Method for manufacturing inorganic material plate and inorganic material plate

Abstract

To provide an inorganic board suitable for achieving high water resistance and a method for manufacturing the same, the manufacturing method of the present invention includes first to sixth steps. In the first step, a first layer (L1) is formed by depositing raw material onto a receiving plate (B1). In the second step, a raw material blank (M) including the first layer (L1) is compressed by pressing one end (first portion (Ma)) and the other end (second portion (Mb)) on a first direction (D1) toward the receiving plate (B1). In the third step, a second layer (L2) is formed on the first layer (L1) by depositing raw material. In the fourth step, the exposed surface of the second layer (L2) is flattened. In the fifth step, the raw material blank (M) is cured under pressure between the receiving plate (B1) and the pressure plate (B2) to form a hardened board (M'). In the sixth step, the first portion (Ma) is processed to form a first back-side joint (P1), and the second portion (Mb) is processed to form a first front-side joint (P2). The inorganic plate (X1) of the present invention has a high-density first back-side joint (P1) and first front-side joint (P2).

Description

Technical Field

[0001] This invention relates to a method for manufacturing an inorganic board that can be used as a building board, and to the inorganic board itself. Background Technology

[0002] As building panels used to form the exterior and interior walls of buildings, there are cases where inorganic panels such as ceramic exterior wall panels and ceramic panels are used. Inorganic panels are formed from raw materials, primarily hydraulic cement-based inorganic materials, through a pressing process. The edges of each inorganic panel are processed into shapes suitable for joining the panels together. Furthermore, in the construction of walls using inorganic panels, multiple inorganic panels are joined together in the vertical and horizontal directions. Such technology related to inorganic panels is described, for example, in Patent Document 1 below.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 5-000411 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] Inorganic wall panels and other wall materials that make up the exterior are exposed to ultraviolet radiation, carbon dioxide, and rainwater in outdoor environments. The effects of water on inorganic wall materials have become increasingly clear in recent years. For example, water can cause fading and peeling of the coating on the surface of the wall material. Water can also cause cracking and the progression of neutralization within the internal structure of the wall material. Furthermore, due to the extreme temperature variations in the environment, the repeated freezing and thawing of water—the freeze-thaw cycle—can promote localized damage to the wall material, including the aforementioned coating peeling, thus leading to the deterioration of the wall material.

[0008] The aforementioned joint shapes at each end edge of the inorganic plate are formed by machining, thus exposing the matrix of the internal structure of the inorganic plate on its machined surface. With such an inorganic plate, water easily penetrates from its end edges into the interior. Therefore, inorganic plates have historically been susceptible to the aforementioned effects of water. From a durability point of view, susceptibility to water-related effects is not desirable in inorganic plates.

[0009] The present invention was conceived based on the following circumstances, and its object is to provide a method for manufacturing an inorganic plate suitable for achieving high water resistance, and an inorganic plate suitable for achieving high water resistance.

[0010] Solution for solving the problem

[0011] According to a first aspect of the present invention, a method for manufacturing an inorganic plate is provided. The method includes a first stacking step, a pressing step, a second stacking step, a planarization step, and a processing step.

[0012] In the first stacking process, a first raw material containing a first inorganic material with hydraulic properties and a first reinforcing material is stacked on a receiving plate to form a first layer. In the pressing process, a second portion of the raw material slab including the first layer is pressed and compressed from the side opposite to the receiving plate toward the receiving plate side, wherein the first portion is one end in a first direction and the second portion is the other end in the first direction.

[0013] In the second stacking process, a second raw material containing a second inorganic material with hydraulic properties and a second reinforcing material is stacked on the first layer to form a second layer. In the planarization process, the exposed surface of the second layer on the side opposite to the receiving plate is planarized.

[0014] In the curing process, after placing a pressure plate on the raw material slab including the first and second layers, the raw material slab is cured in a state where it is pressed between the receiving plate and the pressure plate, thereby forming a hardened board from the raw material slab. In the processing process, the first part is processed to form a first back-side joint, and the second part is processed to form a first front-side joint.

[0015] In the inorganic board manufacturing method of the present invention, by performing the first stacking process, pressing process, second stacking process, and planarization process described above, a raw material blank with a locally higher raw material stacking amount per unit thickness in the first part and the second part can be formed. By performing the curing process described above, which involves pressing the raw material blank in the thickness direction, a hardened board can be produced in which the raw material (inorganic material, reinforcing material) is locally tightly compressed at both ends (first part and second part) in the first direction, and the two ends are locally high-density. Furthermore, by performing the processing process described above, which forms a first back-side joint and a first surface joint at the high-density two ends, an inorganic board having a locally high-density (i.e., dense) first back-side joint and first surface joint can be obtained.

[0016] According to the inorganic board manufacturing method of the present invention, as described above, an inorganic board having a first back-side joint and a first front-side joint with locally high density can be manufactured. Such an inorganic board avoids excessive weight gain and is suitable for preventing water from seeping in from the ends of the inorganic board processed to form the first back-side joint and the first front-side joint. That is, the manufacturing method of the present invention is suitable for achieving high water resistance in the manufactured inorganic board.

[0017] Preferably, in the pressing process, the third and fourth portions of the raw material slab are pressed and compressed from the side opposite to the receiving plate towards the receiving plate side, wherein the third portion is one end in a second direction intersecting the first direction, and the fourth portion is the other end. In this case, in the processing step, the third portion is processed to form a second back-side joint, and the fourth portion is processed to form a second front-side joint.

[0018] In this structure, the raw material slab undergoing the curing process can be formed with a locally higher amount of raw material per unit thickness in the third and fourth parts, in addition to the first and second parts described above. Furthermore, in the processing step, an inorganic plate with locally high density (i.e., dense) first back-side joint, first front-side joint, second back-side joint, and second front-side joint can be manufactured. Such an inorganic plate avoids excessive weight accumulation and is suitable for suppressing water infiltration from the first back-side joint and the first front-side joint, as well as water infiltration from the second back-side joint and the second front-side joint.

[0019] Preferably, in the pressing process, the fifth part of the raw material slab, that is, a part between the first part and the second part in the first direction, is pressed and compressed from the side opposite to the receiving plate toward the receiving plate side.

[0020] After such a pressing process, the raw material slab undergoing the curing process can be formed with a locally higher material accumulation per unit thickness in the fifth part. Therefore, it is possible to manufacture an inorganic board having a locally high-density (i.e., dense) first back-side joint, a first front-side joint, and a fifth part. This fifth part is suitable for functioning as a reinforcement of the inorganic board. Specifically, the fifth part is suitable for suppressing the deflection of the inorganic board during transportation and construction, and therefore suitable for suppressing the generation of microcracks inside the inorganic board caused by such deflection. Suppressing such microcracks is preferable in achieving high water resistance of the inorganic board.

[0021] Preferably, in the pressing process, the sixth part of the raw material slab, that is, a part between the third and fourth parts in the second direction, is pressed and compressed from the side opposite to the receiving plate toward the receiving plate side.

[0022] After undergoing such a pressing process, the raw material slab undergoing the curing process can be formed with a relatively high amount of raw material accumulation per unit thickness in the sixth part. Therefore, it is possible to manufacture an inorganic board with a locally high-density (i.e., dense) sixth part. This sixth part is suitable for functioning as a reinforcing part of the inorganic board. Specifically, it is the same as the above description regarding the fifth part.

[0023] Preferably, the process further includes at least one third stacking step, in which a third raw material containing a third inorganic material with hydraulic properties and a third reinforcing material are stacked to form a third layer. In this case, the third stacking step is performed before the first stacking step to form a third layer on the receiving plate, and the first layer is formed on the third layer during the first stacking step. Alternatively, the third stacking step is performed between the planarization step and the curing step to form a third layer on the second layer. Alternatively, the third stacking step is performed before the first stacking step to form a third layer on the receiving plate, the first layer is formed on the third layer during the first stacking step, and the third stacking step is performed between the planarization step and the curing step to form a third layer on the second layer.

[0024] Such a structure is suitable for forming a third layer as the surface layer from a third material that is more suitable for forming a surface layer compared to the first and second raw materials. For example, a third raw material containing a third reinforcing material smaller than the first and second reinforcing materials is suitable for forming a dense, hardened layer as the surface layer compared to the first and second raw materials.

[0025] Preferably, the receiving plate and / or pressure plate are mold plates with concave and convex shapes on the side surface of the raw material slab.

[0026] This structure is suitable for manufacturing inorganic plates with an appearance surface that is uneven on one or both sides. In addition, in this structure, by using a mold plate with a protrusion at a position corresponding to the predetermined position of the back-side joint (first back-side joint, second back-side joint) of the raw material blank as the aforementioned mold plate, the processing work for the back-side joint in the processing steps can be reduced.

[0027] According to a second aspect of the invention, an inorganic plate is provided. The inorganic plate has a surface and a back surface opposite to the surface, and a thickness between the surface and the back surface. The inorganic plate includes a first back-side joint located at one end in a first direction intersecting the thickness direction and a first surface-side joint located at the other end.

[0028] The first back-side joint has a first base and a first extension. The first base has a thickness equal to or greater than that of a first inner portion adjacent to the first back-side joint in a first direction. The first extension is thinner than the first base and extends outward from the first base along the first direction. The first base and the first extension are of higher density than the first inner portion.

[0029] The first surface-side joint has a second base and a second protrusion. The second base has a thickness equal to or greater than that of a second inner portion adjacent to the first surface-side joint in a first direction. The second protrusion is thinner than the second base and extends outward from the second base along the first direction. The second protrusion is located on the surface side of the first protrusion in the thickness direction. The second base and the second protrusion have a higher density compared to the second inner portion.

[0030] Such an inorganic board avoids excessive weight and is suitable for suppressing water ingress at the locally high-density first back-side joint and first front-side joint. Such an inorganic board can be manufactured by the inorganic board manufacturing method described above in the first aspect of the present invention.

[0031] In a preferred embodiment, the first back-side joint and the first front-side joint have a laminated structure comprising a first hardened layer and a second hardened layer in the thickness direction. Such a structure is suitable for varying the physical properties and characteristics of the first back-side joint and the first front-side joint in the thickness direction.

[0032] Preferably, the inorganic board further comprises a first reinforcing portion, which is a portion in a first direction between the first back-side joint and the first front-side joint. The first reinforcing portion has a laminated structure including a first hardening layer and a second hardening layer, and has a thickness equal to or greater than that of the portion adjacent to the first reinforcing portion in the first direction, and has a higher density compared to the adjacent portion.

[0033] The first reinforcing section, which has a higher density than the adjacent portion, is suitable for reinforcing the inorganic board. Specifically, the first reinforcing section is suitable for suppressing the deflection of the inorganic board during transportation and construction, and therefore suitable for suppressing the generation of microcracks inside the inorganic board caused by such deflection. Suppressing such microcracks is preferred in achieving high water resistance of the inorganic board.

[0034] Preferably, the inorganic plate includes a second back-side joint located at one end in a second direction intersecting the thickness direction and the first direction, and a second front-side joint located at the other end. The second back-side joint has a third base and a third extension. The third base has a thickness equal to or greater than that of a third inner portion adjacent to the second back-side joint in the second direction. The third extension is thinner than the third base and extends outward from the third base along the second direction. The third base and the third extension are of higher density than the third inner portion. The second front-side joint has a fourth base and a fourth extension. The fourth base has a thickness equal to or greater than that of a fourth inner portion adjacent to the second front-side joint in the second direction. The fourth extension is thinner than the fourth base and extends outward from the fourth base along the second direction. The fourth extension is located on the surface side of the plate in the thickness direction than the third extension. The fourth base and the fourth extension are of higher density than the fourth inner portion.

[0035] Such inorganic plates avoid excessive weighting and are suitable for inhibiting water infiltration at the locally high-density first back-side joint, first front-side joint, second back-side joint, and second front-side joint.

[0036] In a preferred embodiment, the second back-side joint and the second front-side joint have a laminated structure comprising a first hardened layer and a second hardened layer in the thickness direction. Such a structure is suitable for varying the physical properties and characteristics of the first back-side joint and the first front-side joint in the thickness direction.

[0037] Preferably, the inorganic board further comprises a second reinforcing portion, which is a portion in the second direction between the second back-side joint and the second front-side joint. The second reinforcing portion has a laminated structure including a first hardening layer and a second hardening layer, and has a thickness equal to or greater than that of the portion adjacent to the second reinforcing portion in the second direction, and has a higher density compared to the adjacent portion.

[0038] The second reinforcing section, which has a higher density than the adjacent section, is suitable for reinforcing the inorganic plate. Specifically, it is the same as the above description regarding the first reinforcing section.

[0039] Preferably, the inorganic board has a laminated structure comprising a first hardening layer, a second hardening layer and a third hardening layer in sequence, or a laminated structure comprising a third hardening layer, a first hardening layer and a second hardening layer in sequence, or a laminated structure comprising a third hardening layer, a first hardening layer, a second hardening layer and a third hardening layer in sequence.

[0040] This structure is suitable for setting a third hardening layer with properties different from the first and second hardening layers. Examples of hardening layers with properties different from the first and second hardening layers include hardening layers with higher density compared to the first and second hardening layers. Such a hardening layer, as the surface layer of this inorganic board, helps to achieve the high water resistance of this inorganic board. Attached Figure Description

[0041] Figure 1 This illustrates a portion of the process of an inorganic plate manufacturing method according to a first embodiment of the present invention.

[0042] Figure 2 Shown in Figure 1 The process that follows the process shown.

[0043] Figure 3 This is a top view of an inorganic plate manufactured by the manufacturing method of the first embodiment.

[0044] Figure 4 It is along Figure 3 A partial sectional view of line IV-IV, omitted from the original text.

[0045] Figure 5 It is along Figure 3 A partial sectional view of the VV line.

[0046] Figure 6 An example of a roller that can be used in the pressing process of the first embodiment is shown.

[0047] Figure 7 (a) is a partially omitted sectional view of an inorganic plate manufactured by the inorganic plate manufacturing method of the modified example. Figure 7 (b) is another partial omitted sectional view of the inorganic plate.

[0048] Figure 8 This illustrates a portion of the process of an inorganic plate manufacturing method according to a second embodiment of the present invention.

[0049] Figure 9 Shown in Figure 8 The process that follows the process shown.

[0050] Figure 10 This is a top view of an inorganic plate manufactured by the manufacturing method of the second embodiment.

[0051] Figure 11 It is along Figure 10 A partial sectional view of the XI-XI line (omitted).

[0052] Figure 12 It is along Figure 10 A partially omitted sectional view of line XII-XII.

[0053] Figure 13 An example of a roller that can be used in the pressing process of the second embodiment is shown.

[0054] Figure 14 This illustrates a portion of the process of an inorganic plate manufacturing method according to a third embodiment of the present invention.

[0055] Figure 15 Shown in Figure 14 The process that follows the process shown.

[0056] Figure 16 Shown in Figure 15 The process that follows the process shown.

[0057] Figure 17 This is a top view of an inorganic plate manufactured by the manufacturing method of the third embodiment.

[0058] Figure 18 It is along Figure 17 A partially omitted sectional view of the XVIII-XVIII line.

[0059] Figure 19 It is along Figure 17 A partial sectional view of the XIX-XIX line (omitted). Detailed Implementation

[0060] Figure 1 as well as Figure 2 This invention illustrates a method for manufacturing an inorganic plate according to a first embodiment. Figures 3 to 5 Inorganic plate X1 is shown as an example of an inorganic plate manufactured by this manufacturing method.

[0061] The inorganic plate X1 has a surface F1 and a back surface F2 opposite to the surface F1. The inorganic plate X1 has a first back-side joint P1 located at one end in a first direction D1 intersecting its thickness direction T, and a first surface-side joint P2 located at the other end. It also has a second back-side joint P3 located at one end in a second direction D2 intersecting both the thickness direction T and the first direction D1, and a second surface-side joint P4 located at the other end. The first back-side joint P1 and the first surface-side joint P2 extend along the second direction D2. The second back-side joint P3 and the second surface-side joint P4 extend along the first direction D1.

[0062] This manufacturing method is a method for manufacturing such inorganic boards, including a first stacking process, a pressing process, a second stacking process, a planarization process, a curing process, and a processing process as follows.

[0063] In the first stacking process, such as Figure 1As shown in (a), the first raw material is deposited on the receiving plate B1 to form the first layer L1. Figure 1 In (a), the left-hand view is a schematic cross-sectional view along the first direction D1 of the inorganic plate X1, and the right-hand view is a schematic cross-sectional view along the second direction D2 of the inorganic plate X1 (the same applies in another process diagram described later). The thickness of the first layer L1 formed by this process is, for example, 5 to 20 mm.

[0064] In this embodiment, the receiving plate B1 is a mold plate with an uneven shape on the side surface of the raw material slab (the surface on the side where the raw material is deposited), specifically having a first protrusion Ba and a second protrusion Bb. The first protrusion Ba is located at a position corresponding to the predetermined formation position of the first back-side joint P1, and the second protrusion Bb is located at a position corresponding to the predetermined formation position of the second back-side joint P3. The receiving plate B1 of this embodiment defines the shape of the surface F1 side of the inorganic plate X1.

[0065] In this embodiment, the first raw material used in this process contains a hydraulic first inorganic material, a first silicate material, and a first reinforcing material. The moisture content of the first raw material is, for example, 25-45%, preferably 30-40%.

[0066] Examples of primary inorganic materials include cement, gypsum, and slag. Examples of cement types include ordinary Portland cement, quick-setting Portland cement, alumina cement, blast furnace cement, and fly ash cement. Examples of gypsum types include anhydrous gypsum, hemihydrate gypsum, and dihydrate gypsum. Examples of slag types include blast furnace slag and converter slag. One or more primary inorganic materials may be used. The Blaine specific surface area of ​​the primary inorganic material is, for example, 2000–10000 cm². 2 / g.

[0067] Examples of primary silicate materials include silica sand, silica powder, silica powder, fly ash, fly ash, and diatomaceous earth. One or more primary silicate materials may be used. The Blaine specific surface area of ​​the primary silicate material is, for example, 3000–30000 cm². 2 / g. The preferred mass ratio of the first inorganic material to the first silicate material in the raw material mixture is 6:4 to 3:7.

[0068] Examples of primary reinforcing materials include plant-based reinforcing materials and organic reinforcing materials such as synthetic fibers. Examples of plant-based reinforcing materials include wood flour, wood fibers, wood chips, wood pulp, wood fibers, wood fiber bundles, waste paper, bamboo fiber, hemp fiber, bagasse, rice husk, and rice straw. Examples of synthetic fibers include polyester fiber, polyamide fiber, polyethylene fiber, polypropylene fiber, and acrylic fiber. One or more primary reinforcing materials may be used. When wood flour is used as the primary reinforcing material, its size is, for example, 20 to 50 mesh. When wood chips are used as the primary reinforcing material, their width is, for example, 0.5 to 2 mm, their length is, for example, 1 to 20 mm, and their aspect ratio (length / width) is, for example, 20 to 30. When wood fiber bundles are used as the primary reinforcing material, their diameter is, for example, 0.1 to 2 mm, and their length is, for example, 2 to 35 mm. The wood fiber bundles may have a branched shape, a curved shape, or a bent shape.

[0069] The first raw material may also contain hollow materials such as expanded polystyrene beads, microspheres, perlite, fly ash balls, white sand spheres, expanded shale, expanded clay, and calcined diatomaceous earth. One type of hollow material or two or more types may be used. The median particle size (diameter D50) of the hollow material is preferably 0.05–2 mm.

[0070] The first raw material may contain other materials besides those mentioned above. Examples of such other materials include mixed materials. Examples of mixed materials include mica, papermaking sludge incineration ash, silica powder, wollastonite, calcium carbonate, magnesium hydroxide, aluminum hydroxide, vermiculite, sepiolite, shaleite, calcareous silicate, kaolinite, zeolite, and pulverized inorganic board. As for mica, flaky mica with an average particle size of 200–700 μm and an aspect ratio of 60–100 is preferred. Examples of pulverized inorganic board include pulverized material from defective inorganic board before hardening and after hardening, generated during the manufacturing process, as well as pulverized material from inorganic board scraps and waste generated at construction sites. The average particle size of these pulverized materials is, for example, 50–150 μm.

[0071] In the pressing process, such as Figure 1As shown in (b), the first portion Ma, the second portion Mb, the third portion Mc, and the fourth portion Md of the raw material slab M, including the first layer L1, are pressed and compressed towards the receiving plate B1 from the side opposite to the receiving plate B1. The first portion Ma is located at one end in the first direction D1. The second portion Mb is located at the other end in the first direction D1. The third portion Mc is located at one end in the second direction D2. The fourth portion Md is located at the other end in the second direction D2.

[0072] As a pressing mechanism, it can be equipped with Figure 6 The device for the roller 100 shown is omitted. The roller 100 includes a shaft 101 and two roller portions 102. In the device, the shaft 101 is supported in a way that allows for displacement and rotation. The roller portions 102 are fixed to the shaft 101. The spacing between the two roller portions 102 can be adjusted according to the spacing between the parts that should be pressed simultaneously.

[0073] In the pressing process, for example, the two roller portions 102 of the roller 100 abut and press against the first portion Ma and the second portion Mb of the raw material blank M, and the raw material blank M is transported along the second direction D2. Then, for example, the two roller portions 102 of the roller 100 abut and press against the third portion Mc and the fourth portion Md of the raw material blank M, and the raw material blank M is transported along the first direction D1. The pressing pressure is, for example, 1 to 10 kg / cm². 2 Through this process, the first part Ma, the second part Mb, the third part Mc, and the fourth part Md in the raw material slab M become thinner.

[0074] In the second stacking process, such as Figure 1 As shown in (c), a second material is deposited on the first layer L1 to form a second layer L2. The second material is deposited over the entire area of ​​the first layer L1. The thickness of the second layer L2 is, for example, 10 to 30 mm. In this embodiment, the second material contains a hydraulic second inorganic material, a second silicate material, and a second reinforcing material. The moisture content of the second material is, for example, 25 to 45%, preferably 30 to 40%.

[0075] Examples of second inorganic materials can be found relating to the first inorganic material as described above. Examples of second silicate materials can be found relating to the first silicate material as described above. Examples of second reinforcing materials can be found relating to the first reinforcing material as described above. The second raw material used in this process may have the same composition as the first raw material used in the first stacking process described above, or it may have a different composition.

[0076] In the planarization process, such as Figure 2As shown in (a), the exposed surface of the second layer L2 (the side opposite to the receiving plate B1) is flattened. Methods for flattening include sweeping the exposed surface of the second layer L2 while the brush is in contact with it, and blowing air onto the exposed surface of the second layer L2. Through this process, a raw material slab M is formed with a relatively high amount of raw material per unit thickness in the first part Ma, the second part Mb, the third part Mc, and the fourth part Md.

[0077] In the maintenance process, such as Figure 2 As shown in (b), after the pressure plate B2 is placed on the raw material slab M including the first layer L1 and the second layer L2, the raw material slab M is cured under the condition of being pressed between the receiving plate B1 and the pressure plate B2, and a hardened plate M' is formed from the raw material slab M. In this embodiment, the pressure plate B2 defines the shape of the back side F2 side of the inorganic plate X1.

[0078] In this process, the clamping pressure is, for example, 20–70 kg / cm². 2 The temperature is, for example, 50℃~80℃, and the curing time is, for example, 6~12 hours. Further curing can also be performed after this initial curing. In the case of so-called autoclave curing as a further curing process, the temperature is, for example, above 150℃, the pressure is, for example, above 0.5MPa, and the curing time is 3~15 hours.

[0079] Through this curing process, a hardened plate M' is formed, in which the raw materials of the first part Ma, the second part Mb, the third part Mc, and the fourth part Md are locally compressed and thus locally high-density. The hardened plate M' has a laminated structure including a first hardened layer 11 and a second hardened layer 12. The first hardened layer 11 is formed by hardening the first layer L1 described above. The second hardened layer 12 is formed by hardening the second layer L2 described above.

[0080] In the processing steps, such as Figure 2 As shown in (c), the first part Ma is processed to form the first back-side joint P1, the second part Mb is processed to form the first front-side joint P2, the third part Mc is processed to form the second back-side joint P3, and the fourth part Md is processed to form the second front-side joint P4 (in...). Figure 2 In (c), make Figure 2 (As shown in (b), the hardened plate M' is reversed). The processing method is, for example, cutting.

[0081] Figures 3 to 5 Inorganic material plate X1 is shown as an example of an inorganic material plate manufactured through the above-described processes. Inorganic material plate X1 has a laminated structure including the first hardened layer 11 and the second hardened layer 12 described above.

[0082] Furthermore, as described above, the inorganic plate X1 has a surface F1 and a back surface F2 opposite to the surface F1, and has a first back-side joint P1 located at one end in the first direction D1 and a first surface-side joint P2 located at the other end, and has a second back-side joint P3 located at one end in the second direction D2 and a second surface-side joint P4 located at the other end. The dimension of the inorganic plate X1 in the first direction D1 is, for example, 200 to 1000 mm, and the dimension in the second direction D2 is, for example, 900 to 3200 mm.

[0083] The first back-side joint P1 is an end portion having a shape suitable for joining inorganic plates together, and in this embodiment, it is an end portion having a solid structure. The first back-side joint P1 has a laminated structure including a first hardening layer 11 and a second hardening layer 12, and has a first base P1a and a first protrusion P1b. The first base P1a has, for example, a thickness equal to or greater than that of the inner portion (first inner portion) adjacent to the first back-side joint P1 in the first direction D1. The first protrusion P1b is thinner than the first base P1a and extends outward from the first base P1a along the first direction D1.

[0084] Furthermore, the first back-side joint P1 (first base P1a, first protrusion P1b) has a higher density than the inner portion (first inner portion) adjacent to the first back-side joint P1 in the first direction D1. The specific gravity of the first back-side joint P1 (first base P1a, first protrusion P1b) is, for example, 1.05 to 1.15 g / cm³. 3 The specific gravity of the inner portion adjacent to the first back-side joint P1 is, for example, 0.9 to 1.1 g / cm³. 3 .

[0085] The first surface-side joining portion P2 is an end portion with a shape suitable for joining inorganic plates together; in this embodiment, it is an end portion with a solid structure. The first surface-side joining portion P2 has a laminated structure including a first hardening layer 11 and a second hardening layer 12, and has a second base portion P2a and a second protrusion portion P2b. The second base portion P2a has, for example, a thickness equal to or greater than that of the inner portion (second inner portion) adjacent to the first surface-side joining portion P2 in the first direction D1. The second protrusion portion P2b is thinner than the second base portion P2a and extends outward from the second base portion P2a along the first direction D1. The second protrusion portion P2b is located in the thickness direction T on the surface F1 side compared to the first protrusion portion P1b. That is, the first protrusion portion P1b is located in the thickness direction T on the back surface F2 side compared to the second protrusion portion P2b.

[0086] Furthermore, the first surface-side joint P2 (second base P2a, second protrusion P2b) has a higher density than the inner portion (second inner portion) adjacent to the first surface-side joint P2 in the first direction D1. The specific gravity of the first surface-side joint P2 (second base P2a, second protrusion P2b) is, for example, 1.05 to 1.15 g / cm³. 3 The specific gravity of the inner portion adjacent to the second back-side joint P2 is, for example, 0.9 to 1.1 g / cm³. 3 .

[0087] The second back-side joint P3 is an end portion with a shape suitable for joining inorganic plates together; in this embodiment, it is an end portion with a solid structure. The second back-side joint P3 has a laminated structure including a first hardening layer 11 and a second hardening layer 12, and has a third base P3a and a third protrusion P3b. The third base P3a, for example, has a thickness equal to or greater than that of the inner portion (third inner portion) adjacent to the second back-side joint P3 in the second direction D2. The third protrusion P3b is thinner than the third base P3a and extends outward from the third base P3a along the second direction D2.

[0088] Furthermore, the second back-side joint P3 (third base P3a, third protrusion P3b) has a higher density than the inner portion (third inner portion) adjacent to the second back-side joint P3 in the second direction D2. The specific gravity of the second back-side joint P3 (third base P3a, third protrusion P3b) is, for example, 1.05 to 1.15 g / cm³. 3 The specific gravity of the inner portion adjacent to the second back-side joint P3 is, for example, 0.9 to 1.1 g / cm³. 3 .

[0089] The second surface-side joining portion P4 is an end portion with a shape suitable for joining inorganic plates together, and in this embodiment, it is an end portion with a solid structure. The second surface-side joining portion P4 has a laminated structure including a first hardening layer 11 and a second hardening layer 12, and has a fourth base portion P4a and a fourth protrusion portion P4b. The fourth base portion P4a has, for example, a thickness equal to or greater than that of the inner portion (fourth inner portion) adjacent to the second surface-side joining portion P4 in the second direction D2. The fourth protrusion portion P4b is thinner than the fourth base portion P4a and extends outward from the fourth base portion P4 along the second direction D2. The fourth protrusion portion P4b is located on the surface F1 side of the third protrusion portion P3b in the thickness direction T. That is, the third protrusion portion P3b is located on the back surface F2 side of the fourth protrusion portion P4b in the thickness direction T.

[0090] Furthermore, the second outer-side joint P4 (fourth base P4a, fourth protrusion P4b) has a higher density than the inner portion (fourth inner portion) adjacent to the second outer-side joint P4 in the second direction D2. The specific gravity of the second outer-side joint P4 (fourth base P4a, fourth protrusion P4b) is, for example, 1.05 to 1.15 g / cm³. 3 The specific gravity of the inner portion adjacent to the second surface-side joint P4 is, for example, 0.9 to 1.1 g / cm³. 3 .

[0091] During the construction of the wall portion using inorganic material board X1, multiple inorganic material boards X1 are joined together in the vertical (longitudinal) and horizontal (transverse) directions. Specifically, the ends of multiple inorganic material boards X1 extending along the second direction D2 (first back-side joint P1, first front-side joint P2) are joined together with each other, for example, in the vertical direction, to connect the multiple inorganic material boards X1, and the ends of multiple inorganic material boards X1 extending along the first direction D1 (second back-side joint P3, second front-side joint P4) are joined together with each other, for example, in the horizontal direction, to connect the multiple inorganic material boards X1 (the construction method for the inorganic material boards in the embodiments described later is also the same).

[0092] In the inorganic plate manufacturing method of the present invention, the process includes a first stacking process, a pressing process, a second stacking process, and a planarization process. Figure 2 Thus, as described above, it is possible to form raw material slabs M with a relatively large amount of raw material accumulation per unit thickness in the first part Ma, the second part Mb, the third part Mc, and the fourth part Md.

[0093] In the subsequent maintenance process ( Figure 2 In (b)), as described above, a hardened plate M' can be formed in which the raw materials of the first part Ma, the second part Mb, the third part Mc and the fourth part Md are locally tightly compressed and the part is locally high-density.

[0094] Furthermore, through subsequent processing steps ( Figure 2 (c)) can obtain an inorganic plate X1 having a first back-side joint P1, a first front-side joint P2, a second back-side joint P3, and a second front-side joint P4 that are locally high-density (i.e., dense).

[0095] According to the inorganic board manufacturing method of the present invention, as described above, an inorganic board X1 having locally high-density first back-side joint P1, first front-side joint P2, second back-side joint P3, and second front-side joint P4 can be manufactured (the bases P1a, P2a, P3a, and P4a of each joint P1 to P4 have a thickness equal to or greater than their respective inner portions). Such an inorganic board X1 avoids excessive weight accumulation and is suitable for preventing water from seeping into the inorganic board ends processed to form the first back-side joint P1, first front-side joint P2, second back-side joint P3, and second front-side joint P4. That is, the manufacturing method of the present invention is suitable for achieving high water resistance in the manufactured inorganic board X1.

[0096] In this manufacturing method, as described above, a mold plate having protrusions (convex portions) at locations corresponding to predetermined formation locations of the back-side joints (first back-side joint P1, second back-side joint P3) in the raw material slab is used as the aforementioned receiving plate B1. Thus, the processing steps ( Figure 2 The machining operations for the back-side joint in (c) are reduced.

[0097] In this manufacturing method, the second back-side joint P3 and the second front-side joint P4, which are not subjected to high-density processing, can also be formed as needed. By using a receiving plate without the second protrusion Bb as the receiving plate B1, it is possible to manufacture an inorganic plate X1 in which the second back-side joint P3 and the second front-side joint P4 are not subjected to high-density processing.

[0098] In this manufacturing method, a receiving plate without the first protrusion Ba and the second protrusion Bb may be used as the receiving plate B1, and a pressure plate having the first protrusion Ba located at a position corresponding to the predetermined forming position of the first back-side joint P1 and the second protrusion Bb located at a position corresponding to the predetermined forming position of the second back-side joint P3 may be used as the pressure plate B2.

[0099] exist Figure 7 The image shows an inorganic plate X1 manufactured in such a modified example. Figure 7 (a) is a partially omitted sectional view (a sectional view in the first direction D1) of the inorganic plate X1 of this modified example. Figure 7 (b) is another partially omitted sectional view of the inorganic plate X1 in this modified example (a sectional view in the second direction D2). Figure 7 The inorganic plate X1 shown is also similar to Figures 3 to 5 Similarly, the inorganic plate X1 shown has a first back-side joint P1, a first front-side joint P2, a second back-side joint P3, and a second front-side joint P4 at its ends, which are locally high-density, and is therefore suitable for achieving high water resistance.

[0100] Figure 8as well as Figure 9 The second embodiment of the present invention illustrates a method for manufacturing an inorganic plate. Figures 10 to 12 Inorganic plate X1' is shown as an example of an inorganic plate manufactured by this manufacturing method.

[0101] The inorganic plate X1' has the same structure as the inorganic plate X1 described above, except that it further includes a first reinforcing part P5 and a second reinforcing part P6.

[0102] The first reinforcing portion P5 is a portion along the first direction D1 between the first back-side joint P1 and the first front-side joint P2, and extends along the second direction D2. Preferably, the first reinforcing portion P5 is located at or near the center of the inorganic plate X1' along the first direction D1. The first reinforcing portion P5 has a laminated structure including a first hardening layer 11 and a second hardening layer 12. The first reinforcing portion P5 has a higher density than the portion adjacent to it along the first direction D1. The specific gravity of the first reinforcing portion P5 is, for example, 1.05 to 1.15 g / cm³. 3 The specific gravity of the portion adjacent to the first reinforcing part P5 is, for example, 0.9 to 1.1 g / cm³. 3 .

[0103] The second reinforcing portion P6 is a part between the second back-side joint portion P3 and the second front-side joint portion P4 in the second direction D2, and extends along the first direction D1. Preferably, the second reinforcing portion P6 is located at or near the center in the inorganic plate X1' in the second direction D2. The second reinforcing portion P6 has a laminated structure including a first hardening layer 11 and a second hardening layer 12. The second reinforcing portion P6 has a higher density than the portion adjacent to it in the second direction D2. The specific gravity of the second reinforcing portion P6 is, for example, 1.05 to 1.15 g / cm³. 3 The specific gravity of the portion adjacent to the second reinforcing part P6 is, for example, 0.9 to 1.1 g / cm³. 3 .

[0104] The other structures of the inorganic plate X1' are the same as those of the inorganic plate X1 described above.

[0105] This manufacturing method is used to manufacture such inorganic plates, and includes a first stacking process, a pressing process, a second stacking process, a planarization process, a curing process, and a processing process as follows.

[0106] In the first stacking process, such as Figure 8 As shown in (a), the first raw material is deposited on the receiving plate B1 to form the first layer L1. Specifically, as shown in the above reference... Figure 1 The first stacking process described in (a) is the same.

[0107] In the pressing process, such as Figure 8 As shown in (b), the first portion Ma, the second portion Mb, the third portion Mc, the fourth portion Md, the fifth portion Me, and the sixth portion Mf of the raw material slab M, including the first layer L1, are pressed and compressed towards the receiving plate B1 from the side opposite to the receiving plate B1. The fifth portion Me is a part between the first portion Ma and the second portion Mb in the first direction D1, and is located at a position corresponding to the predetermined formation position of the first reinforcing portion P5. Preferably, the fifth portion Me is located at or near the center in the first direction D1 of the manufactured inorganic plate X1'. The fifth portion Me extends along the second direction D2. The sixth portion Mf is a part between the third portion Mc and the fourth portion Md in the second direction D2, and is located at a position corresponding to the predetermined formation position of the second reinforcing portion P6. Preferably, the sixth portion Mf is located at or near the center in the second direction D2 of the manufactured inorganic plate X1'. The sixth portion Mf extends along the first direction D1. Regarding Ma, Mb, Mc, and Md in parts one through four, please refer to the above. Figure 1 As stated in (b).

[0108] As the pressing mechanism in this embodiment, a device equipped with Figure 13 The device for the roller 200 shown is omitted. The roller 200 includes a shaft 201 and three roller portions 202. In the device, the shaft 201 is supported so that it can be displaced and rotated. The roller portions 202 are fixed to the shaft 201. The spacing between the roller portions 202 can be adjusted according to the spacing of the parts that should be pressed simultaneously.

[0109] In the pressing process, for example, the three roller portions 202 of roller 200 abut and press against the first portion Ma, the second portion Mb, and the fifth portion Me of the raw material blank M, and the raw material blank M is transported along the second direction D2. Then, for example, the three roller portions 202 of roller 200 abut and press against the third portion Mc, the fourth portion Md, and the sixth portion Mf of the raw material blank M, and the raw material blank M is transported along the first direction D1. The pressing pressure is, for example, 1 to 10 kg / cm². 2 Through this process, the first to sixth portions Ma, Mb, Mc, Md, Me, and Mf in the raw material slab M become thinner.

[0110] In the second stacking process, such as Figure 8 As shown in (c), a second material is deposited on the first layer L1 to form a second layer L2. The second material is deposited over the entire area of ​​the first layer L1. Specifically, as referenced above... Figure 1 The second stacking process described in (c) is the same.

[0111] In the planarization process, such as Figure 9 As shown in (a), the exposed surface of the second layer L2 (the side opposite to the receiving plate B1) is flattened. Specifically, as referenced above... Figure 2 The planarization process described in (a) is the same. Through this process, a raw material slab M is formed with a relatively large amount of raw material accumulation per unit thickness in the first part Ma, the second part Mb, the third part Mc, the fourth part Md, the fifth part Me, and the sixth part Mf.

[0112] In the maintenance process, such as Figure 9 As shown in (b), after placing the pressure plate B2 on the raw material slab M, which includes the first layer L1 and the second layer L2, the raw material slab M is cured under the condition of being pressed between the receiving plate B1 and the pressure plate B2, and a hardened plate M' is formed from the raw material slab M. In this embodiment, the pressure plate B defines the shape of the back side F2 side of the inorganic plate X1'. Regarding the curing conditions in this process, for example, refer to the above-mentioned... Figure 2 The maintenance conditions in the maintenance process described in (b) are the same.

[0113] Through this curing process, a hardened plate M' is formed in which the raw materials in the first part Ma, the second part Mb, the third part Mc, the fourth part Md, the fifth part Me, and the sixth part Mf are locally compressed and the density of that part is locally increased.

[0114] In the processing steps, such as Figure 9 As shown in (c), the first part Ma is processed to form the first back-side joint P1, the second part Mb is processed to form the first front-side joint P2, the third part Mc is processed to form the second back-side joint P3, and the fourth part Md is processed to form the second front-side joint P4 (in...). Figure 9 In (c), make Figure 9 (As shown in (b), the hardened plate M' is reversed). The processing method is, for example, cutting.

[0115] The inorganic plate X1' manufactured by the inorganic plate manufacturing method of the second embodiment is similar to the inorganic plate manufacturing method of the first embodiment, and has a first back-side joint P1, a first front-side joint P2, a second back-side joint P3, and a second front-side joint P4 at its end, which are locally high-density.

[0116] Such an inorganic plate X1' avoids excessive weight gain and is suitable for preventing water from seeping in from the ends of the inorganic plate that have been processed to form the first back-side joint P1, the first front-side joint P2, the second back-side joint P3, and the second front-side joint P4. That is, the inorganic plate manufacturing method of the second embodiment is similar to that of the first embodiment, and is suitable for manufacturing inorganic plates that achieve high water resistance.

[0117] Furthermore, in the inorganic board manufacturing method of the second embodiment, as a curing process ( Figure 9 The raw material slab of (b) can be formed such that the amount of raw material piled up per unit thickness in the fifth part Me and the sixth part Mf is also locally greater. Therefore, it is possible to manufacture an inorganic plate X1' having a first reinforcing part P5 (hardened fifth part Me) and a second reinforcing part P6 (hardened sixth part Mf) that are higher in density (i.e. denser) than the adjacent parts.

[0118] The first reinforcing part P5 and the second reinforcing part P6 are respectively adapted to perform the reinforcing function of the inorganic plate X1'. Specifically, the first reinforcing part P5 and the second reinforcing part P6 are respectively adapted to suppress the deflection of the inorganic plate X1' during transportation and construction, and therefore are adapted to suppress the generation of microcracks inside the inorganic plate X1' caused by such deflection. Such suppression of microcracks is preferred in achieving high water resistance of the inorganic plate X1'.

[0119] In this manufacturing method, a receiving plate without the first protrusion Ba and the second protrusion Bb may be used as the receiving plate B1, and a pressure plate having the first protrusion Ba located at a position corresponding to the predetermined forming position of the first back-side joint P1 and the second protrusion Bb located at a position corresponding to the predetermined forming position of the second back-side joint P3 may be used as the pressure plate B2.

[0120] With this approach, it is also possible to manufacture an inorganic plate X1' having a first back-side joint P1, a first front-side joint P2, a second back-side joint P3, a second front-side joint P4, a first reinforcing part P5, and a second reinforcing part P6.

[0121] In this manufacturing method, the second back-side joint P3 and the second front-side joint P4, which are not subjected to high-density processing, can also be formed as needed. By using a receiving plate without the second protrusion Bb as the receiving plate B1, it is possible to manufacture an inorganic plate X1' in which the second back-side joint P3 and the second front-side joint P4 are not subjected to high-density processing.

[0122] In this manufacturing method, an inorganic plate X1' without the first reinforcing part P5 can also be manufactured as needed. By... Figure 8 In the pressing process shown in (b), the fifth part Me of the raw material blank M is not pressed, and such an inorganic plate X1' can be manufactured.

[0123] In this manufacturing method, an inorganic plate X1' without the second reinforcing part P6 can also be manufactured as needed. By... Figure 8In the pressing process shown in (b), the sixth part Mf of the raw material slab M is not pressed, and such an inorganic slab X1' can be manufactured.

[0124] Figures 14 to 16 The present invention illustrates a method for manufacturing an inorganic plate according to a third embodiment. Figures 17 to 19 Inorganic plate X2 is shown as an example of an inorganic plate manufactured by this manufacturing method.

[0125] The inorganic plate X2 has the same structure as the inorganic plate X1 except that it has a laminated structure including a third hardening layer 13 on its surface F1 side and a third hardening layer 13 on its back side F2 side.

[0126] This manufacturing method is a method for manufacturing such an inorganic board, and includes the following third stacking process, first stacking process, pressing process, second stacking process, planarization process, additional third stacking process, curing process, and processing process.

[0127] In the third stacking process, such as Figure 14 As shown in (a), the third material is deposited on the aforementioned receiving plate B1 to form a third layer L3. The thickness of the third layer L3 is, for example, 5 to 15 mm. In this embodiment, the third material comprises a hydraulically modifiable third inorganic material, a third silicate material, and a third reinforcing material. The moisture content of the third material is, for example, 20 to 40%, preferably 30 to 40%.

[0128] As a third inorganic material, examples can be made of the materials described above that relate to the first inorganic material. As a third silicate material, examples can be made of the materials described above that relate to the first silicate material. As a third reinforcing material, examples can be made of the materials described above that relate to the first reinforcing material.

[0129] The third reinforcing material is smaller than the first and second reinforcing materials. Specifically, when wood flour is used as the first to third reinforcing materials, the size of the wood flour used as the third reinforcing material only needs to be smaller than the size of the wood flour used as the first and second reinforcing materials, for example, 15 to 40 mesh. When wood chips are used as the first to third reinforcing materials, the wood chips used as the third reinforcing material only need to be smaller than the wood chips used as the first and second reinforcing materials, with a width of, for example, 0.4 to 1.8 mm and a length of, for example, 0.8 to 4 mm. When wood fiber bundles are used as the first to third reinforcing materials, the wood fiber bundles used as the third reinforcing material only need to be smaller than the wood fiber bundles used as the first and second reinforcing materials, with a diameter of, for example, 0.08 to 1.8 mm and a length of, for example, 1.8 to 30 mm.

[0130] In the first stacking process, such as Figure 14 As shown in (b), the first raw material is deposited on top of the third layer L3 to form the first layer L1. The second raw material is deposited over the entire area of ​​the first layer L1. In this embodiment, the thickness of the first layer L1 is, for example, 10 to 30 mm.

[0131] In the pressing process, such as Figure 14 As shown in (c), the first part Ma, the second part Mb, the third part Mc, the fourth part Md, the fifth part Me, and the sixth part Mf of the raw material slab M, which includes the third layer L3 and the first layer L1, are pressed and compressed from the side opposite to the receiving plate B1 toward the receiving plate B1.

[0132] In the raw material slab M, the first portion Ma is located at one end in the first direction D1. The second portion Mb is located at the other end in the first direction D1. The first portion Ma and the second portion Mb extend along the second direction D2, respectively.

[0133] In the raw material slab M, the third part Mc is located at one end in the second direction D2. The fourth part Md is located at the other end in the second direction D2. The third part Mc and the fourth part Md extend along the first direction D1, respectively.

[0134] In the raw material slab M, the fifth portion Me is a section along the first direction D1 between the first portion Ma and the second portion Mb. The fifth portion Me extends along the second direction D2. The sixth portion Mf is a section along the second direction D2 between the third portion Mc and the fourth portion Md. The sixth portion Mf extends along the first direction D1.

[0135] As the pressing mechanism in this embodiment, a device equipped with Figure 13 The device of roller 200 as shown (illustration omitted). The pressing method and conditions are the same as those described above regarding the pressing process of the second embodiment, where the pressing is performed by roller 200.

[0136] In the second stacking process, such as Figure 15 As shown in (a), a second material is deposited on the first layer L1 to form a second layer L2. The second material is deposited over the entire area of ​​the first layer L1. Specifically, as referenced above... Figure 1 The second stacking process described in (c) is the same. The thickness of the second layer L2 in this embodiment is, for example, 10 to 30 mm.

[0137] In the planarization process, such as Figure 15 As shown in (b), the exposed surface of the second layer L2 (the side opposite to the receiving plate B1) is flattened. Specifically, as referenced above... Figure 2The planarization process described in (a) is the same. Through this process, a raw material slab M is formed with a relatively large amount of raw material accumulation per unit thickness in the first part Ma, the second part Mb, the third part Mc, the fourth part Md, the fifth part Me, and the sixth part Mf.

[0138] In the additional third stacking process, such as Figure 15 As shown in (c), a third material is deposited on top of the second layer L2 to form an additional third layer L3. The thickness of the additional third layer L3 is, for example, 5 to 15 mm. The moisture content of the third material forming the additional third layer L3 is, for example, 20 to 40%, preferably 30 to 40%.

[0139] In the maintenance process, such as Figure 16 As shown in (a), after placing a pressure plate B2 on the raw material slab M, which includes a third layer L3, a first layer L1, a second layer L2, and an additional third layer L3, the raw material slab M is cured under pressure between a receiving plate B1 and a pressure plate B2, and a hardened plate M' is formed from the raw material slab M. In this embodiment, the pressure plate B2 defines the shape of the back side F2 of the inorganic plate X2. Regarding the curing conditions in the process, for example, refer to the above-mentioned... Figure 2 The maintenance conditions in the maintenance process described in (b) are the same.

[0140] Through this curing process, a hardened plate M' is formed, in which the raw materials of the first part Ma, the second part Mb, the third part Mc, the fourth part Md, the fifth part Me, and the sixth part Mf are locally compressed, resulting in local high density of that part.

[0141] The hardened plate M' has a stacked structure comprising, from the surface F1 side, a third hardened layer 13, a first hardened layer 11, a second hardened layer 12, and an additional third hardened layer 13 in sequence. The third hardened layer 13 is formed by hardening the aforementioned third layer L3. The first hardened layer 11 is formed by hardening the aforementioned first layer L1. The second hardened layer 12 is formed by hardening the aforementioned second layer L2. The additional third hardened layer 13 is formed by hardening the aforementioned additional third layer L3.

[0142] In the processing steps, such as Figure 16 As shown in (b), the first part Ma is processed to form the first back-side joint P1, the second part Mb is processed to form the first front-side joint P2, the third part Mc is processed to form the second back-side joint P3, and the fourth part Md is processed to form the second front-side joint P4 (in Figure 16 In (b), make Figure 16 (The hardened plate M' shown in (a) is reversed). The processing method is, for example, cutting.

[0143] Figures 17 to 19 Inorganic plate X2 is shown as an example of an inorganic plate manufactured through the above-described processes. Inorganic plate X2 has a surface F1 and a back surface F2 opposite to surface F1, and includes a first back-side joint P1 located at one end in the first direction D1 and a first front-side joint P2 located at the other end, and a second back-side joint P3 located at one end in the second direction D2 and a second front-side joint P4 located at the other end. The dimensions of inorganic plate X2 in the first direction D1 and the second direction D2 are the same as those of inorganic plate X1.

[0144] Furthermore, the inorganic plate X2 has a laminated structure comprising, from the surface F1 side, a third hardening layer 13, a first hardening layer 11, a second hardening layer 12, and an additional third hardening layer 13 in sequence. The third hardening layer 13 is formed by hardening the aforementioned third layer L3. The first hardening layer 11 is formed by hardening the aforementioned first layer L1. The second hardening layer 12 is formed by hardening the aforementioned second layer L2. The additional third hardening layer 13 is formed by hardening the aforementioned additional third layer L3.

[0145] The first back-side joint P1 is an end portion with a shape suitable for joining inorganic plates together; in this embodiment, it is an end portion with a solid structure. The first back-side joint P1 has a laminated structure including a third hardening layer 13, a first hardening layer 11, a second hardening layer 12, and an additional third hardening layer 13, and has a first base P1a and a first protrusion P1b. The first protrusion P1b is thinner than the first base P1a and extends outward from the first base P1a along a first direction D1.

[0146] Furthermore, the first back-side joint P1 has a higher density than the inner portion adjacent to it in the first direction D1. The specific gravity of the first back-side joint P1 is, for example, 1.05 to 1.15 g / cm³. 3 The specific gravity of the inner portion adjacent to the first back-side joint P1 is, for example, 0.9 to 1.1 g / cm³. 3 .

[0147] The first surface-side joining portion P2 is an end portion with a shape suitable for joining inorganic plates together, and in this embodiment, it is an end portion with a solid structure. The first surface-side joining portion P2 has a stacked structure comprising, from the surface F1 side, a third hardening layer 13, a first hardening layer 11, a second hardening layer 12, and an additional third hardening layer 13, and has a second base portion P2a and a second protrusion portion P2b. The second protrusion portion P2b is thinner than the second base portion P2a and extends outward from the second base portion P2a along the first direction D1. The second protrusion portion P2b is located on the surface F1 side in the thickness direction T compared to the first protrusion portion P1b. That is, the first protrusion portion P1b is located on the back surface F2 side in the thickness direction T compared to the second protrusion portion P2b.

[0148] Furthermore, the first surface-side joint P2 has a higher density than the inner portion adjacent to it in the first direction D1. The specific gravity of the first surface-side joint P2 is, for example, 1.05 to 1.15 g / cm³. 3 The specific gravity of the inner portion adjacent to the second back-side joint P2 is, for example, 0.9 to 1.1 g / cm³. 3 .

[0149] The second back-side joint P3 is an end portion with a shape suitable for joining inorganic plates together, and in this embodiment, it is an end portion with a solid structure. The second back-side joint P3 has a stacked structure comprising, from the surface F1 side, a third hardening layer 13, a first hardening layer 11, a second hardening layer 12, and an additional third hardening layer 13, and has a third base P3a and a third protrusion P3b. The third protrusion P3b is thinner than the third base P3a and extends outward from the third base P3a along the second direction D2.

[0150] Furthermore, the second back-side joint P3 has a higher density than the inner portion adjacent to it in the second direction D2. The specific gravity of the second back-side joint P3 is, for example, 1.05 to 1.15 g / cm³. 3 The specific gravity of the inner portion adjacent to the second back-side joint P3 is, for example, 0.9 to 1.1 g / cm³. 3 .

[0151] The second surface-side joining portion P4 is an end portion with a shape suitable for joining inorganic plates together, and in this embodiment, it is an end portion with a solid structure. The second surface-side joining portion P4 has a stacked structure comprising, from the surface F1 side, a third hardening layer 13, a first hardening layer 11, a second hardening layer 12, and an additional third hardening layer 13, and has a fourth base portion P4a and a fourth protrusion portion P4b. The fourth protrusion portion P4b is thinner than the fourth base portion P4a and extends outward from the fourth base portion P4a along the second direction D2. The fourth protrusion portion P4b is located in the thickness direction T closer to the surface F1 side than the third protrusion portion P3b. That is, the third protrusion portion P3b is located in the thickness direction T closer to the back surface F2 side than the fourth protrusion portion P4b.

[0152] Furthermore, the second surface-side joint P4 has a higher density than the inner portion adjacent to it in the second direction D2. The specific gravity of the second surface-side joint P4 is, for example, 1.05 to 1.15 g / cm³. 3 The specific gravity of the inner portion adjacent to the second surface-side joint P4 is, for example, 0.9 to 1.1 g / cm³. 3 .

[0153] The inorganic plate X2 manufactured by the inorganic plate manufacturing method of the third embodiment is similar to the inorganic plate manufacturing method of the first embodiment, and has a first back-side joint P1, a first front-side joint P2, a second back-side joint P3, and a second front-side joint P4 at its end, which are locally high-density.

[0154] Such an inorganic plate X2 avoids excessive weight and is suitable for preventing water from seeping in from the ends of the inorganic plate that have been processed to form the first back-side joint P1, the first front-side joint P2, the second back-side joint P3, and the second front-side joint P4. That is, the inorganic plate manufacturing method of the third embodiment is similar to that of the inorganic plate manufacturing method of the first embodiment, and is suitable for manufacturing inorganic plates that achieve high water resistance.

[0155] Furthermore, in the inorganic board manufacturing method of the third embodiment, as a curing process ( Figure 16 The raw material slab M of (a) can be formed such that the amount of raw material piled up per unit thickness in the fifth part Me and the sixth part Mf is also locally greater. Therefore, it is possible to manufacture an inorganic plate X2 having a first reinforcing part P5 (hardened fifth part Me) and a second reinforcing part P6 (hardened sixth part Mf) that are higher in density (i.e. denser) than the adjacent parts.

[0156] The first reinforcing part P5 and the second reinforcing part P6 are respectively adapted to perform the reinforcing function of the inorganic plate X2. Specifically, the first reinforcing part P5 and the second reinforcing part P6 are respectively adapted to suppress the deflection of the inorganic plate X2 during transportation and construction, and therefore are adapted to suppress the generation of microcracks inside the inorganic plate X2 caused by such deflection. Such suppression of microcracks is preferred in achieving high water resistance of the inorganic plate X2.

[0157] Furthermore, in the inorganic board manufacturing method of the third embodiment, a third hardened layer 13 is formed on the surface F1 side and an additional third hardened layer 13 is formed on the back side F2 side as a surface layer. Each third hardened layer 13 in this embodiment is formed from a third raw material containing a third reinforcing material smaller than the first reinforcing material and the second reinforcing material. Compared to the first hardened layer 11 formed from the first raw material and the second hardened layer 12 formed from the second raw material, the third hardened layer 13 can function as a dense surface layer. Such a third hardened layer 13 helps to achieve high water resistance in the inorganic board X2.

[0158] In this manufacturing method, a receiving plate without the first protrusion Ba and the second protrusion Bb may be used as the receiving plate B1, and a pressure plate having the first protrusion Ba located at a position corresponding to the predetermined forming position of the first back-side joint P1 and the second protrusion Bb located at a position corresponding to the predetermined forming position of the second back-side joint P3 may be used as the pressure plate B2.

[0159] With this approach, it is also possible to manufacture an inorganic plate X2 having a first back-side joint P1, a first front-side joint P2, a second back-side joint P3, a second front-side joint P4, a first reinforcing part P5, and a second reinforcing part P6.

[0160] In this manufacturing method, the second back-side joint P3 and the second front-side joint P4, which are not subjected to high-density processing, can also be formed as needed. By using a receiving plate without the second protrusion Bb as the receiving plate B1, it is possible to manufacture an inorganic plate X2 in which the second back-side joint P3 and the second front-side joint P4 are not subjected to high-density processing.

[0161] In this manufacturing method, an inorganic plate X2 without the first reinforcing part P5 can also be manufactured as needed. By... Figure 14 In the pressing process shown in (c), the fifth part Me of the raw material blank M is not pressed, and such an inorganic board X2 can be manufactured.

[0162] In this manufacturing method, an inorganic plate X2 without the second reinforcing part P6 can also be manufactured as needed. By... Figure 14In the pressing process shown in (c), the sixth part Mf of the raw material slab M is not pressed, and such an inorganic slab X2 can be manufactured.

[0163] In the manufacturing method described above, the above reference may also be omitted. Figure 14 The third deposition process described in (a) is used. In this case, an inorganic plate X2 without the third hardened layer 13 on the surface F1 side is manufactured. Alternatively, in this manufacturing method, the above-mentioned process may be omitted. Figure 15 The additional third stacking process described in (c). In this case, an inorganic plate X2 without a third hardened layer 13 is manufactured on the back side F2.

[0164] Explanation of reference numerals in the attached figures

[0165] D1 First Direction

[0166] D2 Second Direction

[0167] T in the thickness direction

[0168] B1 Support Plate

[0169] Ba First protrusion

[0170] Bb Second protrusion

[0171] B2 pressure plate

[0172] M raw material slab

[0173] Ma Part 1

[0174] Mb Part 2

[0175] Mc Part 3

[0176] Md Part 4

[0177] Me Part 5

[0178] Mf Part Six

[0179] L1 First Floor

[0180] L2 Second Layer

[0181] L3 Third Layer

[0182] Inorganic plates X1, X1', and X2

[0183] 11 First Hardened Layer

[0184] 12 Second Hardened Layer

[0185] 13 Third Hardened Layer

[0186] P1 First back side joint

[0187] P1a First base

[0188] P1b First protrusion

[0189] P2 First surface joint

[0190] P2a Second base

[0191] P2b Second extension

[0192] P3 Second back side joint

[0193] P3a Third base

[0194] P3b Third extension

[0195] P4 Second side joint

[0196] P4a Fourth base

[0197] P4b Fourth extension

[0198] P5 First Reinforcement Section

[0199] P6 Second Reinforcement Section.

Claims

1. A method for manufacturing an inorganic board, comprising: In the first stacking process, a first raw material is stacked on a receiving plate to form a first raw material slab including a first layer, wherein the first raw material contains a hydraulic first inorganic material and a first reinforcing material. In the first pressing step, a first part and a second part are partially pressed and compressed from the side opposite to the receiving plate toward the receiving plate side. The first part is one end of the first raw material blank in a first direction, and the second part is the other end of the first raw material blank in the first direction. In the second stacking process, the second raw material is stacked on the first raw material slab to form a second raw material slab including the first layer and the second layer. The second raw material contains a hydraulic second inorganic material and a second reinforcing material. The planarization process involves flattening the exposed surface of the second raw material slab on the side opposite to the receiving plate. In the second pressing process, after a pressure plate is placed on the second raw material blank, the entire surface of the second raw material blank is pressed between the receiving plate and the pressure plate. In the curing process, the second raw material slab is cured while pressed between the receiving plate and the pressure plate, thereby forming a hardened slab from the second raw material slab; and The processing step involves forming a first back-side joint in such a way that the portion of the hardened plate including the first raw material corresponding to the first portion is recessed, and forming a first front-side joint in such a way that the portion of the hardened plate including the first raw material corresponding to the second portion is recessed.

2. The method for manufacturing an inorganic plate according to claim 1, wherein, In the first pressing step, the third and fourth parts are partially pressed and compressed from the side opposite to the receiving plate towards the receiving plate side. The third part is one end of the first raw material blank in the second direction intersecting the first direction, and the fourth part is the other end of the first raw material blank in the second direction. In the processing step, a second back-side joint is formed in such a way that the portion of the hardened plate including the first raw material corresponding to the third portion is recessed, and a second front-side joint is formed in such a way that the portion of the hardened plate including the first raw material corresponding to the fourth portion is recessed.

3. The method for manufacturing an inorganic plate according to claim 1 or 2, wherein, In the first pressing process, the fifth part of the first raw material slab is partially pressed and compressed from the side opposite to the receiving plate toward the receiving plate side, wherein the fifth part is a portion in the first direction between the first part and the second part.

4. The method for manufacturing an inorganic board according to claim 2, wherein, In the first pressing process, the sixth part of the first raw material slab is locally pressed and compressed from the side opposite to the receiving plate toward the receiving plate side, the sixth part being a portion in the second direction between the third part and the fourth part.

5. The method for manufacturing an inorganic plate according to claim 1 or 2, wherein, The inorganic board manufacturing method further includes at least one third stacking step of stacking a third raw material to form a third layer, wherein the third raw material contains a hydraulic third inorganic material and a third reinforcing material. The third stacking process is performed before the first stacking process to form the third layer on the receiving plate. In the first stacking process, the first layer is formed on the third layer to form the first raw material slab. The third stacking process is performed between the planarization process and the curing process to form the second raw material slab having the third layer on the second layer, or The third stacking process is performed before the first stacking process to form the third layer on the receiving plate. In the first stacking process, the first layer is formed on the third layer to form the first raw material slab. The third stacking process is performed between the planarization process and the curing process to form the second raw material slab having the third layer on the second layer.

6. The method for manufacturing an inorganic plate according to claim 1 or 2, wherein, The receiving plate and / or the pressure plate are mold plates with concave and convex shapes on the surface of the raw material slab.

7. The method for manufacturing an inorganic plate according to claim 1 or 2, wherein, The first back-side joint includes a first base and a first protrusion. The first base has a thickness equal to or greater than that of a first inner portion adjacent to the first back-side joint. The first protrusion is thinner than the first base and extends from the first base along the first direction in a shape that includes a recess of the first material. The first surface-side joint includes a second base and a second protrusion. The second base has a thickness equal to or greater than that of a second inner portion adjacent to the first surface-side joint. The second protrusion is thinner than the second base and extends from the second base in the first direction in a shape that includes a recess of the first material.

8. The method for manufacturing an inorganic plate according to claim 7, wherein, The second protrusion includes only the first material.

9. The method for manufacturing an inorganic plate according to claim 1 or 2, wherein, The first raw material and the second raw material are different raw materials.

10. An inorganic plate manufactured by the inorganic plate manufacturing method according to any one of claims 1 to 9, having a surface and a back surface opposite to the surface, and having a thickness between the surface and the back surface, wherein, The inorganic plate has a first back-side joint and a first front-side joint, the first back-side joint being located at one end in a first direction intersecting the thickness direction, and the first front-side joint being located at the other end in the first direction. The first back-side joint has a first base and a first protrusion. The first base has a thickness equal to or greater than that of a first inner portion adjacent to the first back-side joint in the first direction. The first protrusion is thinner than the first base and extends outward from the first base in the first direction in a recessed shape on the surface side. The first surface-side joint has a second base and a second protrusion. The second base has a thickness equal to or greater than that of a second inner portion adjacent to the first surface-side joint in the first direction. The second protrusion is thinner than the second base and extends outward from the second base in the first direction in a recessed shape on the back side. The second protrusion is located on the surface side closer to the first protrusion in the thickness direction. The portion of the first protrusion facing the surface side and the portion of the second protrusion facing the back side have a higher density than the portion of the first protrusion facing the back side.

11. The inorganic plate according to claim 10, wherein, The first base of the first back-side joint and the second base of the first front-side joint have a laminated structure comprising a first hardened layer and a second hardened layer with a lower density than the first hardened layer in the thickness direction.

12. The inorganic plate according to claim 10 or 11, wherein, The inorganic plate further includes a first reinforcing portion, which is a portion in the first direction between the first back-side joint and the first front-side joint. The first reinforcing portion has a thickness equal to or greater than that of the portion adjacent to it in the first direction, and has a higher density compared to the adjacent portion.

13. The inorganic plate according to claim 10, wherein, The inorganic plate has a second back-side joint and a second front-side joint. The second back-side joint is located at one end in a second direction that intersects the thickness direction and the first direction, and the second front-side joint is located at the other end in the second direction. The second back-side joint has a third base and a third protrusion. The third base has a thickness equal to or greater than that of a third inner portion adjacent to the second back-side joint in the second direction. The third protrusion is thinner than the third base and extends outward from the third base along the second direction. The second surface-side joint has a fourth base and a fourth protrusion. The fourth base has a thickness equal to or greater than that of a fourth inner portion adjacent to the second surface-side joint in the second direction. The fourth protrusion is thinner than the fourth base and extends outward from the fourth base along the second direction. The fourth protrusion is located closer to the surface side than the third protrusion in the thickness direction. The portion of the third protrusion facing the surface side and the portion of the fourth protrusion facing the back side have a higher density than the portion of the third protrusion facing the back side.

14. The inorganic plate according to claim 13, wherein, The third base of the second back-side joint and the fourth base of the second front-side joint have a laminated structure comprising a first hardened layer and a second hardened layer with a lower density than the first hardened layer in the thickness direction.

15. The inorganic plate according to claim 13 or 14, wherein, The inorganic plate further comprises a second reinforcing portion, which is a portion in the second direction between the second back-side joint and the second front-side joint. The second reinforcing portion has a thickness equal to or greater than that of the portion adjacent to it in the second direction, and has a higher density compared to the adjacent portion.

16. The inorganic plate according to claim 11 or 14, wherein, The first hardening layer and the second hardening layer each contain reinforcing material, and the first base of the first back-side joint and the second base of the first front-side joint have a laminated structure including a third hardening layer, the third hardening layer containing a reinforcing material smaller than the reinforcing material contained in the first hardening layer and the second hardening layer.

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