An apparatus based on double-plating bath thermoelectrochemical oxidation

Abstract

The present invention provides a device based on dual-plating cell thermo-electrochemical oxidation, comprising two plating cells, each of which is a structure with an upper end open, and is filled with an electrolyte. A workpiece to be plated is placed in the electrolyte of each plating cell, and the two workpieces to be plated are connected by a wire, and the two plating cells are connected by a bidirectional high-frequency pulse power supply, so that the plating cells, the workpiece to be plated, the wire and the bidirectional high-frequency pulse power supply form a current circulation loop, and the surface of the base material is plated. The plating process is to perform cyclic plating in a dual-plating cell system using a bidirectional pulse power supply. Compared with the existing single-plating cell system, the device of the present invention enables the workpiece film layer to grow in an intermittent manner, and can obtain a thicker and denser film layer, thereby greatly improving the mechanical properties of the film layer.

Description

Technical Field

[0001] The present invention relates to the technical field of thermo-electrochemical oxidation, and in particular to a device based on thermo-electrochemical oxidation using a double plating pool. Background Art

[0002] Existing micro-arc oxidation processes use a single-bath system to continuously coat workpieces. When the film formation process reaches a certain stage, the film thickness stops increasing. Continued discharge damages the existing film and etches the existing layer, resulting in a film thickness limit of approximately 80μm. Ceramic films of this thickness are only suitable for general operating conditions. In high-temperature, high-pressure, and highly corrosive environments, such films are prone to cracking. Therefore, thicker and denser ceramic films are required to withstand more demanding operating conditions. Summary of the Invention

[0003] The purpose of the present invention is to provide a device based on dual-plating cell thermo-electrochemical oxidation to coat the surface of a base material. The coating process is to perform cyclic coating in a dual-plating cell system using a bidirectional pulse power supply, so that the workpiece film layer grows in an intermittent manner, and a thicker and denser film layer can be obtained, which greatly improves the mechanical properties of the film layer.

[0004] The applicant completed this application on this basis.

[0005] The purpose of the present invention is to provide a device based on dual-plating pool thermo-electrochemical oxidation, which is characterized in that it includes two plating pools 1, the plating pool 1 is a structure with an open upper end, the plating pool 1 is filled with an electrolyte 5, and a workpiece 3 to be plated is placed in the electrolyte 5 of each plating pool 1. The materials of the workpieces 3 to be plated are the same. The two workpieces 3 to be plated are connected by a wire 2, and the two plating pools 1 are connected to a bidirectional high-frequency pulse power supply 4 through an electric wire, so that the plating pool 1, the workpiece 3 to be plated, the wire 2 and the bidirectional high-frequency pulse power supply 4 form a current circulation loop.

[0006] Working principle: Two workpieces 3 to be coated are immersed in their respective electrolytes 5, and each plating pool 1 is used as a separate conductor. A bidirectional high-frequency pulse power supply 4 is used to make the workpieces 3 to be coated alternately become anodes and cathodes. When the workpieces 3 to be coated serve as anodes, thermo-electrochemical oxidation reactions are carried out. When the workpieces 3 to be coated serve as cathodes, the thermo-electrochemical oxidation reactions are stopped, so that the workpieces 3 to be coated can be intermittently and discontinuously coated.

[0007] Furthermore, the plating pool 1 is made of metal and is used as a conductor.

[0008] Furthermore, the plating pool 1 is made of stainless steel.

[0009] Furthermore, the material of the wire 2 is the same as or different from the material of the two workpieces 3 to be coated.

[0010] Furthermore, the material of the wire 2 is the same as that of the two workpieces 3 to be coated, thereby preventing the wire 2 from being corroded.

[0011] Furthermore, the wire 2 is suspended in the electrolyte 5 of the plating tank 1 , and the wire 2 and the workpiece 3 do not contact any part of the plating tank 1 to prevent a short circuit.

[0012] Furthermore, bolts are provided on the outer wall of the plating pool 1 , and two ends of the bidirectional high-frequency pulse power supply 4 are respectively connected to one of the bolts.

[0013] A method for preparing a wear-resistant coating, the specific steps are as follows:

[0014] This embodiment adopts a dual plating pool system in conjunction with a bidirectional high-frequency pulse power supply. Two workpieces 3 to be plated are immersed in the electrolyte 5 of the two plating pools. During the plating process, the workpieces 3 in the two plating pools alternately serve as anodes and cathodes. When the workpiece 3 being plated serves as an anode, a thermoelectrochemical oxidation reaction is carried out. When the workpiece 3 being plated serves as a cathode, the thermoelectrochemical oxidation reaction is stopped, so that the workpiece 3 being plated can be intermittently and discontinuously plated, thereby making the film layer grow thicker and denser.

[0015] Beneficial effects of the present invention: The present invention provides a device based on dual-plating cell thermo-electrochemical oxidation to coat the surface of a base material. The coating process is to perform cyclic coating in a dual-plating cell 1 system using a bidirectional pulse power supply. Compared with the existing single-plating cell system, the device of the present invention enables the workpiece film layer to grow in an intermittent manner, and a thicker and denser film layer can be obtained, which greatly improves the mechanical properties of the film layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Combined with the following Figure 1 When read together with the accompanying drawings, the above and other features of the present application will be more fully described. It should be understood that these drawings only depict several embodiments of the present application and should not be considered to limit the scope of the present application. The present application will be more clearly and detailed through the use of the accompanying drawings.

[0017] Figure 1 This is a structural diagram of the electrolyte circulation device of the double plating cell in Example 1 of the present application.

[0018] Description of main component symbols

[0019]

[0020]

[0021] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0022] Example 1:

[0023] A device based on dual-plating-pool thermo-electrochemical oxidation comprises two plating pools 1. The plating pools 1 are made of metal and serve as conductors. The plating pools 1 are of an open structure at the top. The plating pools 1 are filled with an electrolyte 5. A workpiece 3 to be plated is placed in the electrolyte 5 of each plating pool 1. The two workpieces 3 to be plated are connected by a wire 2. The material of the wire 2 may be the same as or different from that of the two workpieces 3 to be plated. The wire 2 is suspended in the electrolyte 5 of the plating pool 1 and does not contact any part of the plating pool 1 to prevent a short circuit. Bolts are provided on the outer wall of the plating pool 1. The two ends of a bidirectional high-frequency pulse power supply 4 are respectively connected to one of the bolts via an electric wire, so that the plating pool 1, the workpiece 3 to be plated, the wire 2 and the bidirectional high-frequency pulse power supply 4 form a complete circuit.

[0024] Example 2

[0025] A method for preparing a wear-resistant coating, the specific steps are as follows:

[0026] This embodiment adopts a dual plating pool system in conjunction with a bidirectional high-frequency pulse power supply. Two workpieces 3 to be plated are immersed in the electrolyte 5 of the two plating pools. During the plating process, the workpieces 3 in the two plating pools alternately serve as anodes and cathodes. When the workpiece 3 being plated serves as an anode, a thermoelectrochemical oxidation reaction is carried out. When the workpiece 3 being plated serves as a cathode, the thermoelectrochemical oxidation reaction is stopped, so that the workpiece 3 being plated can be intermittently and discontinuously plated, thereby making the film layer grow thicker and denser.

[0027] The reason is that micro-arc oxidation / thermoelectrochemical oxidation relies on instantaneous electric arcs to work. The arc discharge is accompanied by the ejection of energy and matter, which causes a melting effect at the ejection point. The melt then cools and solidifies. The existing micro-arc oxidation uses a single plating pool system for uninterrupted coating. When the film formation process reaches a certain stage, the melting and cooling and solidification processes are no longer coordinated, and the film thickness no longer increases. If the discharge continues, the arc will destroy the original film layer and etch the already formed film layer. This is why the film thickness limit of micro-arc oxidation is generally 80μm. The present invention uses a dual plating pool system with a bidirectional high-frequency pulse power supply, and intermittent discontinuous coating, which makes the melting and cooling and solidification processes more coordinated, thereby making the film layer grow thicker and denser.

[0028] In this embodiment, two 2024 alloy substrates were immersed in the electrolyte of two plating baths respectively, and the coating was performed under the following conditions:

[0029] (1) The temperature of the electrolyte was controlled at 20°C. The two plating cells were connected to a bidirectional pulse power supply with a pulse frequency of 400 Hz, a constant current mode, a floating voltage, and a current density of 10 A / dm2. Two 2024 alloy substrates alternately became anodes and cathodes in the coating workpiece. The application time was 40 minutes, and the film thickness was measured to be 260 μm.

[0030] (2) The temperature of the electrolyte was controlled at 25°C, and the two plating cells were connected to a bidirectional pulse power supply with a pulse frequency of 500 Hz, a constant current mode, a floating voltage, and a current density of 15 A / dm2. The two 2024 alloy substrates alternately became the anode and cathode in the coating workpiece. The application time was 60 minutes, and the film thickness was measured to be 270 μm.

[0031] (3) The temperature of the electrolyte was controlled at 30°C, and the two plating cells were connected to a bidirectional pulse power supply with a pulse frequency of 900 Hz, a constant current mode, a floating voltage, and a current density of 20 A / dm2. The two 2024 alloy substrates alternately became the anode and cathode in the coating workpiece. The application time was 80 minutes, and the film thickness was measured to be 280 μm.

[0032] It can be seen that under different film-forming conditions, the dual-plating cell system is used in conjunction with a bidirectional high-frequency pulse power supply, and the film thickness is much higher than the existing micro-arc oxidation film-forming limit of 80μm.

[0033] Although this application has disclosed various aspects and embodiments, other aspects and embodiments will be readily apparent to those skilled in the art. Variations and modifications may be made without departing from the spirit of this application, and all such variations and modifications are within the scope of this application. The various aspects and embodiments disclosed in this application are provided for illustrative purposes only and are not intended to limit this application. The actual scope of this application is determined by the claims.

Claims

1. A device based on dual-cell thermo-electrochemical oxidation, characterized in that: The invention comprises two plating pools (1), wherein the plating pools (1) are of an open structure at the top, and an electrolyte (5) is contained in the plating pools (1). A workpiece (3) to be plated is placed in the electrolyte (5) of each plating pool (1), and the workpieces (3) to be plated are made of the same material. The two workpieces (3) to be plated are connected by a wire (2). The two plating pools (1) are connected to a bidirectional high-frequency pulse power supply (4) by a wire. When the frequency of the bidirectional high-frequency pulse power supply (4) is 400 Hz and the current density is 10 A / dm², the plating pools (1), the workpieces (3) to be plated, the wire (2) and the bidirectional high-frequency pulse power supply (4) form a complete circuit. The device controls the two workpieces (3) to be plated to alternately serve as anodes and cathodes through the bidirectional high-frequency pulse power supply (4) to achieve intermittent plating. The device forms a ceramic film layer with a thickness of 260 μm on the surface of the workpiece through intermittent plating. When the frequency of the bidirectional high-frequency pulse power supply (4) is 500 Hz and the current density is 15 A / dm², the device controls the two workpieces (3) to be plated to alternately serve as anodes and cathodes through the bidirectional high-frequency pulse power supply (4). m², so that the plating pool (1), the workpiece (3) to be plated, the wire (2) and the bidirectional high-frequency pulse power supply (4) form a complete circuit, the device controls the two workpieces (3) to be plated to alternately serve as anodes and cathodes through the bidirectional high-frequency pulse power supply (4), and intermittent plating is achieved, and the device forms a ceramic film layer with a thickness of 270 μm on the surface of the workpiece through intermittent plating; when the frequency of the bidirectional high-frequency pulse power supply (4) is 900 Hz and the current density is 20 A / dm², the plating pool (1), the workpiece (3) to be plated, the wire (2) and the bidirectional high-frequency pulse power supply (4) form a complete circuit, the device controls the two workpieces (3) to be plated to alternately serve as anodes and cathodes through the bidirectional high-frequency pulse power supply (4), and intermittent plating is achieved, and the device forms a ceramic film layer with a thickness of 280 μm on the surface of the workpiece through intermittent plating, and the wire (2) is suspended in the electrolyte (5) of the plating pool (1) and does not contact any part of the plating pool (1).

2. The device based on dual-plating cell thermo-electrochemical oxidation according to claim 1, characterized in that: The plating pool (1) is made of metal and is used as a conductor.

3. The device based on dual-plating cell thermo-electrochemical oxidation according to claim 1, characterized in that: The material of the plating pool (1) is stainless steel.

4. The device based on dual-plating cell thermo-electrochemical oxidation according to claim 1, characterized in that: The material of the wire (2) is the same as the material of the two workpieces (3) to be coated.

5. The device based on dual-plating cell thermo-electrochemical oxidation according to claim 1, characterized in that: The material of the wire (2) is the same as the material of the two workpieces (3) to be coated, thereby preventing the wire (2) from being corroded.

6. The device based on dual-plating cell thermo-electrochemical oxidation according to claim 1, characterized in that: The outer wall of the plating pool (1) is provided with connection terminals, and the two poles of the bidirectional high-frequency pulse power supply (4) are respectively connected to the two connection terminals.

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