Wafer lifting device applied to integrated circuit equipment

Abstract

The application provides a wafer lifting device applied to an integrated circuit device, and belongs to the technical field of semiconductor devices.The wafer lifting device applied to the integrated circuit device comprises an outer sleeve vertically arranged below an operation table of the integrated circuit device, a thimble mounting shaft slidably accommodated in the outer sleeve, the thimble mounting shaft being magnetic, a thimble connected to the upper end of the thimble mounting shaft, and a through hole provided on the operation table and through which the thimble passes; the lower end of the outer sleeve has a bottom surface, a spring is arranged between the thimble mounting shaft and the bottom surface of the outer sleeve in the outer sleeve; a cylindrical iron core is sleeved on the outer side surface of the lower part of the outer sleeve, the outer side surface of the cylindrical iron core is provided with a coil, the coil is connected with a power supply and a current control element for controlling the current size thereof.The wafer lifting device has the advantages of simple structure, small space occupation, greatly reduced cost compared with the prior art, and simple control device and control method.

Description

Technical Field

[0001] This invention belongs to the field of integrated circuit equipment technology, and specifically relates to a wafer lifting device used in integrated circuit equipment. Background Technology

[0002] In integrated circuit equipment, the wafer lifting mechanism is a crucial component, requiring the transmission of vertical movement between the atmosphere and a vacuum chamber. Existing technologies, such as those described in US patent applications US15418656 and US09797459, typically use a cylinder or motor with a lead screw as the power source, employing bellows as the power transmission and sealing structure between the vacuum and atmosphere. Three pins are each connected to a bellows, which in turn connect to a triangular structure. The cylinder or motor with a lead screw drives this triangular structure to achieve the pin lifting function. This structure is space-consuming and costly, almost completely occupying the bottom space of the chamber, making assembly and maintenance inconvenient. Other functional structures below the chamber, such as vacuum lines, valves, temperature sensors, and water lines, cannot be installed. Furthermore, the bellows are expensive and are consumable parts requiring periodic replacement, resulting in high equipment operation and maintenance costs. Summary of the Invention

[0003] Based on the problems existing in the prior art, the present invention provides a wafer lifting device for integrated circuit equipment, which replaces the existing lifting devices that use bellows and cylinders or motors with lead screws, and solves many drawbacks of the existing devices such as high cost, large space occupation, and complex structure and control.

[0004] According to the technical solution of the present invention, the present invention provides a wafer lifting device for integrated circuit equipment. The wafer lifting device includes an outer sleeve vertically disposed below the operating table of the integrated circuit equipment. A pin mounting shaft is slidably accommodated inside the outer sleeve. The pin mounting shaft is magnetic, and a pin is connected to the upper end of the pin mounting shaft. A through hole is provided on the operating table for the pin to pass through. The lower end of the outer sleeve has a bottom surface. A spring is disposed between the pin mounting shaft and the bottom surface of the outer sleeve inside the outer sleeve. A cylindrical iron core is sleeved on the outer side of the lower part of the outer sleeve. A coil is disposed on the outer side of the cylindrical iron core. The coil is connected to a power supply and a current control element for controlling the magnitude of the current therein.

[0005] Preferably, the outer sleeve is a flange sleeve with a flange portion having a flange hole at its upper end, and the bottom surface of the operating table has mounting screw holes, through which mounting screws pass and connect to the mounting screw holes of the operating table.

[0006] Furthermore, a sealing ring groove is provided on the upper surface of the flange, and a sealing ring is embedded in the sealing ring groove. The upper and lower surfaces of the sealing ring abut against the operating table and the flange respectively.

[0007] Preferably, the ejector pin mounting shaft is a stepped segmented cylinder with a larger diameter in the middle section and smaller diameters in the upper and lower sections; the outer surfaces of the upper and lower sections of the ejector pin mounting shaft are provided with retaining grooves and retaining springs are embedded therein; a bushing is installed between the retaining spring and the middle section of the ejector pin mounting shaft, and the bushing is annular and sleeved on the outside of the ejector pin mounting shaft.

[0008] Furthermore, the inner diameter of the bushing matches the outer diameter of the upper and lower sections of the ejector pin mounting shaft, and the outer diameter of the bushing matches the inner diameter of the outer sleeve; the outer diameter of the middle section of the ejector pin mounting shaft is smaller than the inner diameter of the outer sleeve.

[0009] Preferably, the bottom surface of the outer sleeve has a through hole and a connector; the outer surface of the bushing has at least one through notch.

[0010] Preferably, it also includes a magnetic switch for detecting the position of the ejector pin mounting shaft, the magnetic switch being disposed on the outer side of the outer sleeve.

[0011] Preferably, the magnetic switch is connected to the outer surface of the outer sleeve via a ring-shaped mounting structure.

[0012] Furthermore, a mounting hole is provided at the center of the upper end of the ejector pin mounting shaft, and the lower end of the ejector pin is set in the mounting hole.

[0013] Furthermore, the through holes through which the ejector pins pass on the operating table are at least three that are not collinear, and the position and number of the wafer lifting devices correspond to these through holes.

[0014] Compared with the prior art, the beneficial technical effects of the present invention applied to the wafer lifting device of integrated circuit equipment are as follows:

[0015] 1. The wafer lifting device of the present invention applied to integrated circuit equipment has a simple structure. Each wafer lifting device only needs a tubular structure to control the up and down lifting of the ejector pin. There is no need to use a tripod structure to connect multiple lifting devices and drive them with cylinders or servo motors and lead screws.

[0016] 2. The wafer lifting device of the present invention occupies very little space, which can make up a lot of space at the bottom of the chamber for the installation of other functional components, and is convenient for installation and maintenance.

[0017] 3. The wafer lifting device of the present invention applied to integrated circuit equipment eliminates the need for cylinders or servo motors with lead screws, thus eliminating the need for additional air sources or expensive servo motor control, and also eliminating the high-cost and easily damaged bellows, thereby greatly reducing costs.

[0018] 4. The wafer lifting device of the present invention, applied to integrated circuit equipment, can achieve wafer lifting within a wide range of positions and speeds by precisely controlling the current supplied to the coil, and can also achieve precise positioning of the wafer at any position within the lifting stroke range. Moreover, the control device and control method are relatively simple.

[0019] 5. The preferred embodiment of this invention for a wafer lifting device in integrated circuit equipment can be equipped with a connector and a purge pipeline at the bottom. This allows for periodic nitrogen purging of the environment for processes requiring high cleanliness, effectively removing particulate matter and preventing the wafer lifting device from jamming or contaminating the wafer, thus ensuring high-quality equipment operation. Alternatively, it can introduce gases required for other processes. Existing technologies using corrugated pipes for lifting cannot achieve this purging and ventilation process. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of an integrated circuit device employing the wafer lifting device of the present invention.

[0021] Figure 2 yes Figure 1 A cross-sectional view of the structure shown.

[0022] Figure 3 This is a three-dimensional structural schematic diagram of a wafer lifting device according to an embodiment of the present invention.

[0023] Figure 4 yes Figure 3 A cross-sectional view of the structure shown.

[0024] Figure 5 yes Figure 4 The diagram shows a three-dimensional structural schematic of the ejector pin mounting shaft and surrounding components.

[0025] Explanation of reference numerals in the attached figures:

[0026] 1. Vacuum chamber;

[0027] 2. Control panel;

[0028] 3. Wafer lifting device;

[0029] 301. Threshold pin;

[0030] 302. Install screws;

[0031] 303. Sealing ring;

[0032] 304, outer jacket sleeve;

[0033] 3041, Flange section;

[0034] 305. Snap ring;

[0035] 306. Bushing;

[0036] 3061. Gap;

[0037] 307. Ejector pin mounting shaft;

[0038] 308. Spring;

[0039] 309. Cylindrical iron core;

[0040] 310. Coil;

[0041] 311. Connector;

[0042] 4. Magnetic switch;

[0043] 401. Ring-shaped installation structure. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0045] It should also be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings. Unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0046] It should be noted that the concepts of "first" and "second" mentioned in this invention are only used to distinguish different devices, modules or units, and are not used to limit the order of functions performed by these devices, modules or units or their interdependencies.

[0047] It should be noted that the terms "a" and "a plurality of" used in this invention are illustrative rather than restrictive. Those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0048] This invention relates to a wafer lifting device for integrated circuit equipment, belonging to the field of semiconductor equipment technology. The wafer lifting device includes an outer sleeve vertically disposed below the operating table of the integrated circuit equipment. A pin mounting shaft, magnetically mounted, is slidably housed within the outer sleeve. A pin is connected to the upper end of the pin mounting shaft, and a through hole is provided on the operating table for the pin to pass through. The lower end of the outer sleeve has a bottom surface. A spring is disposed between the pin mounting shaft and the bottom surface of the outer sleeve within the outer sleeve. A cylindrical iron core is fitted onto the outer surface of the lower part of the outer sleeve, and a coil is disposed on the outer surface of the cylindrical iron core. The coil is connected to a power supply and a current control element for controlling the current within it. The solution of this invention has a simple structure, occupies very little space, significantly reduces costs compared to existing technologies, and the control device and control method are also relatively simple.

[0049] Please see Figure 1 , Figure 2 The integrated circuit equipment involved in this invention includes a vacuum chamber 1, a stage 2, and a wafer lifting device 3. The vacuum chamber 1 provides the necessary vacuum environment for wafer processing. The stage 2 is sealed inside the vacuum chamber 1 (the top surface of the stage 2 forms part of the bottom of the vacuum chamber 1). The stage 2 is used to place the wafer and is equipped with components necessary for completing the wafer process, such as the wafer lifting device 3, vacuum pipelines, process pipelines, cooling or insulation water lines, and temperature sensors. The stage 2 has through holes at the corresponding positions of the wafer lifting devices 3, through which ejector pins 301 pass. There are at least three non-collinear through holes on the stage 2, and the position and number of the wafer lifting devices 3 correspond to these through holes. The wafer lifting device 3 lifts the wafer and moves it up and down by means of the ejector pins 301 extending from the upper operating table 2. In this embodiment, there are 3 ejector pins 301 evenly distributed in the circumference, that is, there are 3 sets of wafer lifting devices 3. However, the application of the present invention is not limited to 3 sets, and can be set to other numbers and positions as needed.

[0050] Please also refer to Figure 3 , Figure 4The present invention relates to a wafer lifting device for integrated circuit equipment. The wafer lifting device 3 includes an outer sleeve 304 vertically disposed below the operating table 2 of the integrated circuit equipment. A pin mounting shaft 307 is slidably housed within the outer sleeve 304. The pin mounting shaft 307 is magnetic, and a pin 301 is connected to its upper end. The lower end of the outer sleeve 304 has a bottom surface. A spring 308 is disposed between the pin mounting shaft 307 and the bottom surface of the outer sleeve 304. A cylindrical iron core 309 is fitted onto the outer surface of the lower part of the outer sleeve 304. A coil 310 is disposed on the outer surface of the cylindrical iron core 309. The coil 310 is connected to a power supply and a current control element that controls the current magnitude. This forms a DC solenoid electromagnet structure, which attracts and releases the pin mounting shaft 307 via electromagnetism, thereby achieving vertical lifting.

[0051] The outer sleeve 304 is a cylindrical thin-walled structure (cylindrical structure) and is the main body of the wafer lifting device 3. Its outer side is exposed to the atmosphere, and its inner side is a vacuum. The ejector pin mounting shaft 307 and the ejector pin 301 slide up and down within its inner side. In a preferred embodiment, the outer sleeve 304 is a flange cylinder, with its upper end having a flange portion 3041 (an outwardly extending annular flange / annular plate) having several flange holes (through holes). The bottom surface of the operating table 2 has several mounting screw holes, and several mounting screws 302 pass through the flange holes one-to-one and connect to the mounting screw holes of the operating table 2. The mounting screws 302 can be standard parts, for example... Figure 3 The three are evenly distributed around the perimeter. This forms a detachable assembly method that is easy to install, clean, maintain, and replace. It is conceivable that the outer sleeve 304 can also be connected to the operating table 2 by means other than flanges and screws, such as plug-in, snap-fit, or direct welding.

[0052] Furthermore, a sealing ring groove is provided on the upper surface of the flange 3041, and a sealing ring 303 is embedded in the sealing ring groove. The sealing ring 303 is a circular sealing ring. The upper and lower surfaces of the sealing ring 303 respectively abut against the operating table 2 and the flange 3041, thereby achieving a sealed isolation between the vacuum environment inside the outer sleeve 304 and the vacuum chamber 1 and the atmospheric environment outside the outer sleeve 304 and under the operating table 2.

[0053] In a preferred embodiment, such as Figure 4 , Figure 5As shown, the ejector pin mounting shaft 307 is a stepped, segmented cylinder with a larger diameter in the middle section and smaller diameters in the upper and lower sections, forming a vertical stepped structure between the middle section and the upper and lower sections. The ejector pin mounting shaft 307 is made of 17-4PH martensitic stainless steel or other magnetic materials that do not affect the process. Both the upper and lower sections of the ejector pin mounting shaft 307 have retaining spring grooves on their outer surfaces, into which retaining springs 305 are embedded. The retaining springs 305 can be standard parts. A bushing 306 is installed between the retaining spring 305 and the middle section of the ejector pin mounting shaft 307, thus fixing the bushing 306 against the stepped structure via the retaining spring 305. The bushing 306 is annular (cylindrical), with two bushings 306 respectively fitted onto the upper and lower sections of the ejector pin mounting shaft 307, symmetrically arranged at both ends of the ejector pin mounting shaft 307, for guiding the vertical movement of the ejector pin mounting shaft 307. The bushing 306 can be made of polyimide (PI) or other wear-resistant materials.

[0054] The inner diameter of bushing 306 matches the outer diameter of the upper and lower sections of ejector pin mounting shaft 307, and the outer diameter of bushing 306 matches the inner diameter of outer sleeve 304; the outer diameter of the middle section of ejector pin mounting shaft 307 is smaller than the inner diameter of outer sleeve 304. Therefore, this middle section does not contact the inner surface of outer sleeve 304, but rather the outer surface of bushing 306 contacts the inner surface of outer sleeve 304 to achieve the motion guiding function, enabling ejector pin mounting shaft 307 to smoothly drive ejector pin 301 to slide up and down.

[0055] Spring 308 is a non-magnetic cylindrical compression spring. Its upper end is located below the ejector pin mounting shaft 307, and its lower end is fixed to or abuts against the bottom surface of the outer sleeve 304. The maximum outer diameter of spring 308 is smaller than the inner diameter of the outer sleeve 304, and it does not contact or rub against the inner surface of the outer sleeve 304. Spring 308 is used to provide buffering damping when the ejector pin mounting shaft 307 descends and thrust when it ascends.

[0056] The cylindrical iron core 309 is a hollow cylinder with an inner diameter matching the outer diameter of the outer sleeve 304. It is fitted onto the outside of the outer sleeve 304 and is made of silicon steel, soft iron, or other non-permanent magnet material. It generates magnetism when energized and loses its electromagnetic properties when de-energized. When current flows through the coil 310, it can be magnetized to generate electromagnetic attraction, thereby attracting or releasing the pin mounting shaft 307, causing it to move up and down. The cylindrical iron core 309 can be a single piece or other forms, such as a multi-layered, stacked, or separate structure.

[0057] Coil 310 is a multi-layered (turns) coil wound around the outside of the cylindrical iron core 309, and is a conductive winding matched to its power. When current flows through it, magnetism is generated, magnetizing the iron core 309 and producing an electromagnetic attraction. The electromagnetic attraction forces of coil 310 and iron core 309 are superimposed, and the resulting electromagnetic attraction force is proportional to the magnitude of the current passing through coil 310. The magnitude of the electromagnetic attraction force can be adjusted by regulating the magnitude of the current passing through coil 310. The current control element controlling the magnitude of the current is existing technology, for example, by adjusting the total resistance value connected in series in the circuit. The relevant manual or electric (automatic) control technology is quite mature, so it will not be elaborated further in this paper.

[0058] The ejector pin 301 has a rod-like structure, with both ends being hemispherical or other shapes. The upper end protrudes through the through-hole of the operating table 2 and directly contacts the wafer. A mounting hole is provided at the center of the upper end of the ejector pin mounting shaft 307, and the lower end of the ejector pin 301 is inserted into this mounting hole. The ejector pin 301 is made of quartz, sapphire, ceramic, or other materials that meet the process requirements.

[0059] In a further preferred embodiment, a structure is also provided for nitrogen purging or introducing gases required for other processes. The bottom surface of the outer sleeve 304 has a through hole and a connector 311, and the outer surface of the bushing 306 has at least one through-hole 3061 (e.g., Figure 5 (As shown). Connector 311 is welded to the lower end of the outer sleeve 304, for example. Connector 311 is a gas line connector with vacuum sealing function, such as a VCR (Vacuum Coupling Radius Seal) connector, used to connect the purge line. The purge line is connected to an external gas source. Nitrogen gas is periodically introduced through the purge line to purge and clean the inside of the outer sleeve 304, and the particles in it are discharged through the notch 3061 on the outer side of the bushing 306 (and the gap between the middle section of the ejector pin mounting shaft 307 and the outer sleeve 304).

[0060] For processes or similar applications with low cleanliness requirements, the above-mentioned purging or ventilation process may be omitted, and there is no need to set the connector 311 or the notch 3061. The bottom surface of the outer sleeve 304 can be set as a blind hole (closed bottom surface).

[0061] More preferably, please refer to Figure 3It also includes a magnetic switch 4 for detecting the position of the ejector pin mounting shaft 307. The magnetic switch 4 is disposed on the outer surface of the outer sleeve 304, for example, by being connected and fixed to the outer surface of the outer sleeve 304 through an annular mounting structure 401 (such as a fixing strap / ring). Several magnetic switches 4 are arranged along the length direction (vertical direction) of the outer sleeve 304. When the ejector pin mounting shaft 307 passes through the sensing point of a certain magnetic switch 4, the magnetic switch 4 senses and generates a detection signal and feeds it back to the control system, so that the control system can obtain the position of the wafer. It can be used as an interlock, action logic signal, etc.

[0062] The working principle of the wafer lifting device 3 in the above embodiments of the present invention is as follows.

[0063] When the ejector pin 301 needs to lower the wafer, an external power supply generates current in the coil 310, which in turn generates electromagnetic properties, magnetizing the cylindrical iron core 309. The current is adjusted by a current control element, gradually increasing the current flowing through the coil 310. This gradually increases the electromagnetic attraction between the coil 310 and the cylindrical iron core 309. The electromagnetic attraction attracts the ejector pin mounting shaft 307 to move downwards against the elastic force of the spring 308. As the spring 308 is compressed, its elastic force gradually increases. The electromagnetic attraction and the spring elastic force are in opposite directions and both gradually increase.

[0064] When the ejector pin 301 needs to carry the wafer upward, the current flowing into the coil 310 is gradually reduced, the electromagnetic attraction force gradually decreases, and the spring force is greater than the electromagnetic attraction force, thereby pushing the ejector pin mounting shaft 307 to move upward. As the upward movement proceeds, both the electromagnetic attraction force and the spring force gradually decrease.

[0065] When the wafer needs to be positioned at a certain location within its total travel range, the current is stabilized at a certain value to balance the electromagnetic attraction, spring force, and the total gravity of the moving part.

[0066] The force analysis during the working process is as follows.

[0067] F X =kx;

[0068] Among them, F X : Spring force of spring 308, k: spring constant, x: deformation of spring 308.

[0069] G = mg;

[0070] Wherein, G: the total weight of the ejector pin mounting shaft 307, snap ring 305, bushing 306, ejector pin 301 (and wafer), m: the total mass of the above parts, and g: gravitational acceleration.

[0071] ;

[0072] Where F: electromagnetic attraction force, N: number of coil turns, I: current intensity, μ0: free permeability, μ0=4π×10 -7 Wb / A·m, S: cross-sectional area of ​​magnetic circuit (i.e., the cross-sectional area of ​​cylindrical iron core 309) δ: air gap length (i.e., the stroke of pin mounting shaft 307).

[0073] According to the equilibrium condition of forces: (downward) F X +G = (Upward)F;

[0074] The total weight of the components, G, is a fixed value, and the spring force, F... X As the spring is compressed, the force gradually increases, and at the same time, the electromagnetic attraction force F gradually increases with the increase of the current, so that the forces in the two directions are always in a dynamic equilibrium state, and the ejector pin 301 can rise and fall smoothly; when the forces in the two directions are completely equal, the ejector pin 301 can be positioned at any position.

[0075] In summary, the wafer lifting device of the present invention applied to integrated circuit equipment has at least the following advantages compared with the prior art.

[0076] Advantage 1: The solution of this invention has a simple structure, low cost, and small footprint. Each wafer lifting device only requires a single tubular structure to achieve the up and down movement of the ejector pin. There is no need to use a tripod structure to connect multiple lifting devices and drive them with cylinders or servo motors and lead screws. Therefore, the structure is simple and occupies very little space, freeing up ample space for the installation of other functional components and facilitating installation and maintenance. By eliminating cylinders or servo motors with lead screws, additional air sources or expensive servo motor control are also eliminated, as well as the high-cost and easily damaged bellows, thus significantly reducing costs.

[0077] Advantage 2: The solution of this invention can achieve wafer lifting and lowering within a wide range of positions and speeds, and can also achieve precise positioning of the wafer at any position within the lifting and lowering stroke range, by precisely controlling the magnitude of the current flowing through the coil. Both the control device and the control method are relatively simple.

[0078] Advantage 3: The preferred solution of this invention can be equipped with connectors and purging pipelines, thereby enabling periodic nitrogen purging of the environment for processes with high cleanliness requirements. This removes particulate matter from the process environment, helping to prevent the wafer lifting device from jamming or contaminating the wafer, and ensuring high-quality operation of the equipment. Existing technologies using corrugated pipes for lifting cannot achieve this type of purging.

[0079] It is understood that the present invention includes, but is not limited to, the lifting and lowering of semiconductor wafers, and is also applicable to other applications, such as any scenario where linear motion transmission is achieved between a vacuum and the atmosphere.

[0080] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer lifting device applied to an integrated circuit device, characterized by, The wafer lifting device (3) includes an outer sleeve (304) vertically disposed below the operating table (2) of the integrated circuit equipment. The outer sleeve (304) accommodates a pin mounting shaft (307) that can slide up and down. The pin mounting shaft (307) is magnetic. A pin (301) is connected to the upper end of the pin mounting shaft (307). A through hole is provided on the operating table (2) for the pin (301) to pass through. The lower end of the outer sleeve (304) has a bottom surface. A spring (308) is disposed between the pin mounting shaft (307) and the bottom surface of the outer sleeve (304) inside the outer sleeve (304). A cylindrical iron core (309) is sleeved on the outer side of the lower part of the outer sleeve (304). A coil (310) is disposed on the outer side of the cylindrical iron core (309). The coil (310) is connected to a power supply and a current control element that controls the magnitude of the current therein. It also includes a magnetic switch (4) for detecting the position of the ejector pin mounting shaft (307), the magnetic switch (4) being disposed on the outer side of the outer sleeve (304); When the pin (301) needs to descend, a current is generated in the coil (310) by the power supply. The current is adjusted by the current control element so that the current flowing into the coil (310) gradually increases from small to large, thereby gradually increasing the electromagnetic attraction between the coil (310) and the cylindrical iron core (309). When the pin (301) needs to rise, the current flowing into the coil (310) is gradually reduced, and the electromagnetic attraction gradually decreases. When the pin (301) needs to be positioned at a certain location, the current is stabilized at a certain value to balance the forces.

2. The wafer lift apparatus for use in an integrated circuit device as recited in claim 1, wherein, The outer sleeve (304) is a flange sleeve, and its upper end is a flange part (3041) with a flange hole. The bottom surface of the operating table (2) has a mounting screw hole, and the mounting screw (302) passes through the flange hole and connects to the mounting screw hole of the operating table (2).

3. The wafer lifting device for integrated circuit equipment as described in claim 2, characterized in that, A sealing ring groove is provided on the upper surface of the flange (3041), and a sealing ring (303) is embedded in the sealing ring groove. The upper and lower surfaces of the sealing ring (303) respectively seal against the operating table (2) and the flange (3041).

4. The wafer lift apparatus for use in an integrated circuit device as recited in claim 1, wherein, The ejector pin mounting shaft (307) is a stepped segmented cylinder with a large diameter in the middle section and a small diameter in the upper and lower sections. The outer surfaces of the upper and lower sections of the ejector pin mounting shaft (307) are provided with retaining spring grooves and retaining springs (305) are embedded therein. A bushing (306) is installed between the retaining spring (305) and the middle section of the ejector pin mounting shaft (307). The bushing (306) is annular and is sleeved on the outside of the ejector pin mounting shaft (307).

5. The wafer lift apparatus for use in an integrated circuit device as recited in claim 4, wherein, The inner diameter of the bushing (306) matches the outer diameter of the upper and lower sections of the ejector pin mounting shaft (307), and the outer diameter of the bushing (306) matches the inner diameter of the outer sleeve (304); the outer diameter of the middle section of the ejector pin mounting shaft (307) is smaller than the inner diameter of the outer sleeve (304).

6. The wafer lift apparatus for use in an integrated circuit device as recited in claim 5, wherein, The bottom surface of the outer sleeve (304) is provided with a through hole and a connector (311); the outer side surface of the bushing (306) is provided with at least one through notch (3061).

7. The wafer lift apparatus for use in an integrated circuit device according to any one of claims 1 to 6, wherein The magnetic switch (4) is connected to the outer side of the outer sleeve (304) through an annular mounting structure (401).

8. The wafer lifting device for integrated circuit equipment as described in any one of claims 1-6, characterized in that, The upper center of the ejector pin mounting shaft (307) is provided with a mounting hole, and the lower end of the ejector pin (301) is disposed in the mounting hole.

9. The wafer lift device for use in an integrated circuit device according to any one of claims 1 to 6, wherein The operating table (2) has at least three through holes through which the ejector pin (301) passes, and the position and number of the wafer lifting device (3) correspond to these through holes.

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