A MEMS gyroscope and a manufacturing method thereof

Abstract

The application discloses a MEMS gyroscope and a manufacturing method thereof, and relates to the technical field of inertia and micro-electro-mechanical system, and aims to solve the problems of large thermal elastic damping and low sensitivity of the MEMS gyroscope. The MEMS gyroscope comprises a base, an electrode assembly, a support anchor point, a resonance structure and a graphene layer formed on the base; and the graphene layer is coated on the surfaces of the resonance structure and the electrode assembly. The manufacturing method is used for manufacturing the MEMS gyroscope, and the manufacturing process is simple and easy to operate.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of inertial technology and micro-electro-mechanical system technology, and in particular to a MEMS gyroscope and a manufacturing method thereof. BACKGROUND

[0002] Mechanical vibration gyroscopes have made great progress through micro-electro-mechanical system (MEMS) technology, meeting the requirements of low cost and small size. Among them, the ring structure gyroscope is a MEMS gyroscope with high sensitivity. For the ring structure gyroscope, the energy dissipation caused by damping is a key challenge for the best operation of the MEMS resonator. In order to improve the sensitivity of the ring structure gyroscope, it is necessary to greatly reduce the thermal elastic dissipation, anchor loss, surface loss, air damping and other energy losses. Thermal elastic damping is considered to be an intrinsic loss caused by the interaction in the material structure, and is the main dissipation mechanism inside the micro resonator, mainly due to the lack of thermal balance between various parts of the vibration structure. Because the energy dissipation caused by thermal elastic damping is not easy to control and eliminate, it is a difficult problem in current technology to improve the sensitivity performance of the gyroscope by reducing the loss caused by thermal elastic damping.

[0003] At present, the thermal elastic damping of the gyroscope is mainly reduced by improving the structural parameters of the resonator, but there are many resonator structures, and this method can only be designed for specific structures. Therefore, the process is complicated, the design cost is increased, and the yield of product manufacturing is low. SUMMARY

[0004] The purpose of the present application is to provide a MEMS gyroscope and a manufacturing method thereof to reduce thermal elastic damping and improve the sensitivity of the MEMS gyroscope.

[0005] In a first aspect, the present application provides a MEMS gyroscope, comprising:

[0006] a substrate, and an electrode assembly, a support anchor, a resonant structure and a graphene layer formed on the substrate; the graphene layer is coated on the surface of the resonant structure and the electrode assembly;

[0007] The resonant structure comprises a plurality of suspension beam structures and a vibration ring; the electrode assembly has a first group of electrodes and a second group of electrodes; the vibration ring is located between the first group of electrodes and the second group of electrodes, and one end of the vibration ring towards the substrate has a gap between the second group of electrodes and the first group of electrodes; the first group of electrodes and the vibration ring have a first gap, and the second group of electrodes and the vibration ring have a second gap; the vibration ring is connected to the support anchor through the plurality of suspension beam structures; the bottom of the electrode assembly and the bottom of the support anchor contain metal.

[0008] Compared with the prior art, the MEMS gyroscope provided by the application contains a graphene layer, which is coated on the surface of the resonant structure. Since the resonant structure generates irreversible heat flow when stretched and compressed during vibration, a larger internal loss is caused. Therefore, the graphene layer with good thermal conductivity and mechanical properties is coated on the surface of the resonant structure. The graphene layer can quickly conduct the heat flow from the high-temperature part of the resonant structure to the low-temperature part, thereby reducing the heat imbalance phenomenon generated in the resonant structure during vibration, reducing energy dissipation, and improving the stability of the resonant structure. Unlike the prior art, the resonant structure is plated with a metal film layer, which increases the thermal elastic damping. The graphene layer with small Zener modulus is coated on the surface of the resonant structure, which can reduce the thermal elastic damping while reducing the internal loss of the resonant structure and increasing the sensitivity of the MEMS gyroscope.

[0009] The graphene layer is also coated on the surface of the electrode assembly. When the resonant structure is stretched and compressed and drives the vibration ring to move, the change in the size of the gap between the vibration ring and the electrode assembly will cause a change in the capacitance. Since graphene has strong conductivity, it can store more charges and quickly charge and discharge. Therefore, after coating the graphene layer on the surface of the electrode assembly, the capacity and rate performance of the electrode can be increased while the conductivity of the electrode is increased. Based on this, after forming the graphene layer on the surface of the electrode assembly, the driving force of the driving electrode and the detection sensitivity of the detection electrode can be increased, so that the change in the capacitance under the action of the electrode assembly is more significant, thereby further achieving the purpose of improving the sensitivity of the MEMS gyroscope.

[0010] In a second aspect, the application provides a method for manufacturing a MEMS gyroscope, comprising:

[0011] providing a first substrate and a second substrate;

[0012] forming an electrode lead on the first substrate;

[0013] forming a support anchor and an electrode assembly on the second substrate;

[0014] bonding the electrode lead surface of the first substrate with the electrode assembly surface of the second substrate, and forming a resonant structure; wherein the resonant structure forms a capacitance with the electrode assembly;

[0015] coating a graphene layer on the surface of the resonant structure and the electrode assembly.

[0016] Compared with the prior art, the method for manufacturing the MEMS gyroscope provided by the application has the same beneficial effects as the MEMS gyroscope provided by the first aspect, and the manufacturing process is simple and easy to operate. BRIEF DESCRIPTION OF DRAWINGS

[0017] The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings:

[0018] Figure 1 A top view of a MEMS gyroscope provided by an embodiment of the application is shown.

[0019] Figure 2 A side view structural schematic diagram of a MEMS gyroscope provided by an embodiment of the application is shown.

[0020] Figures 3A-3E A schematic diagram of a state of a preparation method of a MEMS gyroscope of an exemplary embodiment of the application at this stage is shown.

[0021] Reference Signs:

[0022] 100 - substrate; 101 - first substrate; 102 - second substrate; 200 - electrode lead; 301 - support anchor point; 302 - electrode assembly; 3021 - first group of electrodes; 3022 - second group of electrodes; 303 - resonant structure; 3031 - suspended beam structure; 3032 - vibrating ring; 400 - graphene layer. DETAILED DESCRIPTION

[0023] In order to make the technical problems to be solved by the application, technical solutions and beneficial effects more clearly understood, the following further describes the application in detail with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the application and do not limit the application.

[0024] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0025] In addition, the terms "first", "second", etc. are used only for descriptive purposes and should not be construed as indicating or implying relative importance or an implied indication of the number of indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the application, the meaning of "a plurality of" is two or more, unless otherwise explicitly and specifically limited. The meaning of "several" is one or more, unless otherwise explicitly and specifically limited.

[0026] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0027] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0028] Currently, for ring-type gyroscopes, energy dissipation caused by thermoelastic damping is difficult to control and eliminate. Therefore, improving the sensitivity performance of gyroscopes by reducing losses caused by thermoelastic damping is a current technological challenge. Reducing the thermoelastic damping of a gyroscope is mainly achieved by improving the structural parameters of the resonant device. However, there are many resonant device structures, and this method can only be applied to specific structural designs. Therefore, the process is cumbersome and complex, increasing design costs and resulting in low product yield.

[0029] To address the aforementioned problems, embodiments of the present invention provide a MEMS gyroscope to reduce thermoelastic damping and improve the sensitivity of the MEMS gyroscope. Figure 1 A top view of a MEMS gyroscope provided in an embodiment of the present invention is shown. Figure 2 A side view of the MEMS gyroscope provided in an embodiment of the present invention is shown. Figure 1 and Figure 2 As shown, the MEMS gyroscope provided in this embodiment of the invention includes a substrate 100, an electrode assembly 302, a support anchor point 301, a resonant structure 303, and a graphene layer 400. It should be understood that... Figure 1 In the top view, to avoid blurring the specific structure of the MEMS gyroscope due to the addition of a graphene layer, it was not included. Figure 1 The addition of a graphene layer is actually present in the MEMS gyroscope provided in this embodiment of the invention, which has a graphene layer. Figure 2 For illustrative purposes, the cantilever structure of the MEMS gyroscope has been omitted to more intuitively illustrate the inventive points of this application.

[0030] like Figure 1 and Figure 2As shown, the support anchor point 301, resonant structure 303, and electrode assembly 302 can be formed on the substrate 100, and the graphene layer 400 covers the surface of the resonant structure 303 and the electrode assembly 302. The substrate 100 can be an insulating substrate, including but not limited to plastic substrates, glass substrates, and ceramic substrates. The resonant structure 303 includes multiple cantilever structures 3031 surrounding the support anchor point 301 and a vibrating ring 3032. The cantilever structure 3031 is used to suspend the vibrating ring 3032. Since the resonant structure 303 generates irreversible heat flow during stretching and compression during vibration, resulting in significant internal losses, the graphene layer 400, which has good thermal conductivity and mechanical properties, is covered on the surface of the resonant structure 303. The graphene layer 400 can quickly conduct heat flow from higher temperatures to lower temperatures within the resonant structure 303, thereby reducing the heat imbalance generated in the resonant structure 303 during vibration and reducing energy dissipation. Unlike existing technologies where depositing a metal film on the surface of the resonant structure 303 increases thermoelastic damping, forming a graphene layer 400 with a low Zener modulus on the resonant structure 303 can reduce thermoelastic damping, thereby reducing the inherent losses of the resonant structure 303 and increasing the sensitivity of the MEMS gyroscope.

[0031] For example, the first ends of multiple cantilever structures are connected to support anchor points, and the second ends of multiple cantilever structures are connected to a vibrating ring. Under the action of the electrode assembly, the suspended vibrating ring moves between the electrode assemblies, causing the multiple cantilever structures connected to it to undergo tensile and compressive deformation vibrations. During this process, the interaction between the internal structures of the resonant structure results in thermoelastic damping. Specifically, the material of the resonant structure experiences a temperature increase under tensile stress and a temperature decrease under compressive stress, forming a temperature gradient within the material. To achieve thermal equilibrium in the resonant structure, energy is needed to regulate the temperature gradient. However, the resonant structure has a poor ability to regulate thermal equilibrium. Therefore, when a graphene layer is coated on the surface of the resonant structure, its good thermal conductivity allows for rapid heat transfer from higher-temperature areas to lower-temperature areas, thereby reducing the heat imbalance and energy dissipation. In practical applications, resonant structures are often silicon resonant structures, and coating silicon materials with a film can affect the damping of the silicon material. Existing technologies often coat silicon resonant structures with metal films, but this increases the damping of the silicon material. Therefore, using graphene, a material with a Zener modulus similar to that of silicon, to coat the resonant structure can effectively reduce thermoelastic damping, thereby improving the sensitivity of the MEMS gyroscope.

[0032] like Figure 1 and Figure 2As shown, the electrode assembly 302 has a first set of electrodes 3021 and a second set of electrodes 3022. A vibrating ring 3032 is located between the first set of electrodes 3021 and the second set of electrodes 3022. Multiple cantilever structures 3031 pass through the second set of electrodes 3022 and connect to the vibrating ring 3032, thereby increasing the area of ​​the electrode assembly 302 close to the vibrating ring 3032, which is beneficial to ensuring the sensitivity of the MEMS gyroscope. There is a gap between the end of the vibrating ring 3032 facing the substrate and the second set of electrodes 3022 and the first set of electrodes 3021. There is a first gap between the first set of electrodes 3021 and the vibrating ring 3032, and a second gap between the second set of electrodes 3022 and the vibrating ring 3032. The first and second gaps are used to accommodate the vibration of the resonant structure under the action of the electrode assembly 302, and the change in the size of the gaps can be converted into a change in capacitance.

[0033] The system comprises two sets of electrodes: a first set of electrodes including multiple first sub-electrodes surrounding a support anchor point, and a second set of electrodes including multiple second sub-electrodes surrounding the support anchor point. A vibration ring of the resonant structure surrounds the support anchor point. Specifically, a first driving electrode and a first detection electrode are located between adjacent first sub-electrodes, and these electrodes are arranged alternately. The first driving electrode drives the resonant structure to vibrate when the MEMS gyroscope is stationary, and the first detection electrode detects the modal changes of the resonant structure as the MEMS gyroscope senses rotation. Specifically, the second set of electrodes serves as auxiliary electrodes, used to increase voltage and induce stretching and compression in the resonant structure. Specifically, the vibration ring forms a first capacitor with one first sub-electrode, and the vibration ring forms multiple second capacitors with the multiple second sub-electrodes.

[0034] For example, when the vibrating ring moves closer to the first sub-electrode, the first capacitance increases and the second capacitance decreases; when the vibrating ring moves closer to the second sub-electrode, the first capacitance decreases and the second capacitance increases. By coating the surface of the electrode assembly with a graphene layer, the capacitance and rate capability of the electrode assembly can be increased, the conductivity of the electrode can be increased, and the driving force of the driving electrode and the detection sensitivity of the detection electrode can be increased, making the changes in the first and second capacitances more significant, thereby further improving the sensitivity of the MEMS gyroscope.

[0035] It should be understood that, in order to reduce costs, graphene layers can also be formed only around the electrode assembly, and this can be adjusted according to the actual situation, without limitation here.

[0036] In one example, when a voltage is applied to the first driving electrode by a second set of electrodes, the driving force of the first driving electrode increases, causing the resonant structure to undergo tensile and compressive deformation vibrations. When the MEMS gyroscope rotates at a certain angular velocity, the first detection electrode detects the modal changes of the resonant structure sensed by the MEMS gyroscope during rotation. In practical applications, the angular velocity of the MEMS gyroscope during rotation can be calculated by measuring the amplitude generated by the resonant structure under the action of the electrode assembly. Because graphene has strong conductivity, it can store more charge and charge and discharge quickly. Therefore, when a graphene layer is coated on the surface of the electrode assembly, the conductivity of the electrode can be increased while simultaneously increasing the capacity and rate performance of the electrode, thereby improving the driving force of the first driving electrode and the detection sensitivity of the first detection electrode.

[0037] like Figure 2 As shown, the bottom of the support anchor point, electrode assembly, and substrate contact has an electrode lead 200. The electrode lead 200 is made of at least one of gold, aluminum, titanium, platinum silicide, and titanium silicide, and can be used as an electrode lead to bond the support anchor point and electrode assembly to the substrate.

[0038] An exemplary embodiment of the present invention also provides a method for manufacturing a MEMS gyroscope, which can be used to manufacture the MEMS gyroscope of the present invention. The method is simple and easy to operate and is applicable to all ring-type MEMS gyroscopes. Figures 3A-3E This diagram illustrates the state of the fabrication method of a MEMS gyroscope according to an exemplary embodiment of the present invention at this stage. It should be understood that... Figures 3D-3E For illustrative purposes, the cantilever structure of the MEMS gyroscope has been omitted to more intuitively illustrate the inventive points of this application.

[0039] like Figure 3A As shown, a first substrate 101 and a second substrate 102 are provided, and electrode leads 200 are formed on the first substrate 101. The formation process of the electrode leads 200 can be a conventional basic planar process. For example, after coating photoresist, photolithography, and development, metal and metal patterns are sputtered on the first substrate 101 to form the electrode leads 200. The metal can be at least one of gold, aluminum, titanium, platinum silicide, and titanium silicide. The metal is used as an intermediate transition layer and is placed between the first substrate 101 and the second substrate 102 to be bonded. When the substrate is a silicon substrate, heating causes the mixture of metal and silicon to abstract silicon atoms from the silicon substrate to be bonded to achieve a saturation state of silicon in the metal-silicon two-phase system. After cooling, a good bond is formed. The first substrate 101 and the second substrate 102 can be various common substrates, such as glass substrates, polycrystalline silicon substrates, and monocrystalline silicon substrates.

[0040] like Figure 3BAs shown, support anchor points 301 and electrode components 302 are formed on the second substrate 102. For example, a resist layer can be formed by applying a resist to the second substrate 102, followed by photolithography and development of the resist layer. Then, the support anchor points 301 and electrode components 302 are etched on the second substrate 102, and finally the resist layer is removed. Alternatively, the support anchor points 301 and electrode components 302 can be formed on the second substrate 102 using processes such as inductively coupled oxygen plasma dry etching and reactive ion etching.

[0041] like Figure 3C As shown, the electrode lead 200 surface of the first substrate 101 is bonded to the electrode support surface of the second substrate 102. The bonding process can be, for example, anodic bonding, where the electrode lead 200 surface of the first substrate 101 is anodicly bonded to the electrode assembly 302 surface of the second substrate. When the first substrate 101 is a glass substrate and the second substrate is a silicon substrate, sufficient Si-O bonds are formed at the interface between the two substrates, resulting in a strong and stable bond. Alternatively, eutectic bonding or direct bonding processes can also be used to bond the two substrates.

[0042] like Figure 3D As shown, a resonant structure 303 is formed on the bonded second substrate 102. For example, a resist layer is applied over the two bonded substrates, then photolithography and development are performed on the resist layer, and finally the resonant structure 303 is etched onto the second substrate 101. The resonant structure 303 forms a capacitor with each individual electrode of the electrode assembly 302. Specifically, the oscillating ring of the etched resonant structure 303 can form a capacitor with each individual electrode of the electrode assembly 302.

[0043] like Figure 3EAs shown, a graphene layer 400 is coated on the surfaces of the resonant structure 303 and the electrode assembly 302. In practical applications, various processes can be used to form the graphene layer 400. Specifically, a phenelzine material layer is formed by depositing phenelzine material using a chemical vapor deposition process. During deposition, the encapsulation of the resonant structure 303 and the electrode assembly 302 should be ensured. Secondly, an inert gas plasma bombardment method is used to form a phenelzine material cross-linking layer on the surface of the phenelzine material layer. For example, in a reactive ion etching system, a plasma containing inert atoms such as argon is used to bombard the phenelzine material layer film to form a phenelzine material cross-linking layer on the surface. Finally, the phenelzine material layer with the formed phenelzine material cross-linking layer is annealed to form the graphene layer 400. For example, when the surfaces of the resonant structure 303 and electrode assembly 302 forming the phenelzine cross-linked layer are subjected to high-temperature annealing, the surface of the phenelzine cross-linked layer will decompose and vaporize, and the supramolecular carbon flakes in the surface phenelzine cross-linked layer will graphitize and transform into a graphene film. By controlling the thickness of the phenelzine cross-linked layer, a single-layer graphene carbon film structure can be prepared. Of course, the thickness of the graphene can also be determined according to the actual situation.

[0044] It should be understood that, in addition to the methods described above for forming graphene layers, a transfer method can also be used to transfer graphene to the surface of resonant structures and electrode components. For example, a transition metal with catalytic activity (such as platinum or copper) can be selected as the growth substrate, and then placed in a high-temperature decomposable precursor atmosphere (such as methane). High-temperature annealing allows carbon atoms to be deposited on the substrate surface, forming a graphene layer with a thickness of 0.34 nm. Of course, the thickness of the graphene can be determined according to the actual situation. Subsequently, a traditional wet method can be used to transfer it to the substrate surface. The steps are as follows: polymethyl methacrylate (PMMA) is spin-coated onto the graphene on the metal substrate surface, forming a protective layer on the graphene surface. Then, the graphene with the protective layer is immersed in a chemical solution, allowing the chemical solution to corrode the metal substrate until the metal substrate is completely corroded, after which it is removed. The graphene with a protective layer, which has been etched clean from the metal substrate, is then washed with distilled water and transferred to the surface of the substrate to allow the graphene to adhere to the substrate. Finally, the PMMA layer on the surface of the graphene is removed by high-temperature thermal decomposition, while the graphene layer on the surface of the resonant structure and electrode components is retained, and all the rest is etched away.

[0045] The following example describes a method for fabricating a MEMS gyroscope according to an exemplary embodiment of the present invention.

[0046] Example 1

[0047] The method for fabricating a MEMS gyroscope provided in this invention includes: first, providing a glass substrate and a polycrystalline silicon substrate; then, coating the glass substrate with photoresist to form a resist layer, followed by photolithography and development of the resist layer; next, sputtering gold and gold patterns onto the glass substrate to form electrode leads, and then removing the resist layer. Then, coating the polycrystalline silicon substrate with resist to form a resist layer, followed by photolithography and development of the resist layer; next, etching support anchors and electrode components onto the polycrystalline silicon substrate, and then removing the resist layer. Next, anodicly bonding the electrode lead surface of the glass substrate to the electrode support surface of the polycrystalline silicon substrate, then coating the bonded substrates with resist to form a resist layer, followed by photolithography and development of the resist layer; next, etching a resonant structure onto the polycrystalline silicon substrate, wherein the resonant structure and the electrode components form a capacitor. Finally, depositing phenelzine material using a chemical vapor deposition process to form a phenelzine material layer. In a reactive ion etching system, a plasma containing inert atoms such as argon is used to bombard the Parylene material layer film, forming a Parylene cross-linked layer on the surface. Finally, the Parylene material layer with the cross-linked layer is annealed, causing the surface of the Parylene material layer to decompose and vaporize. The supramolecular carbon flakes in the surface Parylene cross-linked layer are graphitized and transformed into a 0.34 nm thick graphene film. The graphene layer on the surface of the resonant structure and electrode components is retained, while the remaining graphene layer is etched away.

[0048] Example 2

[0049] The method for fabricating a MEMS gyroscope provided in this invention includes: first, providing a glass substrate and a single-crystal silicon substrate; then, coating the glass substrate with photoresist to form a coating layer, followed by photolithography and development of the coating layer; next, sputtering aluminum and aluminum patterns onto the glass substrate to form electrode leads, and then removing the coating layer. Next, coating a polycrystalline silicon substrate with photoresist to form a coating layer, followed by photolithography and development of the coating layer; then, etching support anchors and electrode components onto the single-crystal silicon substrate, and removing the coating layer. Next, bonding the electrode lead surface of the glass substrate to the electrode support surface of the single-crystal silicon substrate, then coating the bonded substrates with photoresist to form a coating layer, followed by photolithography and development of the coating layer; then, etching a resonant structure onto the single-crystal silicon substrate, wherein the resonant structure and the electrode components form a capacitor. Finally, depositing phenelzine material using a chemical vapor deposition process to form a phenelzine material layer. In a reactive ion etching system, a plasma containing inert atoms such as argon is used to bombard the Parylene material layer film, causing a Parylene cross-linked layer to form on the surface. Finally, the Parylene material layer with the cross-linked layer is annealed, causing the surface of the Parylene material layer to decompose and vaporize. The supramolecular carbon flakes in the surface Parylene cross-linked layer are graphitized and transformed into a 100 nm thick graphene film. The graphene layer on the resonant structure and electrode surface is retained, while the remaining graphene layer is completely etched away.

[0050] Example 3

[0051] The method for fabricating a MEMS gyroscope provided in this invention includes: first, providing a polycrystalline silicon substrate and a single-crystal silicon substrate; then, coating a glass substrate with photoresist to form a coating layer, followed by photolithography and development of the coating layer; next, sputtering platinum silicide and platinum silicide patterns on the glass substrate to form electrode leads, and then removing the coating layer; then, coating a polycrystalline silicon substrate with photoresist to form a coating layer, followed by photolithography and development of the coating layer; then, etching support anchors and electrode components on the single-crystal silicon substrate, and removing the coating layer; next, bonding the electrode lead surface of the glass substrate to the electrode support surface of the single-crystal silicon substrate, then coating a polycrystalline silicon substrate with photoresist to form a coating layer, followed by photolithography and development of the coating layer; finally, etching a resonant structure on the single-crystal silicon substrate, wherein the resonant structure and the electrode components form a capacitor. Finally, a graphene layer with a thickness of 0.34 nm was formed on a platinum substrate using chemical vapor deposition, and then transferred to a single-crystal silicon substrate using a wet transfer method. The graphene layer on the surface of the resonant structure and electrode components was retained, while the rest of the graphene layer was etched away.

[0052] Example 4

[0053] The method for fabricating a MEMS gyroscope provided in this invention includes: first, providing a glass substrate and a single-crystal silicon substrate; then, coating the glass substrate with photoresist to form a coating layer, followed by photolithography and development of the coating layer; next, sputtering titanium silicide and titanium silicide patterns onto the glass substrate to form electrode leads, and then removing the coating layer; then, coating the glass substrate with photoresist to form a coating layer, followed by photolithography and development of the coating layer; then, etching support anchors and electrode components onto the single-crystal silicon substrate, and removing the coating layer; next, anodicly bonding the electrode lead surface of the glass substrate to the electrode support surface of the single-crystal silicon substrate, then coating the bonded substrates with photoresist to form a coating layer, followed by photolithography and development of the coating layer; finally, etching a resonant structure onto the single-crystal silicon substrate, wherein the resonant structure and the electrode components form a capacitor. Finally, a 1 nm thick graphene layer was formed on a platinum substrate using chemical vapor deposition and then transferred to a single-crystal silicon substrate using a wet transfer method. The graphene layer on the surface of the resonant structure and electrode components was retained, while the rest of the graphene layer was etched away.

[0054] The above description does not provide detailed explanations of the technical aspects of each layer's patterning, etching, etc. However, those skilled in the art should understand that various technical means can be used to form layers and regions of the desired shape. Furthermore, to form the same structure, those skilled in the art can also design methods that are not entirely identical to those described above. Additionally, although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination.

[0055] The embodiments of the present invention have been described above. However, these embodiments are merely illustrative and not intended to limit the scope of the invention. The scope of the invention is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of the invention, and all such substitutions and modifications should fall within the scope of the invention.

Claims

1. A MEMS gyroscope, characterized in that, include: The substrate and the electrode assembly, support anchor, resonant structure and graphene layer formed on the substrate; The graphene layer covers the surface of the resonant structure and is formed around the electrode assembly. The resonant structure includes multiple cantilever structures and a vibrating ring; the electrode assembly has a first set of electrodes and a second set of electrodes; the vibrating ring is located between the first set of electrodes and the second set of electrodes, and one end of the vibrating ring facing the substrate is spaced apart from the second set of electrodes and the first set of electrodes; there is a first gap between the first set of electrodes and the vibrating ring, and a second gap between the second set of electrodes and the vibrating ring; the vibrating ring is connected to the support anchor point through the multiple cantilever structures.

2. The MEMS gyroscope according to claim 1, characterized in that, The plurality of cantilever beam structures surround the support anchor point, with the first end of the plurality of cantilever beam structures connected to the support anchor point and the second end of the plurality of cantilever beam structures connected to the vibration ring.

3. The MEMS gyroscope according to claim 1, characterized in that, The first set of electrodes includes multiple first sub-electrodes surrounding the support anchor point. The second set of electrodes includes multiple second sub-electrodes surrounding the support anchor point. The multiple cantilever structures pass through the second set of electrodes and are connected to the vibration ring.

4. The MEMS gyroscope according to claim 3, characterized in that, The first driving electrode and the first detection electrode are located between two adjacent first sub-electrodes.

5. The MEMS gyroscope according to claim 3, characterized in that, The vibrating ring surrounds the support anchor point, and the vibrating ring forms a first capacitor with a first sub-electrode, and the vibrating ring forms a plurality of second capacitors with a plurality of second sub-electrodes.

6. The MEMS gyroscope according to claim 3, characterized in that, Two adjacent first sub-electrodes, one of which is a driving electrode used to drive the resonant structure to vibrate when the MEMS gyroscope is stationary, and the other of which is a detection electrode used to detect the modal changes of the resonant structure when the MEMS gyroscope rotates.

7. A method for manufacturing a MEMS gyroscope based on any one of claims 1 to 6, characterized in that, include: A first substrate and a second substrate are provided; Electrode leads are formed on the first substrate; Support anchors and electrode assemblies are formed on the second substrate; The electrode lead surface of the first substrate is bonded to the electrode assembly surface of the second substrate to form a resonant structure; wherein the resonant structure and the electrode assembly form a capacitor; The graphene layer is coated on the surface of the resonant structure and the electrode assembly.

8. The method for fabricating a MEMS gyroscope according to claim 7, characterized in that, The thickness of the graphene layer is greater than or equal to 0.34 nm.

9. The method for fabricating a MEMS gyroscope according to claim 7, characterized in that, The step of forming electrode leads on the first substrate includes: sputtering metal and metal patterns on the first substrate to form electrode leads; the metal is at least one of gold, aluminum, titanium, platinum silicide, and titanium silicide.

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