A method for disassembling a pin-type sensor and a lifting disassembling tool

Abstract

The application discloses a kind of pin type sensor dismounting method and lifting type dismounting frock, wherein, PGA socket is fixed on PCB board, PGA socket is connected with the pin of pin type sensor, its method includes: install PCB board fixing device on PCB board surface, so that PCB board fixing device and PCB board synchronous movement, force that PCB board fixing device receives is evenly distributed relative to PCB board;The position of fixed PCB board and PCB board fixing device;Multiple force areas are symmetrically distributed along the periphery of pin type sensor, along the fixed direction of the periphery of pin type sensor, sequentially cycle on force area and exert the force that makes pin type sensor separate from PCB board;So that the separation distance of pin type sensor and PCB board is in the set range each time in corresponding force area position;Pin type sensor is separated from PCB board, and pin type sensor is obtained.The application proposes PCB board fixing device and sensor stress structure for different types of PCB board and pin type sensor, and realizes the quick separation of PCB board and sensor.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of sensor disassembly, in particular to a pin-type sensor disassembly method and lifting disassembly tool. BACKGROUND

[0002] Mainstream camera optical sensors adopt a pin-type structure. During the camera internal stacking process, the sensor is connected with the PGA socket. The stability of the connection between the camera sensor and the PGA socket is mainly ensured by the tight fit between the sensor pins and the clamping claws in the PGA socket. Due to the friction, there is a large connection force between the sensor with multiple pins and the PGA socket. During the camera assembly and maintenance process, the pin-type sensor (or referred to as "sensor") needs to be disassembled. In the face of the large connection force between the two and the material properties of the sensor itself such as ceramic and glass, the operator or related tooling equipment cannot separate the sensor from the PGA socket.

[0003] In addition, the disassembly method of the pin-type sensor includes manual separation, which peels off the pin-type sensor from the PGA socket zone by zone or stroke by stroke; or using tooling equipment to separate, forcibly peeling off the pins from the PGA socket under the support of sufficient external force, to separate the PCB board from the pin-type sensor.

[0004] In summary, the existing technology mainly has the following disadvantages:

[0005] (1) There are various forms between the sensor and its corresponding PCB board, and there may be cases where the sensor is difficult to fix and clamp, so it cannot be separated by using existing tooling;

[0006] (2) The force required for sensor separation is about 200N-600N, and the PCB board is made of FR-4 material. In the case of directly applying force, the PCB board is prone to deformation, resulting in PCB board failure or component damage;

[0007] (3) The manual separation disassembly method relies too much on experience, and the disassembly method cannot be adjusted in time during the operation process, causing damage to the PCB board or pins, and the pin-type sensor and the PCB board cannot be quickly separated. SUMMARY

[0008] The present application solves the problem of fixing the sensor by combining the lifting disassembly tool and its method, and proposes the fixing method of the clamping combination and various sensor stress structure for different types of pin-type sensors. In addition, the present application also sets up an auxiliary device to realize the quick separation of the pin-type sensor. In order to achieve the above purpose, the present application proposes the following technical scheme:

[0009] A method for disassembling a pin-type sensor, wherein a PGA socket is fixed on a PCB board, and the PGA socket is connected to the pins of the pin-type sensor, comprising:

[0010] The PCB board fixing device is installed on the surface of the PCB board so that the PCB board fixing device moves synchronously with the PCB board and the force on the PCB board fixing device is evenly distributed relative to the PCB board.

[0011] Fix the position of the PCB board and PCB board fixing device, and keep their positions unchanged;

[0012] Multiple force zones are symmetrically distributed around the pin-type sensor. A force is applied sequentially and cyclically to the force zones along a fixed direction around the pin-type sensor to separate the pin-type sensor from the PCB board. This ensures that the separation distance between the pin-type sensor and the PCB board at the corresponding force zone position is within a set range each time.

[0013] The pin-type sensor is separated from the PCB board to obtain the disassembled pin-type sensor.

[0014] Furthermore, it also includes:

[0015] The magnitude of the force on the force-bearing area is detected, and it is determined whether the force on each force-bearing area each time is within the empirical range;

[0016] If the force on the force-bearing area is outside the empirical range, stop the cyclic separation operation, apply vibration assistance and / or hot air assistance to the force-bearing area, and operate the separation operation of the force-bearing area separately until the force on the force-bearing area is within the empirical range.

[0017] On the other hand, the present invention proposes a lifting-type disassembly fixture for a pin-type sensor, which is used to perform the above-described disassembly method for a pin-type sensor, including:

[0018] A receiving platform is used to fix the PCB board and the PCB board fixing device; the receiving platform is also equipped with auxiliary devices to assist in the separation of the PCB board and the pin-type sensor; the auxiliary devices include a hot air auxiliary device and / or a vibration auxiliary device.

[0019] At least two clamping devices are used to clamp the side of the pin-type sensor; each clamping device moves independently along the separation direction between the pin-type sensor and the PCB board to separate the pin-type sensor from the PCB board; each clamping device is equipped with a pressure sensor.

[0020] The PCB board fixing device is fixedly installed on the surface of the PCB board and coupled to the surface of the PCB board; the PCB board fixing device moves synchronously with the PCB board, so that the separation force on the PCB board fixing device is evenly distributed relative to the PCB board.

[0021] Further, a friction element is arranged at the contact position between the clamping device and the pin-type sensor; the friction element is installed inside the clamping device to increase the friction between the pin-type sensor and the clamping device.

[0022] Further, a sensor force receiving structure is arranged at the contact position between the clamping device and the pin-type sensor; the sensor force receiving structure is coupled with the pin-type sensor, and is used to evenly distribute the force for separating the pin-type sensor from the PCB board, so that the force received by the sensor force receiving structure is evenly distributed relative to the pin-type sensor.

[0023] Further, the PCB board fixing device comprises a needle carving type fixing device, which comprises:

[0024] a base plate, which is provided with a plurality of arrayed threaded holes on the surface, and is provided with a PCB board fixing structure on both sides to fix the position of the PCB board on the base plate;

[0025] a plurality of pressure caps installed inside the base plate; the openings of the pressure caps correspond to the threaded holes, and the upper end of the pressure cap is provided with an external thread which is engaged with the internal thread of the threaded hole to press the lower end of the spring and the ejector pin into the pressure cap;

[0026] the spring installed inside the pressure cap; one end of the spring is installed at the bottom of the pressure cap, and the other end is in contact with the ejector pin, so that the ejector pin has an elastic movement space to assist the contact between the ejector pin and the surface of the PCB board;

[0027] the ejector pin installed inside the pressure cap; the upper end of the ejector pin is in contact with the surface of the PCB board, and the lower end of the ejector pin is in contact with the spring.

[0028] Further, the PCB board fixing device further comprises a device emptying type fixing device;

[0029] the device emptying type fixing device is provided with a fixing hole around it, and a screw passes through the fixing hole to fix the PCB board and the device emptying type fixing device;

[0030] the device emptying type fixing device is provided with a device emptying feature which is coupled with the device on the PCB board to protect the device on the PCB board and evenly distribute the separating force received by the PCB board.

[0031] Further, the sensor force receiving structure comprises a pre-installed structure and a flexible material;

[0032] The flexible material is coupled with the pin type sensor, and the flexible material is provided with a plurality of hole positions corresponding to positions of pins of the pin type sensor;

[0033] The pre-installation structure is arranged below a pinless end of the pin type sensor, and the pre-installation structure is fixedly arranged with the flexible material on both sides of the pin type sensor; and the pre-installation structure is arranged inside the receiving table.

[0034] Further, the sensor stress structure further comprises a suction cup and a suction cup fixing structure.

[0035] One end of the suction cup is arranged on a pinless side of the pin type sensor, and the other end is fixedly arranged on the suction cup fixing structure.

[0036] The suction cup fixing structure is arranged below a pinless end of the pin type sensor; and the suction cup fixing structure is arranged inside the receiving table.

[0037] In another aspect, the application further provides a control system for disassembling a pin type sensor, comprising a control device and the lifting disassembling tool.

[0038] The lifting disassembling tool is used to perform the disassembling method.

[0039] The control device is electrically connected with the pressure sensor and the clamping device respectively, and is used to receive a reading of the pressure sensor and control movement of the clamping device.

[0040] The application has the following advantages:

[0041] (1) The lifting disassembling tool solves the problem that a pin type sensor or a PCB board cannot be fixed due to factors such as structure and material, by adopting a combination fixing mode of a clamping device and a plurality of sensor stress structure members; and the friction element arranged in the clamping device can increase friction between the clamping device and the clamped object (PCB board or sensor), and can also protect the clamped object.

[0042] (2) The PCB board fixing device is fixedly arranged on a surface of the PCB board, uniformly disperses stress of the PCB board, and according to different structures of the PCB board, the device empty type fixing device and the needle carving type fixing device are further provided, so that the PCB board fixing device can fix the PCB board with the maximum contact area, and the components of the PCB board are protected as much as possible, and the PCB board is prevented from being deformed due to stress in the separation process.

[0043] (3) The control system proposed in this invention can ensure that the PCB board and the pin-type sensor are subjected to balanced forces during the disassembly process, avoiding deformation of the PCB board or the pin-type sensor. Under the control of the control system, the disassembly process is standardized and scientific, and the sensor disassembly can be completed quickly. Attached Figure Description

[0044] Figure 1 This is a structural diagram of the bidirectional lifting disassembly fixture of Embodiment 1 of the present invention;

[0045] Figure 2 This is a schematic diagram of the installation of the side clamping device in Embodiment 1 of the present invention;

[0046] Figure 3 This is the present invention. Figure 2 Cross-sectional view;

[0047] Figure 4 This is a structural diagram of the device anti-aircraft fixing device in Embodiment 1 of the present invention;

[0048] Figure 5 This is a schematic diagram of the installation of the needle-carving fixing device and the sensor assembly in Embodiment 1 of the present invention;

[0049] Figure 6 This is the present invention. Figure 5 Enlarged view of point A;

[0050] Figure 7 This is a structural diagram of the support column and the four-corner clamping device in Embodiment 2 of the present invention;

[0051] Figure 8 This is a schematic diagram of the installation of the suction cup device in Embodiment 3 of the present invention;

[0052] Figure 9 This is the present invention. Figure 8 Cross-sectional view;

[0053] Figure 10 This is a schematic diagram of the installation of the flexible material in Embodiment 4 of the present invention;

[0054] Figure 11 This is a cross-sectional view of the installation of the pre-installed structural components in Embodiment 4 of the present invention.

[0055] In the figure: 1-PCB board; 101-PGA socket; 2-pin type sensor; 201-pin; 3-device clearance type fixing device; 301-device clearance feature; 302-fixing hole; 303-PCB board contact part; 304-side; 4-needle carving type fixing device; 401-substrate; 40101-threaded hole; 402-pressing cap; 403-spring; 404-thimble; 5-base; 6-accepting table; 7-first guide rail; 8-first sliding block; 9-second guide rail; 10-second sliding block; 11-screw hand wheel; 12-screw support; 1201-bearing; 13-screw nut; 14-right and left toothed screw; 15-connector; 16-suction disc device; 1601-vacuum sponge suction disc; 1602-suction disc fixing structure; 17-preloading structure; 1701-flexible material; 1702-preloading structure; 18-side clamping device; 19-four corner clamping device; 20-friction element; 21-assisting device. DETAILED DESCRIPTION

[0056] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments.

[0057] A pin type sensor 2 dismounting method, a PGA socket 101 is fixed on a PCB board 1, the PGA socket 101 is connected with a pin 201 of the pin type sensor 2, comprising:

[0058] Install the PCB board fixing device on the surface of the PCB board 1, so that the PCB board fixing device moves synchronously with the PCB board 1, and the force received by the PCB board fixing device is uniformly distributed relative to the PCB board 1;

[0059] Fix the position of the PCB board 1 and the PCB board fixing device, and keep the position unchanged;

[0060] A plurality of force application areas are symmetrically distributed around the pin type sensor 2, and a force for separating the pin type sensor 2 from the PCB board 1 is applied on the force application areas in sequence along the fixing direction around the pin type sensor 2, so that the separation distance between the pin type sensor 2 and the PCB board 1 at the corresponding force application area position is within a set range each time;

[0061] The pin type sensor 2 is separated from the PCB board 1, and a dismounted pin type sensor 2 is obtained.

[0062] Further comprising: detecting the force received by the force application area, and judging whether the force received by each force application area each time is within an experience range;

[0063] If the force on the force-bearing area is outside the empirical range, stop the cyclic separation operation, apply vibration assistance and / or hot air assistance to the force-bearing area, and operate the separation operation of the force-bearing area separately until the force on the force-bearing area is within the empirical range.

[0064] This invention proposes a lifting disassembly fixture for performing the above-described disassembly method, comprising: a receiving platform 6 for fixing a PCB board 1 and a PCB board fixing device; the receiving platform 6 is also equipped with an auxiliary device 21 for assisting in the separation of the PCB board 1 and the pin-type sensor 2; the auxiliary device 21 includes a hot air auxiliary device and / or a vibration auxiliary device; at least two clamping devices clamp the side of the pin-type sensor 2; each clamping device moves independently along the separation direction between the pin-type sensor 2 and the PCB board 1 to separate the pin-type sensor 2 from the PCB board 1; each clamping device is equipped with a pressure sensor. The PCB board fixing device is fixedly mounted on the surface of the PCB board 1 and coupled to the surface of the PCB board 1; the PCB board fixing device moves synchronously with the PCB board 1, so that the separation force on the PCB board fixing device is evenly distributed relative to the PCB board 1.

[0065] A friction element 20 is provided at the contact point between the clamping device and the pin-type sensor 2. The friction element 20 is installed inside the clamping device to increase the friction between the pin-type sensor 2 and the clamping device. A sensor force-bearing structure is also provided at the contact point between the clamping device and the pin-type sensor 2. The sensor force-bearing structure is coupled to the pin-type sensor 2 and is used to evenly distribute the force of separation between the pin-type sensor 2 and the PCB board 1, so that the force on the sensor force-bearing structure is evenly distributed relative to the pin-type sensor 2. Example 1

[0066] like Figure 1 As shown, a receiving platform 6 is fixedly installed in the middle of the base 5. The receiving platform 6 is used to fix the PCB board 1 and the PCB board fixing device. The receiving platform 6 is also equipped with an auxiliary device 21 for assisting in the disassembly of the PCB board 1 and the pin-type sensor 2. The auxiliary device 21 includes a hot air auxiliary device and / or a vibration auxiliary device. The number of auxiliary devices 21 can be increased or decreased according to actual needs. The installation position of the auxiliary device 21 can be adjusted according to actual needs. In addition to being installed on the side of the receiving platform 6, it can also be combined with the clamping device or the second guide rail 9.

[0067] The first guide rail 7 and the second guide rail 9 are symmetrically installed on both sides of the base 5, the first guide rail 7 is symmetrically installed with two first sliding blocks 8 along the receiving table 6, and the first sliding block 8 moves horizontally along the first guide rail 7. The second guide rail 9 is fixedly installed on the inner side of the first guide rail 7, and the second guide rail 9 is symmetrically distributed around the receiving table 6; the second guide rail 9 is installed with a second sliding block 10, and the second sliding block 10 moves up and down along the second guide rail 9, so that the PCB board 1 is separated from the pin type sensor 2. The second sliding block 10 is connected with the first sliding block 8 through the connecting piece 15, and the first sliding block 8 moves horizontally along the first guide rail 7 to drive the second sliding block 10 to move up and down along the second guide rail 9.

[0068] As shown in Figure 2 and Figure 3 , one side clamping device 18 is installed on the inner side of the two symmetrically arranged second sliding blocks 10, and the side clamping device 18 clamps the side of the pin type sensor 2. The two symmetrically arranged second sliding blocks 10 drive a side clamping device 18 to move along the direction of separation of the PCB board 1 and the pin type sensor 2, so that the PCB board 1 is separated from the pin type sensor 2. The side clamping device 18 is installed with a pressure sensor, which is used to detect the separation force of the side clamping device 18 in the separation process. The side clamping device 18 is provided with a friction element 20 at the contact position with the pin type sensor 2, and the friction element 20 is used to increase the friction between the pin type sensor and the side clamping device 18.

[0069] The transmission form of the pin type sensor 2 and the PCB board 1 to realize separation can be through structures such as levers, lead screws, cams and gears. The embodiment adopts a reverse tooth lead screw 14 to realize the synchronous motion of the side clamping device 18, and is matched with a transmission device to realize the synchronous motion of the reverse tooth lead screw 14. As shown in Figure 1 , the transmission device includes a lead screw hand wheel 11, a reverse tooth lead screw 14, a lead screw nut 13 and a lead screw support seat 12.

[0070] The screw hand wheel 11 is arranged outside the screw support seat 12 and drives the positive and negative tooth screw 14 to rotate. The number of the screw hand wheel 11 can be adjusted according to actual needs; the screw hand wheel 11 can be manually controlled or electrically controlled or controlled in other ways according to actual conditions. The screw support seat 12 is arranged at both ends of the positive and negative tooth screw 14 in the horizontal direction; the screw support seat 12 is internally provided with a bearing 1201 for supporting and fixing the positive and negative tooth screw 14, and the inner hole of the bearing 1201 is tightly matched with the outer circle of the positive and negative tooth screw 14. The screw nut 13 is fixedly installed between the first sliding blocks 8 and drives the first sliding blocks 8 to move synchronously in the horizontal direction of the first guide rail 7; the screw nut 13 internally accommodates the positive and negative tooth screw 14. The positive and negative tooth screw 14 is arranged in the same direction as the first guide rail 7; the positive and negative tooth screw 14 rotates and drives the screw nut 13 to move horizontally. The positive and negative tooth screw 14 rotates, and the movement directions of the two screw nuts 13 can be arranged to be opposite or reverse.

[0071] The PCB fixing device is fixedly installed on the surface of the PCB 1 and is coupled with the surface of the PCB 1; the PCB fixing device moves synchronously with the PCB 1, so that the separation force received by the PCB fixing device is uniformly distributed relative to the PCB 1. The PCB fixing device provided in the embodiment includes a device-avoiding fixing device 3 as shown in Figure 4 The device-avoiding fixing device 3 can be installed on any face of the PCB 1.

[0072] The size of the device-avoiding fixing device 3 is greater than that of the PCB 1 to be separated, and the device-avoiding fixing device 3 is provided with fixing holes 302 around the device-avoiding fixing device 3, the fixing holes 302 are matched with screws and are used for fixing the PCB 1 and the device-avoiding fixing device 3. The device-avoiding fixing device 3 is provided with a device-avoiding feature 301, which is used for protecting the components on the PCB 1 on one hand and increasing the contact area between the PCB contact part 303 of the device-avoiding fixing device 3 and the PCB 1 as much as possible through the design of the hole to prevent the PCB 1 from being deformed due to stress on the other hand. The side surface 304 arranged around the device-avoiding fixing device 3 is matched with the contact part of the clamping device. Referring to Figure 1 The device-avoiding fixing device 3 can be coupled with any face of the PCB 1, and the PCB 1 and the device-avoiding fixing device 3 are fixedly installed by screws.

[0073] The embodiment also provides a PCB fixing device, which includes, as shown in Figure 5 and Figure 6The pin-engraving type fixing device 4 is shown. The pin-engraving type fixing device 4 includes a base plate 401, pressure caps 402, ejector pins 404, and springs 403. PCB board fixing structures are provided on both sides of the base plate 401 to fix the position of the PCB board 1 on the pin-engraving type fixing device 4; the surface of the base plate 401 has a plurality of arrayed threaded holes 40101. A plurality of pressure caps 402 are installed inside the base plate 401, the openings of which correspond to the threaded holes 40101. The upper end of the pressure cap 402 has an external thread, which engages with the internal thread of the threaded hole 40101 to press the springs 403 and the lower ends of the ejector pins into the pressure caps 402. The pressure caps 402 contain springs 403 and ejector pins 404; one end of the spring 403 is installed at the bottom of the pressure cap 402, and the other end contacts the ejector pin 404; the spring 403 provides elastic movement space for the ejector pin 404, assisting the ejector pin 404 in contacting the PCB board 1. The lower end of ejector pin 404 is in contact with spring 403, and the upper end of ejector pin 404 is in contact with the surface of PCB board 1.

[0074] like Figure 5 As shown, the external thread of the pressure cap 402 engages with the internal thread of the pin-engraved fixing device 4, pressing the lower ends of the spring 403 and the ejector pin 404 into the cavity. The ejector pin 404 itself has flexible movement and movement space, so that it can bear force for different components on the surface of the PCB board 1, making the force on the PCB board 1 more uniform.

[0075] Based on the above-described lifting disassembly fixture, the disassembly method applicable to this embodiment is as follows:

[0076] A PCB board fixing device is fixedly installed on the surface of PCB board 1 (select device clearance device 3 or pin-engraving type fixing device 4 according to the structure of PCB board 1). The PCB board 1 to be separated and the pin-type sensor 2 are placed on the receiving platform 6, and the PCB board 1 and the PCB board fixing device are fixed on the receiving platform 6.

[0077] The pin-type sensor 2 is clamped and fixed by the side clamping device 18, ensuring that the fixing points of the side clamping device 18 on the side of the pin-type sensor 2 are all force areas of the pin-type sensor 2. Driven by the transmission device, the two side clamping devices 18 move sequentially in the same direction, cyclically applying a force to the side of the pin-type sensor 2 to separate it from the PCB board 1, ensuring that the separation distance between the pin-type sensor 2 and the PCB board 1 at each corresponding force area position is within a set range. This set range is based on empirical observations of the separation distance between the PCB board 1 and the pin-type sensor 2 under different force conditions for various models of pin-type sensors 2.

[0078] The movement process of the side clamping device 18 driven by the transmission device is as follows: rotating the screw handle 11, the screw 14 rotates accordingly, the screw nuts 13 on both sides convert the rotation into movement, driving the same direction movement of the first sliding blocks 8 on both sides of the screw nuts 13. During the movement of the first sliding blocks 8 along the first guide rails 7 away from the receiving table 6, the second sliding blocks 10 are driven to move along the second guide rails 9 by the connecting pieces 15, and the side clamping device 18 and the pin-type sensor 2 are synchronously and directionally moved by the second sliding blocks 10.

[0079] The force received by the force receiving area is detected by the pressure sensor installed on the side clamping device 18, and it is judged whether the force received by each force receiving area each time is within the experience range; the experience range is the force value range of the force receiving area summarized according to the disassembly experience of each type of pin-type sensor 2.

[0080] If the force received by the force receiving area is not within the experience range, stop the cycle separation operation, apply vibration assistance and / or hot air assistance to the force receiving area, and separately operate the separation operation of the force receiving area until the force received by the force receiving area is within the experience range. Continue the cycle operation to separate the pin-type sensor 2 from the PCB board 1 to obtain the disassembled pin-type sensor 2.

[0081] The clamping object of the side clamping device 18 in the embodiment is only taken as an example of clamping the pin-type sensor 2, and the pin-type sensor 2 can also be fixed on the receiving table 6, and the side clamping device 18 clamps the PCB board fixing device to perform lifting operation, realizing the separation of the PCB board 1 and the pin-type sensor 2. In the embodiment, the moving direction of the pin-type sensor 2 driven by the side clamping device 18 during the separation process can be set as upward movement or downward movement along the second guide rail 9, which can be changed according to actual conditions. Embodiment 2

[0082] Based on the embodiment 1, the side clamping device 18 between the two symmetrical second sliding blocks 10 is replaced by a four-corner clamping device 19, which is arranged on the inner side of each second sliding block 10, as shown in Figure 7 The four corners of the pin-type sensor 2 are clamped, and the force for separating the pin-type sensor 2 from the PCB board 1 is sequentially applied around the pin-type sensor 2, realizing the separation of the PCB board 1 and the pin-type sensor 2.

[0083] The disassembly method of the pin-type sensor 2 based on the embodiment is as follows:

[0084] The PCB board fixing device (the device avoiding space 3 or the needle carving type fixing device 4 is selected according to the structure of the PCB board 1) is fixedly installed on the surface of the PCB board 1, the PCB board 1 and the pin-type sensor 2 to be separated are placed on the receiving table 6, and the PCB board 1 and the PCB board fixing device are fixed on the receiving table 6.

[0085] The four-corner clamping device 19 clamps and fixes the pin-type sensor 2, so that the fixed points of the four-corner clamping device 19 around the pin-type sensor 2 are the force application areas of the pin-type sensor 2. The four four-corner clamping devices 19 are sequentially moved downward clockwise under the driving of the transmission device, and sequentially apply a force to the pin-type sensor 2 around the pin-type sensor 2 to separate the pin-type sensor 2 from the PCB 1, so that the separation distance between the pin-type sensor 2 and the PCB 1 at the corresponding force application area position is within a set range. The set range is based on the experience summary of the separation distance between the PCB 1 and the pin-type sensor 2 under different force conditions of various models of pin-type sensors.

[0086] The movement process of the transmission device driving the four-corner clamping device 19 is as follows: rotating the lead screw handle 11, the lead screw 14 rotates accordingly, the screw nuts 13 on both sides convert the rotation into movement, and drive the same direction movement of the first sliding blocks 8 on both sides of the screw nuts 13. During the movement of the first sliding blocks 8 away from the receiving table 6 along the first guide rail 7, the second sliding blocks 10 are driven to move along the second guide rail 9 through the connecting piece 15, and the four-corner clamping device 19 and the pin-type sensor 2 are synchronously and directionally moved by the second sliding blocks 10.

[0087] The force applied to the force application area is detected by using the pressure sensor installed on the four-corner clamping device 19, to determine whether the force applied to each force application area each time is within the experience range; the experience range is the force value range of the force application area summarized based on the disassembly experience of various models of pin-type sensors 2.

[0088] If the force applied to the force application area is not within the experience range, stop the cycle separation operation, apply vibration assistance and / or hot air assistance to the force application area, and separately operate the separation operation of the force application area until the force applied to the force application area is within the experience range. Continue the cycle operation to separate the pin-type sensor 2 from the PCB 1, and obtain the disassembled pin-type sensor 2.

[0089] In the embodiment, the clamping object of the four-corner clamping device 19 is only taken as an example of clamping the pin-type sensor 2. The pin-type sensor 2 can also be fixed on the receiving table 6, and the four-corner clamping device 19 clamps the PCB fixing device to perform lifting operation, to realize the separation of the PCB 1 and the pin-type sensor 2. In the embodiment, the moving direction of the four-corner clamping device 19 driving the pin-type sensor 2 during the separation process can be set as upward movement or downward movement along the second guide rail 9, which can be changed according to actual conditions.

[0090] The disassembly method of the embodiment is to change the two-side cyclic lifting into four-corner cyclic lifting. When judging the problematic clamping area, the embodiment is more explicit, and compared with the whole-side adjustment of the pin-type sensor 2 in Embodiment 1, it is simpler to directly adjust the stress difference of the pin-type sensor 2, and is more conducive to balancing the stress of the pin-type sensor 2. Embodiment 3

[0091] On the basis of the above embodiments, when the pin-type sensor 2 side or periphery is not easy to fix, the embodiment proposes a suction cup device 16 as shown in Figure 8 and Figure 9 , which includes a vacuum sponge suction cup 1601 and a suction cup fixing structure 1602. One end of the vacuum sponge suction cup 1601 is installed on the side of the pin-type sensor 2 without pins 201, and the other end is fixedly installed on the suction cup fixing structure 1602. The suction cup fixing structure 1602 is installed below one end of the pin-type sensor 2 without pins 201.

[0092] The embodiment takes the suction cup device 16 as a lifting-type disassembly tool for the sensor stress structure, and the working principle is as follows:

[0093] The PCB board fixing device (device avoiding space 3 or needle carving type fixing device 4 according to the structure of the PCB board 1) is fixedly installed on the surface of the PCB board 1, and the PCB board 1 and the pin-type sensor 2 to be separated are placed on the receiving table 6.

[0094] The movement of the suction cup device 16 cooperating with the clamping device to separate the PCB board 1 and the pin-type sensor 2 has the following two cases:

[0095] First, the clamping device clamps and fixes the pin-type sensor 2: the PCB board 1 and the PCB board fixing device are fixed on the receiving table 6. The pin-type sensor 2 is fixed by the vacuum sponge suction cup 1601, and the suction cup fixing device 1602 is placed in the receiving table 6. The clamping device clamps and fixes the pin-type sensor 2, so that the clamping device at the fixed points of the pin-type sensor 2 is the force area of the pin-type sensor 2. The clamping device is driven by the transmission device and moves downward in turn clockwise, and applies a force to separate the pin-type sensor 2 and the PCB board 1 around the pin-type sensor 2 in turn, so that the separation distance between the pin-type sensor 2 and the PCB board 1 at the corresponding force area position each time is within the set range. The set range is based on the experience summary of the separation distance between the PCB board 1 and the pin-type sensor 2 under different stress conditions of each type of pin-type sensor 2.

[0096] The movement process of the transmission device driving the clamping device is as follows: rotating the lead screw handle 11, the right and left threaded lead screws 14 are rotated, the right and left lead screw nuts 13 convert the rotation into movement, and drive the right and left first sliding blocks 8 of the lead screw nuts 13 to move in the same direction. In the movement process of the first sliding block 8 along the first guide rail 7 away from the receiving table 6, the second sliding block 10 is driven to move along the second guide rail 9 through the connecting piece 15, and the second sliding block 10 drives the clamping device and the pin-type sensor 2 to move in the same direction.

[0097] The second, the clamping device clamps the PCB board fixing device: the pin-type sensor 2 is fixed by using the vacuum sponge suction cup 1601, and the suction cup fixing device 1602 is placed in the receiving table 6. The suction cup device 16 is in the receiving table 6, and the vacuum sponge suction cup 1601 drives the pin-type sensor 2 to move downward or fixes the position of the pin-type sensor 2 in the receiving table 6. The clamping device clamps the PCB board fixing device, so that the fixed points of the clamping device on the PCB board fixing device are the force application areas of the PCB board 1. The clamping device is driven by the transmission device to move upward in turn in a clockwise direction, and the force applied to the periphery of the PCB board fixing device is used to separate the pin-type sensor 2 from the PCB board 1, so that the separation distance between the pin-type sensor 2 and the PCB board 1 at each force application area is within a set range. The set range is based on the experience of the separation distance between the PCB board 1 and the pin-type sensor 2 under different force conditions of various types of pin-type sensors 2.

[0098] The movement process of the transmission device driving the clamping device is as follows: rotating the lead screw handle 11, the right and left threaded lead screws 14 are rotated, the right and left lead screw nuts 13 convert the rotation into movement, and drive the right and left first sliding blocks 8 of the lead screw nuts 13 to move in the same direction. In the movement process of the first sliding block 8 along the first guide rail 7 away from the receiving table 6, the second sliding block 10 is driven to move along the second guide rail 9 through the connecting piece 15, and the second sliding block 10 drives the clamping device and the pin-type sensor 2 to move in the same direction.

[0099] The force applied to the force application area is detected by using the pressure sensor installed in the clamping device, and it is judged whether the force applied to each force application area at each time is within the experience range; the experience range is the force range of the force application area summarized based on the disassembly experience of various types of pin-type sensors 2.

[0100] If the force applied to the force application area is not within the experience range, the cycle separation operation is stopped, vibration assistance and / or hot air assistance is applied to the force application area, and the separation operation of the force application area is operated alone until the force applied to the force application area is within the experience range. Continue the cycle operation to separate the pin-type sensor 2 from the PCB board 1 to obtain the disassembled pin-type sensor 2.

[0101] The clamping device in this embodiment includes a side clamping device 18 and a four-corner clamping device 19. The clamping object can be set as a PCB board fixing device or a pin type sensor 2. The moving direction of the clamping device separation process in this embodiment can be set or changed according to actual conditions.

[0102] The vacuum sponge suction cup 1601 in this embodiment can also be replaced by other types of suction cups according to actual needs. Compared with embodiment 1 and embodiment 2, the fixing of the pin type sensor 2 is increased inside the receiving table 6, and the PCB board 1 and the pin type sensor 2 are more convenient to separate through the bidirectional force applying mode. In addition, the suction cup device 16 is installed on the side of the pin type sensor 2 without the pin 201, which avoids damage to the pin 201 due to improper operation or uneven force. Embodiment 4

[0103] As shown in Figure 10 and Figure 11 , on the basis of embodiment 3, the suction cup device 16 is replaced by a pre-installed structural part 17, which includes a pre-installed structure 1702 and a flexible material 1701.

[0104] The flexible material 1701 is coupled with the pin type sensor 2, and the flexible material 1701 has a plurality of hole positions designed to correspond to the positions of the pins 201 of the pin type sensor 2. Before the PCB board 1 and the pin type sensor 2 are assembled, the flexible material 1701 passes through the pins 201 and is installed on the surface of the pin type sensor 2; the size of the flexible material 1701 is larger than that of the pin type sensor 2, and there is flexible material 1701 on both sides of the pin type sensor 2, and the flexible material 1701 is fixedly connected with the pre-installed structure 1702, and the flexible material 1701 is provided with a stress hole, and the force for separating the PCB board 1 and the pin type sensor 2 can separate the PCB board 1 and the pin type sensor 2.

[0105] The pre-installed structure 1702 is installed below the end of the pin type sensor 2 without the pin 201, and the pre-installed structure 1702 is fixedly installed with the flexible material 1701 on both sides of the pin type sensor 2; the pre-installed structure 1702 is placed inside the receiving table 6.

[0106] The pre-installed structure 1702 is installed below the end of the pin type sensor 2 without the pin 201, and the pre-installed structure 1702 is fixedly installed with the flexible material 1701 on both sides of the pin type sensor 2; the pre-installed structure 1702 is placed inside the receiving table 6.

[0107] The pre-installed structure 1702 is installed below the end of the pin type sensor 2 without the pin 201, and the pre-installed structure 1702 is fixedly installed with the flexible material 1701 on both sides of the pin type sensor 2; the pre-installed structure 1702 is placed inside the receiving table 6.

[0108] The force-receiving holes on both sides of the flexible material 1701 are installed in the clamping device, so that the clamping device is at the force-receiving area of the flexible material 1701 at the fixed points of the force-receiving holes. The clamping device is driven by the transmission device to move downward in turn clockwise, and the force that separates the pin-type sensor 2 from the PCB board 1 is applied in turn at the fixed points of the force-receiving holes, so that the separation distance between the pin-type sensor 2 and the PCB board 1 at the corresponding force-receiving area position is within the set range each time. The set range is based on the experience summary of the separation distance between the PCB board 1 and the pin-type sensor 2 under different force conditions for different models of pin-type sensors 2.

[0109] The movement process of the transmission device driving the clamping device is as follows: rotating the lead screw handle 11, the lead screw with reverse teeth 14 is rotated, the two side lead screw nuts 13 convert the rotation into movement, driving the same direction movement of the first sliding blocks 8 on both sides of the lead screw nuts 13. During the movement of the first sliding blocks 8 along the first guide rails 7 away from the receiving table 6, the second sliding blocks 10 are driven to move along the second guide rails 9 through the connecting pieces 15, and the second sliding blocks 10 drive the clamping device and the pin-type sensor 2 to move synchronously and in the same direction.

[0110] The force received by the force-receiving area is detected by using the pressure sensor installed in the clamping device to determine whether the force received by each force-receiving area each time is within the experience range; the experience range is the force value range of the force-receiving area summarized based on the disassembly experience of different models of pin-type sensors 2.

[0111] If the force received by the force-receiving area is not within the experience range, stop the cyclic separation operation, apply vibration assistance and / or hot air assistance to the force-receiving area, and separately operate the separation operation of the force-receiving area until the force received by the force-receiving area is within the experience range. Continue the cyclic operation to separate the pin-type sensor 2 from the PCB board 1 to obtain the disassembled pin-type sensor 2.

[0112] The clamping device in this embodiment includes side clamping devices 18 and four-corner clamping devices 19. The clamping object can be set as the PCB board fixing device or the pin-type sensor 2. The movement direction of the clamping device during the separation process can be set or changed according to actual conditions.

[0113] Compared with embodiment 3, the pre-installed flexible material 1701 in this embodiment ensures the absolute fixation of the pin-type sensor 2 and is suitable for the separation of various pin-type sensors 2; and avoids the case that the pin-type sensor 2 cannot be fixed by the vacuum sponge sucker 1601 from the bottom due to material or other problems.

[0114] The application further provides a control system for dismounting the pin type sensor 2, comprising a control device and the lifting dismounting tool as described in the above embodiments.

[0115] The lifting dismounting tool of the application solves the problem that the pin type sensor 2 or the PCB 1 cannot be fixed or clamped due to structure, material and other problems by using the combination of the clamping device and the stress structure of the sensor; the friction element 20 arranged in the clamping device can increase the friction between the sensor assembly and the clamping device and protect the sensor assembly. The application provides the PCB fixing device which is fixedly installed on the surface of the PCB 1 and uniformly disperses the stress of the PCB 1; the device clearance type fixing device 3 and the needle carving type fixing device 4 are also provided, and the PCB fixing device is designed according to the different structures of the PCB 1, so that the PCB fixing device can fix the PCB 1 with the maximum contact area, protect the components of the PCB 1 as much as possible, and prevent the PCB 1 from being deformed due to stress in the separation process. The control system of the application can ensure that the stress of the PCB 1 and the pin type sensor 2 is balanced during the dismounting process, and avoid the deformation of the PCB 1 or the pin type sensor 2. Under the control of the control system, the above dismounting process is standardized and scientific, and the dismounting of the sensor can be quickly completed.

[0116] The technical features of the above embodiments can be combined arbitrarily, and to make the description concise, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combination of the technical features does not exist contradictory, it should be considered as the scope of the present application.

[0117] The above embodiments are only used to illustrate the technical solutions of the application, and not to limit the application; although the application has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions recorded in the above embodiments can be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the application.

Claims

1. A method for disassembling a pin type sensor, a PGA socket is fixed on a PCB board, the PGA socket is connected with a pin of the pin type sensor, characterized in that, The application relates to a pin sensor dismounting device and a pin sensor dismounting method. The PCB board fixing device is fixed on the surface of the PCB board and moves synchronously with the PCB board, and the force borne by the PCB board fixing device is uniformly distributed relative to the PCB board. The positions of the PCB board and the PCB board fixing device are fixed, and the positions are kept unchanged. A plurality of force application areas are symmetrically distributed around the pin sensor, and a force for separating the pin sensor from the PCB board is cyclically applied on the force application areas along the fixed direction around the pin sensor. The separation distance between the pin sensor and the PCB board at each corresponding force application area is within a set range. The pin sensor is separated from the PCB board, and a dismounted pin sensor is obtained. The application further relates to a pin sensor dismounting device. The force borne by the force application area is detected, and whether the force borne by each force application area is within an experience range is judged. If the force borne by the force application area is not within the experience range, the cyclic separation operation is stopped, vibration assistance and / or hot air assistance is applied to the force application area, and the separation operation of the force application area is independently operated until the force borne by the force application area is within the experience range.

2. A lift-off tool for a pin sensor, characterized in that The tool is used for performing the pin sensor dismounting method of claim 1, and comprises: A receiving table is used for fixing the PCB board and the PCB board fixing device, and the receiving table is further provided with an auxiliary device used for assisting the separation operation of the PCB board and the pin sensor; the auxiliary device comprises a hot air auxiliary device and / or a vibration auxiliary device. At least two clamping devices are used for clamping the side of the pin sensor; each clamping device is independently moved along the separation direction of the pin sensor and the PCB board, so that the pin sensor is separated from the PCB board; and the clamping device is provided with a pressure sensor. The PCB board fixing device is fixedly arranged on the surface of the PCB board and is coupled with the surface of the PCB board; the PCB board fixing device moves synchronously with the PCB board, so that the separation force borne by the PCB board fixing device is uniformly distributed relative to the PCB board.

3. The raised disassembly tool for a pin-type sensor according to claim 2, characterized by, A friction element is arranged at the contact position of the clamping device and the pin sensor; the friction element is arranged in the inner side of the clamping device and is used for increasing the friction force between the pin sensor and the clamping device.

4. The raised disassembly tool for a pin-type sensor according to claim 3, characterized by, A sensor force bearing structure is further arranged at the contact position of the clamping device and the pin sensor; the sensor force bearing structure is coupled with the pin sensor, and the sensor force bearing structure is used for uniformly dispersing the separation force of the pin sensor and the PCB board, so that the force borne by the sensor force bearing structure is uniformly distributed relative to the pin sensor.

5. The raised disassembly tool for a pin-type sensor according to claim 4, characterized in that, The PCB board fixing device comprises a needle carving type fixing device, and the needle carving type fixing device comprises: A base plate is provided with a plurality of array type threaded holes on the surface, and the two sides of the base plate are provided with PCB board fixing structures used for fixing the positions of the PCB board on the base plate. A plurality of pressing caps are arranged in the inner side of the base plate; the openings of the pressing caps correspond to the threaded holes, the upper ends of the pressing caps are provided with external threads, the external threads are engaged with the internal threads of the threaded holes, and the pressing caps are used for pressing the lower ends of springs and ejector pins into the inner side of the pressing caps. The spring is installed inside the pressure cap; one end of the spring is installed at the bottom of the pressure cap, and the other end is in contact with the thimble, so that the thimble has a flexible moving space, which helps the thimble contact the surface of the PCB board; The thimble is installed inside the pressure cap; the upper end of the thimble is in contact with the surface of the PCB board, and the lower end of the thimble is in contact with the spring.

6. The raised disassembly tool for a pin-type sensor according to claim 4, wherein The PCB board fixing device further comprises a device emptying fixing device; The device emptying fixing device is provided with a fixing hole around it, and a screw passes through the fixing hole to fix the PCB board and the device emptying fixing device; The device emptying fixing device is provided with a component emptying feature, which is coupled with the components of the PCB board, for protecting the components on the PCB board and uniformly dispersing the separating force received by the PCB board.

7. The raised disassembly tool for a pin-type sensor according to claim 4, wherein The sensor stress structure comprises a preloading structure and a flexible material; The flexible material is coupled with the pin type sensor, and the flexible material has a plurality of hole positions designed, which correspond to the positions of the pins of the pin type sensor; The preloading structure is installed below the end of the pin type sensor without pins, and the preloading structure is fixedly installed with the flexible materials on both sides of the pin type sensor; the preloading structure is placed inside the receiving table.

8. The raised disassembly tool for a pin-type sensor according to claim 4, wherein The sensor stress structure further comprises a suction disc and a suction disc fixing structure; One end of the suction disc is installed on one side of the pin type sensor without pins, and the other end is fixedly installed on the suction disc fixing structure; The suction disc fixing structure is installed below the end of the pin type sensor without pins; the suction disc fixing structure is placed inside the receiving table.

9. A control system for disassembling a pin-type sensor, characterized in that, The control device and the lifting dismounting tool according to any one of claims 2 to 8 are included; The lifting dismounting tool is used to perform the dismounting method according to claim 1; The control device is electrically connected with the pressure sensor and the clamping device respectively, for receiving the readings of the pressure sensor and controlling the movement of the clamping device.

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