Exposure method of gantry double-sided lithography system

Abstract

The application discloses a kind of exposure methods of gantry double-sided photoetching system, comprising the following steps: assemble PCB assembly, and PCB assembly is placed to gantry upper platform;Gantry upper platform is moved to the position of CCD component, and the alignment camera of upper and lower sides is positioned simultaneously on the upper and lower sides of PCB;Gantry upper platform is moved to the position of photoetching component, and the photoetching lens of upper and lower sides is photoetched simultaneously on the upper and lower sides of PCB;The PCB assembly on the photoetched gantry upper platform returns to original position, and the PCB assembly on the photoetched gantry lower platform repeats steps 1-3 and is photoetched, and the photoetching system of the application only needs to increase a station on the side of equipment, and the photoetching work of two platforms can be crossed;And photoetching component and CCD component are set in upper and lower two, so that two sides photoetching work can be carried out simultaneously on PCB.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of double-sided photolithography, and particularly relates to an exposure method of a double-sided photolithography system of a gantry. BACKGROUND

[0002] A double-sided photolithography machine and a double-sided photolithography method are disclosed in Chinese patent CN108873621B. The double-sided photolithography machine comprises a mounting frame, a first photolithography assembly and a second photolithography assembly arranged on the two sides of the mounting frame respectively, a first loading table and a second loading table, and a driving mechanism. The driving mechanism comprises a driving assembly. The first loading table and the second loading table pass through a photolithography area in a first motion state and a second motion state respectively. When photolithography is performed, the first loading table moves in a first circular trajectory and passes through the photolithography area in the first motion state to perform photolithography on a first piece to be photolithographed, and the second loading table moves in a second circular trajectory and passes through the photolithography area in the second motion state to perform photolithography on a second piece to be photolithographed. The first loading table and the second loading table both move circularly, and the second piece to be photolithographed can be unloaded or the next first piece to be photolithographed can be loaded when photolithography is performed on the second piece to be photolithographed.

[0003] However, in the prior art, the double-sided photolithography machine with a cantilever double-table face has a single-side support working mode. When photolithography is performed, if the weight of the PCB is too large, the PCB will shake and tilt. The PCB is directly placed for double-sided photolithography, and the two sides of the PCB will be curled.

[0004] In addition, manual pressing or cylinder pressing is used to move the PCB up and down for pressing. Manual pressing is time-consuming and laborious. Automatic pressing requires the PCB to be moved to a specified position, stopped, and pressed. This affects the photolithography rhythm of the PCB. SUMMARY

[0005] The present application aims to solve the problems in the background art and provides an exposure method of a double-sided photolithography system of a gantry.

[0006] The purpose of the present application can be achieved by the following technical solutions:

[0007] An exposure method of a double-sided photolithography system of a gantry, comprising the following steps:

[0008] Step 1: Assemble the PCB assembly and place the PCB assembly on the upper platform of the gantry.

[0009] Step 2: Move the upper platform of the gantry to the position of the CCD assembly, and position the upper and lower surfaces of the PCB simultaneously through the alignment cameras on the upper and lower sides.

[0010] Step 3: move the gantry upper platform to the position of the photoetching assembly, and simultaneously photoetch the upper and lower surfaces of the PCB by the photoetching lenses on the upper and lower sides;

[0011] Step 4: return the photoetched PCB assembly on the gantry upper platform to the original position, and repeat steps 1-3 to photoetch the PCB assembly on the gantry lower platform.

[0012] As a further scheme of the present application, in step 1, the PCB assembly is assembled in the order of the upper glass plate, the PCB, and the lower glass plate from low to high.

[0013] As a further scheme of the present application, in step 2, the upper and lower CCD assemblies are moved along the X and Z axes by the moving module to adjust the horizontal and height positions and to be positioned.

[0014] As a further scheme of the present application, in step 3, the upper and lower photoetching assemblies are moved along the X and Z axes by the moving module to adjust the horizontal and height positions and to be photoetched.

[0015] As a further scheme of the present application, in step 2, the upper glass plate on the gantry upper platform is pressed during the movement of the gantry upper platform.

[0016] As a further scheme of the present application, the pressing process is as follows:

[0017] First, when moving to the pressing mechanism position, the pressing plate contacts the pulley, and as the platform moves, the pulley moves along the arc surface of the pressing plate to the bottom surface of the pressing plate, thereby moving the driving column downward, so that the pressing roller also moves downward and acts on the PCB assembly to perform the pressing work. As the platform moves, the pressing roller fully presses the PCB assembly. Finally, as the platform moves, the pressing plate separates from the pulley, the pressing mechanism is reset, and the next PCB assembly is pressed.

[0018] As a further scheme of the present application, when the upper glass plate is pressed and then photoetched, the driving motor is started to rotate the base, switch the loading and unloading assembly and the pressing roller, and make the loading and unloading assembly be directly below.

[0019] As a further scheme of the present application, in step 4, when the photoetching of the PCB on the gantry upper platform is completed, the PCB assembly moves to the initial position, and then moves to the position of the pressing mechanism. At this time, the lifting cylinder is controlled to move the mounting plate downward, so that the suction cup is adsorbed, the lifting cylinder is reset to the original height, the upper glass plate is removed, and at the same time, the PCB assembly returns to the loading position.

[0020] As a further scheme of the present application: start the double-shaft cylinder to work, drive the telescopic rod to extend through the movable rod, so that the adsorbed upper glass plate moves to the position close to the PCB assembly loading station, i.e. to the front of the pressing mechanism.

[0021] As a further scheme of the present application: when the next group of PCB assemblies is subjected to photoetching, the upper glass plate is moved to be adsorbed, the upper glass plate is placed on the PCB plate through the lifting cylinder, then the double-shaft cylinder is controlled to contract, so that the telescopic rod is contracted into the mounting groove of the base, and the driving motor is controlled, so that the pressing roller is at the bottom, and waits for the pressing work on the next group of PCB assemblies.

[0022] The present application has the following beneficial effects:

[0023] The photoetching system of the present application only needs to increase a station on one side of the equipment, and can realize the cross photoetching work on two platforms, thereby improving the photoetching work amount of the PCB plate; and the upper and lower photoetching assemblies and CCD assemblies are respectively arranged, so that the two-side photoetching work on the PCB plate can be performed at the same time, thereby improving the photoetching efficiency of the PCB plate.

[0024] The pressing mechanism of the present application uses the movement of the PCB plate during photoetching as a power source to realize the descending pressing work of the pressing roller of the pressing mechanism, has the advantages of energy saving and high efficiency, and two groups of the pressing mechanism are cooperated with each other to realize the comprehensive pressing on the PCB plate, has the advantage of good pressing effect, and the pressing work can be realized by using the movement time of the PCB plate, thereby effectively saving the photoetching time.

[0025] The base of the present application connects the pressing mechanism and the loading and unloading mechanism together to realize the pressing work and the taking of the upper glass plate on the PCB plate, and the two mechanisms are respectively automatically operated, thereby greatly saving the manpower, and the two mechanisms are switched according to the rhythm of the photoetching process of the PCB plate, so that they can work in order; and the loading and unloading mechanism is provided with the telescopic rod, so that the loading and unloading mechanism has the advantage of convenient contraction, and occupies a small space of the equipment. BRIEF DESCRIPTION OF DRAWINGS

[0026] The present application will be further described below with reference to the drawings.

[0027] Figure 1 is a structure schematic view of the upper and lower gantry type platform photoetching system of the present application;

[0028] Figure 2 is a top view of the upper and lower gantry type platform photoetching system of the present application;

[0029] Figure 3 is a sectional view of C-C in the present application; Figure 2 ​

[0030] Figure 4 is the structural schematic diagram of the left and right gantry type platform photoetching system of the present application;

[0031] Figure 5 is the structural schematic diagram of the left and right gantry type platform photoetching system of the present application;

[0032] Figure 6 is the structural schematic diagram of the left and right gantry type platform photoetching system of the present application; Figure 5 is the sectional view of D-D in the present application;

[0033] Figure 7 is the structural schematic diagram of the pressing mechanism of the present application;

[0034] Figure 8 is the structural schematic diagram of the connection relationship between the column and the pressing plate of the present application;

[0035] Figure 9 is the structural schematic diagram of the loading and unloading mechanism of the present application;

[0036] Figure 10 is the sectional view of the loading and unloading mechanism of the present application.

[0037] In the figure: 1, base; 2, top seat; 31, gantry type upper platform; 32, gantry type left platform; 41, gantry type lower platform; 42, gantry type right platform; 5, upper photoetching assembly; 6, lower photoetching assembly; 7, upper CCD assembly; 8, lower CCD assembly; 9, PCB plate assembly; 91, PCB plate body; 92, upper glass plate; 93, lower glass plate;

[0038] 10, pressing mechanism; 101, elastic seat; 102, column; 103, pressing roller; 104, pressing plate; 105, pulley;

[0039] 11, loading and unloading mechanism; 111, base; 112, telescopic rod; 113, suction cup; 114, movable rod; 115, double shaft air cylinder; 116, mounting plate; 117, lifting air cylinder. DETAILED DESCRIPTION

[0040] The technical solutions in the embodiments of the present application will be described clearly and completely below with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0041] Embodiment 1

[0042] Please refer to Figures 1-3As shown, the present application is a double-sided photolithography system, including base 1, top seat 2, gantry type upper platform 31, gantry type lower platform 41, upper photolithography assembly 5, lower photolithography assembly 6, upper CCD assembly 7, lower CCD assembly 8, PCB assembly 9;

[0043] The top surface of the base 1 is provided with two top seats 2, and a gap is reserved between the two groups of top seats 2. The upper photolithography assembly 5 is arranged in the gap between the two groups of top seats 2. The lower photolithography assembly 6 is arranged directly below the upper photolithography assembly 5 and is located on the base 1. The top surface of the base 1 is respectively provided with a gantry type upper platform 31 and a gantry type lower platform 41. The bottom surfaces of the gantry type upper platform 31 and the gantry type lower platform 41 are respectively connected to the top surface of the base 1 through sliding rails. The upper CCD assembly 7 is arranged on the top seat 2, and the lower CCD assembly 8 is correspondingly arranged on the base 1. The top surfaces of the gantry type upper platform 31 and the gantry type lower platform 41 are provided with the PCB assembly 9.

[0044] The top seat 2 is a U-shaped structure.

[0045] The gantry type upper platform 31 and the gantry type lower platform 41 are also U-shaped structures. The U-shaped structures of the gantry type upper platform 31 and the gantry type lower platform 41 can well support the top surface of the platform, so that the PCB assembly can be placed on the top surface of the platform without shaking or tilting, ensuring the stability of the PCB assembly during photolithography and improving the quality of the photolithography of the PCB assembly. The horizontal height of the top surface of the gantry type upper platform 31 is higher than that of the gantry type lower platform 41, and the width of the gantry type upper platform 31 is greater than that of the gantry type lower platform 41. Therefore, the gantry type lower platform 41 can move along the bottom of the gantry type upper platform 31, and the two can realize cross operation during photolithography, thereby improving the photolithography effect. The gantry type upper platform 31 and the gantry type lower platform 41 move back and forth along the base 1 through the moving module, realizing the processes of feeding, photolithography and unloading.

[0046] The upper photolithography assembly 5 and the lower photolithography assembly 6 have the same structure and each include a photolithography lens and a lens moving plate. The photolithography lens is connected to the lens moving plate, and the lens moving plate is correspondingly installed on the base 1 and the top seat 2. The lens moving plate is connected to the moving module, and the moving module controls the movement of the upper photolithography assembly 5 and the lower photolithography assembly 6 along the X-axis and the Z-axis, respectively adjusting the horizontal position and the height position of the photolithography assembly.

[0047] The upper CCD assembly 7 and the lower CCD assembly 8 include an alignment camera. The alignment camera is connected to a camera moving plate, and the camera moving plate is correspondingly installed on the base 1 and the top seat 2. The camera moving plate is connected to the moving module. The moving module controls the movement of the upper CCD assembly 7 and the lower CCD assembly 8 along the X-axis and the Z-axis, respectively adjusting the horizontal position and the height position of the CCD assembly.

[0048] The moving module adopts a mode of motor driving screw rod working, and the movement of the corresponding device is controlled through the moving module;

[0049] The PCB assembly 9 comprises a PCB plate 91, an upper glass plate 92 and a lower glass plate 93, the PCB plate 91 is arranged on the bottom surface of the lower glass plate 93, the PCB plate 91 is arranged on the bottom surface of the lower glass plate 93, so that the PCB plate 91 is located between the upper glass plate 92 and the lower glass plate 93, by additionally arranging the upper glass 92 and the lower glass 93 on the PCB plate 91, the PCB plate 91 can be fixed and leveled, so that the two sides of the PCB plate 91 will not be curled, thereby ensuring the quality of the later photoetching;

[0050] In work, first, the lower glass plate 93 is placed on the gantry upper platform 31, then the PCB plate 91 and the lower glass plate 93 are placed on the lower glass plate 93 in turn, the PCB assembly 9 is assembled and pressed to make the PCB assembly closely adhere;

[0051] Then, the gantry upper platform 31 is controlled to move to the position of the upper CCD assembly 7 and the lower CCD assembly 8, the PCB plate 91 is positioned by the alignment camera, and then the PCB plate body is photoetched by the photoetching lens of the upper photoetching assembly 5 and the lower photoetching assembly 6; when photoetching, another set of PCB assembly 9 to be photoetched is placed on the gantry lower platform 41; after the photoetching of the PCB plate 91 on the gantry upper platform 31 is completed, the gantry upper platform 31 is reset and moved, at the same time, the gantry lower platform 41 is controlled to move and sequentially complete the positioning and photoetching work; therefore, the photoetching system of the application only needs to add a work station on one side of the equipment, and the cross photoetching work of the two platforms can be realized, thereby improving the photoetching work amount of the PCB plate 91; and the upper and lower photoetching assemblies and CCD assemblies are arranged respectively, so that the two-side photoetching work of the PCB plate 91 can be simultaneously performed, thereby improving the photoetching efficiency of the PCB plate 91.

[0052] Embodiment 2

[0053] Please refer to Figures 4-6 As shown in the figure, based on the above-mentioned embodiment 1, the application also includes a photoetching system of left and right gantry platform structure, the photoetching system comprises a gantry left platform 32 and a gantry right platform 42;

[0054] The gantry left platform 32 and the gantry right platform 42 are respectively arranged on the top surface of the base 1 through the slide rails on both sides, and are moved along the base 1 through the moving module,

[0055] The top surface of the base 1 is provided with two top bases 2, and gaps are reserved between the two groups of top bases 2. The upper photoetching assembly 5 is arranged in the gap between the two groups of top bases 2. The lower photoetching assembly 6 is arranged directly below the upper photoetching assembly 5 and is located on the base 1. The upper CCD assembly 7 is arranged on the top base 2. The lower CCD assembly 8 is correspondingly arranged on the base 1. The top surface of the gantry type left platform 32 and the gantry type right platform 42 is provided with the PCB assembly 9.

[0056] The base 1, the top base 2, the upper photoetching assembly 5, the lower photoetching assembly 6, the upper CCD assembly 7, the lower CCD assembly 8 and the PCB assembly 9 are the same as those in the above embodiment 1. The structures of the gantry type left platform 32, the gantry type right platform 42, the gantry type upper platform 31 and the gantry type lower platform 41 are the same, and only the arrangement positions of the base 1 are different.

[0057] In operation, first, the lower glass plate 93 is placed on the gantry type left platform 32. Then, the PCB plate 91 and the lower glass plate 93 are sequentially placed on the lower glass plate 93. The PCB assembly 9 is assembled and pressed to tightly adhere.

[0058] Then, the gantry type left platform 32 is controlled to move to the positions of the upper CCD assembly 7 and the lower CCD assembly 8. The PCB plate 91 is positioned by the alignment camera. The PCB plate body is photoetched by the photoetching lens of the upper photoetching assembly 5 and the lower photoetching assembly 6. When photoetching, another group of PCB assemblies 9 to be photoetched is placed on the gantry type right platform 42. When the photoetching of the PCB plate 91 on the gantry type left platform 32 is completed, the gantry type left platform 32 is reset and moved. Meanwhile, the gantry type right platform 42 is controlled to move and sequentially complete the positioning and photoetching. Therefore, the photoetching system of the present application only needs to add a station on one side of the equipment, and the cross photoetching of the two platforms can be realized, thereby improving the photoetching amount of the PCB plate 91. The upper and lower photoetching assemblies and the CCD assemblies are arranged respectively, so that the two-sided photoetching of the PCB plate 91 can be simultaneously performed, thereby improving the photoetching efficiency of the PCB plate 91.

[0059] Embodiment 3

[0060] Please refer to Figures 7-8 As shown in the figure, based on the above embodiment 1 and embodiment 2, the PCB plate 91 is pressed against the lower glass plate 92 during photoetching, so that the PCB plate 91 can be tightly adhered to the upper and lower glass plates, and the air is excluded to ensure the quality of photoetching. At present, manual pressing or air cylinder pressing is used to move the upper and lower plates to press. The manual pressing has the problems of time-consuming and laborious. The automatic pressing needs the PCB assembly 9 to be moved to a specified position, stopped and pressed, which affects the photoetching rhythm of the PCB.

[0061] Therefore, the pressing mechanism 10 is arranged on the moving slide rail of the gantry platform, and the pressing mechanism 10 comprises an elastic seat 101, a stand column 102, a pressing roller 103, a pressing plate 104 and a pulley 105.

[0062] The elastic seat 101 is installed on the slide rail and located away from the photoetching assembly, the stand column 102 penetrates through the top surface of the elastic seat 101 and is in sliding connection with the elastic seat 101, and the stand column 102 is in elastic connection with the inner cavity of the elastic seat 101, the pressing roller 103 is arranged between the top portions of the two stand columns 102, the pulley 105 is arranged at the bottom of the stand column 102 and located above the elastic seat 101, and the pressing plate 104 is arranged on the bottom surface of the gantry platform on both sides.

[0063] The elastic connection between the stand column 102 and the elastic seat 101 can adopt a spring structure.

[0064] The distance between the pulley 105 and the top surface of the elastic seat 101 is matched with the distance between the pressing roller 103 and the top surface of the platform, the pulley 105 can not only drive the stand column 102 to move downward in cooperation with the pressing plate 104, but also limit the movement of the pressing roller 103 to avoid that the pressing roller 103 moves downward too much and the force acting on the glass plate is too large, which may cause the glass to be crushed.

[0065] The end portion of the pressing plate 104 is in arc surface structure, so that the pressing plate 104 has a guiding effect when it moves to the pulley 105.

[0066] During operation, when the gantry platform moves along the slide rail and reaches the position of the pressing mechanism 10, the pressing plate 104 first contacts the pulley 105, and then the pulley 105 moves along the arc surface of the pressing plate 104 to the bottom surface of the pressing plate 104, so as to drive the stand column 102 to move downward, and the pressing roller 103 also moves downward and acts on the PCB plate assembly 9 to perform the pressing work, the pressing roller 103 fully presses the PCB plate assembly 9 as the gantry platform moves, and finally the pressing plate 104 separates from the pulley 105, the pressing mechanism is reset, and the next PCB plate assembly 9 is pressed. Therefore, the pressing mechanism of the present application uses the movement of the PCB plate during photoetching as a power source to realize the downward movement of the pressing roller 103 of the pressing mechanism, has the advantages of energy saving and high efficiency, two groups of components cooperate with each other to fully press the PCB plate, has the advantage of good pressing effect, and the pressing work can be realized by using the movement time of the PCB plate, thereby effectively saving the photoetching time.

[0067] Example 4

[0068] Please refer to Figures 9-10As shown, based on the above embodiment 3, the arrangement of the pressing mechanism 10 only serves to press the PCB board ready for photoetching during movement, and before pressing, the staff needs to place the lower glass plate 93 on the PCB board, and when returning after photoetching, the staff also needs to take and handle the lower glass plate 93, and take out the photoetched PCB board, so there is a problem that the staff has a large workload;

[0069] A loading and unloading mechanism 11 is arranged at the top of the two columns 102, and the loading and unloading mechanism 11 includes a base 111, a pressing roller 103, and a loading and unloading assembly;

[0070] The base 111 is installed between the two columns 102, the bottom of the base 111 is provided with the pressing roller 103, and the top of the base 111 is provided with the loading and unloading assembly for taking and placing the upper glass plate 92. A rotating motor is arranged on one side of the column 102, and the output end of the rotating motor is connected with the base 111. Through the operation of the rotating motor, the base 111 is driven to rotate, so that the pressing roller 103 and the loading and unloading assembly can be switched to complete the work of pressing the PCB board assembly 9 or taking and placing the upper glass plate 92;

[0071] The bottom surface of the base 111 is provided with a mounting groove, and the loading and unloading assembly is located in the mounting groove. The loading and unloading assembly includes an extension rod 112, a suction cup 113, a movable rod 114, a double-shaft air cylinder 115, a mounting plate 116, and a lifting air cylinder 117. The lifting air cylinder 117 is installed in the mounting groove of the base 111, and the output end of the lifting air cylinder 117 is connected with the mounting plate 116. The mounting plate 116 moves along the two sides of the mounting groove, and the two ends of the side wall away from the lifting air cylinder 117 of the mounting plate 116 are respectively provided with the extension rod 112. The end of the extension rod 112 is provided with a mounting block, and the suction cup 113 is sleeved on the mounting block. The double-shaft air cylinder 115 is arranged in the middle of the mounting plate 116, and the output ends of the two sides of the double-shaft air cylinder 115 are respectively connected with the movable rod 114. One end of the movable rod 114 away from the double-shaft air cylinder 115 is connected with the mounting block at the end of the extension rod 112;

[0072] The distance between the pressing roller 103 and the top surface of the platform when the pressing roller 103 is located at the bottom is greater than the distance between the suction cup 113 and the top surface of the platform when the suction cup 113 is located at the bottom, so that when the PCB board is reset after photoetching, the problem of collision does not occur;

[0073] When the work is in operation, after the upper glass plate 92 is pressed tightly and sent to the photoetching, the driving motor is started to work, the base 111 is driven to rotate, the loading and unloading assembly and the pressing roller 103 are switched, so that the loading and unloading assembly is directly below, when the photoetching is finished, the PCB plate assembly 9 moves to the initial position, and then moves to the position of the pressing mechanism 10, at this time, the lifting cylinder 117 is controlled to drive the mounting plate 116 to move downward, so that the suction cup 113 adsorbs, the lifting cylinder 117 is reset to the original height, the upper glass plate 92 is taken off, and at the same time, the PCB plate assembly 9 returns to the feeding position;

[0074] At this time, the double-shaft cylinder 115 is started to work, the telescopic rod 112 is driven to extend through the movable rod 114, so that the adsorbed upper glass plate 92 moves to the position close to the feeding position of the PCB plate assembly 9, that is, moves to the front of the pressing mechanism 10, when the next group of PCB assemblies 9 is photoetched, the upper glass plate 92 is placed on the PCB plate 91 through the lifting cylinder 117 when the adsorbed upper glass plate 92 moves, then the double-shaft cylinder 115 is controlled to contract, so that the telescopic rod 112 is contracted into the mounting groove of the base 111, and the driving motor is controlled, so that the pressing roller 103 is at the bottom, and waits for the next group of PCB assemblies 9 to be pressed tightly;

[0075] Therefore, the base 111 connects the pressing mechanism 10 and the loading and unloading mechanism together, realizes the pressing work and the taking of the upper glass work of the PCB plate, and the two are automatically operated respectively, so that the labor is greatly saved, and according to the rhythm of the photoetching process of the PCB plate, the corresponding switching is carried out, so that the work can be orderly carried out; and the loading and unloading mechanism is provided with the telescopic rod 112, so that the loading and unloading mechanism is convenient to contract, so that it occupies a smaller space of the equipment.

[0076] Embodiment 5

[0077] Based on the above-mentioned embodiment 4, a photoetching method of a double-sided photoetching system of an upper and lower gantry type platform, comprising the following steps:

[0078] Step 1: placing the lower glass plate 93 on the gantry type upper platform 31, then placing the PCB plate 91 and the upper glass plate 92 on the lower glass plate 93 in sequence, assembling the PCB assembly 9, and pressing downward to make the PCB assembly closely adhere;

[0079] Step 2: controlling the gantry type upper platform 31 to move to the position of the upper CCD assembly 7 and the lower CCD assembly 8, positioning the PCB plate 91 through the alignment camera, and then photoetching the PCB plate body through the photoetching lens of the upper photoetching assembly 5 and the lower photoetching assembly 6;

[0080] In the process of moving the upper gantry platform 31, first move to the position of the pressing mechanism 10, the pressing plate 104 contacts with the pulley 105, with the movement of the platform, the pulley 105 moves along the arc surface of the pressing plate 104 to the bottom surface of the pressing plate 104, so as to move the driving column 102 downward, so that the pressing roller 103 will also move downward and act on the PCB assembly 9 to perform the pressing work, with the movement of the platform, the pressing roller 103 fully presses the PCB assembly 9, finally with the movement of the platform, the pressing plate 104 will be separated from the pulley 105, the pressing mechanism resets, waiting for the next PCB assembly 9 to perform the pressing work;

[0081] When the upper glass plate 92 is pressed and sent to the photoetching, the driving motor is started to work, driving the base 111 to rotate, switching the loading and unloading assembly and the pressing roller 103, so that the loading and unloading assembly is directly below;

[0082] Step 3: when photoetching, place another set of PCB assembly 9 to be photoetched on the lower gantry platform 41; wait for the photoetching of the PCB 91 on the upper gantry platform 31 to end, so that the upper gantry platform 31 resets and moves, at the same time, control the lower gantry platform 41 to move and complete the positioning and photoetching work in turn;

[0083] Specifically, when the photoetching of the PCB 91 on the upper gantry platform 31 ends, the PCB assembly 9 moves to the initial position, and then moves to the position of the pressing mechanism 10, at this time, the lifting cylinder 117 is controlled to drive the mounting plate 116 to move downward, so that the suction cup 113 adsorbs, and then the lifting cylinder 117 resets to the original height, and the upper glass plate 92 is removed, at the same time, the PCB assembly 9 returns to the loading position;

[0084] At this time, the double-shaft cylinder 115 is started to work, the telescopic rod 112 is driven to extend through the movable rod 114, so that the adsorbed upper glass plate 92 moves to the position close to the loading position of the PCB assembly 9, that is, moves to the front of the pressing mechanism 10, when the next set of PCB assembly 9 is photoetched, the upper glass plate 92 is placed on the PCB 91 through the lifting cylinder 117, and then the double-shaft cylinder 115 is controlled to contract, so that the telescopic rod 112 contracts into the mounting groove of the base 111, and the driving motor is controlled, so that the pressing roller 103 is at the bottom, waiting for the next set of PCB assembly 9 to perform the pressing work.

[0085] Example 6

[0086] Based on the above example 4, a photoetching method of a double-sided photoetching system of a left and right gantry platform, comprising the following steps:

[0087] Step 1: Place the lower glass plate 93 on the gantry upper platform 31, and then place the PCB plate 91 and the upper glass plate 92 in sequence on the lower glass plate 93 to assemble the PCB assembly 9, and press down to make the PCB assembly tightly adhere;

[0088] Step 2: Control the gantry left platform 32 to move to the position of the upper CCD assembly 7 and the lower CCD assembly 8, position the PCB plate 91 through the alignment camera, and then perform photoetching work on the PCB plate body through the photoetching lens of the upper photoetching assembly 5 and the lower photoetching assembly 6;

[0089] During the movement of the gantry left platform 32, first move to the position of the pressing mechanism 10, the pressing plate 104 contacts the pulley 105, and as the platform moves, the pulley 105 moves along the arc surface of the pressing plate 104 to the bottom surface of the pressing plate 104, thereby moving the driving column 102 downward, so that the pressing roller 103 also moves downward and acts on the PCB assembly 9 to perform pressing work, and as the platform moves, the pressing roller 103 fully presses the PCB assembly 9, and finally as the platform moves, the pressing plate 104 separates from the pulley 105, the pressing mechanism resets, and waits for the next PCB assembly 9 to be pressed;

[0090] When the upper glass plate 92 is pressed to the end and sent to photoetching, the driving motor is started to work, the base 111 is rotated, the loading and unloading assembly and the pressing roller 103 are switched, and the loading and unloading assembly is located directly below;

[0091] Step 3: Place another set of PCB assemblies 9 to be photoetched on the gantry right platform 42 while photoetching; wait for the photoetching of the PCB plate 91 on the gantry left platform 32 to end, move the gantry upper platform 31 back to the original position, and at the same time, control the gantry right platform 42 to move and sequentially complete the positioning and photoetching work;

[0092] Specifically, after the photoetching of the PCB plate 91 on the gantry left platform 32 ends, the PCB assembly 9 moves to the initial position, and then moves to the position of the pressing mechanism 10, at this time, the lifting cylinder 117 drives the mounting plate 116 to move downward, so that the suction cup 113 adsorbs, and then the lifting cylinder 117 resets to the original height, and the upper glass plate 92 is removed, and at the same time, the PCB assembly 9 returns to the loading position;

[0093] At this time, the double shaft air cylinder 115 is started to work, the telescopic rod 112 is driven to extend by the movable rod 114, so that the adsorbed upper glass plate 92 moves to the position close to the PCB assembly 9 feeding station, that is, moves to the front of the pressing mechanism 10. When the next group of PCB assembly 9 is subjected to photoetching, the upper glass plate 92 is placed on the PCB plate 91 by the lifting air cylinder 117 when the adsorbed upper glass plate 92 is moved. Then, the double shaft air cylinder 115 is controlled to retract, so that the telescopic rod 112 is retracted into the mounting groove of the base 111, and the driving motor is controlled, so that the pressing roller 103 is at the bottom, and waits for the next group of PCB assembly 9 to be subjected to the pressing work.

[0094] The above describes one embodiment of the present application in detail, but the content described is only the preferred embodiment of the present application, and cannot be considered to limit the implementation range of the present application. Any equivalent changes and improvements made according to the application scope of the present application should still belong to the patent coverage range of the present application.

Claims

1. An exposure method of a gantry double-sided lithography system, characterized by, The method comprises the following steps: Step 1: Assemble the PCB assembly (9) and place the PCB assembly (9) on the gantry upper platform (31); Step 2: Move the gantry upper platform (31) to the position of the CCD assembly, and simultaneously position the upper and lower surfaces of the PCB (91) through the upper and lower alignment cameras; Step 3: Move the gantry upper platform (31) to the position of the photoetching assembly, and simultaneously photoetch the upper and lower surfaces of the PCB (91) through the upper and lower photoetching lenses; Step 4: Return the photoetched PCB assembly (9) on the gantry upper platform (31) to the original position, and repeat steps 1-3 for the photoetching of the PCB assembly (9) on the gantry lower platform (41); In step 2, during the movement of the gantry upper platform (31) and the gantry lower platform (41), the upper glass plate (92) located on the gantry upper platform (31) and the gantry lower platform (41) is compressed; The compression process is as follows: First, when moving to the position of the compression mechanism (10), the compression plate (104) contacts the pulley (105), and as the platform moves, the pulley (105) moves along the arc surface of the compression plate (104) to the bottom surface of the compression plate (104), thereby moving the driving column (102) downward, so that the compression roller (103) also moves downward and acts on the PCB assembly (9) to perform compression work. As the platform moves, the compression roller (103) fully compresses the PCB assembly (9), and finally, as the platform moves, the compression plate (104) separates from the pulley (105), the compression mechanism returns to the original position, and waits for the next PCB assembly (9) to be compressed.

2. The exposure method of a double-sided lithography system according to claim 1, wherein, In step 1, the assembly sequence of the PCB assembly (9) is from low to high in the order of the upper glass plate (92), the PCB (91), and the lower glass plate (93).

3. The exposure method of a gantry double-sided lithography system according to claim 1, wherein, In step 2, the upper CCD assembly (7) and the lower CCD assembly (8) are controlled to move along the X-axis and the Z-axis by the movement module to adjust the horizontal position and the height position for positioning.

4. The exposure method of a double-sided lithography system of a gantry according to claim 1, wherein, In step 3, the upper photoetching assembly (5) and the lower photoetching assembly (6) are controlled to move along the X-axis and the Z-axis by the movement module to adjust the horizontal position and the height position for photoetching.

5. The exposure method of a double-sided lithography system of a gantry according to claim 1, wherein, When the upper glass plate (92) compression is completed and sent to photoetching, the driving motor is started to drive the base (111) to rotate, switch the loading and unloading assembly and the compression roller (103), and make the loading and unloading assembly be directly below.

6. The exposure method of a double-sided lithography system of a gantry according to claim 5, wherein, In step 4, when the photoetching of the PCB (91) on the gantry upper platform (31) is completed, the PCB assembly (9) moves to the initial position, and then moves to the position of the compression mechanism (10). At this time, the lifting cylinder (117) is controlled to drive the mounting plate (116) to move downward, so that the suction cup (113) is adsorbed, the lifting cylinder (117) returns to the original height, the upper glass plate (92) is removed, and at the same time, the PCB assembly (9) returns to the feeding station.

7. The exposure method of a double-sided lithography system of a gantry according to claim 6, wherein, The double-shaft air cylinder (115) is started to work, the movable rod (114) drives the telescopic rod (112) to extend, the adsorbed upper glass plate (92) is moved to the position close to the PCB assembly (9) feeding station, that is, moved to the front of the pressing mechanism (10).

8. The exposure method of a double-sided lithography system of a gantry according to claim 7, wherein, When the next group of PCB assemblies (9) is subjected to photoetching, the upper glass plate (92) is placed on the PCB (91) by the lifting air cylinder (117) when the adsorbed upper glass plate (92) is moved, then the double-shaft air cylinder (115) is controlled to contract, the telescopic rod (112) is contracted into the mounting groove of the base (111), and the driving motor is controlled, so that the pressing roller (103) is at the bottom, and waits for the next group of PCB assemblies (9) to be pressed.

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