Reconfigurable metasurface based on microfluidics and its control method

Abstract

The present invention relates to the field of artificial electromagnetic material technology, and in particular to a reconfigurable metasurface based on microfluidics and a control method thereof. The reconfigurable metasurface based on microfluidics is sequentially provided with a driving layer, a configuration layer, an elastic film layer and a film deformation accommodating layer along a preset direction; a driving channel and a filling channel are provided in the driving layer; a resonant cavity is provided in the configuration layer, and the resonant cavity is connected to the driving channel and the filling channel; a deformation cavity is provided in the film deformation accommodating layer, and the deformation cavity is used to accommodate the deformed elastic film layer. In the present invention, when the driving liquid in the driving channel enters the resonant cavity, the proportion of the conductive liquid in the resonant cavity is reduced, resulting in a change in the unit structure of the metasurface. At the same time, the unit structure of the metasurface can be changed only because the elastic film layer can be deformed. The present invention can enable microfluidic technology to construct a more complex metasurface configuration.

Description

Technical Field

[0001] The present invention relates to the technical field of artificial electromagnetic materials, and in particular to a microfluidics-based reconfigurable supersurface and a control method thereof. Background Art

[0002] A metasurface is an artificial surface with a periodic subwavelength conductor-dielectric structure. Depending on the structure, it has different reflection, transmission, phase, amplitude, and polarization responses to electromagnetic waves in the corresponding band, thereby achieving the regulation of electromagnetic waves. Therefore, metasurfaces have broad application potential in the fields of stealth and communication.

[0003] At present, the periodic structures on the metasurface are mostly fixed, which means that the ability to control electromagnetic waves is fixed and it is difficult to cope with complex and changing environments. People are gradually shifting their attention to the design of reconfigurable metasurfaces. Reconfigurable metasurfaces can actively change the structure or physical parameters of the conductor-dielectric to change the response of electromagnetic waves. From the perspective of changing the structure of the conductor-dielectric, there are currently designs based on MEMS movable cantilever beams. Through methods such as thermal stress, the morphology of the cantilever beam is adjusted to change the electromagnetic response characteristics of the metasurface; there are also many achievements in the research of metasurfaces based on varactor diodes. The electrical connection structure of the conductor unit is changed by turning the diode on and off, thereby switching the electromagnetic response mode. From the perspective of changing the physical parameters of the conductor-dielectric, there are currently changes in the electromagnetic response by changing the dielectric constant, conductivity and other parameters of the dielectric or conductor through light, heat, chemistry and other stimuli. For example, vanadium dioxide can undergo a metal-insulator property transition at a certain temperature.

[0004] However, there are many problems in the above technologies. For example, the switchable states of the diode-based metasurface are discontinuous, and the number of states depends on the number of diodes in a unit. In the methods of inducing structural or physical property transformation through optical effects, thermal effects, chemical reactions, etc., due to the influence of related parameters such as thermal conductivity, the response of the metasurface has obvious hysteresis, and there are also significant difficulties in the precise control of the stimulus source. Moreover, the above methods all have the problem of narrow tunable frequency band of electromagnetic waves. At present, methods for constructing reconfigurable metasurfaces based on microfluidic manipulation of conductive liquids such as liquid metals have gradually emerged. Liquids can be continuously adjustable over a large range, which means that the response characteristics of electromagnetic waves can be continuously switched within a wide frequency band, which has great application potential. However, this technology involves a complex fluid network, so it is currently difficult to construct a metasurface configuration with a more complex structure, which limits the further development and application of microfluidic metasurfaces. Summary of the invention

[0005] The purpose of the present invention is to at least solve the problem that microfluidic technology is difficult to construct a super surface configuration with a relatively complex structure. This purpose is achieved through the following technical solutions:

[0006] The first aspect of the present invention proposes a reconfigurable metasurface based on microfluidics, wherein the reconfigurable metasurface based on microfluidics is sequentially provided with a driving layer, a configuration layer, an elastic film layer and a film deformation accommodating layer along a preset direction;

[0007] A driving channel and a filling channel are provided in the driving layer, and the driving channel and the filling channel are used to be filled with a driving liquid;

[0008] A resonant cavity is provided in the configuration layer, the resonant cavity is communicated with both the driving channel and the filling channel, and the resonant cavity is used to fill the conductive liquid and / or the driving liquid;

[0009] A deformation cavity is arranged in the accommodating film deformation layer, and the deformation cavity is used to accommodate the deformed elastic film layer.

[0010] According to the reconfigurable metasurface based on microfluidics of the present invention, a resonant cavity is provided in the configuration layer, and the resonant cavity is filled with a conductive liquid. When the driving liquid in the driving channel enters the resonant cavity, the proportion of the conductive liquid in the resonant cavity is reduced, resulting in a change in the unit structure of the metasurface. At the same time, because the configuration layer is combined with the elastic film layer, the elastic film layer can be deformed, so that the unit structure of the metasurface can be changed. In addition, a thin film deformation accommodating layer that can accommodate the deformation of the elastic film layer is also provided on one side of the elastic film layer, so that the elastic film layer can be deformed. Through the structural setting of the reconfigurable metasurface based on microfluidics of the present invention, microfluidic technology can construct a more complex metasurface configuration, thereby improving the practicality of the microfluidic metasurface.

[0011] In addition, the microfluidic-based reconfigurable metasurface according to the present invention may also have the following additional technical features:

[0012] In some embodiments of the present invention, a first through hole is provided between the resonant cavity and the driving channel, and the first through hole is used to connect the driving channel with the resonant cavity. A second through hole is provided between the resonant cavity and the filling channel, and the second through hole is used to connect the filling channel with the resonant cavity. The axes of the first through hole and the second through hole are parallel to a preset direction.

[0013] In some embodiments of the present invention, there are multiple resonant cavities, and the multiple resonant cavities are connected through multiple filling channels.

[0014] In some embodiments of the present invention, the first through hole is disposed at an end of the resonant cavity.

[0015] In some embodiments of the present invention, the second through hole is disposed at the endpoints, centroids, symmetry axes, central axes or geometric intersections of the plurality of resonant cavities.

[0016] In some embodiments of the present invention, the number of the driving channels is at least two, and at least two of the driving channels are connected in parallel or independently.

[0017] In some embodiments of the present invention, the elastic film layer is made of polydimethylsiloxane, Eco-flex or natural rubber;

[0018] The driving layer, the configuration layer and the thin film deformation accommodating layer are made of glass, silicon, polydimethylsiloxane, Eco-flex, polymethyl methacrylate, polycarbonate or cycloolefin copolymer.

[0019] In some embodiments of the present invention, the conductive liquid is liquid metal, ionic liquid, water or electrolyte solution, and the conductive liquid is immiscible with the driving liquid.

[0020] In some embodiments of the present invention, the deformation cavity is filled with gas.

[0021] The second aspect of the present invention proposes a control method of a microfluidic-based reconfigurable metasurface, which is used to control the above-mentioned microfluidic-based reconfigurable metasurface, comprising the following steps:

[0022] Filling the deformation cavity with gas;

[0023] Injecting the driving liquid along the filling channel and filling the filling channel, the resonant cavity and the driving channel;

[0024] Injecting conductive liquid along the filling channel to discharge part of the driving liquid from the driving channel;

[0025] Injecting driving liquid along the filling channel to make part of the conductive liquid in the filling channel be discharged or flow into the resonant cavity;

[0026] The filling channel is sealed, and the driving channel is injected with driving liquid, so that the ratio between the conductive liquid and the driving liquid in the resonant cavity is changed, thereby changing the configuration formed by the conductive liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference numerals are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0028] Figure 1 The schematic diagram of the structure of a reconfigurable metasurface based on microfluidics according to an embodiment of the present invention is schematically shown;

[0029] Figure 2The flowchart of the control method of the reconfigurable metasurface based on microfluidics according to the embodiment of the present invention is schematically shown;

[0030] Figure 3 The schematic diagram of the microfluidic layout of the reconfigurable metasurface based on microfluidics according to the embodiment of the present invention when the microfluidic is driven in single-side parallel connection is shown schematically;

[0031] Figure 4 The schematic diagram of the microfluidic layout of the reconfigurable metasurface based on microfluidics according to the embodiment of the present invention when the microfluidic is driven in bilateral parallel is shown;

[0032] Figure 5 The schematic diagram of the microfluidic layout of the reconfigurable metasurface based on microfluidics according to the embodiment of the present invention when one side is independently driven is shown;

[0033] Figure 6 The schematic diagram of the microfluidic layout of the reconfigurable metasurface based on microfluidics according to the embodiment of the present invention when the two sides are independently driven is shown;

[0034] Figure 7 Schematically shows a schematic diagram of a microfluidic layout of a complex configuration a of a reconfigurable metasurface based on microfluidics according to an embodiment of the present invention;

[0035] Figure 8 Schematically shows a schematic diagram of a microfluidic layout of a complex configuration b of a reconfigurable metasurface based on microfluidics according to an embodiment of the present invention;

[0036] Fig. 9 Schematically shows a schematic diagram of a microfluidic layout of a complex configuration c of a reconfigurable metasurface based on microfluidics according to an embodiment of the present invention;

[0037] Fig.10 Schematically shows a schematic diagram of a microfluidic layout of a complex configuration d of a reconfigurable metasurface based on microfluidics according to an embodiment of the present invention;

[0038] Fig.11 Schematically shows a schematic diagram of a microfluidic layout of a complex configuration e of a reconfigurable metasurface based on microfluidics according to an embodiment of the present invention;

[0039] Fig.12 Schematically shows a schematic diagram of a microfluidic layout of a complex configuration f of a reconfigurable metasurface based on microfluidics according to an embodiment of the present invention;

[0040] Fig.13 Schematically shows a schematic diagram of a microfluidic layout of a complex configuration g of a reconfigurable metasurface based on microfluidics according to an embodiment of the present invention;

[0041] Fig.14 Schematically shows a schematic diagram of a microfluidic layout of a complex configuration h of a reconfigurable metasurface based on microfluidics according to an embodiment of the present invention;

[0042] Fig.15 A schematic diagram of the microfluidic layout of a complex configuration i of a microfluidic-based reconfigurable metasurface according to an embodiment of the present invention is schematically shown.

[0043] The reference numerals are as follows:

[0044] 10 is a driving layer, 11 is a driving channel, and 12 is a filling channel;

[0045] 20 is a configuration layer, 21 is a first through hole, 22 is a resonant cavity, and 23 is a second through hole;

[0046] 30 is an elastic film layer;

[0047] 40 is a film deformation accommodating layer, and 41 is a deformation cavity. DETAILED DESCRIPTION

[0048] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0049] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0050] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0051] For ease of description, spatial relative terms may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure is turned over, then the elements described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." can include both upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or in other directions) and the spatial relative descriptors used in the text are interpreted accordingly.

[0052] like Figure 1 As shown, according to an embodiment of the present invention, a microfluidics-based reconfigurable metasurface is proposed, wherein the microfluidics-based reconfigurable metasurface is sequentially provided with a driving layer 10, a configuration layer 20, an elastic film layer 30 and a film deformation accommodating layer 40 along a preset direction.

[0053] A driving channel 11 and a filling channel 12 are provided in the driving layer 10 , and the driving channel 11 and the filling channel 12 are used to be filled with a driving liquid.

[0054] A resonant cavity 22 is provided in the configuration layer 20 . The resonant cavity 22 is connected to both the driving channel 11 and the filling channel 12 . The resonant cavity 22 is used to be filled with the conductive liquid and the driving liquid.

[0055] A deformation cavity 41 is disposed in the accommodating film deformation layer 40 , and the deformation cavity 41 is used to accommodate the deformed elastic film layer 30 .

[0056] It can be understood that, in the working state, the connection between the resonant cavity 22 and the filling channel 12 is cut off, and the driving liquid is injected into the resonant cavity 22 along the driving channel 11. When the driving liquid flows into the resonant cavity 22, due to the mutual cooperation between the elastic film layer 30 and the accommodating film deformation layer 40, the elastic film layer 30 is recessed downward, and the volume of the resonant cavity 22 increases, resulting in a decrease in the proportion of the conductive liquid in the resonant cavity 22, causing a change in the configuration of the metasurface unit.

[0057] It can be understood that the reconfigurable metasurface based on microfluidics of this embodiment has a resonant cavity 22 in the configuration layer 20, and the resonant cavity 22 is filled with a conductive liquid. When the driving liquid in the driving channel 11 enters the resonant cavity 22, the proportion of the conductive liquid in the resonant cavity 22 is reduced, resulting in a change in the unit structure of the metasurface. At the same time, because the configuration layer 20 is combined with the elastic film layer 30, the elastic film layer 30 can be deformed, so that the unit structure of the metasurface can be changed. In addition, a thin film deformation accommodating layer 40 that can accommodate the deformation of the elastic film layer 30 is also provided on one side of the elastic film layer 30, so that the elastic film layer 30 can be deformed. Through the structural setting of the reconfigurable metasurface based on microfluidics of the present invention, microfluidic technology can construct a more complex metasurface configuration, thereby improving the practicality of the microfluidic metasurface.

[0058] In some embodiments, a first through hole 21 is provided between the resonant cavity 22 and the driving channel 11, and the first through hole 21 is used to connect the resonant cavity 22 with the driving channel 11. A second through hole 23 is provided between the resonant cavity 22 and the filling channel 12, and the second through hole 23 is used to connect the resonant cavity 22 with the filling channel 12. The axes of the first through hole 21 and the second through hole 23 are both parallel to the preset direction. This means that the first opening is perpendicular to the horizontal plane of the configuration layer 20 along the preset direction, and the second opening is also perpendicular to the horizontal plane of the configuration layer 20 along the preset direction. In this way, the driving liquid can flow quickly to the resonant cavity 22, and when the driving liquid enters the resonant cavity 22 and contacts the conductive liquid interface, the structure of the metasurface changes. That is, when the driving liquid flows quickly to the resonant cavity 22, the reconstruction of the metasurface becomes faster accordingly.

[0059] In some embodiments, Figures 3 to 6 As shown, there are multiple resonant cavities 22, and the multiple resonant cavities 22 are connected by filling channels 12. The multiple resonant cavities 22 form an array or a complex structure in the configuration layer 20. The structure of the resonant cavity 22 itself can also be a complex structure to improve the practicality of the reconfigurable metasurface.

[0060] It is understandable that if Figure 3 and Figure 5As shown, it is the case of single-sided drive. The filling channel 12 is arranged at one end of the resonant cavity 22 for filling the resonant cavity 22 array with conductive liquid. The drive channel 11 is arranged at the other end of the resonant cavity 22. In the case of parallel drive (as Figure 3 shown), the ends of each resonant cavity 22 are connected to the same drive channel 11 and merged into a main path. In the case of independent drive (as Figure 5 shown), the ends of each resonant cavity 22 are all connected to a drive channel 11 to draw the drive liquid from their respective drive channels 11.

[0061] It can be understood that, as Figure 4 and Figure 6 shown, it is the case of double-sided drive. The filling channel 12 is arranged at the midpoint, centroid, its axis of symmetry, central axis or geometric intersection of the resonant cavity 22. The filling channel 12 is connected to the corresponding resonant cavity 22 for filling the resonant cavity 22 array. The drive channel 11 is arranged at the two ends of the resonant cavity 22 (as Figure 4 shown). In the case of parallel drive, the drive channels 11 at the ends of the resonant cavity 22 are merged into a main path. In the case of independent drive (as Figure 6 shown), the drive channels 11 at the ends of the resonant cavity 22 are drawn out separately.

[0062] It can be understood that, as Figures 7 to 15 shown, various complex configurations of the resonant cavity 22 are shown to illustrate the generality of the present invention, including the "cross" shape, "L" shape, "U" shape, two Jerusalem shapes, "卐" shape, single-sided open ring, double-sided open ring, double-sided open nested shape resonant cavity 22, generally covering the main configurations currently studied in metasurfaces. The upper part of each subfigure shows the unit configuration, and the lower part shows the array configuration of multi-sided parallel drive. The layout ideas of the drive channel 11 and the filling channel 12 in the above configurations are the same as those in Figures 3 to 6 , that is, the filling channel 12 is arranged at the end point, centroid or its axis of symmetry, central axis and geometric intersection of the resonant cavity 22, and the drive channel 11 is drawn out along both sides of the second through hole 23 and merged into a main path. For independent drive at each end inside the resonant cavity 22 or independent drive between each resonant cavity 22, the drive channel 11 does not need to be merged into a main path and can be directly drawn out along both sides of the second through hole 23 to connect to the drive source.

[0063] In some embodiments, the first through hole 21 is arranged at the end of the resonant cavity 22. Since the structure of the resonant cavity 22 is different, the end position of the resonant cavity 22 needs to be determined according to the different structures of the resonant cavity 22 itself.

[0064] In some embodiments, the second through hole 23 is disposed at the end point, centroid, symmetry axis, medial axis or geometric intersection of each resonant cavity 22. Complex resonant cavities 22 correspond to different second through holes 23 locations, in order to make the filling liquid more fully filled, and when the second through holes 23 are disposed at appropriate locations, the filling liquid filling efficiency is also accelerated. Such a layout method of the second through holes 23 can be applied to resonant cavities 22 of any configuration.

[0065] It can be understood that the number of the driving channels 11 is at least two, and at least two of the driving channels 11 are connected in parallel or independently. Figures 3 to 6 The driving mode of the driving channel 11 can be selected according to different driving requirements of different reconfigurable metasurfaces.

[0066] It is understood that the elastic film layer 30 is made of elastic materials including but not limited to polydimethylsiloxane, Eco-flex (aliphatic aromatic random copolyester), natural rubber, etc. The driving layer 10, the configuration layer 20 and the accommodating film deformation layer 40 are made of inorganic or organic materials including but not limited to glass, silicon, polydimethylsiloxane, Eco-flex (aliphatic aromatic random copolyester), polymethyl methacrylate, polycarbonate, cycloolefin copolymer, etc.

[0067] It is understood that the driving liquid can be, but is not limited to, inorganic or organic liquids such as water, electrolyte solution, silicone oil, fluorinated liquid, etc. The conductive liquid can be, but is not limited to, liquids such as liquid metal, ionic liquid, water or electrolyte solution. However, the conductive liquid and the driving liquid must not be miscible.

[0068] It is understandable that the deformation cavity 41 also has a filling medium, and the filling medium can be various gases, such as air, nitrogen or helium.

[0069] In some embodiments, the processing methods of the driving layer 10, the super surface configuration layer 20, the elastic film layer 30 and the accommodating film deformation layer 40 include but are not limited to soft lithography, laser etching, plasma etching, etc. Their assembly methods include but are not limited to bonding or adhesive methods.

[0070] In addition, if Figure 2 As shown, S1 to S5 in the figure correspond to the states of the microfluidic-based reconfigurable metasurface in the following steps respectively. The present invention also provides a control method of the microfluidic-based reconfigurable metasurface, which is used to control the above-mentioned microfluidic-based reconfigurable metasurface, comprising the following steps:

[0071] Filling the deformation cavity 41 with gas;

[0072] Inject the driving liquid along the filling channel 12 and fill the filling channel 12, the resonance cavity 22 and the driving channel 11;

[0073] Conductive liquid is injected along the filling channel 12, and the driving liquid is discharged from the driving channel 11;

[0074] Injecting driving liquid along the filling channel 12 to discharge the conductive liquid in the filling channel 12 or to flow into the resonant cavity 22;

[0075] The filling channel 12 is sealed, and the driving liquid is injected along the driving channel 11 to change the ratio between the conductive liquid and the driving liquid in the resonance cavity 22, thereby changing the configuration formed by the conductive liquid.

[0076] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A reconfigurable metasurface based on microfluidics, characterized in that: The microfluidics-based reconfigurable metasurface is provided with a driving layer, a configuration layer, an elastic film layer and a film deformation accommodating layer in sequence along a preset direction; A driving channel and a filling channel are provided in the driving layer, and the driving channel and the filling channel are used to be filled with a driving liquid; A resonant cavity is provided in the configuration layer, the resonant cavity is communicated with both the driving channel and the filling channel, and the resonant cavity is used to fill the conductive liquid and the driving liquid; The elastic film layer is combined with the configuration layer, and the elastic film layer can be deformed; A deformation cavity is arranged in the accommodating film deformation layer, and the deformation cavity is used to accommodate the deformed elastic film layer.

2. The microfluidic-based reconfigurable metasurface according to claim 1, characterized in that: A first through hole is provided between the resonant cavity and the driving channel, and the first through hole is used to connect the driving channel with the resonant cavity. A second through hole is provided between the resonant cavity and the filling channel, and the second through hole is used to connect the filling channel with the resonant cavity. The axes of the first through hole and the second through hole are parallel to a preset direction.

3. The microfluidic-based reconfigurable metasurface according to claim 2, characterized in that: There are multiple resonant cavities, and the multiple resonant cavities are connected through multiple filling channels.

4. The microfluidic-based reconfigurable metasurface according to claim 3, characterized in that: The first through hole is arranged at the end of the resonant cavity.

5. The microfluidic-based reconfigurable metasurface according to claim 3, characterized in that: The second through hole is arranged at an end point, a centroid, a symmetry axis, a central axis or a geometric intersection of each of the resonant cavities.

6. The microfluidic-based reconfigurable metasurface according to claim 1, characterized in that: The number of the driving channels is at least two, and at least two of the driving channels are connected in parallel or independently.

7. The microfluidic-based reconfigurable metasurface according to claim 1, characterized in that: The elastic film layer is made of polydimethylsiloxane, Eco-flex or natural rubber; The driving layer, the configuration layer and the thin film deformation accommodating layer are made of glass, silicon, polydimethylsiloxane, Eco-flex, polymethyl methacrylate, polycarbonate or cycloolefin copolymer.

8. The microfluidic-based reconfigurable metasurface according to claim 1, characterized in that: The conductive liquid is liquid metal, ionic liquid, water or electrolyte solution, and the conductive liquid is immiscible with the driving liquid.

9. The microfluidic-based reconfigurable metasurface according to claim 1, characterized in that: The deformation cavity is filled with gas.

10. A control method for a microfluidic-based reconfigurable metasurface, used to control the microfluidic-based reconfigurable metasurface according to any one of claims 1 to 9, characterized in that: The steps include: Filling the deformation cavity with gas; Injecting the driving liquid along the filling channel and filling the filling channel, the resonant cavity and the driving channel; Injecting conductive liquid along the filling channel to discharge part of the driving liquid from the driving channel; Injecting driving liquid along the filling channel to make part of the conductive liquid in the filling channel be discharged or flow into the resonant cavity; The filling channel is sealed, and the driving channel is injected with driving liquid, so that the ratio between the conductive liquid and the driving liquid in the resonant cavity is changed, thereby changing the configuration formed by the conductive liquid.

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