Display device and method of manufacturing the same

Abstract

Embodiments of the present application disclose a display device and a manufacturing method thereof. The display device comprises a flexible display panel, a driving chip and a flexible circuit board. The flexible display panel has a display area, a bending area and a bonding area. The bending area is connected between the display area and the bonding area. The bonding area is bent to a non-display side of the flexible display panel through the bending area. The bonding area comprises a first bonding area and a second bonding area. The first bonding area is located on a side of the flexible display panel away from a bending direction. The second bonding area is located on a side of the flexible display panel facing the bending direction. The driving chip is bonded to the first bonding area. The flexible circuit board is bonded to the second bonding area. The technical solution of the embodiments of the present application helps to reduce the thickness of the display device at the position of the first bonding area, and supports the bent flexible display panel by the flexible circuit board, which helps to avoid the problem of broken lines caused by dead folding of the bending area after bending.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display device and its manufacturing method. Background Technology

[0002] With the continuous development of display technology, the thickness of display panels is becoming increasingly thinner, and flexible display panels have been widely used. However, existing flexible display panels have a large number of module layers, which not only increases design costs but also makes it difficult to reduce the thickness of flexible display panels. How to reduce the thickness of flexible display panels while ensuring the reliability of the screen has become an urgent problem to be solved. Summary of the Invention

[0003] This invention provides a display device and its manufacturing method to reduce the thickness of the display device at the first bonding area. By using a flexible circuit board to support the bent flexible display panel, it helps to avoid the problem of wire breakage caused by dead bending in the bending area after bending.

[0004] In a first aspect, embodiments of the present invention provide a display device, comprising:

[0005] A flexible display panel has a display area, a bending area, and a bonding area. The bending area connects the display area and the bonding area. The bonding area is bent to the non-display side of the flexible display panel through the bending area. The bonding area includes a first bonding area and a second bonding area. The first bonding area is located on the side of the flexible display panel away from the bending direction, and the second bonding area is located on the side of the flexible display panel facing the bending direction.

[0006] A driver chip and a flexible circuit board, wherein the driver chip is bonded to a first bonding area and the flexible circuit board is bonded to a second bonding area.

[0007] Optionally, the distance between the flexible circuit board and the bending area is less than or equal to the distance between the driver chip and the bending area.

[0008] Optionally, the flexible circuit board is connected to the edge of the bending region near the second bonding region.

[0009] Optionally, the flexible circuit board is located between the display area and the second bonding area along a direction perpendicular to the plane where the display area is located, so as to support the display area and the bonding area through the flexible circuit board.

[0010] Optionally, the display device further includes an adhesive layer, wherein a first surface of the flexible circuit board is bonded to a second bonding area, and a second surface of the flexible circuit board is bonded to the non-display side of the flexible display panel via the adhesive layer, with the first surface and the second surface facing each other.

[0011] Optionally, the display device further includes a first support layer, which is located between the flexible circuit board and the adhesive layer in the second bonding area along a direction perpendicular to the plane where the display area is located;

[0012] Preferably, the display device further includes a second support layer, which is located between the adhesive layer and the flexible display panel of the display area along a direction perpendicular to the plane where the display area is located.

[0013] Optionally, the flexible circuit board has a first region, a second region, and a third region, which are arranged sequentially from the side of the flexible circuit board closer to the bonding area to the side farther away from the bonding area.

[0014] The first surface of the flexible circuit board includes a plurality of signal terminals, the signal terminals being located in the second region and bonded to the second bonding region.

[0015] Optionally, the first region of the flexible circuit board is connected to the edge of the bending region near the second bonding region;

[0016] Preferably, in a direction perpendicular to the plane where the display area is located, at least the first region and the second region of the flexible circuit board are located between the display area and the second bonding area to support the display area and the bonding area;

[0017] Preferably, the length of the first region ranges from 2mm to 8mm.

[0018] Optionally, a protective layer is further provided around the second region, and the protective layer is located between the flexible display panel and the first surface of the flexible circuit board in the second bonding region along a direction perpendicular to the plane where the display area is located.

[0019] Secondly, embodiments of the present invention provide a method for manufacturing a display device, comprising:

[0020] A flexible display panel is provided, the flexible display panel having a display area, a bending area and a bonding area, the bending area connecting the display area and the bonding area, and the bonding area including a first bonding area and a second bonding area;

[0021] The driver chip is bonded to the first bonding area, and the flexible circuit board is bonded to the second bonding area.

[0022] The bonding area is bent through the bending area to the non-display side of the flexible display panel;

[0023] The first bonding area is located on the side of the flexible display panel away from the bending direction, and the second bonding area is located on the side of the flexible display panel facing the bending direction.

[0024] The display device and its manufacturing method provided in this invention have a first bonding area located on the side of the flexible display panel away from the bending direction, and a second bonding area located on the side of the flexible display panel facing the bending direction. By bonding the driver chip to the first bonding area and the flexible circuit board to the second bonding area, the driver chip and the flexible circuit board can be located on opposite sides of the flexible display panel. Compared with the prior art, it is not necessary to bond the flexible circuit board to the first bonding area where the driver chip is located, thus avoiding the flexible circuit board occupying the space along the thickness direction of the display device at the first bonding area, which helps to reduce the thickness of the display device at the first bonding area. By bonding the flexible circuit board to the second bonding area, the flexible circuit board can also be used to elevate the flexible display panel in the bent bonding area to support the bent flexible display panel. This allows the flexible circuit board to assist or even replace the support structure in the display device, which helps to ensure the bending radius of the flexible display panel and avoid the problem of dead bending and wire breakage in the bent area after bending. At the same time, it saves on the design and material costs of the support structure and simplifies the manufacturing process of the display device.

[0025] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a top view of a display device in related technologies;

[0028] Figure 2 This is a schematic diagram of the structure of a display device before it is bent, which is part of a related technology.

[0029] Figure 3 yes Figure 2 The diagram shows the structure of the display device after it has been bent.

[0030] Figure 4 yes Figure 1 A schematic diagram of the flexible circuit board structure in the diagram;

[0031] Figure 5 This is a top view of a display device before bending, provided in an embodiment of the present invention;

[0032] Figure 6 yes Figure 5 The top view of the display device after it has been bent.

[0033] Figure 7 yes Figure 5 The sectional view of the display device shown is obtained by cutting along section line DD'.

[0034] Figure 8 yes Figure 6 The display device shown is a cross-sectional view obtained by cutting along section line EE'.

[0035] Figure 9 yes Figure 6 Another sectional view obtained by cutting the display device along section line EE';

[0036] Figure 10 yes Figure 6 Another sectional view obtained by cutting the display device along section line EE';

[0037] Figure 11 This is a schematic diagram of the structure of a flexible circuit board provided in an embodiment of the present invention;

[0038] Figure 12 This is a schematic flowchart of a method for manufacturing a display device according to an embodiment of the present invention. Detailed Implementation

[0039] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0040] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0041] As described in the background section, existing flexible display panels have a large number of module layers, which not only increases design costs but also makes it difficult to reduce the thickness of the flexible display panel. How to reduce the thickness of the flexible display panel while ensuring screen reliability has become an urgent problem to be solved. The inventors have discovered the specific reasons for the above problems as follows:

[0042] Figure 1 This is a top view of a display device in related technologies; Figure 2 This is a schematic diagram of the structure of a display device before it is bent, which is part of a related technology. Figure 3 yes Figure 2 The diagram shows the structure of the display device after it has been bent. Figure 4 yes Figure 1 A schematic diagram of the structure of the flexible circuit board in the diagram. Exemplarily, combined with... Figures 1 to 3 The display device includes a flexible display panel 110, a driver chip 120, and a flexible circuit board 130. Both the driver chip 120 and the flexible circuit board 130 are bonded to the bonding area of ​​the flexible display panel 110. The flexible circuit board 130 is bonded to the flexible display panel 110 using FOP (FPC On Panel) technology. The flexible display panel 110 has a bending area, allowing it to be bent so that the driver chip 120 and the flexible circuit board 130 are positioned above the bent flexible display panel 110. This results in the area of ​​the flexible display panel 110 where the flexible circuit board 130 is bonded being thicker than other areas, occupying space in the thickness direction of the display device. To ensure the bending radius of the flexible display panel 110 and improve reliability, a shim 140 is typically placed below the bent portion of the flexible display panel 110 to support it and prevent a sharp bend. However, the addition of the shim 140 not only increases the number of module layers but also increases process and design costs. Furthermore… Figure 4The diagram illustrates the structure of the flexible circuit board 130 bonded to the flexible display panel 110 on one side, including the gold finger area 131. In conventional designs, a safety distance d1 needs to be set between the driver chip 120 and the flexible circuit board 130. The value of d1 is generally around 0.7mm, which prevents the size of the flexible circuit board 130 near the gold finger area 131 from being extended, resulting in tight wiring space for the flexible circuit board 130.

[0043] To address the aforementioned problems, embodiments of the present invention provide a display device. Figure 5 This is a top view of a display device before bending, provided in an embodiment of the present invention; Figure 6 yes Figure 5 The top view of the display device after it has been bent. Figure 7 yes Figure 5 The sectional view of the display device shown is obtained by cutting along section line DD'. Figure 8 yes Figure 6 The display device shown is a cross-sectional view obtained by cutting along section line EE'. Combined with... Figures 5 to 8 The display device includes: a flexible display panel 210, a driver chip 220, and a flexible circuit board 230.

[0044] The flexible display panel 210 has a display area AA, a bending area B, and a bonding area C. The bending area B connects the display area AA and the bonding area C. The bonding area C is bent through the bending area B to the non-display side of the flexible display panel 210. The bonding area C includes a first bonding area C1 and a second bonding area C2. The first bonding area C1 is located on the side of the flexible display panel 210 away from the bending direction, and the second bonding area C2 is located on the side of the flexible display panel 210 facing the bending direction. A driver chip 220 is bonded to the first bonding area C1, and a flexible circuit board 230 is bonded to the second bonding area C2.

[0045] Specifically, the flexible display panel 210 refers to a display panel with good bending performance, capable of being bent. This display panel may specifically include an organic light-emitting diode (OLED) display panel, etc. The flexible display panel 210 has a display side and a non-display side. Figure 5 and Figure 6 All are top views of the non-display side of the flexible display panel 210. Optionally, the display device also includes a cover plate 240, a polarizer 250, and an optical adhesive layer 260. The polarizer 250 is located on the display side of the flexible display panel 210, and the cover plate 240 is attached to the side of the polarizer 250 away from the flexible display panel 210 via the optical adhesive layer 260.

[0046] The bending area B of the flexible display panel 210 can be bent toward the non-display side of the flexible display panel 210 to bend the bonding area C toward the non-display side of the flexible display panel 210. The first bonding area C1 and the second bonding area C2 in the bonding area C are located on both sides of the flexible display panel 210. The first bonding area C1 is located on the side of the flexible display panel 210 away from the bending direction, that is, the side of the flexible display panel 210 away from the cover plate 240. The second bonding area C2 is located on the side of the flexible display panel 210 facing the bending direction, that is, the side of the flexible display panel 210 closer to the cover plate 240.

[0047] The driver chip 220 includes a display driver integration circuit (DDIC) or a touch and display driver integration (TDDI) chip. The flexible printed circuit board 230 (FPC) can be a flexible printed circuit board made with polyimide or polyester film as a substrate. Multiple bonding pads can be provided in both the first bonding area C1 and the second bonding area C2. The bonding pads in the first bonding area C1 are electrically connected to the signal lines in the flexible display panel 210, and the signal terminals in the driver chip 220 are bonded to the bonding pads in the first bonding area C1, enabling the driver chip 220 to transmit signals to the flexible display panel 210. The bonding pads in the second bonding area C2 are electrically connected to the bonding pads in the first bonding area C1, and the signal terminals in the flexible circuit board 230 are bonded to the bonding pads in the second bonding area C2, enabling the flexible circuit board 230 to provide signals to the driver chip 220.

[0048] By bonding the driver chip 220 to the first bonding area C1 and the flexible circuit board 230 to the second bonding area C2, the driver chip 220 and the flexible circuit board 230 can be located on opposite sides of the flexible display panel 210 (see...). Figure 8 ),and Figure 3 Compared to the proposed solution, there is no need to bond the flexible circuit board 230 to the first bonding area C1 where the driver chip 220 is located. This avoids the flexible circuit board 230 occupying the space along the thickness direction of the display device at the first bonding area C1, thus reducing the thickness of the display device at the first bonding area C1. By bonding the flexible circuit board 230 to the second bonding area C2, the flexible circuit board 230 can also be used to elevate the flexible display panel 210 in the bent bonding area C, providing support for the bent flexible display panel 210. This allows the flexible circuit board 230 to assist or even replace the support structure in the display device (e.g., Figure 2 and Figure 3The raised block 140 in the middle helps to ensure the bending radius of the flexible display panel 210, so as to avoid the problem of dead bending in the bending area B after bending, which would lead to wire breakage, thus ensuring the reliability of the screen. At the same time, it saves the design and material costs of the support structure and simplifies the manufacturing process of the display device.

[0049] In summary, the technical solution of this invention sets a first bonding area on the side of the flexible display panel away from the bending direction, and a second bonding area on the side of the flexible display panel facing the bending direction. By bonding the driver chip to the first bonding area and the flexible circuit board to the second bonding area, the driver chip and the flexible circuit board can be located on opposite sides of the flexible display panel. Compared with the prior art, it is not necessary to bond the flexible circuit board to the first bonding area where the driver chip is located, thus avoiding the flexible circuit board occupying the space along the thickness direction of the display device at the first bonding area, which helps to reduce the thickness of the display device at the first bonding area. By bonding the flexible circuit board to the second bonding area, the flexible circuit board can also be used to raise the flexible display panel in the bent bonding area to support the bent flexible display panel. This allows the flexible circuit board to assist or even replace the support structure in the display device, which helps to ensure the bending radius of the flexible display panel and avoid the problem of dead bending and wire breakage after bending. At the same time, it saves on the design and material costs of the support structure and simplifies the manufacturing process of the display device.

[0050] Based on the above embodiments, combined with Figures 5 to 8 Optionally, the distance between the flexible circuit board 230 and the bending area B is less than or equal to the distance between the driver chip 220 and the bending area B. The distance between the flexible circuit board 230 and the bending area B refers to the vertical distance between the edge of the flexible circuit board 230 near the bending area B and the edge of the bending area B near the bonding area C. Similarly, the distance between the driver chip 220 and the bending area B refers to the vertical distance between the edge of the driver chip 220 near the bending area B and the edge of the bending area B near the bonding area C. Figures 5 to 8 The examples show a case where the distance between the flexible circuit board 230 and the bending area B is equal to the distance between the driver chip 220 and the bending area B. In other embodiments, the distance between the flexible circuit board 230 and the bending area B can also be set to be less than the distance between the driver chip 220 and the bending area B.

[0051] exist Figure 2 In the illustrated solution, because a safety distance d1 needs to be set between the driver chip 120 and the flexible circuit board 130, the distance between the flexible circuit board 130 and the bending area is greater than the distance between the driver chip 120 and the bending area. Therefore, the dimension of the side of the flexible circuit board 130 closest to the driver chip 120 cannot be extended, resulting in limited wiring space for the flexible circuit board 130. Figure 3Compared to the scheme shown, the technical solution of this embodiment of the invention bonds the driving chip 220 and the flexible circuit board 230 to opposite sides of the flexible display panel 210 respectively, eliminating the need to set a safety distance between the driving chip 220 and the flexible circuit board 230. By setting the distance between the flexible circuit board 230 and the bending area B to be less than or equal to the distance between the driving chip 220 and the bending area B, the flexible circuit board 230 can be extended to the edge near the bonding area C, allowing the length of the flexible circuit board 230 to be designed to be longer, which is beneficial to extending the shape of the flexible circuit board 230 and thus increasing the wiring space of the flexible circuit board 230.

[0052] Combination Figures 5 to 8 Furthermore, the flexible circuit board 230 is connected to the edge of the bending area B near the second bonding area C2. Along a direction perpendicular to the plane of the display area AA, the flexible circuit board 230 is located between the display area AA and the second bonding area C2, so as to support the display area AA and the bonding area C. By aligning the flexible circuit board 230 with the edge of the bending area B near the second bonding area C2, the flexible circuit board 230 extends to the edge of the bending area B near the second bonding area C2. Thus, after bending the bonding area C of the flexible circuit board 230 to the non-display side of the flexible display panel 210, the flexible circuit board 230 is positioned between the plane of the display area AA and the plane of the second bonding area C2, perpendicular to the plane of the display area AA. This elevates the flexible display panel 210 at the bonding area C, providing support for the bent flexible display panel 210. Furthermore, by adjusting the thickness of the flexible circuit board 230 to match the bending radius of the flexible display panel 210, the flexible circuit board 230 can replace the support structure in the display device (e.g., ...). Figure 2 and Figure 3 The raised block 140 in the middle is used to avoid the problem of dead bend in the bending area B after bending, which would cause the wire to break. At the same time, it saves the design and material costs of the support structure and reduces the attachment process of the support structure, which helps to simplify the manufacturing process of the display device.

[0053] See Figure 7 and Figure 8Furthermore, the first surface of the flexible circuit board 230 is bonded to the second bonding area C2, and the second surface of the flexible circuit board 230 is bonded to the non-display side of the flexible display panel 210 via an adhesive layer 270, with the first and second surfaces facing each other. Specifically, the adhesive layer 270 is made of composite adhesive tape. The adhesive layer 270 is formed on the side of the flexible display panel 210 away from the cover plate 240, so as to attach the second surface of the flexible circuit board 230 to the non-display side of the flexible display panel 210 through the adhesive layer 270, thereby ensuring a firm bond between the flexible circuit board 230 and the flexible display panel 210 and preventing peeling between the film layers.

[0054] Figure 9 yes Figure 6 Another sectional view of the display device shown is obtained by cutting along section line EE'. See also Figure 9 The display device also includes a first support layer 280, which is located between the flexible circuit board 230 and the adhesive layer 270 of the second bonding area C2 along a direction perpendicular to the plane of the display area AA. Specifically, the length of the first support layer 280 can be less than or equal to the length of the flexible circuit board 230. The edge of the first support layer 280 near the bonding area C can be flush with the edge of the bonding area C near the bending area B. The vertical projection of the first support layer 280 on the cover plate 240 overlaps with the vertical projection of the flexible display panel 210 of the bonding area C on the cover plate 240. In this way, the flexible circuit board 230 and the first support layer 280 can be used together to raise the flexible display panel 210 of the bonding area C to support the bent flexible display panel 210. Based on this, by adjusting the overall thickness of the flexible circuit board 230 and the first support layer 280 between the display area AA and the bonding area C, the overall thickness of the flexible circuit board 230 and the first support layer 280 between the display area AA and the bonding area C is matched with the bending radius of the flexible display panel 210. This helps to avoid the problem of wire breakage caused by a dead bend in the bending area B after bending. The sum of the thicknesses of the flexible circuit board 230 and the first support layer 280 can be less than or equal to the thickness of the support structure in the prior art (e.g., ...). Figure 2 and Figure 3 The thickness of the shim block 140 is reduced to avoid increasing the thickness of the display device. Figure 10 yes Figure 6 Another sectional view of the display device shown is obtained by cutting along section line EE'. See also Figure 9 or Figure 10Based on the above embodiments, optionally, the display device further includes a second support layer 290, located between the adhesive layer 270 and the flexible display panel 210 of the display area AA, along a direction perpendicular to the plane where the display area AA is located. Specifically, the second support layer 290 is located on the side of the flexible display panel 210 away from 240, and the adhesive layer 270 may be formed on the side of the second support layer 290 away from the flexible display panel 210. The second support layer 290 is used to protect the flexible display panel 210 and support the bent flexible display panel 210, which helps to ensure the bending radius of the flexible display panel 210. The second support layer 290 is a flexible material structure, such as polyimide (PI), and specifically includes a support film.

[0055] Figure 11 This is a schematic diagram of the structure of a flexible circuit board provided in an embodiment of the present invention. Figure 11 The flexible circuit board 230 shown can be Figures 5 to 10 Flexible circuit board 230 for any display device. Combined with... Figure 10 and Figure 11 Based on the above embodiments, optionally, along the length of the flexible circuit board 230, the flexible circuit board 230 has a first region a1, a second region a2, and a third region a3, arranged sequentially from the side of the flexible circuit board 230 closest to the bonding area C to the side furthest from the bonding area C. The first surface of the flexible circuit board 230 includes a plurality of signal terminals 231, the signal terminals 231 being located in the second region a2 and bonded to the second bonding area C2. The signal terminals 231 in the flexible circuit board 230 can be "gold fingers," the second region a2 corresponding to the gold finger region, and the signal terminals 231 in the flexible circuit board 230 are bonded to the pads in the second bonding area C2.

[0056] Furthermore, the first region a1 of the flexible circuit board 230 is connected to the edge of the bending region B near the second bonding region C2. Along a direction perpendicular to the plane of the display region AA, at least the first region a1 and the second region a2 of the flexible circuit board 230 are located between the display region AA and the second bonding region C2 to support the display region AA and the bonding region C. Specifically, the edge of the first region a1 of the flexible circuit board 230 near the bending region B is connected to the edge of the bending region B near the second bonding region C2. This allows the first region a1 of the flexible circuit board 230 to extend to the edge of the bending region B near the second bonding region C2, and along a direction perpendicular to the plane of the display region AA, the first region a1 of the flexible circuit board 230 is located between the plane of the display region AA and the plane of the second bonding region C2, so that the flexible display panel 210 of the bonding region C is raised by the first region a1 of the flexible circuit board 230, thus supporting the bent flexible display panel 210. Based on this, by adjusting the thickness of the first region a1 of the flexible circuit board 230, the thickness of the first region a1 of the flexible circuit board 230 is matched with the bending radius of the flexible display panel 210, so as to replace the support structure in the display device with the first region a1 of the flexible circuit board 230.

[0057] exist Figures 1 to 4 In the illustrated solution, because a safety distance d1 needs to be set between the driver chip 120 and the flexible circuit board 130, the dimension of the flexible circuit board 130 near the gold finger area 131 cannot be extended, resulting in tight wiring space for the flexible circuit board 130. Compared with the above solution, the technical solution of this embodiment can increase the dimension of the flexible circuit board 230 near the second region a2, that is, the length d2 of the first region a1, so as to increase the wiring space of the first region a1 of the flexible circuit board 230 while supporting the bent flexible display panel 210 through the flexible circuit board 230. Optionally, in one embodiment, the length d2 of the first region a1 ranges from 2mm to 8mm, and preferably, the length d2 of the first region a1 is 4mm.

[0058] Combination Figure 10 and Figure 11 Optionally, a protective layer is also provided around the second region a2. Along a direction perpendicular to the plane of the display area AA, the protective layer is located between the first surface of the flexible display panel 210 and the flexible circuit board 230 of the second bonding region C2. Specifically, after the flexible circuit board 230 is bonded to the flexible display panel 210, a protective layer can be coated around the second region a2, and this protective layer is located between the first surface of the flexible display panel 210 and the flexible circuit board 230 of the second bonding region C2 to prevent moisture from entering the second region a2 and causing corrosion.

[0059] This invention also provides a method for manufacturing a display device, applicable to the manufacturing of the display device in any of the above embodiments. Figure 12 This is a schematic flowchart illustrating a method for manufacturing a display device according to an embodiment of the present invention. See also... Figure 12 The method specifically includes the following steps:

[0060] S110. A flexible display panel is provided, the flexible display panel having a display area, a bending area and a bonding area, the bending area connecting the display area and the bonding area, and the bonding area including a first bonding area and a second bonding area.

[0061] S120. Bond the driver chip to the first bonding area and bond the flexible circuit board to the second bonding area.

[0062] S130, the bonding area is bent through the bending area to the non-display side of the flexible display panel.

[0063] The first bonding area is located on the side of the flexible display panel away from the bending direction, and the second bonding area is located on the side of the flexible display panel facing the bending direction.

[0064] The technical solution of this invention sets a first bonding area on the side of the flexible display panel away from the bending direction, and a second bonding area on the side of the flexible display panel facing the bending direction. By bonding the driver chip to the first bonding area and the flexible circuit board to the second bonding area, the driver chip and the flexible circuit board can be located on opposite sides of the flexible display panel. Compared with the prior art, it is not necessary to bond the flexible circuit board to the first bonding area where the driver chip is located, thus avoiding the flexible circuit board occupying the space along the thickness direction of the display device at the first bonding area, which helps to reduce the thickness of the display device at the first bonding area. By bonding the flexible circuit board to the second bonding area, the flexible circuit board can also be used to raise the flexible display panel in the bent bonding area to support the bent flexible display panel. This allows the flexible circuit board to assist or even replace the support structure in the display device, which helps to ensure the bending radius of the flexible display panel and avoid the problem of dead bending and wire breakage after bending. At the same time, it saves on the design and material costs of the support structure and simplifies the manufacturing process of the display device.

[0065] Optionally, prior to step S130, the method for manufacturing the display device further includes:

[0066] An adhesive layer is formed on the non-display side of the flexible display panel to bond the first surface of the flexible circuit board to the second bonding area, and the second surface of the flexible circuit board is bonded to the non-display side of the bent flexible display panel through the adhesive layer.

[0067] Optionally, prior to step S130, the method for manufacturing the display device further includes:

[0068] A first support layer is formed on the side of the adhesive layer away from the flexible display panel. The first support layer is located between the flexible circuit board and the adhesive layer in the second bonding area, along a direction perpendicular to the plane where the display area is located.

[0069] Optionally, prior to step S130, the method for manufacturing the display device further includes:

[0070] A second support layer is formed on the non-display side of the flexible display panel, and the second support layer is located between the adhesive layer and the flexible display panel of the display area along a direction perpendicular to the plane where the display area is located.

[0071] Optionally, along the length of the flexible circuit board, the flexible circuit board has a first region, a second region, and a third region, arranged sequentially from the side of the flexible circuit board closer to the bonding area to the side farther from the bonding area; the first surface of the flexible circuit board includes a plurality of signal terminals, the signal terminals are located in the second region, and the signal terminals are bonded to the second bonding area; correspondingly, after step S120, the method for manufacturing the display device further includes:

[0072] A protective layer is formed around the second region, and along a direction perpendicular to the plane where the display area is located, the protective layer is located between the flexible display panel of the second bonding region and the first surface of the flexible circuit board.

[0073] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0074] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A display device, characterized by comprising: The display device comprises: a flexible display panel having a display area, a bending area and a bonding area, the bending area being connected between the display area and the bonding area, the bonding area being bent to a non-display side of the flexible display panel through the bending area, the bonding area comprising a first bonding area and a second bonding area, the first bonding area being located on a side of the flexible display panel away from a bending direction, and the second bonding area being located on a side of the flexible display panel toward the bending direction; a driving chip and a flexible circuit board, the driving chip being bonded to the first bonding area, and the flexible circuit board being bonded to the second bonding area; a distance between the flexible circuit board and the bending area being less than or equal to a distance between the driving chip and the bending area.

2. The display device according to claim 1, wherein The flexible circuit board is adjacent to an edge of the bending area on a side of the second bonding area.

3. The display device according to claim 1, wherein In a direction perpendicular to a plane where the display area is located, the flexible circuit board is located between the display area and the second bonding area to support the display area and the bonding area through the flexible circuit board.

4. The display device according to claim 3, wherein The display device further comprises an adhesive layer, a first surface of the flexible circuit board being bonded to the second bonding area, and a second surface of the flexible circuit board being adhered to a non-display side of the flexible display panel through the adhesive layer, the first surface and the second surface being opposite to each other.

5. The display device according to claim 4, wherein The display device further comprises a first support layer, the first support layer being located between the flexible circuit board and the adhesive layer of the second bonding area in a direction perpendicular to the plane where the display area is located.

6. The display device according to claim 5, wherein The display device further comprises a second support layer, the second support layer being located between the adhesive layer and the flexible display panel of the display area in a direction perpendicular to the plane where the display area is located.

7. The display device according to any one of claims 1 to 6, wherein The flexible circuit board has a first region, a second region and a third region, the first region, the second region and the third region being arranged in sequence from a side of the flexible circuit board close to the bonding area to a side of the flexible circuit board away from the bonding area. A first surface of the flexible circuit board comprises a plurality of signal terminals, the signal terminals being located in the second region, and the signal terminals being bonded to the second bonding area.

8. The display device according to claim 7, wherein The first region of the flexible circuit board is adjacent to an edge of the bending area on a side of the second bonding area.

9. The display device of claim 8, wherein, In a direction perpendicular to a plane where the display area is located, at least the first region and the second region of the flexible circuit board are located between the display area and the second bonding area to support the display area and the bonding area.

10. The display device according to claim 8, wherein A length of the first region ranges from 2 mm to 8 mm.

11. The display device according to claim 7, wherein A periphery of the second region is further provided with a protective layer, the protective layer being located between the flexible display panel of the second bonding area and the first surface of the flexible circuit board in a direction perpendicular to the plane where the display area is located.

12. A method for producing a display device, characterized by The display device comprises: a flexible display panel having a display area, a bending area and a bonding area, the bending area being connected between the display area and the bonding area, the bonding area comprising a first bonding area and a second bonding area; The driving chip is connected to the first bonding area, and the flexible circuit board is connected to the second bonding area; The bonding area is bent to the non-display side of the flexible display panel through the bending area; The first bonding area is located on the side of the flexible display panel away from the bending direction, and the second bonding area is located on the side of the flexible display panel facing the bending direction; The distance between the flexible circuit board and the bending area is less than or equal to the distance between the driving chip and the bending area.

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