Wafer chamfering processing fully automatic equipment

Abstract

The present invention relates to a fully automatic device for wafer chamfering, comprising: a machine platform, and a material box, a conveying device, a visual positioning device, an axis conveying device, a grinding device, and a cleaning device arranged on the machine platform; the conveying device comprises a fixed frame arranged on the machine platform, and a material picking mechanism arranged on the fixed frame; the material picking mechanism comprises a sliding mechanism arranged on the fixed frame, a first motor driving the sliding mechanism to move, a turntable mechanism arranged on the sliding mechanism, and a telescopic suction mechanism arranged on the turntable mechanism; the visual positioning device comprises a bearing assembly arranged on the machine platform, a positioning assembly and a thickness detection mechanism arranged on the bearing assembly; the axis conveying device comprises a bracket arranged on the machine platform, a conveying module arranged on the bracket, and a single-axis conveying mechanism. The fully automatic processing equipment of the present invention can effectively improve the processing efficiency and accuracy, and the equipment structure is compact and occupies a small space.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic product manufacturing, and in particular to fully automatic equipment for wafer chamfering. Background Art

[0002] With the rapid development of electronic products, the electronics market is increasingly demanding wafers, placing higher demands on their quality, specifications, and manufacturing processes. Wafers, also known as silicon wafers, are processed from silicon ingots. Millions of transistors can be etched onto these wafers through specialized processes, making them widely used in the manufacture of integrated circuits. Wafer post-processing typically includes chamfering, cleaning, and drying. The resulting wafers typically have sharp edges, so chamfering is necessary to round these edges.

[0003] When existing equipment performs chamfering on circular wafers, a transfer mechanism is used to coordinate with multiple chamfering equipment mechanisms, resulting in some chamfering equipment being idle, greatly affecting the overall processing efficiency of the wafer; there are also some equipment that distributes the transfer mechanisms used to transfer wafers between adjacent mechanisms, resulting in a complex structure of the overall wafer chamfering processing equipment, high production line purchase costs, and a large site area. In addition, when each mechanism is processing the wafer, the transfer mechanism is idle, wasting resources. Summary of the Invention

[0004] Based on this, the present invention provides a fully automatic device for wafer chamfering processing, which can reduce idle mechanisms and improve the overall wafer processing efficiency. The device has a compact structure and occupies a small space.

[0005] The present invention provides a fully automatic device for wafer chamfering, the device comprising: a machine platform, and a material box, a transport device, a visual positioning device, an axis transport device, a grinding device, and a cleaning device arranged on the machine platform;

[0006] The transport device is used to transport the wafers between the material box and the visual positioning device, and includes a fixed frame provided on the machine platform and a material picking mechanism provided on the fixed frame; the material picking mechanism includes a sliding mechanism provided on the fixed frame, a first motor driving the sliding mechanism to move, a turntable mechanism provided on the sliding mechanism, and a telescopic suction mechanism provided on the turntable mechanism, wherein the turntable mechanism can drive the telescopic suction mechanism to rotate along a horizontal plane;

[0007] The visual positioning device includes a carrying component provided on the machine platform, a positioning component provided on the carrying component, and a thickness detection mechanism;

[0008] The shaft transport device includes a bracket provided on the machine platform, a transport module provided on the bracket, and a single-axis transport mechanism; the transport module is used to transport the wafer between the visual positioning device and the polishing device, and the single-axis transport mechanism is used to transport the wafer between the shaft transport device and the cleaning device;

[0009] The polishing device is used to polish the wafer to be polished;

[0010] The cleaning device is used for cleaning polished wafers.

[0011] Furthermore, the telescopic suction mechanism includes:

[0012] A first guide rail provided on the turntable mechanism, a first conveyor belt connected to the rotating shaft of the first guide rail, a second motor driving the first conveyor belt to move, a first slider provided on the first guide rail and fixedly connected to the first conveyor belt, a second conveyor belt connected to the rotating shaft of the first slider, and a second slider provided on the first slider and fixedly connected to the second conveyor belt; while the first conveyor belt drives the first slider to move horizontally, the second conveyor belt drives the second slider to move horizontally.

[0013] Furthermore, the material taking mechanism further comprises:

[0014] A limit block is provided on the sliding mechanism and is used to limit the rotation angle of the telescopic suction mechanism driven by the turntable mechanism along the horizontal plane.

[0015] Furthermore, a vacuum suction port is provided at the material taking end of the second slider, and an air pipe port is provided on the second slider, and the suction port is communicated with the air pipe port.

[0016] Furthermore, the positioning component includes:

[0017] An imaging unit, a first light source, and a second light source are provided on the supporting component. The first light source and the second light source are located on both sides of the wafer. The first light source is used to cooperate with the imaging unit to obtain an image of the edge of the wafer, and the second light source is used to cooperate with the imaging unit to obtain an image of the chamfered edge of the wafer.

[0018] Furthermore, the transport module includes a first transport module and a second transport module provided on the bracket, the first transport module includes a first slider plate provided on the bracket and moving horizontally along the bracket, and a first sliding material-picking component provided on the first slider plate and moving vertically along the first slider plate; the second transport module includes a second slider plate provided on the bracket and moving horizontally along the bracket, and a second sliding material-picking component provided on the second slider plate and moving vertically along the second slider plate.

[0019] Furthermore, the single-axis transport mechanism includes:

[0020] A balance rail is provided on the bracket, and a material transfer component is provided on the balance rail and moves horizontally along the balance rail; the material transfer component is used to transfer wafers between the first sliding material picking component and the cleaning device, and between the second sliding material picking component and the cleaning device.

[0021] Furthermore, the grinding device comprises:

[0022] A first guardrail is provided on the machine platform, a first rotating suction cup is provided in the first guardrail, a grinding wheel, a flushing and air blowing component, an outer cover is provided on the top of the first guardrail, and a switch component is provided on the first guardrail for opening and closing the outer cover; the first rotating suction cup moves in the horizontal direction; and the grinding wheel moves in the vertical direction.

[0023] Furthermore, the cleaning device comprises:

[0024] A second guardrail is provided on the machine platform, a second rotating suction cup, an air blowing assembly, and a water blowing assembly are sequentially provided in the second guardrail, and a lifting and placing mechanism is provided on the second guardrail; the lifting and placing mechanism includes a fixing part provided on the second guardrail and a lifting part that moves vertically on the fixing part.

[0025] Furthermore, the material box includes a first material box for storing unqualified wafers and a second material box for storing qualified wafers.

[0026] According to the technical solution of the present invention, the fully automatic wafer chamfering processing equipment of the present invention avoids the inefficient state of some workpieces being in a waiting state during wafer processing through the coordinated work between the handling device, visual positioning device, shaft handling device, grinding device and cleaning device, greatly improving the processing efficiency, shortening the average time of wafer processing, and effectively ensuring the processing accuracy. The handling device of the equipment includes a fixed frame and a material picking mechanism provided on the fixed frame, and the shaft handling device includes a bracket, a handling module provided on the bracket, and a single-axis handling mechanism, which reduces the number of manipulators between workpieces, making the equipment structure compact and occupying a small space. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A schematic structural diagram of a fully automatic wafer chamfering processing device provided by an embodiment of the present invention;

[0028] Figure 2 for Figure 1 A schematic structural diagram of the transport device shown;

[0029] Figure 3 for Figure 1Another visual structural diagram of the transport device shown;

[0030] Figure 4 for Figure 1 The structural diagram of the visual positioning device shown;

[0031] Figure 5 for Figure 1 The structural diagram of the shaft handling device shown;

[0032] Figure 6 for Figure 1 A schematic structural diagram of the grinding device shown;

[0033] Figure 7 for Figure 1 Schematic diagram of the structure of the cleaning device shown.

[0034] The meanings of the reference numerals in the accompanying drawings are:

[0035] 100- Fully automatic equipment for wafer chamfering; 1- Machine; 2- Material box, 21- First material box, 22- Second material box; 3- Handling device, 31- Fixed frame, 32- Material picking mechanism, 321- Sliding mechanism, 322- First motor, 323- Turntable mechanism, 324- Telescopic suction mechanism, 3241- First guide rail, 3242- First conveyor belt, 3243- Second motor, 3244- First slider, 3245- Second conveyor belt, 3246- Second slider, 325- Limit block, 32461- Vacuum suction port, 32462- Air pipe port; 4- Visual positioning device, 41- Carrying assembly, 42- Positioning assembly, 421- Imaging unit, 422- First light source, 423- Second light source, 43- Thickness detection mechanism; 5-axis transport device, 51-bracket, 52-transport module, 521-first transport module, 522-second transport module, 5211-first slider plate, 5212-first sliding material picking part, 5221-second slider plate, 5222-second sliding material picking part, 53-single-axis transport mechanism, 531-balancing guide rail, 532-material transfer part; 6-grinding device, 61-first guardrail, 62-first rotary suction cup, 63-grinding wheel, 64-flushing and blowing assembly, 65-outer cover, 66-switch assembly; 7-cleaning device, 71-second guardrail, 72-second rotary suction cup, 73-blowing assembly, 74-water blowing assembly, 75-lifting and placing mechanism, 751-fixing part, 752-lifting part. DETAILED DESCRIPTION

[0036] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the accompanying drawings. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0037] It should be noted that when an element is referred to as being “fixed to” another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or there may be an intermediate element.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0039] This application is based on Figure 1 The X direction is the horizontal direction, the Y direction is the left or lateral direction of the left-right direction, and the Z direction is the upper direction of the up-down direction.

[0040] like Figures 1 to 7 As shown in FIG, it is a schematic diagram of a fully automatic device for wafer chamfering processing according to an embodiment of the present invention.

[0041] like Figure 1-4 As shown, Figure 1 Schematic diagram of a fully automatic wafer chamfering device 100 provided in an embodiment of the present invention. Figure 2 for Figure 1 The schematic structural diagram of the transport device shown in FIG. Figure 3 for Figure 1 Another visual structural diagram of the transport device shown, Figure 4 for Figure 1The structural diagram of the visual positioning device shown in the figure, the device 100 includes: a machine 1, and a material box 2, a conveying device 3, a visual positioning device 4, an axis conveying device 5, a grinding device 6, and a cleaning device 7 arranged on the machine 1; the conveying device 3 is used to convey the wafer between the material box 2 and the visual positioning device 4, including a fixed frame 31 arranged on the machine 1, and a material picking mechanism 32 arranged on the fixed frame 31; the material picking mechanism 32 includes a sliding mechanism 321 arranged on the fixed frame 31, a first motor 322 that drives the sliding mechanism 321 to move, a turntable mechanism 323 arranged on the sliding mechanism 321, and a telescopic suction mechanism 32 arranged on the turntable mechanism 323. 4, the turntable mechanism 323 can drive the telescopic suction mechanism 324 to rotate along the horizontal plane; the visual positioning device 4 includes a supporting component 41 provided on the machine 1, a positioning component 42 and a thickness detection mechanism 43 provided on the supporting component 41; the shaft transporting device 5 includes a bracket 51 provided on the machine 1, a transporting module 52 and a single-axis transporting mechanism 53 provided on the bracket 51; the transporting module 52 is used to transport the wafer between the visual positioning device 4 and the polishing device 6, and the single-axis transporting mechanism 53 is used to transport the wafer between the shaft transporting device 5 and the cleaning device 7; the polishing device 6 is used to polish the wafer to be polished; and the cleaning device 7 is used to clean the polished wafer.

[0042] Specifically, in this embodiment, the transport device 3 transports the wafer in the material box 2 to the visual positioning device 4, and the visual positioning device 4 detects the wafer thickness through the thickness detection mechanism 43. If the wafer thickness does not meet the requirements, the wafer in the visual positioning device 4 is moved to the material box 2 through the transport device 3; if the wafer thickness meets the requirements, the centering of the wafer is detected by the positioning component 42, and the aligned wafer is transported to the polishing device 6 through the transport module 52 for polishing. After the polishing device 6 finishes polishing, the polished wafer is transferred to the single-axis transport mechanism 53 through the transport module 52, and then the single-axis transport mechanism 53 is moved to the material box 2. 3 transports the wafer to the cleaning device 7 for cleaning. After cleaning is completed, the cleaning device 7 moves the polished and cleaned wafer to the single-axis transport mechanism 53. The single-axis transport mechanism 53 transports the polished and cleaned wafer to the transport module 52. The transport module 52 transports the polished and cleaned wafer to the visual positioning device 4. The visual positioning device 4 performs centering detection and chamfering detection on the polished and cleaned wafer. After the detection, it is transported to the material box 2 through the transport device 3. In this embodiment, the wafers that pass the inspection of the visual positioning device 4 can be placed together, and the wafers that fail the inspection can be placed together.

[0043] Furthermore, in this embodiment, when the transporting device 3 transports the wafer between the material box 2 and the visual positioning device 4, the first motor 322 can drive the sliding mechanism 321 to move up and down in the vertical direction (z-axis) to adjust the height of the transporting device 3, and the turntable mechanism 323 can drive the telescopic suction mechanism 324 to rotate along the horizontal plane (the plane formed by the x-axis and the y-axis) to adjust the direction of the telescopic suction mechanism 324, and the telescopic suction mechanism 324 can be telescoped back and forth to adjust the position to accurately absorb the wafer.

[0044] In some embodiments, as Figure 2-3 As shown, the telescopic suction mechanism 324 includes: a first guide rail 3241 provided on the turntable mechanism 323, a first conveyor belt 3242 connected to the rotating shaft of the first guide rail 3241, a second motor 3243 that drives the first conveyor belt 3242 to move, a first slider 3244 provided on the first guide rail 3241 and fixedly connected to the first conveyor belt 3242, a second conveyor belt 3245 connected to the rotating shaft of the first slider 3244, and a second slider 3246 provided on the first slider 3244 and fixedly connected to the second conveyor belt 3245; while the first conveyor belt 3242 drives the first slider 3244 to move horizontally, the second conveyor belt 3245 drives the second slider 3246 to move horizontally.

[0045] Specifically, in this embodiment, the second motor 3243 drives the first conveyor belt 3242 to rotate, the first conveyor belt 3242 drives the first slider 3244 to move horizontally along the first guide rail 3241, and the second conveyor belt 3245 drives the second slider 3247 to move horizontally along the first slider 3244, so that the telescopic suction mechanism 324 is a double telescopic movement control mechanism, which reduces the jitter when moving and placing the wafer, and improves the accuracy of moving and placing the wafer.

[0046] In some embodiments, as Figure 2 As shown, the material taking mechanism 32 further includes: a limit block 325 provided on the sliding mechanism 321 for limiting the rotation angle of the telescopic suction mechanism 324 driven by the turntable mechanism 323 along the horizontal plane.

[0047] Specifically, in this embodiment, when the turntable mechanism 323 drives the telescopic suction mechanism 324 to rotate along the horizontal plane, the limit block 325 limits the telescopic suction mechanism 324 to avoid damage to equipment and waste of production resources due to overtravel during the rotation process.

[0048] In some embodiments, as Figure 2-3 As shown, a vacuum suction port 32461 is provided at the material taking end of the second slider 3246 , and an air pipe port 32462 is provided on the second slider 3246 , and the vacuum suction port 32461 is communicated with the air pipe port 32462 .

[0049] Specifically, in this embodiment, a vacuum suction port 32461 is provided at the material picking end of the second slider 3246 , and the air pipe port 32462 provides a vacuum environment for the vacuum suction port 32461 . When the material picking mechanism 32 picks up the wafer, the vacuum suction port 32461 directly adsorbs it onto the second slider 3246 .

[0050] In some embodiments, as Figure 4 As shown, the positioning component 42 includes: an imaging unit 421, a first light source 422 and a second light source 423 arranged on the supporting component 41, the first light source 422 and the second light source 423 are located on both sides of the wafer, the first light source 422 is used to cooperate with the imaging unit 421 to obtain the image of the edge of the wafer, and the second light source 423 is used to cooperate with the imaging unit 421 to obtain the image of the chamfered edge of the wafer.

[0051] Specifically, in this embodiment, a wafer is placed on the carrier assembly 41, and the wafer is illuminated by the first light source 422. The imaging unit 421 obtains the wafer edge images and wafer notch edge images symmetrical on both sides of the wafer notch. The wafer core coordinates and diameter size are obtained through the wafer edge images symmetrical on both sides of the wafer notch, and it is determined whether they are within the specified range. The chord-center distance and angle between the wafer notch and the core are obtained through the wafer notch edge images, and whether the wafer notch is in the specified direction is verified to achieve wafer centering detection; when it is detected that the wafer is not centered, the visual positioning device 4 can adjust its placement position. The wafer is illuminated by the second light source 423, and the imaging unit 421 obtains the first chamfered edge and the second chamfered edge of the wafer to achieve verification of the wafer chamfered edge.

[0052] In some embodiments, as Figure 5 As shown, Figure 1 The structural schematic diagram of the shaft transporting device shown in the figure, the transport module 52 includes a first transport module 521 and a second transport module 522 arranged on the bracket 51, the first transport module 521 includes a first slider plate 5211 arranged on the bracket 51 and moving horizontally along the bracket 51, and a first sliding material-picking component 5212 arranged on the first slider plate 5211 and moving vertically along the first slider plate 5211; the second transport module 522 includes a second slider plate 5221 arranged on the bracket and moving horizontally along the bracket 51, and a second sliding material-picking component 5222 arranged on the second slider plate 5221 and moving vertically along the second slider plate 5221.

[0053] Specifically, in this embodiment, after the first transport module 521 absorbs the wafer on the visual positioning device 4, it moves along the bracket 51 to the polishing device 6, and the first transport module 521 places the absorbed wafer in the polishing device 6 for polishing. At this time, the second transport module 522 absorbs the wafer on the visual positioning device 4 and transports it to the waiting position to wait. After the polishing device 6 finishes polishing the wafer, the first transport module 521 absorbs the wafer in the polishing device 6 and transports it to the single-axis transport mechanism 53. The single-axis transport mechanism 53 transports the polished wafer to the cleaning device 7 for cleaning. The first transport module 521 The waiting position waits; at this time, the second transport module 522 places the sucked wafer in the polishing device 6 for polishing; the cleaning device 7 transfers the cleaned wafer to the single-axis transport mechanism 53, and the single-axis transport mechanism 53 transports the cleaned wafer to the designated position. Then the second transport module 522 absorbs the cleaned wafer and transports it to the visual positioning device 4 for centering and chamfer edge detection. Then the second transport module 522 absorbs the wafer to be polished from the visual positioning device 4 and transports it to the polishing device 6 for polishing. The first transport module 521 transports the polished wafer to the cleaning device 7 for cleaning. The axis transport device 5 provided in this embodiment realizes the uninterrupted action of transferring materials between the three processing positions, and simplifies the two sets of manipulator structures into one manipulator structure, making the equipment structure more compact and simple, and taking up less space.

[0054] In some embodiments, as Figure 5 As shown, the single-axis transport mechanism 53 includes: a balance guide rail 531 provided on the bracket 51, and a material transfer component 532 provided on the balance guide rail 531 and moving horizontally along the balance guide rail 531; the material transfer component 532 is used to transfer wafers between the first sliding material picking component 5212 and the cleaning device 7, and the second sliding material picking component 5222 and the cleaning device 7.

[0055] Specifically, in this embodiment, the wafers are transported between the transport module 52 and the cleaning device 7 along the balance guide rail 531 through the material transport component 532 .

[0056] In some implementations, such as Figure 6 As shown, Figure 1 The structural schematic diagram of the grinding device shown in the figure shows that the grinding device 6 includes: a first guardrail 61 provided on the machine 1, a first rotating suction cup 62 provided in the first guardrail 61, a grinding wheel 63, a flushing and blowing component 64, an outer cover 65 provided on the top of the first guardrail 61, and a switch component 66 provided on the first guardrail 61 for opening and closing the outer cover 65; the first rotating suction cup 62 moves in the horizontal direction; and the grinding wheel 63 moves in the vertical direction.

[0057] Specifically, in this embodiment, before grinding begins, the outer cover 65 is in an open state, and the transport module 52 places the wafer to be ground on the first rotating suction cup 62. After the first rotating suction cup 62 moves horizontally (in the y-axis direction) to the bottom of the grinding wheel 63, the grinding wheel 63 moves downward in the vertical direction (in the z-axis direction) to perform wafer chamfer grinding. After grinding to a specified shape, the grinding wheel 63 moves upward in the vertical direction (in the z-axis direction) for a certain distance, and the first rotating suction cup 62 moves horizontally (in the opposite direction of the y-axis) to the starting position. The first transport module 521 transports the polished wafer to the cleaning device 7. Preferably, in order to improve production efficiency, the grinding device 6 can be provided with at least 2 groups.

[0058] In some implementations, such as Figure 7 As shown, Figure 1 The structural schematic diagram of the cleaning device shown in the figure, the cleaning device 7 includes: a second guardrail 71 provided on the machine 1, a second rotary suction cup 72, an air blowing assembly 73 and a water blowing assembly 74 provided in the second guardrail in sequence, and a lifting and placing mechanism 75 provided on the second guardrail 71; the lifting and placing mechanism 75 includes a fixing part 751 provided on the second guardrail 71, and a lifting part 752 that moves vertically on the fixing part 751.

[0059] Specifically, in this embodiment, the lifting and placing mechanism 75 cooperates with the single-axis transport mechanism 53 to move the polished wafer on the single-axis transport mechanism 53 to the lifting and placing mechanism 75. The lifting and placing mechanism 75 moves downward to place the wafer on the second rotating suction cup 72. The second rotating suction cup 72 rotates at high speed. At the same time, the blowing assembly 73 and the water blowing assembly 74 blow water and air for cleaning. Preferably, in this embodiment, the blowing assembly 73 and the water blowing assembly 74 can be respectively provided with two groups, one group blows water and air on the front of the wafer, and the other group blows water and air on the back of the wafer. After cleaning is completed, the second rotating suction cup 72 stops rotating, and the lifting and placing mechanism 75 moves upward. The lifting and placing mechanism 75 cooperates with the single-axis transport mechanism 53 to move the cleaned wafer on the lifting and placing mechanism 75 to the single-axis transport mechanism 53.

[0060] In some implementations, such as Figure 1 As shown, the material box 2 includes a first material box 21 for storing unqualified wafers and a second material box 22 for storing qualified wafers.

[0061] Specifically, in the embodiment of the present invention, the unqualified wafers in the first material box 21 may include wafers whose thickness does not meet the requirements and whose chamfers do not meet the requirements after chamfering. The first material box 21 and the second material box 22 may be provided in multiple groups.

[0062] In the above embodiment of the present invention, in order to facilitate the handling and transfer of materials and the arrangement of mechanisms, the visual positioning device 4, the grinding device 6, and the cleaning device 7 can be arranged on the same axis.

[0063] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0064] The above embodiments merely represent preferred embodiments of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A fully automatic device for wafer chamfering, characterized in that: The equipment includes: a machine platform, and a material box, a handling device, a visual positioning device, a shaft handling device, a grinding device, and a cleaning device arranged on the machine platform; The transport device is used to transport the wafers between the material box and the visual positioning device, and includes a fixed frame provided on the machine platform and a material picking mechanism provided on the fixed frame; the material picking mechanism includes a sliding mechanism provided on the fixed frame, a first motor driving the sliding mechanism to move, a turntable mechanism provided on the sliding mechanism, and a telescopic suction mechanism provided on the turntable mechanism, wherein the turntable mechanism can drive the telescopic suction mechanism to rotate along a horizontal plane; The visual positioning device includes a carrying component provided on the machine platform, a positioning component provided on the carrying component, and a thickness detection mechanism; The shaft transport device includes a bracket provided on the machine platform, a transport module provided on the bracket, and a single-axis transport mechanism; the transport module is used to transport the wafer between the visual positioning device and the polishing device, and the single-axis transport mechanism is used to transport the wafer between the shaft transport device and the cleaning device; The polishing device is used to polish the wafer to be polished; The cleaning device is used for cleaning polished wafers.

2. The fully automatic wafer chamfering processing equipment according to claim 1, characterized in that: The telescopic suction mechanism comprises: A first guide rail provided on the turntable mechanism, a first conveyor belt connected to the rotating shaft of the first guide rail, a second motor driving the first conveyor belt to move, a first slider provided on the first guide rail and fixedly connected to the first conveyor belt, a second conveyor belt connected to the rotating shaft of the first slider, and a second slider provided on the first slider and fixedly connected to the second conveyor belt; while the first conveyor belt drives the first slider to move horizontally, the second conveyor belt drives the second slider to move horizontally.

3. The fully automatic wafer chamfering processing equipment according to claim 2, characterized in that: The material taking mechanism also includes: A limit block is provided on the sliding mechanism and is used to limit the rotation angle of the telescopic suction mechanism driven by the turntable mechanism along the horizontal plane.

4. The fully automatic wafer chamfering processing equipment according to claim 2, characterized in that: A vacuum suction port is provided at the material taking end of the second slider, and an air pipe port is provided on the second slider, and the suction port is communicated with the air pipe port.

5. The fully automatic wafer chamfering processing equipment according to claim 1, characterized in that: The positioning component includes: An imaging unit, a first light source, and a second light source are provided on the supporting component. The first light source and the second light source are located on both sides of the wafer. The first light source is used to cooperate with the imaging unit to obtain an image of the edge of the wafer, and the second light source is used to cooperate with the imaging unit to obtain an image of the chamfered edge of the wafer.

6. The fully automatic wafer chamfering processing equipment according to claim 1, characterized in that: The conveying module includes a first conveying module and a second conveying module provided on the bracket, the first conveying module includes a first slider plate provided on the bracket and moving horizontally along the bracket, and a first sliding material-picking component provided on the first slider plate and moving vertically along the first slider plate; the second conveying module includes a second slider plate provided on the bracket and moving horizontally along the bracket, and a second sliding material-picking component provided on the second slider plate and moving vertically along the second slider plate.

7. The fully automatic wafer chamfering processing equipment according to claim 6, characterized in that: The uniaxial transport mechanism comprises: A balance rail is provided on the bracket, and a material transfer component is provided on the balance rail and moves horizontally along the balance rail; the material transfer component is used to transfer wafers between the first sliding material picking component and the cleaning device, and between the second sliding material picking component and the cleaning device.

8. The fully automatic wafer chamfering processing equipment according to claim 6, characterized in that: The grinding device comprises: A first guardrail is provided on the machine platform, a first rotating suction cup is provided in the first guardrail, a grinding wheel, a flushing and air blowing component, an outer cover is provided on the top of the first guardrail, and a switch component is provided on the first guardrail for opening and closing the outer cover; the first rotating suction cup moves in the horizontal direction; and the grinding wheel moves in the vertical direction.

9. The fully automatic wafer chamfering processing equipment according to claim 7, characterized in that: The cleaning device comprises: A second guardrail is provided on the machine platform, a second rotating suction cup, an air blowing assembly, and a water blowing assembly are sequentially provided in the second guardrail, and a lifting and placing mechanism is provided on the second guardrail; the lifting and placing mechanism includes a fixing part provided on the second guardrail and a lifting part that moves vertically on the fixing part.

10. The fully automatic wafer chamfering processing equipment according to claim 1, characterized in that: The material box includes a first material box for storing unqualified wafers and a second material box for storing qualified wafers.

Images