Integrated circuit test method
By employing conventional electrical testing, AOI inspection, and FT2 testing methods for integrated circuit testing, the problem of undetected packaging cracks in integrated circuit production has been solved, thereby improving product quality reliability and the quality control capabilities of manufacturing enterprises.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-19
- Publication Date
- 2026-03-10
AI Technical Summary
In current integrated circuit manufacturing, some products are not functionally tested before shipment, which leads to undetected packaging cracks, affecting product quality and reliability. Furthermore, defective products flow into downstream processes, increasing customer usage risks and making quality control more difficult for enterprises.
Integrated circuit testing methods, including conventional electrical testing, AOI inspection, and FT2 testing, are used to screen out abnormal cells with package cracks. Multi-level screening is conducted through temperature testing, AOI inspection, and FT2 testing machines to ensure product quality.
This effectively identifies defective units with cracked packaging, improves product quality, reduces the inflow of defective products to customers, and enhances the quality control capabilities of manufacturing enterprises.
Smart Images
Figure CN121633783A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of semiconductor technology, specifically referring to an integrated circuit testing method. Background Technology
[0002] In today's rapidly developing integrated circuit industry, product quality and reliability directly impact the stable operation and market reputation of downstream electronic devices. The testing phase, as a crucial link in the integrated circuit manufacturing process, serves as a core safeguard for product quality. As integrated circuit products continue to evolve towards higher integration and miniaturization, their packaging structures are becoming increasingly complex, placing more stringent demands on physical protection and functional testing during the production process. Any minor anomaly in the production process or oversight in the testing procedure can lead to product quality defects, subsequently causing end-application malfunctions and resulting in significant economic losses for companies. In the current integrated circuit production and testing system, some products, based on considerations of production efficiency and cost control, adopt a "pure packaging" testing process. This means that after completing the initial manufacturing stages, the product directly enters the packaging process without a dedicated functional testing phase before shipment, affecting the product's application reliability. Technical investigation revealed that all the defective products exhibited board-mount failure, and the root cause of the failure was cracks in the product packaging. During product transport and positioning, the damaged barrier failed to provide effective protection, leading to abnormal compression and ultimately causing seal cracks. From a detection perspective, because the product used a pure packaging testing process, the packaging station did not conduct pre-shipment functional testing during operation, failing to detect the functional abnormalities caused by the seal cracks in a timely manner. This allowed defective products to enter downstream processes, increasing the risk for downstream customers and posing challenges to the manufacturer's quality control efforts. Summary of the Invention
[0003] In response to the above situation and to overcome the shortcomings of the existing technology, this invention provides an integrated circuit testing method that effectively solves the problem that the current market process is purely packaging, without functional testing before shipment, and cannot screen out products with cracked packages.
[0004] The technical solution adopted by this invention is as follows: This invention proposes an integrated circuit testing method, including step one: incoming materials: preparing the product to be tested; Step 2: Routine Electrical Testing of the Product: The product is placed in a temperature testing machine to complete routine electrical testing; Step 3: AOI Inspection: Inspect the product for damage to its markings or appearance, and screen out defective products. Step 4: FT2 test: Perform open circuit and short circuit tests and leakage tests on the product using a testing machine.
[0005] Preferably, the conventional electrical tests include room temperature tests, high temperature tests, and low temperature tests.
[0006] Preferably, the testing machine includes the ASL1K testing machine.
[0007] Preferably, the testing machine includes a testing head.
[0008] Preferably, the test head includes a board, which includes: OVI30 board, DVI300 board, DVI2K board, XVI board, HVS850 board, ACS board, TMU board and DDD board.
[0009] Preferably, the OVI30 board can carry a maximum voltage of 16V and a current of 30mA.
[0010] Preferably, the test head includes a test head box, which is a square cavity structure. The test head box includes a panel structure and a test head protective cover. The panel structure includes an inner side, an upper side, a lower side, a left side, and a right side. The test head protective cover is an outer side.
[0011] Preferably, the inner side of the test head is provided with a slot, the slot is a vertical groove structure, and the slot is made of elastic plastic material. Several sets of slots are provided, the slots are arranged according to the spacing, and the slots correspond to the slot numbers provided on the upper side of the test head.
[0012] Preferably, the card slot has a notch, one end of the slot structure is fitted with a board, and the other end of the card slot is connected to a slot on the outside of the test head surface. The slot is connected to a carrier board, and the card slot is in close contact with the pins of the board through internally provided metal pins.
[0013] Preferably, the upper and lower sides of the test head are provided with a base plate, the base plate is a hollow structure and is composed of several rows of square structures, and a plate is installed on the top of the hollow structure.
[0014] Preferably, an external cooling fan is provided on the back of the test head, and the external cooling fan includes fan blades, a motor and a housing.
[0015] Preferably, the testing machine includes a testing machine bracket, a testing head is slidably connected to one side of the testing machine bracket, the testing head is connected to a power supply box via a power cord, the power supply box is located on the side of the testing machine bracket away from the testing head, a main unit chassis is located above the power supply box, and an input unit is located above the main unit chassis.
[0016] Preferably, the input unit includes a mouse, a keyboard, and a barcode scanner; The host chassis includes memory modules, memory cards, and driver devices.
[0017] Preferably, after the FT2 test, the tested products are packaged into a tape reel.
[0018] The beneficial effects of the present invention using the above structure are as follows: This solution proposes an integrated circuit testing method. By developing a test machine platform program, open and short circuit tests and leakage tests are added. Before the product enters the tape-out, abnormal units with cracked packages are screened out, and the batch of products is traced and analyzed. This prevents cracked defective products from flowing into the customer's market, thereby effectively improving product quality. Attached Figure Description
[0019] Figure 1 This is a flowchart of an integrated circuit testing method proposed in this invention; Figure 2 This is a schematic diagram of a test machine for an integrated circuit testing method proposed in this invention; Figure 3 This is a schematic diagram of the back of the test head of an integrated circuit testing method proposed in this invention.
[0020] The components are as follows: 1. Test machine; 2. External cooling fan; 3. Test head; 31. Card slot number; 32. Board; 33. Base plate; 34. Test head box; 35. Card slot; 4. Power cord; 5. Test machine bracket; 6. Input unit; 7. Main unit chassis; 8. Power supply box.
[0021] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof. Detailed Implementation
[0022] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.
[0023] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0024] like Figures 1-3 As shown, this invention proposes a method for testing integrated circuits, such as... Figure 1 As shown, it includes the following steps: Step 1: Prepare the product to be tested, which is an integrated circuit product.
[0025] Step 2: Routine electrical performance test at room temperature: Place the product in a temperature testing machine to complete the routine electrical performance test at room temperature. The model of the temperature testing machine is ETS364.
[0026] In some embodiments, the conventional electrical test includes room temperature testing, high temperature testing, and low temperature testing.
[0027] For specific examples, room temperature testing includes, but is not limited to, conducting functional and performance tests on products using a temperature testing machine at a standard room temperature environment of 25°C to establish benchmark data and provide a reference benchmark for subsequent environmental adaptability testing.
[0028] High-temperature testing includes, but is not limited to, conducting functional and performance tests on products using a temperature testing machine at a high-temperature environment of 125°C, simulating extreme use or storage conditions, accelerating material aging and exposing potential defects, and verifying the stability and reliability of products at high temperatures.
[0029] Low-temperature testing includes, but is not limited to, conducting functional and performance tests on products at a low-temperature environment of -40°C, evaluating the impact of low temperatures on the physical properties, electrical performance, and structural integrity of materials, and verifying the reliability of products in cold environments.
[0030] Step 3: AOI inspection, including but not limited to, inspecting whether the product markings or appearance are damaged, and screening out defective products.
[0031] For example, AOI uses high-resolution cameras and image processing algorithms to automatically inspect the appearance of products, including their appearance and markings, and can quickly identify defective products.
[0032] After affixing customer labels to the product packaging box, check the product's shipping label and packaging information. Then, load the carrier tape into the MBB shipping box and wrap the inner box. Finally, the quality inspector conducts a final pre-shipment inspection of the product.
[0033] Step 4: FT2 test: Use tester 1 to perform open circuit and short circuit tests and leakage tests on the product.
[0034] In some embodiments, the test machine 1 includes an ASL1K test machine.
[0035] In some embodiments, the testing machine 1 includes a test head 3.
[0036] Step 4: After completing the FT2 test, package the tested and qualified products into the tape reel for subsequent product shipment.
[0037] In some embodiments, the board 32 inside the test head 3 includes an OVI30 board, a DVI300 board, a DVI2K board, an XVI board, an HVS850 board, an ACS board, a TMU board, and a DDD board. The OVI30 board can carry a maximum voltage of 16V and a current of 30mA and is used for product overvoltage and leakage testing. The test head 3 acts as a central control system, responsible for calculation and control, and coordinating the various boards to complete the test tasks.
[0038] like Figure 2 As shown, in some embodiments, a test machine 1 is included. The test machine 1 includes a test machine bracket 5. A test head 3 is slidably connected to one side of the test machine bracket 5. The test machine bracket 5 drives the test head 3 to move up and down. The test head 3 is connected to a power supply box 8 through a power cable 4. The power supply box 8 is fixed on the side of the test machine bracket 5 away from the test head 3. A host chassis 7 is provided above the power supply box 8. An input unit 6 is provided above the host chassis 7.
[0039] The test machine bracket 5, through its fixing and lifting functions, ensures that the test head 3 is in a stable position that meets testing requirements. The power cable 4 serves as a power transmission channel, delivering stable power from the power supply box 8 to the test head 3, powering its computation and control functions. The main unit chassis 7 stores test data and drives test signals, while the input unit 6, through batch information input and process card scanning, enables information entry and operation control during the testing process. All components work together to form a complete integrated circuit testing and operation system.
[0040] In some implementations, in input unit 6, the barcode scanner is used to scan the process card to obtain test process information, while the mouse and keyboard are used to manually input test-related information such as batches. The three work together to achieve information collection and operation command input before testing.
[0041] Inside the main unit chassis 7, the memory modules provide temporary storage space for test data processing, the memory card is used to store test data for a long time, and the driver device can drive the transmission of test signals, providing data support and signal assurance for the operation and control of the test head 3, ensuring the accuracy of data and the stability of signals during the test process.
[0042] like Figure 3 As shown, in some embodiments, the test head box 34, with its square cavity structure, forms a closed space through its inner and upper side panels, providing an installation carrier and protection for internal components such as the slots 35, boards 32, and base plate 33. The test head protective cover on the outer side further protects the internal components, preventing the intrusion of external dust and impurities, while also facilitating later inspection and maintenance of the internal components, ensuring the stable operation of the test head 3 as a central control system.
[0043] It should be noted that the combination of the vertical groove structure of the slot 35 and the elastic plastic material allows the slot 35 to tightly clamp the board 32, ensuring a stable installation. Several sets of slots 35 are arranged at intervals to accommodate the installation needs of different types of boards 32, enabling multiple boards to work simultaneously. The slots 35 correspond to slot number 31, helping operators quickly identify the board positions, facilitating board installation, replacement, and maintenance, and improving operational efficiency.
[0044] The notch on the card slot 35 prevents incorrect insertion of the board 32, avoiding damage due to incorrect installation orientation or model. The tight contact between the internal metal pins of the card slot 35 and the pins of the board 32 ensures stable signal transmission and power conduction between the board and the card slot 35. The card slot 35 connects to a carrier board via an external slot, transferring test resources from the board 32 to the carrier board, providing necessary signal and power support for integrated circuit testing, and ensuring smooth testing processes.
[0045] It should be noted that the hollow structure and array of squares on the base plate 33 enhance airflow and provide a heat dissipation channel for the board 32 mounted above, preventing the board's performance from being affected by high temperatures. The base plate 33 enables the grounding function of the test head 3 and shields external interference signals, ensuring the accuracy of the board 32's calculations and control. The markings and foolproof design on the upper side of the test head box 34 not only help identify the base plate's installation position but also prevent the base plate from being installed backwards or incorrectly, further improving equipment stability.
[0046] In some implementations, the motor drives the fan blades to rotate, and the airflow is guided through the housing so that the external cooling fan 2 can accelerate the air circulation inside the test head 3, dissipate internal heat, achieve active heat dissipation, reduce the internal temperature of the test head 3, maintain the stable operation of components such as the board 32, extend the equipment life, and support the multi-level heat dissipation system of the test machine 1 to ensure the overall system performance and meet the needs of long-term testing.
[0047] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0048] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.
[0049] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the spirit of the invention, such designs should fall within the protection scope of the present invention.
Claims
1. An integrated circuit testing method, characterized by: The test method comprises the following steps: Step 1: incoming material: prepare the product to be tested; Step 2: product routine electrical test: the product is placed in a temperature tester to complete the routine electrical test; Step 3: AOI detection: detect whether the product identification or appearance is damaged, and screen out test rejects; Step 4: FT2 test: complete the open / short test and leakage test on the product by the tester (1).
2. The integrated circuit test method according to claim 1, wherein: The routine electrical test comprises normal temperature test, high temperature test and low temperature test.
3. The integrated circuit test method according to claim 1, wherein: The tester (1) comprises an ASL1K tester.
4. The integrated circuit test method according to claim 1, wherein: The tester (1) comprises a test head (3).
5. The integrated circuit test method according to claim 4, wherein: The test head (3) comprises a board card (32), and the board card (32) comprises an OVI30 board card, a DVI300 board card, a DVI2K board card, an XVI board card, an HVS850 board card, an ACS board card, a TMU board card and a DDD board card.
6. The integrated circuit test method according to claim 5, wherein: The OVI30 board card can bear a maximum voltage of 16V and a maximum current of 30mA.
7. The integrated circuit test method according to claim 4, wherein: The test head (3) comprises a test head box (34), the test head box (34) is a square cavity structure, and the test head box (34) comprises a panel structure and a test head protective cover, the panel structure comprises an inner side, an upper side, a lower side, a left side and a right side, and the test head protective cover is an outer side.
8. The integrated circuit test method according to claim 4, wherein: The inner side of the test head (3) is provided with a clamping groove (35), the clamping groove (35) is a vertical bar-shaped slot structure, the clamping groove (35) is made of a plastic material with elasticity, a plurality of groups of clamping grooves (35) are arranged at intervals, and the clamping grooves (35) correspond to the clamping groove numbers (31) arranged on the upper side of the test head (3).
9. The integrated circuit test method according to claim 8, wherein: The clamping groove (35) is provided with a notch, one end of the slot structure of the clamping groove (35) is provided with a board card (32), and the other end of the clamping groove (35) is connected to a slot outside the surface of the test head (3), the slot is connected to a carrier plate, and the clamping groove (35) is in close contact with the pins of the board card (32) through the internally arranged metal pins.
10. The integrated circuit test method according to claim 4, wherein: The upper side and the lower side of the test head (3) are provided with a bottom plate (33), the bottom plate (33) is a hollow structure, the bottom plate (33) is composed of a plurality of square structures, and the board card (32) is arranged above the hollow structure.
11. The integrated circuit testing method of claim 4, wherein: The back of the test head (3) is provided with an external cooling fan (2), and the external cooling fan (2) comprises fan blades, a motor and a shell.
12. The integrated circuit testing method of claim 1, wherein: The test machine (1) comprises a test machine support (5), one side of the test machine support (5) is slidably connected with a test head (3), the test head (3) is connected with a power supply box (8) through a power supply line (4), the power supply box (8) is arranged on the side of the test machine support (5) away from the test head (3), a main machine case (7) is arranged above the power supply box (8), and an input unit (6) is arranged above the main machine case (7).
13. The integrated circuit testing method of claim 12, wherein: The input unit (6) comprises a mouse, a keyboard and a scanning gun; The main machine case (7) comprises a memory bank, a storage card and a drive device.
14. The integrated circuit testing method of claim 1, wherein: After the FT2 test, the test good products are packaged into a tape.