Data interaction device and interaction method thereof, electronic device and storage medium

Abstract

A data device and an interaction method thereof, an electronic device and a storage medium, the data interaction device comprising an interaction module, a switch module, a positioning module, a control module and a driving module, the positioning module is configured to generate positioning information of an interaction object when the interaction object is located in a positioning detection area, the control module determines a corresponding target interaction unit according to the positioning information, and controls a target switch unit corresponding to the target interaction unit to communicate the target interaction unit with the driving module, the driving module drives the target interaction unit to interact with the interaction object, and sends data interaction information to the control module.

Description

Technical Field

[0001] This disclosure relates to, but is not limited to, the field of communication technology, specifically to a data interaction device and its interaction method, electronic device, and storage medium. Background Technology

[0002] Near Field Communication (NFC) technology, due to its advantages such as fast connection establishment, high transmission speed, low power consumption, and high security, not only dominates applications in transportation and campuses, but also has a burgeoning application in finance, advertising, healthcare, the Internet of Things (IoT), and artificial intelligence interaction. Currently, NFC technology is mainly used in small-sized NFC products, specifically configured with a single NFC interaction chip paired with a single antenna, such as mobile payments, attendance cards, and campus cards. Summary of the Invention

[0003] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0004] On one hand, embodiments of this disclosure provide a data interaction device, including an interaction module, a switch module, a positioning module, a control module, and a drive module:

[0005] The interaction module includes multiple interaction units, at least one of which is configured to interact with an interaction object within an interaction area;

[0006] The switching module includes multiple switching units corresponding to the multiple interaction units, and each switching unit is configured to connect the interaction module and the driving module under the control of the control module.

[0007] The positioning module is set in the interaction area of ​​the interaction module to form a positioning detection area in the interaction area, and is configured to generate positioning information of the interaction object when the interaction object is located in the positioning detection area.

[0008] The control module is connected to the positioning module and the switch module, and is configured to determine the target switch unit and the target interaction unit corresponding to the positioning information according to the positioning information, and control the target switch unit to connect the target interaction unit to the drive module.

[0009] The driving module is connected to the control module and the switch module, and is configured to drive the target interaction unit to perform data interaction with the interaction object, and send the data interaction information from the interaction object to the control module.

[0010] In an exemplary embodiment, the control module is configured to set the resistance-capacitance matching value of the drive module according to the target interaction unit.

[0011] In an exemplary embodiment, the drive module is provided with resistance and capacitance value adjustment points, and the control module or the drive module stores a resistance and capacitance value matching table;

[0012] The control module is configured to search for the target resistance and capacitance value corresponding to the target interaction unit from the resistance and capacitance value matching table, and adjust the resistance and capacitance value adjustment point to set the resistance and capacitance matching value of the drive module according to the target resistance and capacitance value.

[0013] In an exemplary embodiment, a matching resistor-capacitor circuit is provided between each of the interaction units and the switching module.

[0014] In an exemplary embodiment, the matching resistor-capacitor circuit includes a first parallel capacitor circuit, a second parallel capacitor circuit, a series resistor circuit, and a parallel resistor circuit.

[0015] The first parallel capacitor circuit includes a first capacitor and a second capacitor connected in parallel, one end of which is connected to the antenna in the interaction unit, and the other end of which is connected to the series resistor circuit.

[0016] The second parallel capacitor circuit includes a third capacitor and a fourth capacitor connected in parallel, one end of which is connected to the series resistor circuit, and the other end is grounded.

[0017] The series resistor circuit includes a first resistor, one end of which is connected to the first parallel capacitor circuit, and the other end is grounded.

[0018] The parallel resistor circuit includes a second resistor connected in parallel with the second parallel capacitor circuit.

[0019] In an exemplary embodiment, the driving module includes a driving chip, a filtering circuit, a capacitor matching circuit, and a resistor-capacitor circuit.

[0020] The driver chip is connected to the filter circuit and the resistor-capacitor circuit, and is configured to output a data signal to the filter circuit; receive the data interaction information from the resistor-capacitor circuit, and send the data interaction information to the control module;

[0021] The filtering circuit is connected to the driving chip and the capacitor matching circuit, and is configured to filter the data signal and send the filtered data signal to the capacitor matching circuit.

[0022] The capacitor matching circuit is connected to the filter circuit, the RC circuit, and the switch module. It is configured to adjust the filtered data signal and send the adjusted data signal to the switch module; receive data interaction information from the switch and send the data interaction information to the RC circuit.

[0023] The resistor-capacitor circuit is connected to the driver chip and the capacitor matching circuit, and is configured to receive data interaction information from the capacitor matching circuit, adjust the data interaction information, and send the adjusted data interaction information to the signal receiving end of the driver chip.

[0024] In an exemplary embodiment, the driving module may include a differential-to-single-ended circuit, the differential-to-single-ended circuit including a first signal channel and a second signal channel; the filtering circuit includes a first filtering sub-circuit and a second filtering sub-circuit; the capacitor matching circuit includes a first capacitor matching sub-circuit and a second capacitor matching sub-circuit; the driving chip includes a first signal output terminal, a second signal output terminal, and a signal receiving terminal.

[0025] The first filter sub-circuit includes a first inductor and a fifth capacitor; one end of the first inductor is connected to the first signal output terminal of the driver chip, and the other end is connected to the fifth capacitor; one end of the fifth capacitor is connected to the first inductor and the first capacitor matching sub-circuit, and the other end is grounded.

[0026] The second filter sub-circuit includes a second inductor and a sixth capacitor; one end of the second inductor is connected to the second signal output terminal of the driver chip, and the other end is connected to the sixth capacitor; one end of the sixth capacitor is connected to the matching sub-circuit of the second inductor and the second capacitor, and the other end is grounded;

[0027] The first capacitor matching sub-circuit includes a seventh capacitor. One end of the seventh capacitor is connected to the first filter sub-circuit and the RC circuit, and the other end is connected to the first signal channel of the differential-to-single-ended circuit.

[0028] The second capacitor matching sub-circuit includes an eighth capacitor, one end of which is connected to the second filter sub-circuit, and the other end of which is connected to the second signal channel of the differential-to-single-ended circuit.

[0029] In the differential-to-single-ended circuit, one end of the first signal channel is connected to the first capacitor matching sub-circuit, and the other end is connected to the switching module; one end of the second signal channel is connected to the second capacitor matching sub-circuit, and the other end is grounded; the differential-to-single-ended circuit is configured to process the data signals of the two signal channels into a single signal, and send the single signal to the switching module; receive data interaction information from the switching module, and send the data interaction information to the resistor-capacitor circuit through the first signal channel;

[0030] The RC circuit includes a ninth capacitor, a third resistor, a tenth capacitor, and a fourth resistor; one end of the ninth capacitor is connected to the third resistor, and the other end is grounded; one end of the third resistor is connected to the ninth capacitor, and the other end is connected to the signal receiving terminal of the driver chip and the tenth capacitor; one end of the tenth capacitor is connected to the signal receiving terminal of the driver chip, and the other end is connected to the fourth resistor; one end of the fourth resistor is connected to the tenth capacitor, and the other end is connected to the first capacitor matching sub-circuit; the RC circuit is configured to adjust the data interaction information from the first capacitor matching sub-circuit and send the adjusted data interaction information to the signal receiving terminal of the driver chip.

[0031] In an exemplary embodiment, one end of the ninth capacitor connected to the third resistor is connected to a power supply. In another exemplary embodiment, the driver chip may include a voltage output pin connected to the ninth capacitor and the third resistor; alternatively, one end of the ninth capacitor and the third resistor may be connected to an external power supply.

[0032] In an exemplary embodiment, the data interaction device may include a display module;

[0033] The control module can be connected to the display module and is configured to control the display module to display based on the data interaction information;

[0034] The display module is connected to the control module and is configured to display under the control of the control module.

[0035] In an exemplary embodiment, the interaction module is configured as multiple membrane layers, and each interaction unit includes an antenna coil;

[0036] In the interaction module, the antenna coils of two adjacent interaction units are located in different film layers, and the regions enclosed by the antenna coils of two adjacent interaction units have an overlapping area in the orthographic projection of the plane where one of the film layers is located.

[0037] In an exemplary embodiment, the interaction module is configured with four membrane layers, and the antenna coils of the four adjacent interaction units are respectively disposed on the four membrane layers. The orthographic projection of the area enclosed by the coils of two adjacent interaction units onto the plane of one of the membrane layers has a first overlapping area, and the orthographic projection of the area enclosed by the antenna coils of four adjacent interaction units onto the plane of one of the membrane layers has a second overlapping area.

[0038] In an exemplary embodiment, the antenna coils in the interactive unit adopt a rectangular winding method. The length of the first overlapping region formed by the antenna coils arranged along the second direction along the second direction does not exceed 1 / 6 of the side length of a single antenna coil along the second direction; the length of the first overlapping region formed by the antenna coils arranged along the first direction does not exceed 1 / 6 of the side length of a single antenna coil along the first direction; the length of the second overlapping region along the first direction does not exceed 1 / 6 of the side length of a single antenna coil along the first direction; and the length of the second overlapping region along the second direction does not exceed 1 / 6 of the side length of a single antenna coil along the second direction.

[0039] In an exemplary embodiment, the four membrane layers include a first membrane layer, a second membrane layer, a third membrane layer, and a fourth membrane layer stacked together, and the antenna coils in the four adjacent interactive units are respectively the first coil, the second coil, the third coil, and the fourth coil.

[0040] A plurality of first coils are arranged in an array at intervals on the first film layer along a first direction and a second direction; a plurality of second coils are arranged in an array at intervals on the second film layer along a first direction and a second direction; a plurality of third coils are arranged in an array at intervals on the third film layer along a first direction and a second direction; and a plurality of fourth coils are arranged in an array at intervals on the fourth film layer along a first direction and a second direction.

[0041] In an exemplary embodiment, the interaction module is configured as a single-film layer, and each interaction unit includes an antenna coil;

[0042] The antenna coils of two adjacent interactive units are stacked, and an insulating layer is provided between the stacks of the antenna coils of the two adjacent interactive units. The regions enclosed by the antenna coils of the two adjacent interactive units have an overlapping area in the orthographic projection of the plane of one of the stacks.

[0043] In an exemplary embodiment, the antenna coils of the plurality of interactive units are configured as four stacks, and the antenna coils of the four adjacent interactive units are respectively disposed on the four stacks. The orthographic projection of the area enclosed by the antenna coils of two adjacent interactive units onto the plane of one of the stacks has a third overlapping area, and the orthographic projection of the area enclosed by the antenna coils of four adjacent interactive units onto the plane of one of the stacks has a fourth overlapping area.

[0044] In an exemplary embodiment, the antenna coils in the interactive unit adopt a rectangular winding method. The length of the third overlapping region formed by the antenna coils arranged along the second direction along the second direction does not exceed 1 / 6 of the side length of a single antenna coil along the second direction. The length of the third overlapping region formed by the antenna coils arranged along the first direction along the first direction does not exceed 1 / 6 of the side length of a single antenna coil along the first direction. The length of the fourth overlapping region along the first direction does not exceed 1 / 6 of the side length of a single antenna coil along the first direction. The length of the fourth overlapping region along the second direction does not exceed 1 / 6 of the side length of a single antenna coil along the second direction.

[0045] In an exemplary embodiment, the four stacked layers include a first stacked layer, a second stacked layer, a third stacked layer, and a fourth stacked layer. The antenna coils in the four adjacent interactive units are respectively a first coil, a second coil, a third coil, and a fourth coil. A plurality of first coils are arranged in an array at intervals along a first direction and a second direction in the first stacked layer. A plurality of second coils are arranged in an array at intervals along a first direction and a second direction in the second stacked layer. A plurality of third coils are arranged in an array at intervals along a first direction and a second direction in the third stacked layer. A plurality of fourth coils are arranged in an array at intervals along a first direction and a second direction in the fourth stacked layer. A first insulating layer is provided between the first stacked layer and the second stacked layer. A second insulating layer is provided between the second stacked layer and the third stacked layer. A third insulating layer is provided between the third stacked layer and the fourth stacked layer.

[0046] In an exemplary embodiment, the driving module includes a driving module layer, the display module includes a display module layer, and the positioning module includes a positioning module layer;

[0047] The driving module layer, the display module layer, and the positioning module layer are arranged sequentially along a third direction. The positioning module layer includes multiple infrared receivers and multiple infrared transmitters that are arranged one-to-one with the multiple infrared receivers.

[0048] Alternatively, the interactive device may include a protective layer, and the positioning module layer is disposed between the protective layer and the display module layer. The positioning module layer includes a totally reflective transparent material, multiple infrared receivers, and multiple infrared emitters that correspond one-to-one with the multiple infrared receivers. The multiple infrared emitters and the multiple infrared receivers are disposed in the totally reflective transparent material.

[0049] Alternatively, the display module layer includes a display substrate and a filter element disposed opposite to each other. The display substrate is provided with a plurality of photosensitive elements, and the positioning module layer includes the plurality of photosensitive elements. The plurality of photosensitive elements and the orthographic projection of a plurality of photosensitive areas on the filter element on the display substrate at least partially overlap.

[0050] In an exemplary embodiment, the switching module includes a main switching module and a sub-switching module, wherein:

[0051] The main switch module includes multiple main switch units, and each main switch unit is connected to at least one sub-switch unit among the control module, the drive module, and the sub-switch module.

[0052] The sub-switch module includes multiple sub-switch units, each of which is connected to the control module, a main switch unit, and an interaction unit.

[0053] The control module is connected to the positioning module and the multiple main switch units and multiple sub-switch units in the switch module. It is configured to determine the sub-switch unit and target interaction unit corresponding to the positioning information according to the positioning information, and use the determined sub-switch unit as the target switch unit. It controls the target switch unit and the main switch unit corresponding to the target switch unit to connect the target interaction unit to the drive module.

[0054] The driving module is connected to multiple main switch units in the control module and the main switch module, and is configured to drive the target interaction unit to perform data interaction with the interaction object under the control of the control module.

[0055] On the other hand, this disclosure provides an electronic device including the data interaction device described in any of the above embodiments.

[0056] In another aspect, this disclosure provides a data interaction method, applied to the data interaction device described in any of the above embodiments, the method comprising:

[0057] When the interactive object is located in the location detection area, the location information of the interactive object is generated; the location detection area is formed by the location module, and the location module is set in the interaction area of ​​the interactive module;

[0058] The target switch unit and the target interaction unit corresponding to the location information are determined based on the location information; the target interaction unit is at least one of a plurality of interaction units in the interaction module, and the target switch unit is at least one of a plurality of switch units in the switch module;

[0059] The target switching unit controls the target interaction unit to enter the interaction state, drives the target interaction unit to perform data interaction with the interaction object, and obtains data interaction information from the interaction object.

[0060] In an exemplary embodiment, the method may include: setting a resistance-capacitance matching value according to the target interaction unit.

[0061] In another aspect, this disclosure provides a non-transient computer-readable storage medium configured to store computer program instructions, wherein the computer program instructions, when executed, can implement the data interaction method described in any of the above-described data interaction methods.

[0062] Other features and advantages of embodiments of this disclosure will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing embodiments of this disclosure. Other advantages of embodiments of this disclosure can be realized and obtained by means of the solutions described in the description and the accompanying drawings.

[0063] After reading and understanding the accompanying diagrams and detailed descriptions, the other aspects can be understood. Attached Figure Description

[0064] The accompanying drawings are provided to further illustrate the technical solutions of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the technical solutions of this disclosure and do not constitute a limitation on the technical solutions of this disclosure. The shape and size of each component in the drawings do not reflect actual proportions and are only intended to illustrate the content of this disclosure.

[0065] Figures 1a-1b A block diagram of a data interaction device provided in an embodiment of this disclosure;

[0066] Figures 2a-2c The diagram shown is a block diagram of a data interaction device provided in an exemplary embodiment of this disclosure;

[0067] Figure 2d The diagram shown is a circuit schematic of a driving module provided in an exemplary embodiment of this disclosure.

[0068] Figures 3a-3c The diagram shown is a schematic representation of the structure for data interaction between interactive objects and interactive modules provided in an exemplary embodiment of this disclosure.

[0069] Figure 3dThe diagram shown is a schematic of an ASK encoding method.

[0070] Figure 3e The diagram shown is a schematic diagram illustrating data interaction between the target interaction unit and the interaction object provided in an exemplary embodiment of this disclosure;

[0071] Figure 3f The diagram shown is a logical block diagram of a data interaction device provided in an exemplary embodiment of this disclosure;

[0072] Figures 4a-4b The diagram shown is a block diagram of a data interaction device provided in an exemplary embodiment of this disclosure;

[0073] Figure 4c The diagram shown is a circuit schematic of a matching resistor-capacitor circuit provided in an exemplary embodiment of this disclosure.

[0074] Figures 5a-5b The diagram shown is an equivalent circuit diagram of the antenna and matching resistor-capacitor circuit in the interactive unit provided by an exemplary embodiment of this disclosure.

[0075] Figures 5c-5d The diagram shows a data interaction between an interactive unit and an interactive object.

[0076] Figure 5e The diagram shown is an equivalent circuit schematic of the matching resistor-capacitor circuit connected between the switch module and the antenna coil in an exemplary embodiment of this disclosure.

[0077] Figure 6a The diagram shown is a block diagram of a data interaction device provided in an exemplary embodiment of this disclosure;

[0078] Figures 6b-6c The diagram shown is a structural schematic of an interactive device provided in an exemplary embodiment of this disclosure.

[0079] Figures 7a-7u The diagram shown is a schematic representation of the arrangement of multiple interactive units in an exemplary embodiment of this disclosure.

[0080] Figure 8a The figure shown is a cross-sectional view of a data interaction device in an exemplary embodiment of this disclosure;

[0081] Figure 8b The diagram shown is a planar structural schematic of the data interaction device in an exemplary embodiment of this disclosure;

[0082] Figure 8c The figure shown is a cross-sectional view of a data interaction device in an exemplary embodiment of this disclosure;

[0083] Figure 8d The figure shown is a cross-sectional view of the positioning module in an exemplary embodiment of this disclosure;

[0084] Figure 8eThe figure shown is a cross-sectional view of a data interaction device in an exemplary embodiment of this disclosure;

[0085] Figure 8f The diagram shown is a cross-sectional view of the display module in an exemplary embodiment of this disclosure;

[0086] Figure 8g The figure shown is a cross-sectional view of a data interaction device in an exemplary embodiment of this disclosure;

[0087] Figure 9 The diagram shown is a flowchart of the data interaction method in an embodiment of this disclosure. Detailed Implementation

[0088] The embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. The implementation can be carried out in many different forms. Those skilled in the art will readily understand that the methods and content can be varied in many ways without departing from the spirit and scope of this disclosure. Therefore, this disclosure should not be construed as being limited only to the content described in the following embodiments. Without conflict, the embodiments and features in the embodiments of this disclosure can be arbitrarily combined with each other. To keep the following description of the embodiments of this disclosure clear and concise, detailed descriptions of some known functions and components have been omitted. The accompanying drawings of the embodiments of this disclosure only relate to the structures involved in the embodiments of this disclosure; other structures can be referred to with reference to general designs.

[0089] The scale of the figures in this disclosure can be used as a reference in actual processes, but is not limited thereto. For example, the aspect ratio of the channel, the thickness and spacing of each film layer, and the width and spacing of each signal line can be adjusted according to the actual situation. The number of pixels in the display substrate and the number of sub-pixels in each pixel are not limited to the numbers shown in the figures. The figures described in this disclosure are only schematic diagrams of the structure, and one aspect of this disclosure is not limited to the shapes or values ​​shown in the figures.

[0090] The ordinal numbers “first,” “second,” and “third” used in this specification are used to avoid confusion among the constituent elements, not to limit their quantity.

[0091] In this specification, for convenience, terms such as "middle," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are used to indicate orientation or positional relationships in conjunction with the accompanying drawings. This is solely for the purpose of facilitating the description and simplification, and does not imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this disclosure. The positional relationships of the constituent elements may be appropriately varied depending on the direction in which each constituent element is described. Therefore, the use of terms not limited to those described in the specification may be appropriately replaced as needed.

[0092] In this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they may refer to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection, an indirect connection via an intermediate component, or a connection within two components. Those skilled in the art will understand the specific meaning of these terms in this disclosure based on the specific circumstances.

[0093] In this specification, "electrical connection" includes the situation where components are connected together by elements having a certain electrical function. There are no particular limitations on the term "elements having a certain electrical function," as long as they enable the transmission and reception of electrical signals between the connected components. Examples of "elements having a certain electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements having one or more functions.

[0094] In this specification, "parallel" refers to a state in which two straight lines form an angle of -10° or more and less than 10°, and therefore can include a state in which the angle is -5° or more and less than 5°. Similarly, "perpendicular" refers to a state in which two straight lines form an angle of 80° or more and less than 100°, and therefore can include a state in which the angle is 85° or more and less than 95°.

[0095] In this specification, the terms "film" and "layer" may be interchanged. For example, "conductive layer" may sometimes be replaced with "conductive film." Similarly, "insulating film" may sometimes be replaced with "insulating layer."

[0096] In this specification, triangles, rectangles, trapezoids, pentagons, or hexagons are not strictly defined; they can be approximate triangles, rectangles, trapezoids, pentagons, or hexagons. Small deformations due to tolerances are possible, as are chamfers, curved edges, and other variations.

[0097] In this disclosure, “about” means a value that is not strictly limited and allows for process and measurement errors.

[0098] In the application of NFC technology in large-size or large-area NFC products, the number of objects interacting with the NFC product also increases accordingly. Currently, there are two ways for NFC products to interact with multiple objects: one design is to match a single NFC interaction chip with multiple antennas. The NFC chip activates the read and write operations of each antenna through polling. Since the NFC chip needs to activate multiple antennas with it for each data interaction, it takes a lot of time and reduces the efficiency of NFC data interaction. The other design is to set up multiple NFC chips and multiple antennas in a large-size or large-area product, with each NFC chip matched with one antenna. Although this setting improves the data interaction efficiency of NFC products, it requires multiple NFC chips to run simultaneously or sequentially, resulting in higher power consumption. Multiple NFC chips also increase the production cost of the product.

[0099] This disclosure provides a data interaction device, such as... Figure 1a As shown, the data interaction device 10 includes an interaction module 101, a switch module 102, a positioning module 103, a control module 104, and a drive module 105;

[0100] The interaction module 101 includes multiple interaction units 1011, and at least one interaction unit 1011 is configured to perform data interaction with an interaction object within an interaction area;

[0101] The switch module 102 includes a plurality of switch units 1021 corresponding to a plurality of interaction units 1011. Each switch unit 1021 is configured to connect the interaction module 101 and the drive module 105 under the control of the control module 104.

[0102] The positioning module 103 is set in the interaction area of ​​the interaction module 101 to form a positioning detection area in the interaction area, and is configured to generate positioning information of the interaction object when the interaction object is located in the positioning detection area.

[0103] The control module 104 is connected to the positioning module 103 and the switch module 102. It is configured to determine the target switch unit and the target interaction unit corresponding to the positioning information based on the positioning information, and control the target switch unit to connect the target interaction unit to the drive module 105.

[0104] The drive module 105 is connected to the control module 104 and the switch module 102. It is configured to drive the target interaction unit to perform data interaction with the interaction object and send the data interaction information from the interaction object to the control module 104.

[0105] The data interaction device of this embodiment feeds back the location information of the interaction object to the control module through the positioning module. The control module determines the corresponding target interaction unit based on the location information and controls the target switch unit corresponding to the target interaction unit to connect the target interaction unit to the driving module. Under the control of the control module, the driving module drives the target interaction unit to perform data interaction with the interaction object. When the interaction unit needs to interact with the interaction object, only the interaction switch corresponding to the interaction object is turned on. The driving module does not need to turn on each interaction unit sequentially through polling, thereby saving data interaction time and improving data interaction efficiency. Multiple interaction units are driven by only one driving module, thereby saving costs. When interacting with the interaction object, only one driving module runs, which can reduce power consumption.

[0106] In an exemplary implementation, such as Figure 1a As shown, the switch module 102 may include multiple switch units 1021, each of which is connected to the control module 104 and the drive module 105. For example, the switch module 102 may include m switch units 1021, where m is a positive integer.

[0107] In an exemplary implementation, such as Figure 1b As shown, the switch module 102 may include a main switch module 102-1 and a sub-switch module 1021-2, wherein:

[0108] The main switch module 102-1 includes multiple main switch units 102-11, and each main switch unit 1021-11 is connected to at least one sub-switch unit among the control module 104, the drive module 105 and the sub-switch module.

[0109] Sub-switch module 102-2 includes multiple sub-switch units 102-21, each of which is connected to control module 104, a main switch unit 102-11 and an interaction unit 1011.

[0110] The control module 104 is connected to multiple main switch units 102-11 and multiple sub-switch units 102-21 in the positioning module 103 and the switch module 102. It is configured to determine the sub-switch unit 102-21 and the target interaction unit corresponding to the positioning information based on the positioning information, and use the determined sub-switch unit 102-21 as the target switch unit. It controls the target switch unit and the main switch unit corresponding to the target switch unit to connect the target interaction unit to the drive module 105.

[0111] The drive module 105 is connected to multiple main switch units 120-11 in the control module 104 and the main switch module 102-1. It is configured to drive the target interaction unit to perform data interaction with the interaction object and send the data interaction information from the interaction object to the control module 104.

[0112] In such Figure 1b In the structure shown, each main switch unit 102-11 in the switch module 102 is connected to multiple sub-switch units 102-21. The control module 104 is connected to both the multiple sub-switch units 102-21 and the multiple main switch units 102-11. The drive module 104 is only connected to the multiple main switch units 102-11. The drive module 104 does not need to be directly electrically connected to the multiple sub-switch units 102-21, thus facilitating wiring and saving wiring space and costs. For example, Figure 1b In the structure shown, the main switch module 102-1 includes n main switch units 102-11 and m sub-switch units 102-21, so the total number of switch units is n*m, where m and n are both positive integers. This can save n*m ​​lines between the drive module 104 and the sub-switch units 102-21, greatly reducing wiring space and saving wiring costs.

[0113] In an exemplary embodiment, the aforementioned switch unit 1021, main switch unit 102-11, and sub-switch unit 102-21 may be radio frequency switches (RF switches) or other switches, which are not limited herein.

[0114] In an exemplary embodiment, when the positioning information fed back to the control module 104 by the positioning module 103 includes multiple corresponding target interaction units and target switches, the drive module 105 can sequentially open the target switch units to control the target interaction units to perform data interaction with the interaction objects. When the drive module 105 controls the target interaction units to perform data interaction with the interaction objects, if one or more target interaction units fail to detect the interaction object, it controls the next target interaction unit to perform data interaction with the interaction object.

[0115] In an exemplary implementation, such as Figure 2a As shown, the driving module 104 includes a driving chip 1051 and a filtering circuit 1052, wherein:

[0116] The driver chip 1051 is connected to the control module 104, the filter circuit 1052, and the switch module 102. It is configured to send data signals to the filter circuit 1052 for filtering, receive data interaction information from the interaction module 101 through the switch module 102, and send data interaction information from the interaction object to the control module 104.

[0117] The filter circuit 1052 is connected to the driver chip 1051 and the switch module 102. It is configured to filter the data signal from the driver chip 1051 and send the filtered data signal to the interaction module 101 via the switch module 102.

[0118] In an exemplary implementation, such as Figure 2b As shown, the drive module 105 may include a capacitor matching circuit 1053 and a resistor-capacitor circuit 1055, wherein:

[0119] The capacitor matching circuit 1053 is connected to the filter circuit 1052 and the switch module 102. It is configured to adjust the data signal filtered by the filter circuit 1052, and send the adjusted data signal to the data interaction module via the switch module 102; and send the data interaction information from the switch module 102 to the resistor-capacitor circuit 1055.

[0120] The resistor-capacitor circuit 1055 is connected to the driver chip 1051 and the capacitor matching circuit 1053. It is configured to adjust the data interaction information from the capacitor matching circuit 1053 and send the adjusted data interaction information to the signal receiving end of the driver chip 1051.

[0121] In an exemplary implementation, such as Figure 2c As shown, in Figure 2a Based on this, the drive module 105 may include a capacitor matching circuit 1053, a differential converter single-ended circuit 1054, and a resistor-capacitor circuit 1055, wherein:

[0122] The driver chip 1051 includes two signal output terminals and one signal receiving terminal. The two signal output terminals are connected to the filter circuit 1052, and the signal receiving terminal is connected to the resistor-capacitor circuit 1055. It is configured to output two data signals to the filter circuit 1052 through the two signal output terminals; and receive data interaction information from the resistor-capacitor circuit 1055 through the one signal receiving terminal, and send the data interaction information to the control module 104.

[0123] The filter circuit 1052 includes two filter sub-circuits. One end of each filter sub-circuit is connected to the two signal output terminals of the driver chip 1051, and the other end is connected to the capacitor matching circuit 1053. It is configured to filter the two data signals from the driver chip 1051 and send the filtered dual data signals to the capacitor matching circuit 1053.

[0124] The capacitor matching circuit 1053 is connected to the filter circuit 1052, the differential transformer single-ended circuit 1054, and the RC circuit 1055. It is configured to send the filtered dual-channel data signal to the differential transformer single-ended circuit 1054 and transmit the data interaction information from the differential transformer single-ended circuit 1054 to the RC circuit 1055.

[0125] The differential-to-single-ended circuit 1054 is connected to the capacitor matching circuit 1053 and the switch module 102. It is configured to process the dual-channel data signals into a single-channel signal and send the single-channel signal to the switch module 102; and send the data interaction information from the target interaction unit 1011 to the capacitor matching circuit 1053.

[0126] In such Figure 2b and Figure 2c In the structure shown, the driving module 105 is equipped with a capacitor matching circuit 1053 and a resistor-capacitor circuit 1055. The energy of the data signals transmitted by the transmitting end TX1 and TX2 of the driving module 105 can be adjusted by adjusting the capacitor value in the capacitor matching circuit 1053, and the energy of the signal received by the receiving end RX of the driving module 105 can be adjusted by adjusting the resistance and capacitance values ​​in the resistor-capacitor circuit 1055. When the application scenario of the data interaction device changes and the field strength energy for data interaction with the data interaction object changes, the energy of the transmitted and received signals of the driving module 105 can be adjusted by adjusting the resistance and capacitance elements in the capacitor matching circuit 1053 and the resistor-capacitor circuit 1055. Therefore, it is not necessary to replace the entire data interaction device; only the capacitor value of the capacitor matching circuit 1053 and the resistor-capacitor circuit 1055 in the driving module 105 need to be adjusted.

[0127] In an exemplary embodiment, the filter circuit 1052 may include a capacitor and an inductor, the capacitor matching circuit 1053 may include a matching capacitor, and the resistor-capacitor circuit 1055 may include a capacitor and a resistor connected in series, such as... Figure 2d The diagram shown is a circuit schematic of a driver chip 1051, a filter circuit 1052, a capacitor matching circuit 1053, and a resistor-capacitor circuit 1055. Figure 2d The resistors and capacitors in the medium-resistance-capacitor circuit 1055 can be increased or decreased according to actual conditions. The number of capacitors in the capacitor matching circuit 1053 can be increased according to actual conditions; for example, a grounding capacitor can be added to the capacitor matching circuit 1053. The filter circuit 1052, capacitor matching circuit 1053, RC circuit 1055, and differential transformer single-ended circuit 1054 can be configured in other ways, which are not limited in this disclosure.

[0128] In an exemplary implementation, such as Figure 2dAs shown, the differential-to-single-ended circuit 1054 includes a first signal channel and a second signal channel; the filter circuit 1052 includes a first filter sub-circuit and a second filter sub-circuit; the capacitor matching circuit 1053 includes a first capacitor matching sub-circuit and a second capacitor matching sub-circuit; and the driver chip 1051 includes a first signal output terminal TX1, a second signal output terminal TX2, and a signal receiving terminal RX.

[0129] The first filter sub-circuit includes a first inductor L32 and a fifth capacitor C31; one end of the first inductor L32 is connected to the first signal output terminal TX1 of the driver chip 1501, and the other end is connected to the fifth capacitor C31; one end of the fifth capacitor C31 is connected to the first inductor L32 and the first capacitor matching sub-circuit, and the other end is grounded.

[0130] The second filter sub-circuit includes a second inductor L31 and a sixth capacitor C32; one end of the second inductor L31 is connected to the second signal output terminal TX2 of the driver chip 1051, and the other end is connected to the sixth capacitor C32; one end of the sixth capacitor C32 is connected to the second inductor L31 and the second capacitor matching sub-circuit, and the other end is grounded.

[0131] The first capacitor matching sub-circuit includes a seventh capacitor C33. One end of the seventh capacitor C33 is connected to the first filter sub-circuit and the RC circuit 1055, and the other end is connected to the first signal channel of the differential single-ended circuit 1054.

[0132] The second capacitor matching sub-circuit includes an eighth capacitor C34. One end of the eighth capacitor C34 is connected to the second filter sub-circuit, and the other end is connected to the second signal channel of the differential-to-single-ended circuit 1054.

[0133] In the differential single-ended circuit 1054, one end of the first signal channel is connected to the first capacitor matching sub-circuit, and the other end is connected to the switch module 102; one end of the second signal channel is connected to the second capacitor matching sub-circuit, and the other end is grounded; the differential single-ended circuit 1054 is configured to process the data signals of the two signal channels into a single signal, and send the single signal to the switch module 102; receive data interaction information from the switch module 102, and send the data interaction information to the resistor-capacitor circuit 1055 through the first signal channel;

[0134] The RC circuit 1055 includes a ninth capacitor C21, a third resistor R21, a tenth capacitor C22, and a fourth resistor R22. One end of the ninth capacitor C21 is connected to the third resistor R21, and the other end is grounded. One end of the third resistor R21 is connected to the ninth capacitor C21, and the other end is connected to the signal receiving terminal RX of the driver chip 1051 and the tenth capacitor C22. One end of the tenth capacitor C22 is connected to the signal receiving terminal RX of the driver chip 1051 and the third resistor R21, and the other end is connected to the fourth resistor R22. One end of the fourth resistor R22 is connected to the tenth capacitor C22, and the other end is connected to the first capacitor matching sub-circuit. The RC circuit 1055 is configured to adjust the data interaction information from the first capacitor matching sub-circuit and send the adjusted data interaction information to the signal receiving terminal RX of the driver chip 1051.

[0135] In an exemplary embodiment, Figure 2d In the circuit schematic shown, the driver chip 1051 may include a voltage output pin, VMID, which is connected to the ninth capacitor C21 and the third resistor R21 to provide voltage to the receiving signal terminal RX. In an exemplary embodiment, an external power supply can be used to replace the voltage output pin VMID of the driver chip 1051 to provide voltage to the ninth capacitor C21, the third resistor R21, and the receiving signal terminal RX.

[0136] In an exemplary embodiment, the seventh capacitor C33 has a value between 150 picofarads and 470 picofarads; in some embodiments, the eighth capacitor C34 has a value between 150 picofarads and 470 picofarads.

[0137] In an exemplary embodiment, Figure 2d In the circuit schematic shown, the two output terminals TX1 and TX2 of the driver chip 1051 send data signals to two filter sub-circuits respectively. One filter sub-circuit includes an inductor L31 and a capacitor C32 connected in series, and the other filter sub-circuit includes an inductor L32 and a capacitor C31 connected in series. The differential converter single-ended circuit 1054 receives the filtered two data signals, processes them, and converts them into a single signal, which is then sent to the interaction unit 1011. When the differential converter single-ended circuit 1054 receives data interaction information from the interaction unit, it sends the data interaction information to the driver chip 1051 through the resistor-capacitor circuit 1055 via one of the two terminals connected to the two filter sub-circuits, while the other terminal can be grounded. In an exemplary embodiment, the differential converter single-ended circuit 1054 may include a balance-unbalance (balun) transformer, which can be simply referred to as a balun transformer.

[0138] In an exemplary embodiment, when adjusting the energy of the receiver RX of the driver chip 1051, the resistor-capacitor circuit 1055 can set the ninth capacitor C21 and the tenth capacitor C22 to fixed values, and adjust the energy of the receiver RX by adjusting the resistance values ​​of the third resistor R21 and the fourth resistor R22. In the exemplary embodiment, the resistance value of the third resistor R21 is directly proportional to the energy received by the receiver RX, and the resistance value of the fourth resistor R22 is inversely proportional to the energy received by the receiver RX. The energy received by the receiver RX can be characterized by the peak-to-peak value of a sine wave.

[0139] In some exemplary embodiments, the energy received by the receiving end RX of the driver chip 1051 can be adjusted by adjusting at least one of the ninth capacitor C21, the tenth capacitor C22, the third resistor R21, and the fourth resistor R22. The capacitance value of the ninth capacitor C21 is inversely proportional to the energy received by the receiving end RX, the capacitance value of the tenth capacitor C22 is directly proportional to the energy received by the receiving end RX, the resistance value of the third resistor R21 is directly proportional to the energy received by the receiving end RX, and the resistance value of the fourth resistor R22 is inversely proportional to the energy received by the receiving end RX.

[0140] In an exemplary embodiment, the driver chip 1051, filter circuit 1052, capacitor matching circuit 1053, RC circuit 1055, and differential converter single-ended circuit 1054 can be circuits or chips in related technologies that can achieve the corresponding functions.

[0141] In an exemplary embodiment, Figure 2c In the structure shown, the driver chip 1051 transmits data signals through two signal output terminals TX1 and TX2, which can enhance the transmission power. Correspondingly, the filter circuit 1052 and capacitor matching circuit 1053 can have two input terminals and two output terminals. The two signals are converted into a single signal via the differential-to-single-ended circuit 1054 and sent to the data interaction module 101 via the switching module 102. The driver chip 1051 can be configured with only one signal output terminal TX, depending on the actual situation. For example, if the power output from one signal output terminal TX of the driver chip 1051 is sufficiently high, then only one signal output terminal TX needs to be configured. Figures 2a-2b As shown, the differential-to-single-ended circuit 1054 can be omitted accordingly.

[0142] In an exemplary embodiment, the driver chip 1051 in the driver module 105 has two signal output terminals TX1 and TX2. The data signals emitted from the two signal output terminals TX1 and TX2 are filtered by the filter circuit 1052 to obtain two sine waves. In an exemplary embodiment, the square wave signal emitted from the two signal output terminals TX1 and TX2 of the driver chip 1051 has a frequency of 13.56 MHz. After the square wave signal is filtered by the filter circuit 1052 to remove high-frequency harmonics, it becomes a 13.56 MHz sine wave.

[0143] In an exemplary embodiment, the control module 104 can be a system-on-chip (SOC) or a microcontroller unit (MCU), and the driver chip 1051 can be an NFC chip. Both the driver chip 1051 and the control module can be chips capable of performing the corresponding functions found in related technologies.

[0144] There are multiple protocols for NFC object recognition, such as ISO14443 Type A and Type B / ISO15693 protocols. ISO14443A uses amplitude discrimination for information exchange and can be used for the design and debugging of a single NFC chip to recognize multiple objects.

[0145] In an exemplary embodiment, each interaction unit 1011 may include an antenna coil.

[0146] In an exemplary embodiment, the driver chip 1051 can interact with the interactive object based on the ISO14443A protocol. The working principle of the driver module 104 driving the interaction module 101 to interact with the interactive object is explained below:

[0147] 1) When the interactive object is located in the positioning detection area of ​​the positioning module 103, the positioning module 103 generates the positioning information of the interactive object and sends the positioning information of the interactive object to the control module 104.

[0148] 2) The control module 104 determines the target switching unit and the target interaction unit based on the positioning information, and controls the target switching unit to connect the target interaction unit with the drive module 105.

[0149] 3) After the target interaction unit is connected to the driving module 105, the target interaction unit continuously transmits a sine wave signal with a frequency of 13.56 MHz under the drive of the driving module 105, such as... Figure 3a As shown, when the interactive object is within the range of the communication magnetic field of the target interactive unit, the interactive object obtains energy through coupling and feeds back an interactive signal to the driving module 105 through the target interactive unit.

[0150] 4) After receiving the interaction signal from the interactive object, the driving module 105 determines that the interactive object exists within the communication magnetic field range of the target interactive unit, encodes and modulates the data signal, and then transmits it through the target interactive unit, such as... Figure 3b As shown.

[0151] 5) The interactive object receives the encoded and modulated data signal transmitted by the target interactive unit through the inductive coupling of its own antenna, and decrypts and rectifies it through its internal chip to obtain the corresponding command. Based on the obtained command, it encodes and modulates its own data interaction information and feeds it back to the driver module 105 through the target interactive unit, such as... Figure 3c As shown; in an exemplary embodiment, the type of data interaction information that the interactive object returns to the driving module 105 through the target interactive unit according to the received command can be preset in advance.

[0152] like Figure 3e The diagram shown illustrates a data interaction between the target interaction unit and the interaction object under the drive of the driver module 105.

[0153] 6) The driver module 105 receives the encoded and modulated data interaction information, decodes it, and sends the decoded data interaction information to the control module 104, which then processes the decoded data interaction information. In an exemplary embodiment, the control module 104 can control the corresponding software to process the decoded data interaction information.

[0154] In an exemplary embodiment, when the driving module 105 drives the interaction module 101 to perform data interaction with the interaction object based on the ISO14443A protocol, such as Figure 3b As shown, the encoding mode used by the drive module 105 when sending data signals to the interactive object through the target interactive unit is 100% ASK; as Figure 3c As shown, the interactive object transmits data interaction information to the target interactive unit using a load wave modulation mode.

[0155] like Figure 3d The diagram shows an ASK encoding method using amplitude shift keying (ASK). The driver chip 1051 loads the modulation signal onto a high-frequency carrier to obtain the ASK signal.

[0156] In an exemplary embodiment, the control module 104 is configured to set the resistance-capacitance matching value of the drive module 105 according to the target interaction unit, so that the field strength energy emitted by the interaction unit when interacting with the interaction object is within a preset range. Figures 1a-1bAs shown, the control module 104 sets the RC matching value of the drive module 105 according to the target interaction unit. When each interaction unit 1011 is working, the field strength energy emitted by each interaction unit 1011 is within a preset range. The field strength energy test point N can be set at the receiving end RX to measure whether the field strength energy returned by each interaction unit 1011 received by the drive module 105 is within the preset range (e.g., the field strength energy fluctuates by no more than 5% of the preset field strength energy), thereby ensuring that the field strength energy emitted by multiple interaction units 1011 is as similar as possible. Consistent field strength energy emitted by multiple interaction units 1011 ensures that the identified interaction objects can be stably identified. Furthermore, by setting the RC matching value of the drive module 105 through the control module 104, it can be extended to various application scenarios, expanding the application scope and improving universality. For example, when the field strength energy required to identify the interaction object changes, only the RC matching value in the drive module 105 needs to be set through the control module 104, without needing to replace the entire data interaction device.

[0157] In an exemplary embodiment, after the control module 104 controls the target switching unit to connect the target interaction unit to the drive module 105, the control module 104 can set the resistance-capacitance matching value of the drive module 105 via an SPI interface or an I2C interface, such as... Figure 3f The diagram shown is a logic block diagram of a data interaction device 10.

[0158] In an exemplary embodiment, the drive module 105 is provided with resistance and capacitance value adjustment points, and the control module 104 or the drive module 105 stores a resistance and capacitance value matching table.

[0159] The control module 104 is configured to search for the target resistance and capacitance value corresponding to the target interaction unit from the resistance and capacitance value matching table, and adjust the resistance and capacitance value adjustment point setting of the drive module 105 according to the target resistance and capacitance value.

[0160] In an exemplary embodiment, after determining the application scenario, the field strength energy of each interactive unit 1011 during operation can be determined accordingly. Before the data interaction device 10 officially starts working, the field strength energy of each interactive unit 1011 is tested. When testing a certain interactive unit 1011, if the field strength energy received by the receiving end of the driving module 105 is not within the preset field strength energy range, the RC matching value in the driving module 105 is adjusted until the field strength energy received by the receiving end RX of the driving module 105 is within the preset field strength energy range. The RC matching value corresponding to that interactive unit 1011 is recorded and saved to the RC matching value table. This process is repeated until the field strength energy test of each interactive unit 1011 is completed. After this process is completed, the RC matching table is saved to the driving module 105 or the control module 104, or it can be saved to a location that can be found by other control modules 104. This disclosure does not limit this.

[0161] In an exemplary implementation, such as Figures 2a-2c As shown, an energy test point N can be set at the receiver RX of the driver chip to test the field strength energy at the receiver of the 1051 driver chip. Figures 1a-1b As shown, a field strength energy test point M of the interaction unit can be set between the interaction unit 1011 and the switch module 102 to test the field strength energy of the interaction unit 1011.

[0162] like Figures 1a-2c As shown, the control module 104 sets the resistance-capacitance matching value of the drive module 104 according to the target interaction unit. When the field strength energy of the interaction unit 1011 is working, the field strength energy measured at the field strength energy test point M of each interaction unit 1011 is within the preset range (for example, the field strength energy fluctuates up and down by no more than 5% of the preset field strength energy). This can make the field strength energy sent by multiple interaction units 1011 as similar as possible when they are working, thereby ensuring that the interaction objects that need to be identified can be identified stably.

[0163] In an exemplary embodiment, the control module 104 sets the resistance-capacitance matching value of the driver chip 1051 in the driver module 105 according to the target interaction unit.

[0164] In one feasible implementation, the control module 104 sets the RC matching value of the driver chip 1051, which is combined with the capacitor matching circuit 1053 and the RC circuit 1055 set in the driver module 105. The capacitor matching circuit 1053 and the RC circuit 1055 can make the field strength energy received and transmitted by the driver chip more refined based on the RC matching value set by the control module 104. For example, after testing the RC matching table corresponding to each interactive unit 1011, if the RC matching value of the driver chip 1051 is set according to the RC matching table before the interactive device is officially working, the field strength energy transmitted by the interactive unit 1011 will have a certain deviation from the preset field strength energy range. In order to avoid adjusting the RC values ​​in the RC matching table one by one, the capacitor matching circuit 1053 can be adjusted to make the field strength energy transmitted by each interactive unit 1011 as close as possible to the preset range. Among them, the capacitor matching circuit 1053 and the resistor-capacitor circuit 1055 can be adjusted by hardware, and the control module 104 can set the resistor-capacitor matching value of the driver chip 1051 by software. Under normal circumstances, after the application scenario is fixed, the debugged capacitor matching circuit 1053 and resistor-capacitor circuit 1055 will not be changed. The data interaction device will not adjust the capacitor matching circuit 1053 and resistor-capacitor circuit 1055 each time it interacts with the interaction object, while the control device 104 can set the resistor-capacitor matching value of the driver chip 1051 in each data interaction.

[0165] In an exemplary implementation, such as Figures 4a-4b As shown, each interaction unit 1011 can be equipped with a matching resistor-capacitor circuit 106 to adjust the field strength energy emitted by each interaction unit 1011 so that the field strength energy emitted by each interaction unit is within a preset range.

[0166] In an exemplary implementation, such as Figures 4a-4b As shown, a matching resistor-capacitor circuit 106 can be set between each interaction module 1011 and the switch module 102.

[0167] In an exemplary implementation, such as Figure 4c As shown, each matching resistor-capacitor circuit 106 includes a first parallel capacitor circuit 1061, a second parallel capacitor circuit 1062, a series resistor circuit 1063, and a parallel resistor circuit 1064.

[0168] The first parallel capacitor circuit 1061 includes a first capacitor C1 and a second capacitor C2 connected in parallel. One end is connected to the antenna ANT in the interaction unit 1011, and the other end is connected to the series resistor circuit 1063.

[0169] The second parallel capacitor circuit 1062 includes a third capacitor C3 and a fourth capacitor C4 connected in parallel, one end of which is connected to the first resistor R1 and the other end is grounded.

[0170] The series resistor circuit 1063 includes a first resistor R1, one end of which is connected to the first parallel capacitor circuit 1061, and the other end is grounded.

[0171] The parallel resistor circuit 1064 includes a second resistor R2, which is connected in parallel with the second parallel capacitor circuit 1062.

[0172] In an exemplary embodiment, the matching resistor-capacitor circuit 106 can be combined with the capacitor matching circuit 1053 and the resistor-capacitor circuit 1055 to ensure that the field strength energy emitted by the interaction unit 1011 is within a preset range. Based on the matching resistor-capacitor circuit 106, the field strength energy emitted by the driver chip 1051 is further refined. For example, if the initial setting of the matching resistor-capacitor circuit 106 results in an insufficiently refined range of field strength energy emitted by the interaction unit 1011, the range can be further refined by optimizing the matching resistor-capacitor circuit 106, thereby ensuring that incorrect or unrecognizable interaction objects are avoided.

[0173] In an exemplary embodiment, the antenna in the interaction unit 1011 can be designed by calculating the antenna inductance according to Formula 1:

[0174] Formula 1:

[0175]

[0176] In Formula 1: I1 is the length of one loop of wire used to fabricate the antenna in the interactive unit 1011; D1 is the diameter of the wire used to fabricate the antenna or the width of the wire used to fabricate the antenna on the printed circuit board (PCB); K is a constant, K = 1.47 when the antenna structure is a square antenna, and K = 1.07 when the antenna structure is a loop antenna; N1 is the number of turns in the antenna coil; ln is the natural logarithm function. The actual value of the antenna inductance L1 is determined by factors such as the antenna structure, the diameter or width D1 of the wire used to fabricate the antenna, the distance between the antenna coils, and the shielding layer. When the antenna is fabricated on a PCB, the determining factors for the actual value of the antenna inductance L1 may include the type of PCB. In an exemplary embodiment, the actual value of the antenna inductance L1 can be determined by the shielding layer and the surrounding metal. In an exemplary embodiment, the value of the antenna inductance L1 can be adjusted by adjusting one or more of the above-mentioned D1, I1, the antenna structure, the distance between the antenna coils, and the shielding layer.

[0177] In an exemplary embodiment, the actual value of the antenna inductance L1 can be calculated using Formula 1, or it can be tested using a vector network analyzer (VNA). In an exemplary embodiment, the antenna inductance obtained through VNA testing can be used as the standard, or the final antenna inductance value can be determined by combining the tested antenna inductance value with the antenna inductance value calculated using Formula 1.

[0178] In an exemplary embodiment, it can be achieved by... Figure 4c The matching resistor-capacitor circuit 106 shown adjusts the field strength energy transmitted by the antenna in the interaction unit 1011. For example... Figure 5a The diagram shows the logic of the combination of the antenna and the matching RC circuit 106 in the interaction unit 1011. The sine wave emitted by the antenna in the interaction unit 1011 can be represented by U = Um * Sin(2π * f * t), where U represents voltage, Um represents the maximum voltage value, t represents time, and f represents frequency. In one exemplary embodiment, the value of frequency f can be 13.56 MHz.

[0179] exist Figure 5a In the logic diagram shown, C11, R11, and L11 are the equivalent capacitance, equivalent resistance, and equivalent inductance of the antenna in the interaction unit 1011, respectively. Z0 is the impedance before the antenna impedance matching RC point P (i.e., Z0 is the equivalent resistance of the driving module 105 and the switching module 102). The impedance of the antenna and the overall impedance of the matching RC circuit 106 are denoted as Zeq. To ensure the antenna's transmission energy and efficiency, impedance Z0 and impedance Zeq are set as conjugate matches. In an exemplary embodiment, the value of impedance Z0 is 40 ohms to 60 ohms, so the value of impedance Zeq can also be 40 ohms to 60 ohms; for example, the value of impedance Z0 is 50 ohms, and the value of impedance Zeq is 50 ohms.

[0180] In an exemplary embodiment, Figure 5a In the logic diagram shown, capacitors Cp and Cs can be adjusted according to formulas 2 and 3:

[0181] Formula 2:

[0182]

[0183] Formula 3:

[0184]

[0185] Where Zeq = Req + jXeq, Ztarget = Rtarget + jXtarget, j is the unit of the imaginary number, Req and Xeq are the real and imaginary parts at the working frequency of 13.56 MHz as measured by a vector network analyzer, Rtarget and Xtarget are the actual target real and target imaginary parts to be debugged, W = 2*π*f, and the frequency f is set to 13.56 MHz;

[0186] In an exemplary implementation, Cp can be the smaller value. After determining CP and Cs... Figure 5a The logic diagram can be equivalent to Figure 5b The circuit diagram shown can be used to calculate Xeq' according to Formula 4;

[0187] Formula 4:

[0188]

[0189] According to Formula 4, Xeq' and Req' = Rtarget are calculated.

[0190] The antenna's field strength energy (peak-to-peak value) VPP can be calculated using Equation 5:

[0191] Formula 5:

[0192] To ensure that the field strength energy Vpp transmitted by the antenna in each interactive unit is consistent, the value of capacitor Cp needs to be adjusted. To ensure that Xtarget = 0, Cs can be adjusted according to formula 3.

[0193] In the exemplary embodiment, for ease of debugging, Figure 5a The capacitor Cp in the middle can be used Figure 4c Adjust the capacitors C3 and C4 at two points. Figure 5a The capacitor Cs in the middle can be used Figure 4c Adjust the capacitors C1 and C2 at two points. Figure 5e The diagram shows the equivalent circuit schematic of connecting the matching resistor-capacitor circuit 106 between the antenna in the switching module 102 and the interaction unit 1011.

[0194] In an exemplary embodiment, to facilitate adjustment of the antenna's quality factor Q, the following is used: Figure 4c R1 in the figure is used as the adjustment point for the series resistor. Figure 4c R2 in the figure serves as the adjustment point for the parallel resistor. In the exemplary embodiment, the resistance values ​​and the number of resistors in the series resistor circuit 1063 and the parallel resistor circuit 1064 can be set according to actual conditions, wherein Z0 is the equivalent resistance of the drive module 105 and the switch module 102.

[0195] When the interaction module 101 has multiple interaction units 1011, such as Figures 5c-5d As shown, for the antenna in one of the interaction units 1011, if the antenna's transmission energy is too low, the interactive object will not be easily recognized, resulting in an obstacle to data interaction between the interactive object and the interaction unit 1011; for example... Figure 5d As shown, if the antenna field strength energy in interaction unit 1011 is too high, magnetic leakage will occur, leading to the incorrect identification of other interaction objects. Ultimately, interaction unit 1011 will send the interaction information of the incorrect interaction object to control module 104, and control module 104 will trigger corresponding operations based on the information related to the incorrect interaction object. Therefore, in order to ensure that each interaction unit 1011 can stably identify the corresponding interaction object and communicate normally with it, it is essential to adjust the antenna field strength energy of each interaction unit 1011 in interaction module 101 to be consistent.

[0196] In the exemplary embodiments of this disclosure, the above-described Figures 4a-4b By adjusting the antenna field strength transmission energy in the interaction unit 1011 through the matching resistor-capacitor circuit 106, or by setting the resistor-capacitor matching value of the driver chip 1051 according to the saved resistor-capacitor value of the corresponding interaction unit 1011 during each data interaction by the control device 104, both methods can ensure that the field strength transmission energy of the antenna in the interaction unit 1011 is consistent, achieving stable identification of the interaction object and normal data interaction with the interaction object. When the application scenario changes, it is not necessary to replace the interaction device; only the matching resistor-capacitor circuit 106 or only the resistor-capacitor matching value of the driver module 105 needs to be adjusted, thus avoiding waste of the interaction device.

[0197] In the scheme of setting the resistance and capacitance values ​​of the drive module 105 through the control module 104, when the application scenario changes, there is no need to adjust the hardware of the interactive device; only the software needs to be adjusted to adapt to different application scenarios.

[0198] In an exemplary implementation, such as Figure 6a As shown, the data interaction device 10 may include a display module 107;

[0199] The control module 104 can be connected to the display module 107 and is configured to control the display module 107 to display based on data interaction information;

[0200] The display module 107 is connected to the control module 104 and is configured to display under the control of the control module 104.

[0201] For example, the control module 104 can call up the corresponding audio-visual files according to the data interaction information and control the display module 107 to display them; or the control module 104 can perform corresponding calculations according to the data interaction information to obtain corresponding calculation results, save the calculation results, and display the calculation results through the display module 107.

[0202] In an exemplary embodiment, the data interaction device 10 may include a main control board 108, on which the control module 104 and the drive module 105 may be mounted. In some exemplary embodiments, the control chip for the display module 107 and its backlight, as well as the control chip for the positioning module 103, may be mounted on the main control board. Integrating the control chips of all modules in the data interaction device 10 onto the main control board facilitates the maintenance and management of multiple module control chips, such as... Figure 6b The diagram shows the structure of an interactive device 10. 1071 is the backlight of the display module 107, 1072 is the display panel of the display module 107, and 108 is the main control board. Figure 6b In the structure shown, the display panel 1072 can integrate the interactive module 101.

[0203] In an exemplary embodiment, the data interaction device 10 may include a protective housing 109. In one exemplary embodiment, such as... Figure 6c As shown, the structure of the data interaction device 10 includes, on one side of the protective shell 109, a drive module 105, a control module 104, a backlight 1071 of the display module 107, a display panel 1072 in the display module 107, and a positioning module 103, wherein the display panel 1072 or the drive module 105 can integrate the interaction unit 1011 in the interaction module 101.

[0204] In an exemplary embodiment, the interaction module 101 is configured with multiple membrane layers, and each interaction unit 1011 includes an antenna coil. In the interaction module 101, the antenna coils of two adjacent interaction units 1011 are located in different membrane layers, and the orthographic projection of the area enclosed by the antenna coils of two adjacent interaction units 1011 onto the plane of one of the membrane layers has an overlapping area.

[0205] In an exemplary embodiment, the antenna coil in the interaction unit 1011 is wound in a rectangular manner. In another exemplary embodiment, to facilitate modulation of the antenna coil in the interaction unit 1011, the antenna coil is wound in a square manner. In some exemplary embodiments, the antenna coil in the interaction unit 1011 may use other winding shapes, such as circular winding structures, which are not limited herein.

[0206] In an exemplary embodiment, the interaction module 101 is configured with four membrane layers, such as... Figure 7a As shown, the antenna coils in the four adjacent interactive units 1011 are respectively disposed on the four film layers. The orthographic projection of the area enclosed by the antenna coils in two adjacent interactive units 1011 onto the plane of one of the film layers has a first overlapping area B1, and the orthographic projection of the area enclosed by the antenna coils in the four adjacent interactive units 1011 onto the plane of one of the film layers has a second overlapping area B2.

[0207] In an exemplary embodiment, adjacent interactive units 1011 have a first overlapping region B1 and a second overlapping region B2 on the orthographic projection of one of their film layers. This allows the interactive device 10 to recognize the interactive object in all areas where it interacts with the interactive object, ensuring that each area is covered by an antenna coil. In an exemplary embodiment, the interactive device includes a display module 107, where the display area of ​​the display module 107 is set to the position corresponding to the multiple antenna coils in the interactive module 101. The orthographic projection of the antenna coils in adjacent interactive units 1011 on a certain film layer has a first overlapping region B1 and a second overlapping region B2, ensuring that every location within the display area is covered by a coil.

[0208] In an exemplary embodiment, the antenna coils on each membrane layer in the interaction module 101 are arranged at intervals to avoid mutual interference between antenna coils on the same layer during operation.

[0209] In an exemplary embodiment, the length of the second overlapping region along the first direction X does not exceed 1 / 6 of the side length of a single coil along the first direction; the length of the second overlapping region along the second direction Y does not exceed 1 / 6 of the side length of a single coil along the second direction Y. The length of the first overlapping region B1 formed by the antenna coils arranged along the second direction Y does not exceed 1 / 6 of the side length of a single antenna coil along the second direction Y; the length of the first overlapping region B1 formed by the antenna coils arranged along the first direction X does not exceed 1 / 6 of the side length of a single antenna coil along the first direction X.

[0210] like Figure 7a As shown, in the interaction module 101, the four adjacent coils are the first coil ANT1, the first coil ANT2, the first coil ANT3, and the first coil ANT4. A1, A2, A3, and A4 are the regions where the orthographic projections of the four adjacent coils ANT1, ANT2, ANT3, and ANT4 on the plane of one of the film layers do not overlap.

[0211] In an exemplary implementation, such as Figure 7c-7fAs shown, the four membrane layers include a first membrane layer 101-1, a second membrane layer 101-2, a third membrane layer 101-3, and a fourth membrane layer 101-4 stacked together. Multiple first coils ANT1 are arranged in an array along the first direction X and the second direction Y in the first membrane layer 101-1; multiple second coils ANT2 are arranged in an array along the first direction X and the second direction Y in the second membrane layer 101-2; multiple third coils ANT2 are arranged in an array along the first direction X and the second direction Y in the third membrane layer 101-3; and multiple fourth coils ANT2 are arranged in an array along the first direction X and the second direction Y in the fourth membrane layer 101-4. The first membrane layer 101-1, the second membrane layer 101-2, the third membrane layer 101-3, and the fourth membrane layer 101-4 are stacked together to form four membrane layers 1010-1. Figure 7h As shown Figure 7c A cross-sectional view along M1-M1. Figure 7i for Figure 7c A cross-sectional view along M2-M2. Figure 7j As shown Figure 7c A cross-sectional view along line M3-M3. Figure 7k As shown Figure 7c A cross-sectional view along the M4-M4 axis.

[0212] In an exemplary embodiment, multiple antenna coils can be fabricated on a single film layer, and an insulating layer can be provided between the multiple antenna coils to avoid interference between adjacent antenna coils.

[0213] The following explanation uses an interaction module 101 configured with four membrane layers. The interaction module 101 includes 48 interaction units 1011, and the 48 antenna coils corresponding to these 48 interaction units 1011 are arranged in a 6x8 array as an example. Figure 7b The image shown is a schematic diagram of the planar structure of the 6*8 antenna coil array area in the interaction module 101. Figure 7c The diagram shown is a planar structural schematic of the 6*8 antenna coil array in the interaction module 101. Figure 7d The diagram shows the first coil ANT1 arranged in an array along the first direction X and the second direction Y on the first film layer 101-1. Figure 7e The diagram shows the second coil ANT2 arranged in an array along the first direction X and the second direction Y on the second film layer 101-2. Figure 7f The diagram shows the array arrangement of the third coil ANT3 along the first direction X and the second direction Y on the third film layer 101-3; Figure 7g The diagram shows the fourth coil ANT4 arranged in an array along the first direction X and the second direction Y on the fourth film layer 101-4; where, Figure 7d-7g A schematic diagram of the planar structure after four individual membrane layers are stacked is shown below. Figure 7c As shown.

[0214] In an exemplary embodiment, the interaction module 101 is configured as a single film layer 1010-2, and each interaction unit 1011 includes an antenna coil;

[0215] The antenna coils of two adjacent interactive units 1011 are stacked, and an insulating layer is provided between the stacked layers where the antenna coils of the two adjacent interactive units are located. The area enclosed by the antenna coils of the two adjacent interactive units overlaps in the orthographic projection of the plane where one of the stacked layers is located.

[0216] In an exemplary implementation, such as Figure 7m As shown, in the structure where the interaction module 101 is configured as a single film layer 1010-2, the antenna coils of the multiple interaction units 1011 are configured as four stacks. The antenna coils in the four adjacent interaction units are respectively configured on the four stacks. The orthographic projection of the area enclosed by the antenna coils in two adjacent interaction units onto the plane of one of the stacks has a third overlapping area B3. The orthographic projection of the area enclosed by the antenna coils in four adjacent interaction units onto the plane of one of the stacks has a fourth overlapping area B4.

[0217] In an exemplary embodiment, the antenna coil in the interaction unit 1011 adopts a rectangular winding method. The length of the fourth overlapping region B4 along the first direction X does not exceed 1 / 6 of the side length of a single antenna coil along the first direction; the length of the fourth overlapping region B4 along the second direction Y does not exceed 1 / 6 of the side length of a single antenna coil along the second direction. The length of the third overlapping region B3 formed by the antenna coils arranged along the second direction Y does not exceed 1 / 6 of the side length of a single antenna coil along the second direction Y; the length of the third overlapping region B3 formed by the antenna coils arranged along the first direction X does not exceed 1 / 6 of the side length of a single antenna coil along the first direction X.

[0218] In an exemplary implementation, such as Figures 7m-7sAs shown, the four stacked layers include a first stack 10101, a second stack 10102, a third stack 10103, and a fourth stack 10104 stacked together. The antenna coils in the four adjacent interactive units are the first coil ANT1, the second coil ANT2, the third coil ANT3, and the fourth coil ANT4, respectively. Multiple first coils ANT1 are arranged in an array at intervals along the first direction X and the second direction Y in the first stack 10101. Multiple second coils ANT2 are arranged in an array at intervals along the first direction X and the second direction Y in the second stack 10102. Multiple third coils ANT3 are arranged in an array at intervals along the first direction X and the second direction Y in the third stack 10103; multiple fourth coils ANT4 are arranged in an array at intervals along the first direction X and the second direction Y in the fourth stack 10104; a first insulating layer 1010-1 is provided between the first stack 10101 and the second stack 10102; a second insulating layer 1010-2 is provided between the second stack 10102 and the third stack 10103; and a third insulating layer 1010-3 is provided between the third stack 10103 and the fourth stack 10104.

[0219] Figure 7o The diagram shows the first coil ANT1 arranged in an array along the first direction X and the second direction Y on the first stack 10101; Figure 7p The diagram shows the second coil ANT2 arranged in an array along the first direction X and the second direction Y on the second stack 10102. Figure 7q The diagram shows the array arrangement of the third coil ANT3 along the first direction X and the second direction Y on the third stack 10103; Figure 7r The diagram shows the fourth coil ANT4 arranged in an array along the first direction X and the second direction Y on the fourth stack 10104; where, Figure 7o-7r A schematic diagram of the planar structure after four layers are stacked as follows: Figure 7n As shown. Figure 7s for Figure 7n A sectional view along M5-M5.

[0220] In an exemplary embodiment, adjacent interactive units 1011 have a third overlapping region B3 and a fourth overlapping region B4 on the orthographic projection of one of their stacked planes. This allows the interactive device 10 to recognize the interactive object in all areas where it interacts with the interactive object, ensuring that each area is covered by an antenna coil. In an exemplary embodiment, the interactive device includes a display module 107, where the display area of ​​the display module 107 is set to the position corresponding to the multiple antenna coils in the interactive module 101. The orthographic projection of the antenna coils in adjacent interactive units 1011 on a certain stacked layer has a third overlapping region B3 and a fourth overlapping region B4, ensuring that every location within the display area is covered by a coil.

[0221] In an exemplary embodiment, the antenna coils on each stack in the interaction module 101 are arranged at intervals to avoid mutual interference between antenna coils on the same layer during operation.

[0222] In some exemplary embodiments, Figures 7m-7s picture, Figures 7b-7k The antenna coil arrangement shown can be as follows: Figure 7a As shown, the four adjacent coils are the first coil ANT1, the first coil ANT2, the first coil ANT3, and the first coil ANT4. A1, A2, A3, and A4 are the regions where the orthographic projections of the four adjacent coils ANT1, ANT2, ANT3, and ANT4 on the plane of one of the films or stacks do not overlap.

[0223] In other implementations, Figures 7m-7s picture, Figures 7b-7k The antenna coil arrangement shown can be as follows: Figure 7u As shown, where Figure 7t and Figure 7l As shown Figure 7u A cross-sectional view of the structure shown along the second direction Y.

[0224] In an exemplary embodiment, the antenna arrangement in the interaction module 101 is not limited to having a first overlapping region B1, a second overlapping region B2, or a third overlapping region B3 and a fourth overlapping region B4 between adjacent antenna coils. It can be configured to have only the first overlapping region or the third overlapping region, or there may be no overlapping region between adjacent antenna coils. This disclosure does not limit this.

[0225] In an exemplary embodiment, the interaction module 101 can be configured as a film layer, and multiple antenna coils can be arranged in the same stack. The orthographic projections of adjacent antenna coils on the plane of the film layer do not overlap, so as to avoid mutual interference between adjacent antennas during operation.

[0226] In an exemplary embodiment, the multiple antenna coils corresponding to the multiple interaction units 1011 can be mounted on a PCB board. In practical applications, the antenna coils can be wound in a square manner, and the side length of the square antenna coil can be set to twice the recognizable distance when communicating with the interactive object. For example, if the recognizable distance between the PCB board and the interactive object is 20 mm, then the side length of the square antenna coil is set to 40 mm. In an exemplary embodiment, the recognizable distance can be the range within which the interactive device can interact normally with the interactive object. Within the recognizable distance range, the interactive device can communicate normally with the interactive object. When the distance between the interactive device and the interactive object exceeds the recognizable distance, there may be situations where the interactive object cannot be recognized or normal communication with the interactive object cannot occur.

[0227] In an exemplary embodiment, the positioning module 103 can employ optical touch control, such as infrared touch control. By using optical touch control for positioning, the positioning module 103 can function without metal, thereby avoiding interference when the interaction unit 1011 interacts with the data interaction object.

[0228] In an exemplary implementation, such as Figure 8a The diagram shows a cross-sectional view of the interactive device 10. The driving module 105 includes a driving module layer 105-1, the display module 107 includes a display module layer 107-1, and the positioning module 103 includes a positioning module layer 103-1. The driving module layer 105-1, display module layer 107-1, and positioning module layer 103 are arranged sequentially along the third direction Z. The positioning module layer 103-1 is located on the side of the display module layer 107-1 away from the driving module layer 105-1. Figure 8b The image shows a third-direction observation. Figure 8a The schematic diagram of the planar structure shows that the positioning module layer 103-1 includes multiple infrared receivers 1031 disposed at the edge of the display area of ​​the display module layer 107-1 and multiple infrared transmitters 1032 disposed one-to-one with the multiple infrared receivers 1031. Multiple interaction units 1011 can be disposed in the display module layer 107-1 or the driving module layer 105-1. The infrared transmitters 1032 and the infrared receivers 1031 form a positioning detection area in the interaction area of ​​the multiple interaction units 1011. The infrared transmitters 1032 are configured to transmit infrared signals to the infrared receivers 1031, and the infrared receivers 1031 are configured to receive the infrared signals transmitted by the corresponding infrared transmitters 1032. When the interactive object is located in the positioning detection area, the positioning information of the interactive object is generated and sent to the control module 104.

[0229] In an exemplary embodiment, the orthographic projections of the positioning detection area formed by the positioning module layer 103-1, the display area formed by the display module layer 107-1, and the interaction area formed by multiple interaction units in the interaction module on the plane where the display module layer 107-1 is located overlap each other.

[0230] exist Figure 8b In the structure shown, the infrared emitting end 1032 can be an infrared light emitting diode, and the infrared receiving end 1031 can be an infrared light photosensitive diode.

[0231] In an exemplary implementation, such as Figure 8cAs shown, the data interaction device 10 may include a protective layer 1073, and a positioning module layer 103-1 is disposed between the display module layer 107-1 and the protective layer 1073. The positioning module layer 103-1 is a flat infrared touch panel. In this structure, the material used to make the positioning module layer 103-1 may include a totally reflective transparent material. For example, the totally reflective transparent material may include, but is not limited to, Flatfrog in-glass touch. Multiple infrared emitters and multiple infrared receivers 1032 corresponding one-to-one with the multiple infrared emitters 1031 are disposed in the totally reflective transparent material. Figure 8d As shown, Figure 8c The diagram shows the working principle of the positioning module layer 103-1. The infrared emitting tube 1032 and the infrared receiving tube 1031 are located below the protective layer 1073. They project uniform infrared light onto the surface of the display module layer 107-1. When there is a touch, the infrared light at the corresponding position will weaken, thus the corresponding position can be detected.

[0232] In an exemplary embodiment, the light receiving end 1031 and light receiving end 1032 in the positioning module layer 103-1 are not limited to infrared receivers and infrared transmitters, or can be other light transmitters and receivers, as long as they can realize the positioning function of the positioning module 103.

[0233] In an exemplary implementation, such as Figure 8e-8f The diagram shows a cross-sectional view of the positioning module layer 103-1 integrated into the display module layer 107-1. The display module layer 107-1 includes a display substrate 1076 and a filter element 1075 disposed opposite each other. Multiple photosensitive elements 1074 are disposed on the display substrate. The positioning module layer 103-1 includes multiple photosensitive elements 1074. The orthographic projections of the photosensitive elements 1074 and multiple photosensitive areas 1077 on the filter element 1075 onto the display substrate 1076 at least partially overlap, or the photosensitive elements 1074 are disposed in the gaps between the multiple filter areas 1078 on the filter element 1075. Figure 8f As shown, when an interactive object approaches the display module layer 107-1, it blocks the light at the corresponding location. The photosensitive element 1074 senses the change in light, thereby achieving touch detection. The photosensitive element 1074 is pre-installed during the fabrication of the TFT substrate. Each element of the three primary colors (red, green, and blue) in the display module layer 107-1 can be equipped with a corresponding photosensitive element. The photosensitive element 1074 can generate a sensed current or a sensed voltage based on changes in light. When the ambient light changes, the controller or control module 104 in the positioning module 103 will determine whether the overall brightness has changed or the brightness of a local area has changed based on the sensed current or sensed voltage generated by the photosensitive element 1074. Figure 8fAs shown, when ambient light enters through the filter element 1075, if a certain area of ​​the display module layer 107-1 is blocked by an interactive object or other object, a shadow will be formed on the display module layer 107-1. The sensing current of the photosensitive element 1074 will change. The controller or control module 104 in the positioning module 103 determines whether the ambient light has changed as a whole or whether an object has blocked the light in a local area based on the current or voltage sensed by all the photosensitive elements 1074 in the display module layer 107-1. If the sensing current of all the photosensitive elements 1074 changes in the same or similar way, it can be determined that the ambient light has changed and no interactive object is approaching. If only the sensing current of a local photosensitive element 1074 changes, it can be determined that an interactive object is approaching. At this time, the positioning module 103 sends the corresponding positioning information to the control module 104, and the control module 104 controls the corresponding switch to open the target interactive unit. When the target interactive unit detects that there is an interactive object, it performs data interaction with the interactive object.

[0234] In an exemplary embodiment, the interaction module layer 101-11 can be disposed on the driving module layer 105-1, and the driving module layer 105-1 is disposed on the side of the display module layer 107-1 away from the positioning module layer 103-1, such as... Figure 8a , 8c As shown in Figure 8e; or the interaction module layer 101-11 can be integrated into the display module layer 107-1; or the interaction module layer 101-11 can be positioned between the display module layer 107-1 and the driver module layer 105-1, as shown in Figure 8e. Figure 8g As shown.

[0235] In an exemplary embodiment, both the positioning module layer 103-1 and the interaction module layer 101-11 can be integrated onto the display module layer 107-1 to reduce the manufacturing cost of the interactive device 10.

[0236] In an exemplary implementation, such as Figure 8a , 8c As shown in 8e and 8g, the data interaction device 10 has a protective layer 1073 on the third-direction side of the display film layer 107-1. The protective layer 1073 can prevent damage to the glass in the display module layer 107-1 and can also prevent glass reflection.

[0237] In an exemplary embodiment, the switch module 102 may be fabricated on the interaction module layer 101-11 or on the driver module layer 105-1, and this disclosure does not limit it.

[0238] In an exemplary implementation, such as Figure 8a , 8cAs shown in 8e and 8g, the data interaction device 10 may include an optical film layer 110, which is located on the side opposite to the third direction of the display module layer 107-1.

[0239] In an exemplary implementation, such as Figure 8a , 8c As shown in Figures 8e and 8g, the data interaction device 10 may include a fixing module 111, which is configured to fix the optical film layer 110. The fixing module 111 is made of metal. In order to avoid the metal from interfering with the antenna coil in the interaction module 1011 during data interaction, the area corresponding to the antenna coil in the fixing module 111 and the interaction module 101 is configured as a hollow structure.

[0240] In an exemplary embodiment, the driving module 105 may be a PCB-based driving board or a PET-based driving board.

[0241] One application scenario of the data interaction device 10 provided in this disclosure is as follows: the interaction object is a card carrying an NFC antenna coil. The data interaction device 10 displays corresponding information through the display module 107. When the card approaches a certain display area in the display module 107, the positioning module 103 feeds back positioning information to the control module 104. The control module 104 controls the opening of the switch of the target interaction unit corresponding to the positioning information. The driving module 105 drives the target interaction unit to perform data interaction with the interaction object and feeds back the data interaction information to the control module 104. The control module 104 performs corresponding operations according to the data interaction information and can control the display module 107 to display the results of the corresponding operations. For example, in teaching applications, the operation performed by the control module 104 can be to call up experimental data or related audiovisual teaching materials corresponding to the data interaction information and display them through the display module 107. To illustrate using a chemical experiment: When two cards are placed simultaneously or sequentially in two or the same display area of ​​the display module 107, the control module 104 acquires the data interaction information of the two cards. The data interaction information corresponding to the two cards includes hydrogen and oxygen and their corresponding contents. The control module 104 can then call the corresponding chemical lesson plan based on the two data interaction information to display the chemical reaction of hydrogen and oxygen to produce water, and display the corresponding chemical data or chemical formulas through the display module 107.

[0242] By conducting teaching activities using the data interaction device 10 provided in this disclosure, the amount of experimental equipment and chemical materials required for experiments can be reduced, teaching expenses can be saved, one or more dangers encountered in chemical experiments can be avoided, and teaching safety can be improved.

[0243] In another application scenario, the data interaction device 10 can be used in cultural and recreational activities or competitive games. For example, when playing Go or chess, the positioning module 103 can locate the piece, and multiple interaction units 1011 can determine the placement of a piece. The control module 104 records the piece's position information based on the data interaction information fed back by the interaction units 1011. By tracking the piece's position information, it can determine the winner between the two players and display the final result through the display module 107. In this application, the control module 104 can control the display module 107 to display previous records, allowing for review of records of cultural and recreational activities or competitive games, avoiding one or more drawbacks caused by human forgetting or recording errors.

[0244] In some application scenarios, each interactive object can be set with an identity document (ID) to identify its identity. The control module 104 performs corresponding operations based on the interactive object's ID information. For example, after obtaining the interactive object's ID information, the control module 104 can retrieve the corresponding teaching case and control the display module to display it, or perform calculations corresponding to the ID information and control the display module to display the calculation results. In this application scenario, different interactive objects have different ID information, and the control module performs pre-set operations corresponding to the ID information based on the different interactive object's ID information.

[0245] In other application scenarios, the control module 104 can be configured with execution operations corresponding to the position of each interaction unit. After the interaction object and the target interaction unit interact with each other, the data interaction information fed back to the control module can include information about the interaction object and the target interaction unit, or it can only include information about the target interaction unit. The control module can then perform operations according to the corresponding target interaction unit.

[0246] This disclosure also provides an electronic device, including the data interaction device described in any of the foregoing embodiments.

[0247] In an exemplary embodiment, the electronic device may be any product or component with data interaction function, such as a display panel, entertainment equipment, competition equipment, teaching equipment, chess and card table, teaching aids, experimental equipment, mobile phone, tablet computer, television, monitor, laptop computer, etc.

[0248] This disclosure also provides a data interaction method, applied to the data interaction device described in any of the above embodiments, the method comprising:

[0249] Step S1: When the interactive object is located in the location detection area, the location information of the interactive object is generated; the location detection area is formed by the location module, and the location module is set in the interaction area of ​​the interaction module;

[0250] Step S2: Determine the target switch unit and target interaction unit corresponding to the positioning information based on the positioning information; the target interaction unit is at least one of multiple interaction units in the interaction module, and the target switch unit is at least one of multiple switch units in the switch module;

[0251] Step S3: Control the target interaction unit to enter the interaction state through the target switch unit, drive the target interaction unit to perform data interaction with the interaction object, and obtain data interaction information from the interaction object.

[0252] In an exemplary embodiment, the data interaction method may include: setting a resistance-capacitance matching value according to the target interaction unit.

[0253] In an exemplary embodiment, setting the resistor-capacitor matching value according to the target interaction unit may include: searching for the target resistor-capacitor value corresponding to the target interaction unit from the resistor-capacitor value matching table, and setting the resistor-capacitor matching value of the driving module by adjusting the resistor-capacitor value adjustment point according to the target resistor-capacitor value.

[0254] This disclosure also provides a non-transient computer-readable storage medium configured to store computer program instructions, wherein the computer program instructions, when executed, can implement the data interaction method described in any of the above embodiments.

[0255] This disclosure provides a data device, its interaction method, electronic device, and storage medium. A positioning module feeds back the location information of an interactive object to a control module. The control module determines the corresponding target interaction unit based on the location information and controls a target switch unit corresponding to the target interaction unit to connect the target interaction unit to a driving module. Under the control of the control module, the driving module drives the target interaction unit to interact with the interactive object. When interaction is required, only the interaction switch corresponding to the area of ​​the interactive object is turned on, eliminating the need for the driving module to sequentially turn on each interaction unit through polling, thus saving data interaction time and improving data interaction efficiency. Multiple interaction units in the data interaction device are driven by only one driving module, thereby saving costs. When the data interaction device interacts with an interactive object, only one driving module operates, reducing power consumption.

[0256] It will be understood by those skilled in the art that all or some of the steps, systems, or apparatuses disclosed above, and their functional modules / units, can be implemented as software, firmware, hardware, or suitable combinations thereof. In hardware implementations, the division between functional modules / units mentioned above does not necessarily correspond to the division of physical components; for example, a physical component may have multiple functions, or a function or step may be performed collaboratively by several physical components. Some or all components may be implemented as software executed by a processor, such as a digital signal processor or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit (ASIC). Such software may be distributed on a computer-readable medium, which may include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and can be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media typically contain computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0257] The accompanying drawings of the embodiments disclosed herein only relate to the structures involved in the embodiments of this disclosure; other structures can be referred to in a general design.

[0258] Where there is no conflict, the features of the embodiments disclosed herein can be combined with each other to obtain new embodiments.

[0259] While the embodiments disclosed herein are as described above, the content is merely for the purpose of facilitating understanding of these embodiments and is not intended to limit them. Any person skilled in the art to which these embodiments pertain may make any modifications and changes to the form and details of the implementation without departing from the spirit and scope disclosed herein; however, the patent protection scope of these embodiments shall still be determined by the scope defined in the appended claims.

Claims

1. A data interaction device, comprising an interaction module, a switch module, a positioning module, a control module, and a drive module: The interaction module includes multiple interaction units, at least one of which is configured to interact with an interaction object within an interaction area; The switching module includes multiple switching units corresponding to the multiple interaction units, and each switching unit is configured to connect the interaction module and the driving module under the control of the control module. The positioning module is set in the interaction area of ​​the interaction module to form a positioning detection area in the interaction area, and is configured to generate positioning information of the interaction object when the interaction object is located in the positioning detection area. The control module is connected to the positioning module and the switch module, and is configured to determine the target switch unit and the target interaction unit corresponding to the positioning information according to the positioning information, and control the target switch unit to connect the target interaction unit to the drive module. The driving module is connected to the control module and the switch module, and is configured to drive the target interaction unit to perform data interaction with the interaction object, and send the data interaction information from the interaction object to the control module; the driving module includes a driving chip, a filter circuit, a capacitor matching circuit, a resistor-capacitor circuit, and a differential converter single-ended circuit; The driver chip includes two signal output terminals and one signal receiving terminal. The two signal output terminals are connected to a filter circuit, and the signal receiving terminal is connected to a resistor-capacitor circuit. It is configured to output two data signals to the filter circuit through the two signal output terminals; and receive data interaction information from the resistor-capacitor circuit through the one signal receiving terminal, and send the data interaction information to the control module. The filtering circuit includes two filtering sub-circuits. One end of each filtering sub-circuit is connected to the two signal output terminals of the driver chip, and the other end is connected to the capacitor matching circuit. The circuit is configured to filter the two data signals from the driver chip and send the filtered dual data signals to the capacitor matching circuit. The capacitor matching circuit is connected to the filter circuit, the differential converter single-ended circuit, and the RC circuit, and is configured to send the filtered dual-channel data signal to the differential converter single-ended circuit; and transmit the data interaction information from the differential converter single-ended circuit to the RC circuit. The RC circuit is connected to the driver chip and the capacitor matching circuit. It is configured to receive data interaction information from the capacitor matching circuit, adjust the data interaction information, and send the adjusted data interaction information to the signal receiving end of the driver chip. This enables the energy of the driver module to transmit and receive signals by adjusting the resistors and capacitors in the capacitor matching circuit and the RC circuit. The differential-to-single-ended circuit is connected to the capacitor matching circuit and the switching module, and is configured to process the dual-channel data signals into a single-channel signal and send the single-channel signal to the switching module; and send the data interaction information from the target interaction unit to the capacitor matching circuit.

2. The data interaction device according to claim 1, wherein, The drive module is equipped with resistance and capacitance adjustment points, and the control module or the drive module stores a resistance and capacitance matching table. The control module is configured to search for the target resistance and capacitance value corresponding to the target interaction unit from the resistance and capacitance value matching table, and adjust the resistance and capacitance value adjustment point to set the resistance and capacitance matching value of the drive module according to the target resistance and capacitance value.

3. The data interaction device according to claim 1, wherein a matching resistor-capacitor circuit is provided between each interaction unit and the switch module; the matching resistor-capacitor circuit includes a first parallel capacitor circuit, a second parallel capacitor circuit, a series resistor circuit, and a parallel resistor circuit; The first parallel capacitor circuit includes a first capacitor and a second capacitor connected in parallel, one end of which is connected to the antenna in the interaction unit, and the other end of which is connected to the series resistor circuit. The second parallel capacitor circuit includes a third capacitor and a fourth capacitor connected in parallel, one end of which is connected to the series resistor circuit, and the other end is grounded. The series resistor circuit includes a first resistor, one end of which is connected to the first parallel capacitor circuit, and the other end is grounded. The parallel resistor circuit includes a second resistor connected in parallel with the second parallel capacitor circuit.

4. The data interaction device according to claim 1, wherein, The differential-to-single-ended circuit includes a first signal channel and a second signal channel; the filtering circuit includes a first filtering sub-circuit and a second filtering sub-circuit; the capacitor matching circuit includes a first capacitor matching sub-circuit and a second capacitor matching sub-circuit; the driving chip includes a first signal output terminal, a second signal output terminal, and a signal receiving terminal. The first filter sub-circuit includes a first inductor and a fifth capacitor; one end of the first inductor is connected to the first signal output terminal of the driver chip, and the other end is connected to the fifth capacitor; one end of the fifth capacitor is connected to the first inductor and the first capacitor matching sub-circuit, and the other end is grounded. The second filter sub-circuit includes a second inductor and a sixth capacitor; one end of the second inductor is connected to the second signal output terminal of the driver chip, and the other end is connected to the sixth capacitor; One end of the sixth capacitor is connected to the second inductor and the matching sub-circuit of the second capacitor, and the other end is grounded; The first capacitor matching sub-circuit includes a seventh capacitor. One end of the seventh capacitor is connected to the first filter sub-circuit and the RC circuit, and the other end is connected to the first signal channel of the differential-to-single-ended circuit. The second capacitor matching sub-circuit includes an eighth capacitor, one end of which is connected to the second filter sub-circuit, and the other end of which is connected to the second signal channel of the differential-to-single-ended circuit. In the differential-to-single-ended circuit, one end of the first signal channel is connected to the first capacitor matching sub-circuit, and the other end is connected to the switching module; one end of the second signal channel is connected to the second capacitor matching sub-circuit, and the other end is grounded; the differential-to-single-ended circuit is configured to process the data signals of the two signal channels into a single signal, and send the single signal to the switching module. Receive data interaction information from the switch module and send the data interaction information to the resistor-capacitor circuit through the first signal channel; The RC circuit includes a ninth capacitor, a third resistor, a tenth capacitor, and a fourth resistor; one end of the ninth capacitor is connected to the third resistor, and the other end is grounded; one end of the third resistor is connected to the ninth capacitor, and the other end is connected to the signal receiving end of the driver chip and the tenth capacitor. One end of the tenth capacitor is connected to the signal receiving end of the driver chip, and the other end is connected to the fourth resistor; one end of the fourth resistor is connected to the tenth capacitor, and the other end is connected to the first capacitor matching sub-circuit; the resistor-capacitor circuit is configured to adjust the data interaction information from the first capacitor matching sub-circuit and send the adjusted data interaction information to the signal receiving end of the driver chip.

5. The data interaction device according to claim 1 further includes a display module; The control module is also connected to the display module and is configured to control the display module to display based on the data interaction information. The display module is connected to the control module and is configured to display under the control of the control module.

6. The data interaction device according to claim 5, wherein, The driving module includes a driving module layer, the display module includes a display module layer, and the positioning module includes a positioning module layer; The driving module layer, the display module layer, and the positioning module layer are arranged sequentially along a third direction. The positioning module layer includes multiple infrared receivers and multiple infrared transmitters that are arranged one-to-one with the multiple infrared receivers. Alternatively, the interactive device may further include a protective layer, with the positioning module layer disposed between the protective layer and the display module layer. The positioning module layer includes a totally reflective transparent material, multiple infrared receivers, and multiple infrared emitters that correspond one-to-one with the multiple infrared receivers. The multiple infrared emitters and the multiple infrared receivers are disposed within the totally reflective transparent material. Alternatively, the display module layer includes a display substrate and a filter element disposed opposite to each other. The display substrate is provided with a plurality of photosensitive elements, and the positioning module layer includes the plurality of photosensitive elements. The plurality of photosensitive elements and the orthographic projection of a plurality of photosensitive areas on the filter element on the display substrate at least partially overlap.

7. The data interaction device according to any one of claims 1 to 6, wherein, The interaction module is configured with multiple membrane layers, and each interaction unit includes an antenna coil. In the interaction module, the antenna coils of two adjacent interaction units are located in different film layers, and the regions enclosed by the antenna coils of two adjacent interaction units have an overlapping area in the orthographic projection of the plane where one of the film layers is located.

8. The data interaction device according to claim 7, wherein, The interaction module is configured with four membrane layers. The antenna coils of the four adjacent interaction units are respectively disposed on the four membrane layers. The orthographic projection of the area enclosed by the antenna coils of two adjacent interaction units onto the plane of one of the membrane layers has a first overlapping area. The orthographic projection of the area enclosed by the antenna coils of four adjacent interaction units onto the plane of one of the membrane layers has a second overlapping area.

9. The data interaction device according to claim 8, wherein, The antenna coil in the interaction unit adopts a rectangular winding method; The length of the first overlapping region formed by the antenna coils arranged along the second direction along the second direction does not exceed 1 / 6 of the length of the side of a single antenna coil along the second direction; The length of the first overlapping region formed by the antenna coils arranged along the first direction does not exceed 1 / 6 of the side length of a single antenna coil along the first direction; the length of the second overlapping region along the first direction does not exceed 1 / 6 of the side length of a single antenna coil along the first direction; and the length of the second overlapping region along the second direction does not exceed 1 / 6 of the side length of a single antenna coil along the second direction.

10. The data interaction device according to claim 8, wherein, The four membrane layers include a first membrane layer, a second membrane layer, a third membrane layer, and a fourth membrane layer stacked together. The antenna coils in the four adjacent interactive units are respectively a first coil, a second coil, a third coil, and a fourth coil. A plurality of first coils are arranged in an array at intervals along a first direction and a second direction on the first membrane layer. A plurality of second coils are arranged in an array at intervals along a first direction and a second direction on the second membrane layer. A plurality of third coils are arranged in an array at intervals along a first direction and a second direction on the third membrane layer. A plurality of fourth coils are arranged in an array at intervals along a first direction and a second direction on the fourth membrane layer.

11. The data interaction device according to any one of claims 1 to 6, wherein, The interaction module is configured as a single-film layer, and each interaction unit includes an antenna coil; In the interaction module, the antenna coils of two adjacent interaction units are stacked, and an insulating layer is provided between the stacks of the antenna coils of the two adjacent interaction units. The regions enclosed by the antenna coils of the two adjacent interaction units have an overlapping area in the orthographic projection of the plane of one of the stacks.

12. The data interaction device according to claim 11, wherein the antenna coils of the plurality of interaction units are configured as four stacks, the antenna coils of four adjacent interaction units are respectively disposed on the four stacks, the orthographic projection of the area enclosed by the antenna coils of two adjacent interaction units onto the plane of one of the stacks has a third overlapping area, and the orthographic projection of the area enclosed by the antenna coils of four adjacent interaction units onto the plane of one of the stacks has a fourth overlapping area.

13. The data interaction device according to claim 12, wherein, The antenna coil in the interaction unit adopts a rectangular winding method; The length of the third overlapping region formed by the antenna coils arranged along the second direction along the second direction does not exceed 1 / 6 of the side length of a single antenna coil along the second direction; the length of the third overlapping region formed by the antenna coils arranged along the first direction along the first direction does not exceed 1 / 6 of the side length of a single antenna coil along the first direction; the length of the fourth overlapping region along the first direction does not exceed 1 / 6 of the side length of a single antenna coil along the first direction; the length of the fourth overlapping region along the second direction does not exceed 1 / 6 of the side length of a single antenna coil along the second direction.

14. The data interaction device according to claim 12, wherein, The four stacked layers include a first stack, a second stack, a third stack, and a fourth stack, which are stacked together. The antenna coils in the four adjacent interactive units are respectively a first coil, a second coil, a third coil, and a fourth coil. A plurality of first coils are arranged in an array at intervals along a first direction and a second direction in the first stack. A plurality of second coils are arranged in an array at intervals along a first direction and a second direction in the second stack. A plurality of third coils are arranged in an array at intervals along a first direction and a second direction in the third stack. A plurality of fourth coils are arranged in an array at intervals along a first direction and a second direction in the fourth stack. A first insulating layer is provided between the first stack and the second stack. A second insulating layer is provided between the second stack and the third stack. A third insulating layer is provided between the third stack and the fourth stack.

15. The data interaction device according to any one of claims 1 to 6, wherein the switch module comprises a main switch module and a sub-switch module, wherein: The main switch module includes multiple main switch units, and each main switch unit is connected to at least one sub-switch unit among the control module, the drive module, and the sub-switch module. The sub-switch module includes multiple sub-switch units, each of which is connected to the control module, a main switch unit, and an interaction unit. The control module is connected to the positioning module and the multiple main switch units and multiple sub-switch units in the switch module. It is configured to determine the sub-switch unit and target interaction unit corresponding to the positioning information according to the positioning information, and use the determined sub-switch unit as the target switch unit. It controls the target switch unit and the main switch unit corresponding to the target switch unit to connect the target interaction unit to the drive module. The driving module is connected to multiple main switch units in the control module and the main switch module, and is configured to drive the target interaction unit to perform data interaction with the interaction object under the control of the control module.

16. An electronic device comprising a data interaction device as described in any one of claims 1 to 15.

17. A data interaction method, applied to the data interaction apparatus as described in any one of claims 1 to 15, comprising: When the interactive object is located in the location detection area, the location information of the interactive object is generated; The positioning detection area is formed by the positioning module, which is located in the interaction area of ​​the interaction module. The target switch unit and the target interaction unit corresponding to the location information are determined based on the location information; the target interaction unit is at least one of a plurality of interaction units in the interaction module, and the target switch unit is at least one of a plurality of switch units in the switch module; The target switching unit controls the target interaction unit to enter the interaction state, drives the target interaction unit to perform data interaction with the interaction object, and obtains data interaction information from the interaction object.

18. The data interaction method according to claim 17, further comprising: Set the resistance-capacitance matching value according to the target interaction unit.

19. A non-transient computer-readable storage medium, the storage medium being configured to store computer program instructions, wherein, When the computer program instructions are executed, they can implement the data interaction method described in any one of claims 17 to 18.

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