A thin film packaging structure

Abstract

The present application provides a thin-film encapsulation structure, comprising a substrate, a light-emitting unit disposed on one side of the substrate, and an encapsulation body disposed on a side of the light-emitting unit away from the substrate and covering the light-emitting unit; the encapsulation body comprises a reinforced water-blocking structure having a gathering portion; the reinforced water-blocking structure is configured to guide water vapor that intrudes into the encapsulation body toward the gathering portion. The thin-film encapsulation structure provided herein, by providing a reinforced water-blocking structure within the encapsulation body, the reinforced water-blocking structure having a gathering portion, can guide intruding water vapor toward the gathering portion, thereby preventing water vapor from corroding the light-emitting unit and ensuring normal light emission from the light-emitting unit.

Description

Technical Field

[0001] The present application relates to the field of device packaging technology, and in particular to a thin film packaging structure. Background Art

[0002] OLED (Organic Light Emitting Diode) devices are optoelectronic devices that emit light through carrier injection and recombination. The specific process is that electrons are injected through a metal cathode and transported to the light-emitting layer via an electron transport material. Holes are injected through a metal anode and transported to the light-emitting layer via a hole transport material. The electrons and holes recombine in the light-emitting layer to form excitons, which then de-excite to emit light. OLED devices have attracted much attention due to their excellent light uniformity, thinness, bendability, flexibility, and stretchability.

[0003] At the same time, OLED devices are extremely sensitive to water and oxygen, so they need to be packaged. The current mainstream packaging method is thin film packaging. The packaging structure of OLED devices used in automotive lighting and display is mostly a water barrier layer plus barrier glue and barrier film, such as Figure 1 As shown, this packaging structure has a significant problem: when water vapor intrudes from the interface between the barrier adhesive and the water-blocking layer, it flows in both directions, toward the water-blocking layer and toward the barrier adhesive. Over time, the water vapor will corrode the OLED device through the water-blocking layer, rendering it unable to emit light. Therefore, this application proposes a thin-film packaging structure. Summary of the Invention

[0004] The purpose of this application is to provide a thin film packaging structure to address the above problems.

[0005] The present application provides a thin film packaging structure, comprising:

[0006] A substrate, a light-emitting unit arranged on one side of the substrate, and a packaging body arranged on a side of the light-emitting unit away from the substrate and covering the light-emitting unit; the packaging body has a reinforced water-blocking structure; the reinforced water-blocking structure has a gathering portion; the reinforced water-blocking structure is used to guide water vapor invading the packaging body to the gathering portion.

[0007] According to the technical solutions provided in certain embodiments of the present application, the reinforced water-blocking structure includes a base portion; the base portion has a plurality of cavities extending vertically therethrough; a pointed cone portion is provided in the cavity; and the cross-sectional area of ​​the cavity and the cross-sectional area of ​​the pointed cone portion both decrease in a direction away from the light-emitting unit.

[0008] According to the technical solutions provided in certain embodiments of the present application, the inner sidewall of the cavity is parallel to the outer sidewall of the pointed cone portion.

[0009] According to the technical solutions provided in certain embodiments of the present application, the pointed cone portion is a conical structure; the height of the pointed cone portion is 1 to 50 μm; and the diameter of the tip of the pointed cone portion is 0.1 to 10 μm.

[0010] According to the technical solutions provided in certain embodiments of the present application, the reinforced water-blocking structure is made of hydrophilic organic material; the reinforced water-blocking structure is made by laser engraving.

[0011] According to the technical solution provided in certain embodiments of the present application, the reinforced water-blocking structure also includes a water-locking layer covering the side of the base portion away from the light-emitting unit; the water-locking layer has pores; the water-locking layer is used to absorb and lock water vapor in the package body.

[0012] According to the technical solutions provided in certain embodiments of the present application, the water-locking layer comprises at least two stacked water-locking sub-layers; and the pores of each of the water-locking sub-layers decrease layer by layer in a direction away from the light-emitting unit.

[0013] According to the technical solutions provided in some embodiments of the present application, the package body includes a water-blocking layer, a barrier adhesive, and a barrier film stacked in sequence in a direction away from the light-emitting unit;

[0014] The material of the water-blocking layer includes any one of silicon nitride, silicon oxide, and silicon oxynitride, or a combination of at least two thereof;

[0015] The barrier film is a metal foil or a plastic water-blocking film.

[0016] According to the technical solutions provided in certain embodiments of the present application, the reinforced water-blocking structure is arranged between the water-blocking layer and the barrier adhesive.

[0017] According to the technical solutions provided in certain embodiments of the present application, the reinforced water-blocking structure is arranged in the water-blocking layer.

[0018] Compared with the prior art, the beneficial effects of the present application are as follows: the thin film packaging structure of the present application, by setting a reinforced water-blocking structure in the packaging body, the reinforced water-blocking structure has a gathering part, and the reinforced water-blocking structure can guide the water vapor invading its interior to the gathering part, thereby avoiding water vapor erosion of the light-emitting unit, which is beneficial to ensure the normal light emission of the light-emitting unit.

[0019] In certain embodiments of the present application, a reinforced water-blocking structure is arranged between the water-blocking layer and the barrier adhesive. The reinforced water-blocking structure includes a pointed cone portion in a microneedle structure and a water-locking layer with pores arranged at the tip of the pointed cone portion. The reinforced water-blocking structure can guide the water vapor that invades the interface between the water-blocking layer and the reinforced water-blocking structure in a direction away from the water-blocking layer, preventing it from flowing toward the water-blocking layer, and can also prevent the water vapor that invades the interface between the reinforced water-blocking structure and the barrier adhesive from flowing toward the side close to the pointed cone portion, thereby preventing water vapor from eroding the light-emitting unit through the water-blocking layer and ensuring normal light emission of the OLED device.

[0020] In certain embodiments of the present application, a reinforced water-blocking structure is provided in the water-blocking layer, which can adsorb and gather water vapor that has invaded the interior of the water-blocking layer, preventing it from flowing to the lower layer of the water-blocking layer, thereby preventing water vapor from eroding the light-emitting unit, which is beneficial to the normal light-emitting of the OLED device. It can prevent water vapor from eroding the light-emitting unit 2, which is beneficial to the normal light-emitting of the OLED, and solves the problem that the middle layer of the water-blocking layer in the prior art is not water-blocking.

[0021] In certain embodiments of the present application, a reinforced water-blocking structure is provided between the water-blocking layer and the barrier adhesive, and in the middle layer of the water-blocking layer. The structure can not only adsorb and gather water vapor that has invaded both sides of the reinforced water-blocking structure between the water-blocking layer and the barrier adhesive, but also adsorb water vapor that has invaded the interior of the water-blocking layer. Thus, the thin-film encapsulation structure forms a double reinforced water-blocking structure, thereby better preventing water vapor from invading the light-emitting unit, which is beneficial to the normal light emission of the OLED device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of a thin film packaging structure with water vapor intrusion in the prior art;

[0023] Figure 2 A schematic structural diagram of the thin film encapsulation structure provided in Example 1 of the present application;

[0024] Figure 3 A schematic structural diagram of the reinforced water-blocking structure provided in Example 1 of the present application;

[0025] Figure 4 A schematic structural diagram of water vapor intrusion into the thin film encapsulation structure provided in Example 1 of the present application;

[0026] Figure 5 A schematic structural diagram of the thin film encapsulation structure provided in Example 2 of the present application;

[0027] Figure 6 A schematic structural diagram of water vapor intrusion into the thin film encapsulation structure provided in Example 2 of the present application;

[0028] Figure 7This is a structural schematic diagram of the thin film encapsulation structure provided in Example 3 of the present application.

[0029] The text annotations in the figure represent:

[0030] 1. Substrate;

[0031] 2. Light-emitting unit; 21. Anode layer; 22. Organic material layer; 23. Cathode layer;

[0032] 3. Package body; 31. Water-blocking layer; 32. Reinforced water-blocking structure; 321. Base portion; 322. Conical portion; 323. Water-locking layer; 33. Barrier adhesive; 34. Barrier film. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the technical solution of the present application, the present application is described in detail below with reference to the accompanying drawings. The description in this section is only exemplary and explanatory and should not have any limiting effect on the scope of protection of the present application.

[0034] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0035] Example 1

[0036] Please refer to Figure 2 This embodiment provides a thin film packaging structure, including a substrate 1, a light-emitting unit 2 provided on one side of the substrate 1, and a packaging body 3 provided on a side of the light-emitting unit 2 away from the substrate 1 and covering the light-emitting unit 2; the packaging body 3 has a reinforced water-blocking structure 32; the reinforced water-blocking structure 32 has a gathering portion; the reinforced water-blocking structure 32 is used to guide water vapor invading the packaging body 3 to the gathering portion.

[0037] Specifically, the substrate 1 is a flexible substrate or a rigid substrate, wherein the flexible substrate can be an organic polymer such as PET, PEN, PI, etc., and the rigid substrate can be glass.

[0038] The light-emitting unit 2 includes an anode layer 21, an organic material layer 22 and a cathode layer 23 stacked in sequence, wherein the material of the anode layer 21 includes ITO and / or IZO; the organic material layer 22 includes a hole injection layer, a hole transport layer, an electron blocking layer, a light-emitting layer, a hole blocking layer and an electron blocking layer stacked in sequence; the material of the cathode layer 23 includes Ag and / or Al.

[0039] The package body 3 includes a water-blocking layer 31 , a reinforced water-blocking structure 32 , a barrier adhesive 33 and a barrier film 34 , which are sequentially stacked in a direction away from the light-emitting unit 2 .

[0040] The water-blocking layer 31 is prepared on the side of the cathode layer 23 away from the organic material layer 22, and its function is to block water and oxygen. The material of the water-blocking layer 31 includes any one of silicon nitride, silicon oxide, and silicon oxynitride, or a combination of at least two of them. The preparation method is a mixture of one or more of ALD (atomic layer deposition), PECVD (chemical vapor deposition), IJP (inkjet printing), screen printing or sputtering.

[0041] The reinforced water-blocking structure 32 is prepared on the side of the water-blocking layer 31 away from the cathode layer 23. Its function is to gather the water vapor that invades the package body 3 toward its own gathering part. Specifically, it guides the water vapor that invades the interface between the water-blocking layer 31 and the reinforced water-blocking structure 32 in a direction away from the water-blocking layer 31, thereby inhibiting the water vapor from flowing toward the water-blocking layer 31; at the same time, it inhibits the water vapor at the interface between the reinforced water-blocking structure 32 and the barrier glue 33 from flowing toward the water-blocking layer 31.

[0042] The barrier glue 33 has a water-absorbing function and can be a polyolefin glue or a rubber glue, and is doped with water-absorbing materials such as barium oxide, magnesium oxide or calcium oxide.

[0043] The barrier film 34 is attached to the barrier adhesive 33 and can be a metal foil or a plastic water-blocking film. The material of the metal foil can be titanium, aluminum, copper, iron or other metal or metal alloy. The structure of the plastic water-blocking film is: inorganic water-blocking materials such as aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, etc. are deposited on organic materials such as PET, PI, PEN.

[0044] For further information, please refer to Figure 3 The reinforced water-blocking structure 32 includes a base portion 321; the base portion 321 has a plurality of cavities extending vertically therethrough; a pointed cone portion 322 is provided in the cavity; the cross-sectional area of ​​the cavity and the cross-sectional area of ​​the pointed cone portion 322 both decrease in a direction away from the light-emitting unit 2.

[0045] In this embodiment, the inner wall of the cavity is a conical surface, the pointed cone portion 322 is a cone structure, and its outer wall is a conical surface, that is, a microneedle structure is formed; the central axis of the cavity coincides with the central axis of the pointed cone portion 322, and the inner wall of the cavity is parallel to the outer wall of the pointed cone portion 322; the tip of the pointed cone portion 322 is the gathering portion.

[0046] The microneedle structure works similarly to cactus spines. In arid regions, cacti survive primarily due to their sharp spines, which collect condensation from the air and deposit it on their surfaces. Similarly, beetles in the Nabur Desert use the elytra on their backs to extract water from the thin air.

[0047] Please refer to Figure 4 When water vapor intrudes from the interface between the water-blocking layer 31 and the reinforced water-blocking structure 32, due to the presence of the pointed cone portion 322 equivalent to a microneedle structure in the reinforced water-blocking structure 32, the water vapor gradually adheres to the surface of the pointed cone portion 322 and gradually gathers along the outer surface of the pointed cone portion 322 toward the tip of the pointed cone portion 322 (i.e., the gathering portion). That is, the pointed cone portion 322 in the reinforced water-blocking structure 32 can guide the water vapor away from the water-blocking layer 31, thereby inhibiting the water vapor from flowing toward the water-blocking layer 31, thereby preventing the water vapor from eroding the light-emitting unit 2 through the water-blocking layer 31, and facilitating the normal light emission of the OLED device. When water vapor intrudes from the interface between the reinforced water-blocking structure 32 and the barrier adhesive 33, the reinforced water-blocking structure 32 also gathers the water vapor in its own gathering portion, thereby inhibiting the water vapor from flowing toward the water-blocking layer 31, thereby preventing the water vapor from eroding the light-emitting unit 2 through the water-blocking layer 31, and facilitating the normal light emission of the OLED device.

[0048] Furthermore, the height of the pointed cone portion 322 is 1 to 50 μm; the diameter of the tip of the pointed cone portion 322 is 0.1 to 10 μm; the reinforced water-blocking structure 32 is made of a hydrophilic organic material, such as fluorinated ethylene propylene; the reinforced water-blocking structure 32 is made by laser engraving. During preparation, the entire piece of fluorinated ethylene propylene is first placed on the water-blocking layer 31, and then a laser engraving machine is used to engrave it from the top surface downward. The power of the laser engraving machine is generally controlled to control the cutting depth to avoid damage to the water-blocking layer 31.

[0049] The thin film encapsulation structure provided in this embodiment provides a reinforced water-blocking structure 32 between the water-blocking layer 31 and the barrier adhesive 33. The reinforced water-blocking structure 32 includes a pointed cone 322, the tip of which serves as a gathering portion. The reinforced water-blocking structure 32 can absorb and gather water vapor that has invaded the interface between the water-blocking layer 31 and the reinforced water-blocking structure 32, as well as water vapor that has invaded the interface between the reinforced water-blocking structure 32 and the barrier adhesive 33, in its own gathering portion, thereby preventing water vapor from flowing toward the water-blocking layer 31 and further preventing water vapor from corroding the light-emitting unit 2, thereby facilitating normal light emission of the OLED device.

[0050] Example 2

[0051] This embodiment provides a thin film packaging structure. The similarities between this embodiment and the thin film packaging structure provided in embodiment 1 are not described in detail. The difference is that: Figure 5 The reinforced water-blocking structure 32 further includes a water-locking layer 323 covering the side of the base portion 321 away from the light-emitting unit 2 ; the water-locking layer 323 has pores; the water-locking layer 323 is used to absorb and lock the water vapor in the packaging body 3 .

[0052] The water-locking layer 323 is made by spin coating, slit coating, inkjet printing, PECVD, sputtering, etc., and its material is at least one of bionic gold, urethane compounds, aldehyde compounds, olefin compounds, aromatic hydrocarbon compounds, polyester compounds, epoxy compounds, silicon oxide, silicon oxynitride, and titanium oxide. The thickness of the water-locking layer 323 is 0.01μm to 10μm.

[0053] Please refer to Figure 6 By providing the water-locking layer 323, on the one hand, when water vapor invades from the interface between the reinforced water-blocking structure 32 and the barrier adhesive 33, the pores in the water-locking layer 323 can quickly absorb and lock the water vapor, preventing the water vapor from flowing to the water-blocking layer; on the other hand, the pores in the water-locking layer 323 can also absorb and lock the water vapor adsorbed and accumulated at the tip of the pointed cone portion 322 (i.e., the gathering portion), thereby facilitating the pointed cone portion 322 to continue to adsorb water vapor invading the interface between the water-blocking layer 31 and the reinforced water-blocking structure 32.

[0054] Preferably, the water-locking layer 323 comprises at least two stacked water-locking sub-layers; and the pores of each water-locking sub-layer decrease layer by layer in a direction away from the light-emitting unit 2 .

[0055] The setting of each water-locking sub-layer is based on the capillary principle. According to the capillary principle, water vapor can flow from the area with larger pores to the area with smaller pores. In this embodiment, the pores of the water-locking sub-layer relatively close to the side of the barrier glue 33 are larger, and the pores of the water-locking sub-layer relatively close to the side of the pointed cone 322 are smaller. This can prevent the water vapor invading from the interface between the reinforced water-blocking structure 32 and the barrier glue 33 from flowing toward the side of the reinforced water-blocking structure 32; as the pores gradually decrease, the capillary force will increase accordingly, so that the water vapor gathered outside the pointed cone 322 gradually flows to the side close to the barrier glue 33 under the action of the water-locking layer 323.

[0056] The thin film encapsulation structure provided in this embodiment provides the reinforced water-blocking structure 32 between the water-blocking layer 31 and the barrier adhesive 33. The reinforced water-blocking structure 32 includes a pointed cone 322 and a water-locking layer 323. The tip of the pointed cone 322 is a gathering portion. The pointed cone 322 can adsorb and gather water vapor that has invaded the interface between the water-blocking layer 31 and the reinforced water-blocking structure 32 at the gathering portion. The water-locking layer 323 can absorb and lock the water vapor gathered on the gathering portion, which is conducive to further gathering water vapor at the gathering portion. It can also block water vapor that has invaded the interface between the reinforced water-blocking structure 32 and the barrier adhesive 33. The dual functions of the pointed cone 322 and the water-locking layer 323 are more conducive to preventing water vapor from eroding the light-emitting unit 2 through the water-blocking layer 31, which is conducive to the normal light emission of the OLED device.

[0057] Example 3

[0058] Please refer to Figure 7 This embodiment provides a thin film encapsulation structure, and the similarities between it and the thin film encapsulation structure provided in Example 1 are not repeated here. The difference is that: the encapsulation body 3 includes a water-blocking layer 31, a barrier glue 33 and a barrier film 34 stacked in sequence in a direction away from the light-emitting unit 2; the reinforced water-blocking structure 32 is arranged in the water-blocking layer 31.

[0059] The water-blocking layer in the prior art generally includes three layers: upper, middle, and lower. The upper and lower layers are mostly made of inorganic materials, and the middle layer is mostly made of organic materials. The middle layer does not have a water-blocking effect. Under normal circumstances, the upper and lower layers of the water-blocking layer can play a water-blocking role. In some unexpected circumstances, water vapor may invade the interior of the water-blocking layer and destroy its waterproof performance. To solve this problem, this embodiment provides a reinforced water-blocking structure 32 in the water-blocking layer 31.

[0060] In this embodiment, the water-blocking layer 31 also has three layers: upper, middle, and lower. The materials of the upper and lower layers include any one or a combination of at least two of silicon nitride, silicon oxide, and silicon oxynitride. The upper and lower layers are both prepared by vapor deposition, and the middle layer is the reinforced water-blocking structure 32. The specific structure of the reinforced water-blocking structure 32 is shown in Example 1 and will not be repeated here.

[0061] The thin film encapsulation structure provided in this embodiment provides the reinforced water-blocking structure 32 in the middle layer of the water-blocking layer 31. The reinforced water-blocking structure 32 includes a pointed cone portion 322 in a microneedle structure, and the tip of the pointed cone portion 322 is a gathering portion. This enables the thin film encapsulation structure to block water vapor that intrudes into the water-blocking layer 31 and prevent it from flowing to the lower layer of the water-blocking layer 31, thereby preventing water vapor from eroding the light-emitting unit 2, which is beneficial to the normal light emission of the OLED device.

[0062] Example 4

[0063] This embodiment provides a thin-film encapsulation structure. Similarities with the thin-film encapsulation structure provided in Example 3 are omitted. The difference lies in that the reinforced water-blocking structure 32 further includes a water-locking layer 323 covering the side of the base portion 321 away from the light-emitting unit 2; the water-locking layer 323 has pores; and the water-locking layer 323 is used to absorb and lock moisture within the encapsulation body 3. The specific structure, materials, and preparation process of the water-locking layer 323 are described in Example 2 and are omitted here.

[0064] The thin film encapsulation structure provided in this embodiment provides the reinforced water-blocking structure 32 in the middle layer of the water-blocking layer 31. The reinforced water-blocking structure 32 includes a pointed cone portion 322 having a microneedle structure and a water-locking layer 323 that can quickly absorb and lock water vapor. The pointed cone portion 322 and the water-locking layer 323 together form a double protective barrier, so that the thin film encapsulation structure can double-block water vapor that invades the interior of the water-blocking layer 31, preventing it from flowing to the lower layer of the water-blocking layer 31, thereby preventing water vapor from eroding the light-emitting unit 2, which is beneficial to the normal light emission of the OLED device.

[0065] Example 5

[0066] This embodiment provides a thin film encapsulation structure, which differs from Example 4 in that a reinforced water-blocking structure 32 is further provided between the water-blocking layer 31 and the barrier adhesive 33. That is, the thin film encapsulation structure provided by this embodiment includes two reinforced water-blocking structures 32. The two reinforced water-blocking structures 32 have the same structure, one of which is arranged between the water-blocking layer 31 and the barrier adhesive 33, and the other is arranged in the middle layer of the water-blocking layer 31.

[0067] The thin film encapsulation structure provided in this embodiment has a reinforced water-blocking structure 32 provided between the water-blocking layer 31 and the barrier adhesive 33, and a reinforced water-blocking structure 32 provided in the middle layer of the water-blocking layer 31. This structure can not only adsorb and accumulate water vapor that has intruded onto both sides of the reinforced water-blocking structure 32 between the water-blocking layer 31 and the barrier adhesive 33, but can also adsorb water vapor that has intruded into the interior of the water-blocking layer 31. Thus, the thin film encapsulation structure forms a double reinforced water-blocking structure, thereby better preventing water vapor from invading the light-emitting unit 2, which is beneficial to the normal light emission of the OLED device.

[0068] This article uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is only used to help understand the method and core ideas of this application. The above is only the preferred implementation method of this application. It should be pointed out that due to the limitations of textual expression, there are objectively infinite specific structures. For ordinary technicians in this technical field, without departing from the principles of the present invention, they can also make several improvements, modifications or changes, and can also combine the above technical features in an appropriate manner; these improvements, modifications, changes or combinations, or the direct application of the inventive concept and technical solution to other occasions without improvement, should be regarded as the scope of protection of this application.

Claims

1. A thin film packaging structure, characterized in that: The invention comprises a substrate (1), a light-emitting unit (2) provided on one side of the substrate (1), and a packaging body (3) provided on a side of the light-emitting unit (2) away from the substrate (1) and covering the light-emitting unit (2); the packaging body (3) has a reinforced water-blocking structure (32); the reinforced water-blocking structure (32) has a gathering portion; the reinforced water-blocking structure (32) is used to guide water vapor intruding into the packaging body (3) toward the gathering portion; The reinforced water-blocking structure (32) includes a base portion (321); the base portion (321) has a plurality of cavities extending vertically therethrough; a pointed cone portion (322) is provided in the cavity; the cross-sectional area of ​​the pointed cone portion (322) decreases in a direction away from the light-emitting unit (2), forming a microneedle structure; The reinforced water-blocking structure (32) is made of hydrophilic organic material; The reinforced water-blocking structure (32) further comprises a water-locking layer (323) covering the side of the base portion (321) away from the light-emitting unit (2); the water-locking layer (323) has pores; the water-locking layer (323) is used to absorb and lock water vapor in the packaging body (3); The water-locking layer (323) comprises at least two stacked water-locking sub-layers; along a direction away from the light-emitting unit (2), the pores of each water-locking sub-layer decrease layer by layer.

2. The thin film encapsulation structure according to claim 1, wherein: The inner side wall of the cavity is parallel to the outer side wall of the pointed cone portion (322).

3. The thin film encapsulation structure according to claim 2, wherein: The pointed cone portion (322) is a conical structure; the height of the pointed cone portion (322) is 1 to 50 μm; and the diameter of the tip of the pointed cone portion (322) is 0.1 to 10 μm.

4. The thin film encapsulation structure according to claim 2, wherein: The reinforced water-blocking structure (32) is made by laser engraving.

5. The thin film encapsulation structure according to any one of claims 1 to 4, characterized in that: The packaging body (3) comprises a water-blocking layer (31), a barrier adhesive (33), and a barrier film (34) which are sequentially stacked in a direction away from the light-emitting unit (2); The material of the water-blocking layer (31) includes any one of silicon nitride, silicon oxide, and silicon oxynitride, or a combination of at least two thereof; The barrier film (34) is a metal foil or a plastic water-blocking film.

6. The thin film encapsulation structure according to claim 5, characterized in that: The reinforced water-blocking structure (32) is arranged between the water-blocking layer (31) and the barrier glue (33).

7. The thin film encapsulation structure according to claim 5, wherein: The reinforced water-blocking structure (32) is arranged in the water-blocking layer (31).

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