Mounting base, shower head assembly, temperature control method and plasma processing device

By setting a temperature control channel on the mounting base and dynamically adjusting the cooling method, the temperature control problem of the spray head under high and low bias power is solved, achieving more stable temperature control and extending the life of the heater.

CN116130325BActive Publication Date: 2026-03-17ADVANCED MICRO FAB EQUIP INC CHINA
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-11-12
Publication Date
2026-03-17

AI Technical Summary

Technical Problem

In the prior art, the cooling efficiency of the spray head is insufficient at high bias power, which makes temperature control difficult and the heater is prone to overheating and burning out. At low bias power, the cooling efficiency is higher, which leads to energy waste and unstable temperature control.

Method used

A temperature control channel is set on the mounting base. By introducing coolant or gas into the temperature control channel, the cooling efficiency of the spray head can be dynamically adjusted to enhance or weaken the cooling effect, thereby achieving temperature controllability of the spray head.

Benefits of technology

Improve cooling efficiency at high bias power, reduce cooling efficiency at low bias power, improve spray head temperature controllability, extend heater life, and reduce heater power output.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application provides a mounting base, a shower head assembly, a temperature control method and a plasma processing device. The mounting base is applied to a shower head assembly, the shower head assembly further comprises a heater and a shower head, the heater is used for heating the shower head, the mounting base is provided with a cooling channel for flowing cooling liquid, and is used for cooling the shower head, characterized in that the mounting base further comprises a temperature control channel, which is arranged on a cooling path between the cooling channel and the shower head, and is used for adjusting the cooling efficiency of the shower head. The application can improve the cooling efficiency at high bias power, reduce the cooling efficiency at low bias power, improve the controllability of the temperature of the shower head, reduce the power output of the heater and prolong the service life of the heater.
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Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment technology, and in particular to a mounting base, a spray head assembly, a temperature control method, and a plasma treatment device. Background Technology

[0002] In plasma processing, the modulation gas and process gas are first mixed to form a reactant gas. This reactant gas is then introduced into a reaction chamber, and radio frequency power is applied to perform plasma processing on the semiconductor workpiece. The device used to mix the modulation gas and process gas is a gas spray head assembly. In the spray head assembly, the spray head is mounted on a mounting base and requires precise temperature control. Currently, the temperature control method for the spray head is to indirectly control the spray head by directly controlling the temperature of the mounting base. Figure 1 As shown, the lower surface of the mounting base 100 is used to mount the spray head 200, and the recessed space on its upper surface is used to mount the heater 300 and the airflow device (not shown). The heater 300 directly heats the mounting base 100 and indirectly heats the spray head 200 through heat conduction. The mounting base 100 is also provided with a cooling channel 110 at the lug, through which cooling water or temperature-controlled refrigerant is introduced to cool the mounting base 100, thereby indirectly cooling the spray head 200.

[0003] Currently, for high-power equipment, when the bias power is set high, the heat rise of the spray head caused by the thermal effect of plasma requires a large cooling power from the mounting base to ensure controllable spray head temperature. In the current design, due to insufficient cooling power, the heating power output of the heater is actually zero at high bias power, and the temperature control of the spray head is entirely based on passive temperature control via cooling water. Under this design, when the equipment is used at low bias power, in order to ensure stable spray head temperature control, the heater needs to output high power to heat the mounting base and spray head. A large portion of this energy is carried away by the cooling water, leading to difficulties in temperature control and causing problems such as heater overheating and burnout at high power output, and deformation due to thermal expansion.

[0004] Therefore, a design is needed that has high cooling efficiency at high bias power and relatively low cooling efficiency at low bias power to improve the temperature controllability of the spray head, reduce the power output of the heater, and extend the service life of the heater. Summary of the Invention

[0005] The purpose of this invention is to provide a mounting base, a spray head assembly, a temperature control method, and a plasma treatment device, which can improve cooling efficiency at high bias power and reduce cooling efficiency at low bias power, thereby improving the controllability of spray head temperature, reducing heater power output, and extending heater life.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solution:

[0007] A mounting base is applied to a spray head assembly, the spray head assembly further including a heater and a spray head, the heater being used to heat the spray head, the mounting base having a cooling channel for circulating coolant to cool the spray head, the mounting base further including: a temperature control channel disposed on the cooling path between the cooling channel and the spray head, used to adjust the cooling efficiency of the mounting base on the spray head, circulating coolant being introduced into the temperature control channel to improve the cooling efficiency of the mounting base on the spray head, and purging gas being introduced into the temperature control channel and maintained in a non-flowing state, or a vacuum state being maintained in the temperature control channel to reduce the cooling efficiency of the mounting base on the spray head.

[0008] Furthermore, the number of temperature control channels is at least two, which are distributed sequentially along the cooling path.

[0009] Furthermore, the temperature control channel is provided with a fluid inlet and a fluid outlet. When the fluid is coolant, the fluid inlet is lower than the fluid outlet.

[0010] Furthermore, the temperature control channel is provided with a fluid inlet and a fluid outlet. When the fluid is gas, the fluid inlet is higher than the fluid outlet.

[0011] Furthermore, the temperature control channel can be switched between being filled with coolant or gas.

[0012] Furthermore, the fluid inlet and the fluid outlet are arranged opposite to each other or on the same side.

[0013] Furthermore, the lower surface of the mounting base is used to mount the spray head, a portion of the upper surface of the mounting base is recessed downward to form a receiving space for mounting the heater, the upper surface of the mounting base extends outward to form a hanging ear, and the cooling channel is located at the hanging ear.

[0014] Furthermore, the heater is disposed in close contact with the bottom surface of the receiving space.

[0015] Furthermore, the cooling path is located on the side wall of the mounting base.

[0016] Furthermore, the mounting base is shaped like a closed cylinder at the bottom.

[0017] Furthermore, the temperature control channel is an annular channel surrounding the cylindrical sidewall.

[0018] Furthermore, the temperature control channel includes multiple independently controllable ring segments spaced apart in the circumferential direction.

[0019] A spray head assembly includes a spray head, a heater, and a mounting base as described in any of the above, wherein the spray head and the heater are mounted on the mounting base.

[0020] A method for controlling the temperature of a spray head, comprising:

[0021] Provide the spray head assembly as described above;

[0022] When it is necessary to improve the cooling efficiency of the spray head, circulating coolant is introduced into the temperature control channel;

[0023] When it is necessary to reduce the cooling efficiency of the spray head, purge gas is introduced into the temperature control channel and kept in a non-flowing state, or a vacuum state is maintained in the temperature control channel.

[0024] A plasma processing apparatus includes a reaction chamber and a spray head assembly as described above, the spray head assembly being mounted at the top opening of the reaction chamber.

[0025] Compared with the prior art, the present invention has the following advantages:

[0026] In addition to the cooling channel on the mounting base, a temperature control channel is also added to the cooling path between the cooling channel and the spray head. This temperature control channel can enhance or weaken the cooling effect of the cooling channel on the spray head on the mounting base, adjust the cooling efficiency of the mounting base on the spray head, thereby increasing the cooling efficiency of the spray head at high bias power and decreasing the cooling efficiency of the spray head at low bias power, improving the temperature controllability of the spray head, reducing the power output of the heater, and extending the service life of the heater. Attached Figure Description

[0027] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description will be briefly introduced below. Obviously, the drawings described below are one embodiment of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort:

[0028] Figure 1 This is a schematic diagram of the existing spray head assembly;

[0029] Figure 2 This is a schematic diagram of the structure of a spray head assembly provided in an embodiment of the present invention;

[0030] Figure 3 This is a schematic diagram of the structure of a spray head assembly provided in another embodiment of the present invention;

[0031] Figure 4This is a flowchart of a temperature control method for a spray head provided in an embodiment of the present invention. Detailed Implementation

[0032] The following detailed description, in conjunction with the accompanying drawings and specific embodiments, further illustrates the solution proposed by the present invention. The advantages and features of the present invention will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, used only to facilitate and clearly illustrate the embodiments of the present invention. Please refer to the drawings to make the objectives, features, and advantages of the present invention more apparent and understandable. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and are not intended to limit the implementation conditions of the present invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by the present invention, should still fall within the scope of the technical content disclosed in the present invention.

[0033] like Figure 2 The diagram shows the installation schematic of the spray head assembly provided by the present invention. In the plasma processing device, the top of the reaction chamber 400 is provided with an opening for installing the spray head 200 and its temperature control and airflow device. The spray head assembly includes the spray head 200, the mounting base 100, and the heater 300. The spray head 200 is mounted on the lower surface of the mounting base 100, which is used to mount the spray head 200 on the top of the reaction chamber 400. The mounting base 100 and the heater 300 serve as the temperature control device for the spray head 200. The heater 300 is mounted on the mounting base 100 and indirectly heats the spray head 200 by heating the mounting base 100. The mounting base 100 is typically made of aluminum alloy and has a cooling channel 110 for circulating coolant, which indirectly cools the spray head 200 by cooling the mounting base 100.

[0034] In order to dynamically adjust the cooling efficiency of the mounting base 100 on the spray head 200, the mounting base 100 is also provided with a temperature control channel 120, which is set on the cooling path between the cooling channel 110 and the spray head 200. The temperature control channel 120 can enhance or weaken the cooling effect of the cooling channel 110 on the spray head 200, thereby adjusting the cooling efficiency of the mounting base 100 on the spray head 200.

[0035] Specifically, circulating coolant in the temperature control channel 120 can improve the cooling efficiency of the mounting base 100 on the spray head 200, while purging gas in the temperature control channel 120 and maintaining it in a non-flowing state can reduce the cooling efficiency of the mounting base 100 on the spray head 200. Alternatively, maintaining a vacuum state in the temperature control channel 120 can also reduce the cooling efficiency of the mounting base 100 on the spray head 200.

[0036] Therefore, when the bias power is high, circulating cooling water or coolant is introduced into the temperature control channel 120 of the mounting base 100 to supplement the cooling effect of the cooling channel 110 on the mounting base 100. The superposition of the two coolings can achieve a better cooling effect. Therefore, when the bias power is high, it is not necessary to completely turn off the heater 300, and better temperature control results of the spray head 200 can be obtained.

[0037] In low bias power or idle mode, to prevent excessive heat loss from the coolant in cooling channel 110, the temperature control channel 120 can be purged with air. In this state, since the thermal conductivity of gases, especially stationary gases, is much lower than that of liquids (coolant) or solids (mounting base 100), excessive heat loss from cooling channel 110 can be prevented. This effectively reduces the output power of heater 300, decreases energy consumption, and extends the service life of heater 300. Furthermore, purging the temperature control channel 120 maintains a vacuum state, thereby preventing heat transfer to cooling channel 110.

[0038] As can be seen, the present invention adds a temperature control channel 120 to the mounting base 100, and switches between coolant and gas in the temperature control channel 120. This can dynamically change the thermal conductivity of the cooling path in the mounting base 100, thereby increasing or decreasing the cooling effect of the original cooling channel 110, resulting in a more stable temperature control result for the spray head 200 and reducing the power output of the heater 300.

[0039] Optionally, the temperature control channel 120 is provided with a fluid inlet 121 and a fluid outlet 122. To achieve rapid gas-liquid exchange, when the fluid is coolant, the fluid inlet 121 is lower than the fluid outlet 122; when the fluid is gas, the fluid inlet 121 is higher than the fluid outlet 122. That is, when the temperature control channel 120 is filled with gas and needs to be filled with circulating coolant, the circulating coolant needs to enter from the bottom and flow out from the top; when the temperature control channel 120 is filled with coolant and needs to be filled with gas, the gas needs to enter from the top and flow out from the bottom. Furthermore, the fluid inlet 121 and the fluid outlet 122 can be arranged opposite to each other, such as... Figure 2As shown, the fluid inlet 121 and the fluid outlet 122 are located on the left and right sides of the diagram, respectively, which allows for a more thorough discharge of the liquid from the temperature control channel 120 when switching from liquid to gas. In other embodiments, the fluid inlet 121 and the fluid outlet 122 may also be located on the same side.

[0040] In this embodiment, the spray head 200 is mounted on the lower surface of the mounting base 100, and the heater 300 is mounted within a recessed area on the upper surface of the mounting base 100 forming a receiving space A. The upper surface of the mounting base 100 extends outward to form a hanging lug 130, and the cooling channel 110 is located at the hanging lug 130. Optionally, to improve the heating efficiency of the spray head 200, the heater 300 is positioned close to the bottom surface of the receiving space A, and the heat generated by the heater 300 can be transferred from the bottom of the mounting base 100 to the spray head 200. Therefore, in order not to affect the transfer of heat generated by the heater 300 to the spray head 200 by the mounting base 100, the "cooling path" of this invention is located on the side wall of the mounting base 100, that is, the temperature control channel 120 is located on the side wall of the mounting base 100.

[0041] Optionally, the mounting base 100 is a cylindrical shape with a closed bottom. The temperature control channel 120 is an annular channel surrounding the cylindrical sidewall of the mounting base 100. The temperature control channel 120 is coaxial with the mounting base 100 to ensure consistency in all directions. Furthermore, the temperature control channel 120 may include multiple independently controllable ring segments spaced apart in the circumferential direction, thereby allowing segmented control of cooling efficiency in different directions according to actual needs, achieving a more precise temperature control effect.

[0042] Figure 2 In the spray head assembly shown, a temperature control channel 120 is provided on the cooling path of the mounting base 100. In other embodiments, the number of temperature control channels 120 can be two or more, and each temperature control channel 120 is distributed sequentially on the cooling path to obtain more precise temperature control results.

[0043] Figure 3 Another spray head assembly structure is shown, in which the cooling path of the mounting base 100 is provided with two temperature control channels 120, each of which can be controlled independently. When a high cooling efficiency is required, circulating coolant is introduced into both temperature control channels 120. When a low cooling efficiency is required, purging gas is introduced into both temperature control channels 120 and kept in a non-flowing state or a vacuum state.

[0044] The present invention also provides a method for controlling the temperature of a spray head, such as... Figure 4 As shown, it includes:

[0045] Step S100: Provide the above-mentioned spray head assembly;

[0046] Step S200: When it is necessary to improve the cooling efficiency of the spray head, circulating coolant is introduced into the temperature control channel;

[0047] Step S300: When it is necessary to reduce the cooling efficiency of the spray head, purge gas is introduced into the temperature control channel and kept in a non-flowing state, or a vacuum state is maintained in the temperature control channel.

[0048] The present invention also provides a plasma processing apparatus, including a reaction chamber and a spray head assembly as described above, the spray head assembly being installed at the top opening of the reaction chamber. This plasma processing apparatus can be a capacitively coupled plasma (CCP) processing device or an inductively coupled plasma (ICP) processing device.

[0049] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0050] Although the present invention has been described in detail through the preferred embodiments above, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above description. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A mounting base for a spray head assembly, the spray head assembly further comprising a heater and a spray head, the heater for heating the spray head, the mounting base having a cooling channel for circulating coolant for cooling the spray head, characterized in that, The mounting base further comprises temperature control channels arranged on the cooling path between the cooling channel and the shower head, for adjusting the cooling efficiency of the mounting base on the shower head, circulating cooling liquid in the temperature control channels to increase the cooling efficiency of the mounting base on the shower head, circulating purge gas in the temperature control channels and maintaining a non-flowing state, or maintaining a vacuum state in the temperature control channels to reduce the cooling efficiency of the mounting base on the shower head.

2. The mounting base of claim 1, wherein, The number of temperature control channels is at least two, and they are arranged in sequence on the cooling path.

3. The mounting base of claim 1, wherein, When the fluid is a cooling liquid, the fluid inlet is lower than the fluid outlet.

4. The mounting base of claim 1, wherein, When the fluid is a gas, the fluid inlet is higher than the fluid outlet.

5. A mounting base according to claim 3 or 4, wherein The temperature control channels can be switched to fill with cooling liquid or gas.

6. A mounting base according to claim 3 or 4, wherein The fluid inlet and the fluid outlet are oppositely arranged or arranged on the same side.

7. The mounting base of claim 1, wherein, The lower surface of the mounting base is used to mount the shower head, and part of the upper surface of the mounting base is recessed downward to form a containing space for mounting the heater, the upper surface of the mounting base extends outward to form a lug, and the cooling channel is arranged at the lug.

8. The mounting base of claim 7, wherein, The heater is arranged close to the bottom surface of the containing space.

9. The mounting base of claim 7, wherein, The cooling path is located on the side wall of the mounting base.

10. The mounting base of claim 7, wherein, The shape of the mounting base is a closed-bottom barrel shape.

11. The mounting base of claim 10, wherein, The temperature control channels are annular channels around the side wall of the barrel shape.

12. The mounting base of claim 11, wherein, The temperature control channels include a plurality of independently controllable ring segments arranged at intervals in the circumferential direction.

13. A showerhead assembly, comprising: A shower head, a heater, and a mounting base according to any one of claims 1-12 are included, and the shower head and the heater are mounted on the mounting base.

14. A method of temperature control of a showerhead, characterized by, A shower head assembly according to claim 13 is provided. When it is necessary to increase the cooling efficiency of the shower head, circulating cooling liquid is introduced into the temperature control channels. When it is necessary to reduce the cooling efficiency of the shower head, purge gas is introduced into the temperature control channels and maintained in a non-flowing state, or a vacuum state is maintained in the temperature control channels. A reaction chamber and a shower head assembly according to claim 13 are included, and the shower head assembly is mounted at the top opening of the reaction chamber.

15. A plasma processing apparatus, characterized by comprising: ​

Citation Information

Patent Citations

  • Spraying head heating and cooling device and method for plasma reaction device

    CN106922071A

  • Capacitively coupled plasma processor and temperature adjusting method thereof

    CN111383881A