A cooling system and a cooling method for an electronic device

Abstract

The application provides a cooling method and system for electronic equipment. The method comprises: when the electronic equipment is working, controlling low-boiling cooling medium and high-boiling cooling medium to flow at respective initial mass flow rates; acquiring heat flow density and temperature signals of the electronic equipment in real time, and adjusting the mass flow rates of the low-boiling cooling medium and / or the high-boiling cooling medium in real time. The cooling system comprises an electronic module and a cooling channel, a temperature sensor and a controller located in the electronic module. The cooling channel comprises a first cooling channel and a second cooling channel, and the first cooling channel and the second cooling channel circulate cooling medium with different boiling points. The controller is used for controlling the on-off and mass flow rate of the cooling medium of the first cooling channel, and / or controlling the on-off and mass flow rate of the cooling medium of the second cooling channel. The system and method can solve the problems of instability and low reliability of traditional boiling heat transfer, and can meet the heat dissipation requirements of high heat flow density electronic modules.

Description

Technical Field

[0001] This invention relates to the field of thermal management technology for electronic devices, specifically to a cooling system and cooling method for electronic devices. Background Technology

[0002] With the rapid development of microelectronics technology, electronic systems are constantly evolving towards miniaturization, integration, and high density. Simultaneously, as the functional density and size of electronic systems continue to increase, the heat flux density of electronic devices is also increasing. When electronic devices are operating, their internal electronic components convert power into heat. This heat must be dissipated promptly; otherwise, the components will overheat, leading to a rapid decline in their reliability. Therefore, it is essential to control the temperature of electronic components within a specific range using appropriate methods.

[0003] Currently, traditional heat dissipation technologies for electronic devices include natural heat dissipation, forced air cooling, and liquid cooling. Among them, natural heat dissipation dissipates heat through natural air convection, and its heat dissipation capacity is the lowest. Forced air cooling uses a fan to drive airflow, which exchanges heat with the electronic device through forced convection, and its heat dissipation capacity is relatively high. Liquid cooling uses liquid as a working fluid, and heat is transferred through convection between the liquid and the heat source. It has a very high convective heat transfer coefficient and its heat dissipation capacity is the strongest.

[0004] Furthermore, as the temperature rises, boiling may occur, a vaporization process within the liquid that generates bubbles, which is a phase change process. The latent heat of phase change in the liquid boiling vaporization process can absorb a large amount of heat, and the generated bubbles can create violent disturbances in the liquid, resulting in a very high heat transfer coefficient. Studies have shown that boiling can be used to cool heat sources. For example, currently applied immersion boiling cooling technology and microchannel boiling heat exchange technology both utilize boiling heat exchange to cool heat sources.

[0005] Because boiling heat transfer is a very complex physical process, as the heat flux density increases, the heat exchange between the cooling medium and the heat source surface will successively enter the states of single-phase convective boiling, nucleus boiling, transitional boiling, and film boiling. When single-phase convective boiling develops into nucleus boiling, the heat transfer coefficient rises rapidly, and the heat transfer performance increases significantly; however, as the heat flux density further increases, when it exceeds the critical heat flux density (CHF), it will enter the transitional boiling state, which will cause the heat transfer coefficient to decrease rapidly.

[0006] Furthermore, in actual cooling, if the heat flux density exceeds the critical heat flux density, heat transfer deteriorates drastically, the temperature of the heat source will increase sharply, and the "evaporation" phenomenon may occur, which may lead to the burning of the object being cooled, causing safety problems. Summary of the Invention

[0007] To address the problems of unstable and unreliable traditional boiling heat exchange, such as "evaporation" leading to low cooling efficiency and burnout of the cooled object, this invention designs a cooling system and method for electronic devices. This cooling system and method have strong heat dissipation capabilities, can save on the amount of cooling medium used, can reduce the cooling area and volume, and can solve the problems of unstable and unreliable traditional boiling heat exchange, thus meeting the heat dissipation requirements of high heat flux density electronic modules.

[0008] The technical solution to achieve the purpose of the invention is as follows:

[0009] In a first aspect, the present invention provides a cooling method for an electronic device, comprising the following steps:

[0010] Step 1: When the electronic device is working, control the low-boiling-point cooling medium and the high-boiling-point cooling medium to flow at their respective initial mass flow rates;

[0011] Step 2: Acquire the heat flux density and temperature signal of the electronic device in real time, and adjust the mass flow rate of the low-boiling-point cooling medium and / or the high-boiling-point cooling medium in real time.

[0012] Furthermore, in step 2 above, the heat flux density and temperature signals of the electronic device are acquired in real time, and the mass flow rate of the low-boiling-point cooling medium and / or the high-boiling-point cooling medium is adjusted in real time, including:

[0013] Step 2.1: Acquire the heat flux density and temperature signal of the electronic device in real time;

[0014] Step 2.2: When the heat flux density of the electronic device is between q0 and q1, and the temperature gradually reaches T... s0 At the same time, the low-boiling-point cooling medium and the high-boiling-point cooling medium are controlled to flow at their respective initial mass flow rates;

[0015] Step 2.3: When the heat flux density of the electronic device is between q1 and q2, and the temperature gradually rises to T... s1 At the same time, gradually increase the mass flow rate of the low-boiling-point cooling medium;

[0016] Step 2.4: When the heat flux density of the electronic device is between q2 and q3, and the temperature gradually rises to T... s2 At the same time, the low-boiling-point cooling medium is controlled to flow at the maximum mass flow rate, and the mass flow rate of the high-boiling-point cooling medium is gradually increased.

[0017] Step 2.5: When the heat flux density of the electronic device is between q2 and q3, and the temperature gradually rises to T... s3 At that time, both the low-boiling-point cooling medium and the high-boiling-point cooling medium are controlled to flow at the maximum mass flow rate.

[0018] Furthermore, the temperature difference between the low-boiling-point cooling medium and the high-boiling-point cooling medium is greater than or equal to 10°C.

[0019] Furthermore, the aforementioned low-boiling-point cooling medium and the aforementioned high-boiling-point cooling medium include any two of water, mineral oil, and fluorinated liquid.

[0020] In a second aspect, the present invention provides a cooling system for electronic devices, including an electronic module and cooling channels and a temperature sensor located within the electronic module.

[0021] The cooling channels include a first cooling channel and a second cooling channel, and cooling media with different boiling points flow in the first cooling channel and the second cooling channel.

[0022] The cooling system also includes a controller, which is electrically connected to the temperature sensor, the first liquid inlet assembly, and the second liquid inlet assembly. The controller is used to control the opening and closing of the first cooling channel and the flow rate of the cooling medium liquid based on the temperature signal of the electronic components collected by the temperature sensor, and / or to control the opening and closing of the second cooling channel and the flow rate of the cooling medium liquid.

[0023] Furthermore, one end of the first cooling channel is connected to a first liquid inlet assembly, and the other end is connected to a first liquid outlet assembly, and a first condenser is provided between the first liquid inlet assembly and the first liquid outlet assembly.

[0024] The second cooling channel is connected to a second liquid inlet assembly at one end and a second liquid outlet assembly at the other end, and a second condenser is provided between the second liquid inlet assembly and the second liquid outlet assembly.

[0025] Furthermore, both the first liquid inlet assembly and the second liquid inlet assembly include a medium pipeline and a water pump located on the medium pipeline.

[0026] Furthermore, the aforementioned electronic module includes a cover plate, a module housing, and multiple connectors.

[0027] Furthermore, both the first and second cooling channels are arranged in a zigzag pattern within the electronic module.

[0028] Furthermore, the flow direction of the cooling medium in the first cooling channel is the same as or opposite to the flow direction of the cooling medium in the second cooling channel.

[0029] Furthermore, the aforementioned electronic module is made of a material with high thermal conductivity.

[0030] Compared with the prior art, the beneficial effects of the present invention are: the cooling system and cooling method of the electronic device designed in the present invention adopts liquid boiling heat exchange to dissipate heat from the electronic device, which has the advantages of strong heat dissipation capacity, saving the amount of cooling medium used, and reducing the cooling area and volume. At the same time, it can also solve the problems of instability and low reliability of traditional boiling heat exchange, and can meet the heat dissipation requirements of high heat flux density electronic modules. Attached Figure Description

[0031] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0032] Figure 1 This is a schematic block diagram of a cooling system for electronic devices in a specific implementation.

[0033] Figure 2 This is a perspective view of the electronic module in a specific implementation method;

[0034] Figure 3 This is a schematic diagram showing the distribution of electronic components on the module housing in a specific implementation embodiment;

[0035] Figure 4 This is a structural schematic diagram of the module box in a specific implementation embodiment;

[0036] Figure 5 This describes the distribution of electronic components on the electronic assembly in a specific implementation embodiment;

[0037] The components include: 1. Electronic module; 2. Fan; 3. First condenser; 4. Second condenser; 5. Second water pump; 6. First water pump; 7. First cable; 8. Controller; 9. Second cable; 10. Third cable; 11. First liquid inlet pipe; 12. Second liquid inlet pipe; 13. First liquid outlet pipe; 14. Third liquid inlet pipe; 15. Fourth liquid inlet pipe; 16. Second liquid outlet pipe; 101. Cover plate; 102. First inlet; 103. Second inlet; 104. First outlet; 105. Second outlet; 106. Module housing; 106A. Sealing cover plate; 106B. Housing; 107. Electronic component; 1071. Electronic component; 108. Connector; 1061. First cooling channel; 1062. Second cooling channel. Detailed Implementation

[0038] The present invention will be further described below with reference to specific embodiments, and the advantages and features of the present invention will become clearer as a result. However, these embodiments are merely exemplary and do not constitute any limitation on the scope of the present invention. Those skilled in the art should understand that modifications or substitutions can be made to the details and form of the technical solutions of the present invention without departing from the spirit and scope of the present invention, but all such modifications and substitutions fall within the protection scope of the present invention.

[0039] Example 1:

[0040] This specific embodiment designs a cooling method for electronic devices, including the following steps:

[0041] Step 1: When the electronic device is working, control the low-boiling-point cooling medium and the high-boiling-point cooling medium to flow at their respective initial mass flow rates.

[0042] The temperature difference between the low-boiling-point cooling medium and the high-boiling-point cooling medium is greater than or equal to 10℃.

[0043] Meanwhile, to ensure system safety, the boiling point range of the low-boiling-point cooling medium and the high-boiling-point cooling medium selected in this step is 50~125℃.

[0044] Optionally, the aforementioned low-boiling-point cooling medium and high-boiling-point cooling medium include any two of water, mineral oil, and fluorinated liquid, or other cooling media with a boiling point in the range of 50~125℃.

[0045] Step 2: Acquire the heat flux density and temperature signal of the electronic device in real time, and adjust the mass flow rate of the low-boiling-point cooling medium and / or the high-boiling-point cooling medium in real time.

[0046] This includes real-time acquisition of the heat flux density and temperature signals of electronic devices, and real-time adjustment of the mass flow rate of the low-boiling-point cooling medium and / or the high-boiling-point cooling medium, including:

[0047] Step 2.1: Acquire the heat flux density and temperature signal of the electronic device in real time;

[0048] Step 2.2: When the heat flux density of the electronic device is between q0 and q1, and the temperature gradually reaches T... s0 At that time, the low-boiling-point cooling medium and the high-boiling-point cooling medium are controlled to flow at their respective initial mass flow rates.

[0049] In this step, as the temperature rises, the low-boiling-point cooling medium gradually begins to undergo nucleation boiling within its channel. At this point, the heat transfer coefficient increases rapidly, and the heat exchange also increases significantly. The low-boiling-point cooling medium can dissipate more heat, thereby achieving temperature control of electronic components. Meanwhile, the high-boiling-point cooling medium remains in a unidirectional convective heat transfer state within its channel, and its heat transfer coefficient is relatively low, but it can still dissipate some heat.

[0050] In this process, the low-boiling-point cooling medium plays the main role in heat dissipation, while the high-boiling-point cooling medium only plays a minor role in heat dissipation.

[0051] Step 2.3: When the heat flux density of the electronic device is between q1 and q2, and the temperature gradually rises to T...s1 At the same time, the mass flow rate of the low-boiling-point cooling medium is gradually increased.

[0052] In this step, as the heat flux density of the electronic equipment gradually increases, the boiling state of the low-boiling-point cooling medium gradually transforms into liquid film convection boiling, wet steam heat exchange, or even superheated steam heat exchange. The heat transfer coefficient will rapidly decrease, causing the temperature to rise. At this time, the high-boiling-point cooling medium begins to undergo nucleation boiling within its channel. With a slight increase in temperature, the heat transfer coefficient will rapidly increase, and the heat exchange will also significantly improve, suppressing further temperature increases. The cooling function of the high-boiling-point cooling medium gradually improves, while the cooling function of the low-boiling-point cooling medium gradually decreases.

[0053] Meanwhile, as the temperature gradually rises to value T s1 In the above scenario, while maintaining a constant flow rate of the high-boiling-point cooling medium, the flow rate of the low-boiling-point cooling medium is gradually increased to ensure that the low-boiling-point cooling medium performs its primary cooling function. When the mass flow rate of the low-boiling-point cooling medium gradually increases to v... a1 At this time, the low-boiling-point cooling medium, which was originally in a state of convective boiling, wet steam heat exchange, or even superheated steam heat exchange, gradually transforms into nucleation boiling, which improves the heat dissipation capacity of the low-boiling-point cooling medium and ensures that the system is in a stable temperature state.

[0054] Step 2.4: When the heat flux density of the electronic device is between q2 and q3, and the temperature gradually rises to T... s2 At the same time, the low-boiling-point cooling medium is controlled to flow at the maximum mass flow rate, and the mass flow rate of the high-boiling-point cooling medium is gradually increased.

[0055] In this step, as the heat flux density of the electronic device further increases to between q2 and q3, and the temperature rises to T... s2 At this point, the low-boiling-point cooling medium has reached its maximum mass flow rate v. a1 The low-boiling-point cooling medium is at its maximum flow rate, while the high-boiling-point cooling medium is at its initial flow rate. At this point, the flow rate of the high-boiling-point cooling medium needs to be gradually adjusted, and the cooling ratio of the high-boiling-point cooling medium is gradually increased to ensure the cooling effect of the system.

[0056] Step 2.5: When the heat flux density of the electronic device is between q2 and q3, and the temperature gradually rises to T... s3 At that time, both the low-boiling-point cooling medium and the high-boiling-point cooling medium are controlled to flow at the maximum mass flow rate.

[0057] In this step, as the heat flux density and temperature further increase, the system reaches a maximum where both the low-boiling-point cooling medium and the high-boiling-point cooling medium are flowing at their maximum mass flow rates, achieving the system's maximum heat dissipation capacity.

[0058] In this specific embodiment, the flow rate control strategies for the low-boiling-point and high-boiling-point cooling media, as well as the various stages of heat flux density and the various critical values ​​of temperature, can be obtained through pre-experimental calibration, thereby forming control commands loaded into the controller. The calibration process is as follows:

[0059] a. A high-temperature resistant heating element should be used to simulate the actual chip during the experiment to avoid the chip overheating and burning out.

[0060] b. Set the system to its initial operating state, and set the flow rates of the low-boiling-point cooling medium and the high-boiling-point cooling medium to m³ respectively. a0 m b0 And apply power P to the electronic device (P should be as small as possible at this time);

[0061] c. Gradually increase the power P, making the adjustment as small as possible each time. After each adjustment, observe the change in temperature t collected by the temperature sensor.

[0062] d. When the temperature t rises rapidly, record the temperature value T1 before the rapid rise;

[0063] e. Set the flow rate of the low-boiling-point cooling medium to m a1 m a1 >m a0 ;

[0064] f. Continue to increase the power P, making the adjustment as small as possible each time. After each adjustment, observe the change in temperature t collected by the temperature sensor.

[0065] g. When the temperature t rises rapidly, record the temperature value T2 before the rapid rise;

[0066] h. Set the flow rate of the low-boiling-point cooling medium to its maximum value m. a2 m a2 >m a1 >m a0 ;

[0067] i. Continue to increase the power P, making the adjustment as small as possible each time. After each adjustment, observe the change in temperature t collected by the temperature sensor.

[0068] j. When the temperature t rises rapidly, record the temperature value T3 before the rapid rise;

[0069] k. Set the flow rate of the high-boiling-point cooling medium to m b1 m b1 >m b0 ;

[0070] 1. Continue to increase the power P, making the adjustment as small as possible each time. After each adjustment, observe the change in temperature t collected by the temperature sensor.

[0071] m. When the temperature t rises rapidly, record the temperature value T4 before the rapid rise;

[0072] n. Set the maximum flow rate of the high-boiling-point cooling medium to m. b2 m b2 >m b1 >m b0 ;

[0073] o. Continue to increase the power P, making the adjustment as small as possible each time. After each adjustment, observe the change in temperature t collected by the temperature sensor.

[0074] p. When the temperature t rises rapidly, record the temperature value T5 before the rapid rise.

[0075] The aforementioned cooling method employs two cooling media with different boiling points to cool the electronic module. As heat flux density and heat source power consumption increase, the two cooling media alternately enter a boiling heat exchange state, expanding the boiling heat exchange range of a single cooling medium and resolving issues such as instability and fluctuations associated with single-medium boiling heat exchange. Furthermore, a control strategy is used to manage the system, allowing the two cooling media to alternately undertake the primary heat dissipation task, and adjusting the pump flow rate to further broaden the boiling heat exchange range of the cooling media, thus improving the heat dissipation capacity and reliability of traditional liquid cooling.

[0076] Example 2:

[0077] This embodiment provides a cooling system for electronic devices, see [link to documentation]. Figure 1 As shown, the cooling system includes an electronic module 1, a cooling channel located within the electronic module 1, a temperature sensor, a controller 8, a liquid inlet assembly, a liquid outlet assembly, and a fan 2.

[0078] See Figure 1 As shown, the cooling channel includes a first cooling channel 1061 and a second cooling channel 1062, and cooling media with different boiling points flow in the first cooling channel 1061 and the second cooling channel 1062. For example, a low-boiling-point cooling medium flows in the first cooling channel 1061, and a high-boiling-point cooling medium flows in the second cooling channel 1062.

[0079] Optionally, the first cooling channel 1061 and the second cooling channel 1062 are arranged in a zigzag, reciprocating structure within the electronic module 1. For example, when near a heat source, the first cooling channel 1061 and the second cooling channel 1062 are designed with a dense, zigzag, reciprocating shape to increase their length, and the distance between them is at least less than 2 mm. They can be parallel or spiral. Their cross-sectional shape can be rectangular, circular, or other shapes, and they can be the same or different. The width of the channels is less than 3 mm, and the surface of the channels can be pits, gaps, or porous surfaces to increase the formation of vaporization nuclei during boiling.

[0080] Optional, see Figure 1 As shown, a first cooling channel 1061 has a first liquid inlet assembly connected to a liquid inlet assembly at one end and a first liquid outlet assembly connected to a liquid outlet assembly at the other end, with a first condenser 3 provided between the first liquid inlet assembly and the first liquid outlet assembly. A second cooling channel 1062 has a second liquid inlet assembly connected to a liquid inlet assembly at one end and a second liquid outlet assembly connected to a liquid outlet assembly at the other end, with a second condenser 4 provided between the second liquid inlet assembly and the second liquid outlet assembly.

[0081] Optionally, the flow direction of the cooling medium in the first cooling channel 1061 is the same as or opposite to the flow direction of the cooling medium in the second cooling channel 1062.

[0082] Optionally, both the first and second liquid inlet assemblies described above include a media pipeline and a water pump located on the media pipeline. See also Figure 1 As shown, the first liquid inlet assembly includes a first liquid inlet pipe 11, a first water pump 6, and a second liquid inlet pipe 12, and the first liquid outlet assembly includes a first liquid outlet pipe 13. The second liquid inlet pipe 12 is connected to the first cooling channel 1061 via a first inlet 102 on the electronic module 1, and the first liquid outlet pipe 13 is connected to the first cooling channel 1061 via a first outlet 104.

[0083] See Figure 1 As shown, the second liquid inlet assembly includes a third liquid inlet pipe 14, a second water pump 5, and a fourth liquid inlet pipe 15, and the second liquid outlet assembly includes a second liquid outlet pipe 16. The third liquid inlet pipe 14 is connected to the second cooling channel 1062 via the second inlet 103 on the electronic module 1, and the second liquid outlet pipe 16 is connected to the second cooling channel 1062 via the second outlet 105.

[0084] In one embodiment, the first water pump 6 and the second water pump 5 can be centrifugal, gear-type, or other types, and the flow rate can be adjusted within a certain range.

[0085] In one embodiment, the temperature sensor can be a type K or type T thermocouple, or a temperature sensing chip. There can be one or more of them, and they can be arranged on the surface or inside the module housing 106, or on electronic components.

[0086] See Figures 2 to 5 As shown, the electronic module 1 includes a cover plate 101, multiple connectors, and a module housing 106. The cover plate 101 is detachably fixed to the module housing 106 by screws. The electronic component 107 includes at least one electronic component 1071, and each electronic component can directly contact the module housing 106 or can contact it through other thermally conductive materials.

[0087] See Figure 2 and Figure 4 As shown, the module housing 106 is made of materials with high thermal conductivity, such as aluminum alloy or copper. It includes a sealing cover plate 106A and a housing 106B. The sealing cover plate 106A and the housing 106B are welded together, such as by vacuum brazing, to achieve a seal. The housing 106B is provided with the aforementioned first inlet 102, second inlet 103, first outlet 104, and second outlet 105. The housing 106B is also machined with the aforementioned first cooling channel 1061 and second cooling channel 1062. Connectors 108 are installed on the first inlet 102, second inlet 103, first outlet 104, and second outlet 105 of the housing 106B, connecting the pipes to the channels to facilitate the flow of the cooling medium.

[0088] See Figure 1 As shown, there can be one or more fans 2, located above the first condenser 3 and the second condenser 4, and the first condenser 3 and the second condenser 4 can be cooled by the same fan or different fans.

[0089] See Figure 1 As shown, the controller 8 is electrically connected to the temperature sensor, the first liquid inlet assembly, and the second liquid inlet assembly. It is used to control the on / off state of the first cooling channel 1061 and the flow rate of the cooling medium based on the temperature signal of the electronic components collected by the temperature sensor, and / or to control the on / off state of the second cooling channel 1062 and the flow rate of the cooling medium. Specifically, the controller 8 is electrically connected to the first water pump 6 via the first cable 7, to the second water pump 5 via the second cable 9, and to the temperature sensor via the third cable 10.

[0090] The core of the aforementioned cooling system and method is the use of two cooling media with different boiling points to cool electronic components. As heat flux density and heat source power consumption increase, the two cooling media alternately enter a boiling heat exchange state, expanding the boiling heat exchange range of a single cooling medium and solving problems such as instability and oscillation associated with boiling heat exchange in a single cooling medium. Furthermore, a control strategy is employed to manage the system, allowing the two cooling media to alternately undertake the primary heat dissipation task, and adjusting the pump flow rate to further broaden the boiling heat exchange range of the cooling media. This improves the heat dissipation capacity and reliability of traditional liquid cooling.

[0091] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

[0092] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A cooling method for electronic devices, characterized in that, Includes the following steps: Step 1: When the electronic device is working, control the low-boiling-point cooling medium and the high-boiling-point cooling medium to flow at their respective initial mass flow rates; Step 2: Acquire the heat flux density and temperature signals of the electronic device in real time, and adjust the mass flow rate of the low-boiling-point cooling medium and / or the high-boiling-point cooling medium in real time; including: Step 2.1: Acquire the heat flux density and temperature signal of the electronic device in real time; Step 2.2: When the heat flux density of the electronic device is between q0 and q1, and the temperature gradually reaches T... s0 At the same time, the low-boiling-point cooling medium and the high-boiling-point cooling medium are controlled to flow at their respective initial mass flow rates; Step 2.3: When the heat flux density of the electronic device is between q1 and q2, and the temperature gradually rises to T... s1 At the same time, gradually increase the mass flow rate of the low-boiling-point cooling medium; Step 2.4: When the heat flux density of the electronic device is between q2 and q3, and the temperature gradually rises to T... s2 At the same time, the low-boiling-point cooling medium is controlled to flow at the maximum mass flow rate, and the mass flow rate of the high-boiling-point cooling medium is gradually increased. Step 2.5: When the heat flux density of the electronic device is between q2 and q3, and the temperature gradually rises to T... s3 At that time, both the low-boiling-point cooling medium and the high-boiling-point cooling medium are controlled to flow at the maximum mass flow rate.

2. The cooling method for electronic devices according to claim 1, characterized in that, The temperature difference between the low-boiling-point cooling medium and the high-boiling-point cooling medium is greater than or equal to 10°C.

3. The cooling method for electronic devices according to claim 1 or 2, characterized in that, The low-boiling-point cooling medium and the high-boiling-point cooling medium include any two of water, mineral oil, and fluorinated liquid.

4. A cooling system for an electronic device, used to implement the method as described in any one of claims 1 to 3, comprising an electronic module (1) and cooling channels and a temperature sensor located within the electronic module (1), characterized in that, The cooling channel includes a first cooling channel (1061) and a second cooling channel (1062), and cooling media with different boiling points flow in the first cooling channel (1061) and the second cooling channel (1062); The cooling system also includes a controller (8), which is electrically connected to the temperature sensor, the first liquid inlet assembly, and the second liquid inlet assembly. The controller (8) is used to control the opening and closing of the first cooling channel (1061) and the flow rate of the cooling medium liquid based on the temperature signal of the electronic components collected by the temperature sensor, and / or to control the opening and closing of the second cooling channel (1062) and the flow rate of the cooling medium liquid.

5. The cooling system for electronic devices according to claim 4, characterized in that: The first cooling channel (1061) is connected to a first liquid inlet assembly at one end and a first liquid outlet assembly at the other end, and a first condenser (3) is provided between the first liquid inlet assembly and the first liquid outlet assembly. The second cooling channel (1062) is connected to a second liquid inlet assembly at one end and a second liquid outlet assembly at the other end, and a second condenser (4) is provided between the second liquid inlet assembly and the second liquid outlet assembly.

6. The cooling system for electronic devices according to claim 4, characterized in that: Both the first liquid inlet assembly and the second liquid inlet assembly include a medium pipeline and a water pump located on the medium pipeline.

7. The cooling system for electronic devices according to claim 4, characterized in that: The electronic module (1) includes a cover plate (101), a module box (106), and multiple connectors.

8. The cooling system for electronic devices according to claim 4, characterized in that: The first cooling channel (1061) and the second cooling channel (1062) are arranged in a zigzag reciprocating structure within the electronic module (1).

9. The cooling system for electronic devices according to claim 4, characterized in that: The flow direction of the cooling medium in the first cooling channel (1061) is the same as or opposite to the flow direction of the cooling medium in the second cooling channel (1062).

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