A semiconductor-pumped solid-fiber laser

Abstract

The application discloses a kind of semiconductor pumping solid optical fiber lasers, it is related to optical fiber laser technical field;It improves to check whether the aging damage of optical fiber is removed laser, more troublesome complex, the impact and vibration generated by outside possibly lead to the damage of internal element of optical fiber laser problem, and the present application includes first shell and the second shell being arranged in first shell side, the first shell is connected with second shell by dismounting mechanism, the inside of the first shell is provided with first installation bucket, the side of the first installation bucket is provided with second installation bucket;The present application is provided with first shell and second shell, so that first shell and second shell can be separated from each other, whether the doped optical fiber inside the transparent connecting ring is aging damaged or not is observed through the gap between first shell and second shell, without dismounting the doped optical fiber for observation, simple and convenient operation, save a certain amount of labor.

Description

Technical Field

[0001] This invention relates to the field of fiber laser technology, specifically to a semiconductor-pumped solid-state fiber laser. Background Technology

[0002] A laser is a device that emits laser light. Based on the working medium, lasers can be divided into four main categories: gas lasers, solid-state lasers, semiconductor lasers, and dye lasers. Recently, free-electron lasers have also been developed. High-power lasers typically have pulsed output. Fiber lasers consist of three basic elements: a pump source, a gain medium, and a resonant cavity. The pump source generally uses a high-power semiconductor laser, the gain medium is rare-earth-doped fiber or ordinary nonlinear fiber, and the resonant cavity can be constructed from optical feedback elements such as fiber gratings to form various linear resonant cavities, or from various ring resonant cavities using couplers. The pump light is coupled into the gain fiber through a suitable optical system. After absorbing the pump light, the gain fiber forms population inversion or nonlinear gain and generates spontaneous emission. The generated spontaneous emission light is amplified by stimulated emission and the mode selection effect of the resonant cavity, ultimately forming a stable laser output.

[0003] Currently, doped fibers in medium- and high-power fiber lasers generate laser light under the action of pump light, but also generate a lot of heat. This heat causes the fiber temperature to rise, and long-term use causes aging of the outer polymer layer of the fiber communication. At present, most methods are to disassemble the laser to check whether the fiber is aged or damaged, but disassembly is relatively troublesome and complicated, wasting a certain amount of labor. Moreover, during the use of fiber lasers, external impacts and vibrations may damage the internal components of the fiber laser, affecting the service life of the device.

[0004] To address the aforementioned problems, the inventors proposed a semiconductor-pumped solid-state fiber laser. Summary of the Invention

[0005] To address the problem that disassembling a laser to inspect for aging or damage to the fiber optic cable is cumbersome and complex, and that external impacts and vibrations may damage the internal components of the fiber laser, the present invention aims to provide a semiconductor-pumped solid-state fiber laser.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: It includes a first housing and a second housing disposed on one side of the first housing. The first housing and the second housing are connected by a disassembly mechanism. A first mounting barrel is disposed inside the first housing, and a second mounting barrel is disposed on one side of the first mounting barrel. The first mounting barrel and the second mounting barrel are fixedly connected by a transparent connecting ring, which can be made of acrylic or glass. Both the first and second housings have buffer mechanisms disposed inside. A heat dissipation mechanism is disposed on one side of the second housing. A pump source is fixedly connected to the inner surface of the first mounting barrel, and a dichroic mirror is disposed at one end of the pump source. A focusing collimating lens is fixedly connected to the inner surface of the second mounting barrel, and a doped optical fiber is disposed between the dichroic mirror and the focusing collimating lens. The first housing has an output tube connected to one side, and a protective lens is fixedly connected to one end of the output tube. Shock-absorbing pads are fixedly connected to one side of the second mounting barrel and one side of the first mounting barrel. The shock-absorbing pads increase the lateral buffering capacity of the device and increase the stability of the device. The first and second housings can be separated from each other. The doped optical fiber inside the transparent connecting ring can be observed through the gap between the first and second housings to see if it is aged or damaged. It is not necessary to remove the doped optical fiber for observation. The operation is simple and convenient and saves a certain amount of labor. The doped optical fiber includes an outer cladding layer, an inner cladding layer is fixedly connected to the inner surface of the outer cladding layer, and a doped fiber core is fixedly connected to the inner surface of the inner cladding layer. The outer cladding layer is made of polymer and the inner cladding layer is made of glass.

[0007] Preferably, the disassembly mechanism includes a first disassembly ring, the inner surface of which is fixedly connected to the outer surface of the first housing. A second disassembly ring is provided on one side of the first disassembly ring, the inner surface of which is fixedly connected to the outer surface of the second housing. A disassembly pin is fixedly connected to one side of the first disassembly ring. Several disassembly pins are provided. The first disassembly ring is used to install the disassembly pins, which are inserted into the second disassembly ring to limit its movement. A disassembly pin hole adapted to the disassembly pin is provided on one side of the second disassembly ring. The outer surface of the second housing passes through and slides through the second disassembly ring. A disassembly spring rod is provided, and several disassembly spring rods are provided. A disassembly spring is sleeved on the outer surface of each disassembly spring rod. A disassembly spring hole adapted to the disassembly spring rod is opened on the outer surface of the disassembly spring rod. The disassembly spring rod is inserted into the disassembly spring hole, thereby limiting the disassembly pin and fixing the first housing and the second housing. Pushing the disassembly spring rod causes the disassembly spring to extend, and the disassembly spring rod moves away from the disassembly spring hole, thereby releasing the limitation on the disassembly pin. Moving the first disassembly ring causes the disassembly pin to move away from the disassembly pin hole, thereby separating the first disassembly ring and the second disassembly ring, and moving the first housing and the second housing away from each other.

[0008] Preferably, the buffer mechanism includes a buffer slider. Buffer sliding grooves are formed on the inner surfaces of both the first and second housings. The inner surface of the buffer sliding groove is slidably connected to the outer surface of the buffer slider. A buffer linkage rod is rotatably connected to the outer surface of the buffer slider. The buffer slider is used to mount the buffer linkage rod and a buffer spring. The buffer linkage rod is used to support the first and second mounting barrels. One end of the buffer linkage rod is rotatably connected to the outer surfaces of the first and second mounting barrels, respectively. A buffer spring is fixedly connected to the inner surface of the buffer sliding groove. One end of the buffer spring is fixedly connected to the outer surface of the buffer slider. By setting up the buffer mechanism, the impact force received by the first and second mounting barrels is buffered, reducing the possibility of damage to the internal components of the first and second mounting barrels and increasing the service life of the device.

[0009] Preferably, the heat dissipation mechanism includes a heat dissipation mounting frame, one side of which is fixedly connected to one side of the second housing. A heat dissipation baffle is fixedly connected to the inner surface of the heat dissipation mounting frame. A heat dissipation air pump is fixedly connected to the inner surface of the heat dissipation mounting frame, located inside the heat dissipation baffle. The heat dissipation mounting frame is used to install the heat dissipation baffle and the heat dissipation air pump. The heat dissipation air pump provides power for the flow of gas. The heat dissipation baffle is used to store the cold air between the heat dissipation baffle and the heat dissipation mounting frame. A first heat dissipation annular pipe is fixedly connected to the inner surface of the heat dissipation mounting frame, located outside the heat dissipation baffle. The air outlet of the heat dissipation air pump communicates with the outer surface of the first heat dissipation annular pipe. A second heat dissipation annular pipe is fixedly connected to the inner surface of the heat dissipation mounting frame, located around the outer periphery of the first heat dissipation annular pipe. The first heat dissipation annular pipe and the second heat dissipation annular pipe are connected by a first heat dissipation connecting pipe. The first heat dissipation annular pipe is used to cool the air inside the first heat dissipation annular pipe. The second heat dissipation annular pipe increases the time the air stays between the heat dissipation baffle and the heat dissipation mounting frame. The first heat dissipation connecting pipe is arranged opposite to the air outlet of the heat dissipation air pump to increase the airflow. The first mounting frame has a heat dissipation annular frame fixedly connected to its inner surface. A number of heat dissipation nozzles are provided on the inner surface of the annular frame. A second heat dissipation connecting pipe is connected to one side of the annular frame. One end of the second heat dissipation connecting pipe passes through the first mounting frame and extends into the interior of the second housing. The annular frame is used to install the heat dissipation nozzles, and the cold air ejected from the nozzles is used to dissipate heat from the pump source. The second heat dissipation connecting pipe is used to connect to a heat dissipation metal hose. One end of the second heat dissipation connecting pipe is connected to the outer surface of the second annular frame via the heat dissipation metal hose. A cooling fin is fixedly installed on one side of the heat dissipation mounting frame through a slot. An air inlet is provided on one side of the heat dissipation mounting frame. When the first and second housings move away from each other, the second housing moves the heat dissipation mounting frame away from the first mounting frame. The heat dissipation metal hose compensates for the distance between the heat dissipation mounting frame and the first mounting frame, ensuring the normal operation of the device. Through the heat dissipation mechanism, cold air is blown into the periphery of the pump source through the heat dissipation nozzles, thereby cooling the pump source and increasing the service life of the device.

[0010] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0011] 1. By setting up the first and second housings, the first and second housings can be separated from each other. The doped optical fiber inside the transparent connecting ring can be observed through the gap between the first and second housings to see if it is aged or damaged. It is not necessary to remove the doped optical fiber for observation. The operation is simple and convenient, saving a certain amount of labor.

[0012] 2. By setting up a buffer mechanism, the impact force received by the first and second mounting barrels is buffered, reducing the possibility of damage to the internal components of the first and second mounting barrels and increasing the service life of the device.

[0013] 3. By setting up a heat dissipation mechanism, cool air is blown into the outer periphery of the pump source through heat dissipation nozzles, thereby cooling the pump source and increasing the service life of the device. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0016] Figure 2 This is a schematic diagram of the internal structure of the first housing of the present invention.

[0017] Figure 3 This is a schematic diagram of the internal structure of the first mounting bucket of the present invention.

[0018] Figure 4 This is a schematic diagram of the structure of the doped fiber core of the present invention.

[0019] Figure 5 This is a schematic diagram of the structure of the second housing of the present invention.

[0020] Figure 6 This is a schematic diagram of the structure of the buffer linkage rod of the present invention.

[0021] Figure 7 This is a schematic diagram of the heat dissipation mounting frame of the present invention.

[0022] Figure 8 This is a schematic diagram of the structure of the cooling chip of the present invention.

[0023] Figure 9 This is a schematic diagram of the disassembly mechanism of the present invention.

[0024] In the diagram: 1. First housing; 2. Second housing; 3. First mounting barrel; 4. Transparent connecting ring; 5. Second mounting barrel; 6. Pump source; 7. Dichroic mirror; 8. Focusing collimating lens; 9. Doped optical fiber; 10. Output tube; 11. Protective lens; 12. Outer cladding; 13. Inner cladding; 14. Doped fiber core; 15. Shock-absorbing pad; 120. Disassembly mechanism; 121. First disassembly ring; 122. Second disassembly ring; 123. Disassembly pin; 124. Disassembly pin hole; 125. Disassembly spring rod; 126. Disassembly spring; 127. Disassembly... 130. Spring hole; 131. Buffer mechanism; 132. Buffer slider; 133. Buffer sliding groove; 134. Buffer linkage rod; 145. Buffer spring; 146. Heat dissipation mechanism; 147. Heat dissipation mounting frame; 148. Heat dissipation baffle; 149. Heat dissipation air pump; 140. First annular heat dissipation pipe; 1410. Second annular heat dissipation pipe; 1411. First connecting pipe for heat dissipation; 142. Heat dissipation annular frame; 143. Heat dissipation nozzle; 144. Second connecting pipe for heat dissipation; 145. Heat dissipation metal flexible hose; 1411. Cooling element; 1412. Air inlet. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] like Figure 1-9As shown, this invention provides a semiconductor-pumped solid-state fiber laser, including a first housing 1 and a second housing 2 disposed on one side of the first housing 1. The first housing 1 and the second housing 2 are connected by a disassembly mechanism 120. A first mounting barrel 3 is disposed inside the first housing 1, and a second mounting barrel 5 is disposed on one side of the first mounting barrel 3. The first mounting barrel 3 and the second mounting barrel 5 are fixedly connected by a transparent connecting ring 4, which can be made of acrylic or glass. Both the first housing 1 and the second housing 2 are provided with a buffer mechanism 130 inside. A heat dissipation mechanism 140 is disposed on one side of the second housing 2. A pump source 6 is fixedly connected to the inner surface of the first mounting barrel 3, and a dichroic mirror 7 is disposed at one end of the pump source 6. The inner surface of the second mounting barrel 5... A focusing collimating lens 8 is fixedly connected to the surface. A doped optical fiber 9 is disposed between the dichroic mirror 7 and the focusing collimating lens 8. An output tube 10 is connected to one side of the first housing 1, and a protective lens 11 is fixedly connected to one end of the output tube 10. Shock-absorbing pads 15 are fixedly connected to one side of the second mounting barrel 5 and one side of the first mounting barrel 3. The shock-absorbing pads 15 increase the lateral buffering capacity of the device and increase the stability of the device. The first housing 1 and the second housing 2 can be separated from each other. The doped optical fiber 9 inside the transparent connecting ring 4 can be observed through the gap between the first housing 1 and the second housing 2 to see if it is aged or damaged. It is not necessary to remove the doped optical fiber 9 for observation. The operation is simple and convenient and saves a certain amount of labor.

[0027] The doped optical fiber 9 includes an outer cladding layer 12, an inner cladding layer 13 fixedly connected to the inner surface of the outer cladding layer 12, and a doped fiber core 14 fixedly connected to the inner surface of the inner cladding layer 13.

[0028] By adopting the above technical solution, the outer cladding layer 12 is made of polymer, and the inner cladding layer 13 is made of glass.

[0029] The disassembly mechanism 120 includes a first disassembly ring 121, the inner surface of which is fixedly connected to the outer surface of the first housing 1, a second disassembly ring 122 is provided on one side of the first disassembly ring 121, the inner surface of which is fixedly connected to the outer surface of the second housing 2, and a disassembly pin 123 is fixedly connected to one side of the first disassembly ring 121, and the number of disassembly pins 123 is set to several.

[0030] By adopting the above technical solution, the first disassembly ring 121 is used to install the disassembly pin 123, and the disassembly pin 123 is used to insert into the second disassembly ring 122, thereby limiting the second disassembly ring 122.

[0031] The second disassembly ring 122 has a disassembly pin hole 124 that matches the disassembly pin 123 on one side. The outer surface of the second housing 2 is slidably connected to a disassembly spring rod 125. The number of disassembly spring rods 125 is set to several. The outer surface of the disassembly spring rod 125 is fitted with a disassembly spring 126. The outer surface of the disassembly pin 123 has a disassembly spring hole 127 that matches the disassembly spring rod 125.

[0032] By adopting the above technical solution, the disassembly spring rod 125 is inserted into the disassembly spring hole 127, thereby limiting the disassembly pin 123 and fixing the first housing 1 and the second housing 2. Pushing the disassembly spring rod 125 causes the disassembly spring 126 to extend, and the disassembly spring rod 125 moves away from the disassembly spring hole 127, thereby releasing the limitation on the disassembly pin 123. Moving the first disassembly ring 121 causes the disassembly pin 123 to move away from the disassembly pin hole 124, thereby separating the first disassembly ring 121 from the second disassembly ring 122, and moving the first housing 1 and the second housing 2 away from each other.

[0033] The buffer mechanism 130 includes a buffer slider 131. The inner surfaces of the first housing 1 and the second housing 2 are both provided with buffer sliding grooves 132. The inner surface of the buffer sliding groove 132 is slidably connected to the outer surface of the buffer slider 131. The outer surface of the buffer slider 131 is rotatably connected to a buffer linkage rod 133.

[0034] By adopting the above technical solution, the buffer slider 131 is used to install the buffer linkage rod 133 and the buffer spring 134, and the buffer linkage rod 133 is used to support the first mounting barrel 3 and the second mounting barrel 5.

[0035] One end of the buffer linkage rod 133 is rotatably connected to the outer surface of the first mounting barrel 3 and the second mounting barrel 5 respectively. A buffer spring 134 is fixedly connected to the inner surface of the buffer sliding groove 132. One end of the buffer spring 134 is fixedly connected to the outer surface of the buffer slider 131.

[0036] By adopting the above technical solution and by setting the buffer mechanism 130, the impact force received by the first mounting barrel 3 and the second mounting barrel 5 is buffered, reducing the possibility of damage to the internal components of the first mounting barrel 3 and the second mounting barrel 5, and increasing the service life of the device.

[0037] The heat dissipation mechanism 140 includes a heat dissipation mounting frame 141, one side of which is fixedly connected to one side of the second housing 2. A heat dissipation partition 142 is fixedly connected to the inner surface of the heat dissipation mounting frame 141, and a heat dissipation air pump 143 is fixedly connected to the inner surface of the heat dissipation mounting frame 141 and inside the heat dissipation partition 142.

[0038] By adopting the above technical solution, the heat dissipation mounting frame 141 is used to install the heat dissipation baffle 142 and the heat dissipation air pump 143. The heat dissipation air pump 143 provides power for the flow of gas, and the heat dissipation baffle 142 is used to store the cold air between the heat dissipation baffle 142 and the heat dissipation mounting frame 141.

[0039] A first annular heat dissipation pipe 144 is fixedly connected to the inner surface of the heat dissipation mounting frame 141 and to the outside of the heat dissipation partition 142. The outlet end of the heat dissipation air pump 143 is connected to the outer surface of the first annular heat dissipation pipe 144. A second annular heat dissipation pipe 145 is fixedly connected to the inner surface of the heat dissipation mounting frame 141 and to the outer periphery of the first annular heat dissipation pipe 144. The first annular heat dissipation pipe 144 and the second annular heat dissipation pipe 145 are connected by a first connecting pipe 146.

[0040] By adopting the above technical solution, the first annular heat dissipation pipe 144 is used to cool the air inside the first annular heat dissipation pipe 144, the second annular heat dissipation pipe 145 increases the time that the air stays between the heat dissipation partition 142 and the heat dissipation mounting frame 141, and the first heat dissipation connecting pipe 146 is set opposite to the air outlet of the heat dissipation air pump 143 to increase the air circulation distance.

[0041] A heat dissipation annular frame 147 is fixedly connected to the inner surface of the first mounting barrel 3. A heat dissipation nozzle 148 is provided on the inner surface of the heat dissipation annular frame 147. The number of heat dissipation nozzles 148 is set to a certain extent. A heat dissipation second connecting pipe 149 is connected to one side of the heat dissipation annular frame 147. One end of the heat dissipation second connecting pipe 149 passes through the first mounting barrel 3 and extends into the interior of the second housing 2.

[0042] By adopting the above technical solution, the heat dissipation ring frame 147 is used to install the heat dissipation nozzle 148, the cold air ejected by the heat dissipation nozzle 148 is used to dissipate heat from the pump source 6, and the heat dissipation second connecting pipe 149 is used to connect the heat dissipation metal hose 1410.

[0043] One end of the second heat dissipation connecting pipe 149 is connected to the outer surface of the second heat dissipation annular pipe 145 through a heat dissipation metal flexible tube 1410. A cooling chip 1411 is fixedly installed on one side of the heat dissipation mounting frame 141 by opening a slot. An air inlet 1412 is opened on one side of the heat dissipation mounting frame 141.

[0044] By adopting the above technical solution, when the first housing 1 and the second housing 2 are far apart, the second housing 2 drives the heat dissipation mounting frame 141 away from the first mounting barrel 3. The heat dissipation metal hose 1410 compensates for the distance between the heat dissipation mounting frame 141 and the first mounting barrel 3, ensuring the normal operation of the device. Through the setting of the heat dissipation mechanism 140, cold air is blown into the outer periphery of the pump source 6 through the heat dissipation nozzle 148, thereby cooling the pump source 6 and increasing the service life of the device.

[0045] Working principle: When it is necessary to determine whether the doped optical fiber 9 is aging, push the disassembly spring rod 125 to extend the disassembly spring 126, and move the disassembly spring rod 125 away from the disassembly spring hole 127, thereby releasing the restriction on the disassembly pin 123. Move the first disassembly ring 121 to drive the disassembly pin 123 away from the disassembly pin hole 124, thereby separating the first disassembly ring 121 from the second disassembly ring 122. Move the first housing 1 and the second housing 2 away from each other, and observe whether the doped optical fiber 9 in the transparent connecting ring 4 is aged or damaged through the gap between the first housing 1 and the second housing 2.

[0046] When heat dissipation is required for pump source 6, the cooling chip 1411 is activated to cool the air between heat dissipation mounting frame 141 and heat dissipation partition 142. The heat dissipation air pump 143 is activated to spray outside air through the air inlet 1412, the first heat dissipation annular pipe 144, the first heat dissipation connecting pipe 146, the second heat dissipation annular pipe 145, the heat dissipation metal hose 1410, the second heat dissipation connecting pipe 149, the heat dissipation annular frame 147 and the heat dissipation nozzle 148. The cold air between heat dissipation mounting frame 141 and heat dissipation partition 142 cools the air in the first heat dissipation annular pipe 144 and the second heat dissipation annular pipe 145, thereby causing the heat dissipation nozzle 148 to spray out cold air to dissipate heat from the outer periphery of pump source 6.

[0047] When an external force impacts the first housing 1 and the second housing 2, the first housing 1 and the second housing 2 drive the buffer sliding groove 132 to move the buffer slider 131. The buffer slider 131 drives the buffer linkage rod 133 to rotate. The rotation of the buffer linkage rod 133 drives the buffer slider 131 to move along the buffer sliding groove 132. The movement of the buffer slider 131 compresses the buffer spring 134, causing the buffer spring 134 to contract, thereby buffering the impact force and protecting the pump source 6 and doped optical fiber 9 inside the transparent connecting ring 4 and the second mounting barrel 5, reducing the possibility of device damage.

[0048] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A semiconductor-pumped solid-state fiber laser, comprising a first housing (1) and a second housing (2) disposed on one side of the first housing (1), characterized in that: The first housing (1) and the second housing (2) are connected by a disassembly mechanism (120). A first mounting barrel (3) is provided inside the first housing (1), and a second mounting barrel (5) is provided on one side of the first mounting barrel (3). The first mounting barrel (3) and the second mounting barrel (5) are fixedly connected by a transparent connecting ring (4). Both the first housing (1) and the second housing (2) are provided with a buffer mechanism (130). A heat dissipation mechanism (140) is provided on one side of the second housing (2). The first mounting barrel ( 3) A pump source (6) is fixedly connected to the inner surface of the first housing (1), a dichroic mirror (7) is provided at one end of the pump source (6), a focusing collimating mirror (8) is fixedly connected to the inner surface of the second mounting barrel (5), a doped optical fiber (9) is provided between the dichroic mirror (7) and the focusing collimating mirror (8), an output tube (10) is connected to one side of the first housing (1), a protective lens (11) is fixedly connected to one end of the output tube (10), and shock-absorbing pads (15) are fixedly connected to one side of the second mounting barrel (5) and one side of the first mounting barrel (3). The disassembly mechanism (120) includes a first disassembly ring (121), the inner surface of which is fixedly connected to the outer surface of the first housing (1), a second disassembly ring (122) is provided on one side of the first disassembly ring (121), the inner surface of which is fixedly connected to the outer surface of the second housing (2), and a disassembly pin (123) is fixedly connected to one side of the first disassembly ring (121), and the number of disassembly pins (123) is set to several. The second disassembly ring (122) has a disassembly pin hole (124) adapted to the disassembly pin (123) on one side. The outer surface of the second housing (2) is slidably connected with a disassembly spring rod (125). The number of disassembly spring rods (125) is set to several. The outer surface of the disassembly spring rod (125) is fitted with a disassembly spring (126). The outer surface of the disassembly pin (123) has a disassembly spring hole (127) adapted to the disassembly spring rod (125). The buffer mechanism (130) includes a buffer slider (131). The inner surfaces of the first housing (1) and the second housing (2) are provided with buffer sliding grooves (132). The inner surface of the buffer sliding groove (132) is slidably connected to the outer surface of the buffer slider (131). The outer surface of the buffer slider (131) is rotatably connected to a buffer linkage rod (133). One end of the buffer linkage rod (133) is rotatably connected to the outer surfaces of the first mounting barrel (3) and the second mounting barrel (5), respectively. A buffer spring (134) is fixedly connected to the inner surface of the buffer sliding groove (132), and one end of the buffer spring (134) is fixedly connected to the outer surface of the buffer slider (131).

2. The semiconductor-pumped solid-state fiber laser as described in claim 1, characterized in that, The doped optical fiber (9) includes an outer cladding layer (12), an inner cladding layer (13) is fixedly connected to the inner surface of the outer cladding layer (12), and a doped fiber core (14) is fixedly connected to the inner surface of the inner cladding layer (13).

3. A semiconductor-pumped solid-state fiber laser as described in claim 1, characterized in that, The heat dissipation mechanism (140) includes a heat dissipation mounting frame (141), one side of which is fixedly connected to one side of the second housing (2), and a heat dissipation partition (142) is fixedly connected to the inner surface of the heat dissipation mounting frame (141). A heat dissipation air pump (143) is fixedly connected to the inner surface of the heat dissipation mounting frame (141) and inside the heat dissipation partition (142).

4. A semiconductor-pumped solid-state fiber laser as described in claim 3, characterized in that, A first annular heat dissipation pipe (144) is fixedly connected to the inner surface of the heat dissipation mounting frame (141) and to the outside of the heat dissipation partition (142). The outlet end of the heat dissipation air pump (143) is connected to the outer surface of the first annular heat dissipation pipe (144). A second annular heat dissipation pipe (145) is fixedly connected to the inner surface of the heat dissipation mounting frame (141) and to the outer periphery of the first annular heat dissipation pipe (144). The first annular heat dissipation pipe (144) and the second annular heat dissipation pipe (145) are connected by a first connecting pipe (146).

5. A semiconductor-pumped solid-state fiber laser as described in claim 4, characterized in that, A heat dissipation annular frame (147) is fixedly connected to the inner surface of the first mounting barrel (3). A heat dissipation nozzle (148) is provided on the inner surface of the heat dissipation annular frame (147). The number of heat dissipation nozzles (148) is set to a certain number. A heat dissipation second connecting pipe (149) is connected to one side of the heat dissipation annular frame (147). One end of the heat dissipation second connecting pipe (149) passes through the first mounting barrel (3) and extends into the interior of the second housing (2).

6. A semiconductor-pumped solid-state fiber laser as described in claim 5, characterized in that, One end of the second heat dissipation connecting pipe (149) is connected to the outer surface of the second heat dissipation annular pipe (145) through a heat dissipation metal flexible tube (1410). A cooling chip (1411) is fixedly installed on one side of the heat dissipation mounting frame (141) by opening a slot. An air inlet (1412) is opened on one side of the heat dissipation mounting frame (141).

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