An integrated device and method for chip surface defect detection, sorting and tube packaging

Abstract

The application discloses a kind of integrated device and method of chip surface defect detection, sorting and tube packing, the integrated device includes chip flow pipe, flow pipe chip jam device, flow pipe block device, flow pipe separation device, chip flow pipe is inclinedly arranged, the flow pipe chip jam device, flow pipe block device, flow pipe separation device are spaced apart and installed in the side of chip flow pipe from high to low direction in turn along chip flow pipe, the end of the highest place of chip flow pipe is connected with the last end of chip production line, the end of the lowest place of chip flow pipe is connected with plastic packaging tube, chip flow pipe is installed with a movable rotating side door in corresponding position of flow pipe separation device, unqualified chip collection box is installed below side door, machine vision detection module is installed in the other side of chip flow pipe.The integrated device of the application can detect, sort and tube pack chips, realize high integration.

Description

Technical Field

[0001] This invention relates to the field of chip technology, and in particular to an integrated device and method for chip defect detection, sorting and tube packaging. Background Technology

[0002] Chip packaging and storage methods include three main approaches: tubing, tape and reel, and tray packaging. Tubing is simple, reliable, and offers high resistance to external impacts, making it one of the most common packaging and storage methods for chips. Chips manufactured on the production line need to undergo surface defect inspection before entering tubing packaging. Inspection items include stains, misaligned or missing leads, and unclear silkscreen printing. Existing chip inspection equipment has the following problems:

[0003] (1) Existing chip inspection equipment has high equipment costs for chip surface defect detection and sorting methods. Conventional sorting requires the use of robotic arms for chip sorting, and the equipment cost of high-precision robotic arms is very high.

[0004] (2) The speed of chip detection and sorting is affected by the movement speed of the robotic arm, which makes the speed of chip detection and sorting easily limited; thus affecting the subsequent processes of chip processing.

[0005] (3) The three processes of chip testing, sorting and tube packaging are all done independently. After the chip is tested, it needs to be installed on other equipment for sorting. After sorting, the chip is then tube packaged. The chip testing, sorting and tube packaging are done independently by several separate equipment, which results in low work efficiency. Summary of the Invention

[0006] In order to solve the technical problems existing in the prior art, the present invention provides an integrated device and method that is mainly used for the detection of surface defects of tube-packaged chips and for the detection stage at the end of the chip production line. It can realize chip surface defect detection, sorting and tube packaging in one unit and improve the efficiency of chip detection, sorting and tube packaging.

[0007] To address the aforementioned technical problems, this invention provides an integrated device for chip surface defect detection, sorting, and tube packaging. The integrated device includes a chip flow tube, a chip jamming device, a flow tube blocking device, and a flow tube separation device. The chip flow tube is inclined. The chip jamming device, flow tube blocking device, and flow tube separation device are sequentially and alternately installed along one side of the chip flow tube from high to low. The highest end of the chip flow tube is connected to the end of the chip production line or the object being tested. The lowest end of the chip flow tube is connected to a plastic packaging tube for easy chip packaging. A movable, rotatable side door is installed corresponding to the positions of the chip flow tube and the flow tube separation device. One end of the flow tube separation device is connected to the side door. A defective chip collection box is installed below the side door. A machine vision device is installed on the other side of the chip flow tube, between the chip jamming device and the flow tube blocking device. The detection module, specifically the machine vision detection module, defines the area corresponding to the chip flow tube position as the detection area. The machine vision detection module is electrically connected to a microcontroller module, which in turn is connected to an electromagnetic push rod driver module. This electromagnetic push rod driver module is electrically connected to a chip jamming device, a flow tube blocking device, and a flow tube separation device to control these devices. The chip to be detected at the highest point of the chip flow tube slides into the flow tube. As the chip flows through the detection area, the machine vision detection module performs surface defect detection on the chip in the detection area. After detection, the machine vision detection module sends the detection results to the microcontroller module. Based on the detection results, the microcontroller module controls the electromagnetic push rod driver module to drive the chip jamming device, flow tube blocking device, and flow tube separation device to pop out and retract, thereby achieving sequential detection, sorting, and loading of the chips.

[0008] To further improve the above technical solution, the flow tube chip jamming device, the flow tube blocking device, and the chip flow tube mounting location are respectively provided with a first micro notch and a second micro notch.

[0009] A further improvement to the above technical solution is provided: the flow tube chip jamming device includes a jamming push rod and a jamming electromagnetic push valve. One end of the jamming push rod is connected to the jamming electromagnetic push valve, and the other end of the jamming push rod is installed at the first micro-notch of the chip flow tube. The jamming electromagnetic push valve is electrically connected to an electromagnetic push rod driver module. The electromagnetic push rod driver module controls the jamming electromagnetic push valve to push the jamming push rod to pop out and retract.

[0010] In a further improvement to the above technical solution, a first damping spring is installed inside the locking push rod, and a first rubber is fixed to the top of the other end of the locking push rod. When the locking push rod pops out, the top of the locking push rod will press against the chip surface. The first rubber enhances the friction between the top of the locking push rod and the chip surface, which can lock the chip in the chip flow tube.

[0011] In a further improvement to the above technical solution, the flow tube blocking device includes a blocking push rod and a blocking electromagnetic push valve. One end of the blocking push rod is connected to the blocking electromagnetic push valve, and the other end of the blocking push rod is installed at the second micro-gap in the chip flow tube. The blocking electromagnetic push valve is electrically connected to an electromagnetic push rod driver module, and the electromagnetic push rod driver module controls the blocking electromagnetic push valve to push the blocking push rod to pop out and retract.

[0012] In a further improvement to the above technical solution, the flow tube separation device includes a separation push rod and a separation electromagnetic push valve. One end of the separation push rod is connected to the separation electromagnetic push valve, and the other end of the separation push rod is connected to a coupling. The other end of the separation push rod is connected to the side door of the chip flow tube through the coupling.

[0013] As a further improvement to the above technical solution, a transparent material is fixed at the mounting point of the chip flow tube and the machine vision inspection module, and the machine vision inspection module inspects the surface of the chip through the transparent material.

[0014] In a further improvement to the above technical solution, the microcontroller module is also electrically connected to a display module. The microcontroller module sends the chip detection results detected by the machine vision inspection module to the display module, and the display module displays the detection results.

[0015] On the other hand, the present invention also provides a method for detecting, sorting, and packaging chip surface defects using an integrated device, specifically including the following steps:

[0016] Step S1: The chips to be inspected slide into the chip flow tube sequentially from the highest point of the chip flow tube. The chips flow freely downwards under their own gravity. It is assumed that the Nth chip, the N+1th chip, the N+2th chip, ... the N+Nth chip flow into the chip flow tube in sequence, where N≥1 and N is a positive integer. The Nth chip flows in first, followed by the N+1th chip, then the N+2th chip, and finally the N+Nth chip. In the initial state, the flow tube blocking device is activated, and one end of the blocking push rod of the flow tube pops out and extends into the chip flow tube, blocking the chip to be inspected that is sliding in the chip flow tube, so that the Nth chip is blocked in the area to be inspected. The flow tube chip jamming device is activated, and one end of the jamming push rod of the flow tube jams out and extends into the chip flow tube, jamming the N+1th chip. The machine vision inspection module inspects the Nth chip blocked in the area to be inspected, and proceeds to step S2 or step S3.

[0017] Step S2: If the Nth chip detected by the machine vision module is a qualified chip, then proceed to step S3; if the Nth chip detected by the machine vision module is a defective chip, then proceed to step S4.

[0018] Step S3: If the machine vision module sends the result that the Nth chip is a qualified chip to the microcontroller module, the microcontroller module controls the electromagnetic push rod driver module to drive the separation push rod of the flow tube separation device to pop out, and then proceeds to step S5;

[0019] Step S4: The machine vision module detects that the Nth chip is a defective chip and sends the result to the microcontroller module. The microcontroller module controls the electromagnetic push rod driver module to drive the separation push rod of the flow tube separation device to retract, so that the side door of the chip flow tube opens, and then proceeds to step S6.

[0020] Step S5: The microcontroller module controls the electromagnetic push rod driver module to drive one end of the blocking push rod of the flow tube blocking device to retract, no longer blocking the Nth chip in the chip flow tube, so that the Nth chip with the test result of qualified chip slides down along the chip flow tube and falls into the plastic packaging tube, and proceeds to step S7.

[0021] Step S6: The microcontroller module controls the electromagnetic push rod driver module to drive one end of the blocking push rod of the flow tube blocking device to retract, so that the Nth chip in the chip flow tube is no longer blocked, so that the Nth chip with the test result of being a defective chip slides down along the chip flow tube and slides out from the side door of the chip flow tube into the defective chip collection box, and proceeds to step S7.

[0022] Step S7: The machine vision module detects that the Nth chip has completely slipped out of the detection area, and proceeds to step S8;

[0023] Step S8: The machine vision module detects that the Nth chip has slipped out of the detection area and sends the result to the microcontroller module. The microcontroller module controls the electromagnetic push rod driver module to drive the blocking push rod of the flow tube blocking device to pop out, and proceeds to step S9.

[0024] Step S9: The microcontroller module controls the electromagnetic push rod driver module to drive the locking push rod of the flow tube chip locking device to retract, and proceed to step S10;

[0025] Step S10: All the chips to be tested in the chip flow tube continue to slide downwards, proceeding to step S11;

[0026] Step S11: The machine vision module detects that the N+1th chip has completely slid into the detection area, and proceeds to step S12;

[0027] Step S12: The microcontroller module controls the electromagnetic push rod driver module to drive the locking push rod of the flow tube chip locking device to pop out, locking the N+2th chip, and proceed to step S13;

[0028] Step S13: After the machine vision inspection module inspects the N+1th chip in the area to be inspected, it returns to step S2 or step S3 and executes the cycle based on the inspection result of the machine vision inspection module after inspecting the N+1th chip.

[0029] Compared with existing technologies, the integrated device and method for chip surface defect detection, sorting, and tube packaging of the present invention has at least the following technical advantages:

[0030] The integrated device of this invention includes a chip flow tube, a chip jamming device, a flow tube blocking device, and a flow tube separation device. The chip flow tube is inclined. The chip jamming device, the flow tube blocking device, and the flow tube separation device are sequentially installed at intervals along one side of the chip flow tube from high to low. The highest end of the chip flow tube is connected to the end of the chip production line or the object to be tested, and the lowest end of the chip flow tube is connected to a plastic packaging tube. A movable and rotatable side door is installed at the corresponding position of the chip flow tube and the flow tube separation device. One end of the flow tube separation device is connected to the side door, and a defective chip collection box is installed below the side door. This invention also installs a machine vision inspection module on the other side of the chip flow tube corresponding to the position between the chip jamming device and the flow tube blocking device. The area corresponding to the position of the machine vision inspection module and the chip flow tube is the area to be inspected. The machine vision inspection module is electrically connected to a microcontroller module, and the microcontroller module is connected to an electromagnetic push rod driver module. The electromagnetic push rod driver module is electrically connected to the chip jamming device, the flow tube blocking device, and the flow tube separation device. The chip to be inspected at the highest point of the chip flow tube slides into the tube. As the chip flows through the inspection area of ​​the flow tube, this invention uses a machine vision inspection module to perform surface defect detection on the chip in the inspection area. After inspection, the machine vision inspection module sends the inspection results to the microcontroller module. The microcontroller module controls the electromagnetic push rod driver module to drive the ejection and retraction of the flow tube chip jamming device, flow tube blocking device, and flow tube separation device, thereby realizing the sequential inspection, sorting, and loading of chips. This invention sets up a chip flow tube and tilts it, then uses the chip's own gravity to automatically slide and move the chip in the flow tube. The chip surface is then inspected by the vision inspection module to achieve chip inspection and sorting. The entire inspection and sorting process does not require the use of robotic arms or chip propulsion equipment, greatly reducing equipment costs and shortening sorting time. It also avoids the chip inspection and sorting speed being affected by the movement speed of robotic arms. This invention achieves integrated operation during the sorting process by utilizing a sequential process of jamming, blocking, and separation. This high degree of integration improves the efficiency of detection, sorting, and tube packaging, while also enhancing detection accuracy and automation. Furthermore, the invention employs a pipeline-style detection method using chip flow tubes, which meets the needs of actual production lines. The integrated device can be directly connected to the end of the chip production line and is easily compatible with different production line equipment, making it highly valuable for application. Attached Figure Description

[0031] The following, in conjunction with the accompanying drawings and embodiments, provides a detailed description of the integrated device and method for chip surface defect detection, sorting, and tubing, as well as its technical effects, wherein:

[0032] Figure 1 This is a schematic diagram of the overall structure of the integrated device of the present invention;

[0033] Figure 2 This is a schematic diagram of the structure of the flow tube chip jamming device of the present invention;

[0034] Figure 3 This is a schematic diagram of the use of the flow tube separation device of the present invention when it pops out;

[0035] Figure 4 This is a schematic diagram of the flow tube separation device of the present invention when it is retracted;

[0036] Figure 5 This is a flowchart illustrating the operation of each module of the integrated device of the present invention;

[0037] Figure 6 This is a schematic diagram of the initial state of the chip to be detected in the chip flow tube in step S1 of embodiment two of the present invention;

[0038] Figure 7 This is a schematic diagram of the separation push rod popping out after step S3 is executed in Embodiment 2 of the present invention;

[0039] Figure 8 This is a schematic diagram showing the Nth chip sliding from the chip flow tube into the defective chip collection box after steps S2, S4, and S6 are executed in Embodiment 2 of the present invention.

[0040] Figure 9 This is a schematic diagram showing that after step S11 is executed in Embodiment 2 of the present invention, the N+1th chip completely slides into the detection area.

[0041] In the diagram: 1. Chip flow tube; 11. First micro-notch; 12. Second micro-notch; 13. Side door; 14. Detection area; 2. Flow tube chip jamming device; 21. Jamming push rod; 22. First shock-absorbing spring; 23. First rubber; 24. Jamming electromagnetic push valve; 3. Flow tube blocking device; 31. Blocking push rod; 34. Blocking electromagnetic push valve; 4. Flow tube separation device; 41. Separation push rod; 42. One-section coupling; 5. Defective chip collection box; 6. Machine vision inspection module; 61. Transparent material; 7. Microcontroller module; 8. Electromagnetic push rod driver module; 9. Display module; 10. Plastic packaging tube. Detailed Implementation

[0042] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] like Figure 1 - Figure 5As shown, Embodiment 1 of the present invention provides an integrated device for chip surface defect detection, sorting, and tube packaging. This integrated device includes a chip flow tube 1, a flow tube chip clamping device 2, a flow tube blocking device 3, and a flow tube separation device 4. In a specific embodiment of the present invention, when inspecting chips, the chip flow tube 1 is tilted. The present invention also configures the structure of the chip flow tube 1 as a hollow square tube or a hollow rectangular tube to facilitate the simultaneous accommodation of a row of chips. The present invention installs the flow tube chip clamping device 2, the flow tube blocking device 3, and the flow tube separation device 4 sequentially along one side of the chip flow tube 1 from high to low. The highest end of the chip flow tube 1 is connected to the end of the chip production line or the object being tested, and the lowest end of the chip flow tube 1 is connected to a plastic packaging tube 10, facilitating the tube packaging of chips. The present invention also includes a movable and rotatable side door 13 installed at a position corresponding to the chip flow tube 1 and the flow tube separation device 4. One end of the flow tube separation device 4 is connected to the side door 13, and a defective chip collection box 5 is installed below the side door 13. A machine vision inspection module 6 is installed on the other side of the chip flow tube 1, corresponding to the position between the flow tube chip jamming device 2 and the flow tube blocking device 3. The area corresponding to the position of the machine vision inspection module 6 and the chip flow tube 1 is the inspection area 14. The machine vision inspection module 6 is electrically connected to a microcontroller module 7, which is connected to an electromagnetic push rod driver module 8. The microcontroller module 7 is also electrically connected to a display module 9. The microcontroller module 7 sends the chip inspection results detected by the machine vision inspection module 6 to the display module 9, which displays the inspection results. The electromagnetic push rod driver module 8 is electrically connected to the flow tube chip jamming device 2, the flow tube blocking device 3, and the flow tube separation device 4, facilitating the control of these devices by the electromagnetic push rod driver module 8.The highest point of the integrated device of this invention is connected to the very end of the chip production line. The chips to be tested, transported from the very end of the chip production line, slide sequentially into the chip flow tube 1 from the highest point of the flow tube 1. The chips to be tested slide freely downwards along the chip flow tube 1 under their own gravity. Assume that the Nth chip, the (N+1)th chip, the (N+2)th chip, ..., the (N+N)th chip flow into the chip flow tube 1 sequentially, where N ≥ 1 and N is a positive integer. The Nth chip flows in first, followed by the (N+1)th chip, then the (N+2)th chip, and finally... The N+Nth chip is initially blocked. The flow tube blocking device 3 is activated, with one end extending into the chip flow tube 1, blocking the chip to be detected that is sliding within the flow tube 1. This causes the Nth chip to be blocked in the detection area 14. The flow tube chip locking device 2 is then activated, with one end extending into the chip flow tube 1, locking the N+2th chip. The machine vision inspection module 6 then inspects the Nth chip blocked in the detection area 14 and sends the inspection result. The microcontroller module 7, based on the detection results, drives the electromagnetic push rod driver module 8 to control the ejection and retraction of the flow tube chip jamming device 2, the flow tube blocking device 3, and the flow tube separation device 4. If the machine vision detects that the Nth chip is a qualified chip, the flow tube separation device 4 closes, ejects the side door 13 blocking the chip flow tube 1, and one end of the flow tube blocking device 3 retracts, no longer blocking the chip flow tube 1. This allows the Nth chip, which has a qualified detection result, to slide downwards along the chip flow tube 1 so that the Nth chip falls into the plastic. Inside the material packaging tube 10; if the machine vision detects that the Nth chip is a defective chip, the flow tube separation device 4 is activated, the flow tube separation device 4 retracts, the side door 13 of the chip flow tube 1 is opened, one end of the flow tube blocking device 3 retracts and no longer blocks the Nth chip in the chip flow tube 1, so that the Nth chip with the defective chip detection result slides down along the chip flow tube 1. In addition, the retraction of the flow tube separation device 4 opens the side door 13 of the chip flow tube 1, allowing the Nth chip with the defective chip detection result to slide out of the chip flow tube 1 and fall into the defective chip collection box 5.

[0044] In a specific implementation of this invention, a first micro-notch 11 and a second micro-notch 12 are respectively provided at the mounting locations of the flow tube chip jamming device 2, the flow tube blocking device 3, and the chip flow tube 1. The flow tube chip jamming device 2 includes a jamming push rod 21 and a jamming electromagnetic push valve 24. One end of the jamming push rod 21 is connected to the jamming electromagnetic push valve 24, and the other end of the jamming push rod 21 is installed at the first micro-notch 11 of the chip flow tube 1. The jamming electromagnetic push valve 24 is electrically connected to an electromagnetic push rod driver module 8. The electromagnetic push rod driver module 8 controls the jamming electromagnetic push valve 24 to push the jamming push rod 21 to pop out and retract. The other end of the jamming push rod 21 pops out and can extend into the chip flow tube 1 through the first micro-notch 11. The invention also includes a first damping spring 22 installed inside the locking push rod 21. The first damping spring 22 prevents the locking push rod 21 from sliding, thus preventing slippage. Furthermore, the invention includes a first rubber 23 fixed to the top of the other end of the locking push rod 21. When the locking push rod 21 pops out, its top will press against the chip surface. The first rubber 23 enhances the friction between the top of the locking push rod 21 and the chip surface, effectively locking the chip in the chip flow tube 1 and preventing the chip from sliding down within the chip flow tube 1. The first rubber 23 has high friction and can play an anti-slip role. The first shock-absorbing spring 22 inside the locking push rod 21 further plays a shock-absorbing role. The reason why this invention uses the locking push rod 21 to press against the chip surface to lock the chip, instead of inserting it between two chips, is because the chips are tightly connected together with very small gaps in between, making it difficult to insert between two chips. Therefore, this invention uses the first rubber 23 at the head of the locking push rod 21 to press against the middle of the chip, which can lock the chip with high reliability.

[0045] The flow tube blocking device 3 of the present invention includes a blocking push rod 31 and a blocking electromagnetic push valve 34. One end of the blocking push rod 31 is connected to the blocking electromagnetic push valve 34, and the other end of the blocking push rod 31 is installed at the second micro-notch 12 of the chip flow tube 1. The blocking electromagnetic push valve 34 is electrically connected to the electromagnetic push rod driver module 8. The electromagnetic push rod driver module 8 controls the blocking electromagnetic push valve 34 to push the blocking push rod 31 to pop out and retract. The other end of the blocking push rod 31 pops out and can extend into the chip flow tube 1 through the second micro-notch 12.

[0046] In a specific implementation of this invention, the flow tube separation device 4 includes a separation push rod 41 and a separation solenoid valve. One end of the separation push rod 41 is connected to the separation solenoid valve, and the other end of the separation push rod 41 is connected to a coupling 42. The other end of the separation push rod 41 is connected to the side door 13 of the chip flow tube 1 via the coupling 42. For example, one end of the separation push rod 41 is connected to the coupling 42. Figure 3As shown, when the push rod of the separation push rod 41 pops out, the force of the coupling 42 of the separation push rod 41 can be decomposed into two directions, X and Y. The force in the X direction causes the side door 13 of the chip flow tube 1 to close, while the force in the Y direction, being parallel to the side door 13 of the chip flow tube 1, has no effect; conversely, as... Figure 4 As shown, when the separation push rod 41 retracts, the force of the coupling 42 of the separation push rod section can be decomposed into two directions, X and Y. The force in the X direction causes the side door 13 of the chip flow tube 1 to open, while the force in the Y direction does not play any role because it is parallel to the side door 1 of the chip flow tube 1.

[0047] In a specific embodiment of the present invention, a transparent material 61 is fixed at the mounting location of the chip flow tube 1 and the machine vision inspection module 6, and the machine vision inspection module 6 inspects the surface of the chip through the transparent material 61.

[0048] like Figure 4 - Figure 9 As shown, Embodiment 2 of the present invention provides a method for chip surface defect detection, sorting, and packaging, which uses an integrated device to detect, sort, and package chip surface defects. The method specifically includes the following steps:

[0049] Step S1: The chips to be tested slide into the chip flow tube 1 sequentially from the highest end of the chip flow tube 1. The chips flow freely downwards by their own gravity. It is assumed that the Nth chip, the N+1th chip, the N+2th chip, ... the N+Nth chip flow into the chip flow tube 1 in sequence, where N≥1 and N is a positive integer. The Nth chip flows in first, followed by the N+1th chip, then the N+2th chip, and finally the N+Nth chip. In the initial state, the flow tube blocking device 3 is activated, and one end of the blocking push rod 31 of the flow tube blocking device 3 pops out and extends into the chip flow tube 1, blocking the chip to be tested that is sliding in the chip flow tube 1, so that the Nth chip is blocked in the detection area 14. The flow tube chip jamming device 2 is activated, and one end of the jamming push rod 21 of the flow tube chip jamming device 2 pops out and extends into the chip flow tube 1, jamming the N+1th chip. The machine vision detection module 6 detects the Nth chip blocked in the detection area 14 and proceeds to step S2 or step S3.

[0050] Step S2: If the Nth chip detected by the machine vision module is a qualified chip, then proceed to step S3; if the Nth chip detected by the machine vision module is a defective chip, then proceed to step S4.

[0051] Step S3: If the machine vision module sends the result that the Nth chip is a qualified chip to the microcontroller module 7, the microcontroller module 7 controls the electromagnetic push rod driver module 8 to drive the separation push rod 41 of the flow tube separation device 4 to pop out, and then proceeds to step S5.

[0052] Step S4: The machine vision module detects that the Nth chip is a defective chip and sends the result to the microcontroller module 7. The microcontroller module 7 controls the electromagnetic push rod driver module 8 to drive the separation push rod 41 of the flow tube separation device 4 to retract, so that the side door 13 of the chip flow tube 1 is opened, and then proceed to step S6.

[0053] Step S5: The microcontroller module 7 controls the electromagnetic push rod driver module 8 to drive one end of the blocking push rod 31 of the flow tube blocking device 3 to retract, so that the Nth chip in the chip flow tube 1 is no longer blocked, and the Nth chip with the test result of qualified chip slides down along the chip flow tube 1 and falls into the plastic packaging tube 10, and proceeds to step S7.

[0054] Step S6: The microcontroller module 7 controls the electromagnetic push rod driver module 8 to drive one end of the blocking push rod 31 of the flow tube blocking device 3 to retract, so that the Nth chip in the chip flow tube 1 is no longer blocked, and the Nth chip with the detection result of being a defective chip slides down along the chip flow tube 1 and slides out of the defective chip collection box 5 from the side door 13 to the chip flow tube 1, and proceeds to step S7.

[0055] Step S7: The machine vision module detects that the Nth chip has completely slipped out of the detection area, and proceeds to step S8;

[0056] Step S8: The machine vision module detects that the Nth chip has slipped out of the detection area and sends the result to the microcontroller module 7. The microcontroller module 7 controls the electromagnetic push rod driver module 8 to drive the blocking push rod 31 of the flow tube blocking device 3 to pop out, and proceeds to step S9.

[0057] Step S9: The microcontroller module 7 controls the electromagnetic push rod driver module 8 to drive the locking push rod 21 of the flow tube chip locking device 2 to retract, and proceed to step S10;

[0058] Step S10: All the chips to be tested in the chip flow tube 1 continue to slide downwards, proceeding to step S11;

[0059] Step S11: The machine vision module detects that the N+1th chip has completely slid into the detection area, and proceeds to step S12;

[0060] Step S12: The microcontroller module 7 controls the electromagnetic push rod driver module 8 to drive the locking push rod 21 of the flow tube chip locking device 2 to pop out and lock the N+2th chip, and proceed to step S13.

[0061] Step S13: After the machine vision inspection module 6 inspects the N+1th chip in the area to be inspected 14, it returns to step S2 or step S3 and executes the cycle based on the inspection result of the machine vision inspection module 6 after inspecting the N+1th chip.

[0062] Compared with the prior art, the technical solution disclosed in the above embodiments has the following beneficial effects:

[0063] In the above embodiments, the present invention sets up a chip flow tube 1 and tilts it. The chips then automatically slide and move within the flow tube 1 using their own gravity. A vision inspection module then inspects the chip surface, achieving chip detection and sorting. The entire process eliminates the need for robotic arms or chip propulsion equipment, significantly reducing equipment costs and shortening sorting time. It also avoids the impact of robotic arm movement speed on chip detection and sorting speed. Furthermore, the present invention utilizes a sequential approach involving jamming, blocking, and separation during the sorting process to achieve integrated operation, resulting in a high degree of integration and improved efficiency in detection, sorting, and tube packaging. This also enhances detection accuracy and automation.

[0064] The above-disclosed embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. Therefore, any equivalent variations made in accordance with the claims of the present invention are still within the scope of the present invention.

Claims

1. An integrated device for chip surface defect detection, sorting, and tube packaging, characterized in that: The integrated device includes a chip flow tube, a chip jamming device, a flow tube blocking device, and a flow tube separation device. The chip flow tube is inclined. The chip jamming device, the flow tube blocking device, and the flow tube separation device are sequentially and alternately installed along one side of the chip flow tube from high to low. The highest end of the chip flow tube is connected to the end of the chip production line or the object being tested, and the lowest end of the chip flow tube is connected to a plastic packaging tube for easy chip packing. A movable and rotatable side door is installed corresponding to the position of the chip flow tube and the flow tube separation device. One end of the flow tube separation device is connected to the side door, and a defective chip collection box is installed below the side door. A machine vision inspection module is installed on the other side of the chip flow tube, between the chip jamming device and the flow tube blocking device. The area corresponding to the position of the vision inspection module and the chip flow tube is the inspection area. The machine vision inspection module is electrically connected to a microcontroller module, which is connected to an electromagnetic push rod driver module. The electromagnetic push rod driver module is electrically connected to a chip jamming device, a flow tube blocking device, and a flow tube separation device. The chip to be inspected at the highest point of the chip flow tube slides into the flow tube. When the chip to be inspected flows through the inspection area of ​​the chip flow tube, the machine vision inspection module performs surface defect detection on the chip in the inspection area. After detection, the machine vision inspection module sends the detection result to the microcontroller module. The microcontroller module controls the electromagnetic push rod driver module to drive the ejection and retraction of the chip jamming device, the flow tube blocking device, and the flow tube separation device based on the detection result, thereby realizing the sequential inspection, sorting, and loading of chips. The flow tube chip jamming device, the flow tube blocking device, and the chip flow tube mounting location are respectively provided with a first micro notch and a second micro notch; The flow tube chip jamming device includes a jamming push rod and a jamming electromagnetic push valve. One end of the jamming push rod is connected to the jamming electromagnetic push valve, and the other end of the jamming push rod is installed at the first micro-notch of the chip flow tube. The jamming electromagnetic push valve is electrically connected to the electromagnetic push rod driver module. The electromagnetic push rod driver module controls the jamming electromagnetic push valve to push the jamming push rod to pop out and retract. The locking push rod has a first shock-absorbing spring installed inside, and a first rubber is fixed to the top of the other end of the locking push rod.

2. The integrated device for chip surface defect detection, sorting, and tube packaging as described in claim 1, characterized in that: The flow tube blocking device includes a blocking push rod and a blocking solenoid valve. One end of the blocking push rod is connected to the blocking solenoid valve, and the other end of the blocking push rod is installed at the second micro-gap in the chip flow tube. The blocking solenoid valve is electrically connected to the solenoid push rod driver module. The solenoid push rod driver module controls the blocking solenoid valve to push the blocking push rod to pop out and retract.

3. The integrated device for chip surface defect detection, sorting, and tube packaging as described in claim 1, characterized in that: The flow tube separation device includes a separation push rod and a separation electromagnetic push valve. One end of the separation push rod is connected to the separation electromagnetic push valve, and the other end of the separation push rod is connected to a coupling. The other end of the separation push rod is connected to the side door of the chip flow tube through the coupling.

4. The integrated device for chip surface defect detection, sorting, and tube packaging as described in claim 1, characterized in that: A transparent material is fixed at the mounting points of the chip flow tube and the machine vision inspection module, and the machine vision inspection module inspects the surface of the chip through the transparent material.

5. The integrated device for chip surface defect detection, sorting, and tube packaging as described in claim 1, characterized in that: The microcontroller module is also electrically connected to a display module. The microcontroller module sends the chip detection results detected by the machine vision inspection module to the display module, and the display module displays the detection results.

6. A method integrating chip surface defect detection, sorting, and tube packaging, characterized in that: The integrated device described in any one of claims 1-5 is used to detect, sort, and package chip surface defects, specifically including the following steps: Step S1: The chips to be inspected slide into the chip flow tube sequentially from the highest point of the chip flow tube. The chips flow freely downwards under their own gravity. It is assumed that the Nth chip, the N+1th chip, the N+2th chip, ... the N+Nth chip flow into the chip flow tube in sequence, where N≥1 and N is a positive integer. The Nth chip flows in first, followed by the N+1th chip, then the N+2th chip, and finally the N+Nth chip. In the initial state, the flow tube blocking device is activated, and one end of the blocking push rod of the flow tube pops out and extends into the chip flow tube, blocking the chip to be inspected that is sliding in the chip flow tube, so that the Nth chip is blocked in the area to be inspected. The flow tube chip jamming device is activated, and one end of the jamming push rod of the flow tube jams out and extends into the chip flow tube, jamming the N+1th chip. The machine vision inspection module inspects the Nth chip blocked in the area to be inspected, and proceeds to step S2 or step S3. Step S2: If the Nth chip detected by the machine vision module is a qualified chip, then proceed to step S3; if the Nth chip detected by the machine vision module is a defective chip, then proceed to step S4. Step S3: If the machine vision module sends the result that the Nth chip is a qualified chip to the microcontroller module, the microcontroller module controls the electromagnetic push rod driver module to drive the separation push rod of the flow tube separation device to pop out, and then proceeds to step S5; Step S4: The machine vision module detects that the Nth chip is a defective chip and sends the result to the microcontroller module. The microcontroller module controls the electromagnetic push rod driver module to drive the separation push rod of the flow tube separation device to retract, so that the side door of the chip flow tube opens, and then proceeds to step S6. Step S5: The microcontroller module controls the electromagnetic push rod driver module to drive one end of the blocking push rod of the flow tube blocking device to retract, no longer blocking the Nth chip in the chip flow tube, so that the Nth chip with the test result of qualified chip slides down along the chip flow tube and falls into the plastic packaging tube, and proceeds to step S7. Step S6: The microcontroller module controls the electromagnetic push rod driver module to drive one end of the blocking push rod of the flow tube blocking device to retract, so that the Nth chip in the chip flow tube is no longer blocked, so that the Nth chip with the test result of being a defective chip slides down along the chip flow tube and slides out from the side door of the chip flow tube into the defective chip collection box, and proceeds to step S7. Step S7: The machine vision module detects that the Nth chip has completely slipped out of the detection area, and proceeds to step S8; Step S8: The machine vision module detects that the Nth chip has slipped out of the detection area and sends the result to the microcontroller module. The microcontroller module controls the electromagnetic push rod driver module to drive the blocking push rod of the flow tube blocking device to pop out, and proceeds to step S9. Step S9: The microcontroller module controls the electromagnetic push rod driver module to drive the locking push rod of the flow tube chip locking device to retract, and proceed to step S10; Step S10: All the chips to be tested in the chip flow tube continue to slide downwards, proceeding to step S11; Step S11: The machine vision module detects that the N+1th chip has completely slid into the detection area, and proceeds to step S12; Step S12: The microcontroller module controls the electromagnetic push rod driver module to drive the locking push rod of the flow tube chip locking device to pop out, locking the N+2th chip, and proceed to step S13; Step S13: After the machine vision inspection module inspects the N+1th chip in the area to be inspected, it returns to step S2 or step S3 and executes the cycle based on the inspection result of the machine vision inspection module after inspecting the N+1th chip.

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