Wafer transfer device

Abstract

The application relates to a wafer conveying device, comprising: a conveying track for placing wafers, the conveying track comprising a plurality of rotating shafts arranged perpendicularly to the conveying direction of the conveying track; a driving assembly in driving connection with the plurality of rotating shafts for driving the rotating movement of the plurality of rotating shafts; wherein the outer periphery of each rotating shaft is fixedly sleeved with a plurality of first guide rollers, the outer periphery of the first guide rollers is provided with spiral protruding ribs; the plurality of first guide rollers are symmetrical about the conveying center line of the conveying track, and the spiral protruding ribs extend spirally towards the conveying center line in the rotating direction of the rotating shafts. By arranging the spiral protruding ribs on the outer periphery of the first guide rollers, the contact area between the first guide rollers and the warped wafers can be increased, so that the conveying efficiency and the supporting stability of the wafers are improved; by limiting the extension direction of the spiral protruding ribs, a thrust force perpendicular to the conveying direction can be generated on the wafers, so that the wafers are moved towards the conveying center line of the conveying track, and the centering guiding effect is achieved.

Description

Technical Field

[0001] This invention relates to the field of wafer transport equipment technology, and in particular to a wafer transport device. Background Technology

[0002] With the rapid development of the semiconductor industry, the feature size of integrated circuits is becoming increasingly smaller, and semiconductor wafers are constantly developing towards smaller volume and higher circuit density. The high flatness of the semiconductor thin film surface has an important impact on the high performance, low cost and high yield of devices. Therefore, the requirements for the flatness of the wafer surface will become increasingly stringent.

[0003] In wafer manufacturing processes, wafer transport devices are typically used to move wafers. If the wafer's trajectory deviates during transport, it can affect the transport or unloading process, and may even damage the flatness of the wafer surface. Summary of the Invention

[0004] In view of the above-mentioned defects in the prior art, the purpose of the present invention is to provide a wafer transfer device that can improve the transfer efficiency of warped wafers and also promote the wafer to move toward the transfer center line of the transfer track, thereby playing a centering and guiding role.

[0005] Therefore, the present invention provides the following technical solution.

[0006] This invention provides a wafer transport device, comprising:

[0007] A transport track for placing wafers, the transport track including multiple rotating shafts arranged perpendicular to the transport direction of the transport track;

[0008] A drive assembly, which is connected to the plurality of rotating shafts, is used to drive the plurality of rotating shafts to rotate.

[0009] Each of the rotating shafts is fixedly fitted with a plurality of first guide rollers on its outer periphery, and the first guide rollers are provided with spiral ribs on their outer periphery; the plurality of first guide rollers are symmetrical about the transmission center line of the transmission track, and the spiral ribs extend spirally toward the transmission center line in the rotation direction of the rotating shaft.

[0010] Preferably, on the same rotating shaft, the spiral angle of the spiral rib on the first guide roller that is closer to the transmission center line is larger.

[0011] Preferably, there are at least six first guide rollers on the rotating shaft.

[0012] Preferably, the first guide rollers on any two adjacent rotating shafts are staggered along the axial direction of the rotating shaft.

[0013] Preferably, the spiral rib has more than one spiral turn.

[0014] Preferably, on the same first guide roller, the number of spiral ribs is at least two and the number of spiral turns of the spiral ribs is less than two.

[0015] Preferably, the outer contours of both ends of the spiral rib are curved surfaces.

[0016] Preferably, it further includes a second guide roller with supporting ribs on its outer periphery; the second guide roller is disposed at the center of at least one of the rotating shafts, and the plane of the supporting ribs is perpendicular to the central axis of the rotating shaft.

[0017] Preferably, the supporting rib is annular.

[0018] Preferably, both the spiral rib and the supporting rib are antistatic plastic parts.

[0019] The present invention has the following technical effects:

[0020] This invention provides a wafer transport device, including a transport track and a drive assembly. The transport track includes multiple rotating shafts, each with multiple first guide rollers fixedly fitted around its outer periphery. By providing helical ribs on the outer periphery of the first guide rollers, the contact area between the first guide rollers and the warped wafer can be increased, thereby improving the transport efficiency and support stability of the wafer. Furthermore, by defining the extension direction of the helix of the helical ribs, a thrust perpendicular to the transport direction can be generated on the wafer to fine-tune the wafer's movement direction, causing the wafer to move towards the transport centerline of the transport track, thus achieving a centering and guiding function. Attached Figure Description

[0021] Figure 1 This is a three-dimensional structural diagram of the wafer transport device of the present invention in the state of transporting wafers.

[0022] Figure 2 This is a schematic diagram of the assembly structure of the rotating shaft and the first guide roller in the first embodiment of the present invention;

[0023] Figure 3 This is a schematic diagram of the assembly structure of the rotating shaft and the first guide roller in the second embodiment of the present invention;

[0024] Figure 4 This is a schematic diagram of the assembly structure of the rotating shaft and the first guide roller in the third embodiment of the present invention;

[0025] Figure 5 This is a three-dimensional structural schematic diagram of the first guide roller of the present invention;

[0026] Figure 6 This is a three-dimensional structural schematic diagram of the second guide roller of the present invention;

[0027] Figure 7 for Figure 1 Enlarged view of the structure at point A in the middle.

[0028] Explanation of reference numerals in the attached figures

[0029] 100. Wafer transfer device;

[0030] 1. Conveyor track; 11. Rotating shaft; 12. First guide roller; 121. Spiral rib; 13. Second guide roller; 131. Support rib;

[0031] 2. Drive assembly; 21. Motor; 22. Drive shaft; 23. First magnetic wheel; 24. Second magnetic wheel; 25. Motor bracket; 26. Bearing bracket; 27. Bearing;

[0032] 200. Wafer. Detailed Implementation

[0033] To make the technical solution and beneficial effects of the present invention more apparent and understandable, a detailed description is provided below by listing specific embodiments. Unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application pertains.

[0034] In the description of this invention, unless otherwise expressly defined, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "height," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the purpose of simplifying the description of this invention and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. That is, they should not be construed as limiting this invention.

[0035] In this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating the relative importance of the indicated features or the number of indicated technical features. Therefore, a feature specified as "first" or "second" can explicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two; "several" means at least one; unless otherwise expressly defined.

[0036] In this invention, unless otherwise explicitly defined, the terms "installation," "connection," "linking," "fixing," and "setting," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral molding; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0037] In this invention, unless otherwise explicitly defined, the terms "above," "on top of," "over," "above," "below," "below," "below," or "below" for "first feature above second feature" can refer to the first and second features being in direct contact, or to the first and second features being in indirect contact through an intermediate medium. Furthermore, "above," "over," and "below" for "first feature above second feature" can mean the first feature is directly above or diagonally above the second feature, or simply indicates that the horizontal height of the first feature is higher than the horizontal height of the second feature. Similarly, "below," "below," and "below" for "first feature below second feature" can mean the first feature is directly below or diagonally below the second feature, or simply indicates that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0038] The following is based on Figures 1 to 7 The wafer transport device of the present invention will be described in detail.

[0039] In this embodiment, such as Figures 1 to 7 As shown, the wafer transfer device 100 includes a transfer track 1 and a drive assembly 2. The transfer track 1 is used to place the wafer 200. The transfer track 1 includes multiple rotating shafts 11, which are arranged perpendicular to the transfer direction of the transfer track 1. The drive assembly 2 is connected to the multiple rotating shafts 11 for driving the multiple rotating shafts 11 to rotate. Each rotating shaft 11 has multiple first guide rollers 12 fixedly fitted on its outer periphery. The first guide rollers 12 have helical ribs 121 on their outer periphery. The multiple first guide rollers 12 are symmetrical about the transfer center line of the transfer track, and the helical ribs 121 extend helically towards the transfer center line in the rotation direction of the rotating shaft 11.

[0040] When the wafer 200 is placed on the transport track 1, the lower surface of the wafer 200 is supported on the spiral ribs 121 of the first guide roller 12. Driven by the drive assembly 2, the rotating shaft 11 drives the first guide roller 12 to rotate, and the spiral ribs 121 of the first guide roller 12 generate a pushing force on the surface of the wafer 200 in contact with it, thereby playing the role of transporting the wafer 200.

[0041] The first guide roller 12, by providing helical ribs 121, reduces the surface area used by the first guide roller 12 to support the wafer 200. When the wafer transport device 100 is transporting a warped wafer, the alternating concave and convex surface structure of the first guide roller 12 improves its adaptability to the uneven surface of the wafer, thereby increasing the contact area between the first guide roller 12 and the warped wafer, thus improving the pushing efficiency and support stability of the wafer 200. Furthermore, by defining the structural shape and helical direction of the helical ribs 121, during the rotation of the first guide roller 12, the helical ribs 121 can simultaneously generate a thrust parallel to the transport direction and a thrust perpendicular to the transport direction on the lower surface of the wafer 200. The thrust parallel to the transport direction propels the wafer 200 forward, while the thrust perpendicular to the transport direction fine-tunes the movement direction of the wafer 200, causing the wafer 200 that is deviating from the transport centerline to move towards the transport centerline of the transport track, thereby achieving a centering and guiding effect. The overall structure of the transmission track 1 is simple, and the first guide roller 12 achieves guidance and centering during rotation, making operation convenient.

[0042] In one implementation, such as Figure 2 and Figure 3 As shown, multiple first guide rollers 12 are evenly distributed on the rotating shaft 11, which is beneficial for uniformly supporting the wafer 200.

[0043] In one implementation, such as Figure 2 As shown, on the same rotating shaft 11, the spiral angle of the spiral rib 121 on the first guide roller 12 that is closer to the transmission center line is larger, so that the thrust perpendicular to the transmission direction generated by the first guide roller 12 on the wafer 200 located on the outer side is greater than the thrust perpendicular to the transmission direction generated by the first guide roller 12 on the wafer 200 located on the inner side. The first guide roller 12 that is closer to the transmission center line is mainly used to generate a thrust parallel to the transmission direction, thereby simultaneously forming a more effective transmission power and guiding centering effect.

[0044] It should be understood that, such as Figure 3 As shown, on the same rotating shaft 11, the spiral angles of the spiral ribs 121 on each first guide roller 12 can also be equal. By strictly controlling the size of the spiral angle and / or the distance between two adjacent first guide rollers 12, the first guide roller 12 can generate good transmission power and guiding centering force for the wafer 200.

[0045] In one implementation, such as Figures 2 to 4As shown, there are at least six first guide rollers 12 on the rotating shaft 11, and there can be six, eight, ten or more. By increasing the number of first guide rollers 12, while ensuring that the first guide rollers 12 generate good transmission power and guiding centering force for the wafer 200, the length of a single first guide roller 12 can be reduced. The compact design of the first guide rollers 12 can reduce the processing difficulty of the first guide rollers 12 while ensuring the processing accuracy of the spiral ribs 121.

[0046] In one embodiment, the first guide rollers 12 on any two adjacent rotating shafts 11 are staggered along the axial direction of the rotating shaft 11 to increase the contact area between the first guide rollers 12 and the warped wafer, thereby improving the transmission efficiency and the guiding alignment effect.

[0047] In one implementation, such as Figure 5 As shown, the spiral rib 121 has more than one spiral turn, so that the spiral rib 121 can wrap around the roller body of the first guide roller 12 at least once, thereby increasing the contact area between the spiral rib 121 and the wafer 200 during rotation and improving transmission stability.

[0048] Furthermore, such as Figure 5 As shown, on the same first guide roller 12, the number of spiral ribs 121 is at least two, and the number of spiral turns of a single spiral rib 121 is less than two. This makes the distribution of spiral ribs 121 on the first guide roller 12 more reasonable and facilitates processing and manufacturing.

[0049] Furthermore, such as Figure 5 As shown, the outer contours of both ends of the spiral rib 121 are curved surfaces to prevent the ends of the spiral rib 121 from scratching the lower surface of the wafer 200 during the rotation of the spiral rib 121.

[0050] In one implementation, such as Figure 4 and Figure 6 As shown, it also includes a second guide roller 13, which has a supporting rib 131 on its outer periphery; the second guide roller 13 is provided at the center of at least one rotating shaft 11, and the plane where the supporting rib 131 is located is perpendicular to the central axis of the rotating shaft 11, so that the second guide roller 13 located at the center of the rotating shaft 11 can concentrate the pushing force on the wafer 200 parallel to the transmission center line, thereby improving the transmission efficiency.

[0051] Furthermore, each rotating shaft 11 is provided with a second guide roller 13, and the second guide roller 13 is located at the center of the rotating shaft 11.

[0052] Furthermore, the supporting rib 131 is ring-shaped and has a closed-loop structure with a smooth outer contour to avoid scratching the wafer 200.

[0053] In one embodiment, both the spiral rib 121 and the support rib 131 are antistatic plastic parts, which have an antistatic effect to reduce the static electricity phenomenon of the wafer 200 during the transmission process. In addition, both the spiral rib 121 and the support rib 131 are soft plastic parts, such as rubber structures, to avoid the spiral rib 121 and the support rib 131 scratching the surface of the wafer 200.

[0054] In one embodiment, the first guide roller 12 is mounted on the rotating shaft 11 by a set screw, which makes assembly convenient and allows for easy adjustment of the mounting position of the first guide roller 12 on the rotating shaft 11.

[0055] In one embodiment, the second guide roller 13 is mounted on the rotating shaft 11 by a set screw, which makes assembly convenient and allows for easy adjustment of the mounting position of the second guide roller 13 on the rotating shaft 11.

[0056] In one implementation, such as Figure 7 As shown, the drive assembly 2 includes a motor 21, a transmission shaft 22, and multiple first magnetic wheels 23, which are evenly mounted on the transmission shaft 22. The central axis of the rotating shaft 11 is perpendicular to the central axis of the transmission shaft 22. A second magnetic wheel 24 is mounted on the end of the rotating shaft 11 near the drive assembly 2, and each second magnetic wheel 24 of the rotating shaft 11 is spaced apart from one of the first magnetic wheels 23 of the drive assembly 2. When the motor 21 drives the first magnetic wheel 23 to rotate, the spaced first magnetic wheel 23 and the second magnetic wheel 24 are driven by the principle of magnetic repulsion and attraction, which in turn drives the second magnetic wheel 24 to rotate, ultimately driving the rotating shaft 11 to rotate the first guide roller 12, and the transmission is stable.

[0057] Furthermore, such as Figure 1 and Figure 7 As shown, the wafer transfer device 100 is provided with multiple drive components 2 to improve the stability of the drive.

[0058] Furthermore, such as Figure 7 As shown, the wafer transfer device 100 includes a frame 3, and the drive assembly 2 includes a motor bracket 25, a bearing bracket 26, and a bearing 27. The motor bracket 25 fixes the motor 21 to the frame 3, and the bearing bracket 26 is fixed to the frame 3 and fixes the bearing 27. The bearing 27 supports the drive shaft 22, thereby improving its rotational stability.

[0059] Furthermore, the drive assembly 2 also includes a belt drive mechanism, through which the motor 21 transmits the rotational driving force to the drive shaft 22, thereby improving the driving stability of the entire drive assembly 2.

[0060] Of course, the transmission method of the drive component 2 is not limited to magnetic transmission, but also includes transmission methods that can generate rotational driving force, such as gear transmission or belt transmission.

[0061] It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations included in the claims. Various modifications and changes can be made to the above embodiments without departing from the scope of this disclosure. Similarly, the various technical features of the above embodiments can be arbitrarily combined to form other embodiments of the present invention that may not be explicitly described. Therefore, the above embodiments only illustrate several implementations of the present invention and do not limit the scope of protection of this patent.

Claims

1. A wafer transport device, characterized in that, include: A transfer track (1) is used to place a wafer (200). The transfer track (1) includes a plurality of rotating shafts (11) which are arranged perpendicular to the transfer direction of the transfer track (1). The drive assembly (2) is connected to the plurality of rotating shafts for driving the plurality of rotating shafts to rotate. Each of the rotating shafts (11) is fixedly fitted with a plurality of first guide rollers (12) on its outer periphery. The first guide rollers (12) are provided with spiral ribs (121) on their outer periphery. When the wafer (200) is placed on the transmission track (1), the lower surface of the wafer (200) is supported on the spiral ribs (121) of the first guide rollers (12). The plurality of first guide rollers (12) are symmetrical about the transmission center line of the transmission track, and the spiral ribs (121) extend spirally toward the transmission center line in the rotation direction of the rotating shaft (11). On the same rotating shaft (11), the spiral angle of the spiral rib (121) on the first guide roller (12) closer to the transmission center line is larger; the spiral rib (121) has more than one spiral turn; on the same first guide roller (12), the number of spiral ribs (121) is at least two and the spiral ribs (121) have less than two spiral turns.

2. The wafer transport device according to claim 1, characterized in that, There are at least six first guide rollers (12) on the rotating shaft (11).

3. The wafer transport device according to claim 1, characterized in that, The first guide rollers (12) on any two adjacent rotating shafts (11) are staggered along the axial direction of the rotating shafts (11).

4. The wafer transport device according to claim 1, characterized in that, The outer contours of both ends of the spiral rib (121) are curved surfaces.

5. The wafer transport device according to any one of claims 1-3, characterized in that, It also includes a second guide roller (13), which has a supporting rib (131) on its outer periphery; the second guide roller is provided at the center of at least one of the rotating shafts (11), and the plane of the supporting rib (131) is perpendicular to the central axis of the rotating shaft (11).

6. The wafer transport device according to claim 5, characterized in that, The supporting rib (131) is ring-shaped.

7. The wafer transport device according to claim 5, characterized in that, Both the spiral rib (121) and the support rib (131) are antistatic plastic parts.

Images