Display module, display device and manufacturing method thereof

Abstract

A display module includes multiple micropixel packages and multiple voltage lines electrically connected between a group of adjacent micropixel packages, wherein each of the multiple micropixel packages includes: multiple inorganic light-emitting elements arranged on the upper surface of a second substrate; a micropixel controller arranged on the second substrate and controlling the multiple inorganic light-emitting elements; and an internal connection line arranged on the second substrate and electrically connecting a first voltage line with a second voltage line among the multiple voltage lines, the first voltage line being electrically connected to the first micropixel package in the group of adjacent micropixel packages, and the second voltage line being electrically connected to the second micropixel package in the group of adjacent micropixel packages.

Description

Technical Field

[0001] The present disclosure relates to a display module and a display device for realizing an image using an inorganic light-emitting element, and a method for manufacturing the same. Background Art

[0002] Display devices can be classified into self-luminous displays in which each pixel emits light by itself and passive light-emitting displays requiring a separate light source.

[0003] A liquid crystal display (LCD) is a passive light-emitting display and requires a backlight unit configured to supply light from the back of a display panel, a liquid crystal layer configured to function as a switch for transmitting / blocking light, a color filter configured to change the supplied light to a desired color, etc. Therefore, the LCD is structurally complex and has limitations in achieving a small thickness.

[0004] On the other hand, in self-luminous displays, where each pixel emits its own light through a light-emitting element, components such as a backlight unit and a liquid crystal layer are unnecessary, and color filters can also be omitted. Therefore, self-luminous displays are structurally simple and offer a high degree of design freedom. Furthermore, self-luminous displays can achieve not only a small thickness but also excellent contrast, brightness, and viewing angles.

[0005] Among self-luminous displays, micro-light emitting diode (LED) displays are a type of flat panel display and include multiple LEDs, each about 100 microns in size. Compared to LCDs that require a backlight, micro-LED displays can provide better contrast, response time, and energy efficiency.

[0006] Furthermore, micro LEDs, which are inorganic light-emitting elements, have higher brightness, higher luminous efficiency, and longer lifespan compared to organic light-emitting diodes (OLEDs) that require a separate encapsulation layer for protecting organic materials. Summary of the Invention

[0007] Technical issues

[0008] A display module, a display device, and a method for manufacturing a display module are provided, wherein power lines with improved resistance are provided by forming some of the power lines in a micropixel controller or a micropixel package, and current resistance (IR) drop is minimized, compared to a case where the power lines are formed on a module substrate.

[0009] Technical Solution

[0010] According to one aspect of the present invention, a display module may include: a plurality of pixels; a first substrate; a plurality of micro-pixel packages disposed on the first substrate; and a plurality of voltage lines electrically connected between a group of micro-pixel packages adjacent to each other in a first direction among the plurality of micro-pixel packages. Each of the plurality of micro-pixel packages may include: a second substrate; a plurality of inorganic light-emitting elements disposed on the second substrate; a micro-pixel controller disposed on the second substrate and configured to control the plurality of inorganic light-emitting elements; and an internal connection line disposed in the second substrate and configured to electrically connect a first voltage line among the plurality of voltage lines and a second voltage line among the plurality of voltage lines, the first voltage line being electrically connected to the first micro-pixel package among the group of micro-pixel packages adjacent to each other in the first direction, and the second voltage line being electrically connected to the second micro-pixel package among the group of micro-pixel packages adjacent to each other in the first direction.

[0011] Each of the plurality of voltage lines may transmit voltage between the plurality of micro-pixel packages.

[0012] Each of the plurality of micro pixel packages may receive a voltage through a first voltage line and output the input voltage to a second voltage line through an internal connection line.

[0013] The internal connection line may include electron mobility higher than electron mobility of each of the plurality of voltage lines.

[0014] The multiple micropixel packages may include a first plurality of micropixel packages and a second plurality of micropixel packages, each of the first plurality of micropixel packages being configured to receive voltage from a power supply board and transmit the voltage to a micropixel package adjacent to the micropixel package in a first direction through a corresponding voltage line, and each of the second plurality of micropixel packages being configured to receive voltage from a micropixel package adjacent to the micropixel package in the first direction.

[0015] The internal connection line can be electrically connected to the plurality of inorganic light-emitting elements and the micro-pixel controller, and can transmit a voltage input from any one of the group of micro-pixel packages to each of the plurality of inorganic light-emitting elements and the micro-pixel controller.

[0016] The internal connection line may include a first internal connection line through which a power supply voltage flows and a second internal connection line through which a reference voltage flows, the first internal connection line may be electrically connected to the micro-pixel controller and transmit the power supply voltage thereto, and the second internal connection line may be electrically connected to a plurality of inorganic light-emitting elements and transmit the reference voltage thereto.

[0017] Each of the plurality of pixels may include two or more inorganic light emitting elements among the plurality of inorganic light emitting elements, and the plurality of inorganic light emitting elements may constitute two or more pixels among the plurality of pixels.

[0018] The micro pixel controller may include a third substrate and at least one thin film transistor disposed on the third substrate. The at least one thin film transistor may switch the plurality of inorganic light emitting elements and supply a driving current to the plurality of inorganic light emitting elements.

[0019] According to one aspect of the present disclosure, a display device may include: a plurality of display modules including a plurality of pixels; and a frame configured to support the plurality of display modules. Each of the plurality of display modules may include: a first substrate; a plurality of micro-pixel packages disposed on the first substrate; and a plurality of voltage lines electrically connected between a group of micro-pixel packages adjacent to each other in a first direction. Each of the plurality of micro-pixel packages may include: a second substrate; a plurality of inorganic light-emitting elements disposed on the second substrate; a micro-pixel controller disposed on the second substrate and configured to control the plurality of inorganic light-emitting elements; and an internal connection line disposed in the second substrate and configured to electrically connect a first voltage line among the plurality of voltage lines and a second voltage line among the plurality of voltage lines, the first voltage line being electrically connected to a first micro-pixel package among a group of micro-pixel packages adjacent to each other in the first direction, and the second voltage line being electrically connected to a second micro-pixel package among a group of micro-pixel packages adjacent to each other in the first direction.

[0020] Each of the plurality of voltage lines may transmit voltage between the plurality of micro-pixel packages.

[0021] Each of the plurality of micro pixel packages may receive a voltage through a first voltage line and output the input voltage to a second voltage line through an internal connection line.

[0022] The internal connection line may include electron mobility higher than electron mobility of each of the plurality of voltage lines.

[0023] The multiple micropixel packages may include a first plurality of micropixel packages and a second plurality of micropixel packages, each of the first plurality of micropixel packages being configured to receive voltage from a power supply board and transmit the voltage to a micropixel package adjacent to the micropixel package in a first direction through a corresponding voltage line, and each of the second plurality of micropixel packages being configured to receive voltage from a micropixel package adjacent to the micropixel package in the first direction.

[0024] The internal connection line can be electrically connected to the plurality of inorganic light-emitting elements and the micro-pixel controller, and can transmit a voltage input from any one of the group of micro-pixel packages to each of the plurality of inorganic light-emitting elements and the micro-pixel controller.

[0025] Beneficial effects

[0026] According to the display module and the display device, by forming some of the power lines in the micropixel controller or the micropixel package, power lines with improved resistance can be provided and current resistance (IR) drop can be minimized compared to the case where the power lines are formed on the module substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a diagram illustrating an example of a display module and a display device having the same according to an embodiment.

[0028] Figure 2 is a diagram illustrating an example of arrangement of pixels constituting a unit module of a display device according to an embodiment.

[0029] Figure 3 is a diagram of a display device according to an embodiment.

[0030] Figure 4 is a diagram showing a configuration of a display module included in a display device according to an embodiment.

[0031] Figure 5 is a diagram illustrating a configuration of a display panel included in a display module according to an embodiment.

[0032] Figure 6 is a diagram illustrating an example in which a signal is transmitted to a plurality of tiled display modules in a display device according to an embodiment.

[0033] Figure 7 is a diagram of a method of driving each pixel in a display module according to an embodiment.

[0034] Figure 8 is a diagram illustrating a pixel circuit configured to control a single sub-pixel in a display module according to an embodiment.

[0035] Figure 9 and Figure 10 is a graph showing changes in driving current according to a power supply voltage and a reference voltage in a pixel circuit according to an embodiment.

[0036] Figure 11 is a diagram illustrating a relationship between a micro pixel controller and pixels controlled by the micro pixel controller in a display module according to an embodiment.

[0037] Figure 12 is a side sectional view of a micro pixel package included in a display module according to an embodiment.

[0038] Figure 13 is a diagram illustrating an upper surface of a micro pixel package included in a display module according to an embodiment.

[0039] Figure 14is a diagram of a module substrate on which a micro-pixel package is disposed in a display module according to an embodiment.

[0040] Figure 15 is a diagram illustrating an upper surface of a module substrate on which a micro pixel package is provided in a display module according to an embodiment.

[0041] Figure 16 is a diagram illustrating power supply lines of a module substrate on which a micro pixel package is provided in a display module according to an embodiment.

[0042] Figure 17 is a diagram of power supply lines of a module substrate on which a micro pixel package is provided in a display module according to an embodiment.

[0043] Figure 18 and Figure 19 is a diagram of power supply lines in one micro-pixel package in a display module according to an embodiment.

[0044] Figure 20 is a diagram showing an example of arrangement of a micro pixel controller and inorganic light emitting elements constituting a display module according to an embodiment.

[0045] Figure 21 is a diagram illustrating power supply lines of a module substrate on which a micro pixel controller is provided in a display module according to an embodiment.

[0046] Figure 22 is a diagram of power supply lines of a module substrate on which a micro pixel controller is disposed in a display module according to an embodiment.

[0047] Figure 23 is a diagram of power supply lines in a micro pixel controller in a display module according to an embodiment.

[0048] Figure 24 is a diagram illustrating an example of a method in which a plurality of display modules are coupled to a housing in a display device according to an embodiment.

[0049] Figure 25 is a flowchart of a method of manufacturing a display module according to an embodiment.

[0050] Figure 26 、 Figure 27 、 Figure 28 、 Figure 29 、 Figure 30 and Figure 31 is a diagram showing the embodiment of the Figure 25 Some operations of manufacturing the display module are shown in FIG. DETAILED DESCRIPTION

[0051] The embodiments disclosed in this specification and the components shown in the drawings are merely example embodiments of the present disclosure, and various modifications that can replace the embodiments of this specification and the drawings may be made when the present application is filed.

[0052] Throughout this specification, when a part is referred to as being "connected" to another part, it includes not only a direct connection but also an indirect connection, and the indirect connection includes a connection through a wireless communication network.

[0053] In addition, the terms used herein are used to illustrate the embodiments and are not intended to limit and / or constrain the disclosed embodiments. As used herein, unless the context clearly indicates otherwise, the singular form is intended to also include the plural form. The terms "comprising," "having," and the like are used herein to specify the presence of the described features, numbers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0054] In addition, terms including ordinal numbers such as "first" and "second" as used herein may be used to describe various components, but the components are not limited by these terms. These terms are only used to distinguish one component from another. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component without departing from the scope of this disclosure.

[0055] In addition, terms such as "unit," "part," "block," "component," and "module" may refer to a unit that processes at least one function or operation. For example, these terms may refer to at least one process implemented by software, a hardware component such as a field programmable gate array (FPGA) or an application specific integrated circuit (ASIC), or a combination of software or hardware.

[0056] The reference numerals attached to each operation are used to identify each operation, and the reference numerals do not describe the order of the operations, and the operations may be performed differently from the described order unless clearly specified in the context.

[0057] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0058] Figure 1 is a diagram illustrating an example of a display module and a display device having the same according to an embodiment. Figure 2 is a diagram illustrating an example of arrangement of pixels constituting a unit module of a display device according to an embodiment.

[0059] The display device 1 according to one embodiment is a self-luminous display device, in which a light-emitting element is provided for each pixel so that each pixel can emit light by itself. Therefore, unlike a liquid crystal display (LCD) device, since components such as a backlight unit and a liquid crystal layer are not required, a smaller thickness can be achieved, and due to its simple structure, various design changes can be made.

[0060] In addition, the display device 1 according to the embodiment can use an inorganic light-emitting element (e.g., an inorganic light-emitting diode (LED)) as a light-emitting element provided in each pixel. The inorganic light-emitting element has a faster response speed than an organic light-emitting element such as an organic light-emitting diode (OLED) and can achieve high brightness with low power.

[0061] In addition, compared with organic light-emitting elements that require an encapsulation process because organic light-emitting elements are easily exposed to moisture and oxygen and have poor durability, inorganic light-emitting elements do not require an encapsulation process and have better durability. Hereinafter, the inorganic light-emitting elements mentioned in the embodiments described below may refer to inorganic LEDs.

[0062] The inorganic light emitting element used in the display device 1 according to one embodiment may be a micro LED having a short side length of about 100 μm. As described above, by using micro LEDs, the pixel size can be reduced, and higher resolution can be achieved within the same size screen.

[0063] Furthermore, manufacturing LED chips in micro-unit sizes can address the issue of LED chips being damaged when bent due to the properties of inorganic materials. Specifically, when micro-LED chips are transferred to a flexible substrate, they are not damaged even when the substrate is bent, enabling the realization of flexible display devices.

[0064] Display devices using micro LEDs can be applied to various fields by using very small pixel sizes and thin thicknesses. For example, Figure 1 As shown, by tiling a plurality of display modules 10 each having a plurality of micro LEDs transferred thereto, and by fixing the plurality of display modules 10 to a housing 20, a large-area screen can be realized, and the display device of the large-area screen can be used as a sign, an electronic billboard, etc.

[0065] Figure 1 The three-dimensional coordinate system of the XYZ axes shown is based on display device 1. The plane on which the screen of display device 1 is located is the XZ plane, and the direction of output image or light emission of the inorganic light-emitting element is the +Y direction. Because the coordinate system is based on display device 1, the same coordinate system can be applied to both situations where the display device 1 is lying flat and when the display device 1 is upright.

[0066] Typically, the display device 1 is used in an upright state, and a user views an image in front of the display device 1 , so that the +Y direction of the output image is referred to as the front side, and the direction opposite to the front side may be referred to as the rear side.

[0067] Furthermore, the display device 1 is typically manufactured in a flat position. Therefore, the -Y direction of the display device 1 can be referred to as the downward direction, and the +Y direction can be referred to as the upward direction. That is, in the embodiments described below, the +Y direction can be referred to as the upward direction or the front side, and the -Y direction can be referred to as the downward direction or the rear side.

[0068] The other four surfaces except the upper surface and the lower surface of the flat-panel type display device 1 or the display module 10 may be referred to as side surfaces regardless of the posture of the display device 1 or the display module 10 .

[0069] exist Figure 1 In the example of FIG, the display device 1 is shown as implementing a large-area screen by including a plurality of display modules, but the embodiment of the display device 1 is not limited thereto. The display device 1 may also be implemented as a television (TV), a wearable device, a portable device, a monitor for a personal computer (PC), etc. by including a single display module 10.

[0070] refer to Figure 2 , the display module 10 may have a two-dimensional pixel structure of an M×N array (where M and N are integers greater than or equal to 2). That is, the display module 10 may have a pixel array consisting of M rows and N columns. In other words, the display module 10 may include a plurality of pixels arranged two-dimensionally. Figure 2 The pixel arrangement is conceptually shown, and therefore, of course, in the display module 10 , in addition to the active area in which the pixels are arranged, a bezel area and a line area in which no image is displayed may also be located.

[0071] In this embodiment, when describing that specific components are arranged two-dimensionally, this includes a case where the corresponding components are arranged on the same plane and a case where the corresponding components are arranged on different planes parallel to each other. In addition, in the case where the corresponding components are arranged on the same plane, the upper ends of the arranged components do not necessarily have to be located on the same plane, and the upper ends of the arranged components may be located on different planes parallel to each other.

[0072] For example, a unit pixel P may include at least three sub-pixels that output light of different colors. For example, a unit pixel P may include three sub-pixels SP(R), SP(G), and SP(B) corresponding to red (R), green (G), and blue (B), respectively. The red sub-pixel SP(R) may output red light, the green sub-pixel SP(G) may output green light, and the blue sub-pixel SP(B) may output blue light.

[0073] However, Figure 2 The pixel arrangement is merely an example applicable to the display module 10 and the display device 1 according to one embodiment, and the sub-pixels may be arranged along the Z-axis direction, may not be arranged in a row, and may be implemented to have different sizes. To achieve multiple colors, a single pixel only needs to include multiple sub-pixels, and there is no limitation on the size of each sub-pixel or the arrangement of the sub-pixels.

[0074] In addition, the unit pixel P is not necessarily composed of a red sub-pixel SP (R) configured to output red light, a green sub-pixel SP (G) configured to output green light, and a blue sub-pixel SP (B) configured to output blue light, and may include a sub-pixel configured to output yellow light or white light. That is, there is no limitation on the color or type of light output from each sub-pixel and the number of sub-pixels.

[0075] However, in the embodiment described below, for detailed description, a case where the unit pixel P includes a red sub-pixel SP(R), a green sub-pixel SP(G), and a blue sub-pixel SP(B) will be described as an example.

[0076] As described above, each of the display module 10 and the display device 1 according to one embodiment is a self-luminous display device, in which each pixel can emit light by itself. Therefore, an inorganic light-emitting element emitting light of a different color can be provided in each sub-pixel. For example, a red inorganic light-emitting element can be provided in the red sub-pixel SP(R), a green inorganic light-emitting element can be provided in the green sub-pixel SP(G), and a blue inorganic light-emitting element can be provided in the blue sub-pixel SP(B).

[0077] Therefore, in this embodiment, the pixel P may represent a cluster including a red inorganic light emitting element, a green inorganic light emitting element, and a blue inorganic light emitting element, and the sub-pixel may represent each inorganic light emitting element.

[0078] Figure 3 is a diagram of a display device according to an embodiment.

[0079] refer to Figure 3 , as referenced above Figure 1As described, according to one embodiment, a display device 1 may include a plurality of display modules 10-1, 10-2, ... and 10-n (where n is an integer greater than or equal to two), a main controller 300 and a timing controller 500 configured to control the plurality of display modules 10, a communicator 430 configured to communicate with an external device, a source input part 440 configured to receive a source image, a speaker 410 configured to output sound, and an input part 420 configured to receive a command from a user for controlling the display device 1.

[0080] The input portion 420 may include a button or a touch panel provided in one area of the display device 1, and when the display panel 11 ( Figure 4 ) is implemented as a touch screen, the input portion 420 may include a touch pad provided on the front surface of the display panel 11. In addition, the input portion 420 may further include a remote controller.

[0081] The input portion 420 may receive various commands for controlling the display apparatus 1 (eg, power on / off, volume adjustment, channel adjustment, screen adjustment, various setting changes, etc. of the display apparatus 1 ) from a user.

[0082] The speaker 410 may be provided in one area of the housing 20 , and a separate speaker module physically separated from the housing 20 may also be provided.

[0083] The communicator 430 can send and receive necessary data by communicating with a relay server or other electronic devices. The communicator 430 can adopt at least one of various wireless communication methods, for example, third generation (3G), fourth generation (4G), wireless local area network (LAN), Wi-Fi, Bluetooth, Zigbee, Wi-Fi Direct (WFD), ultra-wideband (UWB), infrared data association (IrDA), low-power Bluetooth (BLE), near field communication (NFC) and Z-wave. In addition, the communicator 430 can adopt a wired communication method, for example, peripheral component interconnect (PCI), PCI Express or universal serial bus (USB).

[0084] The source input portion 440 may receive a source signal input from a set-top box, a USB, an antenna, etc. Therefore, the source input portion 440 may include at least one selected from a source input interface group including a High Definition Multimedia Interface (HDMI) cable port, a USB port, an antenna, etc.

[0085] The source signal received by the source input portion 440 may be processed by the main controller 300 to be converted into a form that may be output by the display panel 11 and the speaker 410 .

[0086] The main controller 300 and the timing controller 500 may include at least one memory configured to store programs for performing the operations described below and various types of data, and at least one processor configured to execute the stored programs.

[0087] The main controller 300 may process a source signal input through the source input part 440 to generate an image signal corresponding to the input source signal.

[0088] For example, the main controller 300 may include a source decoder, a scaler, an image enhancer, and a graphics processor. The source decoder may decode a source signal compressed in a format such as the Moving Picture Experts Group (MPEG) format, and the scaler may output image data of a desired resolution through resolution conversion.

[0089] The image enhancer can improve the image quality of the image data by applying various correction techniques. The graphics processor can classify the pixels of the image data into RGB data and output control signals such as synchronization signals for display timing in the display panel 11. That is, the main controller 300 can output image data and control signals corresponding to the source signal.

[0090] The above-described operations of the main controller 300 are merely examples applicable to the display device 1 , and of course, the main controller 300 may also perform other operations, or may omit some of the above-described operations.

[0091] Image data and control signals output from the main controller 300 may be transmitted to the timing controller 500 .

[0092] The timing controller 500 may convert the image data transmitted from the main controller 300 into a signal that can be transmitted to the driver integrated circuit (IC) 200 ( Figure 4 ) and generates various control signals necessary for displaying the image data on the display panel 11, such as timing control signals.

[0093] The display device 1 according to one embodiment does not need to include a plurality of display modules 10 , but in the embodiment described below, for detailed description, a display device 1 including a plurality of display modules 10 will be described as an example.

[0094] Figure 4 is a diagram showing a configuration of a display module included in a display device according to an embodiment. Figure 5 is a diagram illustrating a configuration of a display panel included in a display module according to an embodiment. Figure 6 is a diagram illustrating an example in which a signal is transmitted to a plurality of tiled display modules in a display device according to an embodiment.

[0095] refer to Figure 4 , each of the plurality of display modules 10-1, 10-2, ... and 10-n may include display panels 11-1, 11-2, ... and 11-n configured to display images and driver ICs 200-1, 200-2, ... and 200-n configured to drive the display panels 11-1, 11-2, ... and 11-n, respectively.

[0096] The driver ICs 200 - 1 , 200 - 2 , . . . , and 200 - n may generate driving signals based on image data and a timing control signal transmitted from the timing controller 500 so that the display panels 11 - 1 , 11 - 2 , . . . , and 11 - n display images.

[0097] The driving signals generated by the driver ICs 200 - 1 , 200 - 2 , . . . , and 200 - n may include gate signals and data signals, and the generated driving signals are input to the display panels 11 - 1 , 11 - 2 , . . . , and 11 - n.

[0098] refer to Figure 5 , the display panel 11 includes a plurality of micro-pixel packages 100-1, 100-2, ... and 100-q, and each of the plurality of micro-pixel packages 100-1, 100-2, ... and 100-q includes an inorganic light-emitting element 120-1, 120-2, ... and 120-q and a micro-pixel controller 130-1, 130-2, ... and 130-q, respectively. In this embodiment, it is described that three or more micro-pixel packages 100-1, 100-2, ... and 100-q are provided, but the embodiment of the display module 10 is not limited thereto. As long as a plurality of micro-pixel packages 100-1, 100-2, ... and 100-q are provided (q is an integer greater than or equal to 2), there is no limit to the number of micro-pixel packages 100.

[0099] The display panel 11 may include a plurality of pixels arranged two-dimensionally as described above, and each pixel may include a plurality of sub-pixels to realize various colors.

[0100] Furthermore, as described above, the display device 1 according to one embodiment is a self-luminous display device, in which each pixel can emit light by itself. Therefore, the inorganic light-emitting elements 120-1, 120-2, ..., and 120-q can be provided in each sub-pixel. In other words, each of the plurality of pixels can include two or more inorganic light-emitting elements 120-1, 120-2, ..., and 120-q.

[0101] Each of the inorganic light-emitting elements 120-1, 120-2, ... and 120-q can be driven by an active matrix (AM) method or a passive matrix (PM) method, but in the embodiments described below, for detailed description, the case where the inorganic light-emitting elements 120-1, 120-2, ... and 120-q are driven by the AM method will be described as an example.

[0102] In a display module 10 according to one embodiment, each inorganic light-emitting element 120-1, 120-2, ... and 120-q can be individually controlled by a micropixel controller 130-1, 130-2, ... and 130-q, respectively, and the micropixel controllers 130-1, 130-2, ... and 130-q can operate in response to a driving signal output from a driver IC 200.

[0103] The micropixel packages 100-1, 100-2, ..., and 100-q may be arranged in rows and columns on the module substrate of the display module 10. That is, the micropixel packages 100-1, 100-2, ..., and 100-q may have a two-dimensional array consisting of a plurality of rows and a plurality of columns. In this case, each of the plurality of micropixel packages 100-1, 100-2, ..., and 100-q may be electrically connected to a micropixel package 100 disposed in an adjacent row and in the same column.

[0104] In this embodiment, when describing that some components are arranged in the same column, this includes not only the case where the components are arranged in columns that perfectly match in terms of numerical value, but also the case where the components are arranged in columns that match each other within a predetermined error range. Additionally, in this embodiment, when describing that some components are arranged in the same row, this includes not only the case where the components are arranged in rows that perfectly match in terms of numerical value, but also the case where the components are arranged in rows that match each other within a predetermined error range.

[0105] In other words, the plurality of micro-pixel packages 100-1, 100-2, ..., and 100-q may be two-dimensionally arranged on a module substrate (a first substrate described below) of the display module 10, and each of the plurality of micro-pixel packages 100-1, 100-2, ..., and 100-q may be electrically connected to a micro-pixel controller adjacent thereto in a first direction. The first direction may correspond to, for example, a column direction (i.e., a Z-axis direction).

[0106] refer to Figure 6, the plurality of display modules 10-1, 10-2, ..., and 10-n may be electrically connected to the driving board 501. For example, the display panel 11 may be connected to a flexible printed circuit board (FPCB) via a film on which the driver IC 200 is mounted. The FPCB may be connected to the driving board 501 to electrically connect the display modules 10 to the driving board 501.

[0107] The timing controller 500 may be provided on a driving board 501. Therefore, the driving board 501 may be referred to as a T-con board. The plurality of display modules 10-1, 10-2, ..., and 10-n may receive image data, timing control signals, etc. from the driving board 501.

[0108] In addition, the display device 1 may further include a main board 301 and a power board 601. The main controller 300 may be provided on the main board 301, and a power circuit may be provided on the power board 601 to supply power to the plurality of display modules 10-1, 10-2, ... and 10-n.

[0109] The power board 601 may be electrically connected to the plurality of display modules 10-1, 10-2, ..., and 10-n through the FPCB, and may supply a power voltage V to the plurality of display modules 10-1, 10-2, ..., and 10-n connected through the FPCB. DD , reference voltage V SS .

[0110] For example, the power supply voltage V supplied from the power supply board 601 DD and reference voltage V SS The power supply voltage V supplied from the power supply board 601 can be applied to the micro pixel package 100 provided on the module substrate through the circuit of the module substrate. DD and reference voltage V SS It may be applied to the micro pixel packages 100 - 1 , 100 - 2 , . . . , and 100 -P arranged in the first row.

[0111] At this time, the micro pixel packages 100 - 1 , 100 - 2 , . . . , and 100 -P arranged in rows other than the first row may receive a voltage from a micro pixel package of a previous row and transmit the input voltage to a micro pixel package of a next row.

[0112] Specifically, each of the plurality of micro pixel packages 100 - 1 , 100 - 2 , . . . , and 100 -P may be electrically connected to micro pixel packages disposed in the same column and in adjacent rows through voltage lines disposed on a module substrate.

[0113] In this case, each of the multiple micropixel packages 100-1, 100-2, ... and 100-P may include an internal connection line electrically connected between a voltage line electrically connected to a micropixel package in a previous row and a voltage line electrically connected to a micropixel package in a next row.

[0114] That is, the voltage V supplied from the power board 601 DD and V SS The voltage can be input to the micropixel packages 100-1, 100-2, ... and 100-P through a voltage line set on the module substrate and connected to the micropixel package of the previous row, and can be output to a voltage line set on the module substrate and connected to the micropixel package of the next row through an internal connection line set in the micropixel packages 100-1, 100-2, ... and 100-P.

[0115] In this case, the internal connection lines provided in micropixel packages 100-1, 100-2, ..., and 100-P have improved line resistance compared to the voltage lines provided on the module substrate, thereby increasing electron mobility. Specifically, when the lines are installed in the micropixel packages, the process difficulty can be reduced compared to when the lines are installed on the module substrate. Therefore, the internal connection lines provided in the micropixel packages can be installed thicker than the voltage lines provided on the module substrate, thereby increasing electron mobility.

[0116] In other words, each of the plurality of micropixel packages 100-1, 100-2, ..., and 100-P may be electrically connected to a micropixel package adjacent thereto in the first direction via a voltage line provided on the module substrate, and may include an internal connection line electrically connecting a voltage line electrically connected to one of the micropixel packages adjacent thereto in the first direction and a voltage line electrically connected to another micropixel package adjacent thereto in the first direction. Each of the plurality of micropixel packages 100-1, 100-2, ..., and 100-P may transmit a voltage input from one of the micropixel packages electrically connected thereto to another micropixel package electrically connected thereto through the internal connection line.

[0117] Therefore, in the display module 10 of the present disclosure, the voltage lines electrically connected between the micropixel packages 100-1, 100-2, ... and 100-P are set on the module substrate, and the internal connection lines electrically connected between the voltage lines are set inside the micropixel package, so that some of the power lines are set in the micropixel package.

[0118] In the display module 10, compared to when voltage is supplied to the micropixel packages 100-1, 100-2, ... and 100-P only through the voltage lines on the module substrate, the rate at which voltage passes through the voltage lines with low electron mobility of the module substrate can be reduced through the internal connection lines inside the micropixel packages 100-1, 100-2, ... and 100-P, and the current resistance (IR) drop of the voltage can be minimized.

[0119] Therefore, the display module 10 allows the plurality of micro pixel controllers 130-1, 130-2, ..., and 130-q to be driven with the same voltage regardless of the distance from the power supply board 601, thereby preventing an IR drop that may occur depending on the distance from the power supply board 601. Voltage transmission between the micro pixel packages 100-1, 100-2, ..., and 100-P will be described in detail below.

[0120] In the above example, the plurality of display modules 10-1, 10-2, ..., and 10-n are described as sharing the driver board 501 and the power supply board 601. However, a separate driver board 501 and a separate power supply board 601 may be connected to each individual display module. Alternatively, the plurality of display modules 10-1, 10-2, ..., and 10-n may be grouped, with one driver board 501 and one power supply board 601 connected to each group.

[0121] Figure 6 1 is a diagram showing the display device 1 on the XY plane, and therefore, only one-dimensional arrangement of the display modules 10-1, 10-2, ... and 10-n is shown. However, of course, as mentioned above with reference to Figure 1 As mentioned above, the plurality of display modules 10 - 1 , 10 - 2 , . . . , and 10 - n may also be arranged two-dimensionally.

[0122] Figure 7 is a diagram of a method of driving each pixel in a display module according to an embodiment. Figure 8 is a diagram illustrating a pixel circuit configured to control a single sub-pixel in a display module according to an embodiment. Figure 9 and Figure 10 is a graph showing changes in driving current according to a power supply voltage and a reference voltage in a pixel circuit according to an embodiment.

[0123] refer to Figure 7, the driver IC 200 may include a scan driver 210 and a data driver 220. The scan driver 210 may output a gate signal for turning on / off a sub-pixel, and the data driver 220 may output a data signal for realizing an image. However, according to various design variations, some operations of the driver IC 200 may be performed by the micropixel controller 130. For example, the operation of the scan driver 210 may be performed by the micropixel controller 130, and in this case, the driver IC 200 may not include the scan driver 210. In the embodiments described below, for the sake of detailed description, a case where the driver IC 200 includes both the scan driver 210 and the data driver 220 will be described as an example.

[0124] The scan driver 210 may generate a gate signal based on a control signal transmitted from the timing controller 500 , and the data driver 220 may generate a data signal based on image data transmitted from the timing controller 500 .

[0125] The micro pixel controller 130 may include a pixel circuit 131 for individually controlling each inorganic light emitting element 120 , and a gate signal output from the scan driver 210 and a data signal output from the data driver 220 may be input to the pixel circuit 131 .

[0126] For example, when the gate voltage V GATE , data voltage V DATA and the power supply voltage V DD When the current is input to the pixel circuit 131, the pixel circuit 131 can output a driving current C for driving the inorganic light emitting element 120. D .

[0127] The driving current C output from the pixel circuit 131 D can be input to the inorganic light emitting element 120, and the inorganic light emitting element 120 can be driven by the input driving current C D And emit light to realize the image.

[0128] As described above, according to an embodiment, each micro pixel controller 130 may be electrically connected to the timing controller 500 to receive a gate signal, and may control the pixel circuit 131 by processing the transmitted gate signal, thereby outputting a driving current C D In this case, the scan driver 210 may be omitted.

[0129] refer to Figure 8 For example, the pixel circuit 131 may include thin film transistors TR1 and TR2 configured to switch or drive the inorganic light emitting element 120 and a capacitor C ST As mentioned above, the inorganic light emitting element 120 may be a micro LED.

[0130] For example, the thin film transistors TR1 and TR2 may include a switching transistor TR1 and a driving transistor TR2, and the switching transistor TR1 and the driving transistor TR2 may be P-type metal oxide semiconductor (PMOS) transistors. However, embodiments of the display module 10 and the display device 1 are not limited thereto, and the switching transistor TR1 and the driving transistor TR2 may be N-type metal oxide semiconductor (NMOS) transistors.

[0131] The switching transistor TR1 has a gate electrode connected to the scan driver 210, a source electrode connected to the data driver 220, and a capacitor C. ST One end and the drain electrode of the gate electrode of the driving transistor TR2. The power supply voltage V DD can be applied to the capacitor C ST the other end.

[0132] In addition, the power supply voltage V DD The reference voltage V may be applied to the source electrode of the driving transistor TR2, and the drain electrode of the driving transistor TR2 may be connected to the anode of the inorganic light emitting element 120. SS Supplied to the cathode of the inorganic light emitting element 120. Reference voltage V SS can be lower than the supply voltage V DD voltage, and can use the ground voltage as a reference voltage V SS To provide grounding.

[0133] The pixel circuit 131 of the above structure can be operated as follows. First, when the gate voltage V GATE When the switching transistor TR1 is turned on, the data voltage V applied from the data driver 220 DATA can be transferred to the capacitor C ST and one end of the gate electrode of the driving transistor TR2.

[0134] Since the capacitor C ST , and the gate-source voltage V GS The corresponding voltage can be maintained for a predetermined time. The driving transistor TR2 can be connected to the gate-source voltage V GS The corresponding driving current C D is applied to the anode of the inorganic light emitting element 120, thereby causing the inorganic light emitting element 120 to emit light.

[0135] At this time, when the high level data voltage V DATA When the gate electrode of the driving transistor TR2 is transmitted, the gate-source voltage V GS reduced, and therefore, a small amount of drive current CD is applied to the inorganic light emitting element 120 so that the inorganic light emitting element 120 can display a low gray scale.

[0136] On the other hand, when the low level data voltage V DATA When the gate-source voltage V GS increases, and therefore, can drive a large amount of current C D is applied to the inorganic light emitting element 120 so that the inorganic light emitting element 120 can display a high gray scale.

[0137] However, the above structure of the pixel circuit 131 is merely an example applicable to the display module 10 according to one embodiment, and various circuit structures for switching and driving the plurality of inorganic light emitting elements 120 may be applied to the display module 10 in addition to the above example.

[0138] In addition, in this embodiment, the brightness control method of the inorganic light emitting element 120 is not limited. The brightness of the inorganic light emitting element 120 can be controlled by one of various methods such as a pulse amplitude modulation (PAM) method, a pulse width modulation (PWM) method, and a hybrid method combining the PAM method and the PWM method.

[0139] In this case, if Figure 9 As shown, when the power supply voltage V applied to the pixel circuit 131 of the micro pixel controller 130 is DD When the drive transistor TR is changed, 2 The gate-source voltage V GS , so that the driving current C supplied to the inorganic light emitting element 120 D Can be changed.

[0140] In addition, if Figure 10 As shown, when the power supply voltage V applied to the pixel circuit 131 of the micro pixel controller 130 is DD , or a reference voltage V applied to the inorganic light emitting element 120 SS When the voltage Vdc changes, the drain-source voltage Vdc of the driving transistor TR2 changes. DS , so that even in the saturation region, the driving current C supplied to the inorganic light emitting element 120 can be changed D .

[0141] Thus, when the power supply voltage V applied to the micro pixel controller 130 and the inorganic light emitting element 120 is DD and reference voltage V SS When the input data voltage V DATA The corresponding driving current C Dis supplied to the inorganic light emitting element 120, and thus, desired brightness may not be provided, and thus, a color difference effect or color conversion may occur.

[0142] When each of the micro pixel controller 130 and the inorganic light emitting element 120 is electrically connected to the power supply board 601 to receive the power supply voltage V DD and reference voltage V SS When the power supply voltage V DD and reference voltage V SS The magnitude of each can vary depending on the line length.

[0143] For example, the farther the micro pixel controller 130 is from the power supply board 601, the longer the line may be, and the lower the power supply voltage V DD The magnitude of may decrease due to the IR drop caused by the inherent resistance of the line. Therefore, as the distance from the power supply board 601 increases, the brightness of the pixel controlled by the micro pixel controller 130 may decrease.

[0144] Therefore, in the display device 1 of the present disclosure, some of the power supply lines may be formed in the micropixel package 100 or the micropixel controller 130, so that the power supply voltage V supplied to each of the plurality of micropixel controllers 130 provided in the display module 10 may be minimized. DD and reference voltage V SS The IR drop of each one.

[0145] Hereinafter, a case where some of the power supply lines are formed in the micropixel package 100 or the micropixel controller 130 will be described in more detail.

[0146] Figure 11 is a diagram illustrating a relationship between a micro pixel controller and pixels controlled by the micro pixel controller in a display module according to an embodiment.

[0147] refer to Figure 11 , one micro pixel controller 130 can control four pixels P1, P2, P3 and P4. Controlling a pixel may refer to controlling a plurality of inorganic light emitting elements 120 constituting the pixel.

[0148] To this end, a plurality of pixel circuits 131 for respectively controlling the inorganic light emitting element 120 constituting each of the four pixels P1, P2, P3, and P4 may be provided on a micro substrate 132 of the micro pixel controller 130. In the embodiment described below, the micro substrate 132 is referred to as a third substrate 132 to separate the micro substrate 132 from the module substrate 13 ( Figure 14 ) and the package substrate 110 ( Figure 12 ) to distinguish them.

[0149] In this case, the pixel circuit 131 may include a plurality of inorganic light emitting elements 120 for switching the pixel, and a driving current C D The voltage is supplied to at least one thin film transistor of the plurality of inorganic light emitting elements 120 constituting a pixel.

[0150] In other words, the micro pixel controller 130 may include at least one thin film transistor disposed on the third substrate 132 to switch the plurality of inorganic light emitting elements 120 constituting two or more pixels and to convert the driving current C D The light is supplied to a plurality of inorganic light emitting elements 120 constituting two or more pixels.

[0151] However, there is no limit to the number of pixels that can be controlled by one micropixel controller 130, and in the following description, for convenience of description, a case will be described where one micropixel controller 130 controls four pixels P1, P2, P3, and P4. As an example, one micropixel controller 130 can control pixels arranged in a 2×n array or an n×2 array (where n is an integer greater than or equal to 1), and in the following description, a case will be described where one micropixel controller 130 controls four pixels P1, P2, P3, and P4 arranged in a 2×2 array.

[0152] As many pixel circuits 131 as the number of inorganic light-emitting elements 120 controlled by the micro pixel controller 130 may be provided, and a case where one pixel circuit 131 controls two or more inorganic light-emitting elements 120 may also be realized.

[0153] The third substrate 132 may be formed of a variety of materials, such as a silicon substrate, a glass substrate, a plastic substrate, a PCB, an FPCB, and a cavity substrate. Since the micropixel controller 130 does not contain a heat source such as an inorganic light-emitting element, the type of substrate may be selected without limitation based on the heat resistance of the material.

[0154] The thin film transistor (TFT) formed on the third substrate 132 may be a low-temperature polycrystalline silicon (LTPS) TFT or an oxide TFT. Alternatively, the TFT may be an amorphous silicon (a-Si) TFT or a single-crystal TFT. However, in this embodiment, for the sake of detailed description, the case where the TFT is an LTPS TFT will be described as an example.

[0155] As described above, the third substrate 132 may be implemented as a silicon substrate. Compared to a glass substrate, a silicon substrate has no limitation on electron mobility, and therefore, when the third substrate 132 is implemented as a silicon substrate, the performance of the LTPS TFT may be improved.

[0156] According to an embodiment of the display module 10, a circuit inspection can be performed individually for each micropixel controller 130, and only the micropixel controller 130 determined to be a qualified product through the circuit inspection can be installed in the display module 10. Therefore, compared with the case where the TFT circuit is directly mounted on the module substrate (the first substrate described below), the circuit can be easily inspected and defective products can be easily replaced.

[0157] Figure 12 is a side sectional view of a micro pixel package included in a display module according to an embodiment. Figure 13 is a diagram illustrating an upper surface of a micro pixel package included in a display module according to an embodiment. Figure 14 is a diagram of a module substrate on which a micro-pixel package is provided in a display module according to an embodiment. Figure 15 is a diagram illustrating an upper surface of a module substrate on which a micro pixel package is provided in a display module according to an embodiment.

[0158] refer to Figure 12 , a plurality of inorganic light-emitting elements 120 (eg, 120R, 120G, 120B) and at least one micro-pixel controller 130 may be disposed in one micro-pixel package 100 .

[0159] A plurality of inorganic light-emitting elements 120 may be provided on the upper surface of a package substrate 110 of one micropixel package 100, and at least one micropixel controller 130 may be provided on the package substrate 110. In the embodiments described below, the package substrate 110 is referred to as a second substrate 110 to distinguish the package substrate 110 from other substrates.

[0160] In the embodiments of the display module 10 and the display device 1, there is no limit to the number of micro pixel controllers 130 included in one micro pixel package 100. For example, when it is assumed that one micro pixel controller 130 controls four pixels, in one micro pixel package 100, the number of micro pixel controllers 130 may be as follows: Figure 12 and Figure 13 In the example of the present invention, four pixels and a micropixel controller 130 for controlling the four pixels may be provided, eight pixels and two micropixel controllers 130 for controlling the eight pixels may be provided, twelve pixels and three micropixel controllers 130 for controlling the twelve pixels may be provided, or sixteen pixels and four micropixel controllers 130 for controlling the sixteen pixels may be provided. In the following description, for convenience of description, a case where four pixels and one micropixel controller 130 for controlling the four pixels are provided in one micropixel package 100 will be described as an example.

[0161] The plurality of inorganic light emitting elements 120 and at least one micro pixel controller 130 may be electrically connected to the second substrate 110 .

[0162] The second substrate 110 may be implemented as one of substrates of various materials such as a silicon substrate, a glass substrate, a plastic substrate, a PCB, an FPCB, and a cavity substrate. Although the type of the second substrate 110 is not limited, in the embodiments described below, for detailed description, a case where the second substrate 110 is implemented as a glass substrate will be described as an example.

[0163] In this embodiment, the inorganic light emitting element 120 may have a flip-chip structure in which a pair of electrodes are provided on a surface opposite to a light emitting surface of a diode.

[0164] The pair of electrodes may include an anode and a cathode. As an example, the anode and the cathode may be provided at both ends of the inorganic light emitting element 120 in the length direction (longitudinal direction).

[0165] The inorganic light emitting element 120 is disposed so that the light emitting surface faces upward (+Y direction), and an electrode disposed on a surface opposite to the light emitting surface may be electrically connected to an upper electrode pad disposed on the upper surface of the second substrate 110 .

[0166] In this embodiment, when describing two components electrically connected, this includes not only cases where a conductive material through which current flows is directly welded between the two components, but also cases where the two components are connected via separate wires, or cases where a conductive adhesive is used between the two components. There is no limitation on the specific connection method, as long as current flows between the two connected components.

[0167] For example, when performing soldering on two components, gold-indium (Au-In) bonding, gold-tin (Au-Sn) bonding, copper (Cu) pillar / tin-silver (SnAg) bump bonding and nickel (Ni) pillar / SnAg bump bonding, solder ball bonding using tin-silver-copper (SnAgCu), tin-bismuth (SnBi) or SnAg, etc. can be used.

[0168] In addition, when a conductive adhesive is used, a conductive adhesive such as anisotropic conductive film (ACF) and anisotropic conductive paste (ACP) may be provided between two components, and pressure is applied to allow current to flow in the direction of the applied pressure.

[0169] As described above, the pixel circuit 131 for switching and driving the inorganic light emitting element 120 may be provided on a separate third substrate 132 instead of the second substrate 110 to constitute the micro pixel controller 130 .

[0170] The third substrate 132 may be provided with connection pins for electrical connection with the second substrate 110 , and the connection pins may be electrically connected to electrode pads provided on the second substrate 110 .

[0171] According to an embodiment of the display module 10, since circuit elements such as TFTs for switching and driving the plurality of inorganic light-emitting elements 120 are provided in the separate micro-pixel controller 130 rather than on the second substrate 110, circuit elements such as TFTs other than electrode pads and wiring do not need to be formed on the second substrate 110. Therefore, the second substrate 110 can be implemented as a glass substrate having excellent durability against heat of the inorganic light-emitting elements 120, and even when the second substrate 110 is implemented as a glass substrate, the performance of the TFTs is not affected.

[0172] In addition, damage to circuit elements during cutting the second substrate 110 or the module substrate (the first substrate described below) and forming circuits, or during replacement of the inorganic light-emitting element 120 can be prevented, and the process difficulty in manufacturing the display module 10 can be reduced.

[0173] Furthermore, according to an embodiment of the display module 10, since circuit elements such as TFTs for switching and driving the plurality of inorganic light-emitting elements 120 are provided in a separate micro-pixel controller 130 rather than on a module substrate (a first substrate described below), the number of metal lines required to mount the circuit elements on the module substrate can be reduced, and thus, the problem of IR drop caused by interference between the plurality of metal lines can be solved. In other words, in the display module 10 of the present disclosure, the number of lines on the module substrate can be reduced compared to a case where the circuit elements are directly mounted on the module substrate, making it possible to solve the problem of IR drop caused by interference between the lines.

[0174] refer to Figure 13 , the micro pixel controller 130 may be disposed on the upper surface of the second substrate 110 and may be disposed at the center portion of the space between the pixels P1, P2, P3, and P4 to be controlled. In this case, the micro pixel controller 130 may be electrically connected to the anode of each pixel P to be controlled through an anode line, and may be electrically connected to the cathode of each pixel P to be controlled through a cathode line.

[0175] However, according to an embodiment, the micropixel controller 130 may not be set at the center part of the space between the pixels P1, P2, P3 and P4, and may be set without restriction as long as the micropixel controller 130 is electrically connected to the pixel P to be controlled. For example, the micropixel controller 130 may be set at a position corresponding to the pixel area of each of the four pixels P1, P2, P3 and P4 controlled by the micropixel controller 130. In this embodiment, the pixel area is the area where each pixel is located, and when the active area of the display panel 11 is divided into the same array as the array of pixels (MXN), the area including each pixel can be defined as the pixel area of the corresponding pixel. As a more specific example, the micropixel controller 130 may be set in an area (i.e., the entire pixel area PW) in which the pixel areas of the four pixels P1, P2, P3 and P4 controlled by the micropixel controller 130 are combined. The micropixel controller 130 may be set at a position corresponding to the center part of the entire pixel area PW.

[0176] In addition, the micropixel controller 130 may be disposed on the lower surface of the second substrate 110, rather than on the upper surface of the second substrate 110 according to the embodiment, and in this case, the micropixel controller 130 may be electrically connected to the pixels P to be controlled through via lines. Hereinafter, for convenience of description, a case where the micropixel controller 130 is disposed on the upper surface of the second substrate 110 will be described as an example.

[0177] In this case, the distances between adjacent pixels in the plurality of pixels included in the display module 10 may all be the same. In this embodiment, when describing that certain values are the same, this may include not only the case where the corresponding values are exactly the same, but also the case where the corresponding values are the same within a predetermined error range.

[0178] That is, the pixel intervals PP between the pixels P1, P2, P3, and P4 to be controlled by one micro pixel controller 130 may be equal to each other. Figure 13 As shown, the pixel interval PP between adjacent pixels in the pixels P1, P2, P3, and P4 provided in one micro-pixel package 100 may be the same. For example, among the pixels P1, P2, P3, and P4 provided on the upper surface of the second substrate 110, the interval between the first pixel P1 and the second pixel P2 may be the same as the interval between the first pixel P1 and the fourth pixel P4.

[0179] like Figure 14 and Figure 15 As shown, the micro pixel package 100 may be provided on the upper surface of the module substrate 13. In the embodiments described below, the module substrate is referred to as a first substrate.

[0180] The first substrate 13 may be formed of a variety of materials, such as a silicon substrate, a glass substrate, a plastic substrate, a PCB, an FPCB, and a cavity substrate. Since the inorganic light-emitting element 120 or the TFT circuit is not directly mounted on the first substrate 13, the type of the first substrate 13 may be selected in consideration of ease of manufacturing, efficiency, cost, and the like.

[0181] As described above, since a plurality of inorganic light-emitting elements 120 are arranged on the upper surface of the second substrate 110 of the micropixel package 100, the micropixel package 100 can be arranged so that the lower surface of the second substrate 110 faces the first substrate 13 and the upper surface of the second substrate 110 faces upward (+Y direction).

[0182] In addition, the micro-pixel packages 100 may be arranged in consideration of the pixel pitch and the entire pixel array of the display module 10. For example, when the display module 10 has a pixel array of an M×N matrix, and the inorganic light-emitting elements 120 are arranged in the micro-pixel packages 100 in an m×n matrix pixel array, M / m (=A) micro-pixel packages 100 may be arranged along the column direction (i.e., the Z-axis direction), and N / n (=B) micro-pixel packages 100 may be arranged along the row direction (i.e., in the X-axis direction).

[0183] That is, multiple micropixel packages 100 can be arranged two-dimensionally on the first substrate 13, A micropixel packages 100 can be arranged along a first direction (for example, a column direction, i.e., a Z-axis direction), and B micropixel packages 100 can be arranged along a second direction (for example, a row direction, i.e., an X-axis direction).

[0184] In other words, the micropixel packages 100 may be arranged in multiple rows and columns on the upper surface of the first substrate 13 , and the display module 10 may include multiple micropixel packages 100 in an AXB (A and B are integers greater than or equal to 2) array.

[0185] As described above, in micro pixel package 100 , the pixel intervals PP between adjacent pixels located above, below, left, and right relative to one pixel can all be kept equal. Such pixel intervals PP can also be kept equal in the units of display module 10 .

[0186] like Figure 14 and Figure 15 As shown, the arrangement and spacing of the micropixel packages 100 can be determined so that even when two adjacent pixels P are set in different micropixel packages 100, the pixel spacing PP' between the two pixels can be kept equal to the pixel spacing PP in a single micropixel package 100.

[0187] The pixel interval PP may be referred to as a pixel pitch, and in this embodiment, the pixel interval PP is defined as representing the distance from the center of one pixel to the center of an adjacent pixel. However, since the embodiment of the display module 10 is not limited thereto, other definitions may be applied to the pixel interval PP.

[0188] The above description has described the arrangement relationship between the micropixel package 100 provided with the inorganic light emitting element 120 and the micropixel controller 130 and the first substrate 13. Hereinafter, the case where some of the power supply lines are provided in the micropixel package 100 to minimize IR drop will be described in more detail.

[0189] Figure 16 is a diagram illustrating power supply lines of a module substrate on which a micro pixel package is provided in a display module according to an embodiment. Figure 17 is a diagram of power supply lines of a module substrate on which a micro pixel package is provided in a display module according to an embodiment. Figure 18 and Figure 19 is a diagram of power supply lines in one micro-pixel package in a display module according to an embodiment.

[0190] When each of the micro pixel controller 130 and the inorganic light emitting element 120 is electrically connected to the power supply board 601 to receive the power supply voltage V DD and reference voltage V SS When the power supply voltage V DD and reference voltage V SS The magnitude of each can vary depending on the line length.

[0191] For example, the farther the micro pixel controller 130 is from the power supply board 601, the longer the line may be, and the lower the power supply voltage V DD The magnitude of may decrease due to the IR drop caused by the inherent resistance of the line. Therefore, as the distance from the power supply board 601 increases, the brightness of the pixel controlled by the micro pixel controller 130 may decrease.

[0192] Therefore, in the display device 1 of the present disclosure, some of the power supply lines may be formed in the micro pixel package 100 so that the power supply voltage V supplied to each of the plurality of micro pixel controllers 130 provided in the display module 10 may be minimized. DD and reference voltage V SS The IR drop of each one.

[0193] refer to Figure 16 and Figure 17 As described above, the plurality of micro-pixel packages 100 may be arranged in a plurality of rows and columns on the first substrate 13. That is, the display module 10 may include a plurality of micro-pixel packages 100 two-dimensionally arranged in A rows and B columns.

[0194] Each of the plurality of micro-pixel packages 100 may receive a power supply voltage V DD and reference voltage V SS , the power supply voltage V DD is supplied to the micro pixel controller 130, and the reference voltage V SS Supplied to the inorganic light emitting element 120 .

[0195] The power supply voltage V supplied from the power supply board 601 DD and reference voltage V SS The voltage may be applied to the micro pixel package 100 disposed on the first substrate 13 through the voltage lines 15 and 17 of the first substrate 13 .

[0196] The power supply voltage V supplied from the power supply board 601 DD and reference voltage V SS It may be applied to the micro pixel packages 100 a arranged in the first row 1600 .

[0197] At this time, each micro-pixel package 100b arranged in a row 1650 other than the first row 1600 may receive a voltage V from the micro-pixel package 100 of the previous row. DD and V SS and the input voltage V DD and V SS Transfer to the next row of micro-pixel packages 100.

[0198] That is, the plurality of micro-pixel packages 100 may include a plurality of first micro-pixel packages 100a and a plurality of second micro-pixel packages 100b, the plurality of first micro-pixel packages 100a being arranged in a first row 1600 and receiving a voltage V from a power supply board 601. DD and V SS , a plurality of second micro-pixel packages 100b are arranged in a row 1650 other than the first row 1600, and each of the plurality of second micro-pixel packages 100b receives a voltage V from a micro-pixel package 100 of a previous row DD and V SS .

[0199] In other words, the plurality of micro-pixel packages 100 may include a plurality of first micro-pixel packages 100a and a plurality of second micro-pixel packages 100b, each of the plurality of first micro-pixel packages 100a receiving a voltage V from the power supply board 601. DD and V SS and the voltage V DD and V SS The voltage is transmitted to the micro-pixel package 100 adjacent thereto in the first direction, and each of the plurality of second micro-pixel packages 100 b receives the voltage from the micro-pixel package 100 adjacent thereto in the first direction.

[0200] Figure 16 and Figure 17 The uppermost row of first substrate 13 is shown as first row 1600 connected to power supply plate 601, but this is merely an embodiment, and depending on the embodiment, there is no limitation on the position of first row 1600. For example, depending on the connection position of power supply plate 601, the lowermost row or the side row may correspond to first row 1600. In the following description, for convenience, the case where first row 1600 corresponds to the uppermost row will be described as an example.

[0201] In other words, a plurality of micro-pixel packages 100 (e.g., 100a and 100b) may be two-dimensionally arranged on the first substrate 13 of the display module 10, and each of the plurality of micro-pixel packages 100 may be electrically connected to a micro-pixel controller adjacent thereto in a first direction. The first direction may correspond to, for example, a column direction, i.e., a Z-axis direction.

[0202] Each of the plurality of micro-pixel packages 100 may be electrically connected to the micro-pixel packages 100 disposed in the same column and in adjacent rows through voltage lines 15 and 17 disposed on the first substrate 13 .

[0203] In this case, each of the plurality of micropixel packages 100 may include internal connection lines 105 and 107 that electrically connect between the voltage lines 15 and 17 electrically connected to the micropixel packages 100 in the previous row and the voltage lines 15 and 17 electrically connected to the micropixel packages 100 in the next row. As described above, the internal connection lines 105 and 107 may electrically connect the voltage lines 15 and 17 electrically connected to one micropixel package 100 among the plurality of voltage lines and the voltage lines 15 and 17 electrically connected to another micropixel package 100 among the micropixel packages 100 adjacent to each other in the first direction.

[0204] That is, the voltage V DD and V SS The voltage can be input to the micropixel package 100 through the voltage lines 15 and 17 set on the first substrate 13 and connected to the micropixel package 100 in the previous row, and can be output to the voltage lines 15 and 17 set on the first substrate 13 and connected to the micropixel package 100 in the next row through the internal connection lines 105 and 107 set in the micropixel package 100.

[0205] In other words, each of the plurality of micro-pixel packages 100 may receive the voltage V through the voltage lines 15 and 17 connected to the micro-pixel packages 100 of the previous row. DD and V SSand through the internal connecting lines 105 and 107 the input voltage V DD and V SS Output to the voltage lines 15 and 17 connected to the micro-pixel package 100 of the next row. That is, each of the plurality of micro-pixel packages 100 can receive the voltage V through the voltage lines 15 and 17 connected to one of the micro-pixel packages 100 adjacent to each other in the first direction. DD and V SS and through the internal connecting lines 105 and 107 the input voltage V DD and V SS Output is to voltage lines 15 and 17 connected to another micro-pixel package 100 among the micro-pixel packages 100 adjacent to each other in the first direction.

[0206] The display module 10 may include a plurality of voltage lines 15 and 17 , which are arranged in each column of a plurality of micro-pixel packages 100 , are electrically connected between the micro-pixel packages 100 arranged in adjacent rows, and transmit voltage between the micro-pixel packages 100 .

[0207] The plurality of voltage lines 15 and 17 may include a voltage source V DD The plurality of power supply voltage lines 15 and the reference voltage V SS Multiple reference voltage lines 17.

[0208] Each of the plurality of power supply voltage lines 15 can be electrically connected between two micro-pixel packages 100 disposed in adjacent rows and simultaneously disposed in the same column, and transmit a power supply voltage V between the two micro-pixel packages 100. DD .

[0209] Each of the plurality of reference voltage lines 17 can be electrically connected between two micro-pixel packages 100 disposed in adjacent rows and simultaneously disposed in the same column, and transmit a reference voltage V between the two micro-pixel packages 100. SS .

[0210] A plurality of voltage lines 15 and 17 may be disposed on a first substrate 13 corresponding to a module substrate and may be electrically connected to a micro pixel package 100 disposed on an upper surface of the first substrate 13 .

[0211] Each of the plurality of micro pixel packages 100 may be disposed on the first substrate 13 and may be electrically connected to the voltage lines 15 and 17 .

[0212] The internal connection lines 105 and 107 of each of the plurality of micropixel packages 100 may be electrically connected to the voltage lines 15 and 17, respectively, that are electrically connected to the micropixel packages 100 that are disposed in the previous row and simultaneously disposed in the same column. In addition, the internal connection lines 105 and 107 of each of the plurality of micropixel packages 100 may be electrically connected to the voltage lines 15 and 17, respectively, that are electrically connected to the micropixel packages 100 that are disposed in the next row and simultaneously disposed in the same column.

[0213] Therefore, the internal connection lines 105 and 107 can electrically connect the voltage lines 15 and 17 connected to the micropixel packages 100 of the previous row with the voltage lines connected to the micropixel packages 100 of the next row.

[0214] Internal connection lines may include a power supply voltage V DD The first internal connection line 105 and the reference voltage V SS The second internal connecting line 107 flows through.

[0215] Results, such as Figure 18 As shown, each of the plurality of micro-pixel packages 100 can receive a power supply voltage V by being connected to a power supply voltage line 15a of a micro-pixel package disposed in a previous row and simultaneously disposed in the same column. DD , and the input power supply voltage V can be DD Output to the power supply voltage line 15b connected to the micro-pixel package in the next row.

[0216] At this time, the micro pixel controller 130 can be electrically connected to the first internal connection line 105 through the voltage supply line 1005 and can receive the power supply voltage V DD That is, the first internal connection line 105 can be electrically connected to the micro pixel controller 130 and can transmit the power supply voltage V DD .

[0217] In addition, if Figure 19 As shown, each of the plurality of micro-pixel packages 100 can receive a reference voltage V by being connected to a reference voltage line 17a of a micro-pixel package disposed in a previous row and simultaneously disposed in the same column. SS , and the reference voltage V SS Output to the reference voltage line 17b connected to the micro-pixel package in the next row.

[0218] At this time, each of the plurality of inorganic light emitting elements 120 may be electrically connected to the second internal connection line 107 through the voltage supply line 1007 and may receive a reference voltage V SSThat is, the second internal connection line 107 can be electrically connected to the plurality of inorganic light emitting elements 120 and can transmit the reference voltage V SS .

[0219] Compared to the voltage lines 15 and 17 provided on the module substrate 13, the internal connection lines 105 and 107 provided in the micro-pixel package 100 have improved line resistance and thus can have high electron mobility. Specifically, when the lines are installed in the micro-pixel package 100, the process difficulty can be reduced compared to when the lines are installed on the module substrate. Figure 18 and Figure 19 As shown, the internal connection lines 105 and 107 provided in the micro pixel package 100 may be formed to be thicker than the voltage lines 15 and 17 provided on the module substrate 13 and thus may have high electron mobility.

[0220] Therefore, in the display module 10 of the present disclosure, the voltage lines 15 and 17 electrically connected between the micropixel packages 100 are arranged on the module substrate, and the internal connection lines 105 and 107 electrically connected between the voltage lines 15 and 17 are arranged inside the micropixel package 100, so that some of the power lines are arranged in the micropixel package 100.

[0221] In the display module 10, the voltage V is supplied to the micro pixel package 100 only through the voltage lines 15 and 17 of the module substrate 13. DD and V SS Compared with the case of FIG, the ratio of the voltage passing through the voltage lines 15 and 17 with low electron mobility of the module substrate 13 can be reduced through the internal connection lines 105 and 107 inside the micropixel package 100, and the IR drop of the voltage can be minimized.

[0222] Therefore, the display module 10 allows multiple micro pixel controllers 130 to be driven with the same voltage regardless of the distance from the power supply board 601, thereby preventing IR drop that may occur depending on the distance from the power supply board 601. Since the IR drop is minimized, the micro pixel controller 130 can provide the desired driving current C to the inorganic light emitting element 120 by controlling the inorganic light emitting element 120 to be at a constant voltage. D To provide expected brightness, and thus, the problems of brightness degradation and color difference effect can be solved.

[0223] In addition, the display module 10 of the present disclosure can have voltage lines 15 and 17 that are shorter than the case where each micropixel package 100 is electrically connected to the power supply board 601 by allowing the output voltage of the micropixel package 100 to be transmitted to the micropixel package of the next row, so that the IR drop can be minimized.

[0224] The case where some of the power lines are disposed in the micropixel package 100 to minimize IR drop has been described in detail above. Hereinafter, the case where some of the power lines are disposed in the micropixel controller 130 to minimize IR drop will be described in detail.

[0225] Figure 20 is a diagram showing an example of arrangement of a micro pixel controller and inorganic light emitting elements constituting a display module according to an embodiment.

[0226] refer to Figure 20 The display module 10 according to one embodiment may not include the micro-pixel package 100 , and may include the micro-pixel controller 130 and the inorganic light-emitting element 120 directly disposed on the first substrate 13 .

[0227] Pixels P each including a plurality of inorganic light emitting elements 120 may be arranged in rows and columns on a first substrate 13 corresponding to a module substrate of the display module 10. That is, the pixels P may be arranged on the upper surface of the first substrate 13 in a two-dimensional array of M rows and N columns.

[0228] In this case, the micro pixel controllers 130 may also be arranged in multiple rows and columns on the first substrate 13. That is, the micro pixel controllers 130 may be arranged on the first substrate 13 in a two-dimensional array consisting of A rows and B columns.

[0229] In other words, the plurality of micro pixel controllers 130 may be two-dimensionally arranged on the first substrate 13 of the display module 10, and each of the plurality of micro pixel controllers 130 may be electrically connected to a micro pixel controller adjacent thereto in a first direction. The first direction may correspond to, for example, a column direction, i.e., a Z-axis direction.

[0230] For example, Figure 20 As shown, the micro pixel controller 130 can be provided on the upper surface of the first substrate 13 and at the center portion of the space between the pixels P1, P2, P3 and P4 to be controlled. In this case, the micro pixel controller 130 can be electrically connected to the anode of each pixel P to be controlled through an anode line, and can be electrically connected to the cathode of each pixel P to be controlled through a cathode line.

[0231] However, according to an embodiment, the micropixel controller 130 may not be set at the center part of the space between the pixels P1, P2, P3 and P4, and may be set without restriction, as long as the micropixel controller 130 is arranged in rows and columns and each micropixel controller 130 is electrically connected to the pixel P to be controlled. For example, the micropixel controller 130 may be set at a position corresponding to the pixel area of each of the four pixels P1, P2, P3 and P4 controlled by the micropixel controller 130. In this embodiment, the pixel area is the area where each pixel is located, and when the active area of the display panel 11 is divided into the same array as the array of pixels (MXN), the area including each pixel can be defined as the pixel area of the corresponding pixel. As a more specific example, the micropixel controller 130 may be set in an area (i.e., the entire pixel area PW) in which the pixel areas of the four pixels P1, P2, P3 and P4 controlled by the micropixel controller 130 are combined. The micropixel controller 130 may be set at a position corresponding to the center part of the entire pixel area PW.

[0232] In addition, according to an embodiment, the micropixel controller 130 may be disposed on the lower surface of the first substrate 13 rather than on the upper surface of the first substrate 13, and in this case, the micropixel controller 130 may be electrically connected to the pixels P to be controlled through via lines. Hereinafter, for the sake of convenience of description, the case where the micropixel controller 130 is disposed on the upper surface of the first substrate 13 will be described as an example.

[0233] In this case, the distances between adjacent pixels in the plurality of pixels included in the display panel 11 may all be the same. In this embodiment, when describing that certain values are the same, this may include not only a case where the corresponding values are exactly the same, but also a case where the corresponding values are the same within a predetermined error range.

[0234] Figure 21 is a diagram illustrating power supply lines of a module substrate on which a micro pixel controller is provided in a display module according to an embodiment. Figure 22 is a diagram of power supply lines of a module substrate on which a micro pixel controller is disposed in a display module according to an embodiment. Figure 23 is a diagram of power supply lines in a micro pixel controller in a display module according to an embodiment.

[0235] exist Figure 21 and Figure 22 As described above, the plurality of micro pixel controllers 130 may be arranged in a plurality of rows and columns on the first substrate 13. That is, the display module 10 may include a plurality of micro pixel controllers 130 two-dimensionally arranged in A rows and B columns.

[0236] That is, multiple micropixel controllers 130 can be arranged two-dimensionally on the first substrate 13, A micropixel controllers 130 can be set along a first direction (for example, a column direction, i.e., a Z-axis direction), and B micropixel controllers 130 can be set along a second direction (for example, a row direction, i.e., an X-axis direction).

[0237] Each of the plurality of micro pixel controllers 130 may receive a power supply voltage V DD and reference voltage V SS , the power supply voltage V DD is supplied to the pixel circuit 131, and the reference voltage V SS Supplied to the inorganic light emitting element 120 .

[0238] The power supply voltage V supplied from the power supply board 601 DD and reference voltage V SS The voltage may be applied to the micro pixel controller 130 disposed on the first substrate 13 through the voltage lines 15 and 17 of the first substrate 13 .

[0239] The power supply voltage V supplied from the power supply board 601 DD and reference voltage V SS It can be applied to the micro pixel controllers 130a arranged in the first row 2100.

[0240] At this time, each micro pixel controller 130b arranged in a row 2150 other than the first row 2100 may receive a voltage V from a micro pixel controller of a previous row. DD and V SS and the input voltage V DD and V SS Transferred to the micro-pixel controller of the next row.

[0241] That is, the plurality of micro pixel controllers 130 may include a plurality of first micro pixel controllers 130a and a plurality of second micro pixel controllers 130b, the plurality of first micro pixel controllers 130a being arranged in a first row 2100 and receiving a voltage V from the power supply board 601. DD and V SS , a plurality of second micro pixel controllers 130b are arranged in a row 2150 other than the first row 2100, and each of the plurality of second micro pixel controllers 130b receives a voltage V from a micro pixel controller of a previous row DD and V S S.

[0242] In other words, the plurality of micro pixel controllers 130 may include a plurality of first micro pixel controllers 130a and a plurality of second micro pixel controllers 130b, each of the plurality of first micro pixel controllers 130a receiving a voltage V from the power supply board 601. DD and VSS and the voltage V DD and V SS Transmitted to the micro pixel controllers adjacent thereto in the first direction, each of the plurality of second micro pixel controllers 130b receives a voltage from the micro pixel controllers adjacent thereto in the first direction.

[0243] Figure 21 and Figure 22 The uppermost row of first substrate 13 is shown as first row 2100 connected to power supply board 601, but this is merely an embodiment, and depending on the embodiment, there is no limitation on the position of first row 2100. For example, depending on the connection position of power supply board 601, the lowermost row or the side row may correspond to first row 2100. In the following description, for convenience, the case where first row 2100 corresponds to the uppermost row will be described as an example.

[0244] Each of the plurality of micro pixel controllers 130 may be electrically connected to micro pixel controllers disposed in the same column and disposed in adjacent rows through voltage lines 15 and 17 disposed on the first substrate 13 .

[0245] In other words, the plurality of micro pixel controllers 130 may be two-dimensionally arranged on the first substrate 13 of the display module 10, and each of the plurality of micro pixel controllers 130 may be electrically connected to a micro pixel controller adjacent thereto in a first direction. The first direction may correspond to, for example, a column direction, i.e., a Z-axis direction.

[0246] In this case, each of the multiple micropixel controllers 130 may include internal connection lines 105 and 107, which are electrically connected between voltage lines 15 and 17 electrically connected to the micropixel controllers of the previous row and voltage lines 15 and 17 electrically connected to the micropixel controllers of the next row.

[0247] That is, the voltage V DD and V SS The voltage lines 15 and 17 provided on the first substrate 13 and connected to the micropixel controller of the previous row can be input to the micropixel controller 130, and the voltage lines 15 and 17 provided on the first substrate 13 and connected to the micropixel controller of the next row can be output to the micropixel controller 130 via the internal connection lines 105 and 107 provided in the micropixel controller 130.

[0248] In other words, each of the plurality of micro pixel controllers 130 may receive a voltage V through the voltage lines 15 and 17 connected to the micro pixel controllers of the previous row. DD and V SS and through the internal connecting lines 105 and 107 the input voltage V DD and VSS Outputs to voltage lines 15 and 17 that are connected to the micropixel controller of the next row.

[0249] Each of the plurality of micropixel controllers 130 may be electrically connected to a micropixel controller adjacent thereto in the first direction via a voltage line provided on the first substrate 13, and may include an internal connection line electrically connecting a voltage line electrically connected to one of the micropixel controllers 130 adjacent thereto in the first direction with a voltage line electrically connected to another micropixel controller 130 adjacent thereto in the first direction. Each of the plurality of micropixel controllers 130 may transmit a voltage input from one of the micropixel controllers 130 electrically connected thereto to another micropixel controller 130 electrically connected thereto through the internal connection line.

[0250] The display module 10 may include a plurality of voltage lines 15 and 17 , which are disposed in each column of a plurality of micro-pixel controllers 130 , are electrically connected between the micro-pixel controllers disposed in adjacent rows, and transmit voltages between the micro-pixel controllers 130 .

[0251] The plurality of voltage lines 15 and 17 may include a voltage source V DD The plurality of power supply voltage lines 15 and the reference voltage V SS Multiple reference voltage lines 17.

[0252] Each of the plurality of power supply voltage lines 15 can be electrically connected between two micro pixel controllers arranged in adjacent rows and simultaneously arranged in the same column, and transmit a power supply voltage V between the two micro pixel controllers. DD .

[0253] Each of the plurality of reference voltage lines 17 can be electrically connected between two micro pixel controllers arranged in adjacent rows and simultaneously arranged in the same column, and transmit a reference voltage V between the two micro pixel controllers 130. SS .

[0254] A plurality of voltage lines 15 and 17 may be disposed on a first substrate 13 corresponding to a module substrate and may be electrically connected to a micro pixel controller 130 disposed on an upper surface of the first substrate 13 .

[0255] Each of the plurality of micro pixel controllers 130 may be disposed on the first substrate 13 and may be electrically connected to the voltage lines 15 and 17 .

[0256] The internal connection lines 105 and 107 of each of the plurality of micropixel controllers 130 may be electrically connected to the voltage lines 15 and 17, respectively, that are electrically connected to the micropixel controllers that are disposed in the previous row and simultaneously disposed in the same column. In addition, the internal connection lines 105 and 107 of each of the plurality of micropixel controllers 130 may be electrically connected to the voltage lines 15 and 17, respectively, that are electrically connected to the micropixel controllers that are disposed in the next row and simultaneously disposed in the same column. As described above, the internal connection lines 105 and 107 may electrically connect the voltage lines 15 and 17 that are electrically connected to one of the micropixel controllers that are adjacent to each other in the first direction among the plurality of voltage lines with the voltage lines 15 and 17 that are electrically connected to another of the micropixel controllers that are adjacent to each other in the first direction.

[0257] Therefore, the internal connection lines 105 and 107 can electrically connect the voltage lines 15 and 17 connected to the micro pixel controller of the previous row with the voltage lines connected to the micro pixel controller of the next row.

[0258] Internal connection lines 105 and 107 may include a power supply voltage V DD The first internal connection line 105 and the reference voltage V SS The second internal connecting line 107 flows through.

[0259] That is, each of the plurality of micro pixel controllers 130 may receive the voltage V through the voltage lines 15 and 17 connected to one of the micro pixel controllers adjacent to each other in the first direction. DD and V SS and input voltage V DD and V SS Outputs are made to voltage lines 15 and 17 connected to the other micro pixel controller among the micro pixel controllers adjacent to each other in the first direction.

[0260] Results, such as Figure 23 As shown, each of the plurality of micro pixel controllers 130 may receive a power supply voltage V by being connected to a power supply voltage line 15a of a micro pixel controller 130 that is disposed in a previous row and is also disposed in the same column. DD , and the input power supply voltage V DD Output to the power supply voltage line 15b connected to the micro pixel controller of the next row.

[0261] In addition, if Figure 23 As shown, each of the plurality of micro pixel controllers 130 may receive a reference voltage V by being connected to a reference voltage line 17a of a micro pixel controller that is disposed in a previous row and is also disposed in the same column. SS, and the input reference voltage V SS Output to reference voltage line 17b connected to the micro pixel controller of the next row.

[0262] At this time, the first internal connection line 105 may be electrically connected to the pixel circuit 131 (at least one TFT) to supply the power supply voltage V to the pixel circuit 131. DD In addition, the second internal connection line 107 may be electrically connected to the cathode line to supply a reference voltage V to the cathode of the inorganic light emitting element 120. SS .

[0263] Compared to the voltage lines 15 and 17 provided on the module substrate 13, the internal connection lines 105 and 107 provided in the micro pixel controller 130 have improved line resistance and thus can have high electron mobility. Specifically, when the lines are installed in the micro pixel controller 130, the process difficulty can be reduced compared to when the lines are installed on the module substrate. Figure 23 As shown, the internal connection lines 105 and 107 provided in the micro pixel controller 130 may be formed to be thicker than the voltage lines 15 and 17 provided on the module substrate 13 and, therefore, may have high electron mobility.

[0264] Therefore, in the display module 10 of the present disclosure, the voltage lines 15 and 17 electrically connected between the micropixel controllers 130 are set on the module substrate, and the internal connection lines 105 and 107 electrically connected between the voltage lines 15 and 17 are set inside the micropixel controller 130, so that some of the power lines are set in the micropixel controller 130.

[0265] In the display module 10, the voltage V is supplied to the micro pixel controller 130 only through the voltage lines 15 and 17 of the module substrate 13. DD and V SS Compared with the case of FIG, the ratio of the voltage passing through the voltage lines 15 and 17 with low electron mobility of the module substrate 13 can be reduced through the internal connection lines 105 and 107 inside the micro pixel controller 130, and the IR drop of the voltage can be minimized.

[0266] Therefore, the display module 10 allows multiple micro pixel controllers 130 to be driven with the same voltage regardless of the distance from the power supply board 601, thereby preventing IR drop that may occur depending on the distance from the power supply board 601. Since the IR drop is minimized, the micro pixel controller 130 can provide the desired driving current C to the inorganic light emitting element 120 by controlling the inorganic light emitting element 120 to be at a constant voltage. D To provide expected brightness, and thus, the problems of brightness degradation and color difference effect can be solved.

[0267] In addition, the display module 10 can have shorter voltage lines 15 and 17 than when each micropixel controller 130 is electrically connected to the power supply board 601 by allowing the output voltage of the micropixel controller 130 to be transmitted to the micropixel controller of the next row, so that the IR drop can be minimized.

[0268] Figure 24 is a diagram illustrating an example of a method in which a plurality of display modules are coupled to a housing in a display device according to an embodiment.

[0269] As described above, a plurality of display modules 10 may be arranged in a two-dimensional matrix and fixed to the housing 20. Figure 24 For example, a plurality of display modules 10 may be installed in a frame 21 located therebelow, and the frame 21 may have a two-dimensional grid structure having opening portion areas corresponding to the plurality of display modules 10 .

[0270] As many openings 21H as the number of display modules 10 may be formed in the frame 21 , and the openings 21H may have the same arrangement as the plurality of display modules 10 .

[0271] The plurality of display modules 10 may be mounted in the frame 21 by using magnetic force of a magnet, coupling of a mechanical structure, bonding of an adhesive, etc. There is no limitation on the method of mounting the display modules 10 in the frame 21 .

[0272] The driving board 501 , the main board 301 , and the power supply board 601 may be disposed under the frame 21 and may be electrically connected to each of the plurality of display modules 10 through an opening 21H formed in the frame 21 .

[0273] The lower cover 22 is coupled to a lower portion of the frame 21 , and the lower cover 22 may form a lower exterior appearance of the display device 1 .

[0274] In the above example, the case where the display modules 10 are arranged two-dimensionally is taken as an example. However, the display modules 10 may be arranged one-dimensionally, and in this case, the structure of the frame 21 may be converted into a one-dimensional grid structure.

[0275] In this way, the display device 1 of the present disclosure can realize a large-area screen by tiling a plurality of display modules 10 and fixing the display modules 10 to the housing 20. Therefore, in the display device 1, the power supply voltage V DD and reference voltage V SS The power supply voltage line 15 and the reference voltage line 17 are designed to be shorter than the case of applying one board to realize a large-area screen, so that the IR drop generated in proportion to the line length can be minimized.

[0276] Figure 25is a flowchart of a method of manufacturing a display module according to an embodiment. Figure 26 、 Figure 27 、 Figure 28 、 Figure 29 、 Figure 30 and Figure 31 is a diagram showing the embodiment of the Figure 25 Some operations of manufacturing the display module are shown in FIG.

[0277] refer to Figure 25 , in operation 2510, internal connection lines 105 and 107 are formed in the package substrate.

[0278] The package substrate refers to the second substrate 110 described above, and the internal connection lines 105 and 107 can be formed inside the second substrate 110. For example, a metal material layer such as copper can be formed in the second substrate 110, and the internal connection lines 105 and 107 can be formed in the second substrate 110 through a photolithography process including processes such as coating, exposure, and development of a photosensitive material and an etching process for selectively removing unnecessary portions. However, according to embodiments, the internal connection lines 105 and 107 can be formed in the upper surface, lower surface, or side surface of the second substrate 110.

[0279] In this case, the internal connection lines 105 and 107 may include a power supply voltage V DD The first internal connection line 105 and the reference voltage V SS The second internal connecting line 107 flows through.

[0280] Figure 26 is a diagram illustrating a side surface of a second substrate 110 in which internal connection lines 105 and 107 are formed according to an embodiment.

[0281] like Figure 26 As shown, for the supply voltage V DD The first internal connection line 105 and the reference voltage V SS The second internal connection line 107 may be formed in the second substrate 110 through the above-described process.

[0282] Despite Figure 26 Not shown, electrode pads to which the inorganic light emitting element 120 and the micro pixel controller 130 are electrically connected may be formed on the second substrate 110 .

[0283] refer to Figure 25 In operation 2520 , an inorganic light emitting element 120 and a micro pixel controller 130 may be disposed on a package substrate having internal connection lines formed therein.

[0284] As described above, the inorganic light-emitting element 120 may be a micro-LED. The micro-LED on the wafer or temporary substrate may be picked up and transferred by a transfer mechanism and then transferred to the second substrate 110. At this point, the inorganic light-emitting element 120 may be transferred so that the anode and cathode face the upper surface of the second substrate 110. Any known transfer method may be employed, such as a laser, a stamp, or a roller.

[0285] In addition, according to a method of connecting the inorganic light emitting element 120 and the electrode pad, a solder material or a conductive adhesive may be provided or applied to the electrode pad formed on the upper surface of the second substrate 110 .

[0286] Electrode pads to which the micro pixel controller 130 may be electrically connected may be formed on the upper surface of the second substrate 110 corresponding to the package substrate. In this case, the micro pixel controller 130 may be disposed on the electrode pads and electrically connected to the second substrate 110.

[0287] The micro pixel controller 130 has therein a pixel circuit 131 for controlling the inorganic light emitting element 120 on the second substrate 110 , and its structure and operation are the same as those described in the embodiment of the display module 10 .

[0288] At the same time, before the micropixel controller 130 is mounted on the second substrate 110, a circuit test can be performed separately, and only the micropixel controller 130 determined to be a qualified product through the circuit test can be mounted on the second substrate 110. Therefore, compared with the case of directly mounting the TFT circuit on the module substrate, the circuit can be easily inspected and defective products can be easily replaced.

[0289] Figure 27 1 is a diagram illustrating a side surface of a second substrate 110 onto which an inorganic light-emitting element 120 and a micro-pixel controller 130 are transferred according to an embodiment. By transferring the inorganic light-emitting element 120 and the micro-pixel controller 130 onto an upper surface of the second substrate 110 on which a solder material or a conductive adhesive is provided or applied, the anode and cathode of the inorganic light-emitting element 120 and the connection pins of the micro-pixel controller 130 can be electrically connected to the electrode pads of the second substrate 110.

[0290] Before the inorganic light-emitting element 120 and the micro-pixel controller 130 are arranged on the second substrate 110, a voltage supply line 1005 electrically connecting the first internal connection line 105 to the micro-pixel controller 130 and a voltage supply line 1007 electrically connecting the second internal connection line 107 and the inorganic light-emitting element 120 can be formed in the second substrate 110.

[0291] refer to Figure 25, in operation 2530, wiring and electrode pads are formed on the module substrate.

[0292] The module substrate refers to the first substrate 13 described above, and wiring and electrode pads may be formed on the upper and lower surfaces of the first substrate 13. For example, a metal material layer such as copper may be formed on the upper surface of the first substrate 13, and wiring and electrode pads may be formed on the first substrate 13 through a photolithography process including processes such as coating, exposure, and development of a photosensitive material, and an etching process for selectively removing unnecessary portions.

[0293] A plurality of voltage lines 15 and 17 may be formed on the upper surface of the first substrate 13. The plurality of voltage lines 15 and 17 may be arranged in multiple rows and columns to electrically connect between the micropixel packages 100 arranged in the multiple rows and columns, and may be formed between the package electrode pads 19 on which the micropixel packages 100 are arranged.

[0294] Figure 28 is a diagram showing a display module according to an embodiment. Figure 28 As shown, each of the plurality of voltage lines 15 and 17 may be formed between two package electrode pads 19 adjacent to each other and arranged in the same column. In this case, the plurality of voltage lines 15 and 17 may include a voltage source for the power supply voltage V DD The plurality of power supply voltage lines 15 and the reference voltage V SS Multiple reference voltage lines 17.

[0295] refer to Figure 25 , in operation 2540, a micro-pixel package may be provided on an upper surface of the module substrate.

[0296] Package electrode pads 19 to which the micropixel packages 100 may be electrically connected may be arranged in a plurality of rows and columns on an upper surface of the first substrate 13 corresponding to the module substrate.

[0297] In this case, the micropixel package 100 may be disposed on the package electrode pad 19 and electrically connected to the first substrate 13. In other words, the micropixel package 100 may be disposed on the first substrate 13 by electrically connecting a lower electrode pad disposed in the micropixel package 100 and the package electrode pad 19 formed on the upper surface of the first substrate 13. For example, the lower electrode pad and the package electrode pad 19 may be electrically connected by welding or a conductive adhesive.

[0298] Figure 29 FIG. 1 is a diagram showing an upper surface of a first substrate 13 on which a micro pixel package 100 is provided according to an embodiment. Figure 29 As shown, a plurality of micro pixel packages 100 may be arranged on the upper surface of the first substrate 13 in a two-dimensional array including a plurality of rows and a plurality of columns.

[0299] That is, a plurality of micropixel packages 100 may be two-dimensionally arranged on the first substrate 13, A micropixel packages 100 may be arranged along a first direction (e.g., a column direction (i.e., Z-axis direction)), and B micropixel packages 100 may be arranged along a second direction (e.g., a row direction (i.e., X-axis direction)).

[0300] In other words, a plurality of micro-pixel packages 100 may be two-dimensionally arranged on a module substrate (a first substrate described below) of the display module 10, and each of the plurality of micro-pixel packages 100 may be electrically connected to a micro-pixel controller adjacent thereto in a first direction. The first direction may correspond to, for example, a column direction (i.e., a Z-axis direction).

[0301] In this case, the internal connection lines 105 and 107 of each of the multiple micropixel packages 100 can be electrically connected to the voltage lines 15 and 17 electrically connected to the micropixel packages in the previous row and the voltage lines 15 and 17 electrically connected to the micropixel packages in the next row.

[0302] Therefore, the internal connection lines 105 and 107 can electrically connect the voltage lines 15 and 17 connected to the micro pixel package of the previous row with the voltage lines connected to the micro pixel package of the next row.

[0303] Internal connection lines 105 and 107 may include a power supply voltage V DD The first internal connection line 105 and the reference voltage V SS The second internal connecting line 107 flows through.

[0304] In other words, each of the plurality of micropixel packages 100 may be electrically connected to a micropixel package adjacent thereto in the first direction via a voltage line provided on the module substrate, and may include an internal connection line that electrically connects a voltage line electrically connected to one of the micropixel packages adjacent thereto in the first direction and a voltage line electrically connected to another micropixel package adjacent thereto in the first direction. Each of the plurality of micropixel packages 100 may transmit a voltage input from one of the micropixel packages electrically connected thereto to another micropixel package electrically connected thereto through the internal connection line.

[0305] As a result, each of the plurality of micro-pixel packages 100 can receive the power supply voltage V by being connected to the power supply voltage line 15a of the micro-pixel package disposed in the previous row and simultaneously disposed in the same column. DD , and the input power supply voltage V can be DD Output to the power supply voltage line 15b connected to the micro-pixel package in the next row.

[0306] At this time, the micro pixel controller 130 can be electrically connected to the first internal connection line 105 through the voltage supply line 1005 and can receive the power supply voltage V DD That is, the first internal connection line 105 can be electrically connected to the micro pixel controller 130 and can transmit the power supply voltage V DD .

[0307] In addition, each of the plurality of micro-pixel packages 100 may receive a reference voltage V by being connected to a reference voltage line 17a of a micro-pixel package disposed in a previous row and simultaneously disposed in the same column. SS , and the reference voltage V SS Output to the reference voltage line 17b connected to the micro-pixel package in the next row.

[0308] At this time, each of the plurality of inorganic light emitting elements 120 may be electrically connected to the second internal connection line 107 through the voltage supply line 1007 and may receive a reference voltage V SS That is, the second internal connection line 107 can be electrically connected to the plurality of inorganic light emitting elements 120 and can transmit the reference voltage V SS .

[0309] refer to Figure 25 , in operation 2550, the driver IC 200 is connected to the module substrate.

[0310] The driver IC 200 may be electrically connected to the first substrate 13 by employing one of various bonding methods such as chip on film (COF) or film on glass (FOG) bonding, chip on glass (COG) bonding, and tape automated bonding (TAB).

[0311] Figure 30 FIG is a diagram of a first substrate 13 to which a driver IC 200 is connected according to an embodiment. For example, when COF bonding is adopted, as shown in FIG. Figure 30 As shown, the driver IC 200 is mounted on the thin film 201 , and one end of the thin film 201 on which the driver IC 200 is mounted may be electrically connected to the first substrate 13 .

[0312] For example, one end of the thin film 201 on which the driver IC 200 is mounted may be electrically connected to the lower electrode pad 14 provided on the lower surface of the first substrate 13, and the lower electrode pad 14 electrically connected to the thin film 201 on which the driver IC 200 is mounted may be connected to the upper line on which the micro pixel package 100 is provided through a via line or a side surface line. The micro pixel package 100 may receive gate signals and data signals from the driver IC 200 through the corresponding upper line.

[0313] refer to Figure 25 , in operation 2560, the FPCB is connected to the module substrate.

[0314] Figure 31 2 is a diagram of a first substrate 13 connected to an FPCB 205 according to an embodiment. As in the above example, when COF bonding is adopted, the other end of the film 201 on which the driver IC 200 is mounted can be electrically connected to the FPCB 205, as shown in FIG. Figure 31 shown.

[0315] The FPCB 205 connected to the film 201 on which the driver IC 200 is mounted may be electrically connected to the driving board 501 and may transmit a timing control signal, image data, etc. output from the driving board 501 to the driver IC 200 .

[0316] In addition, the first substrate 13 may also be connected to the FPCB for receiving power, and the FPCB for supplying power may be electrically connected to the power supply board 601 and may provide the power supply voltage V DD Or reference voltage V SS The power supply voltage V is supplied to the micro pixel controller 130 or the inorganic light emitting element 120. The power supply board 601 can be electrically connected to the first substrate 13 through the FPCB, and can be electrically connected to the micro pixel packages 100 arranged in the first row 1600 on the first substrate 13 through a line to supply the power supply voltage V DD and reference voltage V SS .

[0317] The method for manufacturing the display module 10 according to one embodiment may include all of the above processes, or may include only some of the above processes. Alternatively, other processes may be added.

[0318] Furthermore, in the method of manufacturing the display module 10 according to one embodiment, the manufacturing of the micropixel package 100 may be omitted, and providing some of the power supply lines in the micropixel controller 130 may be included.

[0319] According to an embodiment, a method of manufacturing a display module 10 may include forming internal connection lines 105 and 107 in a micropixel controller 130, forming voltage lines 15 and 17 on a module substrate 13, arranging the micropixel controller 130 and an inorganic light-emitting element 120 on the module substrate 13, connecting a driver IC 200 to the module substrate 13, and connecting an FPCB 205 to the module substrate 13.

[0320] The disclosed embodiments may be implemented in the form of a recording medium storing computer-executable instructions. The instructions may be stored in the form of program code, and when executed by a processor, the instructions may generate a program module to perform the operations of the disclosed embodiments. The recording medium may be implemented as a computer-readable recording medium.

[0321] Computer-readable recording media include various recording media in which instructions that can be read by a computer are stored, such as read-only memory (ROM), random access memory (RAM), magnetic tapes, magnetic disks, flash memory, optical data storage devices, and the like.

[0322] The embodiments disclosed above have been described with reference to the accompanying drawings. Those skilled in the art will appreciate that forms different from the disclosed embodiments may be implemented without departing from the technical spirit and essential features of the present disclosure. The disclosed embodiments are illustrative and should not be construed as limiting.

Claims

1. A display module, comprising: Multiple pixels; a first substrate; A plurality of micro-pixel packages are provided on the first substrate; as well as a plurality of voltage lines electrically connected between a group of micro-pixel packages adjacent to each other in a first direction among the plurality of micro-pixel packages; Wherein, each of the plurality of micro-pixel packages comprises: a second substrate; A plurality of inorganic light-emitting elements are arranged on the second substrate; a micro-pixel controller, disposed on the second substrate and configured to control the plurality of inorganic light-emitting elements; and An internal connection line is arranged in the second substrate and is configured to electrically connect a first voltage line among the multiple voltage lines and a second voltage line among the multiple voltage lines, the first voltage line is electrically connected to a first micropixel package in the group of micropixel packages adjacent to each other in the first direction, and the second voltage line is electrically connected to a second micropixel package in the group of micropixel packages adjacent to each other in the first direction.

2. The display module according to claim 1, wherein: Each of the plurality of voltage lines is configured to transmit a voltage between the plurality of micro-pixel packages.

3. The display module according to claim 2, wherein: Each of the plurality of micro pixel packages is configured to receive a voltage through the first voltage line and output the input voltage to the second voltage line through the internal connection line.

4. The display module according to claim 3, wherein: The internal connection line has an electron mobility higher than an electron mobility of each of the plurality of voltage lines.

5. The display module according to claim 3, wherein: The multiple micropixel packages include a first plurality of micropixel packages and a second plurality of micropixel packages, each of the first plurality of micropixel packages being configured to receive voltage from a power supply board and transmit the voltage to a micropixel package adjacent to the micropixel package in the first direction through a corresponding voltage line, and each of the second plurality of micropixel packages being configured to receive voltage from a micropixel package adjacent to the micropixel package in the first direction. The display module according to claim 3 , wherein: The internal connection line is electrically connected to the plurality of inorganic light-emitting elements and the micro-pixel controller, and transmits a voltage input from any one of the group of micro-pixel packages to each of the plurality of inorganic light-emitting elements and the micro-pixel controller.

7. The display module according to claim 6, wherein: The internal connection line includes a first internal connection line through which a power supply voltage flows and a second internal connection line through which a reference voltage flows, wherein the first internal connection line is electrically connected to the micro-pixel controller and transmits the power supply voltage to the micro-pixel controller; and The second internal connection line is electrically connected to the plurality of inorganic light emitting elements and transmits the reference voltage to the plurality of inorganic light emitting elements.

8. The display module according to claim 1, wherein: Each of the plurality of pixels includes at least two inorganic light emitting elements among the plurality of inorganic light emitting elements, and The plurality of inorganic light-emitting elements constitute at least two pixels among the plurality of pixels.

9. The display module according to claim 1, wherein: The micro-pixel controller includes a third substrate and at least one thin film transistor disposed on the third substrate, and The at least one thin film transistor is configured to switch the plurality of inorganic light emitting elements and supply a driving current to the plurality of inorganic light emitting elements.

10. A display device comprising: a plurality of display modules, including a plurality of pixels; as well as a frame configured to support the plurality of display modules, Wherein, each of the plurality of display modules comprises: a first substrate; a plurality of micro-pixel packages, disposed on the first substrate; and A plurality of voltage lines electrically connected between a group of micro-pixel packages adjacent to each other in a first direction, and Wherein, each of the plurality of micro-pixel packages further comprises: a second substrate; A plurality of inorganic light-emitting elements are arranged on the second substrate; a micro-pixel controller, disposed on the second substrate and configured to control the plurality of inorganic light-emitting elements; and An internal connection line is arranged in the second substrate and is configured to electrically connect a first voltage line among the multiple voltage lines and a second voltage line among the multiple voltage lines, the first voltage line is electrically connected to a first micropixel package in the group of micropixel packages adjacent to each other in the first direction, and the second voltage line is electrically connected to a second micropixel package in the group of micropixel packages adjacent to each other in the first direction.

11. The display device according to claim 10, wherein: Each of the plurality of voltage lines is configured to transmit a voltage between the group of micropixel packages.

12. The display device according to claim 11, wherein Each of the plurality of micro pixel packages is configured to receive a voltage through the first voltage line and output the input voltage to the second voltage line through the internal connection line.

13. The display device according to claim 12, wherein: The internal connection line has an electron mobility higher than an electron mobility of each of the plurality of voltage lines.

14. The display device according to claim 12, wherein: The multiple micropixel packages include a first plurality of micropixel packages and a second plurality of micropixel packages, each of the first plurality of micropixel packages being configured to receive voltage from a power supply board and transmit voltage to a micropixel package adjacent to the micropixel package in the first direction through the second voltage line, and each of the second plurality of micropixel packages being configured to receive voltage from a micropixel package adjacent to the micropixel package in the first direction.

15. The display device according to claim 12, wherein: The internal connection line is electrically connected to the plurality of inorganic light-emitting elements and the micro-pixel controller, and is configured to transmit a voltage input from any one of the group of micro-pixel packages to each of the plurality of inorganic light-emitting elements and the micro-pixel controller.

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