Large depth of field high precision microscopic three-dimensional topography scanning method, system and application

Abstract

The application discloses a large-landscape-depth high-precision microscopic three-dimensional appearance scanning method and system and application. The method comprises the following steps: 1) establishing an imaging model based on the intersection imaging principle; 2) obtaining the depth direction information and the information of the object surface size of two dimensions of the collected image according to the imaging model, and deducing the conversion equation of the image surface and the object surface; 3) calibrating the parameters in the system object-image relationship equation through experiments; 4) scanning the object by using a line laser, calculating the spatial position coordinates of the sampling points through the calibration results, and completing three-dimensional reconstruction. The system comprises an illumination unit, an imaging unit, a displacement unit and an information control unit; the imaging plane of the imaging unit is inclined, and the line laser plane and the lens plane intersect at a straight line, so that the line laser plane is clearly imaged. The application has high efficiency and high precision, and has application value in the fields of automatic processing and part surface detection.

Description

Technical Field

[0001] This invention belongs to the field of optical technology, specifically relating to a large depth-of-field, high-precision microscopic three-dimensional topography scanning method, system, and application. Background Technology

[0002] 3D topography measurement technology refers to the use of sensors to detect physical objects or scenes, and to establish mathematical models based on specific technical means. The raw data collected from the objects or scenes is then processed according to the mathematical model to quickly obtain 3D point cloud data containing the object's morphological features. With the upgrading of industrial manufacturing technology and the improvement of scientific and technological levels, surface 3D topography measurement has broad application prospects in many fields due to its unique engineering value, such as 3D measurement, parts manufacturing, aerospace, and medical testing. Current 3D topography measurement is developing in two directions—large-scale and small-scale. Small-scale measurement is mainly used in fields such as bioengineering and microelectronics, while large-scale measurement mainly measures the geometric dimensions and 3D topography parameters of objects ranging from a few meters to hundreds of meters.

[0003] Current mainstream methods for 3D topography measurement include structured light projection, which reconstructs 3D surface shapes by analyzing the phase changes of sinusoidal fringes on the surface, and stereo vision, which reconstructs 3D structures by capturing multi-angle images and matching feature points. However, compared to the photographic lenses used for macroscopic object measurement, the microscope objectives used for microscopic measurement have higher magnification and a depth of field limited to the micrometer range. The portion of the object being measured outside the depth of field will exhibit defocusing, resulting in significant errors in the raw data detected by the sensor and thus affecting the accuracy of 3D measurement. To address these issues, this paper studies a visual sensing system that operates at high magnification with a large depth of field and high precision, aiming to achieve 3D topography measurement of small industrial components.

[0004] Currently, methods for measuring the three-dimensional morphology of micro-objects are mainly divided into two categories: contact measurement and non-contact measurement. Contact measurement uses a probe to directly contact the surface of the object being measured, thereby determining the coordinate positions of various points on the surface in the world coordinate system. This equipment was initially widely used in the field of three-dimensional measurement of macroscopic objects. However, with the development of modern measurement technology, there are now instruments of this type with accuracy down to the micrometer level, which can meet the requirements for measuring micro-objects. However, its biggest drawback is that it must make contact with the surface of the object being measured during measurement, resulting in low efficiency. It is obviously not feasible for measurement samples whose materials are easily deformed. Non-contact measurement methods mainly refer to optical measurement methods, which have advantages such as high accuracy and fast measurement speed. They are more suitable for most three-dimensional measurement situations. Common optical three-dimensional microscopy measurement methods include confocal microscopy, white light interferometry, and structured light-based three-dimensional microscopy measurement technology.

[0005] Confocal microscopy, due to its single-point measurement, offers extremely high accuracy but is time-consuming, making it unsuitable for rapid 3D topography detection. White light interferometry can achieve nanometer-level precision, but it requires the use of beam interference to acquire information during measurement, which places high demands on the stability of the optical path mechanical structure. It also needs to avoid interference from complex external environments. The process of restoring the 3D topography of an object also requires very complex interference fringe image processing. Furthermore, both confocal microscopy and white light interferometry involve complex structures, have extremely high requirements for optical precision, and use expensive piezoelectric ceramic drive systems, resulting in high system setup costs.

[0006] Structured light measurement is an active measurement method that introduces an active light source to solve the image matching problem in passive vision. Three-dimensional microscopic measurement technology based on structured light has a measurement range at the millimeter level and a measurement accuracy at the micrometer level. It is suitable for measuring most micro-objects, and its measurement system has a relatively simple structure, low cost, and is easy to maintain. While this technology has a long history of development in the three-dimensional shape measurement of macroscopic objects, research on its application in the three-dimensional shape measurement of micro-objects is still in its early stages, thus showing great promise for future applications. Summary of the Invention

[0007] Currently, in microscopic 3D reconstruction, due to the fact that microscope objectives operate at extremely short working distances, they have high magnification and small depth of field. This leads to a significant decrease in the measurement accuracy of 3D morphology outside the depth of field when the microscopic 3D detector is applied to samples with large surface depth differences. To overcome the above problems, the purpose of this invention is to provide a high-precision microscopic 3D morphology scanning method, system, and application with large depth of field.

[0008] To achieve the above objectives, the technical solution of the present invention is as follows:

[0009] A method for high-precision microscopic 3D topography scanning with large depth of field, comprising the following steps:

[0010] 1) Establish an imaging model based on the principle of intersection imaging;

[0011] 2) Based on the imaging model, combined with the imaging rules and the geometric relationship of light propagation, obtain the depth direction information and object surface size information of the two dimensions of the acquired image, and derive the conversion equation between the image plane and the object plane;

[0012] 3) The parameters in the system's object-image relationship equation are calibrated experimentally;

[0013] 4) Use a line laser to scan the object, calculate the spatial coordinates of the sampling points based on the calibration results, and complete the three-dimensional reconstruction.

[0014] A large depth-of-field, high-precision microscopic three-dimensional topography scanning system is used to acquire the surface three-dimensional topography of non-transparent parts using the method described above.

[0015] It includes an illumination unit, an imaging unit, a displacement unit, and an information control unit;

[0016] The illumination unit is a line laser, with a minimum imaging linewidth on the order of micrometers;

[0017] The imaging plane of the imaging unit is tilted, and intersects with the line laser plane and the lens plane in a straight line, so that the line laser plane can be clearly imaged, thereby realizing rapid and high-precision microscopic three-dimensional morphology scanning of the sample under test by using line laser scanning.

[0018] The imaging unit includes a microscope objective, a 45° reflecting mirror, a sleeve lens, and a surface array detector. The microscope objective images the sample, and the reflecting mirror deflects the imaging optical axis of the microscope objective. The deflected light rays are then converged by the sleeve lens onto the surface array detector to form an image, thus completing one image acquisition.

[0019] The imaging unit employs a cage structure to couple the microscope objective and the sleeve lens, and uses a reflector to change the direction of the optical axis. The surface array detector forms an acute angle with the optical axis and forms an image relationship with the line laser plane about the microscope objective.

[0020] The displacement unit is a high-precision combined three-dimensional displacement stage, used to place the sample to be tested for coarse adjustment and micron-level fine adjustment.

[0021] The information control unit includes a computer and a displacement stage controller.

[0022] The line laser of the illumination unit is incident obliquely onto the surface of the sample to be tested.

[0023] The displacement unit has a scanning direction perpendicular to the direction of the line laser stripes and is controlled by a displacement stage controller, achieving micron-level displacement accuracy. The other two directions are coarsely adjusted manually.

[0024] The rapid and high-precision microscopic three-dimensional morphology scanning of the sample to be tested is achieved by using a line laser as the light source and the object to be tested undergoing rapid linear motion. At the same time, the position of the surface array detector is adjusted to clearly image the laser line, thereby achieving high-precision three-dimensional reconstruction.

[0025] One method for applying the system described above includes the following steps:

[0026] 1) Place the object to be measured on the displacement unit and adjust it into the system's field of view;

[0027] 2) Control the displacement unit to move continuously and linearly, while simultaneously enabling the surface array detector to acquire laser stripe images in the same amount of time;

[0028] 3) The laser stripe information is processed during the acquisition process, including image preprocessing and extraction of the laser stripe center line;

[0029] 4) The coordinates of the sampling points of each image in the object space are obtained using the calibration results. The coordinates of multiple images in the object space are arranged in order to obtain the complete three-dimensional surface morphology.

[0030] The beneficial effects of this invention are:

[0031] This invention discloses a large depth-of-field, high-precision microscopic 3D topography scanning system. It utilizes a special imaging structure based on intersection lines and a rotating microscopic imaging system with a surface array detector, enabling clear imaging of the entire light plane. This optimizes the clarity of laser stripe images, achieving a large depth-of-field scanning range while improving the accuracy of point clouds in the 3D reconstruction process and reducing errors. It allows for the acquisition of 3D point clouds of complex parts' surfaces in a single scan. By effectively combining line laser scanning and microscopic imaging through extended depth-of-field technology, the system achieves high efficiency and high precision. The acquired 3D point cloud data provides a reliable data source for subsequent part surface topography analysis, further enhancing the accuracy of inspection. Therefore, this system has significant application value in fields such as automated processing and part surface inspection. Attached Figure Description

[0032] Figure 1 This is a laser triangulation measurement optical path diagram.

[0033] Figure 2 This is a schematic diagram of the imaging principle based on intersection lines.

[0034] Figure 3 This is a schematic diagram of Hinge's Law.

[0035] Figure 4 This is a schematic diagram of a large depth-of-field, high-precision microscopic three-dimensional topography scanning system.

[0036] Figure 5 This is a schematic diagram of the system's spatial coordinates.

[0037] In the figure, there are: illumination unit 1, microscope objective 2, reflector 3, sleeve lens 4, area array detector 5, displacement unit 6, imaging unit 7, computer 8, displacement stage controller 9, and information control unit 10. Detailed Implementation

[0038] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings and specific examples. It should be understood that the specific embodiments described herein are only for explaining the present invention and are not intended to limit the present invention. Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0039] To facilitate the implementation of this invention, the principle of using line lasers for three-dimensional shape reconstruction will be explained first.

[0040] Line laser scanning 3D reconstruction uses laser triangulation to recover the spatial coordinates of an object. Laser triangulation is the basis for quantitative analysis of 3D surface imaging using optical microscopy. When using a line laser, the basic measurement principle of laser triangulation is as follows: Figure 1 As shown, a line laser source is projected onto the surface of the object to be measured. The image detector observes the bending of the laser stripes caused by the change in the surface morphology of the object from another angle and acquires the modulated laser stripe image. Then, according to the principle of triangulation, the surface data of the object is obtained based on the object-image relationship.

[0041] like Figure 1 As shown, the incident ray AE makes an angle of α2 with the normal to the object being measured. The laser intersects the highest and lowest points of the object at points A and E, respectively. Based on the location of the imaging lens, the reflection angle of the ray at point A is α2, and it enters the image sensor after passing through the imaging lens. Extend OA in the opposite direction as shown in the figure, draw OG perpendicular to EG with the foot of the perpendicular at G, and draw DF perpendicular to OC through point D with the foot of the perpendicular at F.

[0042] Based on the similarity between triangle OEG and triangle ODF, the following relationship can be obtained:

[0043] (1)

[0044] ,

[0045] (2)

[0046] (3)

[0047] As can be seen from formula (3), the relative displacement information between AB can be obtained by using fixed system structure parameters such as α1 and α2 and the distance CD between the two imaging positions collected by the image sensor. The distance between the two pixel imaging positions can be calculated by using the number of pixels that the two points cross on the image and the pixel size in the image sensor parameters.

[0048] Imaging depth of field is usually related to the focal length, aperture number, and working distance of the imaging system. The shorter the working distance, the higher the magnification of the object by the imaging system. The shorter the working distance, the smaller the depth of field of the imaging system will be. Therefore, high magnification means smaller depth of field. That is, depth of field is negatively correlated with system magnification. In close-range measurement, the object being measured can only be clearly imaged within a very small range. The part outside the depth of field will produce a defocus phenomenon, and many feature information will be lost as a result, which seriously affects the measurement accuracy. The depth of field affects this type of visual sensor with high magnification and small field of view. In the process of 3D topography reconstruction using line laser scanning, for macroscopic objects, the imaging system used for measurement usually has a large depth of field range, and no special method is needed to extend the depth of field. However, for the measurement of microscopic objects, the small depth of field caused by high magnification makes it impossible for laser lines outside the depth of field to be focused on the image sensor, resulting in large errors in the acquired raw data image. For example, using a common 4x microscope objective, the theoretically calculated depth of field under a common imaging optical path structure is about 40.5 micrometers, which is a very small field of view in the depth direction. In order to overcome the problem of small depth of field in existing microscopic scanning systems, a microscopic light sheet scanning 3D surface imaging structure based on the intersection principle is introduced to expand the depth of field range of the entire imaging system.

[0049] The imaging principle based on intersection lines is specifically described as follows: by tilting the image plane so that the object plane, the imaging lens plane, and the image plane intersect on a straight line, a clear image of the target object near the object plane can be obtained. Figure 2 As shown, because its shape resembles turning pages in a book, this rule is also known as the hinge rule. Theoretically, an imaging system that satisfies the above imaging rules can achieve infinite depth of field when using large-aperture imaging lenses, clearly imaging objects over long distances and achieving infinite depth of focus.

[0050] However, the intersection of the three planes at a single point is only a necessary condition, not a necessary and sufficient condition, for clear imaging. Here, we need to supplement this imaging principle by introducing the constraint effect of the lens's focal length on the object-image plane. According to Newton's law of imaging, when the object and image space media are the same, the object distance and image distance of a lens with focal length f satisfy the following condition:

[0051]

[0052] Combining the geometric laws in imaging, we can derive the following: Figure 3The imaging principle is illustrated below. Specifically, if an auxiliary plane is drawn through the object plane intersection point parallel to the lens plane, and another auxiliary plane is drawn through the lens center parallel to the image plane, then the object plane must pass through the intersection of these two auxiliary planes. According to the above theory, the object plane intersects the lens plane and the image plane along a single line. Therefore, two parallel lines can be used to determine the unique position of the object plane corresponding to the image plane. This concludes the explanation of the intersection-based imaging method for extending depth of field and its supplementary laws.

[0053] Based on the above description of the imaging principle, in actual online laser microscopy 3D reconstruction, the object plane is the line laser light plane, the lens plane is the equivalent lens plane of the microscope objective, and the image plane is the photosensitive surface of the area array detector. When the light plane, the equivalent lens plane, and the photosensitive surface intersect on the same line, the images corresponding to all objects on the light plane will be clearly focused, thereby acquiring clear laser stripes, reducing errors in the original data, and improving the extraction accuracy of the laser stripe centerline coordinates in subsequent image processing, thus obtaining accurate reconstructed 3D point cloud spatial coordinates and reducing reconstruction errors.

[0054] After determining the optical path structure used by the system, the correspondence between image space and object space can be derived based on geometric optics and the geometric relationships of light propagation, as shown below.

[0055] (4)

[0056] (5)

[0057] in, Z Let be the distance from the object point to the equivalent lens plane. f The equivalent focal length of the microscope objective is... φ The angle between the image plane and the equivalent lens plane. P I The location of the imaging point; h This represents the true height of the object in the direction parallel to the lines of intersection with the three planes. For its corresponding image height, β The vertical magnification is the magnification at the imaging location.

[0058] This invention combines the aforementioned imaging principle based on intersection lines and line laser scanning imaging technology to provide a feasible line laser microscopic three-dimensional surface imaging system. Through a special imaging structure based on intersection lines, it achieves large depth-of-field scanning with line lasers, enabling the reconstruction, measurement, and visualization of the three-dimensional morphology of non-transparent microscopic sample surfaces.

[0059] A high-precision, large depth-of-field microscopic 3D topography scanning system includes an illumination unit, an imaging unit, a displacement unit, and an information control unit. The illumination unit uses a blue semiconductor laser diode to emit a line laser onto the sample to be scanned. Based on the specific topographic features of the sample surface, the line laser is modulated into a corresponding line shape. The reflected light from the line laser on the sample is collected by the microscope objective and integrated into parallel light. This parallel light is then converged through a telescope lens onto an array detector, thus completing the acquisition of one contour line. Since the 3D topography of an object is composed of several contour lines, this acquisition process is repeated multiple times. Specifically, a high-precision linear displacement stage enables continuous image acquisition.

[0060] The illumination unit is a line laser with a minimum imaging linewidth on the order of micrometers, also known as a laser sheet. Based on the response wavelength of the area array detector, a blue semiconductor laser diode is used as the line laser source, and it is incident on the sample surface at a certain angle.

[0061] The imaging unit may consist of a microscope objective, a mirror, a sleeve lens, and a surface array detector, and is used to collect line laser line pattern after the surface topography of the object is modulated.

[0062] The microscope objective can be a 4x microscope objective with a long working distance, used for imaging laser lines.

[0063] The sleeve lens is used to focus the image at infinity formed by the microscope objective.

[0064] The area array detector is used to convert the optical signal focused by the sleeve lens into an electrical signal and transmit it to the computer for further data processing.

[0065] The imaging unit adopts a cage structure to couple the microscope objective and the sleeve lens, and uses a reflector between them to change the direction of the optical axis, avoiding the climbing structure, making the system more stable and easier to adjust.

[0066] The displacement unit is a high-precision combined three-dimensional displacement stage.

[0067] The high-precision combined three-dimensional displacement stage, wherein the one aligned with the scanning direction should be a high-precision electric displacement stage, and the other two directions can be set as manual displacement stages.

[0068] The displacement unit is used to place the sample. The accuracy of the displacement stage, which is aligned with the scanning direction, needs to meet the measurement requirements. Its accuracy control determines the scanning accuracy in a fixed direction in the unit point cloud. The other two directions can be coarsely adjusted to adjust the sample position to the region of interest. The displacement stage surface is perpendicular to the optical axis of the microscope objective.

[0069] The information control unit consists of a computer and a displacement stage controller. The computer simultaneously controls the area array detector and the displacement stage to achieve synchronous scanning and completes the subsequent laser line center extraction and three-dimensional reconstruction process.

[0070] System Implementation Examples

[0071] This invention provides a large depth-of-field, high-precision microscopic three-dimensional topography scanning system, such as... Figure 4 As shown, it includes an illumination unit 1, a microscope objective 2, a reflector 3, a sleeve lens 4, a surface array detector 5, a displacement unit 6, an imaging unit 7, a computer 8, a displacement stage controller 9, and an information control unit 10.

[0072] To more clearly illustrate the structure and working principle of the device of the present invention, a spatial rectangular coordinate system is established with the plane containing the equivalent lens as the XOY plane, as follows: Figure 5 As shown, only the object plane and the equivalent lens plane are drawn for illustration. The direction perpendicular to the lens plane downwards is the positive Z-axis. In the illustration, Y is the height direction of the object plane parallel to the laser stripe, and X is the scanning direction of the system perpendicular to the laser stripe. The descriptions of the three directions are replaced by coordinate axis letters.

[0073] The sample is placed on the displacement unit 6. Due to the surface morphology of the sample, the laser line bends to varying degrees in different parts. The reflected light from the modulated laser line along the optical axis is collected by the microscope objective 2 and imaged at infinity. Then, it is focused by the sleeve lens 4 and imaged onto the area array detector 5, thus completing one scanning imaging process. By controlling the displacement unit 6 to complete the step scanning, the original image sequence is obtained. Further image processing and calibration results are then used to obtain the three-dimensional morphology point cloud data of the microscopic surface.

[0074] The illumination unit 1 integrates a Powell prism laser diode to emit a line laser for measurement. The laser focusing position can be adjusted by a stacked focusing ring. When the measurement distance is 8-20 cm, the line width of the line laser can be adjusted to 5 micrometers.

[0075] The displacement unit 6 is a high-precision combined three-dimensional displacement stage, in which the sample height can be manually coarsely and finely adjusted in the Z direction, and the sample placement position can be manually finely adjusted in the Y direction. The scanning direction X direction is a high-precision linear electric displacement stage, which is controlled by the electric displacement stage controller 9. The minimum displacement step size with an error within 20% is 5 micrometers, which can ensure the high precision and continuity of the three-dimensional point cloud coordinates.

[0076] The imaging unit 7 includes a microscope objective 2, a reflector 3, a sleeve lens 4, and a surface array detector 5. It adopts a cage structure to couple the microscope objective and the sleeve lens, and uses a reflector between them to change the optical axis direction by 90°, avoiding the need for a high-rise structure, making the system more compact and easier to adjust.

[0077] The microscope objective 2 is a 4x plan achromatic objective with a focal length of 45mm and a working distance of approximately 18.5mm. It is used to collect reflected light from the line laser along the optical axis and to form an image.

[0078] The reflector 3 is placed behind the microscope objective 2 at a 45-degree angle to the optical axis of the objective. It is used to change the direction of the optical axis and reverse the image formed by the microscope objective 2 by 90 degrees, making the system easier to adjust and more compact and portable.

[0079] The sleeve lens 4 is placed after the reflector 3 and uses an achromatic cemented doublet lens with a focal length of 50 mm to converge the image of the microscope objective 2 obtained by the reflection of the reflector 3 at infinity onto the subsequent sensor.

[0080] The area array detector 5 is placed behind the sleeve lens to receive the image formed by the convergence of the sleeve lens. The photosensitive surface of the detector rotates around the Y axis and has a certain angle with the optical axis, thereby achieving clear imaging of the light plane. The area array detector 5 uses a large target surface black and white CMOS sensor with a diagonal of 15.9mm, which can obtain the maximum depth range while adapting to the microscopic field of view.

[0081] The information control unit 10 consists of a computer 8 and a displacement stage controller 9. The computer 8 simultaneously controls the surface array detector and the high-precision linear electric displacement stage in the X direction to achieve synchronous scanning, and completes the subsequent image data optimization, laser line center extraction and three-dimensional coordinate recovery processes to reconstruct the three-dimensional morphology of the surface of the micro-object.

[0082] Application Example 1

[0083] This invention discloses a large depth-of-field, high-precision microscopic three-dimensional topography scanning system that can be used to detect surface defects in micro-industrial parts. First, three-dimensional point cloud data of a standard part is acquired. Then, three-dimensional point cloud data of a common part is obtained through scanning and compared with the standard part. This allows for the determination of topographic deviations of various parts of the part from the standard part. Finally, artificial intelligence methods are used to identify the type of surface defect, thereby achieving the purpose of topography detection.

[0084] Application Example 2

[0085] This invention provides a high-precision, large-depth-of-field microscopic three-dimensional topography scanning system that can be used to measure the dimensions of micro-parts with complex surfaces. The calibrated system achieves measurement accuracy at the micrometer level. For micro-parts with standardized production processes, the point cloud data acquired through three-dimensional topography scanning can provide the dimensions of each part.

[0086] The embodiments described above can be further combined or replaced, and these embodiments are merely descriptions of preferred embodiments of the present invention, not limitations on the concept and scope of the present invention. Various changes and improvements made to the technical solutions of the present invention by those skilled in the art without departing from the inventive concept are all within the protection scope of the present invention. The protection scope of the present invention is given by the appended claims and any equivalents.

Claims

1. A large depth-of-field, high-precision microscopic three-dimensional topography scanning system, characterized in that, The steps for obtaining the surface three-dimensional morphology of a non-transparent part are as follows: 1) Establish an imaging model based on the principle of intersection imaging; 2) Based on the imaging model, combined with the imaging rules and the geometric relationship of light propagation, obtain the depth direction information and object surface size information of the two dimensions of the acquired image, and derive the conversion equation between the image plane and the object plane; 3) The parameters in the system's object-image relationship equation are calibrated experimentally; 4) Use a line laser to scan the object, calculate the spatial coordinates of the sampling points based on the calibration results, and complete the three-dimensional reconstruction; The large depth-of-field high-precision microscopic three-dimensional topography scanning system includes an illumination unit (1), an imaging unit (7), a displacement unit (6), and an information control unit (10). The illumination unit (1) is a line laser with a minimum imaging linewidth on the order of micrometers; The imaging plane of the imaging unit (7) is tilted and intersects the line laser plane and the lens plane in a straight line, so that the line laser plane can be clearly imaged, thereby realizing rapid and high-precision microscopic three-dimensional morphology scanning of the sample under test by using line laser scanning. The imaging unit (7) includes a microscope objective (2), a 45° mirror (3), a sleeve lens (4), and a surface array detector (5). The microscope objective (2) images the sample, and the mirror (3) deflects the imaging optical axis of the microscope objective (2). The deflected light is focused by the sleeve lens (4) onto the surface array detector (5) to form an image, thus completing one image acquisition. The imaging unit (7) uses a cage structure to couple the microscope objective (2) and the sleeve lens (4), and uses a mirror (3) to change the direction of the optical axis. The surface array detector (5) forms an acute angle with the optical axis and forms an image relationship with the line laser plane about the microscope objective (2).

2. The system according to claim 1, characterized in that: The displacement unit (6) is a high-precision combined three-dimensional displacement stage used to place the sample to be tested for coarse adjustment and micron-level fine adjustment.

3. The system according to claim 1, characterized in that: The information control unit (10) includes a computer (8) and a displacement stage controller (9).

4. The system according to claim 1, characterized in that, The line laser of the illumination unit (1) is incident obliquely onto the surface of the sample to be tested.

5. The system according to claim 1, characterized in that, The displacement unit (6) has a scanning direction perpendicular to the direction of the line laser stripe and is controlled by the displacement stage controller (9). It has micron-level displacement accuracy, and the other two directions are coarsely adjusted manually.

6. The system according to claim 1, characterized in that: The rapid and high-precision microscopic three-dimensional morphology scanning of the sample to be tested is achieved by using a line laser as the light source and the object to be tested to perform rapid linear motion. At the same time, the laser line is clearly imaged by adjusting the position of the surface array detector (5) to achieve high-precision three-dimensional reconstruction.

7. An application method of the system according to claim 1, characterized in that, The steps are as follows: 1) Place the object to be measured on the displacement unit and adjust it into the system's field of view; 2) Control the displacement unit to move continuously and linearly, while simultaneously enabling the surface array detector to acquire laser stripe images in the same amount of time; 3) The laser stripe information is processed during the acquisition process, including image preprocessing and extraction of the laser stripe center line; 4) The coordinates of the sampling points of each image in the object space are obtained using the calibration results. The coordinates of multiple images in the object space are arranged in order to obtain the complete three-dimensional surface morphology.

Images