 may be disposed in the non-display area NA. The one or more flexible films 130 are films having various types of components, such as driving ICs, disposed on a base film with ductility, to supply signals to multiple sub-pixels and driving circuitry in the display area AA. The one or more flexible films 130 may be electrically connected to the display panel 120.

[0066] One or more flexible films 130 are disposed at one end of the non-display area NA of the display panel 120 and can supply power voltage, data voltage, etc. to multiple sub-pixels and driving circuits in the display area AA.

[0067] Driver ICs, such as gate driver ICs and data driver ICs, can be disposed on one or more flexible films 130. The driver IC is a component configured to process data for displaying images and to process drive signals for processing that data. Depending on how the driver IC is mounted, it can be disposed in a manner such as chip-on-glass (COG), chip-on-film (COF), and tape-on-package (TCP). However, for ease of description, a configuration in which the driver IC is mounted on one or more flexible films 130 via a chip-on-film method has been described. However, this disclosure is not limited thereto.

[0068] Printed circuit board 135 can be disposed on the rear surface of rear cover 110 and connected to one or more flexible films 130. Printed circuit board 135 is a component for supplying signals to driver IC. Various types of components for supplying various signals such as drive signals, data signals, etc. to driver IC can be disposed on printed circuit board 135.

[0069] Additionally, an auxiliary printed circuit board (PCB) connected to the PCB 135 may also be provided. For example, the PCB 135 may be referred to as a source PCB (S-PCB) on which data driving components are mounted. The auxiliary PCB connected to the PCB 135 may be referred to as a control PCB (C-PCB) on which a timing controller or the like is mounted. For example, the auxiliary PCB may be provided in the roller 161, on the housing portion HP outside the roller 161, or in direct contact with the PCB 135.

[0070] Reference Figure 4 and Figure 5 The rear cover 110 can be disposed on the rear surface of the display panel 120 and support the display panel 120, one or more flexible films 130, and printed circuit boards 135. The size of the rear cover 110 can be larger than the size of the display panel 120. The rear cover 110 can protect other components of the display unit DP from external influences.

[0071] The back cover 110 may be made of a rigid material. At least a portion of the back cover 110 may be flexible to be rolled or unfolded together with the display panel 120. For example, the back cover 110 may be made of a metallic material such as stainless steel (SUS) or Invar, or a plastic material. However, the material of the back cover 110 may be varied according to the design, as long as the material of the back cover 110 meets physical properties such as thermal deformation, radius of curvature, and stiffness. However, this disclosure is not limited thereto.

[0072] The rear cover 110 includes multiple support areas PA and extension areas MA. The multiple support areas PA are regions in which multiple openings 111 are not provided. The extension areas MA are regions in which multiple openings 111 are provided. The extension areas MA can be referred to as the central region overlapping with the display panel 120. Specifically, the first support area PA1, the extension areas MA, and the second support area PA2 can be sequentially arranged from the uppermost end of the rear cover 110. However, this disclosure is not limited thereto. In this case, because the rear cover 110 is rolled or unfolded along the column direction, the multiple support areas PA and the extension areas MA can be arranged along the column direction.

[0073] The first support area PA1 is the uppermost area of ​​the rear cover 110, i.e., the area fastened to the head rod. A first fastening hole AH1 can be formed in the first support area PA1, such that the first support area PA1 is fastened to the head rod. For example, the first support area PA1 of the rear cover 110 can be fastened to the head rod by means of a screw passing through the head rod and the first fastening hole AH1. Furthermore, because the first support area PA1 is fastened to the head rod, when the head rod moves up or down, the rear cover 110 can also move up or down, and the display panel 120 attached to the rear cover 110 can also move up or down. Figure 4 Five first fastening holes AH1 are shown. However, the number of first fastening holes AH1 is not limited to this. Additionally, reference has been made to... Figure 4 A configuration is described in which the rear cover 110 is fastened to the head rod using a first fastening hole AH1. However, this disclosure is not limited thereto. The rear cover 110 and the head rod can be fastened to each other without separate fastening holes.

[0074] Additionally, one or more flexible films 130 and printed circuit boards 135 connected to one end of the display panel 120 may be disposed in a first support region PA1. The first support region PA1 may support the printed circuit boards 135 to protect them and allow them to remain flat and not bend as the roller 161 rotates.

[0075] The extension region MA extends from the first support region PA1 to the lower side of the rear cover 110. The extension region MA is the area where multiple openings 111 can be provided and the display panel 120 is attached thereto. Specifically, the extension region MA is the area that is wound around or unfolded from the roller 161 together with the display panel 120. The extension region MA may overlap with at least the display panel 120 of other components of the display section DP.

[0076] Additionally, the second support region PA2 extends from the extension region MA toward the lower side of the rear cover 110. The second support region PA2 is the lowermost region of the rear cover 110, i.e., the region fastened to the roller 161. A second fastening hole AH2 can be formed in the second support region PA2, such that the second support region PA2 is fastened to the roller 161. For example, a screw is provided to pass through the roller 161 and the second fastening hole AH2, such that the roller 161 and the second support region PA2 of the rear cover 110 can be fastened to each other. Furthermore, since the second support region PA2 is fastened to the roller 161, the rear cover 110 can be wound around or unfolded from the roller 161. Figure 4 Two second fastening holes AH2 are shown. However, the number of second fastening holes AH2 is not limited to this.

[0077] Meanwhile, the multiple openings 111 formed in the extended region MA are not formed in the first support region PA1 and the second support region PA2. Specifically, the first fastening hole AH1 is formed in the first support region PA1, and the second fastening hole AH2 is formed in the second support region PA2. However, the multiple openings 111 formed in the extended region MA are not formed in the first support region PA1 and the second support region PA2. The shapes of the first fastening hole AH1 and the second fastening hole AH2 are different from those of the multiple openings 111. The first support region PA1 is the region fixed to the head rod, that is, the region supporting one or more flexible films 130 and printed circuit boards 135. The second support region PA2 is the region fixed to the roller 161 and may have higher rigidity than the extended region MA.

[0078] At the same time, for example, Figure 4 The rear cover 110 is shown to have multiple support areas PA and extension areas MA arranged sequentially along the column direction. However, when the rear cover 110 is wound along the row direction, the multiple support areas PA and extension areas MA can be arranged along the row direction.

[0079] The plurality of openings 111 provided in the extension region MA of the back cover 110 may deform due to the stress applied to the display unit DP when it is rolled up or unrolled. Specifically, the extension region MA of the back cover 110 may deform as the plurality of openings 111 contract or expand when the display unit DP is rolled up or unrolled. Furthermore, because the plurality of openings 111 contract or expand, the sliding of the display panel 120 provided in the extension region MA of the back cover 110 is minimized, thereby minimizing the stress applied to the display panel 120.

[0080] Reference Figure 6 The display panel 120 includes a lower substrate 121, a buffer layer 122, a transistor TR, a gate insulating layer 123, a passivation layer 124, a planarization layer 125, a light-emitting element EM, a first bonding layer AD1, a sealing substrate 128, and a sealing member 150.

[0081] First, the display panel 120 includes a display area AA and a non-display area NA. The non-display area NA includes a first non-display area NA1, a second non-display area NA2, and a third non-display area NA3.

[0082] The first non-display area NA1 is the area extending from the display area AA. The planarization layer 125 extending from the display area AA can be disposed in the first non-display area NA1.

[0083] The second non-display area NA2 is an area extending from the first non-display area NA1. The second non-display area NA2 may be an area in which the planarization layer 125 is not disposed. The second non-display area NA2 may be the area between the end of the planarization layer 125 and the end of the sealing substrate 128. Although in Figure 6 Not shown, but when the second non-display area NA2 is located in the left and right edge regions of the display panel 120, the gate driving portion or line portion for operating the light-emitting element EM in the display area AA can be provided in the second non-display area NA2.

[0084] The third non-display area NA3 extends from the second non-display area NA2. The third non-display area NA3 can be the outermost region of the display panel 120. The third non-display area NA3 is a region located on the periphery starting from the end of the sealing substrate 128. The third non-display area NA3 can be a region where a sealing member 150 is provided but no planarization layer 125 is provided. Additionally, multiple pads PE can be provided in the third non-display area NA3 and receive signals from the printed circuit board 135 and multiple flexible films 130.

[0085] Next, the lower substrate 121 may serve as a base member for supporting various components of the display panel 120. The lower substrate 121 may be made of a flexible material, allowing the display panel 120 to be rolled or unfolded. For example, the lower substrate 121 may be made of any of transparent conductive oxides and oxide semiconductors. For example, the lower substrate 121 may be made of transparent conductive oxides (TCOs) such as indium tin oxide (ITO), indium zinc oxide (IZO), and indium tin zinc oxide (ITZO). Alternatively, the lower substrate 121 may be made of oxide semiconductor materials containing indium (In), gallium (Ga), and zinc (Zn), such as indium gallium zinc oxide (IGZO), indium gallium oxide (IGO), and indium tin zinc oxide (ITZO). However, the materials and types of transparent conductive oxides and oxide semiconductors are provided exemplary. The lower substrate 121 may be made of other transparent conductive oxides and oxide semiconductor materials not disclosed in this specification. However, this disclosure is not limited thereto.

[0086] That is, the lower substrate 121 can be formed by depositing a transparent conductive oxide or oxide semiconductor with a very small thickness. Therefore, the lower substrate 121 can be flexible because it has a very small thickness. Furthermore, the display device 100 including the flexible lower substrate 121 can be implemented as a flexible display device 100 that can display images even when the display device 100 is folded or rolled up. For example, in the case where the display device 100 is a rollable display device, the display device 100 can be rolled up around the roller 161 and stored. Therefore, the display device 100 according to this disclosure can be implemented as a flexible display device 100, such as a foldable display device or a rollable display device, by using the flexible lower substrate 121.

[0087] A buffer layer 122 is disposed on the top surface of the lower substrate 121. The buffer layer 122 can suppress the diffusion of moisture and / or oxygen that permeates from the outside of the lower substrate 121. The buffer layer 122 can be made of an inorganic material. For example, the buffer layer 122 can be configured as a single layer or multiple layers made of silicon oxide (SiOx) or silicon nitride (SiNx). However, this disclosure is not limited thereto.

[0088] The pixel portion is disposed on the top surface of the lower substrate 121 and the top surface of the buffer layer 122. The pixel portion includes a driving element for operating multiple light-emitting elements EM and the light-emitting elements EM. The pixel portion can be configured to correspond to the display area AA.

[0089] Next, refer to Figure 6 Multiple transistors TR are disposed on the buffer layer 122 and in the display area AA. The multiple transistors TR can be disposed in multiple sub-pixels within the display area AA. The multiple transistors TR disposed in the multiple sub-pixels can serve as driving elements of the display device 100. For example, the transistors TR can be thin-film transistors (TFTs). However, this disclosure is not limited thereto. In the following, it is assumed that the multiple transistors TR are thin-film transistors. However, this disclosure is not limited thereto.

[0090] A transistor TR consists of a gate electrode GE, an active layer AC, a source electrode SE, and a drain electrode DE.

[0091] The gate electrode GE of the transistor TR is disposed on the buffer layer 122. The gate electrode GE may be made of a conductive material such as copper (Cu), aluminum (Al), molybdenum (Mo), titanium (Ti), or an alloy thereof. However, this disclosure is not limited thereto.

[0092] A gate insulating layer 123 is disposed on the gate electrode GE. In this case, the gate insulating layer 123 is disposed throughout the entire display area AA and the entire non-display area NA. The gate insulating layer 123 is a layer used to insulate the gate electrode GE from the active layer AC. The gate insulating layer 123 can be made of an inorganic material. For example, the gate insulating layer 123 can be configured as a single layer or multiple layers made of silicon oxide (SiOx) or silicon nitride (SiNx). However, this disclosure is not limited thereto.

[0093] An active layer AC is disposed on the gate insulating layer 123. For example, the active layer AC may be made of oxide semiconductor, amorphous silicon, or polycrystalline silicon. However, this disclosure is not limited thereto.

[0094] The source electrode SE and drain electrode DE are spaced apart from each other and disposed on the active layer AC. The source electrode SE and drain electrode DE can be electrically connected to the active layer AC. The source electrode SE and drain electrode DE can each be made of a conductive material such as copper (Cu), aluminum (Al), molybdenum (Mo), titanium (Ti), or alloys thereof. However, this disclosure is not limited thereto.

[0095] A passivation layer 124 is disposed on the transistor TR. The passivation layer 124 can be disposed throughout the entire display area AA and the entire non-display area NA. The passivation layer 124 is an insulating layer used to protect components disposed beneath it. The passivation layer 124 can be made of an inorganic material. For example, the passivation layer 124 can be configured as a single layer or multiple layers made of silicon oxide (SiOx) or silicon nitride (SiNx). However, this disclosure is not limited thereto. Furthermore, the passivation layer 124 can be removed according to the design.

[0096] A planarization layer 125 is disposed on the passivation layer 124. The planarization layer 125 can planarize the upper portion of the lower substrate 121 including the transistor TR. The planarization layer 125 is disposed in a portion of the non-display area NA and the entire display area AA. Specifically, the planarization layer 125 may be disposed in the display area AA and the first non-display area NA1, but not in the second non-display area NA2 and the third non-display area NA3. The planarization layer 125 is made of an organic material. For example, the planarization layer 125 may be configured as a single layer or multiple layers made of an acrylic organic material. However, the present disclosure is not limited thereto.

[0097] The first bonding layer AD1 can surround the side and top surfaces of the planarization layer 125. Specifically, because the planarization layer 125 is made of organic material, it is susceptible to moisture. If the planarization layer 125, like the buffer layer 122, gate insulating layer 123, and passivation layer 124, is disposed in the entire display area AA and the entire non-display area NA, and the side surfaces of the planarization layer 125 are not surrounded by the first bonding layer AD1, moisture that has penetrated into the side surfaces of the planarization layer 125 can be transported to the display area AA, which may degrade the light-emitting element EM. Therefore, the planarization layer 125 is disposed only in the first non-display area NA1, and the first bonding layer AD1 is disposed to surround the planarization layer 125. Thus, moisture penetration caused by the planarization layer 125 can be minimized, and the reliability of the display device 100 can be improved.

[0098] The buffer layer 122, gate insulating layer 123, and passivation layer 124 can be referred to as the first inorganic insulating layer IL1. The buffer layer 122, gate insulating layer 123, and passivation layer 124 can be configured to extend not only to the display area AA, but also to a portion of the second non-display area NA2 and the entire first non-display area NA1. The ends of the first inorganic insulating layer IL1 can be disposed outward from the end of the planarization layer 125 and inward from the end of the sealing substrate 128. Therefore, the ends of the first inorganic insulating layer IL1 can be surrounded by the first bonding layer AD1.

[0099] The light-emitting element EM is disposed on the planarization layer 125. The light-emitting element EM is a self-emissive element that emits light. The light-emitting element EM can be disposed in multiple sub-pixels and operated by multiple transistors TR. The light-emitting element EM may include an anode AN, an organic light-emitting layer EL, and a cathode CA.

[0100] The anode AN can supply positive holes to the organic light-emitting layer EL and is made of a conductive material with a high work function. For example, the anode AN can be made of tin oxide (TO), indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), etc. However, this disclosure is not limited thereto.

[0101] A dam 126 is disposed on the anode AN. The dam 126 is configured to overlap with the display area AA and cover the edge of the anode AN. The dam 126 may be disposed at the boundary between adjacent sub-pixels and reduce color mixing of the light beams emitted from the light-emitting elements EM of each of the multiple sub-pixels. The dam 126 may be made of an insulating material. For example, the dam 126 may be made of a polyimide-based resin, an acrylic-based resin, or a benzocyclobutene (BCB)-based resin. However, this disclosure is not limited thereto.

[0102] An organic light-emitting layer (EL) is disposed on the anode AN exposed from the embankment 126. The EL emits light by receiving positive holes from the anode AN and electrons from the cathode CA. The EL can be a red, green, blue, or white EL, depending on the color of the light emitted from it. In this case, when the EL is a white EL, color filters for various colors can be attached.

[0103] A cathode CA is disposed on the organic light-emitting layer EL and the embankment 126. The cathode CA may be disposed on at least the entire surface of the display area AA. The cathode CA may supply electrons to the organic light-emitting layer EL and is made of a conductive material having a low work function. For example, the cathode CA may be made of one or more materials selected from the group consisting of metals such as magnesium (Mg), silver (Ag), and aluminum (Al) and their alloys. However, this disclosure is not limited thereto. Furthermore, since the display device 100 is a bottom-emitting type display device, the cathode CA can reflect light emitted from the organic light-emitting layer EL to the lower substrate 121.

[0104] Furthermore, although not shown in the accompanying drawings, a sealing layer may be disposed within the entire display area AA, a portion of the entire first non-display area NA1, and a portion of the second non-display area NA2 to cover multiple light-emitting elements EM. Specifically, the sealing layer may be configured to surround the side surface of the planarization layer 125 and minimize moisture penetration through the planarization layer 125. The sealing layer can be formed by alternately stacking multiple inorganic layers and multiple organic layers. For example, the inorganic layers may be made of inorganic materials such as silicon nitride (SiNx), silicon oxide (SiOx), or aluminum oxide (AlOx). The organic layers may be made of epoxy polymers or acrylic polymers. However, this disclosure is not limited thereto.

[0105] A sealing substrate 128 can be disposed on a sealing layer. The sealing substrate 128 can be disposed in the entire display area AA, the entire first non-display area NA1, and the entire second non-display area NA2. Therefore, one end of the sealing substrate 128 can overlap with the boundary between the second non-display area NA2 and the third non-display area NA3.

[0106] For attachment to the sealing substrate 128, a first bonding layer AD1 is disposed in the display area AA, the first non-display area NA1, and the second non-display area NA2. The top surface of the first bonding layer AD1 can be configured to contact the rear surface of the sealing substrate 128. The first bonding layer AD1 can be disposed around the side surface of the planarization layer 125 and in the peripheral region of the first inorganic insulating layer IL1 to contact the lower substrate 121. Therefore, moisture penetration into the display area AA can be minimized.

[0107] A sealing member 150 is disposed on the third non-display area NA3. The sealing member 150 is configured to contact the top surface of the lower substrate 121 disposed in the third non-display area NA3 and the side surface of the first bonding layer AD1 and the side surface of the sealing substrate 128. In this case, the sealing member 150 may be configured to cover the edges of the top and bottom surfaces of the sealing substrate 128.

[0108] The sealing member 150 minimizes moisture penetration through the lateral portion of the display panel 120. Specifically, the sealing member 150 is configured to contact the side surface of the first bonding layer AD1, the side surface of the sealing substrate 128, and the top surface of the lower substrate 121. The sealing member 150 may be configured to cover the side surface of the display panel 120 and has an annular shape corresponding to the shape of the display panel 120 in a plan view. However, this disclosure is not limited thereto. For example, the sealing member 150 may be made of a curable material having a modulus value of 50 MPa to 200 MPa. Furthermore, for example, the sealing member 150 may be made of a curable material based on acrylic, urethane, or silicon. However, this disclosure is not limited thereto.

[0109] Additionally, refer to Figure 6 The back cover 110 can be attached to the sealing substrate 128. The back cover 110 can be attached to the display panel 120 by means of a second bonding layer AD2. The second bonding layer AD2 can be positioned inward from one end of the sealing substrate 128. The second bonding layer AD2 can be made of an adhesive material. The second bonding layer AD2 can be a thermosetting or naturally curable adhesive. For example, the second bonding layer AD2 can be an optically clear adhesive (OCA), a pressure-sensitive adhesive (PSA), etc. However, this disclosure is not limited thereto.

[0110] The accompanying drawings show that the plurality of openings 111 of the rear cover 110 are not filled with the second bonding layer AD2. However, some or all of the plurality of openings 111 of the rear cover 110 may be filled with the second bonding layer AD2. When the interior of the plurality of openings 111 of the rear cover 110 is filled with the second bonding layer AD2, the contact area between the second bonding layer AD2 and the rear cover 110 is increased, thereby preventing separation of the second bonding layer AD2 from the rear cover 110.

[0111] The boundary between the extended region MA of the rear cover 110 and the second support region PA2 can overlap with the sealing substrate 128. Specifically, refer to... Figure 6The boundary between the extended region MA of the back cover 110 and the second support region PA2 can overlap with the end of the sealing substrate 128. Therefore, all the plurality of openings 111 provided in the extended region MA adjacent to the second support region PA2 overlap with the sealing substrate 128 but are not provided outside the sealing substrate 128. That is, the extended region MA of the back cover 110 only overlaps with the first non-display region NA1 and the second non-display region NA2 of the non-display region NA, but not with the third non-display region NA3.

[0112] In related technologies, the substrate of a rollable display device is made of a flexible material, allowing the display panel to be rolled up or unrolled. For example, the substrate can be made of a plastic material such as polyimide (PI). When the substrate is made of a plastic material such as polyimide (PI), it is manufactured by coating the substrate with a suitable material. When the substrate is manufactured using the process of applying the plastic material as described above, the substrate has a sufficiently large thickness. Therefore, a substrate made of a material such as polyimide (PI) can suppress the expansion of the extended area of ​​the back cover, particularly the extended area of ​​the back cover adjacent to the boundary between the extended area and the support area, during repeated rolling and unrolling processes.

[0113] However, various problems arise when using substrates made of plastic materials such as polyimide (PI) as substrates for rollable display devices. For example, because substrates made of plastic materials are formed by applying and curing the substrate material at high temperatures, there are issues with the time required and the difficulty in reducing the thickness to a predetermined level or lower. Therefore, the stress generated during winding and unwinding may increase due to the thicker substrate. Furthermore, compared to substrates in related technologies such as glass substrates, plastic substrates increase the likelihood of static electricity. Static electricity can affect various types of lines and drive elements on the plastic substrate, potentially damaging some components or reducing the display quality of the display device. Additionally, particles may be generated during the formation of the plastic substrate. For example, particles can appear during the application and curing of the substrate material to form the plastic substrate. Moreover, due to the particles, moisture and oxygen can more easily penetrate into the display device. Furthermore, due to the particles, some components may form unevenly on the substrate.

[0114] Therefore, the lower substrate 121 of the display device 100 according to the embodiments of this disclosure is made of either a transparent conductive oxide or an oxide semiconductor. Therefore, the thickness of the display device 100 can be reduced, and the flexibility of the display device 100 can be increased. Therefore, the stress applied during the repeated winding and unfolding of the display device 100 can be reduced. Furthermore, because the lower substrate 121 is made of either a transparent conductive oxide or an oxide semiconductor, the generation of static electricity on the lower substrate 121 can be minimized, and damage or degradation of display quality caused by static electricity can be minimized. Moreover, when the lower substrate 121 is made of a transparent conductive oxide layer or an oxide semiconductor, the lower substrate 121 is formed in a vacuum environment, making the possibility of particle formation significantly low, and even if particles are generated, the particle size is very small. Therefore, the penetration of moisture and oxygen into the display device 100 can be minimized, and the reliability of the display device 100 can be improved. Furthermore, since the lower substrate 121 is made of a transparent conductive oxide layer or an oxide semiconductor that can withstand laser lift-off (LLO) processing, LLO processing can be easily performed on the display device 100 even by using processes and equipment in related technologies. Therefore, the lower substrate 121 is a layer for facilitating LLO processing, and thus the lower substrate 110 can be referred to as a functional thin film, a functional thin film layer, or a functional substrate.

[0115] However, even if the lower substrate 121 is made of either a transparent conductive oxide or an oxide semiconductor and its flexibility is improved by having a very small thickness in the display device 100 according to the embodiments of this disclosure, the lower substrate 121 may still have difficulty firmly supporting the extension region MA of the back cover 110. In particular, when the boundary between the support region and the extension region of the back cover is provided outward from the sealing substrate, there is no component to protect the extension region provided outside the sealing substrate from stress. Therefore, the extension region of the back cover adjacent to the boundary between the extension region and the support region of the back cover is expanded during repeated winding and unwinding, and the back cover has a length longer than the initially manufactured back cover. For this reason, operational defects may occur.

[0116] Therefore, the display device 100 according to the embodiments of the present disclosure is designed such that the boundary between the extension region MA of the rear cover 110 and the second support region PA2 overlaps with the end of the sealing substrate 128, thereby reducing the possibility of the extension region MA expanding. That is, the plurality of openings 111 are designed to overlap only with the inner side of the sealing substrate 128, which has relatively high rigidity. Therefore, even if the plurality of openings 111 contract or expand due to the curling force generated during repeated winding and unfolding processes, the sealing substrate 128 and the second bonding layer AD2 can secure the rear cover 110. Therefore, the display device 100 according to the embodiments of the present disclosure can suppress the possibility of the extension region MA of the rear cover 110 expanding, thereby reducing operational defects that may occur when the rear cover 110 expands.

[0117] At the same time, such as Figure 6 As shown, in the third non-display area NA3, the back cover 110 can be spaced apart from the sealing member 150. Therefore, when the inorganic insulating layer is disposed in the third non-display area, the inorganic insulating layer can receive tensile stress, and thus the inorganic insulating layer may be prone to cracking. Furthermore, during the process of forming the sealing member, an air gap can be formed in the space between the first bonding layer and the sealing member adjacent to the substrate. Due to the air gap formed as described above, the stress applied to the corresponding area can change rapidly relative to the boundary between the sealing member and the first bonding layer. Therefore, compared with the organic material of the planarization layer, inorganic cracks may be more likely to occur in the inorganic insulating layer made of a material with higher hardness and lower ductility. In the case where cracks occur in the inorganic insulating layer, such as the buffer layer, gate insulating layer, or passivation layer, caused by the winding and unfolding process of the display panel, the cracks can propagate to the components adjacent to the inorganic insulating layer, and cracks formed in the area adjacent to the air gap can propagate to the display area. In this case, the reliability of the display device may deteriorate.

[0118] Therefore, in the display device 100 according to the embodiments of the present disclosure, the end of the first inorganic insulating layer IL1, including the buffer layer 122, the gate insulating layer 123, and the passivation layer 124, can be disposed inwardly from the end of the sealing substrate 128. Specifically, the first inorganic insulating layer IL1 is not present near the boundary between the second non-display area NA2 and the third non-display area NA3, and the end of the first inorganic insulating layer IL1 can be disposed around the first bonding layer AD1 or the sealing layer, thereby reducing crack defects. That is, the first inorganic insulating layer IL1 is not disposed in the third non-display area NA3, which is spaced apart from the sealing member 150 and the rear cover 110. Furthermore, the first inorganic insulating layer IL1 is not disposed in the end boundary region of the sealing substrate 128, where there is a high probability of cracking due to rapid stress changes. Therefore, the possibility of cracking can be suppressed more fundamentally.

[0119] Figure 7 This is a cross-sectional view of a display device according to another embodiment of the present disclosure. Figure 7 The display device 200 shown is configured similarly to Figures 1 to 6 The display device 100 shown is essentially the same, except for the position of the boundary between the extension region MA of the rear cover 110 and the second support region PA2. Therefore, repeated descriptions of the same components will be omitted.

[0120] Reference Figure 7 The boundary between the extended region MA of the back cover 110 and the second support region PA2 can overlap with the sealing substrate 128. Specifically, the boundary between the extended region MA of the back cover 110 and the second support region PA2 is provided inward from the end of the sealing substrate 128, such that a portion of the second support region PA2 adjacent to the extended region MA can overlap with the sealing substrate 128. Therefore, all the plurality of openings 111 provided in the extended region MA adjacent to the second support region PA2 overlap with the sealing substrate 128, but are not provided on the outside of the sealing substrate 128. That is, the extended region MA of the back cover 110 only overlaps with the first non-display region NA1 and the second non-display region NA2 of the non-display region NA, but does not overlap with the third non-display region NA3.

[0121] According to another embodiment of the present disclosure, the display device 200 is designed such that the boundary between the extension region MA of the rear cover 110 and the second support region PA2 overlaps with the sealing substrate 128, thereby reducing the possibility of the extension region MA expanding. That is, the plurality of openings 111 are designed to overlap only with the inner side of the sealing substrate 128, which has relatively high rigidity. Therefore, even if the plurality of openings 111 contract or expand due to the curling force generated during repeated winding and unwinding processes, the sealing substrate 128 and the second bonding layer AD2 can secure the rear cover 110. Therefore, the display device 200 according to another embodiment of the present disclosure can suppress the expansion of the extension region MA of the rear cover 110, thereby reducing operational defects that may occur when the rear cover 110 expands.

[0122] Furthermore, according to another embodiment of the present disclosure, the display device 200 is designed such that the boundary between the extension region MA of the rear cover 110 and the second support region PA2 is located further inward than the end of the sealing substrate 128. Therefore, it is possible to suppress the boundary between the extension region MA and the second support region PA2 from being positioned outward from the end of the sealing substrate 128 due to process errors during the bonding process of the sealing substrate 128 and the rear cover 110.

[0123] Figure 8This is a cross-sectional view of a display device according to yet another embodiment of the present disclosure. Figure 8 The display device 300 shown is configured similarly to Figure 7 The display device 200 shown is essentially the same, except that the display device 300 also includes an organic insulating layer OL. Therefore, repeated descriptions of the same components will be omitted.

[0124] Reference Figure 8 The first inorganic insulating layer IL1 of the display device 300 can be disposed in a portion of the entire display area AA, the entire first non-display area NA1, and the second non-display area NA2. That is, the end of the first inorganic insulating layer IL1 can be disposed inward from the end of the sealing substrate 128, and the first bonding layer AD1 or the sealing layer can surround the end region of the first inorganic insulating layer IL1. Therefore, there is a region between the end of the first inorganic insulating layer IL1 and the sealing member 150 in which the first bonding layer AD1 and the lower substrate 121 are in contact with each other.

[0125] Reference Figure 8 An organic insulating layer OL is disposed in the second non-display area NA2 to surround the peripheral area of ​​the first inorganic insulating layer IL1 and to contact the lower substrate 121. In this case, the organic insulating layer OL can be disposed spaced apart from the planarization layer 125. One side of the organic insulating layer OL can be disposed to cover the end of the first inorganic insulating layer IL1 and surround the first inorganic insulating layer IL1. Furthermore, as... Figure 8 As shown, the other side of the organic insulating layer OL can contact the sealing member 150. However, this disclosure is not limited thereto. The first bonding layer AD1 can be configured to surround the other side of the organic insulating layer OL.

[0126] The organic insulating layer OL and the planarization layer 125 can be formed simultaneously. Therefore, the organic insulating layer OL can be made of the same material as the planarization layer 125 and have the same height. However, this disclosure is not limited thereto. The organic insulating layer OL can be formed in a separate process from the planarization layer 125.

[0127] In another embodiment of the display device 300 according to this disclosure, an organic insulating layer OL can be disposed in the second non-display area NA2 to perform the LLO process more smoothly. A lower substrate 121 can be formed on a temporary substrate having a sacrificial layer, and various constituent elements can then be formed on the lower substrate 121. The sacrificial layer can be made of, for example, hydrogenated amorphous silicon or hydrogenated amorphous silicon doped with impurities. Furthermore, when a laser beam is emitted to the lower portion of the temporary substrate after the display device 300 has been fully manufactured, the sacrificial layer can be dehydrogenated, and the sacrificial layer and the temporary substrate can be separated from the lower substrate 121. In this case, transparent conductive oxides and oxide semiconductors are materials that can undergo the LLO process together with the sacrificial layer and the temporary substrate. Therefore, even if the lower substrate 121 is made of either a transparent conductive oxide or an oxide semiconductor, the lower substrate 121 and the temporary substrate can be easily separated.

[0128] However, the area where the lower substrate 121, made of transparent conductive oxide or oxide semiconductor, contacts the first bonding layer AD1 may require a high energy density (E / D) during LLO processing. That is, when the lower substrate 121 and the first bonding layer AD1, made of transparent conductive oxide or oxide semiconductor, are positioned in direct contact with each other, a large amount of energy may be required to separate the lower substrate 121 and the first bonding layer AD1.

[0129] Therefore, in a display device 300 according to another embodiment of the present disclosure, an organic insulating layer OL can be disposed in a second non-display area NA2 to surround the peripheral area of ​​the first inorganic insulating layer IL1, so that LLO processing can be performed relatively easily even on the second non-display area NA2 during the manufacturing process of the display device 300.

[0130] Furthermore, in another embodiment of the display device 300 according to this disclosure, the organic insulating layer OL can be configured to be separate from the planarization layer 125. Because the organic material constituting the organic insulating layer OL is relatively susceptible to moisture penetration, when the organic insulating layer and the planarization layer are connected, moisture can more easily penetrate from the outside of the display device into the display area. Therefore, in another embodiment of the display device 300 according to this disclosure, the organic insulating layer OL and the planarization layer 125 can be separated, thereby suppressing moisture penetration from the outside.

[0131] Figure 9 This is a cross-sectional view of a display device according to yet another embodiment of the present disclosure. Figure 9 The display device 400 shown is configured similarly to Figure 7 The display device 200 shown is essentially the same, except that the display device 400 also includes a second inorganic insulating layer IL2. Therefore, repeated descriptions of the same components will be omitted.

[0132] Reference Figure 9 The second inorganic insulating layer IL2 is spaced apart from the first inorganic insulating layer IL1 and disposed below the sealing member 150. The second inorganic insulating layer IL2 may be disposed in a portion of the third non-display area NA3 and the second non-display area NA2. That is, the second inorganic insulating layer IL2 may be disposed overlapping the end of the sealing substrate 128. However, this disclosure is not limited thereto. The second inorganic insulating layer IL2 may be disposed only in the third non-display area NA3 or only in a portion of the third non-display area NA3.

[0133] The second inorganic insulating layer IL2 may have the same layered structure as the first inorganic insulating layer IL1 or be made of the same material as the first inorganic insulating layer IL1. That is, the second inorganic insulating layer IL2 may also be defined as including a buffer layer 122, a gate insulating layer 123, and a passivation layer 124. However, the buffer layer 122, gate insulating layer 123, and passivation layer 124 constituting the first inorganic insulating layer IL1 may be separated from the buffer layer 122, gate insulating layer 123, and passivation layer 124 constituting the second inorganic insulating layer IL2. Therefore, the first bonding layer AD1 may be disposed in the space between the first inorganic insulating layer IL1 and the second inorganic insulating layer IL2.

[0134] In a display device 400 according to another embodiment of the present disclosure, a second inorganic insulating layer IL2 can be disposed in a portion of the third non-display area NA3 and the second non-display area NA2, thereby suppressing moisture penetration. Compared to the material constituting the sealing member 150 disposed at the outermost periphery, the inorganic material constituting the second inorganic insulating layer IL2 is relatively more effective at suppressing moisture penetration. Therefore, in a display device 400 according to another embodiment of the present disclosure, a second inorganic insulating layer IL2 made of inorganic material can be disposed at the outermost periphery, thereby suppressing moisture penetration from the outside.

[0135] Furthermore, in a display device 400 according to another embodiment of the present disclosure, the first inorganic insulating layer IL1 and the second inorganic insulating layer IL2 are spaced apart from each other. As described above, the arrangement of the second inorganic insulating layer IL2 at the outermost periphery is effective in suppressing moisture penetration. However, there is a possibility that cracks may appear in the area where the second inorganic insulating layer IL2 is provided. Therefore, if the first inorganic insulating layer IL1 and the second inorganic insulating layer IL2 are connected to each other, cracks formed in the second inorganic insulating layer IL2 may propagate to the first inorganic insulating layer IL1. In contrast, in a display device 400 according to another embodiment of the present disclosure, the first inorganic insulating layer IL1 and the second inorganic insulating layer IL2 are separated from each other, and a first bonding layer AD1 is provided in the space between the first inorganic insulating layer IL1 and the second inorganic insulating layer IL2. Therefore, even if cracks appear in the second inorganic insulating layer IL2, crack propagation to the first inorganic insulating layer IL1 can be suppressed.

[0136] Figure 10 This is a cross-sectional view of a display device according to yet another embodiment of the present disclosure. Figure 10 The display device 500 shown is configured similarly to Figure 9 The display device 400 shown is essentially the same, except that the display device 500 also includes an organic insulating layer OL. Therefore, repeated descriptions of the same components will be omitted.

[0137] Reference Figure 10 An organic insulating layer OL is disposed in the second non-display area NA2 to surround the peripheral area of ​​the first inorganic insulating layer IL1. In this case, the organic insulating layer OL can be spaced apart from the planarization layer 125. One side of the organic insulating layer OL can be configured to cover the end of the first inorganic insulating layer IL1 and surround the first inorganic insulating layer IL1. Furthermore, the other side of the organic insulating layer OL can be configured to surround the second inorganic insulating layer IL2. That is, the organic insulating layer OL can be configured to fill the space between the first inorganic insulating layer IL1 and the second inorganic insulating layer IL2. In this case, as... Figure 10 As shown, the other side of the organic insulating layer OL can be configured to be surrounded by the first bonding layer AD1. However, this disclosure is not limited thereto. The other side of the organic insulating layer OL can be configured to contact the sealing member 150.

[0138] The organic insulating layer 100 and the planarization layer 125 can be formed simultaneously. Therefore, the organic insulating layer 100 can be made of the same material as the planarization layer 125 and have the same height. However, this disclosure is not limited thereto. The organic insulating layer 100 can be formed in a separate process from the planarization layer 125.

[0139] In another embodiment of the display device 500 according to this disclosure, the organic insulating layer OL can be disposed in the second non-display area NA2 to perform the LLO process more smoothly. That is, the organic insulating layer OL is disposed in the space between the first inorganic insulating layer IL1 and the second inorganic insulating layer IL2 and is in contact with the lower substrate 121. The first bonding layer AD1 can be disposed on the organic insulating layer OL. Therefore, compared with the case where the lower substrate 121 and the first bonding layer AD1 are disposed in direct contact with each other, the LLO process can be performed easily with relatively little energy.

[0140] Furthermore, in another embodiment of the display device 500 according to this disclosure, the organic insulating layer OL can be configured to be separate from the planarization layer 125. Because the organic material constituting the organic insulating layer OL is relatively susceptible to moisture penetration, when the organic insulating layer and the planarization layer are connected, moisture can more easily penetrate from the outside of the display device into the display area. Therefore, in another embodiment of the display device 500 according to this disclosure, the organic insulating layer OL and the planarization layer 125 can be separated, thereby suppressing moisture penetration from the outside.

[0141] Figure 11 This is a cross-sectional view of a display device according to other embodiments of the present disclosure. Figure 11 It is along Figure 4 A cross-sectional view of line B-B' in the diagram. Figure 11 The display device 600 shown is configured similarly to Figures 1 to 6 The display device 100 shown is essentially the same, except that the left side region, i.e., the gate in-panel (GIP) region, is located in the edge region of the back cover 110 that protrudes from the display panel 120. Therefore, repeated descriptions of the same components will be omitted.

[0142] Reference Figure 11 The gate driving portion 680 and the line portion 690 are disposed on the gate insulating layer 123 in the second non-display area NA2. The gate driving portion 680 and the line portion 690 can be disposed in the second non-display area NA2 adjacent to the left and right edges of the display panel 120. In this case, since the gate driving portion 680 and the line portion 690 are disposed on the lower substrate 121, the area in which the gate driving portion 680 and the line portion 690 are disposed can be referred to as the GIP area.

[0143] The gate driving section 680 can output gate voltage and light emission control voltage under the control of a timing controller, select the sub-pixel to be charged with the data voltage via a gate line such as a light emission control signal line, and adjust the light emission timing. The gate driving section 680 can shift the gate voltage and light emission control voltage using a shift register and supply the gate voltage and light emission control voltage sequentially.

[0144] Line portion 690 may include multiple clock signal lines and multiple ground lines for transmitting multiple clock signals. However, this disclosure is not limited thereto. The line portion may also include signal lines for transmitting other signals.

[0145] Therefore, in other embodiments of the display device 600 according to this disclosure, the end of the first inorganic insulating layer IL1, including the buffer layer 122, the gate insulating layer 123, and the passivation layer 124, can be disposed inwardly from the end of the sealing substrate 128. Specifically, the first inorganic insulating layer IL1 is not present near the boundary between the second non-display area NA2 and the third non-display area NA3, and the end of the first inorganic insulating layer IL1 can be disposed around the first bonding layer AD1 or the sealing layer, thereby reducing crack defects. That is, the first inorganic insulating layer IL1 is not disposed in the third non-display area NA3, which is spaced apart from the sealing member 150 and the rear cover 110. Furthermore, the first inorganic insulating layer IL1 is not disposed in the end boundary region of the sealing substrate 128, where there is a high probability of cracking due to rapid stress changes. Therefore, the possibility of cracking can be suppressed more fundamentally.

[0146] Figure 12 This is a cross-sectional view of a display device according to another embodiment of the present disclosure. Figure 12 The display device 700 shown is configured similarly to Figure 11 The display device 600 shown is essentially the same, except that the display device 700 also includes an organic insulating layer OL. Therefore, repeated descriptions of the same components will be omitted.

[0147] Reference Figure 12 An organic insulating layer OL is disposed in the second non-display area NA2 to surround the peripheral area of ​​the first inorganic insulating layer IL1 and to contact the lower substrate 121. In this case, the organic insulating layer OL can be disposed spaced apart from the planarization layer 125. One side of the organic insulating layer OL can be disposed to cover the end of the first inorganic insulating layer IL1 and surround the first inorganic insulating layer IL1. Furthermore, as... Figure 12 As shown, the other side of the organic insulating layer OL can contact the sealing member 150. However, this disclosure is not limited thereto. The first bonding layer AD1 can be configured to surround the other side of the organic insulating layer OL.

[0148] The organic insulating layer 100 and the planarization layer 125 can be formed simultaneously. Therefore, the organic insulating layer 100 can be made of the same material as the planarization layer 125 and have the same height. However, this disclosure is not limited thereto. The organic insulating layer 100 can be formed in a separate process from the planarization layer 125.

[0149] In another embodiment of the display device 700 according to this disclosure, an organic insulating layer OL can be disposed in the second non-display area NA2 to perform the LLO process more smoothly. That is, the organic insulating layer OL can be disposed in contact with the lower substrate 121 in the second non-display area NA2, and the first bonding layer AD1 can be disposed on the organic insulating layer OL. Therefore, compared with the case where the lower substrate 121 and the first bonding layer AD1 are disposed in direct contact with each other, the LLO process can be performed easily with relatively little energy.

[0150] Furthermore, in another embodiment of the display device 700 according to this disclosure, the organic insulating layer OL can be configured to be separate from the planarization layer 125. Therefore, in another embodiment of the display device 700 according to this disclosure, the organic insulating layer OL and the planarization layer 125 can be separated, thereby inhibiting moisture penetration from the outside.

[0151] Figure 13 This is a cross-sectional view of a display device according to yet another embodiment of the present disclosure. Figure 13 The display device 800 shown is configured similarly to Figure 11 The display device 600 shown is essentially the same as the display device 800, except that the display device 800 also includes a second inorganic insulating layer IL2. Therefore, repeated descriptions of the same components will be omitted.

[0152] Reference Figure 13 The second inorganic insulating layer IL2 is spaced apart from the first inorganic insulating layer IL1 and disposed below the sealing member 150. The second inorganic insulating layer IL2 may be disposed in a portion of the third non-display area NA3 and the second non-display area NA2. That is, the second inorganic insulating layer IL2 may be disposed overlapping the end of the sealing substrate 128. However, this disclosure is not limited thereto. The second inorganic insulating layer IL2 may be disposed only in the third non-display area NA3 or only in a portion of the third non-display area NA3.

[0153] The second inorganic insulating layer IL2 may have the same layered structure as the first inorganic insulating layer IL1 or be made of the same material as the first inorganic insulating layer IL1. That is, the second inorganic insulating layer IL2 may also be defined as including a buffer layer 122, a gate insulating layer 123, and a passivation layer 124. However, the buffer layer 122, gate insulating layer 123, and passivation layer 124 constituting the first inorganic insulating layer IL1 may be separated from the buffer layer 122, gate insulating layer 123, and passivation layer 124 constituting the second inorganic insulating layer IL2. Therefore, the first bonding layer AD1 may be disposed in the space between the first inorganic insulating layer IL1 and the second inorganic insulating layer IL2.

[0154] In a further embodiment of the display device 800 according to the present disclosure, a second inorganic insulating layer IL2 may be disposed within a portion of the third non-display area NA3 and the second non-display area NA2, thereby suppressing moisture penetration. Compared to the material constituting the sealing member 150 disposed at the outermost periphery, the inorganic material constituting the second inorganic insulating layer IL2 is relatively more effective at suppressing moisture penetration. Therefore, in a further embodiment of the display device 800 according to the present disclosure, a second inorganic insulating layer IL2 made of inorganic material may be disposed at the outermost periphery, thereby suppressing moisture penetration from the outside.

[0155] Furthermore, in another embodiment of the display device 800 according to this disclosure, the first inorganic insulating layer IL1 and the second inorganic insulating layer IL2 are spaced apart from each other. Therefore, in yet another embodiment of the display device 800 according to this disclosure, the first bonding layer AD1 is disposed in the space between the first inorganic insulating layer IL1 and the second inorganic insulating layer IL2. Therefore, even if a crack occurs in the second inorganic insulating layer IL2, the propagation of the crack to the first inorganic insulating layer IL1 can be suppressed.

[0156] Figure 14 This is a cross-sectional view of a display device according to yet another embodiment of the present disclosure. Figure 14 The display device 900 shown is configured similarly to Figure 13 The display device 800 shown is essentially the same, except that the display device 900 also includes an organic insulating layer OL. Therefore, repeated descriptions of the same components will be omitted.

[0157] Reference Figure 14 An organic insulating layer OL is disposed in the second non-display area NA2 to surround the peripheral area of ​​the first inorganic insulating layer IL1. In this case, the organic insulating layer OL can be spaced apart from the planarization layer 125. One side of the organic insulating layer OL can be configured to cover the end of the first inorganic insulating layer IL1 and surround the first inorganic insulating layer IL1. Furthermore, the other side of the organic insulating layer OL can be configured to surround the second inorganic insulating layer IL2. That is, the organic insulating layer OL can be configured to fill the space between the first inorganic insulating layer IL1 and the second inorganic insulating layer IL2. In this case, as... Figure 14 As shown, the other side of the organic insulating layer OL can be configured to be surrounded by the first bonding layer AD1. However, this disclosure is not limited thereto. The other side of the organic insulating layer OL can be configured to contact the sealing member 150.

[0158] The organic insulating layer 100 and the planarization layer 125 can be formed simultaneously. Therefore, the organic insulating layer 100 can be made of the same material as the planarization layer 125 and have the same height. However, this disclosure is not limited thereto. The organic insulating layer 100 can be formed in a separate process from the planarization layer 125.

[0159] In another embodiment of the display device 900 according to this disclosure, an organic insulating layer OL can be disposed in the second non-display area NA2 to perform LLO processing more smoothly. That is, the organic insulating layer OL is disposed in the space between the first inorganic insulating layer IL1 and the second inorganic insulating layer IL2 and is in contact with the lower substrate 121. The first bonding layer AD1 can be disposed on the organic insulating layer OL. Therefore, compared with the case where the lower substrate 121 and the first bonding layer AD1 are disposed in direct contact with each other, LLO processing can be performed easily with relatively little energy.

[0160] Furthermore, in another embodiment of the display device 900 according to this disclosure, the organic insulating layer OL can be configured to be separate from the planarization layer 125. Because the organic material constituting the organic insulating layer OL is relatively susceptible to moisture penetration, when the organic insulating layer OL and the planarization layer 125 are connected, moisture can more easily penetrate from the outside of the display device into the display area AA. Therefore, in another embodiment of the display device 900 according to this disclosure, the organic insulating layer OL and the planarization layer 125 can be separated, thereby suppressing moisture penetration from the outside.

[0161] Exemplary embodiments of this disclosure can also be described as follows:

[0162] According to one aspect of this disclosure, a display device is provided. The display device includes: a lower substrate made of a transparent conductive oxide or oxide semiconductor; a first inorganic insulating layer disposed on the lower substrate; a planarization layer disposed on the first inorganic insulating layer; a light-emitting element disposed on the planarization layer; a sealing substrate disposed on the first inorganic insulating layer, the planarization layer, and the light-emitting element; a rear cover disposed on the sealing substrate and having a plurality of openings; and a roller portion configured to wind or unwind the rear cover, wherein an end of the first inorganic insulating layer extends inwardly from an end of the sealing substrate.

[0163] The display device further includes: a first bonding layer configured to attach the sealing substrate to the lower substrate, wherein the first bonding layer is disposed around the first inorganic insulating layer.

[0164] The first bonding layer may be disposed in the peripheral region of the first inorganic insulating layer and in contact with the lower substrate.

[0165] The display device further includes an organic insulating layer, which is configured to surround the peripheral region of the first inorganic insulating layer.

[0166] The display device further includes a second inorganic insulating layer spaced apart from the first inorganic insulating layer and configured to overlap with the end of the sealing substrate.

[0167] The display device further includes an organic insulating layer configured to fill the space between the first inorganic insulating layer and the second inorganic insulating layer.

[0168] The second inorganic insulating layer may be made of the same material as the first inorganic insulating layer.

[0169] The rear cover may include: a first support region; an extension region extending from the first support region and having the plurality of openings; and a second support region extending from the extension region and fastened to the roller portion, wherein the boundary between the extension region and the second support region overlaps with the sealing substrate.

[0170] The boundary between the extended region and the second support region may overlap with the end of the sealing substrate.

[0171] The boundary between the extended region and the second support region may be located further inward than the end of the sealing substrate.

[0172] The display device further includes a second bonding layer configured to attach the rear cover to the display panel, wherein the second bonding layer is located inward from the end of the sealing substrate.

[0173] The display device further includes a flexible film disposed in the first support region and configured to supply signals to the light-emitting element.

[0174] According to another aspect of this disclosure, a display device is provided. The display device includes: a display panel including a functional thin film layer, an inorganic insulating layer, a planarization layer, a light-emitting element, and a sealing substrate, the display panel being divided into a display area and a non-display area; a rear cover disposed on the rear surface of the display panel, configured to support the display panel, and having a plurality of holes; and a sealing member disposed around a side surface of the display panel, wherein the functional thin film layer is made of a transparent conductive oxide or oxide semiconductor, and the inorganic insulating layer includes a first inorganic insulating layer having an end portion disposed inwardly from an end portion of the sealing substrate.

[0175] The display device further includes: a first bonding layer configured to attach the sealing substrate to the display panel, wherein the first bonding layer surrounds the first inorganic insulating layer and contacts the functional thin film layer.

[0176] The display device further includes an organic insulating layer configured to fill the region between the periphery of the first inorganic insulating layer and the sealing member, wherein the organic insulating layer is in contact with the first bonding layer and the functional thin film layer.

[0177] The organic insulating layer may be made of the same material as the planarization layer.

[0178] The display device further includes a second inorganic insulating layer, which is separate from the first inorganic insulating layer and is also disposed below the sealing member.

[0179] The display device further includes an organic insulating layer configured to fill the space between the first inorganic insulating layer and the second inorganic insulating layer.

[0180] The second inorganic insulating layer may be made of the same material as the first inorganic insulating layer.

[0181] The back cover may have multiple openings located only in a central region that overlaps with the display panel, and the ends of the central region overlap with the sealing substrate.

[0182] The end of the central region may overlap with the end of the sealing substrate.

[0183] The end of the central region may be located further inward than the end of the sealing substrate.

[0184] The display device further includes a flexible film disposed above the back cover and configured to supply signals to the light-emitting element.

[0185] Although exemplary embodiments of this disclosure have been described in detail with reference to the accompanying drawings, this disclosure is not limited thereto and can be implemented in many different forms without departing from the technical concept of this disclosure. Therefore, the exemplary embodiments of this disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of this disclosure. The scope of the technical concept of this disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all respects and do not limit this disclosure. The scope of protection of this disclosure should be interpreted based on the following claims, and all technical concepts within their equivalents should be interpreted as falling within the scope of this disclosure.

Claims

1. A display device, comprising: A lower substrate, wherein the lower substrate is made of a transparent conductive oxide or an oxide semiconductor; A first inorganic insulating layer is disposed on the lower substrate; A planarization layer is disposed on the first inorganic insulating layer; The light-emitting element is disposed on the planarization layer; A sealing substrate is disposed on the first inorganic insulating layer, the planarization layer, and the light-emitting element; The rear cover is disposed on the sealing substrate and has multiple openings; as well as The roller section is configured to wind or unfold the rear cover. The end of the first inorganic insulating layer extends inward from the end of the sealing substrate.

2. The display device according to claim 1, further comprising: A first bonding layer is configured to attach the sealing substrate to the lower substrate. The first bonding layer is configured to surround the first inorganic insulating layer.

3. The display device according to claim 2, wherein, The first bonding layer is configured to contact the lower substrate in the peripheral region of the first inorganic insulating layer.

4. The display device according to claim 2, further comprising: An organic insulating layer is configured to surround the peripheral region of the first inorganic insulating layer.

5. The display device according to claim 2, further comprising: A second inorganic insulating layer, spaced apart from the first inorganic insulating layer, is configured to overlap with the end of the sealing substrate.

6. The display device according to claim 5, further comprising: An organic insulating layer is configured to fill the space between the first inorganic insulating layer and the second inorganic insulating layer.

7. The display device according to claim 5, wherein, The second inorganic insulating layer is made of the same material as the first inorganic insulating layer.

8. The display device according to claim 1, wherein, The rear cover includes: First support area; An extension region, the extension region extending from the first support region and having the plurality of opening portions; and A second support region extends from the extended region and is secured to the roller portion, and The boundary between the extended region and the second support region overlaps with the sealing substrate.

9. The display device according to claim 8, wherein, The boundary between the extended region and the second support region overlaps with the end of the sealing substrate.

10. The display device according to claim 8, wherein, The boundary between the extended region and the second support region is located further inward than the end of the sealing substrate.

11. The display device according to claim 10, further comprising: A second bonding layer is configured to attach the rear cover to the sealing substrate. The second bonding layer is located inward from the end of the sealing substrate.

12. The display device according to claim 8, further comprising: A flexible film is disposed in the first support region and configured to supply a signal to the light-emitting element.

13. A display device, comprising: The display panel includes a functional thin film layer, an inorganic insulating layer, a planarization layer, a light-emitting element, and a sealing substrate, wherein the display panel is divided into a display area and a non-display area; A rear cover, disposed on the rear surface of the display panel, is configured to support the display panel and has a plurality of holes; as well as A sealing member is configured to surround the side surface of the display panel. The functional thin film layer is made of transparent conductive oxide or oxide semiconductor, and the inorganic insulating layer includes a first inorganic insulating layer having an end portion disposed inward from the end portion of the sealing substrate.

14. The display device according to claim 13, further comprising: A first bonding layer is configured to attach the sealing substrate to the display panel. The first bonding layer surrounds the first inorganic insulating layer and is in contact with the functional thin film layer.

15. The display device according to claim 14, further comprising: An organic insulating layer is configured to fill the area between the periphery of the first inorganic insulating layer and the sealing member. The organic insulating layer is in contact with the first bonding layer and the functional thin film layer.

16. The display device according to claim 15, wherein, The organic insulating layer is made of the same material as the planarization layer.

17. The display device according to claim 14, further comprising: A second inorganic insulating layer, which is separate from the first inorganic insulating layer, is also disposed below the sealing member.

18. The display device according to claim 17, further comprising: An organic insulating layer is configured to fill the space between the first inorganic insulating layer and the second inorganic insulating layer.

19. The display device according to claim 17, wherein, The second inorganic insulating layer is made of the same material as the first inorganic insulating layer.

20. The display device according to claim 13, wherein, The back cover has multiple openings located only in a central region that overlaps with the display panel, and the ends of the central region overlap with the sealing substrate.

21. The display device according to claim 20, wherein, The end of the central region overlaps with the end of the sealing substrate.

22. The display device according to claim 20, wherein, The end of the central region is located further inward than the end of the sealing substrate.

23. The display device according to claim 20, further comprising: A flexible film is disposed above the back cover and configured to supply signals to the light-emitting element.

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