Methods and apparatus for testing electronic card malfunctions, electronic equipment

Abstract

This application relates to the field of electronic card fault testing technology, and discloses a method for testing electronic card faults, including: performing an open / short circuit test on the electronic card to detect a disconnection fault; if no disconnection fault is found, performing a voltage test on the electronic card to detect a split fault; and if a split fault is found, performing a light test on the electronic card to verify the split fault. By sequentially detecting electronic card faults through open / short circuit testing, voltage testing, and light testing, manual fault observation and judgment by testing personnel is eliminated, reducing the occurrence of misjudgments and improving the accuracy of electronic card fault detection. This application also discloses an apparatus and electronic device for testing electronic card faults.

Description

Technical Field

[0001] This application relates to the field of electronic card fault testing technology, such as a method and apparatus for testing electronic card faults, and an electronic device. Background Technology

[0002] Electronic cards, also known as IC cards (Integrated Circuit Cards), smart cards, intelligent cards, microcircuit cards, or microchip cards, are cards in which a microelectronic chip is embedded in a card base conforming to the ISO 7816 standard. Electronic cards are widely used in industries such as finance, transportation, healthcare, and identity verification, combining microelectronics and computer technology to modernize people's work and lives. After a failed test, electronic cards (such as financial electronic cards) require fault analysis to accurately pinpoint the failure location. Traditional fault analysis of failed electronic cards requires testers to use instruments such as X-ray machines and ultrasonic scanners to inspect and confirm the internal structure of the card, thereby identifying the specific fault.

[0003] In the process of implementing the embodiments of this disclosure, at least the following problems were found in the related art:

[0004] Traditional fault analysis of failed electronic cards requires manual observation and confirmation by test personnel. Inexperienced test engineers are prone to misjudgments.

[0005] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0006] To provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This summary is not intended as a general commentary, nor is it intended to identify key / important components or describe the scope of protection of these embodiments, but rather as a prelude to the detailed description that follows.

[0007] This disclosure provides a method, apparatus, and electronic device for testing electronic card faults, thereby improving the accuracy of electronic card fault detection.

[0008] In some embodiments, a method for testing electronic card faults includes: performing an open / short circuit test on the electronic card to detect a disconnection fault; performing a voltage test on the electronic card to detect a split fault if no disconnection fault exists; and performing a light test on the electronic card to verify the split fault if a split fault exists.

[0009] In some embodiments, the apparatus for testing electronic card faults includes a processor and a memory storing program instructions, the processor being configured to execute the aforementioned method for testing electronic card faults when executing the program instructions.

[0010] In some embodiments, the electronic device includes: an electronic device body; and the aforementioned means for testing electronic card malfunctions, which is mounted on the electronic device body.

[0011] The method, apparatus, and electronic device for testing electronic card faults provided in this disclosure can achieve the following technical effects:

[0012] This disclosed technical solution improves the method for detecting electronic card faults. First, an open-short circuit test is performed on the electronic card to detect open circuit faults. Then, if no open circuit fault is found, a voltage test is performed to detect splitting faults. Finally, if a splitting fault is found, a light test is performed to verify the splitting fault. In this way, by sequentially detecting electronic card faults through open-short circuit testing, voltage testing, and light testing, manual fault observation and analysis by testing personnel is eliminated, reducing the occurrence of misdiagnosis and improving the accuracy of electronic card fault detection.

[0013] The above general description and the description below are exemplary and illustrative only and are not intended to limit this application. Attached Figure Description

[0014] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations and drawings do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are shown as similar elements. The drawings are not to be scaled. And wherein:

[0015] Figure 1 This is a flowchart illustrating a method for testing electronic card malfunctions provided in an embodiment of this disclosure;

[0016] Figure 2 This is a flowchart illustrating another method for testing electronic card faults provided in this disclosure embodiment;

[0017] Figure 3 This is a flowchart illustrating another method for testing electronic card faults provided in this disclosure embodiment;

[0018] Figure 4 This is a flowchart illustrating another method for testing electronic card faults provided in this disclosure embodiment;

[0019] Figure 5This is a flowchart illustrating another method for testing electronic card faults provided in this disclosure embodiment;

[0020] Figure 6 This is a flowchart illustrating another method for testing electronic card faults provided in this disclosure embodiment;

[0021] Figure 7 This is a schematic diagram of the structure of a test circuit for an electronic card provided in an embodiment of this disclosure;

[0022] Figure 8 This is a schematic diagram of a device for testing electronic card faults provided in an embodiment of this disclosure;

[0023] Figure 9 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this disclosure;

[0024] Figure 10a , Figure 10b , Figure 10c This is a graph showing the test results of the voltage test provided in an embodiment of this disclosure. Detailed Implementation

[0025] To provide a more detailed understanding of the features and technical content of the embodiments of this disclosure, the implementation of the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. The accompanying drawings are for illustrative purposes only and are not intended to limit the embodiments of this disclosure. In the following technical description, for ease of explanation, several details are used to provide a full understanding of the disclosed embodiments. However, one or more embodiments may still be implemented without these details. In other cases, well-known structures and devices may be simplified in their depiction to simplify the drawings.

[0026] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this disclosure described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0027] Unless otherwise stated, the term "multiple" means two or more. In embodiments of this disclosure, the character " / " indicates that the preceding and following objects are in an "OR" relationship. For example, A / B means: A or B. The term "and / or" describes an association relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B. The term "correspondence" can refer to an association or binding relationship; A corresponding to B means that there is an association or binding relationship between A and B.

[0028] Electronic card products (such as financial cards) must meet specified mechanical reliability requirements. After card manufacturing, a three-wheeled testing device is used to conduct mechanical stress tests on the electronic card products, requiring zero failures under a certain pressure. For samples that fail, failure analysis must be performed to identify the type of failure. After identifying the type of failure in the electronic card, reinforcement is carried out through design, process, and material adjustments to meet the standard stress requirements.

[0029] Electronic card failures can be categorized into two types: wire breakage and splitting. Splitting failures include chipping or delamination. Wire breakage refers to a broken gold wire inside the electronic card, including broken solder joints, solder joint peeling, or a break in the middle of the gold wire. Chipping refers to a thin, serrated, or needle-like split in the electronic card. Delamination refers to the separation of two or more layers in the electronic card.

[0030] Combination Figure 1 As shown, this disclosure provides a method for testing electronic card malfunctions, including the following steps:

[0031] S101 performs an open / short circuit test on the electronic card to detect any disconnection faults in the electronic card.

[0032] Combination Figure 7 As shown, the test circuit containing the electronic card includes: a first test branch, comprising a power supply, a first diode, and the electronic card connected in series; a second test branch, comprising the electronic card and a second diode connected in series; a third test branch, comprising a power supply, a main circuit, and the electronic card connected in series; and a fourth test branch, comprising the electronic card and the main circuit connected in series.

[0033] Here, the main circuit (power circuit) is the circuit in the test circuit where the electronic card is located that undertakes the tasks of power exchange or control. The specific structure of the main circuit may include basic circuit elements such as interconnected contactors, resistors, and capacitors, or it may include a non-isolated Buck-Boost converter topology with synchronous rectification, as long as it can realize the main function of the main circuit, there are no restrictions here. In practical applications, the test circuit where the electronic card is located also includes a power clamping circuit, which is connected in parallel with the main circuit, and is used to convert the power input voltage into an output voltage whose peak value is clamped at a predetermined level without changing the signal.

[0034] Optionally, an open / short circuit test is performed on the electronic card to detect a disconnection fault, including: determining that the electronic card has a disconnection fault when the first test branch, the second test branch, the third test branch, and the fourth test branch are all open.

[0035] The test path for the first test branch SIO-VCC is: SIO→B→first diode→A→VCC;

[0036] The test path for the second test branch GND-SIO is: GND→C→protected diode→B→SIO;

[0037] The test path for the third test branch VCC-SIO is: VCC→A→E→Main circuit→B→SIO;

[0038] The test path for the fourth test branch SIO-GND is: SIO→B→Main circuit→D→C→GND.

[0039] Therefore, it can be seen that the common path of the first test branch, the second test branch, the third test branch, and the fourth test branch is SIO-B. Thus, using the first, second, third, and fourth test branches together to determine the disconnection fault of the electronic card can improve the accuracy of electronic card fault diagnosis.

[0040] S102, In the absence of a broken wire fault in the electronic card, a voltage test is performed on the electronic card to detect the split fault of the electronic card.

[0041] When an electronic card has a split fault, the integrated circuit inside the electronic card is connected, but the voltage is unstable. Therefore, voltage testing is used to detect the split fault of the electronic card.

[0042] S103, In the event of a split fault in the electronic card, a light test is performed on the electronic card to verify the split fault.

[0043] When an electronic card has a splitting fault, the reflection angle will change when light shines on an uneven metal layer. Therefore, a light test can be used to check for splitting faults in electronic cards.

[0044] The method for testing electronic card faults provided in this disclosure improves the detection method for electronic card faults. First, an open / short circuit test is performed on the electronic card to detect open circuit faults. Then, if no open circuit fault is found, a voltage test is performed to detect splitting faults. Finally, if a splitting fault is found, a light test is performed to verify the splitting fault. In this way, by sequentially detecting electronic card faults through open / short circuit testing, voltage testing, and light testing, manual fault observation and judgment by testing personnel are eliminated, reducing the occurrence of misjudgments and improving the accuracy of electronic card fault detection.

[0045] Combination Figure 2 As shown, this disclosure provides a method for testing electronic card faults, which includes the following steps: performing a voltage test on the electronic card to detect card splitting faults.

[0046] S201, obtain the actual voltage fluctuation difference of the output voltage of the test branch where the electronic card is located.

[0047] In practical applications, the output voltage of the test branch is gradually increased to obtain the actual voltage fluctuation difference of the output voltage of the test branch where the electronic card is located (e.g., the output voltage between VCC and GND) within a preset time period.

[0048] The actual voltage fluctuation difference can be calculated using the following formula:

[0049] ΔV=V n -V n-1

[0050] Where ΔV is the actual voltage fluctuation difference, V n For the output voltage of the test branch detected this time, V n-1 The output voltage of the test branch was detected last time, and n is the number of tests.

[0051] S202, determine the number of target voltage fluctuation differences within a preset time period; wherein, the target voltage fluctuation difference is the voltage fluctuation difference that is greater than or equal to the preset voltage difference among the actual voltage fluctuation differences.

[0052] Here, the preset voltage difference range is [60mV, 120mV], for example, 60mV, 70mV, 80mV, 90mV, 100mV, 110mV, 120mV. After obtaining the actual voltage fluctuation difference of the output voltage of the test branch where the electronic card is located, the target voltage fluctuation difference is determined within the actual voltage fluctuation difference, that is, the voltage fluctuation difference that is greater than or equal to the preset voltage difference, and the number of target voltage fluctuation differences is calculated.

[0053] S203, if the number of target voltage fluctuation differences is greater than or equal to the quantity threshold, it is determined that the electronic card has a crack fault.

[0054] In practical applications, the quantity threshold is positively correlated with the number of detections n; that is, the larger the number of detections n, the larger the quantity threshold; and the smaller the number of detections n, the smaller the quantity threshold.

[0055] When an electronic card has a cracked chip fault, it is prone to severe leakage or short circuit, causing large voltage fluctuations. By detecting the number of voltage fluctuation differences greater than or equal to a preset voltage difference value, a cracked chip fault is determined when the number of target voltage fluctuation differences exceeds or equals a threshold. This allows for efficient and rapid identification of cracked chip faults in electronic cards, improving the accuracy of fault diagnosis.

[0056] Combination Figure 3 As shown, this disclosure provides a method for testing electronic card faults, which includes the following steps: performing a voltage test on the electronic card to detect card splitting faults.

[0057] S301, obtain the actual voltage fluctuation difference of the output voltage of the test branch where the electronic card is located.

[0058] S302, determine the number of target voltage fluctuation differences within a preset time period; wherein, the target voltage fluctuation difference is the voltage fluctuation difference that is greater than or equal to the preset voltage difference among the actual voltage fluctuation differences.

[0059] S303 obtains the low voltage value of the output voltage of the test branch where the electronic card is located when the number of target voltage fluctuation differences is less than the number threshold.

[0060] The low voltage value of the output voltage of the test branch where the electronic card is located, that is, the output voltage value of the test branch where the electronic card is located that is less than the preset voltage value (e.g., 1V).

[0061] S304 indicates that a layering fault has been identified in the electronic card under abnormal low voltage conditions.

[0062] Optionally, the low voltage value anomaly can be determined as follows: obtain the trend of low voltage value changes; if the trend of low voltage value changes is fluctuating up and down, the low voltage value anomaly is determined.

[0063] Optionally, the low voltage value is determined to be abnormal as follows: obtain the actual voltage ratio of the low voltage value to the preset voltage value; if the actual voltage ratio is greater than the preset voltage ratio, the low voltage value is determined to be abnormal.

[0064] When an electronic card exhibits a layering fault, the resistance in the card's circuitry fluctuates, causing the low voltage value to also fluctuate. Therefore, by analyzing the trend of the low voltage value and the voltage ratio, we can determine if there is an abnormality in the low voltage, and then inversely deduce whether the electronic card has a layering fault. Furthermore, because the low voltage value is relatively small, comparing the low voltage value with a preset voltage value provides a clearer understanding of the low voltage value's trend, thereby improving the accuracy of diagnosing electronic card layering faults.

[0065] When an electronic card exhibits a layering fault, low voltage is highly likely to occur. The system detects the number of voltage fluctuations greater than or equal to a preset voltage difference. When the number of target voltage fluctuations falls below a threshold, the presence of a layering fault is determined based on the low voltage value of the output voltage of the test branch containing the electronic card. This method enables efficient and rapid determination of layering faults in electronic cards, improving the accuracy of fault diagnosis.

[0066] Combination Figure 4 As shown, this disclosure provides a method for testing electronic card faults, which includes the following steps: performing a voltage test on the electronic card to detect card splitting faults.

[0067] S401, obtain the actual voltage fluctuation difference of the output voltage of the test branch where the electronic card is located.

[0068] S402, determine the number of target voltage fluctuation differences within a preset time period; wherein, the target voltage fluctuation difference is the voltage fluctuation difference that is greater than or equal to the preset voltage difference among the actual voltage fluctuation differences.

[0069] S403, if the number of target voltage fluctuation differences is greater than or equal to the quantity threshold, it is determined that the electronic card has a crack fault.

[0070] S404: When the number of target voltage fluctuation differences is less than the number threshold, obtain the low voltage value of the output voltage of the test branch where the electronic card is located.

[0071] S405 indicates that the electronic card has a layering fault due to an abnormally low voltage value.

[0072] Referring to Figure 10, Figure 10a The image shows the voltage test results when the electronic card has a cracked chip fault. The electronic card experienced severe leakage, resulting in large voltage fluctuations. Figure 10b This is a voltage test result diagram when an electronic card experiences a layering fault, showing a low voltage anomaly. Figure 10c The voltage test results are shown for an electronic card that did not exhibit obvious chipping or delamination faults.

[0073] In this embodiment, the number of voltage fluctuation differences (target voltage fluctuation differences) greater than or equal to a preset voltage difference value is detected. When the number of target voltage fluctuation differences is greater than or equal to a threshold value, a chip fault is determined in the electronic card; when the number of target voltage fluctuation differences is less than the threshold value and the low voltage value is abnormal, a layer fault is determined in the electronic card. This allows for efficient and rapid determination of chip faults (chip faults / layer faults) in electronic cards, improving the accuracy of fault diagnosis. Simultaneously, the testing process eliminates the need for manual fault observation and analysis by testing personnel, reducing the occurrence of misjudgments and lowering the cost of electronic card fault detection.

[0074] Combination Figure 5 As shown, this disclosure provides a method for testing electronic card faults, which includes the following steps: performing a light test on the electronic card to check for splitting faults.

[0075] S501, in the event that the electronic card has a layering fault, controls the incident light to illuminate the electronic card.

[0076] In actual operation, the incident light is controlled to illuminate the electronic card perpendicularly. The reflected light of the incident light is more obvious in the preset area, making the subsequent brightness detection more obvious.

[0077] S502, obtain the actual luminance of the reflected light of the incident light in the preset reflection area.

[0078] In practical applications, light intensity can be detected using a brightness sensor.

[0079] S503: When the actual light intensity is greater than the preset light intensity, the electronic card is found to have a layering fault.

[0080] The preset brightness can be the brightness value collected during a light test of a normal, unlayered electronic card. Electronic cards (such as metal product chips) typically have 5 or 7 metal layers. During the chip fabrication process, the horizontal alignment between these metal layers is maintained. When a layering anomaly occurs in the electronic card chip, this horizontal relationship between the metal layers is altered. When light shines on an uneven metal layer, the reflection angle changes, resulting in a significant difference in reflected brightness between the layered and normal areas.

[0081] When an electronic card exhibits a delamination fault, if delamination is suspected in the area, the brightness of the preset reflection area will be greater than the preset brightness, significantly higher than the normal area. Further verification of the electronic card's delamination fault through light testing improves the accuracy of fault diagnosis. Simultaneously, it eliminates the need for traditional, costly, and resource-constrained methods like scanning electron microscopes and focused ion beams used in electronic card delamination detection, greatly reducing testing costs.

[0082] Combination Figure 6 As shown, this disclosure provides a method for testing electronic card malfunctions, including the following steps:

[0083] S601 performs an open / short circuit test on the electronic card to detect disconnection faults in the electronic card.

[0084] S602, when there is no open circuit fault in the electronic card, performs a voltage test on the electronic card to detect the split fault of the electronic card.

[0085] S603, in the event of a split fault in the electronic card, performs a light test on the electronic card to verify the split fault.

[0086] S604, in the case of verifying that the electronic card has a layering fault, divide the electronic card into regions to obtain multiple suspected layering regions.

[0087] Optionally, the electronic card is divided into regions, including: determining the shape and area ratio of each suspected layered region; and dividing the electronic card into regions according to the shape and area ratio.

[0088] The shape is defined as the shape in which the reflected light from the incident light shows a significant change in brightness within a pre-defined reflection area after illumination, such as a triangle or a circle. The area ratio is positively correlated with the failure rate of the suspected layered area; the higher the failure rate of the suspected layered area in previous tests, the larger the area ratio. Dividing the electronic card into regions by shape and area ratio helps to more accurately locate the layered positions of the electronic card.

[0089] S605 performs a light test on each suspected layered area to determine the layered location of the electronic card.

[0090] Light tests were conducted on each suspected layered area. If the actual brightness of the suspected layered area was greater than the preset brightness, the suspected layered area was determined to be the layered location of the electronic card.

[0091] In this embodiment, an improved method for detecting electronic card faults is implemented. First, an open-circuit and short-circuit test is performed on the electronic card to detect open circuit faults. Then, if no open circuit fault is found, a voltage test is performed to detect splitting faults. If splitting faults are present, a light test is performed to verify the splitting faults. Finally, light tests are conducted on multiple suspected splitting areas of the electronic card to further determine the splitting locations. This eliminates the need for manual fault observation and judgment by testing personnel, reducing the occurrence of misjudgments and enabling precise location of faulty areas, thus improving the efficiency and accuracy of electronic card fault detection.

[0092] Combination Figure 8 The present disclosure provides an apparatus 800 for testing electronic card faults, including a processor 80 and a memory 81, and may further include a communication interface 82 and a bus 83. The processor 80, communication interface 82, and memory 81 can communicate with each other via the bus 83. The communication interface 82 can be used for information transmission. The processor 80 can call logical instructions in the memory 81 to execute the method for testing electronic card faults described in the above embodiment.

[0093] Furthermore, the logic instructions in the aforementioned memory 81 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium.

[0094] The memory 81, as a computer-readable storage medium, can be used to store software programs and computer-executable programs, such as program instructions / modules corresponding to the methods in the embodiments of this disclosure. The processor 80 executes the program instructions / modules stored in the memory 81 to perform functional applications and data processing, thereby implementing the method for testing electronic card faults in the above-described method embodiments.

[0095] The memory 81 may include a program storage area and a data storage area. The program storage area may store the operating system and application programs required for at least one function; the data storage area may store data created based on the use of the terminal device. Furthermore, the memory 81 may include high-speed random access memory and may also include non-volatile memory.

[0096] The apparatus for testing electronic card faults provided in this disclosure improves the method for detecting electronic card faults. First, an open / short circuit test is performed on the electronic card to detect open circuit faults. Then, if no open circuit fault is found, a voltage test is performed to detect splitting faults. Finally, if a splitting fault is found, a light test is performed to verify the splitting fault. In this way, electronic card faults are detected sequentially through open / short circuit testing, voltage testing, and light testing, eliminating the need for manual fault observation and judgment by testing personnel, reducing the occurrence of misjudgments, and improving the accuracy of electronic card fault detection.

[0097] Combination Figure 9 As shown, this disclosure provides an electronic device (e.g., a computer, a server, etc.) including an electronic device body 90; and the aforementioned device 800 for testing electronic card faults, which is installed on the electronic device body 90.

[0098] This disclosure provides a computer-readable storage medium storing computer-executable instructions configured to perform the above-described method for testing electronic card malfunctions.

[0099] This disclosure provides a computer program product, which includes a computer program stored on a computer-readable storage medium. The computer program includes program instructions that, when executed by a computer, cause the computer to perform the above-described method for testing electronic card malfunctions.

[0100] The aforementioned computer-readable storage medium may be a transient computer-readable storage medium or a non-transitory computer-readable storage medium.

[0101] The technical solutions of this disclosure can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes one or more instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the method described in this disclosure. The aforementioned storage medium can be a non-transitory storage medium, including: a USB flash drive, a portable hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, and other media capable of storing program code; it can also be a transient storage medium.

[0102] The foregoing description and accompanying drawings fully illustrate embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, procedural, and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the order of operation may vary. Parts and features of some embodiments may be included or substituted for parts and features of other embodiments. The scope of the embodiments of this disclosure includes the entire scope of the claims and all available equivalents of the claims. While the terms “first,” “second,” etc., may be used in this application to describe elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, a first element may be called a second element without changing the meaning of the description, and similarly, a second element may be called a first element, provided that all occurrences of “first element” are consistently renamed and all occurrences of “second element” are consistently renamed. First and second elements are both elements, but may not be the same element. Moreover, the terminology used in this application is only for describing embodiments and is not intended to limit the claims. As used in the description of the embodiments and claims, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to also include the plural forms. Similarly, the term “and / or” as used herein means including one or more of the associated listed elements and all possible combinations thereof. Additionally, when used herein, the terms “comprise” and its variations “comprises” and / or “comprising” refer to the presence of stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. Without further limitations, an element defined by the phrase “comprising an…” does not exclude the presence of additional identical elements in the process, method, or apparatus that includes said element. In this document, each embodiment may focus on the differences from other embodiments, and similar or identical parts between embodiments can be referred to mutually. For methods, products, etc., disclosed in the embodiments, if they correspond to the method section disclosed in the embodiments, the relevant parts can be referred to the description of the method section.

[0103] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the embodiments of this disclosure. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0104] The methods and products (including but not limited to devices and equipment) disclosed in the embodiments herein can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of units may be merely a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the shown or discussed units may be through some interfaces, and the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the units may be selected to implement this embodiment according to actual needs. Furthermore, the functional units in the embodiments of this disclosure may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0105] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to embodiments of this disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions marked in the blocks may occur in a different order than that shown in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. In the descriptions corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different blocks may also occur in a different order than disclosed in the description, and sometimes there is no specific order between different operations or steps. For example, two consecutive operations or steps may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. Each block in a block diagram and / or flowchart, and combinations of blocks in a block diagram and / or flowchart, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

Claims

1. A method for testing electronic card failures, characterized by, The method comprises: performing an open-short test on the electronic card to detect a disconnection fault of the electronic card; in the absence of the disconnection fault of the electronic card, performing a voltage test on the electronic card to detect a split fault of the electronic card; in the presence of the split fault of the electronic card, performing a light test on the electronic card to verify the split fault of the electronic card; wherein the split fault comprises a chipping fault or a delamination fault; the voltage test on the electronic card to detect the split fault of the electronic card comprises: obtaining actual voltage fluctuation difference values of an output voltage of a test branch in which the electronic card is located; determining a number of target voltage fluctuation difference values within a preset time length; wherein the target voltage fluctuation difference value is a voltage fluctuation difference value greater than or equal to a preset voltage difference value among the actual voltage fluctuation difference values; in the case that the number of target voltage fluctuation difference values is greater than or equal to a number threshold, it is determined that the electronic card has a chipping fault; or, in the case that the number of target voltage fluctuation difference values is less than the number threshold, obtaining a low voltage value of the output voltage of the test branch in which the electronic card is located; in the case that the low voltage value is abnormal, it is determined that the electronic card has a delamination fault.

2. The method of claim 1, wherein, The test circuit in which the electronic card is located comprises: a first test branch comprising a power supply, a first diode and the electronic card connected in series; a second test branch comprising the electronic card and a second diode connected in series; a third test branch comprising the power supply, a main circuit and the electronic card connected in series; a fourth test branch comprising the electronic card and the main circuit connected in series; The open-short test on the electronic card to detect the disconnection fault of the electronic card comprises: in the case that the first test branch, the second test branch, the third test branch and the fourth test branch are all open, it is determined that the electronic card has a disconnection fault.

3. The method of claim 1, wherein, The low voltage value is determined to be abnormal in the following ways: obtaining a change trend of the low voltage value; in the case that the change trend of the low voltage value is up and down fluctuation, the low voltage value is determined to be abnormal; or, obtaining an actual voltage ratio of the low voltage value to a preset voltage value; in the case that the actual voltage ratio is greater than a preset voltage ratio, the low voltage value is determined to be abnormal.

4. The method of claim 1, wherein, The split fault comprises a delamination fault; the light test on the electronic card to verify the split fault of the electronic card comprises: in the case that the electronic card has a delamination fault, controlling incident light to irradiate the electronic card; obtaining actual light brightness of reflected light of the incident light in a preset reflection area; in the case that the actual light brightness is greater than a preset light brightness, it is verified that the electronic card has a delamination fault.

5. The method according to any one of claims 1 to 4, characterized in that, The method further comprises: in the case that the electronic card has a delamination fault, dividing the electronic card into regions to obtain a plurality of suspected delamination regions; performing a light test on each suspected delamination region to determine a delamination position of the electronic card.

6. The method of claim 5, wherein, The division of the electronic card into regions comprises: determining a division shape and an area ratio of each suspected delamination region; The electronic card is regionally divided according to the division shape and the area proportion.

7. An apparatus for testing electronic card failure, comprising a processor and a memory having stored program instructions, characterized in that, The processor is configured to execute the program instructions to perform the method for testing the electronic card failure according to any one of claims 1 to 6.

8. An electronic device, comprising: Comprise: An electronic device body; And, The apparatus for testing the electronic card failure according to claim 7 is installed in the electronic device body.

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