A display panel, a manufacturing method thereof and a display device

Abstract

The disclosed embodiments disclose a display panel, a manufacturing method thereof and a display device, comprising: a substrate, the display panel having a through hole penetrating the substrate in the thickness direction, the substrate having a display area and a through hole packaging area between the display area and the through hole; a first source-drain metal layer, located on one side of the substrate, and located in the display area; a second source-drain metal layer, located on a side of the first source-drain metal layer away from the substrate, and located in the display area; at least one isolation column, located on one side of the substrate, and located in the through hole packaging area, and arranged around the through hole; wherein the isolation column and the second source-drain metal layer are arranged in different layers.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel, a manufacturing method thereof, and a display device. Background Art

[0002] In related technologies, display panels with full-screen design are becoming more and more popular among consumers. The full-screen is a panel architecture that adopts an ultra-narrow bezel design on all sides, combined with a hole in the display area to place devices such as cameras. The full-screen is the panel architecture with the highest display screen ratio. Summary of the invention

[0003] The embodiments of the present disclosure provide a display panel, a manufacturing method thereof, and a display device, which are used to solve serious problems such as severe corrosion and bubble formation of isolation columns around the full-screen camera hole area.

[0004] A display panel provided by an embodiment of the present disclosure includes:

[0005] A base substrate, wherein the display panel has a through hole penetrating the base substrate in a thickness direction, and the base substrate has a display area and a through hole packaging area located between the display area and the through hole;

[0006] A first source-drain metal layer, located on one side of the substrate;

[0007] A second source-drain metal layer is located on a side of the first source-drain metal layer away from the substrate;

[0008] At least one isolation column is located on one side of the substrate, in the through-hole packaging area, and is arranged around the through-hole; wherein the isolation column and the second source-drain metal layer are arranged in different layers.

[0009] Optionally, in the above-mentioned display panel provided by an embodiment of the present disclosure, the isolation column and the first source-drain metal layer are provided in the same layer and with the same material.

[0010] Optionally, the above-mentioned display panel provided in the embodiment of the present disclosure further includes: at least one transparent routing layer located on the side of the second source / drain metal layer away from the base substrate, and an anode located on the side of the transparent routing layer away from the base substrate; the orthographic projection of the transparent routing layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate, and the orthographic projection of the anode on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate.

[0011] Optionally, the above-mentioned display panel provided in the embodiment of the present disclosure further includes: a first passivation layer located between the second source-drain metal layer and the first source-drain metal layer, and a first flat layer located between the first passivation layer and the second source-drain metal layer; the orthographic projection of the first flat layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate, the first passivation layer covers the through-hole packaging area, and the orthographic projection of the first passivation layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate.

[0012] Optionally, the display panel provided in the embodiment of the present disclosure further includes: a second passivation layer located between the transparent wiring layer and the anode, and the orthographic projection of the second passivation layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate.

[0013] Optionally, in the above-mentioned display panel provided in the embodiment of the present disclosure, it further includes: at least one transparent wiring layer located on the side of the second source-drain metal layer away from the base substrate, an anode located on the side of the transparent wiring layer away from the base substrate, and a first film layer located between the transparent wiring layer and the anode; the orthographic projection of the transparent wiring layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate, and the orthographic projection of the anode on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate;

[0014] The isolation column and the first film layer are provided in the same layer and with the same material.

[0015] Optionally, in the above-mentioned display panel provided by the embodiment of the present disclosure, the material of the first film layer is the same as the material of the first source-drain metal layer, or the material of the first film layer is a negative photoresist.

[0016] Optionally, in the above-mentioned display panel provided by the embodiment of the present disclosure, it also includes: at least one transparent wiring layer located on the side of the second source-drain metal layer away from the base substrate, an anode located on the side of the transparent wiring layer away from the base substrate, a second flat layer located between the transparent wiring layer and the second source-drain metal layer, and a negative photoresist layer located between the second source-drain metal layer and the second flat layer; the orthographic projection of the transparent wiring layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate, and the orthographic projection of the anode on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate;

[0017] The isolation column and the negative photoresist layer are provided in the same layer and with the same material.

[0018] Optionally, the display panel provided in the embodiment of the present disclosure further includes: a first planarization layer located between the first source-drain metal layer and the second source-drain metal layer.

[0019] Optionally, in the above-mentioned display panel provided by the embodiment of the present disclosure, when the material of the isolation column is a negative photoresist, it also includes: a first passivation layer located between the first flat layer and the first source and drain metal layer, the first passivation layer covers the through-hole packaging area, and the orthographic projection of the first passivation layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate.

[0020] Optionally, in the above-mentioned display panel provided by the embodiment of the present disclosure, it further comprises: a light-emitting layer located on a side of the anode away from the base substrate, a cathode located on a side of the light-emitting layer away from the base substrate, and an encapsulation layer located on a side of the cathode away from the base substrate; the light-emitting layer is disconnected at the position of the isolation column;

[0021] The encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer that are stacked, wherein the orthographic projections of the first inorganic layer, the organic layer, and the second inorganic layer on the base substrate all cover the display area and the through-hole encapsulation area.

[0022] Correspondingly, an embodiment of the present disclosure further provides a display device, comprising any of the display panels described above.

[0023] Accordingly, an embodiment of the present disclosure further provides a method for manufacturing any of the display panels described above, comprising:

[0024] Providing a base substrate, the base substrate having a display area, a through hole area, and a through hole packaging area located between the display area and the through hole area;

[0025] forming a first source-drain metal layer on one side of the substrate;

[0026] forming a second source-drain metal layer on a side of the first source-drain metal layer away from the substrate;

[0027] At least one isolation column is formed on one side of the through-hole packaging area of ​​the substrate substrate and is arranged around the through-hole area, wherein the isolation column and the second source-drain metal layer are arranged in different layers;

[0028] The through hole region is cut to form a through hole.

[0029] Optionally, in the above manufacturing method provided by the embodiment of the present disclosure, at least one isolation column arranged around the through-hole area is formed on one side of the through-hole packaging area of ​​the substrate substrate, specifically comprising:

[0030] The first source-drain metal layer is formed in the display area and the isolation column is formed in the through-hole packaging area through a single patterning process.

[0031] Optionally, in the above manufacturing method provided in the embodiment of the present disclosure, after forming the first source-drain metal layer and before forming the second source-drain metal layer, it further includes: forming a first passivation film layer and a first flat film layer, and patterning the first flat film layer to form a first flat layer; the orthographic projection of the first flat layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate;

[0032] After forming the second source-drain metal layer, the method further includes:

[0033] At least one transparent wiring layer is formed; the orthographic projection of the transparent wiring layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate;

[0034] Forming a second passivation film layer on a side of the transparent wiring layer away from the base substrate;

[0035] The first passivation film layer and the second passivation film layer are patterned by a single patterning process to form a first passivation layer and the second passivation film layer is completely removed; the first passivation layer covers the through-hole packaging area, and the orthographic projection of the first passivation layer on the substrate does not overlap with the orthographic projection of the isolation column on the substrate; or, the first passivation film layer and the second passivation film layer are patterned by a single patterning process to form a first passivation layer and a second passivation layer; the first passivation layer covers the through-hole packaging area, and the orthographic projection of the first passivation layer on the substrate does not overlap with the orthographic projection of the isolation column on the substrate, and the orthographic projection of the second passivation layer on the substrate does not overlap with the orthographic projection of the isolation column on the substrate.

[0036] Optionally, in the above manufacturing method provided by the embodiment of the present disclosure, after forming the first source-drain metal layer and before forming the second source-drain metal layer, the method further includes: forming a first flat layer; the orthographic projection of the first flat layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate;

[0037] After forming the second source-drain metal layer, the method further includes: forming at least one transparent wiring layer; the orthographic projection of the transparent wiring layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate;

[0038] At least one isolation column is formed on one side of the through-hole packaging area of ​​the substrate substrate and is arranged around the through-hole area, specifically comprising:

[0039] Forming a first material film layer having the same material as that of the first source-drain metal layer on a side of the transparent wiring layer away from the base substrate;

[0040] The first material film layer is patterned to form a first film layer located in the display area and an isolation column located in the through-hole packaging area.

[0041] Optionally, in the above manufacturing method provided by the embodiment of the present disclosure, after forming the first source-drain metal layer and before forming the second source-drain metal layer, it further includes: forming a first passivation layer and a first planarization layer; the orthographic projection of the first passivation layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate, and the orthographic projection of the first planarization layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate;

[0042] After forming the second source-drain metal layer, the method further includes: forming at least one transparent wiring layer; the orthographic projection of the transparent wiring layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate;

[0043] At least one isolation column is formed on one side of the through-hole packaging area of ​​the substrate substrate and is arranged around the through-hole area, specifically comprising:

[0044] Forming a second material film layer of negative photoresist on a side of the transparent wiring layer away from the base substrate;

[0045] The second material film layer is patterned to form a first film layer located in the display area and an isolation column located in the through-hole packaging area. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 is a schematic diagram of a top view structure of a display panel;

[0047] Figure 2 for Figure 1 An enlarged schematic diagram of the through-hole packaging area;

[0048] Figure 3 for Figure 2 Layout diagram of the DD' direction;

[0049] Figure 4 It is a structural schematic diagram of a display panel in the related art;

[0050] Figure 5 is a structural schematic diagram of another display panel in the related art;

[0051] Fig. 6A is a structural schematic diagram of another display panel in the related art;

[0052] Figure 6B It is a schematic diagram of the structure of transparent routing;

[0053] Figure 7 is a structural schematic diagram of another display panel in the related art;

[0054] Figure 8 A schematic diagram of bubbles generated in an isolation column region in the related art;

[0055] Fig. 9 for Figure 1 A schematic cross-sectional view of the middle display area;

[0056] Figure 10-Figure 19 A schematic diagram of the structure of a display panel provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0057] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the display panel, its manufacturing method and the specific implementation of the display device provided by the embodiment of the present disclosure are described in detail below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described below are only used to illustrate and explain the present disclosure, and are not used to limit the present disclosure. In addition, the embodiments in this application and the features in the embodiments can be combined with each other if there is no conflict.

[0058] The thickness, size and shape of each film layer in the drawings do not reflect the actual proportion of the display panel, and the purpose is only to illustrate the contents of the present disclosure.

[0059] With the rapid development and application of active-matrix organic light emitting diode (AMOLED), current flexible mobile phone displays can be divided into the following types according to the placement of the camera underneath: notch screen, AA hole screen / blind hole screen and the most popular underdisplay camera (UDC) screen.

[0060] However, although the current under-screen camera is considered to be the most advanced full-screen camera technology in the development of AMOLED technology, the development of this technology is still limited by defects such as low transmittance of the camera hole, low life of the luminous pixels, and poor photo display effect. Therefore, a TOF facial unlocking technology that combines UDC technology with face unlocking and AA hole technology for camera photography, namely "under-screen TOF + AA hole" technology, was proposed. Figure 1As shown, an AA hole camera through hole 01 is set in the display area AA of the display panel, and an under-screen TOF face unlocking transmitting hole 02 and a receiving hole 03 are set on both sides of the through hole 01. The application of this technology integrates the most cutting-edge under-screen camera technology and the most mature and widely used AAhole camera photography technology.

[0061] Specifically, Figure 1 As shown, there is a through hole packaging area BB between the display area AA and the through hole 01, such as Figure 2 and Figure 3 As shown, Figure 2 for Figure 1 An enlarged schematic diagram of the through-hole packaging area BB, Figure 3 for Figure 2 Schematic diagram of layout along DD' direction, the through-hole packaging area BB includes: at least one crack dam 04 (Crack Dam) arranged around the through-hole 01, a dam 05 (Dam) arranged around the crack dam 04, at least one isolation column 06 arranged around the dam 05, and a routing 07 located outside the isolation column 06; wherein, the through-hole 01 is used to place a camera, the crack dam 04 is used to prevent the cracks generated when digging the through-hole 01 from digging to the display area AA, the dam 05 is used to prevent the organic layer in the packaging layer from flowing to the through-hole 01, and the isolation column 06 is used to isolate the light-emitting layer to prevent water vapor at the through-hole 01 from entering the display area AA from the light-emitting layer. Since the through-hole 01 is dug in the display area AA, the routing 07 (such as the data line) originally arranged in the through-hole 01 needs to bypass the through-hole 01.

[0062] In the related art, the isolation column structure of the conventional AA Hole product is as follows: Figure 4 and Figure 5 As shown, Figure 4 and Figure 5 for Figure 1 The schematic cross-sectional view along the CC' direction in FIG. 1 includes a base substrate 10, an inorganic film layer 20 (barrier layer + buffer layer) sequentially stacked on the base substrate 10, a gate insulating layer 30 (e.g., a first gate insulating layer, a second gate insulating layer, and a third gate insulating layer), an interlayer insulating layer 40, a first source-drain metal layer (not shown), a first flat layer (not shown), a second source-drain metal layer 50 (Ti / Al / Ti sandwich structure), and a second flat layer 60. The isolation column 06 is designed with the second source-drain metal layer 50, that is, a Ti / Al / Ti film layer is evaporated, and the isolation column 06 and the second source-drain metal layer 50 are formed by dry etching. The through-hole packaging area BB only illustrates the isolation column 06, and the isolation column 06 is generally designed as an undercut structure. Figure 4In the process, a metal film layer 70 for making an anode is evaporated on the second flat layer 60, a first photoresist 80 is coated on the metal film layer 70, the first photoresist 80 is exposed and developed, and the metal film layer 70 is wet-etched to form an anode (not shown) in the display area AA, and the metal film layer 70 in the remaining area is removed. Since the wet etching solution of the metal film layer 70 is a dilute acid, the Al in the isolation column 06 (Ti / Al / Ti sandwich structure) is etched during the etching process, thereby forming an isolation column 06 with an undercut structure, as shown in FIG. Figure 5 As shown, the bottom Ti layer is represented by 061, the Al layer is represented by 062, and the top Ti layer is represented by 063. Figure 4 and Figure 5 The structure is an isolation column 06 made of a display screen that does not currently use the TOF face unlocking design. However, for a display screen that uses the TOF face unlocking design, that is, the "under-screen TOF+AA hole" technology, the receiving hole 02 and the transmitting hole 03 of the under-screen TOF technology retain the light-emitting device to emit light, but the driving circuit that drives the light-emitting device to emit light is moved to the display area AA or the frame area. The driving circuit is electrically connected to the anode of the light-emitting device through a transparent wiring (such as ITO), and the transparent wiring is located between the anode and the second source and drain layer. In order to avoid the space occupied by the transparent wiring, multi-layer transparent wiring is generally used, such as Fig. 6A As shown, for example, it also includes three layers of transparent wiring ( Fig. 6A (not shown), flat layers (such as a third flat layer 90, a fourth flat layer 100 and a fifth flat layer 110) are respectively arranged between the film layers where the transparent wirings are located. Figure 6B As shown, Figure 6B for Figure 1 Schematic diagram of pixel arrangement of the emission hole 02, wherein the emission hole 02 includes a plurality of pixel units P, each pixel unit P includes a light-emitting device, and the light-emitting device includes a stacked anode, a light-emitting layer and a cathode. The driving circuit for driving the light-emitting device in the pixel unit P to emit light is moved to the display area AA or the frame area, and the anode of the light-emitting device is electrically connected to the peripheral driving circuit through a transparent wiring 300. Figure 6B Only one layer of transparent wiring is shown. Of course, in order to save wiring space, it is not limited to one layer of transparent wiring, and it can be two or three layers of transparent wiring... However, since the transparent wiring used to improve the transmittance can only be carried out by wet etching, and the wet etching solution is similar to the anode wet etching solution, both of which use dilute acid. Therefore, the etching solution used in the process of forming the transparent wiring will inevitably corrode the Al in the isolation column 06 (Ti / Al / Ti sandwich structure), thereby causing serious corrosion to the isolation column 06 during the transparent wiring and subsequent processes (anode etching) (such as Figure 7 As shown) and a bubble is formed at the AA Hole position (as shown Figure 8As shown in the figure, major problems such as the under-screen camera and the AA hole isolation column design are difficult to implement.

[0063] In order to solve the problem of severe corrosion of the isolation column and formation of a bubble at the AA Hole position in the transparent wiring etching process in the "under-screen TOF+AA hole" technology, the present disclosure provides a display panel such as Figure 1 , Figure 3 , Fig.12 , Fig.15 , Fig.17 , Fig.18 As shown, Fig.12 , Fig.15 , Fig.17 and Fig.18 They are Figure 1 The cross-sectional schematic diagram along the CC' direction in FIG. 1 is a schematic diagram of a through-hole packaging area BB, in which only isolation columns are shown. The display panel includes:

[0064] The base substrate 10, the display panel has a through hole 01 penetrating the base substrate 10 in the thickness direction, the base substrate 10 has a display area AA and a through hole packaging area BB located between the display area AA and the through hole 01;

[0065] A first source-drain metal layer 11 is located on one side of the substrate;

[0066] The second source-drain metal layer 50 is located on a side of the first source-drain metal layer 11 away from the substrate 10;

[0067] At least one isolation column 06 , the present disclosure takes two isolation columns 06 as an example, the isolation column 06 is located on one side of the substrate 10 , located in the through hole packaging area BB, and arranged around the through hole 01 ; wherein the isolation column 06 and the second source-drain metal layer 50 are arranged in different layers.

[0068] The display panel provided by the embodiment of the present disclosure is configured such that the isolation column 06 is configured in a different layer from the second source-drain metal layer 50, that is, the isolation column 06 and the second source-drain metal layer 50 are located in different layers, so that the isolation column 06 and the first source-drain metal layer 11 are configured in the same layer, and then a passivation layer is deposited on the side of the first source-drain metal layer 11 away from the substrate 10 to protect the isolation column 06, and then subsequent processes such as etching of multi-layer transparent wiring in the under-screen TOF technology are performed. The provision of the passivation layer can avoid the problem of serious corrosion of the Al layer of the isolation column during the etching of the transparent wiring. After the etching of the transparent wiring is completed, the passivation layer protecting the isolation column 06 is removed, and then anodic etching is performed. During the anodic etching process, the isolation column 06 is protected. The Al layer in the column 06 is etched, thereby forming an isolation column of an undercut structure; in addition, the isolation column 06 can also be arranged in the same layer as the film layer (such as the third source-drain metal layer, etc.) located on the side of the second source-drain metal layer 50 away from the substrate 10, and the third source-drain metal layer is arranged to be located on the side of the multi-layer transparent wiring away from the substrate 10, that is, after the transparent wiring is etched, the isolation column 06 is made while making the third source-drain metal layer, thereby avoiding the problem of severe corrosion of the Al layer of the isolation column during the etching of the transparent wiring, and then anodic etching is performed, and the Al layer in the isolation column 06 is etched during the anodic etching process, thereby forming an isolation column of an undercut structure. Therefore, the display panel provided by the embodiment of the present disclosure can avoid the problem of severe corrosion of the isolation column 06 during the etching of the transparent wiring in the "under-screen TOF+AA hole" technology and avoid the undesirable problem of forming a bubble at the AA Hole position.

[0069] like Fig. 9 As shown, Fig. 9 for Figure 1 A schematic cross-sectional view of a pixel in the middle display area AA, including a barrier layer, a buffer layer (the barrier layer and the buffer layer are represented by the inorganic film layer 20 in the previous text), an active layer 400, a first gate insulating layer 500, a first gate layer 600, a second gate insulating layer 700, a second gate layer 800, an interlayer insulating layer 40, a first source-drain metal layer 900, a passivation layer 1000, a first planar layer 31, a second source-drain metal layer 50, a second planar layer 60, an anode 70, a pixel boundary layer 100, and a first substrate 10. Layer 1100, light-emitting layer 190, cathode 1200, first inorganic layer 2001, organic layer 2002 and second inorganic layer 2003, the first inorganic layer 2001, organic layer 2002 and second inorganic layer 2003 constitute an encapsulation layer 200; the first source-drain metal layer 900 and the second source-drain metal layer 50 are electrically connected through a first via V1 that penetrates the first flat layer 31 and the passivation layer 1000, and the anode 70 is electrically connected to the second source-drain metal layer 50 through a second via V2 that penetrates the second flat layer 60.

[0070] In a specific implementation, in the above display panel provided in the embodiment of the present invention, if Fig.12 As shown, the isolation column 06 is provided in the same layer and the same material as at least one film layer located between the base substrate 10 and the second source-drain metal layer 50. Specifically, the isolation column 06 can be provided in the same layer and the same material as the first source-drain metal layer 11. Fig.10 As shown, an inorganic film layer 20 (barrier layer + buffer layer), a gate insulating layer 30 (such as a first gate insulating layer, a second gate insulating layer and a third gate insulating layer), and an interlayer insulating layer 40 are sequentially formed on a base substrate 10, a Ti / Al / Ti metal film layer is deposited on the interlayer insulating layer 40, and a first source-drain metal layer 11 located in the display area AA and an isolation column 06 located in the through-hole packaging area BB are formed by a one-time patterning process, and then a first passivation film layer 21 is deposited on the side of the first source-drain metal layer 11 away from the base substrate 10, and the first passivation film layer 21 covers the through-hole packaging area BB to protect A first flat layer 31 is formed on the side of the first passivation layer material film layer 21 away from the substrate 10, and the orthographic projection of the first flat layer 31 on the substrate 10 does not overlap with the orthographic projection of the isolation column 06 on the substrate 10. A second source-drain metal layer 50 is formed on the side of the first flat layer 31 away from the substrate 10, and a second flat layer 60 is formed on the side of the second source-drain metal layer 50 away from the substrate 10. A multi-layer transparent wiring (not shown) is formed on the side of the second flat layer 60 away from the substrate 10. The transparent wiring in the multi-layer transparent wiring is used to connect the Figure 1 The anode of the light emitting device in the receiving hole 02 and the emitting hole 03 is electrically connected to the peripheral driving circuit (for example, located in the display area or the frame area). Taking the three-layer transparent wiring as an example, there is a flat layer between two adjacent layers of transparent wiring. Fig.10 The diagram shows a third flat layer 90, a fourth flat layer 100 and a fifth flat layer 110 which are stacked in sequence on the side of the second flat layer 60 away from the base substrate 10. The orthographic projections of the second flat layer 60, the third flat layer 90, the fourth flat layer 100 and the fifth flat layer 110 on the base substrate 10 do not overlap with the orthographic projections of the isolation column 06 on the base substrate 10. There is a layer of transparent wiring between the second flat layer 60 and the third flat layer 90, there is a layer of transparent wiring between the third flat layer 90 and the fourth flat layer 100, and the fifth flat layer 110 on the base substrate 10 does not overlap with the orthographic projections of the isolation column 06 on the base substrate 10. A layer of transparent wiring is provided between the fourth flat layer 100 and the fifth flat layer 110, and the orthographic projection of the transparent wiring on the base substrate 10 does not overlap with the orthographic projection of the isolation column 06 on the base substrate 10. Then, a second passivation film layer 120 is deposited on the side of the fifth flat layer 110 away from the base substrate 10, and then a second photoresist 130 is coated on the side of the second passivation film layer 120 away from the base substrate 10, and the second photoresist 130 is exposed and developed, and the first passivation film layer 21 and the second passivation film layer 120 are etched, as shown in FIG. Fig.11As shown, a first passivation layer 21' is formed, the first passivation layer 21' covers the through-hole packaging area BB, and the orthographic projection of the first passivation layer 21' on the base substrate 10 does not overlap with the orthographic projection of the isolation column 06 on the base substrate 10, and the second passivation film layer 120 is completely removed. Then, a metal film layer 70 for making an anode is evaporated on the side of the fifth flat layer 110 away from the base substrate 10, a first photoresist 80 is coated on the metal film layer 70, the first photoresist 80 is exposed and developed, and the metal film layer 70 is wet-etched to form an anode (not shown) in the display area AA, and the metal film layer 70 in the remaining area is removed, that is, the orthographic projection of the anode on the base substrate 10 does not overlap with the orthographic projection of the isolation column 06 on the base substrate 10; because the wet etching solution of the metal film layer 70 is a dilute acid, the Al in the isolation column 06 (Ti / Al / Ti sandwich structure) is etched during the etching process, thereby forming an isolation column 06 with an undercut structure, as shown in FIG. Fig.12 As shown, the bottom Ti layer is represented by 061, the Al layer is represented by 062, and the top Ti layer is represented by 063. Figure 10-12 In the scheme, the provision of the first passivation film layer 21 can avoid the problem of serious corrosion of the Al layer of the isolation column during the transparent wiring etching process. After the transparent wiring etching is completed, the passivation layer protecting the isolation column 06 is removed, and then anodic etching is performed. During the anodic etching process, the Al layer in the isolation column 06 is etched, thereby forming an isolation column 06 with an undercut structure.

[0071] It should be noted that if Fig.11 As shown, the fifth flat layer 110 is formed and the second passivation film layer 120 is completely removed as an example. Of course, the fifth flat layer 110 may not be provided, and the second passivation film layer 120 may be directly used to replace the fifth flat layer 110. The second passivation film layer 120 is retained at the position corresponding to the display area AA and removed at the position corresponding to the through-hole packaging area BB. In addition, Fig.11 The first passivation film layer 21 is etched by providing a second passivation film layer 120 . Of course, the second passivation film layer 120 may not be provided. After the fifth planar layer 110 is formed, the first passivation film layer 21 may be directly etched.

[0072] In a specific implementation, in the above display panel provided in the embodiment of the present invention, if Fig.15 and Fig.17As shown, it also includes: at least one transparent wiring layer (not shown) located on the side of the second source-drain metal layer 50 away from the base substrate 10, an anode (not shown) located on the side of the transparent wiring layer away from the base substrate 10, and a first film layer 140 located between the transparent wiring layer and the anode; the orthographic projection of the transparent wiring layer on the base substrate 10 does not overlap with the orthographic projection of the isolation column 06 on the base substrate 10, and the orthographic projection of the anode on the base substrate 10 does not overlap with the orthographic projection of the isolation column 06 on the base substrate 10;

[0073] The isolation column 06 and the first film layer 140 are provided in the same layer and with the same material.

[0074] In a specific implementation, in the above display panel provided in the embodiment of the present invention, if Fig.15 As shown, the material of the first film layer 140 is the same as that of the first source-drain metal layer 11, that is, the material of the first film layer 140 is Ti / Al / Ti. Fig.13 As shown, an inorganic film layer 20 (blocking layer + buffer layer), a gate insulating layer 30 (for example, a first gate insulating layer, a second gate insulating layer and a third gate insulating layer), and an interlayer insulating layer 40 are sequentially formed on a base substrate 10, a Ti / Al / Ti metal film layer is deposited on the interlayer insulating layer 40, and a first source-drain metal layer 11 located in a display area AA is formed by a patterning process, and then a first flat layer 31 is formed on the side of the first source-drain metal layer 11 away from the base substrate 10, and the orthographic projection of the first flat layer 31 on the base substrate 10 does not overlap with the orthographic projection of the isolation column 06 on the base substrate 10, and then a second source-drain metal layer 50 is formed on the side of the first flat layer 31 away from the base substrate 10, and then a second flat layer 60 is formed on the side of the second source-drain metal layer 50 away from the base substrate 10, and then a multi-layer transparent wiring (not shown) is formed on the side of the second flat layer 60 away from the base substrate 10, and the transparent wiring in the multi-layer transparent wiring is used to connect the transparent wiring located at Figure 1 The anode of the light emitting device in the receiving hole 02 and the emitting hole 03 is electrically connected to the peripheral driving circuit (for example, located in the display area or the frame area). Taking the three-layer transparent wiring as an example, there is a flat layer between two adjacent layers of transparent wiring. Fig.10The diagram shows a third flat layer 90, a fourth flat layer 100 and a fifth flat layer 110 which are stacked in sequence on the side of the second flat layer 60 away from the base substrate 10. The orthographic projections of the second flat layer 60, the third flat layer 90, the fourth flat layer 100 and the fifth flat layer 110 on the base substrate 10 do not overlap with the orthographic projections of the isolation column 06 on the base substrate 10. There is a layer of transparent wiring between the second flat layer 60 and the third flat layer 90, there is a layer of transparent wiring between the third flat layer 90 and the fourth flat layer 100, and the fourth flat layer 110 is disposed on the base substrate 10. A layer of transparent wiring is provided between the flat layer 100 and the fifth flat layer 110, and the orthographic projection of the transparent wiring on the base substrate 10 does not overlap with the orthographic projection of the isolation column 06 on the base substrate 10. Then, a first material film layer (Ti / Al / Ti) 140' is deposited on the side of the fifth flat layer 110 away from the base substrate 10, and a third photoresist 150 is coated on the side of the first material film layer 140' away from the base substrate 10. The third photoresist 150 is exposed and developed, and the first material film layer 140' is etched, as shown in FIG. Fig.14 As shown, a first film layer 140 is formed in the AA area and an isolation column 06 is formed in the through-hole packaging area BB. Then, a metal film layer 70 for making an anode is evaporated on the side of the first film layer 140 away from the base substrate 10, a first photoresist 80 is coated on the metal film layer 70, the first photoresist 80 is exposed and developed, and the metal film layer 70 is wet-etched to form an anode (not shown) in the display area AA, and the metal film layer 70 in the remaining area is removed, that is, the orthographic projection of the anode on the base substrate 10 does not overlap with the orthographic projection of the isolation column 06 on the base substrate 10; since the wet etching solution of the metal film layer 70 is a dilute acid, the Al in the isolation column 06 (Ti / Al / Ti sandwich structure) is etched during the etching process, thereby forming an isolation column 06 with an undercut structure, as shown in FIG. Fig.15 As shown, the bottom Ti layer is represented by 061, the Al layer is represented by 062, and the top Ti layer is represented by 063. Figure 13-Figure 15 In the scheme, after the transparent wiring is made, a first film layer 140 made of the same material as the first source and drain metal 11 is made, and the isolation column 06 is arranged in the same layer as the first film layer 140, so as to avoid the problem of severe corrosion of the Al layer of the isolation column during the etching process of the transparent wiring.

[0075] Specifically, Figure 6B As shown, the embodiment of the present disclosure provides Figure 1 The anodes of the light emitting devices in the emitting hole 02 and the receiving hole 02 are electrically connected to the peripheral driving circuit through the transparent wiring 300. Figure 6BOnly one layer of transparent wiring 300 is shown. Of course, there may be two, three or even more layers. When the transparent wiring layer is two, three or even more layers, a flat layer (third flat layer 90, fourth flat layer 100 or fifth flat layer 110) is provided between two adjacent layers of transparent wiring 300.

[0076] In a specific implementation, in the above display panel provided in the embodiment of the present invention, if Fig.17 As shown, the material of the first film layer 140 is a negative photoresist. Fig.17 The production process of the isolation column 06 Fig.15 In the production process, the difference is: Fig.16 As shown, a first passivation layer 21' is provided between the first flat layer 31 and the first source-drain metal layer 11, the first passivation layer 21' covers the through-hole packaging area BB, and the orthographic projection of the first passivation layer 21' on the base substrate 10 does not overlap with the orthographic projection of the isolation column 06 on the base substrate 10. After forming the fifth flat layer 110, a second material film layer 160 of a negative photoresist material is coated on the side of the fifth flat layer 110 away from the base substrate 10, and a fourth photoresist 170 is coated on the side of the second material film layer 160 away from the base substrate 10. The fourth photoresist 170 is exposed and developed, and the exposure and development conditions are controlled, such as Fig.17 As shown, a first film layer 140 made of a negative photoresist material is formed in the AA region, and an isolation column 06 of an undercut structure is formed in the through hole packaging region BB. Fig.17 The subsequent process of making anodes Fig.15 The same, no further elaboration is given here. Figure 16-Figure 17 In the scheme, a first film layer 140 made of negative photoresist is made after the transparent wiring is made, and the isolation column 06 is arranged in the same layer as the first film layer 140, thereby avoiding the problem of severe corrosion of the Al layer of the isolation column during the etching process of the transparent wiring.

[0077] In a specific implementation, in the above display panel provided in the embodiment of the present invention, if Fig.18As shown, it also includes: at least one transparent wiring layer (not shown) located on the side of the second source-drain metal layer 50 away from the base substrate 10, an anode (not shown) located on the side of the transparent wiring layer away from the base substrate 10, a second flat layer 60 located between the transparent wiring layer and the second source-drain metal layer 50, and a negative photoresist layer 180 located between the second source-drain metal layer 50 and the second flat layer 60; it also includes: a first passivation layer 21' located between the first flat layer 31 and the first source-drain metal layer 11, the first passivation layer 21' covers the through-hole packaging area BB, and the orthographic projection of the first passivation layer 21' on the base substrate 10 does not overlap with the orthographic projection of the isolation column 06 on the base substrate 10; the orthographic projection of the transparent wiring layer on the base substrate 10 does not overlap with the orthographic projection of the isolation column 06 on the base substrate 10, and the orthographic projection of the anode on the base substrate does not overlap with the orthographic projection of the isolation column 06 on the base substrate 10;

[0078] The isolation column 06 and the negative photoresist layer 180 are provided in the same layer and with the same material.

[0079] In a specific implementation, in the above display panel provided in the embodiment of the present invention, if Fig.18 As shown, after forming the second source-drain metal layer 50, a negative photoresist material film layer is coated on the side of the second source-drain metal layer 50 away from the substrate 10, and a fifth photoresist is coated on the side of the negative photoresist material film layer away from the substrate 10, and the fifth photoresist is exposed and developed. By controlling the exposure and development conditions, as shown in FIG. Fig.18 As shown, a negative photoresist layer 180 is formed in the AA area and an isolation column 06 of an undercut structure is formed in the through hole packaging area BB. Then, the subsequent transparent wiring and anode manufacturing process is performed. Fig.18 The structure can also avoid the problem of severe corrosion of the Al layer of the isolation column during the transparent wiring etching process.

[0080] It should be noted that Fig.15 The first film layer 140 formed in the AA region can arrange wiring (such as data lines, etc.), which can reduce the occupied area of ​​the wiring; Fig.17 The first film layer 140 formed in the AA region can play a flat role. Fig.18 The negative photoresist layer 180 formed in the AA region can play a planarizing role.

[0081] Specifically, Fig.12 , Fig.15 , Fig.17 and Fig.18As shown, the number of isolation columns 06 is generally set to more than 3, and the isolation columns 06 can also be reduced to two. After the isolation columns 06 are reduced, the organic layer material in the encapsulation layer will overflow during inkjet printing, so isolation grooves 001 are set around the isolation columns, and one or two isolation grooves 001 can be added between two isolation columns 06. Of course, isolation grooves 001 can also be not set. Specifically, the substrate 10 can include a first flexible substrate, a first barrier layer, and a second flexible substrate arranged in a stacked manner. The second flexible substrate is close to the barrier layer and the buffer layer 20. The isolation groove 001 can be formed by penetrating the following film layers: an interlayer insulating layer 40, a second gate insulating layer 700, a first gate insulating layer 500, a barrier layer and a buffer layer 20, a second flexible substrate, a first barrier layer, and a part of the first flexible substrate. Of course, it is not limited to this, and the film layers penetrated can be selected according to actual needs to form the isolation groove 001.

[0082] In a specific implementation, in the above display panel provided in the embodiment of the present invention, if Fig.19 As shown, it also includes: a light-emitting layer 190 located on the side of the anode away from the substrate 10, a cathode (not shown) located on the side of the light-emitting layer 190 away from the substrate 10, and an encapsulation layer 200 located on the side of the cathode away from the substrate 10; the light-emitting layer 190 is disconnected at the position of the isolation column 06;

[0083] The encapsulation layer 200 includes a first inorganic layer 2001 , an organic layer 2002 and a second inorganic layer 2003 which are stacked, wherein the orthographic projections of the first inorganic layer 2001 , the organic layer 2002 and the second inorganic layer 2003 on the base substrate 10 all cover the display area AA and the through-hole encapsulation area BB.

[0084] In a specific implementation, the above-mentioned display panel provided in the embodiment of the present disclosure may also include other functional film layers well known to those skilled in the art, such as an active layer, a first gate layer, a second gate layer, a third gate layer, and a touch layer and a cover plate located on the side of the packaging layer away from the base substrate.

[0085] Based on the same inventive concept, the embodiment of the present disclosure further provides a method for manufacturing the above display panel, comprising:

[0086] Providing a base substrate, the base substrate having a display area, a through hole area, and a through hole packaging area located between the display area and the through hole area;

[0087] Forming a first source-drain metal layer on one side of the display area of ​​the base substrate;

[0088] Forming a second source-drain metal layer on a side of the first source-drain metal layer away from the substrate;

[0089] At least one isolation column is formed on one side of the through-hole packaging area of ​​the substrate substrate and is arranged around the through-hole area, wherein the isolation column and the second source-drain metal layer are arranged in different layers;

[0090] The through hole area is cut to form a through hole.

[0091] In a specific implementation, in the above-mentioned manufacturing method provided in an embodiment of the present invention, at least one isolation column arranged around the through-hole area is formed on one side of the through-hole packaging area of ​​the substrate substrate, specifically comprising:

[0092] A first source-drain metal layer is formed in the display area and an isolation column is formed in the through-hole packaging area through a single patterning process.

[0093] In a specific implementation, in the above-mentioned manufacturing method provided by the embodiment of the present invention, after forming the first source-drain metal layer and before forming the second source-drain metal layer, it also includes: forming a first passivation film layer and a first flat film layer, and patterning the first flat film layer to form a first flat layer; the orthographic projection of the first flat layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate;

[0094] After forming the second source-drain metal layer, the method further comprises:

[0095] At least one transparent wiring layer is formed; the orthographic projection of the transparent wiring layer on the substrate does not overlap with the orthographic projection of the isolation column on the substrate;

[0096] Forming a second passivation film layer on a side of the transparent wiring layer away from the substrate;

[0097] The first passivation film layer and the second passivation film layer are patterned by a single patterning process to form the first passivation layer and the second passivation film layer is completely removed; the first passivation layer covers the through-hole packaging area, and the orthographic projection of the first passivation layer on the substrate substrate does not overlap with the orthographic projection of the isolation column on the substrate substrate; or, the first passivation film layer and the second passivation film layer are patterned by a single patterning process to form the first passivation layer and the second passivation layer; the first passivation layer covers the through-hole packaging area, and the orthographic projection of the first passivation layer on the substrate substrate does not overlap with the orthographic projection of the isolation column on the substrate substrate, and the orthographic projection of the second passivation layer on the substrate substrate does not overlap with the orthographic projection of the isolation column on the substrate substrate.

[0098] In a specific implementation, in the above manufacturing method provided by the embodiment of the present invention, after forming the first source-drain metal layer and before forming the second source-drain metal layer, it further includes: forming a first flat layer; the orthographic projection of the first flat layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate;

[0099] After forming the second source-drain metal layer, the method further includes: forming at least one transparent wiring layer; the orthographic projection of the transparent wiring layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate;

[0100] At least one isolation column is formed on one side of the through-hole packaging area of ​​the substrate substrate and is arranged around the through-hole area, specifically comprising:

[0101] Forming a first material film layer having the same material as that of the first source-drain metal layer on a side of the transparent wiring layer away from the substrate;

[0102] The first material film layer is patterned to form a first film layer located in the display area and an isolation column located in the through-hole packaging area.

[0103] In a specific implementation, in the above-mentioned manufacturing method provided by the embodiment of the present invention, after forming the first source-drain metal layer and before forming the second source-drain metal layer, it also includes: forming a first passivation layer and a first planarization layer; the orthographic projection of the first passivation layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate, and the orthographic projection of the first planarization layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate;

[0104] After forming the second source-drain metal layer, the method further includes: forming at least one transparent wiring layer; the orthographic projection of the transparent wiring layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate;

[0105] At least one isolation column is formed on one side of the through-hole packaging area of ​​the substrate substrate and is arranged around the through-hole area, specifically comprising:

[0106] Forming a second material film layer of negative photoresist on a side of the transparent wiring layer away from the substrate;

[0107] The second material film layer is patterned to form a first film layer located in the display area and an isolation column located in the through-hole packaging area.

[0108] It should be noted that the manufacturing method of the display panel provided in the embodiment of the present disclosure may refer to the display panel manufacturing process of the aforementioned display panel embodiment, which will not be described in detail here.

[0109] Based on the same inventive concept, the embodiment of the present disclosure further provides a display device, including any of the above display panels provided in the embodiment of the present disclosure. The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc. The implementation of the display device can refer to the above display panel embodiments, and the repeated parts will not be repeated.

[0110] The embodiment of the present disclosure provides a display panel, a manufacturing method thereof, and a display device. The isolation column is set to be arranged in a different layer from the second source-drain metal layer, that is, the isolation column and the second source-drain metal layer are located in different layers, so that the isolation column and the first source-drain metal layer can be arranged in the same layer, and then a passivation layer is deposited on the side of the first source-drain metal layer away from the substrate to protect the isolation column, and then subsequent processes such as etching of multi-layer transparent wiring in the under-screen TOF technology are performed. The setting of the passivation layer can avoid the problem of serious corrosion of the Al layer of the isolation column during the etching of the transparent wiring. After the etching of the transparent wiring is completed, the passivation layer protecting the isolation column is removed, and then anodic etching is performed. During the anodic etching process The Al layer in the isolation column is etched to form an isolation column with an undercut structure. In addition, the isolation column can be arranged in the same layer as the film layer (such as the third source and drain metal layer, etc.) located on the side of the second source and drain metal layer away from the substrate, and the third source and drain metal layer is arranged to be located on the side of the multi-layer transparent wiring away from the substrate, that is, after the transparent wiring is etched, the isolation column is made at the same time as the third source and drain metal layer is made, thereby avoiding the problem of severe corrosion of the Al layer of the isolation column during the etching of the transparent wiring, and then anodic etching is performed, and the Al layer in the isolation column is etched during the anodic etching process, thereby forming an isolation column with an undercut structure. Therefore, the display panel provided by the embodiment of the present disclosure can avoid the problem of severe corrosion of the isolation column during the etching of the transparent wiring in the "TOF+AA hole" technology under the screen and avoid the undesirable problem of bubble formation at the AA Hole position.

[0111] Obviously, those skilled in the art can make various changes and modifications to the present disclosure without departing from the spirit and scope of the present disclosure. Thus, if these modifications and variations of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is also intended to include these modifications and variations.

Claims

1. A display panel, wherein: include: A base substrate, wherein the display panel has a through hole penetrating the base substrate in a thickness direction, and the base substrate has a display area and a through hole packaging area located between the display area and the through hole; A first source-drain metal layer, located on one side of the substrate; A second source-drain metal layer is located on a side of the first source-drain metal layer away from the substrate; At least one isolation column is located on one side of the substrate, located in the through-hole packaging area, and arranged around the through-hole; The display panel further includes: at least one transparent wiring layer located on the side of the second source-drain metal layer away from the base substrate, an anode located on the side of the transparent wiring layer away from the base substrate, and a first film layer located between the transparent wiring layer and the anode; the isolation column is provided in the same layer and material as the first film layer, the material of the first film layer is the same as the material of the first source-drain metal layer, or the material of the first film layer is a negative photoresist; or, the display panel further includes: at least one transparent wiring layer located on the side of the second source-drain metal layer away from the base substrate, an anode located on the side of the transparent wiring layer away from the base substrate, a second flat layer located between the transparent wiring layer and the second source-drain metal layer, and a negative photoresist layer located between the second source-drain metal layer and the second flat layer; the isolation column is provided in the same layer and material as the negative photoresist layer; The orthographic projection of the transparent wiring layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate, and the orthographic projection of the anode on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate.

2. The display panel according to claim 1, wherein: Also includes: A first planar layer is located between the first source-drain metal layer and the second source-drain metal layer.

3. The display panel according to claim 2, wherein: When the material of the isolation column is negative photoresist, it also includes: a first passivation layer located between the first flat layer and the first source and drain metal layer, the first passivation layer covers the through-hole packaging area, and the orthographic projection of the first passivation layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate.

4. The display panel according to claim 1, wherein: It also includes: a light-emitting layer located on a side of the anode away from the substrate, a cathode located on a side of the light-emitting layer away from the substrate, and an encapsulation layer located on a side of the cathode away from the substrate; the light-emitting layer is disconnected at the position of the isolation column; The encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer that are stacked, wherein the orthographic projections of the first inorganic layer, the organic layer, and the second inorganic layer on the base substrate all cover the display area and the through-hole encapsulation area.

5. A display device, wherein: Comprising the display panel according to any one of claims 1-4.

6. A method for manufacturing a display panel according to any one of claims 1 to 4, wherein: include: Providing a base substrate, the base substrate having a display area, a through hole area, and a through hole packaging area located between the display area and the through hole area; forming a first source-drain metal layer on one side of the substrate; forming a second source-drain metal layer on a side of the first source-drain metal layer away from the substrate; At least one isolation column is formed on one side of the through-hole packaging area of ​​the substrate substrate and is arranged around the through-hole area, wherein the isolation column and the second source-drain metal layer are arranged in different layers; The through hole region is cut to form a through hole.

7. The method according to claim 6, wherein: After forming the first source-drain metal layer and before forming the second source-drain metal layer, the method further includes: forming a first flat layer; the orthographic projection of the first flat layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate; After forming the second source-drain metal layer, the method further includes: forming at least one transparent wiring layer; the orthographic projection of the transparent wiring layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate; At least one isolation column is formed on one side of the through-hole packaging area of ​​the substrate substrate and is arranged around the through-hole area, specifically comprising: Forming a first material film layer having the same material as that of the first source-drain metal layer on a side of the transparent wiring layer away from the base substrate; The first material film layer is patterned to form a first film layer located in the display area and an isolation column located in the through-hole packaging area.

8. The method according to claim 6, wherein: After forming the first source-drain metal layer and before forming the second source-drain metal layer, the method further includes: forming a first passivation layer and a first planarization layer; the orthographic projection of the first passivation layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate, and the orthographic projection of the first planarization layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate; After forming the second source-drain metal layer, the method further includes: forming at least one transparent wiring layer; the orthographic projection of the transparent wiring layer on the base substrate does not overlap with the orthographic projection of the isolation column on the base substrate; At least one isolation column is formed on one side of the through-hole packaging area of ​​the substrate substrate and is arranged around the through-hole area, specifically comprising: Forming a second material film layer of negative photoresist on a side of the transparent wiring layer away from the base substrate; The second material film layer is patterned to form a first film layer located in the display area and an isolation column located in the through-hole packaging area.

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