Protective assembly and touch module

Abstract

A protection assembly and a touch module are disclosed. The protection assembly includes a cover plate, a buffer layer and a flexible substrate. The buffer layer is disposed on the cover plate and is made of a transparent polymer. The buffer layer has a light transmittance greater than about 85%, a thickness between about 3 μm and about 15 μm, and a Poisson's ratio greater than about 0.4. The flexible substrate is disposed on the buffer layer and is doped with an inorganic compound. The flexible substrate has a thickness between about 3 μm and about 10 μm, and a Young's modulus between about 1 Gpa and about 10 Gpa. Thus, the touch module can still function when subjected to impact.

Description

Technical Field

[0001] This disclosure relates to a protective component and a touch module. Background Technology

[0002] The durability requirements for touch panels in electronic devices are getting higher and higher. In addition to improving the performance of touch sensitivity and display refresh rate, it is also important to have a drop-resistant and impact-resistant design.

[0003] A review of Chinese patent application publication number CN 100378541C reveals that, in order to increase the hardness, wear resistance, and impact resistance of the cover plate, it discloses the use of a composite protective substrate comprising a buffer layer and a sapphire substrate, which can be applied to touch sensing devices. However, sapphire material has the disadvantages of being prone to cracking and lacking flexibility.

[0004] Therefore, how to propose a protective component and touch module that can solve the above problems is one of the issues that the industry is currently eager to invest research and development resources to address. Summary of the Invention

[0005] In view of this, one purpose of this disclosure is to provide a protective component and a touch module that can solve the above problems.

[0006] To achieve the above objectives, according to one embodiment of this disclosure, a protective component includes a cover plate, a buffer layer, and a flexible substrate. The buffer layer is disposed on the cover plate and is composed of a transparent polymer. The buffer layer has a light transmittance greater than about 85%, a thickness between about 3 μm and about 15 μm, and a Phuket ratio greater than about 0.4. The flexible substrate is disposed on the buffer layer and is doped with an inorganic mixture. The flexible substrate has a thickness between about 3 μm and about 10 μm and a Young's coefficient between about 1 GPa and about 10 GPa.

[0007] In one or more embodiments disclosed herein, the buffer layer has a pozzolanic ratio greater than about 0.5.

[0008] In one or more embodiments disclosed herein, the buffer layer has an elongation of about 200% to about 1600%.

[0009] In one or more embodiments disclosed herein, at least one of the buffer layer and the flexible substrate has a pyrolysis temperature greater than about 340 degrees Celsius.

[0010] In one or more embodiments disclosed herein, at least one of the buffer layer and the flexible substrate has a maximum operating temperature greater than about 350 degrees Celsius.

[0011] In one or more embodiments disclosed herein, the inorganic mixture comprises graphene, diamond, or a mixture thereof.

[0012] In one or more embodiments disclosed herein, the inorganic mixture comprises between about 100 ppm and about 1000 ppm of graphene oxide.

[0013] In one or more embodiments disclosed herein, the protective component further includes a bonding layer. The bonding layer bonds the cover plate and the buffer layer and has a thickness between about 10 nm and about 100 nm.

[0014] In one or more embodiments disclosed herein, the material of the bonding layer comprises epoxy siloxane, amino siloxane, or thiol siloxane.

[0015] In one or more embodiments disclosed herein, the bulk material of the buffer layer comprises polydimethylsiloxane, polymethyl methacrylate, or polycarbonate.

[0016] In one or more embodiments disclosed herein, the component material in the buffer layer comprises an epoxy organic compound, an amino organic compound, or a thiol organic compound.

[0017] In one or more embodiments disclosed herein, the component materials in the flexible substrate include epoxy-based organic compounds or thiol-based organic compounds.

[0018] To achieve the above objectives, according to one embodiment of this disclosure, a touch module includes a protective component, a bridging pattern layer, and an electrode pattern layer. The bridging pattern layer is disposed on the side of a flexible substrate away from the cover plate and includes a plurality of bridging electrodes. The electrode pattern layer is disposed above the bridging pattern layer and includes a first transparent conductive layer, a metal layer, and a second transparent conductive layer, which are sequentially stacked and respectively have a first resistance value, a second resistance value, and a third resistance value.

[0019] In one or more embodiments disclosed herein, the electrode pattern layer has two via regions directly above one of the bridging electrodes. The touch module further includes a first insulating layer and a second insulating layer. The first insulating layer is disposed between the bridging pattern layer and the electrode pattern layer and has two exposed areas. The electrode pattern layer is electrically connected to the bridging electrode via the exposed areas. The second insulating layer is disposed on the electrode pattern layer and covers and fills the via regions.

[0020] In one or more embodiments disclosed herein, the first insulating layer includes a first insulating block and a second insulating block formed at both ends of the bridging electrode, and a third insulating block located between the first insulating block and the second insulating block by an exposed area.

[0021] In one or more embodiments disclosed herein, the electrode pattern layer includes two first electrode blocks and a second electrode block. The first electrode blocks are electrically connected to the bridging electrodes via exposed areas. The second electrode blocks are located between the first electrode blocks, separated by vias.

[0022] In one or more embodiments disclosed herein, the first transparent conductive layer is a first transparent oxide conductive layer, and the second transparent conductive layer is a second transparent oxide conductive layer.

[0023] In one or more embodiments disclosed herein, at least one of the first transparent oxide conductive layer and the second transparent oxide conductive layer has a first region and a second region. The oxygen content of the first region is greater than the oxygen content of the second region.

[0024] In one or more embodiments disclosed herein, the second region is located between the first region and the metal layer.

[0025] In summary, the protective component disclosed herein, through the elasticity provided by the buffer layer and the high Young's coefficient provided by the flexible substrate, can resist impacts, thus allowing the touch module's touch function to continue. Furthermore, the touch module disclosed herein uses a composite touch electrode design in conjunction with the protective component; therefore, in addition to resisting impacts and maintaining touch functionality through the protective component, the composite touch electrode can also effectively reduce impedance to increase the touch refresh rate.

[0026] The above description is only used to illustrate the problem to be solved by this disclosure, the technical means to solve the problem, and the effects produced, etc. The specific details of this disclosure will be described in detail in the following implementation method and related drawings. Attached Figure Description

[0027] To make the above and other objects, features, advantages and embodiments disclosed herein more apparent and understandable, the accompanying drawings are described below:

[0028] Figure 1 A schematic diagram illustrating a touch module according to an embodiment of this disclosure;

[0029] Figure 2 For illustration Figure 1 A magnified view of a portion of the touch module;

[0030] Figure 3 For illustration Figure 2 The structure in the diagram is shown in a cross-sectional view along line segment 3-3;

[0031] Figure 4 For illustration Figure 2 A partial cross-sectional view of the electrode pattern layer in the image;

[0032] Figure 5 A graph illustrating the drop ball test of the protection components in different implementations;

[0033] Figure 6 A cross-sectional view of a touch module according to another embodiment of this disclosure is shown.

[0034] [Symbol Explanation]

[0035] 100, 100A: Touch module

[0036] 110: Flexible substrate

[0037] 120: Bridge Pattern Layer

[0038] 121: Bridging electrode

[0039] 130: First insulating layer

[0040] 130a, 130b: Exposed areas

[0041] 131a: First insulating block

[0042] 131b: Second insulating block

[0043] 131c: Third insulating block

[0044] 140: Electrode pattern layer

[0045] 140a1, 140a2: First electrode block

[0046] 140b: Second electrode block

[0047] 140c1, 140c2: Through-hole area

[0048] 141: First transparent oxide conductive layer

[0049] 141a, 143a: First Region

[0050] 141b, 143b: Second Region

[0051] 143: Second transparent oxide conductive layer

[0052] 150: Second insulation layer

[0053] 160: Wiring

[0054] 170: Flexible Circuit Board

[0055] 200, 300: Protection components

[0056] 210: Cover plate

[0057] 220: Buffer layer

[0058] 330: Bonding layer

[0059] Z1: Touch area

[0060] Z2: Surrounding Area Detailed Implementation

[0061] The following describes several embodiments of this disclosure with reference to the accompanying drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this disclosure. That is, in some embodiments of this disclosure, these practical details are not essential. Furthermore, for the sake of simplicity in the drawings, some conventional structures and elements will be shown in a simple schematic manner.

[0062] Please refer to Figure 1 This is a schematic diagram illustrating a touch module 100 according to an embodiment of the present disclosure. Figure 1 As shown, in this embodiment, the touch module 100 includes a flexible substrate 110, a touch electrode layer, multiple traces 160, and a flexible circuit board 170. A touch area Z1 and a peripheral area Z2 are defined on the flexible substrate 110. The peripheral area Z2 is located at the outer edge of the touch area Z1. The touch electrode layer is disposed within the touch area Z1. The traces 160 are located within the peripheral area Z2, and both ends of each trace 160 are connected to the touch electrode layer and the flexible circuit board 170, respectively, thereby transmitting the touch signals generated by the touch electrode layer to the flexible circuit board 170.

[0063] Please refer to Figure 2 as well as Figure 3 . Figure 2 For illustration Figure 1 A partial enlarged view of the touch module 100. Figure 3 For illustration Figure 2 The structure in the diagram is shown in a cross-sectional view along line segment 3-3. Figure 2 The area shown is located within the touch area Z1. For example... Figure 2 and Figure 3 As shown, in this embodiment, the touch electrode layer includes a bridging pattern layer 120 and an electrode pattern layer 140. The touch module 100 further includes a first insulating layer 130 and a second insulating layer 150. The bridging pattern layer 120 is disposed on the flexible substrate 110 and includes a plurality of bridging electrodes 121. The following description focuses on one of the bridging electrodes 121. The first insulating layer 130 is disposed on the bridging pattern layer 120 and has two exposed areas 130a and 130b adjacent to opposite ends of the bridging electrode 121. The electrode pattern layer 140 is disposed on the first insulating layer 130 and is electrically connected to the bridging electrode 121 via the exposed areas 130a and 130b. The electrode pattern layer 140 has two through-hole areas 140c1 and 140c2 directly above the bridging electrode 121. The second insulating layer 150 is disposed on the electrode pattern layer 140 and covers and fills the through-hole areas 140c1 and 140c2.

[0064] In some embodiments, the thickness of the first insulating layer 130 is about 1.25 μm and the thickness of the second insulating layer 150 is about 2 μm, but this disclosure is not limited thereto.

[0065] In detail, such as Figure 2 and Figure 3 As shown, in this embodiment, the electrode pattern layer 140 includes two first electrode blocks 140a1 and 140a2 and a second electrode block 140b. The first electrode blocks 140a1 and 140a2 are electrically connected to the bridging electrode 121 via exposed areas 130a and 130b, respectively. The second electrode block 140b is located between the first electrode blocks 140a1 and 140a2, separated by vias 140c1 and 140c2. Thus, the two first electrode blocks 140a1 and 140a2 can transmit touch signals via the bridging electrode 121 and are electrically isolated from the second electrode block 140b.

[0066] In some embodiments, the electrode pattern layer 140 includes a plurality of first-axis conductive units spaced apart from each other and a plurality of second-axis conductive units spaced apart from each other and spanning the first-axis conductive units. Specifically, the aforementioned "first axis" and "second axis" are, for example, two axes perpendicular to each other (e.g., the Y-axis and the X-axis). In other words, the first-axis conductive units are conductive lines extending along the first axis and arranged at intervals. The combination of the aforementioned two first electrode blocks 140a1, 140a2 and the bridging electrode 121 is part of one of the first-axis conductive units. The second-axis conductive units are conductive lines extending along the second axis and arranged at intervals. The aforementioned second electrode block 140b is one of the second-axis conductive units, which spans across opposite sides of the bridging electrode 121 (separated by the first insulating layer 130). Thus, the aforementioned exposed areas 130a, 130b span across opposite sides of the bridging electrode 121 and divide the electrode pattern layer 140 into the first electrode blocks 140a1, 140a2 and the second electrode block 140b.

[0067] like Figure 3 As shown, in this embodiment, the electrode pattern layer 140 includes a first transparent oxide conductive layer 141 (i.e., the first transparent oxide conductive layer), a metal layer 142, and a second transparent oxide conductive layer 143 (i.e., the second transparent conductive layer), which are stacked sequentially and have a first resistance value, a second resistance value, and a third resistance value, respectively. The first resistance value and the third resistance value are greater than the second resistance value. By constructing the touch electrode layer with the aforementioned composite conductive structure, the resistance of the circuitry within the touch module 100 can be effectively reduced, thereby making the touch module 100 suitable for use in medium to large-sized products.

[0068] In some embodiments, the first transparent oxide conductive layer 141 and the second transparent oxide conductive layer 143 are made of indium tin oxide (ITO). This allows the first transparent oxide conductive layer 141 and the second transparent oxide conductive layer 143 to have good light transmittance. In some embodiments, the metal layer 142 is made of silver, but this disclosure is not limited thereto. In some embodiments, the metal layer 142 may be a nano-silver ink layer, a nano-silver paste layer, or a nano-sputtered layer, etc., but is not limited thereto. This allows the metal layer 142 to have a low resistance.

[0069] In some embodiments, the thickness of the first transparent oxide conductive layer 141 is about 40 nm, but this disclosure is not limited thereto. In some embodiments, the thickness of the metal layer 142 is from about 8.5 nm to about 9.5 nm, but this disclosure is not limited thereto. In some embodiments, the thickness of the second transparent oxide conductive layer 143 is about 40 nm, but this disclosure is not limited thereto.

[0070] like Figure 2 and Figure 3 As shown, in this embodiment, the first insulating layer 130 includes a first insulating block 131a and a second insulating block 131b formed at opposite ends of the bridging electrode 121, and a third insulating block 131c located between the first insulating block 131a and the second insulating block 131b, separated by exposed areas 130a and 130b. Specifically, the first insulating block 131a and the second insulating block 131b cover opposite ends of the bridging electrode 121 and are not exposed. The first insulating block 131a, the third insulating block 131c, and the second insulating block 131b sequentially cover the bridging electrode 121 along its extension direction. Exposed areas 130a and 130b are formed between the first insulating block 131a and the third insulating block 131c, and between the third insulating block 131c and the second insulating block 131b, respectively. Furthermore, as... Figure 3 As shown, the first insulating block 131a, the second insulating block 131b, and the third insulating block 131c have slopes. Specifically, the first insulating block 131a, the second insulating block 131b, and the third insulating block 131c are shaped like hills with slopes.

[0071] The aforementioned structural configuration effectively mitigates the problem of cracks in the electrode pattern layer 140 disposed on the first insulating layer 130. Specifically, since the electrode pattern layer 140 is positioned above the opposite ends of the bridging electrode 121 by climbing over the first insulating block 131a and the second insulating block 131b, the problem of cracks in the electrode pattern layer 140 near the opposite ends of the bridging electrode 121 can be effectively mitigated.

[0072] like Figure 2As shown, in this embodiment, exposed areas 130a and 130b span opposite sides of the bridging electrode 121. This increases the contact area between the first electrode blocks 140a1 and 140a2 of the electrode pattern layer 140 and the bridging electrode 121, thereby reducing impedance.

[0073] Please refer to Figure 4 It is a drawing Figure 2 A partial cross-sectional view of the electrode pattern layer 140 in the image. (See image for details.) Figure 4 As shown, in this embodiment, the first transparent oxide conductive layer 141 has a first region 141a and a second region 141b. The oxygen content of the first region 141a is greater than that of the second region 141b. The second region 141b of the first transparent oxide conductive layer 141 is located between the first region 141a and the metal layer 142. The second transparent oxide conductive layer 143 has a first region 143a and a second region 143b. The second region 143b of the second transparent oxide conductive layer 143 is located between the first region 143a and the metal layer 142. With this structural configuration, the first transparent oxide conductive layer 141 and the second transparent oxide conductive layer 143 can effectively have high transmittance and low impedance.

[0074] Table 1 below shows the process parameters for manufacturing the electrode pattern layer 140 in Examples A to C.

[0075]

[0076] It should be noted that in Table 1, layer 1 and layer 2 are the process parameters used when manufacturing the first region 141a and the second region 141b of the first transparent oxide conductive layer 141, respectively; layer 3 is the process parameter used when manufacturing the metal layer 142; and layers 4 and 5 are the process parameters used when manufacturing the second region 143b and the first region 143a of the second transparent oxide conductive layer 143, respectively. As shown in Table 1, in manufacturing the first transparent oxide conductive layer 141 and the second transparent oxide conductive layer 143 of Example A, the first regions 141a and 143a and the second regions 141b and 143b all use a high oxygen flux (i.e., 1.0 sccm). In manufacturing the first transparent oxide conductive layer 141 and the second transparent oxide conductive layer 143 of Example B, the first regions 141a and 143a and the second regions 141b and 143b all use a low oxygen flux (i.e., 0.3 sccm). In manufacturing the first transparent oxide conductive layer 141 and the second transparent oxide conductive layer 143 of embodiment C, the first regions 141a and 143a both use a high oxygen flow rate (i.e., 1.0 sccm), while the second regions 141b and 143b both use a low oxygen flow rate (i.e., 0.3 sccm).

[0077] Table 2 below shows the physical parameters of the electrode pattern layer 140 in Examples A to C.

[0078]

[0079] As shown in Table 2 above, the transmittance of the electrode pattern layer 140 (i.e., the first transparent oxide conductive layer 141 and the second transparent oxide conductive layer 143 each contain regions with different oxygen contents) in Example C can be maintained at greater than 87%, and the impedance can also be maintained at less than 10 ops.

[0080] like Figure 3 As shown, in this embodiment, the touch module 100 further includes a protective component 200. The protective component 200 includes a cover plate 210, a buffer layer 220, and a flexible substrate 110. The buffer layer 220 is disposed on the side of the flexible substrate 110 away from the cross-linked pattern layer 120 and is located between the cover plate 210 and the flexible substrate 110. The buffer layer 220 is made of a transparent polymer. The buffer layer 220 has a transmittance greater than about 85%, a thickness between about 3 μm and about 15 μm, and a Phuoc's ratio greater than about 0.4. The flexible substrate 110 has a thickness between about 3 μm and about 10 μm, preferably between about 3 μm and about 6 μm. The flexible substrate 110 is doped with an inorganic mixture to have a Young's coefficient between about 1 GPa and about 10 GPa. The aforementioned thickness limitation is to make the touch module 100 suitable for foldable applications.

[0081] In some embodiments, the buffer layer 220 has a Poisson ratio that is further greater than about 0.5.

[0082] In some embodiments, the buffer layer 220 has an elongation of between about 200% and about 1600%.

[0083] In some embodiments, at least one of the buffer layer 220 and the flexible substrate 110 has a decomposition temperature greater than about 340 degrees Celsius. In some embodiments, at least one of the buffer layer 220 and the flexible substrate 110 has a maximum service temperature greater than about 350 degrees Celsius. This allows the protective component 200 to withstand the high-temperature processes involved in manufacturing the electrode pattern layer 140.

[0084] In some embodiments, the main material of the flexible substrate 110 preferably comprises colorless polyimide (CPI), but this disclosure is not limited thereto.

[0085] In some embodiments, the inorganic mixture comprises graphene, diamond, or a mixture thereof.

[0086] In some embodiments, the inorganic mixture contains between about 100 ppm and about 1000 ppm of graphene oxide, preferably between about 300 ppm and about 500 ppm.

[0087] In some embodiments, the components of the flexible substrate 110 may also include epoxy-functional organic compounds or thiol-functional organic compounds to increase compatibility with inorganic mixtures. Additionally, acetic acid may be added to inhibit premature gelation.

[0088] In some embodiments, the main material of the buffer layer 220 includes polydimethylsiloxane (PDMS), poly(methyl methacrylate) (PMMA), or polycarbonate (PC), with polydimethylsiloxane being preferred, but this disclosure is not limited thereto.

[0089] Table 3 below shows the parameters of physical, mechanical, and chemical properties of various materials.

[0090]

[0091] As shown in the table above, PDMS and CPI exhibit better performance in terms of physical, mechanical, and chemical properties, thus demonstrating better ability to withstand high-temperature or corrosive processes. In other words, in some embodiments, PDMS can be preferentially selected as the material for the buffer layer 220, and CPI can be preferentially selected as the material for the flexible substrate 110.

[0092] In some embodiments, the components of the buffer layer 220 also include epoxy-based organic compounds, amino-based organic compounds, or thiol-based organic compounds. In some embodiments, the buffer layer 220 comprises a PDMS-Epoxy composite material. In some embodiments, the ratio of PDMS to Epoxy is from about 3:2 to about 1:1, and IPA-xylene solvent is used. It is worth noting that, in addition to IPA, water is required to aid hydrolysis and acetic acid is used to inhibit premature gelation.

[0093] Please refer to Figure 5 This is a chart illustrating the drop ball test of the protective component 200 in different embodiments. It should be noted that Embodiment I is an embodiment where the touch module 100 omits the buffer layer 220 and the flexible substrate 110 is not doped with an inorganic mixture. Embodiment II is an embodiment where the touch module 100 omits the buffer layer 220 and the flexible substrate 110 is doped with an inorganic mixture. Embodiment III is as follows... Figure 3 The touch module 100 shown includes a protective component 200. (See example...) Figure 5 As shown, Example III can significantly increase the ball's landing height compared to Examples I and II.

[0094] As can be seen from the above configuration, the protective component 200 of this embodiment can resist impact when subjected to impact by the elasticity provided by the buffer layer 220 and the high Young's coefficient provided by the flexible substrate 110, so that the touch function of the touch module 100 can still be performed.

[0095] Please refer to Figure 6 This is a cross-sectional view illustrating a touch module 100A according to another embodiment of this disclosure. Figure 6 As shown, this embodiment is for Figure 3 The protective component 200 of the touch module 100 shown is modified. Specifically, the protective component 300 in this embodiment further includes a bonding layer 330. The bonding layer 330 bonds the cover plate 210 and the buffer layer 220, and has a thickness between about 10 nm and about 100 nm, preferably between about 40 nm and about 60 nm. The purpose of the bonding layer 330 is to better serve as a bonding medium between the cover plate 210 and the buffer layer 220.

[0096] In some embodiments, the material of the bonding layer 330 comprises epoxy functional silane, amino functional silane, or thiol functional silane, but this disclosure is not limited thereto.

[0097] From the detailed description of the specific embodiments disclosed above, it is clear that the protective component disclosed herein, through the elasticity provided by the buffer layer and the high Young's coefficient provided by the flexible substrate, can resist impact when subjected to an impact, thus allowing the touch function of the touch module to still function. Furthermore, the touch module disclosed herein also uses a composite touch electrode design in conjunction with the protective component; therefore, in addition to resisting impact through the protective component to maintain touch function, the composite touch electrode can also effectively reduce impedance to increase the touch refresh rate.

[0098] Although the present disclosure has been described above with reference to embodiments, it is not intended to limit the present disclosure. Any person skilled in the art may make various modifications and alterations without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the scope defined in the appended claims.

Claims

1. A protective component, characterized in that, Include: A cover plate; A buffer layer, disposed on the cover plate, is composed of a transparent polymer, the buffer layer having a light transmittance greater than 85%, a thickness between 3 µm and 15 µm, and a Purkinje ratio greater than 0.4; and A flexible substrate is disposed on and in contact with the buffer layer and is doped with an inorganic mixture. The flexible substrate has a thickness between 3 µm and 10 µm and a Young's coefficient between 1 Gpa and 10 Gpa.

2. The protection component according to claim 1, characterized in that, The buffer layer has a pozzolanic ratio greater than 0.

5.

3. The protection component according to claim 1, characterized in that, The buffer layer has an elongation rate between 200% and 1600%.

4. The protection component according to claim 1, characterized in that, The buffer layer and at least one of the flexible substrate have a pyrolysis temperature greater than 340 degrees Celsius.

5. The protection component according to claim 1, characterized in that, The buffer layer and at least one of the flexible substrate have a maximum operating temperature greater than 350 degrees Celsius.

6. The protection component according to claim 1, characterized in that, The inorganic mixture contains graphene, diamond, or a mixture thereof.

7. The protection component according to claim 1, characterized in that, The inorganic mixture contains between 100 ppm and 1000 ppm of graphene oxide.

8. The protection component according to claim 1, characterized in that, It further includes a bonding layer that bonds the cover plate to the buffer layer and has a thickness between 10 nm and 100 nm.

9. The protection component according to claim 8, characterized in that, The bonding layer is made of epoxy siloxane, amino siloxane, or thiol siloxane.

10. The protection component according to claim 1, characterized in that, The main material of the buffer layer includes polydimethylsiloxane, polymethyl methacrylate, or polycarbonate.

11. The protection component according to claim 1, characterized in that, The components of the buffer layer include epoxy organics, amino organics, or thiol organics.

12. The protection component according to claim 1, characterized in that, The components in the flexible substrate include epoxy-based organic compounds or thiol-based organic compounds.

13. A touch module, characterized in that, Include: A protection component as described in any one of claims 1 to 12; A bridging pattern layer is disposed on the side of the flexible substrate away from the cover plate and includes multiple bridging electrodes; as well as An electrode pattern layer is disposed above the bridging pattern layer and includes a first transparent conductive layer, a metal layer and a second transparent conductive layer stacked in sequence and having a first resistance value, a second resistance value and a third resistance value respectively.

14. The touch module according to claim 13, characterized in that, The electrode pattern layer has two through-hole areas directly above one of the bridging electrodes, and the touch module further includes: A first insulating layer is disposed between the bridging pattern layer and the electrode pattern layer, and has two exposed areas, wherein the electrode pattern layer is electrically connected to the bridging electrode via the exposed areas; and A second insulating layer is disposed on the electrode pattern layer and covers and fills the via areas.

15. The touch module according to claim 14, characterized in that, The first insulating layer includes a first insulating block and a second insulating block respectively formed at both ends of the bridging electrodes, and a third insulating block located between the first insulating block and the second insulating block separated by the exposed areas.

16. The touch module according to claim 14, characterized in that, The electrode pattern layer contains: The two first electrode blocks are electrically connected to the bridging electrodes via the exposed areas, respectively; and A second electrode block is located between the first electrode blocks, separated by the vias.

17. The touch module according to claim 13, characterized in that, The first transparent conductive layer is a first transparent oxide conductive layer, and the second transparent conductive layer is a second transparent oxide conductive layer.

18. The touch module according to claim 17, characterized in that, At least one of the first transparent oxide conductive layer and the second transparent oxide conductive layer has a first region and a second region, and the oxygen content of the first region is greater than the oxygen content of the second region.

19. The touch module according to claim 18, characterized in that, The second region is located between the first region and the metal layer.

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