Centring assembly for high frequency interaction components and method

By using a centering and assembly device for folded waveguide components and end cap components, the problems of precision and structural complexity in the assembly of high-frequency interaction components are solved, achieving high-precision centering and assembly and simplifying the assembly process, thus avoiding component deformation and wear.

CN116079316BActive Publication Date: 2026-02-06AEROSPACE INFORMATION RES INST CAS
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Patent Information

Application Number
CN202310309959.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-03-27
Publication Date
2026-02-06
Estimated Expiration
2043-03-27

AI Technical Summary

Technical Problem

Existing assembly methods for high-frequency interaction components are difficult to achieve high-precision alignment and assembly, and the assembly devices have complex structures and pose risks of component deformation and wear.

Method used

The alignment and assembly device for folded waveguide components and end cap components includes components such as an alignment base, a micrometer clamp holder, a micrometer clamp, and a flange. The position of the components is adjusted by the micrometer clamp, and a protective cover is used to avoid direct contact. The micrometer clamp is locked by measuring and adjusting the lever gauge.

Benefits of technology

It achieves high-precision alignment and assembly, avoids part deformation and wear, simplifies the assembly process, and improves electronic efficiency and performance indicators.

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Abstract

The present disclosure provides a centering assembly device and method of high-frequency interaction assembly, and relates to the field of microwave electric vacuum devices, and specifically comprises: a centering base; a micrometer fixing frame installed on the centering base; a micrometer installed on the micrometer fixing frame, used for adjusting the position of a folded waveguide part in the horizontal direction and the vertical direction, and locking the folded waveguide part when the folded waveguide part is in a centered state; a positioning base; a flange plate fixedly connected with the positioning base through a bolt column; and a micrometer provided on the flange plate and used for locking a gun end cover part and a collector end cover part. The present disclosure also provides a centering assembly method of high-frequency interaction assembly, which adopts the above two devices to perform the centering assembly of the high-frequency interaction assembly. The present disclosure is a kind of adjustment method based on online detection data to correct assembly errors in real time, which satisfies the high-precision centering assembly of the high-frequency interaction assembly, and has the advantages of simple structure, easy preparation and implementation of assembly.
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Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of microwave electron vacuum devices, and in particular to a centering assembly device and method of a high-frequency interaction assembly. BACKGROUND

[0002] There is a huge demand for terahertz technology in broadband communication, medical imaging, nondestructive testing, etc., and the current problem limiting the development of terahertz technology is the lack of terahertz radiation sources. With the working frequency of the traveling wave tube entering the terahertz frequency band, due to the influence of the size co-passing effect, the size of the slow wave structure becomes very small. The traditional spiral line traveling wave tube and the coupled cavity traveling wave tube have been difficult to meet the requirements due to the problems of machining, bandwidth, heat dissipation, etc. The high-frequency interaction assembly is one of the indispensable components of the traveling wave tube, and the high-frequency interaction assembly is composed of end cover parts and folded waveguide parts. In recent years, the proposal of the folded waveguide slow wave structure has made it possible to develop a terahertz band traveling wave tube. This structure has unique advantages such as wide frequency band, flat dispersion characteristics, small high-frequency loss, and easy processing, and has received close attention at home and abroad and is widely used in the terahertz field. Overall, the main methods for manufacturing folded waveguide parts that can be practically used include Ultra-fine WEDM (Ultra-fine Wire Electrical Discharge Machining) technology, LIGA technology, UV-LIGA technology, and DRIE technology. The folded waveguide parts obtained by the above methods are often divided into 2-3 parts for machining and then assembled together to form a complete electron channel and slow wave circuit.

[0003] Currently, the main methods for assembling folded waveguide parts are pin positioning and external surface positioning, and the positioning accuracy is about 10-20 μm. The parts are loosely fitted, and it is difficult to avoid deformation caused by the subsequent welding process, which cannot meet the precision requirements of the slow wave structure at terahertz frequencies, and affects the improvement of performance indicators such as electron efficiency, gain, and noise.

[0004] At the same time, end cover parts need to be assembled at both ends of the folded waveguide parts to realize the complete assembly of the high-frequency interaction assembly. However, the current assembly method and structure of the high-frequency interaction assembly are relatively complex, the assembly precision is difficult to detect, it is difficult to adjust the spatial position of the end cover parts in real time based on the detection data, and the assembly mold needs to directly contact the assembled parts, which has the risk of damaging and wearing the mating surface. SUMMARY

[0005] In view of the above problems, the present disclosure provides a centering assembly device and method of a high-frequency interaction assembly to improve the problem that the current assembly device of the high-frequency interaction assembly cannot simultaneously satisfy high-precision centering assembly and simple device structure.

[0006] One aspect of the present disclosure provides a centering assembly device for a high-frequency interaction assembly, comprising: a centering assembly device for a folded waveguide part, specifically comprising: a centering base; a micrometer fixing frame installed on the centering base; a micrometer installed on the micrometer fixing frame, used for adjusting the position of the folded waveguide part in the horizontal direction and the vertical direction, and locking the folded waveguide part when the folded waveguide part is in a centered state; and a centering assembly device for an end cover part, specifically comprising: a positioning base; a flange plate fixedly connected with the positioning base through a bolt column; and a micrometer provided on the flange plate, used for locking the gun end cover part and the collector end cover part.

[0007] According to an embodiment of the present disclosure, the folded waveguide part comprises a first folded waveguide part and a second folded waveguide part, and further comprises a folded waveguide part protective cover, the folded waveguide part protective cover is provided with a first recess for accommodating the first folded waveguide part; and the folded waveguide part protective cover is arranged between the first folded waveguide part and the vertical micrometer.

[0008] According to an embodiment of the present disclosure, the centering base further comprises: a second recess for accommodating the second folded waveguide part.

[0009] According to an embodiment of the present disclosure, the micrometer fixing frame is in the shape of a door, wherein at least one through hole is arranged at the horizontal side and the vertical side of the micrometer fixing frame, so as to install the horizontal micrometer and the vertical micrometer.

[0010] According to an embodiment of the present disclosure, the micrometer fixing frame is threadedly connected with the centering base; and the centering base extends two installation rails in the horizontal direction, and the bottom ends of the two vertical sides of the micrometer fixing frame are connected with the two installation rails.

[0011] According to an embodiment of the present disclosure, the flange plate comprises at least one through hole for the micrometer to pass through.

[0012] According to an embodiment of the present disclosure, further comprising: an end cover part protective cover arranged between the collector end cover part and the micrometer.

[0013] According to an embodiment of the present disclosure, further comprising a lever gauge used for measuring the distance between the gun end cover part and the collector end cover part, and adjusting the micrometer according to the measured distance, so as to lock the gun end cover part and the collector end cover part.

[0014] Another aspect of the present disclosure provides a centering assembly method of a high-frequency interaction assembly, comprising: centering and assembling and welding a first folded waveguide part and a second folded waveguide part by using the centering assembly device of the high-frequency interaction assembly described above; assembling and welding a gun end cover part and a collector end cover part to the first folded waveguide part and the second folded waveguide part after welding; and the first folded waveguide part, the second folded waveguide part, the gun end cover part and the collector end cover part together constitute the high-frequency interaction assembly.

[0015] The above at least one technical solution adopted in the embodiments of the present disclosure at least has the following beneficial effects: (1) the overall structure is simple, and high-precision centering assembly is met while being easy to assemble; (2) the protective cover is arranged to bear the adjusting pressure, so that the assembly device is prevented from directly contacting the parts during assembly, the parts are prevented from being deformed, and the risk of damaging and wearing the matching surface is avoided; (3) the device of the present disclosure requires a mature technology, complete social matching, and easy-to-complete process to realize. BRIEF DESCRIPTION OF DRAWINGS

[0016] For a more complete understanding of the present disclosure and its advantages, reference is now made to the following description taken in conjunction with the accompanying drawings in which:

[0017] Figure 1 The overall structure schematic diagram of the centering assembly device of the folded waveguide part provided by the embodiments of the present disclosure is schematically shown;

[0018] Figure 2 The front view of the centering assembly device of the folded waveguide part provided by the embodiments of the present disclosure is schematically shown;

[0019] Figure 3 The overall structure schematic diagram of the assembly device of the end cover part provided by the embodiments of the present disclosure is schematically shown;

[0020] Figure 4 The overall structure schematic diagram of the high-frequency interaction assembly after assembly is schematically shown.

[0021]

BRIEF DESCRIPTION OF DRAWINGS

[0022] 1, centimeter card; 2, centering base; 3, folded waveguide part protective cover; 4, centimeter card fixing frame; 5, folded waveguide part; 6, collector end cover part; 7, gun end cover part; 8, lever table; 9, positioning base; 10, flange plate; 11, bolt column. DETAILED DESCRIPTION

[0023] In order to make the objects, technical solutions and advantages of the present disclosure clearer, the present disclosure will be further described in detail below with reference to specific embodiments and drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, but not all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present disclosure.

[0024] The terms used herein are only used to describe specific embodiments, and are not intended to limit the present disclosure. The terms "include", "contain" and the like used herein indicate the existence of the described features, steps, operations and / or components, but do not exclude the existence or addition of one or more other features, steps, operations or components.

[0025] In the present disclosure, unless otherwise explicitly specified and limited, the terms "mount", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, can be fixedly connected, or can be detachably connected, or integrated; can be mechanically connected, or electrically connected or can communicate with each other; can be directly connected, or indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances.

[0026] In the description of the present disclosure, it should be understood that the orientation or positional relationship indicated by the terms "longitudinal", "length", "circumferential", "front", "back", "left", "right", "top", "bottom", "inner", "outer" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present disclosure and simplifying the description, and does not indicate or imply that the subsystem or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0027] Throughout the drawings, the same elements are denoted by the same or similar reference numerals. When it may cause confusion in understanding the present disclosure, the conventional structure or configuration will be omitted. And the shape, size, positional relationship of each component in the drawing does not reflect the true size, proportion and actual positional relationship. In addition, in the claims, any reference symbol located between parentheses should not be constructed as a limitation on the claims.

[0028] Similarly, to simplify the present disclosure and help understand one or more of the various disclosed aspects, in the above description of the exemplary embodiments of the present disclosure, various features of the present disclosure are sometimes grouped together in a single embodiment, figure or description thereof. The description referring to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" and the like means that the particular feature, structure, material or characteristic being described is included in at least one embodiment or example of the present disclosure. The illustrative representations of the above terms in the specification do not necessarily refer to the same embodiment or example. Moreover, the described particular features, structures, materials or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0029] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "multiple" is at least two, for example, two, three, etc., unless otherwise explicitly specified.

[0030] At present, the main ways of assembling the folded waveguide parts are pin positioning method and outer surface positioning method, and the positioning accuracy is about 10-20 μm, and most of them are loose fitting, which is difficult to avoid the deformation caused by the subsequent welding process, and cannot meet the precision requirements of terahertz frequency on the slow wave structure, affecting the improvement of performance indicators such as electronic efficiency, gain, and noise. At the same time, the end cover parts need to be assembled at both ends of the folded waveguide parts to realize the complete assembly of the high-frequency interaction assembly, but the current assembly method of the high-frequency interaction assembly needs to directly contact the parts to be assembled, which has the risk of damaging and wearing the mating surface, and the structure of the assembly device is also relatively complex.

[0031] In view of the above problems, the present disclosure provides an assembly device and method of a high-frequency interaction assembly to improve the problem that the current assembly device of the high-frequency interaction assembly is difficult to simultaneously satisfy high-precision centering assembly and simple device structure.

[0032] The centering assembly device of the high-frequency interaction assembly provided by the present disclosure includes a centering assembly device of a folded waveguide part and a centering assembly device of an end cover part, Figure 1 The overall structure schematic diagram of the centering assembly device of the folded waveguide part provided by the embodiment of the present disclosure is schematically shown. Please refer to Figure 1The centering assembly device of the folded waveguide parts comprises a centering base 2, a micrometer clamp fixing frame 4 installed on the centering base 2, and a micrometer clamp 1 installed on the micrometer clamp fixing frame 4, which is used to adjust the position of the folded waveguide parts 5 in the horizontal direction and the vertical direction, and lock the folded waveguide parts 5 when the folded waveguide parts 5 are in the centered state.

[0033] Figure 2 The centering assembly device of the folded waveguide parts is shown in the front view. Specifically, the folded waveguide parts 5 comprise first folded waveguide parts and second folded waveguide parts. The centering assembly device of the folded waveguide parts further comprises a folded waveguide part protective cover 3, which is provided with a first recess for placing the first folded waveguide parts, and is arranged between the first folded waveguide parts and the micrometer clamp 1 in the vertical direction. The folded waveguide part protective cover 3 is used to bear the adjusting action of the micrometer clamp 1, so as to avoid the damage to the surface of the second folded waveguide parts.

[0034] In the embodiment of the present disclosure, the shape of the first recess is adapted to the shape of the first folded waveguide parts, so that the device is suitable for the installation of folded waveguide parts 5 of various sizes. In the actual application process, folded waveguide part protective covers 3 of different sizes can be arranged according to the needs. In the process of centering the folded waveguide parts 5, the folded waveguide part protective cover 3 can replace the folded waveguide parts 5 to bear the adjusting pressure of the micrometer clamp 1, so as to prevent the deformation of the folded waveguide parts 5 and further damage and wear the mating surface.

[0035] The centering base 2 further comprises a second recess for placing the second folded waveguide parts. The weight of the centering base 2 can support the micrometer clamp 1 and the micrometer clamp fixing frame 4 at the same time, and has a suitable center of gravity, so as not to easily tilt. In the embodiment of the present disclosure, the centering base 2 is provided with a through hole along the direction of the electron flow through the folded waveguide parts 5, so as to have better heat dissipation conditions in the process of welding the centered folded waveguide parts 5.

[0036] The micrometer holder 4 is U-shaped, with at least one through hole on each of its horizontal and side edges to allow the micrometers 1 to pass through in both the horizontal and vertical directions. In the disclosed embodiment, two micrometer holders 4 and seven micrometers 1 are provided, with the micrometer holders 4 respectively located at opposite ends of the centering base 2 along the direction of electron flow in the folded waveguide component 5. One micrometer 1 is provided on each side of the micrometer holder 4 for centering and adjusting the horizontal direction of the folded waveguide component 5; one micrometer 1 is provided on the horizontal edge of one micrometer holder 4, and two micrometers 1 are provided on the horizontal edge of the other micrometer holder 4 for centering and adjusting the vertical direction of the folded waveguide component 5. In some other embodiments of this disclosure, other numbers of micrometer holders 4 and micrometers 1 can be used, as long as the centering and assembly of the folded waveguide component 5 in both the horizontal and vertical directions can be satisfied; no limitation is made here.

[0037] In this embodiment, the micrometer holder 4 and the centering base 2 are threadedly connected. Specifically, the centering base 2 extends two mounting edges in the horizontal direction, and the bottom ends of both sides of the micrometer holder 4 are threadedly connected to the two mounting edges respectively. In some other embodiments of this disclosure, other connection methods can also be used to connect the micrometer holder 4 and the centering base 2, as long as the stability of the overall device is met, and no limitation is made here.

[0038] The assembly device for the end cap parts provided in this disclosure specifically includes: a positioning base 9; a flange 10, which is fixedly connected to the positioning base 9 by bolts 11; and a micrometer clamp 1, which is installed on the flange 10 and used to lock the gun end cap part 7 and the collection end cap part 6. Figure 3 The schematic diagram illustrates the overall structure of the assembly apparatus for the end cap part provided in the embodiments of this disclosure.

[0039] like Figure 3 As shown, the flange 10 includes at least one through hole for the micrometer clip 1 to pass through. In this embodiment, four micrometer clips 1 are provided. A threaded hole is provided on the side of the flange 10, and a screw abuts against the micrometer clip 1 through the threaded hole, achieving a fixed connection between the micrometer clip 1 and the flange 10. Simultaneously, four bolt posts 11 are provided to fix the positioning base 9 to the flange 10, providing space for the assembly of the end cover parts. The assembly device for the end cover parts also includes a protective cover for the end cover parts. The protective cover is disposed between the collecting extreme end cover part 6 and the micrometer clip 1, and is used to withstand the adjustment action of the micrometer clip 1, preventing damage to the surface of the collecting extreme end cover part 6, thereby avoiding damage and wear to the mating surfaces.

[0040] Meanwhile, a through hole with a diameter of 4 mm is arranged at the center of the collecting end cover part 6 and the gun end cover part 7, and a blind hole with a diameter of 1.5 mm is arranged on the end face of each of the folded waveguide parts after alignment. A stepped shaft is arranged on the protection cover of the end cover part and the positioning base 9 respectively, and is matched with the blind hole and the through hole on the same side respectively, so that the two end covers and the folded waveguide parts have high concentricity.

[0041] In the embodiment of the present disclosure, a lever table 8 is arranged, which is fixedly connected to the bolt column 11, and is used for measuring the distance between the gun end cover part 7 and the collecting end cover part 6. The millimeter card 1 is adjusted according to the measured distance, so that the millimeter card 1 locks the gun end cover part 7 and the collecting end cover part 6.

[0042] Another aspect of the present disclosure provides a centering assembly method of a high-frequency interaction assembly, comprising: using the centering assembly device of the folded waveguide part to center and assemble and weld the first folded waveguide part and the second folded waveguide part; using the assembly device of the end cover part to assemble and weld the gun end cover part 7 and the collecting end cover part 6 of the first folded waveguide part and the second folded waveguide part after welding; and the first folded waveguide part, the second folded waveguide part, the gun end cover part 7 and the collecting end cover part 6 jointly constitute the high-frequency interaction assembly.

[0043] Figure 4The overall structure of the assembled high-frequency interaction assembly is shown schematically. Specifically, in the embodiment of the present disclosure, the centering assembly method of the folded waveguide part 5 mainly includes the following steps: placing the first folded waveguide part in the first groove, placing the second folded waveguide part in the second groove, so that the first folded waveguide part is approximately aligned with the second folded waveguide part; adjusting the micrometer clamps 1 in the vertical direction of the micrometer clamp holder 4, and observing the height of the end face of the first folded waveguide part and the second folded waveguide part in real time by using a microscope, until the height difference of the end face of the first folded waveguide part and the second folded waveguide part is less than a threshold value, for example, 0.005 mm; if the adjustment is excessive, the first folded waveguide part can be inverted by 180 degrees and continue to be lowered until the height difference of the end face of the first folded waveguide part and the second folded waveguide part is less than the threshold value; the three micrometer clamps 1 in the vertical direction are tightened with a small torque; adjusting the micrometer clamps 1 in the horizontal direction of the micrometer clamp holder 4, and observing whether the first folded waveguide part and the second folded waveguide part are aligned to form an electron channel by using a microscope; after observing that the first folded waveguide part and the second folded waveguide part are aligned to form an electron channel, the four micrometer clamps 1 in the horizontal direction are tightened with a small torque; the height difference of the end face of the first folded waveguide part and the second folded waveguide part is re-measured, if it is less than the threshold value, then the seven micrometer clamps 1 are tightened with a large torque, if it exceeds the threshold value, then the above steps are repeated; in the case of alignment to form an electron channel, the first folded waveguide part and the second folded waveguide part are welded.

[0044] The assembly method of the end cover part mainly includes the following steps: connecting the positioning base 9 and the flange plate 10; placing the gun end cover part 7 on the positioning base 9; placing the aligned folded waveguide part 5 vertically on the gun end cover part 7; placing the collector end cover part 6 vertically on the other end of the folded waveguide part 5, and placing the end cover part protection cover; adjusting the micrometer clamps 1, gradually pressing the end cover part protection cover, measuring the distance between the two end cover parts by using the lever table 8, and adjusting the corresponding micrometer clamps 1 according to the measured value; under the condition that the micrometer clamps 1 are locked, the folded waveguide part 5, the gun end cover part 7 and the collector end cover part 6 are welded.

[0045] In the embodiment of the present disclosure, laser welding, argon arc welding or electron beam welding can be used.

[0046] In actual application, the assembly method in the embodiment of the present disclosure can be adjusted in size according to the specific size of the high-frequency interaction assembly to be assembled, and the size of each part in the assembly method is not limited as long as the purpose of centering assembly can be achieved.

[0047] In summary, the centering assembly device of the folded waveguide part and the assembly device of the end cover part provided by the present disclosure make the structure of the overall high-frequency interaction assembly device simple, meet the high-precision centering assembly, and are easy to assemble. Meanwhile, the tooling fixture, raw materials, process equipment, etc. required by the device of the present disclosure are mature in technology, complete in social matching, and easy to complete the process implementation.

[0048] The specific embodiments described above further illustrate the technical solutions of the present disclosure, and it should be understood that the above description is only for specific embodiments of the present disclosure and is not intended to limit the present disclosure. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A centering assembly for high frequency interaction components, characterized in that, The application relates to a centering assembly device for a folded waveguide part, which comprises a centering base (2), a micrometer clamp fixing frame (4) installed on the centering base (2), and a micrometer clamp (1) installed on the micrometer clamp fixing frame (4) and used for adjusting the position of the folded waveguide part (5) in the horizontal direction and the vertical direction and locking the folded waveguide part (5) when the folded waveguide part (5) is in a centered state. The application also relates to a centering assembly device for an end cover part, which comprises a positioning base (9), a flange plate (10) fixedly connected with the positioning base (9) through a bolt column (11), and a micrometer clamp (1) penetrating through the flange plate (10) and used for locking a gun end cover part (7) and a collecting electrode end cover part (6). The folded waveguide part (5) comprises a first folded waveguide part and a second folded waveguide part, and the application further comprises a folded waveguide part protective cover (3) provided with a first recess used for accommodating the first folded waveguide part, and the folded waveguide part protective cover (3) is arranged between the first folded waveguide part and the micrometer clamp (1) in the vertical direction. The centering base (2) further comprises a second recess used for accommodating the second folded waveguide part. The micrometer clamp fixing frame (4) is in the shape of a Chinese character door, wherein at least one through hole is arranged at the horizontal side and the side of the micrometer clamp fixing frame (4) to install the micrometer clamp (1) in the horizontal direction and the vertical direction.

2. A centering assembly for high frequency interaction components according to claim 1, characterized in that, The micrometer clamp fixing frame (4) is threadedly connected with the centering base (2), wherein the centering base (2) extends two installation edges in the horizontal direction, and the bottom ends of the two side edges of the micrometer clamp fixing frame (4) are connected with the two installation edges.

3. The centering assembly for high frequency interaction components of claim 1, wherein, The flange plate (10) comprises at least one through hole for penetrating the micrometer clamp (1).

4. The centering assembly for high frequency interaction components of claim 1, wherein, The application further comprises an end cover part protective cover arranged between the collecting electrode end cover part (6) and the micrometer clamp (1).

5. The centering assembly for high frequency interaction components of claim 1, wherein, The application further comprises a lever table (8) used for measuring the distance between the gun end cover part (7) and the collecting electrode end cover part (6), and the micrometer clamp (1) is adjusted according to the measured distance to lock the gun end cover part (7) and the collecting electrode end cover part (6). The application comprises centering assembly and welding of a first folded waveguide part and a second folded waveguide part by using the centering assembly device for the high-frequency interaction assembly.

6. The centering assembly for high frequency interaction components of claim 1, wherein, The application comprises assembly and welding of a gun end cover part (7) and a collecting electrode end cover part (6) on the welded first folded waveguide part and the second folded waveguide part.

7. A method of centering an assembly of high frequency interaction components, comprising: The first folded waveguide part, the second folded waveguide part, the gun end cover part and the collecting electrode end cover part jointly constitute a high-frequency interaction assembly. ​ ​ ​

Citation Information

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